JP2018010974A - Heat conduction connector and electronic apparatus including the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To improve heat dissipation from a heat source by promoting heat conduction from a circuit board or an electronic component mounted thereon, while making it difficult to hinder the mounting of an electronic component on the circuit board.SOLUTION: A heat conduction connector 30 for conducting heat on the circuit board 10 to the heat sink 3 side includes a heat conduction connector 30 having a strip heat conduction sheet 31 containing metal, carbon or ceramic, and silicon rubber sheets 32, 33 covering the faces fixed tightly to the circuit board 10 and heat sink 3, respectively, at the opposite ends of the heat conduction sheet 31. An electronic apparatus 1 including the heat conduction connector 30 is also provided.SELECTED DRAWING: Figure 2

Description

  The present invention relates to a heat conductive connector and an electronic device including the same.

  Control systems for automobiles, aircraft, ships, and home or commercial electronic devices have become more accurate and complex, and along with this, the integration density of small electronic components on circuit boards has been increasing. . As a result, it is strongly desired to solve the failure and shortening of the life of electronic components due to the heat generation around the circuit board. In order to realize quick heat dissipation from the circuit board, conventionally, the circuit board itself is made of a material with excellent heat dissipation, and a means such as attaching a heat sink or driving a heat dissipation fan is combined singly or in combination. Has been done.

  Among these, the method of configuring the circuit board itself from a material having excellent heat dissipation, such as diamond, aluminum nitride (AlN), cBN, etc., increases the cost of the circuit board extremely. In addition, the arrangement of the heat dissipating fan causes problems such as failure of rotating equipment called a fan, necessity of maintenance for preventing the trouble, and securing of installation space. On the other hand, the heat radiation fin can easily increase heat dissipation by increasing the surface area by forming a large number of columnar or flat projections using a metal having high thermal conductivity (for example, aluminum). Therefore, it is very widely used as a heat dissipation component. As a heat dissipation component, for example, a flat concave portion or a reference surface itself is brought into close contact with the upper surface of a heat generating component arranged on the circuit board with various heights so that the heat contact can be ensured for each heat generating component. What can be done is known (see Patent Document 1).

JP2008-243999A

  Due to the height of electronic components mounted on the circuit board, and in recent years, as the control of electronic equipment has advanced, the need for double-sided mounting that uses not only the front side but also the back side of the circuit board has increased. In many cases, the heat sink cannot be brought into direct contact with the circuit board. In such a case, the heat sink and the circuit board must be separated. For example, in a control device for an automobile, a relatively large capacitor or semiconductor chip is integrated on a circuit board rather than a home electronic device. For this reason, it is a problem how to transfer heat from the electronic component to the heat sink separated from the circuit board. As a method for solving such a problem, a method of sandwiching a heat conductive elastic material in a space between a circuit board and a heat sink can be considered. However, in this method, the space between the circuit board and the heat sink is occupied by the heat conductive elastic material, which hinders mounting of electronic components on the back side of the circuit board. Moreover, since the thickness of a heat conductive member is large, there also exists a problem that heat conduction efficiency is low.

  The present invention has been made in view of the above problems, and it is difficult to hinder the mounting of electronic components on a circuit board, and heat conduction from the circuit board or electronic components mounted on the circuit board to the heat sink is facilitated to dissipate heat from the heat source. The purpose is to further increase.

  A heat conducting connector according to an embodiment for achieving the above object is a heat conducting connector for conducting heat on a circuit board side to a heat sink side, and is a belt-like heat conducting sheet containing metal, carbon or ceramics And a silicone rubber sheet that covers surfaces of the heat conductive sheet that are firmly fixed to the circuit board and the heat sink at both ends.

  In the heat conductive connector according to another embodiment, the heat conductive sheet is further bent or bent so as to form a space inward, and the inner side and the inner side and the opposite side across the heat conductive sheet A rubber-like elastic body may be provided at least on the inside of the outside located at the inside.

  In the heat conductive connector according to another embodiment, the rubber-like elastic body may further include a contact portion that contacts the end surface of the circuit board.

  In the heat conductive connector according to another embodiment, the rubber-like elastic body includes a first support part provided inside the heat conductive sheet, and a second support part sandwiched from both sides of the circuit board together with the first support part. , May be provided.

