JP2017059995A - Chip antenna and method of manufacturing the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a chip antenna capable of preventing an antenna pattern from being peeled from a base substance as much as possible, at a low cost.SOLUTION: Provided is a chip antenna 1 comprising: an antenna pattern 3 configured by folding a conductive plate in a three-dimensional shape; and a resin base substance 2 that holds the antenna pattern 3 on its surface. The base substance 2 that configures the chip antenna 1 integrally has an engaged part 27 engaged with a surface of the antenna pattern 3 in a thickness direction of the conductive plate. The engaged part 27 is provided along a marginal part of the antenna pattern 3.SELECTED DRAWING: Figure 2

Description

  The present invention relates to a chip antenna and a method for manufacturing the chip antenna, and more particularly, has a wireless communication function such as a smart meter (digital watt-hour meter), a mobile phone (including a smartphone), a notebook type or a tablet type PC. The present invention relates to a chip antenna mounted on a circuit board for electrical and electronic equipment and a manufacturing method thereof.

  In recent years, electric and electronic devices having a wireless communication function are increasing, and accordingly, the demand for chip antennas is increasing. Therefore, it is necessary to increase the productivity of chip antennas. Therefore, the present applicant, as described in Patent Document 1 below, is an antenna pattern formed by bending a conductive plate such as a metal plate into a three-dimensional shape, and the antenna pattern is injection molded with resin as an insert part, A chip antenna composed of a substrate having an antenna pattern held on the surface is proposed. This chip antenna can be obtained by continuously performing an antenna pattern forming process and a base molding process (an insert molding process in which the base is injection molded with resin using the antenna pattern as an insert part).

  In the above-described chip antenna, in order to stably exhibit desired antenna characteristics, it is necessary to closely contact an antenna portion that transmits and receives radio waves, among antenna patterns, with no gap to the base. For this reason, in the chip antenna of Patent Document 1, in order to prevent the antenna portion from floating (peeling from the base), a tongue-shaped protrusion embedded in the base is provided at the edge of the antenna pattern. Of these, measures such as increasing the surface roughness of at least the joint surface with the substrate are taken.

  A chip antenna is often mounted on a circuit board by so-called reflow processing. In the reflow process, a chip antenna is placed on a paste-like solder (cream solder) applied to the surface of a circuit board, and then heated together at a predetermined temperature (at least a melting point of the solder). Then, the chip antenna is soldered to the circuit board by cooling in a normal temperature atmosphere. This reflow processing has an advantage that chip antenna mounting work on a plurality of circuit boards can be simultaneously and automatically executed.

JP 2012-74835 A

  By the way, as described in Patent Document 1, when an antenna pattern is inserted and a base is injection-molded with resin, the antenna pattern is formed of a conductive plate such as a metal whose linear expansion coefficient is much smaller than that of resin. Therefore, the size and shape do not change before and after insert molding. On the other hand, the resin base contracts and deforms as the mold contracts. Here, the size of the antenna pattern (particularly the length of the antenna part) is determined mainly depending on the frequency (wavelength) of the radio wave to be transmitted and received. It is necessary to increase the size (lengthening) of the antenna portion in comparison with the use of transmitting and receiving. Increasing the length of the antenna portion inevitably increases the length of the base that holds the antenna portion on the surface. However, as the length of the base increases, the amount of deformation associated with molding shrinkage increases. Therefore, particularly in a chip antenna for transmitting and receiving radio waves in a low frequency band, the antenna portion of the antenna pattern is likely to be partially peeled off even if the above-described peeling prevention measures are taken on the antenna pattern.

  In order to prevent such problems from occurring as much as possible, the molding temperature when insert-molding the substrate is lowered (specifically, the molding temperature is lower than the recrystallization temperature of the resin). Tried. This is because the molding shrinkage of the substrate can be suppressed as the molding temperature is lowered. However, if the substrate molding temperature is lowered, the crystal structure of the substrate (resin) is not stable, and when the reflow treatment is performed by an electrical / electronic device manufacturer, the substrate is greatly shrunk or deformed, and the chip antenna is mounted on the circuit board. It was found that the frequency of not being able to implement properly increases.

