JP4775367B2 - Vertical holding device for surface workpiece and surface processing device of surface processing device - Google Patents

Description

  The present invention relates to a holding device for holding a flat workpiece such as a glass substrate or a semiconductor substrate, and supplies an etchant (etching solution) such as hydrofluoric acid to the surface of the glass substrate as a workpiece by a processing head. In a surface device that forms an etchant flow path that forms an etching region of a certain area in the gap between the processing head and the workpiece by suction, for example, in a surface device that scans the processing head to process the surface of the workpiece. The present invention relates to a vertical holding device for a flat plate-like workpiece and a surface machining device that can reliably hold and fix the workpiece.

  A panel of a liquid crystal television or a personal computer monitor is composed of a TFT array and a color filter, and these are produced by repeatedly transferring a pattern drawn on a photomask using an exposure apparatus.

  In recent years, with the growing demand for large LCD TVs, the size of photomasks that support large panels has increased, and the display quality has been improved. It has been.

  An exposure apparatus having a size of 1220 mm × 1400 mm has been announced as a photomask size, and the size of the photomask will be further increased.

  Synthetic quartz glass having a small thermal expansion coefficient is used as the base material of the photomask, but the flatness of the base material greatly affects the exposure accuracy. When a base material with poor flatness is used, it is understood from experience that a high-definition product cannot be obtained due to pattern deviation, and a flatness of several μm is required.

  It is considered that it is very difficult to perform strict required performance such as flatness by a conventional mechanical polishing method such as a double-side polishing method or a single-side polishing method using water, polishing abrasive grains, and polishing cloth.

  In such a mechanical polishing method, the flatness of the substrate is improved by devising the uniforming of the relative movement speed between the polishing surface pressure and the polishing head and the workpiece, Since the entire surface of the substrate is flattened while being simultaneously polished, it is extremely difficult to control for flattening the partial shape.

  In view of this, a method for flattening the surface by performing local etching using plasma has been proposed as a processing method instead of machining. This is achieved by measuring the shape or thickness distribution of the workpiece in advance and then controlling the plasma scanning speed on the workpiece according to the distribution, thereby controlling the amount of etching removed and realizing high flatness. It is the correction processing method for doing.

  When this plasma etching method is applied to the processing of a glass substrate, the correction processing method by the plasma etching requires an increase in processing speed because the processing time becomes extremely long as the glass substrate becomes larger. In order to increase the processing speed, it is necessary to enlarge the processing area, that is, to increase the area of the plasma area. However, due to the difference in material properties, specifically, the relative permittivity and the difference in thermal conductivity, Becomes unstable, the amount of processing fluctuates, the input power increases, and heat accumulates on the glass substrate, making control difficult and worsening the surface roughness of the workpiece.

  In addition, the plasma etching method requires expensive devices such as a vacuum chamber and a gas exhaust device, and the processing of a large glass substrate has a problem that the cost for processing further increases.

  Therefore, the present applicant paid attention to the chemical etching method as a new processing method in place of the mechanical processing method and the plasma etching processing method described above (Patent Documents 1 and 2).

  The chemical etching method disclosed in Patent Document 1 uses an etching solution (etchant) that can take an active state and an inactive state depending on temperature, and is immersed in an inert etchant contained in a tank. The semiconductor substrate is moved relative to the etchant jet nozzle in a direction parallel to the main surface of the semiconductor substrate while an active etchant is applied to a part of the main surface of the semiconductor substrate by an etchant jet nozzle. The active etchant is applied to the entire surface, and the reacted etchant applied to the main surface of the semiconductor substrate is immediately discharged out of the tank through the etchant discharge pipe.

Patent Document 2 discloses a nozzle having a concentric tube structure in which a pipe having an introduction passage to which an etchant as a processing liquid is supplied and a discharge passage through which the etchant is discharged is disposed inside and outside, and the etchant is directed toward an object to be processed. Is supplied from the inner pipe, and the etchant supplied from the gap between the outer pipe and the inner pipe toward the object to be processed is supplied.
JP-A-11-045872 Japanese Patent Laid-Open No. 10-163153

  When the technique disclosed in Patent Document 1 described above is to be applied to a workpiece having a large size, a tank that can accommodate the workpiece is required, and the facility becomes very large, which is not realistic.

  On the other hand, in the technique disclosed in Patent Document 2, it is not necessary to immerse the substrate in a tank in which an inert etchant is accommodated. As a result of experiments on flattening, it was found that the target planar shape could not be obtained.

  Here, as a method of flattening the surface of the glass substrate or the like, the surface of the workpiece is intended based on the measurement data obtained by measuring the surface shape of the workpiece such as the glass substrate. The correction process of partially processing so that it may become a shape is used.

  Therefore, in order to apply the correction process to the above-described chemical etching type surface processing method to process the surface of the workpiece with high flatness, an etchant such as hydrofluoric acid (etching solution) is applied to the glass substrate by the processing head. Then, by supplying to the surface of the workpiece such as a semiconductor substrate and sucking, an etchant flow path that forms an etching area of a certain area is formed in the gap between the processing head and the workpiece, for example, the processing head is Scanning is performed at a scanning speed corresponding to the removal amount determined by the shape measurement data and the target shape. At that time, a machining trace shape (hereinafter referred to as a unit machining trace) as a unit is measured on the surface of the workpiece formed by the etching region with the machining head stationary, and based on the unit machining trace based on the measurement result. Thus, the removal amount to be removed by machining from the surface of the workpiece before machining and the scanning speed of the machining head are obtained, and the machining head is driven by this scanning speed.

  In such a processing method, if the glass substrate is held in a vertical posture, the planar occupation space of the entire processing apparatus can be reduced, and particularly a large glass substrate can realize a significant space saving. It is necessary to securely hold the glass substrate without coming off.

  Further, in such a processing method, the present applicant arranges a flat dummy material around the glass substrate, so that the peripheral edge of the glass substrate can be obtained even if the processing head moves to a position beyond the edge of the glass substrate. Although it has been proposed that a desired planar shape can be obtained for the portion, it is also necessary to prevent a step from being generated on the surface of the glass substrate and the dummy material while the glass substrate is held.

  The first object of the present invention is to stabilize the etchant region even when the processing head moves to a position beyond the edge of the flat plate-like workpiece such as a glass substrate, and to achieve a high precision up to the peripheral portion of the flat plate-like workpiece. An object of the present invention is to provide a vertical holding device and a surface processing device for a flat plate-like workpiece of a surface processing device that can be processed smoothly.

