JP2019111692A - Resin molding apparatus and method of manufacturing resin molded article - Google Patents

Abstract

To provide a resin molding apparatus capable of forming a mold with a small number of components.SOLUTION: A resin molding apparatus of the present invention includes a mold 1000, a temperature raising stage S1, a resin molding stage S2, and an eject stage S4. The mold 1000 includes one mold 200 and the other mold 100. A resin molded product 1b after resin molding can be released from the other mold 100 in a state of being fixed to the one mold 200. At least one of the one mold 200 and the other mold 100 is attachable to and detachable from each stage, and movable between each stage. The temperature raising stage S1 heats the mold 1000. The resin molding stage S2 performs resin molding. The eject stage S4 releases the resin molded product 1b from the mold 1000.SELECTED DRAWING: Figure 4

Description

  The present invention relates to a resin molding apparatus and a method of manufacturing a resin molded article.

  In resin molding, it is a conventional practice to fix and mold a resin mold on one stage of a resin molding apparatus (for example, Patent Document 1 etc.).

Unexamined-Japanese-Patent No. 6-177190

  However, when performing from resin molding to taking out of a resin molded product (mold release) within one stage, for example, it may be necessary to add a part for resin molded product taking out to a molding die. In that case, the number of parts of the mold increases, and the manufacturing cost and the manufacturing period of the mold may increase.

  Then, an object of this invention is to provide the manufacturing method of the resin molding apparatus and resin molded product which can comprise a shaping | molding die with a small number of parts.

In order to achieve the above object, a first resin molding apparatus of the present invention is
Includes mold, heating stage, resin molding stage, and eject stage,
The mold includes one mold and the other mold,
The resin molded article after resin molding can be released from the other mold while being fixed to the one mold,
At least one of the one mold and the other mold is removable from the stages and movable between the stages,
The temperature raising stage raises the temperature of the mold;
The resin molding stage performs resin molding,
The eject stage releases the resin molded product from the mold;
The one mold is characterized by having a resin molded product fixing mechanism for fixing the resin molded product.

Further, to achieve the above object, a second resin molding apparatus of the present invention is:
Includes mold, heating stage, resin molding stage, and eject stage,
The mold includes one mold and the other mold,
The resin molded article after resin molding can be released from the other mold while being fixed to the one mold,
At least one of the one mold and the other mold is removable from the stages and movable between the stages,
The temperature raising stage raises the temperature of the mold;
The resin molding stage performs resin molding,
The eject stage releases the resin molded product from the mold;
In the other mold, in the one mold, the area of the surface facing the other mold and in contact with the resin is larger than the area of the surface facing the one mold and in contact with the resin. It is characterized in that the resin molded product can be released from the other mold while being fixed to the one mold by being large.

  In the following, the first resin molding apparatus of the present invention and the second resin molding apparatus of the present invention may be collectively referred to as "the resin molding apparatus of the present invention".

The first method for producing a resin molded article of the present invention is
Using a mold comprising one mold and the other,
A temperature raising step of raising the temperature of the mold in a temperature raising stage;
A resin molding step of performing resin molding at a resin molding stage;
A first mold release step of releasing a resin molded product after resin molding from the other mold in a state of being fixed to the one mold by a resin molded product fixing mechanism;
A second release step of releasing the resin molded product from the one mold in the eject stage;
It is characterized by including.

The second method for producing a resin molded product of the present invention is
Using a mold comprising one mold and the other,
A temperature raising step of raising the temperature of the mold in a temperature raising stage;
A resin molding step of performing resin molding at a resin molding stage;
A first release step of releasing a resin molded product after resin molding from the other mold in a state of being fixed to the one mold;
A second release step of releasing the resin molded product from the one mold in the eject stage;
Including
In the other mold, in the one mold, the area of the surface facing the other mold and in contact with the resin is larger than the area of the surface facing the one mold and in contact with the resin. Due to the large size, in the first release step, the resin molded product can be released from the other mold while being fixed to the one mold.

  In the following, the first method for producing a resin molded article of the present invention and the second method for producing a resin molded article of the present invention will be collectively referred to as "the method for producing a resin molded article of the present invention". There is a case.

  ADVANTAGE OF THE INVENTION According to this invention, the manufacturing method of the resin molding apparatus which can comprise a shaping | molding die with a small number of parts, and a resin molded product can be provided.

FIG. 1A is a cross-sectional view schematically showing a part of the configuration of the resin molding apparatus of Example 1 and a part of steps in a method of manufacturing a resin molded product using the resin molding apparatus. FIG. 1B is a cross-sectional view schematically showing another configuration of another part of the resin molding apparatus as in FIG. 1A and another step in the same method of manufacturing a resin molded product as in FIG. 1A. FIG. 1C is a cross-sectional view schematically showing a modified example of the resin molding apparatus and the method for producing a resin molded product in Example 1. FIG. 2A is a cross-sectional view schematically showing a part of the configuration of the resin molding device of Example 2 and a part of steps in a method of manufacturing a resin molded product using the resin molding device. FIG. 2B is a cross-sectional view schematically showing another configuration of another part of the resin molding apparatus as in FIG. 2A and another step in the method of manufacturing the resin molded product as in FIG. 2A. FIG. 2C is a cross-sectional view schematically showing still another partial configuration of the same resin molding apparatus as FIG. 2A and still another step in the same method of manufacturing a resin molded product as FIG. 2A. FIG. 3A is a cross-sectional view schematically showing a part of the configuration of the resin molding device of Example 3 and a part of steps in a method of manufacturing a resin molded product using the resin molding device. FIG. 3B is a cross-sectional view schematically showing another configuration of another part of the resin molding apparatus as in FIG. 3A and another step in the method of manufacturing the resin molded product as in FIG. 3A. 3C is a cross-sectional view schematically showing still another partial configuration of the same resin molding apparatus as that of FIG. 3A and still another step of the same method of manufacturing a resin molded product as that of FIG. 3A. FIG. 3D is a cross-sectional view schematically showing still another partial configuration of the same resin molding apparatus as that of FIG. 3A and still another step of the same method of manufacturing a resin molded product as that of FIG. 3A. FIG. 3E is a cross-sectional view schematically showing still another partial configuration of the same resin molding apparatus as that of FIG. 3A and still another step of the same method of manufacturing a resin molded product as that of FIG. 3A. 3F is a cross-sectional view schematically showing still another partial configuration of the same resin molding apparatus as that of FIG. 3A and still another step of the same method of manufacturing a resin molded product as that of FIG. 3A. FIG. 4: is a schematic diagram which shows the outline | summary in an example of the manufacturing method of the resin molding apparatus of this invention, and a resin molded product using the same. FIG. 5 is a cross-sectional view schematically showing a modification of the molding die. FIG. 6 is a view schematically showing another modified example of the molding die. FIG. 6 (a) is a plan view, and FIG. 6 (b) is a cross-sectional view. FIG. 7: is a figure which shows typically an example of a structure of the unnecessary resin part after resin molding. Fig.7 (a) is a side view, FIG.7 (b) is a front view. FIGS. 8A and 8B are schematic views showing an example of the relationship between the form of the plunger and the form of the unnecessary resin portion.

  The invention will now be described in more detail by way of example. However, the present invention is not limited by the following description.

  In the resin molding apparatus according to the present invention, for example, the other mold is fixed to the resin molding stage, and the one mold is attachable to and detachable from each stage, and movable between the stages. May be

  In the resin molding apparatus of the present invention, for example, the resin molding stage further causes the resin molded product to be released from the other mold in a state of being fixed to the one mold, and the eject stage is the resin The molded article may be released from the one of the molds.

  In the resin molding apparatus of the present invention, for example, both of the one mold and the other mold may be detachable from the respective stages and movable between the respective stages.

  In the resin molding apparatus according to the present invention, for example, the eject stage separates the resin molded article from the other mold in a state of being fixed to the one mold, and further, the resin molded article It may be released from the one of the molds.

  The resin molding apparatus of the present invention may further include, for example, a cure stage, and the cure stage may cure the resin in the mold.

The resin molding apparatus of the present invention is, for example,
The fluid resin injection member further includes a fluid resin injection member for injecting the fluid resin into the one mold cavity, and an unnecessary resin portion removal member for removing the unnecessary resin portion cured by the fluid resin.
The fluid resin injection member has at least one of a protrusion and a recess on the contact surface with the fluid resin,
The unnecessary resin portion removing member may have at least one of a convex portion and a concave portion on the contact surface with the unnecessary resin portion.

  The resin molding apparatus of the present invention may further include, for example, a mold opening suppression member for suppressing mold opening between the one mold and the other mold.

  The resin molding apparatus of the present invention may further include, for example, a temperature raising mechanism for raising the temperature of the molding die, and a resin molded product cooling mechanism for cooling the resin molded article.

  In the resin molding apparatus of the present invention, the one mold may or may not have a mold cavity (one mold cavity). In the resin molding apparatus of the present invention, the other mold may or may not have a mold cavity (the other mold cavity). For example, in the resin molding apparatus of the present invention, the one mold may have a mold cavity (one mold cavity), and the other mold may not have a mold cavity. In the resin molding apparatus of the present invention, the one mold may have one mold cavity, and the other mold may have the other mold cavity. That is, in the resin molding apparatus of the present invention, both the one mold and the other mold may have a mold cavity.

  In the said other type | mold in the resin molding apparatus of this invention, the surface opposite to said one type | mold means the surface perpendicular | vertical with respect to the mold opening direction, for example. Further, the surface facing the one mold includes the surface other than the other mold cavity (for example, the surface of the surplus resin accommodating portion, the surface of the resin flow channel, etc.). In the one mold of the resin molding apparatus of the present invention, the surface facing the other mold means, for example, a surface perpendicular to the mold opening direction. In addition, the surface facing the other mold includes the surfaces other than the one mold cavity (for example, the surface of the excess resin accommodating portion, the surface of the resin flow channel, the surface of the runner, etc.).

  In the method for producing a resin molded product of the present invention, for example, the first mold release step may be performed at the resin molding stage.

  In the method for producing a resin molded product of the present invention, for example, the first mold release step may be performed in the ejection stage.

  The method for producing a resin molded product of the present invention may further include, for example, a resin curing step of curing the resin in the mold in the curing stage.

