JP5326837B2 - Light emitting device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a light emitting device which is capable of efficiently extracting light emitted from a light emitting element and a wavelength conversion member, to the outside while reducing color unevenness due to difference in optical path length of light propagated in the wavelength conversion member and avoiding the reduction of reliability due to deterioration of an adhesive comprising a resin. <P>SOLUTION: The light emitting device includes: the light emitting element having a semiconductor element structure; a covering member which contains a light reflective material and exposes an emission surface of the light emitting element and covers a side surface of the light emitting element; and a light-transmissive member which is spaced from the light emitting element and has a light emitting surface and a light receiving surface for receiving light from the emission surface of the light emitting element, which face each other. The covering member is extended from the side surface of the light emitting element to the light-transmissive member in a spacing area between the light emitting element and the light-transmissive member, and this extending portion surrounds the spacing area, and a first reflecting surface is provided on a surface on the spacing area side. <P>COPYRIGHT: (C)2011,JPO&amp;INPIT

Description

  The present invention relates to a light-emitting device, and more particularly to a light-emitting device including a light-reflective coating member that covers a light-emitting element.

  2. Description of the Related Art In recent years, light-emitting devices equipped with semiconductor light-emitting elements such as light-emitting diodes (LEDs) and laser diodes (LDs) as light sources have been used for various lighting and display devices. In particular, these semiconductor light-emitting elements are attracting attention as light sources for next-generation lighting that can replace light bulbs and fluorescent lamps because of their low power consumption and long life, and further improvements in light emission output and light emission efficiency are required. . There is also a need for a light source that has excellent light distribution characteristics, high brightness, and high reliability, such as floodlights such as automobile headlights.

  For example, in the light emitting device disclosed in Patent Document 1, an LED element is placed in a case opened on the light extraction side, and a coating material containing light reflecting particles is filled in the case, so that light in the LED element is filled. The outer surface area excluding the extraction surface is covered with this coating material. In addition, a sheet-like phosphor layer covering the light extraction surface of the LED element is disposed on the outer surface of the molded coating material, and the surface of the phosphor layer is used as a light emission surface. This phosphor layer is made of a resin containing a phosphor such as YAG that emits wavelength-converted secondary light (yellow light) by receiving and exciting primary light (blue light) from the LED element, White light can be emitted from the light exit surface by mixing the primary light and the secondary light.

  For example, in Patent Document 2, an LED chip assembly in which a phosphor chip is fixed to an LED chip with a light-transmitting adhesive is mounted on a cup portion of an lead frame or an insulating substrate, and a light scattering agent is mixed. A light-emitting device in which the LED chip assembly is sealed with a protective layer or a sealing resin is disclosed.

JP 2007-019096 A JP 2002-141559 A JP 2002-305328 A

  However, in the light emitting device disclosed in Patent Document 1, the optical path length of the light propagating in the phosphor layer differs depending on the incident angle of the light incident on the phosphor layer from the LED element. The amount of wavelength conversion by the phosphor is relatively large. For this reason, there is a problem in that the color mixture ratio of light changes depending on the emission angle of the light emitted from the phosphor layer, resulting in color unevenness.

  In the light emitting device disclosed in Patent Document 2, the LED chip and the phosphor chip are fixed using an adhesive made of a resin material, and the adhesive is applied by light or heat emitted from the LED chip or the phosphor chip. Deterioration causes light loss and chromaticity change, resulting in a problem that the reliability of the light emitting device is lowered. On the other hand, if the LED chip and the phosphor chip are arranged apart from each other without using an adhesive, such problems can be improved, but light reflection on the surface of the phosphor chip is increased, and the phosphor chip is increased. As a result, the light coupling efficiency of the light emitting device is deteriorated. In addition, light components emitted from the LED chip and incident on the mounting substrate such as the cup portion of the lead frame and the insulating substrate are affected by light absorption by the mounting substrate and are not effectively extracted to the outside, which may reduce the light output. was there.

  Therefore, the present invention has been made in view of such circumstances, reducing color unevenness due to a difference in optical path length propagating in a wavelength conversion member including a phosphor, and reducing reliability due to deterioration of an adhesive made of resin. It is an object of the present invention to provide a light emitting device that can efficiently extract light emitted from the light emitting element and the wavelength conversion member to the outside while avoiding the problem.

The present invention can solve the above problems by the following means (1) to (14).
(1) A light-emitting element having a semiconductor element structure, a light-reflective material, a light-emitting element exposed surface, a covering member that covers the side surface, and a distance between the light-emitting element and facing each other A light-transmitting member having a light-emitting surface and a light-receiving surface that receives light from an emission surface of the light-emitting element, and the covering member is configured to emit the light in a separation region between the light-emitting element and the light-transmitting member. A light-emitting device that extends from a side surface of the element to the light transmission member, the extending portion surrounds the separation region, and has a first reflection surface on a surface of the separation region.
(2) The light emitting device according to (1), wherein the separation region is a gap, and the first reflection surface is provided at an interface between the covering member and the gap.
(3) The light emitting device according to (1) or (2), wherein the first reflecting surface is a concave surface.
(4) The light emitting device according to claim 1 or 2, wherein the first reflecting surface has a convex curved surface.
(5) The light emitting device according to any one of (1) to (4), wherein the covering member has a second reflecting surface surrounding a side surface of the light transmitting member on a surface thereof.
(6) The light emitting unit according to (5), wherein the covering member covers a side surface of the light transmitting member, and the second reflecting surface is provided at an interface between the covering member and the side surface of the light transmitting member. apparatus.
(7) The light emitting device according to (5) or (6), wherein the second reflecting surface is provided on a surface of an extending portion of the covering member that extends forward from the light emitting surface of the light transmitting member. .
(8) A light-emitting element having a semiconductor element structure, a light-reflective material, a light-emitting surface that exposes an emission surface of the light-emitting element and covers the side surface, a light-emitting surface facing each other, and the light-emitting element A light-transmitting surface that receives light from the light-emitting surface of the light-emitting element, and a light-transmitting member that is bonded to the light-emitting surface of the light-emitting element, and the covering member is disposed outside the light-transmitting member and transmits the light. A light emitting device that extends forward from the light emitting surface from a side surface of the member, the extending portion surrounds the light emitting surface, and has a second reflecting surface on the light emitting surface side surface and the side surface of the light transmitting member .
(9) The light emitting device according to (8), wherein a side surface of the light transmitting member is provided on an inner side than an outer side surface of the light emitting element.
(10) The extending portion is inclined such that the opening width is narrower than the light emitting surface side, and the second reflecting surface of the extending portion faces the light emitting surface, and the front of the light emitting surface is The light-emitting device according to any one of the above (7) to (9), which covers a part.
(11) The extending portion has the opening width wider than the light emitting surface side, and the second reflecting surface of the extending portion is provided on the outer side of the light emitting surface. 9) The light-emitting device according to any one of
(12) The light-transmitting member has a light-transmitting member that is bonded to the light-emitting surface of the light-transmitting member and has a second light-emitting surface on the surface facing the bonding side, The light-emitting device according to (10) or (11), wherein the side surface is covered and the second reflecting surface is provided on the side surface.
(13) The light emitting device according to any one of (1) to (12), wherein the light transmitting member is a wavelength conversion member excited by the light emitting element.
(14) The light emitting device according to (13), wherein the wavelength conversion member is a plate-like body.

  According to the present invention, it is possible to provide a light emitting device capable of high-output light emission with little color unevenness and having both high light emission efficiency and reliability.

It is the schematic top view (b) of the light-emitting device which concerns on one embodiment of this invention, and the schematic sectional drawing (a) in the AA cross section. It is a schematic sectional drawing explaining the light source part periphery of the light-emitting device which concerns on one Embodiment of this invention. It is a schematic sectional drawing of the light emitting element which concerns on one embodiment of this invention. It is the schematic top view (b) of the light-emitting device which concerns on one embodiment of this invention, the schematic sectional drawing (a) in the AA cross section, and the schematic sectional drawing (c) explaining the light source part periphery. It is a schematic sectional drawing of the light-emitting device which concerns on one embodiment of this invention. It is a schematic sectional drawing of the light-emitting device which concerns on one embodiment of this invention. It is a schematic sectional drawing explaining the light source part periphery of the light-emitting device which concerns on one Embodiment of this invention. It is a schematic sectional drawing of the light-emitting device which concerns on one Embodiment of this invention. It is a schematic sectional drawing explaining the light source part periphery of the light-emitting device which concerns on one Embodiment of this invention.