  An electronic device according to an embodiment of the present invention is disposed in a part of a gap between a circuit board on which electronic components are mounted, a heat sink that is separated from the circuit board, and the circuit board and the heat sink. A heat conductive connector for conducting heat on the circuit board side to the heat sink side, wherein the heat conductive connector includes a band-shaped heat conductive sheet containing metal, carbon or ceramics, and a heat conductive sheet And a silicone rubber sheet covering the surfaces to be tightly fixed to the circuit board and the heat sink at both ends.

  In the electronic device according to another embodiment, the heat conductive sheet is further curved or bent so as to form a space inwardly, and the inner side and the inner side and the inner side of the heat conductive sheet are on the opposite side. A rubber-like elastic body may be provided at least on the inside of the located outside.

  In the electronic device according to another embodiment, the rubber-like elastic body may further include a contact portion that contacts the end surface of the circuit board.

  In the electronic device according to another embodiment, the rubber-like elastic body includes a first support part provided inside the heat conductive sheet, a second support part sandwiched from both sides of the circuit board together with the first support part, May be provided.

  In the electronic device according to another embodiment, the circuit board includes a convex heat conduction port on the back side of the electronic component mounting surface, and the heat conduction connector so that the silicone rubber sheet is brought into contact with the heat conduction port. May be fixed to the circuit board and the heat sink.

  ADVANTAGE OF THE INVENTION According to this invention, it is hard to prevent mounting of the electronic component of a circuit board, heat conduction from a circuit board or the electronic component mounted in it to a heat sink can be accelerated | stimulated, and the heat dissipation from a heat source can be improved more.

FIG. 1 shows a partially transparent perspective view (1A) and a partially transparent plan view (1B) of an electronic apparatus according to the first embodiment. 2 shows an AA line cross-sectional view (2A) of the electronic device of FIG. 1 (1B) and an enlarged perspective view (2B) of the heat conducting connector in the cross-sectional view. FIG. 3 shows an enlarged view (3A) of a part B of FIG. 2 (2A) and a partially transparent view (3B) when a part of the heat conductive connector is seen from the back surface of the circuit board. FIG. 4 is a diagram illustrating an example of a method for manufacturing the heat conductive connector of FIG. FIG. 5: shows the AA sectional view (5A) similar to FIG. 2 of the electronic device which concerns on 2nd Embodiment, and the expansion perspective view (5B) of the heat conductive connector in the said sectional view, respectively. 6 shows an AA line cross-sectional view (6A) similar to FIG. 2 of the electronic apparatus according to the third embodiment and an enlarged perspective view (6B) of the heat conducting connector in the cross-sectional view. FIG. 7: shows the AA sectional view (7A) similar to FIG. 2 of the electronic device which concerns on 4th Embodiment, and the expansion perspective view (7B) of the heat conductive connector in the said sectional view, respectively. FIG. 8 shows a perspective view (8A) of the heat conducting connector according to the first modification and a perspective view (8B) of the heat conducting connector according to the second modification, respectively.

  Next, each embodiment of the present invention will be described with reference to the drawings. The embodiments described below do not limit the invention according to the claims, and all the elements and combinations thereof described in the embodiments are the means for solving the present invention. It is not always essential.

(First embodiment)
FIG. 1 shows a partially transparent perspective view (1A) and a partially transparent plan view (1B) of an electronic apparatus according to the first embodiment. 2 shows an AA line cross-sectional view (2A) of the electronic device of FIG. 1 (1B) and an enlarged perspective view (2B) of the heat conducting connector in the cross-sectional view.

  The electronic apparatus 1 according to the first embodiment is a part of the control device mounted on the automobile in this embodiment and the following embodiments. Various devices such as a control device for industrial use and a control device for industrial robots. The electronic device 1 includes a housing 2 that is a substantially elliptic cylinder and is separable in the thickness direction. The electronic device 1 includes a printed circuit board (hereinafter referred to as “PCB” or simply “circuit board”) 10 in a housing 2 and a heat sink 3 at a predetermined distance from the PCB 10. In this embodiment, the heat sink 3 is preferably composed of a metal material having high thermal conductivity typified by aluminum or an aluminum alloy, and includes a large number of fins for enhancing heat dissipation. The heat sink 3 may include pins instead of the fins or together with the fins.