The method for producing a resin molded article of the present invention is, for example,
further,
A flowable resin injection step of injecting a flowable resin into the one mold cavity using a flowable resin injection member;
And an unnecessary resin portion removing step of removing the unnecessary resin portion in which the flowable resin is cured using the unnecessary resin portion removing member,
The fluid resin injection member has at least one of a protrusion and a recess on the contact surface with the fluid resin,
The unnecessary resin portion removing member may have at least one of a convex portion and a concave portion on the contact surface with the unnecessary resin portion.

  In the method for producing a resin molded product of the present invention, for example, in the molding step, the mold opening suppression member may be used to suppress the mold opening between the one mold and the other mold.

  In the method for producing a resin molded product according to the present invention, for example, the temperature of the mold may be raised and the resin molded product may be cooled in the release step.

  In the method of manufacturing a resin molded product of the present invention, the one mold may or may not have a mold cavity (one mold cavity). In the method for producing a resin molded product according to the present invention, the other mold may or may not have a mold cavity (the other mold cavity). For example, in the method for producing a resin molded product of the present invention, the one mold may have a mold cavity (one mold cavity), and the other mold may not have a mold cavity. In the method for producing a resin molded product of the present invention, the one mold may have one mold cavity, and the other mold may have the other mold cavity. That is, in the method of manufacturing a resin molded product of the present invention, both the one mold and the other mold may have a mold cavity.

  In the said other type | mold in the manufacturing method of the resin molded product of this invention, the surface opposite to said one type | mold means the surface perpendicular | vertical with respect to the mold opening direction, for example. Further, the surface facing the one mold includes the surface other than the other mold cavity (for example, the surface of the surplus resin accommodating portion, the surface of the resin flow channel, etc.). In the one mold of the method for producing a resin molded product of the present invention, the surface facing the other mold means, for example, a surface perpendicular to the mold opening direction. In addition, the surface facing the other mold includes the surfaces other than the one mold cavity (for example, the surface of the excess resin accommodating portion, the surface of the resin flow channel, the surface of the runner, etc.).

  The method for producing a resin molded article of the present invention may be performed, for example, using the resin molding apparatus of the present invention.

  In the present invention, the resin molded article is not particularly limited, and may be, for example, a resin molded article obtained by merely molding a resin, or a resin molded article obtained by resin sealing a component such as a chip. In the present invention, the resin molded product may be, for example, an electronic component. Moreover, in the present invention, the resin molded product may be, for example, a finished product or an incomplete semifinished product.

  In the present invention, "resin molding" or "resin sealing" means, for example, that the resin is in a cured (solidified) state. However, in the present invention, “resin molding” or “resin sealing” is not limited to the above meaning, and is, for example, a semi-cured (semi-solidified) state in which the resin is not completely cured (solidified) May be The semi-hardened (semi-solidified) state may be, for example, a state in which the resin is hardened (solidified) to such an extent that it can be released from the mold or to which it can be transported together with the mold.

  In the present invention, the resin material before molding and the resin after molding are not particularly limited, and may be, for example, a thermosetting resin such as an epoxy resin or a silicone resin, or may be a thermoplastic resin. . In addition, a composite material partially containing a thermosetting resin or a thermoplastic resin may be used. In the present invention, examples of the form of the resin material before molding include granular resin, flowable resin, sheet-like resin, tablet-like resin, powder-like resin and the like. In the present invention, the fluid resin is not particularly limited as long as it is a resin having fluidity, and examples thereof include liquid resin and molten resin. In the present invention, the liquid resin means, for example, a resin which is liquid or has fluidity at room temperature. In the present invention, the molten resin means, for example, a resin which has become liquid or has fluidity by melting. The form of the resin may be any other form as long as it can be supplied to the cavity, pot or the like of the mold.

  Also, in general, "electronic component" may refer to a chip before resin sealing and to a state in which the chip is resin sealed, but in the present invention, when simply referred to as "electronic component", Unless otherwise specified, it refers to an electronic component (electronic component as a finished product) in which the chip is resin-sealed. In the present invention, “chip” refers to a chip before resin sealing, and specific examples include a chip such as an IC, a semiconductor chip, or a semiconductor element for power control. In the present invention, the chip before resin sealing is referred to as “chip” for convenience in order to distinguish it from the electronic component after resin sealing. However, the “chip” in the present invention is not particularly limited as long as it is a chip before resin sealing, and may not be in the form of a chip.

  In the present invention, the term "flip chip" refers to an IC chip having a bump-like projecting electrode called a bump on an electrode (bonding pad) on the surface of the IC chip, or to such a chip form. The chip is mounted downward (face down) on a wiring portion such as a printed circuit board. The flip chip is used, for example, as one of chips or mounting methods for wireless bonding.

  In the present invention, for example, both surfaces of the substrate may be resin-molded to manufacture a resin molded product. Further, for example, a resin molded product may be manufactured by resin-sealing (resin molding) components (for example, a chip, a flip chip, etc.) mounted on both sides of a substrate. In the present invention, the substrate (also referred to as an interposer) is not particularly limited, but may be, for example, a lead frame, a wiring substrate, a wafer, a ceramic substrate or the like. For example, as described above, the substrate may be a mounting substrate in which a chip is mounted on one side or both sides thereof. Although the mounting method of the said chip | tip is not specifically limited, For example, a wire bonding, flip chip bonding, etc. are mentioned. In the present invention, for example, the chip may be resin-sealed on both sides of the mounting substrate to manufacture an electronic component in which the chip is resin-sealed. Further, the application of the substrate sealed with the resin sealing device of the present invention is not particularly limited, but for example, a high frequency module substrate for mobile communication terminal, a module substrate for power control, a substrate for device control etc. may be mentioned. .

  Moreover, in the present invention, "mounting" includes "mounting" or "fixing". Furthermore, in the present invention, "placement" includes "fixing".

  Further, in the present invention, the “molding die” is not particularly limited, and is, for example, a die or a ceramic die.

  In the present invention, the method for producing a resin molded product may be any molding method such as transfer molding, injection molding, compression molding and the like. Further, the resin molding apparatus may be, for example, any resin molding apparatus of a compression molding apparatus such as a transfer molding apparatus, an injection molding apparatus, or the like. In Examples 1 to 3 described later, an example of manufacturing a resin molded product by transfer molding using a resin molding apparatus which is a transfer molding apparatus will be described.

  As described above, the resin molding apparatus of the present invention has a stage separate from the resin molding stage, and the mold can be transported into the other stage. The outline | summary in the example is typically shown in FIG. As illustrated, this resin molding apparatus has a temperature rising stage S1, a resin molding stage S2, a cure stage S3, and an eject stage S4. Then, the mold 1000 is moved between the stages in the above order to manufacture the resin molded product 1 b. After that, the mold 1000 can be returned to the temperature raising stage S1 again, and the same method of manufacturing a resin molded product can be performed again. As described above, by using the configuration in which the mold is circulated between the stages, for example, the number of parts of the mold can be reduced, and the production period and cost of the mold can be reduced.

  However, FIG. 4 is merely an example and does not limit the present invention. For example, the curing stage S3 is optional in the resin molding apparatus of the present invention, and may or may not be. In Examples 1 and 2 described later, an example in which the cure stage is not used is shown, and in Example 3 described later, an example in which the cure stage is used is illustrated. Further, the configuration of the mold 1000 of FIG. 4 is also an example, and the configuration of the mold in the resin molding apparatus of the present invention is not limited to this. The mold 1000 of FIG. 4 includes an upper mold (the other mold) 100 and a lower mold (the one mold) 200 as illustrated. The upper mold 100 has an upper mold cavity (the other mold cavity) 101 on the lower surface side, and the lower mold 200 has a lower mold cavity (one mold cavity) 201 on the upper surface side. The lower mold 200 has a cull (excess resin accommodating portion) 202 on the lower surface side. The cull 202 is connected to the lower surface of the lower mold cavity 201 via a gate (resin flow path) 203. In the mold 1000, for example, the upper mold (the other mold) 100 is fixed to the resin molding stage, and only the lower mold (the one mold) 200 can be attached to and detached from the respective stages. It may be movable. Further, in the mold 1000, for example, both the upper mold (the other mold) 100 and the lower mold (the one mold) 200 can be attached to and detached from the stages, and can be moved between the stages May be Further, in the resin molded product 1 b of FIG. 4, both surfaces of the substrate 1 are resin-molded with the resin (hardened resin) 20 respectively. However, the configuration of the resin molded product that can be manufactured in the present invention is not limited to the configuration of the resin molded product 1 b of FIG. 4.

  Hereinafter, specific embodiments of the present invention will be described based on the drawings. Each drawing is schematically drawn with omission, exaggeration, etc. as appropriate for the convenience of description.

  In the present embodiment, an example of a resin molding apparatus and an example of a method of manufacturing a resin molded product using the same will be described.

  In the steps (a) to (f) of FIG. 1A and the steps (g) to (n) of FIG. 1B, a part of the configuration of the resin molding apparatus of this embodiment and a resin molded article using the resin molding apparatus The process in a manufacturing method is shown typically. Moreover, the modification of the manufacturing method of the resin molding apparatus of FIG. 1A and FIG. 1B and a resin molded product is shown to process (l1)-(o1) of FIG. 1C. 1A, FIG. 1B and FIG. 1C are shown by dividing FIG. 1 into three for convenience. Hereinafter, part or all of FIGS. 1A, 1B and 1C may be referred to as “FIG. 1”.

  The resin molding apparatus of the present embodiment includes a molding die, a temperature raising stage, a resin molding stage, and an ejection stage, as described later. Then, as described later, the upper mold (the other mold) in the mold is fixed to the resin molding stage, and the lower mold (the one mold) is detachable from each of the stages, and each of the stages It is possible to move between.

  The manufacturing method of the resin molded product shown to process (a)-(n) of FIG. 1 can be performed as follows. First, as shown in FIG. 1A, the lower mold (one mold) 200 is prepared. As shown, the lower mold 200 has a lower mold cavity (one mold cavity) 201 on the upper surface side. The lower mold 200 also has a cull (excess resin accommodating portion) 202 on the lower surface side. The cull 202 is connected to the lower mold cavity 201 via a gate (resin flow path) 203. The lower die 200 can be attached to and detached from the temperature raising stage, the resin molding stage, and the eject stage, and can be moved between the stages.

