JP2016225664A - Light-emitting device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a light-emitting device capable of achieving light emission of high luminance with high luminous efficiency, by increasing the optical coupling efficiency from a light-emitting element to a light transmitting member.SOLUTION: A light-emitting device includes: a light transmitting member having the light-emitting surface and the light-receiving surface of the light-emitting device; a light-emitting element including an emission surface facing the light-receiving surface, and being bonded to the light transmitting member; and a light guide member provided to extend from the light-emitting element surface to the light transmitting member surface, and guiding the emission light from the light-emitting element to the light transmitting member. The light guide member has: a junction region for bonding the emission surface of the light-emitting element and the light-receiving surface of the light transmitting member while facing each other; and a first coating region extending from the junction region, and covering the surface of one of the light-emitting element and light transmitting member projecting outward from the junction region. A first reflection surface for reflecting the emission light to the light transmitting member side is provided on the outer surface of the first coating region.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a light emitting device, and more particularly to a light emitting device including a light guide member that increases luminous efficiency.

  2. Description of the Related Art In recent years, light-emitting devices equipped with semiconductor light-emitting elements such as light-emitting diodes (LEDs) and laser diodes (LDs) as light sources have been used for various lighting and display devices. In particular, since these semiconductor light emitting devices have low power consumption and long life, they are attracting attention as light sources for next-generation illumination that can be replaced with fluorescent lamps, and further improvements in light emission output and light emission efficiency are required. There is also a need for a light source with good light distribution characteristics and high brightness, such as floodlights such as car headlights.

  For example, Patent Document 1 discloses a protection in which an LED chip assembly in which a phosphor chip is fixed to an LED chip with a light-transmitting adhesive is mounted on a cup portion or an insulating substrate of a lead frame and a light scattering agent is mixed. A light emitting device in which the LED chip assembly is sealed with a layer or a sealing resin has been proposed.

JP 2002-141559 A JP 2007-019096 A JP 2002-305328 A JP-A-10-151794 JP 2009-043764 A JP 2008-300621 A JP 2008-277592 A

  However, in the light-emitting device described in the cited document 1, the light-transmitting adhesive that adheres the phosphor chip onto the LED chip is directly from the phosphor chip or through the side surface of the light-emitting element, and the lead frame cup portion. The light emitted from the LED chip or the phosphor chip is guided by the adhesive and absorbed by the surface of the insulating substrate, the electrode provided on the insulating substrate, or the lead frame. As a result, there is a problem that the light output of the light emitting device is reduced, and the same problem exists in the translucent resin that covers the surface of the light emitting element or phosphor chip and the substrate, electrode, or the like. Moreover, the light path by such a translucent member is small, and even if it is narrow, the influence on the characteristics of the light emitting device is large. Furthermore, the LED chip and the phosphor chip of the cited document 1 are only bonded to each other by an adhesive, and the coupling efficiency of light emitted from the LED chip to the phosphor chip is low. There is a concern that luminance unevenness, color unevenness, and directivity deteriorate when the external shape alignment is poor.

  The present invention has been made in view of the above problems, and its purpose is to reduce the loss of light emitted from the light emitting element to increase its utilization efficiency, and to improve the optical coupling efficiency from the light emitting element to the light transmitting member. It is to provide a light emitting device capable of enhancing the luminous efficiency and luminance.

The light emitting device according to the present invention can achieve the above object by the following configurations (1) to (15).
(1) A light-transmitting member having a light-emitting surface and a light-receiving surface of a light-emitting device, a light-emitting element that includes an output surface facing the light-receiving surface, and is bonded to the light-transmitting member; A light guide member that extends to the surface of the member and guides the light emitted from the light emitting element to the light transmitting member, wherein the light guide member includes the light exit surface of the light emitting element and the light. A joining region that joins the light-receiving surfaces of the transmissive member facing each other, and a first portion that extends from the joining region and covers one surface of the light emitting element and the light transmissive member that protrudes outward from the joining region. And a first reflective surface that reflects the emitted light toward the light transmitting member, provided on an outer surface of the first covered region.
(2) The light emitting device includes a covering member having a light reflecting material, and the covering member covers the surface of the light guide member and exposes the light emitting surface to cover the surfaces of the light emitting element and the light transmitting member. The light emitting device according to (1) above.
(3) The light-emitting device according to (1) or (2), wherein the light transmission member is a wavelength conversion member that is excited by light emitted from the light-emitting element.
(4) The first covering region covers one protruding surface and the other side surface of the light emitting element and the light transmitting member, and the first reflecting surface is provided to face the side surface. The light emitting device according to any one of (1) to (3) above.
(5) The covering member covers the surface of the other side surface through the light guide member of the first covering region, and covers the surface of the side surface of the light emitting element or the light transmitting member exposed from the light guide member. The light emitting device according to (4), wherein the light emitting device is covered.
(6) A part of the light receiving surface of the light transmitting member protrudes outward from the emission surface, and the first reflecting surface is an inclined surface inclined from the side surface of the light emitting element toward the light receiving surface side. (1) The light-emitting device in any one of (5).
(7) The light emitting device according to (6), wherein a light receiving surface of the light transmitting member is larger than an emission surface of the light emitting element and includes the emission surface.
(8) A part of the emission surface of the light emitting element protrudes outward from the light receiving surface, and the first reflection surface is an inclined surface inclined from the side surface of the light transmission member to the emission surface side. (1) The light-emitting device in any one of (5).
(9) The light emitting device according to (8), wherein an emission surface of the light emitting element is larger than a light receiving surface of the light transmitting member and includes the light receiving surface.
(10) A plurality of the light emitting elements are separated from each other and bonded to a light receiving surface side of the light transmitting member, and the light guide member has a part of the light receiving surface sandwiched between the separated light emitting elements. A second reflecting surface that extends from the joining region and covers the second covering region and that reflects the emitted light from the adjacent light emitting elements toward the light receiving surface is provided in the second covering region. The light-emitting device according to any one of (1) to (9), provided on the outer surface of the device.
(11) The light emitting device according to (10), wherein the second covering region covers side surfaces of the separated light emitting elements facing each other.
(12) The light emitting device according to (10) or (11), wherein at least one pair of the plurality of light emitting elements has different distances from the light emitting surface to the light receiving surface of the light transmitting member.
(13) The light-emitting element includes a semiconductor layer and a substrate closer to the emission surface than the semiconductor layer, and the light guide member extends to and covers a side surface of the substrate to expose the semiconductor side surface. The light-emitting device according to any one of (1) to (12).
(14) The light-emitting device includes a light-reflective material, includes a covering member that exposes the light-emitting surface and covers a part of the light-emitting element and the light-transmitting member, and the first reflective surface or The light emitting device according to any one of (1) to (13), wherein the second reflecting surface is provided at an interface between the light guide member and the covering member.
(15) The light emitting device according to any one of (1) to (14), wherein the first reflection surface or the second reflection surface is a convex curved surface that is convex toward the side surface.

  According to the present invention, light is efficiently extracted from the light emitting element by joining the light transmitting member and the light emitting element disposed to face each other by the light guide member provided between and between the light transmitting member and the region extending from the light transmitting member. Thus, a light-emitting device that can be light-guided and optically coupled to the light-transmitting member and can emit light with high luminance and high luminance can be provided. Further, the light transmission member and the light emitting element joined by the light guide member are further covered with a light reflective coating member to form a light emitting device having a light emitting surface in a part of the light transmission member, thereby further improving the efficiency. When the light transmissive member is a wavelength converting member, the light emitting device that can emit light with high luminance with light distribution characteristics with little color unevenness and high light emission efficiency can be provided. Further, with such a structure, the light emitting element and the light transmitting member have different outer shapes, sizes, and arrangements, so that a light source having a desired shape and outer dimensions can be obtained. A light emitting device capable of adjusting light emission characteristics such as luminance can be obtained.

It is the schematic top view (b) of the light-emitting device which concerns on one embodiment of this invention, and the schematic sectional drawing (a) in the AA cross section. It is a schematic sectional drawing explaining the light source part periphery of the light-emitting device which concerns on one embodiment of this invention. It is a schematic sectional drawing explaining the periphery of the light source part of the light-emitting device of the comparative example which concerns on this invention. It is a schematic sectional drawing of the light emitting element which concerns on one embodiment of this invention. It is the schematic sectional drawing (a) of the light-emitting device which concerns on one embodiment of this invention, and the schematic sectional drawing (b) explaining the light source part periphery. It is a schematic sectional drawing explaining the light source part periphery of the light-emitting device which concerns on one embodiment of this invention. It is a schematic sectional drawing for demonstrating the light source part periphery of the light-emitting device which concerns on one embodiment of this invention. It is a schematic sectional drawing explaining the light-emitting device which concerns on one embodiment of this invention. It is a schematic sectional drawing explaining the light-emitting device which concerns on one embodiment of this invention.

  Hereinafter, embodiments of the invention will be described with reference to the drawings as appropriate. However, the light-emitting element / device described below is for embodying the technical idea of the present invention, and the present invention is not limited to the following. In particular, the dimensions, materials, shapes, relative arrangements, and the like of the components described below are not intended to limit the scope of the present invention only to specific examples unless otherwise specified. Only. Note that the size, positional relationship, and the like of the members shown in each drawing may be exaggerated for clarity of explanation. Furthermore, each element constituting the present invention may be configured such that a plurality of elements are constituted by the same member and the plurality of elements are shared by one member, and conversely, the function of one member is constituted by a plurality of members. It can also be realized by sharing. Similarly, each embodiment described below can be applied by appropriately combining the components and the like unless otherwise specified.

