JP2020031122A - Semiconductor device and manufacturing method thereof - Google Patents

Abstract

To reduce the size of a semiconductor device.SOLUTION: A semiconductor device includes a heat dissipating member 2 having an arrangement surface 2a, a heat generating component 3 having a main body 21 disposed on the disposing surface 2a of the heat dissipating member 2 and a lead 22 protruding from the main body 21, and a pressing member 4 that presses the main body 21 of the heat generating component 3 against the arrangement surface 2a so as to be fixed to the heat dissipating member 2, and the pressing member 4 is made of a resin material having electrical insulation.SELECTED DRAWING: Figure 2

Description

  The present invention relates to a semiconductor device and a method for manufacturing a semiconductor device.

Conventionally, in order to radiate heat of a heat-generating component that generates heat by energization with high efficiency, a heat-generating component is arranged on a heat-dissipating member, and the heat-generating component is pressed by an elastic force of a pressing member (leaf spring) fixed to the heat-dissipating member. There is a semiconductor device pressed against a heat dissipation member.
Patent Literature 1 discloses a semiconductor device in which an insulating member is disposed between a heat-generating component and a pressing member in order to electrically insulate the heat-generating component from the pressing member. Patent Document 1 discloses a configuration in which a part of the outer edge of an insulating member is brought into contact with a step (side wall) formed in a heat radiating member, and a through hole formed in a lead (wiring member) of a heat generating component in the insulating member. Is disclosed. With these configurations, in the semiconductor device of Patent Literature 1, displacement of the heat-generating component with respect to the heat-radiating member and the insulating member is suppressed.

JP 2017-183338 A

  However, in the conventional semiconductor device, the pressing member is made of metal and is electrically connected to the heat radiating member. Therefore, it is necessary to position the lead of the heat-generating component away from the press member so that the lead of the heat-generating component and the pressing member are not electrically short-circuited. In this case, there is a problem that the arrangement area of the heat-generating component and the pressing member in the heat-radiating member becomes large, which hinders miniaturization of the semiconductor device.

  The present invention has been made in view of the above circumstances, and has as its object to provide a semiconductor device which can be reduced in size and a method for manufacturing the semiconductor device.

  One embodiment of the present invention is a heat radiating member having an arrangement surface, a heat generating component having a main body disposed on the arrangement surface and a lead protruding from the main body, and the main body being fixed to the heat radiating member. And a pressing member for pressing the pressing member against the arrangement surface, wherein the pressing member is made of a resin material having electrical insulation.

  One embodiment of the present invention is a method for manufacturing a semiconductor device for manufacturing the semiconductor device, wherein the plurality of leads of the heat-generating component are individually inserted into a plurality of lead insertion holes formed in the pressing member. Thus, there is provided a method of manufacturing a semiconductor device, comprising: a mounting step of mounting the heat generating component to the pressing member; and a fixing step of fixing the pressing member to the heat radiating member after the mounting step.

  According to the present invention, since the pressing member is a resin material having an insulating property, electrical insulation between the lead and the heat radiating member can be ensured even when the lead is located near the pressing member. Since the lead can be arranged near the pressing member, the area where the heat-generating component and the pressing member are arranged on the arrangement surface can be reduced. Therefore, the size of the semiconductor device can be reduced.

1 is a plan view illustrating a semiconductor device according to an embodiment of the present invention. FIG. 2 is a sectional view taken along the line II-II in FIG. 1. FIG. 3 is a sectional view taken along the line III-III in FIG. 1. FIG. 4 is a sectional view taken along the line IV-IV in FIG. 1. FIG. 5 is a perspective view of a pressing member included in the semiconductor device of FIGS. FIG. 5 is a perspective view of a pressing member included in the semiconductor device of FIGS. FIG. 5 is an enlarged sectional view showing a pressing portion of a pressing member provided in the semiconductor device of FIGS. FIG. 5 is a cross-sectional view showing a state in which leads of the same heat-generating component are inserted into lead insertion holes of a pressing member in the semiconductor device of FIGS. FIG. 5 is a perspective view showing a state in which a heat-generating component is attached to a pressing member in the semiconductor device of FIGS. FIG. 5 is an exploded perspective view showing a state in which the semiconductor device of FIGS. 1 to 4 is disassembled into a heat radiating member, a heat generating component and a pressing member, and a circuit board. It is sectional drawing which shows the movement of the pressing part at the time of fixing a pressing member to an arrangement surface.

Hereinafter, an embodiment of the present invention will be described with reference to FIGS.
As shown in FIGS. 1 to 4, the semiconductor device 1 according to the present embodiment includes a heat radiating member 2, a heat generating component 3, and a pressing member 4. Further, the semiconductor device 1 of the present embodiment includes a circuit board 5.

