JP2017163039A - Imprint device, and manufacturing method of object - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an imprint device advantageous in terms of more accurate patterning.SOLUTION: An imprint device has an arrangement section for arranging an imprint material in the shot region of a substrate, a first supply section for supplying first gas between a mold at an imprint position and the imprint material arranged in the shot region, and a second supply section for supplying gas forming a gas curtain partitioning a processing space performing imprint and an arrangement work space for arranging the imprint material. The second supply section is configured to be able to supply gas, selected from a plurality of gases including the first gas and second gas different therefrom, as the gas for forming a gas curtain. A control section controls selection of gas for forming a gas curtain, supplied from the second supply section, according to the position in the movement path of the substrate.SELECTED DRAWING: Figure 1

Description

  The present invention relates to an imprint apparatus and an article manufacturing method.

  Imprint technology is being put into practical use as one of lithography technologies for manufacturing articles such as semiconductor devices. In an imprint apparatus, a pattern is formed by bringing a mold (mold) into contact with an imprint material on a substrate. Therefore, in principle, pattern defects are likely to occur compared to conventional exposure apparatuses, and reduction of these defects is an issue. It has become. Specifically, when the mold (mold) and the imprint material on the substrate are brought into contact with each other, the curing reaction of the imprint material is difficult to proceed due to the influence of oxygen in the air between them, and the pattern transferred thereby. Defects can occur. As a solution to this, there is a method of waiting until the residual gas dissolves, diffuses or permeates in the imprint material or mold and disappears. However, the productivity is reduced due to the time required for the waiting.

  Patent Document 1 discloses an imprint apparatus that uses a permeable gas in an imprint atmosphere and dissolves or diffuses the permeable gas remaining in the imprint material or the mold to quickly reduce the residual gas. Patent Document 2 discloses an imprint apparatus that uses a condensable gas that condenses due to an increase in pressure when the mold and the imprint material come into contact with the imprint atmosphere. This condensable gas is liquefied when it remains, and its volume is reduced to one hundredth compared to when it is gas, so that the influence of the residual gas on pattern formation can be suppressed.

  As a countermeasure against particles, it is conceivable to form an air curtain from the outer periphery of the mold toward the substrate. By forming the air curtain, particles floating in the apparatus cannot enter the space surrounded by the nozzles. Thereby, even if it does not reduce the particle amount of the whole area in an imprint apparatus, it can suppress that a particle penetrate | invades into the imprint position which is a position where a mold and the imprint material on a board | substrate are contacted.

  Patent document 3 is disclosing the structure which forms the 1st airflow in which functional gas flows, and the 2nd airflow in which an air curtain airflow flows. Patent Document 3 further interposes a third airflow between the first airflow and the second airflow for the purpose of preventing a decrease in the concentration of the functional gas due to the mixing of the air curtain airflow and the functional gas. The configuration is disclosed.

Special table 2007-509769 gazette JP 2004-103817 A JP 2014-056854 A

  However, in the configuration as disclosed in Patent Document 3, there is a possibility that an air curtain air flow (second air flow) or a third air flow is involved in the imprint space as the substrate moves toward the imprint position. .

  An object of the present invention is to provide an imprint apparatus that is advantageous in terms of more accurate pattern formation.

According to one aspect of the present invention, there is provided an imprint apparatus for forming a pattern on a substrate by bringing a mold into contact with an imprint material on the substrate,
An arrangement part for arranging the imprint material in a shot region of the substrate;
A movement mechanism for moving the substrate along a movement path between an imprint position where the contact is made and an arrangement position where the arrangement by the arrangement unit is performed;
A first gas that supplies a first gas between the mold at the imprint position and the imprint material arranged in the shot region from a first supply port provided between the mold and the arrangement portion. A supply section;
A processing space including the imprint position and the first supply port and a layout work space including the layout position are partitioned from a second supply port provided between the first supply port and the placement unit. A second supply unit for supplying a gas for forming a gas curtain, the gas for forming the gas curtain includes the first gas and a second gas different from the first gas, A second supply unit configured to be able to supply a gas selected from a plurality of gases;
A control unit that controls selection of a gas for forming the gas curtain supplied by the second supply unit according to a position of the substrate in the movement path;
There is provided an imprint apparatus characterized by comprising:

  According to the present invention, for example, an imprint apparatus that is advantageous in terms of more accurate pattern formation can be provided.