  In addition to the first object described above, the second object of the present invention is a vertical holding device for a plate-like workpiece of a surface processing apparatus capable of arranging a dummy material arranged around the glass substrate without any step with respect to the glass substrate. And a surface processing apparatus.

  A first configuration of a vertical workpiece vertical holding device of a surface processing apparatus that realizes an object of the present invention includes a holding plate that holds a flat workpiece in a vertical posture in accordance with a central opening. A workpiece holding device, and an etchant is supplied to the surface of the workpiece held on the front surface side of the holding plate by the processing head and sucked to thereby provide a gap between the processing head and the workpiece. In a surface processing apparatus that forms an etchant flow path that forms an etching area of a predetermined area and processes the surface of the workpiece by relatively scanning the processing head and the workpiece, the workpiece holding The apparatus is provided with a vacuum chuck portion that sucks and holds the outer peripheral portion of the back surface of the workpiece around the central opening formed in the holding plate, and the vacuum chuck portion is provided to hold the workpiece. Work piece maintenance provided The outer periphery of the region, characterized in that the attachment of the dummy member mounting region a plurality, each of the dummy member to each dummy member attachment region attached a flat dummy member communicating with the surface of the workpiece.

  The 2nd structure of the vertical holding | maintenance apparatus of the flat workpiece of the surface processing apparatus which implement | achieves the objective of this invention is the above-mentioned 1st structure, and the said dummy member positions the front-back direction with respect to the said holding plate. It is held and fixed by a dummy member longitudinal position adjustment mechanism that can be adjusted at a plurality of locations.

  The third configuration of the flat workpiece vertical holding device of the surface processing apparatus for realizing the object of the present invention is any one of the configurations described above, and the holding plate constitutes the workpiece holding region, The frame-shaped first plate member having the central opening and the dummy member mounting region are configured, the first plate member is fitted into the inner opening, and is relative to the first plate member at least in the front-rear direction. A movable second plate member, and a front-rear direction relative position in which the first member and the second member are held and fixed at a plurality of locations by adjusting the relative position in the front-rear direction of the first plate member and the second plate member. And a position adjuster.

  The fourth configuration of the vertical workpiece vertical holding device of the surface processing apparatus that realizes the object of the present invention is the above-described third configuration, and the first member can be slid with respect to the second member. It has the slide guide means to hold | maintain, It is characterized by the above-mentioned.

  A first configuration of a surface processing apparatus that realizes the object of the present invention is to hold a flat plate-like workpiece by the vacuum chuck portion in the vertical holding devices of the second to fourth configurations described above, and to move the position in the front-rear direction. After the position of the flat workpiece surface and the dummy member surface is adjusted to be flat by an adjustment mechanism, the vertical holding device can be moved in two directions of the main scanning direction and the sub-scanning direction. It is characterized by being disposed in parallel with the scanning surface.

  A second configuration of the surface processing apparatus that realizes the object of the present invention is disposed to face the workpiece in the vertical posture, is movable in two directions of the main scanning direction and the sub-scanning direction, and is spaced in the sub-scanning direction. It has a plurality of movable bodies arranged and arranged, and the processing head is attached to each movable body.

  A third configuration of the surface processing apparatus that realizes the object of the present invention is the above-described second configuration of the surface processing apparatus, which is linked to the plurality of moving bodies and simultaneously moves the plurality of moving bodies in the sub-scanning direction. It has a moving mechanism for moving the amount.

  A fourth configuration of the surface processing apparatus that realizes the object of the present invention is the second configuration of the surface processing apparatus described above, and includes a moving mechanism that individually moves the plurality of moving bodies in the sub-scanning direction. And

  According to the present invention, since the workpiece such as a glass substrate can be detachably held from the back side in a vertical posture, it does not affect the surface processing of the workpiece by the processing head, and during processing It can also be prevented from falling, and the processing head moves to a position beyond the edge of the flat work piece such as a glass substrate by a dummy member arranged on the outer periphery of the flat work piece such as a glass substrate to be sucked and held. Even in this case, the etchant region is not disturbed, and high-accuracy processing can be performed up to the peripheral edge of a flat plate-like workpiece such as a glass substrate.

  Further, by using a plurality of dummy members, the dummy members can be arranged around the workpiece such as a glass substrate without any gap.

  According to the second aspect of the invention, since the inclination of the entire dummy member can be adjusted, and the unevenness of the dummy member can be adjusted partially, the workpiece such as a glass substrate that is sucked and held by the holding plate can be adjusted. A dummy member can be attached at the same level as the surface.

  According to the invention of claim 3, since the workpiece such as a glass substrate can be adjusted with respect to the dummy member, the joint between the dummy member and the workpiece can be made flat. For example, when controlling the posture of the machining head while measuring the distance between the dummy member and the workpiece surface and passing through this joint, the machining head is brought into contact with the dummy member or the workpiece surface. Can be prevented.

  According to the invention which concerns on Claim 4, a workpiece, such as a glass substrate, can be slid and the inclination with a dummy member can be made to correspond.

  According to the invention which concerns on Claim 5, surface processing is realizable with a processing head in the state which made flat the surface of flat plate-like workpieces, such as a glass substrate, and a dummy member.

  In the inventions according to claims 6 to 7, the processing time by the processing head for a workpiece such as a glass substrate held in a vertical posture can be shortened.

  Hereinafter, the present invention will be described in detail based on embodiments shown in the drawings.

  FIG. 1 is a view showing a chemical etching type surface processing apparatus (abbreviated as a wet etching processing apparatus) according to the present invention, and FIG. 2 is a substrate holder for holding the processing head of FIG. 1 and a glass substrate as a workpiece in a vertical posture. It is a figure which shows the relationship.

  A wet etching processing apparatus 1 shown in FIG. 1 includes an etchant circulation device 1A surrounded by a broken line and a processing head 2 connected to the etchant circulation device 1A, and the processing head 2 with respect to the surface of a glass substrate 3 as a workpiece. And a processing head scanning device 1B that moves the two in two directions orthogonal to each other. Examples of the glass substrate 3 as a workpiece include a synthetic quartz glass plate, a photomask substrate, a large photomask substrate, and the like, and the large substrate is one having a side of 300 mm square or more. Further, the workpiece is not limited to a glass substrate, but may be a silicon wafer or the like.

