JP2017188672A - Method for manufacturing light-emitting element-mounting substrate, method for manufacturing light-emitting device by use thereof, light-emitting element-mounting substrate, and light-emitting device arranged by use thereof - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide: a method for manufacturing a light-emitting element-mounting substrate, which enables the cost cutting; a method for manufacturing a light-emitting device by use thereof; a light-emitting element-mounting substrate; and a light-emitting device arranged by use of the substrate.SOLUTION: A method for manufacturing a light-emitting element-mounting substrate comprises the steps of: disposing arrays of core parts 16 each having an optically reflective insulative member 14 on a surface of a conductor core 12; integrally fixing the core parts 16 by a light-shielding resin 20; and removing part of the insulative member 14 so that a surface of each conductor core 16 is exposed from the light-shielding resin 20.SELECTED DRAWING: Figure 4

Description

  The present disclosure relates to a method for manufacturing a substrate for mounting a light emitting element, a method for manufacturing a light emitting device using the same, a substrate for mounting a light emitting element, and a light emitting device using the same.

  As various light sources, light emitting devices including light emitting elements such as LED (light emitting diode) chips are used. Some of such light emitting devices have a light emitting element and a base on which the light emitting element is mounted. For example, in the light emitting devices described in Patent Documents 1 and 2, the light emitting element is mounted on an assembly of light emitting device housings in which a lead frame obtained by punching or etching a metal sheet is integrated with a resin by insert molding technology. Is placed.

JP 2008-235469 A JP 2010-135718 A

In the lead frame processing step when manufacturing such an assembly of light emitting device casings, punching and etching processes are required, and a lot of waste and waste liquid are generated, leading to an increase in the cost of the lead frame. As a result, there is a problem that the cost of the light emitting device finally manufactured increases.
The present embodiment has been made in view of such circumstances, and a method for manufacturing a light-emitting element mounting substrate, a method for manufacturing a light-emitting device using the same, a light-emitting element mounting substrate, and a method for manufacturing the same An object is to provide a light emitting device used.

A method of manufacturing a light-emitting element mounting substrate according to an embodiment of the present invention includes a step of arranging a plurality of core portions each having a light-reflective insulating member on a surface of a conductor core, and shielding a plurality of the core portions. A step of integrally fixing with a conductive resin, and a step of removing a part of the insulating member so that the surface of the conductor core is exposed from the light-shielding resin.
The substrate for mounting a light emitting element according to an embodiment of the present invention includes a plurality of conductor cores, a light-reflective insulating member that covers a side surface of each of the conductor cores, and the insulating members bonded together. A top surface of the conductor core, a bottom surface of the conductor core, and the insulating member around the top surface and the bottom surface are exposed from the light shielding resin.

  Accordingly, it is possible to provide a method for manufacturing a light-emitting element mounting substrate, a method for manufacturing a light-emitting device using the same, a light-emitting element mounting substrate, and a light-emitting device using the same.

It is a schematic cross section which shows a core part. It is a schematic cross section which shows an insulating spacer member. It is a schematic diagram explaining the manufacturing method of 1st Embodiment of this invention. It is a schematic diagram explaining the manufacturing method of 1st Embodiment of this invention. It is a schematic diagram explaining the manufacturing method of 1st Embodiment of this invention. It is a schematic diagram explaining the manufacturing method of 1st Embodiment of this invention. It is a schematic diagram explaining the light-emitting device of 1st Embodiment of this invention. It is a schematic diagram explaining the manufacturing method of 2nd Embodiment of this invention. It is a schematic diagram explaining the light-emitting device of 2nd Embodiment of this invention. It is a schematic diagram explaining the manufacturing method of 3rd Embodiment of this invention. It is a schematic diagram explaining the manufacturing method of 3rd Embodiment of this invention. It is a schematic diagram explaining the manufacturing method of 3rd Embodiment of this invention. It is a schematic diagram explaining the lower surface of FIG. It is a schematic diagram explaining the AA cross section of FIG.

  Hereinafter, embodiments of the invention will be described with reference to the drawings as appropriate. However, the light-emitting element mounting substrate and the method for manufacturing the light-emitting element mounting substrate described below are for embodying the technical idea of the present disclosure, and unless otherwise specified, Is not limited to the following. The contents described in one embodiment and example are applicable to other embodiments and examples. Of the configurations described in the other embodiments, the same name indicates the same or the same member, and the detailed description is omitted as appropriate. The size, positional relationship, and the like of the members shown in each drawing may be exaggerated for easy explanation.

<First Embodiment>
The manufacturing method of the light emitting element mounting substrate 100 according to the first embodiment includes a step of arranging a plurality of core portions 16 having light-reflective insulating members 14 on the surface of the conductor core 12, and a plurality of core portions 16. A step of integrally fixing with the light-shielding resin 20; Hereinafter, a method for manufacturing a light-emitting element mounting substrate according to the present embodiment will be described with reference to FIGS.