The block diagram of the imprint apparatus in embodiment. The figure explaining the switching control of the gas for air curtains in embodiment. The figure explaining the switching control of the gas for air curtains in embodiment. The figure explaining the structure of the 2nd supply port in 2nd Embodiment. 6 is a flowchart illustrating a control flow related to imprint processing according to the embodiment.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. In addition, this invention is not limited to the following embodiment, It shows only the specific example advantageous for implementation of this invention. Moreover, not all combinations of features described in the following embodiments are indispensable for solving the problems of the present invention.

<First Embodiment>
The imprint apparatus according to the first embodiment will be described with reference to FIG. The imprint apparatus 10 is used for manufacturing articles such as semiconductor devices, and forms a pattern on a substrate by bringing the imprint material on the substrate to be processed into contact with a mold (mold) to cure the imprint material. Device. In the present embodiment, a photocuring method for curing the imprint material by irradiation with ultraviolet rays is employed, but the present invention is not limited to this, and for example, a thermosetting method for curing the imprint material by heat input may be employed. it can. The pattern of the cured product formed using the imprint apparatus is used permanently on at least a part of various articles or temporarily used when manufacturing various articles. The article is an electric circuit element, an optical element, a MEMS, a recording element, a sensor, or a mold. Examples of the electric circuit elements include volatile or nonvolatile semiconductor memories such as DRAM, SRAM, flash memory, and MRAM, and semiconductor elements such as LSI, CCD, image sensor, and FPGA. Examples of the mold include an imprint mold. The pattern of the cured product is used as it is as a constituent member of at least a part of the article or temporarily used as a resist mask. After etching or ion implantation or the like is performed in the substrate processing step, the resist mask is removed.

  The imprint apparatus 10 includes a head 12 that holds a mold 11 having a pattern surface. The head 12 is supported by the structure 18, and is connected to the substrate 13 for contact (pressing) and separation (release) between the mold 11 and the imprint material on the substrate 13 by a driving source (not shown) and the control unit 50. It can be driven in a direction in which the mold 11 approaches or separates. The imprint apparatus 10 includes an ultraviolet light source 16 and an illumination optical system 17 in order to irradiate ultraviolet rays for curing the imprint material 21-2.

  The substrate stage 14 holds the substrate 13 and can move on the stage surface plate 19. The imprint apparatus 10 includes an arrangement unit 20 (dispenser) that arranges (applies or supplies) the imprint material 21-2 in the shot region of the substrate 13. The placement unit 20 includes a nozzle that discharges (supply) the imprint material 21-1. The substrate stage 14 includes a moving mechanism 14 a that moves the substrate by moving on the stage surface plate 19. The moving mechanism 14a can move the substrate along the movement path between the imprint position and the arrangement position of the imprint material. Here, the imprint position refers to a position where the mold 11 and the imprint material on the substrate 13 are contacted. Moreover, the arrangement position of the imprint material is a position where the arrangement unit 20 arranges the imprint material, for example, a position facing a nozzle that discharges the imprint material. When the imprinting is performed, the moving mechanism 14 a moves the substrate 13 to the arrangement position, and the imprint material 21-2 is arranged by the arrangement unit 20.

  The imprint apparatus 10 includes a control unit 50 that controls a series of imprint processes from when the imprint material 21-2 is disposed on the substrate 13 until the imprint material 21-2 is cured. As the imprint material, a curable composition (sometimes referred to as an uncured resin) that is cured by being given energy for curing is used. As the energy for curing, for example, an electromagnetic wave is used when the photocuring method is employed, and heat is used, for example, when the thermosetting method is employed. The electromagnetic wave is, for example, light such as infrared light, visible light, or ultraviolet light whose wavelength is selected from a range of 10 nm to 1 mm. A curable composition is a composition which hardens | cures by irradiation of light or by heating. Among these, the photocurable composition cured by light contains at least a polymerizable compound and a photopolymerization initiator, and may contain a non-polymerizable compound or a solvent as necessary. The non-polymerizable compound is at least one selected from the group consisting of a sensitizer, a hydrogen donor, an internal release agent, a surfactant, an antioxidant, and a polymer component.