  The PCB 10 is formed of a material having excellent insulating properties. For example, a paper phenol substrate in which a paper base material is hardened with a phenol resin, a paper epoxy substrate in which a paper base material is hardened with an epoxy resin, and a cloth woven with glass fibers. Glass epoxy board solidified with epoxy resin, glass composite board solidified by mixing paper and glass base material, ceramic substrate made of highly insulating ceramics such as alumina, polytetrafluoroethylene, polyimide, etc. It is made of a highly insulating resin. In this embodiment, the PCB 10 is arranged in the housing 2 so that two substantially semicircular plates face each other in the diametrical end face of each plate. However, the PCB 10 may be a single substantially circular plate.

  It has many electronic components that are electrically connected to or disconnected from the wiring drawn on the front surface (upper surface in FIG. 2) and back surface (lower surface in FIG. 2) of the PCB 10. ing. The electronic component is not limited to a specific component, and includes capacitors 20 and 22 and an IC chip 21 in this embodiment. As shown in FIG. 2, in this embodiment, the capacitor 20 and the IC chip 21 are connected to the front surface of the PCB 10. Further, the capacitor 22 and the IC chip 21 are connected to the back surface of the PCB 10. However, these electronic components 20, 21, and 22 may be connected to only the front side surface or only the back side surface of the PCB 10. In FIG. 1, since the PCB 10 and the electronic components 20 and 21 are transparently illustrated, they are represented by dotted lines.

  The back side surface of the PCB 10 and the front side surface of the heat sink 3 (the surface facing the PCB 10) are arranged with a predetermined gap (for example, 10 mm or 5 mm) therebetween. In particular, since the PCB 10 in this embodiment has the capacitor 22 and the IC chip 21 mounted on the back surface, it is difficult to directly connect to the front surface of the heat sink 3. For this reason, another member that efficiently guides the heat generated from the many electronic components 20, 21, and 22 mounted on the PCB 10 to the heat sink 3 is required. The member is the heat conductive connector 30.

  The heat conduction connector 30 is a connector that is disposed in a part of a gap between the PCB 10 and the heat sink 3 and conducts heat on the PCB 10 side to the heat sink 3 side. As shown in FIG. 2 (2B), the heat conductive connector 30 includes a band-shaped heat conductive sheet 31 containing metal, carbon, or ceramics, and a silicone rubber sheet 32 that covers the surfaces that are closely fixed to the PCB 10 at both ends of the heat conductive sheet 31. And a silicone rubber sheet 33 that covers the surface to be tightly fixed to the heat sink 3. As long as the heat conductive sheet 31 contains metal, carbon, or ceramics, the metal, carbon, or ceramics may be used as the main material, or other materials may be used as the main material. Further, the “main material” referred to here means a material in an amount exceeding 50 mass% with respect to the total mass of the heat conductive sheet 31. Further, the “main material” may mean a material having an amount exceeding 50 volume% with respect to the total volume of the heat conductive sheet 31. In this embodiment, as an example, an example in which the main material is used in a meaning exceeding 50 mass% will be described. Further, suitable materials for the heat conductive sheet 31 and the silicone rubber sheets 32 and 33 will be described later with reference to FIG.

  In this embodiment, the heat conductive sheet 31 is curved in a substantially U shape, and the silicone rubber sheets 32 and 33 are fixed to both end sides of the curved outer surface 31a, respectively. The curved inner surface 31b of the heat conductive sheet 31 is an exposed surface in a state where the silicone rubber sheets 32 and 33 are not fixed. The heat conductive sheet 31 is preferably made of a material having higher heat conductivity than the silicone rubber sheets 32 and 33. The heat conductive sheet 31 is desirably a flexible material, and the thickness is preferably 100 to 1000 μm, and more preferably 300 to 700 μm. On the other hand, the silicone rubber sheets 32 and 33 are preferably thin elastic bodies in order to enhance heat conduction in the thickness direction. In addition, since the surface of PCB10 is provided with minute unevenness | corrugations, it is preferable that the silicone rubber sheets 32 and 33 have sufficient thickness so that it can contact | adhere so that the said unevenness | corrugation may be filled. Specifically, the thickness of the silicone rubber sheets 32 and 33 is preferably 30 to 800 μm, more preferably 100 to 300 μm.

  The silicone rubber sheets 32 and 33 are sheets having excellent heat resistance and excellent thermal conductivity. Further, the silicone rubber sheets 32 and 33 are preferably sheets excellent in adhesiveness to the PCB 10 and the heat sink 3. For this reason, the silicone rubber sheets 32 and 33 can be directly fixed to the PCB 10 and the heat sink 3 without the presence of inclusions such as an adhesive. The heat conductive sheet 31 may be provided in the gap between the PCB 10 and the heat sink 3 by bending a flat plate into a substantially U shape, or may be provided in the gap between the PCB 10 and the heat sink 3 in a substantially U shape. good.

