JP2013142731A - Optical module, circuit board and communication system - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an optical module capable of preventing physical interference with an optical waveguide, and to provide a circuit board and a communication system on which the optical module is mounted.SOLUTION: The optical module includes: a housing having interior space including an opening on a board mounting surface, an element mounting surface forming a part of an inner surface of the interior space, and a waveguide introduction port which is formed on a side surface side intersecting with the board mounting surface, is opened to the board mounting surface and communicates with the interior space; and an optical element mounted on the element mounting surface. When the optical module is mounted on a circuit board at the board mounting surface, an optical waveguide protruding from a surface of the circuit board is introduced into the interior space from the waveguide introduction port.

Description

  The present invention relates to an optical module, a circuit board on which the optical module is mounted, and a communication system.

  Optical interconnections between boards are being researched to realize exascale computing. In the optical interconnection, an optical module that is an optical transmitter or an optical receiver transmits and receives an optical signal through an optical transmission path. Patent Documents 1 to 4 describe a configuration in which an optical module and an optical transmission line are formed on a circuit board.

JP 2004-29621 A JP 2000-98153 A JP 2002-189137 A JP 2003-139799 A

  In the optical interconnection between boards, application of an organic optical waveguide made of an organic optical material is expected as an optical transmission path. However, since the organic optical waveguide is used by being stuck on a circuit board, it protrudes from the substrate surface. Therefore, there is a problem that the organic optical waveguide is mounted on the circuit board and may physically interfere with the housing of the optical module optically coupled to the organic waveguide.

  The present invention has been made in view of the above, and an object thereof is to provide an optical module capable of preventing physical interference with an optical waveguide, a circuit board on which the optical module is mounted, and a communication system.

  In order to solve the above-described problems and achieve the object, an optical module according to the present invention includes an internal space having an opening on a substrate mounting surface, an element mounting surface constituting a part of the inner surface of the internal space, A housing formed on a side surface intersecting the substrate mounting surface and having a waveguide introduction port connected to the opening and the internal space; and an optical element mounted on the element mounting surface, When mounted on a circuit board on the board mounting surface, an optical waveguide protruding from the surface of the circuit board is introduced into the internal space from the waveguide introduction port.

  In the optical module according to the present invention, in the above invention, the housing includes a plate member having the element mounting surface, and a frame member having the substrate mounting surface joined to the plate member. It is characterized by.

  In the optical module according to the present invention as set forth in the invention described above, the housing includes a guide hole for performing alignment when mounted on the circuit board.

  Moreover, the optical module according to the present invention includes, in the above-described invention, a lens element that is disposed corresponding to the optical element, and a holding holder that holds the lens element at the position of the arrangement. And having two guide holes formed so as to be able to be fitted to the MT type optical connector.

  The optical module according to the present invention is characterized in that, in the above invention, a spacer is provided between the holding holder and the element mounting surface.

  In the optical module according to the present invention as set forth in the invention described above, the spacer is made of a material having higher rigidity than the plate member.

  Further, in the optical module according to the present invention, in the above invention, the thickness of the spacer is a variation in distance from the substrate mounting surface to the condensing point of the lens element caused by a tolerance of the height of the internal space. It is selected so that it may correct so that it may reduce.

  The optical module according to the present invention is characterized in that, in the above invention, the optical module includes an electronic element mounted on the element mounting surface and connected to the optical element.

  The optical module according to the present invention is characterized in that, in the above invention, the holding holder is made of metal, and a gap between the holding holder and the electronic element is filled with a heat conductive resin. To do.

  The optical module according to the present invention is characterized in that, in the above invention, the electronic element is mounted in a recess formed in the element mounting surface.

  The optical module according to the present invention is characterized in that, in the above invention, the housing includes a heat dissipation structure formed so as to penetrate from the back side of the electronic element.

  The optical module according to the present invention is characterized in that, in the above invention, the heat dissipation structure is a heat dissipation member embedded in the casing.

  The optical module according to the present invention is characterized in that, in the above invention, the heat dissipation member is embedded in a via hole formed in the casing.

  In the optical module according to the present invention, in the above invention, the heat resistance of the bonding member that bonds the plate member and the frame member is higher than the heat resistance of the bonding member that bonds the housing and the substrate. It is characterized by.

