JP2019009181A - Substrate support tool - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a substrate support tool capable of easily removing a substrate from a chassis or the like by reducing the work man-hours for supporting the substrate. SOLUTION: A fixing portion 11 fixed to a substrate 2 and a locking portion projected to the back surface side of the substrate 2 and inserted into a first support hole 31 provided in a chassis 3 located on the back surface side of the substrate. 12 is provided. The locking portion 12 is a locking piece 121 that is locked to the first support hole 31 and a releasing piece that releases the locking piece 121 when a part of the locking piece 121 is exposed to the surface side of the substrate 2 and is operated. 122 is provided. The board 2 is supported on the chassis 3 by the locking piece 121, and the board 2 can be removed from the chassis 3 by operating the release piece 122. [Selection diagram] Fig. 1

Description

  The present invention relates to a board support for supporting a board such as a circuit board on a member such as a chassis or a case.

  As a technique for supporting a substrate on a member such as a chassis or a case of an electronic device (hereinafter referred to as a chassis or the like), for example, a substrate support in Patent Documents 1 and 2 has been proposed. The technique of Patent Literature 1 is a technique in which a fixture is supported on a chassis or the like with a screw, and a locking piece provided on the fixture is fitted into a hole provided in a substrate to support the fixture. The technique of Patent Document 2 is a technique in which a locking member having a claw portion is soldered to a substrate, and a boss provided on a chassis or the like is locked to the claw portion and supported.

Japanese Patent Laid-Open No. 2002-217469 JP-A-2006-119794

  In the technique of Patent Document 1, it is necessary to fix the fixture to the chassis or the like with screws, and an operation for this fixing is required. In addition, since a fixture is interposed between the chassis and the board, it is effective when securing a space (gap) between the two, but is not suitable for supporting both in direct contact. It is. Further, since the fixture has a hook-shaped locking piece, it is difficult to release the engagement when the locking piece and the hole in the board are engaged, and the board is removed from the chassis or the like during board maintenance. Is difficult.

  The technique of Patent Document 2 is effective in simplifying the operation because the locking member is soldered to the substrate. However, it is necessary to provide a boss on the chassis or the like, and there is a disadvantage that the operation for that is necessary. is there. Further, since the claw portion of the locking member bites into and locks the boss such as the chassis, it is difficult to release this locking, and it is difficult to remove the board from the chassis or the like during the maintenance of the board.

  It is an object of the present invention to provide a substrate support that can reduce the number of work steps required to support a substrate while easily removing the substrate from a chassis or the like.

  The present invention includes a fixing portion that is fixed to a substrate, and a locking portion that protrudes from the back surface side of the substrate and is inserted into a first support hole provided in a chassis or the like that exists on the back surface side of the substrate. The locking portion includes a locking piece that is locked to the first support hole, and a release piece that releases the locking of the locking piece when a part is exposed to the surface side of the substrate and is operated. To do.

  In a preferred embodiment of the present invention, the locking portion is provided on one side of the fixing portion, and the other side of the fixing portion is provided with a restriction portion fitted in a second support hole provided in the chassis or the like. Moreover, as for another form, a latching | locking part is provided in the both sides of the adhering part. Furthermore, as for another form, the latching | locking part is provided only in the one side of the said adhering part.

  According to the present invention, the substrate support can be realized simply by fixing the substrate support to the substrate and inserting it into the support hole provided in the chassis or the like, which is effective in reducing the number of steps. Further, in a state where the substrate support is supported, the support of the substrate can be released simply by operating from the surface side of the substrate, which is effective for maintenance or reuse.

1 is an external perspective view of a substrate support according to Embodiment 1 of the present invention. Sectional drawing of the state which supported the board | substrate of Embodiment 1. FIG. BRIEF DESCRIPTION OF THE DRAWINGS (a) Front view, (b) Top view, (c) Left side view of the substrate support of Embodiment 1. Sectional drawing which shows the process of adhering a board | substrate support tool to a circuit board. Sectional drawing which shows the process of supporting a circuit board in a chassis. (A) Front view of the modification of the board | substrate support tool of Embodiment 1, (b) Sectional drawing of a support state. (A) Front view of the board | substrate support tool of Embodiment 2, (b) Sectional drawing of a support state. (A) Front view of substrate support tool of Embodiment 3, (b) Sectional view of support state.

