JP2016100940A - Electric power conversion system - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an electric power conversion system capable of downsizing a whole system without inhibiting a heat radiation path of a heating component.SOLUTION: In an electric power conversion system 1, a heat sink 60 includes a body part 62, and a radiation fin 64 on which the body part 62 is provided. The body part 62 includes a thick wall part, defining a heat radiation path 68, on which a heating component is mounted, and a thin wall part, provided outside of the heat radiation path 68, on which non-heating components 14, 18, 120 are mounted.SELECTED DRAWING: Figure 2

Description

  The present invention relates to a power conversion device, and more particularly to a power conversion device that can be suitably applied to a vehicle that is a hybrid vehicle.

  In recent years, in vehicles such as four-wheeled vehicles, hybrid vehicles using an engine that is an internal combustion engine and an electric motor in cooperation with a drive system have become widespread.

  In such a hybrid vehicle, a power conversion device is used as one of the components of an electronic control device that operates an engine and an electric motor in cooperation. Since such a power conversion apparatus inputs and outputs relatively large power, the power conversion apparatus includes a heat sink that generates heat and dissipates heat transferred during operation of the power conversion apparatus.

  Such a heat sink is in thermal contact with a plurality of semiconductor elements, which are heat-generating components that generate heat while performing a switching operation at the time of power conversion. It dissipates heat to the surrounding atmosphere.

  Under such circumstances, Patent Document 1 relates to a power semiconductor device, a switching element that performs power conversion from direct current to alternating current, a flywheel diode that performs power conversion from three-phase alternating current to direct current, and a temperature at which the temperature of the switching element is detected. A sensor unit and a plurality of power modules formed by resin-sealing, a control board having a control circuit unit for controlling the switching element, and a smoothing capacitor for suppressing voltage fluctuations of the power supplied to the switching element are integrated The structure which mounted | wore the heat sink 3 for heat dissipation with each insert case assembled | attached to is disclosed.

JP 2005-323417 A

  However, according to the study of the present inventor, in the configuration of Patent Document 1, the heat of the switching element, which is a heat generating component, is dissipated using a heat sink, and the heat dissipation path from the switching element, which is a heat generating source, to the heat sink. Since heat radiation fins are defined radially, a heat sink that has a certain thickness from the heat source installation surface to the heat radiation fins and gains the cross-sectional area of the heat radiation path is necessary for efficient heat dissipation. It is thought that it becomes.

  Here, according to further studies by the present inventors, the components of the power conversion device such as an inverter are mounted on a heat sink having a flat top surface, and the heat generated during the power conversion operation is Since heat is transferred radially, the heat sink has a region that is not used as a heat dissipation path (non-heat dissipation path region), and the area occupied by the heat sink may not be used effectively. Since components such as an inverter are mounted on a heat sink having a simple top surface, the configuration becomes bulky. As a result, the size of the entire device tends to increase, and there is room for improvement.

  The present invention has been made through the above-described studies, and an object thereof is to provide a power conversion device that can reduce the size of the entire device without obstructing the heat dissipation path of the heat-generating component.

  In order to achieve the above object, the present invention comprises a heat generating component that generates heat during operation, a non-heat generating component that is in thermal contact with the heat generating component, and a heat sink that mounts the heat generating component and the non-heat generating component. In the power conversion device exhibiting a power conversion function, the heat sink includes a main body portion and a heat radiating fin provided in the main body portion, and the main body portion has a heat dissipation path mounted with the heat generating component. It is a first aspect to have a defined thick portion and a thin portion on which the non-heat-generating component is mounted and set outside the heat dissipation path.

  Moreover, this invention makes it 2nd aspect that the said thin part is provided in the edge part area | region of the periphery of the said main-body part in addition to 1st aspect.

  Moreover, in addition to the 1st or 2nd aspect, this invention makes it the 3rd aspect that the said thin part has a recessed part which accommodates at least one part of the said non-heat-generating component.

  According to the present invention, in addition to any one of the first to third aspects, the non-heat generating component includes a terminal block for fixing the electric wiring, a positioning member for positioning the electric wiring, and a current flowing through the electric wiring. The fourth aspect includes any of the current sensors to be detected.

