JP2020181956A - Electronic device - Google Patents

Abstract

To provide an electronic device capable of dissipating heat generated from electronic components to a wiring substrate side.SOLUTION: The electronic device includes a heat radiation fin 11 having two screw holes 11A formed therein, a second electronic component 13, a wiring substrate 21 on which a second through-hole 53B and the through-portion 53C are formed, a metal attachment member 19 having a plurality of heat radiating portions 44 provided on an upper surface 42b of a second portion 42 exposed from the through-portion 53C and projecting above the upper surface 42b of the wiring substrate 21 from the upper surface 42b of the second portion 42 and a third through-hole 46, and a screw 27, inserted into the second through-hole 53B and the third through-hole 46 from the upper surface 21b side of the wiring substrate 21, fastened to the screw holes 11A.SELECTED DRAWING: Figure 2

Description

The present invention relates to an electronic device.

Patent Document 1 discloses an electronic device including an electronic component that generates heat and a heat radiating fin that dissipates heat from the electronic component.

As one of the above electronic components, there is an intelligent power semiconductor module (DIP IPM) having a transfer mold structure in which a switching element and a control integrated circuit for driving and protecting the switching element are incorporated.

The intelligent power semiconductor module (hereinafter, simply referred to as “semiconductor module”) has a plurality of connection terminals extending upward, and is formed with a first through hole for passing a screw.
An electronic device provided with a semiconductor module having such a configuration has a pad in which a second through hole for inserting a screw is formed in addition to the semiconductor module and is electrically connected to a plurality of connection terminals. It has a wiring board having a wiring board and heat radiation fins having screw holes formed therein.

The electronic device is inserted into the first and second through holes with the semiconductor module sandwiched between the wiring board and the heat radiation fins, and three components (wiring board,) are provided by screws fastened to the screw holes. The heat radiation fins and semiconductor module) are fixed.

Republished WO 2016/071964

By the way, in recent years, there has been a demand to dissipate heat generated from electronic components (semiconductor modules) constituting an electronic device to a wiring board side.
However, in the above electronic device, it is difficult to dissipate the heat generated from the electronic component (semiconductor module) to the wiring board side.

Therefore, an object of the present invention is to provide an electronic device capable of dissipating heat generated from an electronic component to a wiring board side.

In order to solve the above problems, the electronic device according to one aspect of the present invention is placed on a plate material having two screw holes arranged at intervals in the first direction and an upper surface of the plate material. An electronic component body, two first through holes formed in the electronic component body and formed inside the two screw holes in the first direction, and a plurality of connections provided in the electronic component body. An electronic component having a terminal, a second through hole facing the screw hole, and a second through hole penetrating in the thickness direction of the electronic component on which the plate material and the electronic component are laminated, and the second through hole. A wiring board in which a penetrating portion penetrating in the same direction is formed and electrically connected to the plurality of connection terminals with a space interposed between the electronic component and the electronic component in the thickness direction of the electronic component. A third through hole is formed between the screw hole and the second through hole, and faces the screw hole and the second through hole, and is arranged at a distance in the first direction. Two first portions, a second portion provided in the space, extending in the first direction and connecting the two first portions, the second portion exposed from the penetrating portion. A plurality of heat radiating portions provided on the upper surface of the second portion and projecting upward from the upper surface of the wiring substrate, and the two first portions and the second portion are partitioned by the electrons. A metal attachment member having a recess for accommodating a component, and a screw inserted into the second through hole and the third through hole from the upper surface side of the wiring board and fastened to the screw hole. The electronic component is fixed between the wiring board and the plate material by pressing the electronic component body in a direction from the second portion toward the plate material.

According to the present invention, a plurality of wiring boards on which a penetration portion is formed and a plurality of wiring boards provided on the upper surface of a second portion exposed from the penetration portion and projecting upward from the upper surface of the second portion above the upper surface of the wiring board. By providing a metal attachment member having a heat dissipation portion of the above, heat generated from an electronic component is conducted to a plurality of heat dissipation portions via a second portion, and a plurality of heat dissipation provided on the wiring board side is provided. It is possible to dissipate heat from the unit to the outside of the electronic device.

Further, in the electronic device according to one aspect of the present invention, the plate material has two through holes arranged at intervals in the first direction, and is larger than the electronic component. It is a heat radiation fin including a component mounting surface on which an electronic component is mounted, and the through hole may be formed at a position facing the screw hole.

In this way, the heat radiation fins, electronic components, wiring boards, metal attachment members, and screws that are the plate materials are provided, and the screws inserted into the second through hole and the third through hole are fastened to the screw holes of the plate material. This makes it possible to fix the electronic component between the heat radiation fin and the metal attachment member without using the first through hole formed in the electronic component.
As a result, when replacing another electronic component with an electronic component having a smaller outer shape than the other electronic component, the heat radiation fin used in the other electronic component can be diverted.

Further, by fastening the screw to the screw hole, the entire surface of the second portion in contact with the electronic component body presses the electronic component body in the direction from the wiring board to the heat radiation fins, so that the entire electronic component body is pressed. Can be pressed uniformly.
As a result, the heat of the electronic component can be conducted to the heat radiation fin from the entire surface of the electronic component located on the heat radiation fin side, so that the heat dissipation characteristics of the heat radiation fin can be improved.

Further, in the electronic device according to one aspect of the present invention, an insulating sheet provided between the plurality of connection terminals and the heat radiation fins and surrounding the outer periphery of the electronic component may be provided.