  FIG. 3 shows an enlarged view (3A) of a part B of FIG. 2 (2A) and a partially transparent view (3B) when a part of the heat conductive connector is seen from the back surface of the circuit board.

  The PCB 10 includes a plurality of heat conduction ports 40 for facilitating the conduction of heat from the PCB 10 immediately below the capacitor 20 (not shown in FIG. 3). It is preferable that the heat conduction port 40 is provided at a location on the back side of the PCB 10 that is not electrically connected to the wiring. The heat conduction port 40 is made of a material having excellent heat conductivity, for example, aluminum, aluminum alloy, copper, silver, or gold. These materials are also excellent in electrical conductivity. For this reason, when the wiring of the PCB 10 and the heat conduction port 40 are electrically connected, the silicone rubber sheets 32 and 33 have a function of preventing energization from the heat conduction port 40 to the heat conduction sheet 31. It will be.

  Thus, the PCB 10 includes the convex heat conduction port 40 on the back side of the mounting surface of the electronic components 20 and 21, and the heat conduction connector 30 is arranged so that the silicone rubber sheets 32 and 33 are in contact with the heat conduction port 40. The PCB 10 and the heat sink 3 are closely attached and fixed. As a result, heat from the PCB 10 can be effectively transmitted to the heat sink 3 side, and failure of the electronic components 20 and 21 can be prevented. It should be noted that the heat conduction port 40 shown in FIG. 3 is only partly illustrated, and actually, more heat conduction ports 40 are connected to the back side surface or the front side surface of the PCB 10. It is preferable to prepare for.

  FIG. 4 is a diagram illustrating an example of a method for manufacturing the heat conductive connector of FIG.

  The heat conductive connector 30 includes a heat conductive sheet 31 and silicone rubber sheets 32 and 33. In this embodiment, the heat conductive sheet 31 is a thin sheet obtained by curing a material obtained by blending and dispersing graphite fibers and carbon particles in the resin 51. Even if the resin 51 exceeds 50 mass% with respect to the total mass of the heat conductive sheet 31, or the graphite fibers and the carbon particles may exceed 50 mass% with respect to the total mass of the resin 51. That is, as long as there is no big trouble in heat conduction, the heat conductive sheet 31 may use the resin 51 as a main material, or may use graphite fibers or carbon particles as a main material. As the resin 51, for example, a thermoplastic resin can be suitably used. As the thermoplastic resin, a resin having a high melting point that does not melt when conducting heat from the PCB 10 is preferable. For example, polyphenylene sulfide (PPS), polyetheretherketone (PEEK), polyamideimide (PAI), etc. Preferably, it can be mentioned. As shown in the enlarged view of part C in FIG. 4 (4A), the resin 51 is dispersed, for example, in the form of particles in the gaps between the graphite fibers in the state before the heat conductive sheet 31 is pressed. In addition to the graphite fiber and the resin 51, the heat conductive sheet 31 may be dispersed with aluminum nitride or diamond as a filler for further enhancing heat conduction.

  The heat conductive sheet 31 is disposed in the concave portion of the first mold 60 and pressed while being heated by the second mold 61 from above the heat conductive sheet 31. As a result, the resin 51 melts and brings the graphite fibers into close contact so as to fill the gaps between the graphite fibers. When the first mold 60 and the second mold 61 are opened, the heat conductive sheet 31 that can be used for the heat conductive connector 30 can be obtained.

  Next, the silicone rubber sheets 32 and 33 are laminated on both sides of one side of the heat conductive sheet 31. Preferably, nothing is interposed between the silicone rubber sheets 32 and 33 and the heat conductive sheet 31. However, any inclusion that does not inhibit the heat conduction from the silicone rubber sheets 32 and 33 to the heat conduction sheet 31 may be interposed.

  The silicone rubber sheets 32 and 33 are excellent in heat conductivity and adhesiveness. As a method for increasing the thermal conductivity of the silicone rubber, a method of dispersing a high thermal conductivity filler such as aluminum nitride or aluminum can be exemplified. Further, the silicone rubber sheets 32 and 33 can be exemplified by a silicone rubber in which a silicone resin is combined with a bifunctional silicone raw rubber in order to increase the adhesiveness. The silicone resin is preferably an MQ resin. MQ resin is a single bond of Si in order to crosslink only the 4-way branched Q unit with a structure in which oxygen atoms are bonded to four bonds of Si and to stop the terminal reactivity. A resin to which a one-way branched M unit having a structure in which an oxygen atom is bonded is added. In addition, it is preferable to use a silicone resin that binds many hydroxyl groups because the adhesiveness of the silicone rubber can be increased.