  As shown in FIGS. 1 and 2, the light emitting device of the present invention mainly includes a light emitting element 10, a light transmitting member 20, and a light guide member 30. The light emitting element 10 has an emission surface, and the light transmitting member 20 has a surface 21 (light emitting surface 90) exposed to the outside, a light receiving surface 22 facing the surface 21, and a side surface, respectively. The light emitting element 10 is arranged with its emission surface facing the light receiving surface 22 of the light transmitting member, and one member of the light emitting element 10 and the light transmitting member 20 is protruded outward from the other member. The light guide member 30 can be applied with an adhesive that fixes the light emitting element 10 and the light transmitting member 20, and has a light transmitting property, and transmits light from the surface of the light emitting element and the light transmitting member, specifically from the surface of the light emitting element. It extends to the surface of the member and has a function of guiding the emitted light from the light emitting element 10 to the light transmitting member 20. The light guide member 30 has a joining region 31 that joins the emitting surface of the light emitting element and the light receiving surface 22 of the light transmitting member that face each other, and extends from the joining region, and the protruding surface (the emitting surface of the light emitting element). Covering area (32, 37) covering the surface or a part of the light receiving surface 22 of the light transmitting member). The light guide member is spaced apart from the mounting surface of the substrate, and recedes from the mounting side surface of the light emitting element 10 and is positioned on the light transmitting member 20 side. Accordingly, it is possible to prevent light emitted from the light emitting element 10 from being propagated through the light guide member 30 and guided to the substrate 50 and absorbed. A reflective surface that reflects the light emitted from the light emitting element 10 toward the light transmitting member 20 is provided on the outer surface of the covering region. As described above, the reflection of the outer surface of the light guide member 30 can suppress the diffusion of light, focus the light in the light guide member 30, and guide the light to the light transmission member 20. The loss of light due to absorption , The light emitted from the light emitting element 10 can be efficiently coupled to the light transmitting member 20, and the luminance distribution on the light emitting surface can be improved. Moreover, the brightness | luminance and chromaticity in a light emission surface can be made favorable distribution by joining a light emitting element and a light conversion member.

  Further, as shown in FIGS. 1, 2, 5, and 6, the covering region covers the surface of the protruding portion so as to connect the other side surface, and faces the coated side surface. It is preferable that the reflecting surface is provided on the outer surface of the film. By making the inclined surface connecting the surface of one protrusion and the other side surface the outer surface, the swelling to the outside of the covering region is suppressed, and the light transmitting member 20 of the light reflected by the outer surface is reached When the optical path length of the light guide member 30 is shortened and the outer surface is a concave curved surface, the light guide function of the light guide member 30 can be enhanced by a convex curved reflection surface.

  In addition, as shown in FIGS. 1 and 2, the light-emitting device of the present invention further includes a light-reflective coating member 40, and a part of the light-emitting element 10 and the light transmission member 20 is covered with the coating member 40. The exposed surface 21 of the light transmitting member can be used as the light emitting surface 90 of the device, and a surface light emitting type light emitting device can be obtained. The covering member 40 also functions as a filler and a sealing material containing the light reflective material 45, and the light emitting device can be downsized. Further, by providing the light guide member 30 so as to cover the surface of the light guide member 30 due to its light reflectivity, the light guide action is assisted, and the light coupling efficiency of the emitted light from the light emitting element 10 to the light transmitting member can be further enhanced. it can. Further, on the surface of the light emitting element and the light transmitting member, an area covered by the light guide member and an area exposed from the area are provided, and these areas are covered with the covering member, that is, the exposed area is directly The covering region is preferably covered with the covering member via the light guide member. Specifically, the covering member covers one side surface in the covering region via the light guide member 30 and covers the other side surface exposed from the light guide member 30. Thus, the light reflection function by the covering member restricts the light propagation region from the light emitting element 10 to the light transmitting member 20 in the exposed region while strengthening the light confinement action in the light guide member 30 in the covering region. Thus, light can be efficiently guided to the light transmitting member 20 by the light guide member 30. Furthermore, the reflective surface of the said covering area | region is provided in the interface of the said light guide member and the said covering member, and the function is further improved and it is preferable. With such a configuration, it is possible to increase the utilization efficiency of light emitted from the light emitting element 10 and to realize high luminance light emission with less color unevenness and excellent light distribution characteristics.

(Embodiment 1)
1 and 2 show a light-emitting device 100 according to Embodiment 1 of the present invention, and the cross-section of FIG. 1A is a schematic cross-sectional view taken along the line AA of FIG. 2 is a schematic cross-sectional view around the light source section. The light emitting device 100 of the example shown in FIG. 1 is a surface light emitting type light emitting device having a light emitting surface 90. The light-emitting device 100 mainly includes a light-emitting element 10 having a semiconductor element structure 11 on a growth substrate 1 and a plate-like light having a light-receiving surface 22 opposite to the surface 21 where a surface 21 to be a light-emitting surface 90 is exposed. The light-transmitting member 20, the light guide member 30 that guides the light emitted from the light-emitting element 10 to the light-transmitting member 20, and the covering member 40 containing the light-reflecting material 45 are configured. The light emitting element 10 is flip-chip mounted on the wiring layer 51 of the substrate 50 with the emission surface being the back surface of the growth substrate 1 facing the light receiving surface 22 of the light transmitting member. The light transmitting member 20 is optically coupled. A frame body 55 is provided on the substrate 50 so as to surround the light emitting element 10 and the light transmissive member 20, and a covering member 40 is filled inside thereof, so that the light emitting element 10 and a part of the light transmissive member 20 are covered. Covered by a member 40. The light emitting region of the light emitting device 100, that is, the light emission window portion is substantially limited to the surface 21 of the light transmitting member 20, and a surface light emitting light emitting device having the light emitting surface 90 as the surface 21 is obtained. Further, the light emitting device 100 can control the luminance of light emitted from the surface 21, that is, the light emitting surface 90, and the distribution of light distribution, depending on the shape and size of the surface 21 of the light transmitting member 20. Furthermore, the light emitting device has a relatively uniform luminance and chromaticity within the light emitting surface. Here, the planar shapes of the light transmitting member and the light emitting element are rectangular as shown in the figure, and the light emitting element is included in the light transmitting member in a plane.

  The light source part will be described in detail with reference to FIG. 2. The light guide member 30 has a joining region 31 that joins the light emitting element 10 and the light transmitting member 20 to face each other, and more specifically, transmits light. The light receiving surface 22 of the member is provided in a region facing the light emitting surface of the light emitting element 10. In a specific example, for example, an example described later, the thickness of the bonding region is about 0.01 μm to 100 μm. By interposing the light guide member 30 in the joining region, the light emitting element and the light transmitting member are separated from each other, and the refractive index difference on the exit surface of the light emitting element 10 is reduced as compared with the case where gas such as the atmosphere is interposed. The light can be efficiently extracted from the light emitting element 10. Therefore, light from the emission surface of the light emitting element 10 is transmitted into the bonding region 31 and directly optically coupled to the light receiving surface 22 of the light transmitting member.

  In the present embodiment, the light receiving surface 22 of the light transmitting member is larger than the light emitting surface of the light emitting element 10, and a part of the light receiving surface 22 protrudes outward from the light emitting surface of the light emitting element 10. In other words, the side surface of the light transmitting member 20 is located outside the side surface of the light emitting element 10, and the protrusion is provided on the entire periphery. Such a light emitting device 100 can increase the luminous flux of the emitted light by using the light emitting surface 90 of the light emitting device as a relatively large light emitting window than the emitting surface of the element. The light guide member 30 extends from the joining region 31 described above, and covers the protruding surface of the light transmitting member and the side surface hanging from a part of the side surface of the light emitting element 10. Specifically, this region is provided in a region protruding outward from the joining region. Here, since the emitted light from the light emitting element 10 is usually radiated not only from the emitting surface but also from the side surface and the bottom surface side (mounting surface side), a part of the light is mainly emitted from the side surface of the light emitting element. Is incident on the light-guiding area 32 and guided. That is, as in the case of the junction region described above, also in the first covering region 32, the difference in the refractive index of the emission surface of the light emitting element can be relaxed, and the light extraction efficiency can be increased. Here, the outer surface facing the coating member 40 side of the first covering region 32, that is, the outer surface facing the side surface of the light emitting element 10 of the first covering region 32, transmits the light emitted from the light emitting element 10. The first reflecting surface 33 is reflected on the member 20 side, and thus the reflected light of the emitted light is reflected and guided by the first reflecting surface 33 to the light receiving surface 22 side of the light transmitting member 20. The light transmission member 20 is optically coupled. In this way, the light emitted from the light emitting element 10 to the side is once taken out into the light guide member 30 and then reflected by the first reflecting surface 33, so that it is exposed from the light guide member and reflects the light emitting element 10. Light loss due to absorption in the light emitting element 10 can be reduced as compared with a form directly covered by the conductive covering member 40, and light is once propagated and spread in the light guide member. The light emission characteristics can be improved.

  As described above, the first reflecting surface 33 of the light guide member 30 is provided at the interface with the covering member 40 as shown in FIG. 1 and FIG. In addition, since the interface is composed of the translucent light guide member 30 and the covering member 40 containing a light reflective material in the translucent base material, Become. Such a configuration is a structure that can be easily formed by filling the covering member 40 after forming the first covering region 32 on the light guide member 30 and is excellent in mass productivity. The first reflecting surface 33 is not necessarily provided at the interface with the covering member 40. For example, the outer surface of the first covering region 32 facing the covering member 40 and the covering member 40 are separated from each other, a gap is provided therebetween, and the first reflecting surface 33 is an interface between the light guide member 30 and air. The form provided in may be sufficient. According to this form, the light guide member 30 side has a high refractive index at this interface, and a large amount of light can be reflected in the first covering region 32. Further, the light component transmitted from the first covering region 32 into the gap can be reflected again on the surface of the covering member 40. In addition to this form, for example, a layer made of a highly reflective metal film such as silver (Ag) or aluminum (Al), a dielectric multilayer film, or translucent particles is provided on the outer surface of the first covering region 32. The first reflecting surface 33 may be formed.

  In the light emitting device 100, the surface of the first covering region 32 that faces the side surface of the light emitting element 10 is preferably an inclined surface that is inclined from the side surface toward the light receiving surface 22 of the light transmitting member. Thereby, the light emitted from the light emitting element 10 to the side can be favorably reflected to the light receiving surface 22 side of the light transmitting member, and the cross-sectional width is widened toward the protruding surface, so that the optical coupling is good. it can. Further, the inclined surface may be a flat surface, but by being a convex curved surface that is convex toward the bonding region 31, the surface area of the first reflecting surface 33 can be increased as compared with the case of being a flat surface. This is preferable because the reflection efficiency can be increased.

  The method for forming the first covering region 32 is not particularly limited. For example, the first covering region 32 is formed by mounting the light transmitting member 20 after applying an appropriate amount of the resin material constituting the light guide member 30 on the emission surface of the light emitting element 10. can do. At this time, the light transmitting member 20 may be pressed appropriately. The resin can be applied by a dispensing method, a stamping method, or the like, and the light transmitting member 20 can be placed in a mass production with a die bonding apparatus having a collet capable of adsorbing, transporting and pressing the light transmitting member 20.