As described above, the electronic component is an electronic component whose outer shape is smaller than that of other electronic components. Therefore, the thickness of the electronic component is thinner than the thickness of other electronic components.
Therefore, in the thickness direction of the electronic component, the distance from the connection terminal formed on the electronic component to the heat radiation fin is smaller than the distance from the connection terminal formed on the other electronic component to the heat radiation fin.
Therefore, by providing an insulating sheet that surrounds the outer periphery of the electronic component between the plurality of connection terminals constituting the electronic component and the heat radiation fin, it is possible to suppress the connection between the connection terminal and the heat radiation fin.

Further, in the electronic device according to one aspect of the present invention, the first portion includes a first portion main body in which the third through hole is formed and extends in a direction from the wiring board toward the heat radiation fin. It has a protruding portion that projects from the inner side surface of the first portion main body toward the electronic component and supports the outer peripheral portion of the insulating sheet in a state where the insulating sheet and the heat radiating fin do not come into contact with each other. The insulating sheet may be arranged so as to be sandwiched between the protrusion and the plurality of connection terminals.

By providing the protruding portion having such a configuration and arranging the insulating sheet so as to be sandwiched between the protruding portion and the plurality of connection terminals, the position of the insulating sheet in the thickness direction of the electronic component is regulated. be able to.

Further, in the electronic device according to the one aspect of the present invention, grease may be provided between the electronic component main body and the heat radiation fin.

By having the grease arranged between the electronic component main body and the heat radiation fins in this way, it is possible to improve the adhesion between the electronic component main body and the heat radiation fins via the grease. As a result, the heat generated from the main body of the electronic component can be efficiently conducted to the heat radiating fins, so that the heat radiating characteristics can be improved.

Further, in the electronic device according to one aspect of the present invention, the material of the plate material may be an insulating material.

As described above, an insulating material may be used as the material of the plate material.

Further, in the electronic device according to one aspect of the present invention, the electronic component body has a rectangular shape in a plan view, and has a first side surface and a first side surface arranged in a second direction orthogonal to the first direction. Of the plurality of connection terminals including the second side surface, some of the connection terminals project from the first side surface and are provided so as to extend from the electronic component toward the wiring board, and the remaining connection terminals are provided. Is provided so as to project from the second side surface and extend from the electronic component toward the wiring board, and the second portion is formed by connecting a part of the connection terminals and the remaining connection terminals. It may be arranged between them and have a thickness that does not protrude from the connection terminal.

As described above, the thickness is set so as not to protrude from the connection terminal between a part of the plurality of connection terminals provided on the first side surface and the rest of the plurality of connection terminals provided on the second side surface. By arranging the portion of, it is possible to prevent the second portion from interfering with the electrical connection between the plurality of connection terminals and the wiring board.

Further, in the electronic device according to one aspect of the present invention, a flange portion in contact with the upper surface of the wiring substrate, a bush body inserted into the second through hole and the third through hole, and the second penetration. A screw insertion hole that penetrates the flange portion and the bush body in the direction in which the hole and the third through hole extend and into which the screw is inserted, and an engaging protrusion that protrudes radially outward from the outer peripheral surface of the bush body. A bush having a portion may be provided, and an engaging groove portion that engages with the engaging protrusion may be formed in the third through hole.

By providing a bush having an engaging protrusion having such a configuration and forming an engaging groove for engaging with the engaging protrusion in the third through hole, the engaging protrusion and the engaging groove can be formed. Can be engaged to temporarily fix the wiring board to the metal attachment member.
As a result, it is possible to easily perform the work of inserting the screw into the screw insertion hole formed in the bush and fastening the screw to the screw hole formed in the plate material.

Further, in the electronic device according to one aspect of the present invention, a cushioning sheet that is arranged between the second portion and the electronic component main body and is in close contact with the second portion and the electronic component main body is further provided. You may.

In this way, by providing a cushioning sheet in close contact with the second portion and the electronic component body between the second portion and the electronic component body, when the electronic component body is pressed by the second portion, The electronic component body can be protected from impact, and the electronic component body can be pressed over the entire surface of the second portion facing the electronic component body via the cushioning sheet.

According to the present invention, heat generated from electronic components can be dissipated to the wiring board side.

It is a side view which shows the schematic structure of the electronic device which concerns on 1st Embodiment of this invention. It is an exploded perspective view of the electronic device shown in FIG. It is a perspective view of the electronic device shown in FIG. Of the electronic devices shown in FIG. 1, a first portion of a wiring board, a bush, and an attachment member surrounded by a region A is shown in a vertical cross section and is an enlarged view. Of the electronic devices shown in FIG. 1, it is an enlarged view of a second electronic component surrounded by a region B, an insulating sheet, a first portion of an attachment member, and heat radiation fins. It is a side view of the electronic device in which the wiring board, the first electronic component, and the radiation fin are screwed. It is a side view which shows the schematic structure of the electronic device which concerns on 2nd Embodiment of this invention.

(Embodiment)
The electronic device 10 of the first embodiment will be described with reference to FIGS. 1 to 6.
In FIGS. 1 to 6, the X direction is the direction (first direction) in which the two first through holes 39 (or the through holes 114 shown in FIG. 6) are arranged, and the Z direction is orthogonal to the X direction. The thickness direction of the second electronic component 13 (or the first electronic component 101) is shown as well as the thickness direction.
In FIG. 2, the solder 31 shown in FIG. 1 is not shown. In FIG. 2, the Y direction indicates a direction (second direction) orthogonal to the X direction and the Z direction.
In FIG. 4, O indicates the axis of the third through hole 46 (hereinafter, referred to as “axis O”).