  Therefore, after the substrate is insert-molded to obtain a chip antenna as a finished product, a countermeasure is taken in which the chip antenna is subjected to annealing treatment (heat treatment for increasing the dimensional stability, strength and rigidity of the resin component). However, in this case, a separate annealing process is required. Moreover, when performing the annealing process, in order to suppress the deformation of the substrate (particularly the occurrence of warping and bending) due to the annealing process, the processing conditions such as the heating temperature and the heating time are precisely controlled to place a weight on the chip antenna. It is necessary to take time-consuming measures such as. Therefore, the manufacturing cost of the chip antenna is inevitably increased.

  In view of the above circumstances, an object of the present invention is to provide a chip antenna capable of effectively reducing the possibility that an antenna pattern is peeled off from a substrate at a low cost.

  The present invention devised to achieve the above object includes an antenna pattern formed by bending a conductive plate into a three-dimensional shape, and a resin substrate holding the antenna pattern on the surface, and the antenna pattern is an upper surface of the substrate. And a plurality of terminal portions exposed on the lower surface of the base body, each of which is soldered to the circuit board. The base body is an antenna in the thickness direction of the conductive plate. An engaging portion that engages with the surface of the pattern is integrally provided, and the engaging portion is provided along an edge portion of the antenna pattern. The “antenna portion” in the present invention is a portion that performs at least one of transmission and reception of radio waves. The “upper surface of the base” means a surface parallel to the circuit board at a position spaced from the circuit board, and the “lower surface of the base” means a surface facing the circuit board (contact surface).

  In the chip antenna having the above-described configuration, with the antenna pattern arranged on the surface of the base, an engaging portion that engages the surface of the antenna pattern in the thickness direction of the conductive plate is provided along the edge of the antenna pattern. It can obtain by implementing the process formed.

  As described above, the chip antenna according to the present invention can be obtained by fixing the individually produced antenna pattern and the substrate. Therefore, at the time of manufacturing the substrate (injection molding), as in the case where the antenna pattern is used as an insert part and the substrate is injection-molded with resin, defects caused by the difference in linear expansion coefficient between them (partial separation of the antenna pattern) ) To avoid the occurrence of as much as possible, it is not necessary to lower the molding temperature intentionally, the molding temperature at which the resin crystal structure is stabilized, specifically, the substrate at a temperature higher than the recrystallization temperature of the resin. Can be injection molded. As the molding temperature of the substrate is increased, the amount of deformation of the substrate due to mold shrinkage increases. However, since the substrate is injection molded alone, if the substrate is injection molded in anticipation of deformation due to mold shrinkage, the predetermined shape / An accurate substrate can be easily obtained. And since the base of injection molding as described above has a stable crystal structure of the resin that constitutes the base, if it is a chip antenna that holds (fixes) an antenna pattern on the surface of the base, this is used. Even when mounting on the circuit board by the reflow process, it is possible to mount the circuit board appropriately on the circuit board as much as deformation of the base body due to the reflow process (heating) is suppressed as much as possible. Therefore, the annealing process for the substrate (chip antenna) can be omitted.

  The antenna pattern is provided integrally with the base body, and an engagement portion that engages with the surface of the antenna pattern in the thickness direction of the conductive plate is formed along the edge of the antenna pattern to form the base body (surface). Fixed to. At this time, if the engaging portion is formed along the entire edge portion of the antenna pattern, the possibility that the antenna pattern is partially peeled off from the substrate surface can be reduced as much as possible. In this case, there is no need to provide a tongue-like protrusion embedded in the antenna pattern in the antenna pattern or to roughen the surface roughness of the joint surface of the antenna pattern with the substrate as in Patent Document 1. The manufacturing cost of the antenna pattern can be reduced.

