JP2018533846A - 液冷却放熱システム及びその液体放熱列 - Google Patents
液冷却放熱システム及びその液体放熱列 Download PDFInfo
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- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
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- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
- H05K7/20272—Accessories for moving fluid, for expanding fluid, for connecting fluid conduits, for distributing fluid, for removing gas or for preventing leakage, e.g. pumps, tanks or manifolds
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- F28D1/04—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid with tubular conduits
- F28D1/053—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid with tubular conduits the conduits being straight
- F28D1/0535—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid with tubular conduits the conduits being straight the conduits having a non-circular cross-section
- F28D1/05366—Assemblies of conduits connected to common headers, e.g. core type radiators
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
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- F28D1/00—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators
- F28D1/02—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid
- F28D2001/0253—Particular components
- F28D2001/026—Cores
- F28D2001/028—Cores with empty spaces or with additional elements integrated into the cores
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- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D21/00—Heat-exchange apparatus not covered by any of the groups F28D1/00 - F28D20/00
- F28D2021/0019—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for
- F28D2021/0028—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for for cooling heat generating elements, e.g. for cooling electronic components or electric devices
- F28D2021/0031—Radiators for recooling a coolant of cooling systems
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- F28F2250/00—Arrangements for modifying the flow of the heat exchange media, e.g. flow guiding means; Particular flow patterns
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- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
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- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
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- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
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Abstract
【選択図】図1
Description
2 ポンプカバー
3 ポンプホルダー締結ネジ
4 ポンプステータ
5 ポンプホルダー
6 ポンプシールリング
7 ポンプロータ
8 ポンプ本体
9 ポンプ水室メインプレート
10 ポンプ水室
11 窓口
12 放熱列
13 放熱列放注水孔
14 ファン
15 ファン締結ネジ
16 シリカゲルチューブ
17 パイプ
18 水管継手
19 水冷パッドチャンバー体
20 水冷パッドLED装飾品
21 水管継手シールリング
22 継手締結ネジ
23 水冷パッドシールリング
24 吸熱銅底板
25 銅底板締結ネジ