  The heat radiating member 2 has an arrangement surface 2a on which the heat generating component 3 and the pressing member 4 are arranged. The arrangement surface 2a is formed as a flat surface. The heat radiation member 2 may be formed, for example, in a flat plate shape. The heat dissipating member 2 of the present embodiment includes a bottom wall portion 11 including the arrangement surface 2a, a cylindrical peripheral wall portion 12 extending from the periphery of the arrangement surface 2a in the thickness direction of the bottom wall portion 11 (positive Z-axis direction), Is provided. That is, the heat dissipating member 2 is formed in a box shape having the arrangement surface 2a as a bottom surface and opening above the arrangement surface 2a. The heat-generating component 3, the pressing member 4, the circuit board 5, and the like are accommodated in the box-shaped heat radiating member 2. The heat radiating member 2 may be made of any material, but in this embodiment, is made of a material having a high thermal conductivity (for example, aluminum).

  As shown in FIGS. 1 and 10, a locking portion 13 is formed on the heat radiation member 2 of the present embodiment. The locking portion 13 positions the pressing member 4 on the arrangement surface 2a by being hooked on the pressing member 4 arranged on the arrangement surface 2a of the heat radiation member 2. The locking portion 13 may be, for example, a concave portion formed to be depressed from the arrangement surface 2a, but in the present embodiment, is a projection protruding from the arrangement surface 2a. A plurality of locking portions 13 are formed. The plurality of locking portions 13 are arranged at intervals from each other.

  The heat-generating component 3 is a component that generates heat when energized. As shown in FIGS. 1 to 4 and 9, the heat generating component 3 includes a main body 21 disposed on the arrangement surface 2 a of the heat radiating member 2 and a lead 22 protruding from the main body 21.

The main body 21 is a portion that mainly generates heat when energized, and is a lump having a predetermined volume. The main body 21 includes a semiconductor element (not shown) that is a main heat source, and a resin 23 that seals the semiconductor element. The semiconductor element may be, for example, a transistor or a diode. The electrodes of the semiconductor element are connected to the leads 22. The resin 23 has an electrical insulating property. The resin 23 may be formed in any shape, but is formed in a rectangular parallelepiped shape in the present embodiment. Accordingly, the main body 21 can be arranged on the arrangement surface 2a with the flat surface 23a of the resin 23 (hereinafter, referred to as the lower surface 23a of the main body 21) facing the arrangement surface 2a of the heat radiation member 2. it can.
The main body 21 of the present embodiment further includes a metal part 24 for heat radiation. The metal portion 24 may not be exposed on the surface of the resin 23, for example, but is exposed on the lower surface 23a of the resin 23 in the present embodiment. The metal portion 24 protrudes from the resin 23 in a direction along the lower surface 23 a of the resin 23. In the illustrated example, the protruding portion of the metal portion 24 is formed with the hole 25 penetrating therethrough, but the present invention is not limited to this.

  When the metal part 24 is not exposed on the lower surface 23a of the resin 23, the main body part 21 may directly contact the arrangement surface 2a of the heat radiation member 2, for example. In this embodiment, since the metal part 24 is exposed on the lower surface 23a of the resin 23, the main body part 21 is disposed on the arrangement surface 2a of the heat radiation member 2 via the insulating sheet 6 having electrical insulation. The insulating sheet 6 is preferably made of a material having high thermal conductivity.

  The lead 22 of the heat generating component 3 protrudes from the main body 21 in a direction along the lower surface 23a. Specifically, the lead 22 projects along the lower surface 23a of the main body 21 in the direction opposite to the above-described metal part 24. The leads 22 are spaced from each other so as to be electrically insulated from the arrangement surface 2a of the heat radiation member 2 in a state where the main body 21 is arranged on the arrangement surface 2a of the heat radiation member 2. The lead 22 is bent at an intermediate portion in the longitudinal direction. As a result, the leading end of the lead 22 in the protruding direction extends in a direction away from the arrangement surface 2 a of the heat radiation member 2. The tips of the leads 22 are connected to a circuit board 5 described later.

  As shown in FIGS. 8 and 9, the heat generating component 3 of the present embodiment includes a plurality (three in the illustrated example) of leads 22. The plurality of leads 22 project from the main body 21 in the same direction. The plurality of leads 22 are arranged at intervals along the lower surface 23a of the main body 21 in a direction (X-axis direction) orthogonal to the direction in which the leads 22 protrude.

  As shown in FIGS. 1 and 9, the semiconductor device 1 of the present embodiment includes a plurality of the heat generating components 3 described above. The plurality of heat generating components 3 may be arranged at least on the arrangement surface 2a of the heat radiating member 2 with an interval therebetween. The plurality of heat generating components 3 may be arranged in a line in one direction along the arrangement surface 2a of the heat radiation member 2, for example. In the present embodiment, the plurality of heat generating components 3 constitute two heat generating component groups 26 arranged side by side in the first direction (X-axis direction) along the arrangement surface 2a of the heat radiating member 2. The two heat generating component groups 26 are arranged at intervals in a second direction (Y-axis direction) orthogonal to the first direction along the arrangement surface 2a. The number of heat generating components 3 constituting the same heat generating component group 26 may be arbitrary, but is five in the present embodiment.