  Next, embodiments of the present invention will be described with reference to the drawings. FIG. 1 is an external perspective view of a substrate support 1 according to Embodiment 1 of the present invention, and FIG. 2 is a cross-sectional view of a state in which a substrate 2 is supported on a chassis 3. In the following description, for convenience, the “vertical direction” represents a direction with reference to FIG. The substrate support 1 is formed by punching an elastic plate material, here a metal plate having a spring property, into a required shape and then bending it. Then, the circuit board 2 to be supported is placed so as to be in contact with the upper bottom surface of the emboss 33 provided in the chassis 3, and the first insertion hole 21 and the second insertion hole 22 opened in the circuit board 2. The circuit board 2 is embossed, that is, the chassis 3 is supported by mounting the board support 1 on the first support hole 31 and the second support hole 32 opened in the emboss 33. Yes.

  The substrate support 1 includes three portions, that is, a fixing portion 11, a locking portion 12, and a regulating portion 13. As shown in FIGS. 3 (a) to 3 (c), three views (a front view, a plan view, and a left side view) of the substrate support 1, the fixing portion 11 is configured as a flat plate having a required area and shape. ing. Here, it is formed as a substantially H-shaped flat plate, and the fixing portion 11 is used for fixing the substrate support 1 to the circuit board 2 as will be described later, and by an automatic mounting machine. It is also used when the substrate support 1 is gripped and transported.

  The locking portion 12 is connected to one side of the fixing portion 11 and includes a locking piece 121 and a release piece 122. The locking piece 121 is bent at a required length from one side edge of the fixing portion 11 at a right angle in a downward direction, and further bent at a middle portion thereof in a wedge shape with the tip side facing outward and upward. ing. Further, a tapered step portion 121a is bent at the front end portion of the wedge shape. A rib wall 123 bent along both side edges is provided in a region of the locking piece 121 bent at a right angle from the fixing portion, and the mechanical strength (bending strength) of the region is increased. It has been.

  The release piece 122 is formed on the distal end side of the locking piece 121, and the distal end portion 122 a extends while curving somewhat outward to a position above the fixing portion 11. The distal end portion 122a of the release piece is bent into a roll shape so as not to damage the operator's fingertip when releasing, which will be described later.

  Here, the vertical dimension of the locking piece 121, especially the dimension of the region extending downward, is the same as the thickness of the circuit board 2 and the chassis 3 described above when the fixing portion 11 is used as a reference. The dimension is set to be sufficiently larger than the dimension. Further, the step portion 121a of the locking piece 121 is set at a position below the fixing portion 11 by a dimension substantially equal to the total thickness of the circuit board 2 and the chassis 3 when the fixing portion 11 is used as a reference. Has been. The length of the release piece 122 that is directed upward from the stepped portion 121 a is set to be longer than the dimension of the combined thickness of the circuit board 2 and the chassis 3.

  The restricting portion 13 is connected to the other side of the fixing portion 11 and includes a restricting piece 131 that is bent at a required length from the other side edge of the fixing portion 11 at a right angle downward. . Moreover, the rib wall 132 bent and raised by the required height dimension is provided along the both-sides edge of the control piece 131, and the mechanical strength of the control part 13 is raised. The vertical dimension of the restricting portion 13 is longer than the thickness of the circuit board 2 and preferably slightly longer than the total thickness of the circuit board 2 and the chassis 3. Here, although details will be described later, the bending dimension of the rib wall 132, that is, the wall height dimension is set to be substantially equal to the short side dimension of the second support hole 32.

  The substrate support 1 is fixed to a circuit board 2 to be supported in advance. A circuit pattern (not shown) made of a conductive layer exists on the surface of the circuit board 2, and a fixed land 23 is formed using a part of the circuit pattern. Further, the above-described insertion holes, that is, the first insertion hole 21 and the second insertion hole 22 are opened in a state of passing through the fixing land 23 in the thickness direction of the circuit board. These first and second insertion holes 21 and 22 have a rectangular shape through which the locking portion 12 and the restriction portion 13 of the substrate support 1 can be inserted, and the fixing lands are arranged in the short side direction of the insertion holes 21 and 22. 23 is sandwiched.

