JP6242437B2 - Light emitting device - Google Patents

Description

  The present invention relates to a light emitting device.

  In recent years, many LEDs have been used as light sources for lighting devices. As a method for obtaining white light of an illumination device using LEDs, a method using three types of LEDs, a red LED, a blue LED, and a green LED, and a phosphor that emits yellow light by converting excitation light emitted from the blue LED is used. There are methods. As a light source for illumination, white light with sufficient luminance is required, and lighting devices using a plurality of LED chips have been commercialized.

  As an example of such an illuminating device, for example, Japanese Patent Laying-Open No. 2003-152225 (Patent Document 1) discloses a light emitting device 101 as schematically shown in FIG. The light emitting device 101 shown in FIG. 14 is provided with a concave element storage portion 103 on a metal plate 102 made of aluminum, and an insulating glass epoxy substrate between the element storage portions. A printed circuit board 104 provided with a wiring portion 105 formed of copper foil is formed. In the example shown in FIG. 14, the light emitting element 106 placed (arranged) in the element storage portion 103 and the wiring portion 105 on the printed circuit board 104 are electrically connected via a bonding wire 107. It becomes. Further, the element storage portion 103 is configured to be sealed with a resin sealing body 108 so as to cover the light emitting element 106 and the bonding wire 107 together. Patent Document 1 describes that by providing such a configuration, it is possible to provide a light-emitting device that can improve heat dissipation and can efficiently extract light from a light-emitting diode chip to the outside.

  However, in the light emitting device 101 as shown in FIG. 14, a printed circuit board 104 provided with a wiring portion 105 formed of copper foil is disposed in the immediate vicinity of a metal plate 102 formed of aluminum (in the drawing). As a distance between the metal plate 102 and the wiring portion 105, a linear distance d in the horizontal direction is shown). For this reason, it is assumed that sufficient electrical insulation is not achieved between the metal plate 102 and the wiring part 105. Further, since the light emitting device 101 as shown in FIG. 14 includes the printed circuit board 104 formed of a glass epoxy substrate, there is a problem that a manufacturing process becomes complicated and an inexpensive light emitting device cannot be provided.

  Further, for example, Japanese Patent Laid-Open No. 2006-287020 (Patent Document 2) discloses an LED component 201 as schematically shown in FIG. The LED component 201 shown in FIG. 15 is formed by joining a heat sink 203 made of metal or ceramic on which an LED chip 204 is mounted in a through hole formed in a wiring board 202. In the example shown in FIG. 15, the LED chip 204 and the wiring pattern 205 formed on the wiring substrate 202 are electrically connected by the bonding wire W, and the LED chip 204 and the bonding wire W are formed of a transparent resin. The resin sealing body 206 is buried. Patent Document 2 describes that by providing such a configuration, it is possible to efficiently dissipate the heat generated by the LED chip, and to provide a surface-mount type LED component excellent in productivity and a method for manufacturing the same. ing.

  However, Patent Document 2 does not describe in detail a method of applying a transparent resin for embedding the LED chip 204 and the bonding wire W. Further, the LED component 201 shown in FIG. 15 disclosed in Patent Document 2 is difficult to manufacture because the wiring pattern 205 is formed on a part of the side surface and the back surface of the wiring substrate 202, and can be manufactured at low cost. There is a problem that you can not.

JP 2003-152225 A JP 2006-287020 A

  The present invention has been made in order to solve the above-described problems, and an object of the present invention is to provide a light emitting device that can achieve sufficient electrical insulation, can be easily manufactured at low cost. Is to provide.

The light emitting device of the present invention includes an insulating substrate formed of an insulating material, a light emitting portion formed on the upper surface of the insulating substrate, a sealing body for sealing the light emitting portion, and the insulating substrate. A positive electrode external connection land and a negative electrode external connection land provided on the upper surface of the substrate, and a wiring pattern including a cathode wiring pattern and an anode wiring pattern disposed on the upper surface of the insulating substrate. A plurality of light emitting elements mounted on the insulating substrate, the light emitting elements are mounted between the wiring patterns, and the positive electrode external connection land and the negative electrode external connection land are the anode wiring The sealing body includes a first sealing body containing a first phosphor and a second phosphor different from the first phosphor, respectively connected to the pattern and the cathode wiring pattern. 2 of the sealing body seen including, the positive electrode external connection land and the negative electrode external connection land, characterized in that face each other across the light emitting portion.

  In the light emitting device of the present invention, the sealing body preferably has a hexagonal shape, a circular shape, or a rectangular top shape.

In the light emitting device of the present invention, it is preferable that the insulating substrate has a circular or rectangular upper surface shape.

In the light emitting device of the present invention, it is preferable that the insulating substrate includes a polarity display of a positive electrode adjacent to the positive electrode external connection land. In this case, it is more preferable that the insulating substrate includes a polarity indication of a negative electrode adjacent to the negative electrode external connection land.

In the light emitting device of the present invention, it is preferable that the insulating substrate includes a polarity display of a negative electrode adjacent to the negative electrode external connection land.

In the light emitting device of the present invention, the positive electrode external connection land is electrically connected to the anode wiring pattern, and the negative electrode external connection land is electrically connected to the cathode wiring pattern through an external lead wiring pattern. The external lead-out wiring pattern includes a first external lead-out wiring pattern formed between the positive electrode external connection land and the anode wiring pattern, and a space between the negative electrode external connection land and the cathode wiring pattern. It is preferable to have a second external lead wiring pattern formed. In this case, the width of the external lead wiring pattern is preferably smaller than the width of the positive electrode external connection land and the negative electrode external connection land .

  In the light emitting device of the present invention, it is preferable that the second sealing body is formed on the first sealing body. In this case, it is preferable that the first sealing body is partially covered with the second sealing body.

  According to the present invention, it is possible to provide a light emitting device that can achieve sufficient electrical insulation, can be easily manufactured at low cost, and a manufacturing method thereof. In addition, the light emitting device of the present invention has improved color rendering properties as compared with conventional ones and is less likely to cause color misregistration, and can be suitably applied to a liquid crystal display and an illumination light source.