26 ポンプ室
30 上流水室
31 入水口
32 出水口
33 注水口
34 ハーモニカ管
35 ファン固定大側板
36 下流水室
37 錫半田フィン
38 ポンプチャンバー
39 半田フィン
40 仕切り片
Claims (10)
- 冷却管と、冷却管に設けられる放熱構成部を備える放熱手段と、
発熱素子に付着され、この発熱素子から熱伝導機能を稼ぐ吸熱手段と、
前記放熱装置と前記吸熱装置を接続するために設けられるパイプと、及び
前記冷却管の間に一体的に設けられ、動力を発生させて冷却液を前記冷却管の中に循環させるポンプ送り装置であって、ポンプ水室が備えられ、前記ポンプ水室の上端と下端の開口に冷却管へ接続される接続口が設けられ、かつ前記接続口がシール半田付けによって開放の上下両端における冷却管の管口に半田付けされることによって、冷却管と並行して設置されるようにして前記ポンプ送り装置全体を放熱列と一体にさせる前記ポンプ送り装置と、
を備えることを特徴とする液冷却放熱システム。 - さらに一定量の冷却液を有する留液室を備え、前記冷却液は前記発熱素子からこの冷却液に分散された熱を集中し伝送するものであるが、前記留液室が前記放熱装置の冷却管の少なくとも一端に設けられており、
前記ポンプ送り装置はポンプ室とこのポンプ室内に設けられるポンプ動力本体とを備え、前記ポンプ室の両端にそれぞれ冷却管へ接続する少なくとも一つの入液口と排液口が設けられ、前記ポンプ動力本体は出液口を介して冷却液をポンプ送りさせて冷却管によって循環させることを特徴とする前記請求項1に記載の液冷却放熱システム。 - 前記留液室が前記冷却管の一側に設けられ、前記留液室内に仕切り片が設けられ、この仕切り片が中間位置に位置されており、前記仕切り片によって前記留液室を入液チャンバーと出液チャンバーに仕切り、前記入液チャンバーが留液室の中間位置に設置され、前記冷却管が入液チャンバーと出液チャンバーに連通して、前記入液チャンバーに入液口が設けられ、前記出液チャンバーに出液口が設けられており、前記パイプはそれぞれ入液口と出液口を吸熱手段へ接続することを特徴とする前記請求項2に記載の液冷却放熱システム。
- 前記留液室は前記冷却管の両側にそれぞれ設けられる上流液室と下流液室が備えられ、前記上流液室内に仕切り片が設けられ、前記仕切り片が中間位置に位置されており、前記仕切り片によって前記上流液室を入液チャンバーと出液チャンバーに仕切り、前記入液チャンバーが上流液室の中間位置に位置され、前記冷却管は入液冷却管と出液冷却管が備えられ、それぞれ入液チャンバーと出液チャンバーを前記下流液室へ連通することを特徴とする前記請求項2に記載の液冷却放熱システム。
- 前記入液冷却管はN本並行して設けられ、共に切断されて窓口の形状に形成され、窓口の上下にそれぞれ並行しているN個の入液冷却管の管口が形成され、前記ポンプ室に相応するそれぞれN個の入液口と出液口が設けられ、前記ポンプ室はそれぞれN個の入液口と出液口を入液冷却管の上下両端の管口に封止されるように連通しており、
前記出液冷却管はその数がMとされるとM>N?1(Nは整数)が満たされ、並行して前記入液冷却管の両側に設けられることを特徴とする前記請求項4に記載の液冷却放熱システム。 - 前記ポンプ動力本体はモーターと動力翼片を備え、前記動力翼片はけい素鋼翼片であり、ステンレス鋼軸芯を使用しており、前記放熱手段の側面にファンが設けられ、前記ファンにより気体が流動して放熱手段の温度を下げて熱を取り出すことを特徴とする前記請求項2?5のいずれか一つに記載の液冷却放熱システム。
- 前記放熱構成部は放熱フィンや放熱波紋ストリップであり、前記放熱フィンの場合、前記冷却管に嵌着されて半田付けによって固定されまたはこの冷却管に直接に半田付けされていることを特徴とする前記請求項6に記載の液冷却放熱システム。
- 前記吸熱手段は熱交換底板と冷却液収納チャンバーを備え、前記熱交換底板と冷却液収納チャンバーとがシールリングを介して接続されることを特徴とする前記請求項7に記載の液冷却放熱システム。
- 前記熱交換底板は銅やアルミニウムやアルミニウム合金や合金鋼の金属材料からなり、
前記熱交換底板の内側底面に溝付き型構造が採用され、冷却液収納チャンバー内の冷却液を発熱素子に最大限に近接させることを特徴とする前記請求項8に記載の液冷却放熱システム。 - 冷却管及び冷却管に設けられる放熱構造部と、
ポンプ室とポンプ室内に設けられるポンプ動力本体とを備え、前記ポンプ室が一体的に前記冷却管の間に設けられ、ポンプ動力本体は動力を発生させて冷却液を前記冷却管の中に循環させるポンプ送り装置と、および
一定量の冷却液を有するとともに連通させる留液室であって、前記冷却液は前記発熱素子からこの冷却液に分散された熱を集中し伝送するものであり、前記留液室が前記放熱装置の冷却管の少なくとも一端に設けられ、又は前記ポンプ室を留液室としている前記留液室と、
を備えることを特徴とする請求項1に記載の液冷却放熱システムの液体放熱列。
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PCT/CN2017/070823 WO2017088840A1 (zh) | 2015-11-12 | 2017-01-11 | 一种液冷散热系统及其液体散热排 |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7115786B1 (ja) * | 2021-01-27 | 2022-08-09 | 崇賢 ▲黄▼ | 液冷放熱器 |
Families Citing this family (48)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104754924B (zh) * | 2015-03-31 | 2016-02-03 | 广东申菱环境系统股份有限公司 | 液冷装置和辅助散热装置结合的服务器散热系统 |
CN105263301B (zh) * | 2015-11-12 | 2017-12-19 | 深圳市研派科技有限公司 | 一种液冷散热系统及其液体散热排 |
TWI634304B (zh) * | 2016-03-01 | 2018-09-01 | 雙鴻科技股份有限公司 | 水冷散熱裝置 |