  The imprint material is applied in a film form on the substrate by a spin coater or a slit coater. Alternatively, the liquid ejecting head may be applied to the substrate in the form of droplets, or in the form of islands or films formed by connecting a plurality of droplets. The imprint material has a viscosity (viscosity at 25 ° C.) of, for example, 1 mPa · s or more and 100 mPa · s or less. Further, the amount of imprint material discharged from the nozzle and the distribution on the substrate are also appropriately determined depending on the desired thickness of the imprint material formed on the substrate, the density of the pattern to be formed, and the like.

  Under the control of the control unit 50, the moving mechanism 14a transports the substrate 13 so that the shot area on the substrate 13 where the imprint material 21-2 is disposed is at the imprint position. At this time, the position of the substrate stage 14 is measured by the measuring unit 15, and the substrate stage 14 is aligned by a control mechanism and an alignment mechanism (not shown). Note that the measurement unit 15 can be, for example, a laser interferometer or an encoder. The control unit 50 drives the head 12 to bring the pattern surface of the mold 11 into contact with the imprint material 21-2 on the shot region, and in that state, irradiates ultraviolet rays to cure the imprint material 21-2. In addition, when employ | adopting a thermosetting method, heat sources, such as a heater incorporated in the mold holding part, are used.

  By the series of imprint processes, the pattern of the mold 11 is transferred to the shot area on the substrate 13.

  In the imprint process, when the mold 11 and the imprint material on the substrate 13 are brought into contact with each other, the curing reaction of the imprint material is difficult to proceed due to the influence of oxygen in the air between the mold 11 and the transferred pattern. Malfunctions can occur. Therefore, in this embodiment, the purge gas 23 (from the first supply port 22 provided between the mold 11 and the placement unit 20 between the mold 11 at the imprint position and the imprint material 21-2 on the shot region. First gas) is supplied and imprinting is performed. Here, as the purge gas 23, a permeable gas that is excellent in diffusibility and solubility in the imprint material from the viewpoint of filling properties and permeates the mold when contacting the mold and the imprint material can be employed. Alternatively, as the purge gas 23, a condensable gas that is liquefied by an increase in pressure in the space between the mold and the imprint material at the time of contact between the mold and the imprint material on the substrate may be employed. When the mold and the imprint material are in contact with each other, the gas remaining in the imprint material or the mold is dissolved or diffused in the case of a permeable gas, and in the case of a condensable gas, it is liquefied by the pressure increase due to the imprint. In comparison, the volume is reduced to one hundredth. Thereby, the influence of residual gas on pattern formation can be suppressed. Specifically, nitrogen, helium, carbon dioxide, hydrogen, xenon, pentafluoropropane, or the like can be employed as the permeable gas. However, when flammable hydrogen is used as the permeable gas, it is necessary to separately install an explosion-proof system in the imprint apparatus so as to be careful of fire. As the condensable gas, specifically, one gas selected from hydrofluorocarbon typified by pentafluoropropane, hydrofluoroether, or the like, or a mixed gas thereof may be employed. Such purge gas 23 is stored in a first tank 31 communicating with the first supply port 22. The first supply port 22 and the first tank 31 constitute a first supply unit that supplies the purge gas 23 to the gap between the mold and the imprint material on the shot region.

  Further, if particles adhere to the shot area on the substrate, pattern defects may occur in the shot area. Further, if imprinting is performed on a shot area to which particles are attached, the mold 11 may be damaged. Therefore, the inside of the imprint apparatus 10 reduces the particle concentration by blowing a gas that has been passed through a ULPA filter (Ultra Low Penetration Air Filter) having a particle removal function and cleaned with a fan. However, even if these countermeasures are taken, particles adhering to the transported substrate 13 may enter the imprint apparatus or generate dust from the drive unit in the imprint apparatus.

