JP2020009824A - Optical communication device and method for manufacturing optical communication device - Google Patents

Abstract

To position an electric circuit board and an optical circuit unit.SOLUTION: An optical communication device 1a to which a communication optical fiber 100 is connected includes: an optical circuit unit 20 that transmits and receives signal light; a lens 65 that spatially and optically couples an input/output end of the signal light with an input/output end of the communication optical fiber 100; a base substrate 10 that incorporates the optical circuit unit 20 and lens 65; and an electric circuit board 30 that incorporates a control circuit 20 controlling the optical circuit unit 20 and has a plurality of VIA holes 31. The base substrate 10a has a groove 11a formed outside a region where the optical circuit unit 20 and lens 65 are incorporated, and further includes a fixing pin 70 inserted (press-fitted/fitted) into one of the VIA holes 31 and the groove 11a.SELECTED DRAWING: Figure 1

Description

  The present invention relates to an optical communication device and a method for manufacturing the optical communication device.

  The optical communication module often uses an IC chip (hereinafter, referred to as a SiP chip) manufactured using silicon photonics technology. Such an optical communication module is used, for example, in a small device of SFP + (Small Form-Factor Pluggable Plus) or less, which handles multiple wavelengths, such as WDM (Wavelength Division Multiplexing).

  In general, an optical communication module generally mounts an optical module called a TOSA (Transmitter Optical SubAssembly), a ROSA (Receiver Optical SubAssembly) or a BOSA (Bi-directional Optical SubAssembly) on a substrate in a three-dimensional manner. For example, Patent Document 1 discloses an optical transceiver in which an optical transceiver module and a transceiver circuit are connected by an FPC (Flexible Printed Circuits) board.

JP 2013-172037 A (FIG. 9)

  In order to connect the optical transmission / reception module and a PCB (Printed Circuit Board) on which electronic components are mounted, a lead wire is complicatedly mounted on a substrate, or an FPC is fully used as in the technology described in Patent Document 1. And the assembling process was complicated. In addition, even if optical components (LD (Laser Diode), PD (Photo Diode), etc.) are small, there is a problem in that they become large by being made into an optical module, which hinders miniaturization of a communication module.

  Further, the SiP (Silicon Photonics) chip is one in which optical components are monolithically fabricated, and is very small. However, the downsizing of the optical module loses its significance. If possible, it is desirable to mount the SiP chip on the surface of the PCB, but it is difficult at present because the optical system fluctuates due to a change in the shape (expansion / contraction) of the PCB due to the temperature. Therefore, for example, it is necessary to construct an optical system on a metal such as stainless steel.

  Incidentally, it is conceivable to adopt a PCB insertion type structure in which linear recesses are provided on both sides of a metal housing on which an optical system (for example, an optical circuit or a lens) is constructed, and a PCB is inserted into the linear recesses. Even at this time, positioning of the PCB (electric circuit board) (particularly, positioning in the insertion direction) is difficult.

  The present invention has been made to solve such a problem, and provides an optical communication device capable of positioning an electric circuit board and an optical circuit unit, and a method of manufacturing the optical communication device. As an issue.

  In order to achieve the above object, the present invention provides an optical communication device to which a communication optical fiber is connected, wherein the optical communication device comprises: an optical circuit unit for transmitting and receiving signal light; and an input / output terminal for the signal light. An optical coupling element for spatially optically coupling the input and output ends of the communication optical fiber, a base substrate in which the optical circuit section and the optical coupling element are incorporated, and a control circuit for controlling the optical circuit section. An electric circuit board provided with a plurality of VIA holes, wherein the base member has a groove or a recess formed outside a region where the optical circuit portion and the optical coupling element are incorporated, and any one of the VIA holes is formed. And a fixing pin inserted into the groove or the concave portion.

  The fixing pin is inserted (press-fitted) into a VIA hole of the electric circuit board, and inserted (fitted) into a groove or a recess formed in the base material. Thereby, the base member in which the optical circuit portion and the optical coupling element are incorporated and the electric circuit board in which the control circuit is incorporated are positioned. Therefore, the optical circuit and the optical coupling element and the control circuit are positioned.

