JP2019044220A - Demolding method for cylindrical member - Google Patents

Abstract

To provide a demolding method in which a member is easy to demold from a matrix regardless of the size of a gap between the matrix and an electroformed film.SOLUTION: A demolding method for a cylindrical member comprises: a step in which an insulation material is arranged on part of a cylindrical metal matrix for molding a cylindrical member; a step in which an electroformed film is formed so that the insulation material includes a hole on the side face of the cylindrical metal matrix; and a step in which the electroformed film is demolded from the cylindrical matrix using the hole. The insulation material may be one of metal oxide films, masking tapes, rubbers, and resists.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a method for releasing an electroformed film from a matrix when manufacturing a cylindrical member formed by electroforming a metal matrix.

  In the electroforming process, after forming an electroformed film of a predetermined thickness by electroplating on a matrix mold or an electroforming mold, a method of forming a mold release coating is mainly used as a method of releasing the electroformed film from the matrix. ing. As a method of forming a release film, a mechanical treatment method of applying wax, grease or the like, a chemical treatment film method of forming by anodic electrolysis in a 10% NaOH solution or a chemical treatment solution such as a chromic acid solution is there.

  In addition, there has been proposed a method of releasing the mold by supplying compressed air into the electroformed film in close contact after the end surface treatment (see, for example, Patent Document 1).

Unexamined-Japanese-Patent No. 5-98487

  In the mold release method of Patent Document 1, a gap for supplying a fluid such as compressed air is required. For example, when the electroformed film is thickened or strengthened, the gap for supplying the fluid may be narrowed.

  Therefore, the present invention provides a method for easily removing molds from the matrix regardless of the size of the gap between the matrix and the electroformed film.

  In order to solve the above-mentioned subject, in the mold release method of the cylindrical member of the present invention, the process of arranging insulating material in a part of cylindrical metal matrix which molds a cylindrical member, and the side of the cylindrical metal matrix The method further comprises the steps of: forming an electroformed film so as to include a hole shape by using an insulating material; and releasing the electroformed film from the cylindrical mold using the hole shape.

  According to the present invention, the electroformed film can be easily released from the matrix.

(A) It is sectional drawing which shows an example of the cylindrical member regarding the mold release method concerning embodiment of this invention, and an insulation process. (B) It is a perspective view of the mother die 1 after the insulation process. It is sectional drawing at the time of mold release of a cylindrical member and a mold release apparatus. FIG. 10 is a perspective view of a mother die 1 after insulation processing in Example 2; It is an electroforming film precipitation state figure around an insulation treatment material. (A) It is sectional drawing of the matrix and cylindrical member of Example 2. FIG. (B) It is sectional drawing of the matrix and cylindrical member of Example 3. FIG. (A) It is sectional drawing of the mother die of Example 4, and a cylindrical member. (B) It is sectional drawing of the matrix in Example 5, and a cylindrical member. It is shape sectional drawing of the insulating material formed using the resist. FIG. 18 is a cross-sectional view of a matrix and a cylindrical member in Example 8;

  Embodiments of the present invention will be described using the drawings. FIG. 1A shows a cross-sectional view of the embodiment of the present invention, which is an example of the configuration before releasing the mold. Insulating rings 2 are set on both ends of a mold 1 which is a cylindrical metal mold. And the process which arrange | positions the insulating material 3 is performed with respect to the part which wants to form a hole shape with respect to an electroforming film. Thereafter, the electroformed film 4 is deposited by electroforming to form a cylindrical member, and the insulating ring 2 and the insulating material 3 are removed. FIG. 1 (b) is a perspective view of FIG. 1 (a).

  In FIG. 1A, the insulating ring 2 is used so that the electroformed film 4 is not formed at the end of the matrix 1. As another method, the end of the mold 1 may be made of, for example, a material such as aluminum, titanium or tungsten which is a metal material capable of forming an insulating film by anodic oxidation. Alternatively, a thin film made of the above-described metal material that can be anodized may be formed on the surface of the mold 1 and the surface may be oxidized by anodization. In this case, a thin film made of the above-described metal material that can be anodized can be formed not on the side surface but on the bottom surface, and the surface can be oxidized by anodization.