  Note that the resin material constituting the light guide member 30 may drip directly from the protruding portion of the light emitting element 10 or the light transmitting member 20 or along the side surface of the light emitting element 10 and reach the mounting substrate 50. FIG. 3 is a schematic cross-sectional view for explaining a mode in which a hanging portion is provided on such a light guide member 36. As shown in FIG. 3, in this embodiment compared with the present invention, when the adhesive resin of the light guide member 36 hangs down continuously onto the mounting substrate 50 along the side surface of the light emitting element 10, light is emitted at the hanging portion. A path is formed. For this reason, the light emitted from the light emitting element 10 to the side or below is guided to the mounting substrate 50 side by this hanging portion, reaches the surface of the mounting substrate 50 and the wiring 51, and reduces the light loss due to absorption. Arise. In addition, the formation of the drooping portion may block the formation of the underfill 70 or the like in the region between the light emitting element 10 and the substrate 50 and the intrusion of the covering member 40. Light loss occurs. In particular, when the application amount of the resin material is too large, the light guide member 36 hangs directly on the substrate 50 from the protruding portion of the light transmitting member 20, or the light emitting element 10 and the substrate 50 are cross-linked by being separated from the bonding region. Even so, an optical path is formed in the same manner as described above, and there is a risk of causing optical loss. Further, in the third embodiment to be described later, a hanging portion that covers the side surface and reaches the mounting board similarly, although it is a structure that is difficult to be formed as compared with the case where the light transmitting member protrudes as in the present embodiment. Can be provided. Therefore, it adjusts suitably so that the application quantity of a resin material may not become excessive, and it adjusts with the area of a protrusion surface, and the position of a protrusion part so that it may mention later.

  Therefore, it is preferable that the outer surface of the first covering region 32 is located closer to the light transmission member 20 than the bottom surface and the mounting surface of the light emitting element 10, and the range covered by the first covering region 32 is light emission. It is preferable to be halfway along the side surface of the element 10. That is, as shown in FIGS. 1 and 2, on the side surface of the light emitting element 10, the region (first covering region 32) covered with the light emitting member on the emission surface (upper) side, the bottom surface, and the mounting surface It is desirable that a region exposed on the (lower) side is provided. Furthermore, the exposed region is preferably covered with the covering member 40. More specifically, when the light emitting element 10 includes the semiconductor layer 11 having an element structure and the substrate 1 on the emission surface side from the semiconductor layer, the light guide member 30 extends to the side surface of the substrate to cover the substrate, The side surface of the semiconductor layer 11 is preferably exposed. Thereby, while improving the light reflectivity by the side of the semiconductor layer 11 containing a light emitting layer, the light transmittance by the side of a board | substrate can be improved. The first covering region 32 may be formed to extend uniformly from the bonding region 31 to the side surface of the light emitting element 10, but discretely and partially from the bonding region 31 to the side surface of the light emitting element 10. It may be formed by drooping.

  Such a form is easily achieved by subjecting the region to be exposed from the light guide member 30 to a surface treatment such as applying a release agent in advance so that the region is not easily covered with the light guide member 30 or the like. A commercially available product can be used as the mold release agent, and for example, a fluorine-type mold release agent such as a spray-type die-free or a chemical liquid-type optool manufactured by Daikin can be used. In particular, the surface opposite to the emission surface of the light emitting element 10 and the mounting surface are preferably surface-treated, and further, a part of the side surface continuous from the surface, particularly the side surface of the semiconductor layer 11, that is, the exposure of the semiconductor layer 11. The surface is preferably surface-treated. Further, the surface treatment and the covering member 40 do not have to coincide with each other, and may partially overlap or be separated.

  On the other hand, in the light emitting device 100 of the example shown in FIGS. 1 and 2, the side surface of the light transmitting member 20 is preferably exposed from the light guide member 30 and further covered with a light reflective coating member 40. Thus, compared to the case where the light guide member 30 also covers the side surface of the light transmissive member 20, the outward bulge of the outer surface of the light guide member 30 can be suppressed, and thus the optical path length to the light transmissive member 20 is shortened. It is possible to increase the optical coupling efficiency. Further, as described above, it is preferable because the first reflection surface 33 having a shape and an inclination angle suitable for light reflection toward the light receiving surface 22 side can be easily formed.

  Next, each component and structure of the light emitting device of the present invention will be described in detail below.

(Light emitting element)
The light-emitting element 10 can be a known element, specifically a semiconductor light-emitting element, and is particularly preferably a GaN-based compound semiconductor because it can emit visible light and ultraviolet light having a short wavelength that can excite a fluorescent substance efficiently. . A specific emission peak wavelength is 240 nm or more and 560 nm or less, preferably 380 nm or more and 470 nm or less. In addition, a light emitting element of ZnSe, InGaAs, or AlInGaP semiconductor may be used.

(Light emitting element structure)
The light emitting element structure 11 by the semiconductor layer is composed of at least a first conductivity type (n-type) layer 2 and a second conductivity type (p-type) layer 3 as illustrated in FIG. The structure which has is preferable. The electrode structure is preferably the same surface side electrode structure in which both the first conductivity type (negative) and the second conductivity type (positive) electrodes 6 and 7 are provided on one main surface side. A counter electrode structure in which electrodes are provided to face each other may be used. As for the mounting form of the light emitting element 10, for example, in the same surface side electrode structure, flip chip mounting in which the electrode forming surface is the mounting surface and the substrate 1 side facing it is the main emitting surface is the emitting surface and the light transmitting member. 20 is preferable in terms of optical connection. In addition to this, the electrode forming surface side is the main emission surface, and the light transmission member is mounted on it, face-up mounting, flip chip mounting on the light transmission member with wiring structure, and light transmission with the above-mentioned counter electrode structure It is possible to connect the member and the mounting substrate, and it is preferable to mount the embodiment in which the light emitting element and the light transmitting member are not provided with wiring and electrodes. Note that the growth substrate 1 of the semiconductor layer 11 may be removed when the light emitting element structure is not formed, and a support substrate such as a conductive substrate or another translucent member is added to the semiconductor layer from which the growth substrate has been removed. -It is also possible to have a structure in which substrates are bonded. The light transmitting member 20 can also be used for the supporting substrate, and other elements having a structure in which the semiconductor layer is bonded and covered with a light transmitting member such as glass or resin may be used. The removal of the growth substrate can be performed by peeling, polishing, or LLO (Laser Lift Off), for example, by mounting or holding on a support, an apparatus, or a submount. In addition, the light emitting element 10 can have a light reflecting structure. Specifically, of the two main surfaces of the semiconductor layer 11 facing each other, the other main surface facing the light extraction side (emission surface side) is formed. The light reflection side (the lower side in FIG. 1) can be provided, and a light reflection structure can be provided in the semiconductor layer on this light reflection side or in an electrode. As an example of the light reflecting structure, a structure in which a multilayer reflective layer is provided in the semiconductor layer, or an electrode having a highly light reflective metal film such as Ag or Al or a dielectric multilayer film, or a reflective layer is provided on the semiconductor layer. There is a structure.

(Nitride semiconductor light emitting device)
As an example of the light emitting element 10, in the nitride semiconductor light emitting element 10 of FIG. 4, an n-type semiconductor layer that is the first nitride semiconductor layer 2 and the active layer 3 are formed on the C-plane sapphire substrate that is the growth substrate 1. The light emitting layer and the p-type semiconductor layer which is the second nitride semiconductor layer 4 are epitaxially grown in this order. Then, a part of the n-type layer 2 is exposed to form an n-type pad electrode, which is the first electrode 7, and a light-transmitting conductive layer 5 such as ITO is formed on almost the entire surface of the p-type layer 4. 6, a p-type pad electrode is formed. Further, the protective film 8 is provided by exposing the surfaces of the n-type and p-type pad electrodes 6 and 7 and covering the semiconductor layer. Note that the n-type pad electrode 7 may be formed through a light-transmitting conductive layer as in the p-type. The growth substrate 1 includes C-plane sapphire, R-plane and A-plane, an insulating substrate such as spinel (MgAl ₂ O ₄ ), silicon carbide (6H, 4H, 3C), Si, ZnS, ZnO, GaAs. There are semiconductor conductive substrates such as GaN and AlN. As an example of a nitride semiconductor, in addition to In _x Al _y Ga _1-xy N (0 ≦ x, 0 ≦ y, x + y ≦ 1), B, P, and As may be mixed crystals. . The n-type and p-type semiconductor layers 2 and 4 are not particularly limited to a single layer or multiple layers, and the active layer 3 preferably has a single (SQW) or multiple quantum well structure (MQW). As an example of the blue light emitting element structure 11, an n-type semiconductor layer such as Si-doped GaN is formed on a sapphire substrate via a nitride semiconductor underlayer such as a buffer layer, for example, a low-temperature growth thin film GaN and a GaN layer. N-type contact layer and GaN / InGaN n-type multilayer film layer, followed by InGaN / GaN MQW active layer, and p-type semiconductor layer, for example, Mg-doped InGaN / AlGaN p-type multilayer film layer And a p-type contact layer of Mg-doped GaN.

(Light transmission member)
The light emitting device 100 of FIG. 1 includes a light transmitting member 20 that transmits light from the light emitting element 10. The light transmission member 20 is preferably a light conversion member having a wavelength conversion material capable of converting the wavelength of at least part of the light passing therethrough. For example, as in the embodiment, the primary light from the light source excites the phosphor as the wavelength conversion material in the light transmitting member 20 to obtain secondary light having a wavelength different from that of the primary light. Outgoing light having a desired hue can be realized by color mixing with light.