  According to the power conversion device according to the first aspect of the present invention described above, the heat sink includes the main body portion and the heat radiation fin provided on the main body portion, and the main body portion is mounted with the heat-generating component and dissipates heat. Since it has a thick part that defines the path and a thin part that is mounted on the outside of the heat dissipation path while mounting non-heat generating parts, it does not obstruct the heat dissipation path of the heat generating parts, The size can be reduced. In particular, the height above and below the linear outline of the area (heat transfer diffusion area) consisting of a heat dissipation path that follows the heat gradient from the heat source mounted on the thick part of the heat sink toward the heat dissipation fins By disposing non-heat-generating parts (equipment that does not generate heat during operation, and parts that generate less heat than heat-generating parts even if it generates heat) in the thin-walled part that is reduced in thickness, the heat dissipation path of the heat-generating parts Therefore, it is possible to effectively use the space in the apparatus without obstructing the above, and thus it is possible to reduce the weight and cost by reducing the height of the apparatus, reducing the size of the entire apparatus, and reducing the thickness of the heat sink.

  Moreover, according to the power converter device concerning the 2nd aspect of this invention, since the thin part is provided in the edge part area | region of the peripheral part of the main-body part of a heat sink, it is not used as a heat dissipation path area | region of a heat sink. Heat-dissipating parts can be placed in the central main area used as the heat-dissipating path area of the heat sink while providing a thin part in the remaining area of the periphery, and the heat-dissipating path area required in a manner that does not substantially impede the heat-dissipating path area The overall size of the apparatus can be reliably reduced while ensuring the above.

  Moreover, according to the power converter device concerning the 3rd aspect of this invention, since the thin part has a recessed part which accommodates at least one part of a non-heat-generating component, a non-heat-generating component is made into a heat-generating component and its related. It can be mounted on the heat sink in a manner that does not unnecessarily enter the housing space in the case in which the parts are housed, and the size of the entire apparatus can be reliably reduced.

  According to the power converter of the fourth aspect of the present invention, the non-heat generating component includes a terminal block for fixing the electrical wiring, a positioning member for positioning the electrical wiring, and a current sensor for detecting a current flowing through the electrical wiring. Since any one of them is included, it is possible to arrange components that do not generate heat substantially in the remaining area that is not used as the heat dissipation path area, while ensuring the necessary heat dissipation path area in a manner that does not substantially disturb the heat dissipation path area. Therefore, the size of the entire apparatus can be reliably reduced.

FIG. 1 is a perspective view showing a configuration of a power conversion device according to an embodiment of the present invention. FIG. 2 is a cross-sectional view taken along the line AA of FIG. FIG. 3 is a partially enlarged view of FIG.

  Hereinafter, the power converter according to the embodiment of the present invention will be described in detail with reference to FIGS. 1 to 3 as appropriate. In the figure, the x-axis, y-axis, and z-axis constitute a three-axis orthogonal coordinate system, the z-axis direction corresponds to the vertical direction, and the xz plane is the horizontal plane.

  FIG. 1 is a perspective view illustrating a configuration of a power conversion device according to the present embodiment. FIG. 2 is a cross-sectional view taken along the line AA of FIG. FIG. 3 is a partially enlarged view of FIG.

  As shown in FIG. 1 to FIG. 3, the power conversion device 1 is mounted and fixed to the lower case 10 and an upper portion of the lower case 10 via a fitting structure (not shown), and the upper portion of the power conversion device 1. The lower case 10 is disposed in the lower part of the lower case 10, and the heat sink 60 for mounting the lower case 10 via a fastening member (not shown), the lower case 10 and the upper case 40 are defined in cooperation. And a power module 70 housed in the internal housing space, and is mounted on a vehicle such as a hybrid vehicle (not shown). The power conversion device 1 is typically mounted on a vehicle and is not shown in the figure, but a direct current supplied from a battery as a secondary battery to a driving electric motor is converted into an alternating current (three-phase current). It has a DC (Direct Current) / AC (Alternate Current) conversion function for conversion. In addition, the power converter device 1 may have an AC / DC conversion function for converting an alternating current supplied to the battery from the electric motor or a regenerative mechanism (not shown) into a direct current as necessary.

  Both the lower case 10 and the upper case 40 are typically molded products made of non-conductive resin (synthetic resin), and the heat sink 60 is typically a cast product made of metal such as an aluminum material. is there. The power module 70, the circuit board 80, the output bus bar 100, and the current sensor 120 are accommodated in an internal housing space defined by the lower case 10 and the upper case 40 in cooperation.