  Further, the circuit board according to the present invention is mounted on the board mounting surface so that the optical waveguide protruding on the substrate surface and the optical waveguide are introduced into the internal space from the waveguide introduction port. And an optical module according to the invention.

  In the circuit board according to the present invention, in the above invention, the heat resistance of the bonding member that bonds the plate member and the frame member is higher than the heat resistance of the bonding member that bonds the housing and the substrate. It is characterized by.

  Further, a communication system according to the present invention is characterized by using the above optical module or circuit board.

  According to the present invention, it is possible to prevent physical interference with the optical waveguide.

FIG. 1 is a schematic perspective view of an optical module according to Embodiment 1. FIG. FIG. 2 is an exploded view of the optical module shown in FIG. FIG. 3 is a plan view of the optical module shown in FIG. 4 is a cross-sectional view taken along line AA in FIG. FIG. 5 is a front view of the optical module shown in FIG. 6 is a cross-sectional view taken along line BB in FIG. FIG. 7 is a diagram for explaining a method of mounting the optical module on the circuit board. FIG. 8 is a diagram for explaining an optical module mounted on a circuit board. FIG. 9 is a schematic cross-sectional view of the optical module according to the second embodiment.

  Embodiments of an optical module and a circuit board according to the present invention will be described below in detail with reference to the drawings. Note that the present invention is not limited to the embodiments. Moreover, in each drawing, the same code | symbol is attached | subjected suitably to the same or corresponding element. Furthermore, it should be noted that the drawings are schematic, and dimensional relationships between elements may differ from actual ones. Even between the drawings, there are cases in which portions having different dimensional relationships and ratios are included.

(Embodiment 1)
FIG. 1 is a schematic perspective view of an optical module according to Embodiment 1. FIG. FIG. 2 is an exploded view of the optical module shown in FIG. FIG. 3 is a plan view of the optical module shown in FIG. 4 is a cross-sectional view taken along line AA in FIG. FIG. 5 is a front view of the optical module shown in FIG. 6 is a cross-sectional view taken along line BB in FIG. Hereinafter, the optical module according to the first embodiment will be described with reference to FIGS.

  The optical module 100 includes a housing 10, a VCSEL (Vertical Cavity Surface Emitting Laser) array element 20, an IC driver 30, a microlens array element 40, a lens array element holder 50, and a spacer 60. .

  The housing 10 includes a rectangular plate member 11 and a U-shaped frame member 12. The plate member 11 has a laminated substrate structure in which, for example, a dielectric such as a resin and a copper foil for forming a wiring pattern are alternately laminated, for example, five layers. The frame member 12 has a structure of a laminated substrate in which, for example, a dielectric such as a resin and a copper foil forming a wiring pattern are alternately laminated, for example, nine layers. The plate member 11 and the frame member 12 are joined by solder, Au bumps, or the like in the joining layer 13 so as to ensure the conduction of the wiring pattern between the plate member 11 and the frame member 12. By joining the plate member 11 and the frame member 12, an internal space 14, an element mounting surface 11 a, and a waveguide inlet 15 are formed in the housing 10. The internal space 14 has an opening 14 a on the board mounting surface 12 a opposite to the surface joined to the plate member 11 of the frame member 12, and is surrounded by the frame member 12. The element mounting surface 11 a is the surface of the plate member 11 to which the frame member 12 is not joined, and constitutes a part of the inner surface of the internal space 14. The waveguide introduction port 15 is formed by the opening of the frame member 12 on the side surface intersecting with the substrate mounting surface 12 a and is connected to the opening 14 a and the internal space 14.

  A marker 11aa and a recess 11ab for mounting the IC driver 30 are formed on the element mounting surface 11a. On the substrate mounting surface 12a, a land grid array is formed in which planar electrode pads 16 having a diameter of 450 μm, for example, are arranged in a grid pattern with a pitch of 1 mm, for example. The planar electrode pad 16 includes, for example, a planar electrode pad 16a for power supply, a planar electrode pad 16b for differential high frequency signal, a planar electrode pad 16c for ground, and a planar electrode pad 16d for control signal. In the figure, the same type of planar electrode pads are indicated by the same type of hatching.

