JP2018205456A - フルカラーled表示パネル - Google Patents
フルカラーled表示パネル Download PDFInfo
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- JP2018205456A JP2018205456A JP2017109156A JP2017109156A JP2018205456A JP 2018205456 A JP2018205456 A JP 2018205456A JP 2017109156 A JP2017109156 A JP 2017109156A JP 2017109156 A JP2017109156 A JP 2017109156A JP 2018205456 A JP2018205456 A JP 2018205456A
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- light emitting
- display panel
- blue
- light
- emitting layer
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- 230000005284 excitation Effects 0.000 claims abstract description 49
- 239000000758 substrate Substances 0.000 claims abstract description 41
- 239000011159 matrix material Substances 0.000 claims abstract description 18
- 239000007850 fluorescent dye Substances 0.000 claims description 7
- 239000003086 colorant Substances 0.000 claims description 6
- 230000005540 biological transmission Effects 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 description 12
- 108010043121 Green Fluorescent Proteins Proteins 0.000 description 8
- 239000000049 pigment Substances 0.000 description 6
- 238000006243 chemical reaction Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 230000001678 irradiating effect Effects 0.000 description 3
- WGLPBDUCMAPZCE-UHFFFAOYSA-N Trioxochromium Chemical compound O=[Cr](=O)=O WGLPBDUCMAPZCE-UHFFFAOYSA-N 0.000 description 2
- 229910000423 chromium oxide Inorganic materials 0.000 description 2
- 239000000975 dye Substances 0.000 description 2
- 229910044991 metal oxide Inorganic materials 0.000 description 2
- 150000004706 metal oxides Chemical class 0.000 description 2
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000012466 permeate Substances 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
- H01L33/502—Wavelength conversion materials
- H01L33/504—Elements with two or more wavelength conversion materials
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B5/00—Optical elements other than lenses
- G02B5/20—Filters
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B5/00—Optical elements other than lenses
- G02B5/20—Filters
- G02B5/22—Absorbing filters
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/44—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the coatings, e.g. passivation layer or anti-reflective coating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/507—Wavelength conversion elements the elements being in intimate contact with parts other than the semiconductor body or integrated with parts other than the semiconductor body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/505—Wavelength conversion elements characterised by the shape, e.g. plate or foil
