JP2016170983A - Luminaire and light fitting - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a luminaire which inhibits warpage of a mounting substrate, and to provide a light fitting.SOLUTION: A luminaire includes: a long housing 20; a mounting substrate 11 formed by a long resin substrate and disposed in the housing 20; and LED elements 12 (light emitting elements) mounted on the mounting substrate 11. The mounting substrate 11 has bending parts 11a formed by folding sides of the resin substrate which are arranged along a longitudinal direction.SELECTED DRAWING: Figure 3

Description

  The present invention relates to a lighting device and a lighting fixture, for example, a lighting device and a lighting fixture having a light emitting element such as a light emitting diode (LED).

  The LED is expected to be an alternative light source for various lamps such as fluorescent lamps and incandescent lamps which are conventionally known because of high efficiency and long life. In particular, product development of lamps using LEDs (LED lamps) has been actively promoted.

  As this type of LED lamp, for example, a straight tube type LED lamp (straight tube LED lamp) that replaces a straight tube fluorescent lamp is known (see Patent Document 1).

JP 2009-043447 A

  The straight tube LED lamp includes, for example, a long casing, a pair of caps provided at both ends of the casing, and an LED module housed in the casing. The LED module includes a mounting board and a plurality of LED elements mounted on the mounting board.

  In recent years, with the increase in the length of LED modules, it has been studied to use a long substrate as a mounting substrate for mounting LED elements. However, when a long mounting board is used, there is a problem that the mounting board is warped with a temperature change such as when the lamp is turned on or the ambient environment of the lamp, and a desired light distribution characteristic cannot be obtained. .

  In particular, it was found that when a resin substrate in which a metal wiring is formed (such as CEM-3) is used as the mounting substrate, the mounting substrate is greatly warped.

  The present invention has been made to solve such a problem, and an object thereof is to provide a lighting device and a lighting fixture capable of suppressing warpage of a mounting board.

  In order to achieve the above object, one embodiment of a lighting device according to the present invention includes a housing, a long resin substrate, a mounting substrate disposed in the housing, and mounted on the mounting substrate. The mounting substrate has a bent portion formed by bending a side along the longitudinal direction of the resin substrate.

  According to the present invention, it is possible to suppress warping of the mounting substrate.

It is an external appearance perspective view of the straight tube | pipe LED lamp which concerns on embodiment. It is sectional drawing (XZ sectional drawing) of the straight tube | pipe LED lamp which concerns on embodiment. It is sectional drawing (YZ sectional drawing) of the straight tube | pipe LED lamp which concerns on embodiment. It is a perspective view of the LED module of the straight tube | pipe LED lamp which concerns on embodiment. It is a perspective view of the LED module of the straight tube | pipe LED lamp of a comparative example. It is sectional drawing (YZ sectional drawing) of the straight tube | pipe LED lamp of a comparative example. It is an external appearance perspective view of the illuminating device which concerns on embodiment. It is sectional drawing (YZ sectional drawing) of the straight tube | pipe LED lamp which concerns on the modification 1. It is sectional drawing (YZ sectional drawing) of the straight tube | pipe LED lamp which concerns on the modification 2. It is sectional drawing (YZ sectional drawing) of the straight tube | pipe LED lamp which concerns on the modification 3. It is sectional drawing (YZ sectional drawing) of the straight tube | pipe LED lamp which concerns on the modification 4. It is sectional drawing (YZ sectional drawing) of the straight tube | pipe LED lamp which concerns on the modification 5. It is sectional drawing (YZ sectional drawing) of the straight tube | pipe LED lamp which concerns on the modification 6. It is sectional drawing (YZ sectional drawing) of the straight tube | pipe LED lamp which concerns on the other aspect of the modification 6. It is an external appearance perspective view of the illuminating device which concerns on the modification 7. FIG. It is an external appearance perspective view of the illuminating device which concerns on the modification 8.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. Each of the embodiments described below shows a preferred specific example of the present invention. Therefore, the numerical values, shapes, materials, components, component arrangement positions, connection forms, and the like shown in the following embodiments are merely examples, and are not intended to limit the present invention. Therefore, among the constituent elements in the following embodiments, constituent elements that are not described in the independent claims showing the highest concept of the present invention are described as optional constituent elements.

  Each figure is a schematic diagram and is not necessarily illustrated strictly. Moreover, in each figure, the same code | symbol is attached | subjected to the substantially same material and member, and the overlapping description is abbreviate | omitted or simplified.

(Embodiment)
In the following embodiments, a straight tube LED lamp that is a light source for illumination and a lighting fixture including the straight tube LED lamp are illustrated as an aspect of the lighting device. In the present embodiment, the tube axis direction (longitudinal direction) of the straight tube LED lamp is defined as the X axis direction, and one direction (short direction) orthogonal to the X axis is defined as the Y axis direction. The direction orthogonal to is the Z-axis direction.

[Straight tube LED lamp]
A configuration of the straight tube LED lamp 1 according to the embodiment will be described with reference to FIGS. 1, 2, and 3. FIG. 1 is an external perspective view of a straight tube LED lamp according to an embodiment. 2 is an XZ sectional view of the straight tube LED lamp, and FIG. 3 is a sectional view (YZ sectional view) of the straight tube LED lamp taken along line III-III in FIG.

  The straight tube LED lamp 1 is a straight tube type LED lamp that replaces a conventional straight tube fluorescent lamp, and as shown in FIGS. 1 to 3, the LED module 10 and a long housing for housing the LED module 10. A casing 20, a base 30 accommodated in the casing 20, a drive circuit 40 for causing the LED module 10 to emit light, and a pair of caps 50 provided at both ends in the longitudinal direction of the casing 20 Is provided.

  In the present embodiment, a one-side power feeding method is adopted in which power is fed from only one side of the pair of caps 50.