  The housing 10 has three guide holes 17 for alignment that are formed so as to penetrate from the frame member 12 to the plate member 11. In FIG. 3, the guide holes 17 are arranged so as to form an isosceles triangle.

  The VCSEL array element 20 that is an optical element is an element in which a plurality of (for example, 12) VCSEL elements are arranged in a one-dimensional array, and is mounted in the vicinity of the recess 11ab of the element mounting surface 11a. The IC driver 30 which is an electronic element is for driving the VCSEL array element 20 and is mounted in the recess 11ab of the element mounting surface 11a. The microlens array element 40 is arranged corresponding to the VCSEL array element 20, and for example, twelve microlenses corresponding to the number of VCSEL elements of the VCSEL array element 20 are arranged in a one-dimensional array. It is a configured element. The microlens array element 40 is made of a light-transmitting material with respect to light emitted from the VCSEL array element such as glass such as quartz glass or resin.

  The lens array element holder 50 holds the microlens array element 40 by a holding hole 52 formed in the main surface 51, and the optical axis of each microlens of the microlens array element 40 corresponds to each of the VCSEL array elements 20. It is held so as to coincide with the optical axis of the VCSEL element. The lens array element holder 50 has alignment guide holes 53 formed on both sides of the holding hole 52. By using the guide hole 53, the MT type optical connector can be fitted into the optical module 100, and the characteristics of the optical module 100 can be easily tested. The MT type optical connector refers to an optical connector having guide pin holes into which fitting pins can be inserted at both ends of a connection end face, and an optical fiber arranged between them, like an MT connector specified in JIS C5981. The spacer 60 is interposed between the element mounting surface 11 a of the plate member 11 and the lens array element holder 50. When the thickness of the spacer 60 is changed, the distance between the microlens array element 40 and the VCSEL array element 20 changes. Accordingly, the condensing position of the laser light emitted from the VCSEL array element 20 through the microlens array element 40 also changes. Accordingly, it is possible to correct so as to reduce the variation in the distance from the substrate mounting surface 12a to the condensing point of the microlens array element 40, which is caused by the height tolerance of the internal space 14 of the housing 10. The lens array element holder 50 is chamfered so that a part of the side surface 54 facing the frame member 12 is inclined with respect to the main surface 51. The lens array element holder 50 and the spacer 60 are preferably made of a metal material having high thermal conductivity such as copper.

  The operation of the optical module 100 will be described. First, the IC driver 30 is supplied with a power supply voltage signal, a differential high-frequency signal, a control signal, and the like from the outside via a wiring pattern formed on the planar electrode pad 16 and the housing 10, and the VCSEL array is based on these signals. The element 20 is driven. Each VCSEL element of the VCSEL array element 20 outputs a laser light signal having a wavelength of 1.1 to 1.5 μm, for example, including a differential high-frequency signal. Each microlens of the microlens array element 40 receives and collects the laser light signal output from each VCSEL element, and realizes predetermined optical coupling with, for example, an external optical component. In the case of realizing optical coupling, it is preferable to use a lens element such as the microlens array element 40 because coupling efficiency can be higher than so-called butt coupling that does not use a lens element.

  Next, a method for assembling the optical module 100 will be described. First, the plate member 11 and the frame member 12 are joined by solder reflow, Au bump pressure welding, or the like. At this time, SnAuC solder having a melting point of, for example, about 220 ° C. is used. Further, the alignment between the plate member 11 and the frame member 12 can be performed using the three guide holes 17.

  Next, the VCSEL array element 20 is mounted on the element mounting surface 11a. If the VCSEL array element 20 is aligned using the marker 11aa, it can be mounted at a more accurate position. Next, the IC driver 30 is mounted in the recess 11ab of the element mounting surface 11a. The IC driver 30 is wire-bonded to the electrode pad formed on the element mounting surface 11a. Wire bonding is also performed between the VCSEL array element 20 and the IC driver 30. Since the IC driver 30 is mounted in the recess 11ab, the difference in height between the VCSEL array element 20 and the IC driver 30 is reduced, so that the length of the bonding wire can be shortened. As a result, deterioration of the quality of the differential high-frequency signal output from the IC driver 30 to the VCSEL array element 20 via wire bonding is suppressed.