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Theoretical Computer Science (AREA)
- Led Device Packages (AREA)
- Optical Filters (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
【解決手段】紫外から青色波長帯の光を放射する複数のLED3を基板上にマトリクス状に配置したLEDアレイ基板1と、光三原色に対応させて複数の前記LED3上に並べて設けられ、該LED3から放射される励起光によって励起されて対応色の蛍光に夫々波長変換する複数の蛍光発光層5と、前記蛍光発光層5上を覆って設けられた前記励起光を遮断する励起光カット層8と、を備えたものである。
【選択図】図2
Description
先ず、LEDアレイ基板1の製造工程について説明する。
複数のLED3を駆動するための配線が施された配線基板4上の所定位置に近紫外から青色波長帯の光を放射する複数のLED3を上記配線と電気的に接続させた状態で取り付けてLEDアレイ基板1を製造する。
先ず、透明基板6上にブラックレジストを塗布した後、フォトマスクを使用して露光し、現像し、各蛍光発光層5の形成位置に対応させて例えば図1に示すようなストライプ状の開口9を設けてブラックマトリクス7を形成する。又は、ブラックマトリクス7は、黒色顔料を含むペーストをインクジェット、スクリーン印刷等により塗布して形成してもよい。さらには、酸化クロム等の金属酸化物を成膜し、これをエッチングして形成してもよい。
先ず、LEDアレイ基板1のLED3側と、蛍光発光層基板2の透明基板6側とを対面させた状態で、上記各基板に予め設けられたアライメントマークを使用して両基板のアライメントが実施される。そして、LEDアレイ基板1に設けられた赤色、緑色及び青色対応のLED3に対して、蛍光発光層基板2に設けられた赤色、緑色及び青色蛍光発光層5R,5G,5Bが夫々位置決めされる。
3…LED
4…配線基板(基板)
5…蛍光発光層
5R…赤色蛍光発光層
5G…緑色蛍光発光層
5B…青色蛍光発光層
7…ブラックマトリクス
8…励起光カット層
Claims (5)
- 紫外から青色波長帯の光を放射する複数のLEDを基板上にマトリクス状に配置したLEDアレイ基板と、
光三原色に対応させて複数の前記LED上に並べて設けられ、該LEDから放射される励起光によって励起されて対応色の蛍光に夫々波長変換する複数の蛍光発光層と、
前記蛍光発光層上を覆って設けられた前記励起光を遮断する励起光カット層と、
を備えたことを特徴とするフルカラーLED表示パネル。 - 少なくとも各色対応の前記蛍光発光層の間には、ブラックマトリクスが設けられていることを特徴とする請求項1記載のフルカラーLED表示パネル。
- 前記蛍光発光層は、対応色の蛍光色素を含有する蛍光発光レジストであることを特徴とする請求項1又は2記載のフルカラーLED表示パネル。
- 前記励起光カット層は、前記励起光が紫外線である場合には、紫外線カットフィルターであり、各蛍光発光層上を覆って設けられることを特徴とする請求項1〜3のいずれか1項に記載のフルカラーLED表示パネル。
- 前記励起光カット層は、前記励起光が青色光である場合には、青色光の透過を低下したブルーライトカットフィルターであり、各蛍光発光層上、又は青色蛍光発光層を除く赤及び緑色蛍光発光層上を覆って設けられることを特徴とする請求項1〜3のいずれか1項に記載のフルカラーLED表示パネル。
Priority Applications (7)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017109156A JP2018205456A (ja) | 2017-06-01 | 2017-06-01 | フルカラーled表示パネル |
CN201880036308.8A CN110692097A (zh) | 2017-06-01 | 2018-04-24 | 全彩led显示面板 |
KR1020197037677A KR20200014799A (ko) | 2017-06-01 | 2018-04-24 | 풀 컬러 led 디스플레이 패널 |
EP18810613.2A EP3633657A4 (en) | 2017-06-01 | 2018-04-24 | MULTICOLORED TYPE LED DISPLAY PANEL |
PCT/JP2018/016592 WO2018221081A1 (ja) | 2017-06-01 | 2018-04-24 | フルカラーled表示パネル |
TW107118389A TW201906199A (zh) | 2017-06-01 | 2018-05-30 | 全彩led顯示面板 |
US16/699,481 US20200098952A1 (en) | 2017-06-01 | 2019-11-29 | Full-color led display panel |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017109156A JP2018205456A (ja) | 2017-06-01 | 2017-06-01 | フルカラーled表示パネル |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2018205456A true JP2018205456A (ja) | 2018-12-27 |
Family
ID=64455299
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2017109156A Pending JP2018205456A (ja) | 2017-06-01 | 2017-06-01 | フルカラーled表示パネル |
Country Status (7)