  In the etchant circulation device 1A, an etchant 5 such as hydrofluoric acid is accommodated in an etchant tank 4 having a sealed structure, and the etchant 5 in the etchant tank 4 is supplied to the processing head 2 by an etchant supply system 6. Further, the processing head 2 and the etchant tank 4 are connected by an etchant recovery tube 7, and the etchant 5 supplied to the surface of the glass substrate 3 from the processing head 2 is sucked and returned from the etchant recovery tube 7 to the etchant tank 4.

  A gas exhaust pipe 8 is connected to the etchant tank 4, and the gas in the etchant tank 4 is exhausted by a gas exhaust pump 9 that also serves as a suction pump. When the concentration of the etchant 5 in the etchant tank 4 is reduced or increased, or when the amount of the etchant is reduced, water 11 and the etchant 5 are individually or mixed from the concentration controller 10 and supplied into the supply pipe in the etchant tank 4. 12 is supplied. As the etchant, hydrofluoric acid (hydrofluoric acid), a mixed liquid of hydrofluoric acid and ammonium fluoride, or the like can be used.

  The etchant supply system 6 includes, in order from the etchant tank 4 side, a liquid feed pump 13, a heat exchanger 14, a temperature measuring body 15 for measuring the temperature of the sent etchant 5, and the flow rate of the sent etchant 5. A flow rate adjusting valve 16 for adjusting, a flow meter 17 for measuring the flow rate of the etchant 5 to be fed, and a hydrofluoric acid concentration sensor 18 are arranged, and a supply pipe 19 comprising a flexible pipe provided downstream from the hydrofluoric acid concentration sensor 18. Is connected to the machining head 2.

  The heat exchanger 14 heats or cools the etchant 5 by the temperature control unit 20 so that the temperature of the etchant 5 fed based on the temperature measurement information of the temperature measuring body 15 becomes a predetermined temperature. Further, the flow rate adjusting valve 16 adjusts the flow rate so that the flow rate of the etchant 5 sent based on the flow rate information of the flow meter 17 becomes a predetermined flow rate. The hydrofluoric acid concentration sensor 18 feeds back the measured concentration value to the concentration controller 10 and controls the inside of the etchant tank 4 to a set concentration.

  A gas exhaust pump 9 also serving as a suction pump sucks and exhausts the gas in the etchant tank 4 to bring the inside of the etchant tank 4 into a negative pressure state, and the etchant 5 supplied between the processing head 2 and the glass substrate 3. The gas vaporized from a part of the etchant 5 is sucked from the processing head 2 and recovered into the etchant tank 4 through the recovery pipe 7. If the gas vaporized from a part of the etchant 5 supplied to the surface of the glass substrate 3 is diffused, the surface of the glass substrate 3 is corroded and the surface roughness is deteriorated. The surface roughness on the surface of the glass substrate 3 can be increased by sucking and exhausting.

  The various controls described above in the etchant circulation device 1A are executed by a control device (not shown).

  The machining head 2 is formed by integrating a disk-shaped nozzle block body 41 and a disk-shaped back block body 42 joined to the back side of the nozzle block body 41 with a fixing screw 43 to form an overall disk shape. The configuration is as follows.

  As shown in FIG. 1B, the nozzle block body 41 forms a supply nozzle portion 44 that supplies an etchant at the center position, and sucks the etchant on the same circumference centering on the supply nozzle portion 44. A plurality of discharge holes 45 for discharging are formed at an equal pitch. On the back side of the nozzle block body 41, a first circumferential groove 46 that opens to the back side corresponding to the plurality of discharge holes 45 is formed, and the plurality of discharge holes 45 communicate with the circumferential groove 46. .

  The back block body 42 is formed in a donut shape having an opening 47 in the center, and a second circumferential groove 48 having the same inner and outer diameter as the first circumferential groove 46 is formed on the front surface. When joined to the block body 41, the first circumferential groove 46 and the second circumferential groove 48 form an annular collection portion that collects the etchant from the plurality of discharge holes 45 at one place. In addition, the diameter of the discharge hole 45 was 1 mm or less, and the space | interval of the discharge hole 45 was 0.5 mm or less.

  Further, as the material for the nozzle block body 41 and the back block body 42, it is desirable to select a material that has excellent etchant resistance and excellent mechanical properties such as bending strength and hardness. In particular, a fluororesin such as polytetrafluoroethylene, hard vinyl chloride, ABS, polyethylene, polypropylene, polycarbonate, methylpentene, PEEK and the like are used.

  A plurality of discharge passages 49 communicating with the second circumferential groove 48 are formed in the body portion of the back block body 42, and the recovery pipe 7 of the etchant circulation device 1 </ b> A is connected to the discharge end portions of these discharge passages 49. The supply pipe 19 of the etchant circulation device 1A is connected to the etchant supply nozzle section 44 of the nozzle block body 41 through the opening 47 of the back block body 42.

  The etchant 5 continuously supplied from the etchant supply nozzle portion 44 of the processing head 2 to the surface of the glass substrate 3 is supplied to a plurality of discharge holes 45 provided on the circumference of the radius R around the etchant supply nozzle portion 44. Since suction and discharge are continuously performed, an etching region, which is a constant region in which an etchant flow path is formed between the head and the surface of the workpiece, is formed with a radius R.

  Although the glass substrate 3 in the vertical holding posture may be processed using one processing head 2, the processing head scanning device 1 </ b> B of the present embodiment uses the three processing heads 2 to process the glass substrate 3 in the vertical posture. I try to process.

  As shown in FIG. 2, the processing head scanning device 1B fixes a substrate holding table (not shown) that holds a glass substrate 3 as a workpiece in a vertical posture to an apparatus base 31 and is held by the substrate holding table. A processing head is provided on each of the moving bodies 32A, 32B, and 32C of a plurality of (three in this example) two-way moving stage 32 that can move in two directions perpendicular to the horizontal direction along the surface of the glass substrate 3. 2, the processing head scanning speed control unit 33 controls the main scanning speed for moving each processing head 2 in the horizontal direction and the feed amount in the sub-scanning direction that is sent at a predetermined pitch in the vertical direction. Then, the substrate holder and the three two-way moving stages 32 except for the processing head scanning speed control unit 33 are covered with an apparatus cover 34 to prevent the etchant 5 from scattering into the room and the vaporized gas from being diffused. Yes.

  The three two-way moving stages 32 are made of an aluminum frame 36 that is formed in a gate shape by attaching a horizontal frame member 35C to the upper part of a pair of vertical frame members 35A and 35B arranged to face each other along the scanning direction of the processing head 2. Is attached. Then, a linear movement guide mechanism 37 constituted by, for example, a ball screw mechanism is attached to the pair of vertical frame members 35A and 35B in the vertical direction, and the first, second, and third horizontal beams 38A are attached to the pair of linear movement guide mechanisms 37. , 38B, 38C are mounted apart in the vertical direction.