  Therefore, in the present embodiment, as a further measure, a second supply unit that supplies a gas that forms a gas curtain that defines a processing space including the imprint position and the first supply port 22 is provided. Specifically, the second supply port 24 is provided between the first supply port 22 and the placement unit 20. A gas for forming a gas curtain that partitions the processing space and the placement work space including the placement position of the imprint agent by the placement unit 20 is supplied from the second supply port 24.

  Further, in the present embodiment, a plurality of second supply ports 24 are provided so as to surround the mold 11, the head 12, and the first supply port 22, and air curtain gas 25 is blown onto the substrate 13 and the substrate stage 14 from there. . The air flow of the air curtain gas 25 forms a gas curtain (air curtain), and particles floating in the apparatus cannot enter the processing space surrounded by the air curtain. Thereby, even if it does not reduce the particle amount of the whole area in an imprint apparatus, the penetration | invasion of the particle to an imprint position can be suppressed. Furthermore, particles adhering to the substrate 13 can also be reduced. For this reason, the particles adhering to the substrate 13 can be reduced without enlarging the air conditioning system of the apparatus.

  The air curtain gas 25 may be a gas with few particles, and may be, for example, clean dry air (hereinafter abbreviated as “CDA”). Alternatively, CDA that has passed through a particle removal filter may be used as necessary. In the present embodiment, the second supply port 24 is selected from a plurality of gases including the purge gas 23 and the CDA (second gas) as described above, which is different from the purge gas 23, as the air curtain gas 25. The gas can be supplied. Specifically, a first tank 31 that stores the purge gas 23 and a second tank 32 that stores CDA communicate with the second supply port 24 via the switching valve 33, and thereby the second supply unit It is configured. The switching valve 33 can switch the supply source tank under the control of the control unit 50.

  Hereinafter, the air curtain gas switching control by the control unit 50 will be described with reference to FIGS. 2 and 3. 2A and 3A show the case of the conventional example, and FIGS. 2B and 3B show the case of the present embodiment. 3 (a) and 3 (b) are plan views showing the passage of time as in FIGS. 2 (a) and 2 (b). The second supply port 24 is the mold 11 or the first supply port. A plurality are provided so as to surround 22. In FIG. 2, the air curtain gas is injected from the second supply port 24, and a gas curtain is formed. The gas curtain partitions the processing space 41 including the imprint position and the first supply port 22 and the arrangement work space 42 including the arrangement position of the imprint material by the arrangement unit 20. In FIG. 2, the shot region 26 on the substrate is located below the placement unit 20, and the placement unit 20 places the imprint material 21-1 in the shot region 26. Thereafter, the substrate is transported along the movement path indicated by the arrow 43, passes under the second supply port 24, and is transported to the imprint position below the mold 11.

  At this time, as the substrate stage 14 is driven, the air curtain gas 25 supplied from the second supply port 24 on the arrangement unit 20 side as viewed from the imprint position is imprinted on the shot region 21-2. And the mold 11 may be drawn. In such a case, the concentration of the purge gas 23 supplied from the first supply port 22 between the imprint material 21-2 and the mold 11 on the shot region decreases. For this reason, the imprint material 21-2 cannot fill the concave pattern of the mold 11, and the possibility that a pattern defect will occur increases. As a countermeasure, a method of reducing the concentration by supplying a large amount of the purge gas 23 supplied from the first supply port 22 may be considered, but the cost increases.

  Therefore, the control unit 50 controls switching of the gas for forming the gas curtain, which is supplied from the second supply port 24, according to the movement of the substrate 13) according to the position of the substrate 13 in the movement path. In the present embodiment, for example, the control unit 50 forms the gas curtain at a predetermined timing after the placement of the imprint material is started and before the shot area reaches the position with respect to the second supply port 24 by substrate transport. The gas to be switched is switched from CDA to purge gas. This is shown in FIG. 2 (b).