Country | Link |
---|---|
US (1) | US20200098952A1 (ja) |
EP (1) | EP3633657A4 (ja) |
JP (1) | JP2018205456A (ja) |
KR (1) | KR20200014799A (ja) |
CN (1) | CN110692097A (ja) |
TW (1) | TW201906199A (ja) |
WO (1) | WO2018221081A1 (ja) |
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2020196271A1 (ja) * | 2019-03-22 | 2020-10-01 | 日亜化学工業株式会社 | 画像表示装置の製造方法および画像表示装置 |
JPWO2020226044A1 (ja) * | 2019-05-08 | 2020-11-12 | ||
WO2021020393A1 (ja) * | 2019-07-30 | 2021-02-04 | 日亜化学工業株式会社 | 画像表示装置の製造方法および画像表示装置 |
JP2021021875A (ja) * | 2019-07-30 | 2021-02-18 | エルジー ディスプレイ カンパニー リミテッド | 表示装置 |
WO2021095603A1 (ja) * | 2019-11-11 | 2021-05-20 | 日亜化学工業株式会社 | 画像表示装置の製造方法および画像表示装置 |
KR20210090087A (ko) | 2020-01-09 | 2021-07-19 | 삼성전자주식회사 | 발광 소자 및 표시 장치 |
JP2021193425A (ja) * | 2020-06-08 | 2021-12-23 | 株式会社ニッコー | タクシーの表示灯 |
US11476394B2 (en) | 2020-01-09 | 2022-10-18 | Samsung Electronics Co., Ltd. | Light emitting device and display apparatus |
JP7585602B2 (ja) | 2019-11-11 | 2024-11-19 | 日亜化学工業株式会社 | 画像表示装置の製造方法および画像表示装置 |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11545607B2 (en) | 2017-12-04 | 2023-01-03 | Tunghsu Group Co., Ltd. | Upper substrate for miniature LED component, miniature LED component, and miniature LED display device |
CN111162108A (zh) * | 2020-01-02 | 2020-05-15 | 京东方科技集团股份有限公司 | 一种显示面板、其制作方法及显示装置 |
KR20220111513A (ko) * | 2021-02-02 | 2022-08-09 | 삼성전자주식회사 | 디스플레이 모듈 및 그 제조 방법 |
WO2023033204A1 (ko) * | 2021-09-01 | 2023-03-09 | 엘지전자 주식회사 | 디스플레이 장치 |
Citations (6)
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JPH10208879A (ja) * | 1997-01-27 | 1998-08-07 | Idemitsu Kosan Co Ltd | 蛍光変換膜の製造方法 |
JPH10319877A (ja) * | 1997-05-16 | 1998-12-04 | Toshiba Corp | 画像表示装置及び発光装置 |
JP2002217454A (ja) * | 2001-01-19 | 2002-08-02 | Matsushita Electric Ind Co Ltd | Ledアレー及びこれを用いたled表示装置 |
JP2006032021A (ja) * | 2004-07-13 | 2006-02-02 | Idemitsu Kosan Co Ltd | 色変換基板の製造方法及び色変換基板 |
CN104064658A (zh) * | 2014-07-05 | 2014-09-24 | 福州大学 | 一种led显示屏及其3d显示装置 |
JP2015064391A (ja) * | 2012-01-23 | 2015-04-09 | シャープ株式会社 | 蛍光体基板、表示装置および電子機器 |
Family Cites Families (2)
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---|---|---|---|---|
JP2012145725A (ja) | 2011-01-12 | 2012-08-02 | Panasonic Corp | Ledディスプレイ装置および立体視用眼鏡 |
US9111464B2 (en) | 2013-06-18 | 2015-08-18 | LuxVue Technology Corporation | LED display with wavelength conversion layer |
-
2017
- 2017-06-01 JP JP2017109156A patent/JP2018205456A/ja active Pending
-
2018
- 2018-04-24 WO PCT/JP2018/016592 patent/WO2018221081A1/ja active Application Filing
- 2018-04-24 KR KR1020197037677A patent/KR20200014799A/ko unknown
- 2018-04-24 CN CN201880036308.8A patent/CN110692097A/zh active Pending
