US7902464B2 - Heat sink arrangement for electrical apparatus - Google Patents
Heat sink arrangement for electrical apparatus Download PDFInfo
- Publication number
- US7902464B2 US7902464B2 US12/475,728 US47572809A US7902464B2 US 7902464 B2 US7902464 B2 US 7902464B2 US 47572809 A US47572809 A US 47572809A US 7902464 B2 US7902464 B2 US 7902464B2
- Authority
- US
- United States
- Prior art keywords
- printed circuit
- circuit board
- semiconductor devices
- heat sink
- disposed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active, expires
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L2023/4018—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by the type of device to be heated or cooled
- H01L2023/4031—Packaged discrete devices, e.g. to-3 housings, diodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/10—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers
- H01L25/11—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L29/00
- H01L25/115—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L29/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09036—Recesses or grooves in insulating substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10166—Transistor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10431—Details of mounted components
- H05K2201/10439—Position of a single component
- H05K2201/10446—Mounted on an edge
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3447—Lead-in-hole components
Definitions
- This invention relates to dissipation of heat from an electrical apparatus, e.g. a power supply apparatus, employing semiconductor devices.
- Some electrical apparatus uses power semiconductor devices as its components.
- Power semiconductor devices are connected to a driver printed circuit board on which a driver circuit for driving the power semiconductor devices is formed.
- the driver printed circuit board is connected to a control printed circuit board on which a control circuit for controlling the driver circuit is formed.
- the power semiconductor devices are mechanically coupled to a heat sink for dissipating heat from the semiconductor devices.
- the control printed circuit board may be mounted to the heat sink on which the power semiconductor devices are mounted, with the driver printed circuit board mounted between the power semiconductor devices and the control printed circuit board, to thereby assemble them into a single block.
- JP 7-7167 U discloses use of a flexible board for connecting components mounted on a case to components mounted on a printed circuit board attached to the case.
- An object of the present invention is to provide an electrical apparatus, in which electrical components are prevented from being broken down and, still, which can be small in size.
- An electrical apparatus includes a first printed circuit board formed of an insulating substrate which is coated with an electrically conductive film.
- the first printed circuit board may be a multi-layered board or a single-layered board.
- An electrical component disposed external to the first printed circuit board has a rigid connector connected to the conductive film of the first printed circuit board. This connection of the connector to the conductive film may put strain to the connector, the electrical component and/or the first printed circuit board.
- the insulating substrate includes a flexible portion in the vicinity of the portion of the conductive film to which the electrical component is connected.
- the flexible portion may be formed by thinning a portion, which is to become the flexible portion, of the insulating substrate relative to the remaining portion.
- the electrical component may be a semiconductor device mounted on a heat sink.
- the connector is a lead of the semiconductor device.
- the semiconductor device may be a power semiconductor device.
- the first printed circuit board may be disposed near the heat sink.
- a second printed circuit board may be mounted to the surface of the heat sink opposite to the surface on which the semiconductor device is mounted.
- the second printed circuit board is electrically and mechanically coupled to the first printed circuit board.
- FIG. 1 is a block diagram of an electrical apparatus according to an embodiment of the present invention.
- FIG. 2 is a front view of a heat dissipating portion of the electrical apparatus shown in FIG. 1 .
- FIG. 3 is a side view of the heat dissipating portion shown in FIG. 2 .
- FIG. 4 is a cross-sectional view along a line 4 - 4 in FIG. 2 .
- An electrical apparatus is, for example, a power supply apparatus for use in welding or electroplating.
- the power supply apparatus includes, as shown in FIG. 1 , an AC-to-DC converting circuit 4 for converting a three-phase commercial AC voltage, for example, applied to power supply input terminals 2 a , 2 b and 2 c , to a DC voltage.
- the AC-to-DC converting circuit 4 includes, for example, a rectifying circuit and a smoothing circuit.
- the DC voltage from the AC-to-DC converting circuit 4 is applied to a DC-to-AC converting circuit, e.g. an inverter 6 , which includes plural, e.g. six, power semiconductor devices, e.g. IGBTs 8 .
- the IGBTs 8 are connected in a full-bridge circuit configuration.
- the DC voltage applied to the inverter 6 is converted therein to a high-frequency voltage, which is developed between two inverter output terminals 10 a and 10 b .
- the high-frequency voltage is voltage-transformed by a transformer (not shown), and the voltage-transformed high-frequency voltage is converted to a DC voltage by a high-frequency-to-DC converting circuit (not shown).
- the resulting DC voltage is applied across a load, for example, between a torch and workpiece in a welding machine, or between two electrodes for electroplating.