  The substrate support 1 is fixed to the fixing land at the same time when various electronic components are mounted on the circuit board by an automatic mounting machine, for example. FIGS. 4A to 4C are views showing this fixing process. In this fixing, as shown in FIG. 4A, the fixing portion 11 is vacuum-sucked by the suction nozzle N of the automatic mounting machine, and the fixing land 23 is obtained. It is conveyed to the top. Next, as shown in FIG. 4B, the nozzle N is lowered and fixed onto the surface of the fixing land 23. At this time, the locking portion 12 is inserted into the first insertion hole 21 from the surface side, the restriction portion 13 is inserted into the second insertion hole 22, and the fixing portion 11 is in close contact with the surface of the fixing land 23. Then, as shown in FIG. 4 (c), various electronic components are mounted on the circuit pattern by reflow using a soldering material such as solder, and at the same time, the fixing portion 11 of the substrate support 1 is fixed to the fixing land 23. . In this fixed state, the locking portion 12 and the restricting portion 13 are in a state of protruding to the back side of the circuit board 2.

  On the other hand, the chassis 3 supporting the circuit board 2 is provided with the emboss 33 as described above. The emboss 33 corresponds to the first insertion hole 21 and the second insertion hole 22 as described above. A first support hole 31 and a second support hole 32 are opened. The first support hole 31 has a shorter side dimension than that of the first insertion hole 21. The second support hole 32 is formed to have substantially the same dimensions as the second insertion hole 22.

  When the circuit board 2 is supported on the chassis 3, as shown in FIG. 5A to FIG. 5C, first, as shown in FIG. 12 and the regulating portion 13 are aligned with the first and second support holes 31 and 32, respectively, and then the circuit board 2 is lowered and placed on the surface of the emboss 33. Further, the circuit board 2 is pressed toward the surface of the emboss 33 as shown in FIG. By this pressing, as shown in FIG. 5C, the locking portion 12 and the restricting portion 13 are inserted into the first and second support holes 31 and 32, respectively.

  When the locking portion 12 is inserted into the first support hole 31, as shown in FIG. 2, the locking piece 121 of the locking portion 12 is elastically deformed and contracted to reduce the first support hole 31. After the insertion, the stepped portion 121a is locked to the inner edge on the lower surface side of the first support hole 31. Thus, the locking piece 121 supports the circuit board 1 on the chassis 3. In addition, the restricting portion 13 is fitted into the second support hole 32, but the height dimension of the rib wall 132 of the restricting portion 13 is equal to the short side dimension of the second support hole 32 as described above. When the restricting portion 13 is fitted in the second support hole 32, the movement is restricted by the second support hole 32, and the position of the circuit board 2 is restricted in the short side direction with respect to the chassis 3. become.

  In this way, the circuit board 2 is supported by the chassis 3 by the board support 1, but in this state, the position of the circuit board 2 is regulated with respect to the chassis 3 by the regulating part 13. It is not moved inside the support hole 31. In particular, since the locking portion 12 is restricted from moving in the short side direction of the first support hole 31, the locking piece 121 of the locking portion 12 interferes with the inner edge of the first support hole 31. It is prevented from being deformed, the locking state between the stepped portion 121a and the first support hole 31 is prevented from being released, and a stable support state is maintained.

  When removing the circuit board 2 from the chassis 3, as shown by a chain line in FIG. 2, the tip of the release piece 122 of the locking portion 12 protruding to the front surface side of the circuit board 2 through the first insertion hole 21 with a finger or the like When moving inward (in the direction of the arrow), the release piece 122 and the locking piece 121 integral therewith are elastically deformed and reduced, and the locked state between the stepped portion 121a and the inner edge of the first support hole 31 is released. The If the circuit board 2 is lifted upward while maintaining this state, the locking part 12 and the restricting part 13 can be pulled out from the support holes 31 and 32, respectively, and the circuit board 2 can be removed.

  As described above, the substrate support 1 according to the first embodiment can be configured by processing one metal plate, and thus can be configured with a minimum number of parts. In addition, the substrate support 1 is fixed to the circuit board 2 at the fixing portion 11. Since this fixing can be fixed by reflowing of solder or the like, the fixing operation to the circuit board 2 can be automated and the number of steps is reduced. I'll do it. Further, when the circuit board 2 is supported by the chassis 3, the circuit board 2 is positioned with respect to the chassis 3 and then the circuit board 2 is pressed against the surface of the chassis 3. Easy. Furthermore, the circuit board 2 can be easily detached from the chassis 3 simply by operating the release piece 122 of the board support 1, which is effective in reusing the circuit board 2.

