JP2018049199A5 - - Google Patents
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- JP2018049199A5 JP2018049199A5 JP2016185295A JP2016185295A JP2018049199A5 JP 2018049199 A5 JP2018049199 A5 JP 2018049199A5 JP 2016185295 A JP2016185295 A JP 2016185295A JP 2016185295 A JP2016185295 A JP 2016185295A JP 2018049199 A5 JP2018049199 A5 JP 2018049199A5
- Authority
- JP
- Japan
- Prior art keywords
- wet etching
- glass substrate
- local
- substrate
- opening
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 238000001039 wet etching Methods 0.000 claims 43
- 239000000758 substrate Substances 0.000 claims 29
- 239000011521 glass Substances 0.000 claims 16
- 238000004519 manufacturing process Methods 0.000 claims 5
- 239000000463 material Substances 0.000 claims 3
- 239000007788 liquid Substances 0.000 claims 2
- 231100000078 corrosive Toxicity 0.000 claims 1
- 231100001010 corrosive Toxicity 0.000 claims 1
- 238000002955 isolation Methods 0.000 claims 1
- -1 polytetrafluoroethylene Polymers 0.000 claims 1
- 229920001343 polytetrafluoroethylene Polymers 0.000 claims 1
- 239000004810 polytetrafluoroethylene Substances 0.000 claims 1
Claims (13)
ガラス基板を支持する基板支持手段と、
前記基板支持手段によって支持された前記ガラス基板の主表面に対向するように前記ガラス基板の下側に配置されるウェットエッチング手段と、
前記基板支持手段と前記ウェットエッチング手段とを相対移動させる相対移動手段を備え、
前記ウェットエッチング手段は上面に前記ウェットエッチング液を前記ガラス基板の主表面に供給する開口部を有し、少なくとも前記開口部における前記ガラス基板の主表面と対向する面は前記ウェットエッチング液に対して撥液性を有する材料で構成されているウェットエッチング槽と、リンス槽と、を有することを特徴とする局所ウェットエッチング装置。 In a local wet etching apparatus for manufacturing a photomask substrate by locally processing the main surface of a glass substrate with a wet etching solution,
Substrate support means for supporting the glass substrate;
Wet etching means disposed on the lower side of the glass substrate so as to face the main surface of the glass substrate supported by the substrate supporting means;
Relative movement means for relatively moving the substrate support means and the wet etching means,
The wet etching means has an opening for supplying the wet etching solution to the main surface of the glass substrate on the upper surface, and at least a surface of the opening facing the main surface of the glass substrate is in contact with the wet etching solution. A local wet etching apparatus comprising a wet etching tank made of a material having liquid repellency and a rinsing tank.
前記ガラス基板を前記基板支持手段に載置し、
前記相対移動手段を用いて、局所ウェットエッチングを行う前記ガラス基板の所定の場所に前記ウェットエッチング手段をセットし、
前記ガラス基板の所定の場所を局所ウェットエッチングすることを特徴とするフォトマスク用基板の製造方法。 Using the local wet etching apparatus according to any one of claims 1 to 11,
Placing the glass substrate on the substrate support means;
Using the relative movement means, set the wet etching means in a predetermined place of the glass substrate to perform local wet etching,
A method for manufacturing a substrate for a photomask, comprising performing local wet etching on a predetermined location of the glass substrate.
前記局所ウェットエッチングを行う前記ガラス基板の主表面が下向きになるように前記ガラス基板を保持し、
開口部を有し、少なくとも前記開口部の前記ガラス基板の主表面と対向する面は前記ウェットエッチング液に対して撥液性を有する材料で構成されたウェットエッチング槽と、リンス槽とを用意し、
前記ウェットエッチング槽の前記開口部の上面に前記ウェットエッチング液を保持し、
ウェットエッチング手段を前記ガラス基板の主表面に近接させることによって前記ウェットエッチング液を前記ガラス基板の主表面に接触させて局所ウェットエッチングを行った後、リンス槽により前記ガラス基板の主表面に残留するウェットエッチング液を除去することを特徴とするフォトマスク用基板の製造方法。 In the method of manufacturing a photomask substrate, a local wet etching is performed by bringing a wet etching solution into contact with a part of the main surface of the glass substrate to manufacture a photomask substrate.