- Control signals for controlling the respective IGBTs 8 to convert the DC voltage applied thereto to the high-frequency voltage are supplied to the respective IGBTs 8 from a driver circuit 12 .
- a control circuit 14 gives instructions to the driver circuit 12 regarding the manner in which the IGBTs 8 should be controlled.
- each of the IGBTs 8 is arranged in a chip form and mounted on a heat sink 16 .
- Each IGBT 8 is the electrical component as referred to in the accompanying Claims.
- the heat sink 16 has an IGBT mounting surface 16 a of a rectangular shape, for example, as shown in FIG. 3 , and also a number of fins 16 b on the opposite surface.
- the fins 16 b extend substantially perpendicularly to the mounting surface 16 a .
- Three IGBTs 8 are disposed in a row on the mounting surface 16 a , and their heat dissipating surfaces are in surface-contact with the mounting surface 16 a .
- the three IGBTs 8 are pressed against the mounting surface 16 a by means of a retainer 18 a.
- the retainer 18 a has three planar portions 181 a contacting a larger portion of the surfaces of the three IGBTs 8 opposite to the heat dissipating surfaces thereof.
- the three planar portions 181 a are connected together by a connecting portion 181 b , which is bent, at a portion near a first side surface of the IGBTs 8 , toward the mounting surface 16 a of the heat sink 16 .
- a lip portion 181 c integral with the connecting portion 181 b is in contact with the mounting surface 16 a .
- the lip portions 181 c is fixed to the mounting surface 16 a by means of two screws 20 a .
- the respective IGBTs 8 are screwed to the mounting surface 16 a by three screws 22 a extending, through the respective planar portions 181 a of the retainer 18 and the IGBTs 8 , into the mounting surface 16 a .
- the remaining three IGBTs 8 are similarly mounted on the mounting surface 16 a of the heat sink 16 by means of a retainer 18 b and screws 20 b and 22 b , which are similar to the retainer 18 a and the screws 20 a and 22 a.
- Each IGBT 8 has three leads 24 a , 24 b and 24 c .
- the three leads 24 a - 24 c of each IGBT 8 extend from a second side surface thereof, which is opposite to the first side surface, in the direction away from the retainers 18 a and 18 b , and are bent in a direction away from the heat sink 16 .
- the leads 24 a - 24 c are made of a material having high rigidity, e.g. metal.
- the leads 24 a - 24 c are the connector referred to in the accompanying Claims.
- the leads 24 a - 24 c are electrically and mechanically connected by, for example, soldering, to patterned conductors formed at predetermined locations on a printed circuit board 120 , on which the driver circuit 12 is arranged. This eliminates the need for use of wires for electrical connections between the respective IGBTs 8 and the printed circuit board 120 .
- the printed circuit board 120 is disposed, being spaced from and substantially in parallel with the mounting surface 16 a of the heat sink 16 .
- the printed circuit board 120 slightly overlaps the mounting surface 16 a , and the remaining portion lies outside the mounting surface 16 a .
- the printed circuit board 120 is the first printed circuit board referred to in the accompanying Claims.
- the printed circuit board 120 has its portion remote from the mounting surface 16 a secured to a printed circuit board 140 , on which the control circuit 14 is arranged, by means of three screws 32 .
- the driver circuit on the printed circuit board 120 is electrically connected to the control circuit 14 on the printed circuit board 140 .
- the printed circuit board 140 is disposed, being spaced from and in parallel with the outermost fin 16 b , and is secured to the outermost fin 16 b by means of a plurality of spacers 26 and screws 28 .
- the major surfaces of the printed circuit board 140 lie perpendicular to the IGBTs 8 . In this manner, the heat sink 16 with the IGBTs 8 mounted thereon and the printed circuit boards 120 and 140 form one block.
- the printed circuit board 140 is the second printed circuit board referred to in the accompanying Claims.
- the printed circuit boards 120 and 140 are formed of a rigid or hard insulating materials, e.g. a glass epoxy material, with a electrically conductive film, e.g. copper foil. Electric components are soldered to the conductive films at predetermined locations. If, therefore, the dimensional precision of the printed circuit boards 120 and 140 is low, and/or the precision of assemblage of the IGBTs 8 and printed circuits boards 120 and 140 is low, strain may be put on the IGBTs 8 , which causes the IGBTs 8 to rise up from the mounting surface 16 a , resulting in insufficient heat dissipation from the IGBTs 8 . In some cases, strain is put on the leads 24 a - 24 c of the IGBTs 8 , causing the rigid leads 24 a - 24 c to snap or bend.