  As shown in FIGS. 1 to 4, the pressing member 4 presses the main body 21 against the arrangement surface 2 a by being fixed to the heat radiation member 2. The pressing member 4 is made of an electrically insulating resin material. The resin material forming the pressing member 4 may be any resin material, but is preferably an elastically deformable material. Further, it is more preferable that the resin material forming the pressing member 4 is a material having a small change in elastic modulus with respect to a change in temperature (a material having a small temperature dependence of the elastic modulus). Examples of such a resin material include polycarbonate (PC).

As shown in FIGS. 1 to 7, the pressing member 4 of the present embodiment includes a member main body 31 and a pressing portion 32.
The member main body 31 is a portion fixed to the arrangement surface 2a of the heat radiation member 2. The member main body 31 may be fixed to the arrangement surface 2a of the heat radiation member 2 by an arbitrary method such as bonding. The member main body 31 of the present embodiment is detachably fixed to the heat radiating member 2 by screwing. Specifically, the member main body 31 is formed with a screw insertion hole 33 through which the shaft of the screw 7 is inserted. The member main body 31 is provided with the female screw 14 formed in the heat radiating member 2 and opened in the mounting surface 2a after the shaft portion of the screw 7 is passed through the screw insertion hole 33, and thereby the mounting surface 2a of the heat radiating member 2 It is sandwiched between the head of the screw 7. Thereby, the member main body 31 can be fixed to the heat radiation member 2.

The member main body 31 has an opposing surface 31a that opposes and contacts the arrangement surface 2a in a state where the member main body 31 is arranged on the arrangement surface 2a of the heat radiation member 2. The member main body 31 has an opposite surface 31b facing the opposite side to the opposite surface 31a. In the present embodiment, the opposite surface 31b is parallel to the opposite surface 31a. In the following description, the direction in which the opposing surface 31a and the opposite surface 31b of the member main body 31 are aligned (Z-axis direction) may be referred to as the thickness direction of the member main body 31.
An accommodating recess (recess) 34 is formed in the member body 31 from the opposite surface 31b. The housing recess 34 may or may not penetrate in the thickness direction of the member main body 31 so as to open on the facing surface 31a of the member main body 31, for example.

  As shown in FIGS. 1, 5, and 6, the member main body 31 is formed with a locked portion 35 which is hooked on the locking portion 13 of the heat radiating member 2 (see FIGS. 1 and 10). The locked portion 35 may be, for example, a protrusion protruding from the facing surface 31a of the member main body 31. In the present embodiment, the locked portion 35 is formed to be recessed from the facing surface 31a of the member main body 31, and is a protrusion. Is a concave portion into which a. A plurality of locked parts 35 are formed. The plurality of locked parts 35 are arranged at intervals from each other. When the member main body 31 is arranged on the arrangement surface 2a of the heat radiating member 2, the plurality of locking portions 13 of the heat radiating member 2 are individually inserted into the plurality of locked portions 35. Thereby, the pressing member 4 can be positioned on the arrangement surface 2a of the heat radiation member 2.

  As shown in FIGS. 2, 5, and 7, the member main body 31 is formed with a plurality of board positioning portions 36 for positioning a circuit board 5 described below with respect to the pressing member 4. Each board positioning portion 36 protrudes from the opposite surface 31 b of the member main body 31 in the thickness direction of the member main body 31. The board positioning section 36 has a support section 37 for supporting the circuit board 5 and a guide section 38 for guiding the circuit board 5. The support portion 37 has a support surface 37 a that is higher than the opposite surface 31 b of the member body 31 and supports the circuit board 5. The guide portion 38 is formed in a rod shape extending in the thickness direction of the member main body 31 from the support surface 37a. The guide portion 38 guides the circuit board 5 to a predetermined position on the member main body 31 by being inserted into the circuit board 5. The plurality of substrate positioning parts 36 are spaced apart from each other in a direction along the opposite surface 31b. The number of the substrate positioning portions 36 may be arbitrary, but is two in the present embodiment.

  The specific shape of the member main body 31 may be arbitrary. As shown in FIGS. 1, 5, and 6, the member body 31 of the present embodiment has a long side extending in the first direction (X-axis direction) and a short side extending in the second direction (Y-axis direction). It is formed in a rectangular plate shape in plan view.

As shown in FIGS. 5 to 7, the screw insertion hole 33 of the member main body 31 is formed to penetrate the member main body 31 in the thickness direction. A plurality (three in the illustrated example) of screw insertion holes 33 are arranged at intervals in the first direction. The plurality of screw insertion holes 33 are arranged at equal intervals. Specifically, the three screw insertion holes 33 are located at the middle and both ends of the member main body 31 in the first direction.
The screw insertion hole 33 is formed to accommodate the head of the screw 7. For this reason, when the member main body 31 is fixed to the heat radiating member 2 by screwing, the head of the screw 7 attached to the screw insertion hole 33 does not project from the opposite surface 31b of the member main body 31.