  Hereinafter, embodiments of the invention will be described with reference to the drawings as appropriate. However, the light-emitting device described below is for embodying the technical idea of the present invention, and the present invention is not limited to the following. In particular, the dimensions, materials, shapes, relative arrangements, and the like of the components described below are not intended to limit the scope of the present invention only to specific examples unless otherwise specified. Only. Note that the size, positional relationship, and the like of the members shown in each drawing may be exaggerated for clarity of explanation. Furthermore, each element constituting the present invention may be configured such that a plurality of elements are constituted by the same member and the plurality of elements are shared by one member, and conversely, the function of one member is constituted by a plurality of members. It can also be realized by sharing. Similarly, the embodiments described below can be applied by appropriately combining the components and the like unless otherwise specified.

<Embodiment 1>
FIG. 1 is a schematic view of a light emitting device according to Embodiment 1 of the present invention, FIG. 1 (a) is a schematic cross-sectional view taken along line AA of FIG. 1 (b), and FIG. It is a schematic sectional drawing around the light source part. The light emitting device of the example shown in FIGS. 1 and 2 mainly includes a light emitting element 10, a light transmitting member 20 that transmits light emitted from the light emitting element, and a light reflecting property that covers a part of the light emitting element and the light transmitting member. Covering members 40 and 45.

  The light emitting element 10 has a semiconductor element structure provided on a substrate, and one flip chip is mounted on the wiring 55 of the mounting substrate 50 by a conductive adhesive 60 with the back surface of the substrate as an upper surface. On the mounting substrate 50, a first frame 51 and a second frame 52 higher than the first frame 51 are provided outside the first frame 51 so as to surround the light emitting element 10. Yes. Then, the inside of the first frame 51 is filled with a covering member 40 containing a light reflective material 46, and the back surface of the substrate of the light emitting element 10 is exposed as a light emitting surface, and the periphery of the light emitting element 10 is exposed. The portion is covered with the covering member 40. Thereby, the light emitted from the light emitting element 10 to the side or downward is reflected inside the element by the light-reflective coating member 40 and can be efficiently extracted from the back surface of the substrate.

  On the first frame 51, a single plate-like light transmitting member 20 having a surface 21 (light emitting surface 90) and a light receiving surface 22 facing each other is placed, and the first frame 51 is closed. A separation region 30 is provided between the light receiving surface 22 and the light emitting surface of the light emitting element 10. The light transmitting member 20 is disposed apart from the light emitting element 10 by the first frame 51, receives and transmits the light emitted from the light emitting element 10 by the light receiving surface 22, and passes the surface 21 to the outside of the apparatus. discharge. The light transmissive member 20 is a wavelength conversion member containing a phosphor that can emit light emitted from the light emitting element 10 as primary light and emit secondary light that is excited by the primary light and is wavelength-converted light. Also good.

  The covering member 40 is formed by scooping up the inner wall of the first frame 51 to the upper surface of the frame, extends from the back surface to the front outside the element, and extends from the side surface of the element to the upper surface. As shown in the drawing, it is preferable to contact the light receiving surface 22 of the light transmitting member. Furthermore, the 1st reflective surface 31 is provided in the surface. The first reflecting surface 31 is a concave curved surface, and the area of the reflecting surface is increased and the reflection efficiency can be improved as compared to a flat surface, and the light receiving member 20 having a wider width than the light emitting element 10 can receive light. Light can be suitably reflected and coupled to the surface 22. That is, the separation region 30 has a structure surrounded by the covering member 40 and the first reflection surface 31 in addition to the light receiving surface 22 and the emission surface, and the light emitting element 10 and the light transmission member 20 are separated from each other. Accordingly, it is possible to suppress the decrease in optical coupling efficiency due to the above, and to suitably improve the color unevenness and the brightness unevenness by the scattering action by the covering member 40.

  Light emitted in a high angle direction from the exit surface on the back surface of the substrate by the first reflecting surface 31 provided around the light emitting element 10 is absorbed by the incidence on the inner wall surface of the first frame 51. Without being influenced by the light, it is reflected to the light receiving surface 22 side of the light transmitting member and optically couples. Further, the incident angle of the light transmitting member on the light receiving surface 22 can be reduced by the light scattering action of the first reflecting surface 31. Therefore, particularly when the incident angle to the light transmission member 20 is reduced at the peripheral portion of the light transmission member 20 facing the first reflection surface 31, and the light transmission member 20 is a wavelength conversion member, Color unevenness caused by the difference in optical path length can be reduced. Further, the light reflected by the light receiving surface 22 of the light transmitting member (return light) and a part of the secondary light emitted from the light receiving surface 22 are also incident on the first reflecting surface 31, and similarly, the light receiving surface of the light transmitting member. The light can be reflected and scattered on the side 22 and can be incident again on the light receiving surface 22, and the light coupling efficiency to the light transmitting member 20 can be increased.

  Further, in the first embodiment, the separation region 30 between the light receiving surface 22 of the light transmitting member and the light emitting element 10 is a gap, and the first reflecting surface 31 is the covering member 30, the gap, and the gap. It is provided at the interface with gas such as air. In general, the light emitting element 10 and the light transmitting member 20 are arranged apart from each other by a gap 30 without using an adhesive composed of a resin material. It can be avoided that 20 deteriorates and the reliability decreases. When separated by the gap 30, the light reflection at the light receiving surface 22 of the light transmissive member increases, but the return light is reflected again by the first reflective surface 31, so that the light coupling efficiency to the light transmissive member 20 is increased. Can be suppressed. Therefore, it is preferable that the first reflection surface 31 has a higher light reflectance than the emission surface of the light emitting element 10, and further it is preferable that the light scattering action is higher.

  Further, a light-reflective coating member 45 is filled between the first frame 51 and the second frame 52 in the same manner as described above, and the second reflection surface 32 is provided on the surface thereof. Yes. In the first embodiment, the covering member 45 exposes the surface 21 of the light transmitting member to cover the side surface of the light transmitting member 20, and the second reflecting surface 32a covers the side surface of the light transmitting member 20. It is provided at the interface of the member 45. Thereby, the light which leaks to the side from the side surface of the light transmission member 20 is reflected upward, and high-luminance light emission can be realized. Further, when the light transmitting member 20 is a wavelength conversion member, there is a risk that light having a large amount of the secondary light component that has undergone wavelength conversion due to shortage of the primary light component from the light emitting element 10 may be emitted from the periphery and the side. However, by reflecting such lateral light to the inside by the second reflecting surface 32, color mixing of the primary light and the secondary light can be promoted, and color unevenness can be reduced. Further, by covering the side surface of the light transmitting member 20 and exposing the surface 21, a surface light emitting type light emitting device serving as a main light extraction window portion (light emitting surface 90) of the light emitting device 100 is formed. Depending on the shape of the surface 21, the light distribution of the light emitting device 100 can be controlled.

  The covering member 45 is formed by scooping up the inner wall of the second frame 52 to the vicinity of the upper surface of the frame, and between the light transmitting member 20 and the second frame 52, that is, outside the light transmitting member 20. Thus, it has an extending portion extending forward from the light emitting surface 90, and the second reflecting surface 32 is formed up to the surface of the extending portion. Thereby, the light emitted at a higher angle than the light emitting surface 90 of the light transmitting member can be reflected upward, and the front luminance of the light emitting device 100 can be further increased. Note that the second reflecting surface 32b of the extending portion is a concave curved surface, and a relatively wide light distribution can be obtained as compared with the case of the convex curved surface. Further, when the light transmitting member 20 is a wavelength conversion member as described above, the higher the primary light, the longer the optical path length that propagates through the wavelength conversion member and the greater the wavelength conversion amount. The emitted light at an angle may have a large amount of secondary light component, but by scattering the light to the inside of the apparatus by the second reflecting surface 32b formed on the surface of the extending portion, the mixed color of the primary light and the secondary light And color unevenness can be further reduced.

  As described above, the light-emitting device of the present invention has a light-emitting element of a light source unit in which at least a side surface is coated on a covering member at the bottom of the covering member having the concave portion and the concave portion. A light-transmitting member that is closed like a closing lid is provided to form a composite light source unit. In the separated area in the composite light source part, that is, the peripheral side surface of the area sandwiched between the light source part and the light transmitting member is surrounded by the covering member, and is taken out from the light source in the area surrounded by the first reflecting surface. The primary light and secondary light emitted from the light transmitting member to the light source side are superimposed on each other and the first reflecting surface, and desired light emission characteristics, In this structure, light of orientation, chromaticity distribution, and luminance distribution is extracted from the surface of the light transmitting member that is the light emitting surface of the composite light source. Therefore, since it is a covering member of a transparent member provided with a light-reflective material as will be described later, the scattering function is added to the reflecting action, so that the function can be further enhanced. Further, when a covering member serving as a second reflecting surface for reflecting the light extracted from the composite light source, that is, the light extracted outside the light transmitting member, is additionally provided, each of the above characteristics. Controllability is improved. Therefore, the first and second reflecting surfaces may be formed of an integral covering member, or may be individually molded as described in each embodiment.