- a rigid or hard insulating materials e.g. a glass epoxy material
- a electrically conductive film e.g. copper foil. Electric components are soldered to the conductive films
- a flexible portion 30 is formed in the printed circuit board 120 .
- the printed circuit board 120 is a multi-layered printed circuit board formed of an epoxy glass material 120 a within which a conductive pattern formed of plural, e.g. three, conductive films 120 b , is arranged.
- the flexible portion 30 is formed by removing part of the epoxy glass material 120 a from the opposite major surfaces of the epoxy glass material 120 a , at a location slightly spaced in the direction away from the leads 24 a - 24 c .
- the flexible portion 30 extends in the direction along which the leads 24 a - 24 c are arranged.
- the flexible portion 30 can absorb strain which may be generated, as described above, when the dimensional precision of the printed circuit boards 120 and 140 and/or the precision of assembling the IGBTs 8 and the printed circuit boards 120 and 140 are low. Then, it never happens that the contact of the IGBTs 8 with the heat sink 16 becomes defective, or that the leads 24 a - 24 c snap or bend. Since the flexible portion 30 is formed by removing part of the insulating material of the printed circuit board 120 , there is no need for preparing a separate, flexible printed circuit board for connection of the IGBTs 8 and the printed circuit board 120 , in order for strain to be absorbed.
- the present invention has been described as being embodied in a power supply apparatus for welders or electroplating machines. However, the present invention is not limited to them, but it can be embodied in any electrical apparatuses in which electrical components need be connected to printed circuit boards.
- the flexible portion has been described as being formed in a multi-layered printed circuit board, but, when the printed circuit board used includes a conductive film only on one surface, the flexible portion can be formed by removing part of the insulating material from the other surface of the printed circuit board.
- the leads of the semiconductor devices are soldered to the printed circuit board 120 , but they may be electrically and mechanically connected by screwing, caulking or the like.
- other semiconductor devices such as bipolar transistors and FETs, than IGBTs may be used.
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Combinations Of Printed Boards (AREA)
- Structure Of Printed Boards (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
Description
Claims (1)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US12/475,728 US7902464B2 (en) | 2005-05-25 | 2009-06-01 | Heat sink arrangement for electrical apparatus |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005-152393 | 2005-05-25 | ||
JP2005152393A JP2006332247A (en) | 2005-05-25 | 2005-05-25 | Heat radiation structure of electric power unit and electric apparatus |
US11/439,412 US7579554B2 (en) | 2005-05-25 | 2006-05-22 | Heat sink arrangement for electrical apparatus |
US12/475,728 US7902464B2 (en) | 2005-05-25 | 2009-06-01 | Heat sink arrangement for electrical apparatus |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US11/439,412 Division US7579554B2 (en) | 2005-05-25 | 2006-05-22 | Heat sink arrangement for electrical apparatus |
Publications (2)
Publication Number | Publication Date |
---|---|
US20090237898A1 US20090237898A1 (en) | 2009-09-24 |
US7902464B2 true US7902464B2 (en) | 2011-03-08 |
Family
ID=37444380
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US11/439,412 Active 2027-01-25 US7579554B2 (en) | 2005-05-25 | 2006-05-22 | Heat sink arrangement for electrical apparatus |
US12/475,728 Active 2026-07-19 US7902464B2 (en) | 2005-05-25 | 2009-06-01 | Heat sink arrangement for electrical apparatus |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US11/439,412 Active 2027-01-25 US7579554B2 (en) | 2005-05-25 | 2006-05-22 | Heat sink arrangement for electrical apparatus |
Country Status (3)
Country | Link |
---|---|
US (2) | US7579554B2 (en) |
JP (1) | JP2006332247A (en) |
CN (1) | CN100562216C (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9943015B2 (en) | 2015-08-17 | 2018-04-10 | Man Piu Fung | Assembly structure of high-power semiconductors and heat sink |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010010630A (en) * | 2008-06-30 | 2010-01-14 | Fujitsu Ltd | Substrate unit, substrate, and electronic device |