  Of the planar electrode pads 16, the planar electrode pad 16a for power supply and the planar electrode pad 16d for control signal are arranged on the waveguide inlet 15 side (the leading end side of the U-shape) of the frame member 12. . As a result, there is no signal wiring pattern other than the differential high-frequency signal in the path from the differential high-frequency signal planar electrode pad 16 b to the IC driver 30 through the wiring pattern in the housing 10. Therefore, the wiring pattern for the differential high-frequency signal can be easily routed and the pattern length can be shortened, so that the deterioration of the quality of the differential high-frequency signal is suppressed.

  Next, the spacer 60 is bonded to the element mounting surface 11a with an adhesive or the like. Here, in order to reduce the height of the optical module 100 while reducing the height of the optical module 100 while maintaining the height of the internal space 14 (to reduce the height), and efficiently dissipate heat generated during operation of the IC driver 30 to the outside. In order to do so, it is preferable that the plate member 11 is thinner. However, if the plate member 11 is thin, the heat from the IC driver 30 may cause deformation such as warpage or deflection. As a result, for example, the distance between the VCSEL array element 20 and the microlens array element 40 changes, and the predetermined optical coupling state may be deteriorated. On the other hand, if the spacer 60 is formed of a material such as metal, which has higher rigidity than the housing 10, the above deformation is suppressed, so that deterioration of a predetermined optical coupling state is also suppressed.

  Further, as described above, since the frame member 12 has a structure in which dielectrics and copper foils are alternately laminated, an error from a design value due to a manufacturing error or the like tends to occur in the thickness. If there is an error in the thickness of the frame member 12, an error also occurs in the height of the internal space 14, and an error occurs in the predetermined optical coupling realized by the microlens array element 40. Therefore, spacers 60 having different thicknesses are prepared in advance, and the spacers 60 have such thicknesses as to offset the error according to the error of the thickness of the frame member 12 (the height of the internal space 14) measured in advance. If this is selected and used, the above optical coupling error problem is solved.

  Next, the microlens array element 40 is inserted into the holding hole 52 of the lens array element holder 50 and bonded. Next, after the lens array element holder 50 is placed on the spacer 60 and the VCSEL array element 20 and the microlens array element 40 are aligned, the lens array element holder 50 is bonded to the spacer 60. At this time, if the gap between the lens array element holder 50 or the spacer 60 and the IC driver 30 is filled with a resin having high thermal conductivity such as silicone, heat generated during the operation of the IC driver 30 is passed through the resin through the lens array. Since heat is radiated from the element holder 50 and the spacer 60, it is preferable.

  The alignment between the VCSEL array element 20 and the microlens array element 40 is performed by observing the state of light transmitted through the microlens array element 40 in a state where the VCSEL array element 20 is operated to output laser light. Can be performed by so-called active alignment. The observation of the state of the light transmitted through the microlens array element 40 may be performed using, for example, a microscope, or the MT connector of a known optical fiber array with an MT connector is opposed to the microlens array element 40. The intensity of the laser beam output from the optical fiber array may be measured. The guide hole 53 is provided for positioning with the MT connector for evaluation via the guide pin. In this case, if the guide pin is inserted into the guide hole of the MT connector and the guide hole 53 of the lens array element holder 50, the MT connector can be easily fitted to the lens array element holder 50. At this time, a spacer is inserted between the light input / output end face of the organic waveguide so that light is coupled to the optical connection end face of the MT connector. Thus, the MT connector and the microlens array element 40 can be aligned with high accuracy, and the characteristics of the optical module 100 can be easily evaluated. Thereby, active alignment with higher positional accuracy is realized.

  As described above, since the lens array element holder 50 is partially chamfered on the side surface 54 facing the frame member 12, an adhesive for bonding the lens array element holder 50 to the spacer 60 is poured. Easy and workable.

  Next, a method for mounting the optical module 100 on a circuit board will be described. FIG. 7 is a diagram for explaining a method of mounting the optical module on the circuit board. As shown in FIG. 7, an organic optical waveguide 210 is mounted on the circuit board 200 by adhesion. One end of the organic optical waveguide 210 is processed into a wedge-shaped wedge portion 211. In addition, on the circuit board 200, three markers 220 arranged in correspondence with the arrangement of the guide holes 17 of the optical module 100 are provided.