  Next, as shown in FIG. 1 (b), the temperature of the lower mold 200 is raised (heating step). Specifically, first, the lower mold 200 is moved to the temperature raising stage. As shown in FIG. 1 (b), the temperature raising stage includes a temperature raising stand 2200. The heating stage has a heater 2201 therein. The heater 2201 is not particularly limited, but may be, for example, a cartridge heater. Then, the substrate (frame) 1 is supplied to the upper surface of the lower mold 200 in a state where the lower mold 200 is placed on the temperature raising stand 2200 as illustrated. Then, in this state, the temperature of the lower mold 200 and the substrate 1 is raised by the temperature raising stand 2200 and the heater 2201. The substrate 1 may be provided with, for example, a through hole (not shown). For example, as described later, the flowable resin can flow from the lower mold cavity (one mold cavity) side to the upper mold cavity (the other mold cavity) side by the through hole of the substrate 1.

  Then, as shown in FIG. 1C, after raising the temperature of the lower mold 200 and the substrate 1, the lower mold 200 and the substrate 1 are moved to the resin molding stage.

  Next, as shown in FIGS. 1 (d) to 1 (i), resin molding is performed on a resin molding stage (resin molding process). Further, in the present embodiment, as described later, in the resin molding stage, the resin after resin molding is fixed to the lower mold (one mold) 200 by the resin molded product fixing mechanism (cal 202 and gate 203). Then, the mold is released from the upper mold (the other mold) 100 (first mold release step).

  As shown in FIG. 1D, a resin molding stage in this resin molding apparatus includes an upper platen (the other platen) 3100 and a lower platen (the one platen) 3200. The upper platen 3100 includes a heater 3101 therein, and the lower platen 3200 includes a heater 3201 therein. The heaters 3101 and 3201 are not particularly limited, but may be, for example, cartridge heaters. As illustrated, the upper platen (the other mold) 100 is fixed to the lower surface of the upper platen 3100. The upper mold 100 has an upper mold cavity (the other mold cavity) 101 on the lower surface side. In addition, the lower platen 3200 has a pot 3204 as illustrated, in which a tablet (resin material) 20a can be accommodated. The resin molding stage further includes a plunger drive mechanism (fluid resin injection member drive mechanism) 3202 and a plunger (fluid resin injection member) 3203, as illustrated. By driving the plunger 3203 by the plunger drive mechanism 3202, as described later, fluid resin can be injected into the lower mold cavity (one mold cavity) 201. Further, as shown in the drawing, the plunger 3203 has a groove (concave portion) 3205 on the contact surface with the flowable resin.

  As shown in FIG. 1D, the lower mold 200 and the substrate 1 are conveyed in the direction of the arrow a1, and moved between the upper platen 3100 and the lower platen 3200 in the resin molding stage. For the conveyance of the lower mold 200, for example, a conveyance mechanism (not shown) may be used. Further, as shown in FIG. 1D, the tablet (resin material) 20 a is supplied to the pot 3204.

  Then, as shown in FIG. 1E, the lower mold 200 is fixed to the lower platen 3200, and the resin material 20a is accommodated in the pot 3204. In this state, it is preferable that the upper mold 100 and the lower mold 200 of the mold 1000 be heated to a moldable temperature.

  Further, as shown in FIG. 1 (f), the upper mold 100 and the lower mold 200 of the mold 1000 are clamped. At this time, as shown in the drawing, the resin material 20a in the pot 3204 is melted by the temperature-rising lower die 200 to form a molten resin (fluid resin) 20b.

  Next, as shown in FIG. 1G, the plunger drive mechanism 3202 raises the plunger 3203 in the direction of the arrow b1. Thereby, as shown, the fluid resin 20b is filled in the lower mold cavity 201 via the cull (unnecessary resin storage portion) 202 and the gate (resin flow path) 203, and the through-hole of the substrate 1 (see FIG. The upper mold cavity 101 is also filled via the not shown). At this time, the presence of the cal 202 and the gate 203 suppresses or prevents changes in the resin pressure in the upper mold cavity 101 and the lower mold cavity 201 even if the volume of the flowable resin 20b varies. it can.

  In addition, the cull (unnecessary resin accommodating portion) 202 and the gate (resin flow path) 203 function as a “resin molded product fixing mechanism” that fixes the resin after resin molding to the lower mold 200 as described later. However, the resin mold in the resin molding apparatus of the present invention is not limited to the form having the resin molding mechanism. For example, in addition to or instead of the resin molding mechanism, the resin molding die in the resin molding apparatus of the present invention is, in the other die, an area of a surface opposite to the one die and in contact with the resin. Also, in the one mold, the area of the surface facing the other mold and in contact with the resin is larger, so that the resin after resin molding is fixed to the one mold in the other. It may be releasable from the mold. Specifically, for example, as shown in FIG. 1 (g), the inclination angle between the side surface 201a of the lower mold cavity (one mold cavity) 201 and the side surface 101a of the upper mold cavity (the other mold cavity) The taper angles may be different. In the same figure, the side surface 101a of the upper mold cavity 101 has a gentle inclination angle and is more horizontal than the side surface 201a of the lower mold cavity 201. Thereby, in upper mold (the other mold) 100, the lower mold (one mold) is opposed to the area of the surface facing the lower mold (one mold) 200 and in contact with the resin (that is, the upper surface of upper mold 100). In 200), the area of the surface facing the upper mold (the other mold) 100 and in contact with the resin (that is, the bottom of the lower mold 200) is larger. That is, in the lower mold 200, the upper mold 100 is perpendicular to the mold opening direction and in contact with the resin than the area of the surface (upper surface of the upper mold 100) perpendicular to the mold opening direction and in contact with the resin. The area of the surface (bottom of the lower mold 200) is larger. Therefore, in the mold 1000 of FIG. 1, the resin molded product is easily fixed to the lower mold 200 when the mold is opened. In the present invention, in the other mold, the area of the surface facing the one mold and in contact with the resin is opposed to the other mold in the one mold and is in contact with the resin. The specific example in which the area of the surface is larger is not limited to this. For example, when the bottom area of one mold cavity is larger than the bottom area of the other mold cavity, the resin molded product may be easily fixed to the one mold cavity. Also, for example, even if the shapes of one mold cavity and the other mold cavity are the same, the resin molded product is fixed to the one mold cavity because the one mold cavity is larger than the other mold cavity. It may be easy.

  Then, as shown in FIG. 1 (h), after the flowable resin 20b is cured (solidified), the upper mold 100 and the lower mold 200 are opened. In addition, the method to harden | cure (solidify) the fluidity resin 20b is not specifically limited, You may use a well-known method suitably. For example, when the flowable resin 20b is a thermosetting resin, the flowable resin 20b may be cured (solidified) by continuing the heating of the upper mold 100 and the lower mold 200. Also, for example, when the flowable resin 20b is a thermoplastic resin, the flowable resin 20b may be cured (solidified) by cooling or allowing the upper mold 100 and the lower mold 200 to cool. In FIG. 1 (h), the flowable resin 20 b in the upper mold cavity 101 and the lower mold cavity 201 is cured to be a cured resin 20. In addition, the resin in the cull (excess resin accommodating portion) 202 and the gate (resin flow path) 203 is cured to form an excess resin (unnecessary resin portion) 20 d. Of the unnecessary resin portion 20d, a portion hardened in the groove (concave portion) 3205 of the plunger is a protruding unnecessary resin portion (protrusion) 20e.

  Here, as illustrated, the shapes of the cull 202 and the gate 203 (resin molded product fixing mechanism) become thinner toward the top. As a result, as shown in FIG. 1 (h), when the mold is opened, the resin molded product (the cured resin 20 and the substrate 1) connected to the unnecessary resin portion 20 d is fixed to the lower mold 200. Only the mold 100 is released from the resin molded product (the cured resin 20 and the substrate 1) (first release step).

  Next, as shown in FIG. 1 (i), the lower die 200 is transported out of the resin molding stage together with the resin molded product and the unnecessary resin portion.

  Furthermore, as shown to FIG. 1 (j)-(l), the unnecessary resin part 20d is removed from a resin molded product in a cull discharge stage (unnecessary resin part removal stage) (unnecessary resin part removal process).

  As shown in FIG. 1 (j), the cull discharge stage (unnecessary resin portion removal stage) of this resin molding apparatus includes a rod (unnecessary resin portion removal member) 4000 for cull discharge. The rod 4000 for discharging the cull has a groove (concave portion) 4001 having the same shape and size as the groove 3205 of the plunger on the contact surface with the unnecessary resin portion 20d.

  As shown in FIG. 1 (j), the cull discharging rod 4000 is raised in the direction of the arrow c1. As a result, as shown in FIG. 1K, the rod 4000 for discharging the cull is brought into contact with the unnecessary resin portion 20d. At this time, as illustrated, the unnecessary resin portion (protrusion) 20 e is fitted into the groove (concave portion) 4001 of the cull discharge rod. In that state, as illustrated, the cull discharge rod 4001 is rotated in the direction of the arrow d1. Thereby, the unnecessary resin portion 20 d is screwed off and separated from the cured resin 20 in the lower mold cavity 201.

  Thereafter, as shown in FIG. 1 (l), the cull discharge rod 4000 is lowered in the direction of the arrow c2. Thereby, as shown in the drawing, the unnecessary resin portions 20 d and 20 e in contact with the cull discharge rod 4000 are lowered and completely separated from the cured resin 20 in the lower die cavity 201. Thereby, as illustrated, the resin molded product 1b in which both surfaces of the substrate 1 are resin-molded by the cured resin 20 is manufactured.

  Next, the lower mold 200 is moved into the eject stage together with the resin molded product 1b. Then, as shown in FIGS. 1 (m) and (n), the resin molded product 1b is released from the lower mold 200 in the eject stage (a second release step).

  As shown in FIG. 1 (m), the eject stage of this resin molding apparatus includes a cooling stand 5000. The cooling stand 5000 has a cooling mechanism (cold runner) 5001 in its inside. Further, the cooling stand 5000 has air supply holes 5002 penetrating from the upper surface to the lower surface of the cooling stand 5000 at positions corresponding to the cal 202 and the gate 203 of the lower mold 200.

  As shown in FIG. 1 (m), the lower mold 200 is placed on a cooling stand 5000 together with the resin molded product 1b. In this state, the lower mold 200 and the resin molded product 1 b are cooled by the cooling table 5000 and the cold runner 5001.