  In addition to the above manufacturing method, the heat conductive connector 30 may be manufactured using another manufacturing method described below. For example, after the first mold 60 and the second mold 61 are opened and the heat conductive sheet 31 is taken out, a silicone rubber sheet is laminated on the entire surface of one side, and then the silicone rubber sheet in the central region excluding both ends is peeled off. May be. Further, as the heat conductive sheet 31, a sheet containing a metal such as aluminum or SUS or a ceramic such as aluminum nitride may be used without using a sheet containing graphite.

(Second Embodiment)
Next, a second embodiment of the present invention will be described. In the description of the second embodiment, portions common to the first embodiment are denoted by the same reference numerals, and redundant description is omitted for the description of the first embodiment.

  FIG. 5: shows the AA sectional view (5A) similar to FIG. 2 of the electronic device which concerns on 2nd Embodiment, and the expansion perspective view (5B) of the heat conductive connector in the said sectional view, respectively.

  The electronic device 1 according to the second embodiment is common to the electronic device 1 according to the first embodiment except for the form of the heat conducting connector 30a. The heat conductive connector 30 a includes a belt-shaped heat conductive sheet 31 containing metal, carbon, or ceramics, a silicone rubber sheet 32 that covers the surfaces that are closely fixed to the PCB 10 at both ends of the heat conductive sheet 31, and a surface that is closely fixed to the heat sink 3. And a covering silicone rubber sheet 33. Suitable materials for the heat conductive sheet 31 and the silicone rubber sheets 32 and 33 are the same as those in the first embodiment. In this embodiment, the heat conductive sheet 31 is bent in a substantially U shape, and the silicone rubber sheets 32 and 33 are fixed to both ends of the bent outer surface 31a, respectively. Silicone rubber sheets 32 and 33 are not fixed to the bent inner surface 31b of the heat conductive sheet 31, and a rubber-like elastic body 65 is provided instead.

  The rubber-like elastic body 65 is preferably a thermosetting elastomer such as silicone rubber, urethane rubber, isoprene rubber, ethylene propylene rubber, natural rubber, ethylene propylene diene rubber, nitrile rubber (NBR) or styrene butadiene rubber (SBR); It is configured to include thermoplastic elastomers such as urethane, ester, styrene, olefin, butadiene, and fluorine, or composites thereof. The rubber-like elastic body 65 is preferably made of a material having high heat resistance that can maintain its form without being melted or decomposed by the heat transmitted through the heat conductive sheet 31. More preferably configured. The rubber-like elastic body 65 may be configured by dispersing fillers typified by aluminum nitride, cBN, diamond particles and the like in rubber in order to increase its thermal conductivity. In addition, the heat conductive sheet 31 may be curving in the substantially U shape similarly to 1st Embodiment instead of substantially U shape.

  Thus, the heat conductive sheet 31 is curved or bent so that a space can be formed inward, and includes the rubber-like elastic body 65 in the inward. For this reason, even if vibration etc. are added after attaching the heat conductive connector 30a between the PCB 10 and the heat sink 3, the rubber-like elastic body 65 can hold the shape of the heat conductive sheet 31. Therefore, the adhesion between the silicone rubber sheet 32 and the PCB 10 and the adhesion between the heat sink 3 and the silicone rubber sheet 33 can be maintained for a long time. The rubber-like elastic body 65 may or may not be bonded to the inner side of the heat conductive sheet 31, but is more preferably bonded.

(Third embodiment)
Next, a third embodiment of the present invention will be described. In the description of the third embodiment, portions common to the previous embodiment are denoted by the same reference numerals, and redundant description is omitted for the description of the previous embodiment.

  6 shows an AA line cross-sectional view (6A) similar to FIG. 2 of the electronic apparatus according to the third embodiment and an enlarged perspective view (6B) of the heat conducting connector in the cross-sectional view.

