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JP2019033168A - Electronic control device - Google Patents

Electronic control device Download PDF

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Publication number
JP2019033168A
JP2019033168A JP2017153035A JP2017153035A JP2019033168A JP 2019033168 A JP2019033168 A JP 2019033168A JP 2017153035 A JP2017153035 A JP 2017153035A JP 2017153035 A JP2017153035 A JP 2017153035A JP 2019033168 A JP2019033168 A JP 2019033168A
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Prior art keywords
heat
electronic component
circuit board
printed circuit
housing
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JP2017153035A
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Japanese (ja)
Inventor
秀明 山田
Hideaki Yamada
秀明 山田
一樹 小笠原
Kazuki Ogasawara
一樹 小笠原
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Keihin Corp
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Keihin Corp
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Priority to JP2017153035A priority Critical patent/JP2019033168A/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

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  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

To increase a mounting area while securing heat dissipation from a pyrogenicity electronic component, and without increasing a printed board.SOLUTION: An electronic control device 10 includes: a printed board 30; a pyrogenicity electronic component 40 mounted to one surface 31 of the printed board 30; and a housing 20 that houses the printed board 30 and the pyrogenicity electronic component 40. In the other surface 32 of the printed board 30, electronic components 51 to 53 each of which a power consumption is relatively are mounted. The pyrogenicity electronic component 40 includes a heat spreader 45. A substrate opposite surface 40b on the side opposite to the printed board 30 in the pyrogenicity electronic component 40 contacts to the housing 20 through a heat discharge grease 61. The housing 20 includes a heat discharge fin 24. A heat discharge structure of a heat generated by the pyrogenicity electronic component 40 is structured by a passage 60 of the heat spreader 45, the substrate opposite surface 40b, the heat discharge grease 61, the housing 20, and the heat discharge fin 24.SELECTED DRAWING: Figure 1

Description

本発明は、発熱が大きい電子部品を用いた電子制御装置に関する。   The present invention relates to an electronic control device using an electronic component that generates a large amount of heat.

近年、電子制御装置の高能力化が求められており、このために、電子部品の発熱量は増加しつつある。これに対し、電子制御装置の放熱性を高める技術が各種提案されてきた（例えば特許文献１（図１参照））   In recent years, there has been a demand for higher performance of electronic control devices. For this reason, the amount of heat generated by electronic components is increasing. On the other hand, various techniques for improving the heat dissipation of the electronic control device have been proposed (for example, Patent Document 1 (see FIG. 1)).

特許文献１で知られている電子制御装置は、ケースとカバーとから成る筐体に、発熱が大きい電子部品を収納している。この電子部品は、プリント基板の一方の面に実装されている。このプリント基板の他方の面は、カバーの内面に対向している。このカバーの内面には、プリント基板の他方の面へ向かって突出した、突出部が形成されている。この突出部の先端面には、柔軟性を有する半個体の熱伝導材を介して、プリント基板の他方の面が重ねられている。電子部品が発した熱は、プリント基板と熱伝導材と突出部との、放熱経路を介してカバーに伝わり、このカバーから外部へ放散される。   In the electronic control device known from Patent Document 1, an electronic component that generates a large amount of heat is housed in a casing composed of a case and a cover. This electronic component is mounted on one surface of the printed circuit board. The other surface of the printed board faces the inner surface of the cover. A projecting portion that projects toward the other surface of the printed circuit board is formed on the inner surface of the cover. The other surface of the printed circuit board is overlaid on the front end surface of the protrusion via a semi-solid heat conductive material having flexibility. The heat generated by the electronic component is transmitted to the cover through the heat dissipation path of the printed circuit board, the heat conductive material, and the protrusion, and is dissipated from the cover to the outside.

しかしながら、プリント基板のなかの、一方の面にしか電子部品を実装することができず、プリント基板の実装面積が少なくなる。また、多くの電子部品を実装するには、プリント基板を大きくせざるを得なく、その分、電子制御装置が大型化する。   However, electronic components can be mounted only on one side of the printed circuit board, and the mounting area of the printed circuit board is reduced. In order to mount a large number of electronic components, the printed circuit board must be enlarged, and the electronic control device is enlarged accordingly.

