JP2019205991A - Organic film formation device and manufacturing method of organic film - Google Patents

Abstract

To provide an organic film formation device and a manufacturing method of an organic film capable of shortening a cooling time of a substrate formed with the organic film and capable of maintaining a quality of the organic film.SOLUTION: An organic film formation device 1 includes: a chamber 10 capable of maintaining an environment having a pressure reduced below the atmospheric pressure; an exhaust part 20 capable of exhausting an inner part of the chamber; a first heating part 32 which is provided on the inner part of the chamber and has at least one first heater 32a; a second heating part which is provided on the inner part of the chamber, has at least one second heater and is provided so as to be opposed to the first heating part; treatment regions 30a, 30b on which a work-piece 100 having a substrate and a solution including organic material coated on an upper surface of the substrate and solvent between the first heating part and the second heating part; and a cooling part 40 which supplies cooling gas or coolant to at least one of inner parts of the first heating part and the second heating part.SELECTED DRAWING: Figure 1

Description

  Embodiments described herein relate generally to an organic film forming apparatus and an organic film manufacturing method.

  There is a technique for forming an organic film on a substrate by applying a solution containing an organic material and a solvent on the substrate and heating the solution. For example, in the manufacture of liquid crystal display panels, a varnish containing polyamic acid is applied to the surface of a transparent electrode or the like provided on a transparent substrate, imidized to form a polyimide film, and the resulting film is rubbed Thus, an alignment film is formed. In the production of a flexible resin substrate, a varnish containing polyamic acid is applied to the surface of a support substrate such as a glass substrate, imidized to form a polyimide film, and then peeled off from the support substrate. At this time, the substrate coated with the varnish containing polyamic acid is heated to imidize the polyamic acid. In addition, a substrate coated with a solution containing an organic material and a solvent is heated to evaporate the solvent, thereby forming an organic film on the substrate.

When a solution containing an organic material and a solvent is applied on a substrate and heated to form an organic film, a treatment at an extremely high temperature of about 100 ° C. to 600 ° C. may be required. In addition, the organic film may be formed inside a chamber whose pressure is reduced from atmospheric pressure (see, for example, Patent Document 1).
The substrate on which the organic film is formed is taken out from the inside of the chamber or the like where the processing has been performed and transferred to the next process or the like. When the organic film is formed by heating, the temperature of the substrate becomes high, so that it is difficult to take out or carry the substrate having a high temperature from the chamber. In addition, if a device and a placement unit for cooling a substrate having a high temperature are separately provided, a place for installing the device and the placement unit is required, and the cost of manufacturing equipment increases.

In this case, if the cooling gas is supplied into the chamber, the cooling time of the substrate on which the organic film is formed can be shortened. Therefore, it is possible to shorten the time from the completion of the formation of the organic film on the substrate to the start of the formation of the organic film on the next substrate.
However, when an organic film is formed by heating a solution containing an organic material and a solvent, a sublimate is generated and adheres to the inner wall of the chamber. Therefore, simply supplying a cooling gas to the inside of the chamber may cause a sublimate adhering to the inner wall of the chamber to peel off and adhere to the organic film. If foreign substances such as sublimates adhere on the organic film, the quality of the organic film may be deteriorated.
Therefore, it has been desired to develop a technique capable of shortening the cooling time of the substrate on which the organic film is formed and maintaining the quality of the organic film.

Japanese Patent Laid-Open No. 9-320949

  Problems to be solved by the present invention include an organic film forming apparatus capable of shortening the cooling time of a substrate on which an organic film is formed and maintaining the quality of the organic film, and a method for manufacturing the organic film Is to provide.

  An organic film forming apparatus according to an embodiment is provided with a chamber capable of maintaining an atmosphere depressurized from an atmospheric pressure, an exhaust unit capable of exhausting the interior of the chamber, and at least one first A first heating unit having a heater, and a second heating unit provided in the chamber, having at least one second heater, and provided to face the first heating unit, A process for supporting a workpiece between the first heating unit and the second heating unit and having a substrate and a solution containing an organic material and a solvent applied to the upper surface of the substrate. A cooling unit that supplies a cooling gas or a refrigerant to at least one of the region, the first heating unit, and the second heating unit. The workpiece supported in the processing region is cooled by supplying the cooling gas or the refrigerant to at least one of the first heating unit and the second heating unit.

  According to the embodiments of the present invention, there is provided an organic film forming apparatus capable of shortening the cooling time of a substrate on which an organic film is formed and maintaining the quality of the organic film, and a method for manufacturing the organic film. Provided.

It is a model perspective view for illustrating the organic film formation apparatus concerning this embodiment. (A)-(d) is a schematic diagram for demonstrating the supply form of a cooling gas. It is a schematic diagram for illustrating the cooling unit according to another embodiment. It is a schematic diagram for illustrating the organic film forming apparatus which concerns on another form. It is a schematic diagram for illustrating the organic film forming apparatus which concerns on another form. It is a schematic diagram for illustrating the case where supply piping is made into one system. It is a schematic diagram for illustrating the organic film forming apparatus which concerns on other embodiment. It is a schematic diagram for illustrating the organic film forming apparatus which concerns on other embodiment. It is a schematic diagram for illustrating the organic film forming apparatus which concerns on other embodiment. (A)-(c) is a schematic diagram for illustrating the organic film forming apparatus which concerns on other embodiment.

Hereinafter, embodiments will be illustrated with reference to the drawings. In addition, in each drawing, the same code | symbol is attached | subjected to the same component and detailed description is abbreviate | omitted suitably.
FIG. 1 is a schematic perspective view for illustrating an organic film forming apparatus 1 according to the present embodiment.
In addition, the X direction, Y direction, and Z direction in FIG. 1 represent three directions orthogonal to each other. The vertical direction in this specification can be the Z direction.

The workpiece 100 includes a substrate and a solution applied to the upper surface of the substrate.
The substrate can be, for example, a glass substrate or a semiconductor wafer. However, the substrate is not limited to those illustrated.
The solution contains an organic material and a solvent. The organic material is not particularly limited as long as it can be dissolved by a solvent. The solution can be, for example, a varnish containing polyamic acid. However, the solution is not limited to those illustrated.

As shown in FIG. 1, the organic film forming apparatus 1 includes a chamber 10, an exhaust unit 20, a processing unit 30, a cooling unit 40, and a control unit 50.
The chamber 10 has a box shape. The chamber 10 has an airtight structure capable of maintaining an atmosphere whose pressure is reduced from the atmospheric pressure. There is no particular limitation on the external shape of the chamber 10. The external shape of the chamber 10 can be a rectangular parallelepiped, for example. The chamber 10 can be formed from, for example, a metal such as stainless steel.

  A flange 11 can be provided at one end of the chamber 10. The flange 11 can be provided with a sealing material 12 such as an O-ring. The opening of the chamber 10 on the side where the flange 11 is provided can be opened and closed by an open / close door 13. The opening / closing door 13 is pressed against the flange 11 (sealing material 12) by a driving device (not shown), so that the opening of the chamber 10 is closed so as to be airtight. The opening / closing door 13 is separated from the flange 11 by a driving device (not shown), so that the workpiece 100 can be carried in or out through the opening of the chamber 10.

  A flange 14 may be provided at the other end of the chamber 10. The flange 14 may be provided with a sealing material 12 such as an O-ring. The opening of the chamber 10 on the side where the flange 14 is provided can be opened and closed by a lid 15. For example, the lid 15 can be detachably provided on the flange 14 using a fastening member such as a screw. When performing maintenance or the like, the lid 15 is removed to expose the opening of the chamber 10 on the side where the flange 14 is provided.

  A cooling unit 16 can be provided on the outer wall of the chamber 10. A cooling water supply unit (not shown) is connected to the cooling unit 16. The cooling unit 16 can be, for example, a water jacket. If the cooling part 16 is provided, it can suppress that the outer wall temperature of the chamber 10 becomes higher than predetermined | prescribed temperature.

The exhaust unit 20 exhausts the inside of the chamber 10. The exhaust unit 20 includes a first exhaust unit 21 and a second exhaust unit 22.
The first exhaust unit 21 is connected to an exhaust port 17 provided on the bottom surface of the chamber 10. The first exhaust unit 21 includes an exhaust pump 21a and a pressure control unit 21b.
The exhaust pump 21a can be, for example, a dry vacuum pump.
The pressure control unit 21b is provided between the exhaust port 17 and the exhaust pump 21a.
The pressure controller 21b controls the internal pressure of the chamber 10 to be a predetermined pressure based on the output of a vacuum gauge (not shown) that detects the internal pressure of the chamber 10.
The pressure control unit 21b can be, for example, an APC (Auto Pressure Controller).

The second exhaust unit 22 is connected to an exhaust port 18 provided on the bottom surface of the chamber 10. The second exhaust unit 22 includes an exhaust pump 22a and a pressure control unit 22b.
The exhaust pump 22a can be, for example, a turbo molecular pump (TMP).
The second exhaust unit 22 has an exhaust capability capable of exhausting to a high vacuum molecular flow region.
The pressure control unit 22b is provided between the exhaust port 18 and the exhaust pump 22a.
The pressure control unit 22b controls the internal pressure of the chamber 10 to be a predetermined pressure based on the output of a vacuum gauge (not shown) that detects the internal pressure of the chamber 10.
The pressure control unit 22b can be, for example, APC.