The electronic device 10 includes a heat radiation fin 11 which is a plate material, a second electronic component 13 (electronic component), grease 15, a metal attachment member 19, a wiring board 21, a bush 23, and a cushioning sheet 25. , A screw 27, an insulating sheet 29, and a solder 31.
Among the components of the electronic device 10, the grease 15, the second electronic component 13, the metal attachment member 19, and the wiring board 21 are placed on the heat radiation fins 11 with the grease 15, the second electronic component 13, and the metal attachment. The members 19 and the wiring board 21 are laminated in this order.

The heat radiation fin 11 is a wiring board 103 corresponding to a first electronic component 101 (another electronic component) having a larger outer shape than the second electronic component 13 and a plurality of connection terminals 112 constituting the first electronic component 101. It is the same heat radiation fin as the heat radiation fin 11 used in the electronic device 100 provided with the above.

Here, while explaining the configuration of the electronic device 100 with reference to FIG. 6, the heat radiating fins 11 used in the electronic device 10 will be described.

The electronic device 100 includes a first electronic component 101, heat radiation fins 11, a wiring board 103, screws 27, and solder 105.

The first electronic component 101 has an electronic component main body 111, a plurality of connection terminals 112, and a through hole 114.
The electronic component main body 111 has a rectangular shape in a plan view. The electronic component main body 111 has side surfaces 111A and 111B arranged in the X direction and two side surfaces arranged in the direction toward the paper surface of FIG. 6 (directions orthogonal to the X direction and the Z direction) (hereinafter, "terminals"). It has "arrangement surface").
The electronic component main body 111 has a surface 111a in contact with the heat radiation fins 11 and a surface 111b arranged on the opposite side of the surface 111a and in contact with the wiring board 103.

A part of the plurality of connection terminals 112 is provided on one terminal arrangement surface, and the rest is provided on the other terminal arrangement surface. The connection terminals 112 provided on the two terminal mounting surfaces are arranged at intervals in the X direction.

The connection terminal 112 has a first terminal portion 112A and a second terminal portion 112B. The first terminal portion 112A has an L-shape and projects in the direction from the surface 111a to the surface 111b.
The second terminal portion 112B projects from the tip of the first terminal portion 112A in the direction toward the wiring board 103. The width of the second terminal portion 112B in the X direction is narrower than the width of the first terminal portion 112A. The second terminal portion 112B is arranged so as to penetrate the wiring board 103.

Two through holes 114 are formed so as to penetrate the electronic component main body 111 in the Z direction. The two through holes 114 are arranged so as to sandwich the plurality of connection terminals 112 from the X direction when viewed from the side. One through hole 114 is formed at one end of the electronic component main body 111 arranged on one side in the X direction. The other through hole 114 is formed at the other end of the electronic component main body 111 arranged on the other side in the X direction.

As the first electronic component 101 configured as described above, for example, an intelligent power semiconductor module (DIP IPM) having a transfer mold structure incorporating a switching element and a control integrated circuit for driving and protecting the switching element is exemplified. be able to.

The heat radiation fin 11 is a metal member having a rectangular shape in a plan view, and has a component mounting surface 11a, an outer peripheral surface 11b, and a screw hole 11A.
The component mounting surface 11a is a rectangular flat surface that contacts the surface 111a of the electronic component body 111.
The outer peripheral surface 11b is a flat surface arranged outside the component mounting surface 11a.

The screw hole 11A is formed at a position facing the through hole 114. Therefore, two screw holes 11A are formed at intervals in the X direction.
The heat radiating fin 11 having the above configuration radiates heat generated from the first electronic component 101 to the outside of the electronic device 100.

The wiring board 103 has an insulating board 116, a pad portion 118 (land portion), and a wiring pattern (not shown) connected to the pad portion 118.

The insulating substrate 116 has a rectangular shape, and has surfaces 116a and 116b, a terminal insertion hole 116A, and a through hole 116B.
The surface 116a is in contact with the surface 111b of the electronic component body 111. The surface 116b is a surface arranged on the opposite side of the surface 116a.

The terminal insertion hole 116A is formed so as to penetrate the portion of the insulating substrate 116 facing the second terminal portion 112B in the Z direction. A second terminal portion 112B is inserted into the terminal insertion hole 116A. The second terminal portion 112B inserted into the terminal insertion hole 116A protrudes from the pad portion 118.

The through hole 116B is formed so as to penetrate the portion of the insulating substrate 116 facing the through hole 114 in the Z direction. The through holes 116B are arranged at intervals in the X direction.

A plurality of pad portions 118 are formed on the surface 116b. The pad portion 118 is arranged so as to surround the terminal insertion hole 116A.
The wiring pattern (not shown) is formed on the surface 116b. The wiring pattern is connected to the pad portion 118.

The screw 27 is fastened to the screw hole 11A in a state of being inserted into the through hole 116B and the through hole 114 from the surface 116b side. The screw 27 fixes the first electronic component 101 between the wiring board 103 and the heat radiation fin 11.

The solder 105 is provided on the pad portion 118 so as to surround the second terminal portion 112B. The solder 105 fixes the second terminal portion 112B and the pad portion 118.