  With regard to the insulation processing performed on the portion forming holes in the electroformed film 4 (electrodeposited film), an insulating material such as a masking tape, rubber, resist, etc. in addition to the insulating method using the oxide film described above It can also be used.

  With regard to the insulating material, it is necessary to select a material having excellent acid resistance and alkali resistance depending on the type of electroforming bath.

  If it is a masking tape, the tape made from the polyimide which has the outstanding corrosion resistance and heat resistance, for example can be used. In the case of the masking tape, the mother die 1 can be easily subjected to the insulation treatment.

  Further, a resist may be used in the case where the hole shape to be provided is minute for the electroformed film, in the case where it is desired to give a complicated shape, in the case where the dimensional tolerance is strict, The resist may be in the form of liquid, film, electrodeposition resist or the like, and any of them may be used. With respect to the application to the mold 1, by using a photolithography method or a printing method, it is possible to apply an insulating process of a shape that is difficult to form with a masking tape.

  With regard to the peeling of the insulating material carried out to the portion forming the hole in the electroformed film, if it is a masking tape, special treatment after electroforming is unnecessary and it can be easily peeled off. On the other hand, in the case of using a resist, peeling can be easily performed by using a peeling solution compatible with various resists.

  The material of the electroformed film formed by the electroforming method includes nickel, nickel-iron, nickel-iron-cobalt, nickel-cobalt, nickel-phosphorus, nickel-iron-phosphorus alloy and the like. In addition, for example, iron or an alloy thereof, copper or an alloy thereof, cobalt or an alloy thereof, a tungsten alloy, a fine particle dispersed metal or the like can also be used. As the material of matrix 1, iron or its alloy, stainless alloy, aluminum or its alloy, copper or its alloy, tungsten alloy, etc. with surface treatment such as wear resistance or corrosion resistance as needed can be appropriately used. Just do it.

  The thickness of the coating is preferably 10 to 1000 μm in the form of a belt. If the thickness is 10 μm or less, the film thickness is too thin, so the electroformed film is broken at the time of mold release. When the thickness is 1000 μm or more, the stress of the electroformed film becomes too high, and the adhesion to the matrix becomes high. In addition, since the rigidity of the electroformed film itself becomes strong, the resistance at the time of mold release is increased, and the electroformed film is deformed at the time of mold release. When the cylindrical member is used as a mold, if the thickness is less than 100 μm, the rigidity of the electroformed film is insufficient and sufficient durability as a mold can not be obtained. On the other hand, at 1000 μm or more, there is a problem that the mold release becomes difficult due to the above reason. Therefore, when using a cylindrical member as a metal mold | die, as thickness of an electroforming film, the range of 100-1000 micrometers is more preferable.

  The insulating ring 2 is subjected to the insulating treatment to the portion of 25 mm from both ends of the mother die 1. In order to give a hole shape to the electroformed film, as shown in FIG. 1 (b), four points in total at 90 ° pitch so as to be point symmetrical with respect to the circumferential direction of the matrix 1 An insulation process is performed to arrange a circular insulating material 3. Thereafter, electroforming treatment is performed on the matrix 1, and an electroforming film 4 of electroforming nickel-iron alloy is formed on a portion which is not subjected to the insulation treatment. By removing the insulating material and releasing the electroformed film 4, a cylindrical member made of an electroformed film provided with four holes can be obtained. At this time, when the shape of the hole is too large, the rigidity of the cylindrical member becomes small, and when it is too small, it is difficult to catch because of demolding. Therefore, the diameter of the hole shape is the diameter of the master 1 However, 0.01 to 0.04 is preferable. More preferably, the diameter of the hole shape is preferably 0.025 to 0.035 with respect to the diameter of the matrix 1.

  A nickel-iron alloy was used as the composition of the electroformed film. The reason why the nickel-iron alloy is used is that hardness and tensile strength are higher than that of nickel alone, and therefore, it shows excellent performance when used as an electroforming mold. In addition, by selecting a nickel-phosphorus alloy, a nickel-iron-phosphorus alloy, a nickel-cobalt alloy, a nickel-iron-cobalt alloy, etc., when used as a mold, it exhibits better performance than nickel alone. On the other hand, by alloying, stress adjustment of the electroformed film becomes difficult, and it becomes difficult to release the electroformed film from the matrix. Therefore, it is necessary to add a plurality of stress modifiers and maintain the chemical concentration precisely, which makes it difficult to control the plating bath. By using the present invention, the electroformed film can be easily removed from the matrix without complicated management of the plating bath.

