CN108941889A - Laser process equipment, three-dimensional antenna and processing method and communication equipment - Google Patents
Laser process equipment, three-dimensional antenna and processing method and communication equipment Download PDFInfo
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- CN108941889A CN108941889A CN201810814197.0A CN201810814197A CN108941889A CN 108941889 A CN108941889 A CN 108941889A CN 201810814197 A CN201810814197 A CN 201810814197A CN 108941889 A CN108941889 A CN 108941889A
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- antenna
- laser light
- light source
- laser
- insulating substrate
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- 238000000034 method Methods 0.000 title claims abstract description 24
- 238000004891 communication Methods 0.000 title claims abstract description 9
- 238000003672 processing method Methods 0.000 title claims abstract description 9
- 238000012545 processing Methods 0.000 claims abstract description 47
- 239000000758 substrate Substances 0.000 claims abstract description 42
- 238000001514 detection method Methods 0.000 claims abstract description 5
- 239000002184 metal Substances 0.000 claims description 55
- 229910052751 metal Inorganic materials 0.000 claims description 55
- 239000000463 material Substances 0.000 claims description 46
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 18
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 12
- 229910052802 copper Inorganic materials 0.000 claims description 12
- 239000010949 copper Substances 0.000 claims description 12
- 229910052759 nickel Inorganic materials 0.000 claims description 9
- 238000005520 cutting process Methods 0.000 claims description 6
- 238000009713 electroplating Methods 0.000 claims description 5
- 238000007747 plating Methods 0.000 claims description 5
- 239000007787 solid Substances 0.000 claims description 5
- 239000000126 substance Substances 0.000 claims description 5
- 239000000919 ceramic Substances 0.000 claims description 4
- 238000005553 drilling Methods 0.000 claims description 4
- 239000011521 glass Substances 0.000 claims description 4
- 238000004519 manufacturing process Methods 0.000 claims description 4
- 239000004033 plastic Substances 0.000 claims description 4
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 3
- 229910052737 gold Inorganic materials 0.000 claims description 3
- 239000010931 gold Substances 0.000 claims description 3
- 238000001746 injection moulding Methods 0.000 claims description 3
- 230000003287 optical effect Effects 0.000 claims description 3
- 229920000642 polymer Polymers 0.000 claims description 3
- 239000002994 raw material Substances 0.000 claims description 3
- 229910052709 silver Inorganic materials 0.000 claims description 3
- 239000004332 silver Substances 0.000 claims description 3
- 229910052718 tin Inorganic materials 0.000 claims description 3
- 239000011135 tin Substances 0.000 claims description 3
- 230000000007 visual effect Effects 0.000 abstract 1
- 238000013461 design Methods 0.000 description 8
- 238000007689 inspection Methods 0.000 description 2
- 238000003754 machining Methods 0.000 description 2
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000008092 positive effect Effects 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
- H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
- Waveguide Aerials (AREA)
Abstract
The invention discloses a kind of laser process equipments of three-dimensional antenna, comprising: laser light source is laser machined to the insulating substrate to three-dimensional antenna, to obtain the wiring path of the metallic circuit of three-dimensional antenna；Positioning unit positions and fixes insulating substrate to carry out to insulating substrate；Stereoptics visual detection unit；And linear motor；Wherein, the quantity of laser light source is multiple；Positioning unit has multiple changeable processing stations, and multiple processing stations correspond to multiple laser light sources.The invention also discloses a kind of three-dimensional antenna and processing method and communication equipments.
Description
Technical Field
The invention belongs to the field of antenna design, and particularly relates to laser processing equipment of a three-dimensional antenna, the three-dimensional antenna, a processing method and communication equipment.
Background
With the wide application of antennas and the development of new technologies, new requirements are put on the design of antennas and equipment for manufacturing antennas. In some conventional antenna assemblies, surface mount components are attached to upper and lower surfaces of a Printed Circuit Board (PCB) or a Flexible Printed Circuit (FPC) to form the antenna assembly. Because both the PCB and the FPC are of a sheet type or a multi-layer sheet type structure, the surface mount component can be attached only to a single side surface or both upper and lower side surfaces of the outermost layer of the PCB. Therefore, the arrangement of elements on a circuit board of the conventional antenna assembly or the design of the conventional antenna assembly is limited by the PCB or the FPC, so that the application range of the antenna assembly is limited, the PCB or the FPC needs to be considered first when the antenna is designed, and the flexibility of the placement of the elements is low.
