JP2015211314A - Crystal oscillator - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a crystal oscillator capable of improving the bonding strength between a conductive bonding material and a thermosensor.SOLUTION: A crystal oscillator comprises: a rectangular substrate 110a; a frame body provided on an upper surface of the substrate 110a; a mounting frame body 160 provided on a lower surface of the substrate 110a; a joint terminal 112 provided along an outer peripheral edge of the lower surface of the substrate 110a; a joint pad 161 provided along an outer peripheral edge of an upper surface of the mounting frame body 160; a pair of electrode pads 111 provided on the upper surface of the substrate 110a; a pair of connection pads 115 provided on the lower surface of the substrate 110a; a pair of mounting pads 116 electrically connected to the connection pads 115 and provided on the lower surface of the substrate 110a; a crystal element 120 mounted on the electrode pad 111; a thermosensor 150 mounted on the connection pads 115 and the mounting pads 116 by a conductive bonding material 160; and a lid body 130 bonded to an upper surface of the frame body 110b. The joint terminal 112 and the joint pad 161 are electrically bonded.

Description

  The present invention relates to a crystal resonator used in an electronic device or the like.

  The crystal resonator generates a specific frequency by using the piezoelectric effect of the crystal element. For example, a package having a substrate, a first frame provided on the upper surface of the substrate for providing the first recess, and a second frame provided on the lower surface of the substrate for providing the second recess. And a crystal resonator that is mounted on an electrode pad provided on the upper surface of the substrate and a temperature sensitive device that is mounted on a connection pad provided on the lower surface of the substrate has been proposed (for example, , See Patent Document 1 below).

JP 2011-2111340 A

  In the above-described quartz resonator, the temperature sensitive element is mounted in the second recess using a conductive bonding material such as solder. Such a crystal resonator has been miniaturized and the area of the connection pad is reduced, so that the amount of the conductive bonding material provided on the connection pad is also reduced. Therefore, in such a crystal resonator, there is a concern that the bonding strength between the conductive bonding material and the temperature sensitive element may be reduced.

  This invention is made | formed in view of the said subject, and makes it a subject to provide the crystal oscillator which can improve the joint strength of an electroconductive joining material and a temperature sensing element.

  A crystal resonator according to one aspect of the present invention includes a rectangular substrate, a frame provided on the upper surface of the substrate, a mounting frame provided on the lower surface of the substrate, and an outer peripheral edge of the lower surface of the substrate. Provided bonding terminals, bonding pads provided along the outer peripheral edge of the upper surface of the mounting frame, a pair of electrode pads provided on the upper surface of the substrate within the frame, and provided on the lower surface of the substrate within the mounting frame A pair of connection pads, a pair of mounting pads electrically connected to the connection pads and provided on the lower surface of the substrate, a crystal element mounted on the electrode pads, and a conductive bonding material to the connection pads and the mounting pads And a lid body bonded to the upper surface of the frame body, and the bonding terminal and the bonding pad are electrically bonded to each other.

  A crystal resonator according to one aspect of the present invention includes a rectangular substrate, a frame provided on the upper surface of the substrate, a mounting frame provided on the lower surface of the substrate, and an outer peripheral edge of the lower surface of the substrate. Provided bonding terminals, bonding pads provided along the outer peripheral edge of the upper surface of the mounting frame, a pair of electrode pads provided on the upper surface of the substrate within the frame, and provided on the lower surface of the substrate within the mounting frame A pair of connection pads, a pair of mounting pads electrically connected to the connection pads and provided on the lower surface of the substrate, a crystal element mounted on the electrode pads, the connection pads, and the mounting pads with a conductive bonding material. The mounted temperature sensitive element and a lid bonded to the upper surface of the frame body are provided, and the bonding terminal and the bonding pad are electrically bonded. By doing so, the crystal resonator can ensure the amount of the conductive bonding material because the conductive bonding material for bonding the temperature sensitive element is provided not only on the connection pad but also on the mounting pad. Then, a fillet having an inclination that gradually increases the thickness of the conductive bonding material from the mounting pad toward the side surface of the connection terminal of the temperature sensitive element is formed, and the conductive bonding material and the temperature sensitive element are bonded. Strength can be improved.