It is a top view which shows typically the light-emitting device 1 of the preferable 1st example of this invention. It is sectional drawing which shows typically the light emission part 2 in the light-emitting device 1 of the example shown in FIG. It is a top view which shows typically the insulated substrate 3 of the light-emitting device 1 of the example shown in FIG. It is a top view which shows typically the light-emitting device 21 of the preferable 2nd example of this invention. It is a top view which shows typically the light-emitting device 31 of the preferable 3rd example of this invention. It is a top view which shows typically the light-emitting device 41 of the preferable 4th example of this invention. It is a top view which shows typically the light-emitting device 51 of the preferable 5th example of this invention. 2 is a perspective view showing a case where the light emitting device 1 of the example shown in FIG. 1 is applied to a fluorescent lamp type LED lamp 61. FIG. It is a perspective view which shows the case where the light-emitting device 41 of the example shown in FIG. 6 is applied to the fluorescent lamp type LED lamp 71. It is sectional drawing which shows the case where the light-emitting device 41 of the example shown in FIG. It is a figure which shows one preferable example of the manufacturing method of the light-emitting device of this invention in steps. It is a figure which shows typically the silicone rubber sheet 91 of a preferable example used for the manufacturing method of the light-emitting device of this invention. It is a graph which shows the chromaticity coordinate of CIE. It is sectional drawing which shows the conventional typical light-emitting device 101 typically. It is sectional drawing which shows the conventional typical LED component 201 typically.

  FIG. 1 is a top view of a light emitting device 1 of a preferred first example of the present invention, and FIG. 2 is a cross-sectional view schematically showing a light emitting unit 2 in the light emitting device 1 of the example shown in FIG. FIG. 3 is a top view schematically showing the insulating substrate 3 of the light emitting device 1 of the example shown in FIG. In the light emitting device 1 of the present invention, a plurality of linear wiring patterns 4 are formed in parallel on an insulating substrate 3, and a plurality of light emitting elements 5 are electrically connected to the wiring patterns 4 between the wiring patterns 4. The light emitting unit 2 is mounted in a connected state and sealed with a sealing body 6. In the light emitting device 1 of the present invention, in particular, by directly mounting the light emitting element 5 on the insulating substrate 3, the withstand voltage between adjacent light emitting elements and between the light emitting elements / electrodes can be increased.

  According to the light emitting device 1 of the present invention, a plurality of light emitting elements 5 are mounted in a state of being electrically connected to the wiring pattern 4 between the plurality of linear wiring patterns 4 formed on the insulating substrate 3. Thus, unlike the conventional case where an insulating layer is formed on a metal substrate, sufficient electrical insulation is achieved. That is, as described above, in the configuration as in the example shown in FIG. 14 of the related art, the printed circuit board 104 provided with the wiring portion 105 is disposed in the immediate vicinity of the metal plate 102 on which the light emitting element is mounted. For this reason, it has been difficult to achieve sufficient electrical insulation. In such a configuration, in order to achieve sufficient electrical insulation without being separated by an insulator, it is necessary to secure a sufficient linear distance d in the horizontal direction between the metal plate 102 and the wiring portion 105. There is. On the other hand, in the light emitting device 1 of the present invention, the wiring pattern 4 is directly formed on the insulating substrate 3, and the light emitting element 5 is directly mounted on the insulating substrate 3, and the bonding wire W is connected to the wiring pattern 4. Since it is used and electrically connected, the light-emitting device can be designed without considering the linear distance described above, and the manufacture is facilitated. In addition, since the light emitting device 1 of the present invention is not configured to form an insulating layer on a metal plate, a process for forming the insulating layer on the metal plate is not necessary in manufacturing, and the manufacturing is easy from this point.

  In addition, when a light emitting device including one light emitting element having a high light emission intensity is caused to emit light, the light emission is a bright spot shape, which is dazzling to the human eye, so that the application is limited. Since the light-emitting device 1 of the present invention includes a plurality of light-emitting elements 5, uniform light emission can be realized without causing bright spot-like light emission, and can be applied to a wide range of applications. In the light emitting device 1 according to the present invention, the mounting positions of the plurality of light emitting elements 5 can be freely set along the linear wiring patterns 4 formed in parallel. The chromaticity can be easily adjusted. Further, in the light emitting device 1, it is possible to easily take a heat dissipation measure by setting the mounting position of the light emitting element 5 so that heat generation of the light emitting element is not concentrated. Furthermore, in the light emitting device 1 of the present invention, the number of light emitting elements mounted can be adjusted, so that the total luminous flux and power consumption can be adjusted according to the desired specifications.

  In the light-emitting device 1 of the present invention, it is preferable that a plurality of light-emitting elements 5 are mounted in a straight line along the wiring pattern with each linear wiring pattern interposed therebetween. The number of wiring patterns in the light emitting device of the present invention is not particularly limited. However, since at least one wiring pattern for anode and one wiring pattern for cathode are required, at least two wiring patterns are required. Yes, preferably in the range of 2-4. In order to obtain a total luminous flux of 300 lm at a current of 350 mA from the light emitting device, 36 light emitting elements are required. In this case, for example, the wiring pattern 4 is formed so as to have four wiring patterns 4a, 4b, 4c, and 4d, twelve wiring patterns 4a and 4b, twelve wiring patterns 4b and 4c, and wiring pattern 4c. , 4d are respectively mounted with 12 light emitting elements 5 (example shown in FIGS. 1 to 3).

  1 to 3 show an example in which the light-emitting device 1 is realized to have a square upper surface shape. In this case, as shown in FIG. 3, a linear wiring pattern is used. 4 is preferably formed so as to be parallel to one of the diagonal lines of the square shape that is the top surface shape of the light emitting device 1. By forming the wiring pattern 4 in this way, the length and interval of the wiring pattern 4 can be sufficiently secured, and a region for fixing a light emitting device and a hole for external wiring, which will be described later, can be formed. There is an advantage that can be secured. Note that the above-described top surface shape of the light emitting device means a shape in a cross section parallel to the substrate surface of the insulating substrate 3.

  Moreover, in the light-emitting device 1 of this invention, it is preferable that each light emitting element 5 mounted on both sides of the wiring pattern 4 is shifted and arrange | positioned so that side surfaces may not oppose. By arranging the light emitting element 5 in this manner, there is an advantage that the luminance becomes uniform and luminance unevenness can be reduced.