  As described above, the light transmissive member 20 according to the first embodiment includes the light emitting element 10 in a plan view from the surface 21 (light emitting surface 90), and the side surface is outward from the side surface (end surface) of the light emitting element 10. The light receiving surface 22 is wider than the light emitting surface of the light emitting element 10 and is optically connected through the light guide member, so that there is little loss. The protruding length of the side surface of the light transmitting member with respect to the side surface of the light emitting element is, for example, not less than 0.25 times and not more than 5 times the thickness of the light emitting element, specifically 0.5 times or more and 2 times. Is less than double. As an example, in the light emitting device of Example 1, the light transmitting member 20 protrudes to the end with a width of about 50 μm. In addition, as shown in a third embodiment to be described later, the side surface of the light transmitting member may be positioned on the inner side of the side surface of the light emitting element, that is, the light emitting element may protrude from the emission surface. The light receiving surface 22 of the light transmitting member may be smaller than the light emitting surface of the light emitting element 10. If it is this form, the protrusion length is 0.25 times or more and 5 times or less, for example, compared with the thickness of the light transmissive member, specifically, 0.5 times or more and 2 times or less. By narrowing the light emitting region with respect to the light emitting element, the luminance is relatively increased, the color mixture is made uniform, and the color unevenness is reduced. Further, if the side surface of the light transmitting member 20 is located on the same plane as the side surface of the light emitting element 10, the amount of light from the light emitting element 10 is insufficient at the outer edge portion of the light transmitting member, resulting in color unevenness. It can suppress becoming easy.

  Here, as a translucent material used as a base material of the light transmissive member 20, the material similar to the following coating member 40 can be used, for example, inorganic substances, such as resin or glass, can be used. Even when the conversion function is not provided, it is preferable to use the same material as the light transmission member for light conversion, excluding or replacing the phosphor. Further, when the light transmitting member is plate-like as in the embodiment, both the front surface 21 and the light receiving surface 22 are substantially flat surfaces, and furthermore, both opposing surfaces are substantially parallel to each other. The efficiency of optical coupling through the light guide member of the present invention is increased, and joining is facilitated, which is preferable. On the other hand, it is not limited to a plate shape, but various shapes or forms such as a shape having a curved surface in whole or in part, a surface shape such as an uneven surface, for example, a shape for condensing and dispersing, for example, a lens shape, etc. Such an optical shape can also be used. Further, as a wavelength conversion function, in addition to emitting primary light of the light emitting element and mixed light of the converted light (secondary light), for example, converted light by ultraviolet light of the light emitting element or mixed light by a plurality of converted lights In addition, a light-emitting device that mainly emits secondary light converted from primary light can be used.

The light transmissive member 20 having the wavelength conversion function is specifically a glass plate, a material provided with the light conversion member, or a phosphor crystal of the light conversion member or a single crystal, a polycrystal, or an amorphous material having a phase thereof. Sintered body, aggregate, porous material, and translucent material such as translucent resin, impregnated with ceramic body or phosphor crystal particles and appropriately added translucent material Or a translucent member containing phosphor particles, such as a molded body of translucent resin. In addition, it is preferable from a heat resistant viewpoint that the light transmissive member 20 is comprised with an inorganic material rather than organic materials, such as resin. Specifically, it is preferably made of a translucent inorganic material containing a phosphor, and in particular, a sintered body of a phosphor and an inorganic substance (binding material, binder), or a sintered body or crystal made of a phosphor. This increases reliability. In addition, when using the YAG phosphor of the example, in addition to YAG single crystals and high-purity sintered bodies, YAG / alumina sintered bodies using alumina (Al ₂ O ₃ ) as a binder, and glass are bonded. A sintered body as a material is preferable from the viewpoint of reliability. Further, by forming the light transmitting member 20 in a plate shape, the coupling efficiency with the emission surface of the light emitting element 10 configured in a planar shape is good, and the light transmitting member 20 can be easily positioned so as to be substantially parallel to the main surface of the light transmitting member 20. Can be combined. In addition, by making the thickness of the light transmissive member 20 substantially constant, the wavelength conversion amount of the light passing therethrough can be made substantially uniform, the ratio of color mixing can be stabilized, and color unevenness at the site of the light emitting surface 90 can be suppressed. Therefore, in the case where a plurality of light emitting elements 10 are mounted on one light transmitting member 20, there is little unevenness in luminance and chromaticity distribution in the light emitting surface 90 due to the arrangement of the individual light emitting elements 10, and it is substantially uniform and high. Luminous light emission can be obtained. Note that the thickness of the light transmitting member 20 having a wavelength conversion function is preferably 10 μm or more and 500 μm or less, and more preferably 50 μm or more and 300 μm or less, in terms of light emission efficiency and chromaticity adjustment.

The wavelength conversion member can be suitably combined with a blue light emitting element to emit white light. As a typical phosphor used for the wavelength conversion member, a YAG phosphor (yttrium, aluminum, garnet) and LAG-based phosphor (lutetium aluminum garnet) can be mentioned, in particular, at the time of high luminance and long-term use _{(Re 1-x Sm x)} 3 (Al 1-y Ga y) 5 O 12 : Ce (0 ≦ x <1, 0 ≦ y ≦ 1, where Re is at least one element selected from the group consisting of Y, Gd, La, and Lu). In addition, phosphor including at least one selected from the group consisting of YAG, LAG, BAM, BAM: Mn, (Zn, Cd) Zn: Cu, CCA, SCA, SCESN, SESN, CESN, CASBN and CaAlSiN ₃ : Eu Can be used. In addition to the light transmissive member, the wavelength conversion member can also be provided, for example, between the light transmissive member and the light emitting element, and between the light emitting element and the covering member in the coupling member. Similarly, the light transmitting member, the wavelength converting member, and the sintered body can be disposed in the light emitting device. It is also possible to increase the reddish component using a nitride-based phosphor having yellow to red light emission, and to realize illumination with high average color rendering index Ra, light bulb color LED, and the like. Specifically, by adjusting the amount of phosphors having different chromaticity points on the CIE chromaticity diagram according to the light emission wavelength of the light emitting device, the phosphors are connected with each other on the chromaticity diagram. Any point can be made to emit light. In addition, nitride phosphors, oxynitride phosphors, and silicate phosphors that convert near-ultraviolet to visible light into a yellow to red region can be used. For example, L ₂ SiO ₄ : Eu (L is an alkaline earth metal), particularly (Sr _x Mae _1-x ) ₂ SiO ₄ : Eu (Mae is an alkaline earth metal such as Ca and Ba), and the like. Examples of nitride phosphors and oxynitride (oxynitride) phosphors include Sr—Ca—Si—N: Eu, Ca—Si—N: Eu, Sr—Si—N: Eu, and Sr—Ca—Si. —O—N: Eu, Ca—Si—O—N: Eu, Sr—Si—O—N: Eu, and the like. As the alkaline earth silicon nitride phosphor, the general formula LSi ₂ O ₂ N ₂ : Eu , general formula _{L x Si y N (2 /} 3x + 4 / 3y): Eu or _{L x Si y O z N (} 2 / 3x + 4 / 3y-2 / 3z): Eu (L is, Sr, Ca, Sr, and Ca Any).

(Coating member)
As shown in FIG. 1, the covering member 40 covers a part of the light transmitting member 20, and specifically covers at least a part of the side surface of the light transmitting member 20. In the present invention, since the covering member is suspended from the element or the like to prevent the formation of a light leakage path, it is preferable that the reflectance of the covering member is higher than that of the substrate and the wiring provided thereon. The covering member 40 containing the light reflecting material is preferably a translucent resin material for the base material, and preferably uses a silicone resin composition, a modified silicone resin composition, etc., an epoxy resin composition, An insulating resin composition having translucency such as a modified epoxy resin composition and an acrylic resin composition can be used. A covering member having excellent weather resistance, such as a hybrid resin containing at least one of these resins, can also be used. Furthermore, inorganic materials having excellent light resistance such as glass and silica gel can be used. Further, by molding a resin material, it can be molded into a desired shape and a desired region can be covered. In the present invention, the surface of the light emitting element, the light guide member, and the light transmitting member of the light source section, particularly the side surfaces thereof are covered. Can be formed. In addition, the surface on the light emitting surface side can also have a desired shape, and can be a concave or convex curved surface in addition to a flat surface shape as illustrated. In the first embodiment, a silicone resin is used as a covering member from the viewpoint of heat resistance and weather resistance.

The covering member 40 includes at least one light reflective material 45 in the base material. By including the light reflective material 45, the reflectance of the covering member 40 is increased, and more preferably, when a low-absorbing particle is used, light absorption and loss are reduced, and the covering member having light scattering properties it can. The light reflective material 45 contained in the covering member 40 is one oxide selected from the group consisting of Ti, Zr, Nb, Al, and Si, or at least one of AlN and MgF. Is at least one selected from the group consisting of TiO ₂ , ZrO ₂ , Nb ₂ O ₅ , Al ₂ O ₃ , MgF, AlN, and SiO ₂ . Since the light-reflective material particles are one kind of oxide selected from the group consisting of Ti, Zr, Nb, and Al, the material can be made highly reflective and low-absorbent. The difference in refractive index with the functional resin is increased, which is preferable. The covering member 40 can also be constituted by a molded body made of the light reflecting material, specifically, a porous material such as an aggregate obtained by agglomerating the particles or a sintered body, In addition, a molded body by a sol-gel method may be used, which is preferable because the difference in refractive index between the light reflecting material and the air in the porous body can be increased, and the light reflecting property can be increased. . On the other hand, compared with a covering member provided with a base material such as the resin, it can be molded into a desired shape and controllability of the covering region is good, and sealing performance and airtightness can be improved. Then, it is preferable to use a covering member provided with the base material. Also, considering the characteristics of both covering members, a composite molded body of both can be formed. For example, the outer surface side of the porous molded body is impregnated with resin, and the inner surface side of the light emitting element side is porous. The structure can be made. As described above, the covering member or the surrounding body may be configured such that the inner region communicates with the outside or is gas permeable and at least does not leak light.

  In the covering member 40 containing the light reflective material 45 in the base material described above, the depth at which light leaks differs depending on the concentration and density of the covering member 40. Therefore, the concentration and density are appropriately set according to the shape and size of the light emitting device. Adjust it. For example, when the thickness is reduced with a relatively small light emitting device, it is preferable to provide the light-reflecting material 45 with a high concentration. On the other hand, in the manufacturing process such as the preparation of the covering member 40 containing the light reflecting material 45, the application of the raw material, and the molding, the concentration is adjusted so as to be suitable for it. The same applies to the porous body. As an example, in the case of the embodiment, it is preferable that the concentration of the light-reflecting material 45 is 20 weight percent (wt%) or more, and the thickness is 20 μm or more. The emitted light with high directivity can be obtained, and the underfill can be easily formed by the covering member with an appropriate viscosity. Moreover, if the density | concentration of a light reflective material is made high, the thermal diffusibility of a coating | coated member can be improved.