  In the case of the present embodiment, the shrinkage rate due to cooling is larger in the resin molded product (package) 1 b than in the lower mold 200. For this reason, when it cools in the state of FIG. 1 (m), a clearance gap will be between the cured resin 20 of the resin molded product 1b, and the lower mold | type cavity 201. As shown in FIG. Thereby, the resin molded product 1 b can be easily released from the lower mold 200. However, the present invention is not limited to this. For example, in the present invention, in addition to or instead of cooling of the mold, heating (temperature increase) of the mold may be performed in the mold release step of the method for producing a resin molded product. Moreover, in the mold release step, the resin molded product may be cooled or heated (heated). Further, in the release step, the mold and the resin molded product may or may not be cooled or may not be heated (heated), respectively. Further, as described above, in the present embodiment, the shrinkage factor due to cooling is larger in the resin molded product (package) 1 b than in the lower mold 200. However, the present invention is not limited to this, and depending on the coefficient of thermal expansion of the mold and the resin after resin molding, the shrinkage due to cooling may not be as described above. In that case, for example, a method different from that of the present embodiment may be used in the releasing step.

  Further, as shown in FIG. 1 (n), air is supplied from the air supply hole 5002 so as to spray the resin molded product 1b in the direction of arrow x1, that is, from the bottom to the top. The air supply mechanism (not shown) is not particularly limited. For example, an air pump may be used. Thereby, the resin molded product 1 b is released from the lower mold 200.

  In the present embodiment, the resin molded product 1 b can be manufactured as described above.

  Next, FIG. 1C shows a modified example of the method of manufacturing a resin molded product in the present example. In this modification, first, the steps of FIGS. 1 (a) to 1 (l) are performed in the same manner as described above (not shown). Thereafter, the second release step is performed as shown in steps (l1) to (o1) shown in FIG. 1C. Specifically, it is as follows.

  First, FIG. 1 (11) shows the state of the lower mold 200 immediately after the process of FIG. 1 (1). As illustrated, the resin molded product 1 b is placed on the lower mold 200. The unnecessary resin portion 20 b is separated from the resin molded product 1 b and removed. The mold 200 and the resin molded product 1b are moved into the eject stage, and the resin molded product 1b is released from the lower mold 200 as shown in FIGS. 1 (m1) to (o1).

  As shown in FIG. 1 (m1), this eject stage includes a temperature raising stand 5100 instead of the cooling stand 5000. The temperature raising stand 5100 has a heater 5101 inside. The heater 5101 is not particularly limited, but may be, for example, a cartridge heater. Further, the heater 5101 has an air supply hole 5102 penetrating from the upper surface to the lower surface of the heater 5101 at a position corresponding to the cull 202 and the gate 203 of the lower mold 200.

  As shown in FIG. 1 (m1), the lower die 200 is placed on the temperature raising stand 5100 together with the resin molded product 1b. In this state, the temperature of the lower mold 200 and the resin molded product 1b is raised by the temperature raising stand 5100 and the heater 5101 (temperature raising mechanism).

  Then, in that state, as shown in FIG. 1 (n1), the resin molded product 1b is cooled. Specifically, as illustrated, the cooling unit 6001 of the unloader (conveying mechanism) 6000 having the cooling unit (resin molded product cooling mechanism) 6001 is brought into contact with the resin molded product 1 b and cooled. The cooling unit 6001 is not particularly limited, but may be, for example, a Peltier device or the like. Thus, by raising the temperature of the mold (the lower mold 200) and cooling the resin molded product 1b, the lower mold 200 expands and the resin molded product 1b shrinks. Thereby, a gap is created between the cured resin 20 of the resin molded product 1 b and the lower mold cavity 201. Therefore, the resin molded product 1 b can be easily released from the lower mold 200. In that state, as shown in the drawing, air is supplied from the air supply hole 5102 in the direction of the arrow x2, that is, from the bottom to the top, so as to spray the resin molded product 1b. The air supply mechanism (not shown) is not particularly limited. For example, an air pump may be used. Thereby, the resin molded product 1 b is released from the lower mold 200 (second release step).

  Then, as shown in FIG. 1 (o 1), the resin molded product 1 b released from the lower mold 200 is transported by the unloader 6000 out of the eject stage.

  Next, another embodiment of the present invention will be described.

  In the first embodiment, the upper mold (the other mold) 100 is fixed to the resin molding stage, and the lower mold (the one mold) 200 is attachable to and detachable from the respective stages of the resin molding apparatus. An example is shown that is movable. On the other hand, in the present embodiment (Example 2), both the lower mold (one mold) 200 and the upper mold (the other mold) 100 in the mold 1000 can be attached to and detached from the respective stages of the resin molding apparatus. The example which is movable between each said stage is shown.

  In the steps (a) to (f) of FIG. 2A, the steps (g) to (m) of FIG. 2B, and the steps (n) to (s) of FIG. The process in the manufacturing method of the resin molded product using the said resin molding apparatus is shown typically. Further, (q1) in FIG. 2C shows a modified example. 2A, FIG. 2B and FIG. 2C are shown by dividing FIG. 2 into three for convenience. Hereinafter, part or all of FIGS. 2A, 2B and 2C may be referred to as “FIG. 2”.

  The manufacturing method of the resin molded product shown to process (a)-(s) of FIG. 2 can be performed as follows. First, as shown in FIG. 2A, a mold 1000 is prepared. The mold 1000 includes the upper mold (the other mold) 100 and the lower mold (the one mold) 200 as in the first embodiment, and has the same configuration as the first embodiment. Further, as illustrated, the configurations of the upper mold 100 and the lower mold 200 are also the same as in the first embodiment.

  Next, the mold 1000 is moved into the temperature rising stage of the resin molding apparatus, and the temperature of the mold 1000 is raised in the temperature rising stage as shown in FIGS. 2 (b) to 2 (f) (temperature rising process).

  As shown in FIG. 2B, the temperature raising stage of this resin molding apparatus includes an upper platen (the other platen) 2110 and a lower platen (the one platen) 2210. The upper platen 2110 has a heater 2111 therein. The lower platen 2210 has a heater 2211 therein. The heater 2111 and the heater 2211 are not particularly limited, but may be, for example, a cartridge heater.

  First, the lower die 200 is fixed on the lower platen 2210 as shown in FIG. At this time, the upper mold 100 is in a state of being mounted on the lower mold 200. That is, the entire mold 1000 is placed on the lower platen 2210.

  Next, as shown in FIG. 2C, the lower platen 2210 is raised in the direction of the arrow A1. Then, the upper die 100 is fixed to the lower surface of the upper platen 2110 as illustrated. Although the method of fixing the lower mold 200 on the lower platen 2210 and the method of fixing the upper mold 100 to the lower surface of the upper platen 2110 are not particularly limited, for example, even using an electrostatic chuck, a mechanical chuck, etc. Good.

  Further, as shown in FIG. 2D, the lower platen 2210 is lowered in the direction of the arrow B1 to open the mold 1000, and the substrate (frame) 1 is supplied into the mold 1000. Although the substrate 1 is fixed to the lower surface of the upper mold 100 in the same drawing, the present invention is not limited to this. For example, the substrate 1 may be mounted on the upper surface of the lower mold 100. When the substrate 1 is fixed to the lower surface of the upper mold 100 as shown, the method is not particularly limited. For example, an upper mold substrate holding portion (not shown) may be provided on the upper mold 100 to fix the substrate 1. The upper mold substrate holding portion is not particularly limited, but may be, for example, a substrate holding member (substrate clamp) holding the substrate 1. Alternatively, for example, a suction hole may be provided in the upper mold, a suction mechanism (not shown) may be connected to the suction hole, and the substrate 1 may be adsorbed and fixed to the upper mold 100 by suction from the suction hole. . The suction mechanism is also not particularly limited, but may be, for example, a decompression pump. The substrate 1 may be, for example, the same as that of the first embodiment.

  Then, as shown in FIG. 2E, the lower platen 2210 is raised in the direction of the arrow A2 to close the mold 1000. In this state, the heaters 2111 and 2211 may be operated to raise the temperature of the mold 1000 and the substrate 1. Alternatively, before the mold 1000 is placed on the lower platen 2210, the heaters 2111 and 2211 may be operated in advance to raise the temperature of the mold 1000 and the substrate 1.

  Next, the fixation between the lower mold 200 and the lower platen 2210 and the fixation between the upper mold 100 and the upper platen 2110 are released. Then, as shown in FIG. 2F, the lower platen 2210 is lowered to open the lower platen 2210 and the upper platen 2110, and the molding die 1000 is moved to the resin molding stage.

  Next, as shown in FIGS. 2 (g) to 2 (m), resin molding is performed on the resin molding stage (resin molding process).

  As shown in FIG. 2G, the resin molding stage in this resin molding apparatus includes an upper platen (the other platen) 3100 and a lower platen (the one platen) 3210. The upper platen 3100 is the same as the upper platen 3100 of the first embodiment except that the upper mold 100 is not fixed. The upper platen 3100 includes a heater 3101 inside as in the first embodiment. The lower platen 3210 includes a heater 3211 therein. The heaters 3101 and 3211 are not particularly limited, but may be, for example, cartridge heaters. The lower platen 3210 has a pot 3214, as shown, in which a tablet (resin material) 20a can be accommodated. The lower platen 3210 has a resin inlet 3219 connected to the pot 3214 on its side surface. In addition, a heat insulating material may be arrange | positioned and heat-insulated may be arrange | positioned, for example. Further, as illustrated, the resin molding stage in the same drawing further includes a plunger drive mechanism (fluid resin injection member drive mechanism) 3212 and a plunger (fluid resin injection member) 3213. By driving the plunger 3213 by the plunger drive mechanism 3212, as described later, the flowable resin can be injected into the lower mold cavity (one mold cavity) 201. Further, unlike the plunger 3203 of the first embodiment, the plunger 3213 is flat without having a groove (recess) in the contact surface with the flowable resin.

  First, as shown in FIG. 2G, the tablet (resin material) 20a is supplied (charged) to the pot 3214 from the resin charging port 3219 by the resin charging rod 3216. Further, as shown in the drawing, the mold 1000 and the substrate 1 are conveyed in the direction of the arrow a11 and moved between the lower platen 3210 and the upper platen 3100.

  Next, as shown in FIG. 2H, the mold 1000 is fixed to the lower platen 3210. Further, as shown in the figure, the plunger 3213 is raised in the direction of the arrow b11, and the tablet (resin material) 20a is pushed up above the resin insertion port 3219. At this time, since the resin charging rod 3216 remains inserted into the resin charging port 3219, the tablet (resin material) 20a does not spill from the resin charging port 3219. Further, the shape of the resin charging rod 3216 is not particularly limited. For example, when the tip of the resin charging rod 3216 is rounded as shown, when the plunger 3213 is raised in the direction of the arrow b11, the plunger 3213 can be suppressed or prevented from being caught by the tip of the resin charging rod 3216 .