  On the other hand, as seen in the sixth and seventh embodiments and FIGS. 8 and 9, the light source includes a light transmitting member such as a wavelength conversion member, that is, the light emitting element and the light transmitting member are directly or via an adhesive or the like. The composite light source units may be integrated with each other. In this case, the reflection surface of the covering member protruding forward from the light source unit is the same as the second reflection surface provided outside the composite light source. That is, as described above, in the vicinity of the light source unit, desired light emission characteristics can be obtained by the reflection, condensing, and scattering actions, similarly to the covering member and the first reflection surface on the light source unit side. Further, instead of the light transmissive member included in the light source unit, another light transmissive member is used to provide an extended portion of the covering member having a desired shape, its second reflecting surface, and a desired light emitting surface. Shape and light emission characteristics can be obtained. Specifically, as in the fifth and sixth embodiments, the extending portion of the covering member having a narrower emission port than the light source portion, and the translucent member thereof can be used. On the other hand, the emission side can also be formed in a wide shape. By using the translucent member, light is superimposed in the member in the same manner as the above-described separated region, and desired light emission is transmitted through the translucent member. It can be taken out from the second light emitting surface of the member surface.

  Next, each component of the light emitting device of the present invention will be described in detail below.

(Light emitting element)
The light-emitting element 10 can be a known element, specifically a semiconductor light-emitting element, and is particularly preferably a GaN-based compound semiconductor because it can emit visible light and ultraviolet light having a short wavelength that can excite a fluorescent substance efficiently. . A specific emission peak wavelength is 240 nm or more and 560 nm or less, preferably 380 nm or more and 470 nm or less. In addition, a light emitting element of ZnSe, InGaAs, or AlInGaP semiconductor may be used.

(Light emitting element structure)
As illustrated in FIG. 3, the light-emitting element structure 11 formed of a semiconductor layer is composed of at least a first conductivity type (n-type) layer 2 and a second conductivity type (p-type) layer 4, and further, an active layer 3 is interposed therebetween. The structure which has is preferable. The electrode structure is preferably the same surface side electrode structure in which both the first conductivity type (negative) and the second conductivity type (positive) electrodes 6 and 7 are provided on one main surface side. A counter electrode structure in which electrodes are provided to face each other may be used. As for the mounting form of the light emitting element 10, for example, in the same surface side electrode structure, flip chip mounting in which the electrode forming surface is the mounting surface and the substrate 1 side facing it is the main emitting surface is the emitting surface and the light transmitting member. 20 is preferable in terms of optical connection. In addition to this, the electrode forming surface side is the main emission surface, and the light transmission member is mounted on it, face-up mounting, flip chip mounting on the light transmission member with wiring structure, and light transmission with the above-mentioned counter electrode structure It is possible to connect the member and the mounting substrate, and it is preferable to mount the embodiment in which the light emitting element and the light transmitting member are not provided with wiring and electrodes. Note that the growth substrate 1 of the semiconductor layer 11 may be removed when the light emitting element structure is not formed, and a support substrate such as a conductive substrate or another translucent member is added to the semiconductor layer from which the growth substrate has been removed. -It is also possible to have a structure in which substrates are bonded. The light transmitting member 20 can also be used for the supporting substrate, and other elements having a structure in which the semiconductor layer is bonded and covered with a light transmitting member such as glass or resin may be used. The removal of the growth substrate can be performed by peeling, polishing, or LLO (Laser Lift Off) by mounting or holding the growth substrate on a support, device, or submount, for example. In addition, the light emitting element 10 can have a light reflecting structure. Specifically, of the two main surfaces of the semiconductor layer 11 facing each other, the other main surface facing the light extraction side (emission surface side) is formed. The light reflection side (the lower side in FIG. 1) can be provided, and a light reflection structure can be provided in the semiconductor layer on this light reflection side or in an electrode. As an example of the light reflecting structure, a structure in which a multilayer reflective layer is provided in the semiconductor layer, or an electrode having a highly light reflective metal film such as Ag or Al or a dielectric multilayer film, or a reflective layer is provided on the semiconductor layer. There is a structure.

(Nitride semiconductor light emitting device)
As an example of the light emitting element 10, in the nitride semiconductor light emitting element 10 of FIG. 3, an n-type semiconductor layer that is the first nitride semiconductor layer 2 and the active layer 3 are formed on the C-plane sapphire substrate that is the growth substrate 1. The light emitting layer and the p-type semiconductor layer which is the second nitride semiconductor layer 4 are epitaxially grown in this order. Then, a part of the n-type layer 2 is exposed to form an n-type pad electrode, which is the first electrode 7, and a light-transmitting conductive layer 5 such as ITO is formed on almost the entire surface of the p-type layer 4. 6, a p-type pad electrode is formed. Further, the protective film 8 is provided by exposing the surfaces of the n-type and p-type pad electrodes 6 and 7 and covering the semiconductor layer. Note that the n-type pad electrode 7 may be formed through a light-transmitting conductive layer as in the p-type. The growth substrate 1 includes C-plane sapphire, R-plane and A-plane, an insulating substrate such as spinel (MgAl ₂ O ₄ ), silicon carbide (6H, 4H, 3C), Si, ZnS, ZnO, GaAs. There are semiconductor conductive substrates such as GaN and AlN. Examples of the nitride semiconductor, the general formula _{In x Al y Ga 1-xy} N (0 ≦ x, 0 ≦ y, x + y ≦ 1) of the other, B and P, may be mixed with As. The n-type and p-type semiconductor layers 2 and 4 are not particularly limited to a single layer or multiple layers, and the active layer 3 preferably has a single (SQW) or multiple quantum well structure (MQW). As an example of the blue light emitting element structure 11, an n-type semiconductor layer such as Si-doped GaN is formed on a sapphire substrate via a nitride semiconductor underlayer such as a buffer layer, for example, a low-temperature growth thin film GaN and a GaN layer. N-type contact layer and GaN / InGaN n-type multilayer film layer, followed by InGaN / GaN MQW active layer, and p-type semiconductor layer, for example, Mg-doped InGaN / AlGaN p-type multilayer film layer And a p-type contact layer of Mg-doped GaN.

(Light transmission member)
The light emitting device 100 of FIG. 1 includes a light transmitting member 20 that transmits light from the light emitting element 10. The light transmission member 20 is preferably a light conversion member having a wavelength conversion material capable of converting the wavelength of at least part of the light passing therethrough. For example, as in the embodiment, the primary light from the light source excites the phosphor as the wavelength conversion material in the light transmitting member 20 to obtain secondary light having a wavelength different from that of the primary light. Outgoing light having a desired hue can be realized by color mixing with light.

  As described above, the light transmissive member 20 according to the first embodiment includes the light emitting element 10 in a plan view from the surface 21 (light emitting surface 90), and the side surface is outward from the side surface (end surface) of the light emitting element 10. The light receiving surface 22 is wider than the light emitting surface of the light emitting element 10 and is optically connected to the light emitting element 10 so that there is little loss. In addition, as shown in Embodiments 6 and 7 to be described later, the side surface of the light transmitting member 20 may be positioned inside the side surface of the light emitting element 10, that is, the emission surface of the light emitting element 10 may protrude. As in this example, the light receiving surface 22 of the light transmitting member may be smaller than the light emitting surface of the light emitting element 10. By narrowing the light emitting region with respect to the light emitting element, the luminance is relatively increased, the color mixture is made uniform, and the color unevenness is reduced. Further, if the side surface of the light transmitting member 20 is located on the same plane as the side surface of the light emitting element 10, the amount of light from the light emitting element 10 is insufficient at the outer edge portion of the light transmitting member, resulting in color unevenness. It can suppress becoming easy.