  In the light emitting device 1 of the present invention, the light emitting element 5 is preferably a light emitting element having a rectangular top surface shape. Here, the upper surface shape of the light emitting element 5 indicates the shape of the upper surface parallel to the substrate surface of the insulating substrate 3 when mounted on the insulating substrate 3. Specific examples of such a light emitting element 5 having a rectangular top surface include a light emitting element having a short side in the range of 200 to 300 μm and a long side in the range of 400 to 1000 μm. Is done. In the light emitting device 1 of the present invention, when such a light emitting element 5 having a rectangular upper surface shape is used, the direction along the short side of the upper surface shape of the light emitting element 5 is parallel to the longitudinal direction of the wiring pattern 4. It is preferable to be mounted so as to be. Usually, in the light emitting element 5 having a rectangular upper surface shape, since the electrode pad is formed on the short side of the upper surface, the light emission using the bonding wire W can be performed by mounting the light emitting element 5 as described above. Electrical connection between the electrode pad of the element 5 and the wiring pattern 4 can be easily performed, and defects such as cutting of the bonding wire W and peeling of the bonding wire W can be prevented. Moreover, by doing in this way, the advantage that it can adjust easily so that desired light can be obtained by mounting the light emitting element 5 by a desired space | interval and a desired number along the longitudinal direction of the wiring pattern 4 is obtained. There is.

  As described above, the light-emitting element 5 used in the present invention is preferably a light-emitting element having a rectangular upper surface shape, but a normal electrode pad is formed on the short side of the upper surface of the light-emitting element as described above. This facilitates electrical connection with the wiring pattern 4 using the bonding wires W, and the effect of preventing defects such as cutting and peeling of the bonding wires W is particularly remarkable. It is more preferable to use a light emitting element having an upper surface shape. Here, the “long shape” refers to a shape in which the length of the long side is significantly longer than the length of the short side in the top surface shape. For example, the long side is 480 μm and the short side is 240 μm. The light emitting element which has various upper surface shapes is illustrated. In the case of using a light-emitting element having a long upper surface shape, it is preferable to use a light-emitting element in which an electrode pad is provided at the end of the short side (short side) and the electrode pad is opposed.

  In the light emitting device 1 of the present invention, how to electrically connect the plurality of linear wiring patterns 4 arranged in parallel and the plurality of light emitting elements 5 is particularly limited. Instead, the light emitting elements 5 mounted with the linear wiring pattern 4 interposed therebetween may be electrically connected in series or may be electrically connected in parallel. The light emitting elements 5 mounted with the linear wiring pattern 4 interposed therebetween are electrically connected in series, and the light emitting elements 5 mounted linearly along the linear wiring pattern are electrically connected in parallel. May be. Note that it is preferable that the distance between the light emitting element and the electrode is short because the voltage drop due to the resistance of the wiring is minimized. Furthermore, a plurality of light emitting elements arranged in a straight line along the wiring pattern are not electrically connected to the electrodes, but a part of the light emitting elements are simply mounted as spare light emitting elements. It is preferable to keep it. In this manner, when it is found that there is a light emitting element that fails and does not emit light in an inspection process (described later) before sealing the light emitting element with the sealing body, the spare light emitting element is electrically connected to the electrode. To a predetermined brightness.

  In the light emitting device of the present invention, it is also preferable that the wiring pattern further has a pattern for positioning electrical connection with the light emitting element or a pattern for indicating the mounting position of the light emitting element. FIG. 3 shows an example in which four linear wiring patterns 4 formed in parallel are connected with patterns 7. By using this pattern 7 as a guide for positioning the electrical connection between the wiring pattern 4 and the light emitting element 5 or mounting the light emitting element 5, the electrical connection between the light emitting element and the wiring pattern can be achieved. There is an advantage that the connection can be facilitated and that it can also be used as a recognition pattern when using an automation device.

  In the light emitting device 1 of the present invention, the linear distance between the light emitting element 5 and the wiring pattern 4 is preferably 0.1 mm or more, and more preferably 0.5 mm or more. Here, this linear distance means a linear distance between the light emitting element 5 and the wiring pattern 4 in the direction along the substrate surface of the insulating substrate 3. Electrical insulation is reliably achieved because the linear distance is 0.1 mm or more. From the viewpoint of sagging during wire bonding and prevention of cutting of the bonding wire, the linear distance along the horizontal direction between the light emitting element 5 and the wiring pattern 4 is preferably 1.5 mm or less. More preferably, it is 0.0 mm or less.

  In the light emitting device 1 of the present invention, as shown in FIG. 2, the thickness of the wiring pattern 4 is preferably smaller than the thickness of the light emitting element. Thereby, the light emitted from the light emitting element 5 is reduced from being blocked by the light emitted to the outside by the wiring pattern, and the light emitting device 1 that can efficiently emit the light to the outside can be realized. Specifically, the difference between the thickness of the region of the wiring pattern 4 and the thickness of the light emitting element 5 is preferably 0.005 mm or more, and more preferably 0.07 mm or more.

Insulating substrate 3 in the light emitting device 1 of the present invention may be formed of a material having insulation properties, but are not particularly limited, the thermal expansion is small, thermal conductivity is high and the light reflectance Is high, a white ceramic substrate is preferable. Here, “white” refers to the color of an object such that the object reflects almost 100% of visible light of all wavelengths (however, there is no ideal white object having a reflectance of 100%). .) By using a white ceramic substrate as the insulating substrate 3, light emitted from the light emitting element 5 can be reflected by the white ceramic substrate, particularly in the lower surface direction. In addition to being able to be used effectively without loss, it can also be suitably applied to applications that supply a large current as a drive current that requires high heat dissipation and heat resistance. Furthermore, the reliability of the light-emitting element 5 can be improved, and when the sealing body 6 contains a phosphor (described later), deterioration of the phosphor due to heat from the light-emitting element 5 can be suppressed. The chromaticity deviation of the light emitted after wavelength conversion is unlikely to occur. Furthermore, by using a ceramic substrate having a high light reflectivity as described above, there is no need to use silver having a light reflectivity of 90% or more as a substrate material and / or a wiring pattern forming material. Furthermore, there is no problem that silver is further sulfided.

  When using a white ceramic substrate, the light reflectivity is as high as 90% or more, so aluminum oxide (alumina), aluminum nitride, boron nitride, silicon nitride, magnesium oxide, forsterite, steatite, low temperature sintering Any one selected from ceramics or a ceramic substrate formed of these composite materials is preferable. Among these, a white ceramic substrate made of aluminum oxide (alumina), which is inexpensive, has high reflectance, is easy to process, and is widely used as an industrial material, is particularly preferable.

  As the light emitting element 5 used in the light emitting device 1 of the present invention, a light emitting element usually used in this field can be used without any particular limitation. Examples of such a light-emitting element include a gallium nitride compound semiconductor and a ZnO (zinc oxide) compound semiconductor on a substrate such as a sapphire substrate, a ZnO (zinc oxide) substrate, a GaN substrate, a Si substrate, a SiC substrate, and a spinel. Examples thereof include semiconductor light emitting devices such as blue LED (light emitting diode) chips, InGaAlP compound semiconductor LED chips, and AlGaAs compound semiconductor LED chips on which materials such as these are grown. Above all, a single-sided two-electrode structure can be easily formed on an insulating substrate, and a nitride semiconductor with good crystallinity can be formed with high productivity. Therefore, a blue LED in which a gallium nitride compound semiconductor is grown on a sapphire substrate is used as a light emitting element. It is preferable to use as. When such a blue LED is used as a light emitting element, white is obtained by dispersing a phosphor that emits yellow light when excited by light from the semiconductor light emitting element. It is preferable to realize a light emitting device (described later).