[LED module]
The LED module 10 is a light source of the straight tube LED lamp 1 and emits, for example, white light as illumination light. As an example, the LED module 10 is a BY type white LED light source that emits white light by a blue LED chip and a yellow phosphor.

  Only one LED module 10 may be arranged so as to extend from one end in the longitudinal direction of the housing 20 to the other end, or a plurality of LED modules 10 may be provided along the tube axis direction of the housing 20. It may be arranged. In any case, the LED module 10 is long.

  As shown in FIGS. 2 and 3, the LED module 10 includes a mounting substrate 11 and a plurality of LED elements 12 mounted on one surface (first main surface) of the mounting substrate 11. Although not shown, the LED module 10 further emits the LED element 12 from the outside of the LED module 10 and metal wiring patterned in a predetermined shape on the first main surface (element mounting surface) of the mounting substrate 11. And a pair of connection terminals that receive the supply of electric power. The metal wiring and the pair of connection terminals are electrically connected.

  The mounting substrate 11 is a substrate for mounting the LED element 12. In the present embodiment, a rectangular substrate that is long in the longitudinal direction of the housing 20 is used as the mounting substrate 11. In the mounting substrate 11, an element mounting surface on which the LED element 12 is mounted is a first main surface (front surface), and a surface opposite to the first main surface is a second main surface (back surface). Surface). In the present embodiment, the LED element 12 is mounted only on the first main surface of the mounting substrate 11, and the LED element is not mounted on the second main surface. As will be described later, the LED module 10 is disposed on the base 30 such that the second main surface side of the mounting substrate 11 faces the base 30.

  The mounting substrate 11 is constituted by a resin substrate based on a resin. As the resin substrate, for example, a glass epoxy substrate made of glass fiber and epoxy resin, a substrate made of paper phenol or paper epoxy, or the like can be used.

  In the present embodiment, the resin substrate has flexibility, and the mounting substrate 11 is formed in a predetermined shape by bending the resin substrate. Therefore, the thickness of the resin substrate used as the mounting substrate 11 is preferably thinner than the thickness of the housing 20, and is, for example, 1 mm or less, more preferably 0.7 mm or less. In the present embodiment, a glass epoxy substrate made of a thin film type glass epoxy resin having a thickness of 0.1 mm or more and 0.2 mm or less is used as the resin substrate constituting the mounting substrate 11.

  Here, a detailed configuration of the mounting substrate 11 will be described with reference to FIGS. 2 and 3 and FIG. FIG. 4 is a perspective view of the LED module of the straight tube LED lamp according to the embodiment.

  As shown in FIGS. 2 to 4, the mounting substrate 11 includes a bent portion 11 a formed by bending a side along the longitudinal direction of the long resin substrate. Specifically, the mounting substrate 11 includes a bent portion 11a and an element mounting portion 11b that is a portion on which the LED element 12 is mounted.

  The bent portion 11 a is a first plate portion of a resin substrate that extends in the longitudinal direction of the housing 20. The element mounting portion 11 b is a second plate portion of a resin substrate that extends in the longitudinal direction of the housing 20. That is, the resin substrate before being bent is a flat plate in which the first plate portion corresponding to the bent portion 11a and the second plate portion corresponding to the element mounting portion 11b are formed in a planar shape.

  The bent portion 11a is formed by bending so as to raise the long side end portion of the long and rectangular flat plate-shaped resin substrate. In the present embodiment, the height of the bent portion 11a is constant along the X-axis direction. That is, the bending width (bending amount) when the long side end of the resin substrate is bent is made constant along the X-axis direction. Note that the height of the bent portion 11a may not be constant.

  In the present embodiment, the bent portion 11a is formed by bending the resin substrate so that the first main surface (device mounting surface) on which the LED element 12 is mounted on the mounting substrate 11 is mountain-folded. ing.

  A pair of bent portions 11a is formed so as to face each other. Specifically, the pair of bent portions 11a are formed by bending each of the pair of sides facing each other along the longitudinal direction of the resin substrate. The height (the amount of bending) of each of the pair of bent portions 11a is the same, but may be different instead of the same. For example, the element mounting part 11b of the mounting substrate 11 can be inclined by making the height of each of the pair of bent parts 11a different. Thereby, a light distribution angle can be adjusted.

  As shown in FIG. 3, in the cross section (XY cross section) perpendicular to the longitudinal direction of the housing 20, the bent portion 11a and the element mounting portion 11b form a predetermined angle. That is, the mounting substrate 11 is formed by bending the resin substrate so that the bent portion 11a and the element mounting portion 11b form a predetermined angle.

  The amount of bending when the resin substrate is bent when forming the bent portion 11a can be expressed as a bending angle (bending angle) θ. The bending angle θ is, for example, about 60 ° to about 100 °, and is set to 90 ° in the present embodiment.

  In the present embodiment, the height (bending amount) of the bent portion 11a is smaller than the width (length in the Y-axis direction) of the element mounting portion 11b.

  The LED element 12 is an example of a light emitting element, and is mounted on a first main surface (element mounting surface) on the mounting substrate 11. As shown in FIG. 2, in the present embodiment, the plurality of LED elements 12 are mounted in a line along the longitudinal direction (X-axis direction) of the mounting substrate 11, but the layout of the LED elements 12 is as follows. Is not limited to this.

  Each LED element 12 is a so-called surface mount device (SMD) type light emitting element in which an LED chip and a phosphor are packaged. As shown in FIG. 3, each LED element 12 includes a package (container) 12a, an LED chip 12b accommodated in the package 12a, and a sealing member 12c for sealing the LED chip 12b. The LED element 12 in the present embodiment is a white LED element that emits white light.