  In FIG. 3B, the gas supplied from the second supply port 24 immediately before the shot region 26 reaches the position with respect to the second supply port 24 (the position where the gas from the second supply port 24 is applied). It is shown that the CDA is switched to the purge gas. In FIG. 3A showing the conventional example, such switching is not performed and CDA is continuously supplied. As described above, in the present embodiment, the gas from the second supply port 24 that may be drawn between the imprint material 21-2 on the shot region and the mold 11 as the substrate stage 14 is driven is changed to CDA. To purge gas 23. Therefore, the concentration of the purge gas 23 existing between the imprint material 21-2 and the mold 11 does not decrease. Thereby, it can prevent effectively that a pattern defect arises because the imprint material cannot fill the concave pattern of a mold.

  FIG. 5 shows a control flow by the control unit 50 according to the imprint process in the present embodiment. In executing this imprint process, purge gas is supplied from the first supply port 22, and air curtain gas 25 is supplied from the second supply port 24. The supply of the purge gas may be always performed, or may be controlled so as to be performed only before and after the contact between the mold 11 and the imprint material on the substrate 13 in order to save the purge gas.

  First, after the substrate stage 14 is driven to move the shot area on the substrate to the arrangement position, the arrangement unit 20 arranges the imprint material in the shot area (S1). At this time, CDA is supplied from the second supply port 24 as the air curtain gas 25. Next, the control unit 50 controls the switching valve 33 to switch the air curtain gas 25 supplied from the second supply port 24 from CDA to purge gas (S2). The gas switching timing will be described later.

  Next, the substrate stage 14 is driven to move the shot area where the imprint material is arranged to the imprint position (S3). Thereafter, the control unit 50 controls the switching valve 33 to return the air curtain gas 25 supplied from the second supply port 24 from the purge gas to the CDA (S4). The gas switching timing will be described later.

  Thereafter, contact between the mold 11 and the imprint material on the shot area of the substrate 13 (S5), exposure for curing the imprint material (S6), and release (S7) are performed. After the completion of mold release, it is determined whether or not the processing for all shots has been completed (S8). If there are still remaining shots, the process returns to S1 for imprinting the next shot area. This processing ends when the processing for all shots is completed.

  Here, the timing for switching the air curtain gas 25 supplied from the second supply port 24 from the CDA to the purge gas 23 in step S2 will be described. As described above, in the present embodiment, for example, the air curtain gas is used at a predetermined timing from when the placement of the imprint material is started until the shot region reaches the position with respect to the second supply port 24 by substrate transport. Is switched from CDA to purge gas. The basic idea is for an air curtain that may be drawn between the imprint material 21-2 on the shot area and the mold 11 when the mold and the imprint material are contacted in step S5. It is only necessary that the gas 25 is switched to the purge gas 23. Therefore, the gas supplied from the second supply port 24 may be switched to the purge gas 23 before the shot region 26 starts to pass under the second supply port 24. In other words, the “predetermined timing” may be a point in time immediately before the shot region 26 crosses the gas curtain due to the movement of the substrate by the moving mechanism 14a. Alternatively, the switching may be performed at the time when the imprint material is arranged on the substrate 13 or at the time when the arrangement is finished in step S1. In other words, the “predetermined timing” may be a point in time when the placement unit 20 is executing placement of the imprint material or a time point when the placement unit 20 finishes placing the imprint material. Further, the CDA may be switched to the purge gas after the release of the previous shot area and before the imprint material is arranged in the current shot area.

  Next, the timing for returning the air curtain gas 25 supplied from the second supply port 24 from the purge gas to the CDA in step S4 will be described. As a basic idea, when the mold and the imprint material are contacted in step S5, the air curtain gas 25 must be drawn between the imprint material 21-2 and the mold 11 on the shot area. That's fine. Therefore, the purge gas 23 may be returned to the CDA immediately after the shot area 26 moves under the mold 11 (imprint position). Alternatively, the purge gas 23 may be returned to the CDA during the contact between the mold and the imprint material. Alternatively, after the completion of the contact between the mold and the imprint material in step S5, the purge gas 23 may be returned to the CDA at a timing before performing the exposure for curing the imprint material in step S6.