  According to the present invention, the electric circuit board and the optical circuit unit can be positioned.

FIG. 2 is a perspective view illustrating an internal structure of the optical communication device according to the first embodiment of the present invention. FIG. 2 is a plan view of the optical communication device according to the first embodiment of the present invention. FIG. 2 is a front view of the optical communication device according to the first embodiment of the present invention. FIG. 2 is a plan view of a base material used in the optical communication device according to the first embodiment of the present invention. FIG. 2 is a front view of a base material used in the optical communication device according to the first embodiment of the present invention. FIG. 2 is a plan view of a PCB used in the optical communication device according to the first embodiment of the present invention. It is a top view of an optical circuit part and a control circuit. FIG. 2 is a sectional view of a press-fit pin and a PCB used in the optical communication device according to the first embodiment of the present invention. FIG. 3 is a plan view illustrating a first manufacturing process of the optical communication device according to the first embodiment of the present invention. FIG. 3 is a plan view illustrating a second manufacturing process of the optical communication device according to the first embodiment of the present invention. FIG. 5 is a plan view illustrating a third manufacturing step of the optical communication device according to the first embodiment of the present invention. It is a top view explaining the 1st manufacturing process of the optical communication device which is a 2nd embodiment of the present invention. It is a top view explaining the 2nd manufacturing process of the optical communication device which is a 2nd embodiment of the present invention. It is a top view explaining the 3rd manufacturing process of the optical communication device which is a 2nd embodiment of the present invention. It is a top view explaining the 4th manufacturing process of the optical communication device which is a 2nd embodiment of the present invention. It is a top view of the photoelectric fusion module used in the optical communication device which is a 3rd embodiment of the present invention. It is sectional drawing of the groove | channel of the base material of the 1st modification of this invention. It is a perspective view of a base material in which a groove | channel was formed with the width and space | interval being substantially the same. It is a perspective view of a base material in which a plurality of circular concave parts were formed.

  Hereinafter, an embodiment of the present invention (hereinafter, referred to as “the present embodiment”) will be described in detail with reference to the drawings. It should be noted that the drawings are only schematically shown to the extent that the present invention can be sufficiently understood. In addition, in each drawing, common constituent elements and similar constituent elements are denoted by the same reference numerals, and redundant description thereof will be omitted.

(1st Embodiment)
(Description of configuration)
FIG. 1 is a perspective view showing the internal structure of the optical communication device according to the first embodiment of the present invention, FIG. 2A is a plan view thereof, and FIG. 2B is a front view thereof.
The optical communication device 1a includes a base member 10a, a SiP chip 20 as an optical circuit, a PCB 30 as an electric circuit board, an IC 40 as a control circuit, a receptacle buffer plate 50, a receptacle 60, and an optical coupling element. , And one or more fixing pins 70, 70,..., And a plurality (for example, two) of wires 80, 80. Note that the receptacle 60 is connected to the communication optical fiber 100. The communication optical fiber 100 may be of a pigtail type (coaxial type).

FIG. 3A is a plan view of a base material used in the optical communication device according to the first embodiment of the present invention. FIG. 3B is a front view thereof.
The base substrate 10a is a metal member having a rectangular shape in a plan view, and has a U shape (substantially U shape) in cross section. On the bottom portion 13 of the base member 10a, a groove 11a is formed in a net shape outside the region where the SiP chip 20 and the lens 65 are incorporated. Thus, a plurality of cross-shaped grooves and a plurality of intersections (intersections) thereof are formed in the bottom portion 13 of the base substrate 10a. Further, linear concave portions 12a, 12b are formed in the side walls 14a, 14b of the base material 10a. Note that both sides of the PCB 30 are inserted into the linear concave portions 12a and 12b.