  The covering member forming region is provided with a covering member 40 on at least the side surface of the light transmitting member 20, preferably also covering the side surface of the light emitting element, and more preferably, the light emitting surface is exposed in the light source unit including the light transmitting member and the light emitting element. The same applies to the case where the other is covered and the light guide member 30 is interposed. As a result, it is possible to avoid light leaking from the side surface of the light transmitting member, and when having a relatively high intensity light from the side surface, and having a light conversion member, light having a color difference is suppressed and The directivity can be improved, and luminance unevenness and color unevenness can be reduced. Moreover, the directivity and the brightness can be improved by covering the side surfaces of the respective members and elements and restricting them to the light extraction direction side. In addition, when the light transmitting member 20 contains a wavelength conversion material, the heat generation of the wavelength conversion material is particularly significant, which can be improved. If the side surface of the light transmitting member 20 is covered with the covering member 40 and the surface 21 is exposed, the outer surface shape is not particularly limited, and the exposed surface is more than the surface 21 of the light transmitting member as shown in FIG. A recessed structure may be used. By projecting the light emitting surface 90, light shielding by the covering member 40 can be avoided, and substantially the same surface may be used, and a desired surface can be obtained. In the first embodiment, the covering member 40 also covers a part of the light receiving surface 22, and as shown in the drawing, the periphery of the light emitting element 10 is specifically opposed to the light emitting element 10 on the light receiving surface 22 of the light transmitting member. The area except for is covered. With this configuration, as shown in FIG. 2, the light receiving surface 22 is provided with an optical connection region (joining region 31) and a covering region covered through the light guide member (covering regions 32 and 33). . Further, in the covering region, the light traveling toward the light receiving surface 22 side of the light transmitting member is reflected toward the light extraction side, and the light loss of the primary light due to light absorption or the like at the substrate 50 can be suppressed. As shown in FIGS. 5 and 8, when a plurality of light emitting elements 10 are joined to one light transmitting member 20, the covering member 40 is also filled between the light emitting elements (second covering region 34). It is preferable to cover the separated area of the light receiving surface 22. With respect to the heat of the light conversion member in the joining region, this configuration can enhance the heat dissipation property of the separation region, which is also preferable in the protruding portion of the light transmission member and the first covering region 32 as described above.

(Additive components)
In addition to the light-reflective material 45 and the light conversion member, a viscosity extender or the like can be appropriately added to the covering member 40, whereby a desired emission color, color of these members or the surface of the device, for example, high contrast Thus, a light emitting device having a desired directional characteristic such as black for conversion to black can be obtained. Similarly, various colorants can be added as filter materials for cutting unnecessary wavelengths. The same applies to other members, and light transmissive materials such as a light guide member, a sealing member, and a light transmissive member.

(Light guide member)
The light guide member 30 is used as an adhesive that is interposed between the light emitting element 10 and the light transmitting member 20 and fixes both members. The light guide member is preferably made of a material having translucency so that the light emitted from the light emitting element 10 can be guided to the light transmissive member side and both the members can be optically coupled. Examples of the material include resin materials used for the above-described members, and a translucent thermosetting resin such as a silicone resin or an epoxy resin is preferable. A silicone resin is preferable because it is excellent in heat resistance and light resistance. In addition, it is preferable to use a silicone resin because the effect of the fluorine-based mold release agent is high. Furthermore, if it is a dimethyl-type silicone resin, it is excellent in reliability, such as high temperature tolerance, and if it is a phenyl-type silicone resin, the refractive index can be made high and the extraction efficiency of the light from the light emitting element 10 can be improved.

(Mounting board 50)
On the other hand, in the light-emitting device 100 of FIG. 1, the substrate 50 on which the light-emitting element 10 is mounted can use a substrate at least having a wiring 51 connected to the electrode of the element, and an external connection wiring 52. Etc. may be provided. The substrate material is, for example, aluminum nitride (AlN), single crystal, polycrystal, sintered substrate, other materials such as ceramics such as alumina, glass, semi-metal or metal substrates such as Si, and laminates thereof. Bodies and composites can be used, and metallic and ceramic materials are preferred because of their high heat dissipation. Note that the substrate 50 may not have wiring. For example, in the form in which the growth substrate side is mounted with the element of FIG. 4 and the electrode of the element is wire-connected to the electrode of the apparatus, or the light-transmitting member is provided with wiring. But you can. Moreover, the form which covers the outer side surface of the mounting board | substrate 50 other than the form in which the coating | coated member 40 is provided on the mounting board | substrate 50 like the light-emitting device to show in figure may be sufficient. Further, it is preferable that at least the surface of the mounting substrate 50 is made of a highly reflective material. As shown in FIGS. 1 and 2, the light emitting element 10 is bonded onto the wiring 51 by a conductive adhesive 60 and is electrically connected to the outside. As the conductive adhesive 60, solder, Ag paste, Au bump, or the like can be used.

(Frame body, laminated substrate, base material)
The light emitting device 100 shown in FIG. 1 has a frame 55 and is a holding member for the covering member 40. The frame body 55 can be formed of ceramic, resin, or the like. Alumina having high light reflectivity is preferable, but not limited to this as long as a reflective film is formed on the surface. If it is resin, besides using screen printing or the like, the molded body may be bonded to the mounting substrate. Further, it is preferable to increase the reflectance by using a light reflective material as in the covering member 40. Moreover, you may color a frame according to the objective like the said addition member. In addition, this frame can also be removed after filling or forming the covering member. Further, the frame body may be formed integrally with the mounting substrate of the light emitting element, such as a laminated substrate 56, a base of a device base having a cavity structure, or the like.

(Method for manufacturing light emitting device)
An example of a method for manufacturing the light emitting device 100 shown in FIG. 1 will be described below. First, bumps 60 are formed on the mounting substrate 50 or on the light emitting element 10 and are flip-chip mounted. In this example, one LED chip is mounted side by side in a region corresponding to one light emitting device on the substrate 50 before separation. Next, the light guide member 30 is applied to the light emission surface side of the light emitting element 10 (the back surface of the sapphire substrate or the nitride semiconductor exposed surface if the substrate is removed by LLO), and the light transmitting member 20 is laminated. The resin 30 is thermoset and bonded. Next, a resin constituting the covering member 40 is potted by a dispenser (liquid metering discharge device) or the like so as to cover the side surface of the light transmitting member 20 in the frame 55 standing around the light emitting element 10. To do. The dropped resin 40 scoops up and covers the side surfaces of the light emitting element 10 and the light transmitting member 20 by surface tension, and forms an inclined surface that becomes lower from the surface 21 toward the frame body 55. Further, the exposed surface of the resin 40 may be flattened so as to be substantially flush with the surface 21. Then, after the resin 40 is cured, dicing is performed at a predetermined position, and the light emitting device 100 is obtained by cutting into a desired size.

(Embodiment 2)
FIG. 5A is a schematic cross-sectional view of the light-emitting device 200 according to Embodiment 2 of the present invention, and FIG. 5B is a schematic cross-sectional view for explaining the periphery of the light source unit. In the light emitting device 200, the configuration other than the number of the light emitting elements 10 and the structure of the light guide member 30 is substantially the same as that of the above-described first embodiment, and therefore the same configuration is denoted by the same reference numeral. The description will be omitted as appropriate.

  In the light emitting device of the present invention, the number of light emitting elements 10 bonded to one light transmitting member 20 is not particularly limited. By using a plurality of light-emitting elements 10 relative to the single element of Embodiment 1, a plurality of light-emitting elements are used in accordance with the size and shape of the light-transmitting member and the light-emitting surface, and to obtain desired light-emitting characteristics. It can be arranged appropriately and can be driven individually, which is preferable because a light emitting surface having a desired shape and light emission characteristics can be obtained. When a plurality of light emitting elements 10 are mounted, the light emitting elements 10 are provided at an appropriate distance from each other, and the distance is appropriately determined in consideration of the light distribution characteristics of the light emitting device, heat dissipation, and the mounting accuracy of the light emitting elements. For example, it is within 10% of the dimension of the light emitting element. In addition, the plurality of light emitting elements 10 may be coupled to each other. In the present embodiment, the two are arranged in a line, but the present invention is not limited to this, and various arrangements such as a lattice arrangement, regular, irregular, etc. are possible, and preferably each element. It is preferable to arrange the intervals at substantially equal intervals to reduce the intensity distribution.

  In the light emitting device 200, a plurality of (two in the drawing) light emitting elements 10 are mounted on the mounting substrate 50 so as to be separated from each other, and light having a light receiving surface 22 having a size including the plurality of light emitting elements 10. The transmission member 20 is joined to the light transmission member 20 via the light guide member 30. In this light emitting device 200, the frame body is a base body 56 having a cavity structure laminated on the substrate 50, and is electrically connected to the wiring layer 51 for the mounting element on the upper surface side, and external connection A wiring layer 52 is also provided on the lower surface side of the substrate 56.

  In such a light emitting device 200, the bonding regions 31 are provided in regions facing the light receiving surface 22 of the light transmitting member and the light emitting surface of each light emitting element 10. The first covering region 32 described above is a light emitting element 10 disposed outside the light receiving surface among the plurality of light emitting elements, and is provided on a side surface facing the outside, and the periphery of the light receiving surface 22. The first reflection surface 33 is provided on the outer surface of the light-emitting element 10 so that the light emitted from the light-emitting element 10 is reflected to the light-receiving surface 22 side of the light transmission member and guided. be able to. In this example, although not shown, a plurality of light emitting elements are arranged at one end portion of the light receiving surface, and a first covering region and a first reflecting surface are provided on the side surface on the end portion side. May be separated for each element. Preferably, the first covering region and the first reflecting surface are joined together, and are arranged close to each other so that they are formed. At this time, it may be a first covering region provided with a recess between the elements.