  Next, as shown in FIG. 2I, the lower platen 3210 is raised in the direction of the arrow C1. Thereby, the mold 1000 is clamped by the lower platen 3210 and the upper platen 3100 as illustrated. In this state, the mold 1000 raises the temperature to a temperature at which the resin material 20a can be melted by raising the temperature by the above-mentioned temperature raising stage and raising the temperature through the upper platen 3100 and the lower platen 3210 by the heaters 3101 and 3211. It is done. Thereby, as illustrated, the resin material 20a in the pot 3214 is melted to be a molten resin (fluid resin) 20b.

  Next, as shown in FIG. 2J, the plunger drive mechanism 3212 raises the plunger 3213 in the direction of the arrow b12. As a result, the flowable resin 20 b is filled in the lower mold cavity 201 and the upper mold cavity 101 as illustrated. The mechanism by which the flowable resin 20 b is filled in the lower mold cavity 201 and the upper mold cavity 101 is, for example, the same as that of the first embodiment.

  Then, as shown in FIG. 2 (k), the flowable resin 20b is cured (solidified) to form the cured resin 20 and the unnecessary resin portion 20d as in the first embodiment. The method of curing (solidifying) the flowable resin 20b is, for example, the same as that of the first embodiment. Thereafter, as shown, the lower platen 3210 is lowered in the direction of the arrow D1, and the upper mold 100 and the upper platen 3100 are released.

  Next, as shown in FIG. 2L, the mold 1000 is lifted in the direction of arrow E1 together with the resin molded product 1b (substrate 1 and cured resin 20) by a transport mechanism (not shown) or the like. At this time, as illustrated, the unnecessary resin portion 20 d remains on the lower platen 3210 and is separated from the resin molded product 1 b. This is set such that the bottom surface of the unnecessary resin portion 20d (the surface where the lower platen 3210 and the plunger 3213 and the unnecessary resin portion 20d contact) is larger than the surface where the unnecessary resin portion 20d and the cured resin 20 contact. In addition, this is because the shapes of the cull 202 and the gate 203 are set to a tapered shape that spreads in the direction of the bottom surface of the unnecessary resin portion 20d. Then, as shown in the drawing, the molding die 1000 is moved together with the resin molded product 1b in the direction of the arrow a12, conveyed out of the molding stage, and moved into the ejection stage.

  On the other hand, as shown in FIG. 2 (m), the plunger 3213 is lowered in the direction of the arrow b13 to separate it from the unnecessary resin portion 20d. The unnecessary resin portion 20d is transported out of the molding stage by a transport mechanism (not shown) or the like and discharged.

  Furthermore, as shown in FIG. 2 (n) to (s), the resin molded product 1b is released from the mold 1000 in the eject stage. In this process, as described later, a first mold release process of releasing the cured resin 20 after resin molding from the upper mold (the other mold) 100 in a state of being fixed to the lower mold (the one mold) And a second release step of releasing the resin molded product 1b from the mold 1000 (lower die 200) in the eject stage.

  As shown in FIG. 2 (n), an eject stage placed in this resin molding apparatus includes a cooling stand 5000 and an upper die lifting mechanism (upper die lifting part) 7000. Similar to the first embodiment, the cooling table 5000 has a cooling mechanism (cold runner) 5001 and an air supply hole 5002, and has the same configuration as the cooling table 5000 of the first embodiment.

  Further, as shown in FIG. 2 (n), in the mold 1000, the side surface 101a of the upper mold cavity 101 has a gentle inclination angle and is more horizontal than the side surface 201a of the lower mold cavity 201. . As a result, the resin molded product is more easily fixed to the lower mold 200 than the upper mold 100. Therefore, as described later, the cured resin 20 after resin molding can be released from the upper mold (the other mold) 100 in a state where it is fixed to the lower mold (the one mold) 200.

  As shown in FIG. 2 (n), the mold release process (the first mold release process and the second mold release process) of FIG. Fix on top. In this state, the mold 1000 and the resin molded product 1 b are cooled by the cooling stand 5000 and the cold runner 5001. At this time, as in the first embodiment, the shrinkage factor due to cooling is larger in the resin molded product (package) 1 b than in the lower mold 200. For this reason, when it cools in the state of FIG. 2 (n), a clearance gap will be between the cured resin 20 of the resin molded product 1b and the upper mold cavity 101, and between the cured resin 20 and the lower mold cavity 201. Thereby, the resin molded product 1 b can be easily released from the molding die 1000. However, as described in the first embodiment, the present invention is not limited to this.

  Then, as shown in FIG. 2 (n), the upper die lifting mechanism 7000 is lowered in the direction of the arrow F1. Thereby, as shown in FIG. 2 (o), the upper die 100 is brought into contact with the lower surface of the upper die lifting mechanism 7000 and fixed. Further, as shown in FIG. 2 (o), the upper die lifting mechanism 7000 is lifted in the direction of the arrow F2. Thereby, the upper mold 100 is lifted as shown in FIG. At this time, as described above, since the side surface 101a of the upper mold cavity 101 has a gentler inclination angle than the side surface 201a of the lower mold cavity 201, the resin molded product 1b is easily fixed to the lower mold 200. . Also, as shown, the bottom of the lower mold cavity 201 (in the lower mold cavity 201) is smaller than the area of the upper surface of the upper mold cavity 101 (the surface facing the lower mold 200 in the upper mold cavity 101 and perpendicular to the mold opening direction). Since the area of the surface facing the upper mold 100 and perpendicular to the mold opening direction is larger, the cured resin 20a on the lower mold 200 side is more easily fixed than the cured resin 20a on the upper mold 100 side. As a result, the resin molded product 1 b is easily fixed to the lower mold 200. Therefore, as shown in FIG. 2 (p), the cured resin 20 after resin molding can be released from the upper mold (the other mold) 100 in a state of being fixed to the lower mold (one mold) 200 ( First release step).

  Further, as shown in FIG. 2 (q), air is supplied from the air supply hole 5002 so as to spray the resin molded product 1b in the direction of the arrow x11, that is, from the bottom to the top. The air supply mechanism (not shown) is not particularly limited. For example, an air pump may be used. Thereby, the resin molded product 1 b is released from the lower mold 200 (second release step). Thereafter, the resin molded product 1b is transported to the outside of the eject stage by an unloader (transport mechanism, not shown) or the like. As described above, the resin molded product 1 b can be manufactured.

  On the other hand, after transporting the resin molded product 1b out of the eject stage, the upper die lifting mechanism 7000 is lowered. Then, as shown in FIG. 2 (r), the upper mold 100 and the lower mold 200 are clamped again.

  Thereafter, only the upper die lifting mechanism 7000 is lifted and separated from the upper die 100 as shown in FIG. 2 (s). Thereafter, the forming die 1000 is transferred out of the eject stage by a transfer mechanism (not shown) or the like. The molding die 1000 can be transported to the temperature raising stage again, and the method of manufacturing a resin molded article can be performed again by the same process as in FIGS. 2 (a) to 2 (s).

  As a modification of the eject stage and the mold release process (the first mold release process and the second mold release process) shown in FIGS. 2 (n) to 2 (s), as shown in FIG. 2 (q1), Instead of the cooling stand 5000, the temperature raising stand 5100 and the cooling unit 6001 may be used. Similarly to the first embodiment, the temperature raising stand 5100 shown in FIG. 2 (q1) has a heater 5101 and an air supply hole 5102, and has the same configuration as the temperature elevation stand 5100 of the first embodiment. Further, the unloader (transport mechanism) 6000 shown in FIG. 2 (q1) has a cooling unit 6001 similarly to the first embodiment, and has the same configuration as the unloader (transport mechanism) 6000 of the first embodiment. First, the same steps as in FIG. 2 (n) to (p) are performed except that the temperature raising stand 5001 is used instead of the cooling stand 5000. Thereafter, as shown in FIG. 2 (q1), the cooling unit 6001 of the unloader (conveying mechanism) 6000 is brought into contact with the resin molded product 1b and cooled. As described above, by raising the temperature of the mold (the lower mold 200) and cooling the resin molded product 1b, the lower mold 200 expands and the resin molded product 1b shrinks. Thereby, a gap is created between the cured resin 20 of the resin molded product 1 b and the lower mold cavity 201. Therefore, the resin molded product 1 b can be easily released from the lower mold 200. In that state, as shown in the figure, air is supplied from the air supply hole 5102 in the direction of arrow x11, that is, from the bottom to the top, so as to spray the resin molded product 1b. The air supply mechanism (not shown) is not particularly limited. For example, an air pump may be used. Thereby, the resin molded product 1 b is released from the lower mold 200 (second release step). Thereafter, the resin molded product 1b released from the lower mold 200 is transported by the unloader 6000 out of the eject stage (not shown).

  Next, still another embodiment of the present invention will be described.

  In the present embodiment, an example using a cure stage will be further described. Furthermore, an example using a mold opening suppression member is also described.

  Steps (a) to (z2) in FIGS. 3A to 3F schematically show a part of the configuration of the resin molding apparatus according to the present embodiment and steps in a method of manufacturing a resin molded product using the resin molding apparatus. . 3A to 3F are illustrated by dividing FIG. 3 into six for convenience. Hereinafter, some or all of FIGS. 3A to 3F may be referred to as “FIG. 3”.

  The manufacturing method of the resin molded product shown to process (a)-(z 2) of FIG. 3 can be performed as follows. First, as shown in FIG. 3A, a molding die 1010 is prepared. As shown, the mold 1010 includes an upper mold (the other mold) 110 and a lower mold (the one mold) 210. The upper mold 110 has an upper mold cavity (the other mold cavity) 111 on the lower surface side, and the lower mold 210 has a lower mold cavity (one mold cavity) 211 on the upper surface side. The lower mold 210 has a cull (excess resin accommodating portion) 212 on the lower surface side. Also, the lower mold 210 has a runner 214 on the upper surface side. The cull 212 is connected to the lower surface of the runner 214 via the first gate (resin channel) 213. The runner 214 is connected to the side surface of the lower mold cavity 211 via the second gate (resin flow path) 215. Further, the upper mold 110 and the lower mold 210 respectively have grooves (mold opening suppressing member mounting grooves) 119 and 219 on the side surfaces of the left and right ends thereof.

  Next, the molding die 1010 is moved into the temperature raising stage of the resin molding apparatus, and as shown in FIGS. 3B to 3F, the temperature of the molding die 1010 is raised in the temperature raising stage (temperature raising step).