  Here, as a translucent material used as a base material of the light transmissive member 20, the material similar to the following coating member 40 can be used, for example, inorganic substances, such as resin or glass, can be used. Even when the conversion function is not provided, it is preferable to use the same material as the light transmission member for light conversion, excluding or replacing the phosphor. Further, when the light transmitting member is plate-like as in the embodiment, both the front surface 21 and the light receiving surface 22 are substantially flat surfaces, and furthermore, both opposing surfaces are substantially parallel to each other. The efficiency of optical coupling through the light guide member of the present invention is increased, and joining is facilitated, which is preferable. On the other hand, it is not limited to a plate shape, but various shapes or forms such as a shape having a curved surface in whole or in part, a surface shape such as an uneven surface, for example, a shape for condensing and dispersing, for example, a lens shape, etc. Such an optical shape can also be used. Further, as a wavelength conversion function, in addition to emitting primary light of the light emitting element and mixed light of the converted light (secondary light), for example, converted light by ultraviolet light of the light emitting element or mixed light by a plurality of converted lights In addition, a light-emitting device that mainly emits secondary light converted from primary light can be used.

The light transmissive member 20 having the wavelength conversion function is specifically a glass plate, a material provided with the light conversion member, or a phosphor crystal of the light conversion member or a single crystal, a polycrystal, or an amorphous material having a phase thereof. Sintered body, aggregate, porous material, and translucent material such as translucent resin, impregnated with ceramic body or phosphor crystal particles and appropriately added translucent material Or a translucent member containing phosphor particles, such as a molded body of translucent resin. In addition, it is preferable from a heat resistant viewpoint that the light transmissive member 20 is comprised with an inorganic material rather than organic materials, such as resin. Specifically, it is preferably made of a translucent inorganic material containing a phosphor, and in particular, a sintered body of a phosphor and an inorganic substance (binding material, binder), or a sintered body or crystal made of a phosphor. This increases reliability. In addition, when using the YAG phosphor of the example, in addition to YAG single crystals and high-purity sintered bodies, YAG / alumina sintered bodies using alumina (Al ₂ O ₃ ) as a binder, and glass are bonded. A sintered body as a material is preferable from the viewpoint of reliability. Further, by forming the light transmitting member 20 in a plate shape, the coupling efficiency with the emission surface of the light emitting element 10 configured in a planar shape is good, and the light transmitting member 20 can be easily positioned so as to be substantially parallel to the main surface of the light transmitting member 20. Can be combined. In addition, by making the thickness of the light transmissive member 20 substantially constant, the wavelength conversion amount of the light passing therethrough can be made substantially uniform, the ratio of color mixing can be stabilized, and color unevenness at the site of the light emitting surface 90 can be suppressed. Therefore, in the case where a plurality of light emitting elements 10 are mounted on one light transmitting member 20, there is little unevenness in luminance and chromaticity distribution in the light emitting surface 90 due to the arrangement of the individual light emitting elements 10, and it is substantially uniform and high. Luminous light emission can be obtained. Note that the thickness of the light transmitting member 20 having a wavelength conversion function is preferably 10 μm or more and 500 μm or less, and more preferably 50 μm or more and 300 μm or less, in terms of light emission efficiency and chromaticity adjustment.

The wavelength conversion member can be suitably combined with a blue light emitting element to emit white light. As a typical phosphor used for the wavelength conversion member, a YAG phosphor (yttrium, aluminum, Garnet) and LAG-based phosphors (lutetium, aluminum, garnet). In particular, (Re _1-x Sm _x ) ₃ (Al _1-y Ga _y ) ₅ O _{12 in} high brightness and long time use. : Ce (0 ≦ x <1, 0 ≦ y ≦ 1, where Re is at least one element selected from the group consisting of Y, Gd, La, and Lu). Further, a phosphor containing at least one selected from the group consisting of YAG, LAG, BAM, BAM: Mn, (Zn, Cd) Zn: Cu, CCA, SCA, SCESN, SESN, CESN, CASBN, and CaAlSiN ₃ : Eu. Can be used. In addition to the light transmissive member, the wavelength conversion member can also be provided, for example, between the light transmissive member and the light emitting element, and between the light emitting element and the covering member in the coupling member. Similarly, the light transmitting member, the wavelength converting member, and the sintered body can be disposed in the light emitting device. It is also possible to increase the reddish component using a nitride-based phosphor having yellow to red light emission, and to realize illumination with high average color rendering index Ra, light bulb color LED, and the like. Specifically, by adjusting the amount of phosphors having different chromaticity points on the CIE chromaticity diagram according to the light emission wavelength of the light emitting device, the phosphors are connected with each other on the chromaticity diagram. Any point can be made to emit light. In addition, nitride phosphors, oxynitride phosphors, and silicate phosphors that convert near-ultraviolet to visible light into a yellow to red region can be used. For example, L ₂ SiO ₄ : Eu (L is an alkaline earth metal), particularly (Sr _x Mae _1-x ) ₂ SiO ₄ : Eu (Mae is an alkaline earth metal such as Ca and Ba) and the like. Examples of nitride phosphors and oxynitride (oxynitride) phosphors include Sr—Ca—Si—N: Eu, Ca—Si—N: Eu, Sr—Si—N: Eu, and Sr—Ca—Si. —O—N: Eu, Ca—Si—O—N: Eu, Sr—Si—O—N: Eu, and the like. As the alkaline earth silicon nitride phosphor, the general formula LSi ₂ O ₂ N ₂ : Eu , general formula _{L x Si y N (2 /} 3x + 4 / 3y): Eu or _{L x Si y O z N (} 2 / 3x + 4 / 3y-2 / 3z): Eu (L is, Sr, Ca, One of Sr and Ca).

(Coating member)
The covering members 40 and 45 cover a part of the light emitting element 10 and the light transmitting member 20 as shown in FIG. In the present invention, since the covering member hangs down from the element or the like and prevents the formation of a light leakage path, it is preferable that the reflectance of the covering member is higher than that of the mounting substrate and the wiring provided thereon. In addition, the covering members 40 and 45 containing the light reflecting materials 46 and 47 are preferably made of a translucent resin material for the base material, preferably a silicone resin composition, a modified silicone resin composition, etc. An insulating resin composition having translucency such as an epoxy resin composition, a modified epoxy resin composition, and an acrylic resin composition can be used. A covering member having excellent weather resistance, such as a hybrid resin containing at least one of these resins, can also be used. Furthermore, inorganic materials having excellent light resistance such as glass and silica gel can be used. Further, by molding the resin material, it can be formed into a desired shape, and a desired region can be covered. In the present invention, the surface of the light emitting element of the light source unit and the light transmitting member, particularly the side surface thereof can be covered. In addition, the surface on the light emitting surface side can also have a desired shape, and can be a concave or convex curved surface in addition to a flat surface shape as illustrated. In the first embodiment, a silicone resin is used as a covering member from the viewpoint of heat resistance and weather resistance.

The covering members 40 and 45 contain at least one kind of light reflecting material 46 and 47 in the base material. By including the light reflecting materials 46 and 47, the reflectivity of the covering members 40 and 45 is increased, and more preferably, when low-absorbing particles are used, light absorption and loss are reduced, and light scattering is provided. A covering member can be formed. The light-reflective materials 46 and 47 contained in the covering members 40 and 45 are at least one oxide selected from the group consisting of Ti, Zr, Nb, Al, and Si, or at least one of AlN and MgF. Specifically, it is at least one selected from the group consisting of TiO ₂ , ZrO ₂ , Nb ₂ O ₅ , Al ₂ O ₃ , MgF, AlN, and SiO ₂ . Since the light-reflective material particles are one kind of oxide selected from the group consisting of Ti, Zr, Nb, and Al, the material can be made highly reflective and low-absorbent. The difference in refractive index with the functional resin is increased, which is preferable. The covering members 40 and 45 can also be formed of a molded body made of the light reflecting material. Specifically, the covering members 40 and 45 may be made of a porous material such as an aggregate obtained by agglomerating the particles or a sintered body. In addition, a molded body by the sol-gel method may be used, because the difference in refractive index between the light reflective material and the air in the porous layer can be increased, and the light reflectivity can be increased. ,preferable. On the other hand, compared with a covering member provided with a base material such as the resin, it can be molded into a desired shape and controllability of the covering region is good, and sealing performance and airtightness can be improved. Then, it is preferable to use a covering member provided with the base material. Also, considering the characteristics of both covering members, a composite molded body of both can be formed. For example, the outer surface side of the porous molded body is impregnated with resin, and the inner surface side of the light emitting element side is porous. The structure can be made. As described above, the covering member or the surrounding body may be configured such that the inner region communicates with the outside or is gas permeable and at least does not leak light.