特開２００３−２８９１９１号公報JP 2003-289191 A

本発明は、発熱性電子部品からの放熱性を確保しつつ、プリント基板を大きくすることなく実装面積を増すことによって、電子制御装置の小型化を図ることができる技術を、提供することを課題とする。   It is an object of the present invention to provide a technique capable of reducing the size of an electronic control device by increasing the mounting area without enlarging a printed circuit board while ensuring heat dissipation from heat-generating electronic components. And

請求項１に係る発明は、プリント基板と、このプリント基板の一方の面に実装された発熱性電子部品と、前記プリント基板と前記発熱性電子部品とを収納する筐体とを含む、電子制御装置において、
前記プリント基板の他方の面には、消費電力が比較的少ない電子部品が実装され、
前記発熱性電子部品は、ヒートスプレッダを有し、
前記発熱性電子部品のなかの、前記プリント基板とは反対側の基板反対面は、放熱グリースを介して前記筐体に接しており、
この筐体は、放熱フィンを有し、
前記発熱性電子部品が発生する熱の放熱構造は、前記ヒートスプレッダと前記基板反対面と前記放熱グリースと前記筐体と前記放熱フィンとの経路によって構成されていることを特徴とする。 An invention according to claim 1 includes an electronic control including a printed circuit board, a heat generating electronic component mounted on one surface of the printed circuit board, and a housing for housing the printed circuit board and the heat generating electronic component. In the device
On the other side of the printed circuit board, electronic components with relatively low power consumption are mounted,
The exothermic electronic component has a heat spreader,
Of the heat-generating electronic components, the opposite surface of the substrate opposite to the printed circuit board is in contact with the housing via heat radiation grease,
This housing has radiating fins,
A heat dissipation structure for heat generated by the heat-generating electronic component is configured by a path of the heat spreader, the opposite surface of the substrate, the heat dissipation grease, the casing, and the heat dissipation fin.

請求項１に係る発明では、発熱性電子部品が発生する熱の放熱構造は、ヒートスプレッダと発熱性電子部品の基板反対面と放熱グリースと筐体と放熱フィンとの経路によって構成される。発熱性電子部品が発生する熱を、プリント基板を介することなく、放熱フィンへ伝えることができる。プリント基板の他方の面から筐体へ伝わる放熱経路を、必要としない。このため、プリント基板の他方の面には、電子部品を実装することが可能である。従って、発熱性電子部品からの放熱性を確保しつつ、プリント基板を大きくすることなく実装面積を増すことによって、電子制御装置の小型化を図ることができる。   In the invention according to claim 1, the heat radiation structure generated by the heat-generating electronic component is constituted by the path of the heat spreader, the opposite surface of the heat-generating electronic component, the heat radiation grease, the housing, and the heat radiation fin. Heat generated by the heat-generating electronic component can be transmitted to the heat radiating fins without going through the printed circuit board. There is no need for a heat dissipation path that is transmitted from the other surface of the printed circuit board to the housing. For this reason, it is possible to mount an electronic component on the other surface of the printed circuit board. Accordingly, it is possible to reduce the size of the electronic control device by increasing the mounting area without enlarging the printed circuit board while ensuring heat dissipation from the heat-generating electronic components.

本発明による電子制御装置の構成図である。It is a block diagram of the electronic controller by this invention.

本発明を実施するための形態を添付図に基づいて以下に説明する。図１（ａ）は、電子制御装置１０の断面構成を示している。図１（ｂ）は、図１（ａ）の電子制御装置１０の要部を拡大して示している。   EMBODIMENT OF THE INVENTION The form for implementing this invention is demonstrated below based on an accompanying drawing. FIG. 1A shows a cross-sectional configuration of the electronic control device 10. FIG. 1B shows an enlarged view of a main part of the electronic control device 10 of FIG.