  The package 12a is molded from a white resin or the like, and includes an inverted frustoconical recess (cavity). The inner surface of the recess is an inclined surface, and is configured to reflect light from the LED chip 12b upward.

  The LED chip 12b is mounted on the bottom surface of the recess of the package 12a. The LED chip 12b is an example of a semiconductor light emitting element that emits light with a predetermined direct-current power, and is a bare chip that emits monochromatic visible light. The LED chip 12b is die-bonded to the bottom surface of the recess of the package 12a, for example, with a die attach material (die bond material). For example, a blue LED chip that emits blue light when energized can be used as the LED chip 12b.

  The sealing member 12c is, for example, a phosphor-containing resin including a phosphor that is a light wavelength converter, and converts the wavelength of light from the LED chip 12b to a predetermined wavelength (color conversion) and seals the LED chip 12b. The LED chip 12b is protected by stopping. The sealing member 12c is filled in the recess of the package 12a, and is sealed up to the opening surface of the recess. As the sealing member 12c, for example, when the LED chip 12b is a blue LED, a phosphor-containing resin in which YAG (yttrium, aluminum, garnet) -based yellow phosphor particles are dispersed in a silicone resin in order to obtain white light. Can be used. Accordingly, since the yellow phosphor particles are excited by the blue light of the blue LED chip and emit yellow light, the sealing member 12c emits white light by mixing the excited yellow light and the blue light of the blue LED chip. Is released. The sealing member 12c may also contain a light diffusing material such as silica.

  Although not shown, the LED element 12 has two electrode terminals, a positive electrode and a negative electrode, and these electrode terminals and a metal wiring (metal pattern) patterned on the mounting substrate 11 are electrically connected. Has been. That is, the metal wiring is electrically connected to the LED element 12. This metal wiring is formed so as to avoid the bent portion of the mounting substrate 11 (resin substrate). That is, no metal wiring is formed at the bent portion of the mounting substrate 11. Thereby, it is possible to prevent the metal wiring from being disconnected when the resin substrate is bent.

[Case]
The housing | casing 20 is a translucent cover which has translucency. As an example, the housing 20 is a long cylindrical straight tube having openings at both ends. The housing 20 is an outer member that forms an outer shell of the straight tube LED lamp 1. In addition, although the cylindrical thing is used for the housing | casing 20, it does not necessarily need to be cylindrical and may use a rectangular tube-shaped thing.

  Inside the housing 20, the LED module 10, the base 30, the drive circuit 40, and the like are arranged. A first base 51 is attached to one end of the housing 20 in the longitudinal direction, and a second base 52 is attached to the other end of the housing 20 in the longitudinal direction. The housing 20 and the first base 51 or the second base 52 can be bonded and fixed with a resin adhesive such as silicone resin.

The housing 20 can be, for example, a straight tube made of glass or transparent resin that is transparent to visible light. More specifically, the casing 20 is a glass tube (glass bulb) made of soda-lime glass having silica (SiO ₂ ) of 70 to 72 [%], polycarbonate (PC), acrylic (PMMA), or the like. A plastic tube made of a transparent resin material can be used. In the present embodiment, the same glass tube (the total length is about 1167 mm) used for the 40-type straight tube fluorescent lamp is used as the housing 20.

  Further, the housing 20 may be provided with a light diffusing unit having a light diffusing function for diffusing light from the LED module 10. Thereby, the light emitted from the LED module 10 can be diffused when passing through the housing 20. As the light diffusion portion, for example, a light diffusion sheet or a light diffusion film formed on the inner surface or the outer surface of the housing 20 can be considered. Specifically, a milky white light diffusion film can be formed by attaching a resin or a white pigment containing a light diffusion material (fine particles) such as silica or calcium carbonate to the inner surface or the outer surface of the housing 20. Other light diffusing portions include a lens structure provided inside or outside the housing 20, or a concave portion or a convex portion formed in the housing 20. For example, the case 20 may be provided with a light diffusion function (light diffusion part) by printing a dot pattern on the inner surface or the outer surface of the case 20 or processing a part of the case 20 into irregularities. it can. Or the housing | casing 20 itself can also be made to have a light-diffusion function (light-diffusion part) in the housing | casing 20 by shape | molding using the resin material etc. in which the light-diffusion material was disperse | distributed.

[Base]
The base 30 is a holding member for holding the LED module 10 (mounting substrate 11). The LED module 10 (mounting substrate 11) is fixed to the base 30. In the present embodiment, the mounting substrate 11 is fixed to the base 30 so that the pair of bent portions 11a are positioned on the base 30 side. Specifically, an adhesive 61 is provided in a portion of the mounting substrate 11 surrounded by the pair of bent portions 11a, the element mounting portion 11b, and the base 30, and the mounting substrate 11 and the base 30 are attached to this adhesive. 61 is fixed by adhesion. In this case, as the adhesive 61, an adhesive having a high thermal conductivity may be used. Thereby, the heat generated in the LED element 12 can be efficiently conducted to the base 30 via the adhesive 61. As the adhesive 61, for example, a resin adhesive made of silicone resin or the like can be used.

  The base 30 is fixed to the inner surface of the housing 20. In the present embodiment, the base 30 and the housing 20 are bonded and fixed by an adhesive 62. The adhesive 62 is intermittently formed along the longitudinal direction of the housing 20, but is not limited thereto, and may be formed in a straight line over the entire longitudinal direction of the base 30. As the adhesive 62, for example, a resin adhesive made of silicone resin or the like can be used.

  The base 30 is a single long plate material, for example, a metal metal plate made of an aluminum alloy or the like, or a resin resin plate. The base 30 is preferably composed of a metal material or a resin material having high thermal conductivity so that the base 30 also functions as a heat sink. Thereby, the heat generated in the LED module 10 can be efficiently conducted to the housing 20 via the base 30.