  In the covering members 40 and 45 containing the light-reflective materials 46 and 47 in the base material described above, the depth at which light leaks differs depending on the concentration and density of the materials. The density and density should be adjusted. For example, when the wall thickness is reduced with a relatively small light emitting device, it is preferable to provide high-concentration light reflecting materials 46 and 47. On the other hand, the concentration of the covering members 40 and 45 containing the light-reflective materials 46 and 47 is adjusted so as to be suitable for the manufacturing process such as preparation of the covering members 40 and 45, application of the raw materials, and molding. The same applies to the porous body. As an example, in the case of the example, it is preferable that the concentration of the light-reflective materials 46 and 47 is 20 weight percent (wt%) or more, and the thickness is 20 μm or more. Luminous and highly directional emitted light can be obtained, and underfill can be easily formed with a covering member with an appropriate viscosity. Moreover, if the density | concentration of a light reflective material is made high, the thermal diffusibility of a coating | coated member can be improved.

  In the formation region of the covering member, the covering member 40 is provided on at least the side surface of the light emitting element 10, preferably also covers the side surface of the light transmitting member 20, and more preferably, the light emitting surface is provided in the light source unit including the light transmitting member and the light emitting element. Expose and coat others. As a result, light can be prevented from leaking from the side surface of the light transmitting member, and if the light converting member has a relatively high intensity from the side surface, light having a color difference can be suppressed, and radiation light can be prevented. The directivity can be improved, and luminance unevenness and color unevenness can be reduced. Moreover, the directivity and the brightness can be improved by covering the side surfaces of the respective members and elements and restricting them to the light extraction direction side. In addition, when the light transmitting member 20 contains a wavelength conversion material, the heat generation of the wavelength conversion material is particularly significant, which can be improved. If the side surface of the light transmitting member 20 is covered with the covering member 45 and the surface 21 is exposed, the outer surface shape is not particularly limited. As shown in FIG. 8, when a plurality of light emitting elements 10 are joined to one light transmitting member 20, a covering member 40 is also filled between the light emitting elements to cover the separated area of the light receiving surface 22. It is preferable to do. With respect to the heat of the light conversion member in the joining region, this configuration can enhance the heat dissipation of the separation region.

(Additive components)
In addition to the light-reflective materials 46 and 47 and the light conversion member, a viscosity extender or the like can be added as appropriate to the covering members 40 and 45, so that the desired light emission color, the color of these members or the device surface can be obtained. For example, a light emitting device having desired directivity characteristics such as black for increasing the contrast can be obtained. Similarly, various colorants can be added as filter materials for cutting unnecessary wavelengths. The same applies to other members, and light transmissive materials such as a light guide member, a sealing member, and a light transmissive member.

(Mounting board 50)
On the other hand, in the light-emitting device 100 of FIG. 1, the substrate 50 on which the light-emitting element 10 is mounted can use a substrate at least having a wiring 55 connected to the electrode of the element, as shown in FIG. As shown, a wiring (56) for external connection may be provided. The substrate material is, for example, aluminum nitride (AlN), single crystal, polycrystal, sintered substrate, other materials such as ceramics such as alumina, glass, semi-metal or metal substrates such as Si, and laminates thereof. Bodies and composites can be used, and metallic and ceramic materials are preferred because of their high heat dissipation. The substrate 50 may not have wiring. For example, the growth substrate side may be mounted with the element of FIG. 3 and the element electrode may be wire-connected to the electrode of the apparatus, or the light-transmitting member may be wired and connected. But you can. Moreover, the form which covers the outer side surface of the mounting board | substrate 50 other than the form in which the coating | coated members 40 and 45 are provided on the mounting board | substrate 50 like the light-emitting device to show in figure may be sufficient. Further, it is preferable that at least the surface of the mounting substrate 50 is made of a highly reflective material. As shown in FIGS. 1 and 2, the light emitting element 10 is bonded onto the wiring 55 by a conductive adhesive 60 and is electrically connected to the outside. As the conductive adhesive 60, solder, Ag paste, Au bump, or the like can be used.

(Frame)
The light emitting device 100 shown in FIG. 1 has frames 51 and 52, which also function as holding members for the covering members 40 and 45. The frames 51 and 52 can be formed of ceramic or resin. Alumina having high light reflectivity is preferable, but not limited to this as long as a reflective film is formed on the surface. If it is resin, besides using screen printing or the like, the molded body may be bonded to the mounting substrate. Further, it is preferable to increase the reflectance by using a light reflective material as in the case of the covering members 40 and 45. Moreover, you may color a frame according to the objective like the said addition member. In addition, this frame can also be removed after filling or forming the covering member. Further, the frame body may be formed integrally with the mounting substrate of the light emitting element, such as a laminated substrate, an apparatus base having a cavity structure with a base material, and the like.

(Method for manufacturing light emitting device)
An example of a method for manufacturing the light emitting device 100 shown in FIG. 1 will be described below. First, the conductive adhesive 60 is formed on the mounting substrate 50 or the light emitting element 10 and is flip-chip mounted. In this example, one light emitting element 10 is mounted side by side in a region corresponding to one light emitting device on the substrate 50 before separation. Next, the height of the first frame 51 standing up around the light emitting element 10 (the emission surface of the light emitting element 10 (or the nitride semiconductor exposed surface if the substrate is removed by the growth substrate rear surface or LLO)) is higher. ), The resin constituting the covering member 40 is potted by a dispenser (liquid fixed quantity discharge device) or the like so as to cover the side surface of the light transmitting member 20. The dropped resin 40 scoops up and covers the side surface of the light emitting element 10 and the inner wall of the first frame body 51 by surface tension, and becomes higher from the emission surface of the light emitting element 10 toward the upper surface of the first frame body 51. An inclined surface is formed. Next, the light transmission member 20 is placed on the first frame 51. And the resin which comprises the coating | coated member 45 is similarly potted in the 2nd frame 52 (it is higher than a 1st frame) standingly arranged around the 1st frame. The dropped resin 45 scoops and covers the side surface of the light transmission member 20 and the inner wall of the second frame body 52 by surface tension, and has an inclined surface that becomes higher from the surface 21 toward the upper surface of the second frame body 52. It is formed. Finally, after the resins 40 and 45 are cured, dicing is performed at a predetermined position, and the light emitting device 100 is obtained by cutting out to a desired size.

<Embodiment 2>
4 is a schematic view of a light emitting device according to Embodiment 2 of the present invention, FIG. 4 (a) is a schematic cross-sectional view taken along line AA of FIG. 4 (b), and FIG. c) is a schematic sectional view of the periphery of the light source section. In the light emitting device of the example shown in FIG. 4, the same reference numerals are given to substantially the same configurations as those of the above-described first embodiment, and description thereof will be omitted as appropriate.

  The light emitting device 200 of the example shown in FIG. 4 includes a device base 59 having a cavity structure in which a first recess 57 having a smaller diameter than the second recess is provided in a second recess 58 opened to the outside. A plurality of (two in the drawing) light emitting elements 10 are flip-mounted on the wiring 55 provided at the bottom of the first recess 57. A plate-like light transmitting member 20 having a surface 21 (light emitting surface 90) and a light receiving surface 22 facing each other is placed on the bottom of the second recess 58. The lid is closed. The first concave portion 57 is filled with the covering member 40 containing the light reflective material 46, the back surface of the substrate of the light emitting element 10 is exposed, and the peripheral portion of the light emitting element 10 is covered with the covering member 40. ing. The covering member 40 in the first recess 57 is formed by crawling up the inner wall of the first recess 57 to the upper surface (second recess bottom surface) of the first recess 57, and from the side surface of the light emitting element 10. It extends to the top surface, outside the element, and in front of the exit surface. Moreover, you may contact | abut to the light-receiving surface 22 of a light transmissive member like a figure. And the 1st reflective surface 31 is provided in the surface.

  As described above, the first reflecting surface 31 can reflect and scatter light components incident on the light receiving surface 22 of the light transmitting member at a high angle, and increase the incident light components at a low angle. The optical coupling efficiency to the transmissive member 20 can be increased, and color unevenness caused by the optical path length difference in the wavelength conversion member can be reduced. Further, in the second embodiment, the first reflecting surface 31 is a convex curved surface, and the area of the reflecting surface is increased as compared with the case where it is a flat surface, and the center of the light transmitting member 20 is compared with the case where it is a concave curved surface. The effect of condensing light on the part is strong, and the luminance in the front direction of the apparatus can be increased while increasing the incident light component at a low angle.

