JP2019206088A - Mask for alignment of ball and manufacturing method therefor - Google Patents

Abstract

To provide a mask for alignment of a ball having a coating layer for reducing adhesive force formed on a squeegeeing surface side so that an inside projection dose not penetrate from a mask body to the squeegeeing surface side.SOLUTION: A mask has a mask body formed by plating and formed with a plurality of apertures to which a conductive all is inserted, and a projection formed by plating and partially projecting other than the apertures of a mask body back surface on a substrate side facing an electrode of a substrate, in which the projection is formed by a first plating layer, and composed of an inside projection by exposing a surface of a squeegeeing surface side and an outside projection formed by a second plating layer on a surface excluding the squeegeeing surface side of the inside projection and projected to the substrate side, in which the mask body is integrally formed with the outside projection by the second plating layer, and a coating layer for reducing adhesive force is formed on a surface on the squeegeeing surface side where at least the inside projection is exposed and a surface on the squeegeeing surface side of the mask body in the peripheral vicinity thereof.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a ball array mask for mounting conductive balls and a method of manufacturing the same.

  Conventionally, a mask body formed with plating and formed with a plurality of openings through which the conductive balls transferred are inserted, and a side that is formed by plating and faces the electrodes of the substrate rather than the side where the conductive balls are transferred A protrusion partially protruding in addition to the opening on the back surface of the mask main body, the protrusion being separated from the internal protrusion formed by the first plating layer and the first plating layer on the surface of the internal protrusion. Formed by the second plating layer, and is formed of an external protrusion on the side facing the electrode of the substrate, and the mask body is integrally formed with the external protrusion by the second plating layer. A ball array mask is known in which a central portion is a flat surface in a side view, and a peripheral edge portion around the central flat surface is rounded.

JP 2017-5053 A

  In the conventional arrangement mask, the protrusion is formed by an internal protrusion formed by the first plating layer and a second plating layer different from the first plating layer on the surface of the internal protrusion, and the electrode of the substrate. The external protrusion formed by the second plating layer is formed integrally with the mask body, but the internal protrusion formed by the first plating layer is the mask. Since it is not formed integrally with the main body and is exposed to the squeegee surface side, there is a concern that the bonding strength may be weakened due to the usage environment, secular change, or the like, and may drop off. For example, if an adhesive tape is attached to the squeegee surface after mounting the conductive ball and the conductive ball is removed, a force to pull up the internal protrusion due to the adhesive force of the adhesive tape is applied. There was a risk of slipping out to the surface side. In addition, if the array mask is handled roughly during transportation, there is a concern that the internal protrusion may fall off the mask body to the squeegee surface side due to vibration or the like.

  The present invention has been made to solve the above-described problems, and a ball array in which a coating layer for reducing adhesive force is formed on the squeegee surface side so that the internal protrusions do not come out from the mask body to the squeegee surface side. A mask and a method for manufacturing the same are provided.

  In the ball arrangement mask according to the present invention, a mask body formed with plating and formed with a plurality of openings through which the conductive balls transferred are formed, and a squeegee surface formed with plating and into which the conductive balls are transferred. A protrusion partially protruding in addition to the opening on the back side of the mask body on the substrate side facing the substrate electrode instead of the side, and the protrusion is formed by the first plating layer, and the surface on the squeegee surface side is exposed. The mask main body is formed of an internal protrusion formed on the surface of the internal protrusion excluding the squeegee surface side, and an external protrusion that is formed on the surface of the substrate other than the first plating layer and protrudes toward the substrate. The squeegee squeegee is formed integrally with the external projection by the second plating layer, and at least the surface of the squeegee surface side where the internal projection is exposed and the vicinity thereof. It is obtained by forming a coating layer of pressure-sensitive adhesive force reducing the surface of the surface side.

  Further, the coating layer for reducing the adhesive force is formed on the entire surface of the mask main body on the squeegee surface side including the exposed squeegee surface side of the internal protrusions.