  The SiP chip 20 and the lens 65 are disposed on the bottom 13 of the base 10a. The SiP chip 20 is an optical circuit portion configured by a silicon wire waveguide, and may include a photoelectric conversion element such as a Si photodiode 23 (FIG. 5). Therefore, a plurality of electrode pads 26, 26 are formed on the upper surface of the SiP chip 20, and the electrode pads 26, 26 are electrically connected to the IC 40 by wires 80, 80.

FIG. 4 is a plan view of a PCB used in the optical communication device according to the first embodiment of the present invention.
As shown in the cross-sectional view of FIG. 6, the PCB 30 includes a ground layer 34c, a wiring layer 34d adjacent to the ground layer 34c, a power layer 34b, a wiring layer 34a adjacent to the power layer 34b, and insulating layers 35a and 35b. , 35c. The PCB 30 has a plurality of wiring VIAs (not shown) connecting the wiring layers 34a and 34d and the power supply layer 34b, and a plurality of ground VIAs 31 and 31 connecting the ground layer 34c and the wiring layers 34a and 34d.・ It has

  Since the PCB 30 is designed for high-speed signals, a large number of ground vias 31 are formed to strengthen the ground. Also, the solid pattern 32 (FIG. 4) and the ground VIA 31 connecting the solid pattern 32 and the ground layer 34c (FIG. 6) are formed on the outermost layer of the PCB 30, particularly, the wiring layer 34a (FIG. 6) below the IC 40. Are formed.

  The PCB 30 is formed in a U-shape in plan view, and the total radiation substantially matches the width of the linear concave portions 12a and 12b of the base substrate 10a. Note that the U-shaped concave portion is a region where the SiP chip 20 and the lens 65 are incorporated as shown in FIG. 2A.

FIG. 5 is a plan view of the optical circuit unit and the control circuit.
The SiP chip 20 as an optical circuit unit is, for example, an optical circuit of a single-core bidirectional communication module, and has a plurality of electrode pads 26 formed on an upper surface. In the SiP chip 20, for example, spot size converters 21a and 21b, a wavelength multiplexer / demultiplexer 22 as a wavelength division filter, and a photodiode 23 as a light receiving element are formed on the surface of a Si substrate (not shown). It was done.

  The wavelength multiplexer / demultiplexer 22 is formed of a silicon wire waveguide, and is used as a wavelength division filter. The wavelength multiplexer / demultiplexer 22 guides the laser light incident on the spot size converter 21a to the photodiode 23. The wavelength multiplexer / demultiplexer 22 guides the laser light incident on the spot size converter 21b to the spot size converter 21a.

  The spot size converter 21a couples between the lens 65 and the silicon wire waveguide, and functions as an input / output terminal for signal light. The silicon wire waveguide is an optical waveguide in which the core material is silicon and the cladding material is quartz, and the light path can be bent sharply as compared with the quartz optical waveguide.

  The IC 40 includes, for example, a laser diode 43, a drive control circuit 44 for driving and controlling the laser diode 43, a transimpedance amplifier 41 as a control circuit for controlling the photodiode 23, a monitoring photodiode 42, and a transimpedance amplifier 41. Are provided. Further, the electrode pads 46, 46 and the electrode pads 26, 26 of the SiP chip 20 are arranged close to each other.

  The laser diode 43 irradiates the spot size converter 21b with laser light (signal light). The transimpedance amplifier 41 converts a current signal output from the photodiode 23 into a voltage signal. The monitoring photodiode 42 monitors the light emission intensity of the laser diode 43.

  By the way, the SiP chip 20 uses one communication optical fiber 100 to perform bidirectional communication. Therefore, the wavelength of light incident on the photodiode 23 and the laser diode provided at the other end of the communication optical fiber 100 are used. Is set to be different from the wavelength of the emitted light.

  The lens 65 spatially optically couples the spot size converter 21a and the input / output end of the communication optical fiber 100.