[Drive circuit]
The drive circuit 40 is a lighting circuit for controlling the lighting state of the LED element 12 in the LED module 10. In the present embodiment, the drive circuit 40 adjusts the DC voltage input via the first base 51 to a predetermined polarity and voltage value and outputs the adjusted voltage to the LED module 10.

  As shown in FIG. 2, the drive circuit 40 includes, for example, one or a plurality of circuit elements (circuit parts) 41 for supplying power to the LED elements 12. The plurality of circuit elements 41 are mounted on the mounting substrate 11 on which the LED elements 12 are mounted. Specifically, the plurality of circuit elements 41 are mounted on the element mounting portion 11 b of the mounting substrate 11.

  The plurality of circuit elements include, for example, a diode bridge circuit (rectifier circuit) that performs full-wave rectification of input DC power, a fuse element, and the like. As the plurality of circuit elements, a resistor, a capacitor, a coil, a diode, a transistor, or the like may be used as necessary.

  In the present embodiment, the plurality of circuit elements 41 are mounted on the mounting substrate 11, but are not limited thereto. For example, a circuit board different from the mounting board 11 may be arranged in the housing 20 or the base 50, and a plurality of circuit elements 41 may be mounted on this circuit board.

[First cap]
The first base 51 is a power supply base for supplying power to the LED module 10. The first base 51 is a power receiving base that receives power for causing the LED module 10 (LED element 12) to emit light from the outside of the lamp (power source or the like). The 1st nozzle | cap | die 51 is latched by the socket of a lighting fixture, for example, and is comprised so that the straight tube | pipe LED lamp 1 may be supported.

  The first base 51 is provided at one end of the casing 20 in the longitudinal direction. For example, the first base 51 is configured in a cap shape so as to cover the opening at one end of the casing 20 in the longitudinal direction. The first base 51 includes a base body 51a and a pair of power supply pins 51b.

  The base body 51a has a substantially bottomed cylindrical shape having an opening and a bottom surface, and is made of a resin material such as polybutylene terephthalate (PBT).

  The power supply pin 51b is an example of a base pin, and is provided on the base body 51a. The power supply pin 51b is attached so as to protrude outward from the bottom of the base body 51a. The power supply pins 51b are a pair of conductive pins that receive power for causing the LED module 10 to emit light from an external device (power supply circuit) such as a lighting fixture, and are made of a metal material such as brass. In the present embodiment, DC power is received by the pair of power supply pins 51b.

  By attaching the first base 51 to the socket of the lighting fixture, the pair of power supply pins 51b are in a state of receiving DC power from a power supply device (power supply circuit) built in the lighting fixture. The pair of power supply pins 51 b are connected to the drive circuit 40 in the housing 20 by lead wires or the like, and the DC power received by the pair of power supply pins 51 b is supplied to the drive circuit 40. In addition, you may comprise a power supply device so that the straight tube | pipe LED lamp 1 may be incorporated instead of the lighting fixture outside a lamp. In this case, the pair of power supply pins 51 b receives AC power from, for example, a commercial AC power supply and supplies the power to a power supply device built in the housing 20.

  The 1st nozzle | cap | die 51 comprised in this way can be produced by insert molding using the electric power feeding pin 51b and the resin material, for example. Moreover, the 1st nozzle | cap | die 51 can also be produced by press-fitting the feed pin 51b in the nozzle | cap | die main body 51a which is a resin molding.

  In addition, since the 1st nozzle | cap | die 51 which concerns on this Embodiment is a GX16t-5 nozzle | cap | die (L-shaped pin cap) in the straight tube LED lamp based on JISC7709-1, the electric power feeding pin 51b is L-shaped. .

[Second base]
The second base 52 is a non-power supply base and has a function of attaching the straight tube LED lamp 1 to a lighting fixture. The 2nd nozzle | cap | die 52 is latched by the socket of a lighting fixture, for example, and is comprised so that the straight tube | pipe LED lamp 1 may be supported.

  The second base 52 is provided at the other end in the longitudinal direction of the housing 20. For example, the second base 52 is configured in a cap shape so as to cover the opening at the other end in the longitudinal direction of the housing 20. The second base 52 in the present embodiment includes a base body 52a and a non-feed pin 52b.

  The base body 52a has a substantially bottomed cylindrical shape having an opening and a bottom surface, and is made of a resin material such as polybutylene terephthalate (PBT).

  The non-feeding pin 52b is an example of a cap pin, and is provided on the cap body 52a. The non-power supply pin 52b is attached so as to protrude outward from the bottom of the base body 52a. The non-power supply pin 52b is an attachment pin for attaching the straight tube LED lamp 1 to a lighting fixture, and is made of a metal material such as brass, for example. The non-feed pin 52b is a single conductive pin having a T-shaped cross section.

  Similarly to the first base 51, the second base 52 configured as described above can be manufactured by insert molding using the non-feed pin 52b and a resin material, for example. Moreover, the 2nd nozzle | cap | die 52 can also be produced by press-fitting the non-power feeding pin 52b in the nozzle | cap | die main body 52a which is a resin molding.

  The second base 52 may be provided with a grounding function, and the second base 52 may be used as a grounding base. In this case, the non-feeding pin 52b functions as an earth pin grounded via the lighting fixture, and is connected to the metal base 30 with earth. Thereby, the base 30 is grounded via the non-feeding pin 52b and the lighting fixture.

[Effects]
Next, the effect of the straight tube LED lamp 1 according to the present embodiment will be described including the background to the present invention.

  In recent years, LED modules have become longer, and it has been studied to use a long substrate having a large aspect ratio as a mounting substrate on which LED elements are mounted. However, when a long mounting board is used, the mounting board is warped.