  The iron content in the electroformed film in the present invention is 1 to 70 wt%. In order to increase hardness and strength, 5 to 50 wt% is preferable. Furthermore, when it is desired to impart flexibility to the electroformed film, it is more preferable to set the iron content to 10 to 30 wt%. By setting the iron content in the electroformed film to 10 to 30 wt%, flexibility can be imparted while enhancing hardness and strength.

  In addition, the electroformed film in the present invention may contain sulfur, carbon and manganese as impurities. However, a sulfur content of 0.1 wt% or less, a carbon content of 0.01 wt% or less, and a manganese content of 0.1 wt% or less are acceptable because they do not affect the physical properties of the electroformed film. Moreover, when making a thermal expansion coefficient small, the composition used as an invar alloy can also be selected. That is, 36 wt% of nickel is added to iron, and about 0.7 wt% of manganese and less than 0.2 wt% of carbon are contained.

  The film properties of the electroformed film 4 were as follows.

<Characteristics of electroformed nickel-iron alloy film>
Hardness Hv (0.1 kg) 500 to 600
Tensile strength 1500-2100 MPa

  Hereinafter, the present invention will be more specifically described by way of examples. However, the present invention is not limited to only such embodiments.

Example 1
In Example 1, the dimensions of the matrix die 1 are 200 mm in diameter and 850 mm in length, and insulation processing is applied up to 25 mm from both ends. In order to impart a hole shape to the electroformed film, as shown in the perspective view of FIG. 1 (b), the insulating material 3 is disposed such that the center of the circle having a diameter of 6.5 mm is 125 mm from the upper end. An insulation process is performed in which four circular insulation materials 3 are arranged at 90 ° pitch so as to be point-symmetrical with the center axis of the matrix 1 as the center of symmetry. Thereafter, an electroforming film 4 made of an electroformed nickel-iron alloy is formed on a portion which has not been subjected to the insulating process by using the electroforming method for the matrix 1. By removing the insulating material 3 and releasing the electroformed film 4, a cylindrical member provided with four holes having a length of 800 mm, an inner diameter of 200 mm, and a diameter of 6.5 mm is obtained.

  In the insulation process, a masking material is used such that the end of the electroformed film 4 formed on the matrix 1 is vertical. A masking tape is placed on the portion of the electroformed film where holes are to be formed, and insulation processing is performed to form an electroformed nickel-iron alloy film having a thickness of 300 μm. After electroforming, the end face and the masking material for hole shape preparation are removed. As a result, in the electroformed nickel-iron alloy coating, the electroformed end face has a shape substantially perpendicular to the matrix. With respect to the circularly-insulated part, a hole shape of 6.56.5 mm can be formed.

  As shown in FIG. 2, the fixing jig 5 is inserted into a hole of 6.56.5 mm to fix the electroformed film 4. A rotary motor is attached to the mold release device, and can be pulled up while rotating the matrix. In a state where the electroformed film is fixed, the motor is driven, and the electroformed film 4 can be released from the matrix 1 by pulling the matrix upward while rotating the matrix.

(Example 2)
As shown in FIG. 3, the insulating material 3 is disposed such that the center of the circle having a diameter of 6.5 mm is disposed 125 mm from the upper and lower ends with respect to both ends of the matrix 1. Insulating treatment is performed by arranging eight round insulating materials 3 at 90 ° pitch so as to be point symmetrical with respect to the circumferential direction of the mold with respect to the central axis of the mold. The insulation process is carried out with masking tape in the same manner as in Example 1. Thus, by giving eight hole shapes to the cylindrical member in point-symmetrical positions, the cylindrical member can be fixed with an equal force, and the risk of deformation of the cylindrical member when the matrix is pulled up is reduced. . When the demolding treatment is performed in the same manner as in Example 1, the electroformed film 4 can be released from the matrix 1.