CN106455420B (zh) * | 2016-09-11 | 2018-10-12 | 奇鋐科技股份有限公司 | 水冷排单元及其水冷模组 |
CN106852096B (zh) * | 2017-04-20 | 2023-10-03 | 石家庄盈博智能科技有限公司 | 一种水冷散热装置 |
CN107084376A (zh) * | 2017-06-29 | 2017-08-22 | 湖南明和光电设备有限公司 | 一种液冷风冷组合散热系统 |
TWD191875S (zh) * | 2017-11-10 | 2018-07-21 | 雙鴻科技股份有限公司 | 水冷散熱裝置 |
CN108088301A (zh) * | 2017-12-25 | 2018-05-29 | 江西鑫田车业有限公司 | 一种通用型散热器 |
CN108287602B (zh) * | 2018-01-29 | 2021-04-30 | 温州职业技术学院 | 一种计算机电源散热装置 |
US10694640B2 (en) * | 2018-01-30 | 2020-06-23 | Quanta Computer Inc. | Server water cooling modules prevent water leakage device |
CN108323113B (zh) * | 2018-02-12 | 2024-03-29 | 广东昂湃液冷技术有限公司 | 一种双向施压的液冷散热结构 |
JP7031373B2 (ja) * | 2018-03-01 | 2022-03-08 | セイコーエプソン株式会社 | プロジェクター |
CN108681192A (zh) * | 2018-03-13 | 2018-10-19 | 苏州科勒迪电子有限公司 | 可应用于dmd芯片散热的液冷型散热器 |
JP7238401B2 (ja) * | 2018-03-30 | 2023-03-14 | 日本電産株式会社 | 冷却装置 |
JP2019179832A (ja) * | 2018-03-30 | 2019-10-17 | 日本電産株式会社 | 冷却装置 |
US10768677B2 (en) * | 2018-04-13 | 2020-09-08 | Cooler Master Technology Inc. | Heat dissipating device having colored lighting and persistence effect |
CN108566768B (zh) * | 2018-06-01 | 2021-03-23 | 深圳市研派科技有限公司 | 一种无管液冷散热系统 |
CN109164931B (zh) * | 2018-07-26 | 2021-07-27 | 合肥金新允电子技术有限公司 | 一种elo工业触摸显示器的散热装置 |
US10681841B2 (en) * | 2018-08-08 | 2020-06-09 | Evga Corporation | Water-cooling heat dissipation device suitable for computer |
CN108845654B (zh) * | 2018-09-15 | 2023-10-31 | 东莞市领胜泵业科技有限公司 | 一种水冷散热器 |
CN109944806B (zh) * | 2019-04-23 | 2024-08-13 | 迎新科技(中国)有限公司 | 并联双泵导液装置及其液冷散热系统 |
CN109247000B (zh) * | 2018-11-12 | 2024-08-27 | 青岛天乾科技有限公司 | 一种电子产品一体化水冷散热器及其应用的方法 |
US10852788B2 (en) * | 2018-12-12 | 2020-12-01 | George Anthony Edwards | Computer component cooling device and method |
CN109491471A (zh) * | 2018-12-28 | 2019-03-19 | 浙江晟昱散热器制造有限公司 | 一种石墨烯涂层散热器 |
CN111623648A (zh) * | 2019-02-28 | 2020-09-04 | 浙江吉利汽车研究院有限公司 | 散热装置、散热系统及汽车 |
CN109817106B (zh) * | 2019-03-19 | 2024-05-14 | 京东方科技集团股份有限公司 | 显示装置 |
CN112399776B (zh) | 2019-08-13 | 2022-05-24 | 深圳昂湃技术有限公司 | 一种液冷散热装置 |
CN110750149A (zh) * | 2019-11-20 | 2020-02-04 | 北京市鑫全盛科技有限公司 | 双层散热的水冷散热器的水冷头 |
CN111194155B (zh) * | 2019-12-18 | 2021-10-12 | 深圳市迅凌科技有限公司 | 水冷头、水冷散热器以及电子设备 |
CN111552363B (zh) * | 2020-05-15 | 2024-08-02 | 深圳市万景华科技有限公司 | 液冷散热装置 |
CN111984086B (zh) * | 2020-09-14 | 2022-03-11 | 青海师范大学 | 一种计算机水冷散热装置 |
CN112153869A (zh) * | 2020-09-25 | 2020-12-29 | 南京科廖灼电子商务有限公司 | 一种可智能调控温度的网络科技用交换机 |
CN112444050A (zh) * | 2020-11-30 | 2021-03-05 | 东莞汉旭五金塑胶科技有限公司 | 内置有水泵的整体腔式水冷排 |
CN112596591B (zh) * | 2020-12-04 | 2023-04-18 | 福建工程学院 | 一种可对固态硬盘和南桥芯片主动散热的水冷式散热装置 |
CN112506319B (zh) * | 2020-12-07 | 2023-02-24 | 华为技术有限公司 | 液冷系统及电子设备 |
CN112393626A (zh) * | 2020-12-09 | 2021-02-23 | 惠州汉旭五金塑胶科技有限公司 | 进水多流道多集水盒加水泵的液冷散热水排 |