  Further, when a plurality of light emitting elements 10 are bonded to the light receiving surface 22 side of one light transmitting member 20, the light guide member 30 also hangs down in a separated region sandwiched between adjacent light emitting elements, that is, adjacent light emission. A second covering region 34 that extends from the bonding region 31 and covers a part of the side surfaces of the element 10 facing each other and a part of the light receiving surface 22 sandwiched between the elements is provided. The second covering region 34 is usually provided so as to connect the mutually facing side surfaces of the adjacent light emitting elements 10. Further, the outer surface of the second covering region 34 is also positioned on the light transmitting member 20 side from the mounting surface of the light emitting element 10, that is, the light guide member is separated from the mounting substrate, whereby the substrate 50. Can be prevented from being absorbed by leaking light. A second reflecting surface 35 that reflects the light emitted from the light emitting element 10 toward the light receiving surface 22 is provided on the outer surface of the second covering region 34. As described above, in the light emitting device in which the plurality of light emitting elements 10 are mounted on the light receiving surface 22 of one light transmitting member 20, the second reflecting surface 35 of the light guide member 30 laterally extends from the plurality of light emitting elements 10. The light emitted to the separated region can be taken out well, reflected to the light receiving surface 22 side of the light transmitting member, and optically coupled to the light transmitting member 20. Also, the second reflecting surface 35 preferably has an inclined surface similar to the first reflecting surface in the light emitting device 100 of the first embodiment. In particular, as shown in the figure, it is preferable that one convex curved surface is provided between the elements because the outgoing light from each element is preferably reflected in the separated region and can be mixed with each other.

  In addition, it is preferable that the 2nd reflective surface 35 is provided in the distance from the light-receiving surface 22 of a light transmissive member far from each output surface in the light emitting element 10. FIG. As a result, as shown in FIG. 8 (Embodiment 5), when the reflecting surface 35 or the protruding end of the convex curved surface is provided closer to the light receiving surface than the light emitting surface, it is provided between the light emitting surface and the light receiving surface. In comparison, the light emitted from each light-emitting element 10 can be diffused and guided extensively, and the reduction of the luminous flux in the separated region can be reduced. Therefore, the luminance unevenness caused by the arrangement of each light-emitting element 10 and its light distribution is reduced. Further, the chromaticity unevenness can be reduced, and the luminance in the light emitting surface can be made uniform. On the other hand, in the former case as shown in FIG. 8, the light emitting elements are easily separated and the luminance unevenness is increased, but the light extraction efficiency can be increased, which is preferable.

  In addition, at least one set of the plurality of light emitting elements 10 has different emission surface heights due to mounting misalignment or the like, and the distance from the emission surface of each light emitting element to the light receiving surface 22 of the light transmitting member is different from each other. A light guide member may be interposed. Thereby, light incidence from one light emitting element 10 to the adjacent light emitting element 10 can be reduced, and loss of light flux due to light absorption in the light emitting element 10 can be suppressed. Such a form can be adjusted by the thickness of the conductive adhesive 60 that adheres the light emitting element 10 onto the mounting substrate 50.

  Like the first reflective surface, the second reflective surface 35 is preferably provided at the interface between the light guide member 30 and the covering member 40 sandwiched between the adjacent light emitting elements 10. The separation region sandwiched between adjacent light emitting elements often exposes the surface of the substrate without forming a metal film such as wiring on the mounting substrate 50, and is liable to absorb light, so at least the surface of this substrate Is preferably covered with a covering member, more preferably the covering member 40 is filled, and the second reflecting surface 35 is provided at the interface with the covering member 40. Further, as described above, a mode in which a gap is provided between the covering member 40 filled in the separation region and the second reflecting surface 35 may be employed.

(Embodiment 3)
FIG. 6 is a schematic cross-sectional view illustrating the periphery of the light source unit of the light-emitting device according to Embodiment 3 of the present invention. In this light emitting device, the configuration other than the relationship between the size of the light emitting element 10 and the light transmitting member 20 and the structure of the light guide member 30 is the same as that of the above-described first embodiment. Are denoted by the same reference numerals, and description thereof will be omitted as appropriate. In the light emitting device of the example shown in FIG. 6, the light receiving surface 22 of the light transmitting member is smaller than the light emitting surface of the light emitting element 10, and a part of the light emitting surface protrudes outside the light receiving surface 22. In other words, the side surface of the light transmissive member 20 is located inside the side surface of the light emitting element 10. Such a light emitting device can increase the luminance of emitted light by using the light emitting surface 90 of the light emitting device as a relatively small light emitting window. That is, unlike the above-described first and second embodiments, the light guide member extends to the protruding surface of the light emitting element and the side surface of the light transmitting member provided on the inner side of the protruding end, and the region is It is covered.

  In the light emitting device of the present embodiment, the light guide member 30 has a joint region 31 that joins the region of the light emitting element 10 facing the light transmissive member and the light receiving surface 22 of the light transmissive member. In addition, the light guide member 30 includes a first covering region 32 that extends from the joining region 31, climbs to the side surface of the light transmitting member 20, and covers the side surface of the light transmitting member 20. The first covering region 32 that covers the side surface of the light transmitting member 20 reflects and collects the light emitted from the light emitting element 10, particularly reflects the light at the end thereof, and guides it to the light transmitting member 20 side. Can be light. Further, since the outer surface of the first covering region 32 is also located closer to the light transmission member 20 than the mounting surface of the light emitting element 10, light leakage to the mounting substrate 50 can be prevented. Here, the outer surface facing the covering member 40 side of the first covering region 32, that is, the outer surface facing the side surface of the light transmitting member of the first covering region 32, emits light emitted from the light emitting element 10 to the light transmitting member. It has the 1st reflective surface 33 reflected in 20 side. Therefore, the light transmitted to the first covering region 32 is reflected to the light transmitting member 20 side by the first reflecting surface 33, and the reflected light is optically coupled to the light transmitting member 20, so Released to the outside. As described above, by efficiently coupling the light emitted from the light emitting element 10 to the light receiving surface 22 side of the light transmitting member with the light transmitting member, the utilization efficiency of the light emitted from the light emitting element 10 can be improved. it can.

  The first reflecting surface 33 in the light emitting device according to the present embodiment can also have the same interface configuration as the first reflecting surface 33 in the light emitting device 100 according to the first and second embodiments. It is preferably provided at the interface with the covering member 40. Further, the outer surface of the first covering region 32 that faces the side surface of the light transmitting member 20 is an inclined surface that is inclined from the side surface toward the light emitting surface of the light emitting element 10, and the first reflecting surface 33 is also the same. An inclined surface is preferable, which can be favorably reflected toward the light transmitting member 20 side. Furthermore, although this inclined surface may be a flat surface, the surface area of the first reflecting surface 33 can be increased by being a convex curved surface convex toward the bonding region 31 as described above, and the light reflection efficiency is increased. This is preferable.

  On the other hand, in the light emitting device of the example shown in FIG. 6, it is preferable that the side surface of the light emitting element 10 is exposed from the light guide member 30 and is covered with a light reflective coating member 40. As described above, the light guide member 30 covers the side surface of the light emitting element 10 by providing the outer surface of the light guide member 30 so as to connect the emission surface of the light emitting element 10 and the side surface of the light transmitting member 20. Compared to the case, the outward swelling of the outer surface of the light guide member 30 can be suppressed. Therefore, the optical path length to the light transmission member 20 of the light reflected by the outer surface of the light guide member 30 can be shortened, light absorption in the light guide member 30 is reduced, and the light to the light transmission member 20 is reduced. The coupling efficiency can be increased. Moreover, it becomes easy to form the 1st reflective surface 33 which has the shape suitable for the light reflection to the light transmissive member 20 side, and an inclination angle, and the reflective efficiency by the 1st reflective surface 33 can be improved.

(Embodiment 4)
FIG. 7 is a schematic cross-sectional view illustrating the periphery of the light source unit of the light-emitting device according to Embodiment 4 of the present invention. In the example shown in FIG. 7, the configuration of the light guide member 30 and the configuration other than the shape of the surface 21 of the light transmission member are substantially the same as those of the above-described first embodiment. The same reference numerals are given and description thereof is omitted as appropriate. In the light emitting device of the example shown in FIG. 7, the light receiving surface 22 of the light transmitting member is larger than the light emitting surface of the light emitting element 10, and a part of the light receiving surface 22 protrudes outside the light emitting surface of the light emitting element 10. The light guide member 30 has a joining region 31 that joins a region facing the light emitting element of the light receiving surface 22 of the light transmissive member and the emission surface of the light emitting element 10, and extends from the joining region 31. Thus, the light receiving surface 22 of the projecting portion of the light transmitting member 20 is covered, and a third covering region 37 having an outer surface on the light transmitting member 20 side from the mounting surface of the light emitting element 10 is provided. Further, the side surface of the light emitting element 10 and the side surface of the light transmitting member 20 are exposed from the light guide member 30. The outer surface of the third covering region 37 has a third reflecting surface 38 that reflects the light emitted from the light emitting element 10 toward the light receiving surface 22 of the light transmitting member 20. Here, the 3rd covering field and the 3rd reflective surface are one form of the above-mentioned 1st covering field and the 1st reflective surface, respectively.

  The outer surface of the third covering region 37 is preferably an inclined surface inclined from the end of the emission surface of the light emitting element 10 toward the light receiving surface 22 side of the protruding portion of the light transmitting member 20. As a result, the third reflecting surface 38 becomes an inclined surface inclined from the end of the emitting surface of the light emitting element 10 toward the light receiving surface 22 side of the protruding portion of the light transmitting member 20, and from the emitted light of the light emitting element 10 and the light transmitting member. The reflected light and the emitted light can be favorably reflected on the light receiving surface 22 side of the light transmitting member. Further, the inclined surface may be a flat surface, but by being a convex curved surface that is convex toward the bonding region 31, the surface area of the third reflecting surface 38 can be increased as compared with the case of being a flat surface. This is preferable because the reflection efficiency can be increased. The third reflecting surface 38 is preferably provided at the interface with the covering member 40 as with the first reflecting surface 33 of the first embodiment, but is separated from the covering member 40 by a gap. Alternatively, a metal film or a dielectric multilayer film may be provided.