  The electronic device 1 according to the third embodiment is common to the electronic device 1 according to each of the above-described embodiments except for the form of the heat conducting connector 30b. The heat conductive connector 30b includes a belt-shaped heat conductive sheet 31 containing metal, carbon, or ceramics, a silicone rubber sheet 32 that covers the surfaces that are closely fixed to the PCB 10 at both ends of the heat conductive sheet 31, and a surface that is closely fixed to the heat sink 3. And a covering silicone rubber sheet 33. Suitable materials for the heat conductive sheet 31 and the silicone rubber sheets 32 and 33 are the same as those in the above-described embodiments. In this embodiment, as in the second embodiment, the heat conductive sheet 31 is bent in a substantially U shape, and the silicone rubber sheets 32 and 33 are fixed to both ends of the bent outer surface 31a, respectively. . Silicone rubber sheets 32 and 33 are not fixed to the bent inner surface 31b of the heat conductive sheet 31, and a rubber-like elastic body 65 is provided instead. A rubber-like elastic body 66 is provided on the bent outer surface 31 a of the heat conductive sheet 31. The rubber-like elastic body 66 is in close contact with the outer surface 31a of the heat conductive sheet 31 in an adhesive or non-adhered state. The rubber-like elastic body 66 may have any shape, but has a height that is flush with the silicone rubber sheets 32 and 33 or does not protrude toward the PCB 10 and the heat sink 3 than the silicone rubber sheets 32 and 33.

  The rubber-like elastic bodies 65 and 66 can be made of the same material as the rubber-like elastic body 65 of the second embodiment, and are more preferably made of, for example, silicone rubber or fluorine rubber. The rubber-like elastic bodies 65 and 66 may be configured by dispersing fillers represented by aluminum nitride, cBN, diamond particles and the like in rubber. In addition, the heat conductive sheet 31 may be curving in the substantially U shape similarly to 1st Embodiment instead of substantially U shape.

  Thus, the heat conductive sheet 31 is curved or bent so as to form a space inward, and the inner side and the inner side and the outer side located on the opposite side across the heat conductive sheet 31 are rubber-like. Elastic bodies 65 and 66 are provided. For this reason, even if vibration etc. are added after attaching the heat conductive connector 30b between the PCB 10 and the heat sink 3, the rubber-like elastic bodies 65 and 66 can hold the shape of the heat conductive sheet 31. Therefore, the adhesion between the silicone rubber sheet 32 and the PCB 10 and the adhesion between the heat sink 3 and the silicone rubber sheet 33 can be maintained for a long period of time as in the second embodiment or more.

(Fourth embodiment)
Next, a fourth embodiment of the present invention will be described. In the description of the fourth embodiment, portions common to the previous embodiment are denoted by the same reference numerals, and redundant description is omitted for the description of the previous embodiment.

  FIG. 7: shows the AA sectional view (7A) similar to FIG. 2 of the electronic device which concerns on 4th Embodiment, and the expansion perspective view (7B) of the heat conductive connector in the said sectional view, respectively.

  The electronic device 1 according to the fourth embodiment is the same as that described above except that more capacitors 22 are mounted on the back surface of the PCB 10 (the surface closer to the heat sink 3) and the form of the heat conductive connector 30c is different. Common to the electronic apparatus 1 according to the embodiment. The heat conductive connector 30c includes a belt-shaped heat conductive sheet 31 containing metal, carbon, or ceramics, a silicone rubber sheet 32 that covers the surfaces that are closely fixed to the PCB 10 at both ends of the heat conductive sheet 31, and a surface that is closely fixed to the heat sink 3. And a covering silicone rubber sheet 33. Suitable materials for the heat conductive sheet 31 and the silicone rubber sheets 32 and 33 are the same as those in the above-described embodiments. In this embodiment, the heat conductive sheet 31 is bent in a substantially U-shape as in the second embodiment. Unlike the first embodiment, the heat conductive connector 30c is tightly fixed to the front side surface of the PCB 10 via the silicone rubber sheet 32 instead of the back side surface of the PCB 10. Therefore, the silicone rubber sheet 32 is fixed to the inner surface 31 b of the heat conductive sheet 31. In addition, the heat conductive connector 30c is closely fixed via the heat sink 3 and the silicone rubber sheet 33 as in the first embodiment.

  The heat conduction port (not shown in FIG. 7) described in the first embodiment is preferably provided on an opposing surface (surface on the front side of the PCB 10) sandwiching the PCB 10 with respect to the capacitor 22. Therefore, heat conducted from the heat conduction port to the heat conduction sheet 31 through the silicone rubber sheet 32 is conducted to the heat sink 3 through the silicone rubber sheet 33. In addition, the heat conductive sheet 31 may be curving in the substantially U shape similarly to 1st Embodiment instead of substantially U shape.