  Note that the light-emitting element used in the light-emitting device of the present invention is not limited to blue light emission, and for example, a light-emitting element having a light emission color such as ultraviolet light emission or green light emission may be used. In addition, instead of using a blue LED as a light emitting element and converting the light emitted from the blue LED by a phosphor to obtain white, for example, three colors of red, green, and blue are used without using the phosphor. Of course, the light emitting device may be realized by using each LED chip as a light emitting element so as to obtain a color necessary for illumination such as white.

  The shape of the light-emitting element 5 used in the light-emitting device 1 of the present invention is not particularly limited. However, as described above, the top surface shape is preferably rectangular, and it is long. More preferred. In addition, in the light-emitting device 1 of this invention, it is necessary to use the light emitting element 5 by which the P side electrode and the N side electrode were formed in one surface. Such a light emitting element 5 is mounted between the wiring patterns 4 on the insulating substrate 3 with the surface on which the P-side electrode and the N-side electrode are formed as an upper surface, and is electrically connected to the wiring pattern 4.

  As shown in FIG. 2, the electrical connection between the light emitting element 5 and the wiring pattern 4 is realized by bonding bonding wires W to the wiring pattern 4 for the P-side electrode and the N-side electrode, respectively. As the bonding wire W, any appropriate fine metal wire that has been widely used in the art can be used without particular limitation. Examples of such fine metal wires include gold wires, aluminum wires, copper wires, platinum wires, etc., among which there is little corrosion, moisture resistance, environmental resistance, adhesion, electrical conductivity, thermal conductivity, elongation. It is preferable to use a gold wire as the bonding wire W because the rate is good and a ball can be easily formed.

  In the light emitting device 1 of the present invention, as described above, a plurality of light emitting elements 5 mounted in a state of being electrically connected to the wiring pattern 4 are electrically connected between the wiring patterns 4. Each wire W is sealed with a sealing body 6. The sealing with the sealing body 6 may be performed by forming a plurality of linear sealing bodies so as to include the light emitting elements 5 mounted on both sides along the linear wiring pattern 4. All of the linear wiring pattern and the light emitting element may be sealed with one sealing body. From the viewpoint of reducing unevenness in luminance of the light emitting device and reducing variations in the thickness of the sealing body, all of the linear wiring patterns and light emitting elements on the insulating substrate are used as in the examples shown in FIGS. It is preferable to seal with one sealing body.

  The material (sealing material) for forming the sealing body 6 in the light emitting device 1 of the present invention is not particularly limited as long as it is a light-transmitting material, and has been widely known in the art. It can be formed using any appropriate material. As such a sealing material, for example, a translucent resin material excellent in weather resistance such as an epoxy resin, a urea resin, or a silicone resin, or a translucent inorganic material such as silica sol or glass excellent in light resistance is suitable. Used.

  The sealing body 6 in the present invention can be adjusted so as to obtain desired light, and white, day white, light bulb color and the like can be easily obtained. Therefore, the sealing body 6 preferably contains a phosphor. . Examples of the phosphor include Ce: YAG (cerium activated yttrium, aluminum, garnet) phosphor, Eu: BOSE (europium activated barium / strontium / orthosilicate) phosphor, Eu: SOSE (europium activated strontium / barium / orthosilicate). ) Phosphors, europium activated α sialon phosphors and the like can be suitably used, but are not limited thereto.

  In addition, you may make it make the sealing body 6 in this invention contain a diffusing agent with fluorescent substance. Although it does not restrict | limit especially as a diffusing agent, For example, barium titanate, titanium oxide, aluminum oxide, silicon oxide, calcium carbonate, silicon dioxide etc. are used suitably.

  The sealing body 6 in the present invention can be realized in two layers according to the desired light chromaticity of the light emitting device 1. In this case, as shown in FIG. 2, a first sealing body layer 8 containing the first phosphor and a second phosphor containing the second phosphor laminated on the first sealing body layer 8. It is preferable that the sealing body layer 9 be provided. Thus, by comprising the sealing body 6 by the 1st sealing body layer 8 and the 2nd sealing body layer 9, chromaticity can be adjusted easily and the light-emitting device without a chromaticity shift is favorable. There is an advantage that it can be provided at a low yield with a reasonable yield. As a preferred specific example, methylsilicone is used as the resin material, and Eu: BOSE is dispersed and cured as the first phosphor to form the first encapsulant layer 8, and the first encapsulant layer 8 is formed. The second sealing body layer 9 is formed by covering the sealing body layer 8 using organically modified silicone as the resin material, and dispersing and curing Eu: SOSE as the second phosphor. Cases are illustrated. From the viewpoint of chromaticity misalignment, the second sealing body layer 9 is formed on the first sealing body layer 8 so as to cover at least part of the upper surface of the first sealing body layer 8. It is preferable that the layers are laminated, and it is particularly preferable that the entire surface of the upper surface of the first sealing body layer 8 is covered with the second sealing body layer 9 as shown in FIG. In addition, when the light-emitting device which emits light of desired chromaticity is obtained only by one layer (1st fluorescent substance layer), of course, the sealing body 6 may be implement | achieved by the single layer. Here, even if the boundary between the first sealing body layer 8 containing the first phosphor and the second sealing body layer 9 containing the second phosphor is clearly separated, it is clear. It does not have to be separated.

  The shape of the sealing body 6 in the present invention is not particularly limited, but it is preferable to have a hexagonal shape, a circular shape, a rectangular shape, or a square top surface shape. In FIG. 1 to FIG. 3, the first sealing body layer 8 is formed to have a square top surface shape, and the first sealing body layer 8 has a square shape so as to cover the entire top surface of the first sealing body layer 8. An example in which the second sealing body layer 9 is formed so as to have an upper surface shape is shown. In addition, the upper surface shape of the sealing body 6, the first sealing body layer 8, and the second sealing body layer 9 described above refers to a shape in a cross section parallel to the substrate surface of the insulating substrate 3.