図１（ａ）及び図１（ｂ）に示されるように、電子制御装置１０は、筐体２０と、プリント基板３０と、このプリント基板３０の一方の面３１（第１面３１）に実装された発熱性電子部品４０と、プリント基板３０の他方の面３２（第２面３２）に実装された他の電子部品５１〜５３とを含む。   As shown in FIGS. 1A and 1B, the electronic control device 10 is mounted on the housing 20, the printed circuit board 30, and one surface 31 (first surface 31) of the printed circuit board 30. The generated heat-generating electronic component 40 and other electronic components 51 to 53 mounted on the other surface 32 (second surface 32) of the printed circuit board 30 are included.

筐体２０は、プリント基板３０と発熱性電子部品４０と他の電子部品５１〜５３とを収納している。この筐体２０は、ケース２１と、このケース２１の開口を塞ぐ略平板状のカバー２２とから成る。カバー２２は、ケース２１にビス２３によって取り外し可能に取り付けられている。ケース２１とカバー２２は、熱伝導性が良好な材料、例えばアルミニウム合金によって構成されてなる。筐体２０は、少なくとも１つの放熱フィン２４を有する。この放熱フィン２４は、例えばケース２１の平板状の底板２５から外方へ延びている。   The housing 20 houses the printed circuit board 30, the heat generating electronic component 40, and other electronic components 51 to 53. The housing 20 includes a case 21 and a substantially flat cover 22 that closes the opening of the case 21. The cover 22 is detachably attached to the case 21 with screws 23. The case 21 and the cover 22 are made of a material having good thermal conductivity, for example, an aluminum alloy. The housing 20 has at least one heat radiating fin 24. The heat radiating fins 24 extend outward from, for example, a flat bottom plate 25 of the case 21.

プリント基板３０は、ケース２１の底面２６（底板２５の内面２６）に対し、間隔を有して概ね平行に配置されるとともに、ビス３３によってケース２１の内部に止められている。プリント基板３０の第１面３１は、ケース２１の底面２６に対向している。   The printed circuit board 30 is disposed substantially parallel to the bottom surface 26 of the case 21 (the inner surface 26 of the bottom plate 25) with a space therebetween, and is stopped inside the case 21 by screws 33. The first surface 31 of the printed circuit board 30 faces the bottom surface 26 of the case 21.

プリント基板３０の材質は、特に限定されるものではなく、例えばエポキシ樹脂等の樹脂材料である。このプリント基板３０は、第１面３１と第２面３２とに、図示せぬ配線層及び絶縁層が形成されてなる。配線層は、導電性の配線回路パターンによって構成されており、例えば銅箔パターンからなる。絶縁層は、電気絶縁性を有した被膜であって、配線層のなかの接続部位と外部接続端子のみを露出させるとともに、配線層の残りの部分の表面全体を被覆している。   The material of the printed circuit board 30 is not specifically limited, For example, it is resin materials, such as an epoxy resin. The printed circuit board 30 is formed by forming a wiring layer and an insulating layer (not shown) on a first surface 31 and a second surface 32. The wiring layer is composed of a conductive wiring circuit pattern, and is made of, for example, a copper foil pattern. The insulating layer is a film having electrical insulation, and exposes only the connection portion and the external connection terminal in the wiring layer, and covers the entire surface of the remaining portion of the wiring layer.

発熱性電子部品４０は、動作することによる発熱量が多く積極的に放熱する必要がある電子部品、例えばパワー半導体モジュールによって構成される。この発熱性電子部品４０は、パワー半導体素子等の発熱する電子素子４１をリードフレーム４２やボンデイングワイヤ４３と共に、封止樹脂４４によって一体にモールドしたものであり、ヒートスプレッダ４５を有する。電子素子４１は、ヒートスプレッダ４５に実装されている。ヒートスプレッダ４５は、封止樹脂４４から露出した構成と、封止樹脂４４によって全体をモールドされた構成とを問わない。   The heat-generating electronic component 40 is constituted by an electronic component, for example, a power semiconductor module, that generates a large amount of heat due to operation and needs to actively dissipate heat. The heat-generating electronic component 40 is obtained by integrally molding a heat-generating electronic element 41 such as a power semiconductor element together with a lead frame 42 and a bonding wire 43 with a sealing resin 44 and has a heat spreader 45. The electronic element 41 is mounted on the heat spreader 45. The heat spreader 45 may have a configuration exposed from the sealing resin 44 or a configuration molded entirely with the sealing resin 44.