  Similarly to the member main body 31, the accommodation recess 34 of the member main body 31 has a side extending in the first direction as a long side and a side extending in the second direction as a short side in plan view as viewed from the opposite surface 31b side of the member main body 31. It is formed in a rectangular shape having sides. The accommodation recess 34 is located between the two screw insertion holes 33 located at both ends of the member main body 31 in the first direction. For this reason, the screw insertion hole 33 located in the middle of the member main body 31 in the first direction opens on the bottom surface of the accommodation recess 34.

  As shown in FIGS. 1, 3, 5, and 6, a through hole 39 is formed in the member main body 31 so as to penetrate the member main body 31 in the thickness direction. The through-hole 39 of the present embodiment is formed in a partial area of the accommodation recess 34 in a plan view within a range that does not interfere with the screw insertion hole 33. Specifically, the through hole 39 is formed between the screw insertion holes 33 located at both ends of the member main body 31 and the screw insertion holes 33 positioned at the middle of the member main body 31 in the area of the accommodation recess 34 viewed in a plan view. One is formed in each of two located regions. That is, the member main body 31 has two through holes 39 arranged in the first direction.

The thickness of the member main body 31 may be constant, for example, except for a region where the accommodation recess 34 and the through hole 39 are formed. In the present embodiment, as shown in FIGS. 2 to 7, the thickness of both ends 42, 43 (first end 42, second end 43) of the member main body 31 in the second direction is equal to the both ends in the second direction. It is smaller than the thickness of the main part 41 of the member main body 31 located between 42 and 43. Both ends 42 and 43 in the second direction of the member main body 31 may be located at least in the thickness direction of the member main body 31 from the facing surface 31a of the main part 41 of the member main body 31. In the present embodiment, both end portions 42 and 43 in the second direction of the member main body 31 are opposite to the member main body 31 in the thickness direction so as to form the opposite surface 31 b of the member main body 31 together with the main portion 41 of the member main body 31. It is located close to the end on the surface 31b side. Thus, in a state where the pressing member 4 is arranged on the arrangement surface 2a of the heat radiation member 2, both end portions 42 and 43 of the member main body 31 in the second direction can be located away from the arrangement surface 2a.
In the present embodiment, the above-described recess 34 and the through hole 39 are formed in the main portion 41 of the member main body 31. In addition, the through hole 39 is formed in the main portion 41 of the main body 41 in the second direction of the main portion 41 at a position closer to the facing surface 31a than the both ends 42 and 43 of the main body 31 in the second direction. It is open at both ends.

  As shown in FIGS. 2 to 7, the pressing portion 32 is connected to the member main body 31 so as to be elastically deformable. The pressing portion 32 is arranged so as to overlap with the main body 21 of the heat generating component 3 arranged on the arrangement surface 2 a of the heat radiation member 2. When the member main body 31 is fixed to the arrangement surface 2a of the heat radiation member 2, the pressing portion 32 elastically bends and deforms to press the main body 21 against the arrangement surface 2a.

  The pressing portion 32 protrudes from a side portion of the member main body 31 that faces in a direction along the facing surface 31a of the member main body 31. The projecting direction of the pressing portion 32 may coincide with, for example, a direction along the facing surface 31a of the member main body 31. The protruding direction of the pressing portion 32 in the present embodiment is a direction approaching the opposing surface 31a of the member main body 31 in the thickness direction of the member main body 31 from the base end to the distal end in the protruding direction (particularly in FIG. 7).

The thickness of the pressing portion 32 in the thickness direction of the member main body 31 is smaller than the thickness of the member main body 31 (particularly, the main portion 41). Thereby, the pressing portion 32 can be elastically deformed in the thickness direction of the member main body 31 around the connection portion with the member main body 31. In FIG. 7, a pressing portion 32 indicated by a two-dot chain line shows a state where the pressing portion 32 is elastically bent and deformed.
The pressing portion 32 is located away from the facing surface 31 a of the member main body 31 in the thickness direction of the member main body 31. In the present embodiment, the pressing portion 32 is positioned close to the end of the member main body 31 on the side opposite to the surface 31b in the thickness direction of the member main body 31. Thus, in a state where the pressing member 4 is disposed on the arrangement surface 2a of the heat radiation member 2, the pressing portion 32 can be positioned away from the arrangement surface 2a.

For example, only one pressing portion 32 may be provided for the same member main body 31. In the present embodiment, as shown in FIGS. 1 to 6, a plurality of pressing portions 32 are provided for the same member main body 31. The plurality of pressing portions 32 are arranged so as to overlap with the main body portions 21 of the plurality of heat generating components 3 arranged on the arrangement surface 2 a of the heat radiation member 2. When the member main body 31 is fixed to the arrangement surface 2a of the heat radiating member 2, each of the plurality of pressing portions 32 elastically bends and deforms and presses the plurality of main bodies 21 to the arrangement surface 2a.
The thickness of the pressing portion 32 in the thickness direction of the member main body 31 may be equal between the plurality of pressing portions 32, for example, but is different between the plurality of pressing portions 32 in the present embodiment. The thickness of the pressing portion 32 is a dimension of the pressing portion 32 corresponding to a direction in which the pressing portion 32 elastically bends and a direction in which the pressing portion 32 overlaps the main body 21 of the heat generating component 3.