(Arrangement of core part 16)
First, as shown in FIG. 2, the spherical core portions 16 are arranged. Here, the position of the core portion 16 is adjusted using a spherical insulating spacer member 18 having substantially the same size as the core portion 16. Specifically, a row in which one insulating spacer member 18 is arranged between a set of core portions 16 formed by a plurality of (four in FIG. 2) core portions 16 arranged in a row, and a plurality of A plurality of rows in which only the insulating spacer members 18 are arranged are alternately arranged. The set of the core part 16 and the core part is used as an electrode of the light emitting device 200. Therefore, depending on the number of light emitting devices 200 manufactured using the light emitting element mounting substrate 100, for example, several tens to thousands of core portions 16 or sets of core portions are provided. The array of the core part may be a three-dimensional array in which the core parts are stacked in addition to the one-dimensional array or the two-dimensional array.

  As shown in FIG. 1A, the core portion 16 has a light-reflective insulating member 14 on the entire surface of the spherical conductor core 12. The shape of the conductor core 12 may be a shape other than a spherical shape, and is preferably a shape in which an insulating member can be easily formed on the surface. The size of the conductor core 12 can be appropriately selected depending on the size of the light emitting element 24 to be mounted and the size of the light emitting device 200 obtained by the present embodiment. It can be about 0 mm.

  For example, the light-reflective insulating member 14 is formed on the entire surface of the conductor core 12 by repeating the process of spraying and baking the light-reflective insulating member 14 on the entire surface of the conductor core 12 as many times as necessary. Is done. The thickness of the light reflective insulating member 14 can be, for example, about 0.01 to 0.1 mm.

  As shown in FIG. 1B, it is preferable that all of the insulating spacer members 18 are made of an insulating material. Moreover, it is preferable that the insulating spacer member 18 has substantially the same size and shape as the shape of the core portion to be used.

(Adhesion of core part 16)
The core portion 16 and the insulating spacer member 18 arranged as shown in FIG. 2 are bonded to each other using an adhesive or the like at adjacent locations, and the core portions or the core portion and the insulating spacer member 18 are joined. An assembly of core parts is formed. Since the core portion 16 and the insulating spacer member 18 can be fixed in a light shielding resin forming step described later, this bonding step can be omitted when a temporary fixing jig is used.

(Light-shielding resin formation process)
Next, using a mold having a substantially rectangular parallelepiped cavity so as to cover the core assembly, the light-shielding resin composition is injected into the mold and molded, as shown in FIG. A substantially rectangular parallelepiped base preparation 120 whose body is completely enclosed in the light-shielding resin 20 is obtained. A mold runner and a gate may be provided as appropriate. Thereby, the plurality of core portions 16 and the insulating spacer member 18 can be integrally fixed by the light shielding resin 20. At this time, since the light-shielding resin composition can be caused to flow from the gap between the core portion 16 and the insulating spacer member 18, the light-shielding resin 20 can be easily molded. Further, since the core portion 16 and the insulating spacer member 18 are spherical, the shape of the gap between them can be complicated, and the core portion 16 or the insulating spacer member 18 and the light-shielding resin 20 are in close contact with each other. Improves.

(Conductor core exposure process)
Next, a predetermined thickness is removed from the upper and lower surfaces of the obtained substrate preparation 120 by grinding, polishing, or the like, and a part of the conductor core 12 on the upper and lower surfaces of the substrate preparation after the removal is insulated from the insulating member 14 and light shielding. The resin 20 is exposed. Thereby, the conductor core 12, the insulating member 14, and the light-shielding resin 20 are arranged substantially flush on the upper and lower surfaces of the substrate preparation body after the removal step.

  As a result, as shown in FIGS. 4, 12, and 13, the plurality of conductor cores 12, the light-reflective insulating member 14 that covers the side surfaces of each conductor core 12, and the insulating members 14 are joined together. The light-emitting element mounting substrate 100 can be made such that the conductor core 12 is exposed from the light-shielding resin 20 on the upper and lower surfaces thereof. Since the light shielding resin 20 and the insulating member 14 are removed until a part of the conductor core 12 is exposed, the core portion 16 is formed on the light shielding resin 20 when the light shielding resin 20 of the base preparation body 120 is formed. For example, the top portion of the core portion 16 may be exposed from the light shielding resin 20.

(Metal film forming process)
The metal film 22 may be formed on the exposed portion of the conductor core 12 of the light emitting element mounting substrate 100 by plating, sputtering, or the like. In the present embodiment, as shown in FIG. 5, a metal film is formed on the exposed surface of the conductor core 12, the exposed surface of the insulating member 14, and the surface of the light shielding resin 20 so as to connect the exposed surfaces of the plurality of conductor cores 12. 22 is formed. Specifically, two metal films 22 are arranged for each set of core parts composed of four core parts 16 in which the plurality of core parts 16 are arranged in a row. That is, one metal film 22 is formed for two core portions, and a plurality of metal films 22 are arranged separately. As the material of the metal film 22, since the metal film 22 is connected to the light emitting element 24 or the outside of the light emitting device via a connection terminal (connector) or the like, the metal film 22 has a high conductivity or mechanical and electrical connection. A thing with high property is preferable. In addition, it is preferable to use a highly light-reflective material (for example, Ag or the like) for the metal film 22 on the upper surface 31 side on which the light emitting element 24 is placed. The metal film does not need to be formed on the exposed surfaces of all the conductor cores, and may be formed at a necessary portion.