It is a disassembled perspective view which shows the crystal resonator which concerns on this embodiment. (A) It is AA sectional drawing of FIG. 1, (b) It is BB sectional drawing of FIG. (A) is the plane perspective view which looked at the package which comprises the crystal oscillator concerning this embodiment from the upper surface, (b) looked at the board | substrate of the package which comprises the crystal oscillator concerning this embodiment from the upper surface. It is a plane perspective view. (A) is the plane perspective view which looked at the substrate of the package which constitutes the crystal oscillator concerning this embodiment from the undersurface, and (b) looked at the package which constitutes the crystal oscillator concerning this embodiment from the undersurface It is a plane perspective view. (A) is the plane perspective view which looked at the mounting frame which constitutes the crystal oscillator concerning this embodiment from the upper surface, and (b) is the bottom of the mounting frame which constitutes the crystal oscillator concerning this embodiment It is the plane perspective view seen from. It is the top view which looked at the crystal oscillator concerning this embodiment from the lower surface. (A) is the plane perspective view which looked at the package which comprises the crystal oscillator concerning the 1st modification of this embodiment from the upper surface, (b) is the crystal oscillator concerning the 1st modification of this embodiment. It is the plane perspective view which looked at the substrate of the package which constitutes from the upper surface. (A) is the plane perspective view which looked at the substrate of the package which constitutes the crystal oscillator concerning the 1st modification of this embodiment from the lower surface, and (b) is the crystal concerning the 1st modification of this embodiment It is the plane perspective view which looked at the package which comprises a vibrator from the lower surface. It is the top view which looked at the crystal oscillator concerning the 1st modification of this embodiment from the lower surface. (A) is the plane perspective view which looked at the package which comprises the crystal resonator which concerns on the 2nd modification of this embodiment from the upper surface, (b) is the crystal resonator which concerns on the 2nd modification of this embodiment. It is the plane perspective view which looked at the substrate of the package which constitutes from the upper surface. (A) is the plane perspective view which looked at the substrate of the package which constitutes the crystal oscillator concerning the 2nd modification of this embodiment from the lower surface, and (b) is the crystal concerning the 2nd modification of this embodiment It is the plane perspective view which looked at the package which comprises a vibrator from the lower surface. (A) is the plane perspective view which looked at the package which comprises the crystal oscillator which concerns on the 3rd modification of this embodiment from the upper surface, (b) is the crystal oscillator which concerns on the 3rd modification of this embodiment It is the plane perspective view which looked at the substrate of the package which constitutes from the upper surface. (A) is the plane perspective view which looked at the substrate of the package which constitutes the crystal oscillator concerning the 3rd modification of this embodiment from the lower surface, and (b) is the crystal concerning the 3rd modification of this embodiment It is the plane perspective view which looked at the package which comprises a vibrator from the lower surface. It is the top view which looked at the crystal oscillator concerning the 3rd modification of this embodiment from the lower surface.

  As shown in FIGS. 1 to 6, the crystal resonator according to this embodiment includes a package 110, a crystal element 120 bonded to the upper surface of the package 110, and a temperature sensitive element bonded to the lower surface of the package 110. 150. The package 110 has a first recess K1 surrounded by the upper surface of the substrate 110a and the inner surface of the frame 110b. A second recess K2 surrounded by the lower surface of the substrate 110a and the inner surface of the mounting frame 160 is formed. Such a crystal resonator is used to output a reference signal used in an electronic device or the like.

  The substrate 110a has a rectangular shape and functions as a mounting member for mounting the crystal element 120 mounted on the upper surface and the temperature sensitive element 150 mounted on the lower surface. An electrode pad 111 for mounting the crystal element 120 is provided on the upper surface of the substrate 110a, and a connection pad 115 for mounting the temperature sensitive element 150 is provided on the lower surface of the substrate 110a. A first electrode pad 111a and a second electrode pad 111b for bonding the crystal element 120 are provided along one side of the substrate 110a. Bonding terminals 112 are provided at the four corners of the lower surface of the substrate 110a. Also, two of the four junction terminals 112 are electrically connected to the crystal element 120. Also, two of the four junction terminals 112 are electrically connected to the temperature sensing element 150. The first joint terminal 112a and the third joint terminal 112c that are electrically connected to the crystal element 120 are provided so as to be located diagonally on the lower surface of the substrate 110a. Further, the second joint terminal 112b and the fourth joint terminal 112d electrically connected to the temperature sensitive element 150 are provided with the first joint terminal 112a and the third joint terminal 112c connected to the crystal element 120. It is provided so as to be located at a diagonal of the substrate 110a different from the diagonal.