Specifically, each pressing portion 32 protrudes mainly in the second direction from the first end portion 42 or the second end portion 43 that forms a side portion of the member main body 31. The first end portion 42 and the second end portion 43 of the member main body 31 are formed to be thinner than the main portion 41 of the member main body 31 like the pressing portion 32. For this reason, the first end portion 42 and the second end portion 43 of the member main body 31 are elastically bent and deformed in the thickness direction of the member main body 31 with respect to the main portion 41 of the member main body 31 together with the pressing portion 32, for example. Alternatively, for example, there is no need to bend and deform.
At the first end 42 and the second end 43 of the member body 31, a plurality of (five in the illustrated example) pressing portions 32 are arranged at intervals in the first direction. Five pressing portions 32 protruding from the first end portion 42 correspond to the five heat generating components 3 constituting one heat generating component group 26. The five pressing parts 32 protruding from the second end 43 correspond to the five heat generating components 3 constituting the other heat generating component group 26.

In the five pressing portions 32 arranged in the first direction, the thickness of the two first pressing portions 32A located at both ends in the arrangement direction is the smallest, and one second pressing portion located in the middle in the arrangement direction. 32B has the largest thickness. The thickness of the third pressing portion 32C located between the first pressing portion 32A and the second pressing portion 32B in the arrangement direction is larger than the thickness of the first pressing portion 32A and larger than the thickness of the second pressing portion 32B. small. That is, the thickness of the pressing portion 32 increases from both ends in the arrangement direction of the plurality of pressing portions 32 toward the middle.
In the illustrated example, the thickness of the second pressing portion 32B is equal to the thickness of both ends 42, 43 of the member main body 31, and the thickness of the first and third pressing portions 32A, 32C is equal to the both ends 42, 43 of the member main body 31. 43, but is not limited to this. Further, the five pressing portions 32 arranged in the first direction are formed so as to be flush with the surface of the both ends 42 and 43 of the member main body 31 facing in the same direction as the facing surface 31a of the member main body 31. But it is not limited to this.

As shown in FIGS. 1 to 9, the pressing member 4 of the present embodiment has a lead insertion hole 45 through which a plurality of leads 22 provided on the same heat generating component 3 are inserted. The lead insertion hole 45 is formed to penetrate the pressing member 4 in the thickness direction (Z-axis direction). The tips of the plurality of leads 22 are inserted into the lead insertion holes 45.
For example, only one lead insertion hole 45 may be formed for the same heat generating component 3 so as to collectively pass the plurality of leads 22 of the same heat generating component 3. A plurality (three in the example shown) of the same heat-generating component 3 is formed in the same heat-generating component 3 so as to individually pass through the leads 22 of the same heat-generating component 3.

  The interval between the plurality of lead insertion holes 45 corresponding to the same heat generating component 3 may be, for example, the same as the interval between the leads 22 of the same heat generating component 3. In the present embodiment, as shown in FIG. 8, the interval between the plurality of lead insertion holes 45 is wider than the interval between the plurality of leads 22. For this reason, when the plurality of leads 22 are individually inserted into the plurality of lead insertion holes 45, some of the leads 22 are elastically deformed and deformed so as to increase the interval between the plurality of leads 22. Accordingly, a portion of the pressing member 4 located between the lead insertion holes 45 is sandwiched between the leads 22, and the heat generating component 3 can be held by the pressing member 4.

  The lead insertion hole 45 may be formed at any part of the pressing member 4. As shown in FIGS. 5 to 7, the lead insertion hole 45 of the present embodiment is formed at a boundary between the member body 31 of the pressing member 4 and the pressing portion 32. The boundary portion includes a boundary between the member main body 31 and the pressing portion 32 and a portion of the member main body 31 and the pressing portion 32 located near the boundary. Specifically, the boundary portion includes the first and second ends 42 and 43 of the member main body 31 and the base end of the pressing portion 32 in the protruding direction. In the illustrated example, the lead insertion holes 45 are formed in the first and second ends 42 and 43 of the member main body 31.

  As shown in FIGS. 2 to 4 and 9, the lead 22 of each heat-generating component 3 is located on the surface side of the first and second end portions 42 and 43 of the member body 31 which faces in the same direction as the facing surface 31 a of the member body 31. From the lead insertion hole 45, and protrudes from the lead insertion hole 45 toward the opposite surface 31 b of the member main body 31. In a state where the heat generating component 3 is attached to the pressing member 4 in this manner, the leads 22 and the main body 21 of the heat generating component 3 are arranged in order in the protruding direction of the pressing portion 32.