FIG. 6 is a sectional view of a press-fit pin and a PCB used in the optical communication device according to the first embodiment of the present invention.
The PCB 30 is a multilayer board in which insulating layers 35a, 35b, 35c and metal layers (ground layers 34c, wiring layers 34a, 34d, and power supply layers 34b) are alternately stacked. The PCB 30 is formed of a cylindrical metal that electrically connects the entire area of the ground layer 34c and the annular areas (circular zones) of the wiring layers 34a and 34d. The cylindrical metal and the annular regions of the wiring layers 34a and 34d are referred to as a ground VIA 31, and the inner surface of the cylindrical metal is referred to as a VIA hole. Note that the cylindrical metal forming the ground VIA 31 is insulated from the power supply layer 34b and the wiring layers 34a and 34d other than the circular band region.

  The press-fit pin 70 as a fixing pin is formed by a head 71 and a shaft 72. The outer diameter of the shaft portion 72 is formed slightly larger than the inner diameter of the ground VIA 31 of the PCB 30, and is electrically connected to the ground VIA 31 by press-fitting. The outer diameter of the shaft portion 72 is formed slightly larger than the width of the groove 11a. In addition, at the cross-shaped intersection where the press-fit pin 70 is fitted, it is preferable that the thickness of the shaft 72 be slightly larger than the length of the diagonal line of the intersection. The press-fit pin 70 is formed of any material of stainless steel, aluminum, and copper-tungsten alloy.

  The width of the groove 11a is slightly shorter than the inner diameter of the ground VIA31. Therefore, when the shaft portion 72 is fitted, the tip shape of the shaft portion 72 substantially matches the shape of the groove 11a, and the press-fit pin 70 and the base member 10a come into electrical contact. The depth of the groove 11a may be any depth as long as the press-fit pin is stable (for example, 0.5 mm or more). The head 71 is formed in a semi-elliptical cross section by caulking using a predetermined tool.

  FIGS. 7, 8, and 9 are plan views illustrating the manufacturing steps of the optical communication device according to the first embodiment of the present invention. 7 shows the first step (SP1), FIG. 8 shows the second step (SP2), and FIG. 9 shows the third step (SP3).

  As shown in FIG. 7, in the first manufacturing process (SP1), components are mounted on the base substrate 10a and the PCB 30. Specifically, the SiP chip 20 and the lens 65 are mounted on the upper surface of the base material 10a. A receptacle buffer plate 50 having a receptacle 60 is attached to the front surface of the base member 10a. Further, the IC 40 and the like are mounted on the PCB 30 by surface mounting.

  As shown in FIG. 8, in the second manufacturing step (SP2), the PCB 30 is inserted into the linear recesses 12a and 12b on both sides of the base 10a from behind. Then, when the front end of the PCB 30 and the receptacle buffer plate 50 are in contact with each other, the position of the ground VIA 31 of the PCB 30 substantially coincides with the cross-shaped intersection of the groove 11a of the base substrate 10a.

  As shown in FIG. 9, in the third manufacturing step (SP3), the press-fit pin 70 is inserted into the ground VIA 31. When the head 71 (FIG. 6) of the press-fit pin 70 is hit with a tool having a predetermined shape, the head 71 is deformed into a predetermined shape, and the tip of the shaft 72 (FIG. 6) is formed into a groove 11a. It is deformed and fits. In order to be deformed into the shape of the groove 11a, it is preferable that the width of the groove 11a is shorter than the inner diameter of the ground VIA31. As a result, the base member 10a and the PCB 30 are fixed by caulking. Further, the position of the ground VIA 31 of the PCB 30 coincides with the cross-shaped intersection of the groove 11a.

  Further, the electrode pads 26, 26 of the SiP chip 20 and the electrode pads 46, 46 of the IC 40 are connected by wires 80, 80. Thus, the optical communication device 1a is completed.

  The SiP chip 20 and the lens 65 are disposed at predetermined positions on the base substrate 10a. Since the positional relationship between the SiP chip 20 and the lens 65 and the ground VIA 31 is fixed by the press-fit pin 70, the positional relationship between the IC 40 disposed near the ground VIA 31 and the SiP chip 20 and the lens 65 is fixed. . Therefore, regardless of the thermal expansion of the PCB 30, the positional relationship between the laser diode 43 inside the IC 40, the SiP chip 20, and the lens 65 is fixed.