  The substrate 110a is made of an insulating layer made of a ceramic material such as alumina ceramic or glass-ceramic. The substrate 110a may be one using an insulating layer or may be a laminate of a plurality of insulating layers. A wiring pattern 113 and a via conductor 114 for electrically connecting the electrode pad 111 provided on the upper surface and the bonding terminal 112 provided on the lower surface of the substrate 110a are provided on and inside the substrate 110a. Yes. Further, a connection pattern 117 for electrically connecting the connection pad 115 provided on the lower surface and the bonding terminal 112 provided on the lower surface of the substrate 110a is provided on the surface of the substrate 110a.

  The frame 110b is disposed along the outer peripheral edge of the upper surface of the substrate 110a, and is for forming the first recess K1 on the upper surface of the substrate 110a. The frame 110b is made of a ceramic material such as alumina ceramics or glass-ceramics, and is formed integrally with the substrate 110a.

  The electrode pad 111 is for mounting the crystal element 120. A pair of electrode pads 111 are provided on the upper surface of the substrate 110a, and are provided adjacent to each other along one side of the substrate 110a. The electrode pad 111 is electrically connected to the bonding terminal 112 provided on the lower surface of the substrate 110a through the wiring pattern 113 and the via conductor 114 provided on the upper surface of the substrate 110a as shown in FIGS. It is connected to the.

  As shown in FIG. 3, the electrode pad 111 is composed of a first electrode pad 111a and a second electrode pad 111b. Further, as shown in FIG. 4B, the junction terminal 112 includes a first junction terminal 112a, a second junction terminal 112b, a third junction terminal 112c, and a fourth junction terminal 112d. The via conductor 114 includes a first via conductor 114a, a second via conductor 114b, and a third via conductor 114c. The wiring pattern 113 is composed of a first wiring pattern 113a and a second wiring pattern 113b. The first electrode pad 111a is electrically connected to one end of the first wiring pattern 113a provided on the substrate 110a. The other end of the first wiring pattern 113a is electrically connected to the first joint terminal 112a through the first via conductor 114a. Therefore, the first electrode pad 111a is electrically connected to the first joint terminal 112a. The second electrode pad 111b is electrically connected to one end of the second wiring pattern 113b provided on the substrate 110a. The other end of the second wiring pattern 113b is electrically connected to the third junction terminal 112c through the third via conductor 114c.

  The joint terminal 112 is used for electrical joining with the joint pad 161 of the mounting frame 160. The junction terminals 112 are provided at the four corners of the lower surface of the substrate 110a. Two of the bonding terminals 112 are electrically connected to a pair of electrode pads 111 provided on the upper surface of the substrate 110a. In addition, the junction terminal 112 that is electrically connected to the electrode pad 111 is provided so as to be located diagonally on the lower surface of the substrate 110a. The second joint terminal 112b is electrically connected to the sealing conductor pattern 118 via the second via conductor 114b.

  The wiring pattern 113 is provided on the upper surface of the substrate 110a, and is drawn from the electrode pad 111 toward the neighboring via conductor 114. Moreover, the wiring pattern 113 is comprised by the 1st wiring pattern 113a and the 2nd wiring pattern 113b, as shown in FIG.

  The via conductor 114 is provided inside the substrate 110a, and both ends thereof are electrically connected to the wiring pattern 113, the connection pattern 117, or the sealing conductor pattern 118. The via conductor 114 is provided by filling a conductor in a through hole provided in the substrate 110a. As shown in FIGS. 3 and 6, the via conductor 114 includes a first via conductor 114 a, a second via conductor 114 b, and a third via conductor 114 c.

  The connection pad 115 has a rectangular shape and is used for mounting a temperature sensing element 150 described later. Further, as shown in FIG. 6, the connection pad 115 includes a first connection pad 115a and a second connection pad 115b. The conductive bonding material 170 is provided between the lower surface of the connection pad 115 and the connection terminal 151 of the temperature sensitive element 150.