  As described above, the chip antenna according to the present invention can be obtained by separately manufacturing the base and the antenna pattern and then fixing the antenna pattern on the surface of the base. Therefore, it is considered that it is disadvantageous in terms of manufacturing cost as compared with the chip antenna of Patent Document 1 obtained by continuously performing the antenna pattern forming process and the process of inserting the antenna pattern and injection molding the substrate. It is done. However, as described above, in the configuration of the present invention, in addition to being able to omit the time-consuming annealing treatment, the antenna pattern fabrication cost can be reduced, and thus the cost reduction due to these synergistic effects is fixed to the antenna pattern. Exceeds cost increase due to separate process. Therefore, the manufacturing cost can be reduced as a whole. As mentioned above, according to this invention, the chip antenna which can reduce effectively the possibility that an antenna pattern will peel from a base | substrate can be provided at low cost.

  In the above-described configuration, it is preferable that a recess corresponding to the shape of the antenna pattern is provided on the surface of the base body, and the antenna pattern is fitted to the recess in a gap fitting state. In this way, even when the base body contracts to some extent as the reflow process is performed, the contraction amount can be absorbed by the gap interposed between the two opposing surfaces of the base body and the antenna pattern. Thereby, the possibility that the antenna pattern is partially peeled off from the surface of the substrate can be reduced more effectively.

  The antenna part of the antenna pattern has through holes that are open on both front and back surfaces, and the engaging part engages with the surface of the antenna pattern in the thickness direction of the conductive plate at the peripheral part of the through hole. If further provided, the possibility that the antenna portion of the antenna pattern is peeled off from the surface of the substrate can be reduced more effectively. Note that the shape of the antenna portion (the shape in plan view) can be arbitrarily selected as long as the desired antenna characteristics can be ensured. Therefore, for example, the antenna portion has a mesh shape. Many may be formed.

  As described above, according to the present invention, even when reflow processing is selected as a method for mounting on a circuit board, a chip antenna that can effectively reduce the possibility that the antenna pattern is peeled off from the substrate can be manufactured at low cost. It becomes possible to provide.

It is a schematic perspective view of the circuit board which mounted the chip antenna concerning one embodiment of the present invention on the surface. 1A is a plan view (top view) when the chip antenna shown in FIG. 1 is viewed from the direction A shown in FIG. 1, and FIG. 2B is a view showing the chip antenna from the direction B shown in FIG. It is a top view (side view) when seen. 2A is a schematic cross-sectional view taken along the line CC in FIG. 2A, FIG. 2B is a schematic cross-sectional view taken along the line D-D in FIG. 2A, and FIG. FIG. 3 is a schematic cross-sectional view taken along line EE in FIG. It is a schematic sectional drawing for demonstrating the process of fixing an antenna pattern to a base | substrate among the manufacturing processes of the chip antenna shown in FIG. 1, Comprising: (a) The figure fitted the antenna pattern in the recessed part provided in the base | substrate. The figure which shows a state, (b) A figure is a figure which shows the formation step of an engaging part. It is a top view of the chip antenna concerning other embodiments.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

  FIG. 1 shows a partial schematic perspective view of a circuit board 10 on which a chip antenna 1 according to an embodiment of the present invention is mounted. A chip antenna 1 shown in FIG. 1 includes an antenna pattern 3 made of a conductive plate and a resin base 2 holding the antenna pattern 3 on the surface.

  Here, the overall length dimension (longitudinal dimension) of the chip antenna 1 is set according to the frequency (wavelength) of the radio wave transmitted and received by the chip antenna 1. For example, when the chip antenna 1 is used for transmission / reception of radio waves in the 920 MHz band, the overall length of the antenna portion 31 of the antenna pattern 3 (specifically, the overall length of the portion of the antenna portion 31 whose outer surface is exposed to the outside). Is set to about 40 mm, for example. The overall length dimension of the base body 2 holding the antenna pattern 3 is set to be at least larger than the overall length dimension of the antenna portion 31. When the overall length dimension of the antenna portion 31 is set to about 40 mm as described above, the overall length dimension of the base body 2 is For example, it is set to about 50 mm. Note that the overall length of the base 2 is appropriately changed depending on the size of the antenna mounting space of the circuit board 10 and the like.