EP4012313A1 (en) * | 2020-12-14 | 2022-06-15 | Asetek Danmark A/S | Radiator with adapted fins |
CN112995814B (zh) * | 2021-02-06 | 2022-02-08 | 金华职业技术学院 | 一种新媒体传播用播音装置 |
CN112969331B (zh) * | 2021-02-24 | 2022-06-07 | 李柯兴 | 一种电子工程用抗干扰设备 |
CN113242680A (zh) * | 2021-05-28 | 2021-08-10 | 惠州汉旭五金塑胶科技有限公司 | 一种提高散热效果的液冷散热器 |
CN115533309A (zh) * | 2021-06-28 | 2022-12-30 | 上海壹晨机械设备有限公司 | 一种用于薄板焊接的手持激光焊接一体机 |
TWM623656U (zh) * | 2021-10-06 | 2022-02-21 | 志合訊息股份有限公司 | 液冷式筆記型電腦及其供電裝置 |
TWM623783U (zh) * | 2021-11-12 | 2022-02-21 | 志合訊息股份有限公司 | 給水裝置及其水管接頭結構 |
CN114269142B (zh) * | 2021-11-24 | 2023-07-18 | 苏州浪潮智能科技有限公司 | 一种适配于液冷散热软管模组的治具及其使用方法 |
CN114302255A (zh) * | 2021-12-22 | 2022-04-08 | 段梦飞 | 一种物联网信息基站 |
TW202340666A (zh) * | 2022-04-08 | 2023-10-16 | 微星科技股份有限公司 | 散熱裝置 |
CN219317208U (zh) | 2023-01-09 | 2023-07-07 | 惠州市讯硕科技有限公司 | 一体式水冷水泵 |
CN117100489B (zh) * | 2023-10-24 | 2023-12-26 | 成都科瑞普医疗器械有限公司 | 一种用于应急的伤处冷敷装置 |
Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05312492A (ja) * | 1992-05-14 | 1993-11-22 | Showa Alum Corp | 熱交換器 |
JP2001320187A (ja) * | 2000-02-29 | 2001-11-16 | Matsushita Electric Ind Co Ltd | 電子部品の液体冷却装置 |
JP2002368471A (ja) * | 2001-06-05 | 2002-12-20 | Matsushita Electric Ind Co Ltd | 冷却装置 |
JP2004218969A (ja) * | 2003-01-16 | 2004-08-05 | Univ Tokyo | 熱交換器 |
JP2005332856A (ja) * | 2004-05-18 | 2005-12-02 | Honda Motor Co Ltd | 放熱装置 |
US20070103869A1 (en) * | 2005-11-08 | 2007-05-10 | Foxconn Technology Co., Ltd. | Integrated liquid cooling system |
JP2008177599A (ja) * | 2008-03-06 | 2008-07-31 | Sanyo Denki Co Ltd | ラジエータ |
JP2013015289A (ja) * | 2011-07-05 | 2013-01-24 | Sharp Corp | 熱交換器及びそれを搭載した空気調和機 |
JP2013145830A (ja) * | 2012-01-16 | 2013-07-25 | Nikkei Nekko Kk | 電子機器用液冷システムにおけるラジエータ |
JP2015050233A (ja) * | 2013-08-30 | 2015-03-16 | 富士通株式会社 | 放熱器および放熱器の製造方法 |
Family Cites Families (70)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE69013761T2 (de) * | 1989-06-05 | 1995-03-16 | Ebara Corp | Magnetpumpe. |
JP3530151B2 (ja) * | 2001-06-08 | 2004-05-24 | 株式会社東芝 | 発熱体を内蔵する電子機器およびこの電子機器に用いる冷却装置 |
US20030007325A1 (en) * | 2001-07-09 | 2003-01-09 | Thunem Erik Andrew | Use of a sealed insulated container for a personal computer coupled with a method for removal of waste heat generated by the encased electronics |
CN2577441Y (zh) * | 2002-08-05 | 2003-10-01 | 邵俊发 | 水冷式全密闭散热装置 |
US7079394B2 (en) * | 2003-01-08 | 2006-07-18 | Lenovo (Singapore) Pte. Ltd. | Compact cooling device |
US7094039B2 (en) * | 2003-05-21 | 2006-08-22 | Act-Rx Technology Corporation | Heat-dissipating fan |
US7971632B2 (en) * | 2003-11-07 | 2011-07-05 | Asetek A/S | Cooling system for a computer system |
CN2657080Y (zh) * | 2003-11-14 | 2004-11-17 | 吉林大学 | 用于计算机发热件的冷却装置 |
US6955212B1 (en) * | 2004-04-20 | 2005-10-18 | Adda Corporation | Water-cooler radiator module |