  As described above, the heat conductive sheet 31 is curved or bent so as to form a space inward, and includes a silicone rubber sheet 32 at a portion that is an inner surface 31b that can be fixed to the PCB 10, and an outer side. A silicone rubber sheet 33 is provided on a portion of the surface 31 a that can be fixed to the heat sink 3. As described above, the silicone rubber sheets 32 and 33 may be provided not only on the outer surface 31a of the heat conductive sheet 31 but also on the inner surface 31b.

(Modification)
Next, modified examples of the heat conductive connectors 30 to 30c attached to the electronic apparatus 1 according to each of the embodiments of the present invention will be described. In the description of the modification, portions common to the previous embodiment are denoted by the same reference numerals, and redundant description is omitted for the description of the previous embodiment.

  FIG. 8 shows a perspective view (8A) of the heat conducting connector according to the first modification and a perspective view (8B) of the heat conducting connector according to the second modification, respectively.

  The heat conductive connector 30d according to the first modification has a structure that can hold the front surface with the PCB 10 sandwiched between the heat conductive connector 30a attached to the electronic device 1 according to the second embodiment as a basic structure. Specifically, the structure of the heat conducting connector 30d is as follows.

  The heat conductive connector 30d includes a belt-shaped heat conductive sheet 31 containing metal, carbon, or ceramics, a silicone rubber sheet 32 that covers the surfaces that are closely fixed to the PCB 10 at both ends of the heat conductive sheet 31, and a surface that is closely fixed to the heat sink 3. And a covering silicone rubber sheet 33. Suitable materials for the heat conductive sheet 31 and the silicone rubber sheets 32 and 33 are the same as those in the above-described embodiments. In this embodiment, the heat conductive sheet 31 is curved in a substantially U shape, and the silicone rubber sheets 32 and 33 are fixed to both end sides of the curved outer surface 31a, respectively. The curved inner surface 31b of the heat conductive sheet 31 is provided with a first support portion 65 made of a rubber-like elastic body. The first support portion 65 corresponds to the rubber-like elastic body 65 in the second embodiment. A suitable material for the first support portion 65 is the same as the material for the rubber-like elastic body 65 described in the second embodiment.

  On the outer surface 31 a of the heat conductive sheet 31, a connection portion 67 that rises substantially vertically upward, and a horizontal line that extends substantially parallel to the silicone rubber sheet 32 with a gap from the silicone rubber sheet 32 from above the connection portion 67. A second support portion 69 including a portion 68 is provided. A suitable material for the second support portion 69 is the same as the material for the rubber-like elastic body 66 described in the third embodiment. The gap between the horizontal portion 68 and the silicone rubber sheet 32 is formed with a width corresponding to the thickness of the PCB 10. For this reason, as shown in FIG. 8 (8A), the PCB 10 can be inserted in the direction of the white arrow.

  Thus, the heat conductive connector 30d according to the modified example includes a first support portion 65 provided inside the heat conductive sheet 31, and a second support portion 69 sandwiched from both surfaces of the PCB 10 together with the first support portion 65. A cylindrical elastic body. For this reason, the heat conductive connector 30d can connect the PCB 10 and the heat sink 3 more stably.

  The heat conductive connector 30e according to the modified example 2 includes a substantially V-shaped heat conductive sheet 31, a silicone rubber sheet 32 that covers surfaces that are closely fixed to the PCB 10 at both ends of the heat conductive sheet 31, and a surface that is closely fixed to the heat sink 3. And a rubber-like elastic body 65 that is partly sandwiched between the inner surface 31 b of the heat conductive sheet 31 and extends upward from the silicone rubber sheet 32. The rubber-like elastic body 65 has a side surface 70 corresponding to a central angle of about 270 degrees on the side surface of the substantially cylindrical shape. The rubber-like elastic body 65 includes a contact portion 72 that rises at a substantially right angle with the silicone rubber sheet 32. The contact portion 72 and the silicone rubber sheet 32 form a region where the PCB 10 can be placed, as indicated by white arrows. The side surface 71 of the rubber-like elastic body 65 opposite to the heat conductive sheet 31 is a surface continuing from the side surface of the rubber-like elastic body 65 in contact with the inner surface 31b. The outer surface 31a of the heat conductive sheet 31 includes a silicone rubber sheet 32 on a horizontal plane constituting a part thereof, and a silicone rubber sheet 33 on an end of a curved surface connected in an arc shape from the horizontal plane.