  Further, a ball screw 40 for the sub-scanning direction is attached between the pair of vertical frame members 35A and 35B along the vertical direction, and a plurality (three in this example) of sub-scanning nut portions (in this example) (Not shown) are attached, and horizontal beams 38A, 38B, and 38C are attached to these three sub-scanning nut portions.

  These three sub-scanning nut portions are installed vertically with a predetermined interval, and the first, second, and third horizontal beams 38A are driven by simultaneously driving the pair of linear movement guide mechanisms 37. 38B and 38C can be simultaneously moved in the vertical direction with extremely high accuracy.

  Further, ball screws 39A, 39B, 39C for driving in the main scanning direction are attached to the first, second, and third horizontal beams 38A, 38B, 38C along the scanning direction, and these ball screws 39A, The moving bodies 32A, 32B, 32C are fixed to main scanning nut portions (not shown) of 39B, 39C, and the machining head 2 is attached to these moving bodies 32A, 32B, 32C, respectively.

  The ball screws 39A, 39B, 39C for driving in the main scanning direction and the ball screw 40 for driving in the sub-scanning direction have motors (not shown) that rotationally drive the respective screw members, and these motors are used to control the machining head scanning speed. Drive control is performed by the unit 33.

  That is, each processing head 2 moves independently in the main scanning direction, and waits for all the processing heads 2 to finish scanning in the forward direction, for example, and then rotates the ball screw 40 for the sub-scanning direction by a predetermined number of times. The first, second, and third horizontal beams 38A, 38B, and 38C are simultaneously moved, for example, downward by a predetermined distance. Then, each head 2 is moved independently, for example, in the backward direction. In this example, as shown in FIG. 2B, each processing head 2 is moved in a zigzag manner from the top to the bottom.

  In this example, since three processing heads 2 are vertically spaced and driven simultaneously, the time required for processing the entire surface of the glass substrate 2 by one processing head 2 is 1/3 of the total processing time. The processing time can be shortened.

  In addition, the thing of a various structure can be used as a structure of the process head 2, The example is demonstrated below.

  Further, as shown in FIG. 2 (c), the processing head 2 moves to the outside beyond the end of the glass substrate 3 and stops, and when the three processing heads 2 finish scanning, the processing head 2 is lowered by a predetermined pitch, Start scanning in the opposite direction.

  Since a plurality (three in this example) of processing heads 2 are attached to the moving bodies 32A, 32B, 32C of the two-way moving stage 32, the processing head 2 shown in FIG. In the main scanning state, when the step movement (sub scanning) is performed in the vertical direction in FIG. 5B, the processing head 2 is fixed to the moving bodies 32A, 32B, 32C of the two-way moving stage 32, and the surface of the processing head 2 is the main surface. When parallel to the scanning direction and the sub-scanning direction, the distance between the surfaces of the processing head 2 and the surface of the glass substrate 3 changes due to the distortion of the glass substrate 3, and if the distance between the surfaces is excessively widened, Causes liquid drawing.

  As one of the causes of etchant dripping and liquid drawing, the entire amount of the etchant supplied from the supply nozzle portion 44 of the processing head 2 shown in FIG. 1B toward the glass substrate surface is around the supply nozzle portion 44. Although it does not occur in a stable state where it flows to the discharge hole 45 provided in the surface by suction, if the distance between the surfaces is too large, the above-described etchant flow becomes unstable, thereby causing the liquid dripping and liquid drawing.

  Such liquid dripping or liquid drawing greatly affects surface processing with high flatness on a workpiece such as a glass substrate.

  Therefore, in the present embodiment, a so-called turning operation that enables the direction of the processing head 2 to be three-dimensionally changed with respect to the surface of the glass substrate 3 is enabled, and is interposed in the gap between the surface of the processing head 2 and the surface of the glass substrate 3. The posture of the machining head 2 is controlled so that the etchant to be sucked and discharged in the above-described stable state.

  In the reciprocating main scan shown in FIG. 4A and the sub-scan shown in FIG. 5A, when the inter-surface distance between the surface of the processing head 2 and the surface of the glass substrate 3 increases, To provide a glass substrate having a highly flat surface by allowing the surface of the glass substrate 3 to be processed into a target shape by setting the inter-surface distance within the predetermined range in which the above-described liquid dripping and liquid drawing do not occur. Is possible.

  Further, as shown in FIG. 6B, when the processing head 2 is fixed to the moving bodies 32A, 32B, 32C of the two-way moving stage 32, the glass substrate surface is moved to the processing head 2 side due to the distortion of the glass substrate 3. If the machining head 2 moves too close to the main scanning trajectory, the machining head 2 may come into contact with the glass substrate 3.

  However, by turning the machining head 2, as shown in FIG. 6A, it is possible to avoid the machining head 2 from coming into contact with the glass substrate 3 by increasing the distance between the narrowed surfaces.

  Therefore, the upper limit value of the distance between the glass substrate 3 and the processing head 2 is set to a range where liquid dripping and liquid drawing does not occur, and the distance at which the processing head 2 does not contact the surface of the glass substrate 3 is set to a lower limit value. It is only necessary to turn the machining head.

  In the present embodiment, as shown in FIG. 3, the machining head 2 is attached with a posture control mechanism 151 for performing a turning operation at the rear end portion of the machining head 2, and this posture control mechanism 151 is moved by the two-way moving stage 32. It is attached to the bodies 32A, 32B, 32C.

  The posture control mechanism 151 includes a fixed portion 152 fixed to the moving bodies 32A, 32B, and 32C and a head mounting portion 153 to which the machining head 2 is mounted facing each other in the front-rear direction, and the head mounting portion 153 is oriented. The fixed part 152 can be changed in three dimensions.

  In the posture control mechanism 151, the orientation changing mechanism that can change the orientation of the head mounting portion 153 has a configuration using three-point support, and is between the fixed portion 152 formed in a rectangular frame or a flat plate shape and the head mounting portion 153. The ball member 154 that forms a free bearing is provided at one corner, the first actuator 155 and the second actuator 156 are disposed at the corners located on both sides of the ball member 154, and the fixed portion and the head mounting portion 153 are provided. A coil spring 157 is disposed between the head mounting portion 53 and the head mounting portion 153 is urged by the spring force of the coil spring 157 so that the head mounting portion 153 is always in contact with the contact end with the first actuator 155 and the second actuator 156. To prevent backlash.