In addition, the PCB has a long manufacturing process and high cost, and in some specific antenna circuit applications, people need to find a new process route with a short manufacturing process and low cost.
Disclosure of Invention
The technical problem to be solved by the invention is to provide laser processing equipment of a three-dimensional antenna, the three-dimensional antenna and communication equipment, the laser processing equipment of the three-dimensional antenna has higher processing efficiency, the flexibility of the arrangement of elements on a processed antenna circuit is higher, the three-dimensional antenna is more compact, more application functions can be integrated, and the application range of the antenna circuit is expanded.
In order to solve the problems, the technical scheme of the invention is as follows:
a laser processing apparatus of a stereo antenna includes:
the laser source is used for carrying out laser processing on the insulating base material of the three-dimensional antenna so as to obtain a routing path of the metal circuit of the three-dimensional antenna;
a positioning unit for positioning the insulating base material and fixing the insulating base material;
the stereoscopic optical vision detection unit is used for carrying out positioning detection on the insulating base material; and
a linear motor for adjusting the position of the insulating substrate;
wherein,
the number of the laser light sources is multiple;
the positioning unit has a plurality of switchable processing stations corresponding to the plurality of laser light sources.
According to an embodiment of the present invention, the laser light source includes:
at least one first laser light source for laser of the antenna pattern of the stereo antenna;
at least one second laser light source used for laser via holes on the stereo antenna; and
and at least one third laser light source for cutting off the polymer carrier of the three-dimensional antenna.
According to an embodiment of the present invention, the first laser light source is an infrared laser light source with a wavelength of 1064nm, and/or a picosecond laser light source;
the second laser light source is a green laser light source with the wavelength of 532nm, and/or an ultraviolet laser light source with the wavelength of 355nm, and/or a picosecond laser light source;
the third laser light source is an ultraviolet laser light source with the wavelength of 355nm, and/or a green laser light source with the wavelength of 532nm, and/or a picosecond laser light source.
A stereoscopic antenna, comprising:
the insulating substrate is used for providing stability of the whole structure of the three-dimensional antenna;
a plurality of surface mount components disposed on an outer surface of the insulating substrate; and
the metal circuit is arranged on the outer surface of the insulating substrate and/or the position of the metalized through hole of the insulating substrate, and the metal circuit is electrically connected with the surface mount component;
wherein,
the number of the metalized through holes is one or more, and the diameter of each metalized through hole is less than 0.5 mm;
the metal circuit is made of any one of a combination material of copper and nickel, a combination material of copper and silver, a combination material of copper and nickel and gold, and a combination material of copper and nickel and tin; the metal circuit is directly formed on the insulating substrate.
According to an embodiment of the invention, the insulating substrate is provided with vias, the metal lines being arranged at the locations of the vias.
According to an embodiment of the present invention, the via hole is a conductive via hole, a first end of the conductive via hole is provided with the metal line, and a second end of the conductive via hole is provided with the surface mount component; or
The first end and the second end of the conductive via hole are both provided with the metal line.
According to an embodiment of the invention, the material of the insulating substrate is one or more of plastic or glass or ceramic.
According to an embodiment of the present invention, the operating frequency range of the stereo antenna is above 3 GHz.
A processing method of a three-dimensional antenna comprises the following steps:
s1: selecting raw materials for preparing an insulating base material, and preparing the insulating base material by using a mould injection molding process according to the size requirement of the insulating base material;
s2: laser processing the insulating substrate by using the laser processing equipment as claimed in any one of claims 1 to 3, and directly processing a routing path of the metal circuit of the stereo antenna on the insulating substrate;
s3: covering a metal layer on the routing path by using a chemical plating and/or electroplating process to obtain the metal circuit;
s4: and fixing a surface mounting element on the outer surface of the insulating substrate by using a surface mounting process, wherein the surface mounting element is electrically connected with the metal circuit.
According to an embodiment of the present invention, the step S2 includes a surface engraving process, an edge cutting process, and a drilling process.
A communication device comprising a stereo antenna as described in any of the embodiments of stereo antennas above.
Due to the adoption of the technical scheme, compared with the prior art, the invention has the following advantages and positive effects:
1) the laser processing equipment for the three-dimensional antenna comprises a plurality of laser light sources and a positioning unit with a plurality of switchable stations, the plurality of processing stations are arranged to correspond to the plurality of laser light sources, the completion of the corresponding procedures of the plurality of laser light sources can be realized through the switching stations after the insulating base material is positioned at one time, the processing flow of the routing path of the metal circuit is shortened, and the processing efficiency and the processing precision are improved.