  Specifically, the lower case 10 mainly includes a side peripheral wall 12 that circulates around a vertical axis on a plane parallel to the xy plane, and a bottom wall 13 that closes the bottom of the side peripheral wall 12.

  A part of the bottom wall 13 is provided with an inner terminal block 14 projecting downward, and disposed on the positive side of the x-axis with respect to the inner terminal block 14 and projecting upward. A positioning pin 18 and an opening 19 that is disposed on the negative side of the x-axis with respect to the inner terminal block 14 and that opens the interior of the lower case 10 are provided. The inner terminal block 14 and the positioning pins 18 are provided in such a manner that three inner terminal blocks 14 and three positioning pins 18 are juxtaposed in the y-axis direction, and are typically formed integrally with the bottom wall 13 when the lower case 10 is formed. The inner terminal block 14 and the positioning pin 18 are non-heat-generating parts because they do not perform electrical operations. Each of the inner terminal blocks 14 is fitted with a collar 16 made of metal or the like. Typically, the upper ends of the collars 16 are set flush with the upper surface of the inner terminal block 14. In the opening 19, the bottom of the power module 70 is exposed to the outside from the internal housing space defined by the lower case 10 and the upper case 40 in cooperation. A fastening portion that fastens the bottom wall 13 to the heat sink 60 via a fastening member is provided on the remaining portion of the bottom wall 13 other than the inner terminal block 14, the positioning pins 18, and the opening 19. Illustration of such fastening members and fastening portions is omitted.

  A part of the side peripheral wall 12 is provided with a configuration in which three outer terminal blocks 20 each projecting in the positive direction of the x-axis are juxtaposed in the direction of the y-axis. Each of the outer terminal blocks 20 is typically formed integrally with the side peripheral wall 12 when the lower case 10 is formed. The outer terminal blocks 20 are each formed with a recess 22 that is recessed downward from the upper surface thereof. Each of the recesses 22 is fitted with a collar 24 made of metal or the like, and each of the collars 24 is typically set to be flush with the upper surface of the corresponding outer terminal block 20. The outer end portions of the corresponding output bus bars 100 are respectively placed on the upper surfaces of the outer terminal blocks 20, and the outer end portions of the output bus bars 100 are respectively connected to the electric motor side through the fastening members 26 and omitted from the reference numerals. It is fastened to the screw hole of the collar 24 together with the end of the bus bar. The side peripheral wall 12 is formed with notches 28 and 30 that are recessed downward from the upper end thereof. The notches 28 are provided corresponding to the three external terminal blocks 20 arranged side by side, and the corresponding output bus bars 100 are formed outside the internal housing space in which the lower case 10 and the upper case 40 define the cooperation. To each of them. Instead of each notch 28, a through-hole penetrating the side peripheral wall 12 may be provided.

  The upper case 40 mainly includes a side peripheral wall 42 that circulates around a vertical axis on a plane parallel to the xy plane, and an upper wall 43 that closes the upper portion thereof.

  A part of the side peripheral wall 42 is formed with notches 44 and 46 that are recessed upward from the lower end thereof. The cutout portions 44 are provided corresponding to the cutout portions 28 of the lower case 10 and extend the corresponding output bus bars 100. However, the notch portion 44 is provided when the corresponding output bus bar 100 is extended only by the notch portion 28 of the lower case 10 or when a through hole penetrating the side peripheral wall 12 is provided instead of the notch portion 28. Is omitted. The notch portion 46 is provided corresponding to the notch portion 30 of the lower case 10, and in cooperation with the notch portion 30, both are omitted from illustration, but an electric control unit ECU (Electronic Control Unit) is electrically connected. A receiving portion for receiving an input / output signal connector to be connected.

  A part of the upper wall 43 forms a protruding wall 47 whose shape changes so as to protrude upward. Below the protruding wall 47, a high-profile component such as a smoothing capacitor mounted on the upper surface of the circuit board 80 is disposed.

  The heat sink 60 mainly includes a rectangular main body 62 and a plurality of fins 64 that protrude downward from the lower surface of the main body 62.

  A recess 66 is formed in the end region of the peripheral edge of the main body 62 on the positive side of the x-axis so as to be recessed downward from the upper surface thereof. In the recess 66, the inner terminal block 14 of the lower case 10 is correspondingly accommodated in a position-aligned manner. The upper surface position of the inner terminal block 14 is typically set in the recess 66. In the main body 62, the vertical thickness of the portion where the concave portion 66 is not formed is thicker than the vertical thickness of the portion where the concave portion 66 is formed. That is, in the main body 62, the portion where the recess 66 is not formed is a thick portion having a large thickness in the vertical direction, and the portion where the recess 66 is formed is a thin portion having a small thickness in the vertical direction. is there.