  Thus, since the rubber-like elastic body 65 includes the contact portion 72 that contacts the end surface of the PCB 10, the heat conductive connector 30 e can be easily fixed in the gap with the heat sink 3 at the end portion of the PCB 10.

(Other embodiments)
As described above, the preferred embodiments and modifications of the present invention have been described. However, the present invention is not limited thereto, and various modifications can be made.

  For example, the silicone rubber sheets 32 and 33 may be provided on only one side or both sides of the both sides of the heat conductive sheet 31. The heat conductive sheet 31 may have any shape other than a substantially U shape, a substantially V shape, or a substantially U shape. Further, the heat conductive sheet 31 may be formed in a predetermined shape represented by a substantially U-shape, or may be a flat plate that can be freely deformed during use.

  The electronic device 1 and various heat conduction connectors 30 to 30e according to each embodiment can arbitrarily combine these various components. For example, the rubber-like elastic body 65 of the heat conductive connector 30a may be provided on the inner surface 31b of the heat conductive connector 30c. Further, a rubber-like elastic body 66 of the heat conductive connector 30b may be provided on the outer surface 31a of the heat conductive connector 30. Further, one or more of the various heat conductive connectors 30 to 30 e may be provided as one or a plurality of heat conductive members that connect the PCB 10 and the heat sink 3.

  The electronic device and the heat conductive connector according to the present invention can be used for various devices such as automobiles, industrial robots, power generation devices, PCs, and household appliances.

DESCRIPTION OF SYMBOLS 1 Electronic device, 3 Heat sink, 10 PCB (circuit board), 20 Capacitor (an example of electronic component), 21 IC chip (an example of electronic component), 22 Capacitor (an example of electronic component), 30, 30a, 30b, 30c, 30d, 30e Thermal conductive connector, 31 Thermal conductive sheet, 32, 33 Silicone rubber sheet, 40 Thermal conductive port, 65 First support part (rubber-like elastic body), 66 Second support part (rubber-like elastic body), 72 Tangent.

Claims (9)

A heat conduction connector for conducting heat on the circuit board side to the heat sink side,
A belt-like heat conductive sheet containing metal, carbon or ceramics;
A silicone rubber sheet that covers the surfaces of the heat conductive sheet that are tightly fixed to the circuit board and the heat sink at both ends;
A heat conducting connector. The heat conductive sheet is curved or bent so as to form a space inward,
The heat conductive connector according to claim 1, further comprising a rubber-like elastic body at least on the inner side of the inner side and the outer side of the inner side and the outer side of the heat conductive sheet.   The heat conductive connector according to claim 2, wherein the rubber-like elastic body includes a contact portion that contacts an end surface of the circuit board. The rubber-like elastic body is
A first support portion provided on the inner side of the heat conductive sheet;
A second support part sandwiched from both sides of the circuit board together with the first support part;
The heat conductive connector of Claim 2 or Claim 3 provided with these. A circuit board on which electronic components are mounted;
A heat sink disposed separately from the circuit board;
A heat conducting connector disposed in a part of a gap between the circuit board and the heat sink, for conducting heat on the circuit board side to the heat sink side;
An electronic device comprising:
The heat conductive connector is a belt-shaped heat conductive sheet containing metal, carbon or ceramics,
A silicone rubber sheet that covers the surfaces of the heat conductive sheet that are tightly fixed to the circuit board and the heat sink at both ends;
Electronic equipment comprising. The heat conductive sheet is curved or bent so as to form a space inward,
The electronic device according to claim 5, wherein a rubber-like elastic body is provided on at least the inner side of the inner side and the outer side of the inner side and the outer side located on the opposite side across the heat conductive sheet.   The electronic apparatus according to claim 6, wherein the rubber-like elastic body includes an abutting portion that abuts against an end surface of the circuit board. The rubber-like elastic body is
A first support portion provided on the inner side of the heat conductive sheet;
A second support part sandwiched from both sides of the circuit board together with the first support part;
The electronic device according to claim 6 or claim 7, further comprising: The circuit board includes a convex heat conduction port on the back side of the mounting surface of the electronic component,
9. The electronic device according to claim 5, wherein the heat conductive connector is closely fixed to the circuit board and the heat sink so that the silicone rubber sheet is brought into contact with the heat conductive port. 10. .