JP2005315156A (ja) * | 2004-04-28 | 2005-11-10 | Toshiba Corp | ポンプおよびポンプを備える電子機器 |
JP4549759B2 (ja) * | 2004-07-08 | 2010-09-22 | 富士通株式会社 | 冷却モジュール |
JP2006039663A (ja) * | 2004-07-22 | 2006-02-09 | Hitachi Ltd | 液循環システム及びこれを用いる液冷システム |
CN100371854C (zh) * | 2004-12-24 | 2008-02-27 | 富准精密工业(深圳)有限公司 | 液冷式散热装置 |
US20060185378A1 (en) * | 2005-02-18 | 2006-08-24 | Cooler Master Co. Ltd. | Liquid-cooling heat dissipation assembly |
JP2006234255A (ja) * | 2005-02-24 | 2006-09-07 | Hitachi Ltd | ラジエータと、当該ラジエータを備えた液冷システム |
EP2239646A3 (en) * | 2005-05-06 | 2011-09-28 | Asetek A/S | A method of cooling a computer system |
TWI296187B (en) * | 2005-07-29 | 2008-04-21 | Foxconn Tech Co Ltd | Integrated liquid cooling system |
TW200733856A (en) * | 2006-02-20 | 2007-09-01 | Sunonwealth Electr Mach Ind Co | Composite heat-dissipating module |
EP1881394A1 (en) * | 2006-07-20 | 2008-01-23 | Silver-Stone Technology Co., Ltd. | Liquid-cooling heat dissipating device for dissipating heat by a casing |
US7621143B2 (en) * | 2006-09-28 | 2009-11-24 | Lenovo (Singapore) Pte. Ltd. | Cooling systems |
CN101166409A (zh) * | 2006-10-16 | 2008-04-23 | 英业达股份有限公司 | 液冷式散热装置 |
US7466550B2 (en) * | 2006-11-03 | 2008-12-16 | Xigmatek Co., Ltd | Integrated heat dissipating assembly |
US8528628B2 (en) * | 2007-02-08 | 2013-09-10 | Olantra Fund X L.L.C. | Carbon-based apparatus for cooling of electronic devices |
US20090044929A1 (en) * | 2007-08-15 | 2009-02-19 | Xigmatek Co., Ltd | Liquid cooling module |
US20090139698A1 (en) * | 2007-12-03 | 2009-06-04 | Watronx, Inc. (Aka Onscreen Technologies, Inc.) | Carbon-based waterlock with attached heat-exchanger for cooling of electronic devices |
JP4859823B2 (ja) * | 2007-12-14 | 2012-01-25 | 株式会社日立製作所 | 冷却装置およびそれを用いた電子機器 |
CN201248224Y (zh) * | 2008-07-18 | 2009-05-27 | 鸿富锦精密工业(深圳)有限公司 | 散热装置 |
WO2010016046A1 (en) * | 2008-08-08 | 2010-02-11 | University Of Limerick | A cooling device |
EP2456982A4 (en) * | 2009-07-22 | 2017-06-14 | Vbox Incorporated | Gaseous fluid pump |
CN102056459A (zh) * | 2009-10-30 | 2011-05-11 | 鸿富锦精密工业(深圳)有限公司 | 液冷散热装置 |
US9927181B2 (en) * | 2009-12-15 | 2018-03-27 | Rouchon Industries, Inc. | Radiator with integrated pump for actively cooling electronic devices |
US10103089B2 (en) * | 2010-03-26 | 2018-10-16 | Hamilton Sundstrand Corporation | Heat transfer device with fins defining air flow channels |
JP5577506B2 (ja) * | 2010-09-14 | 2014-08-27 | ソーラテック コーポレイション | 遠心式ポンプ装置 |
US20120125575A1 (en) * | 2010-11-24 | 2012-05-24 | Tai-Her Yang | Cold/heat discharge with inner fluid to actuate the external fluid pump |
US9170056B2 (en) * | 2010-12-03 | 2015-10-27 | International Business Machines Corporation | Duplex flexible heat exchanger |