Next, with reference to FIGS. 1 to 5, the second electronic component 13, grease 15, metal attachment member 19, wiring board 21, bush 23, cushioning sheet 25, screw 27, which constitute the electronic device 10, The insulating sheet 29 and the solder 31 will be described in order.

The second electronic component 13 has an electronic component main body 35, a plurality of connection terminals 37, and a first through hole 39.
The electronic component main body 35 has a rectangular shape in a plan view. The electronic component main body 35 has surfaces 35a and 35b, side surfaces 35A and 35B, a first side surface 35C, and a second side surface 35D.
The surface 35a is a flat surface that contacts the component mounting surface 11a of the heat radiation fin 11. The surface 35b is a plane arranged on the opposite side of the surface 35a.

The side surfaces 35A and 35B are planes orthogonal to the X direction. The side surface 35A is arranged on one side in the X direction. The side surface 35B is arranged on the other side in the X direction (arranged on the opposite side of the side surface 35A).
The thickness, width (width in the Y direction), and length (length in the X direction) of the electronic component body 35 are the thickness, width (width in the Y direction), and length of the electronic component body 111 shown in FIG. It is configured to be smaller than the length (length in the X direction).

A part of the plurality of connection terminals 37 is provided on the first side surface 35C, and the rest is provided on the second side surface 35D. The connection terminals 37 provided on the first and second side surfaces 35C and 35D are arranged at intervals in the X direction.
The connection terminal 37 has a first terminal portion 37A and a second terminal portion 37B.
The first terminal portion 37A has an L-shape and projects in the direction from the surface 35a to the surface 35b.
The second terminal portion 37B projects from the tip of the first terminal portion 37A in the direction toward the wiring board 21. The width of the second terminal portion 37B in the X direction is configured to be narrower than the width of the first terminal portion 37A.

In the connection terminal 37 having the above configuration, the second terminal portion 37B penetrates the wiring board 21 in the Z direction, and the first terminal portion 37A is arranged on the heat radiation fin 11 side of the wiring board 21.
In this state, a space C extending in the horizontal direction (direction orthogonal to the Z direction) is formed between the wiring board 21 and the electronic component main body 35. A plurality of second terminal portions 37B are arranged on both sides of the space C in the Y direction.

As described above, the thickness of the electronic component main body 35 is configured to be thinner than the thickness of the electronic component main body 111 shown in FIG.
Therefore, the distance in the Z direction from the plurality of connection terminals 37 constituting the second electronic component 13 to the heat radiation fins 11 is the Z from the plurality of connection terminals 112 constituting the first electronic component 101 to the heat radiation fins 11. It is shorter than the distance in the direction.

Two first through holes 39 are formed so as to penetrate the electronic component main body 35 in the Z direction. The two first through holes 39 are arranged so as to sandwich the plurality of connection terminals 37 from the X direction when viewed from the side.
One first through hole 39 is formed at one end of the electronic component main body 35 arranged on one side in the X direction. The other first through hole 39 is formed at the other end of the electronic component body 35 arranged on the other side in the X direction.

As the second electronic component 13 configured as described above, for example, an intelligent power semiconductor module (DIP IPM) having a transfer mold structure incorporating a switching element and a control integrated circuit for driving and protecting the switching element shall be exemplified. Can be done.

As described above, the thickness, width (width in the Y direction), and length (length in the X direction) of the electronic component main body 35 are the thickness and width (Y) of the electronic component main body 111 shown in FIG. It is configured to be smaller than the width in the direction) and the length (length in the X direction).
Therefore, the formation positions of the two first through holes 39 are formed in the first electronic component 101 and are arranged inside the formation positions of the two through holes 114.

That is, the formation positions of the two first through holes 39 are arranged inside the two screw holes 11A formed in the heat radiation fin 11.
Therefore, it is not possible to insert the screw 27 into the first through hole 39 formed in the second electronic component 13 and fasten the screw 27 to the screw hole 11A formed in the heat radiation fin 11.

The grease 15 is provided between the surface 35a of the electronic component main body 35 and the component mounting surface 11a of the heat radiation fin 11. The grease 15 is in contact with the surface 35a of the electronic component main body 35 and the component mounting surface 11a of the radiating fin 11 in a state of being pressed from the wiring board 21 toward the radiating fin 11.

In this way, by having the grease 15 arranged between the surface 35a of the electronic component main body 35 and the component mounting surface 11a of the heat radiation fin 11, the electronic component main body 35 and the heat radiation fin 11 are connected to each other via the grease 15. It is possible to improve the adhesion between the two. As a result, the heat generated from the electronic component main body 35 can be efficiently conducted to the heat radiating fins 11, so that the heat radiating characteristics of the heat radiating fins 11 can be improved.

The metal attachment member 19 is a member arranged between the heat radiation fin 11 and the second electronic component 13 and the wiring board 21.
The metal attachment member 19 has two first portions 41, a second portion 42, a recess 43, and a plurality of heat radiating portions 44.

The first portion 41 is provided between the screw hole 11A formed in the heat radiation fin 11 and the second through hole 53B formed in the wiring board 21. The two first portions 41 are arranged so as to face each other via the second electronic component 13.
The first portion 41 has a first portion main body 45, a third through hole 46, an engaging groove portion 47, and a protruding portion 48.

The first partial main body 45 is a square columnar member extending in the Z direction (direction from the wiring board 21 toward the heat radiation fins 11). The first partial main body 45 is provided between the screw hole 11A and the second through hole 53B.
The first partial main body 45 has a lower surface 45a and an upper surface 45b arranged in the Z direction, and an inner side surface 45c.