As shown in FIGS. 2 to 4 and 10, the circuit board 5 is arranged above the heat generating component 3 and the pressing member 4 arranged on the arrangement surface 2 a of the heat radiating member 2.
The circuit board 5 is provided with a lead through hole 51 for individually inserting the tips of the leads 22 of the heat generating component 3 and a positioning through hole 52 for inserting the guide part 38 of the board positioning part 36 of the pressing member 4. ing. Each of the lead through-hole 51 and the positioning through-hole 52 penetrates in the thickness direction of the circuit board 5.
The circuit board 5 has mounted thereon a circuit component 53 that forms a circuit with the heat-generating component 3. The circuit component 53 may be mounted only on the facing surface 5a of the circuit board 5 facing the pressing member 4, for example. In the present embodiment, the circuit components 53 are mounted on both surfaces (the opposing surface 5a and the surface facing the opposite side of the opposing surface 5a) of the circuit board 5.

  As shown in FIGS. 2 to 4, when the circuit board 5 is arranged on the pressing member 4, the circuit board 5 is arranged on the support surface 37 a of the support portion 37 of the board positioning section 36. For this reason, the circuit board 5 is arranged at an interval with respect to the facing surface 31 a of the member main body 31. When the circuit board 5 is disposed on the pressing member 4, the tip of the lead 22 projecting from the opposite surface 31 b of the member main body 31 through the lead insertion hole 45 is inserted into the lead through hole 51. Thereby, each heat generating component 3 and the circuit board 5 can be electrically connected. Further, the circuit component 53 mounted on the facing surface 5 a of the circuit board 5 is housed in the housing recess 34 of the pressing member 4.

  The semiconductor device 1 of the present embodiment may include, for example, as shown in FIGS. 2 to 4, a heat generating component 3, a pressing member 4, and a sealing resin 8 that seals the circuit board 5 housed in the heat radiating member 2. The sealing resin 8 may be formed, for example, by flowing the heat generating component 3, the pressing member 4, and the circuit board 5 into the heat radiating member 2 in a state of being housed in the heat radiating member 2.

Next, an example of a method (manufacturing method) for manufacturing the semiconductor device 1 according to the present embodiment will be described.
When manufacturing the semiconductor device 1, first, as shown in FIG. 9, the heat generating component 3 is attached to the pressing member 4 (attaching step). In the mounting step, the plurality of leads 22 of the heat generating component 3 may be individually inserted into the plurality of lead insertion holes 45 of the pressing member 4. Specifically, the lead 22 of the heat generating component 3 may be inserted into the lead insertion hole 45 from the side of the facing surface 31 a of the member main body 31. Thereby, the main body 21 of the heat generating component 3 can be disposed on the side of the facing surface 31 a of the member main body 31 with respect to the pressing portion 32 of the pressing member 4. When the leads 22 of the heat generating component 3 are inserted through the lead insertion holes 45, the heat generating component 3 can be held by the pressing member 4. In this state, the projecting length of the lead 22 projecting from the opposite surface 31b of the pressing member 4 is smaller than the projecting length of the board positioning portion 36 projecting from the opposite surface 31b of the pressing member 4. In the mounting step of the present embodiment, the plurality of heat generating components 3 are mounted on the pressing member 4.

  Thereafter, as shown in FIGS. 2 to 4, 10, and 11, the pressing member 4 is fixed to the heat radiation member 2 (fixing step). In the fixing step, first, the pressing member 4 is arranged on the arrangement surface 2a of the heat radiating member 2 such that the opposing surface 31a of the member body 31 of the pressing member 4 faces the arrangement surface 2a of the heat radiating member 2. At this time, by hooking the locked part 35 of the pressing member 4 on the locking part 13 of the heat radiating member 2, the positioning of the pressing member 4 and the heat generating component 3 with respect to the heat radiating member 2 can be easily performed. In a state where the pressing member 4 is arranged on the arrangement surface 2a of the heat radiating member 2, as shown in FIG. 11, the main body 21 of the heat generating component 3 is located between the arrangement surface 2a of the heat radiating member 2 and the pressing portion 32 of the pressing member 4. Located in.

Next, the pressing member 4 may be fixed to the arrangement surface 2a of the heat radiation member 2. In the present embodiment, the member main body 31 of the pressing member 4 is fixed to the arrangement surface 2a of the heat radiation member 2 by screwing. As a result, the pressing portion 32 of the pressing member 4 is elastically bent and deformed, and the main body 21 of the heat generating component 3 is pressed against the disposition surface 2 a of the heat radiating member 2 by the elastic force of the pressing portion 32. Thus, the fixing step is completed.
In the manufacturing method according to the present embodiment, before performing the fixing step, the insulating sheet 6 is previously arranged on the arrangement surface 2a of the heat radiating member 2, as shown in FIG. Thereby, the heat radiating member 2 and the heat generating component 3 can be electrically insulated from each other with the insulating sheet 6 interposed between the heat radiating member 2 and the heat generating component 3.