(Light emitting element mounting process)
A plurality of light emitting elements are mounted on the upper surface of the substrate for mounting a light emitting element with a metal film thus obtained. In the present embodiment, as shown in FIG. 5, the light emitting element 24 having a pair of positive and negative electrodes on one surface is mounted on the light emitting element mounting substrate 100 with the surface on which the electrode is disposed facing the light emitting element mounting substrate 100 side. Flip chip mounting is performed on the upper surface 31 of the mounting substrate 100. At this time, one metal film 22 and one positive or negative electrode of one light emitting element 24 are electrically connected. As the conductive connection means between the light emitting element mounting substrate 100 and the light emitting element 24, solder, anisotropic conductive paste, or the like can be used.

(Light emitting element sealing process)
As shown in FIG. 5, the sealing material 26 covers and seals the light emitting element 24 and the upper surface 31 (the surface on which the light emitting element is placed) of the light emitting element mounting substrate 100 to seal the light emitting device assembly 130. Form.
In the present embodiment, by increasing the area of the light-emitting element mounting substrate, the number of light-emitting devices that can perform processing such as mounting and sealing of the light-emitting elements at a time is increased, thereby suppressing the manufacturing cost. it can.

(Individualization process)
Then, the light emitting device assembly 130 is cut along a predetermined cutting line so as to include at least two or more core portions, and is separated into individual pieces to obtain a light emitting device 200 as shown in FIG. The cutting line is preferably provided at a position where the conductor core 12 is not cut. For example, it is preferable to be provided at a position where the plurality of insulating spacer members 18 are cut along a row in which only the light shielding resin 20 and / or the plurality of insulating spacer members 18 are arranged. If the ratio of the metal members on the dividing line that divides the light emitting device assembly 130 into pieces is high, the singulation cost increases. For example, in the method of punching with a mold or the method of cutting with a dicer, the blade is consumed faster than in the case of a resin, and braking is difficult if there is a metal member. In the present embodiment, the conductor cores 12 separated in advance are integrally fixed and used as the light emitting element mounting base 100, so that the metal material can be separated into pieces without being cut. As a result, the cutting can be performed at high speed, and the productivity of the cutting blade can be reduced because the consumption of the cutting blade is small.

The light emitting element mounting substrate 100 manufactured as described above can easily manufacture a light emitting element mounting substrate having a large area by using the spherical conductor core 12 separated in advance.
In addition, the conductor core 12 directly under the light emitting element 24 is covered with the light-reflective insulating member 14, and the metal film 22 is formed thereon, thereby energizing the heat dissipation path (the conductor core 12 directly under the light emitting element 24). This is preferable because the separation design of the path (the conductor core 12 electrically connected to the metal film 22 outside the light emitting element 24) becomes easy.

Second Embodiment
After the light emitting element mounting substrate 100 is manufactured as in the first embodiment, a reflector capable of reflecting the emitted light from the light emitting element 24 may be formed on the upper surface 31 side of the light emitting element mounting substrate 100. For example, as shown in FIG. 7, a reflector 42 that exposes the metal film 22 of the substrate for mounting a light emitting element with a metal film on the bottom surface of the recess 40 is formed using a mold. Or it is good also as the reflector 42 by preparing the plate-shaped molded object which has a some through-hole, and affixing on the upper surface 31. FIG. Note that the metal film 22 may be formed after the reflector 42 is formed.

  Thereafter, the light emitting element 24 is mounted as in the first embodiment, and the sealing material 26 is embedded in the recess 40 to form the light emitting device assembly 130A.

  Then, the light emitting device aggregate 130A is cut along a predetermined cutting line and separated into individual pieces to obtain a light emitting device 200A as shown in FIG. In the example of FIG. 8, the light emitting device 200 </ b> A is cut so as to have one recess 40. Each light emitting device 200A may be cut so as to have two or more concave portions.

<Third Embodiment>
The light emitting element mounting substrate of the present embodiment further includes a protection element 50 that is electrically connected to the conductor core 12A and embedded in the light shielding resin 20A.

(Arrangement of core portion 16A)
In the present embodiment, as shown in FIG. 9, the dice-shaped core portions 16 </ b> A are linearly arranged to form a bar-shaped one-dimensionally arranged metal core assembly 140. The dice-shaped core portion 16A can be formed, for example, by pressing the spherical core portions from the three directions of up and down, front and rear, and left and right after the spherical core portions are aligned. The core portion 16A has a conductor core 12A and a light-reflective insulating member 14A that covers the surface of the conductor core 12A, and is electrically conductive from the insulating member 14A in a region electrically connected to the protection element 50. The body core 12A is exposed. For example, the conductor core 12A is exposed by removing the insulating member 14A on one side surface of the one-dimensional array metal core assembly 140. Alternatively, the insulating member 14A may be pierced by piercing a bump provided on the protective element 50 without removing the insulating member 14A, and the conductor core 12A and the protective element 50 may be electrically connected.

(Protective element placement process)
As shown in FIG. 9, the protective element 50 is flip-chip mounted at a predetermined position where the conductor core 12A is exposed. At this time, the protective element 50 straddles the joint surface between the adjacent core part 16 </ b> A and the core part 16 </ b> A, and the protective element 50 is arranged to be joined to the conductor core 12 by the two electrodes of the protective element 50. As an electrical connection means between the protection element 50 and the conductor core 12, soldering, anisotropic conductive paste, bump connection, or the like can be used.