  Further, four distance sensors 158 are arranged at equal intervals around the processing head 2 on the head mounting portion 153 of the attitude control mechanism 151 as shown in FIG. The distance sensor 158 has a four-point arrangement, but may have a three-point arrangement. As the distance sensor 158, a laser displacement meter, an air micrometer, or the like is used.

  The distance sensor 158 measures the distance between the surface of the processing head 2 and the glass substrate 3 at a plurality of locations around the processing head 2 at the same time, and inputs the measured value to the attitude control drive device 159.

  The posture control drive device 159 drives and controls the first actuator 155 and the second actuator 156 so that there is no variation if there are variations in the measurement values from these distance sensors 158. The first actuator 155 and the second actuator 156, for example, can control the energization of the electromagnetic solenoid so that the operating member can advance and retreat, and the operating member comes into contact with the back side of the head mounting portion 153.

  When the glass substrate 3 facing the processing head 2 that moves in the main scanning direction is distorted, the attitude control drive device 159 detects this as a variation in the measurement values of the plurality of distance sensors 158, and The first actuator 155 and the second actuator 156 are driven and controlled so as to be parallel to the surface of the processing head 2 in accordance with the distortion of the glass substrate 3, and the operating member is advanced and retracted, and the direction of the head mounting portion 153 is changed. The posture of the machining head 2 is controlled.

  The posture control of the machining head 2 is continuously performed along with the main scanning of the machining head 2.

  The attitude control drive device 159 drives and controls the first actuator 155 and the second actuator 156 so that the difference between the maximum value and the minimum value in the measured values of the distance sensors 158 is 100 μm, and the surface of the processing head 2 is made of glass. The posture is controlled so as to be parallel to the facing portion of the substrate 3. The distance between the surface of the glass substrate 3 and the surface of the processing head 2 is set to 50 μm to 500 μm.

  In the present embodiment, the surface shape is measured for correction processing while the glass substrate 3 is held in a vertical posture, and correction processing is performed by the processing head 2 while maintaining this holding state. The glass substrate 3 is distorted as described above in a state where the glass substrate 3 is held in a vertical posture.

  However, the surface shape is measured in a state where the glass substrate 3 before processing is held in a vertical posture on the processing apparatus, and the processing head 2 is driven and the etchant is driven according to the target removal amount calculated for the surface shape flattening. Since supply / discharge and the like are controlled, a highly flat substrate surface can be obtained even when the processed glass substrate 3 is in a horizontal posture.

  In the above-described embodiment, the surface of the glass substrate 3 that needs to be processed is equally divided into three areas along the sub-scanning direction, and each divided area is processed simultaneously by the processing head 2 provided corresponding to each divided area. The first to third horizontal beams 38A, 38B, and 38C are simultaneously moved in the sub-scanning direction by the same amount (same pitch). However, the present invention is not limited to this, and each machining head 2 is individually moved. It may be possible to move in the sub-scanning direction. Further, the segment areas do not have to have the same pitch in the sub-scanning direction, and the lengths of the individual segment areas in the sub-scanning direction may be different.

  Further, the processing head 2 having the above-described configuration is moved from one horizontal end to the other end of the upper end of the glass substrate 3 held in the vertical posture by the two-way moving stage 32 as indicated by an arrow in FIG. When the main scanning is performed horizontally and the predetermined position on the other end is reached, the sub-scan is sent downward by a predetermined amount, and then the main scanning is performed toward the one end. Do. Note that the scan order may be reversed from the bottom to the top.

  In the above-described control of the main scanning speed, when correction processing is assumed, the shape of the surface of the glass substrate 3 is measured in advance, and the shape before processing and the processing head 2 are set so as to be closest to the target shape based on the measurement result. The amount of machining removal and the main scanning speed of the machining head are calculated from the shape of the static machining trace formed by machining. For example, the main scanning speed of the processing head 2 is controlled so that a large convex portion has a large etching amount, and a small convex portion or a concave portion has a small etching amount. The scanning speed after the processing head 2 passes through the glass substrate 3 is not particularly defined, but it is preferable to increase the scanning speed in consideration of the processing time.

  The shape of the surface of the glass substrate 3 can be measured using a non-contact method using a laser or the like, or a contact method such as a stylus. In addition, since the measurement is performed with the glass substrate 3 held in a vertical posture, the influence of the self-weight deflection of the glass substrate 3 can be eliminated.

  In the present embodiment, as shown in FIG. 7, the substrate holding device 50 that holds the glass substrate 3 in a vertical posture is formed in a rectangular flat plate shape by an aluminum flat plate, and has a rectangular opening 51 in the center. The base plate 52 is formed.

  The opening size of the opening 51 is formed smaller by a length L from the outer periphery than the outer size of the glass substrate 3 to be held. The glass substrate 3 is held in a horizontal posture in accordance with the opening 51, and a plurality of vacuum chucks 54 are provided in a plurality of locations (in this embodiment) on the belt-like suction band 53 formed with a width L around the opening 51. 3 places), and the outer peripheral portions of the four sides of the glass substrate 3 are sucked and held by these vacuum chucks 54.

  The vacuum chuck 54 includes a suction pad 56 formed in an oblong shape by protruding an O-ring 55 forward from the surface of the base plate 52 (the glass substrate 3 holding side) and the suction pad 56. The suction hole 57 penetrates the front and back (thickness direction) of the base plate 52 so as to be positioned, and a vacuum source (not shown) is connected to the suction hole 57 via a pipe (not shown).

  Then, the front surface side (processing surface side) of the glass substrate 3 is set to the front side, and the back surface side outer peripheral portion of the glass substrate 3 is brought into contact with the O-ring 55 of the vacuum chuck 54 provided in each suction band portion 53. As a result, the space formed by the contact portion between the O-ring 55 and the glass substrate 3 becomes a vacuum, and the glass substrate 3 can be sucked and held on the base plate 52 in a vertical posture.

  On the other hand, the base plate 52 is formed with an area to which four dummy members 60 formed in a rectangular flat plate shape are attached so as to surround the glass substrate 3 to be sucked and held.

  The dummy member 60 is in contact with the end surface of the glass substrate 3 without a gap and without a step in the thickness direction so that the surface of the dummy member 60 and the surface of the glass substrate 3 are flush with each other.