  For example, the method of manufacturing the semiconductor device 1 may be completed by completing the fixing step. In the present embodiment, after the fixing step, the board mounting step is performed. In the board mounting step, the circuit board 5 is first placed on the pressing member 4 as shown in FIGS. At this time, first, the guide portion 38 of the board positioning portion 36 of the pressing member 4 is inserted into the circuit board 5, and then the lead 22 of the heat generating component 3 is inserted. That is, after the circuit board 5 is positioned with respect to the pressing member 4, the leads 22 of the heat generating component 3 are inserted into the circuit board 5. Thereby, the leads 22 of the plurality of heat generating components 3 can be easily and reliably inserted into the circuit board 5. After the circuit board 5 is arranged, the leads 22 of the heat generating component 3 are electrically connected to the circuit board 5 by soldering or the like, thereby completing the board mounting process.

As described above, according to the semiconductor device 1 of the present embodiment, the pressing member 4 is a resin material having an insulating property. For this reason, even if the lead 22 of the heat generating component 3 is located near the pressing member 4, electrical insulation between the lead 22 and the heat radiating member 2 can be ensured. Since the lead 22 can be arranged near the pressing member 4, the area where the heat generating component 3 and the pressing member 4 are arranged on the arrangement surface 2a can be reduced. Therefore, the size of the semiconductor device 1 can be reduced.
Further, since the pressing member 4 is made of resin, it is possible to suppress the main body 21 of the heat generating component 3 from being damaged as compared with the case where the pressing member 4 is made of metal harder than resin. .

  Further, according to the semiconductor device 1 of the present embodiment, the pressing member 4 is formed with the plurality of lead insertion holes 45 through which the plurality of leads 22 of the heat generating component 3 are individually inserted. Therefore, the heating component 3 can be easily positioned with respect to the pressing member 4 only by passing the lead 22 through the lead insertion hole 45. Further, by positioning the heat generating component 3 with respect to the pressing member 4, when the pressing member 4 is fixed to the heat radiating member 2, it is possible to suppress or prevent the displacement of the heat generating component 3 with respect to the pressing member 4. Therefore, the heat generating component 3 can be easily positioned with respect to the heat radiating member 2 only by fixing the pressing member 4 to the heat radiating member 2. In particular, in the present embodiment, since the plurality of heat generating components 3 are attached to the same pressing member 4, the plurality of heat generating components 3 can be simultaneously positioned with respect to the heat radiating member 2.

  Further, since the lead insertion hole 45 is formed in the pressing member 4, the lead 22 of the heat generating component 3 and the pressing member 4 are positioned on the arrangement surface 2 a of the heat radiating member 2. For this reason, the arrangement area of the heat generating component 3 and the pressing member 4 on the arrangement surface 2a of the heat radiation member 2 can be further reduced. Therefore, the size of the semiconductor device 1 can be further reduced.

  Further, according to the semiconductor device 1 of the present embodiment, the lead insertion hole 45 of the pressing member 4 is formed at the boundary between the member main body 31 and the pressing portion 32 of the pressing member 4. For this reason, since the lead 22 of the heat generating component 3 is also located at the boundary between the member main body 31 and the pressing portion 32, the area where the heat generating component 3 and the pressing member 4 are disposed on the mounting surface 2 a of the heat radiating member 2 can be further reduced. it can. Therefore, the size of the semiconductor device 1 can be further reduced.

Further, according to the semiconductor device 1 of the present embodiment, since the thickness of the pressing portion 32 of the pressing member 4 is different between the plurality of pressing portions 32, the pressing force of the plurality of pressing portions 32 (the heat generating component 3). (A pressing force for pressing the main body portion 21) can be made uniform.
More specifically, when the thickness of the plurality of pressing portions 32 arranged in the first direction is the same, the pressing force of the pressing portion 32 increases from the middle in the arrangement direction of the plurality of pressing portions 32 to both ends. Therefore, it becomes large. On the other hand, in the present embodiment, the thickness of the plurality of pressing portions 32 arranged in the first direction decreases from the middle in the arrangement direction of the plurality of pressing portions 32 toward both ends. The pressing force of the pressing portion 32 decreases as the thickness of the pressing portion 32 decreases. Thereby, the pressing force of the pressing portions 32 can be made uniform among the plurality of pressing portions 32 arranged in the first direction.

Further, according to the semiconductor device 1 of the present embodiment, the housing body 34 of the pressing member 4 is formed with the housing recess 34 that is recessed from the opposite surface 31b. For this reason, even if the circuit component 53 forming a circuit together with the heat generating component 3 is mounted on the opposing surface 5 a of the circuit board 5 facing the pressing member 4, the circuit component 53 is stored in the storage recess 34 of the member main body 31. can do. Thus, the thickness of the semiconductor device 1 including the circuit board 5 can be reduced. Therefore, it is possible to reduce the size (particularly, the thickness) of the semiconductor device 1.
Further, by arranging the circuit component 53 mounted on the circuit board 5 near the lead 22 of the heating component 3, the wiring of the circuit board 5 from the heating component 3 to the circuit component 53 can be shortened. Thereby, the impedance of the circuit including the heat-generating component 3 and the circuit component 53 can be reduced.