  Further, as shown in FIG. 4C, the covering member 40 is also filled in a separation region located between the adjacent light emitting elements 10. In this way, by covering the plurality of light emitting elements 10 with the covering member 40 and optically coupling the emitted light and the reflected light from the first reflecting surface 31 to the light transmitting member 20, the luminous flux can be increased. In addition, the light transmitting member 20 reflects and scatters a high-angle light component emitted from one light emitting element 10 to the side, that is, the other light emitting element 10 side, by the first reflecting surface 31 at the peripheral portion of the light transmitting member 20. Can be coupled to the light receiving surface 22. Therefore, even when the area of the light receiving surface 22 of the light transmitting member is increased, the amount of light at the peripheral portion where the primary light component from the light emitting element 10 is likely to be insufficient can be compensated to reduce the occurrence of color unevenness. Further, when the light transmitting member 20 is a wavelength conversion member, a high angle light component emitted from one light emitting element 10 and a low angle light component emitted from the other light emitting element 10 are mixed. In addition, the reflection of the surface of the covering member 40 between the elements is also added, that is, the light of each light emitting element 10 is suitably mixed in the separation region 30. As a result, light is superimposed over a wide area of the light receiving surface 22 of the light transmitting member, the angle component of the incident light can be compensated for, and color unevenness due to the optical path length difference can be reduced. Similarly, the primary light and the secondary light emitted to each other are mixed with each other in the separation region 30.

  Further, in the second embodiment, the covering member 45 provided in the second recess 58 is formed by scooping up the inner wall of the second recess 58, and also exposes the side surface of the light transmission member 20, and further, FIG. In this manner, the light transmitting member 20 is formed so as to be separated from the light transmitting member 20. The second reflecting surface 32 is provided on the surface of the covering member 45 so as to face the side surface of the light transmitting member 20, and has a relatively wide arrangement compared to the second reflecting surface 32 of the first embodiment. Light can be realized.

  As shown in FIGS. 4A and 4B, the sealing member 70 can be provided so as to cover part of the surfaces of the light transmitting member 20 and the covering member 45. In such a light emitting device, the refractive index difference at the interface with the surface 21 of the light transmitting member is relaxed by the sealing member 70, and light can be efficiently extracted from the surface 21 of the light transmitting member. In addition, since the light component at a high angle is reduced by the first and second reflecting surfaces 31 and 32, there is little color unevenness, and light having an incident angle exceeding the total reflection angle with respect to the inner surface of the sealing member 70. Since components are reduced and a high transmittance can be obtained even in a flat shape, the device can be thinned while having high luminous efficiency.

(Sealing member)
Here, the surface of the sealing member 70 on the light extraction side can be formed in various shapes according to the purpose. For example, as shown by the dotted lines in FIGS. 4A and 4B, the light extraction side surface has a spherical (hemispherical) lens shape and a convex curved surface, so that the light transmission member 20 can efficiently emit light. It can be taken out well. Further, the present invention is not limited to this, and various optical elements and optical members having a desired shape can be formed. A concave lens shape, a parabolic surface, a convex shape with a flat tip can be formed, and light can be scattered as an uneven surface.

If the refractive index of the sealing member 70 is lower than that of the light transmitting member 20, the sealing member 70 can be bonded to the surface to improve the light extraction efficiency. This sealing member 70 is a resin material such as an epoxy resin, a silicone resin, a modified silicone resin, a urea resin, a urethane resin, an acrylic resin, a polycarbonate resin, a polyimide resin, and the like, similar to the base material of the covering members 40 and 45 described above. Can be used. Moreover, since the sealing member 70 also plays a role as a sealing material for protecting the light emitting element 10 and the light transmitting member 20, a material excellent in weather resistance, heat resistance, and hardness is preferable. Among these, an epoxy resin or a hard material is preferable. The silicone resin is preferred. In addition, glass may be used. Furthermore, the phosphor as described above and / or light scattering particles such as TiO ₂ and / or a filler such as quartz glass can be appropriately added to the sealing member 70. The sealing member is formed by compression molding, transfer molding, potting, or the like.

<Embodiment 3>
FIG. 5 is a schematic cross-sectional view of a light-emitting device according to Embodiment 3 of the present invention. In the light emitting device of the example shown in FIG. 5, the same reference numerals are given to substantially the same configurations as those of the first embodiment described above, and description thereof will be omitted as appropriate.

  In the light emitting device 300 of the example shown in FIG. 5, a plurality of (two in the drawing) light emitting elements 10 are connected in series to each other on the wiring 55 of the mounting substrate 50 and flip-chip mounted to increase the driving voltage. Can do. Similarly to the first embodiment described above, the covering member 40 is filled in the first frame 51, the back surface of the substrate of each light emitting element 10 is exposed, and the peripheral portion of each light emitting element 10 is covered. The first frame 51 is formed so as to scoop up the inner wall, and the first reflecting surface 31 is provided on the surface thereof. The covering member is also filled in the region between the light emitting elements 10.

  Further, the surface of the covering member 45 formed outside the first frame 51 is formed on the lower side (mounting substrate) side. In other words, the covering member 45 is formed so as to creep up from the outside to the side surface of the light transmitting member 20 while covering the side surface of the light transmitting member 20, and the surface of the covering member 45 continuous from the light transmitting member 20 is It is a concave curved surface. In such a form, the second frame body 52 in the first embodiment is filled and cured with the covering member 45 using a frame body lower than the first frame body 51, and then the second frame body 52. It can produce by removing. Therefore, in this case, the second reflecting surface 32 is provided only at the interface between the side surface of the light transmitting member 30 and the covering member 45. In this way, the surface of the covering member 45 is inclined to the rear side of the light emitting surface 90 toward the side outside the light transmitting member 20, and the light emitted from the light emitting surface 90 is shielded. In this way, a high luminous flux and a wide light distribution can be obtained. In this example, the light transmitting member 20 has such a width that it protrudes laterally from the frame body 51, so that a higher luminous flux and a wider light distribution can be obtained.

<Embodiment 4>
FIG. 6 is a schematic cross-sectional view of a light-emitting device according to Embodiment 4 of the present invention. In the light emitting device of the example shown in FIG. 6, components substantially similar to those of the first embodiment described above are denoted by the same reference numerals and description thereof is omitted as appropriate.

  In the light emitting device 400 of the example shown in FIG. 6, a plurality (two in the drawing) of light emitting elements 10 are formed on the wiring 55 in the concave portion of the device base body (50, 51) having a frame or the like and provided with the concave portion. Flip chip mounting. The inside of the recess is filled with a covering member 40. The covering member 40 exposes the back surface of the substrate of the light emitting element 10 so as to cover the peripheral portion of each light emitting element 10 and scoop up the inner wall of the recess. The surface is formed and extends forward from the back surface of the substrate toward the outside of the device, and the surface forms a recess including the back surface of the substrate of the light emitting device 10 at the bottom surface. The light transmissive member 20 is installed in a recess formed by the covering member 40, and the peripheral edge portion on the light receiving surface side is in contact with the surface of the covering member 40. Therefore, the light transmitting member 20 closes a part of the concave portion formed by the covering member 40, that is, the light emitting element region recessed from the covering member 40 by the concave portion, and is separated from the light emitting element 10. A space is provided in the region 30, and a first reflecting surface 31 is provided on the inner surface of the recessed portion in the separated region 30.

  Further, a covering member 45 is filled around the light transmitting member 20 so as to cover the side surface of the light transmitting member 20, and the light transmitting member 20 is fixed and light is emitted from the side surface of the light transmitting member 20. Is preventing. The second reflecting surface 32 is provided at least on the interface (32a) between the covering member 45 and the side surface of the light transmissive member 20, and similarly to the first reflecting surface 31 of the second embodiment, the second reflecting surface 32 extends from the instant. It also has a curved second reflecting surface 32b. The outer surface of the covering member 45 is substantially flat as shown in the figure, but may be extended forward from the light emitting surface 90 as in the first embodiment, or may be suspended as in the third embodiment. You may let them.

  In the fourth embodiment, as shown by a dotted line in FIG. 6, after the covering member is molded and cured, the mounting substrate may be further removed in addition to the frame, and the covering member itself is the base of the light emitting device 400. Will be made. Further, in this case, the wiring 55 bonded to each electrode on the light emitting element 10 is left exposed on the back surface of the substrate made of the covering member so that the light emitting element 10 can be fed as an external connection terminal. As described above, the light emitting device 400 has high reliability while suppressing the optical coupling efficiency to the light transmitting member 20, can suppress the occurrence of color unevenness, and the substrate itself emits light. Since it is comprised by the coating | coated member which coat | covers the element 10, thickness reduction and size reduction of an apparatus can be achieved and the versatility of a light-emitting device can be improved.