The lower surface 45a is a flat surface arranged on the heat radiation fin 11 side. In a state where the screw 27 is fastened to the screw hole 11A (state shown in FIG. 1), the lower surface 45a is in contact with the outer peripheral surface 11b of the heat radiation fin 11.
The upper surface 45b is a flat surface arranged on the wiring board 21 side, and is integrally formed with the upper surface 42b. The upper surface 45b is flush with the upper surface 42b.
The upper surface 45b is arranged on the opposite side of the lower surface 45a. In a state where the screw 27 is fastened to the screw hole 11A (state shown in FIG. 1), the lower surface 45a is in contact with the outer peripheral surface 11b of the heat radiation fin 11.
The inner side surface 45c is a side surface arranged on the side of the second electronic component 13. The inner side surface 45c faces the second electronic component 13 in the X direction.

The third through hole 46 is formed so as to penetrate the first partial main body 45 located between the screw hole 11A and the second through hole 53B formed in the wiring board 21 in the Z direction.
In the third through hole 46, not only the screw 27 but also the bush body 57 of the bush 23 having a larger outer diameter than the screw 27 is inserted from the wiring board 21 side.
Therefore, the opening diameter of the third through hole 46 is formed to be larger than the opening diameter of the screw hole 11A.

The engaging groove 47 projects from the inner peripheral surface 46a of the third through hole 46 in the direction toward the axis O of the third through hole 46, and two ring-shaped protrusions arranged at positions adjacent to each other in the Z direction. It is formed between the portions 49. The engaging groove portion 47 is a ring-shaped groove extending in the circumferential direction of the third through hole 46.

The protruding portion 48 is provided inside the lower end portion of the first partial main body 45. The projecting portion 48 projects from the inner side surface 45c of the first partial main body 45 toward the second electronic component 13.
The protrusion 48 has a surface 48a and a support surface 48b. The surface 48a and the support surface 48b are planes orthogonal to the Z direction. The surface 48a is arranged on the heat radiation fin 11 side. The surface 48a forms a part of the lower surface 45a and is in contact with the outer peripheral surface 11b of the heat radiation fin 11.
The support surface 48b is a surface arranged on the opposite side of the surface 48a, and is arranged on the wiring board 21 side. The support surface 48b supports the insulating sheet 29.

By having the protruding portion 48 having such a configuration, it is possible to support the insulating sheet 29 between the plurality of connection terminals 37 and the protruding portion 48. Thereby, the position of the insulating sheet 29 in the Z direction can be regulated.

The second portion 42 is provided in the space C and extends in the X direction. The second portion 42 is a member having a quadrangular prism shape. The second portion 42 connects two first portions 41 arranged in the X direction. The second portion 42 is integrally formed with the two first portions 41.
The second portion 42 has a flat lower surface 42a and an upper surface 42b. The lower surface 42a faces the surface 35b of the electronic component body 35 in the Z direction.
A part of the upper surface 42b is exposed from the penetrating portion 53C formed on the wiring board 21. The remaining portion of the upper surface 42b (the portion located outside the penetrating portion 53C) is in contact with the lower surface 21a of the wiring board 21.

The second portion 42 is arranged between a part of the plurality of connection terminals 37 provided on the first side surface 35C and the rest of the plurality of connection terminals 37 provided on the second side surface 35D. The second portion 42 has a thickness that does not protrude from the plurality of connection terminals 37.

In this way, the second portion 42 is arranged between a part of the plurality of connection terminals 37 provided on the first side surface 35C and the rest of the plurality of connection terminals 37 provided on the second side surface 35D. At the same time, by setting the thickness of the second portion 42 so that it does not protrude from the plurality of connection terminals 37, the second portion 42 interferes with the electrical connection between the plurality of connection terminals 37 and the wiring board 21. Can be suppressed.

The second portion 42 is a cushioning sheet 25 arranged between the second portion 42 and the electronic component main body 35 when the wiring board 21 and the metal attachment member 19 are fixed to the heat radiation fins 11 by screws 27. The electronic component main body 35 is pressed by the entire lower surface 42a of the second portion 42.

The recess 43 is partitioned by the inner side surfaces 45c of the two first portions 41, the two protrusions 48, and the lower surface 42a of the second portion 42. The recess 43 accommodates the entire second electronic component 13.

The plurality of heat radiating portions 44 are provided on a part of the upper surface 42b exposed from the penetrating portion 53C among the upper surface 42b of the second portion 42. The plurality of heat radiating portions 44 are arranged at intervals in the X direction.
The heat radiating portion 44 projects upward from the upper surface 42b of the second portion 42 to the upper surface 21b of the wiring board 21. As a result, the upper end surface 44a of the heat radiating portion 44 is arranged above the upper surface 21b of the wiring board 21.
That is, the plurality of heat radiating portions 44 have a height that allows sufficient contact with the outside air located on the wiring board 21 side.

As described above, the wiring board 21 on which the penetration portion 53C is formed and the upper surface 42b of the second portion 42 exposed from the penetration portion 53C are provided, and the upper surface 42b of the second portion 42 to the upper surface 42b of the wiring board 21 are provided. By providing the metal attachment member 19 having a plurality of heat radiating portions 44 projecting upward, the heat generated from the second electronic component 13 via the second portion 42 is radiated from the plurality of heat radiating portions 44. It becomes possible to conduct to. As a result, the heat of the second electronic component 13 can be dissipated through the plurality of heat radiating portions 44 provided on the wiring board 21 side.