Holding the glass substrate so that the main surface of the glass substrate that performs the local wet etching is downward,
A wet etching bath having a opening and at least a surface facing the main surface of the glass substrate of the opening is made of a material having liquid repellency with respect to the wet etching solution, and a rinse bath is prepared. ,
Holding the wet etching solution on the upper surface of the opening of the wet etching bath;
After the wet etching means is brought into contact with the main surface of the glass substrate by bringing the wet etching means close to the main surface of the glass substrate, local wet etching is performed, and then remains on the main surface of the glass substrate by a rinse bath. A method for producing a photomask substrate, comprising removing a wet etching solution.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016185295A JP2018049199A (en) | 2016-09-23 | 2016-09-23 | Local wet etching device and manufacturing method of substrate for photomask |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016185295A JP2018049199A (en) | 2016-09-23 | 2016-09-23 | Local wet etching device and manufacturing method of substrate for photomask |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2018049199A JP2018049199A (en) | 2018-03-29 |
JP2018049199A5 true JP2018049199A5 (en) | 2019-10-03 |
Family
ID=61767573
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2016185295A Pending JP2018049199A (en) | 2016-09-23 | 2016-09-23 | Local wet etching device and manufacturing method of substrate for photomask |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2018049199A (en) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102325256B1 (en) * | 2018-08-08 | 2021-11-11 | 주식회사 오럼머티리얼 | Device for forming pattern of mask and producing method of mask |
JP6803018B2 (en) * | 2019-03-05 | 2020-12-23 | 株式会社Nsc | Etching solution for glass and manufacturing method of glass substrate |
CN111704364B (en) * | 2020-06-30 | 2022-11-25 | 福建省卓成环保科技有限公司 | Corrosion device and corrosion method for producing local ground glass by chemical method |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03272140A (en) * | 1990-03-22 | 1991-12-03 | Fujitsu Ltd | Chemical treater for semiconductor substrate |
JP3511441B2 (en) * | 1996-11-29 | 2004-03-29 | 忠弘 大見 | Liquid-saving liquid supply nozzle, wet processing apparatus, and wet processing method used for wet processing including cleaning, etching, development, and peeling |
JP2002176020A (en) * | 2000-09-04 | 2002-06-21 | Sony Corp | Apparatus and method for treating substrate as well as method for manufacturing device product |
US6555017B1 (en) * | 2000-10-13 | 2003-04-29 | The Regents Of The University Of Caliofornia | Surface contouring by controlled application of processing fluid using Marangoni effect |
JP3737452B2 (en) * | 2002-05-31 | 2006-01-18 | 株式会社東芝 | Etching equipment |
JP4725767B2 (en) * | 2004-08-12 | 2011-07-13 | 有限会社岡本光学加工所 | Strain-free surface processing equipment and surface processing technology for optical materials |
DK2073939T3 (en) * | 2006-10-16 | 2012-10-22 | Materials And Technologies Corp | Wet processing device using a fluid meniscus |
JP4775367B2 (en) * | 2007-12-03 | 2011-09-21 | 東ソー株式会社 | Vertical holding device for surface workpiece and surface processing device of surface processing device |
JP5153750B2 (en) * | 2009-10-09 | 2013-02-27 | 三菱電機株式会社 | Substrate surface treatment device, solar cell manufacturing device |
JP5652381B2 (en) * | 2011-11-29 | 2015-01-14 | 東ソー株式会社 | Surface processing method and apparatus |
-
2016
- 2016-09-23 JP JP2016185295A patent/JP2018049199A/en active Pending
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