  Further, since the positional relationship between the electrode pad 26 of the SiP chip 20 and the electrode pad 46 of the IC 40 is fixed, the length of the wire 80 becomes constant. Further, the electrode pads 26, 26 and the electrode pads 46, 46 are arranged close to each other. Therefore, the waveform of the high-frequency signal transmitted from the IC 40 to the SiP chip 20 becomes good.

  As described above, according to the optical communication device 1a of the first embodiment, the upper surface of the base member 10a on which the SiP chip 20 is mounted has the groove 11a having a width equal to or less than the inner diameter of the ground VIA31. Further, the base material 10a and the PCB 30 can be fixed by inserting (press-fitting) the positioning fixing press-fit pins 70 into the ground VIA 31 and inserting (fitting) them into the grooves 11a. That is, the PCB 30 can be fixed by forming the linear concave portions 12a and 12b without considering the thickness accuracy of the PCB 30.

  Since the base material 10a has the plurality of grooves 11a, the designer of the PCB 30 can design the positioning (fixing) holes (recesses) with some degree of freedom. In addition, since the ground VIA 31 is used, it is not necessary to additionally design a hole for positioning and fixing, and the degree of freedom in design is improved. As a result, the overall size of the optical communication device 1a using the SiP chip 20 can be reduced due to the design flexibility of the PCB 30.

(2nd Embodiment)
In the optical communication device 1a of the first embodiment, the press-fit pin 70 is provided around the IC 40. However, the press-fit pin 70 can be provided just below the IC 40. In order to realize the optical communication device 1b (FIG. 13) having such a configuration, a manufacturing process is different from that of the first embodiment.

  FIGS. 10, 11, 12, and 13 are plan views illustrating the manufacturing steps of the optical communication device according to the second embodiment of the present invention. 10 shows a first step (SP11), FIG. 11 shows a second step (SP12), FIG. 12 shows a third step (SP13), and FIG. 13 shows a third step (SP13).

  As shown in FIG. 10, in the first manufacturing step (SP11), components are mounted on the base substrate 10a and the PCB 30. At this time, the difference from FIG. 7 (SP1) of the first embodiment is that the IC 40 is not mounted on the PCB 30. Therefore, the ground VIA 31 at the center of the solid pattern 32 can be confirmed. As shown in FIG. 11, in the second manufacturing step (SP12), as in FIG. 8 (SP8) of the first embodiment, the PCB 30 is inserted into the linear recesses 12a and 12b on both sides of the base 10a from behind. Is done.

  As shown in FIG. 12, in the third manufacturing step (SP13), the plurality of press-fit pins 70 are press-fitted into the ground VIA 31 and fitted into the grooves 11a. At this time, the point different from FIG. 9 (SP3) of the first embodiment in that the press-fit pin 70 is press-fitted not only in the peripheral portion of the region where the IC 40 is mounted but also in that region (that is, immediately below the IC 40). I do.

  Further, as shown in FIG. 13, in a fourth step (SP14), the IC 40 is mounted by soldering. Then, wires 80 are connected between the electrode pads 26 of the SiP chip 20 and the electrode pads 46 of the IC 40. Thus, the optical communication device 1b is completed.

  In the optical communication device 1b of the present embodiment, the ground VIA 31 is also provided immediately below the IC 40. Therefore, the electrical connection between the solid pattern 32 and the ground layer 34c is ensured. Therefore, the optical communication device 1b has better high-frequency characteristics than the optical communication device 1a of the above embodiment.

(Third embodiment)
In the optical communication devices 1a and 1b according to the first and second embodiments, the photodiode 23 is included in the SiP chip 20 and the laser diode 43 is built in the IC 40. However, the SiP chip 20 is replaced with the photodiode 23, the laser diode 43, or the like. The electric fusion module 25 in which the electric circuit of (1) is mounted on the Si substrate by surface mounting may be used.