In FIG. 1, as an example, the case where the upper end surface 44a of the heat radiating portion 44 is located above the head of the screw 27 is shown as an example, but the position of the upper end surface 44a (the height of the heat radiating portion 44) is shown. ) Can be set as appropriate.
Further, in FIGS. 1 to 3, the case where the number of heat radiating units 44 is four has been described as an example, but the number of heat radiating parts 44 can be appropriately set.

As the metal material constituting the metal attachment member 19 having the above structure, for example, aluminum, copper, or the like can be used.

The wiring board 21 has an insulating board 53, a pad portion 55 (land portion), and a wiring pattern (not shown) connected to the pad portion 55.

The insulating substrate 53 is rectangular and has a lower surface 53a, an upper surface 53b, a terminal insertion hole 53A, a second through hole 53B, and a through portion 53C.
The lower surface 53a is a plane orthogonal to the Z direction, and is arranged on the metal attachment member 19 side. The lower surface 53a is in contact with the upper surface 45b of the first portion 41 and the upper surface 42b of the second portion 42. The lower surface 53a is a surface corresponding to the lower surface 21a of the wiring board 21.

The upper surface 53b is a plane orthogonal to the Z direction, and is arranged on the opposite side of the lower surface 53a. The upper surface 53b is a surface arranged on the outside of the electronic device 10. A plurality of pad portions 55 and wiring patterns (not shown) are formed on the upper surface 53b. The upper surface 53b is a surface corresponding to the upper surface 21b of the wiring board 21.

The terminal insertion hole 53A is formed so as to penetrate the portion of the insulating substrate 53 facing the second terminal portion 37B in the Z direction. A plurality of terminal insertion holes 53A are formed at intervals in the X direction. The second terminal portion 37B inserted into the terminal insertion hole 53A protrudes from the pad portion 55.

The second through hole 53B is formed so as to penetrate the portion of the insulating substrate 53 facing the third through hole 46 in the Z direction. Two second through holes 53B are formed at intervals in the X direction.
The bush body 57 of the bush 23 having an outer diameter larger than that of the screw 27 is inserted into the second through hole 53B from the upper surface 53b side of the insulating substrate 53.
Therefore, the opening diameter of the second through hole 53B is formed to be larger than the opening diameter of the screw hole 11A. The opening diameter of the second through hole 53B can be, for example, the same as the opening diameter of the third through hole 46.

The penetration portion 53C is formed so as to penetrate the portion of the insulating substrate 53 located between the pads 55 in the Y direction and between the two second through holes 53B in the X direction in the Z direction. There is. The shape of the penetrating portion 53C is a rectangular shape in a plan view. The penetrating portion 53C extends in the X direction. The penetrating portion 53C exposes a part of the upper surface 42b of the second portion 42.

The pad portion 55 is formed on the upper surface 53b so as to surround the terminal insertion hole 53A. A plurality of pad portions 55 are formed at intervals in the X direction.
The wiring pattern (not shown) is formed on the upper surface 53b of the insulating substrate 53. The wiring pattern is connected to the pad portion 55.

The bush 23 has a flange portion 56, a bush main body 57, a screw insertion hole 59, and an engaging protrusion 62.

The collar portion 56 is provided at one end of the bush body 57. The collar portion 56 is integrally formed with the bush main body 57. The outer shape of the collar portion 56 is circular. The outer diameter of the flange portion 56 is configured to be larger than the outer diameter of the bush main body 57. In a state where the bush body 57 is inserted into the third through hole 46, the flange portion 56 is in contact with the upper surface 53b of the insulating substrate 53.

The bush body 57 is a member having a cylindrical outer shape and extends in the Z direction. The bush main body 57 is inserted into the second through hole 53B and the third through hole 46 from the upper surface 21b side of the wiring board 21. The outer diameter of the bush body 57 is configured to be smaller than the opening diameter of the second through hole 53B. As a result, a cylindrical gap is formed between the inner peripheral surface of the second through hole 53B and the outer peripheral surface of the bush body 57.
The length of the bush main body 57 is set so that a part of the bush main body 57 is arranged in the third through hole 46 and does not protrude to the outside of the third through hole 46.

The screw insertion hole 59 is formed so as to penetrate the flange portion 56 and the bush body 57 in the Z direction in which the second through hole 53B and the third through hole 46 extend. The opening diameter of the screw insertion hole 59 is such that the screw 27 can be inserted.

The engaging protrusion 62 is provided on the outer peripheral surface 57a of the bush body 57. The engaging protrusion 62 is formed so as to project radially outward from the outer peripheral surface 57a. The engaging protrusion 62 has a ring shape that surrounds the outer peripheral surface 57a in the circumferential direction.
The engaging protrusion 62 engages with the engaging groove 47 when the bush 23 is inserted into the second through hole 53B and the third through hole 46. In this state, the flange portion 56 is in contact with the upper surface 53b of the insulating substrate 53.

A bush 23 having an engaging protrusion 62 having such a configuration is provided, and an engaging groove 47 that engages with the engaging protrusion 62 is formed in the third through hole 46, whereby the engaging protrusion is provided. By engaging 62 with the engaging groove portion 47, the wiring board 21 can be temporarily fixed to the metal attachment member 19.
As a result, the work of inserting the screw 27 into the screw insertion hole 59 formed in the bush 23 and fastening the screw 27 to the screw hole 11A formed in the heat radiation fin 11 can be easily performed.