  In particular, when a resin substrate (for example, CEM-3) is used as the mounting substrate, the mounting substrate is greatly warped. This is considered to be caused by a difference in thermal expansion at the time of temperature change due to the difference between the linear expansion coefficient of the resin substrate and the linear expansion coefficient of the metal wiring (metal pattern) formed on the element mounting surface of the resin substrate. That is, it warps due to the thermal stress of the resin substrate.

  On the other hand, in order to improve the heat dissipation of the heat generated in the LED element, it is required to make the mounting substrate on which the LED element is mounted thinner. For example, it has been studied to use a resin substrate having a thickness of 1 mm or less as a mounting substrate.

  Thus, when a thin resin substrate having a small thickness is used as the mounting substrate, the mounting substrate is easily warped and the amount of warpage is increased. That is, in addition to the mounting substrate being thinned and the mechanical strength being reduced, the mounting substrate is easily greatly warped by the thermal stress of the resin substrate. As a result, the LED element is displaced from a predetermined position, and there is a problem that a desired light distribution characteristic cannot be obtained.

  Therefore, as shown in FIG. 5, when a mounting substrate 11A made of a long resin substrate on which the LED elements 12 are mounted is used, in order to suppress warping of the mounting substrate 11A, for example, a thickness of about 1 mm is used. Using a double-sided substrate (for example, CEM-3) in which metal is formed on both sides of the resin substrate, as shown in FIG. 6, dummy metal wiring is provided on the surface (back surface) opposite to the element mounting surface of the mounting substrate 11A. Formation of 13A (metal pattern) has been studied. In this case, the mounting substrate 11 </ b> A and the base 30 are bonded and fixed with an adhesive 61 applied between the metal wiring 13 </ b> A and the base 30.

  However, even if the dummy metal wiring 13A is formed on the back surface of the mounting substrate 11A made of a resin substrate, if the metal wiring 13A is thinned to reduce the overall thickness of the mounting substrate 11A, the metal wiring is caused by the thermal stress of the resin substrate. It was found that 13A was pulled and the warping of the mounting substrate 11A could not be suppressed well.

  On the other hand, if the thickness of the metal wiring 13A is increased in order to suppress the warpage of the mounting board 11A, the thickness of the mounting board 11A including the metal wiring 13A increases, and a thin mounting board cannot be realized. . For this reason, problems such as being unable to efficiently dissipate heat generated in the LED element 12 occur.

  Thus, it has been extremely difficult to suppress warping of the mounting substrate when a long and thin resin substrate having a thickness of 1 mm or less is used as the mounting substrate.

  Therefore, in the present embodiment, as shown in FIGS. 3 and 4, as a substrate on which the LED element 12 is mounted, a bent portion 11a formed by bending a side along the longitudinal direction of a long resin substrate. The mounting substrate 11 having the above is used.

  Thereby, even if a long resin substrate is used as the mounting substrate 11 of the LED element 12, the mechanical strength against bending in the longitudinal direction of the mounting substrate 11 is structurally increased by forming the bent portion 11a. Can do. As a result, warpage of the mounting substrate 11 due to thermal stress of the resin substrate can be suppressed.

  A dummy metal pattern may be further formed on the surface of the mounting substrate 11 opposite to the element mounting surface. Thereby, the curvature of the mounting substrate 11 can be further suppressed.

  In the present embodiment, as shown in FIG. 3, the bent portion 11 a and the element mounting portion 11 b in the mounting substrate 11 form a predetermined angle in a cross section perpendicular to the longitudinal direction of the housing 20. . For example, the bending angle θ of the bent portion 11a is, for example, about 60 ° to about 100 °.

  Thereby, since the reinforcement effect by the bending part 11a can fully be exhibited, the curvature suppression effect of the mounting substrate 11 by the bending part 11a can be acquired reliably.

  Moreover, in this Embodiment, the bending part 11a is formed by bending a resin substrate so that the surface (element mounting surface) in which the LED element 12 in the mounting substrate 11 is mounted may be mountain-folded. For example, a pair of bent portions 11a is formed by bending each of a pair of sides facing each other along the longitudinal direction of the resin substrate.

  Thereby, a recess (space) can be formed on the surface of the mounting substrate 11 opposite to the element mounting surface. That is, the concave portion can be formed by bending the mounting substrate 11. Therefore, the space area by this recessed part can be utilized. For example, the circuit element 41 can be mounted on the back surface of the element mounting portion 11b of the mounting substrate 11, or the power supply circuit can be accommodated in the recess in the case of a built-in power supply type.

  In this case, you may make the depth of the recessed part of the mounting substrate 11 comprised by bending the resin substrate below the thickness of the mounting substrate 11. FIG. In other words, the height of the inner surface of the bent portion 11a (the depth of the concave portion) after being bent is set to the thickness of the mounting substrate 11 by setting the bending width when the long side end portion of the resin substrate is bent to be equal to or less than the thickness of the resin substrate. The following may be used. For example, when the thickness of the mounting substrate 11 (resin substrate) is 1 mm or less, the depth of the recess is 1 mm or less.

  As described above, by setting the depth of the concave portion of the mounting substrate 11 to be equal to or less than the thickness of the mounting substrate 11, heat extraction from the back surface of the mounting substrate 11 can be improved, and heat generated in the LED element 12 can be efficiently generated. Heat can be dissipated.

  Further, in the present embodiment, a base 30 for holding the mounting board 11 is provided, and the mounting board 11 is fixed to the base 30 so that the pair of bent portions 11a are located on the base 30 side. ing.

  Thereby, the space area enclosed by a pair of bending part 11a, the element mounting part 11b, and the base 30 can be obtained. That is, a space region can be formed in a portion surrounded by the recess formed by the pair of bent portions 11 a and the element mounting portion 11 b and the base 30.