  The dummy member 60 plays a role equivalent to the presence of the glass substrate 3 with respect to the processing head 2 protruding from the edge of the glass substrate 3 when the processing head 2 moves to the outer peripheral portion of the glass substrate 3. . If the processing head 2 is scanned in a state where the dummy member 60 is not disposed, and the processing head 2 reaches the outer peripheral portion of the glass substrate 3 and protrudes beyond the edge of the glass substrate 3, the processing head 2 and the glass substrate 3 The etching area formed in the gap protrudes outward from the outer peripheral edge of the glass substrate 3, and the flow path of the etchant forming the etching area is disturbed, making it impossible to process in the regular etching area.

  On the other hand, as in this embodiment, the etchant region formed by the processing head 2 is formed at the end of the glass substrate 3 by surrounding the glass substrate 3 with the dummy member 60 without gaps and without causing a step. Even when approaching or exceeding the end of the glass substrate 3, the dummy member 60 is extended from the end of the glass substrate 3, so that the flow path of the etchant forming the etching region is not disturbed.

  For this reason, it becomes possible to process the edge part of the glass substrate 3 according to the target shape.

  In this embodiment, since the glass substrate 3 and the dummy member 60 are attached to the base plate 52, the surface of the dummy member 60 is the glass substrate 3 in a state where the glass substrate 3 is attracted and held to the base member 52. The position in the thickness direction can be adjusted so as to coincide with the surface.

  The dummy member 60 is integrally formed by screwing an aluminum back plate 62 from the back plate 62 side with a screw 63 to the back surface of the main plate 61 formed of a material such as polyvinyl chloride having corrosion resistance against the etchant. The hardness and rigidity of the plate 61 are increased. By providing the back plate 62, wear of the contact surface caused by contact with the distal end surface of a push screw 64 described later is reduced, and a bottomed screw hole 62a into which a pull screw 65 described later is screwed is provided. It can be formed on the back plate 62.

  The base member 52 is divided into dummy member attachment regions 52A, 52B, 52C, and 52D, which are regions to which the dummy member 60 is attached. A push screw 64 is screwed into each dummy member attachment region 52A, 52B, 52C, and 52D. A plurality of screw holes 58 are formed, and a plurality of pull screw insertion holes 59 through which the pull screws 65 are inserted are formed. In the present embodiment, the arrangement positions of the screw holes 58 and the pull screw insertion holes 59 in the dummy member attachment regions 52A, 52B, 52C, 52D are the same, and are not limited to the example shown in FIG.

  The push screw 64 is screwed into the screw hole 58 and passes through the screw hole 58, and the front end surface of the push screw 64 comes into contact with the back plate 62 of the dummy member 60. Therefore, as the push screw 64 is screwed in, the front end surface of the push screw 64 jumps out toward the front surface of the base member 52, so that the dummy member 60 is partially pushed forward.

  The pulling screw 65 has a threaded portion at the tip, and the pulling screw insertion hole 59 is inserted until the head comes into contact with the seating surface of the base member 52, so that the leading screw is connected to the back plate of the dummy member 60. It is screwed into a female screw part 62 a provided on 62. When the pulling screw 65 is rotated in the tightening direction, the dummy member 60 is attracted to the base member 52 side and is fixed to the base member 52.

  That is, the dummy member 60 is fixed to the dummy member attachment regions 52A, 52B, 52C, and 52D by the pull screw 65, respectively. When the tightening amount of the pull screw 65 is increased, the dummy member 60 in the peripheral portion of the pull screw 65 becomes the base member. It will be drawn to the 52 side.

  Therefore, by adjusting the screwing amount of the push screw 64 and the pull screw 65, the position of each dummy member 60 can be adjusted in the direction of moving away from the base member 52 and approaching the base member 52. The surface level of each dummy member 60 can be made to coincide with the same level as the surface of the glass substrate 3 to be formed.

  Thus, after adjusting the screwing amount of the push screw 64 and the pull screw 65 so that the surface of the glass substrate 3 and the surface of the dummy member 60 are flat, the substrate holding device 50 is moved with respect to the scanning surface of the processing head 2. Are placed opposite each other in parallel.

Second Embodiment FIGS. 8 to 11 show a second embodiment of the present invention.

  8A is a front view of the substrate holding device 70 viewed from the front side, FIG. 8B is a sectional view taken along the line DD of FIG. 9A, and FIG. 9 is a rear view of the substrate holding device 70 viewed from the back side. 10 (a) is a cross-sectional view taken along the line EE in FIG. 9, FIG. 10 (b) is a cross-sectional view taken along the line FF in FIG. 9, and FIG. 11 (a) is a cross-sectional view taken along the line GG in FIG. FIG. 11B is a cross-sectional view taken along the line H-H in FIG.

  In the first embodiment, a rectangular opening 51 is formed at the center of one base plate 52, and an adsorption band 53 having a vacuum chuck 54 is defined around the opening 51, and the adsorption band 53. Although the dummy member attachment areas 52A, 52B, 52C, and 52D for attaching the dummy member 60 to the periphery are partitioned, the substrate holding device 70 of the second embodiment is a rectangular frame-shaped glass provided with a vacuum chuck 54. A substrate holding base (first plate member) 71 and a rectangular frame-shaped dummy member holding base (second plate member) 72 that divides dummy member attachment regions 72A, 72B, 72C, 72D to which the dummy member 60 is attached are separated. The glass substrate holding base 71 is fitted into the rectangular frame of the dummy member holding base 72 without backlash, and the dummy member holding base 72 and the glass are formed on the back side. The mounting device 73 provided with a plate holding base 71 at four corners, is attached integrally.

  As shown in FIG. 10A, the glass substrate holding base 71 is thicker than the dummy member holding base 72, and the front surface of the glass substrate holding base 71 and the front surface of the dummy member holding base 72 are In a state in which the glass substrate holding base 71 is adjusted to the same level, the glass substrate holding base 71 protrudes to the back side on the back side, and the glass substrate holding base 71 and the dummy member holding base 72 are attached with a step.

  The attachment device 73 is disposed at both left and right ends of the upper and lower frame members 71a of the glass substrate holding base 71 in a state where the substrate holding device 70 is held in a vertical posture. The attachment device 73 is formed on the one side portion of the attachment plate 73a by fixing the other side of the attachment plate 73a to the frame member 71a with the fixing bolt 73B so that one side of the attachment plate 73a protrudes from the frame member 71a to the outside of the frame. The tip of the mounting bolt 74 penetrating the one hole 73b is screwed into the dummy member holding base 72 and fixed.