  Further, according to the method of manufacturing the semiconductor device 1 of the present embodiment, a fixing step of fixing the pressing member 4 to the heat radiation member 2 is performed after the attaching step of attaching the heat generating component 3 to the pressing member 4. Then, in the mounting step, the plurality of leads 22 of the heat generating component 3 are individually inserted into the plurality of lead insertion holes 45 of the pressing member 4. Therefore, in the mounting step, the heat generating component 3 can be easily positioned with respect to the pressing member 4. Further, in the fixing step, it is possible to suppress or prevent the displacement of the heat generating component 3 with respect to the pressing member 4. Therefore, the heat generating component 3 can be easily positioned with respect to the heat radiating member 2 only by fixing the pressing member 4 to the heat radiating member 2.

  Further, according to the semiconductor device 1 of the present embodiment, the through-hole 39 formed in the pressing member 4 is larger than the two ends 42 and 43 of the main part 41 of the member main body 31 in the second direction. At the portion located on the side of the facing surface 31a, the main portion 41 is open at both ends in the second direction. For this reason, when the sealing resin 8 is poured onto the disposition surface 2a of the heat dissipating member 2 in a state where the heat generating component 3, the pressing member 4, and the circuit board 5 are disposed on the disposition surface 2a of the dissipating member 2, 8 can reach the gap between the arrangement surface 2a of the heat radiating member 2 and both ends 42 and 43 of the member main body 31 in the second direction through the through hole 39 of the member main body 31. Therefore, the leads 22 of the heat generating component 3 located between the arrangement surface 2 a of the heat radiating member 2 and both ends 42, 43 of the member main body 31 in the second direction can be reliably sealed by the sealing resin 8.

  Although the details of the present invention have been described above, the present invention is not limited to the above-described embodiment, and various changes can be made without departing from the gist of the present invention.

  In the semiconductor device of the present invention, the lead insertion hole 45 of the pressing member 4 may be formed, for example, on the tip end side of the pressing portion 32 in the protruding direction. The lead insertion hole 45 may be formed in, for example, an extension part that further extends from the tip of the pressing part 32 pressed toward the main body part 21 of the heat generating component 3.

  In the semiconductor device of the present invention, for example, the lead insertion hole 45, the accommodation recess 34, the locked portion 35, the substrate positioning portion 36, and the through hole 39 may not be formed in the pressing member 4.

  In the semiconductor device of the present invention, the pressing portion 32 of the pressing member 4 may protrude from, for example, only one of the first and second ends 42 and 43 of the member main body 31.

DESCRIPTION OF SYMBOLS 1 Semiconductor device 2 Heat radiating member 2a Arrangement surface 3 Heat generating component 4 Pressing member 5 Circuit board 5a Opposing surface 6 Insulating sheet 8 Sealing resin 21 Main body 22 Lead 31 Member main body 31a Opposing surface 31b Opposite surface 32, 32A, 32B, 32C Part 34 accommodation recess (recess)
39 Through-hole 41 Main part 42 First end 43 Second end 45 Lead insertion hole 53 Circuit component

Claims (6)

A heat dissipating member having an arrangement surface, a heat generating component having a main body disposed on the disposition surface and a lead protruding from the main body, and pressing the main body against the disposition surface by being fixed to the heat dissipating member And a member,
A semiconductor device, wherein the pressing member is made of a resin material having electrical insulation. The heat generating component includes a plurality of the leads,
The semiconductor device according to claim 1, wherein the pressing member has a plurality of lead insertion holes through which the plurality of leads are individually inserted. The pressing member is connected to the member main body fixed to the arrangement surface and the member main body so as to be elastically deformable and deformable, and is arranged on the main body portion, and the member main body is disposed on the arrangement surface. A pressing portion that elastically bends and deforms by being fixed to press the main body portion against the arrangement surface, wherein the lead insertion hole is formed at a boundary portion between the member main body and the pressing portion. Item 3. The semiconductor device according to item 2. Comprising a plurality of the heat generating components,
The pressing member is a member main body fixed to the arrangement surface, and connected to the member main body so as to be elastically deformable and deformable, and is disposed on each of a plurality of the main body portions, and the member main body is the A plurality of pressing portions that elastically bend and deform by being fixed to the arrangement surface and press a plurality of the main body portions against the arrangement surface, respectively.
4. The semiconductor device according to claim 1, wherein a thickness of the pressing portion differs between the plurality of pressing portions. 5. The pressing member is connected to the member main body fixed to the arrangement surface and the member main body so as to be elastically deformable and deformable, and is arranged on the main body portion, and the member main body is disposed on the arrangement surface. A pressing portion that elastically bends and deforms by being fixed to press the main body portion against the arrangement surface, wherein the member main body is depressed from a surface of the member main body facing the opposite side to the arrangement surface. The semiconductor device according to claim 1, wherein a concave portion is formed. A method of manufacturing a semiconductor device according to claim 1, wherein the method comprises:
An attaching step of attaching the heating component to the pressing member by individually inserting the plurality of leads of the heating component into a plurality of lead insertion holes formed in the pressing member;
After the attaching step, a fixing step of fixing the pressing member to the heat radiating member,
A method for manufacturing a semiconductor device comprising:

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