  Therefore, as described above, the circuit element 41, the power supply circuit, and the like can be accommodated using this space region. Further, the mounting substrate 11 and the base 30 can be bonded and fixed by providing the adhesive 61 in a space region surrounded by the pair of bent portions 11a, the element mounting portion 11b, and the base 30. Thereby, even if the mounting area of the LED element 12 is equivalent to the conventional one, the contact area with the adhesive 61 can be increased by the amount of the bent portion 11a. As a result, not only can the adhesive strength between the mounting substrate 11 and the base 30 be improved, but also the heat generated in the LED element 12 can be efficiently conducted to the base 30 via the adhesive 61 so that heat is dissipated. Can be improved.

[Lighting device]
Next, the lighting fixture 2 which concerns on embodiment of this invention is demonstrated using FIG. FIG. 7 is an external perspective view of the lighting fixture according to the embodiment.

  As shown in FIG. 7, the lighting fixture 2 according to the embodiment is a base light type lighting fixture, and includes a straight tube LED lamp 1 and a fixture main body 3. In the present embodiment, two straight tube LED lamps 1 are used.

  The instrument main body 3 includes a pair of sockets 4 that are electrically connected to the straight tube LED lamp 1 and holds the straight tube LED lamp 1, and an instrument housing 5 to which the socket 4 is attached. The instrument housing 5 can be formed by, for example, pressing an aluminum steel plate. Moreover, the inner surface of the instrument housing | casing 5 is a reflective surface which reflects the light emitted from the straight tube | pipe LED lamp 1 in the predetermined direction (for example, downward).

  The instrument body 3 configured as described above is attached to, for example, a ceiling via a fixture. A translucent cover member may be provided so as to cover the straight tube LED lamp 1.

  As described above, the straight tube LED lamp 1 according to the present embodiment can be realized as a lighting fixture or the like.

(Modification)
Hereinafter, modifications of the present invention will be described with reference to the drawings.

(Modification 1)
FIG. 8 is a cross-sectional view of a straight tube LED lamp according to the first modification.

  As shown in FIG. 8, in the mounting substrate 11 in this modification, the LED element 12 is mounted not only on the element mounting portion 11b but also on the bent portion 11a. In this case, as shown in FIG. 8, it is good to be comprised so that the bending part 11a may incline. For example, the bending portion 11a may be gently inclined by setting the bending angle θ of the bending portion 11a to about 30 ° to about 60 °.

  Also in this modification, since the bent part 11a is formed in the mounting substrate 11, the curvature of the mounting substrate 11 can be suppressed to the same effect as the above embodiment.

  Furthermore, in this modification, the LED element 12 is also mounted on the bent portion 11a. Thereby, the straight tube | pipe LED lamp which has the light distribution characteristic of a wide light distribution angle is realizable.

  In this modification, the bent portion 11a is gently inclined, but the bent angle θ of the bent portion 11a is set to about 60 ° to about 100 ° (for example, 90 °) as in the above embodiment. Good.

  Moreover, in this modification, although the LED element 12 is mounted in each of a pair of bending part 11a, you may mount the LED element 12 only in one side of a pair of bending part 11a. Moreover, you may mount the LED element 12 only in the bending part 11a, without mounting the LED element 12 in the element mounting part 11b.

(Modification 2)
FIG. 9 is a cross-sectional view of a straight tube LED lamp according to Modification 2.

  As shown in FIG. 9, in this modification, the circuit element 41 is mounted on the bent portion 11 a of the mounting substrate 11. In this case, as shown in FIG. 9, the circuit element 41 may be mounted on the bent portion 11a with the bent portion 11a inclined, and the bent portion is bent with the bending angle θ set to 90 ° as shown in FIG. The circuit element 41 may be mounted on the part 11a.

  Also in this modification, since the bent part 11a is formed in the mounting substrate 11, the curvature of the mounting substrate 11 can be suppressed to the same effect as the above embodiment.

  Furthermore, in this modification, the circuit element 41 is mounted on the bent portion 11a. Thereby, the dead space in the housing | casing 20 can be used effectively.

  In this modification, the circuit element 41 is mounted on the front surface of the bent portion 11a, but may be mounted on the back surface of the bent portion 11a. Thereby, the part (concave part) enclosed by a pair of bending part 11a, the element mounting part 11b, and the base 30 can be used effectively.

(Modification 3)
FIG. 10 is a cross-sectional view of a straight tube LED lamp according to Modification 3.

  As shown in FIG. 10, in the present modification, each of the pair of bent portions 11 a is a mountain formed by bending the resin substrate twice so that the element mounting surface of the mounting substrate 11 is a mountain fold and a valley fold. It has the fold part 11a1 and the valley fold part 11a2. Moreover, the valley fold part 11a2 and the base 30 in each of a pair of bending part 11a are being fixed with the screw 70. FIG.

  Also in this modification, since the bent part 11a is formed in the mounting substrate 11, the curvature of the mounting substrate 11 can be suppressed to the same effect as the above embodiment.

  Furthermore, in this modification, the bent portion 11 a of the mounting substrate 11 and the base 30 are fixed by screws 70. Thereby, the mounting substrate 11 and the base 30 can be fixed without using an adhesive. Therefore, the space region of the portion (concave portion 80) surrounded by the pair of bent portions 11a, the element mounting portion 11b, and the base 30 can be used. For example, a power circuit or the like can be stored in this space area.

  In this modification, the bent portion 11a and the base 30 are fixed by the screw 70, but the bent portion 11a and the base 30 may be fixed by a fastening member other than the screw 70.

(Modification 4)
FIG. 11 is a cross-sectional view of a straight tube LED lamp according to Modification 4.