  A radial heat transfer diffusion region 68 having a radiation angle opened downward from the power module 70 is defined from the upper surface of the main body 62 toward the plurality of fins 64. The heat transfer diffusion region 68 is used when heat generated during operation of the power module 70 is transferred from the main body 62 toward the plurality of fins 64 while being diffused radially according to a thermal gradient and is radiated from the plurality of fins 64. This is an area composed of defined heat dissipation paths. Therefore, the outer contour line 69 including the heat transfer diffusion region 68 is estimated as a straight line that is circular in the cross section of the main body 62 and has an opening angle of 45 ° with respect to the downward direction in the cross section of the main body 62. The Here, the recess 66 is set in the outer region of the heat transfer diffusion region 68 in the main body 62. The peripheral portion of the opening 19 in the bottom wall 13 of the lower case 10 abuts on the upper surface of the main body 62 in the outer region of the heat transfer diffusion region 68. The positioning pins 18 of the lower case 10 in which a part of the inner terminal block 14 and the bottom wall 13 of the lower case 10 attached to the recess 66 abuts on the main body 62 are arranged in the power module 70 via the main body 62. In thermal contact with the power semiconductor element. A part of the inner terminal block 14 to be mounted in the recess 66 may be accommodated in the recess 66. In addition, the component mounted in the recess 66 may be the positioning pin 18 or the current sensor 120 instead of the inner terminal block 14.

  The power module 70 is typically a molded product made of a plurality of power semiconductor elements for power conversion such as an IGBT (Insulated Gate Bipolar Transistor) (not shown) and a non-conductive resin (synthetic resin). A module case 72 for housing a plurality of power semiconductor elements, and a conductive plate typically connected at one end to the plurality of power semiconductor elements and at the other end extending from the module case 72 And a power module side bus bar 74 made of a member. The power module 70 is a heat generating component that generates heat during operation.

  The bottom of the module case 72 is opened toward the upper surface of the heat sink 60. The plurality of power semiconductor elements are attached to the module case 72 and abut on the upper surface of the heat sink 60 through the opened bottom of the module case 72 and the opening 19 of the lower case 10. Between the plurality of power semiconductor elements and the upper surface of the heat sink 60, the heat conductivity typically equal to or higher than that of the heat sink 60 is exhibited in order to improve the heat conductivity at the bottom of the plurality of power semiconductor elements. May be provided with a metal heat spreader 76. A fastening portion for fastening the module case 72 to the heat sink 60 via a fastening member is provided on the remaining portion other than the opened bottom portion of the module case 72 and the extending portion of the power module side bus bar 74. Illustration of such fastening members and fastening portions is omitted. The module case 72 may have a structure in which the bottom thereof is not opened as necessary. In such a case, a plurality of power semiconductor elements are connected to the heat sink 60 via the module case 72. Thermally contacts the top surface.

  The power module side bus bar 74 is typically an electrical wiring provided in a manner in which three are arranged side by side in the y-axis direction corresponding to the U phase, V phase and W phase of the three-phase current, It consists of a single plate-like member made of metal that is bent in the vertical direction while being horizontally arranged in such a manner that the width direction thereof is along the y-axis direction. Each of the power module side bus bars 74 extends from the module case 72 and extends in the positive direction of the x-axis, and terminates on the upper surface of the inner terminal block 14 of the lower case 10. It is mounted on the upper surface of the inner terminal block 14 and is fastened to the screw hole of the collar 16 together with the inner end portion of the corresponding output bus bar 100 via the fastening member 102. The upper surface of the terminal portion of the power module side bus bar 74, the upper surface of the inner end portion of the output bus bar 100, and the vertical position of the top of the fastening member 102 are the depth of the recess 66 formed in the main body portion 62 of the heat sink 60, and By adjusting the accommodation depth of the inner terminal block 14 with respect to the recess 66, the inner volume can be adjusted so as to increase the effective volume of the internal accommodation space defined by the lower case 10 and the upper case 40 in cooperation.