  Such a light emitting device, for example, by placing a light emitting element on a support substrate, applying a covering member to form a molded body, and performing surface treatment with a release agent or the like in advance, is peeled off from the support substrate, This can be realized by a method of taking out the molded body of the covering member in which the light source part is embedded. In addition, the wiring structure of the light source part is mounted with the surface of the emission region facing the support substrate as described above, and as a light emitting element electrode and a conductor thereon, film formation, plating, bump, etc. after peeling The conductor may be formed by forming the above-mentioned covering member, the wiring side surface is placed facing the support substrate, and the conductor or support substrate is previously placed on the light emitting element side, the support substrate side or both. After providing the upper wiring layer and a conductor combining them, the wiring may be separated from the support substrate by peeling.

<Embodiment 5>
FIG. 7 is a schematic cross-sectional view for explaining the light emitting device according to Embodiment 5 of the present invention. In the light emitting device of the example shown in FIG. 7, the same reference numerals are given to substantially the same configurations as those of the above-described first embodiment, and description thereof will be omitted as appropriate.

  In the light emitting device of the example shown in FIG. 7, as in the above-described fourth embodiment, one light emitting element 10 is flip-chip mounted on the wiring 55 in the frame of the mounting substrate, and the covering member 40 emits light. A recess that covers the periphery of the element 10 and includes the back surface of the substrate of the light emitting element 10 on the bottom surface is formed on the surface. The light transmitting member 20 is placed with the peripheral portion on the light receiving surface 22 side in contact with the surface of the recess formed by the covering member 40. Therefore, the light transmitting member 20 closes a part of the concave portion formed by the covering member 40 and is separated from the light emitting element 10, and the first inner surface of the concave portion of the covering member 40 in the separation region 30 from the light emitting element 10 is provided. A reflective surface is provided. Here, the separation region 30 between the light emitting element 10 and the light transmissive member 30 may be a gap as described above, and as a modified example thereof, as in a seventh embodiment to be described later, the light transmissive property is formed in the concave portion by the covering member 40. A member (35) may be provided, and the light transmitting member 20 may be bonded onto the light transmitting member (35). Thereby, the refractive index difference in the interface with the back surface of the substrate of the light emitting element 10 and the interface with the light receiving surface 22 of the light transmitting member is relaxed, and the optical coupling efficiency to the light transmitting member 20 can be increased.

  Further, in the light emitting device of the example shown in FIG. 7, another translucent member 71 having a top surface and a bottom surface facing each other is joined on the light transmissive member 20 with the bottom surface side as a joint surface, and the translucent member. The side surface of 71 and the side surface of the light transmitting member 20 are covered with a covering member 45. Thus, this light emitting device is a surface light emitting type light emitting device in which the upper surface of the translucent member 71 is the main light extraction window.

(Translucent member)
Such a translucent member 71 is preferably made of a material having translucency so that the emitted light of the light emitting element 10 can be guided to the light extraction side and both the members can be optically coupled. The light transmissive member can be made of the same material as the sealing member 70 of the second embodiment, specifically, a transparent resin or glass. For example, the bottom surface and the top surface of the light transmissive member 20 have a rectangular shape. A cone-shaped transparent resin is formed and processed. Further, as a specific material, a light-transmitting thermosetting resin such as a silicone resin or an epoxy resin is preferable, and a silicone resin is preferable because it is excellent in heat resistance and light resistance. In addition, it is preferable to use a silicone resin because the effect of the fluorine-based mold release agent is high. Furthermore, if it is a dimethyl-type silicone resin, it is excellent in reliability, such as high temperature tolerance, and if it is a phenyl-type silicone resin, the refractive index can be made high and the extraction efficiency of the light from the light emitting element 10 can be improved. Further, as in the seventh embodiment described later, it can be used as an adhesive 35 that is interposed between the light emitting element 10 and the light transmitting member 20 and fixes both members.

  The second reflecting surface is continuously provided on the side surface of the translucent member 71 and the interface between the side surface of the light transmitting member 20 and the covering member 45. Further, the size of the bottom surface is substantially the same as the size of the light emitting surface 90 of the light transmitting member, the top surface is smaller than the bottom surface, and the side surface of the light transmitting member 71 is an inclined surface that tapers upward. Accordingly, the second reflecting surface provided at the interface with the side surface of the translucent member 71 is inclined inward, and the light emitted upward from the light emitting surface 90 of the light transmitting member is directed toward the center. The light can be reflected so as to be condensed, light emission with high luminance can be obtained, and the color mixture of the primary light and the secondary light is promoted to reduce color unevenness.

  In the light emitting device of the example shown in FIG. 7, the surface 23 of the light transmitting member is an uneven surface 23A, and light is scattered by the uneven surface 23A to reduce luminance unevenness while improving the light extraction efficiency. In addition, the superimposition of the primary light and the secondary light is promoted to reduce the occurrence of color unevenness, and a substantially uniform light distribution can be obtained. Such a concavo-convex surface 23A can be formed by a process such as polishing, dry etching, wet etching, etc., and an irregular concavo-convex structure can be formed in addition to an irregular concavo-convex structure. Further, such a concavo-convex structure 23A can be provided not only on the surface 23 of the light transmitting member but also on the light receiving surface 22 and further on the surface of each member on the optical path. It may be provided on the surface of the substrate on the semiconductor element structure side, and although not described in detail in Embodiment 1, a structure as shown in FIG. 2 (1A in the drawing) may be used.

<Embodiment 6>
FIG. 8 is a schematic cross-sectional view for explaining the light emitting device according to Embodiment 6 of the present invention. In the light emitting device of the example shown in FIG. 8, the same reference numerals are given to the substantially same configurations as those of the first and third embodiments, and the description will be omitted as appropriate.

  In the light emitting device 500 of the example shown in FIG. 8, the two light emitting elements 10 are flip-chip mounted on the wiring 55 in the frame of the mounting substrate 50 as in the above-described fifth embodiment, and the covering member 40 is The peripheral portion such as the side surface of the light emitting element 10 and the side surface of the light transmitting member 20 bonded to the substrate of the light emitting element 10 are covered. The light transmitting member 20 is bonded to the light emitting element 10 via a light transmitting adhesive (not shown), and its end is provided on the inner side of the outer side surface of the light emitting element 10, that is, the light emitting element. And are included in the region of the plurality of light emitting elements. Therefore, the light source unit is joined to the element 10 without substantially having the above-described separation region 30. The second reflecting surface 32b in the vicinity of the light source extends from the light emitting surface 90 in front of the light emitting surface 90 on the outer side of the light transmitting member 20 of the light source unit, as in the first embodiment. Part is provided and provided on the inner surface thereof. The frame is removed after the covering member 40 is formed, as in the third embodiment. As shown in the figure, the covering member 40 forms a recess with the light source portion as the bottom, and with the second reflecting surface 32b that hits the inner wall of the recess, the light from the light source portion, particularly the embodiment 1, The high angle component from the light emitting surface 90 is suitably reflected, and the high angle component is condensed on the optical axis side, so that the light can be emitted with high directivity with a narrow emission angle. Further, the color unevenness when using the wavelength conversion member, particularly on the high angle side, can be preferably improved by the irregular reflection of the covering member 40. Compared with Embodiment 1, since the light emitting element 10 and the light transmission member 20 are joined in the light source unit, higher output and higher luminance can be expected.

  As described above, the surface of the covering member 40, the concave portion of the present embodiment, is sealed with the sealing member 70, and, for example, as shown in FIG. As the light emitting surface 91), the sealing region can be used as a translucent member region, and desired light emission characteristics can be obtained by superimposing suitable light in the same manner as the separation region 30. In addition, by using the concave curved surface of the concave portion, an optical lens suitable for it, for example, a collimating lens or an optical member can be molded to obtain a desired directivity. The clad region can be bonded to the region corresponding to the covering member.

<Embodiment 7>
FIG. 9 is a schematic cross-sectional view for explaining the light-emitting device according to Embodiment 7 of the present invention. In the light emitting device of the example shown in FIG. 9, the substantially same configuration as that of the above-described fifth embodiment is denoted by the same reference numeral, and description thereof is omitted as appropriate.