  As shown in FIG. 11, in the straight tube LED lamp in this modification, the base 30 is not disposed, and the mounting substrate 11 and the housing 20 are fixed with an adhesive 61. Specifically, the mounting substrate 11 and the housing 20 are bonded and fixed with an adhesive 61 provided in a portion (concave portion) surrounded by the pair of bent portions 11 a, the element mounting portion 11 b, and the housing 20. .

  Also in this modification, since the bent part 11a is formed in the mounting substrate 11, the curvature of the mounting substrate 11 can be suppressed to the same effect as the above embodiment.

  Further, in the present modification, the mounting substrate 11 is directly fixed to the inner surface of the housing 20 via the adhesive 61. Thereby, since the heat conduction path between the LED element 12 and the housing 20 can be shortened, the heat dissipation of the heat generated in the LED element 12 can be further improved as compared with the above embodiment.

(Modification 5)
FIG. 12 is a cross-sectional view of a straight tube LED lamp according to Modification 5.

  In the above embodiment, the bent portion 11a is formed by bending the resin substrate so that the element mounting surface of the mounting substrate 11 is mountain-folded. However, as shown in FIG. The bent portion 11a is formed by bending the resin substrate so that the element mounting surface of the substrate 11 is valley-folded. Specifically, the pair of bent portions 11a is formed by bending each of the pair of sides facing each other along the longitudinal direction of the resin substrate.

  In the present modification, the element mounting portion 11 b of the mounting substrate 11 is placed on the base 30. The mounting substrate 11 and the base 30 can be fixed with an adhesive, for example.

  Also in this modification, since the bent part 11a is formed in the mounting substrate 11, the curvature of the mounting substrate 11 can be suppressed to the same effect as the above embodiment.

  Furthermore, since the element mounting portion 11b of the mounting substrate 11 can be placed on the base 30, heat generated by the LED elements 12 can be efficiently conducted to the base 30. Thereby, the heat dissipation of the heat generated in the LED element 12 is improved.

(Modification 6)
FIG. 13 is a cross-sectional view of a straight tube LED lamp according to Modification 6.

  The casing 20 in the above embodiment is a non-split type, but the casing in the present modification is a split type. Specifically, as shown in FIG. 13, in this modification, a long cylindrical casing (envelope) is configured by the translucent cover 20A and the base 30A. That is, by connecting the translucent cover 20A and the base 30A, a cylindrical casing having openings at both ends is configured, and a base 50 (not shown) is attached to each of both ends. In addition, the casing when the translucent cover 20A and the base 30A are joined has a circular outline in a cross section perpendicular to the longitudinal direction.

  The translucent cover 20A is a translucent substantially semi-cylindrical translucent member, and the cross-sectional shape in a cross section (YZ cross section) perpendicular to the X axis is a substantially semicircular arc shape. Further, the translucent cover 20A is fixed to the base 30A by engaging the edges on both sides in the circumferential direction with the stepped portions of the base 30A. The translucent cover 20A can be formed using a resin material such as polycarbonate or acrylic.

  The base 30A is a long member, and is covered with the translucent cover 20A. In this modification, the base 30A is a metal base made of metal. As the base 30A, for example, an extruded material made of aluminum can be used. The base 30 </ b> A functions as a heat sink that dissipates heat generated by the LED module 10 and also functions as a mounting table for mounting and fixing the LED module 10. In order to directly radiate heat from the base 30A to the outside of the lamp, a part of the base 30A is exposed to the outside of the lamp. Radiation fins are provided on the exposed portion of the base 30A. A resin base made of resin may be used as the base 30A.

  Also in this modification, since the bent part 11a is formed in the mounting substrate 11, the curvature of the mounting substrate 11 can be suppressed to the same effect as the above embodiment.

  Moreover, in this modification, as shown in FIG. 14, the recessed part 31 may be provided in the base 30A, and the LED module 10 may be arrange | positioned in this recessed part 31. As shown in FIG. Thus, by disposing the LED module 10 in the recess 31, leakage of the adhesive 61 can be suppressed. This configuration can also be applied to the above-described embodiment and modifications 1 to 5. That is, a recess may be provided in the base 30, and the LED module 10 may be disposed in this recess.

(Other variations)
The lighting device according to the present invention has been described above based on the embodiments and the modifications. However, the present invention is not limited to the above-described embodiments and modifications.

  For example, in the above-described embodiment and modification, the bent portion 11a is formed by bending the side in the longitudinal direction of the resin substrate once or twice, but the present invention is not limited to this, and the resin substrate is bent three or more times. The bent portion may be formed by this. That is, the cross-sectional shape of the portion surrounded by the pair of bent portions 11a, the element mounting portion 11b, and the base 30 can be an arbitrary polygon.

  In the above-described embodiment and modification, the single-side power feeding method that receives power from only one of the pair of bases 50 (first base 51) is used. It does not matter as the method. In this case, instead of the second base (non-power feeding base) 52, the first base 51 (power feeding base) may be provided in this portion.

  In the above-described embodiment and modification, the first base 51 is an L-shaped base, but may be a G13 base. Further, not only the first base 51 but also the second base 52 may be a G13 base. That is, as in the above embodiment, a 1-pin to 2-pin base structure in which one of the pair of bases 50 is one pin (1 pin) and the other is two pins (2 pins) may be used. In addition, both of the pair of caps 50 may have a two-pin to two-pin cap structure having two pins (two pins).

  Moreover, in said embodiment and modification, although the base body of the 1st nozzle | cap | die 51 and the 2nd nozzle | cap | die 52 was made into the integrally molded product by resin, it is not restricted to this, It is comprised by several components. Also good. For example, the base body of the first base 51 and the second base 52 may be divided into halves, and the base body may be configured by fixing two parts by screwing or the like.