FIG. 14 is a plan view of an optoelectronic fusion module used in the optical communication device according to the third embodiment of the present invention.
The photoelectric fusion module 25 is a module in which the optical circuit 27 and the electric circuit 28 are modularized, and functions as an optical circuit unit as a whole. The optical circuit 27 includes a spot size converter 21a and a wavelength multiplexer / demultiplexer 22 as a wavelength division filter. The electric circuit 28 includes a photodiode 23 as an optical signal receiving unit and a laser diode 43 as an optical signal generating unit. , A drive control circuit 44, a transimpedance amplifier 41, a monitoring photodiode 42, and a plurality of electrode pads 26, 26, 26, 26. The electric circuit 28 is fixed on the Si substrate by surface mounting.

  Although not shown, the IC 40 (FIGS. 1 and 2A and the like) includes a drive control circuit 44 and a control circuit for controlling the transimpedance amplifier 41, and the same number of electrode pads 46 as the electrode pads 26 are provided. . Also, the same number of wires 80 as the electrode pads 26 are provided.

  According to the optical communication device 1c (not shown) of the present embodiment, the electrode pads 26, 26, 26, 26 and the electrode pad 46 are similar to the optical communication devices 1a and 1b of the first and second embodiments. , Are placed in close proximity. Further, since the positional relationship between the electrode pad 26 of the SiP chip 20 and the electrode pad 46 of the IC 40 is fixed, the length of the wire 80 becomes constant. Therefore, the waveform of the high-frequency signal transmitted from the IC 40 to the SiP chip 20 becomes good.

(Modification)
The present invention is not limited to the above-described embodiment. For example, the following various modifications are possible.

(1) The groove 11a in the above embodiment has a rectangular shape in cross section, and the width of the shallow portion is equal to the width of the deep portion. However, the width can be increased toward the deep portion. FIG. 15 is a cross-sectional view of the groove of the base material according to the first modification of the present invention. The groove 11b formed in the base material 10b has a trapezoidal shape in cross section. That is, in the groove 11b, the width of the deep portion is longer than the width of the surface. When the press-fit pin 70 as a fixing pin is press-fitted (fitted), the tip of the shaft portion 72 is deformed into a trapezoidal shape in cross section, so that the press-fit pin 70 is hard to be removed from the base 10b. If the press-fit pin 70 is a resin member, thermal deformation due to heating is likely to occur.

(2) The width of the groove 11a of the first embodiment is slightly smaller than the outer diameter of the shaft portion 72 of the press-fit pin 70, and the interval between the adjacent groove 11a is increased. FIG. 16 is a perspective view of a base material in which a groove is formed with approximately the same width and interval. The base material 10c has a plurality of columns 18 formed such that the interval (pitch) between the groove 11c and the adjacent groove 11c approaches the width of the groove 11c. Further, since the interval between the adjacent grooves 11c is shorter than the interval between the adjacent grooves 11a in the above-described embodiment, the degree of freedom of the position where the press-fit pin 70 is hit is improved. That is, the degree of freedom in designing the board for determining the position of the ground VIA 31 is improved. As a result, the effects of improving the transmission characteristics of the module and reducing its size can be obtained.

(3) Although the groove 11a of the first embodiment is linear, a plurality of recesses having other shapes such as a circle may be formed. Further, a plurality of columnar columns may be formed. FIG. 17 is a perspective view of a base material having a plurality of circular concave portions formed thereon. The base member 10d has a plurality of circular concave portions 19 formed therein. This also increases the degree of freedom of the position where the press-fit pin 70 is hit. That is, the degree of freedom in designing the board for determining the position of the ground VIA 31 is improved. As a result, the effect of improving the transmission characteristics of the module and reducing the size can be obtained.

(4) In the optical communication device 1a of the embodiment, the PCB 30 is inserted into the linear recesses 12a and 12b on both sides of the base member 10a, but the PCB 30 is placed on the base member 10b (not shown). It can be placed flat. That is, although the linear concave portions 12a and 12b are provided on both sides of the base substrate 10a, the linear concave portions 12a and 12b may be omitted.