  In the chip antenna 1 shown in FIG. 1, the base 2 has a solid rectangular parallelepiped shape, as shown in FIGS. 2 (a) and 2 (b), an upper surface 21 and a lower surface 22 that are parallel to each other, and a pair of side surfaces that are parallel to each other. 23 and 23 and a pair of end surfaces 24 and 24 parallel to each other. As the molding resin for the substrate 2, one having a dielectric constant of 4 or more is selectively used. For example, one or more selected from the group of polyphenylene sulfide (PPS), liquid crystal polymer (LCP), polyamide (PA) and the like. These thermoplastic resins can be used as a base resin, which is mixed with a filler such as ceramics.

  The antenna pattern 3 is formed into a three-dimensional shape by bending a conductive plate. The antenna portion 31 is formed in a substantially rectangular shape in plan view, and a plurality of (arranged along the long side of the antenna portion 31 ( In the present embodiment, a total of four) terminal portions 32 and a plurality of connection portions 33 that are interposed between the antenna portions 31 and the respective terminal portions 32 and connect them are integrally provided. The antenna portion 31 is held on the upper surface 21 of the base 2 with its surface (outer surface) exposed to the outside, and each connection portion 33 is attached to the side surface 23 of the base 2 with its surface exposed to the outside. Is retained. In the present embodiment, the lower end of each connection portion 33 is exposed on the lower surface 22 of the base 2, and this exposed portion functions as the terminal portion 32. In practice, radio waves are also transmitted and received by the connection unit 33, but the amount of radio waves transmitted and received by the connection unit 33 is small enough to be ignored compared to the amount of radio waves transmitted and received by the antenna unit 31.

  As the conductive plate serving as the base material of the antenna pattern 3, for example, a metal plate such as a copper plate, a steel plate, or a SUS plate, or a plate obtained by plating these metal plates, and the plate thickness is desired. What is set as thin as possible (for example, 1 mm or less, more preferably 0.5 mm or less) is used as long as the three-dimensional shape can be maintained.

  As shown in FIGS. 3A to 3C, the antenna pattern is formed in the region (in this embodiment, the upper surface 21 and both side surfaces 23 and 23) of the surface of the base 2 where the antenna pattern 3 is to be held. 3 is provided, and the antenna pattern 3 is held in a state of being fitted and accommodated in the recess 25.

  The recess 25 may be formed so that the opening area thereof is the same as the area of the antenna pattern 3 to be accommodated, but in this embodiment, the recess 25 is formed to be slightly larger than the area of the antenna pattern 3. Therefore, the antenna pattern 3 is fitted and accommodated in the concave portion 25 in a so-called gap fitting state, and between the two surfaces 2 a and 3 a of the antenna pattern 3 and the base 2 facing each other in the direction orthogonal to the depth direction of the concave portion 25. There is a slight gap 4 [particularly, see the enlarged view in FIG. 3 (a)]. In addition, the base body 2 integrally includes an engaging portion 27 that engages with the surface of the antenna pattern 3 in the thickness direction of the conductive plate (antenna pattern 3). From the above, the antenna pattern 3 is held on the surface of the base 2 so as to be sandwiched between the engaging portion 27 and the inner bottom surface of the recess 25. In the present embodiment, a long hole-like through hole 34 extending in the longitudinal direction of the antenna pattern 3 is provided in the central portion in the short direction of the antenna portion 31, and the engaging portion 27 is connected to the antenna pattern 3 (the antenna portion 31 and the antenna portion 31). It is provided along the whole edge part of the connection part 33), and also along the peripheral part of the through-hole 34 [refer FIG. 2 (a) (b) and FIG. 3 (a)-(c)].