  Further, in the method of manufacturing a ball array mask according to the present invention, a mask body formed by plating and formed with a plurality of openings through which the transferred conductive balls are inserted, and the conductive balls formed by plating. And a protrusion partially protruding in addition to the opening on the back surface of the mask body on the substrate side facing the substrate electrode, not on the squeegee surface side into which the squeegee is transferred, the protrusion being formed by the first plating layer, An internal protrusion whose surface on the side is exposed, and an external protrusion formed on the surface excluding the squeegee surface side of the internal protrusion by a second plating layer different from the first plating layer and protruding toward the substrate side The mask main body is formed integrally with the external protrusion by the second plating layer, and a step of forming a resist layer for forming the internal protrusion on the SUS base material, and the internal protrusion A step of forming the first plating layer by plating on the SUS base material so as to have a constant height, and a step of removing the resist layer for forming the internal protrusions after the formation of the first plating layer is completed. Removing the first plating layer other than the internal protrusions and leaving the internal protrusions made of the first plating layer on the SUS base material, and a resist for forming a plurality of openings between the internal protrusions on the SUS base material A step of forming a layer, a step of forming a second plating layer by plating on the SUS base material and the internal protrusion so that the mask main body has a specified thickness, and formation of the second plating layer. When finished, a step of removing the resist layer for forming a plurality of openings, a step of peeling the mask main body from the SUS base material and the internal protrusions of the first plating layer and the external protrusions of the second plating layer, At least of the internal protrusions A step of the out surface of the squeegee side and the squeegee side of the surface of the surrounding vicinity of the mask body forming a coating layer of adhesive force reducing, those having a.

  The method further includes the step of forming a coating layer for reducing the adhesive force on the entire surface of the mask body including the exposed squeegee surface side of the internal protrusion.

  According to the present invention, since the coating layer for reducing the adhesive force is formed on at least the surface on the squeegee surface side where the internal protrusion is exposed and the surface on the squeegee surface side of the mask body in the vicinity thereof, After the ball is mounted, adhesive tape, etc. is applied to the squeegee surface side to remove the conductive ball. Even if a pulling force is applied due to the adhesive force of the adhesive tape, the internal protrusion does not reach the internal protrusion. There is no risk of slipping out from the squeegee side. In addition, during transportation of the array mask, the risk of the internal projections falling off from the mask body to the squeegee surface side due to vibration or the like is reduced.

It is sectional drawing which shows the manufacturing method of the mask for ball | bowl arrangement | sequence in Example 1 of this invention in order of a process. It is principal part sectional drawing which expands and shows the structure of the columnar protrusion of the ball | bowl arrangement | sequence mask in Example 1 of this invention. It is principal part sectional drawing which expands and shows the structure of the columnar protrusion of the conventional ball | bowl arrangement | sequence mask.