In order to reduce the pressure inside the chamber 10, first, the internal pressure of the chamber 10 is set to about 10 pa by the first exhaust part 21. Next, the internal pressure of the chamber 10 is set to about 10 Pa to 1 × 10 ⁻² Pa by the second exhaust unit 22. In this way, the time required to reduce the pressure to a desired pressure can be shortened.

  As described above, the first exhaust unit 21 is an exhaust pump that performs rough exhaust from atmospheric pressure to a predetermined internal pressure. Therefore, the first exhaust part 21 has a large displacement. The second exhaust unit 22 is an exhaust pump that exhausts to a predetermined lower internal pressure after completion of roughing exhaust. After exhausting is started at least by the first exhaust unit 21, electric power can be applied to the heating unit 32 described later to start heating.

  The exhaust port 17 connected to the first exhaust unit 21 and the exhaust port 18 connected to the second exhaust unit 22 are arranged on the bottom surface of the chamber 10. Therefore, a downflow airflow toward the bottom surface of the chamber 10 can be formed in the chamber 10 and the processing unit 30. As a result, the sublimate containing the organic material, which is generated by heating the workpiece 100 to which the solution containing the organic material and the solvent is applied, is easily discharged out of the chamber 10 along the downflow airflow. In this way, it is possible to prevent foreign matters such as sublimates from adhering to the workpiece 100. Thereby, an organic film can be formed without a sublimate adhering to the workpiece 100.

  Further, if the exhaust port 17 connected to the first exhaust unit 21 having a large exhaust amount is disposed at the center portion of the bottom surface of the chamber 10, the chamber 10 faces the center portion of the chamber 10 when viewed in plan. A uniform air flow can be formed. Therefore, the sublimation product is prevented from staying due to the uneven flow of the air flow, and the sublimation product can be easily discharged. In this way, it is possible to prevent foreign matters such as sublimates from adhering to the workpiece 100. Therefore, the organic film can be formed without the sublimate adhering to the workpiece 100.

The processing unit 30 includes a frame 31, a heating unit 32, a work support unit 33, a soaking unit 34, a soaking plate support unit 35, and a cover 36.
Inside the processing unit 30, a processing area 30a and a processing area 30b are provided. The processing areas 30a and 30b are spaces for processing the workpiece 100. The workpiece 100 is supported inside the processing areas 30a and 30b. The processing area 30b is provided above the processing area 30a. In addition, although the case where two processing areas were provided was illustrated, it is not necessarily limited to this. Only one processing region may be provided. It is also possible to provide three or more processing regions. In the present embodiment, a case where two processing regions are provided is illustrated as an example, but the case where one processing region and three or more processing regions are provided can be considered similarly.

  The processing regions 30 a and 30 b are provided between the heating unit 32 and the heating unit 32. The treatment regions 30a and 30b are composed of a soaking part 34 (an upper soaking plate 34a (corresponding to an example of a first soaking plate), a lower soaking plate 34b (corresponding to an example of a second soaking plate), It is surrounded by a side soaking plate 34c and a side soaking plate 34d). As will be described later, a gap is provided between the upper soaking plates 34a and between the lower soaking plates 34b, but the processing regions 30a and 30b are partitioned spaces.

The processing regions 30a, 30b and the space inside the chamber 10 are connected via gaps provided between the upper soaking plates 34a and the lower soaking plates 34b. Therefore, when the workpiece 100 is heated in the processing regions 30a and 30b, the pressure in the space between the inner wall of the chamber 10 and the processing unit 30 is reduced together with the space inside the processing regions 30a and 30b. If the pressure in the space between the inner wall of the chamber 10 and the processing unit 30 is reduced, heat released from the processing regions 30a and 30b to the outside can be suppressed. That is, the heat storage efficiency is improved. Therefore, the power applied to the heater 32a (corresponding to an example of the first heater and the second heater) can be reduced. Moreover, since it can suppress that the temperature of the heater 32a becomes more than predetermined temperature, the lifetime of the heater 32a can be lengthened.
Moreover, since the heat storage efficiency is improved, a desired temperature increase can be obtained even in a process that requires a rapid temperature increase. Moreover, since it can suppress that the temperature of the outer wall of the chamber 10 becomes high, the cooling part 16 can be simplified.

  The frame 31 has a frame structure made of an elongated plate material or a shape steel. The external shape of the frame 31 can be the same as the external shape of the chamber 10. The external shape of the frame 31 can be a rectangular parallelepiped, for example.

  A plurality of heating units 32 are provided. The heating unit 32 can be provided below the processing regions 30a and 30b and above the processing regions 30a and 30b. The heating unit 32 provided below the processing regions 30a and 30b is a lower heating unit (corresponding to an example of a second heating unit). The heating unit 32 provided above the processing regions 30a and 30b is an upper heating unit (corresponding to an example of a first heating unit). The lower heating unit faces the upper heating unit. In addition, when a plurality of processing regions are provided so as to overlap in the vertical direction, the upper heating unit provided in the lower processing region can also be used as the lower heating unit provided in the upper processing region. .

For example, the lower surface (back surface) of the workpiece 100 supported by the processing region 30a is heated by the heating unit 32 provided at the lower portion of the processing region 30a. The upper surface of the workpiece 100 supported by the processing region 30a is heated by the heating unit 32 that is also used by the processing region 30a and the processing region 30b. The lower surface (back surface) of the workpiece 100 supported by the processing region 30b is heated by the heating unit 32 that is also used as the processing region 30a and the processing region 30b. The upper surface of the workpiece 100 supported by the processing region 30b is heated by the heating unit 32 provided on the upper portion of the processing region 30b.
In this way, since the number of heating units 32 can be reduced, it is possible to reduce power consumption, manufacturing cost, and space saving.

Each of the plurality of heating units 32 includes at least one heater 32a and a pair of holders 32b. In the following, a case where a plurality of heaters 32a are provided will be described.
The pair of holders 32b are provided so as to extend in the longitudinal direction (X direction in FIG. 1) of the processing regions 30a and 30b.
The heater 32a has a rod shape and is provided so as to extend between the pair of holders 32b in the Y direction.
The plurality of heaters 32a can be provided side by side in the direction in which the holder 32b extends. For example, the plurality of heaters 32a can be provided side by side in the longitudinal direction (X direction in FIG. 1) of the processing regions 30a and 30b. The plurality of heaters 32a are preferably provided at equal intervals. The heater 32a can be, for example, a sheathed heater, a far infrared heater, a far infrared lamp, a ceramic heater, a cartridge heater, or the like. Various heaters can be covered with a quartz cover. In this specification, the term “bar heater” includes various heaters covered with a quartz cover.

  However, the heater 32a is not limited to the illustrated one. The heater 32a only needs to be capable of heating the workpiece 100 in an atmosphere reduced in pressure from atmospheric pressure. That is, the heater 32a only needs to use heat energy by radiation.

  The specifications, number, interval, and the like of the plurality of heaters 32a in the upper heating unit and the lower heating unit can be appropriately determined according to the composition of the solution to be heated (solution heating temperature), the size of the workpiece 100, and the like. The specifications, number, interval, and the like of the plurality of heaters 32a can be determined as appropriate by performing simulations and experiments. In addition, “presenting a bar shape” is not limited to a cross-sectional shape, and includes a columnar shape, a prismatic shape, and the like.

  The space provided with the plurality of heaters 32a is surrounded by a holder 32b, an upper soaking plate 34a, a lower soaking plate 34b, and a side soaking plate 34c. The space in which the plurality of heaters 32a are provided is partitioned into a processing region 30a and a processing region 30b by the soaking part 34. In this case, a gap is provided between the upper soaking plates 34a and between the lower soaking plates 34b, but the space provided with the plurality of heaters 32a is a substantially closed space. Therefore, it can suppress that the cooling gas mentioned later supplied to the space where the some heater 32a was provided from the cooling part 40 leaks into process area | region 30a, 30b.

  The workpiece 100 is heated by the upper heating unit and the lower heating unit. The workpiece 100 is heated in the processing regions 30a and 30b via the upper soaking plate 34a and the lower soaking plate 34b. Here, the vapor containing the sublimated product generated when the solution is heated tends to adhere to an object having a temperature lower than the temperature of the workpiece 100 to be heated. However, since the upper soaking plate 34a and the lower soaking plate 34b are heated, it is possible to suppress the sublimate from adhering to the upper soaking plate 34a and the lower soaking plate 34b, and to ride on the downflow airflow described above. Then, it is discharged out of the chamber 10. Therefore, it is possible to suppress the sublimate from adhering to the workpiece 100. Moreover, since the workpiece | work 100 is heated from both surfaces, it becomes easy to make the workpiece | work 100 high temperature.

  The pair of holders 32b are provided to face each other in a direction orthogonal to the direction in which the plurality of heaters 32a are arranged. One holder 32 b is fixed to the end surface of the frame 31 on the door 13 side. The other holder 32b is fixed to the end surface of the frame 31 opposite to the opening / closing door 13 side. The pair of holders 32b can be fixed to the frame 31 using a fastening member such as a screw, for example. The pair of holders 32b holds a non-heat generating portion near the end of the heater 32a. The pair of holders 32b can be formed from, for example, an elongated metal plate or steel. The material of the pair of holders 32b is not particularly limited, but a material having heat resistance and corrosion resistance is preferable. The material of the pair of holders 32b can be stainless steel, for example.

The workpiece support unit 33 supports the workpiece 100 between the upper heating unit and the lower heating unit. A plurality of workpiece support portions 33 can be provided. The plurality of work support portions 33 are provided below the processing region 30a and below the processing region 30b. The plurality of work support portions 33 can be rod-shaped bodies.
One end portion (the upper end portion in FIG. 1) of the plurality of workpiece support portions 33 is in contact with the lower surface (back surface) of the workpiece 100. For this reason, the shape of one end of the plurality of workpiece support portions 33 is preferably hemispherical. If the shape of one end of the plurality of workpiece support portions 33 is hemispherical, it is possible to suppress the occurrence of damage on the lower surface of the workpiece 100. Further, since the contact area between the lower surface of the workpiece 100 and the plurality of workpiece support portions 33 can be reduced, the heat transmitted from the workpiece 100 to the plurality of workpiece support portions 33 can be reduced.

As described above, the workpiece 100 is heated by thermal energy due to radiation in an atmosphere reduced in pressure from atmospheric pressure. Accordingly, in the plurality of workpiece support portions 33, the distance from the upper heating portion to the upper surface of the workpiece 100 and the distance from the lower heating portion to the lower surface of the workpiece 100 are such that the workpiece 100 can be heated. Next, the workpiece 100 is supported.
This distance is a distance at which the heat energy by radiation can reach the workpiece 100 from the heating unit 32.

The other ends (lower ends in FIG. 1) of the plurality of workpiece support portions 33 are a plurality of rod-like members or plate-like members that are spanned between a pair of frames 31 on both sides of the processing portion 30. Etc. can be fixed. In this case, if a plurality of workpiece support portions 33 are detachably provided, work such as maintenance is facilitated. For example, a male screw can be provided at the other end of the work support portion 33, and a female screw can be provided at a plurality of rod-like members or plate-like members.
Further, for example, the plurality of work support portions 33 are merely placed without being fixed to a plurality of rod-like members or plate-like members spanned between the frames 31 on both sides of the processing portion 30. But you can. For example, a plurality of holes are formed in the rod-like member or plate-like member, and the plurality of workpiece support portions 33 are held by the rod-like member or plate-like member by inserting the plurality of workpiece support portions 33 into the holes. You can make it. The diameter of the hole can be as follows even when the workpiece support 33 is thermally expanded. For example, the diameter of the hole is preferably set to such an extent that air between the work support 33 and the inner wall of the hole can escape even if the work support 33 is thermally expanded. If it does in this way, even if the air in a hole expands thermally, it can prevent the workpiece | work support part 33 being extruded.

The number, arrangement, interval, and the like of the plurality of workpiece support portions 33 can be changed as appropriate according to the size and rigidity (deflection) of the workpiece 100. The number, arrangement, interval, and the like of the plurality of workpiece support portions 33 can be appropriately determined by performing simulations or experiments.
The material of the plurality of workpiece support portions 33 is not particularly limited, but it is preferable to use a material having heat resistance and corrosion resistance. The material of the plurality of workpiece support portions 33 can be stainless steel, for example.

In addition, at least end portions of the plurality of workpiece support portions 33 that are in contact with the workpiece 100 can be formed from a material having low thermal conductivity. The material with low thermal conductivity can be, for example, ceramics. In this case, among ceramics, a material having a thermal conductivity at 20 ° C. of 32 W / (m · k) or less is preferable. The ceramic can be, for example, alumina (Al ₂ O ₃ ), silicon nitride (Si ₃ N ₄ ), zirconia (Zr ₂ ), or the like.

The soaking unit 34 includes a plurality of upper soaking plates 34a, a plurality of lower soaking plates 34b, a plurality of side soaking plates 34c, and a plurality of side soaking plates 34d. The plurality of upper soaking plates 34a, the plurality of lower soaking plates 34b, the plurality of side portion soaking plates 34c, and the plurality of side portion soaking plates 34d have a plate shape.
The plurality of upper soaking plates 34a are provided on the lower heating unit side (work 100 side) of the upper heating unit. The plurality of upper soaking plates 34a are provided separately from the plurality of heaters 32a. That is, a gap is provided between the upper surface of the plurality of upper soaking plates 34a and the lower surface of the plurality of heaters 32a. The plurality of upper soaking plates 34a are provided side by side in the direction in which the plurality of heaters 32a are arranged (X direction in FIG. 1).
The plurality of lower soaking plates 34b are provided on the upper heating part side (workpiece 100 side) of the lower heating part. The plurality of lower soaking plates 34b are provided separately from the plurality of heaters 32a. That is, a gap is provided between the lower surface of the plurality of lower heat equalizing plates 34b and the upper surface of the plurality of heaters 32a. The plurality of lower soaking plates 34b are arranged side by side in the direction in which the plurality of heaters 32a are arranged (X direction in FIG. 1).
The side soaking plate 34c is provided on each of the side portions on both sides (X direction in FIG. 1) of the processing regions 30a and 30b in the direction in which the plurality of heaters 32a are arranged. The side soaking plate 34 c can be provided inside the cover 36. In addition, at least one heater 32 a provided separately from the side heat equalizing plate 34 c and the cover 36 may be provided between the side heat equalizing plate 34 c and the cover 36.
The side heat equalizing plate 34d is provided on each of the side portions on both sides (the Y direction in FIG. 1) of the processing regions 30a and 30b in the direction orthogonal to the direction in which the plurality of heaters 32a are arranged.
The processing regions 30a and 30b are surrounded by a plurality of upper soaking plates 34a, a plurality of lower soaking plates 34b, a plurality of side soaking plates 34c, and a plurality of side soaking plates 34d. A cover 36 surrounds these outsides.

As described above, the plurality of heaters 32a have a rod shape and are arranged side by side with a predetermined interval. When the heater 32a is rod-shaped, heat is radiated radially from the central axis of the heater 32a. In this case, the temperature of the heated part becomes higher as the distance between the central axis of the heater 32a and the heated part becomes shorter. Therefore, when the workpiece 100 is held so as to face the plurality of heaters 32a, the region of the workpiece 100 positioned immediately above or immediately below the heater 32a is directly above or directly below the space between the plurality of heaters 32a. The temperature is higher than the area of the workpiece 100 that is positioned. That is, when the workpiece 100 is directly heated using the plurality of heaters 32a having a rod shape, a non-uniform temperature distribution is generated in the heated workpiece 100.
If a non-uniform temperature distribution occurs in the workpiece 100, the quality of the formed organic film may be degraded. For example, there is a possibility that bubbles are generated in a portion where the temperature is high, or the composition of the organic film is changed in a portion where the temperature is high.

  The organic film forming apparatus 1 according to the present embodiment is provided with the plurality of upper soaking plates 34a and the plurality of lower soaking plates 34b described above. Therefore, the heat radiated from the plurality of heaters 32a is incident on the plurality of upper soaking plates 34a and the plurality of lower soaking plates 34b, and is radiated toward the workpiece 100 while propagating through the inside in the surface direction. . As a result, it is possible to suppress the occurrence of non-uniform temperature distribution in the workpiece 100, and as a result, the quality of the formed organic film can be improved. That is, according to the organic film forming apparatus 1 according to the present embodiment, a substrate coated with a solution containing an organic material and a solvent can be uniformly heated to form a uniform organic film within the substrate surface.

  In this case, if the distance between the surface of the heater 32a and the upper soaking plate 34a immediately below and the distance between the surface of the heater 32a and the lower soaking plate 34b immediately above are too short, the upper soaking plate is too short. There is a possibility that non-uniform temperature distribution occurs in the hot plate 34a and the lower heat equalizing plate 34b, and as a result, non-uniform temperature distribution occurs in the workpiece 100. If these distances are too long, the temperature rise of the workpiece 100 may be delayed. According to the knowledge obtained by the present inventors, these distances are preferably 20 mm or more and 100 mm or less.

The materials of the plurality of upper soaking plates 34a and the plurality of lower soaking plates 34b are preferably materials having high thermal conductivity. The plurality of upper soaking plates 34a and the plurality of lower soaking plates 34b may include, for example, at least one of aluminum, copper, and stainless steel.
As will be described later, the cooling gas is supplied from the cooling unit 40 to the region where the plurality of heaters 32a are provided. In this case, dry air may be used as the cooling gas. Therefore, there is a possibility that oxygen in the dry air reacts with the heated materials of the plurality of upper soaking plates 34a and the plurality of lower soaking plates 34b.

  When the plurality of upper soaking plates 34a and the plurality of lower soaking plates 34b contain copper, aluminum, or the like, it is preferable to provide a layer containing a material that is difficult to oxidize on the surface. For example, when the plurality of upper soaking plates 34a and the plurality of lower soaking plates 34b contain copper, it is preferable to provide a layer containing nickel on the surface. For example, the surfaces of the plurality of upper soaking plates 34a and the plurality of lower soaking plates 34b containing copper can be plated with nickel. When the plurality of upper soaking plates 34a and the plurality of lower soaking plates 34b contain aluminum, it is preferable to provide a layer containing aluminum oxide on the surface. For example, the surfaces of the plurality of upper soaking plates 34a and the plurality of lower soaking plates 34b containing aluminum can be anodized.

  When the temperatures of the plurality of upper soaking plates 34a and the plurality of lower soaking plates 34b are 300 ° C. or lower during heating, the plurality of upper soaking plates 34a and the plurality of lower soaking plates 34b containing aluminum are included. Can be used.

  When the temperature of the plurality of upper soaking plates 34a and the plurality of lower soaking plates 34b is 500 ° C. or higher during heating, the plurality of upper soaking plates 34a and the plurality of lower soaking plates 34b including stainless steel are used. Or it is preferable to use a plurality of upper soaking plates 34a and a plurality of lower soaking plates 34b having copper and a layer containing nickel on the surface. In this case, if a plurality of upper soaking plates 34a and a plurality of lower soaking plates 34b containing stainless steel are used, versatility and maintainability can be improved.

Further, part of the heat radiated from the plurality of upper soaking plates 34a and the plurality of lower soaking plates 34b goes to the side of the processing region. For this reason, the above-described side soaking plates 34c and 34d are provided on the side of the processing region. A part of the heat incident on the side soaking plates 34c and 34d is radiated toward the workpiece 100 while propagating in the surface direction on the side soaking plates 34c and 34d. Therefore, the heating efficiency of the workpiece 100 can be improved.
Further, as described above, the heating efficiency of the workpiece 100 can be further improved if at least one heater 32a is provided outside the side soaking plate 34c. In addition, the sublimation product generated when the organic film is heated tends to adhere to a location lower than the ambient temperature. By heating the side soaking plate 34c as well, it is possible to suppress the sublimate from adhering to the side soaking plate 34c.

  Here, if a non-uniform temperature distribution different from that of the upper temperature equalizing plate 34a and the lower temperature equalizing plate 34b occurs in the side temperature equalizing plates 34c and 34d, there is a possibility that a non-uniform temperature distribution occurs in the workpiece 100. Therefore, it is preferable that the material of the side soaking plates 34c and 34d is the same as the material of the upper soaking plate 34a and the lower soaking plate 34b described above.

  As described above, the temperatures of the plurality of upper soaking plates 34a and the plurality of lower soaking plates 34b may be 500 ° C. or higher. Therefore, there is a possibility that the amount of elongation of the upper soaking plate 34a and the lower soaking plate 34b becomes large, or warpage due to thermal deformation occurs. Therefore, it is preferable to provide a gap between the plurality of upper soaking plates 34a. It is preferable to provide a gap between the plurality of lower soaking plates 34b. These gaps include the heating temperature, the dimensions of the upper soaking plate 34a in the direction in which the plurality of upper soaking plates 34a are arranged, the dimensions of the lower soaking plate 34b in the direction in which the plurality of lower soaking plates 34b are arranged, and the upper soaking plate. 34a and lower soaking plate 34b can be appropriately determined. For example, at a predetermined maximum heating temperature, a gap of about 1 mm to 2 mm can be generated between the plurality of upper soaking plates 34a and between the plurality of lower soaking plates 34b. If it does in this way, it can control that a plurality of upper soaking plates 34a interfere, and a plurality of lower soaking plates 34b interfere with each other at the time of heating.

  The plurality of upper soaking plates 34a and the plurality of lower soaking plates 34b have been described as being arranged in the direction in which the plurality of heaters 32a are arranged, but the upper soaking plates 34a and the lower soaking plates 34b At least one may be a single plate member. In this case, at least one of the upper soaking plate 34 a and the lower soaking plate 34 b is supported by the pair of soaking plate support portions 35 closest to both ends of the frame 31.

The plurality of soaking plate support portions 35 (upper soaking plate support portions) are provided side by side in the direction in which the plurality of upper soaking plates 34a are arranged. The soaking plate support portion 35 can be provided immediately below the upper soaking plates 34a in the direction in which the plurality of upper soaking plates 34a are arranged.
The plurality of soaking plate support portions 35 can be fixed to the pair of holders 32b using a fastening member such as a screw. The pair of soaking plate support portions 35 detachably support both ends of the upper soaking plate 34a. A plurality of heat equalizing plate support portions (lower heat equalizing plate support portions) that support the plurality of lower heat equalizing plates 34b can also have the same configuration.

If the upper soaking plate 34a and the lower soaking plate 34b are fixed using a fastening member such as a screw, the upper soaking plate 34a and the lower soaking plate 34b are deformed by thermal expansion. When the upper soaking plate 34a and the lower soaking plate 34b are deformed, the distance between the upper soaking plate 34a and the workpiece 100 and the distance between the lower soaking plate 34b and the workpiece 100 are locally changed. There is a risk that a non-uniform temperature distribution may occur in the workpiece 100.
If the upper soaking plate 34a and the lower soaking plate 34b are supported by the pair of soaking plate support portions 35, a dimensional difference due to thermal expansion can be absorbed. Therefore, it is possible to suppress the upper soaking plate 34a and the lower soaking plate 34b from being deformed.

The cover 36 has a plate shape and covers the upper surface, the bottom surface, and the side surface of the frame 31. That is, the inside of the frame 31 is covered by the cover 36. However, the cover 36 on the open / close door 13 side can be provided on the open / close door 13, for example.
The cover 36 surrounds the processing areas 30a and 30b, but the boundary between the upper surface and the side surface of the frame 31, the boundary between the side surface and the bottom surface of the frame 31, and the vicinity of the open / close door 13 is between the inner wall of the chamber 10 and the cover 36. A gap is provided to connect the space and the processing areas 30a and 30b.
Further, the cover 36 provided on the upper surface and the bottom surface of the frame 31 is divided into a plurality of parts. A gap is provided between the divided covers 36. That is, the space in the processing unit 30 (the processing region 30a and the processing region 30b) is a space communicating with the space in the chamber 10. Therefore, since the space between the inner wall of the chamber 10 and the cover 36 and the processing regions 30a and 30b are connected, the pressure in the processing regions 30a and 30b is reduced between the inner wall of the chamber 10 and the cover 36. The pressure can be the same. The cover 36 can be formed from, for example, stainless steel.
The cover 36 provided on the upper surface and the bottom surface of the frame 31 may be a single plate member.
A space is provided between the inner wall of the chamber 10 and the cover 36. That is, the organic film forming apparatus 1 has a double structure including the chamber 10 and the processing unit 30 (processing regions 30a and 30b). In this way, the heat escaping from the processing regions 30a and 30b to the outside can be reduced, so that the heating efficiency can be improved.
Further, the cover 36 can also have a function of reflecting heat incident from the heater 32a side to reflect the heat to the processing regions 30a and 30b side. Therefore, if the cover 36 is provided, the heat escaping from the processing chambers 30a and 30b to the outside can be reduced, so that the heating efficiency can be improved.

  The cooling unit 40 supplies the cooling gas to the space where the plurality of heaters 32a are provided. The cooling unit 40 does not directly supply the cooling gas to the processing regions 30a and 30b. The cooling unit 40 cools the soaking part 34 surrounding the processing regions 30 a and 30 b with the cooling gas, and cools the workpiece 100 in a high temperature state by the cooled soaking part 34. That is, the cooling unit 40 indirectly cools the workpiece 100 in a high temperature state with the cooling gas.

The cooling unit 40 includes a nozzle 41, a gas source 42, and a gas control unit 43.
The nozzle 41 is connected to a space provided with a plurality of heaters 32a. The nozzle 41 can be attached to, for example, the side soaking plate 34c or the frame 31. The number and arrangement of the nozzles 41 can be changed as appropriate. For example, in the case illustrated in FIG. 1, nozzles 41 are provided on one side in the X direction in the processing unit 30 in FIG. 1, but nozzles are provided on both sides in the X direction in the processing unit 30 in FIG. 41 can also be provided. Further, the nozzle 41 can be provided on one side or both sides in the Y direction in FIG.
A plurality of nozzles 41 can also be provided side by side.

  The gas source 42 supplies cooling gas to the nozzle 41. The gas source 42 can be, for example, a high-pressure gas cylinder or factory piping. A plurality of gas sources 42 may be provided. For example, a first gas source that supplies a first cooling gas and a second gas source that supplies a second cooling gas may be provided.

The cooling gas can be, for example, an inert gas such as dry air, nitrogen gas, or helium gas. However, the kind of cooling gas is not limited to what was illustrated.
If the cooling gas contains oxygen, the soaking part 34 and the organic film in a high temperature state may be oxidized. Therefore, the cooling gas is preferably a gas that does not contain oxygen, such as nitrogen gas or inert gas. However, nitrogen gas and inert gas are expensive. On the other hand, dry air is cheap. Therefore, when the soaking part 34 or the organic film is in a high temperature state, nitrogen gas, inert gas, or the like can be used, and dry air can be used after the temperature of the soaking part 34 or the organic film is lowered. In this way, the manufacturing cost can be reduced.
Further, the temperature of the cooling gas can be set at, for example, normal temperature to 50 ° C. However, the temperature of the cooling gas is not limited to this. For example, when the temperature of the workpiece 100 is equal to or higher than a temperature that does not cause condensation when the workpiece 100 is taken out from the organic film forming apparatus 1 into the atmosphere, and when the workpiece 100 is transported from the organic film forming apparatus 1 to the next process or the like. The temperature may be equal to or lower than a temperature that does not adversely affect conveyance.

  The gas control unit 43 is provided between the nozzle 41 and the gas source 42. For example, the gas control unit 43 can perform supply and stop of the cooling gas, control of the flow rate and pressure, and the like. Moreover, when using multiple types of cooling gas, the gas control part 43 can also perform switching of a cooling gas.

The supply timing of the cooling gas by the gas control unit 43 can be after the heat treatment for the workpiece 100 is completed. Note that the completion of the heat treatment may be after the temperature at which the organic film is formed is maintained for a predetermined time.
In this case, for example, the supply timing of the cooling gas may be immediately after the organic film is formed, or may be in the middle of returning the internal pressure of the chamber 10 to the atmospheric pressure. In this case, the cooling gas can also function as a vent gas that returns the internal pressure of the chamber 10 to atmospheric pressure. Further, the supply timing of the cooling gas may be after the internal pressure of the chamber 10 is returned to the atmospheric pressure.
Immediately after the organic film is formed, the internal pressure of the chamber 10 is lower than the atmospheric pressure, that is, the gas is low in the chamber 10. Therefore, even if the cooling gas is supplied to the inside of the chamber 10, it is possible to suppress scattering of sublimates existing in the processing regions 30a and 30b by the supplied cooling gas. Further, the cooling time and the adjustment time of the internal pressure of the chamber 10 when returning to the atmospheric pressure can be overlapped. That is, the substantial cooling time can be shortened.
On the other hand, in the middle of returning the internal pressure of the chamber 10 to the atmospheric pressure or after returning the internal pressure of the chamber 10 to the atmospheric pressure, since there is a gas inside the chamber 10, heat dissipation by convection can be used.

  When supplying the cooling gas while returning the internal pressure of the chamber 10 to the atmospheric pressure, the second exhaust unit 22 is stopped, and the cooling gas can be supplied in a state where only the first exhaust unit 21 is operated. . In this state, the internal pressure of the chamber 10 is continuously reduced from 10 Pa to atmospheric pressure by the first exhaust unit 21. Therefore, a downflow airflow toward the bottom surface of the chamber 10 can be formed in the chamber 10 and the processing unit 30. As a result, the sublimate containing the organic material, which is generated by heating the workpiece 100 to which the solution containing the organic material and the solvent is applied, is easily discharged out of the chamber 10 along the downflow airflow. In this way, it is possible to prevent the sublimate from staying, so that the sublimate can be easily discharged. Further, even if the supplied cooling gas leaks into the processing region 30a and the processing region 30b, it is discharged by the downflow airflow, so that foreign matters such as sublimates can be prevented from adhering to the work 100. That is, cooling that enables heat dissipation by convection and suppression of sublimation retention can be performed. In addition, as described above, the exhaust pump 21a of the first exhaust unit 21 is a pump with a large amount of exhaust. Therefore, by using the first exhaust unit 21, high temperature gas is discharged at a high exhaust rate. Can do. In addition, when the exhausted gas is high temperature, in order to prevent the exhaust pump 21a from being damaged, a cooling unit is provided between the exhaust pump 21a and the exhaust port 17 as necessary, so that the gas having a predetermined temperature or higher is exhausted. You may make it not be accommodated in. Further, during the return of the internal pressure of the chamber 10 to the atmospheric pressure, the first exhaust unit 21 may be operated intermittently so as to perform the exhaust operation again after operating for a fixed time and stopping. Thus, by operating the first exhaust unit 21 intermittently, the heat exchange by convection is promoted in the chamber 10 during the stop, and the gas containing the heat after the heat exchange is performed during the operation. Since it is exhausted, the heat in the chamber 10 can be exhausted more efficiently.

In this way, depending on the type and size of the workpiece 100, in order to suppress scattering of sublimated materials or to substantially reduce the cooling time, the cooling gas may be supplied immediately after the organic film is formed. preferable. In order to improve the cooling efficiency, it is preferable to supply the cooling gas during the return of the internal pressure of the chamber 10 to the atmospheric pressure or after the internal pressure of the chamber 10 is returned to the atmospheric pressure.
Note that the supply flow rate of the cooling gas may be variable as the internal pressure of the chamber 10 changes. In this case, when the internal pressure of the chamber 10 is lower than the atmospheric pressure, cooling is performed while supplying the first flow rate of the cooling gas to return the internal pressure of the chamber 10 to the atmospheric pressure, and then the internal pressure of the chamber 10 is increased. After returning to atmospheric pressure, cooling can be continued by supplying a cooling gas having a second flow rate lower than the first flow rate. In this way, the pressure can be returned to the atmospheric pressure more quickly, and after returning to the atmospheric pressure, the cooling can be continued without causing convection as much as possible.

2A to 2D are schematic views for illustrating the supply form of the cooling gas G. FIG.
As shown in FIG. 2A, the cooling gas G can be supplied from the X direction in FIG. 1 toward the heater 32a.
As shown in FIG. 2B, the cooling gas G can be supplied from the X direction in FIG. 1 toward the upper side of the heater 32a and the lower side of the heater 32a.
As shown in FIG. 2C, the cooling gas G is supplied from one side in the X direction in FIG. 1 to the upper side of the heater 32a and supplied from the other side in the X direction to the lower side of the heater 32a. it can. In this way, the flow of the cooling gas G becomes smooth. If the flow of the cooling gas G becomes smooth, it becomes easy to suppress the cooling gas G supplied to the space provided with the plurality of heaters 32a from leaking into the processing regions 30a and 30b.
As shown in FIG. 2D, the cooling gas G can be supplied from one side in the X direction in FIG. 1 and the cooling gas G can be sucked from the other side in the X direction. For example, the discharge nozzle 44 can be connected to a space provided with a plurality of heaters 32 a, and the suction part 45 can be connected to the discharge nozzle 44. The suction unit 45 can be, for example, a blower. In this way, the flow and discharge of the cooling gas G are smooth. Moreover, it can suppress that the pressure of the space in which the some heater 32a was provided rises. Therefore, it becomes easy to suppress that the cooling gas supplied to the space provided with the plurality of heaters 32a leaks into the processing regions 30a and 30b.
If it is possible to suppress the cooling gas G from leaking into the processing regions 30 a and 30 b, it is possible to suppress the sublimate present in the processing regions 30 a and 30 b from adhering to the organic film of the workpiece 100.

In addition, although the case where the cooling gas G was supplied from the X direction in FIG. 1 was illustrated, it is the same also when the cooling gas G is supplied from the Y direction in FIG.
As shown in FIGS. 2A to 2D, when the cooling gas G is supplied from the horizontal direction (X direction or Y direction), the cooling gas G is at least of the upper soaking plate 34b and the lower soaking plate 34a. Flowing along one of the main surfaces, a flow of the cooling gas G in the horizontal direction is formed. Since the surface of the workpiece 100 extends in the horizontal direction (X direction or Y direction) in FIG. 1, the cooling gas G flows in the direction in which the surface of the workpiece 100 extends. Therefore, even if the cooling gas G leaks into the processing regions 30a and 30b, the formation of the flow of the cooling gas G in the Z direction that collides with the surface of the workpiece 100 can be suppressed. Thereby, it is possible to suppress the sublimate from colliding with the surface of the workpiece 100 along the flow of the cooling gas G, so that the sublimate present in the processing regions 30a and 30b becomes the organic film of the workpiece 100. It can suppress adhering.

Next, returning to FIG. 1, the controller 50 will be described.
The control unit 50 includes a calculation unit such as a CPU (Central Processing Unit) and a storage unit such as a memory.
The control unit 50 controls the operation of each element provided in the organic film forming apparatus 1 based on a control program stored in the storage unit.

FIG. 3 is a schematic view for illustrating a cooling unit 40a according to another embodiment.
The cooling unit 40a includes a cooling body 41a and a refrigerant supply unit 42a.
The cooling body 41a is provided between at least one of the upper soaking plate 34a and the plurality of heaters 32a and between the lower soaking plate 34b and the plurality of heaters 32a.
The cooling unit 40a illustrated in FIG. 3 includes a cooling body 41a between the upper soaking plate 34a and the plurality of heaters 32a and between the lower soaking plate 34b and the plurality of heaters 32a. . In addition, arrangement | positioning of the cooling body 41a is not necessarily limited to what was illustrated. For example, the cooling body 41a can be provided between the heater 32a and the heater 32a in parallel with the heater 32a.
A coolant channel is provided inside the cooling body 41a.

When cooling, the refrigerant supply unit 42a supplies the refrigerant into the cooling body 41a and collects the refrigerant discharged from the cooling body 41a. The refrigerant supply unit 42a can circulate the refrigerant.
When heating by the plurality of heaters 32a, the refrigerant supply unit 42a discharges the refrigerant from the inside of the cooling body 41a.
The refrigerant supply unit 42a may include, for example, a recovery tank, a liquid feed pump, a cooler, and the like.
The refrigerant is not particularly limited as long as it is a liquid. The refrigerant can be, for example, water.
As described above, the cooling units 40 and 40a supply the cooling gas or the refrigerant to at least one of the upper heating unit and the lower heating unit.
Note that the inside of the upper heating unit and the inside of the lower heating unit are spaces in which the heaters 32a are present, and are spaces separated from the processing regions 30a and 30b by the upper heating plate or the lower heating plate. is there.
The refrigerant is supplied into a cooling body 41a provided in at least one of the upper heating unit and the lower heating unit.
And the workpiece | work 100 supported by the process area | regions 30a and 30b is cooled by at least any one of the upper heating part to which cooling gas or the refrigerant | coolant was supplied, and a lower heating part.
In addition, both the cooling parts 40 and 40a are provided, and both cooling with a cooling gas and a refrigerant | coolant can also be performed.

Moreover, as explained above, the method for manufacturing an organic film according to the present embodiment can include the following steps.
A step of heating a workpiece 100 having a substrate and a solution containing an organic material and a solvent applied to the upper surface of the substrate in an atmosphere reduced in pressure from atmospheric pressure.
The process of cooling the workpiece | work 100 in which the organic film was formed by heating.
In this case, in the process of heating the workpiece 100, the workpiece 100 is heated in the processing regions 30a and 30b between the upper heating unit and the lower heating unit.
In the process of cooling the workpiece 100, a cooling gas or a refrigerant is supplied into at least one of the upper heating unit and the lower heating unit. The workpiece 100 supported by the processing regions 30a and 30b is cooled by at least one of an upper heating unit to which a cooling gas or a refrigerant is supplied and a lower heating unit.
In addition, since the content of each process can be the same as that of what was mentioned above, detailed description is abbreviate | omitted.

Here, the heating temperature of the workpiece 100, that is, the heating temperature of the solution containing the organic material and the solvent may be about 100 ° C to 600 ° C. Therefore, the temperature of the workpiece 100 immediately after the organic film is formed may be about 100 ° C. to 600 ° C.
The substrate on which the organic film is formed is taken out from the organic film forming apparatus 1 and transferred to the next process or the like. In this case, it is difficult to take out or transport the workpiece 100 in a high temperature state from the organic film forming apparatus 1. Further, if a device and a placement unit for cooling the workpiece 100 in a high temperature state are separately provided, a place for installing the device and the placement unit becomes necessary, and the cost of manufacturing equipment increases.

In this case, the cooling gas can be directly supplied to the processing regions 30a and 30b to cool the workpiece 100 in a high temperature state. If the workpiece 100 in a high temperature state is cooled by the cooling gas, the cooling time can be shortened. Therefore, it is possible to shorten the time from the completion of the formation of the organic film in the workpiece 100 to the start of the formation of the organic film in the next workpiece 100.
However, when an organic film is formed by heating a solution containing an organic material and a solvent, a sublimate or the like is generated, and the sublimate or the like adheres to the inside of the processing regions 30a and 30b or floats in the internal space. There is a case. For this reason, when the cooling gas is directly supplied to the processing regions 30a and 30b, the attached sublimates are peeled off, or the floating sublimates are put on the flow of the cooling gas, and thus on the organic film. There is a risk of adhesion. If foreign substances such as sublimates adhere on the organic film, the quality of the organic film may be deteriorated.

Therefore, the cooling unit 40 according to the present embodiment supplies the cooling gas to the space provided with the plurality of heaters 32a. As described above, the space in which the plurality of heaters 32 a are provided is partitioned from the processing regions 30 a and 30 b by the heat equalizing unit 34. The space provided with the plurality of heaters 32a is a partitioned space. Therefore, it is possible to prevent the cooling gas supplied from the cooling unit 40 to the space provided with the plurality of heaters 32a from leaking into the processing regions 30a and 30b.
In addition, as illustrated in FIG. 2, the flow of the cooling gas G can be formed in the same horizontal direction (X direction or Y direction) as the direction in which the surface of the workpiece 100 extends. Although a gap is provided in the soaking part 34, as described above, even if the cooling gas G leaks from the gap in the soaking plate 34, a flow that collides with the surface of the workpiece 100 is not formed.
If it is possible to suppress the formation of a flow that collides with the surface of the workpiece 100, even if the cooling gas leaks into the processing regions 30a and 30b, sublimates adhered to the inside of the processing regions 30a and 30b, etc. It can peel and can suppress adhering on an organic film.
Moreover, in the cooling unit 40 according to the present embodiment, it is possible to introduce the cooling gas G into the inside of the upper heating unit and the lower heating unit provided above and below the workpiece 100. If the cooling gas G can be introduced into the upper and lower heating units 32, the workpiece 100 can be indirectly cooled from both sides of the workpiece 100. Therefore, the cooling efficiency can be improved.
As described above, according to the present embodiment, the cooling time of the substrate on which the organic film is formed can be shortened, and the quality of the organic film can be maintained.

FIG. 4 is a schematic view for illustrating an organic film forming apparatus 1a according to another embodiment. In this embodiment, the difference (third exhaust part 23) from the above-described embodiment will be described, and the other description will be omitted.
When the internal pressure of the chamber 10 returns to the atmospheric pressure, a gas having a high temperature may stay in the upper space of the chamber 10 due to convection, and the temperature of the upper space may be higher than that of the lower space. That is, there may be a temperature difference between the upper space and the lower space in the chamber 10. In this case, when a transport apparatus for taking out or transporting the workpiece 100 from the organic film forming apparatus 1a enters the chamber 10, it is necessary to wait until the temperature of the upper space where the temperature is high falls to a predetermined temperature. Further, when the next workpiece 100 is carried into the upper and lower processing regions and subjected to heat treatment, the quality of the organic film formed between the plurality of workpieces 100 processed in the upper processing region and the lower processing region is improved. Variation may occur. Therefore, in order to carry in the next work 100 after the temperature distribution in the chamber 10 becomes uniform, it is necessary to wait until the temperature of the upper space where the temperature is high decreases.

Therefore, the organic film forming apparatus 1a according to the present embodiment is provided with a third exhaust part 23.
The third exhaust unit 23 exhausts the inside of the chamber 10.
The third exhaust unit 23 is connected to an exhaust port 19 provided above the chamber 10. The 3rd exhaust part 23 can be used as the exhaust apparatus which exhausts the factory building in which the process part 30 is installed, for example.
The third exhaust unit 23 may include a cooling unit that exhausts the exhausted gas between the exhaust port 19 and the exhaust device.

The exhaust port 19 is provided, for example, at a position above the center in the Z direction of the side wall of the chamber 10 or at the ceiling of the chamber 10. When the exhaust port 19 is provided on the side wall of the chamber 10, more preferably, the exhaust port 19 is located above the uppermost processing region (the processing region 30 b in FIG. 4) in the Z direction of the side wall of the chamber 10. Is provided. When the exhaust port 19 is provided on the ceiling of the chamber 10, the exhaust port 19 can be provided between the frame 31 and the inner wall of the chamber 10 in a plan view.
Since the exhaust port 19 is provided above the chamber 10, the gas in the upper space of the chamber 10 can be positively exhausted through the exhaust port 19 by the third exhaust unit 23. As a result, the high-temperature gas staying in the upper space is discharged, and the upper space can be cooled more efficiently. Moreover, even if the sublimate containing the organic material generated by heating the workpiece 100 coated with the solution containing the organic material and the solvent remains in the upper space, it is discharged by the third exhaust unit 23. be able to. If it does in this way, it will be suppressed that a sublimation thing stays also in upper space, and discharge of a sublimation thing will become easy.

FIG. 5 is a schematic view for illustrating an organic film forming apparatus 1b according to another embodiment.
FIG. 6 is a schematic diagram for illustrating the case where the supply piping is integrated into one system.
In addition, the structure of the cooling unit 40 in the organic film forming apparatus 1b can be the same as that of the cooling unit 40 illustrated in FIGS.
In FIG. 5, in the processing unit 30, the supply amount of the cooling gas G supplied to the space provided with the plurality of upper heaters 32a is made larger than the space provided with the plurality of lower heaters 32a. For example, the supply amount of the cooling gas G supplied to the space A provided with the plurality of upper heaters 32a is made larger than the space C provided with the plurality of lower heaters 32a in FIG.
Alternatively, the supply amount of the cooling gas G supplied to the space B and the space A rather than the space C is increased.
In this case, the cooling unit 40 uses the nozzles 41 connected to the spaces A to C as separate gas sources 42 so as to control the supply amount of the cooling gas G supplied to the spaces A to C, respectively. You may connect. Alternatively, the nozzles 41 connected to the spaces A to C are connected to the same gas source 42, and the supply amount of the cooling gas G supplied to the spaces A to C between the gas source 42 and the nozzle 41 is controlled. A flow control unit may be provided.
Thereby, when the internal pressure of the chamber 10 returns to the atmospheric pressure, even if a gas having a high temperature stays in the upper space of the chamber 10 due to convection, the upper space is actively cooled to shorten the temperature drop time of the upper space. can do.
As shown in FIG. 6, when the supply pipe is made into one system, the cooling gas G may flow from above so that the space provided with the plurality of upper heaters 32 a is upstream.

  In addition, as shown in FIG. 5, the nozzle 41 that jets the cooling gas G may have a narrower nozzle side. Thereby, the flow velocity of the cooling gas G can be increased, and the cooling gas G can be distributed to the plurality of heaters 32a. Further, by increasing the flow rate of the cooling gas G, more convection in the chamber 10 can be caused, and the temperature difference between the upper space and the lower space can be reduced.

FIG. 7 is a schematic view for illustrating an organic film forming apparatus 1c according to another embodiment. The configuration of the cooling unit 40a in the organic film forming apparatus 1c can be the same as that of the cooling unit 40a illustrated in FIG.
In FIG. 7, in the processing unit 30, the flow rate of the refrigerant supplied to the space provided with the plurality of heaters 32 a above is larger than the space provided with the plurality of heaters 32 a below. For example, the supply amount of the refrigerant to be supplied to the space A in which the plurality of heaters 32a above is provided is larger than the space C in which the plurality of heaters 32a below in FIG. 7 is provided.
Or the supply amount of the refrigerant | coolant supplied to the space B rather than the space B and the space B from the space C is increased. In this case, the cooling unit 40a changes the cooling bodies 41a connected to the spaces A to C to different refrigerant supply units 42a so as to control the supply amounts of the refrigerant supplied to the spaces A to C, respectively. You may connect. Or the cooling body 41a connected to each space AC is connected to the same refrigerant | coolant supply part 42a, and the supply amount of the refrigerant | coolant supplied to each space AC between the refrigerant | coolant supply part 42a and the cooling body 41a You may provide the flow control part which controls.
Thereby, when the internal pressure of the chamber 10 returns to the atmospheric pressure, even if a gas having a high temperature stays in the upper space of the chamber 10 due to convection, the upper space is actively cooled to shorten the temperature drop time of the upper space. can do.

  In addition, in the organic film formation apparatus 1a provided with the exhaust part of FIG. 4, either or both of the cooling part 40 of FIG. 5 or the cooling part 40a of FIG. 7 can be provided.

FIG. 8 is a schematic view for illustrating an organic film forming apparatus 1d according to another embodiment.
In this embodiment, a difference (housing 62 having an exhaust space) from the above-described embodiment will be described, and other description will be omitted.
As described above, when the internal pressure of the chamber 10 returns to the atmospheric pressure after the start of the supply of the cooling gas G, a gas having a higher temperature stays in the upper space of the chamber 10 due to convection, and the temperature of the upper space compared to the lower space. May be higher. In order to shorten the temperature lowering time of the internal space of the chamber 10, it is necessary to exhaust the gas having a high temperature in the upper space faster.
Therefore, in the organic film forming apparatus 1d of the present embodiment, a casing 62 having an exhaust space is connected to the chamber 10. The housing 62 is connected to the chamber 10 via the first valve 60 and is connected to the third exhaust part 23 via the second valve 61.
The first valve 60 and the second valve 61 are closed until a certain time has elapsed after the supply of the cooling gas G is started. At this time, gas having a high temperature stays in the upper space of the chamber 10 by convection inside the chamber 10. Further, the internal pressure of the chamber 10 in a state in which the first valve 60 and the second valve 61 are closed is increased after the supply of the cooling gas G is started, and is relatively higher than the internal pressure inside the casing 62 which is a sealed space. To be high.
Subsequently, after a certain time has elapsed since the supply of the cooling gas G was started, the first valve 60 and the second valve 61 are opened. By opening the first valve 60 and the second valve 61, the space in the chamber 10 and the space in the housing 62 communicate with each other, and the high temperature gas staying in the upper space of the chamber 10 is The air is sucked into the housing 62 whose pressure is lower than the internal pressure of the chamber 10 and is discharged by the third exhaust part 23.
Thus, by connecting the casing 62 having the exhaust space whose pressure is lower than the internal pressure in the chamber 10 to the chamber 10, the suction force drawn into the casing 62 caused by the differential pressure between the casing 62 and the chamber 10 is used. High-temperature gas staying in the upper part of the chamber can be rapidly exhausted. For this reason, the temperature lowering time of the chamber can be shortened without the exhaust speed being affected by the flow path resistance of the piping leading to the exhaust section or the exhaust capability of the exhaust section.

FIG. 9 is a schematic view for illustrating an organic film forming apparatus 1e according to another embodiment.
In this embodiment, differences (oxygen concentration sensor 63, vacuum sensor 64, opening 66, valve 65, piping 67) from the above-described embodiment will be described, and other descriptions will be omitted.
The organic film forming apparatus 1e of this embodiment is provided with an oxygen concentration sensor 63, a vacuum sensor 64, an opening 66 opened to the chamber 10, and a pipe 67 connected via a valve 65.
The oxygen concentration sensor 63 detects the oxygen concentration in the chamber 10, and the vacuum sensor 64 detects the degree of vacuum in the chamber 10. These sensors are used as follows.
In accordance with the oxygen concentration in the chamber 10 detected by the oxygen concentration sensor 63, the heating start / stop operation by the heating unit 32 and the power (heating temperature) applied to the heating unit 32 are controlled. Further, the start / stop operation of the exhaust by the first exhaust unit 21 and the second exhaust unit 22 is controlled according to the degree of vacuum in the chamber 10 detected by the vacuum sensor 64. For example, after the exhaust is started by the first exhaust unit 21, the vacuum sensor 64 detects that the predetermined internal pressure has been reached, and then the exhaust is started by the second exhaust unit 22. In addition, after the exhaust is started by the first exhaust unit 21, the oxygen concentration sensor 63 detects that the oxygen concentration is lower than the predetermined oxygen concentration, and then the heating unit 32 starts heating.
However, the oxygen concentration sensor 63 and the vacuum sensor 64 are not assumed to be used in a high temperature (for example, 200 ° C. or higher) environment and may not be heat-resistant.
The oxygen concentration sensor 63 and the vacuum sensor 64 are provided outside the processing regions 30 a and 30 b surrounded by a cover and a reflector in the chamber 10. During the heat treatment, the chamber 10 is in a reduced pressure atmosphere, so heat and sublimates generated in the processing regions 30a and 30b are confined in the processing regions 30a and 30b, and sensors outside the processing regions 30a and 30b are provided. Heat and sublimation do not diffuse in the space.
However, the heat treatment is completed, and heat and sublimate are diffused out of the processing region by convection that occurs in the process of returning from the reduced pressure atmosphere to the atmospheric pressure in the chamber 10. When such diffusion occurs, sublimates and high-temperature gas come into contact with these sensors, and the sensors may break down or the detection accuracy of the sensors may deteriorate.
Therefore, the oxygen concentration sensor 63 and the vacuum sensor 64 are provided on the downstream side of the valve 65 in the pipe 66 having the opening 66 on the upstream side. That is, by closing the valve 65, the space in which these sensors are provided is isolated from the space in the chamber 10, and by opening the valve 65, the space in which these sensors are provided becomes the space in the chamber 10. Can communicate. When the inside of the chamber 10 is decompressed by the exhaust unit 20, the valve 65 is opened and communicated with the space in the chamber, and the degree of vacuum and the oxygen concentration are detected. In addition, after the heating process is completed after a certain time has elapsed from the start of heating, when the space in the chamber 10 is returned to atmospheric pressure, the valve 65 is closed to isolate the sensor from the space in the chamber 10. . As described above, the degree of vacuum and the oxygen concentration in the chamber 10 can be detected by opening and closing the valve 65 when necessary. On the other hand, it is possible to suppress sublimation substances and high-temperature gas diffusing into the chamber 10 from coming into contact with the sensor, and it is possible to suppress sensor failure and deterioration in sensor detection accuracy.
Further, as described above, the introduction of the cooling gas G from the gas source 43 is started immediately after the organic film is formed, or while the internal pressure of the chamber 10 is returned to the atmospheric pressure, or after the internal pressure of the chamber 10 is returned to the atmospheric pressure. Then, after the temperature in the chamber 10 becomes a predetermined value or less, the open / close door 13 of the chamber 10 is opened, and the workpiece 100 is carried out. After the temperature in the chamber 10 falls below a predetermined value, when the temperature in the chamber 10 falls to a predetermined temperature that the sensor can withstand, the valve 65 is opened again, and the oxygen concentration or vacuum in the chamber is adjusted as necessary. The degree may be detected. Whether the temperature in the chamber 10 has become equal to or lower than a predetermined value is determined based on temperature detection by a thermometer that measures the temperature in the chamber 10 or whether a predetermined cooling time has elapsed.
The heating start / stop operation by the heating unit 32 based on the detection results of the oxygen concentration sensor 63 and the vacuum sensor 64 described above, the exhaust start / stop operation by the first exhaust unit 21 and the second exhaust unit 22, and the valve The operation of various elements such as the opening / closing operation 65 is also controlled by the control unit 50.
In FIG. 9, the oxygen concentration sensor 63 and the vacuum sensor 64 are provided in the same pipe 67. However, a plurality of pipes 67 may be provided, and the oxygen concentration sensor 63 and the vacuum sensor 64 are provided in each pipe 67. You may arrange. Further, the oxygen concentration sensor 63 and the vacuum sensor 64 are not limited to those provided in the pipe 67, and either the oxygen concentration sensor 63 or the vacuum sensor 64 may be provided in the pipe 67. Moreover, the piping 67 should just be a member which can maintain the space obstruct | occluded by the valve | bulb 65, and is not limited to a pipe shape.

FIG. 10A is a schematic view for illustrating an organic film forming apparatus 1f according to another embodiment.
FIG. 10B is a schematic view for illustrating a cooling gas supply mode according to the organic film forming apparatus 1f.
In this embodiment, the difference (cooling gas supply mode) from the above-described embodiment will be described, and the other description will be omitted.
When the cooling gas is introduced from the same direction into the plurality of heating units 32 (upper heating unit, lower heating unit) in the processing regions 30a and 30b, the plurality of heating units 32 are heated to about 600 ° C. And flows through the surface of the heater 32b in the same direction. Then, the cooling gas whose temperature has risen due to the transfer of heat from the heater 32b leaks from the space between the inner wall of the chamber 10 and the cover 36 and the processing regions 30a, 30b, etc., and leaks into the chamber. 10 is discharged from the same direction into the space between the inner wall and the cover 36. As described above, when the cooling gas is introduced into the plurality of heating units 32 from the same direction, the cooling gas whose temperature has increased is discharged from the same direction. That is, the space where the cooling gas whose temperature has risen is discharged is uneven, and the uneven space in the chamber 10 is a high-temperature space. When the biased space becomes a high-temperature space, the temperature of that portion is slowed down, and it takes time to cool down before opening the opening / closing door 13 of the chamber 10, resulting in a waiting time. Further, when a temperature difference occurs in the chamber 10, the sublimate gasified in the high temperature space is deposited in the low temperature space and adheres to members in the chamber 10, for example, the inner wall of the chamber 10. If the sublimate adheres to the members in the chamber 10, the sublimate may adhere to the workpiece 100 that performs the next processing. Further, it is necessary to remove the attached sublimate, and the maintainability deteriorates. For this reason, when introducing the cooling gas into the heating unit 32, it is necessary to make the heat distribution in the chamber 10 uniform so that the uneven space does not become a high-temperature space.
Therefore, the introduction direction of the cooling gas in at least one heating unit 32 among the plurality of heating units 32 and the introduction direction of the cooling gas introduced into the other heating unit 32 are different. As a result, the high-temperature spaces are dispersed, and the heat distribution in the chamber 10 becomes uniform. As a result, there is no need to wait for the temperature of the high-temperature space to drop, there is no waiting time when the chamber 10 is opened, and the adhesion of sublimates to the inner wall of the chamber 10 can be suppressed.
For example, as shown in FIGS. 10A and 10B, the cooling unit 40 introduces the cooling gas into the lower heating unit from a direction different from the direction in which the cooling gas introduced into the upper heating unit is introduced. That is, the cooling gas is introduced from the opposite direction into the plurality of heating units 32 located adjacent to each other in the Z direction (up and down direction). Thereby, the cooling gas whose temperature has risen is discharged from the plurality of adjacent heating units 32 in the chamber 10 in the opposite directions, and the high-temperature space H is efficiently dispersed, so that the heat of the chamber 10 can be efficiently dispersed. Distribution is uniform. As a result, there is no need to wait for the temperature of the high-temperature space to drop, there is no waiting time when the chamber 10 is opened, and the adhesion of sublimates to the inner wall of the chamber 10 can be suppressed.
10A and 10B, the cooling gas is introduced from the opposite direction in the X direction. However, the cooling gas may be introduced from the opposite direction in the Y direction, or the X direction and the Y direction are combined. The cooling gas may be introduced from different directions.
10 (a) and 10 (b), the upper soaking plate 34a and the lower soaking plate 34b are arranged side by side in the direction in which the plurality of heaters 32a are arranged. As in the other embodiments described above, At least one may be a single plate member.
FIG. 10A shows the X direction in the processing unit 30 so that the cooling gas is introduced from the opposite direction into the plurality of heating units 32 located adjacent to each other in the Z direction (vertical direction). Although the nozzles 41 are arranged in the opposite direction every other stage on one side, the present invention is not limited to this. For example, the nozzles 41 can be provided on both sides of the processing unit 30 in the X direction. In this case, the nozzles 41 on both sides are respectively connected to the gas source 42 via the gas control unit 43, and the direction in which the cooling gas is discharged is controlled by adjusting the supply flow rates of the nozzles 41 on both sides. Good.
Further, as shown in FIG. 10C, the cooling gas is introduced into one heating unit 32 from different directions when seen in a plan view, and the high temperature space is dispersed so as to be discharged from different directions. Good.

The embodiment has been illustrated above. However, the present invention is not limited to these descriptions.
As long as the features of the present invention are provided, those skilled in the art appropriately modified the design of the above-described embodiments are also included in the scope of the present invention.
For example, the shape, dimensions, arrangement, and the like of the organic film forming apparatus 1 are not limited to those illustrated, but can be changed as appropriate.
Moreover, each element with which each embodiment mentioned above is combined can be combined as much as possible, and what combined these is also included in the scope of the present invention as long as the characteristics of the present invention are included.

  DESCRIPTION OF SYMBOLS 1 Organic film forming apparatus, 10 chamber, 20 exhaust part, 30 process part, 30a process area, 30b process area, 32 heating part, 32a heater, 33 work support part, 34 soaking part, 34a upper soaking plate, 34b lower part Soaking plate, 34c Side soaking plate, 36 cover, 40 cooling unit, 40a cooling unit, 41 nozzle, 41a cooling body, 42 gas source, 42a refrigerant supply unit, 43 gas control unit, 44 discharge nozzle, 45 suction unit , 50 control unit, 100 workpieces

Claims (13)

A chamber capable of maintaining an atmosphere depressurized from atmospheric pressure;
An exhaust part capable of exhausting the interior of the chamber;
A first heating unit provided in the chamber and having at least one first heater;
A second heating unit provided in the chamber, having at least one second heater, and provided to face the first heating unit;
A process for supporting a workpiece between the first heating unit and the second heating unit and having a substrate and a solution containing an organic material and a solvent applied to the upper surface of the substrate. Area,
A cooling unit that supplies a cooling gas or a refrigerant into at least one of the first heating unit and the second heating unit;
With
An organic film forming apparatus in which the work supported in the processing region is cooled by supplying the cooling gas or the refrigerant to at least one of the first heating unit and the second heating unit. . The first heater has a rod shape, and a plurality of the first heaters are arranged in a direction in which the surface of the workpiece extends,
The first heating unit further includes at least one first heat equalizing plate provided on the second heating unit side to be separated from the plurality of first heaters,
2. The organic material according to claim 1, wherein the cooling unit supplies the cooling gas or the refrigerant in a direction in which a surface of the workpiece extends in a space partitioned from the processing region by the first heat equalizing plate. Film forming device. The second heater has a rod shape, and a plurality of the second heaters are arranged in a direction in which the surface of the workpiece extends,
The second heating unit further includes at least one second heat equalizing plate provided on the first heating unit side to be separated from the plurality of second heaters,
The cooling unit supplies the cooling gas or the refrigerant in a direction in which a surface of the workpiece extends in a space partitioned from the processing region by the second heat equalizing plate. The organic film forming apparatus described.   The organic film forming apparatus according to claim 2 or 3, wherein the refrigerant is supplied into a cooling body provided in at least one of the first heating unit and the second heating unit.   The organic exhaust according to claim 1, wherein the exhaust unit operates intermittently so as to operate again after operating for a certain period of time while the cooling unit supplies the cooling gas or the refrigerant. Film forming device. A chamber capable of maintaining an atmosphere depressurized from atmospheric pressure;
A first exhaust part capable of exhausting the interior of the chamber to a pressure lower than atmospheric pressure;
An upper exhaust port provided above the chamber;
A second exhaust unit that is connected to the upper exhaust port and exhausts a high-temperature gas that has accumulated in the upper space of the chamber;
A first heating unit provided in the chamber and having at least one first heater;
A second heating unit provided in the chamber, having at least one second heater, and provided to face the first heating unit;
A workpiece having a substrate and a solution containing an organic material and a solvent applied to the upper surface of the substrate is supported between the first heating unit and the second heating unit. A processing area;
A cooling unit that supplies a cooling gas or a refrigerant into at least one of the first heating unit and the second heating unit;
With
An organic film forming apparatus in which the work supported in the processing region is cooled by supplying the cooling gas or the refrigerant to at least one of the first heating unit and the second heating unit. . A plurality of the first heating units are provided in the vertical direction intersecting the direction in which the surface of the workpiece extends,
The said cooling part increases the flow volume of the cooling gas or refrigerant | coolant supplied to the inside of the said 1st heating part located upward rather than the said 1st heating part located below. 6. The organic film forming apparatus according to 6.   The said 1st exhaust part operate | moves intermittently so that it may operate | move again, after operating | moving and stopping for a fixed time, while the said cooling part supplies cooling gas or a refrigerant | coolant. Organic film forming equipment. A vacuum sensor for detecting the degree of vacuum in the chamber;
An oxygen concentration sensor for detecting the oxygen concentration in the chamber;
Further comprising a pipe connected through an opening provided in the chamber and a valve;
9. At least one of the vacuum sensor and the oxygen concentration sensor is provided on the downstream side of the valve in the pipe with the opening as an upstream side. Organic film forming equipment.   9. The cooling unit according to claim 1, wherein the cooling unit introduces the cooling gas into the lower heating unit from a direction different from an introduction direction of the cooling gas introduced into the upper heating unit. The organic film forming apparatus as described in 2. Heating a workpiece having a substrate and a solution containing an organic material and a solvent applied to the upper surface of the substrate in an atmosphere reduced in pressure from atmospheric pressure;
Cooling the work on which the organic film is formed by performing the heating;
With
In the step of heating the workpiece, the workpiece is heated in a processing region between the first heating unit and the second heating unit,
In the process of cooling the workpiece,
Supplying a cooling gas or a refrigerant to at least one of the first heating unit and the second heating unit;
Production of an organic film in which the work supported in the processing region is cooled by supplying the cooling gas or the refrigerant to at least one of the first heating unit and the second heating unit. Method. In the process of cooling the workpiece,
The method for producing an organic film according to claim 11, wherein a gas having a high temperature staying in an upper space in an atmosphere depressurized from the atmospheric pressure is discharged. In the process of cooling the workpiece,
The exhaust part that depressurizes the atmosphere is stopped intermittently so as to urge the heat exchange in the atmosphere and operate again so that the gas containing the heat after the heat exchange is performed is discharged. The method for producing an organic film according to claim 11 or 12, wherein the organic film is operated.

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