  By joining the light emitting element 10 and the light transmitting member 20 with such a light guide member 30, the light emitting element is compared with the case where the light emitting element 10 and the light transmitting member 20 are joined only by the joining region 31. Ten outgoing lights can be suitably combined, and the luminance and chromaticity distribution in the light emitting surface can be made uniform. Such a light guide function of the light guide member 30 depends on the protruding length of the side surface of the light emitting element 10 with respect to the side surface of the light transmissive member 20, and may be in the above-described range, for example. Such a covering form of the light guide member 30 can be achieved by appropriately adjusting the amount of the light guide member, the protruding width, and the surface area, and a light-emitting element 10 is obtained by applying a release agent over substantially the entire side surface of the light-emitting element 10. This can be achieved by preventing the light guide member 30 from drooping to the side surface. A release agent may be applied also to the side surface of the light transmitting member 20 and can be manufactured with high accuracy. In this example, since the side surface of the light emitting element is exposed, the side surface is not covered as in the first and second embodiments, thereby suppressing re-entry light to the element by the light guide member with respect to return light and converted light. In other words, the contact area between the light guide member and the light emitting element can be minimized to increase the coupling efficiency. Further, in the example shown in FIG. 7, the surface 23 of the light transmitting member is an uneven surface, and the light transmitted through the light transmitting member 20 is scattered by the unevenness to improve the light extraction efficiency from the light transmitting member 20. In addition, luminance unevenness and color unevenness can be reduced and uniform light distribution can be achieved. In particular, it is preferable to mount a plurality of light emitting elements 10 because luminance unevenness and color unevenness due to the light emitting element 10 are reduced. Such unevenness can form a treatment such as polishing, dry etching, wet etching, etc. on the surface of the light transmission member, and can also form an uneven structure with a regular pattern in addition to an irregular uneven structure. Further, such a concavo-convex structure can be provided not only on the surface of the light transmitting member but also on the light receiving surface and further on the surface of each member on the optical path, and in particular, the interface with the light guide member or It may be provided on the surface of a member in contact therewith, for example, the surface of the substrate 1 on the semiconductor layer 11 side, and such a structure is used although not described in detail in the embodiments.

(Modification)
In the first to fourth embodiments described above, the case where either one of the light emitting element and the light transmitting member is mainly included in the other, that is, inside the other is described. However, the light emission in the light emitting device of the present invention is described. The relationship between the element and the light transmission member is not limited to this form, and one of the elements only needs to have at least a part of the protrusion protruding outward from the other. For example, one of the side surfaces constituting the light emitting element, or a part of one side surface protrudes outward from the side surface constituting the light transmitting member, and the other side surfaces are substantially flush with each other, or transmits light. The form may be such that the member protrudes, or vice versa. In such a form, the 1st coating area | region is provided in the one side surface which protruded, or a part of the side surface. Further, in a top view, a form in which protrusions are provided on either side of either the light emitting element or the light transmitting member may be employed. In such a form, at least one of the first covering regions 32 described in the first and second embodiments is provided in the cross section of the region having the protrusions. In addition, when there are a plurality of light emitting elements, the first covering region may be provided in the light emitting element and the light transmission member in each element, and may be mixed. Preferably, it is preferable that one of the first and third embodiments be provided with a first covering region on either one, that is, from the viewpoint of the function of the light guide member. May be mixed. More preferably, the first covering region may be unified in any form with the light emitting element over the entire outer periphery of the light transmitting member. This is because unevenness in luminance and chromaticity in the light emitting surface can be reduced, and it is most preferable that one of the side surfaces of the light emitting element and the light transmitting member is included inside the other.

  As described above, the light guide member in the present invention is provided between the surface of the light emitting element and the light transmitting member, and optically couples both to thereby form a composite light source. The first covering region that extends from the bonding region and covers the bonding region where they face each other, and one protruding surface, or the other end surface provided on the inner side of the protruding surface, Is provided. Specifically, since the light guide member uses a resin material and is also used as an adhesive, as described above, by providing a projecting surface, the light guide member wets and spreads from the joining region to the surface, and from the projecting surface. Furthermore, it may be wetted and spread to the side surface serving as the other end. Thus, since the light guide member utilizes wetness of the resin to each surface at the time of production, specifically before resin curing, first, the amount of the material, the application method, and the protruding surface In addition to controlling the width and area of the protrusion, the spread to other regions can be controlled using a release agent. Therefore, as a specific form of the light guide member, it is preferable that the thickness of the light-guiding member is smaller than that of the light transmitting member and smaller than that of the growth substrate to reduce the composite light source and increase the coupling efficiency. In addition, the protrusion width at that time can be easily controlled at the time of manufacture by setting the thickness of the light emitting element or the light transmitting member to about 0.25 to 5 times, diffusion of light from a suitable element, Condensation is possible. As described above, as shown in the first and third embodiments, when covering the other end from one projecting portion, it is preferable that the end on the projecting portion side is exposed. In comparison, the characteristics of the present invention can be improved by suppressing the spread of the light source, which is preferable. Further, in the case of coating, it is preferable that the thickness is thinner than that of the other end portion because the influence can be reduced and the same effect as a coating member described later can be expected.

  Further, as described above, the covering area of the protruding surface is preferably thinner than the joining area as shown in FIG. 7, but the effect of the present invention can be obtained even if the element side surface is exposed by releasing the mold and exposed. I can expect. As seen in the first and third embodiments, various characteristics are affected by the covering region on the side surface of the element. However, when the translucent substrate 1 made of a different material from the semiconductor layer 11 is provided, the substrate is By covering, it is possible to assist the function of the light guide member as a light propagation region between the light transmitting member and the element, similarly to the light guide member. In particular, in the case of a light conversion member, since the component of the converted light is also included in the region, the chromaticity unevenness and the orientation are effective. Further, in the element from which the substrate 1 has been removed, the light component from the emission surface is much larger than the side surface, so that the element side surface may be exposed. As described above, the presence of the covering member can assist the light confinement function in the composite light source, the light emission from the light emitting surface, and the coupling of the light guiding member, but reflection such as a metal film or a dielectric multilayer film. A membrane can be substituted. In the case of having a light reflecting material as in the embodiment, the light oozes out into the base material, so that the light of the light source spreads more than the inside of the coating, thereby improving the efficiency of light diffusion and light collection. Further, it is preferable because it is suitable for light emission characteristics, luminance unevenness, and directivity, and particularly contributes synergistically to the function of the light guide member. Also in the case of a light conversion member, it is preferable that it contributes favorably to color unevenness and orientation, and the side surface is coated, so that the surface 21 is different from the color and wavelength component ratio, and the side surface is relatively high. It is preferable because emission can be suppressed.

  In addition, the member having the protruding portion of either the light emitting element 10 or the light transmitting members 20 and 24 may have no clear boundary between the surface facing the other member and the side surface continuous from the surface. . For example, in the light emitting device 100 of the first embodiment, the light receiving surface 22 and the side surface of the light transmitting member 20 may be integrated to form a single curved surface, for example, a spherical surface or a part thereof. Further, when the light receiving surface 22 of the light transmitting member and the light emitting surface of the light emitting element 10 are directly bonded by crystal bonding or the like by thermocompression bonding, the protrusion has the first covering region, and has a plurality of light emitting elements. Can also form a light guide member 30 having a second covering region between the elements.

(Embodiment 5)
FIG. 8 is a schematic cross-sectional view of a light emitting device 300 according to Embodiment 5 of the present invention. In the light emitting device 300, components substantially similar to those of Embodiments 1 to 4 described above are denoted by the same reference numerals. The description will be omitted as appropriate. In the example shown in FIG. 8, a surface-emitting light source in which the light emitting element 10 and the light transmitting member 20 are covered with a covering member 40 containing a light reflecting material 45 and the surface 21 of the light transmitting member 20 is a light emitting surface. The sealing member 80 which is formed and covers the light source and further covers a part of the covering member to be a hemispherical optical lens is provided. In the light emitting device 300, a plurality of (two in the drawing) light emitting elements 10 are flip-chip mounted on a wiring pattern 51 on the upper surface side of the mounting substrate 50, and one light transmitting member 20 guides light. The members 30 are joined. In this example, the frame body viewed in the first embodiment has the covering member 40 removed after molding, and the side surface of the covering member 40 is exposed to the outside to constitute the outer surface of the light emitting device. The width of the cross section of the light receiving surface 22 of the light transmitting member is smaller than the distance between the outer side surfaces of the light emitting element 10 located on the outermost side, in other words, smaller than the width of the region where the plurality of light emitting elements are provided. Further, the side surface of the light emitting element 10 located at the outermost portion protrudes outward from the side surface of the light transmitting member 20. And the light guide member 30 has the 2nd coating | covering area | region similar to Embodiment 2, and the 2nd reflective surface 35 in the isolation | separation area | region pinched | interposed between adjacent light emitting elements, The side surface of the light transmissive member 20 The first covering region and the first reflecting surface 33 are the same as those in the third embodiment in the region connecting the light emitting element 10 located on the outermost surface and the projecting portion of the emitting surface.

  According to such a configuration of the light emitting device 300, light emitted from the light emitting element 10 is transmitted through the first and second covering regions of the light guide member 30 and the first and second reflecting surfaces 33 and 35. The light can be efficiently coupled to the member 20 and light can be efficiently extracted from the light transmitting member 20 to the sealing member 80, so that a light-emitting device with higher output can be obtained. Further, the emitted light is exaggerated or changed by the optical lens 80 due to the light distribution characteristics on the surface 21 of the light transmitting member, but the light guide member 30 of the present invention can make the brightness and chromaticity unevenness uniform. Therefore, a light emitting device having excellent light distribution characteristics can be obtained. Further, the sealing member 80 continuously covers a part of the surface 21 of the light transmitting member and the surface of the covering member 40, and reflects the light of the sealing member 80 on the surface of the covering member 40 to the outside. By making the surface of the covering member 40 light-emitting side concave and inclined from the side surface of the light transmitting member 20 to the substrate 50 side, light can be diffused and light emitted from the light-emitting device can be oriented widely. As described above, in the light emitting device of the present invention, an optical member can be bonded to the light transmitting surface of the light emitting surface to obtain desired light emission characteristics.

(Sealing member)
Here, when the refractive index of the sealing member 80 is lower than that of the light transmitting member, the sealing member 80 can be bonded to the surface 21 to improve the light extraction efficiency. The surface on the light emitting side of the sealing member 80 can be formed in various shapes according to the purpose. For example, as shown in FIG. 8, when the light emitting surface has a spherical (hemispherical) lens shape and a convex curved surface, it can be efficiently extracted to the outside with respect to light emission of the light transmitting member. Further, the present invention is not limited to this, and various optical elements and optical members having desired shapes can be used. A concave lens shape, a parabolic curved surface, a convex shape with a flat tip can be formed, and light can be scattered as an uneven surface.