2) In the stereo antenna in one embodiment of the invention, the metal circuit is directly formed on the insulating substrate, the surface mounting element is directly arranged on the outer surface of the insulating substrate and is electrically connected with the metal circuit, and by adopting the structural design mode, the surface mounting unit can be placed at any position of the insulating substrate according to the requirement, and the metal wiring is directly formed on the insulating substrate according to the position where the surface mounting unit is required to be placed. Compared with the design mode of the existing antenna circuit, the design of the PCB and the FPC on the arrangement of elements is overcome, so that the flexibility of the arrangement of the elements on the three-dimensional antenna is higher, the three-dimensional antenna is more compact, and more application functions can be integrated.
3) In one embodiment of the invention, the connection mode of the three-dimensional antenna is expanded by arranging the conductive via hole on the insulating substrate and connecting the metal lines at two ends by using the conductive via hole or connecting the metal lines and the surface mounting element by using the conductive via hole.
4) According to the processing method of the three-dimensional antenna, the wiring path of the metal circuit is processed on the insulating base material by using the laser processing equipment, and then the metal layer is covered on the wiring path by utilizing the chemical plating and/or electroplating process on the wiring path to obtain the metal circuit.
Drawings
Fig. 1 is a view showing the unit composition of a laser processing apparatus for a solid antenna according to the present invention;
fig. 2 is a structural diagram of a three-dimensional antenna according to the present invention;
fig. 3 is a flowchart of a method for processing a three-dimensional antenna according to the present invention.
Description of reference numerals:
1-insulating base material, 2-metal circuit, 3-surface mounted element and 4-via hole;
5-laser light source, 51-infrared laser light source, 52-green laser light source, 53-ultraviolet laser light source, 54-picosecond laser light source, 6-positioning unit and 61-processing station.
Detailed Description
The laser processing device, the stereo antenna and the communication device of the stereo antenna provided by the invention are further described in detail with reference to the accompanying drawings and specific embodiments. Advantages and features of the present invention will become apparent from the following description and from the claims.
Example 1
Referring to fig. 1, a laser processing apparatus of a solid antenna includes: the laser light source 5 is used for carrying out laser processing on the insulating base material 1 of the three-dimensional antenna so as to obtain a routing path of a metal circuit of the three-dimensional antenna; and a positioning unit 6 for positioning the insulating base material 1 and fixing the insulating base material 1; and a stereoscopic optical vision inspection unit (not shown in the figure) for performing positioning inspection of the insulating base material 1; and a linear motor (not shown in the figure) for adjusting the position of the insulating base material 1; wherein, the number of the laser light sources 5 is a plurality; the positioning unit 6 has a plurality of switchable processing stations 61, and the plurality of processing stations 61 correspond to the plurality of laser light sources 5.
The laser processing equipment of the three-dimensional antenna in the embodiment comprises a plurality of laser light sources 5 and a positioning unit 6 with a plurality of switchable stations, wherein a plurality of processing stations 61 are arranged to correspond to the plurality of laser light sources 5, so that after the insulating substrate 1 is positioned at one time, the completion of the corresponding processes of the plurality of laser light sources 5 is realized by switching the processing stations 61, on one hand, the processing flow of the routing path of the metal circuit is shortened, and the processing efficiency is improved; on the other hand, the machining precision is improved because multiple times of positioning are not needed.
Further, the laser light source 5 includes: at least one first laser light source for laser antenna patterns of the stereo antenna; at least one second laser light source for laser via holes on the stereo antenna; and at least one third laser light source for cutting off the polymer carrier of the three-dimensional antenna.
Specifically, the first laser light source is an infrared laser light source 51 with the wavelength of 1064nm, and/or a picosecond laser light source 54; the second laser light source is a green laser light source 52 with the wavelength of 532nm, and/or an ultraviolet laser light source 53 with the wavelength of 355nm, and/or a picosecond laser light source 54; the third laser source is an ultraviolet laser source 53 with the wavelength of 355nm, and/or a green laser source 52 with the wavelength of 532nm, and/or a picosecond laser source 54.
Of course, other laser sources may be provided as desired. The infrared laser light source 51 may be mainly used to realize engraving of a figure outline, the green laser light source 52 may be mainly used to cut, the ultraviolet laser light source 53 may be mainly used to realize drilling, and the picosecond laser light source 54 may be mainly used to realize higher-precision machining. Of course, the laser light source described above can be used for other processes as well.