  Here, FIG. 4 is a top view of the light emitting device 21 of the second preferred example of the present invention. The light emitting device 21 of the example shown in FIG. 4 has the same configuration as the light emitting device 1 of the example shown in FIG. 1 except that the top surface shape of the sealing body 22 is circular. The parts having the configuration are denoted by the same reference numerals and description thereof is omitted. As shown in FIG. 4, since the sealing body 22 is realized to have a circular upper surface shape, there is an advantage that the light directivity is good because of the symmetrical shape. For this reason, it is particularly preferable to realize the sealing body 22 so as to have a circular upper surface shape as shown in FIG. 4 among the above-described hexagonal shape, circular shape, rectangular shape, or square shape.

  Moreover, you may make it form the sealing body 6 in the hemisphere which becomes convex upwards. In this case, it becomes possible to give the sealing body 6 a function as a lens.

  The light emitting device 1 of the present invention is not particularly limited as to the overall shape, but is preferably realized to have a hexagonal shape, a circular shape, a rectangular shape, or a square shape. In the case where the light emitting device has a rectangular or square upper surface shape, the light emitting elements can be arranged in close contact with each other, which is particularly preferable when the light emitting device is applied to a fluorescent lamp type LED lamp. In addition, when the light emitting device is applied to a light bulb type LED lamp (described later), it is preferable that the light emitting device is realized to have a circular upper surface shape. 1 and 4 show an example in which the light-emitting device 1 is realized to have a square upper surface shape as described above.

  FIG. 5 is a top view of the light emitting device 31 of the third preferred example of the present invention. The light emitting device 31 in the example shown in FIG. 5 has the hexagonal shape on the top surface of the sealing body 33 and the light emitting device 1 in the example shown in FIG. 1 except that the top surface shape of the light emitting device 31 is circular. The parts having the same configuration are denoted by the same reference numerals, and the description thereof is omitted. Realizing the sealing body 33 to have a hexagonal top surface shape as in the light emitting device 31 of the example shown in FIG. 5 also has an advantage of good light directivity because of the symmetrical shape. In addition, the light emitting device 31 having a circular upper surface shape (using the insulating substrate 32 having a circular upper surface shape) as in the example shown in FIG. 5 can be particularly preferably applied to a light bulb type LED lamp.

  FIG. 6 is a top view of a light emitting device 41 according to a fourth preferred embodiment of the present invention. In the light emitting device 41 of the example illustrated in FIG. 6, the upper surface shape of the sealing body 42 (first sealing body layer 43) is circular, and the second sealing body layer 44 is the first sealing body layer. 5 has the same configuration as that of the light emitting device 31 of the example shown in FIG. 5 except that it is formed so as to cover only a part of the upper surface of 43, and the portions having the same configuration are the same. A description is omitted with reference marks. By realizing the sealing body 42 to have a circular upper surface shape like the light emitting device 41 of the example shown in FIG. 6, there is an advantage that the directivity of light is good because of the symmetrical shape. Further, in the example shown in FIG. 6, the first sealing body layer 43 formed so as to have a circular upper surface shape and the first sealing body layer 43 are formed so as to partially cover the first sealing body layer 43. A sealing body 42 is formed with the second sealing body layer 44. In this way, by forming the second sealing body layer 44 so as to partially cover the first sealing body layer 43, a light emitting device can be obtained by adjusting only a part of the first sealing body layer. There is an advantage that a light emitting device having desired chromaticity characteristics (for example, falling within the range of FIG. 13B showing chromaticity coordinates described later) can be obtained. In such a case, the portion of the first sealing body layer 43 covered with the second sealing body layer 44 is selected according to desired chromaticity characteristics (for example, chromaticity coordinates described later are shown). A portion that does not fall within the range of FIG. 13B). Further, since the light emitting device 41 of the example shown in FIG. 6 has a circular upper surface shape, the light emitting device 41 can be particularly suitably applied to the light bulb type LED lamp as with the light emitting device 31 of the example shown in FIG.

  FIG. 7 is a top view of a light emitting device 51 according to a preferred fifth example of the present invention. In the light emitting device 51 of the example illustrated in FIG. 7, the upper surface shape of the sealing body 52 (first sealing body layer 53) is a square shape, and the second sealing body layer 44 is the first sealing body layer. 5 has the same configuration as that of the light emitting device 31 of the example shown in FIG. 5 except that it is formed so as to cover only a part of the upper surface of 53, and the portions having the same configuration are the same. A description is omitted with reference marks. By realizing the sealing body 52 (first sealing body layer 53) to have a square upper surface shape like the light emitting device 51 of the example shown in FIG. 7, a fixing hole and an external wiring, which will be described later, are realized. There is an advantage that a region where a hole or the like can be formed can be secured. Further, in the example shown in FIG. 7, the first sealing body layer 53 formed so as to have a square top surface shape and the first sealing body layer 53 are partially covered. The sealing body 42 is formed with the second sealing body layer 44, and thereby the same effect as the example shown in FIG. 6 is exhibited. Further, since the light emitting device 51 of the example shown in FIG. 7 has a circular upper surface shape, the light emitting device 51 can be particularly suitably applied to the light bulb type LED lamp, similarly to the light emitting devices 31 and 41 of the examples shown in FIGS. The first sealing body layer 43 and the first sealing body layer 53 contain a first phosphor, and the second sealing body layer 44 contains a second phosphor.

  The light-emitting device of the present invention can provide a light-emitting device that is easy to manufacture and is less likely to cause color misregistration, and is therefore particularly suitable for a backlight light source or an illumination light source for a liquid crystal display. By using the light emitting device of the present invention, the light source having an arbitrary color tone such as a light bulb color including white can be realized.

  The light-emitting device of the present invention usually has a fixing hole for attaching and fixing to a counterpart member in order to provide the above-described use. In the light emitting devices 1 and 21 having a square top surface shape shown in FIGS. 1 and 4, the light emitting devices 1 and 21 are provided so as to penetrate through the insulating substrate 3 at opposite corners of the insulating substrate 3 having a square top surface shape. The case where the fixing holes 11 are arranged diagonally and formed one by one is shown. Further, in the light emitting devices 31, 41, 51 having the circular upper surface shape shown in FIGS. 5 to 7, the notch-shaped fixing hole 34 passes through the center of the insulating substrate 32 having the circular upper surface shape. An example is shown in which they are arranged on a straight line and formed one by one.

  Moreover, in order to use for the use mentioned above, the light-emitting device of this invention is attached and fixed to a counterpart member using a fixing jig. Examples of the fixing jig include a screw that is inserted into the fixing hole 11 having a thread formed on the inner wall and screwed therein, as in the fixing jig 19 shown in FIGS. 1 and 4. The fixing jig may be an adhesive sheet.