  The mounting pad 116 has a rectangular shape, and is used for mounting the temperature sensitive element 150 and securing an amount of a conductive bonding material 170 described later. The conductive bonding material 170 is inclined so that the thickness gradually increases from the mounting pad 116 toward the connection terminal 151 of the temperature-sensitive element 150. That is, the fillet of the conductive bonding material 170 is formed on the mounting pad 116. By forming the fillet in this way, the temperature sensitive element 150 can improve the bonding strength between the connection pad 115 and the mounting pad 116.

  The second mounting pad 116b is provided so as to be positioned between the pair of electrode pads 111 in plan view. Further, by doing so, the heat transferred from the crystal element 120 is transferred from the second mounting pad 116b to the second connection pad 115b via the substrate 110a located immediately below the electrode pad 111. Therefore, since such a crystal resonator can further shorten the heat conduction path, the temperature of the crystal element 120 and the temperature of the temperature sensing element 150 are approximated and output from the temperature sensing element 150. It becomes possible to further reduce the difference between the temperature obtained by converting the voltage and the actual temperature around the quartz crystal element 120.

  Here, taking the case where the long side dimension of the substrate 110a as viewed in plan is 1.2 to 2.5 mm and the short side dimension is 1.0 to 2.0 mm, the connection pad 115 is taken as an example. The size of the mounting pad 116 will be described. The length of the side of the connection pad 115 parallel to the short side of the substrate 110a is 0.2 to 0.5 mm, and the length of the side parallel to the long side of the substrate 110a is 0.25 to 0.55 mm. It has become. The length of the side parallel to the short side of the substrate 110a of the mounting pad 116 is 0.2 to 0.5 mm, and the length of the side parallel to the long side of the substrate 110a is 0.1 to 0.4 mm. It has become. As described above, the length of one side of the mounting pad 116 facing the center direction of the substrate 110a is set to be the same length as the length of one side of the connection pad 115 facing the center direction of the substrate 110a. . Therefore, since the conductive bonding material 170 is bonded from the connection pad 115 toward the mounting pad 116 as shown in FIG. 6 in a plan view, the conductive bonding material 170 is compared with the conventional crystal resonator. This increases the bonding area and improves the bonding strength. Further, the length between the first connection pad 115a and the second connection pad 115b is 0.1 to 0.3 mm.

  The first connection pads 115a and the first mounting pads 116a and the second bonding terminals 112b are connected by a first connection pattern 117a provided on the lower surface of the substrate 110a. The second connection pad 115b and the second mounting pad 116b are connected to the fourth joint terminal 112d by a second connection pattern 117b provided on the lower surface of the substrate 110a.

  The connection pattern 117 is provided on the lower surface of the substrate 110a, and is drawn from the mounting pad 116 toward the nearby junction terminal 112. Further, as shown in FIG. 4A, the connection pattern 117 includes a first connection pattern 117a and a second connection pattern 117b. The length of the first connection pattern 117a and the length of the second connection pattern 117b are substantially equal. Here, the substantially equal length means that the difference between the length of the first connection pattern 117a provided on the lower surface of the substrate 110a and the length of the second connection pattern 117b provided on the lower surface of the substrate 110a is different by 0 to 200 μm. Shall be included. As for the length of the connection pattern 117, it is assumed that the length of a straight line passing through the center of each connection pattern 117 is measured. That is, when the wiring length of the first connection pattern 117a and the wiring length of the second connection pattern 117b are substantially equal, the generated resistance values are equal, and the load resistance applied to the temperature sensing element 150 is also uniform. Therefore, it becomes possible to output a voltage stably.

  The second connection pattern 117b is provided so as to overlap the first electrode pad 111a in plan view. In addition, by doing so, heat transmitted from the crystal element 120 is transferred from the second connection pattern 117b to the second mounting pad 116b and the second connection pad 115b via the substrate 110a immediately below the first electrode pad 111. It will be transmitted. Therefore, in such a crystal resonator, the temperature of the crystal element 120 and the temperature of the thermosensitive element 150 are approximated by further shortening the heat conduction path and further increasing the number of heat conduction paths. It is possible to further reduce the difference between the temperature obtained by converting the voltage output from the temperature element 150 and the temperature around the actual crystal element 120.