(Example 3)
When performing the same insulation process as Example 1, the thickness of the insulating material 3 is made 3 times the film thickness of the electroformed film 4. In the insulation process, as in the first embodiment, four insulating materials 3 are arranged at a height of 125 mm from the upper end of the master 1. In the electroforming process, the current is concentrated in the vicinity of the insulating material 3 and the electroformed film thickness becomes thicker toward the insulating portion. The film thickness around the insulating material may reach several times the film thickness near the center. Therefore, when the thickness of the insulation treatment material is set to the same thickness as the thickness of the electroformed film, as shown in FIG. 4, the electroformed film crosses over the insulation treatment material and is deposited, making it difficult to remove the insulating material 3 Become. If the insulating material remains, it will enter the interface between the mold 1 and the cylindrical member at the time of demolding, which will increase the resistance at the time of demolding. As a result of making the thickness of the insulating material three times as large as that of the electroformed film, the shape of the electroformed film around the insulating material is formed vertically, and the insulating material can be reliably removed. Further, the electroformed film 4 produced in this manner becomes thicker toward the insulating material as shown in FIG. 5 (a). In addition, the electroformed film 4 becomes thicker toward the insulating material 3 at the end of the matrix 1 as well. When viewed in cross section, a film thickness distribution in which two reverse crown shapes overlap is formed at a total of two places on the upper and lower sides of the insulating material 3. In fact, since the film thickness is increased in three dimensions toward the insulating material 3, the thickness of the electroformed film 4 is increased also in the cross section orthogonal to FIG. 5 (a). Further, when the insulation processing as in Example 2 is performed, a total of three film thickness distributions in which two reverse crown shapes are overlapped are formed when viewed in a cross section as illustrated in FIG. 5B. When the mold release treatment is performed in the same manner as in Example 1, the electroformed film 4 can be released from the mother die 1.

(Example 4)
In the step of performing the same insulation treatment as in Example 1 to give the hole shape to the electroformed film 4, as shown in FIG. 6A, the thickness of the electroformed film 4 becomes thinner from the upper direction to the lower direction Electroforming process. In the present embodiment, the film thickness of the electroformed film 4 is adjusted by optimizing the masking of the anode material used for the electroforming. Other than that, the film thickness can also be adjusted by using the auxiliary electrode, adjusting the insulation process to the matrix, or the like. By performing the electroforming process so that the thickness on the lower side of the cylindrical member is reduced, the stress of the lower electroformed film is reduced, so that the initial release resistance is reduced. In the mold release step, since the most resistance is applied in the early stage of mold release, the mold release property is improved by reducing the stress of the electroformed film on the lower side. Also in the present embodiment, as in the third embodiment, since the film thickness increases toward the insulating material 3, two crown shapes overlap in the upper and lower two places of the insulating material 3 applied to give the hole shape. A thick film thickness distribution is formed. When the mold release treatment is performed in the same manner as in Example 1, the electroformed film 4 can be released from the matrix.

(Example 5)
As shown in FIG. 6 (b), the electroformed film 4 is formed using a matrix 1 which decreases as the outer diameter moves downward. The insulation process is the same as in the first embodiment. When the cylindrical member is formed in this manner, the mold release resistance gradually decreases because the clearance between the matrix and the cylindrical member increases as the mold release proceeds and the matrix is pulled upward. As in the first embodiment, when the mold release treatment is performed, the electroformed film 4 can be released from the matrix 1.

(Example 6)
This embodiment is the same as the embodiment 1 except that a resist is used as the insulating material 3 for giving the hole shape to the electroformed film 4. For the resist, an electrodeposition resist is used. The formation of the resist film uses a photolithography method. The thickness of the resist is 900 μm, which is three times the thickness of the electroformed film 4. By performing the insulation process using a resist, the insulation process can be performed with high accuracy as compared to a masking tape or the like. In addition, complicated shapes, minute hole shapes and the like which are difficult to process with masking tape can be manufactured. When the mold release treatment from the mother die 1 is performed on the electroformed nickel-iron alloy film produced in this manner, mold release can be performed as in the first embodiment.