  In the light emitting device of the present invention, it is preferable that the light emitting device is fixed using a fixing jig formed of the same material as the insulating substrate. By using a fixing jig made of the same material as the insulating substrate, the thermal expansion coefficient of the insulating substrate and the fixing jig can be made the same, and the insulating substrate is cracked and cracked due to heat warpage. This can be reduced and the yield of the light-emitting device can be improved. Specifically, a fixing jig formed of any one selected from aluminum oxide, aluminum nitride, boron nitride, silicon nitride, magnesium oxide, forsterite, steatite, low-temperature sintered ceramic, or a composite material thereof. Can be suitably used according to the forming material of the insulating substrate.

  Here, FIGS. 8 to 10 show examples in which the light-emitting device of the present invention is applied as a light source for illumination. FIG. 8 is a perspective view showing a case where the light emitting device 1 of the example shown in FIG. 1 is applied to a fluorescent lamp type LED lamp 61. FIG. 9 shows a light emitting device 41 of the example shown in FIG. FIG. 10 is a perspective view showing a case where the present invention is applied to an LED lamp 71 (the second phosphor layer 44 partially covering the first phosphor layer 43 is omitted), and FIG. 10 is shown in FIG. It is sectional drawing which shows the case where the light-emitting device 41 of an example is applied to the light bulb type LED lamp 81. As shown in FIGS. 8 to 10, the light emitting devices 1 and 41 are attached and fixed using fixing jigs 19 in the fixing holes 11 and 34, respectively.

  In the light emitting device of the present invention, as shown in FIGS. 1 and 4 to 7, the positive electrode external connection land 12 and the negative electrode external connection land 13 are directly provided on the insulating substrates 3 and 32. It is preferable that an external connection wiring 14 for electrically connecting the positive electrode external connection land 12 and the negative electrode external connection land 13 and a power source (not shown) is provided.

  Further, the light emitting device of the present invention is formed by forming external wiring holes 15 through the insulating substrates 3 and 32 in the insulating substrates 3 and 32 as shown in FIGS. 1 and 4 to 7 respectively. It is preferable. In the example shown in FIGS. 1 and 4, the insulating substrate 3 having a square top surface shape is arranged so as to be arranged on another diagonal line different from the diagonal line provided with the fixing holes 11 described above. An electrode external connection land 12 and a negative electrode external connection land 13 are provided, and a notched external wiring hole 15 is formed in the vicinity of the center of two opposing sides of the insulating substrate 3. In the example shown in FIGS. 5 to 7, a straight line that passes through a substantially vertical center on a straight line that passes through the center where the fixing hole 34 is formed on the insulating substrate 32 having a circular upper surface shape as described above. A notch-like external wiring hole 15 is formed thereon, and a positive electrode external connection land 12 and a negative electrode external connection land 13 are provided oppositely between the fixing hole 34 and the external wiring hole 15. It has been. 4 to 7, when the fixing hole 34 and the external wiring hole 15 are formed in a cutout shape in the insulating substrate 32 having a circular upper surface shape, it is attached to the mating member. In this state, it also serves as a detent that prevents the light emitting device from rotating in the circumferential direction.

  Further, as shown in FIG. 3, the light emitting device of the present invention electrically connects one end of the wiring pattern 4 to the positive electrode external connection land 12 and the negative electrode external connection land 13 on the insulating substrate 3. Preferably, external lead wiring patterns 16 and 17 are further formed. With such external lead wiring patterns 16 and 17, a positive electrode external connection land 12, an external lead wiring pattern 16, a negative electrode external connection land 13, and an external lead wiring are provided between a power source (not shown) and the wiring pattern 4. Electrical connection can be made via the patterns 17.

  In the light emitting device of the present invention, it is preferable that an inspection pattern is further formed on the insulating substrate. FIG. 3 shows an example in which spot-shaped inspection patterns 18 are formed between the wiring patterns 4a and 4b and between the wiring patterns 4c and 4d. Since the inspection pattern 18 is formed on the insulating substrate 3, the wiring pattern 4a and the wiring pattern 4b, the wiring pattern 4b and the wiring pattern 4c, and the wiring pattern 4c and the wiring pattern 4d are formed. Can be easily inspected through the inspection pattern 18. The inspection pattern 18 can also be used as a recognition pattern when die bonding and wire bonding are performed by an automated apparatus. Note that the pattern for inspection is not limited to the spot shape as shown in FIG. 3, but is a pattern that is electrically connected to the wiring pattern 4b and the wiring pattern 4c and can be applied to the probe. It may be realized.

  The present invention also provides a method for manufacturing a light emitting device. The manufacturing method of the light emitting device of the present invention described above is not particularly limited, but can be preferably manufactured by applying the manufacturing method of the light emitting device of the present invention. The method for manufacturing a light emitting device of the present invention includes a step of forming a plurality of wiring patterns on an insulating substrate, a step of mounting a plurality of light emitting elements between the wiring patterns, and electrically connecting the light emitting elements and the wiring pattern. And a step of placing a silicone rubber sheet having a through hole on the insulating substrate, and a step of forming a sealing body for sealing the light emitting element in the through hole of the silicone rubber sheet. . Here, FIG. 11 is a diagram showing step by step a case where the light emitting device 1 shown in FIG. 1 is manufactured as a preferred example of the method for manufacturing the light emitting device of the present invention. Hereinafter, with reference to FIG. 11, the manufacturing method of the light-emitting device of this invention is demonstrated concretely.

  First, as shown in FIG. 11A, the wiring pattern 4 is formed on the insulating substrate 3. As described above, FIG. 11 shows a case where the light emitting device 1 shown in FIG. 1 is manufactured. As the wiring pattern 4, four linear wiring patterns 4a, 4b, 4c and 4d are arranged in parallel to each other. 3 is formed. As a preferred specific example, a gold film having a thickness of 0.07 mm is formed on a white insulating substrate 3 made of aluminum oxide having a thickness of 1 mm using a sputtering method, and then the wiring patterns 4a and 4b are formed by a photoetching method. , 4c, 4d (width 1 mm, interval 2 mm), but is not limited thereto. As described above, as a pattern 7 for positioning the electrical connection with the light emitting element or as a guide 7 for the mounting position of the light emitting element, a pattern bulging outward from the straight line, external lead wiring patterns 16 and 17, and for inspection In the case of forming a pattern, the photo-etching may be performed by designing the pattern so as to be a desired pattern.