  Although detailed illustration is omitted, the chip antenna 1 is mounted on the circuit board 10 by soldering a total of four terminal portions 32 provided on the antenna pattern 3 to the circuit board 10 shown in FIG. . This soldering is often performed by a so-called reflow process. In addition, at least one of the total four terminal portions 32 functions as a fixing portion for fixing the chip antenna 1 to the circuit board 10 and as a power supply terminal electrically connected to the power supply line of the circuit board 10. And at least one of the remaining terminal portions 32 functions as the fixed portion and a ground terminal for grounding the antenna pattern 3 to the ground via the circuit board 10. Combines functionality. Further, the terminal portion 32 other than the power supply terminal and the ground terminal functions only as the fixed portion.

  The chip antenna 1 having the configuration described above is completed by fixing a separately formed three-dimensional antenna pattern 3 on the surface of a base 2 injection-molded with resin. Here, the base body 2 after the injection molding does not have the engaging portion 27 described above, but has a convex portion 26 provided in a region where the engaging portion 27 is to be formed (a peripheral region of the concave portion 25) [FIG. See (a)].

  On the other hand, although the illustration is omitted, the three-dimensional antenna pattern 3 is formed by, for example, pressing (punching) the conductive plate to form a developed pattern in which the three-dimensional antenna pattern 3 is developed on a plane. After that, the developed pattern is completed by bending using a press die and various actuators (for example, an air cylinder and a hydraulic cylinder).

  As described above, after the base body 2 and the antenna pattern 3 are individually manufactured, the antenna pattern 3 is fixed to the base body 2. In the present embodiment, first, as schematically shown in FIG. 4A, the antenna pattern 3 is fitted into the recess 25 provided on the surface of the base 2. At this time, as described above, since the antenna pattern 3 is fitted and accommodated in the recess 25 in a so-called gap-fitted state, the base body 2 and the antenna pattern 3 that face each other in the direction perpendicular to the depth direction of the recess 25. A slight gap 4 is interposed between the two surfaces 2a and 3a. Next, as shown in FIG. 4B, by applying ultrasonic vibration while pressing the pressing member 40 against the convex portion 26 provided in the peripheral region of the concave portion 25, the free end of the convex portion 26 is formed. The engaging portion 27 is formed by being enlarged and deformed. Thus, the antenna pattern 3 is sandwiched between the engaging portion 27 and the inner bottom surface of the recess 25, and the chip antenna 1 including the base body 2 and the antenna pattern 3 held on the surface thereof is completed. In addition to the above method, the engaging portion 27 can be formed by pressing the heated pressure member 40 against the convex portion 26, or can be formed in a convex shape while rotating the pressure member 40. It can also be formed by pressing against the portion 26.

  As described above, the chip antenna 1 according to the present invention can be obtained by fixing the antenna pattern 3 and the substrate 2 that are individually manufactured. Therefore, when the base body 2 is manufactured (injection molding), as in the case where the base body 2 is injection-molded with resin using the antenna pattern 3 as an insert part, a problem caused by the difference between the linear expansion coefficients of the two and the three (antenna In order to avoid the occurrence of partial peeling of pattern 3 as much as possible, it is not necessary to intentionally lower the molding temperature. The molding temperature at which the resin crystal structure is stabilized, specifically, the resin The substrate 2 can be injection-molded at the crystallization temperature or higher. As the molding temperature of the base body 2 is increased, the deformation amount of the base body 2 due to molding shrinkage increases. However, since the base body 2 is injection molded by itself, if the base body 2 is injection molded after allowing for deformation due to molding shrinkage. The base body 2 having a predetermined shape and accuracy can be easily obtained. The base body 2 injection-molded as described above has a stable crystal structure of the resin constituting the base body 2, so that the chip antenna 1 holds (fixes) the antenna pattern 3 on the surface of the base body 2. If present, even if this is mounted on the circuit board 10 by reflow processing, it can be appropriately mounted on the circuit board 10 as much as deformation of the base 2 due to reflow processing (heating) is suppressed as much as possible. it can. Therefore, the annealing process for the substrate 2 can be omitted.