(Arrangement of insulating spacer members 18A)
As shown in FIG. 10, the one-dimensional array metal core assembly 140 and the insulating spacer member 18 </ b> A are alternately aligned and bonded to form a planar array metal core assembly 150. At this time, the protection element 50 is located between the side surfaces of the one-dimensionally arranged metal core assembly 140 and the insulating spacer member 18A. That is, the protective elements 50 are aligned and bonded to the side surfaces instead of the upper and lower surfaces. You may provide the recessed part in which the protection element 50 is accommodated in the side surface of 18 A of insulating spacer members.

(Light-shielding resin formation process)
Next, using a mold having a substantially rectangular parallelepiped cavity so as to cover the planar array metal core assembly 150, the light-shielding resin composition is injected into the mold and molded, and the planar array metal core assembly 150 is formed. A base preparation body included in the light-shielding resin 20A is formed. At this time, a gap between the core portion 16A and the insulating spacer member 18A where there is no protective element 50 becomes an inflow path of the resin composition and also serves as an anchor.

Thereafter, the upper and lower surfaces of the substrate preparation body are ground / polished to a predetermined thickness to remove a part of the light-shielding resin 20A and the insulating member 14A, and the conductor core 12A is exposed on the upper and lower surfaces to emit light as shown in FIG. The element mounting base 100A is used. The subsequent steps are the same as those in the first embodiment and the second embodiment.
According to the present embodiment, since the protective element 50 is included in the light emitting element mounting base 100A, light emitted from the light emitting element is not absorbed by the protective element 50. Can be suppressed.

Hereinafter, materials suitable for each component of the light emitting device of the embodiment will be described.
(Core part)
The core portion includes at least a conductor core and a light-reflective insulating member. For example, a metal core with a light-reflective insulating film, a metal sphere with a light-reflective insulating film, or a graphite sphere with a light-reflective insulating film. The surface of the core portion may have a fine concavo-convex shape in order to increase the bonding force with the light-shielding resin.

(Conductor core)
The conductor core is a member used as an electrode and / or a heat dissipation path of the light emitting device. Therefore, the material can be a metal with good electrical conductivity. For example, metals such as Cu, Al, Ag, Au, Pt, Pd, and Rh, alloys thereof, or carbon materials such as graphite can be used. The conductor core reflects light emitted from the light emitting element mounted on the light emitting element mounting substrate, for example, 70%, preferably 80% or more. For example, when the light emitting element emits blue light, it is preferable to use Al, Ag, or the like.

  The entire conductor core may have the same composition or may have a plurality of regions having different compositions. For example, it is good also as a multilayer structure which consists of 2 or more types of materials by forming into a film by plating etc. a 2nd metal part so that a 1st metal part may be covered. Moreover, you may have insulation materials, such as a void | hole inside, and anisotropic conductors, such as a strand wire and a litz wire, may be sufficient.

  Examples of the shape of the conductor core include a cylinder, a prism (polyhedron), a sphere (including an ellipsoid), a circular tube (cylinder), and a three-dimensional shape similar to these. The shape of the conductor core is appropriately selected according to the structure provided on the light-emitting element mounting substrate such as a through hole or castellation.

  A part of the conductor core is exposed on the surface (the upper surface 31 and the lower surface 32) of the light-emitting element mounting base, and the exposed portion is connected to the light-emitting element using a bonding member such as a wire or solder. Electrically connected. Therefore, the size and shape of the conductor core is preferably such that the exposed portion has an area and shape suitable for connection with the light emitting element. For example, it is preferable that the conductor core is exposed so as to be substantially flush with the upper and lower surfaces of the light-emitting element mounting substrate. When a metal film to be described later is provided so as to cover the exposed portion of the conductor core, the metal film and the light emitting element are connected via a bonding member.

  The light-emitting element placed on the light-emitting element placement base may be in contact with any of the conductor core, the light-reflective insulating member, and the light-shielding resin. By placing the light emitting element on the conductor core, heat dissipation of heat generated by the light emitting element can be improved. Further, by directly connecting the conductor core and the electrode of the light emitting element via a conductive joining member such as solder, the light emitting device can be reduced in size without the need for a wire.

  In order to use the conductor core as an electrode of the light emitting device, a plurality of core portions are provided for one light emitting element mounting substrate. In order to use it as an electrode of the light emitting device, it is sufficient that the base of the light emitting device has a minimum of two conductor cores. A plurality of conductor cores may be used as one of the electrodes of the light emitting device. For example, you may mount the electrode of a light emitting element over the conductor core arrange | positioned adjacently via an electroconductive joining member. By changing the arrangement of the core portions including the conductor cores, the arrangement of the conductive portions in the light emitting element mounting base can be changed as appropriate, increasing the degree of freedom in designing the light emitting element mounting base. be able to.

  The conductor core is exposed on the upper surface 31 and the lower surface 32 of the light emitting element mounting substrate. One conductor core may be exposed at two locations, the upper surface and the lower surface, and separate conductor cores may be exposed at the upper surface and the lower surface. By using the conductor core to which the light emitting element is bonded as the external terminal of the base, the heat dissipation characteristics can be improved.