  The circuit board 80 is typically arranged in parallel to the xy plane and is a flat circuit board such as a PCB (Printed Circuit Board), and is mounted on the lower case 10 or the upper case 40.

  Mounted on the circuit board 80 are high-profile components such as a smoothing capacitor, a CPU (Central Processing Unit) for driving control of a plurality of power semiconductor elements, and low-profile components such as a resistance element and a memory. A region where the space around the circuit board 80 is occupied by components is shown as a mounting component occupation region 82. Since the depth of the concave portion 66 formed in the main body portion 62 of the heat sink 60 and the accommodation depth of the inner terminal block 14 with respect to the concave portion 66 are ensured, the position of the top portion of the fastening member 102 in the vertical direction is lowered, As a result, the volume of the mounting component occupation area 82 on the lower side of the circuit board 80 is ensured equally large at a position where the position in the vertical direction is lowered to the vicinity of the upper surface of the module case 72 of the power module 70.

  The output bus bar 100 is typically an electrical wiring provided in a manner arranged in parallel in the y-axis direction corresponding to the U-phase, V-phase, and W-phase of the three-phase current. It consists of a single plate-like member made of metal that is bent in the vertical direction while being horizontally arranged in a posture in which the width direction is along the y-axis direction. The output bus bars 100 each extend in the x-axis direction between their inner and outer ends.

  The inner end portions of the output bus bars 100 are respectively placed on the upper surfaces of the corresponding inner terminal blocks 14, and the screw holes of the collars 16 together with the terminal portions of the corresponding power module side bus bars 74 through the fastening members 102. To be concluded. The outer end portions of the output bus bars 100 are respectively placed on the upper surfaces of the corresponding outer terminal blocks 20 and screw holes of the collars 24 together with the corresponding end portions of the bus bars on the electric motor side via the fastening members 26. To be concluded. Positioning pins 18 corresponding to the lower case 10 are inserted into the intermediate portions of the output bus bar 100 on the negative side of the x-axis with respect to the central portion in the x-axis direction, and are positioned by being fitted with the positioning pins 18. Intermediate portions on the positive side of the x-axis with respect to the central portion of the output bus bar 100 are each inserted through the through holes 122 formed in the corresponding case 121 of the current sensor 120 in the x-axis direction. A shield plate 104 extending from an intermediate portion on the negative side of the x-axis with respect to the center portion of the output bus bar 100 toward the inner end portion of the output bus bar 100 has an upper end of the positioning pin 18, an upper surface of the output bus bar 100, and a fastening member. The empty space between the top of 102 and the mounting component occupation area 82 on the lower side of the circuit board 80 is used to enter and be arranged above the top of the fastening member 102.

  Typically, three current sensors 120 are mounted on the lower case 10 and three in the y-axis direction are detected in order to detect currents of U-phase, V-phase, and W-phase currents flowing in the output bus bar 100 correspondingly. A case 121 which is provided in a juxtaposed manner and is a molded product made of a magnetically permeable resin (synthetic resin), a current element such as a Hall element which is included in the case 121 and which is not illustrated, and the case 121 is connected to the x axis And a through hole 122 penetrating in the direction. The corresponding output bus bar 100 is inserted through each of the through holes 122, and the current sensor 120 detects the current flowing through the corresponding output bus bar 100. Since the amount of heat generated during operation of the current sensor 120 is significantly smaller than that of the power module 70, the current sensor 120 can be evaluated as a substantially non-heat-generating component. The current sensor 120 attached to the lower case 10 is in thermal contact with a plurality of power semiconductor elements in the power module 70 via the main body 62.

  As is clear from the above description, in the power conversion device 1 in the present embodiment, the heat sink 60 includes the main body portion 62 and the heat radiation fins 64 provided on the main body portion 62, and the main body portion 62 generates heat. Since the component has a thick portion that defines the heat dissipation path 68 and a thin portion that is set outside the heat dissipation path 68 and has the non-heat generating components 14, 18, and 120 mounted thereon, The size of the entire apparatus can be reduced without obstructing the heat dissipation path 68 of the heat generating component. In particular, outward from the linear outer contour line 69 of the region region (heat transfer diffusion region) 68 composed of a heat radiation path according to the thermal gradient from the heat source mounted on the thick part of the heat sink 60 toward the heat radiation fin 64. Reduce the top and bottom height of this part to thin parts and add non-heat-generating parts (equipment that does not generate heat during operation, and parts that generate less heat than heat-generating parts even if heat is generated during operation) 14, 18, 120 Since the arrangement allows effective use of the space in the apparatus without obstructing the heat dissipation path 68 of the heat-generating component, the apparatus can be reduced in height, the overall size of the apparatus can be reduced, and the heat sink 60 can be reduced. Reduction in weight and cost can be achieved.