  A compression coil spring 75 is elastically mounted on the attachment bolt 74 between the head and the attachment plate 73a, and the dummy holding base 72 is urged toward the back side by the spring force of the compression coil spring 75.

  Further, a second hole 73c is formed in one side portion of the attachment plate 73a, and a height adjuster 76 with a micrometer head is attached to the attachment plate 73a in accordance with the second hole 73c. The height adjuster 76 is composed of a micrometer, and a sleeve 76a is fixed to a mounting plate 73a by a nut member 76b. The spindle 76c of the height adjuster 76 passes through the second hole 73c and comes into contact with the back surface of the dummy member holding base 72. The dummy is biased toward the back surface by the spring force of the compression coil spring 75. The movement of the member holding base 72 in the back direction is restricted.

  Since the substrate holding device 70 fixes the dummy member holding base 72 to the apparatus main body, when the knob 76d of the height adjuster 76 is turned, the spindle 76c moves in the front-rear direction, and the dummy member holding base 72 is moved. In contrast, the glass substrate holding base 71 moves in the front-rear direction against the spring force of the compression coil spring 75 or against the spring force, and the relative height between the dummy member holding base and the glass substrate holding base 71 is adjusted. The At that time, the height is adjusted by the scale of the micrometer.

  Slide guide devices 77 are arranged at both upper and lower ends of the left and right frame members 71b of the glass substrate holding base 71 with the substrate holding device 70 held in a vertical posture.

  The slide guide device 77 is formed on one side portion of the mounting plate 77a by fixing the other side of the mounting plate 77a to the frame member 71b with fixing bolts 77B so that one side of the mounting plate 77a protrudes from the frame member 71b to the outside of the frame. The guide pin 78 penetrates through the hole 77b in a loosely fitted state, and a linear bush 79 is press-fitted into the penetrating portion of the guide pin 78, and the tip end portion of the guide pin 78 is screwed into the dummy member holding base 72 and fixed. Yes.

  The inner diameter of the hole 77b of the mounting plate 77a is made larger than the outer diameter of the guide pin 78, and the outer diameter of the flange 79a of the linear bush 79 is sufficiently larger than the inner diameter of the hole 77b. Even when the holding base 71 is slid, the linear bush 79 does not come out of the hole 77b.

  Therefore, the glass substrate holding base 71 can be slid in the vertical plane with respect to the dummy member holding base 72 fixed to the apparatus main body. At that time, since the inner diameter of the first hole 73b is larger than the outer diameter of the mounting bolt 74 of the height adjuster 76, the height adjuster 76 becomes an obstacle to the slide of the glass substrate holding base 71. There is no.

  In each dummy member mounting area 72A, 72B, 72C, 72D of the dummy member holding base 72, a dummy member 60 having the same structure as that of the first embodiment is mounted with a dummy member using the differential screw mechanism shown in FIG. The dummy member 60 is attached by the apparatus 80 so that it can be pushed and pulled in the front-rear direction. In the present embodiment, the dummy member attaching device 80 is arranged in a 5 × 3 manner with respect to one dummy member 60 as shown in FIG.

  As shown in FIG. 11 (b), the dummy member mounting device 80 has a sudat bolt 81 erected on the back side of the dummy member 60, and the sudat bolt 81 is loosely fitted in the large diameter hole 72 a formed in the dummy member holding base 72. And by adjusting the position of the sudder bolt 81 in the front-rear direction with respect to the dummy member holding base 72, the front-rear direction and inclination of the dummy member 60 can be adjusted. In this front-rear direction adjustment, a cylindrical height adjustment screw 83 having screw portions formed on the inner and outer peripheral portions thereof is screwed onto a plate nut 82 constituting a differential screw mechanism fixed to the back surface of the dummy member holding base 72, A sudat bolt 81 is screwed into the inner screw of the height adjusting screw 83, and an engaging nut 84 that is screwed into the sudat bolt 81 is engaged with the end face of the height adjusting screw 83.

  In such a configuration, the screw pitch between the outer peripheral screw of the height adjusting screw 83 and the plate nut 82 is set to be smaller than the screw pitch between the inner screw of the height adjusting screw 83 and the sudat bolt 81. When the height adjusting screw 83 is rotated, the sudat bolt 81 slightly moves in the front-rear direction due to the difference in the screw pitch. The height adjusting screw 83 is fixed to the plate nut 82 by tightening the tightening nut 85 screwed into the height adjusting screw 83 until it contacts the plate nut 82, and the engaging nut 84 is connected to the end of the height adjusting screw 83. By tightening until it comes into contact, the movement of the sudat bolt 81 in the front-rear direction is restricted.

  In the case of the present embodiment as well, the dummy member mounting device 80 can adjust the level of the surface of the dummy member 60 and the surface of the glass substrate 3 to be the same as in the first embodiment. Further, the glass substrate holding base 71 can be moved in the front-rear direction by the height adjuster 76 with respect to the dummy member holding base 72 so that the tilt angle can be adjusted and slid. The inclination of the surface of the glass substrate 3 that has been made can be made to coincide with the inclination of the dummy member 60 held by the dummy member holding base 72.

  As shown in FIG. 12, if the inclinations of the dummy member 60 and the glass substrate 3 are inconsistent, a distance sensor 158 is attached to the processing head 2 and the distance between the surface of the glass substrate 3 and the surface of the dummy member 60 is measured. However, when the machining head 2 is scanned in the direction of the arrow by controlling the posture of the machining head 2, for example, when the machining head 2 reaches the boundary between the dummy member 60 and the glass substrate 3, the distance on the dummy member 60 side. And the glass substrate 3 side are different, the processing head 2 is controlled to be in a posture in consideration of both inclinations, and the processing head 2 may come into contact with the glass substrate 3.

  However, by adjusting the inclination of the glass substrate 3 to coincide with the inclination of the dummy member 60, the joint between the glass substrate 3 and the dummy member 60 becomes straight and the processing head 2 comes into contact with the glass substrate 3. Can be prevented.

  In the first and second embodiments described above, the four dummy members 60 are combined and disposed so as to abut one side of the glass substrate 3, but the arrangement of the dummy members 60 is limited to this. For example, a configuration using two sets of planar L-shaped dummy members can be exemplified.