Example 1.
A method of manufacturing a ball array mask in Embodiment 1 of the present invention will be described with reference to FIG.
First, a resist is laminated on the SUS base material 1, and necessary exposure and development processes are performed to partially form a resist layer 2 for forming protrusions on the SUS base material 1 (see FIG. 1A). The protrusion-forming resist layer 2 has, for example, a cylindrical shape, but may have a polygonal shape or the like, and is not limited to a cylindrical shape. Next, for example, the first plating layer 3 is formed by plating the entire surface of the SUS base material 1 so that the protrusions 3a have a predetermined height (thickness) (see FIG. 1B). When the formation of the first plating layer 3 is completed, the resist layer 2 for forming the protrusion is removed (see FIG. 1C). Next, all of the first plating layer 3 other than the protrusion 3a is removed, and only the internal protrusion 3a made of the first plating layer 3 is left on the SUS base material 1 (see FIG. 1D). The protrusion formed by the remaining first plating layer 3 is an internal protrusion 3a. That is, if the person has mastered a certain amount of work, the internal protrusion 3a made of the first plating layer 3 can be produced without requiring a particularly high technical skill. Then, a resist 4 for forming an opening is pasted on the SUS base material 1 (see FIG. 1E), required exposure and development processes are performed, and a plurality of openings are formed between the internal protrusions 3a on the SUS base material 1. A forming resist layer 4a is formed (see FIG. 1F). Next, the second plating layer 5 is formed by plating separately from the first plating layer on the SUS base material 1 and the internal protrusion 3a so that the mask body has a specified thickness (FIG. 1). (See (g)). Of the second plating layer 5, the portion located on the inner protrusion 3 a and facing the electrode of the substrate is the outer protrusion 5 a. That is, the mask main body is integrally formed with the external protrusion 5 a made of the second plating layer 5. Then, by removing the resist layer 4a for forming the plurality of openings, the second plating layer 5 in which the plurality of openings 5b through which the conductive balls are inserted is formed between the internal protrusions 3a is formed (FIG. 1 (h)). reference). Next, the internal protrusion 3a made of the first plating layer 3 and the external protrusion 5a made of the second plating layer 5 are peeled from the SUS base material 1 (see FIG. 1 (i)). Here, the internal protrusion 3a made of the first plating layer is not formed integrally with the mask body, and the surface on the squeegee surface side is exposed to the outside. Finally, for example, when the conductive ball is mounted on the squeegee surface side after mounting the conductive ball and the conductive ball is removed, the internal protrusion 3a does not come out from the mask body to the squeegee surface side due to the adhesive force of the adhesive tape. Thus, by forming the coating layer 6 for reducing the adhesive force on the entire surface on the squeegee surface side, the ball array mask of the present invention is completed (FIG. 1 (k)). The coating layer 6 can prevent the internal protrusions 3a from falling off by merely forming the coating layer 6 at least on the squeegee surface side where the internal protrusions 3a are exposed and in the vicinity of the mask body. The coating layer 6 is made of, for example, a fluororesin, a silicon resin, an acrylic resin or the like having water repellency, but may be made of other materials as long as the adhesive force can be reduced. In the conventional case, the surface on the squeegee surface side of the internal projection 3a of the completed ball arrangement mask is exposed as shown in FIG. 3, but in the present invention, as shown in FIG. For example, after mounting the conductive ball, an adhesive tape or the like is attached to the squeegee surface side after mounting the conductive ball, and during the operation of removing the conductive ball, the pulling force is applied by the adhesive force of the adhesive tape. However, the inner protrusion 3a does not reach the squeegee surface side from the mask main body. In addition, during transportation of the array mask, the possibility that the internal projections 3a fall off from the mask body to the squeegee surface side due to vibration or the like is reduced.
In the present invention, the coating layer 6 for reducing the adhesive force is formed on the entire surface of the mask body on the squeegee surface side. Further, the water repellency for preventing the adhesion of flux to the necessary portion on the lower surface of the mask body on the substrate side The coating layer may be formed.
The first plating layer 3 and the inner protrusion 3a formed by the first plating layer are made of, for example, nickel sulfamate, citrate, nickel chloride, and NTS (1.3.6-sodium naphthalene trisulfonate) as a brightener. The second plating layer (mask body) 5 and the external protrusion 5a formed by the second plating layer are formed, for example, by nickel sulfate, nickel chloride, boric acid, and gloss. You may form using the plating bath composition (gloss plating) which consists of NTS (1.36-6-naphthalene trisulfonate sodium) as an agent. In this case, gloss plating increases as a whole amount, and the gloss plating has higher hardness, so that durability against elongation is improved. Moreover, there is an advantage that the surface of the substrate surface can be easily cleaned. Also, the reason why the first plating layer 3 and the inner protrusion 3a formed by the first plating layer are not glossy plated is that the inner protrusion 3a is less likely to fall off due to friction when the surface is rough like the matte plating. Because it becomes.

Example 2
In the first embodiment, the cylindrical inner protrusion 3a is formed by partially forming the cylindrical protrusion-forming resist layer 2 on the SUS base material 1, but instead of the cylindrical shape, For example, a continuous rectangular stripe-shaped inner protrusion may be formed by continuously forming an elongated rectangular frame-shaped resist layer for forming a protrusion, or an elongated rectangular frame-shaped internal protrusion may be formed. The internal protrusions may be intermittently formed by intermittently forming a resist layer for forming a protrusion.