(5) In the first and second embodiments, the optical communication devices 1a and 1b have been described. However, a combination of the groove 11a, the PCB 30, and the press-fit pin 70 can be used in a device such as a laser pointer. In the external view (FIG. 1) of the optical communication device 1a described above, although the sealing is not specified, the sealing may be performed by providing a lid.

(6) In the first and second embodiments, the SiP chip 20 and the lens 65 are previously disposed on the base member 10a (SP1), and then the PCB 30 is inserted into the linear recesses 12a, 12b (SP2). After inserting the PCB 30 into the linear recesses 12a and 12b, the SiP chip 20 and the lens 65 can be disposed on the base substrate 10a.

1a, 1b, 1c Optical communication device 10a, 10b, 10c, 10d Base material 11a, 11b, 11c Groove 12a, 12b Linear recess 14a, 14b Side wall 19 Circular recess 20 SiP chip (optical circuit section)
22 Wavelength multiplexer / demultiplexer (wavelength division filter)
23 Photodiode (Optical Signal Receiving Unit in Third Embodiment)
25 Photoelectric fusion module (optical circuit section)
26, 46 electrode pad 30 PCB (electric circuit board)
31 Ground VIA (VIA hole)
32 solid pattern 40 IC (control circuit)
43 Laser Diode (Optical Signal Generation Unit in Third Embodiment)
65 lens (optical coupling element)
70 Press-fit pin (fixed pin)
80 wire 100 optical fiber for communication

Claims (9)

An optical communication device to which a communication optical fiber is connected,
An optical circuit unit for transmitting and receiving signal light;
An optical coupling element for spatially optically coupling the input / output end of the signal light and the input / output end of the communication optical fiber,
A base substrate in which the optical circuit unit and the optical coupling element are incorporated,
A control circuit for controlling the optical circuit unit is incorporated, comprising: an electric circuit board having a plurality of VIA holes;
The base substrate has a groove or a recess formed outside of the optical circuit unit and the installation area of the optical coupling element,
An optical communication device further comprising a fixing pin inserted into any of the VIA holes and the groove or the concave portion. The optical communication device according to claim 1,
The optical communication device according to claim 1, wherein the VIA hole into which the fixing pin is inserted is disposed immediately below or near the control circuit, or both. The optical communication device according to claim 1 or 2, wherein:
The optical communication device according to claim 1, wherein the base substrate has a side wall formed with a linear recess for inserting the electric circuit board in an optical axis direction of the optical circuit unit. The optical communication device according to claim 1,
The fixing pin is to be fitted into the groove or the concave portion,
The optical communication device, wherein the electric circuit board is fixed to the base material. The optical communication device according to claim 4, wherein
The groove is a cruciform groove continuously provided,
The optical communication device, wherein the fixing pin is fitted into an intersection of the cross-shaped groove. The optical communication device according to claim 1,
The optical communication device, wherein the fixing pin is formed of any material of stainless steel, aluminum, and copper-tungsten alloy. The optical communication device according to claim 1,
The optical communication device according to claim 1, wherein a width of the groove is deeper in a deep portion than in a cross-sectional view. The optical communication device according to claim 1,
The optical circuit unit includes an optical signal generation unit that generates a transmission signal light, an optical signal reception unit that receives a reception signal light, and a wavelength division filter that divides the transmission signal light and the reception signal light. Optical communication device. An optical circuit unit for transmitting and receiving signal light, an optical coupling element for spatially optically coupling the input / output end of the signal light and the input / output end of the communication optical fiber, and incorporating the optical circuit unit and the optical coupling element Optical communication for manufacturing an optical communication device comprising: a base material having a groove or a recess formed outside the region; and an electric circuit board having a plurality of via holes in which a control circuit for controlling the optical circuit portion is incorporated. A method of manufacturing a device,
A first step in which the optical circuit unit and the optical coupling element are incorporated into the base material;
A second step in which the electric circuit board incorporated in the first step is inserted into a first recess of the base material;
A light having a third step in which a fixing pin is inserted into at least one of the plurality of via holes of the electric circuit board inserted in the second step and the groove or the concave part. A method for manufacturing a communication device.

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