  When the optical module 100 is mounted on the circuit board 200, for example, a known flip chip bonder can be used. In this case, the back surface 11b of the optical module 100 is sucked and lifted by the head of the flip chip bonder, the optical module 100 is moved to a predetermined position on the circuit board 200, and is mounted from the head through the housing 10. By applying heat, each planar electrode pad 16 of the optical module 100 and the electrode pad on the circuit board 200 are soldered. Thereby, the circuit board 1000 on which the optical module 100 is mounted is completed.

  At the time of mounting, the optical module 100 can be accurately mounted at a desired position on the circuit board 200 by aligning the guide hole 17 of the optical module 100 with the marker 220 on the circuit board 200.

  Although the organic optical waveguide 210 protrudes from the surface of the circuit board 200, when the optical module 100 is mounted on the circuit board 200, the organic optical waveguide 210 is introduced into the internal space 14 from the waveguide inlet 15. Therefore, it is possible to prevent physical interference with the optical module 100.

  Further, when mounting using a flip chip bonder, the melting point is higher than that of the high melting point solder so that the high melting point solder joining the plate member 11 and the frame member 12 is not melted by the heat applied from the head. It is preferable to use a low-melting-point solder having a low temperature. As the low melting point solder, for example, SnPb solder having a melting point of about 183 ° C. or SnBi solder having a melting point of about 137 ° C. can be used. However, even when SnAgCu is used for joining the frame member and the plate member, the melting point rises after melting, so that SnAgCu solder can be used if temperature management is accurately performed when the optical module is mounted. In addition, it is preferable that the microlens array element 40 is made of glass because deformation due to heat hardly occurs even when heating for mounting is performed by a flip chip bonder. Also, the adhesive used for bonding the microlens array element 40, the lens array element holder 50, or the spacer 60 is preferably an epoxy resin having high heat resistance.

  FIG. 8 is a diagram for explaining an optical module mounted on a circuit board. As shown in FIG. 8, the VCSEL array element 20 is electrically connected to the IC driver 30 by bonding wires 101. The IC driver 30 is electrically connected to an electrode pad (not shown) on the element mounting surface 11a by a bonding wire 102. Further, as shown by the electrical path DL, the electrode pads are formed on the circuit board from the wiring pattern formed on the element mounting surface 11a via the plate member 11, the bonding layer 13, the frame member 12, and each planar electrode pad 16. It is electrically connected to 200 wiring patterns.

  By aligning the guide hole 17 of the optical module 100 with the marker 220 on the circuit board 200, the VCSEL element is aligned with the guide hole 17 of the optical module 100, and the marker 220 on the circuit board 200 is aligned. And the organic waveguide 210 are aligned so that the positional relationship between the microlens array element 40 and the organic optical waveguide 210 is appropriate.

  The organic optical waveguide 210 is introduced into the internal space 14 from the waveguide introduction port 15, so that it does not physically interfere with the optical module 100. Further, the organic optical waveguide 210 is not physically interfered with the microlens array element 40 and the lens array element holder 50 by appropriately setting the thickness of the frame member 12. At this time, the waveguide inlet 15 may be closed with grease or resin so that dust or the like does not enter the internal space 14.

  When the optical module 100 is used, the IC driver 30 is supplied with a power supply voltage signal, a differential high-frequency signal, a control signal, and the like from the circuit board 200 via the planar electrode pad 16. The VCSEL array element 20 is driven by the IC driver 30 and outputs a laser light signal L including a differential high-frequency signal from each VCSEL element. Each microlens of the microlens array element 40 receives the laser light signal L output from each VCSEL element, and condenses the laser light signal L on the organic optical waveguide 210 from above the organic optical waveguide 210. The wedge portion 211 reflects the collected laser light signal L and couples it to the organic optical waveguide 210. The organic optical waveguide 210 transmits the laser light signal L to, for example, another circuit board.

  As described above, the spacer 60 has a variation in the distance from the substrate mounting surface 12a to the condensing point of the microlens array element 40 caused by the effect of suppressing the deformation of the plate member 11 and the tolerance of the thickness of the frame member 12. As a result, a suitable coupling of the laser light signal L to the organic optical waveguide 210 is realized.