Comparative example.
For comparison with the present invention, the structure of the columnar protrusions of the conventional ball array mask will be described with reference to FIG.
As shown in FIG. 3, the internal protrusion 3a of the conventional ball array mask remains exposed on the surface on the squeegee surface side. For example, an adhesive tape or the like is applied to the squeegee surface side after mounting the conductive balls, If a pulling force is applied by the adhesive force of the adhesive tape during the operation of removing the conductive ball, the internal protrusion 3a may come out of the mask body toward the squeegee surface as indicated by the arrow in the figure. Also, if the array mask is handled roughly during transportation, the internal projections 3a may fall off from the mask body to the squeegee surface side due to vibration or the like.

DESCRIPTION OF SYMBOLS 1 SUS base material 2 Protrusion forming resist layer 3 First plating layer 3a Internal protrusion 4 by first plating layer 4 Opening formation resist 4a Multiple opening forming resist layer 5 Second plating layer ( Mask body)
5a External projection 5b by second plating layer Multiple openings 6 Coating layer for reducing adhesive strength

Claims (4)

The mask body formed by plating and formed with a plurality of openings through which the conductive balls transferred are inserted, and the substrate side formed by plating and opposed to the substrate electrode, not the squeegee surface side into which the conductive balls are transferred A protrusion partially protruding in addition to the opening on the back surface of the mask body, the protrusion being formed by a first plating layer, and an internal protrusion having an exposed surface on the squeegee surface side. The mask body is formed of a second plating layer different from the first plating layer on the surface excluding the squeegee surface side of the protrusion, and includes an external protrusion protruding toward the substrate side. A ball arrangement mask formed integrally with the external protrusion by a layer,
A ball arranging mask, wherein a coating layer for reducing adhesive force is formed on at least a surface on the squeegee surface side where the internal protrusion is exposed and a surface on the squeegee surface side of the mask body in the vicinity thereof.   2. The ball arrangement mask according to claim 1, wherein the adhesive layer reducing coating layer is formed on the entire surface of the mask body including the squeegee surface side where the internal protrusions are exposed. The mask body formed by plating and formed with a plurality of openings through which the conductive balls transferred are inserted, and the substrate side formed by plating and opposed to the substrate electrode, not the squeegee surface side into which the conductive balls are transferred A protrusion partially protruding in addition to the opening on the back surface of the mask body, the protrusion being formed by a first plating layer, and an internal protrusion having an exposed surface on the squeegee surface side. The mask body is formed of a second plating layer different from the first plating layer on the surface excluding the squeegee surface side of the protrusion, and includes an external protrusion protruding toward the substrate side. A method of manufacturing a ball arrangement mask formed integrally with the external protrusion by a layer,
Forming a resist layer for forming the internal protrusion on a SUS base material;
Forming a first plating layer by plating on a SUS base material so that the internal protrusion has a predetermined height;
After the formation of the first plating layer, the step of removing the resist layer for forming the internal protrusions;
Removing the first plating layer other than the internal protrusions and leaving the internal protrusions made of the first plating layer on the SUS base material;
Forming a plurality of opening forming resist layers between the internal protrusions on the SUS base material;
Forming a second plating layer by plating on the SUS base material and the internal protrusion so that the mask body has a specified thickness;
After the formation of the second plating layer, the step of removing the resist layer for forming the plurality of openings,
Peeling the mask main body from the internal protrusions made of the first plating layer and the external protrusions made of the second plating layer from the SUS base material;
Forming a coating layer for reducing adhesive force on at least the surface of the squeegee surface side of the exposed internal protrusion and the surface of the mask body near the periphery of the squeegee surface side; and
A method of manufacturing a ball array mask, comprising:   4. The ball array mask according to claim 3, further comprising a step of forming a coating layer for reducing adhesive force on the entire surface of the mask body including the exposed squeegee surface side of the internal protrusion. Production method.

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