以下、この発熱性電子部品４０のなかの、プリント基板３０の第１面３１に実装される面４０ａのことを「被実装面４０ａ」といい、プリント基板３０とは反対側の面４０ｂのことを、「基板反対面４０ｂ」という。発熱性電子部品４０は、被実装面４０ａを第１面３１に接着材により接合されるとともに、リードフレーム４２を第１面３１にハンダにより接合されている。   Hereinafter, the surface 40a mounted on the first surface 31 of the printed circuit board 30 in the heat generating electronic component 40 is referred to as a “mounted surface 40a”, and the surface 40b opposite to the printed circuit board 30. Is referred to as “substrate opposite surface 40b”. In the heat-generating electronic component 40, the mounted surface 40a is bonded to the first surface 31 with an adhesive, and the lead frame 42 is bonded to the first surface 31 with solder.

発熱性電子部品４０の基板反対面４０ｂは、ケース２１の底面２６（底板２５の内面２６）に対して若干の隙間を有して対向している。さらに、この基板反対面４０ｂは、放熱グリース６１を介して筐体２０に接している。より具体的には、放熱グリース６１は、筐体２０のなかのケース２１の底面２６と、発熱性電子部品４０の基板反対面４０ｂとの間に、両者２６，４０ｂ間の隙間を埋めるように介在している。この放熱グリース６１は、両者２６，４０ｂ間に塗り込められた、周知の熱伝導グリースによって構成される。この熱伝導グリースは、粘性を有しており、基板反対面４０ｂの全面にわたって、塗り込められることが好ましい。発熱性電子部品４０の基板反対面４０ｂから筐体２０へ、放熱グリース６１によって効率よく熱伝達をすることができる。   The board opposite surface 40b of the heat-generating electronic component 40 is opposed to the bottom surface 26 of the case 21 (the inner surface 26 of the bottom plate 25) with a slight gap. Further, the substrate opposite surface 40 b is in contact with the housing 20 via the heat dissipating grease 61. More specifically, the heat dissipating grease 61 fills the gap between the bottom surface 26 of the case 21 in the housing 20 and the opposite surface 40b of the heat-generating electronic component 40 between the two heat sinks 26 and 40b. Intervene. The heat dissipating grease 61 is constituted by a well-known heat conducting grease which is applied between the two 26 and 40b. This heat conductive grease has viscosity and is preferably applied over the entire surface of the substrate opposite surface 40b. Heat can be efficiently transferred from the substrate opposite surface 40 b of the heat-generating electronic component 40 to the housing 20 by the heat radiation grease 61.

他の電子部品５１〜５３は、消費電力が比較的少ない電子部品である。この消費電力が比較的少ない電子部品５１〜５３は、放熱量が少なく放熱対策を必要としない一般的な部品であり、特に種類を問わない。   The other electronic components 51 to 53 are electronic components that consume relatively little power. The electronic components 51 to 53 with relatively low power consumption are general components that have a small amount of heat dissipation and do not require a heat dissipation measure, and are not particularly limited in type.

発熱性電子部品４０が発生する熱の放熱構造は、ヒートスプレッダ４５と発熱性電子部品４０の基板反対面４０ｂと放熱グリース６１と筐体２０と放熱フィン２４との経路６０、つまり放熱経路６０によって構成されている。   The heat dissipation structure generated by the heat-generating electronic component 40 is constituted by the heat spreader 45, the substrate opposite surface 40b of the heat-generating electronic component 40, the heat dissipation grease 61, the path 60 between the housing 20, and the heat dissipation fin 24, that is, the heat dissipation path 60. Has been.