The cushioning sheet 25 is arranged between the second portion 42 and the electronic component main body 35. With the metal attachment member 19 pressed in the direction from the second portion 42 toward the electronic component body 35, the cushioning sheet 25 is in close contact with the lower surface 42a of the second portion 42 and the surface 35b of the electronic component body 35. doing.

By having the cushioning sheet 25 having such a configuration, when the electronic component main body 35 is pressed by the second portion 42, the electronic component main body 35 can be protected from impact and the cushioning sheet 25 can be protected. The electronic component main body 35 can be pressed by the entire lower surface 42a of the second portion 42.

At the stage where the grease 15, the second electronic component 13, the cushioning sheet 25, and the metal attachment member 19 are laminated on the heat radiating fin 11 (in a state where the cushioning sheet 25 is not pressed), the first A gap (not shown) is formed between the lower surface 45a of the portion 41 and the heat radiation fin 11.
The gap disappears when the cushioning sheet 25 is pressed, and the lower surface 45a of the first portion 41 comes into contact with the heat radiation fin 11.

The screw 27 is fastened to the screw hole 11A of the heat radiation fin 11 in a state of being inserted into the screw insertion hole 59 formed in the bush 23 arranged in the second through hole 53B and the third through hole 46. .. As a result, the second electronic component 13 is pressed against the second portion 42 via the cushioning sheet 25, so that the second electronic component 13 is fixed between the heat radiation fin 11 and the metal attachment member 19.

By providing the metal attachment member 19 described above, and a screw 27 inserted into the second through hole 53B and the third through hole 46 and fastened to the screw hole 11A of the heat radiation fin 11, the second electron is provided. It is possible to fix the second electronic component 13 between the heat radiation fin 11 and the metal attachment member 19 without using the first through hole 39 formed in the component 13.
Therefore, when the first electronic component 101 is replaced with the miniaturized second electronic component 13, the heat radiation fin 11 used in the first electronic component 101 can be diverted.

Further, by fastening the screw 27 to the screw hole 11A, the entire lower surface 42a of the second portion 42 in contact with the electronic component main body 35 presses the electronic component main body 35 in the direction from the wiring board 21 toward the heat radiation fin 11. Therefore, it is possible to uniformly press the entire electronic component main body 35.
This makes it possible to conduct the heat of the second electronic component 13 to the heat radiating fin 11 from the entire surface 35a of the electronic component body 35 located on the heat radiation fin 11 side. As a result, the heat dissipation characteristics of the heat dissipation fins 11 can be improved.

The insulating sheet 29 has a frame shape having an opening 29A into which the electronic component main body 35 can be inserted. The insulating sheet 29 is provided so as to surround the outer periphery of the electronic component main body 35.
The outer peripheral portion 29B of the insulating sheet 29 is supported by the protruding portion 48 in a state where the insulating sheet 29 and the heat radiation fins 11 are not in contact with each other. The insulating sheet 29 is arranged so as to be sandwiched between the protrusion 48 and the plurality of connection terminals 37.
As the insulating sheet 29, for example, silicon, rubber, or the like can be used.

As described above, since the thickness of the electronic component body 35 is thinner than the thickness of the first electronic component 101, the distance from the plurality of connection terminals 37 formed on the electronic component body 35 to the heat radiation fins 11 is determined. It is smaller than the distance from the plurality of connection terminals 112 constituting the first electronic component 101 to the heat radiation fins 11.
Therefore, by providing an insulating sheet 29 surrounding the outer circumference of the electronic component main body 35 between the plurality of connection terminals 37 constituting the second electronic component 13 and the heat radiation fins 11, the plurality of connection terminals 37 and the heat radiation fins are provided. It is possible to suppress the conduction with 11.

Further, by arranging the insulating sheet 29 so as to be sandwiched between the protruding portion 48 and the plurality of connection terminals 37, the position of the insulating sheet 29 in the Z direction can be regulated.

The solder 31 is provided on the pad portion 55. The solder 31 connects the second terminal portion 37B protruding from the pad portion 55 and the pad portion 55. The solder 31 is formed after the screws 27 are fastened to the screw holes 11A.

According to the electronic device 10 of the first embodiment, the wiring board 21 on which the penetration portion 53C is formed and the upper surface 42b of the second portion 42 exposed from the penetration portion 53C are provided on the upper surface 42b of the second portion 42. By providing a metal attachment member 19 having a plurality of heat radiating portions 44 projecting upward from the upper surface 42b of the wiring board 21 from the upper surface 42b, the second electronic component 13 can be provided via the second portion 42. The generated heat can be conducted to a plurality of heat radiating units 44. As a result, the heat of the second electronic component 13 can be dissipated through the plurality of heat radiating portions 44 provided on the wiring board 21 side.

(Second Embodiment)
The electronic device 70 of the second embodiment will be described with reference to FIG. 7. In FIG. 7, the same components as those of the electronic device 10 of the first embodiment are designated by the same reference numerals.

The electronic device 70 is configured in the same manner as the electronic device 10 except that it has a plate material 71 in which the screw holes 11A are formed in place of the heat radiation fins 11 constituting the electronic device 10 of the first embodiment.
As the material of the plate material 71, an insulating material (for example, an insulating resin) is used. Therefore, the plate material 71 does not function as a heat radiation fin.