JP5371939B2 (ja) * | 2010-12-07 | 2013-12-18 | 株式会社市丸技研 | 流体送り装置及びタイヤ加硫装置 |
DE102011004306A1 (de) * | 2011-02-17 | 2012-08-23 | Behr Gmbh & Co. Kg | Rippe für einen Wärmeübertrager |
TWI464324B (zh) * | 2011-07-04 | 2014-12-11 | Sunonwealth Electr Mach Ind Co | 風扇 |
ES2406184B1 (es) * | 2011-12-01 | 2014-04-29 | Valeo Térmico, S. A. | Intercambiador de calor para gases, en especial de los gases de escape de un motor |
US20130202908A1 (en) * | 2012-02-08 | 2013-08-08 | Grzegorz Jan Kusinski | Equipment for use in corrosive environments and methods for forming thereof |
CN202585391U (zh) * | 2012-03-28 | 2012-12-05 | 深圳市研派科技有限公司 | 一种液冷散热系统 |
US20140008039A1 (en) * | 2012-07-03 | 2014-01-09 | Antec, Inc. | Liquid-cooling heat dissipation apparatus for electronic elements |
US20140069614A1 (en) * | 2012-09-13 | 2014-03-13 | Asia Vital Components Co., Ltd. | Heat dissipaion device and thermal module using same |
DE202012009586U1 (de) * | 2012-10-05 | 2012-12-14 | Asia Vital Components Co., Ltd. | Kühleinrichtung und Kühlmodul mit dieser Kühleinrichtung |
CN102883590A (zh) * | 2012-10-19 | 2013-01-16 | 郑宏杰 | 换热器与水泵一体式水冷散热器 |
US9772142B2 (en) * | 2013-02-05 | 2017-09-26 | Asia Vital Components Co., Ltd. | Water-cooling device with stator and rotor pumping unit |
US9689627B2 (en) * | 2013-02-05 | 2017-06-27 | Asia Vital Components Co., Ltd. | Water-cooling device with waterproof stator and rotor pumping unit |
CN203084639U (zh) * | 2013-03-01 | 2013-07-24 | 蔡柏彬 | 水冷装置 |
TWI487475B (zh) * | 2013-04-02 | 2015-06-01 | Quanta Comp Inc | 散熱模組 |
US9639125B2 (en) * | 2013-10-31 | 2017-05-02 | Microsoft Technology Licensing, Llc | Centrifugal fan with integrated thermal transfer unit |
US9301421B2 (en) * | 2013-11-21 | 2016-03-29 | Lenovo Enterprise Solutions (Singapore) Pte. Ltd. | Closed loop liquid cooling system for electronic packages |
US9618003B2 (en) * | 2013-12-10 | 2017-04-11 | Electric Torque Machines Inc. | High efficiency transverse flux motor fan |
AT515828B1 (de) * | 2014-05-23 | 2022-02-15 | Fronius Int Gmbh | Kühlvorrichtung und Wechselrichtergehäuse mit einer solchen Kühlvorrichtung |
CN204009742U (zh) * | 2014-08-28 | 2014-12-10 | 倪杨程 | 一体式循环水冷散热器 |
TWM503078U (zh) * | 2015-01-09 | 2015-06-11 | Micro Star Int Co Ltd | 液冷式散熱裝置 |
CN204425872U (zh) * | 2015-01-27 | 2015-06-24 | 肖启能 | 一种液冷散热器的水冷头结构 |
US9818671B2 (en) * | 2015-02-10 | 2017-11-14 | Dynatron Corporation | Liquid-cooled heat sink for electronic devices |
CN204392759U (zh) * | 2015-02-13 | 2015-06-10 | 钛创科技股份有限公司 | 电子设备的液冷式散热装置 |
EP3237992B1 (en) * | 2015-03-24 | 2020-10-21 | Hewlett-Packard Enterprise Development LP | Liquid cooling with a cooling chamber |
US9992910B2 (en) * | 2015-06-11 | 2018-06-05 | Cooler Master Co., Ltd. | Liquid supply mechanism and liquid cooling system |