  Next, as shown in FIG. 11B, the light emitting element 5 is mounted between the wiring patterns 4. Here, the light emitting element 5 can be mounted by directly bonding the light emitting element 5 to the insulating substrate 3 using a thermosetting resin such as an epoxy resin, an acrylic resin, or an imide resin. By doing so, the withstand voltage determined by the creeping discharge voltage can be made as high as possible. That is, the withstand voltage between the light emitting elements arranged in the electrode direction is determined by the distance between the light emitting elements and the dielectric constant of the insulating substrate, and the withstand voltage between the light emitting elements and the electrodes is also the same as that of the light emitting elements. It is determined by the shortest distance to the electrode and the dielectric constant of the insulating substrate. As a preferred specific example, the light-emitting element 5 has a short side width of 0.24 mm and a long side of 0.2 mm between the linear wiring patterns 4 a, 4 b, 4 c and 4 d formed in parallel on the insulating substrate 3. Although the case where the LED chip of 48 mm and thickness 0.14 mm is adhere | attached and fixed using an epoxy resin is mentioned, it is not limited to this. Thereafter, as shown in FIG. 11B, the wiring pattern 4 and the light emitting element 5 are electrically connected using wire bonding W according to a desired electrical connection state.

  In the method for manufacturing a light emitting device according to the present invention, after the light emitting element and the wiring pattern are electrically connected as described above, the characteristics of the light emitting element are inspected. It is preferable that the method further includes a step of connecting the spare light emitting element to the wiring pattern. This inspection can be performed, for example, by passing a current through the light emitting element and measuring its light output characteristics. Further, as an appearance inspection, disconnection of the bonding wire W and bonding failure may be performed together.

  Next, as shown in FIG. 11C, a silicone rubber sheet 91 having a through hole 92 is placed on the insulating substrate 3. Here, FIG. 12 is a view schematically showing a preferred example of the silicone rubber sheet 91 used in the method for manufacturing a light emitting device of the present invention. The silicone rubber sheet used in the production method of the present invention has a through hole that becomes a space for forming a sealing body. However, the shape of the through hole is not particularly limited, and is intended to be formed. The thing of the shape according to the upper surface shape of the sealing body to be used can be used. As described above, since the sealing body preferably has a hexagonal shape, a circular shape, a rectangular shape, or a square shape, the through hole of the silicone rubber sheet 91 has a hexagonal shape, a circular shape, a rectangular shape, or a square shape. It is preferable to have an upper surface shape. FIG. 12 shows a silicone rubber sheet 91 having a through hole 92 having a rectangular upper surface shape as an example. Note that the silicone rubber sheet 91 having the through-hole 92 as described above can be used particularly suitably when all of the linear wiring pattern and the light emitting element on the insulating substrate are sealed with one sealing body. However, when a plurality of linear sealing bodies are formed so as to include the light emitting elements 5 mounted on both sides along the linear wiring pattern 4, a plurality of corresponding through holes having a desired shape are provided. A silicone rubber sheet may be used.

  The silicone rubber sheet 91 is preferable because it is easily available and has elasticity because it is made of rubber, and can be provided in close contact with a gap such as a wiring pattern without gaps. In addition, the silicone rubber sheet 91 can prevent leakage of a resin for forming a sealing body, which will be described later, in a state of being provided on the insulating substrate 3, and can be easily removed after the sealing body is formed. It is preferable that an adhesive sheet is bonded, and the adhesive sheet is bonded to the insulating substrate 3 with this adhesive sheet.

  The thickness of the silicone rubber sheet used in the method for manufacturing a light emitting device of the present invention is preferably at least twice the thickness of the first encapsulant layer to be formed. Since the silicone rubber sheet has a thickness that is twice or more the thickness of the first sealing body layer, the silicone rubber sheet can be applied twice to correct the chromaticity deviation, thereby preventing the leakage of the sealing material. is there.

  Next, as illustrated in FIG. 11D, a sealing body 6 that seals the light emitting element 5 is formed in the through hole 92 of the silicone rubber sheet 91. Here, the sealing body 6 preferably contains a phosphor as described above. The sealing body 6 may be formed in either a single layer or a double layer (FIG. 11 shows the case where the light emitting device 1 shown in FIG. The case where the sealing body 6 is formed so as to have the first sealing body layer 8 containing the second sealing body layer 9 containing the second phosphor is shown.

  The step of sealing the light emitting element with this sealing body in the method for manufacturing the light emitting device of the present invention includes the step of injecting a sealing material containing the first phosphor into the through hole of the silicone rubber sheet, Including a step of curing the resin containing the phosphor and forming the first encapsulant layer, and a step of measuring the chromaticity characteristics of the light emitting device after the formation of the first encapsulant layer. preferable.

  In this case, first, a sealing material containing the first phosphor is injected into the through hole 92 of the silicone rubber sheet 91. Here, as the sealing material, for example, as described above, a light-transmitting resin material having excellent weather resistance such as epoxy resin, urea resin, and silicone resin, silica sol having excellent light resistance, and light-transmitting inorganic material such as glass. Materials are preferably used. Further, as described above, for example, Ce: YAG phosphor, Eu: BOSE or Eu: SOSE phosphor, europium activated α sialon phosphor, etc. can be suitably used as the first phosphor. Moreover, the diffusion agent mentioned above may be added to the sealing material.

  Next, the sealing material containing the first phosphor injected into the through hole 92 of the silicone rubber sheet 91 is cured. As a method for curing the sealing material, a conventionally known appropriate method can be used without particular limitation depending on the sealing material to be used. For example, when a silicone resin that is a translucent resin material is used as the sealing material, the sealing material can be cured by thermosetting the silicone resin. Note that a molding resin may be used as the sealing material, and the sealing material may be cured using a mold. The shape of the sealing body (first sealing body layer) formed by curing the sealing material is not particularly limited. For example, by forming the sealing body into a hemispherical shape that protrudes upward. The sealing body may have a function as a lens.

  Next, the chromaticity characteristics of the light emitting device after forming the first sealing body layer as described above are measured. Here, FIG. 13 is a graph showing CIE chromaticity coordinates. The chromaticity characteristics of the light emitting device can be measured by using a measuring device employing a d · 8 (diffuse illumination · 8 ° light receiving method) optical system in accordance with JIS 28722, Condition C, DIN5033tail7 and ISOk772411. For example, the weight ratio of the first phosphor and the silicone resin as the sealing material is 5: 100 so as to emit light with x, y = (0.325, 0.335) in the CIE chromaticity table. When the first sealing body layer is formed by injecting the mixture in the through hole 92 of the silicone rubber sheet 91 and thermosetting at a temperature of 150 ° C. for 30 minutes to form the first sealing body. The chromaticity range of the layer is within the region (a) in FIG. When measuring the chromaticity characteristics of the light emitting device having such a first sealing body layer, the chromaticity range is out of the region (b) in FIG. In such a case, the second sealing body layer is formed on the first sealing body layer so that the chromaticity range of the light emitting device is in the region (b) in FIG.