  In addition, the antenna pattern 3 is provided integrally with the base 2, and the engaging portion 27 that engages the surface of the antenna pattern 3 in the thickness direction of the conductive plate is connected to the antenna pattern 3 (the antenna portion 31 and the connecting portion 33). The antenna pattern 3 (especially the antenna portion 31) is fixed to the base 2 by being formed along the peripheral edge of the through hole 34 provided in the antenna portion 31 and being fixed to the base 2 (surface). The possibility of partial peeling from the surface can be reduced as much as possible. In this case, as in Patent Document 1, the antenna pattern 3 is provided with a tongue-like protrusion embedded in the base 2, or the surface roughness of the joint surface of the antenna pattern 3 with the base 2 is roughened. Since it becomes unnecessary, the production cost of the antenna pattern 3 can be reduced.

  As described above, the chip antenna 1 according to the present invention can be obtained by separately manufacturing the base 2 and the antenna pattern 3 and then fixing the antenna pattern 3 to the surface of the base 2. Therefore, it is considered that it is disadvantageous in terms of manufacturing cost as compared with the chip antenna of Patent Document 1 obtained by continuously performing the antenna pattern forming process and the process of inserting the antenna pattern and injection molding the substrate. It is done. However, as described above, due to the configuration of the present invention, in addition to being able to omit the annealing process for the substrate 2 that requires labor, the manufacturing cost of the antenna pattern 3 can be reduced. This exceeds the cost increase by separately performing the fixing process of the antenna pattern 3. Therefore, the manufacturing cost can be reduced as a whole. As mentioned above, according to this invention, the chip antenna 1 which can reduce effectively the possibility that the antenna pattern 3 peels from the base | substrate 2 can be provided at low cost.

  Further, in this embodiment, the antenna pattern 3 is fitted in a gap fitting state with respect to the concave portion 25 provided on the surface of the base 2, so that the base 2 is somewhat contracted as the reflow process is performed. Even in this case, the contraction amount can be absorbed by the gap 4 interposed between the opposing two surfaces 2a and 3a of the base 2 and the antenna pattern 3. Therefore, it is possible to more effectively reduce the possibility that the antenna portion 31 of the antenna pattern 3 is partly peeled off from the base body 2 and realize the chip antenna 1 that can stably exhibit desired antenna characteristics. Can do. The concave portion 25 of the base 2 may be formed so that the gap width of the gap 4 is substantially the same between all the opposing two surfaces 2a and 3a. However, the positioning of the antenna pattern 3 with respect to the base 2 is accurately performed. From the viewpoint of performing, the gap width of the gap 4 formed between some of the opposing two surfaces 2a and 3a may be intentionally reduced.

  The chip antenna 1 and the manufacturing method thereof according to the embodiment of the present invention have been described above. However, the chip antenna 1 can be appropriately modified without departing from the gist of the present invention.

  For example, the base 2 constituting the chip antenna 1 is not limited to a solid rectangular parallelepiped, but has a hollow shape in which the lower surface 22 is opened, or an inverted cross section in which the lower surface 22 and both end surfaces 24 and 24 are opened. It is also possible to use a concave shape. In this case, in addition to being able to reduce the amount of resin used, there are advantages that the amount of deformation of the substrate 2 due to molding shrinkage and the like can be further suppressed.