  In the present embodiment, a light source part is formed in the same manner as in the sixth embodiment, and a light transmissive member 71 is provided on the light transmissive member 20 in the same manner as in the fifth embodiment, and the surface thereof is subjected to the second light emission. The covering member 40 covers the side surface of the covering member 40 to form an extending portion, and the second reflecting surface 32b is formed on the inner wall side thereof, that is, on the interface with the translucent member 71. As in the sixth embodiment, the light emitting element 10 and the light transmitting member 20 in the light source section have the side surfaces of the light emitting element 10 projecting from the light transmitting member 20, and the light transmitting member 20 is included in the output surface of the element 10 and its substrate. It has a structure. Further, the light source, that is, the translucent member 71 bonded onto the light transmissive member 20 is similarly narrower than the light transmissive member 20 and is included in the light emitting surface 90, and the light source is similar to the fifth embodiment. The width is such that the light emitting surface 90 side is wider than the second light emitting surface 91 side. As described above, the structure in which the respective members are sequentially reduced from the light emitting element 10 toward the second light emitting surface 91 allows the condensing effect to the second light emitting surface side 91 in the sixth embodiment. Can be increased.

  As a modification, on the contrary, the width of the surface of the translucent member 71 (second light emitting surface 91) serving as an emission port and the opening width of the extending portion can be wider than the light emitting surface 90 side. . In this case, since it is an open structure, the light extraction efficiency can be increased, and the size of the light source can be increased.

  As described above, when the translucent member 71 is provided, similarly to the above-described separation region 30, a light superimposing effect can be obtained by confining light in the member, and uneven luminance and uneven color can be suitably obtained. Can be suppressed. Furthermore, it can be further improved by mixing diffusing particles such as a filler and a light reflecting material in the translucent member 71. In this case, the concentration of the light reflecting material is preferably smaller than that of the covering member 40. On the other hand, for example, if the inclination of the second reflecting surface 32b is small after the covering member 40 is formed, the translucent member 71 can be extracted, and thereby the inside surrounded by the extending portion is described in the embodiment. It can be outside air like 1-4. In this way, the extension part, even as a region only surrounded by the second reflection surface 32b on the surface, according to the opening width of the extension part, it is possible to obtain the light collection and scattering effect, Compared with the case where the translucent member 71 is used, light confinement in the surrounding region is reduced, so that a high luminous flux can be achieved.

  Further, when the light transmitting member 20 is a wavelength conversion member, the thickness and the particle size or concentration of the phosphor contained therein have a great influence on the chromaticity of the light emitted from the apparatus. Therefore, rather than controlling the light emitted from the apparatus only by the light transmissive member 20, the sealing member that controls the chromaticity and light flux of the light emitted from the apparatus by the thickness and shape of the light transmissive member 20 and is joined to the light transmissive member 20 separately. It is possible to control the light emitted from the apparatus suitably by assigning the function and role to each member / region, such as controlling the light distribution of the light emitted from the apparatus by 70, the translucent member 71 or the surrounding area as described above. It becomes possible. Furthermore, such a sealing member 70 and the translucent member 71 are surrounded or covered by a covering member together with the light source part including the light transmitting member 20, or an enclosing region by the covering member as described above is formed. Thus, light can be efficiently coupled to the member / region from the light transmitting member 20 in a relatively simple manner, and the light control function by the member / region can be enhanced.

<Example 1>
Examples according to the present invention will be described in detail below. Needless to say, the present invention is not limited to the following examples.

As shown in FIG. 1, the light emitting device of Example 1 has a substantially square LED chip of about 1 mm × 1 mm as a light emitting element 10 on a wiring 55 of an AlN ceramic substrate 50 (a nitride semiconductor is laminated on a sapphire substrate). In this structure, one light emitting wavelength of 455 nm and a thickness of about 90 μm is flip-chip mounted. A first frame 51 having a height of about 150 μm is provided on the ceramic substrate 50 to surround the LED chip 10. The inside of the first frame 51 is filled with a silicone resin coating member 40 containing a light-reflective material 46, which is a fine particle of TiO _{2 having} a particle size of about 270 nm, at a concentration of about 23 weight percent. The LED chip 10 is covered with the covering member 40 so that the back surface of the sapphire substrate of the chip 10 is exposed. Further, the covering member 40 gently crawls up from the LED chip 10 to the inner wall of the first frame 51 to the upper surface of the frame 51, and a first reflecting surface 31 having a concave curved surface is formed on the surface. On the first frame 51, a phosphor plate (this surface 21 and light receiving surface 22) that is a sintered body of YAG phosphor and alumina (Al ₂ O ₃ ) as the plate-like light transmitting member 20. The outer shape is a substantially rectangular shape of about 7.4 mm × 3.3 mm and the thickness is about 120 μm), and the first frame 51 is closed. The phosphor plate 20 is in contact with the covering member 40 scooping up the inner wall of the first frame 51, and a gap 30 is provided in the separation region 30 between the LED chip 10 and the phosphor plate 20. Further, a second frame body 55 that is taller than the first frame body 51 is provided on the ceramic substrate 50 so as to surround the first frame body 51. The inside of the second frame 55 is filled with a covering member 45 similar to the above, and the covering member 45 exposes the surface 21 of the phosphor plate 20 as the light emitting surface 90 and The side walls are covered and the inner wall of the second frame 52 is gently crawled up to the vicinity of the upper surface of the frame 52. As a result, the second reflecting surface 32 is formed on the surface of the covering member 45, which is composed of an interface between the covering member 45 and the side surface of the phosphor plate 20 and a concave curved surface extending upward.

  As described above, Example 1 can provide a light-emitting device that exhibits substantially the same effect as that of Embodiment 1.

  The light-emitting device of the present invention can be suitably used for backlight sources such as illumination light sources, LED displays, liquid crystal display devices, traffic lights, illumination switches, various sensors, various indicators, and the like.

DESCRIPTION OF SYMBOLS 10 ... Light emitting element (1 ... Growth substrate, 2 ... 1st conductivity type (n-type) semiconductor layer, 3 ... Active layer, 4 ... 2nd conductivity type (p-type) semiconductor layer, 5 ... Translucent conductive layer, 6 ... 2nd electrode (p-side pad electrode), 7 ... 1st electrode (n-side pad electrode), 8 ... Protective film, 11 ... Element structure)
20 ... light transmission member (21, 23 ... surface, 22 ... light receiving surface, 23A ... concave / concave structure)
30 ... separation region / gap 31 ... first reflecting surface 32 ... second reflecting surface 40 (first), 45 (second) ... covering member (46 (first), 47 (second) ... light reflectivity material)
50 ... Mounting substrate (51, 52 ... Frame, 55, 56 ... Wiring, 57, 58 ... Recess, 59 ... Device base)
60 ... conductive adhesive 70 ... sealing member 71 ... translucent member 90 ... light emitting surface 91 ... second light emitting surface

Claims (12)

A light emitting device having a semiconductor device structure;
A coating member containing a light reflective material, exposing an emission surface of the light emitting element, and covering the side surface;
A light-transmitting member having a light-emitting surface spaced from the light-emitting element and facing each other, and a light-receiving surface that receives light from an emission surface of the light-emitting element,
The covering member extends from a side surface of the light emitting element to the light transmitting member in a separation region of the light emitting element and the light transmission member, and the extending portion surrounds the separation region, and the surface of the separation region side A light emitting device having a first reflecting surface.   The light emitting device according to claim 1, wherein the separation region is a gap, and the first reflecting surface is provided at an interface between the covering member and the gap.   The light emitting device according to claim 1, wherein the first reflecting surface is a concave surface.   The light emitting device according to claim 1, wherein the first reflecting surface has a convex curved surface.   5. The light emitting device according to claim 1, wherein the covering member has a second reflecting surface on a surface thereof surrounding a side surface of the light transmitting member. The covering member covers a side surface of the light transmitting member;
The light emitting device according to claim 5, wherein the second reflecting surface is provided at an interface between the covering member and a side surface of the light transmitting member.   The light emitting device according to claim 5, wherein the second reflecting surface is provided on a surface of an extending portion of the covering member that extends forward from the light emitting surface of the light transmitting member. The extension part is inclined so that the opening width is narrower than the light emitting surface side, and the second reflecting surface of the extension part faces the light emitting surface, and partially covers the front of the light emitting surface. The light emitting device according to claim 7 . 8. The light emitting device according to claim 7, wherein the extension portion has an opening width wider than the light emitting surface side, and the second reflecting surface of the extension portion is provided outside the side of the light emitting surface. A light-transmitting member that is bonded to the light-emitting surface of the light-transmitting member and includes a second light-emitting surface on the surface facing the bonding side;
The light emitting device according to claim 9 or 10, wherein the extending portion covers a side surface of the translucent member, and the second reflecting surface is provided on the side surface. The light transmitting member, the light emitting device according to any one of claims 1 to 10 wherein the wavelength conversion member is excited to the light emitting element. The light emitting device according to claim 11 , wherein the wavelength conversion member is a plate-like body.

Images