JPH06346271A - Nickel laminate and its production - Google Patents

Abstract

PURPOSE:To obtain a nickel laminate excellent in adhesion strength. CONSTITUTION:A first nickel layer 1 as a base material is primarily electroformed with mat nickel, a photoresist film is patterned on the surface of the layer 1, and then a second nickel layer 2 having a specified pattern is secondarily electroformed with bright nickel or mat nickel. Consequently, the layer 2 is not peeled off from the layer 1 even when the laminate is vibrated or bent, and a laminate excellent in adhesion is obtained.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a nickel laminate having good adhesion, which is suitable for use in components requiring vibration resistance such as ink jet nozzle diaphragms and chip insertion jigs for electronic components. And the manufacturing method thereof.

[0002]

2. Description of the Related Art Conventionally, for example, an ink jet nozzle diaphragm is generally made by etching. At the time of etching, as shown in FIG.
Polyimide 11 on the back side of S material 10 (15 to 20 μm thick)
And then patterning a resist film 12 on the surface of the SUS material 10 as shown in FIG.
Then, an etching process is performed as shown in FIG.
Finally, the resist film 12 is removed to obtain an inkjet nozzle vibrating plate 13 as shown in FIG.

[0003]

However, when the polyimide 11 is used as the base material, the durability is inferior to that of metal and the adhesion with the SUS material 10 is not so good. In addition, sagging easily occurs during etching, and it is difficult to obtain a highly precise shape. Therefore, the present inventors have excellent durability,
In addition, in order to obtain a highly accurate nozzle diaphragm for inkjet, we tried to make it by nickel electroforming. 1st nickel layer as a base material in a normal bright nickel bath
Then, a photoresist film is patterned on the surface of the first nickel layer, and then a second nickel layer is formed on the surface of the first nickel layer which is not covered by the photoresist film. It is an attempt to cast.

However, the first nickel layer and the second nickel layer were difficult to adhere to each other and were easily peeled off. It was confirmed that this was due to electroforming the first nickel layer as a base material in a bright nickel bath. The reason for this is not clear, but one of the possible reasons is that when the primary nickel layer of the base material is subjected to primary electroforming in a nickel sulfamate bath containing butynediol or a brightener such as saccharin or NTS. Since the first nickel layer contains a large amount of sulfur and carbon, an oxide film may be formed on the surface of the first nickel layer between the first electroforming and the second electroforming, and chemicals such as alkaline developer may be attached. The surface condition of the first nickel layer changes. Therefore, it is considered that the second nickel layer is compositionally difficult to adhere to the surface of the first nickel layer. In addition, since the crystals on the glossy surface of the first nickel layer are densely packed, it is considered that the second nickel layer is hard to physically adhere.

The present invention has been made in view of these points, and an object thereof is to provide a nickel laminate having excellent adhesion between nickel layers and a method for producing the same.

[0006]

A nickel laminate of the present invention is obtained by secondary electroforming a second nickel layer 2 having a predetermined pattern on the surface of a primary electroformed first nickel layer 1. The first nickel layer 1 is made of matte nickel to which no brightener is added.

In the production of the nickel laminate of the present invention, a step of primary electroforming the first nickel layer 1 on the surface of the electroforming mold 3 with a matte nickel bath, and a step of forming the first nickel layer 1 on the surface A step of patterning the photoresist film 6, and a step of secondarily electroforming the second nickel layer 2 on the surface of the first nickel layer 1 which is not covered with the photoresist film 6.
And a step of peeling the first nickel layer 1 together with the second nickel layer 2 from the electroforming mold 3.

Here, it is important that the first nickel layer 1
It is arbitrary whether the second nickel layer 2 is formed by electroforming of bright nickel or dull nickel by electroforming of dull nickel. Here, matte nickel with no brightener added means that no brightener is intentionally added after the construction bath, and when carbon is contained as an impurity in the bath, the allowable range is 0.012% or less. To do.
This is because if it is contained more than that, good adhesion cannot be obtained as in the case of forming the first nickel layer with bright nickel.

[0009]

Function: First nickel layer 1 electroformed with matte nickel
Has a crystal on the surface that is rougher than that formed by bright nickel, and has a satin-like texture, and the second nickel layer 2 is likely to be physically and firmly adhered. Further, when the first nickel layer 1 is electroformed with matte nickel, the content of carbon or sulfur is very small or not contained at all, so that the surface condition of the first nickel layer 1 is not significantly changed, and the composition is also improved. The adhesion with the second nickel layer 2 can be enhanced.

[0010]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 1 shows a nickel laminated body to which the present invention is applied, in which a second nickel layer 2 having a predetermined pattern is laminated on the surface of a first nickel layer 1 serving as a base material.
An example of the electroforming method of such a nickel laminated body will be described with reference to FIGS. First, the electroforming mother die 3 is immersed in an electrolytic solution of a matte nickel bath to perform primary electroforming on the surface of the mother die 3. The composition and plating conditions of this matte nickel bath are shown below. Nickel sulfamate 450 g / l Boric acid 30 g / l pH 4 to 4.5 Bath temperature 50 ° C. Current density 2 A / dm ^{2 to} 7 A / dm By performing electroforming in a bath of ² or more, (A) of FIG. As shown in FIG. 1, the first nickel layer 1 is formed on the surface of the electroforming mold 3. The thickness of this first nickel layer 1 is, eg, about 15 μm.