  When the conductor core is used as a heat dissipation path without being used as an electrode, the conductor core and the light emitting element may not be electrically connected, and the conductor core is exposed on the surface of the light emitting element mounting substrate. It is not always necessary to be. The conductor core is preferably arranged so as to be connected from the vicinity of the light emitting element serving as a heat source to the vicinity of the surface of the substrate for mounting the light emitting element so that heat from the light emitting element can be easily released to the outside.

(Light-reflective insulating member)
In the present embodiment, the light-reflective insulating member covers the side surface of the conductor core. The light-reflective insulating member may be a single layer or a structure in which a plurality of layers are stacked. When multiple layers are stacked, if a thermosetting resin film is provided on the side close to the conductor core and an adhesive layer is provided on the outermost periphery, does the adhesive need be used when forming the core assembly? Or a small amount, so productivity is good.

  The light-reflective insulating member is formed on the side surface of the conductor core, for example, as a single layer film or a multilayer film with a substantially uniform thickness. The film thickness of the light reflective insulating member is, for example, several μm to several hundred μm. If it is about several tens of μm, it is preferable because both insulation can be secured and the light emitting device (light emitting element mounting substrate) can be made compact. The light-reflective insulating member may be formed on the side surface of the conductor core with a substantially uniform thickness, and a part of the thickness may be formed thicker than other portions.

  The conductor cores located on the upper and lower surfaces of the substrate for mounting the light emitting element and exposed to the outside are also exposed from the light-reflective insulating member, and the light-reflective insulating members are exposed on the upper and lower surfaces of the substrate. Is disposed around the conductor core. By having a light-reflective insulating member between the plurality of conductor cores, the plurality of conductor cores are arranged in a state of being insulated from each other.

  As a material of the light-reflective insulating member, a material using a resin as a base material is preferable from the viewpoint of cost and ease of manufacture. Examples of the resin used as the base material include a thermosetting resin and a thermoplastic resin. Specifically, epoxy resin compositions, silicone resin compositions, modified epoxy resin compositions such as silicone-modified epoxy resins; modified silicone resin compositions such as epoxy-modified silicone resins; polyimide resin compositions, modified polyimide resin compositions; Polyphthalamide (PPA); Polycarbonate resin; Polyphenylene sulfide (PPS); Liquid crystal polymer (LCP); ABS resin; Phenol resin; Acrylic resin; PBT resin; Polypropylene resin (PP); Polyamide (PA) 6, PA66; Examples thereof include resins such as fide resin (PPS); polyetheretherketone resin (PEEK). The material of the base material is not limited to resin, and other materials such as glass may be used.

  In order to impart light reflectivity to these base materials, for example, titanium dioxide, silicon dioxide, zirconium dioxide, potassium titanate, alumina, aluminum nitride, boron nitride, mullite, niobium oxide, various rare earth oxides (for example, , Yttrium oxide, gadolinium oxide) or the like may be added. The reflectance is preferably high with respect to the emission wavelength of the light emitting element to be mounted. For example, the reflectance with respect to the emitted light from the light emitting element to be mounted is set to be 70% or more on average in the region of 440 nm to 630 nm. preferable. Moreover, it is preferable that an average reflectance is higher than the conductor core to be used in the region of 440 nm to 630 nm.

  The light-reflective insulating member may be formed in advance so that a part of the conductor core is exposed, or the entire periphery of the conductor core is covered with the light-reflective insulating member, and then the light-reflective insulation is performed. The surface of the conductor core may be exposed from the insulating member by removing a part of the member. When removing it later, for example, if a thermosetting resin is used as the base material of the light-reflective insulating member and a thermoplastic resin is used as the light-shielding resin, the difference in dissolution rate due to the drug is utilized to make the light-reflective insulation. Since the member can be selectively dissolved with a drug, not only cutting and removal but also dissolution and removal are possible.

(Light shielding resin)
The light shielding resin is an insulating member that integrally fixes a plurality of core portions.
The light shielding property means that, for example, 70% of light (mainly visible light) from the light emitting element can be shielded, preferably 90%, and more preferably 95% or more. It may be one that reflects light or one that absorbs light. For example, white or black. Thereby, the photodegradation of the resin base material can be suppressed.
Examples of the light-shielding resin include thermosetting resins and thermoplastic resins. These resins are added with a light reflecting material, a light absorbing material, and the like in order to have a light shielding property against light of a light emitting element to be mounted. These additives may be in the form of particles, fibers or the like. The light-shielding resin may be composed of a single material or may be composed of a plurality of different materials, and may protrude not only between the plurality of core portions but also at the upper portion or the lower portion.

  The light density applied to the resin located in the vicinity of the light emitting element (particularly in contact with or facing the light emitting element) is very high, and the light emission efficiency of the light emitting apparatus is reduced by causing deterioration and discoloration of the resin as the light emitting apparatus is driven. May decrease. By making the resin located directly under the light emitting element light-shielding, light degradation of the resin can be suppressed and the light emission efficiency of the light emitting device can be maintained.