(Example 7)
When a resist is used as the insulating material 3 for giving the hole shape to the electroformed film 4, the shape of the insulating process can be formed arbitrarily. For example, as shown in FIGS. 7 (a), (b) and (c), the insulating material 3 is formed so that the thickness continuously changes from the surface of the mold 1 to the surface of the electroformed film, It is possible to provide a hole shape that makes it easy to pull the electroformed film 4 during molding. In the present embodiment, an electrodeposition resist is used, exposure processing is performed using a maskless exposure machine, and development processing is performed to form the resist shape of FIG. 7A on the matrix 1. After that, the electroforming process was performed to a predetermined thickness, and as a result of removing the resist, it was possible to give the cylindrical member a hole shape whose dimensions continuously change. Further, if a resist is formed as shown in FIG. 7B, a step-like hole shape can be produced. If the resist is formed as shown in FIG. 7C, the tip shape of the electroformed film can be rounded. By rounding the electroformed shape at the tip of the hole, the load applied to the electroformed film is dispersed when pulling the electroformed film at the time of demolding, so the risk of deformation or breakage of the electroformed film is reduced.

(Example 8)
As shown in FIG. 8A, the insulation process is performed only at the end of the matrix 21, and the electroforming process is started. When the first electroformed film 24 is formed to about 50 μm, the electroforming process is temporarily stopped. In this state, the mother die is taken out from the electroforming tank, washed with water and dried, and then, as shown in FIG. 8B, the same insulation treatment as in Example 1 is performed. Thereafter, although the electroforming process is resumed, once the nickel plating film is exposed to the atmosphere, a strong oxide film is formed on the plating film surface. Therefore, it is necessary to sufficiently remove the oxide film by acid cleaning before resumption of the electroforming process. In this example, the substrate was immersed for 5 minutes in a dilute aqueous sulfuric acid solution of about 10 wt%. Thereafter, water washing is performed, the insulating material 23 is disposed, and the electroforming process is restarted, and the second electroformed film 25 is formed to about 250 μm, so that the total thickness of the electroformed films 24 and 25 is 300 μm. did. By removing the insulating material 23 after electroforming, a concave shape can be formed in the electroformed film. By making the hooking part at the time of demolding into a concave shape, it is possible to prevent the contact between the matrix and the hooking jig at the time of demolding. Therefore, the risk of damaging the mother mold at the time of demolding can be reduced. The hooking portion at the time of demolding may be appropriately selected from the concave shape and the through hole according to the specification of the product.

(Other embodiments)
The present invention will be described in more detail by the following examples, which are not intended to limit the present invention.

  The electroformed film produced in Examples 1 to 86 can be used for an endless type resin belt molding die for transport and the like. The hole shape formed in the electroformed film of Examples 1 to 7 can be used as a fixing hole when attached to a molding machine or the like. When the hole shape formed in the electroformed film is used as a fixing hole when attached to a molding machine or the like, the process of forming the fixing hole can be reduced, and the productivity is excellent.

1 master 2 insulating ring 3 insulating material 4 electroformed film (cylindrical member)
5 Cylindrical member fixture 6 Mother mold fixture 7 Drive motor
23 Insulating material 24 First electroformed film 25 Second electroformed film

Claims (6)

  A step of disposing an insulating material on a cylindrical metal matrix forming a cylindrical member, and a step of forming an electroformed film on the side surface of the cylindrical metal matrix so as to include a concave shape or a hole shape by the insulating material And a step of releasing the electroformed film from the cylindrical matrix using the concave shape or the hole shape.   The method for demolding a cylindrical member according to claim 1, wherein a plurality of the insulating materials are arranged point-symmetrically with respect to a central axis of the matrix.   A plurality of the insulating materials are disposed on one end side of the cylindrical metal matrix and the other end side opposite to the one end side, and the electroformed film has a hole shape on the one end side and the other The mold release method for a cylindrical member according to claim 1 or 2, wherein the mold is demolded using the hole shape on the end side.   The method for releasing a cylindrical member according to any one of claims 1 to 3, wherein the thickness of the insulating material is three or more times the thickness of the electroformed film.   The electroformed film has a reverse crown-shaped film thickness distribution in which the film thickness is continuously increased from the both end side of the electroformed film toward the hole shape along the longitudinal direction of the matrix. The method for releasing a cylindrical member according to any one of claims 1 to 4, characterized in that The method for releasing a cylindrical member according to any one of claims 1 to 5, wherein the insulating material is any one of a metal oxide film, a masking tape, a rubber and a resist.

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