  In step S3, the control unit 50 supplies the purge gas 23 supplied from the second supply port 24 while the shot area moves from the arrangement work space 42 to the processing space 41, that is, while the shot area crosses the gas curtain. Alternatively, the flow rate may be controlled to decrease. By doing so, at least one of volatilization and drying of the imprint material on the shot area is prevented.

  According to the configuration described above, gas entrainment of the gas curtain accompanying movement of the substrate can be reduced. As a result, the possibility of particle adhesion to the substrate is reduced, and a decrease in the concentration of the purge gas supplied between the imprint material and the mold can be suppressed, and the occurrence of pattern defects can be suppressed. This means that a problem that cannot be solved by the conventional imprint apparatus can be solved. According to this embodiment, the problem of the conventional imprint apparatus is solved, and more accurate pattern formation can be realized.

Second Embodiment
In the above-described embodiment, an example in which a plurality of the second supply ports 24 are provided so as to surround the mold 11 and the first supply port 22 has been described. By the way, in the above-described embodiment, the purge gas is used only for a predetermined period instead of using the purge gas as the air curtain gas for the entire period because the cost of the purge gas is taken into consideration. Furthermore, from the viewpoint of saving the purge gas, it is not necessary to use the purge gas in all of the plurality of second supply ports. Therefore, in the following second embodiment, a configuration example in which the purge gas is used as the air curtain gas at only a part of the plurality of second supply ports will be described.

  Since the schematic configuration of the imprint apparatus in this embodiment is the same as that of the first embodiment, FIG. 1 is used. In FIG. 4, a plurality of second supply ports 24 are provided so as to surround the mold 11 and the first supply port 22. Each of the plurality of second supply ports 24 can be constituted by, for example, a discharge nozzle. Here, the plurality of second supply ports 24 include a first partial supply port 241 and a second partial supply port 242. The first partial supply port 241 is a part of the plurality of second supply ports 24 located closest to the placement unit 20, and the substrate 13 extends under the second supply port 24 along the movement path. When passing, it is located above the shot area 26. In the present embodiment, the second partial supply port 242 is a supply port other than the first partial supply port 241 among the plurality of second supply ports 24. Only the first partial supply port 241 among the plurality of second supply ports 24 is configured to selectively supply CDA or purge gas as the air curtain gas.

  Here, at a predetermined timing from when the placement of the imprint material to the shot region is started until the shot region reaches a position below the first partial supply port 241, The air curtain gas is switched from CDA to purge gas. Thus, since the purge gas is not supplied from all of the plurality of second supply ports 24, the amount of purge gas used can be reduced.

  Further, the first partial supply port 241 discharges the imprint material in the placement unit 20 in a direction orthogonal to the direction of the substrate movement path (a direction from the placement unit 20 toward the imprint position, for example, the X-axis direction) in plan view. It is composed of a number of supply ports having a width b larger than the width a of the part. This is shown in the enlarged view in FIG. Therefore, the first partial supply port 241 that passes above the shot area 26 is larger than the shot area 26.

  In addition, the air curtain gas supplied from the portion of the second partial supply port 242 that is on the side opposite to the placement portion 20 when viewed from the imprint position is imprinted on the substrate as the substrate stage 14 is driven. It is not drawn between 21-2 and the mold 11. Therefore, the first partial supply port 241 does not have to exceed half of the plurality of second supply ports 24. In the present embodiment, the first partial supply port 241 includes less than half of the plurality of second supply ports 24 including the supply port closest to the placement unit 20 and a predetermined number of supply ports adjacent to the left and right thereof. It consists of a supply port.

<Embodiment of Method for Manufacturing Article>
The method for manufacturing an article according to an embodiment of the present invention is suitable for manufacturing an article such as a microdevice such as a semiconductor device or an element having a fine structure. The method for manufacturing an article according to the present embodiment includes a step of performing pattern formation on an imprint material on a substrate using the imprint apparatus (step of performing imprint processing on the substrate), and a substrate on which a pattern is formed in such a step. And a step of processing (a substrate subjected to imprint processing). Further, the manufacturing method includes other well-known steps (oxidation, film formation, vapor deposition, doping, planarization, etching, resist stripping, dicing, bonding, packaging, and the like). The method for manufacturing an article according to the present embodiment is advantageous in at least one of the performance, quality, productivity, and production cost of the article as compared with the conventional method.