  Further, in the power conversion device 1 according to the present embodiment, since the thin portion is provided in the end region of the peripheral edge of the main body 62 of the heat sink 60, the peripheral edge that is not used as the heat dissipation path region 68 of the heat sink 60. While providing a thin portion in the remaining area of the heat sink, a heat-generating component can be disposed with respect to the central main area used as the heat-dissipation path area 68 of the heat sink 60, and the heat dissipation required in a manner that does not substantially impede the heat-dissipation path area 68 While securing the route region 68, the size of the entire apparatus can be reliably reduced.

  Moreover, in the power converter device 1 in this embodiment, since the thin part has the recessed part 22 which accommodates at least one part of the non-heat-generating components 14, 18, 120, the non-heat-generating components 14, 18, 120 are provided. The heat sink 60 can be mounted on the heat sink 60 in a manner that does not unnecessarily enter the housing spaces in the cases 10 and 40 in which the heat generating components and related components are accommodated, and the size of the entire apparatus can be reliably reduced. it can.

  Further, in the power conversion device 1 according to the present embodiment, the non-heat-generating components 14, 18, 120 are the terminal block 14 for fixing the electrical wirings 74, 100, the positioning member 18 for positioning the electrical wirings 74, 100, and the electrical wiring 74. , 100, and the current sensor 120 that detects the current flowing through 100, the components 14, 18, 120 that do not substantially generate heat can be disposed in the remaining area that is not used as the heat dissipation path area 68. While ensuring the necessary heat dissipation path area 68 in a manner that does not substantially impede the heat dissipation path area 68, the size of the entire apparatus can be reliably reduced.

  In the present invention, the type, shape, arrangement, number, and the like of the members are not limited to the above-described embodiment, and the gist of the invention is appropriately replaced such that the constituent elements are appropriately replaced with those having the same operational effects. Of course, it can be changed as appropriate without departing from the scope.

  As described above, the present invention can provide a power conversion device that can reduce the size of the entire device without obstructing the heat dissipation path of the heat-generating component, and has a universal universal character. Therefore, it is expected to be widely applicable to power conversion devices for vehicles such as hybrid vehicles.

DESCRIPTION OF SYMBOLS 1 ... Power converter 10 ... Lower case 12 ... Side peripheral wall 13 ... Bottom wall 14 ... Inner terminal block 16 ... Collar 18 ... Positioning pin 19 ... Opening part 20 ... Outer terminal block 22 ... Recess 24 ... Collar 26 ... Fastening member 28 ... Cutting Notch 30 ... Notch 40 ... Upper case 42 ... Side wall 43 ... Upper wall 44 ... Notch 46 ... Notch 47 ... Projection wall 60 ... Heat sink 62 ... Body 64 ... Fin 66 ... Recess 68 ... Heat transfer Diffusion region 69 ... Outer contour 70 ... Power module 72 ... Module case 74 ... Power module side bus bar 76 ... Heat spreader 80 ... Circuit board 82 ... Mounted component occupied region 100 ... Output bus bar 102 ... Fastening member 104 ... Shield plate 120 ... Current sensor 121 ... Case 122 ... Through hole

Claims (4)

In a power conversion device that exhibits a power conversion function, comprising a heat generation component that generates heat during operation, a non-heat generation component that is in thermal contact with the heat generation component, and a heat sink that mounts the heat generation component and the non-heat generation component.
The heat sink includes a main body part, and a heat radiation fin provided in the main body part,
The main body includes a thick part that defines the heat dissipation path while mounting the heat generating component, and a thin part that is mounted outside the heat dissipation path while mounting the non-heat generating component. A power converter.   The power conversion device according to claim 1, wherein the thin portion is provided in an end region of a peripheral edge of the main body portion.   The power converter according to claim 1, wherein the thin portion has a recess that accommodates at least a part of the non-heat-generating component.   The non-heat-generating component includes any one of a terminal block for fixing an electric wiring, a positioning member for positioning the electric wiring, and a current sensor for detecting a current flowing through the electric wiring. The power converter in any one.

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