  In the first embodiment, since the substrate support 1 is formed of a metal plate, that is, a conductive plate, if the fixed land 23 of the circuit board 2 is formed as a part of the ground pattern, the substrate support 1 Can function as a ground terminal. Therefore, the ground pattern of the circuit board 2 can be grounded to the chassis 3 when the locking part 12 and the restricting part 13 of the board support part 1 are inserted into the support holes 31 and 32 and brought into electrical contact.

  FIG. 6A is a front view of a substrate support 1A according to a modification of the first embodiment, and parts equivalent to those of the substrate support 1 of the first embodiment are denoted by the same reference numerals. In this modified example of the substrate support 1 </ b> A, the vertical position of the distal end portion 122 b of the release piece 122 of the locking portion 12 is shortened to substantially the same position as the fixing portion 11. In this way, as shown in FIG. 6B, when the circuit board 2 is supported by the chassis 3, the front end 122b of the release piece 122 is not projected to the surface side of the circuit board 2. When the front end 122b interferes with external force or the like, it is possible to prevent the release piece 122 from being moved unintentionally to release the locked state. In this modification, when releasing the support, a tool J such as a screwdriver (screwdriver) is inserted into the first insertion hole 21 and the release piece 122 is operated.

  FIG. 7A is a front view of the substrate support 1 </ b> B of the second embodiment, and parts equivalent to those of the substrate support 1 of the first embodiment are denoted by the same reference numerals. The substrate support 1 </ b> B includes a fixing portion 11 and a pair of locking portions 12 disposed on both sides of the fixing portion 11. The fixing part 11 has the same configuration as that of the first embodiment. Each of the pair of locking portions 12 has the same configuration as that of the first embodiment, but is configured in a line-symmetric shape with the fixing portion 11 interposed therebetween. That is, a locking piece 121 is formed from both ends of the fixing portion 11 outward, and a release piece 122 is further formed. Therefore, in the second embodiment, the restriction unit 13 of the first embodiment is not provided.

  In the second embodiment, a pair of first insertion holes 21 are opened in the circuit board 2 as shown in the cross-sectional view of FIG. When the fixing portion 11 of the substrate support 1B is fixed to the circuit board 2 with solder or the like, the pair of locking portions 12 are respectively projected from the corresponding two first insertion holes 21 to the back surface side. As in the first embodiment, an automatic mounting machine can be used as a method for fixing the substrate support 1B to the circuit board 2.

  The chassis 3 that supports the circuit board 2 is provided with an emboss 33 as in the first embodiment, and a pair of first support holes 31 corresponding to the pair of first insertion holes 21 are provided in the emboss. It is open. These support holes 31 are the same as in the first embodiment in that the width dimension is larger than that of the insertion hole 21.

  When the circuit board 2 is supported on the chassis, as in the first embodiment, the circuit board 2 is embossed while aligning the pair of locking portions 12 of the board support 1B with the corresponding first support holes 21. The circuit board 2 is pressed against the chassis 3. By this pressing, the pair of locking portions 12 are respectively inserted into the first support holes 31, and the locking pieces 121 are inserted through the support holes 31 in a state where they are elastically deformed and reduced, and after the insertion, the pair of locking portions 12 are elastically restored. Locked to the support hole 31. As a result, the board support 1 </ b> B supports the circuit board 2 on the chassis 3.

  The substrate support 1 </ b> B according to the second embodiment does not include the restriction portion according to the first embodiment. However, in the pair of locking portions 12, the locking pieces 121 are locked in the first support holes 31, respectively. Since an elastic repulsive force is generated in each case, the position of the circuit board 2 is regulated by these elastic repulsive forces, and the locked state in the locking portion 12 is maintained. In the case of releasing the support, the locking state at the locking portion 12 is released by operating the release piece 122 as in the first embodiment.

  Also in the second embodiment, the substrate support can be configured by processing a single metal plate, and therefore can be configured with a minimum number of parts. Further, since the substrate support 1B can be fixed by reflow, the fixing operation to the circuit board 2 can be automated and the number of steps is small. When the circuit board 2 is supported on the chassis 3, it is only necessary to position the circuit board 2 with respect to the chassis 3 and then press the circuit board 2 against the surface of the chassis 3. Furthermore, the circuit board 2 can be easily removed from the chassis 3 simply by operating the locking portion 12 of the board support 1B, which is effective in reusing the circuit board 2.