(A) is the schematic of the wet etching processing apparatus which shows 1st Embodiment of this invention, (b) is a front view of the processing head shown to (a). 1A is a cross-sectional view taken along the line AA in FIG. 1, FIG. 2B is a diagram illustrating an arrangement state of three processing heads, and FIG. 2C is a diagram illustrating a scanning order of the processing heads. The schematic structure of an attitude | position control mechanism is shown, (a) is a cross-sectional view, (b) is a top view. (A) is a diagram illustrating a stable formation state of an etchant flow path during main scanning of the processing head, and (b) is a diagram illustrating an unstable formation state. (A) is a diagram for explaining a stable formation state of an etchant flow path during step (sub) scanning of the processing head, and (b) is a diagram for explaining an unstable formation state. (A) The contact avoidance control state of the processing head and the glass substrate during main scanning of the processing head, (b) is a diagram for explaining the contact non-avoidance control state. (A) is a front view of a board | substrate holding | maintenance apparatus, (b) is BB arrow sectional drawing of (a), (c) is the C section enlarged view of (b). (A) is a front view (dummy member attachment state) of the board | substrate holding | maintenance apparatus which shows 2nd Embodiment, (b) is DD sectional view taken on the line of (a). The rear view of the board | substrate holding | maintenance apparatus of FIG. (A) is the EE arrow sectional drawing of FIG. 9, FIG.10 (b) is the FF arrow sectional drawing of FIG. (A) is GG arrow sectional drawing of FIG. 9, FIG.11 (b) is HH arrow sectional drawing of FIG. The figure explaining a mode that the processing head contacts a glass substrate by the mismatching of the inclination of the joint part of the glass substrate and dummy member of the processing head controlled by turning.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Wet etching processing apparatus 1A Etchant circulation apparatus 1B Processing head scanning apparatus 2 Processing head 3 Glass substrate (workpiece)
4 Etchant Tank 5 Etchant 6 Etchant Supply System 7 Etchant Recovery Pipe 8 Gas Exhaust Pipe 9 Gas Exhaust Pump 10 Concentration Controller 11 Water 12 Supply Pipe 13 Liquid Pump 14 Heat Exchanger 15 Temperature Sensor 16 Flow Control Valve 17 Flowmeter 18 Foot Acid concentration sensor 19 Supply pipe 20 Temperature control unit 31 Device base 32 Two-way moving stage 32A to 32C Moving table 33 Processing head scanning speed control unit 34 Device cover 35A, 35B Vertical frame member 35C Horizontal frame member 36 Frame 37 Linear movement guide Mechanisms 38A, 38B, 38C Horizontal beams 39A, 39B, 39C Ball screw 40 for driving in the main scanning direction Ball screw 41 for the sub-scanning direction Nozzle block body 42 Back block body 43 Fixing screw 44 Supply nozzle section 45 Discharge hole 46 First Circumferential groove 47 opening 48 Double circumferential groove 49 Discharge path 50, 70 Substrate holding device 51 Opening 52 Base plate 52A, 52B, 52C, 52D Dummy member attachment area 53 Adsorption band portion 54 Adsorption chuck 55 O-ring 56 Adsorption pad 57 Adsorption hole 58 Screw hole 59 Screw Insertion hole 60 Dummy member 61 Main plate 62 Back plate 62a Screw hole 63 Screw 64 Press screw 65 Pull screw 71 Glass substrate holding base 71a Upper and lower frame members 71b Left and right frame members 72 Dummy member holding bases 72A, 72B, 72C, 72D Dummy Member attachment region 73 Attachment device 73a Attachment plate 73b First hole 73c Second hole 73B Fixing bolt 74 Attachment bolt 75 Compression coil spring 76 Height adjuster 76a Sleeve 76b Nut member 76c Spindle 76d Knob 77 Slide guide device 77a Attachment 77b the hole 77B fixing bolt 78 guide pin 79 Linear bushings 80 dummy member attaching device 81 Sudattoboruto 82 plate nut 83 height adjustment screw 84 engages a nut 85 tightening nut

Claims (8)

A workpiece holding device having a holding plate for holding a flat plate-like workpiece in a vertical posture in accordance with the central opening, and on the surface of the workpiece held on the front side of the holding plate By supplying and sucking the etchant by the processing head, an etchant flow path that forms an etching region of a constant area is formed in the gap between the processing head and the workpiece, and the processing head and the workpiece are relative to each other. In a surface processing apparatus for processing the surface of a workpiece by scanning automatically,
In order to hold the workpiece, the workpiece holding device is provided with a vacuum chuck portion that sucks and holds the outer peripheral portion of the back side of the workpiece around the central opening formed in the holding plate. There are a plurality of dummy member attachment areas to which a plate-like dummy member connected to the surface of the workpiece is attached on the outer periphery of the workpiece holding area provided with the vacuum chuck portion, and each dummy member attachment area has the dummy member attached thereto. A vertical holding apparatus for a plate-like workpiece of a surface processing apparatus, wherein a member is attached.   2. The surface processing apparatus according to claim 1, wherein the dummy member is held and fixed by a dummy member front-rear direction position adjusting mechanism that allows the front-rear direction position to be adjusted at a plurality of positions with respect to the holding plate. Vertical holding device for flat workpieces.   The holding plate constitutes the workpiece holding region, the frame-shaped first plate member having the central opening, the dummy member mounting region, and the first plate member as an inner opening. A first plate member that can be fitted and adjusted relative to the first plate member at least in the front-rear direction; The vertical holding device for a plate-like workpiece of the surface processing device according to claim 1, further comprising a front-rear direction relative position adjuster that holds and fixes the second member at a plurality of locations.   4. A vertical holding device for a flat workpiece of a surface processing apparatus according to claim 3, further comprising slide guide means for holding the first member slidably with respect to the second member.   A flat plate-like workpiece is held by the vacuum chuck portion in the vertical holding device according to any one of claims 2 to 4, and the flat plate-like workpiece surface, the dummy member surface, The vertical holding device is disposed in parallel to the scanning surface of the processing head that can move in two directions of the main scanning direction and the sub-scanning direction after the position is adjusted to be flat. Processing equipment   A plurality of moving bodies that are arranged to face the workpiece in the vertical posture, are movable in two directions of the main scanning direction and the sub-scanning direction, and are spaced apart in the sub-scanning direction; The surface processing apparatus according to claim 5, wherein the processing head is attached to a body.   The surface processing apparatus according to claim 6, further comprising a moving mechanism that is linked to the plurality of moving bodies and simultaneously moves the plurality of moving bodies in the sub-scanning direction by the same amount. The surface processing apparatus according to claim 6, further comprising a moving mechanism that individually moves the plurality of moving bodies in the sub-scanning direction.

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