US10185351B2 (en) * | 2015-06-25 | 2019-01-22 | Asia Vital Components Co., Ltd. | Foldable water-cooling device |
US9807906B2 (en) * | 2015-07-20 | 2017-10-31 | Asia Vital Components Co., Ltd. | Liquid-cooling device and system thereof |
US9823028B2 (en) * | 2015-07-20 | 2017-11-21 | Asia Vital Components Co., Ltd. | Water cooling device with detachably assembled modularized units |
TWM512730U (zh) * | 2015-08-20 | 2015-11-21 | Cooler Master Co Ltd | 水冷式散熱裝置 |
US10274999B2 (en) * | 2015-10-27 | 2019-04-30 | Asia Vital Components Co., Ltd. | Water-cooling device |
CN105263301B (zh) * | 2015-11-12 | 2017-12-19 | 深圳市研派科技有限公司 | 一种液冷散热系统及其液体散热排 |
US10058007B2 (en) * | 2016-09-26 | 2018-08-21 | Asia Vital Components Co., Ltd. | Water-cooling radiator unit and water-cooling module using same |
US10539144B2 (en) * | 2017-05-02 | 2020-01-21 | Asia Vital Components Co., Ltd. | Fan central barrel coupling structure |
US20190041105A1 (en) * | 2017-08-07 | 2019-02-07 | Asia Vital Components Co., Ltd. | Heat-exchange structure for water cooling device |
CN207987285U (zh) * | 2018-01-17 | 2018-10-19 | 广州市金镭五金制品有限公司 | 一种用于矽钢片退火钝化工艺的冷却装置 |
-
2015
- 2015-11-12 CN CN201510769643.7A patent/CN105263301B/zh active Active
-
2017
- 2017-01-11 WO PCT/CN2017/070823 patent/WO2017088840A1/zh active Application Filing
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Patent Citations (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05312492A (ja) * | 1992-05-14 | 1993-11-22 | Showa Alum Corp | 熱交換器 |
JP2001320187A (ja) * | 2000-02-29 | 2001-11-16 | Matsushita Electric Ind Co Ltd | 電子部品の液体冷却装置 |
JP2002368471A (ja) * | 2001-06-05 | 2002-12-20 | Matsushita Electric Ind Co Ltd | 冷却装置 |
JP2004218969A (ja) * | 2003-01-16 | 2004-08-05 | Univ Tokyo | 熱交換器 |
JP2005332856A (ja) * | 2004-05-18 | 2005-12-02 | Honda Motor Co Ltd | 放熱装置 |
US20070103869A1 (en) * | 2005-11-08 | 2007-05-10 | Foxconn Technology Co., Ltd. | Integrated liquid cooling system |
CN1964611A (zh) * | 2005-11-08 | 2007-05-16 | 富准精密工业(深圳)有限公司 | 整合式液冷散热装置 |
JP2008177599A (ja) * | 2008-03-06 | 2008-07-31 | Sanyo Denki Co Ltd | ラジエータ |
JP2013015289A (ja) * | 2011-07-05 | 2013-01-24 | Sharp Corp | 熱交換器及びそれを搭載した空気調和機 |
JP2013145830A (ja) * | 2012-01-16 | 2013-07-25 | Nikkei Nekko Kk | 電子機器用液冷システムにおけるラジエータ |
JP2015050233A (ja) * | 2013-08-30 | 2015-03-16 | 富士通株式会社 | 放熱器および放熱器の製造方法 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7115786B1 (ja) * | 2021-01-27 | 2022-08-09 | 崇賢 ▲黄▼ | 液冷放熱器 |
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CN105263301A (zh) | 2016-01-20 |
US20170367217A1 (en) | 2017-12-21 |
WO2017088840A1 (zh) | 2017-06-01 |
US10609841B2 (en) | 2020-03-31 |
CN105263301B (zh) | 2017-12-19 |
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