- 2018-04-24 EP EP18810613.2A patent/EP3633657A4/en not_active Withdrawn
- 2018-05-30 TW TW107118389A patent/TW201906199A/zh unknown
-
2019
- 2019-11-29 US US16/699,481 patent/US20200098952A1/en not_active Abandoned
Patent Citations (6)
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JPH10208879A (ja) * | 1997-01-27 | 1998-08-07 | Idemitsu Kosan Co Ltd | 蛍光変換膜の製造方法 |
JPH10319877A (ja) * | 1997-05-16 | 1998-12-04 | Toshiba Corp | 画像表示装置及び発光装置 |
JP2002217454A (ja) * | 2001-01-19 | 2002-08-02 | Matsushita Electric Ind Co Ltd | Ledアレー及びこれを用いたled表示装置 |
JP2006032021A (ja) * | 2004-07-13 | 2006-02-02 | Idemitsu Kosan Co Ltd | 色変換基板の製造方法及び色変換基板 |
JP2015064391A (ja) * | 2012-01-23 | 2015-04-09 | シャープ株式会社 | 蛍光体基板、表示装置および電子機器 |
CN104064658A (zh) * | 2014-07-05 | 2014-09-24 | 福州大学 | 一种led显示屏及其3d显示装置 |
Cited By (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11476308B2 (en) | 2019-03-22 | 2022-10-18 | Nichia Corporation | Method for manufacturing image display device and image display device |
WO2020196271A1 (ja) * | 2019-03-22 | 2020-10-01 | 日亜化学工業株式会社 | 画像表示装置の製造方法および画像表示装置 |
CN113439343A (zh) * | 2019-03-22 | 2021-09-24 | 日亚化学工业株式会社 | 图像显示装置的制造方法和图像显示装置 |
JP7507373B2 (ja) | 2019-03-22 | 2024-06-28 | 日亜化学工業株式会社 | 画像表示装置の製造方法および画像表示装置 |
JPWO2020196271A1 (ja) * | 2019-03-22 | 2020-10-01 | ||
WO2020226044A1 (ja) * | 2019-05-08 | 2020-11-12 | 日亜化学工業株式会社 | 画像表示装置の製造方法および画像表示装置 |
JP7457255B2 (ja) | 2019-05-08 | 2024-03-28 | 日亜化学工業株式会社 | 画像表示装置の製造方法および画像表示装置 |
CN113994484A (zh) * | 2019-05-08 | 2022-01-28 | 日亚化学工业株式会社 | 图像显示装置的制造方法以及图像显示装置 |
JPWO2020226044A1 (ja) * | 2019-05-08 | 2020-11-12 | ||
JP2021021875A (ja) * | 2019-07-30 | 2021-02-18 | エルジー ディスプレイ カンパニー リミテッド | 表示装置 |
WO2021020393A1 (ja) * | 2019-07-30 | 2021-02-04 | 日亜化学工業株式会社 | 画像表示装置の製造方法および画像表示装置 |
JP7523741B2 (ja) | 2019-07-30 | 2024-07-29 | 日亜化学工業株式会社 | 画像表示装置の製造方法および画像表示装置 |
WO2021095603A1 (ja) * | 2019-11-11 | 2021-05-20 | 日亜化学工業株式会社 | 画像表示装置の製造方法および画像表示装置 |
JP7585602B2 (ja) | 2019-11-11 | 2024-11-19 | 日亜化学工業株式会社 | 画像表示装置の製造方法および画像表示装置 |
KR20210090087A (ko) | 2020-01-09 | 2021-07-19 | 삼성전자주식회사 | 발광 소자 및 표시 장치 |
US11476394B2 (en) | 2020-01-09 | 2022-10-18 | Samsung Electronics Co., Ltd. | Light emitting device and display apparatus |
JP2021193425A (ja) * | 2020-06-08 | 2021-12-23 | 株式会社ニッコー | タクシーの表示灯 |
Also Published As
Publication number | Publication date |
---|---|
WO2018221081A1 (ja) | 2018-12-06 |
CN110692097A (zh) | 2020-01-14 |
TW201906199A (zh) | 2019-02-01 |
EP3633657A4 (en) | 2021-03-03 |
KR20200014799A (ko) | 2020-02-11 |
US20200098952A1 (en) | 2020-03-26 |
EP3633657A1 (en) | 2020-04-08 |
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