発熱性電子部品４０の電子素子４１が発生した熱は、電子素子４１からヒートスプレッダ４５、封止樹脂４４、基板反対面４０ｂ、放熱グリース６１、ケース２１の底板２５、放熱フィン２４の経路で伝わり、放熱フィン２４から大気に放散される。   The heat generated by the electronic element 41 of the heat-generating electronic component 40 is transmitted from the electronic element 41 through the path of the heat spreader 45, the sealing resin 44, the board opposite surface 40b, the heat radiation grease 61, the bottom plate 25 of the case 21, and the heat radiation fin 24. The heat is dissipated from the radiating fins 24 to the atmosphere.

このように、発熱性電子部品４０が発生する熱を、プリント基板３０を介することなく、放熱フィン２４へ伝えることができる。プリント基板３０の他方の面３２から筐体２０へ伝わる放熱経路を、必要としない。このため、プリント基板３０の他方の面３２には、他の電子部品５１〜５３を実装することが可能である。従って、発熱性電子部品４０からの放熱性を確保しつつ、プリント基板３０を大きくすることなく実装面積を増すことによって、電子制御装置１０の小型化を図ることができる。   In this way, the heat generated by the heat generating electronic component 40 can be transmitted to the heat radiating fins 24 without going through the printed circuit board 30. There is no need for a heat dissipation path that travels from the other surface 32 of the printed circuit board 30 to the housing 20. For this reason, it is possible to mount other electronic components 51 to 53 on the other surface 32 of the printed circuit board 30. Therefore, it is possible to reduce the size of the electronic control device 10 by increasing the mounting area without enlarging the printed circuit board 30 while ensuring heat dissipation from the heat-generating electronic component 40.

本発明の電子制御装置１０は、ハイブリッド自動車や電気自動車に搭載するのに好適である。   The electronic control device 10 of the present invention is suitable for mounting on a hybrid vehicle or an electric vehicle.

１０…電子制御装置、２０…筐体、２４…放熱フィン、３０…プリント基板、３１…プリント基板の一方の面、３２…プリント基板の他方の面、４０…発熱性電子部品、４０ｂ…基板反対面、４５…ヒートスプレッダ、５１〜５３…消費電力が比較的少ない電子部品、６０…経路、６１…放熱グリース。   DESCRIPTION OF SYMBOLS 10 ... Electronic control apparatus, 20 ... Housing | casing, 24 ... Radiation fin, 30 ... Printed circuit board, 31 ... One surface of a printed circuit board, 32 ... The other surface of a printed circuit board, 40 ... Exothermic electronic component, 40b ... Opposite substrate Surface, 45 ... heat spreader, 51-53 ... electronic component with relatively low power consumption, 60 ... path, 61 ... heat radiation grease.

Claims (1)

プリント基板と、このプリント基板の一方の面に実装された発熱性電子部品と、前記プリント基板と前記発熱性電子部品とを収納する筐体とを含む、電子制御装置において、
前記プリント基板の他方の面には、消費電力が比較的少ない電子部品が実装され、
前記発熱性電子部品は、ヒートスプレッダを有し、
前記発熱性電子部品のなかの、前記プリント基板とは反対側の基板反対面は、放熱グリースを介して前記筐体に接しており、
この筐体は、放熱フィンを有し、
前記発熱性電子部品が発生する熱の放熱構造は、前記ヒートスプレッダと前記基板反対面と前記放熱グリースと前記筐体と前記放熱フィンとの経路によって構成されていることを特徴とする電子制御装置。 In an electronic control device comprising: a printed circuit board; a heat generating electronic component mounted on one surface of the printed circuit board; and a housing that houses the printed circuit board and the heat generating electronic component.
On the other side of the printed circuit board, electronic components with relatively low power consumption are mounted,
The exothermic electronic component has a heat spreader,
Of the heat-generating electronic components, the opposite surface of the substrate opposite to the printed circuit board is in contact with the housing via heat radiation grease,
This housing has radiating fins,
The heat dissipation structure for heat generated by the heat-generating electronic component is configured by a path of the heat spreader, the opposite surface of the substrate, the heat dissipation grease, the housing, and the heat dissipation fin.
JP2017153035A 2017-08-08 2017-08-08 Electronic control device Pending JP2019033168A (en)

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