  As shown in FIG. 3B, the temperature raising stage of this resin molding apparatus includes an upper platen (the other platen) 2110 and a lower platen (the one platen) 2210. Similar to the second embodiment, the upper platen 2110 includes the heater 2111 therein, and the lower platen 2210 includes the heater 2211 therein.

  First, as shown in FIG. 3B, the lower mold 210 is fixed on the lower platen 2210. At this time, the upper mold 110 is placed on the lower mold 210. That is, the entire forming die 1010 is placed on the lower platen 2210.

  Next, as shown in FIG. 3C, the lower platen 2210 is raised in the direction of the arrow A11. Then, the upper mold 110 is fixed to the lower surface of the upper platen 2110 as illustrated. Although the method of fixing the lower mold 210 on the lower platen 2210 and the method of fixing the upper mold 110 to the lower surface of the upper platen 2110 are not particularly limited, for example, even using an electrostatic chuck, a mechanical chuck, etc. Good.

  Further, as shown in FIG. 3D, the lower platen 2210 is lowered in the direction of the arrow B11 to open the mold 1010, and the substrate (frame) 1 is supplied into the mold 1010. Although the substrate 1 is placed on the upper surface of the lower mold 110 in the same drawing, the present invention is not limited to this, and for example, the substrate 1 may be fixed to the lower surface of the upper mold 110. The substrate 1 may be, for example, the same as in the first and second embodiments.

  Then, as shown in FIG. 3E, the lower platen 2210 is raised in the direction of arrow A12 to close the mold 1010. In this state, the heaters 2111 and 2211 may be operated to raise the temperature of the mold 1010 and the substrate 1. Alternatively, before the mold 1000 is placed on the lower platen 2210, the heaters 2111 and 2211 may be operated in advance to raise the temperature of the mold 1000 and the substrate 1.

  Next, the fixation between the lower mold 210 and the lower platen 2210 and the fixation between the upper mold 110 and the upper platen 2110 are released. Then, as shown in FIG. 3F, the lower platen 2210 is lowered to open the lower platen 2210 and the upper platen 2110, and the molding die 1010 is moved to the resin molding stage.

  Next, as shown in FIGS. 3 (g) to 3 (n), resin molding is performed at the resin molding stage (resin molding process).

  As shown in FIG. 3G, the resin molding stage in this resin molding apparatus includes an upper platen (the other platen) 3120 and a lower platen (the one platen) 3220. The upper platen 3120 includes a heater 3121 therein. The lower platen 3220 includes a heater 3221 therein. The heaters 3121 and 3221 are not particularly limited, but may be, for example, cartridge heaters. The lower platen 3220 has a pot 3224 as shown, and can accommodate the tablet (resin material) 20a therein. The lower platen 3220 has a resin inlet 3229 connected to the pot 3224 on its side surface. In addition, a heat insulating material may be arrange | positioned and heat-insulated may be arrange | positioned, for example. Further, as illustrated, the resin molding stage in the same figure further includes a plunger drive mechanism (fluid resin injection member drive mechanism) 3222 and a plunger (fluid resin injection member) 3223. By driving the plunger 3223 by the plunger drive mechanism 3222, as described later, fluid resin can be injected into the lower mold cavity (one mold cavity) 211. Further, as shown in the drawing, the plunger 3223 has a groove (concave portion) 3225 in the contact surface with the flowable resin.

  First, as shown in FIG. 3G, the tablet (resin material) 20a is supplied (charged) to the pot 3224 from the resin charging port 3229 by the resin charging rod 3226. Further, as shown in the drawing, the molding die 1010 and the substrate 1 are conveyed in the direction of the arrow a 22 and moved between the lower platen 3220 and the upper platen 3120.

  Next, as shown in FIG. 3H, the mold 1010 is fixed to the lower platen 3220. Further, as shown in the figure, the plunger 3213 is raised in the direction of the arrow b21, and the tablet (resin material) 20a is pushed up above the resin insertion port 3229. At this time, since the resin charging rod 3226 remains inserted into the resin charging port 3229, the tablet (resin material) 20a does not spill from the resin charging port 3229. Further, the shape of the resin feeding rod 3226 is not particularly limited. For example, when the tip of the resin charging rod 3226 is rounded as shown, when the plunger 3223 is raised in the direction of the arrow b21, the plunger 3223 can be suppressed or prevented from being caught by the tip of the resin charging rod 3226 .

  Next, as shown in FIG. 3I, the lower platen 3220 is raised in the direction of the arrow C11. This clamps the mold 1010 with the lower platen 3220 and the upper platen 3120 as shown. In this state, the molding die 1010 raises the temperature to a temperature at which the resin material 20a can be melted by raising the temperature by the above-described temperature raising stage and raising the temperature via the upper platen 3120 and the lower platen 3220 by the heaters 3121 and 3221. It is done. Thereby, the resin material 20a in the pot 3224 is melted and becomes a molten resin (fluid resin).

  Next, as shown in FIG. 3 (j), the plunger 3223 is raised by the plunger drive mechanism 3222 in the direction of the arrow b22. Thereby, as shown in the drawing, the molten resin (fluid resin) 20 b is filled in the lower mold cavity 211 and the upper mold cavity 111. Specifically, the flowable resin 20b flows in the above order in the inside of the cull (unnecessary resin storage portion) 212, the first gate (resin flow path) 213, the runner 214, and the second gate (resin flow path) 215. , Lower mold cavity 211 is filled. Furthermore, the flowable resin 20 b is also filled into the upper mold cavity 111 through the through hole (not shown) of the substrate 1. At this time, due to the presence of the cull (unnecessary resin storage portion) 212, the first gate (resin flow channel) 213, the runner 214 and the second gate (resin flow channel) 215, the volume of the flowable resin 20b varies. Even in this case, changes in resin pressure in the upper mold cavity 111 and the lower mold cavity 211 can be suppressed or prevented.

  The runner 214 and the second gate (resin flow path) 215 function as a “resin molded product fixing mechanism” that fixes the resin after resin molding to the lower mold 210 as described later.

  Next, as shown in FIG. 3 (k), the mold opening suppressing members 300 are prepared one by one on the left and right. As illustrated, the mold opening suppressing member 300 has a U-shaped shape, and the tip thereof can be inserted into the groove (mold opening suppressing member mounting groove) 219 of the upper mold 110 and the lower mold 210. As shown in FIG. 3 (k), the left and right mold opening suppressing members 300 are moved in the direction of the arrow e1 (that is, toward the molding die 1010). Then, as shown in FIG. 3L, the tip of the mold opening suppressing member 300 is inserted and mounted in the groove (mold opening suppressing member mounting groove) 219 of the upper mold 110 and the lower mold 210. Thereby, the upper mold 110 and the lower mold 210 can be suppressed or prevented from opening.

  Then, as shown in FIG. 3 (m), the flowable resin 20b is cured (solidified) to form a cured resin 20 and unnecessary resin portions 20d, 20e and 20f. As illustrated, the resin cured in the upper mold cavity 111 and the lower mold cavity 211 is taken as a cured resin 20. The resin cured in the cull (surplus resin storage portion) 212 and the first gate (resin flow path) 213 is designated as a surplus resin (unnecessary resin portion) 20 d. The resin cured in the groove (concave portion) 3225 of the plunger is used as a projection-like unnecessary resin portion (projection) 20 e. Then, the resin cured in the runner 214 and the second gate (resin flow path) 215 is set as a surplus resin (unnecessary resin portion) 20 f. The method for curing (solidifying) the flowable resin 20b is, for example, the same as in Examples 1 and 2. In the present embodiment, as described later, curing of the resin is further advanced using a curing stage. Therefore, in the stage of FIG. 3 (m) and (n) (within the resin molding stage), the cured resin 20 and the unnecessary resin portions 20 d, 20 e and 20 f are cured (solidified) to a extent that they can be transported together with the molding die 1100. If it is Thereafter, the upper mold 110 and the upper platen 3120 are unlocked, and the lower platen 3220 is lowered to separate the upper mold 110 and the upper platen 3120 as illustrated.

  Next, as shown in FIG. 3 (n), an arrow together with the resin molded product 1b (the substrate 1 and the cured resin 20) and the unnecessary resin portions 20d, 20e and 20f by the conveyance mechanism (not shown) or the like. Lift in the direction of E11. Then, as shown in the drawing, the molding die 1100 is moved together with the resin molded product 1b and the unnecessary resin portions 20d, 20e and 20f in the direction of arrow a23 to be transported out of the molding stage and moved into the curing stage.

  Next, as shown in FIGS. 3 (o) and 3 (p), the resin in the molding die 1100 is cured in a curing stage (resin curing step).

  As shown in FIG. 3 (o), the curing stage in this resin molding apparatus includes a temperature raising stand 8000. The temperature raising stand 8000 has a heater 8001 therein. The heater 8001 is not particularly limited, but may be, for example, a cartridge heater. In addition, the temperature raising stand 8000 has a relief groove 8002 at a position corresponding to the unnecessary resin portions 20 d and 20 e at the upper part thereof.

  As shown in FIG. 3O, the molding die 1100 is placed on the temperature raising stand 8000 together with the resin molded product 1b and the unnecessary resin portions 20d, 20e and 20f. At this time, the protrusion 20 e of the unnecessary resin portion is accommodated in the relief groove 8002. Then, the temperature of the molding die 1010 is raised by the heater 8001 via the temperature raising stand 8000. This further accelerates the curing of the cured resin 20 and the unnecessary resin portions 20d, 20e and 20f, to such an extent that the cured resin 20 and the unnecessary resin portions 20d, 20e and 20f can maintain their shapes even when the mold 1010 is opened. Cure.

  Thereafter, as shown in FIG. 3 (p), the molding die 1100 is lifted in the direction of the arrow E12 together with the resin molded product 1b and the unnecessary resin portions 20d, 20e and 20f by a transport mechanism (not shown) or the like. Further, the molding die 1100 is moved together with the resin molded product 1b and the unnecessary resin portions 20d, 20e and 20f in the direction of the arrow a24 (that is, out of the curing stage), and the cull discharging stage (unnecessary resin portion removing stage) Transport inside.

  Further, as shown in FIGS. 3Q to 3S, the unnecessary resin portion 20d is removed from the resin molded product in the cull discharge stage (the unnecessary resin portion removing stage).