Furthermore, the laser processing equipment of the stereo antenna also comprises an auxiliary unit, and the auxiliary unit can be used for conveying workpieces, removing dust, cooling, protecting personnel, warning and the like.
Example 2
Referring to fig. 2, a solid antenna includes: an insulating substrate 1 for providing stability of the overall structure of the three-dimensional antenna; a plurality of surface mount components 3, the surface mount components 3 being arranged on the outer surface of the insulating substrate 1; the metal circuit 2 is arranged on the outer surface of the insulating base material 1, and the metal circuit 2 is electrically connected with the surface mounting component 3; the number of the metalized through holes is one or more, and the diameter of each metalized through hole is less than 0.5 mm; the metal wiring 2 is directly formed on the insulating base material 1. The material of the metal line 1 may be any one of a combination material of copper and nickel, a combination material of copper and silver, a combination material of copper and nickel and gold, and a combination material of copper and nickel and tin.
In the embodiment, the metal line 2 is directly formed on the insulating substrate 1 by the stereo antenna, and the surface mount element 3 is directly disposed on the outer surface of the insulating substrate 1 and electrically connected to the metal line 2, it can be understood that, by adopting the structural design manner, the surface mount unit 3 can be disposed at any position of the insulating substrate 1 as required, for example, one surface mount unit 3 can be disposed on the first side surface of the insulating substrate 1 as required, and the other surface mount unit can be disposed on the second side surface opposite to the first side surface, of course, a plurality of surface mount units 3 can also be compactly disposed on the same surface, and the metal trace 2 can be directly formed on the insulating substrate 1 according to the position where the surface mount unit 3 is required to be disposed. The layout position of electronic components in the circuit of the existing three-dimensional antenna using the PCB or the FPC is limited by the PCB or the FPC, structures in other aspects may be sacrificed in the need of compact design, and meanwhile, the integration of components with multiple application functions is not facilitated. More application functions can be integrated.
Further, the insulating substrate 1 is provided with vias 4 at which the metal lines 2 are arranged. Preferably, the via 4 is a conductive via, a first end of the conductive via is provided with the metal line 2, and a second end of the conductive via is provided with the surface mount component 3; or both the first end and the second end of the conductive via are provided with metal lines 2. The connection mode of the lines on the three-dimensional antenna is expanded by connecting the metal lines 2 at two ends by using the conductive through holes or connecting the metal lines 2 and the surface mounting component 3 by using the conductive through holes.
Further, the material of the insulating substrate 1 is one or more of plastic or glass or ceramic. It will be appreciated that the insulating substrate 1 may be made of one of plastic or glass or ceramic, or may be formed by combining sub-units made of the above materials, respectively, as desired.
Furthermore, the working frequency range of the stereo antenna is more than 3 GHz.
Example 3
Referring to fig. 3, a method for processing a three-dimensional antenna includes: s1: selecting raw materials for preparing the insulating base material, and preparing the insulating base material by using a mould injection molding process according to the size requirement of the insulating base material; s2: performing laser processing on the insulating base material by using the laser processing equipment of the three-dimensional antenna in the embodiment 1, and directly processing a routing path of a metal circuit of the three-dimensional antenna on the insulating base material; s3: covering a metal layer on the wiring path by using a chemical plating and/or electroplating process to obtain a metal circuit; s4: and fixing the surface mounting element on the outer surface of the insulating substrate by using a surface mounting process, wherein the surface mounting element is electrically connected with the metal circuit.
Specifically, the step S2 includes a surface engraving process, an edge cutting process, and a drilling process, but should not be limited thereto.
In the processing method of the three-dimensional antenna in the embodiment, the routing path of the metal circuit is processed on the insulating base material by using the laser processing equipment, and then the metal layer is covered on the routing path by using the chemical plating and/or electroplating process on the routing path to obtain the metal circuit, so that the laser processing method is low in cost and high in processing efficiency; compared with a PCB preparation process, the scheme provided by the embodiment has the advantages of short process flow and low cost.
Example 4
A communication device including the stereo antenna in embodiment 2 of the present invention.
The embodiments of the present invention have been described in detail with reference to the accompanying drawings, but the present invention is not limited to the above embodiments. Even if various changes are made to the present invention, it is still within the scope of the present invention if they fall within the scope of the claims of the present invention and their equivalents.