10: Imprint apparatus, 14: Substrate stage, 14a: Movement mechanism, 20: Arrangement unit, 22: First supply port, 24: Second supply port, 31: First tank, 32: Second tank, 33: Switching valve

Claims (13)

An imprint apparatus for forming a pattern on a substrate by bringing a mold into contact with an imprint material on the substrate,
An arrangement part for arranging the imprint material in a shot region of the substrate;
A movement mechanism for moving the substrate along a movement path between an imprint position where the contact is made and an arrangement position where the arrangement by the arrangement unit is performed;
A first gas that supplies a first gas between the mold at the imprint position and the imprint material arranged in the shot region from a first supply port provided between the mold and the arrangement portion. A supply section;
A processing space including the imprint position and the first supply port and a layout work space including the layout position are partitioned from a second supply port provided between the first supply port and the placement unit. A second supply unit for supplying a gas for forming a gas curtain, the gas for forming the gas curtain includes the first gas and a second gas different from the first gas, A second supply unit configured to be able to supply a gas selected from a plurality of gases;
A control unit that controls selection of a gas for forming the gas curtain supplied by the second supply unit according to a position of the substrate in the movement path;
An imprint apparatus comprising:   The control unit is configured to start the placement of the imprint material on the shot region by the placement unit until the shot region reaches a position with respect to the second supply port by the movement of the substrate by the moving mechanism. The imprint apparatus according to claim 1, wherein a gas for forming the gas curtain is switched from the second gas to the first gas at a predetermined timing.   The imprint apparatus according to claim 2, wherein the predetermined timing is a point in time when the placement of the imprint material by the placement unit is being executed.   The imprint apparatus according to claim 2, wherein the predetermined timing is a point in time when the placement of the imprint material by the placement unit is completed.   The control unit further changes a gas for forming the gas curtain from the first gas to the first gas at a timing after the shot area is moved to the imprint position by the movement of the substrate by the movement mechanism. The imprint apparatus according to any one of claims 2 to 4, wherein the gas is switched to two gases.   The control unit may further supply a gas for forming the gas curtain during the contact after the shot area is moved to the imprint position by the movement of the substrate by the moving mechanism. The imprint apparatus according to claim 5, wherein the imprinting apparatus is switched from gas to the second gas.   The controller may further reduce a supply amount or a flow rate of the first gas supplied from the second supply port while the shot region crosses the gas curtain by the movement of the substrate by the moving mechanism. The imprint apparatus according to claim 2, wherein the imprint apparatus is characterized in that:   The said 1st gas contains at least any one of the permeable gas which permeate | transmits the said type | mold by the said contact, and the condensable gas liquefied by the said contact, The any one of Claim 1 thru | or 7 characterized by the above-mentioned. The imprint apparatus described.   The imprint apparatus according to claim 8, wherein the second gas is clean dry air. A plurality of the second supply ports are provided so as to surround the mold and the first supply port,
The first gas or the second gas is configured to be selectively supplied only from a part of the plurality of second supply ports close to the arrangement portion. The imprint apparatus according to claim 1.   The partial supply ports include a number of supply ports having a width larger than the width of the discharge portion of the imprint material in the arrangement portion in a direction orthogonal to the direction of the movement path in plan view. The imprint apparatus according to claim 10.   The part of the supply ports includes a supply port that is less than half of the plurality of second supply ports, including a supply port that is closest to the placement unit and a predetermined number of supply ports adjacent to the left and right of the supply port. The imprint apparatus according to claim 11. A step of performing pattern formation on a substrate using the imprint apparatus according to any one of claims 1 to 12,
Processing the substrate on which the pattern has been formed in the step;
A method for producing an article comprising:

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