  As shown in FIG. 3Q, the cull discharge stage (unnecessary resin portion removal stage) of this resin molding apparatus includes a rod (unnecessary resin portion removal member) 4000 for cull discharge. Similar to the first embodiment, the cull discharge rod 4000 has a groove (concave portion) 4001 having the same shape and size as the groove 3225 of the plunger on the contact surface with the unnecessary resin portion 20d.

  As shown in FIG. 3 (q), the cull discharging rod 4000 is raised in the direction of the arrow c21. Thereby, as shown in FIG. 3 (r), the rod 4000 for discharging the cull is brought into contact with the unnecessary resin portion 20d. At this time, as illustrated, the unnecessary resin portion (protrusion) 20 e is fitted into the groove (concave portion) 4001 of the cull discharge rod. In that state, as illustrated, the cull discharge rod 4001 is rotated in the direction of the arrow d21. Thereby, the unnecessary resin portion 20 d is screwed off and separated from the unnecessary resin portion 20 f in the lower die cavity 211.

  Thereafter, as shown in FIG. 3 (s), the cull discharging rod 4000 is lowered in the direction of the arrow c22. As a result, the unnecessary resin portions 20 d and 20 e in contact with the cull discharge rod 4000 are lowered as shown in the figure, and are completely separated from the unnecessary resin portion 20 f in the lower die cavity 201. Furthermore, as illustrated, the molding die 1100 is moved together with the resin molded product 1b and the unnecessary resin portion 20f in the direction of arrow a25 (that is, out of the cull discharge stage) by a transport mechanism (not shown) or the like. , Transport into the eject stage.

  Furthermore, as shown in FIGS. 3 (t) to (z2), the resin molded product 1b is released from the molding die 1010 in the eject stage (releasing step). As described later, in this release step, a first release step of releasing the cured resin 20 from the upper mold (the other mold) 110 in a state of being fixed to the lower mold (the one mold) 210; And a second release step of releasing the resin molded product 1b from the forming die 1010 (lower die 200) in the eject stage.

  As shown in FIG. 3 (t), the eject stage placed in this resin molding apparatus includes a cooling table 5010 and an upper die lifting mechanism (upper die lifting part) 7000. The cooling stand 5010 has a cooling mechanism (cold runner) 5011 therein. Further, the cooling table 5010 has air supply holes 5012 penetrating from the upper surface to the lower surface of the cooling table 5010 at positions corresponding to the cull 212 and the gate 213 of the lower mold 210.

  In the releasing step (first releasing step and second releasing step) of FIG. 3 (t) to (z2), first, as shown in FIG. Fix on top. In this state, the molding die 1010 and the resin molded product 1 b are cooled by the cooling stand 5010 and the cold runner 5011. This method is not particularly limited. For example, as illustrated, the eject stage may further include a coolant supply mechanism 5200 and a pipe (pipe for cooling liquid supply) 5201. Then, the cooling table 5010 may be cooled by supplying the cooling liquid from the cooling liquid supply mechanism 5200 to the cold runner 5011 via the pipe 5201 and circulating it. At this time, as in the first and second embodiments, the contraction rate due to cooling is larger in the resin molded product (package) 1 b than in the lower mold 210. For this reason, when it cools in the state of FIG. 3 (t), a clearance gap will be between the cured resin 20 of the resin molded product 1b and the upper mold cavity 111, and between the cured resin 20 and the lower mold cavity 211. Thus, the resin molded product 1 b can be easily released from the molding die 1010. However, as described in the first and second embodiments, the present invention is not limited to this.

  Next, as shown in FIG. 3 (u), the left and right mold opening suppressing members 300 are moved in the direction of arrow e2 (that is, in the direction away from the molding die 1010) and removed from the molding die 1010.

  Then, as shown in FIG. 3 (v), the upper die lifting mechanism 7000 is lowered in the direction of the arrow F11. Thereby, as shown in FIG. 3 (w), the upper mold 110 is brought into contact with the lower surface of the upper mold lifting mechanism 7000 and fixed. Furthermore, as shown in FIG. 3 (w), the upper die lifting mechanism 7000 is lifted in the direction of the arrow F12. Thereby, as shown in FIG. 3 (x), the upper mold 110 is lifted. At this time, since the unnecessary resin portion 20 f remains in the runner 214 and the second gate 215, the resin molded product 1 b is easily fixed to the lower mold 210. In other words, in the mold 1010 of the present embodiment, since the lower mold (one mold) 210 includes the runner 214 and the second gate 215, the lower mold (one mold) is formed in the upper mold (the other mold) 110. The lower mold (one mold) 210 is opposed to the upper mold (the other mold) 110 and the resin with the area of the surface facing the 210 and in contact with the resin (ie, the upper surface of the upper mold 110). The area of the contacting surface (i.e., the bottom of the lower mold 210) is larger. That is, since the lower mold (one mold) 210 has the runner 214 and the second gate 215, the area of the surface (upper surface of the upper mold 110) perpendicular to the mold opening direction and in contact with the resin in the upper mold 110. Rather, in the lower mold 210, the area of the surface (bottom of the lower mold 210) that is perpendicular to the mold opening direction and in contact with the resin is larger. Therefore, as shown in FIG. 3 (x), the cured resin 20 after resin molding can be released from the upper mold (the other mold) 110 in a state where it is fixed to the lower mold (the one mold) First release step).

  Further, as shown in FIG. 3 (y), air is supplied from the air supply hole 5012 so as to spray the resin molded product 1b in the direction of the arrow x21, that is, from the bottom to the top. Specifically, for example, as illustrated, the air may be supplied by the air supply mechanism 5300 via the pipe (air supply pipe) 5301. The air supply mechanism 5300 is not particularly limited, but for example, an air pump may be used. Thereby, the resin molded product 1 b is released from the lower mold 210 (second release step). Thereafter, the resin molded product 1b is transported to the outside of the eject stage by an unloader (transport mechanism, not shown) or the like. As described above, the resin molded product 1 b can be manufactured. The unnecessary resin portion 20f may be separated from the resin molded product 1b at another stage, for example.

  On the other hand, after transporting the resin molded product 1b out of the eject stage, the upper die lifting mechanism 7000 is lowered. Then, as shown in FIG. 3 (z), the upper mold 110 and the lower mold 210 are clamped again.

  Thereafter, only the upper die lifting mechanism 7000 is lifted and separated from the upper die 110 as shown in FIG. 3 (z2). Thereafter, the forming die 1010 is moved in the direction of the arrow a 26 by a transfer mechanism (not shown) or the like, and transferred out of the eject stage. The molding die 1010 can be transported to the temperature raising stage again to perform the method of manufacturing a resin molded product again by the same steps as in FIGS. 3 (a) to 3 (y). Also, for example, prior to performing the method for manufacturing a resin molded product again, the molding die 1010 may be cleaned.

  In this example (Example 3), an example was shown in which the resin in the mold was cured in the curing stage using the curing stage. However, in the present invention, the curing stage is optional as described above, and may or may not be.

  In the present invention, for example, as in the first and second embodiments, the other mold in the mold is fixed to the resin molding stage, and the one mold is detachable from each of the stages, and It may be movable between each stage. Also, for example, as in the third embodiment, both the one mold and the other mold may be removable from the respective stages and movable between the respective stages. In the former case, there is an advantage that only one of the molds needs to be moved between the stages. In the latter case, there is an advantage that alignment between the one mold and the other mold is unnecessary in the molding stage. In the former case (when only one of the molds is moved), the resin must be completely cured (solidified) in the resin molding stage. In the latter case (when moving one mold and the other mold), the resin may be in a semi-cured (semi-solidified) state in the resin molding stage. As a result, since the usage time of the resin molding stage in one cycle of the method for manufacturing a resin molded product is shortened, the cycle can be rotated fast, and there is an advantage that the manufacturing efficiency of the resin molded product is high. In order to completely cure (solidify) the resin in the semi-cured (semi-solidified) state, for example, as described in Example 3 and FIG. 4, a curing stage may be used. Further, in this case, in order to suppress or prevent the resin in the semi-cured (semi-solidified) state from leaking from the mold, for example, as described in the third embodiment, a mold opening suppressing member may be used.

  As mentioned above, although Examples 1-3 were described, this invention is not limited to this, A various deformation | transformation is possible. For example, in Examples 1 to 3, an example is shown in which the lower mold is the "one mold" of the present invention and the upper mold is the "other mold" of the present invention. However, the present invention is not limited thereto. For example, the upper mold may be the "one mold" of the present invention, and the lower mold may be the "other mold" of the present invention.

  Furthermore, some of the variations of the present invention will be described with reference to FIGS.

  In Examples 1 to 3, both upper and lower molds have an example having a mold cavity. However, as described above, in the present invention, the mold is not limited to this. For example, in the present invention, only one of the upper and lower molds may have a mold cavity. An example of such a mold is schematically shown in the cross-sectional view of FIG. The mold 1000 of FIG. 5 includes an upper mold (the other mold) 100 and a lower mold (the one mold) 200 as in the molds 1000 of the first and second embodiments. The mold 1000 of FIG. 5 is the same as the mold 1000 of Examples 1 and 2 except that the upper mold 100 does not have the upper mold cavity (the other mold cavity) 101. In the mold of the present invention, for example, only the upper mold may have a mold cavity and the lower mold may not have a mold cavity, contrary to FIG.

  Further, FIG. 6 schematically shows a modification of the lower mold (one mold) 200 of the first and second embodiments. FIG. 6A is a plan view of a part of the lower mold 200, and FIG. 6B is a cross-sectional view. As illustrated, a groove (anti-burr groove) 208 is provided around the resin injection port (spool) of the cull 202. Due to the presence of the groove 208, even if the resin leaks from the periphery of the resin inlet, the leaked resin is accommodated in the groove 208. Thereby, the molding defect etc. which originate in the thin burr (unnecessary resin part) derived from the said leaked resin can be suppressed or prevented.