  In addition, the straight tube LED lamp 1 in the above-described embodiment and modification is a system that receives DC power from an external power supply. However, by incorporating a power supply circuit (AC-DC converter circuit), AC power is supplied from the external power supply. A method of receiving power may also be used.

  Moreover, although said embodiment and modification demonstrated the straight tube | pipe LED lamp as an example of an illuminating device, it is not limited to this. For example, the present invention is also applied to a lighting device 100 that is a long LED base light (LED light bar) as shown in FIG. 15 or a lighting device 200 that is a ceiling light as shown in FIG. it can. In the lighting devices 100 and 200, the LED module 10 in the above embodiment is arranged. Note that the ceiling light may be a square shape as shown in FIG. 16 or a circle shape.

  In the above-described embodiment and modification, the SMD type LED module having a structure in which the LED element 12 in which the LED chips are individually packaged is secondarily mounted on the mounting substrate 11 is used as the LED module 10. Not limited to this. For example, it is a COB (Chip On Board) type LED module in which a plurality of LED chips are directly mounted on a mounting substrate 11 as a light emitting element, and the plurality of LED chips are collectively sealed with a phosphor-containing resin. It doesn't matter.

  Moreover, in said embodiment and modification, although the LED module 10 (LED element 12) was comprised so that white light might be emitted by a blue LED chip and yellow fluorescent substance, it is not restricted to this. For example, a phosphor-containing resin containing a red phosphor and a green phosphor may be used and combined with this and a blue LED chip to emit white light. Moreover, you may use the LED chip which light-emits colors other than blue, for example, using the ultraviolet LED chip which emits the ultraviolet light which is shorter wavelength than the blue light which a blue LED chip emits, mainly by ultraviolet light You may comprise so that white light may be emitted by the blue fluorescent substance, green fluorescent substance, and red fluorescent substance which are excited and discharge | release blue light, red light, and green light.

  Further, in the above embodiments and modifications, the case where an LED chip is used as the light emitting element is illustrated, but as the light emitting element, another light emitting element such as a semiconductor laser, an organic EL (Electro Luminescence), or an inorganic EL is used. Also good.

  Moreover, in said embodiment and modification, although the LED module 10 was used as a line light source for illumination, it is applicable also except an illumination use. For example, the LED module 10 can be used as a line light source for a display. Besides this, the LED module 10 can also be used as a line light source for a copying machine, a guide light, a signboard, or a line light source for an inspection apparatus. .

  In addition, the embodiment can be realized by arbitrarily combining the components and functions in each embodiment without departing from the scope of the present invention, or a form obtained by subjecting each embodiment to various modifications conceived by those skilled in the art. Forms are also included in the present invention.

1 Straight tube LED lamp (lighting device)
2 Lighting fixtures 11, 11A Mounting substrate 11a Bending part 11a1 Mountain folding part 11a2 Valley folding part 11b Element mounting part 12 LED element (light emitting element)
20 Housing 30 Base 41 Circuit element 61, 62 Adhesive 70 Screw (fastening member)
100, 200 lighting device

Claims (16)

A housing,
A mounting board constituted by a long resin substrate and disposed in the housing;
A light emitting element mounted on the mounting substrate,
The mounting substrate has a bent portion formed by bending a side along a longitudinal direction of the resin substrate. The mounting substrate has an element mounting portion that is a portion on which the light emitting element is mounted;
The bent portion is a first plate portion of the resin substrate extending in a longitudinal direction of the housing;
The element mounting portion is a second plate portion of the resin substrate that extends in a longitudinal direction of the housing.
The lighting device according to claim 1, wherein the bent portion and the element mounting portion form a predetermined angle in a cross section perpendicular to the longitudinal direction of the housing. The lighting device according to claim 2, wherein the bent portion is formed by bending the resin substrate such that a surface of the mounting substrate on which the light emitting element is mounted is mountain-folded. A pair of the bent portions are formed,
The lighting device according to claim 2 or 3, wherein the pair of bent portions are formed by bending each of the pair of sides facing each other along the longitudinal direction of the resin substrate so as to face each other. Furthermore, a base for holding the mounting board is provided,
The lighting device according to claim 4, wherein the mounting board is fixed to the base such that a pair of the bent portions are positioned on the base side. The lighting device according to claim 5, wherein the mounting substrate and the base are fixed by an adhesive provided in a portion surrounded by the pair of bent portions, the element mounting portion, and the base. Each of the pair of bent portions includes a mountain fold portion and a valley fold portion formed by bending the resin substrate twice so that a surface on which the light emitting element is mounted on the mounting substrate is a mountain fold and a valley fold. And
The lighting device according to claim 5, wherein the valley fold portion and the base of each of the pair of bending portions are fixed by a fastening member. The lighting device according to claim 4, wherein the mounting substrate and the housing are fixed by an adhesive provided in a portion surrounded by the pair of bent portions, the element mounting portion, and the housing. The lighting device according to claim 2, wherein the bent portion is formed by bending the resin substrate such that a surface on which the light emitting element is mounted on the mounting substrate is a valley fold. The lighting device according to claim 1, wherein a circuit element for supplying power to the light emitting element is mounted on the bent portion. The lighting device according to claim 1, wherein a light emitting element is also disposed in the bent portion. The lighting device according to claim 1, wherein a thickness of the resin substrate is thinner than a thickness of the housing. The lighting device according to claim 12, wherein the resin substrate is a glass epoxy substrate. The mounting substrate is formed with a pattern of metal wiring electrically connected to the light emitting element,
The lighting device according to any one of claims 1 to 13, wherein the metal wiring is formed so as to avoid a bent portion of the mounting substrate. The housing is elongated,
The illuminating device according to any one of claims 1 to 14, wherein a base is provided at an end portion in a longitudinal direction of the housing. A lighting fixture comprising the lighting device according to claim 15.

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