  Examples of the resin that serves as a base material for the light-shielding resin include thermosetting resins and thermoplastic resins. Specifically, epoxy resin compositions, silicone resin compositions, modified epoxy resin compositions such as silicone-modified epoxy resins; modified silicone resin compositions such as epoxy-modified silicone resins; polyimide resin compositions, modified polyimide resin compositions; Polyphthalamide (PPA); Polycarbonate resin; Polyphenylene sulfide (PPS); Liquid crystal polymer (LCP); ABS resin; Phenol resin; Acrylic resin; PBT resin; Polypropylene resin (PP); Polyamide (PA) 6, PA66; Examples thereof include resins such as fide resin (PPS); polyetheretherketone resin (PEEK).

A light reflecting material is preferably added to these resins. As the light reflecting material, a reflecting member (for example, TiO) that hardly absorbs light from the light emitting element and has a large refractive index difference with respect to the resin serving as a base material. ₂ , Al ₂ O ₃ , ZrO ₂ , MgO) or the like can be dispersed to efficiently reflect light.

(Reflector)
As the reflector, the same material as the light-shielding resin described above can be used. Moreover, it is preferable to contain the light reflection material similarly to the light shielding resin. A dielectric multilayer film or a multilayer film made of an insulating film and a metal film can also be used.

(Metal film)
A metal film may be formed by plating or the like on the surface of the conductor core exposed on the upper surface and the lower surface of the light emitting element mounting substrate. The metal film on the upper surface side of the light-emitting element mounting base on which the light-emitting element is mounted is preferably made of a metal having a high reflectance with respect to light from the light-emitting element. In addition, it is preferable to use a metal having good wettability with solder for the metal film on the lower surface side of the light-emitting element mounting substrate that serves as an external electrode of the light-emitting device. In consideration of the adhesion between the outermost metal film and the conductor core, the metal film may be a base layer, and the metal film may have a multilayer structure.

  The metal film may be formed not only on the surface of the conductor core but also on the surface of a light-reflective insulating member or light-shielding resin. For example, the surface of the conductor core exposed on the surface of the substrate for mounting the light emitting element, the surface of the insulating member and the light shielding resin on the surface of the base for mounting the light emitting element on at least one conductor core serving as the mounting portion of the light emitting element A metal film is provided over. By providing such a metal film, heat from the light emitting element can be spread in the horizontal direction of the base of the light emitting device.

Further, the metal film may function as a wiring layer that electrically connects two or more conductor cores. For example, the surface of each conductor core and the insulating member and the light-shielding resin positioned between the conductor cores are covered with a metal film so as to connect the adjacent conductor cores. Thereby, it becomes possible to form serial or parallel wiring, and the degree of freedom in designing the base of the light emitting device is improved. For example, by connecting a plurality of light emitting elements in series and increasing the driving voltage to decrease the driving current, voltage drop (power loss) can be suppressed and energy efficiency as a light source can be increased.
The metal film may be provided after the formation of the light shielding resin described later, or may be provided on the conductor core before the formation of the light shielding resin.

(Light emitting element)
Examples of the light emitting element that can be mounted on the light emitting element mounting substrate include a light emitting diode, a laser diode, a light emitting transistor, and a light emitting thyristor.
The light emitting element is preferably placed on the exposed surface of the conductor core in terms of heat dissipation. An insulating member having a good thermal conductivity or a thin insulating film may be provided between the light emitting element and the conductor core. For example, a light emitting element using an insulating substrate such as a sapphire substrate can be junction-up mounted on the exposed surface of the conductor core.

  In the case of flip chip mounting (also referred to as a junction down mount), it is preferable that at least a pair of electrodes of the light emitting element is electrically connected to two or more conductor cores. When bending stress is applied to the base of the light-emitting device, the bending stress tends to concentrate on the resin portion that is more likely to deform than the metal portion, not the metal portion. Therefore, in flip-chip mounting, bending stress concentrates on the insulating portion present near the light emitting element, causing light emitting element cracking and peeling or cracking of the conductive connection member such as solder or bump, and consequently turning off the light emitting element. Easy to cause. By arranging a plurality of conductor cores in the vicinity of the light emitting element, the light emitting element mounting portion at the base of the light emitting device and its periphery are made of a plurality of light reflecting insulating members or light shielding resins. The bending stress is dispersed, the bending stress is not concentrated in the vicinity of the light emitting element, and failure such as non-lighting due to external stress to the base of the light emitting device can be suppressed.

  Further, since the interval between adjacent light emitting device casings is narrower than that of a frame insert type light emitting element mounting substrate, the interval between the light emitting element mounting portions can be reduced in the aggregate of the light emitting device casings. By increasing the processing capacity of the mounter, the assembly cost can be reduced.

(Insulating spacer member)
The light emitting element mounting substrate of the present embodiment may further include an insulating spacer member. By disposing the spacer member between the core portion, the distance between the core portions can be set. Thereby, the freedom degree of design of the light emitting element mounting base | substrate or a light-emitting device can be raised.
As a material of the insulating spacer member, for example, the same material as that of the above-described light reflective insulating member can be used. By using the resin, cutting, cutting (dividing into pieces) and the like can be easily performed. The shape can be determined as appropriate depending on the design of the light-emitting element mounting substrate to be obtained. For example, a cylinder, a prism (polyhedron), a sphere (including an ellipsoid), a circular tube (cylinder), or an approximation to these Can be given. Further, an adhesive layer may be provided on the outermost periphery. The surface of the insulating spacer member may have a fine concavo-convex shape in order to increase the bonding force with the light shielding resin.
Depending on the distance to be adjusted, the insulating spacer member may have a spherical shape, a linear shape such as a square bar or a round bar, a film shape, or a sheet shape with a certain thickness.