Claims (11)
1. A laser processing device of a stereo antenna is characterized by comprising:
the laser source is used for carrying out laser processing on the insulating base material of the three-dimensional antenna so as to obtain a routing path of the metal circuit of the three-dimensional antenna;
a positioning unit for positioning the insulating base material and fixing the insulating base material;
the stereoscopic optical vision detection unit is used for carrying out positioning detection on the insulating base material; and
a linear motor for adjusting the position of the insulating substrate;
wherein,
the number of the laser light sources is multiple;
the positioning unit has a plurality of switchable processing stations corresponding to the plurality of laser light sources.
2. The laser processing apparatus of the solid antenna as claimed in claim 1, wherein the laser light source comprises:
at least one first laser light source for laser of the antenna pattern of the stereo antenna;
at least one second laser light source used for laser via holes on the stereo antenna; and
and at least one third laser light source for cutting off the polymer carrier of the three-dimensional antenna.
3. The laser processing device of the stereo antenna as claimed in claim 2, wherein the first laser source is an infrared laser source with a wavelength of 1064nm, and/or a picosecond laser source;
the second laser light source is a green laser light source with the wavelength of 532nm, and/or an ultraviolet laser light source with the wavelength of 355nm, and/or a picosecond laser light source;
the third laser light source is an ultraviolet laser light source with the wavelength of 355nm, and/or a green laser light source with the wavelength of 532nm, and/or a picosecond laser light source.
4. A stereoscopic antenna, comprising:
the insulating substrate is used for providing stability of the whole structure of the three-dimensional antenna;
a plurality of surface mount components disposed on an outer surface of the insulating substrate;
and
the metal circuit is arranged on the outer surface of the insulating substrate and/or the position of the metalized through hole of the insulating substrate, and the metal circuit is electrically connected with the surface mount component;
wherein,
the number of the metalized through holes is one or more, and the diameter of each metalized through hole is less than 0.5 mm;
the metal circuit is made of any one of a combination material of copper and nickel, a combination material of copper and silver, a combination material of copper and nickel and gold, and a combination material of copper and nickel and tin;
the metal circuit is directly formed on the insulating substrate.
5. The stereoscopic antenna as claimed in claim 4, wherein the insulating substrate is provided with a via hole, and the metal line is disposed at a position of the via hole.
6. The stereoscopic antenna as claimed in claim 5, wherein the via hole is a conductive via hole, a first end portion of the conductive via hole is provided with the metal line, and a second end portion of the conductive via hole is provided with the surface mount component; or
The first end and the second end of the conductive via hole are both provided with the metal line.
7. The stereo antenna according to claim 4, wherein the insulating substrate is made of one or more of plastic, glass or ceramic.
8. The stereo antenna according to claim 4, wherein the operating frequency range of the stereo antenna is above 3 GHz.
9. A processing method of a three-dimensional antenna is characterized by comprising the following steps:
s1: selecting raw materials for preparing an insulating base material, and preparing the insulating base material by using a mould injection molding process according to the size requirement of the insulating base material;
s2: laser processing the insulating substrate by using the laser processing equipment as claimed in any one of claims 1 to 3, and directly processing a routing path of the metal circuit of the stereo antenna on the insulating substrate;
s3: covering a metal layer on the routing path by using a chemical plating and/or electroplating process to obtain the metal circuit;
s4: and fixing a surface mounting element on the outer surface of the insulating substrate by using a surface mounting process, wherein the surface mounting element is electrically connected with the metal circuit.
10. The method for manufacturing a solid antenna of claim 9, wherein the step S2 includes a surface engraving process, an edge cutting process, and a drilling process.
11. A communication device comprising a stereo antenna according to any one of claims 4 to 8.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810814197.0A CN108941889A (en) | 2018-07-23 | 2018-07-23 | Laser process equipment, three-dimensional antenna and processing method and communication equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810814197.0A CN108941889A (en) | 2018-07-23 | 2018-07-23 | Laser process equipment, three-dimensional antenna and processing method and communication equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108941889A true CN108941889A (en) | 2018-12-07 |
Family
ID=64464597
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810814197.0A Pending CN108941889A (en) | 2018-07-23 | 2018-07-23 | Laser process equipment, three-dimensional antenna and processing method and communication equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108941889A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI701096B (en) * | 2019-02-01 | 2020-08-11 | 立誠光電股份有限公司 | Lds optical device and manufacturing processes thereof |
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| TWI701096B (en) * | 2019-02-01 | 2020-08-11 | 立誠光電股份有限公司 | Lds optical device and manufacturing processes thereof |
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Application publication date: 20181207 |
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| RJ01 | Rejection of invention patent application after publication |