Since the electronic device 70 of the second embodiment having such a configuration includes the metal attachment member 19 described in the first embodiment, the heat generated from the second electronic component 13 is transferred to the wiring board 21 side. Can dissipate heat from.

Although the preferred embodiments of the present invention have been described in detail above, the present invention is not limited to such specific embodiments, and various aspects of the present invention are described within the scope of the claims. It can be transformed and changed.

10, 70 ... Electronic device 11 ... Heat dissipation fin 11a ... Parts mounting surface 11A ... Screw holes 11b, 57a ... Outer peripheral surface 13 ... Second electronic component 15 ... Gris 19 ... Metal attachment member 21 ... Wiring board 21a, 42a, 45a, 53a ... Bottom surface 21b, 42b, 45b, 53b ... Top surface 23 ... Bush 25 ... Cushioning sheet 27 ... Screw 29 ... Insulation sheet 29A ... Opening 31 ... Solder 35 ... Electronic component body 35a, 35b, 48a ... Surface 35A, 35B ... Side surface 35C ... First side surface 35D ... Second side surface 37 ... Connection terminal 37A ... First terminal part 37B ... Second terminal part 39 ... First through hole 41 ... First part 42 ... Second part Part 43 ... Recessed 44 ... Heat dissipation part 44a Upper end surface 45 ... First part Main body 45c ... Inner side surface 46 ... Third through hole 46a ... Inner peripheral surface 47 ... Engagement groove 48 ... Protruding part 48b ... Support surface 49 ... Ring-shaped protrusion 53 ... Insulation substrate 53A ... Terminal insertion hole 53B ... Second through hole 53C ... Penetration part 55 ... Pad part 56 ... Bush body 57 ... Bush body 59 ... Screw insertion hole 62 ... Engagement protrusion 71 ... Plate material A, B ... area C ... space O ... axis

Claims (9)

A plate material with two screw holes arranged at intervals in the first direction,
An electronic component body placed on the upper surface of the plate material, two first through holes formed in the electronic component body and formed inside the two screw holes in the first direction, and the electron. Electronic components with multiple connection terminals provided on the component body,
A second through hole facing the screw hole and penetrating in the thickness direction of the electronic component on which the plate material and the electronic component are laminated, and a penetrating portion penetrating in the same direction as the second through hole. Is formed, and in the thickness direction of the electronic component, a wiring board electrically connected to the plurality of connection terminals with a space interposed between the electronic component and the wiring board.
A third through hole is formed between the screw hole and the second through hole, and faces the screw hole and the second through hole, and is arranged with a space in the first direction. Two first portions, a second portion provided in the space, extending in the first direction and connecting the two first portions, the second portion exposed from the penetrating portion. A plurality of heat radiating portions, which are provided on the upper surface of the second portion and project upward from the upper surface of the wiring board, and are partitioned by the two first portions and the second portion, and the electrons. A metal attachment member with a recess for accommodating parts,
A screw inserted into the second through hole and the third through hole from the upper surface side of the wiring board and fastened to the screw hole.
With
The electronic component is an electronic device fixed between the wiring board and the plate material by pressing the electronic component body in a direction from the second portion toward the plate material. The plate material has two through holes arranged at intervals in the first direction, and dissipates heat including a component mounting surface on which other electronic components larger than the electronic component are mounted. Fin and
The electronic device according to claim 1, wherein the through hole is formed at a position facing the screw hole. The electronic device according to claim 2, further comprising an insulating sheet provided between the plurality of connection terminals and the heat radiation fins and surrounding the outer periphery of the electronic component. The first portion includes a first portion main body in which the third through hole is formed and extends in a direction from the wiring board toward the heat radiation fin.
A protruding portion that projects from the inner side surface of the first portion main body toward the electronic component and supports the outer peripheral portion of the insulating sheet in a state where the insulating sheet and the heat radiating fin do not come into contact with each other.
Have,
The electronic device according to claim 3, wherein the insulating sheet is arranged so as to be sandwiched between the protruding portion and the plurality of connection terminals. The electronic device according to any one of claims 2 to 4, which has grease arranged between the electronic component main body and the heat radiation fin. The electronic device according to claim 1, wherein the material of the plate material is an insulating material. The electronic component body has a rectangular shape in a plan view, and includes a first side surface and a second side surface arranged in a second direction orthogonal to the first direction.
Of the plurality of connection terminals, some of the connection terminals project from the first side surface and are provided so as to extend in the direction from the electronic component toward the wiring board, and the remaining connection terminals are provided on the second side surface. It is provided so as to project from the electronic component and extend in the direction from the electronic component toward the wiring board.
The second portion is described in any one of claims 1 to 6, wherein the second portion is arranged between the partial connection terminal and the remaining connection terminal and has a thickness that does not protrude from the connection terminal. Electronic device. The collar portion in contact with the upper surface of the wiring board, the bush body inserted into the second through hole and the third through hole, and the collar in the direction in which the second through hole and the third through hole extend. A bush having a screw insertion hole that penetrates the portion and the bush body and into which the screw is inserted, and an engaging protrusion that protrudes radially outward from the outer peripheral surface of the bush body.
The electronic device according to any one of claims 1 to 7, wherein an engaging groove portion that engages with the engaging protrusion portion is formed in the third through hole. The invention according to any one of claims 1 to 8, further comprising a cushioning sheet arranged between the second portion and the electronic component main body and in close contact with the second portion and the electronic component main body. Electronic device.

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