  In FIG. 7, an example of a structure of the unnecessary resin parts 20d and 20e is shown typically. Fig.7 (a) is a side view, FIG.7 (b) is a front view. As illustrated, the protrusions 20 e of the unnecessary resin portion have a convex shape of − (minus) shape. As described in the above embodiment, when the plunger (flowable resin injection member) has a groove on the contact surface with the flowable resin, a protrusion such as the unnecessary resin portion 20e corresponding to the shape of the groove A (convex) is formed. Thereby, as described in the above-described embodiment, for example, it becomes easy to remove the unnecessary resin portion using a rod for discharging the cull (unnecessary resin portion removing member). However, the present invention is not limited to this. For example, when the flowable resin injection member has at least one of a protrusion and a recess on the contact surface with the flowable resin, the shape of at least one of the protrusion and the recess is not limited to the groove shape. It may have any shape. Further, the shape of at least one of the convex portion and the concave portion formed in the unnecessary resin portion corresponding to the shape of at least one of the convex portion and the concave portion in the flowable resin injection member is not limited to the shape of 20e in FIG. It may have any shape. For example, the protrusion 20e of FIG. 7 has a-(minus) shape as described above. However, the present invention is not limited to this, and for example, the fluid resin injection member has a + (plus) shape concave or convex portion on the contact surface with the fluid resin, and correspondingly, it is not necessary. The resin portion 20e may be a positive (plus) convex or concave portion. Further, in response to this, the shape of at least one of the convex portion and the concave portion which the rod for discharging the cull (unnecessary resin portion removing member) has on the contact surface with the unnecessary resin portion can be appropriately changed.

  The side views of FIGS. 8A and 8B schematically show an example of the relationship between the form of the plunger (fluid resin injection member) and the form of the unnecessary resin portion. FIG. 8A is an example in which the unnecessary resin portion 20 d (that is, the one obtained by curing the flowable resin) does not protrude from the outer periphery of the contact surface of the plunger 3213 with the unnecessary resin portion 20 d. FIG. 8B is an example in which the unnecessary resin portion 20 d protrudes from the outer periphery of the contact surface of the plunger 3213. In the case of FIG. 8A, it is easy to suppress or prevent the flowable resin from leaking from the outer periphery of the contact surface of the plunger 3213. On the other hand, in the case of FIG. 8B, the plunger 3213 can easily apply a force to the fluid resin.

  According to the present invention, for example, in a molding die, parts (for example, ejector pins etc.) for taking out a resin molded product can be omitted, so that the molding die can be configured with a small number of parts.

  Furthermore, the present invention is not limited to the above-described embodiments, and may be arbitrarily and appropriately combined, changed, or selected as needed without departing from the scope of the present invention. It is a thing.

1 board (frame)
1b Resin molded product (sealed substrate)
20 Hardening resin 20a tablet (resin material)
20b Molten resin (flowable resin)
20d, 20e, 20f surplus resin (unnecessary resin part)
100, 110 Upper type (other type)
101, 111 Upper mold cavity (other mold cavity)
101a Upper mold cavity (other mold cavity) 101 side surface 119 groove (mold opening suppressing member mounting groove)
200, 210 Lower type (one type)
201, 211 Lower mold cavity (one mold cavity)
201a Upper mold cavity (other mold cavity) 201 side surface 202, 212 cull (excess resin accommodating portion, resin molded product fixing mechanism)
203 Gate (Resin flow path, resin molded product fixing mechanism)
208 Grooves (anti-burr grooves)
213 1st gate (resin flow path)
214 runner 215 second gate (resin flow path)
219 groove (mold opening suppression member mounting groove)
300 type opening restraint member 1000, 1010 mold 2110 upper platen (other platen)
2111 Heater 2200 Heating base 2201 Heater 2210 Lower platen (one platen)
2211 Heater 3100 Upper Platen (Other Platen)
3101 heater 3200, 3210, 3220 lower platen (one platen)
3201, 3211, 3221 heaters 3202, 3212, 3222 Plunger drive mechanism (fluid resin injection member drive mechanism)
3203, 3213, 3223 Plunger (flowable resin injection member)
3204, 3214, 3224 pot 3205, 3225 groove (groove of plunger, recess)
3216, 3226 Resin charging rod 3219, 3229 Resin charging port 4000 Rod for discharging cull (unnecessary resin part removing member)
4001 Grooves (grooves and recesses in the rod for discharging culls)
5000, 5010 Cooling stand 5001, 5011 Cooling mechanism (cold runner)
5002, 5012 Air supply hole 5100 Heating table 5101 Heater 5102 Air supply hole 5200 Cooling fluid supply mechanism 5201 Piping (piping for cooling fluid supply)
5300 Air supply mechanism 5301 Piping (piping for air supply)
6000 Unloader (transport mechanism)
6001 Cooling unit (Resin molded product cooling mechanism)
7000. Upper mold lifting mechanism 8000 Heating stage 8001 Heater 8002 Relief groove a1, a11 to a12, a21 to a26 Arrow b1 indicating the moving direction of lower die (one die) b1 Arrow b11 indicating the rising direction of plunger 3203, b12 plunger Arrow b13 representing the rising direction of arrow 3213 Arrows b21 and b22 representing the lowering direction of plunger 3213 Arrows c1 and c21 representing the rising direction of plunger 3223 Arrows c2 and c22 representing the rising direction of rod 4000 for discharge Arrows d1 and d21 denoting the downward direction of the arrows d1 and d21 Arrows denoting the direction of rotation of the rod 4000 for discharging the cull arrows x1, x2, x11 and x21 Arrows denoting the direction of air supply from the air supply holes A1, A2, A11 and A12 Lower platen Indicates the rising direction of (one platen) 2210 Marks B 1, B 2, B 11, B 12 Arrow C 1 representing the lowering direction of lower platen (one platen) 22 10 Arrow C 11 representing the upward direction of lower platen (one platen) 32 10 Lower platen (one platen) 3220 Arrow D1 representing the downward direction of the lower platen (one platen) 3210 Arrow E1 representing the upward direction of the mold 1000 E11, E12 Arrow representing the upward direction of the mold 1010 F1, F11 Descending direction of the upper mold lifting mechanism 7000 Arrow F2 representing the F12 F12 Arrow S1 representing the rising direction of the upper mold lifting mechanism 7000 Temperature rising stage S2 Resin molding stage S3 Cure stage S4 Eject stage

Claims (15)

Includes mold, heating stage, resin molding stage, and eject stage,
The mold includes one mold and the other mold,
The resin molded article after resin molding can be released from the other mold while being fixed to the one mold,
At least one of the one mold and the other mold is removable from the stages and movable between the stages,
The temperature raising stage raises the temperature of the mold;
The resin molding stage performs resin molding,
The eject stage releases the resin molded product from the mold;
A resin molding apparatus characterized in that the one mold has a resin molded product fixing mechanism for fixing the resin molded product. Includes mold, heating stage, resin molding stage, and eject stage,
The mold includes one mold and the other mold,
The resin molded article after resin molding can be released from the other mold while being fixed to the one mold,
At least one of the one mold and the other mold is removable from the stages and movable between the stages,
The temperature raising stage raises the temperature of the mold;
The resin molding stage performs resin molding,
The eject stage releases the resin molded product from the mold;
In the other mold, in the one mold, the area of the surface facing the other mold and in contact with the resin is larger than the area of the surface facing the one mold and in contact with the resin. A resin molding apparatus characterized in that the resin molded product can be released from the other mold in a state of being fixed to the one mold by being large. The other mold is fixed to the resin molding stage,
The one mold is removable from the stages and movable between the stages,
The resin molding stage further causes the resin molded product to be released from the other mold while being fixed to the one mold.
The eject stage causes the resin molded product to be released from the one of the molds.
The resin molding apparatus of Claim 1 or 2. Both the one mold and the other mold are removable with respect to the respective stages and movable between the respective stages,
The ejection stage releases the resin molded product from the other mold in a state of being fixed to the one mold, and further releases the resin molded product from the one mold of the mold. ,
The resin molding apparatus of Claim 1 or 2. In addition, including cure stage,
The curing stage cures the resin in the mold.
The resin molding apparatus as described in any one of Claims 1-4. The fluid resin injection member further includes a fluid resin injection member for injecting the fluid resin into the one mold cavity, and an unnecessary resin portion removal member for removing the unnecessary resin portion cured by the fluid resin.
The fluid resin injection member has at least one of a protrusion and a recess on the contact surface with the fluid resin,
The unnecessary resin portion removing member has at least one of a convex portion and a concave portion on the contact surface with the unnecessary resin portion.
The resin molding apparatus as described in any one of Claims 1-5. Furthermore, the mold opening suppression member which suppresses the mold opening of said one type | mold and said other type | mold is included,
The resin molding apparatus as described in any one of Claims 1-6. Furthermore, a temperature raising mechanism for raising the temperature of the molding die, and a resin molded product cooling mechanism for cooling the resin molded product,
The resin molding apparatus as described in any one of Claims 1-7. Using a mold comprising one mold and the other,
A temperature raising step of raising the temperature of the mold in a temperature raising stage;
A resin molding step of performing resin molding at a resin molding stage;
A first mold release step of releasing a resin molded product after resin molding from the other mold in a state of being fixed to the one mold by a resin molded product fixing mechanism;
A second release step of releasing the resin molded product from the one mold in the eject stage;
A method for producing a resin molded product, comprising: Using a mold comprising one mold and the other,
A temperature raising step of raising the temperature of the mold in a temperature raising stage;
A resin molding step of performing resin molding at a resin molding stage;
A first release step of releasing a resin molded product after resin molding from the other mold in a state of being fixed to the one mold;
A second release step of releasing the resin molded product from the one mold in the eject stage;
Including
In the other mold, in the one mold, the area of the surface facing the other mold and in contact with the resin is larger than the area of the surface facing the one mold and in contact with the resin. A method of manufacturing a resin molded article characterized in that the resin molded article can be released from the other mold in a state fixed to the one mold in the first mold release step by making the size large. .   The method for producing a resin molded product according to claim 9, further comprising a resin curing step of curing the resin in the mold in a curing stage. further,
A flowable resin injection step of injecting a flowable resin into the one mold cavity using a flowable resin injection member;
And an unnecessary resin portion removing step of removing the unnecessary resin portion in which the flowable resin is cured using the unnecessary resin portion removing member,
The fluid resin injection member has at least one of a protrusion and a recess on the contact surface with the fluid resin,
The unnecessary resin portion removing member has at least one of a convex portion and a concave portion on the contact surface with the unnecessary resin portion.
The manufacturing method of the resin molded product as described in any one of Claims 9-11.   The method for producing a resin molded product according to any one of claims 9 to 12, wherein in the molding step, the mold opening between the one mold and the other mold is suppressed using a mold opening suppression member.   The method for producing a resin molded product according to any one of claims 9 to 13, wherein in the mold release step, the temperature of the mold is raised and the resin molded product is cooled.   The manufacturing method of the resin molded product as described in any one of Claims 9-14 performed using the resin molding apparatus as described in any one of Claims 1-8.

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