(Protective element)
The light emitting device may include a protection element that protects the light emitting element from destruction due to overcurrent. For example, a Zener diode or a capacitor can be used as the protective element. A single-sided electrode is preferable because it can be mounted face-down wirelessly. For example, it is preferably connected to the side surface of the conductor core, covered with a light-shielding resin, and provided inside the light-emitting element mounting substrate. The insulating member is removed at the connection portion between the protective element and the conductor core. Accordingly, since the protective element can be disposed in the light emitting element mounting substrate, the possibility that light from the light emitting element is absorbed or shielded by the protective element is reduced, and the light extraction efficiency of the light emitting device can be increased.

(Encapsulant)
The light emitting device may have a sealing material for protecting the light emitting element from external physical and chemical deterioration factors. The sealing material should just be formed so that a light emitting element may be directly or indirectly covered, for example, a silicone resin, an epoxy resin, etc. can be used conveniently. In the UV-LED, optical glass may be used.

(Other parts)
The light emitting device may have a wavelength conversion member or a light scattering member that converts part of light from the light emitting element into light having a different wavelength. For example, the sealing material may contain a wavelength conversion substance such as a phosphor. In addition, the resin member such as a light shielding resin may appropriately contain a filler of a material in order to adjust characteristics such as thermal conductivity and a coefficient of thermal expansion.

  First, as shown in FIG. 1A, a plurality of spherical conductor cores 12 made of Cu and having a diameter of 0.9 mm are prepared. Next, a light-reflective insulating member 14 that is a silicone resin containing titanium oxide is formed on the entire surface of these conductor cores 12 to a thickness of 0.06 mm. Thereby, the core part 16 having a diameter of 1.02 mm is obtained.

  Next, as shown in FIG. 2, these core portions 16 and insulating spacer members 18 that are spheres made of an insulating resin having a diameter of 1 mm are arranged. Specifically, in the present embodiment, one insulating spacer member 18 is arranged between a set of core portions 16 constituted by a plurality of (four in FIG. 2) core portions 16 arranged in a line. A plurality of rows and a row in which only the plurality of insulating spacer members 18 are arranged are alternately arranged. The core portion 16 or the set of core portions is used as a lead electrode of the light emitting device 200. And these are adhere | attached and the aggregate | assembly of a core part is formed.

  Next, as shown in FIG. 3, a light-reflective molding resin composition made of an epoxy resin containing titanium oxide is molded using a mold so as to cover the aggregate of core portions, and the aggregate of core portions is formed. A base preparation 120 is obtained which is completely encapsulated in a light-reflective molding resin whose body is the light-shielding resin 20.

  Next, as shown in FIGS. 4, 12, and 13, a predetermined thickness is removed from the upper and lower surfaces of the obtained substrate preparation 120 by grinding or polishing, and the conductor core 12 is formed on the upper and lower surfaces of the substrate preparation. To expose a part of

  Further, as shown in FIG. 5, a metal film 22 is formed on the exposed portion of the conductor core 12 by plating.

  As shown in FIG. 5, a plurality of light emitting elements 24 are mounted on the upper surface of the substrate for mounting a light emitting element with a metal film thus obtained. In the present embodiment, a light emitting element 24 having a size of 0.85 mm in length, 0.65 mm in width, and 0.15 mm in thickness provided with a pair of positive and negative electrodes on one surface, a surface side on which the electrodes are disposed, and a metal Flip chip mounting is performed so that the substrate for mounting the light-emitting element with a film faces each other. At this time, one metal film and the positive or negative electrode of one light emitting element 24 are connected to each other. As a connection means between the light emitting element mounting substrate with the metal film and the light emitting element 24, solder, anisotropic conductive paste, or the like can be used.

Next, as shown in FIG. 5, the light-emitting element 24 and the upper surface of the substrate for mounting the light-emitting element with the metal film (the surface on which the light-emitting element is mounted) are covered with a translucent resin that becomes the sealing material 26. The light emitting device assembly 130 is formed by sealing.
As shown in FIG. 6, the light emitting device assembly 130 includes the plurality of insulating spacer members 18 and the light-shielding resin 20 at a predetermined cutting line along a row in which only the plurality of insulating spacer members 18 are arranged. The light-reflective molding resin is cut with a dicer and separated into individual pieces to form the light-emitting device 200.

  In order to form the core portion, a white light-reflective insulating member having a thickness of 0.06 mm is formed on a spherical conductor core made of Cu having a diameter of 0.9 mm. Thereby, a core part with a diameter of 1.02 mm is obtained. As shown in FIG. 9, the core portions are aligned in a straight line, and pressure is applied from three directions to form a bar-shaped one-dimensional arrayed metal core assembly 140. By pressure welding, the copper sphere becomes a dice-shaped conductor core.