The sealing member 80 is a resin such as an epoxy resin, a silicone resin, a modified silicone resin, a urea resin, a urethane resin, an acrylic resin, a polycarbonate resin, or a polyimide resin, as with the base material and the light guide member of the covering member 30 described above. It can be formed using a material. Further, since the sealing member 80 also serves as a sealing material for protecting the light emitting element 10 and the light transmitting member 20, a material excellent in weather resistance, heat resistance, and hardness is preferable. Among these, an epoxy resin, or A hard silicone resin is preferred. In addition, glass may be used. Furthermore, the phosphor as described above and / or light scattering particles such as TiO ₂ and / or a filler such as quartz glass can be appropriately added to the sealing member 80. The sealing member 80 is formed by compression molding, transfer molding, or the like.

(Embodiment 6)
FIG. 9 is a schematic cross-sectional view of a light-emitting device 400 according to Embodiment 6 of the present invention. Components that are substantially the same as those of Embodiments 1 and 2 described above are denoted by the same reference numerals and description thereof is omitted as appropriate. To do. In the light emitting device 400 of the example shown in FIG. 9, the light emitting element 10 is flip-chip mounted at substantially the center of the bottom of a mounting substrate (package) 56 having a recess. The mounting portion is a part of the mounting base 56, but may be a submount. On the light emitting element 10, a light transmission member 24 is placed and bonded via a light guide member 30. Then, the recess is filled with the sealing member 84, and the recess is closed by the light conversion member 81 having a surface that becomes the light emitting surface 82 of the light emitting device 400. The light transmitting member 24 and the light converting member 81 can be configured in the same manner as in the case where the above light transmitting member and the above light transmitting member 20 contain a wavelength conversion material, respectively, and the sealing member is also in the fifth embodiment. For example, it can be composed of a translucent resin. In particular, in this example, the light transmitting member 24 may not include a wavelength conversion material, and may be a concentrating or diffusing optical element in addition to a plate shape as illustrated, or a light scattering material may be mixed. Further, a reflective film having a concave curved surface is provided so as to cover the convex portion side surface of the mounting portion from the inner surface of the concave portion, and can be reflected and condensed toward the members 24 and 84. Here, this reflecting film is formed by the covering member 41 containing the light reflecting material 46, and is formed into a concave reflecting surface by the above-described resin creeping. The covering member 41 may be formed with a highly reflective metal film such as Ag or Al on the surface thereof instead of the covering member 41, or may be provided with a light conversion member containing a phosphor as described above. Alternatively, the cover member may not be provided, and the inner surface of the mounting substrate may be a reflective surface as in the prior art. Further, in the concave portion, the light conversion member may be contained in the sealing member 84, airtight sealing or air may be used, and the member 81 may be a member that does not contain the light conversion member like the member 24. . That is, it is possible to provide a light-emitting device that includes converted light by providing a light conversion member in any one of the members 24, 41, 81, and 84, and can also be a light-emitting device that extracts light emitted from the light-emitting element without being included in any of them.

  In such a light emitting device 400 as well, as in the second embodiment, the light guide member 30 includes the above-described joining region 31, the first covering region, and the first reflecting surface 33, and the inside of the recess is sealed. Since it is filled with the member 84, the outer surface of the first covering region forms an interface with the translucent sealing member, and the first reflecting surface 33 is provided at the interface. That is, if a difference in refractive index is provided between the light guide member and the sealing member, the interface reflection can be used, and if the first covering region side is set to a high refractive index, the reflectance can be increased. It is the same. Light is emitted from the light emitting element 10 by being diffused in all directions, and a part of the light component is reflected by the inner surface of the first reflecting surface 33 toward the light receiving surface 26 side of the light transmitting member 24 and the light is reflected. The light can be emitted from the light emitting surface 25, a part of the light can be reflected by the concave portion, and taken out from the light transmitting member 81. Therefore, the light of the light emitting element 10 is condensed by the light transmitting member 24 and emitted from the surface 25, the brightness of the light emitting surface 82 is increased in the front direction, and the light diffusion in the recess is suppressed to reduce the light absorption. be able to. The same applies to the second reflecting surface 35 and the second covering region.

  Further, in the case of the fourth embodiment in which the light emitting element 10 is not covered with the light reflective covering member 40, the covering range of the first and second covering regions provided on the side surface of the light emitting element 10 is As in the first embodiment, or wider than the first embodiment is preferable. If the area covered by the light guide member 30 on the side surface of the light emitting element 10 is wide, the light extraction efficiency from the light emitting element 10 into the light guide member 30 can be increased, and the surface areas of the first and second reflecting surfaces 33 and 35 can be increased. The coupling efficiency of light to the light transmission member 20 can be increased. However, as described above, in order to avoid light loss due to light absorption by the mounting base 56, the light guide member 30 has an outer surface located on the light transmitting member 20 side from the mounting surface of the light emitting element 10, It is preferable to be separated from the surface of the mounting substrate 56.

  Examples according to the present invention will be described in detail below. Needless to say, the present invention is not limited to the following examples.

Example 1
As shown in FIG. 5, the light source unit of the light emitting device of Example 1 has a substantially square LED chip of about 1 mm × 1 mm (nitrided on the sapphire substrate 10) as the light emitting element 10 on the wiring 51 of the ceramic substrate 50 of AlN. Flip-chip mounting of two light emitting wavelengths (455 nm) in a structure in which a physical semiconductor 11 is laminated, and sintering of YAG and alumina (Al ₂ O ₃ ) as a light transmitting member 20 which is a plate-like light conversion member thereon The outer shape of the body, the surface 21 and the light receiving surface 22 is approximately 1.1 mm × 2.2 mm, and a thickness of approximately 150 μm is placed thereon and joined together by the light guide member 30. At this time, an appropriate amount of the silicone resin used as the light guide member 30 is applied on the emission surface of each LED (the back surface of the substrate 1) with tweezers, and the light transmitting member 20 is placed thereon with tweezers. The resin is heat-cured for 60 minutes in an oven at 150 ° C., and two LEDs are bonded so as to be included in the light receiving surface of the light transmitting member as shown in the figure. In this way, the light guide member 30 is covered with the joining region 31 between the LED and the light transmitting member, the first covering region 32 covering the outer side surface of the LED light source, and the inner side surface between the LEDs. A second covering region 34 is formed, and at this time, a light guide member is formed on the LED side surface on the substrate and part or substantially all of the semiconductor layer 11. Then, as shown in FIG. 1, the LED is mounted on the wiring 51 of the substrate 50, and the covering member 40 is filled in the recess inside the frame body that surrounds the light emitting element 10 and the light transmitting member 20. In a state where the surface 21 of 20 is exposed as a light emitting surface, the light emitting element 10 and the light transmitting member 20 are encapsulated by a covering member 40, and the frame is removed as shown in FIG. 8 to obtain a light emitting device. Here, the covering member 40 is a silicone resin containing the light reflecting material 45 which is a fine particle of TiO _{2 having} a particle diameter of about 270 nm at a concentration of about 23 weight percent. When the light-emitting device of Example 1 is driven at a current of 350 mA, the luminous flux is about 167 [lm] (chromaticity y value is about 0.339), the maximum luminance is 6086 [cd / cm ² ], and the average luminance is 3524 [cd / cm]. ² ], which emits light with high luminous flux and high brightness.

(Example 2)
As shown in FIG. 6, the light emitting device of Example 2 has a configuration in which the light receiving surface of one light transmitting member is included in the light emitting surface of one light emitting element. A single LED chip 10 having a substantially rectangular shape of about 1 mm × 6.5 mm provided with six element structures on a substrate, and a light transmitting member 20 having a substantially rectangular shape of about 0.8 mm × 6.3 mm, A light emitting device is manufactured in the same manner as in Example 1. When the light transmitting member 20 is placed, the first covering region 32 is formed by lightly pressing the light guiding member 30 over a part of the side surface of the light transmitting member 20. When the light-emitting device of Example 2 is driven at a current of 700 mA, the luminous flux is about 740 [lm] (chromaticity y value is about 0.280), the maximum luminance is 4629 [cd / cm ² ], and the average luminance is 4123 [cd / cm]. ² ], which emits light with high luminous flux and high brightness.

  The light emitting device of the present invention can be suitably used for backlight light sources such as illumination light sources, LED displays, liquid crystal display devices, traffic lights, illumination switches, various sensors, various indicators, and the like.

DESCRIPTION OF SYMBOLS 10 ... Light emitting element (1 ... Growth substrate, 2 ... 1st conductivity type (n-type) semiconductor layer, 3 ... Active layer, 4 ... 2nd conductivity type (p-type) semiconductor layer, 5 ... Translucent conductive layer, 6 ... 2nd electrode (p-side pad electrode), 7 ... 1st electrode (n-side pad electrode), 8 ... Protective film, 11 ... Element structure)
20, 24 ... Light transmission member (21, 23, 25 ... surface, 22, 26 ... light receiving surface)
DESCRIPTION OF SYMBOLS 30 ... Light guide member (31 ... Joining area | region, 32 ... 1st coating | covering area | region, 33 ... 1st reflective surface, 34 ... 2nd coating | coated area, 35 ... 2nd reflective surface, 37 ... 3rd coating | covering area | region , 38 ... third reflecting surface), 40, 41 ... covering member, 45, 46 ... light reflective material 50 ... mounting board (51, 52 ... wiring, 55 ... frame, 56 ... laminated board or base material), 60. Conductive adhesive

Claims (3)

A light transmissive member having a light emitting surface and a light receiving surface of the light emitting device;
A light emitting element having an emission surface facing the light receiving surface and bonded to the light transmission member;
A light guide member that extends from the light emitting element surface to the light transmitting member surface and guides light emitted from the light emitting element to the light transmitting member, and
The light guide member is
A bonding region for bonding the light emitting surface of the light emitting element and the light receiving surface of the light transmitting member to face each other;
A first covering region extending from the bonding region and covering one surface of the light emitting element and the light transmitting member protruding outward from the bonding region;
And having
A light emitting device in which a first reflecting surface for reflecting the emitted light toward the light transmitting member is provided on an outer surface of the first covering region.   The light emitting device includes a covering member having a light reflecting material, and the covering member covers a surface of the light guide member and exposes the light emitting surface to cover the surfaces of the light emitting element and the light transmitting member. The light emitting device according to 1.   The light-emitting device according to claim 1, wherein the light transmission member is a wavelength conversion member that is excited by light emitted from the light-emitting element.

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