  Here, the circuit board 200 has substantially the same configuration as that of the optical module 100, but a photodiode array element as a light receiving element is mounted instead of the VCSEL array element 20, and a transimpedance amplifier is replaced instead of the IC driver 30. And a receiving optical module on which a limiting amplifier and the like are mounted. The receiving optical module can receive a laser light signal transmitted from another circuit board through another organic optical waveguide. This realizes optical interconnection between boards.

  As described above, according to the optical module 100 according to the first embodiment, physical interference between the optical module 100 and the organic optical waveguide 210 is prevented. Furthermore, a suitable optical coupling between the laser light signal L output from the VCSEL array element 20 and the organic optical waveguide 210 is realized.

(Embodiment 2)
FIG. 9 is a schematic cross-sectional view of an optical module according to Embodiment 2 of the present invention. As shown in FIG. 9, the optical module 100A according to the second embodiment is different from the optical module 100 according to the first embodiment in that the housing 10 is replaced with the housing 10A. Is different. The case 10A is different from the case 10 in that the case 10 has a configuration in which the plate member 11 is replaced with the plate member 11A.

  The plate member 11 </ b> A has a configuration in which a plurality of rod-shaped heat radiation members 71 are embedded in the plate member 11 so as to penetrate from the bottom surface of the recess 11 ab on the back surface side of the IC driver 30. The heat radiating member 71 is made of a material having high thermal conductivity, and is preferably made of, for example, copper or aluminum. A heat sink 72 is provided on the back surface 11b of the plate member 11A so as to be in contact with the heat radiating member 71. The heat sink 72 is also made of a material having high thermal conductivity, and is preferably made of, for example, copper or aluminum.

  In the optical module 100A, heat generated during the operation of the IC driver 30 is dissipated by the heat dissipating member 71 and the heat sink 72, which is more preferable. A via hole is formed in the plate member 11A, and a heat dissipation member 71 having a high thermal conductivity is embedded in the via hole.

  As another example of the mounting method of the optical module, a case of mounting using solder will be described.

  In general, with respect to the surface (substrate mounting surface 12a) on which the planar electrode pad 16 of the optical module 100 is present, solder balls are placed on the planar electrode pad 16 at the initial stage of manufacturing the optical module 100 / or. A BGA (ball grid array) -shaped optical module 100 is mounted after the optical module 100 is manufactured, and the solder is melted to mount the optical module 100 on a circuit board (Opto-substrate).

  However, in this embodiment, the planar electrode surface pad 16 of the optical module 100 is formed in an LGA (land grid array) shape as shown in the figure, and solder mounting is performed by a method that does not use solder balls.

  Specifically, a mask plate having a thickness of about 10 μm with a hole at a predetermined position where electrical connection is made is placed on the Opto-substrate, and solder cream is applied on the mask plate to smooth the surface like a spatula. Then, a solder cream is put in the hole, and an excessive solder cream thicker than the mask plate thickness is removed, and a solder cream layer having a thickness of about 100 μm is formed at a predetermined place where electrical connection is made.

Thereafter, the positions of the optical module 100 and the Opto-substrate are aligned, and the solder is melted and mounted. This mounting includes a method of mounting with a flip chip bonder and a method of reflow mounting through a reflow furnace.
After that, the gap on the mounting surface is filled with a general underfill material.

  The solder cream layer having a thickness of about 100 μm formed at a predetermined location where the electrical connection is performed may be formed on the optical module side.

  Further, it was confirmed that there was no problem in reliability of an object (Opto-board on which an optical module was mounted) on which solder mounting was performed without using solder balls.

  When the above mounting method is used, the solder layer can be made thinner than the BGA, so that the variation in the distance between the frame member and the circuit board can be reduced. As a result, the light output from the optical module can be reduced. Can be stably coupled to the organic waveguide.

  In the above embodiment, the casing is configured by joining a plate member and a frame member. However, the configuration is not particularly limited as long as it has an opening, an internal space, and a waveguide inlet. For example, a plate member and a frame member may be integrally formed, but a U-shape is preferable because an area where the LGA can be arranged can be increased. Further, the shape of the plate member is not limited to a rectangle. Further, the shape of the frame member is not limited to the U-shape in which all of one side of the rectangular frame body is opened as in the above-described embodiment. For example, only a part of one side of the frame is opened. Or a part of or all of the plurality of sides may be open.