  Further, the shape of the antenna pattern 3 described above is merely an example, and in particular, the shape of the antenna portion 31 can be appropriately changed as long as necessary antenna characteristics can be secured. For example, in the chip antenna 1 shown in FIG. 5, the antenna part 31 employs the antenna pattern 3 formed in a mesh shape having a large number of through holes 35 opened on both front and back surfaces. Although detailed illustration is omitted, in this case as well, a recess 25 corresponding to the planar shape of the antenna pattern 3 is provided on the surface of the base 2, and the antenna pattern 3 has a peripheral region of the recess 25. It is sandwiched and fixed between the engaging portion 27 that engages with the outer surface of the antenna pattern 3 in the thickness direction of the conductive plate and the inner bottom surface of the concave portion 25 formed by deforming. In this way, the holding force (adhesiveness) of the antenna part 31 can be further enhanced by the amount that the engaging part 27 can be uniformly formed (arranged) in the entire area of the antenna part 31. Therefore, it is possible to further reduce the possibility that the antenna unit 31 is partially peeled from the base body 2.

  The antenna portion 31 of the chip antenna 1 needs to have a portion where the conductive plate is connected in a straight line in the longitudinal direction at least in a partial region in the short direction. This is because the frequency characteristics change and desired antenna characteristics cannot be exhibited. Therefore, as in the embodiment shown in FIG. 5, when the antenna part 31 is formed in a mesh shape by providing a large number of through holes 35 in the antenna part 31, it is necessary to pay attention to the size and arrangement of the through holes 35. There is.

  Further, the number and arrangement of the terminal portions 32 to be provided in the antenna pattern 3 can be arbitrarily changed according to the form and circuit configuration of the circuit board 10 to be mounted.

  The present invention is not limited to the above-described embodiments, and can of course be implemented in various forms without departing from the gist of the present invention. The scope of the present invention is defined by the terms of the claims, and includes the equivalent meanings recited in the claims and all modifications within the scope.

DESCRIPTION OF SYMBOLS 1 Chip antenna 2 Base | substrate 3 Antenna pattern 10 Circuit board 21 Upper surface 22 Lower surface 25 Concave part 27 Engagement part 31 Antenna part 32 Terminal part 33 Connection part

Claims (7)

An antenna pattern formed by bending a conductive plate into a three-dimensional shape, and a resin base holding the antenna pattern on the surface, the antenna part being held on the top surface of the base, and the bottom surface of the base In a chip antenna having a plurality of terminal portions exposed to each of which is soldered to a circuit board,
The base body integrally has an engaging portion that engages with the surface of the antenna pattern in the thickness direction of the conductive plate, and the engaging portion is provided along an edge portion of the antenna pattern. A chip antenna characterized by.   2. The chip antenna according to claim 1, wherein a concave portion corresponding to the shape of the antenna pattern is provided on the surface of the base body, and the antenna pattern is fitted to the concave portion in a gap fitting state.   The antenna part of the antenna pattern has through holes opened on both front and back surfaces, and the engaging part engages with the surface of the antenna pattern in the thickness direction of the conductive plate at the peripheral part of the through hole. The chip antenna according to claim 1, further provided.   The chip antenna according to claim 3, wherein the antenna portion has a mesh shape having a large number of the through holes. An antenna pattern formed by bending a conductive plate into a three-dimensional shape, and a resin base that holds the antenna pattern on the surface, the antenna part being held on the top surface of the base, and the bottom surface of the base A method of manufacturing a chip antenna, wherein each of the terminal portions is soldered to a circuit board.
With the antenna pattern disposed on the surface of the base, an engaging portion that engages with the surface of the antenna pattern in the thickness direction of the conductive plate is formed along the edge of the antenna pattern. A method of manufacturing a chip antenna comprising a step.   The concave portion corresponding to the shape of the antenna pattern is provided on the surface of the base, and the engaging portion is formed by deforming a peripheral region of the concave portion after fitting the antenna pattern to the concave portion. 6. A method for manufacturing a chip antenna according to 5.   The method for manufacturing a chip antenna according to claim 6, wherein the antenna pattern is fitted in the recess with a gap fitted.

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