  In the second embodiment, the circuit board 2 is supported in two places, that is, in the two support holes 31, so that the mechanical strength of the support is increased and the support is supported. Reliability can be improved. The second embodiment is preferably applied when a large circuit board 2 having a relatively large weight is supported.

  FIG. 8A is a front view of the substrate support 1 </ b> C of the third embodiment, and parts equivalent to those of the substrate support 1 of the first embodiment are denoted by the same reference numerals. The substrate support 1 </ b> C includes a fixing portion 11 and a single locking portion 12 disposed on one side of the fixing portion. The fixing part 11 has the same configuration as that of the first embodiment. The locking portion 12 has the same configuration as that of the first embodiment. Also in the third embodiment, the restricting portion of the first embodiment is not provided.

  The support of the circuit board by the board support 1C of the third embodiment is basically the same as in the first and second embodiments. In this case, as shown in the cross-sectional view of FIG. 8B, the circuit board 2 has one first insertion hole 21 and the chassis 3 has one first support hole 31. . Then, after fixing the substrate support 1C to the circuit board 2 and pressing the locking portion 12 of the substrate support 1C against the chassis 3 while aligning the locking portion 12 with the first support hole 31 of the chassis 3, the locking portion 12 is inserted into the first support hole 31. When the locking portion 12 is inserted into the first support hole 31, the locking portion 12 is locked to the first support hole 31, and the board support 1 </ b> C supports the circuit board 2 to the chassis 3.

  The substrate support 1C according to the third embodiment is preferably applied to the circuit board 2 having a relatively light weight because the number of the locking portions 12 is one. When releasing the support, the locking state between the locking portion 12 and the first support hole 31 is released by operating the release piece 122 as in the first and second embodiments.

  Also in the third embodiment, the substrate support 1C can be configured by processing one metal plate, and can be fixed by reflow, so that the fixing operation to the circuit board 2 can be automated and the number of steps is small. When the circuit board 2 is supported on the chassis 3, it is only necessary to position the chassis 3 against the chassis 3 and then press the circuit board 2 against the surface of the chassis 3. Furthermore, the circuit board 2 can be easily detached from the chassis 3 simply by operating the locking portion 12, which is effective in reusing the circuit board 2.

  The present invention is not limited to the configurations and shapes of the first to third embodiments. For example, the board support may be fixed to the edge of the circuit board, and the locking part may protrude to the back side of the circuit board through the outside of the edge or through a notch provided in the edge. The substrate support may be fixed to the back surface of the circuit board and protrude from the back surface to the back surface, that is, the chassis side. Furthermore, it may be fixed so as to sandwich the edge of the circuit board from the front and back. In the present invention, when the circuit board support does not require a conductive function such as grounding, the board support may be formed of an insulating material such as a resin. In this case, the board supporter may fix the fixing part to the circuit board with an adhesive.

1, 1A, 1B, 1C Substrate support 2 Circuit board 3 Chassis 11 Fixing portion 12 Locking portion 13 Restriction portion 21 First insertion hole 22 Second insertion hole 23 Fixed land 31 First support hole 32 Second Support hole 33 Emboss 121 Locking piece 122 Release piece

Claims (5)

  A substrate support for supporting a substrate on a chassis or the like, a first fixing portion fixed to the substrate and a first portion provided on a chassis or the like that protrudes from the back surface side of the substrate and is located on the back surface side of the substrate. A locking portion that is inserted into the support hole, and the locking portion is engaged with a locking piece that is locked in the first support hole and a part of the locking piece is exposed on the surface side of the substrate. And a release piece for releasing the engagement of the engagement piece.   The said latching | locking part is provided in one side of the said adhering part, and the other side of the said adhering part is provided with the control part fitted in the 2nd support hole provided in the said chassis etc .. Substrate support tool.   The substrate support according to claim 1, wherein the locking portion is provided on both sides of the fixing portion.   The substrate support according to claim 1, wherein the locking portion is provided only on one side of the fixing portion. The substrate support according to any one of claims 1 to 4, wherein the substrate support is formed of a conductive material and fixed to a ground pattern of the substrate.

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