  In addition, the optical waveguide provided on the circuit board is not limited to the organic optical waveguide as long as it protrudes from the substrate surface, for example, a ridge type optical waveguide such as a silicon fine wire waveguide, an optical fiber sheet, An optical waveguide such as a PLC chip may be used.

  The method of mounting the optical module on the circuit board is not limited to flip chip bonding, and may be performed by, for example, reflow or solder stud pressure contact. Moreover, you may comprise the communication system using said optical module or said circuit board.

  Further, the present invention is not limited by the above embodiment. What was comprised combining each component mentioned above suitably is also contained in this invention. Further effects and modifications can be easily derived by those skilled in the art. Therefore, the broader aspect of the present invention is not limited to the above-described embodiment, and various modifications can be made.

10, 10A Housing 11, 11A Plate member 11a Element mounting surface 11aa, 220 Marker 11ab Recess 11b Back surface 12 Frame member 12a Substrate mounting surface 13 Bonding layer 14 Internal space 14a Opening 15 Waveguide inlet 16, 16a, 16b, 16c, 16d Planar electrode pad 17, 53 Guide hole 20 VCSEL array element 30 IC driver 40 Micro lens array element 50 Lens array element holder 51 Main surface 52 Holding hole 54 Side surface 60 Spacer 71 Heat radiation member 72 Heat sink 100, 100A Optical module 101, 102 Bonding Wire 200, 1000 Circuit board 210 Organic optical waveguide 211 Wedge DL Electric path L Laser optical signal

Claims (17)

An internal space having an opening on the substrate mounting surface, an element mounting surface constituting a part of the inner surface of the internal space, and a side surface intersecting with the substrate mounting surface are formed in the opening and the internal space. A housing having a waveguide inlet to be connected;
An optical element mounted on the element mounting surface;
And an optical waveguide protruding to the surface of the circuit board is introduced into the internal space from the waveguide introduction port when mounted on the circuit board on the board mounting surface.   The optical module according to claim 1, wherein the casing includes a plate member having the element mounting surface and a frame member having the substrate mounting surface joined to the plate member.   The optical module according to claim 1, wherein the casing includes a guide hole for performing alignment when mounted on the circuit board.   A lens element arranged in correspondence with the optical element; and a holding holder for holding the lens element at the arrangement position. The holding holder is formed so as to be able to be fitted with an MT type optical connector. The optical module according to claim 1, further comprising one guide hole.   The optical module according to claim 4, further comprising a spacer interposed between the holding holder and the element mounting surface.   The optical module according to claim 5, wherein the spacer is made of a material having higher rigidity than the plate member.   The thickness of the spacer is selected so as to correct the variation in the distance from the substrate mounting surface to the condensing point of the lens element caused by the tolerance of the height of the internal space. The optical module according to claim 5 or 6.   The optical module according to claim 1, further comprising an electronic element mounted on the element mounting surface and connected to the optical element.   The optical module according to claim 8, wherein the holding holder is made of metal, and a gap between the holding holder and the electronic element is filled with a heat conductive resin.   The optical module according to claim 8, wherein the electronic element is mounted in a recess formed on the element mounting surface.   The optical module according to claim 8, wherein the casing includes a heat dissipation structure formed so as to penetrate from the back side of the electronic element.   The optical module according to claim 11, wherein the heat dissipation structure is a heat dissipation member embedded in the housing.   The optical module according to claim 12, wherein the heat radiating member is embedded in a via hole formed in the housing.   The heat resistance of the joining member that joins the plate member and the frame member is higher than the heat resistance of the joining member that joins the housing and the substrate. Optical module. An optical waveguide protruding from the substrate surface;
The optical module according to any one of claims 1 to 14, which is mounted on the substrate mounting surface so that the optical waveguide is introduced into the internal space from the waveguide introduction port,
A circuit board comprising:   The circuit board according to claim 15, wherein a heat resistance of a bonding member for bonding the plate member and the frame member is higher than a heat resistance of a bonding member for bonding the housing and the substrate.   A communication system using the optical module or circuit board according to claim 1.

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