KR101182661B1 (en) | 2011-05-27 | 2012-09-17 | 주식회사 유라코퍼레이션 | Cooling pan device of power module for using inverter |
KR101182662B1 (en) | 2011-05-27 | 2012-09-14 | 주식회사 유라코퍼레이션 | Cooling pan device of power module for using inverter |
JP5663450B2 (en) | 2011-10-18 | 2015-02-04 | 株式会社日立製作所 | Power converter |
JP6637479B2 (en) | 2017-11-16 | 2020-01-29 | 矢崎総業株式会社 | Electronic circuit board |
Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4931134A (en) | 1989-08-15 | 1990-06-05 | Parlex Corporation | Method of using laser routing to form a rigid/flex circuit board |
US5031023A (en) * | 1989-07-11 | 1991-07-09 | Sgs-Thomson Microelectronics S.R.L. | Single-In-Line plastic package with open ended slots for slidingly accommodating fasteners' stems prearranged on an external heat sink |
DE4231140A1 (en) | 1992-09-17 | 1994-03-24 | Bosch Gmbh Robert | Electronic control appts. module - has power component mounted on circuit board with flexible section allowing it to contact heat sink element |
JPH077167U (en) | 1993-06-29 | 1995-01-31 | 松下電工株式会社 | Electrical component mounting structure |
US5988738A (en) | 1995-05-11 | 1999-11-23 | Blessing; Veit | Seat group element |
US6185101B1 (en) | 1997-12-24 | 2001-02-06 | Denso Corporation | Electronic circuit apparatus and method for assembling the same |
US6501662B2 (en) | 2000-01-28 | 2002-12-31 | Sanden Corporation | Motor driving inverter |
US6646884B1 (en) | 1999-05-31 | 2003-11-11 | Tyco Electronics Logistics Ag | Sandwich-structured intelligent power module |
US7012812B2 (en) | 2002-03-13 | 2006-03-14 | Rambus, Inc. | Memory module |
US7151671B2 (en) * | 2001-12-04 | 2006-12-19 | Tokyo R & D Co., Ltd. | Power supply |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63108675U (en) * | 1986-12-27 | 1988-07-13 | ||
JPH03241786A (en) * | 1990-02-19 | 1991-10-28 | Aiwa Co Ltd | Packaging of mechanism parts onto printed-circuit board |
JPH07193370A (en) * | 1993-12-25 | 1995-07-28 | Ibiden Co Ltd | Flex rigid printed board and its manufacturing method |
US5998738A (en) * | 1996-08-30 | 1999-12-07 | Motorola Inc. | Electronic control module |
-
2005
- 2005-05-25 JP JP2005152393A patent/JP2006332247A/en active Pending
-
2006
- 2006-05-22 US US11/439,412 patent/US7579554B2/en active Active
- 2006-05-25 CN CNB2006100996342A patent/CN100562216C/en active Active
-
2009
- 2009-06-01 US US12/475,728 patent/US7902464B2/en active Active
Patent Citations (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5031023A (en) * | 1989-07-11 | 1991-07-09 | Sgs-Thomson Microelectronics S.R.L. | Single-In-Line plastic package with open ended slots for slidingly accommodating fasteners' stems prearranged on an external heat sink |
US4931134A (en) | 1989-08-15 | 1990-06-05 | Parlex Corporation | Method of using laser routing to form a rigid/flex circuit board |
DE4231140A1 (en) | 1992-09-17 | 1994-03-24 | Bosch Gmbh Robert | Electronic control appts. module - has power component mounted on circuit board with flexible section allowing it to contact heat sink element |
JPH077167U (en) | 1993-06-29 | 1995-01-31 | 松下電工株式会社 | Electrical component mounting structure |
US5988738A (en) | 1995-05-11 | 1999-11-23 | Blessing; Veit | Seat group element |
US6185101B1 (en) | 1997-12-24 | 2001-02-06 | Denso Corporation | Electronic circuit apparatus and method for assembling the same |
US6418021B1 (en) | 1997-12-24 | 2002-07-09 | Denso Corporation | Electronic circuit apparatus and method for assembling the same |
US6646884B1 (en) | 1999-05-31 | 2003-11-11 | Tyco Electronics Logistics Ag | Sandwich-structured intelligent power module |
US6501662B2 (en) | 2000-01-28 | 2002-12-31 | Sanden Corporation | Motor driving inverter |
US7151671B2 (en) * | 2001-12-04 | 2006-12-19 | Tokyo R & D Co., Ltd. | Power supply |
US7012812B2 (en) | 2002-03-13 | 2006-03-14 | Rambus, Inc. | Memory module |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9943015B2 (en) | 2015-08-17 | 2018-04-10 | Man Piu Fung | Assembly structure of high-power semiconductors and heat sink |
Also Published As
Publication number | Publication date |
---|---|
CN1870858A (en) | 2006-11-29 |
US20060267180A1 (en) | 2006-11-30 |
US7579554B2 (en) | 2009-08-25 |
US20090237898A1 (en) | 2009-09-24 |
CN100562216C (en) | 2009-11-18 |
JP2006332247A (en) | 2006-12-07 |
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