  The insulating member 14A on one side surface of the one-dimensionally arranged metal core assembly 140 is removed, and a Zener diode that is the protective element 50 is flip-chip mounted at a predetermined position where the insulating member 14A is removed.

  Next, as shown in FIG. 10, the one-dimensional array metal core assemblies 140 and the insulating spacer members 18 </ b> A are alternately aligned and bonded to form a planar array metal core assembly 150. The insulating spacer member 18 </ b> A is 0.67 mm square, and has a length equivalent to that of the one-dimensional array metal core assembly 140.

  The planar array metal core assembly 150 is sandwiched and pressed by a mold using an insert molding technique and molded using a light-reflective thermoplastic resin composition that becomes the light-shielding resin 20A. The substrate preparation body to be prepared is ground / polished to a predetermined thickness on the upper and lower surfaces of the substrate preparation body, and the metal core surfaces are exposed on the upper and lower surfaces to form a light emitting element mounting substrate 100A as shown in FIG.

  Conductive plating is performed on the exposed upper and lower conductor cores 12A to form a metal film 22, and a light-emitting element mounting substrate with a metal film is formed. The upper surface (light emitting element placement side) is light reflective plating (eg, Ag plating).

  A face-down light emitting device having a size of 0.85 mm in length, 0.65 mm in width, and 0.15 mm in thickness provided on one surface with a pair of positive and negative electrodes on one side of the substrate for mounting the light emitting element with a metal film is predetermined. Is placed on the conductor core 12A subjected to plating. The distance between the pair of positive and negative electrodes is 0.14 mm. A light-emitting device assembly 130A is formed by covering and sealing the upper surface (the surface on which the light-emitting elements are mounted) of the light-emitting element mounting substrate on which the light-emitting elements 24 are mounted with a sealing material 26 made of a translucent resin. Form. Finally, the light emitting device assembly 130 </ b> A is cut with a die along a predetermined cutting line to be separated into individual pieces, whereby the light emitting device 200 is obtained.

As a substrate of a light emitting device including a light emitting element such as an LED chip, it can be used for various light sources.

12, 12A Conductor cores 14, 14A Insulating members 16, 16A Core portions 18, 18A Insulating spacer members 20, 20A Light blocking resin 22 Metal film 24 Light emitting element 26 Sealing material 31 Upper surface 32 Lower surface 40 Recess 42 Reflector 50 Protective element (Zener diode)
100, 100A Light-Emitting Element Mounting Base 120 Base Prepared Body 130, 130A Light-Emitting Device Assembly 140 One-Dimensional Array Metal Core Assembly 150 Planar Array Metal Core Assembly 200, 200A Light-Emitting Device

Claims (15)

A step of arranging a plurality of core portions having light-reflective insulating members on the surface of the conductor core;
Fixing the plurality of core parts integrally with a light-shielding resin;
And a step of removing a part of the insulating member so that the surface of the conductor core is exposed from the light shielding resin.   The manufacturing method of the base for light emitting element mounting of Claim 1 which has the process of forming a metal film on the surface of the said conductor core exposed from the said light-shielding resin.   The method for manufacturing a substrate for mounting a light emitting element according to claim 1, wherein in the step of arranging, the position of the core portion is adjusted using an insulating spacer member.   The manufacturing method of the base | substrate for light emitting element mounting of any one of Claims 1-3 which has the process of adhere | attaching these core parts before the process of fixing.   The manufacturing method of the base for light emitting element mounting of any one of Claims 1-4 which electrically connects a protective element to the side surface of the said predetermined | prescribed core part before the said process to fix.   The manufacturing method of the light-emitting device which has the process of mounting a light emitting element on the light emitting element mounting base | substrate manufactured by the manufacturing method of any one of Claims 1-5.   The method for manufacturing a light emitting device according to claim 6, further comprising a step of covering the light emitting element with a sealing material.   The method for manufacturing a light-emitting device according to claim 6, further comprising a step of cutting the light-shielding resin so as to include at least two core portions. A light-emitting element mounting substrate,
A plurality of conductor cores;
A light-reflective insulating member covering a side surface of each of the conductor cores;
A light-shielding resin that joins the insulating members together,
The light emitting element mounting substrate, wherein the upper surface of the conductor core, the lower surface of the conductor core, and the insulating member around the upper surface and the lower surface are exposed from the light shielding resin.   The light emitting element mounting substrate according to claim 9, further comprising a metal film on a surface of the conductor core.   The light emitting element mounting substrate according to claim 9 or 10, comprising an insulating spacer member between the plurality of conductor cores.   The light emitting element mounting substrate according to any one of claims 9 to 11, wherein at least two or more of the plurality of conductor cores are electrically connected by a metal film. The light-emitting element mounting substrate according to any one of claims 9 to 12,
A light emitting device comprising: a light emitting element mounted on the light emitting element mounting base and electrically connected to the plurality of conductor cores.   The light emitting element has positive and negative electrodes on a surface close to the light emitting element mounting substrate, and the plurality of conductor cores and the positive and negative electrodes of the light emitting element are electrically connected to each other. The light emitting device according to claim 13.   The light-emitting device according to claim 13, further comprising a protective element that is electrically connected to the conductor core and is covered with the light-shielding resin.