Then, the electroforming mold 3 having the first nickel layer 1 attached thereto is lifted from the bath, and a negative type photoresist 4 is uniformly formed on the surface of the first nickel layer 1 as shown in FIG. Apply and dry or laminate. Then, a negative type film 5 corresponding to a desired pattern is brought into close contact with the resist 4 as shown in (C) of the figure, and each process of baking and developing is performed to obtain the desired pattern as shown in (D) of the figure. A patterned photoresist film 6 is formed. Of course, the photoresist 4 may be a positive type instead of the negative type.

Then, the electroforming mold 3 having the photoresist film 6 formed thereon is transferred to a bright nickel bath for secondary electroforming. The composition and plating conditions of this bright nickel bath are shown below. Nickel sulfamate 450 g / l Butynediol 0.005 to 0.01 g / l NTS 0.01 to 0.05 g / l Boric acid 30 g / l pH 4 to 4.5 Bath temperature 50A or above Current density 2A / Dm ^{2 to} 7 A / dm ² , electroforming is performed to form the second nickel layer 2 on the surface of the first nickel layer 1 not covered with the photoresist film 6 as shown in FIG. To do. The thickness of the second nickel layer 2 is about 30 μm.

After the electroforming of the second nickel layer 2, the photoresist film 6 is removed, and the first nickel layer 1 is peeled off together with the second nickel layer 2 from the electroforming mold 3 as shown in FIG. To do. Thus, a nickel laminate electroformed product as shown in FIG. 2G and FIG. 2 is obtained.

The adhesion strength between the first and second nickel layers 1 and 2 of the nickel laminated body thus obtained was tested. That is, although vibration was applied to this nickel laminated body, the second nickel layer 2 such as a laminated body of the first nickel layer and the second nickel layer formed of bright nickel is
It did not peel off from the nickel layer 1, and it was in perfect contact. In addition, the nickel laminate is used as the first nickel layer 1
It was bent to the side and a peeling stress was applied to one end between the first and second nickel layers 1 and 2, but there was no peeling of the joint as shown in FIG. Unlike the joint portion C of the first nickel layer 1 with the second nickel layer 2, the portion D of the exposed surface portion of the first nickel layer 1 which is not covered with the second nickel layer 2 in the vicinity thereof is torn off. A fractured state was recognized, and it was clearly understood how strongly the nickel layers 1 and 2 were closely attached.

Although the second nickel layer 2 is formed by electroforming either bright nickel or dull nickel, it has excellent adhesion to the first nickel layer 1, but as in the above-mentioned embodiment, the second nickel layer 2 is formed. When electroforming is carried out in a bright nickel bath containing butynediol, the second nickel layer 2 containing sulfur is the first nickel layer 1 containing no sulfur in a corrosive environment.
On the other hand, it acts as an anode, and the corrosion stops at the second nickel layer 2, so that the corrosion resistance can be improved.

The second nickel layer 2 is usually formed at a current density of about ² to 7 A / dm ^{2 as} described above, but preferably at a low current density of 0.5 to 1 A / dm ² . If the two-nickel layer 2 is formed, the electrodeposition time will be long, but the affinity with the first nickel layer 1 will be improved, and even better adhesion can be obtained.

[0017]

According to the present invention, the first nickel layer 1 is formed in the laminated body in which the second nickel layer 2 having a predetermined pattern is formed on the surface of the first electroformed first nickel layer 1. Since it is made of matte nickel without the addition of a brightener, a nickel laminate with excellent adhesion can be obtained,
For example, it can be suitably used for parts such as ink jet nozzle diaphragms that require vibration resistance.

[Brief description of drawings]

FIG. 1 is a perspective view showing a nickel laminate with a part cut away.

FIG. 2 is an electroforming process diagram of a nickel laminate.

FIG. 3 is a partial perspective view showing a state in which the adhesion strength of the nickel laminate is tested.

FIG. 4 is an etching process diagram of an inkjet nozzle diaphragm according to a conventional etching method.

[Explanation of symbols]

 1 First Nickel Layer 2 Second Nickel Layer 3 Electroforming Master 6 Photoresist Film

Claims (2)

[Claims] 1. A second nickel layer 2 having a predetermined pattern is secondarily electroformed on a surface of the first electroformed first nickel layer 1, and the first nickel layer 1 does not include a brightening agent. A nickel laminate characterized by being formed of bright nickel. 2. A step of primary electroforming the first nickel layer 1 on the surface of the electroforming mold 3 in a matte nickel bath, and a step of patterning a photoresist film 6 on the surface of the first nickel layer 1. And a step of secondary electroforming the second nickel layer 2 on the surface of the first nickel layer 1 which is not covered with the photoresist film 6, and from the electroforming mold 3 to the first nickel layer 1 to the second nickel layer 2 A method for manufacturing a nickel laminate, comprising: