JP2019125513A - Luminaire - Google Patents

Abstract

To provide a luminaire suitable for the downsizing while insulation proof pressure between an electrode for connecting power supply electrical wire from the outside and the mounting basal plate of a light emitter is sufficiently ensured even having a simple structure.SOLUTION: A luminaire 10 comprises: a conductivity mounting basal plate 12 having a low step 12a provided on the circumference, a high step 12b provided on the inside of the low step 12a, and an emitting light region 12c provided at the center of the high step 12b; an opening 14a for opening the emitting light region 12c; a wiring board 14 installed on the high step 12b; a pair of electrodes 16 and 18 provided on the wiring board 14 for supplying the electric power from the outside and at least a part is exposed; a plurality of light emitters 20 mounted in the emitting light region 12c; a wire 22 for electrically connecting the plurality of light emitters 20 to the pair of electrodes 16 and 18; and an insulation quality outer frame body 28 provided on the outside of the exposed portion of the pair of electrodes 16 and 18 and at least on the lower step 12a.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a lighting device mounted on various lighting fixtures.

  In recent years, lighting devices using a plurality of light emitting elements (LEDs) have been adopted as light sources for lighting instead of light bulbs and fluorescent lamps. Patent Document 1 describes an LED light source including a substrate, a light emitting unit in which a plurality of LED bare chips are mounted and resin-sealed on the substrate, and a feeding electrode provided on the substrate surface outside the light emitting unit. . Then, in order to ensure a sufficient insulation distance (creeping distance, space distance) between the power supply electrode and the side surface of the substrate, the LED light source is sandwiched between the upper and lower insulating supports larger than the substrate and attached to the metal casing. It is made.

JP, 2014-120544, A

  The light emitting device described in Patent Document 1 becomes large because the upper and lower insulating supports are larger than the substrate. In addition, in this light emitting device, the number of components such as the upper and lower insulating supports is increased, which may lower the reliability of the device and increase the cost. The appearance of a lighting device that can be miniaturized with a simple structure and has a sufficient withstand voltage between the feeding electrode and the side surface of the substrate is desired. The present invention has been made in view of such circumstances, and it has a simple structure, but the insulation withstand voltage between the electrode for connecting the power supply wire from the outside and the heat dissipation substrate of the light emitting element is sufficient. It is an object of the present invention to provide a lighting device which is

  The illumination device according to the present invention comprises a conductive mounting substrate including a low step provided on the outer periphery, a high step provided inside the low step, and a light emitting region provided in the center of the high step. And an insulating wiring substrate provided on the high step portion, and an opening for opening the light emitting region, and provided on the wiring substrate to supply power from the outside, at least a part of which is exposed A pair of electrodes, a plurality of light emitting elements mounted in the light emitting region, a wire electrically connecting the plurality of light emitting elements and the pair of electrodes, and at least a low step outside the exposed portion of the pair of electrodes And an insulating outer frame provided on the

  The method for manufacturing a lighting device according to the present invention comprises a conductive collective mounting substrate on which a plurality of light emitting regions are regularly provided, and an opening for opening the plurality of light emitting regions, and the insulating device is provided on the collective substrate Group wiring board, a group of a pair of electrodes provided around each opening on the group wiring board to supply power from the outside, and a plurality of light emitting elements mounted in each light emitting region And a groove for forming a groove reaching the collective mounting substrate at the boundary of the respective lighting devices of the collective lighting device comprising: and a wire electrically connecting the pair of electrodes and the plurality of light emitting elements The method includes the steps of: filling the groove with an insulating material; and separating the at least the insulating material and the collective mounting substrate by a width smaller than the width of the groove to separate the respective lighting devices.

  The lighting device of the present invention is provided with a low step on the periphery of the upper surface of the mounting substrate, and is provided with an insulating outer frame around the periphery including the step. Therefore, the creeping distance between the mounting substrate and the pair of electrodes is increased with a simple structure and without enlargement. Therefore, a sufficient withstand voltage can be secured between them.

The top view (a) and sectional drawing (b) of the illuminating device of embodiment. The top view (a) and sectional drawing (b) explaining the wiring board installation process which manufactures the illuminating device of embodiment. The top view (a) and sectional drawing (b) explaining the covering material formation process which manufactures the illuminating device of embodiment. The top view (a) and sectional drawing (b) explaining the mounting process which manufactures the illuminating device of embodiment. The top view (a) and sectional drawing (b) explaining the wiring process which manufactures the illuminating device of embodiment. The top view (a) and sectional drawing (b) explaining the groove formation process which manufactures the illuminating device of embodiment. The top view (a) and sectional drawing (b) explaining the filling process which manufactures the illuminating device of embodiment. The top view (a) and sectional drawing (b) explaining the isolation | separation process which manufactures the illuminating device of embodiment. Sectional drawing (a) of outer frame body vicinity of the illuminating device of embodiment, and sectional drawing (b) of outer frame body vicinity of the illuminating device of reference form.

  Hereinafter, a lighting device and a method of manufacturing the lighting device of the present invention will be described based on embodiments with reference to the drawings. Note that the drawings schematically represent the lighting device, components of the lighting device, and peripheral members of the lighting device, and the dimensions and dimensional ratio of these actual products are not necessarily equal to the dimensions and dimensional ratio in the drawings. I do not do it. Further, unless otherwise specified, in the present specification, for convenience, directions such as “upper” and “lower” are indicated on the basis of the direction of the lighting device shown in FIG. The overlapping description is appropriately omitted, and the same reference numeral may be given to the same member.

  Fig.1 (a) has shown the upper surface of the illuminating device 10 which concerns on embodiment of this invention. FIG. 1B shows a vertical cross section in the vicinity of the central portion of the lighting device 10. FIGS. 2 to 8 show each process when manufacturing the lighting device 10. The lighting apparatus 10 includes a mounting substrate 12, a wiring substrate 14, a pair of electrodes 16 and 18, a plurality of light emitting elements 20, wires 22, an inner frame 24, a sealing resin 26, and an outer frame 28. And have.

  The mounting substrate 12 is conductive, and is made of, for example, aluminum or an aluminum alloy having high thermal conductivity, and is a substantially square plate-like member. A low step 12a is provided on the outer periphery of the mounting substrate 12, and a high step 12b is provided inside the low step 12a. Further, a circular light emitting region 12 c is provided at the center of the high step 12 b of the mounting substrate 12. In the present embodiment, the light emitting area 12 c is an area inside the inner frame 24.

  Forty light emitting elements 20 are mounted in the light emitting area 12 c of the mounting substrate 12. The arrangement of the 40 light emitting elements 20 will be described later. The number 40 of the light emitting elements 20 is an example, and the number of the plurality of light emitting elements 20 is not particularly limited. In order to obtain white-based light emission for general illumination, each light emitting element 20 is a blue light emitting element of the same type and the same size provided with a gallium nitride based compound semiconductor. The blue light emitting device includes a base made of sapphire glass, a diffusion layer obtained by diffusion-growing an n-type semiconductor and a p-type semiconductor on the base, and an n-type provided on the upper surface of the n-type semiconductor and the p-type semiconductor. An electrode and a p-type electrode are provided.

  The wiring board 14 is insulating and is disposed on the high step 12b. The wiring board 14 is a substantially square plate-like member made of glass epoxy resin. At the center of the wiring board 14, an opening 14a which is a circular hole is provided. That is, the opening 14a opens the light emitting region 12c. As shown in FIG. 2, the wiring board 14 is provided with a pair of electrodes 16 and 18 on the top surface thereof. The pair of electrodes 16 and 18 are provided to face each other so as to sandwich the opening 14a. The pair of electrodes 16 and 18 are electrodes for electrically connecting a pair of electric wires 30 and 32 for supplying power from the outside. The pair of electrodes 16 and 18 are formed on the upper surface of the wiring board 14 by, for example, gold plating.

  The electrode 16 includes an element connection area 16a to which the light emitting element 20 is electrically connected through the wire 22, and a wire connection area 16b outside the element connection area 16a to which the wire 30 is connected. . The element connection region 16a has a shape of a part of an annular ring along the outside of the opening 14a. The wire connection area 16b has a shape in which one corner of a rectangle (including a square) is cut out in a fan-like shape consisting of a part of the opening 14a and a part of the element connection area 16a.

  Similarly, the electrode 18 includes an element connection area 18a to which the light emitting element 20 is electrically connected through the wire 22, and a wire connection area 18b outside the element connection area 18a to which the electric wire 32 is connected. Have. The shapes of the element connection area 18a and the wire connection area 18b are the same as the shapes of the element connection area 16a and the wire connection area 16b, respectively. The pair of electric wires 30 and 32 are peripheral members of the lighting device 10 and are not included in the components of the lighting device 10.

  The wire connection regions 16 b and 18 b are preferably provided at different corner portions of the mounting substrate 12 respectively. If the wire connection areas 16b and 18b are separated, it is easy to solder the wire 30 to the wire connection area 16b and the wire 32 to the wire connection area 18b. In the present embodiment, the wire connection regions 16 b and 18 b are provided at diagonal portions across the opening 14 a. The wire connection regions 16b and 18b may be provided at adjacent corner portions.

  As shown in FIG. 3, the lighting device 10 further includes a covering material 34 on the wiring substrate 14 that exposes at least a part of the top surfaces of the electrodes 16 and 18. The exposed part of the upper surface of the electrodes 16 and 18 is a part of each of the wire connection areas 16 b and 18 b. In the present embodiment, the covering material 34 is made of a photoresist resin. For this reason, the exposed part of the upper surface of the electrodes 16 and 18 can be formed simply and correctly.

  Further, one of the n-type electrode and the p-type electrode of a certain light emitting element 20 and the other of the n-type electrode and the p-type electrode of the next light emitting element 20 are sequentially electrically connected via the wire 22 . And the wire 22 arrange | positioned at the edge part of the light emission area | region 12c is electrically connected to element connection area | region 16a, 18a. Thus, as shown in FIG. 5, light emitting groups in which eight light emitting elements 20 are connected in series are electrically connected to the pair of electrodes 16 and 18 in parallel in five columns.

  As shown in FIG. 1, the outer frame body 28 is provided outside the exposed portions of the pair of electrodes 16 and 18 and at least on the lower step 12 a. In the present embodiment, the outer frame 28 is provided on the low step 12a and the covering material 34 on the high step 12b. The outer frame body 28 is, for example, an insulating member made of a resin such as a silicone resin. By providing the outer frame body 28 in the lighting apparatus 10, the creeping distance between the mounting substrate 12 and the exposed portion of the wire connection region 16b and the creeping distance between the mounting substrate 12 and the exposed portion of the wire connection region 18b are outer frames As it passes through the surface of the body 28, it becomes large. Therefore, a sufficient withstand voltage can be secured between the mounting substrate 12 and the exposed portion of the wire connection region 16b and the exposed portion of the wire connection region 18b.

  Fig.9 (a) is sectional drawing of outer frame 28 vicinity of the illuminating device 10, FIG.9 (b) is sectional drawing of outer frame 48 vicinity of the other illuminating device 40 which is a reference form. In the present embodiment, as shown in FIG. 9A, the outer wall surface 28a of the outer frame 28 is flat. In FIG. 9, the withstand voltage between the mounting substrate 12 and the electrode 16 is improved as the creeping distance from the upper left corner of the mounting substrates 12 and 42 exposed to the top of the outer frames 28 and 48 is larger. It is known. In the lighting device 10, as shown in FIG. 9A, the creeping distance from the mounting substrate 12 to the top of the outer frame 28 is the step D between the low step 12a and the high step 12b, and the wiring board 14 It is the sum of the thickness T of the covering material 34 and the height H along the outer wall surface 28a from the upper surface of the low step 12a.

  On the other hand, in the lighting device 40 in which the outer frame body 48 is provided on the covering material 34 in the same manner as the inner frame body without providing the low stepped portion on the mounting board 42, as shown in FIG. The creepage distance from the top to the top of the outer frame 48 is the sum of the thickness T of the wiring substrate 14 and the covering material 34 and the length L along the outer wall 48 a of the outer frame 48. The length along the inner wall surface 48b of the outer frame 48 is also L. Therefore, in order to improve the withstand voltage of the lighting device 10 more than the withstand voltage of the lighting device 40, D may be set such that D + T + H> T + L, that is, D + H> L.

  Therefore, in the present embodiment, the sum of the step D between the low step 12a and the high step 12b and the height H along the outer wall surface 28a from the upper surface inside the low step 12a is within the outer frame 28. The lower step 12a is formed to be larger than the length L along the wall surface 28b. The setting of the lower step 12a is such that the cross-sectional shape of the outer frame 48 is a part of a circle such as a semicircle, a part of an ellipse such as a semi-ellipse, or a triangle or a square The same applies to the case of polygonal shape.

  As shown in FIG. 7 and FIG. 8, the outer frame body 28 is chipped at two places where the pair of electric wires 30 and 32 respectively pass from the outside toward the electrodes 16 and 18. In addition, as long as the outer frame 28 is provided on the periphery including the lower step 12 a of the mounting substrate 12, the outer frame 28 may be chipped at places other than the two places. In addition, the outer frame 28 may be missing at one point where both of the pair of electric wires 30 and 32 pass from the outside toward the electrodes 16 and 18.

  The method of manufacturing the lighting device 10 includes a wiring substrate installation step, a covering material formation step, a mounting step, a wiring step, a groove formation step, a filling step, and a separation step. FIG. 2A shows an upper surface for explaining a wiring board installation process when manufacturing the lighting device 10. FIG. 2 (b) shows a vertical cross section near the center of FIG. 2 (a). In the wiring board installation step, the collective wiring board 54 is fixed on the collective mounting board 52 via an adhesive or the like. The collective mounting substrate 52 is regularly provided with a plurality of light emitting regions 12c. In addition, the collective wiring board 54 is provided with an opening 14 a that opens the plurality of light emitting areas 12 c.

  FIG. 3A shows an upper surface for explaining a covering material forming process when manufacturing the lighting device 10. FIG.3 (b) has shown the vertical cross section of central part vicinity of Fig.3 (a). In the covering material forming step, the collective wiring board 54 is covered with the covering material 34. At this time, a part of the wire connection area 16b and a part of the wire connection area 18b are exposed. At these exposed portions, the pair of electric wires 30, 32 are soldered to the wire connection regions 16b, 18b, respectively. Further, in the covering material forming step, the inner portions of the element connection regions 16a and 18a are also exposed. At these exposed portions, the wires 22 connected to the light emitting element 20 are connected to the element connection regions 16a and 18a.

  FIG. 4A shows an upper surface for explaining a mounting process when manufacturing the lighting device 10. FIG. 4 (b) shows a vertical cross section near the center of FIG. 4 (a). In the mounting step, a plurality of light emitting elements 20 are mounted on the light emitting regions 12 c of the collective mounting substrate 52 by die bonding paste.

  FIG. 5A shows an upper surface for explaining a wiring process when manufacturing the lighting device 10. FIG.5 (b) has shown the vertical cross section of central part vicinity of Fig.5 (a). In the wiring process, the plurality of light emitting elements 20 are connected to one another via the wires 22. In addition, the wires 22 at the ends when the plurality of light emitting elements 20 are connected are connected to the element connection regions 16a and 18a.

  FIG. 6A shows an upper surface for explaining a groove forming process when manufacturing the lighting device 10. FIG. 6 (b) shows a vertical cross section in the vicinity of the central part of FIG. 6 (a). In the groove forming step, grooves 56 which reach the collective mounting substrate 52 are formed at the boundaries of the respective lighting devices 10 constituting the collective lighting device 50. Here, the collective lighting device 50 includes a conductive collective mounting substrate 52, an insulating collective wiring board 54, a group of a pair of electrodes 16 and 18, a plurality of light emitting elements 20, and a wire 22. There is. A group of a pair of electrodes 16 and 18 is provided around each opening 14a on the collective wiring board 54 in order to supply power from the outside. The plurality of light emitting elements 20 are mounted on the respective light emitting regions 12 c. The wire 22 electrically connects each pair of electrodes 16 and 18 to each of the plurality of light emitting elements 20.

  FIG. 7A shows an upper surface for explaining a filling process when manufacturing the lighting device 10. FIG.7 (b) has shown the perpendicular cross section of central part vicinity of Fig.7 (a). In the filling step, the groove 56 is filled with an insulating material to be the outer frame 28. Further, as shown in FIG. 7, prior to the filling step or after the filling step, the inside of the light emitting element 20 and the wire 22 are made higher so as to cover the exposed element connection regions 16a and 18a. The frame 24 is formed in a circular shape. The inner frame 24 is made of, for example, a white light-shielding resin.

  After the inner frame 24 is formed, the sealing resin 26 is filled in the inner frame 24. Thereby, the light emitting element 20 and the wire 22 are sealed. The sealing resin 26 is a transparent resin base material containing a predetermined amount of fluorescent agent. For example, a sealing resin is prepared by mixing a fluorescent agent composed of yttrium aluminum garnet (YAG) as a raw material of fluorescent particles or a dye as a raw material of pigment particles into an epoxy resin base material or silicone resin base material. 26 can be produced.

  FIG. 8A shows an upper surface for explaining the separation process when manufacturing the lighting device 10. FIG. 8 (b) shows a vertical cross section near the center of FIG. 8 (a). In the separation step, at least the insulating material and the collective mounting substrate 52 are cut by a width smaller than the width of the groove 56 and separated into the respective lighting devices 10. Thus, a lighting device 10 as shown in FIG. 1 is obtained. Then, as shown in FIG. 1, the ends of the electric wires 30, 32 supplied from the motherboard or the like are connected to the exposed portions of the electric wire connection regions 16b, 18b of the lighting device 10 by soldering (not shown). .

DESCRIPTION OF SYMBOLS 10 illumination apparatus 12 mounting board 12a lower step 12b high step 12c light emission area 14 wiring board 14a opening 16 electrode 16a element connection area 16b wire connection area 18 electrode 18a element connection area 18b wire connection area 20 light emitting element 22 wire 24 Frame 26 Sealing resin 28 Outer frame 28a Outer wall 28b Inner wall 30, 32 Electric wire 34 Coating material 40 Lighting device 42 Mounting board 48 Outer frame 48a Outer wall 48b Inner wall 50 Aggregate lighting device 52 Collective mounting board 56 Groove D Mounting board step (depth of groove on mounting board)
H Height along the outer wall L Length along the inner wall

Claims (8)

A conductive mounting substrate comprising a low step provided on the outer periphery, a high step provided on the inner side of the low step, and a light emitting region provided in the center of the high step;
An insulating wiring substrate provided with an opening for opening the light emitting region, and installed on the high step;
A pair of electrodes provided on the wiring substrate to supply power from the outside, at least a part of which is exposed;
A plurality of light emitting elements mounted in the light emitting region;
A wire electrically connecting the plurality of light emitting elements and the pair of electrodes;
An insulating outer frame provided on at least the low step portion outside the exposed portion of the pair of electrodes;
A lighting device having In claim 1,
The illuminating device whose outer wall surface of the said outer frame is flat. In claim 2,
The sum of the height difference D between the low step and the high step and the height H along the outer wall from the upper surface inside the low step is the length along the inner wall of the outer frame Lighting devices larger than L. In any one of claims 1 to 3,
The illuminating device which the said outer frame body is missing in at least one place which a pair of electric wire passes toward the said pair of electrodes from the exterior. In any one of claims 1 to 4,
A covering material for exposing at least a part of the pair of electrodes on the wiring substrate;
The illuminating device by which the said outer frame body was provided also on the said coating material. In any one of claims 1 to 5,
The illuminating device whose main material of the said mounting board is aluminum. A conductive collective mounting substrate in which a plurality of light emitting regions are regularly provided, and an opening for opening the plurality of light emitting regions, and an insulating collective wiring substrate provided on the collective substrate, and an external A group of a pair of electrodes provided around each of the openings on the collective wiring board to supply power from the plurality of light emitting elements mounted in each of the light emitting regions; A groove forming step of forming a groove reaching the collective mounting substrate at the boundary of each lighting unit of the collective lighting device including a pair of electrodes and a wire electrically connecting each of the plurality of light emitting elements;
Filling the groove with an insulating material;
A separation step of cutting at least the insulating material and the collective mounting substrate with a width smaller than the width of the groove to separate them into respective lighting devices;
A method of manufacturing a lighting device comprising: In claim 7,
In the groove forming step, the sum of the depth D of the collective mounting substrate portion of the groove and the height H along the outer wall surface of the outer frame from the upper surface of the groove is the inside of the outer frame The manufacturing method of the illuminating device which forms the said groove | channel in the said collective mounting board | substrate so that it may become larger than length L along a wall surface.

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