  In the case of forming the second encapsulant layer, the method for manufacturing the light emitting device of the present invention includes the first method after the step of measuring the chromaticity characteristics of the light emitting device after the formation of the first encapsulant layer described above. A step of injecting a sealing material containing a second phosphor on the sealing body layer, and a step of forming a second sealing body layer by curing the sealing material containing the second phosphor. Preferably, the method further includes a step of measuring chromaticity characteristics of the light emitting device after the formation of the second sealing body layer and a step of removing the silicone rubber sheet. That is, in the same manner as each step of forming the first sealing body layer described above, first, a sealing material containing the second phosphor is injected onto the first sealing body layer and cured. Then, a second encapsulant layer is formed. The second phosphor and the sealing material for forming the second sealing body layer are preferably selected from the first phosphor and the sealing material for forming the first sealing body layer described above. Depending on the chromaticity characteristics to be obtained, it is appropriately selected, and in some cases, a diffusing agent can be further added and used. In the case of the above-described example, for example, the second phosphor and a silicone resin that is a sealing material so that light with x, y = (0.345, 0.35) is obtained in the CIE chromaticity table. Are mixed at a weight ratio of 2: 100 and injected onto the first encapsulant layer and thermally cured at 150 ° C. for 1 hour to form a second encapsulant layer. By doing so, when the chromaticity characteristics of the light emitting device are similarly measured after forming the second sealing body layer, the light emitting device in the chromaticity range in the region (b) in FIG. Can be obtained.

  As described above, in the method for manufacturing a light-emitting device of the present invention, a second encapsulant layer is further formed as necessary, whereby a light-emitting device free from chromaticity deviation is manufactured at a low yield with a low yield. Will be able to. As described above, the second sealing body layer may be formed so as to cover at least part of the upper surface of the first sealing body layer, and covers the entire upper surface of the first sealing body layer. (For example, the example shown in FIGS. 1, 4, and 5), or may be formed so as to partially cover the upper surface of the first sealing body layer (for example, FIG. 6, example shown in FIG.

  Further, for example, the first phosphor and the silicone resin as the sealing material have a weight of 5:80 so as to emit light with x, y = (0.325, 0.335) in the CIE chromaticity table. When the first mixture is injected into the through-hole 92 of the silicone rubber sheet 91 and thermally cured at a temperature of 120 ° C. for 30 minutes to form the first encapsulant layer, etc. When the chromaticity range of the light emitting device after layer formation is measured and the chromaticity range is within the region (b) in FIG. 13, the second encapsulant layer as described above is provided. Further, it is not necessary to form the light-emitting device, and a light-emitting device including the first sealing body layer as it is as a sealing body may be manufactured.

  In the method for manufacturing a light emitting device of the present invention, as described above, after forming the first sealing body layer alone or the first sealing body layer and the second sealing body layer, the silicone rubber sheet 91 is formed. The light emitting device of the present invention described above is provided. As described above, the silicone rubber sheet 91 can be easily removed by adhering a double-sided adhesive sheet on one surface and adhering it to the insulating substrate 3 with this adhesive sheet. The silicone rubber sheet can be used many times.

  1, 21, 31, 41, 51 Light emitting device, 2 Light emitting portion, 3, 32 Insulating substrate, 4 Positioning wiring pattern, 5 Light emitting element, 6, 22, 33, 42, 52 Sealed body, 7 pattern, 8, 43, 53 1st sealing body layer, 9, 44 2nd sealing body layer, 11, 34 Fixing hole, 12 Positive electrode external connection land, 13 Negative electrode external connection land, 14 External connection wiring, 15 External Hole for wiring, 16, 17 External lead wiring pattern, 18 Inspection pattern, 19 Fixing jig, 61, 71 Fluorescent lamp type LED lamp, 81 Light bulb type LED lamp, 91 Silicone rubber sheet, 92 Through hole.

Claims (10)

An insulating substrate formed of an insulating material ;
A light emitting part formed on the upper surface of the insulating substrate;
A sealing body for sealing the light emitting part;
A positive electrode external connection land and a negative electrode external connection land provided on the upper surface of the insulating substrate;
A wiring pattern including a cathode wiring pattern and an anode wiring pattern disposed on the upper surface of the insulating substrate;
The light emitting unit has a plurality of light emitting elements mounted on the insulating substrate,
The light emitting element is mounted between the wiring patterns,
The positive electrode external connection land and the negative electrode external connection land are connected to the anode wiring pattern and the cathode wiring pattern, respectively.
The sealing body includes a first sealing body containing a first phosphor and a second sealing body containing a second phosphor different from the first phosphor ,
The light-emitting device, wherein the positive electrode external connection land and the negative electrode external connection land are opposed to each other with the light-emitting portion interposed therebetween .   The light emitting device according to claim 1, wherein the sealing body has a hexagonal shape, a circular shape, or a rectangular upper surface shape. The light-emitting device according to claim 1, wherein the insulating substrate has a circular or rectangular upper surface shape. The light-emitting device according to claim 1, wherein the insulating substrate includes a polarity display of a positive electrode adjacent to the positive electrode external connection land. The light emitting device according to claim 4, wherein the insulating substrate includes a polarity display of a negative electrode adjacent to the negative electrode external connection land. The light emitting device according to claim 1, wherein the insulating substrate includes a polarity display of a negative electrode adjacent to the negative electrode external connection land. The positive electrode external connection land is electrically connected to the anode wiring pattern, and the negative electrode external connection land is electrically connected to the cathode wiring pattern through an external lead wiring pattern.
The external lead-out wiring pattern includes a first external lead-out wiring pattern formed between the positive electrode external connection land and the anode wiring pattern, and a space between the negative electrode external connection land and the cathode wiring pattern. The light emitting device according to claim 1, further comprising: a second external lead wiring pattern formed on the substrate. 8. The light emitting device according to claim 7, wherein a width of the external lead wiring pattern is smaller than a width of the positive electrode external connection land and the negative electrode external connection land . The light emitting device according to any one of claims 1 to 8, characterized in that said second sealing member is formed on the first sealing body. The light emitting device according to claim 9 , wherein the first sealing body is partially covered with the second sealing body.

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