  The sealing conductor pattern 118 plays a role of improving the wettability of the sealing member 131 when it is joined to the lid 130 via the sealing member 131. As shown in FIGS. 3 and 4, the sealing conductor pattern 118 is electrically connected to the second joint terminal 112b through the second via conductor 114b. The sealing conductor pattern 118 is, for example, 10 to 25 μm in thickness by applying nickel plating and gold plating on the surface of a conductor pattern made of tungsten or molybdenum, for example, so as to surround the upper surface of the first frame 110b in an annular shape. Is formed.

  Here, a method for manufacturing the substrate 110a will be described. When the substrate 110a is made of alumina ceramic, first, a plurality of ceramic green sheets obtained by adding and mixing an appropriate organic solvent or the like to a predetermined ceramic material powder is prepared. In addition, a predetermined conductor paste is applied to the surface of the ceramic green sheet or a through-hole previously punched by punching the ceramic green sheet by screen printing or the like. Further, these green sheets are laminated and press-molded and fired at a high temperature. Finally, a predetermined portion of the conductor pattern, specifically, the electrode pad 111, the bonding terminal 112, the wiring pattern 113, the via conductor 114, the connection pad 115, the mounting pad 116, the connection pattern 117, and the sealing conductor pattern 118 are obtained. It is produced by applying nickel plating, gold plating, silver palladium or the like to the part. Moreover, the conductor paste is comprised from the sintered compact etc. of metal powders, such as tungsten, molybdenum, copper, silver, or silver palladium, for example.

  The mounting frame 160 is joined along the outer peripheral edge of the lower surface of the substrate 110a, and is used to form the second recess K2 on the lower surface of the substrate 110a. The mounting frame 160 is made of, for example, an insulating substrate such as a glass epoxy resin, and is bonded to the lower surface of the substrate 110 a via a conductive bonding material 170. Inside the mounting frame 160, as shown in FIG. 5, a conductor part for electrically connecting a bonding pad 161 provided on the upper surface and an external terminal 162 provided on the lower surface of the mounting frame 160. 163 is provided. Bonding pads 161 are provided at the four corners of the upper surface of the mounting frame 160, and external terminals 162 are provided at the four corners of the lower surface. Two of the four external terminals 162 are electrically connected to the crystal element 120 and used as input / output terminals of the crystal element 120. Also, two of the four external terminals 162 are electrically connected to the temperature sensing element 150. Further, the first external terminal 162 a and the third external terminal 162 c that are electrically connected to the crystal element 120 are provided so as to be located diagonally on the lower surface of the mounting frame 160. The second external terminal 162b and the fourth external terminal 162d that are electrically connected to the temperature sensing element 150 are provided with the first external terminal 162a and the third external terminal 162c that are connected to the crystal element 120. It is provided so that it may be located in the diagonal of the mounting frame 160 different from the diagonal which is.

  The bonding pad 161 is for electrically bonding to the bonding terminal 112 of the substrate 110a via the conductive bonding material 170. As shown in FIG. 5A, the bonding pad 161 includes a first bonding pad 161a, a second bonding pad 161b, a third bonding pad 161c, and a fourth bonding pad 161d. As shown in FIG. 5B, the external terminal 162 includes a first external terminal 162a, a second external terminal 162b, a third external terminal 162c, and a fourth external terminal 162d. The conductor part 163 includes a first conductor part 163a, a second conductor part 163b, a third conductor part 163c, and a fourth conductor part 163d. The first bonding pad 161a is electrically connected to the first external terminal 162a via the first conductor portion 163a, and the second bonding pad 161b is connected to the second external terminal 162b via the second conductor portion 163b. Electrically connected. The third bonding pad 161c is electrically connected to the third external terminal 162c via the third conductor portion 163c, and the fourth bonding pad 161d is connected to the fourth external terminal 162d via the fourth conductor portion 163d. Electrically connected.

  The external terminal 162 is for mounting on a mounting board such as an electronic device. The external terminals 162 are provided at the four corners of the lower surface of the mounting frame 160. Two of the external terminals 162 are electrically connected to a pair of electrode pads 111 provided on the upper surface of the substrate 110a. The remaining two terminals of the external terminals 162 are electrically connected to a pair of connection pads 115 provided on the lower surface of the substrate. The second external terminal 162b is connected to a mounting pad connected to a ground potential that is a reference potential on a mounting board of an electronic device or the like. As a result, the lid 130 bonded to the sealing conductor pattern 118 is connected to the second external terminal 162b having the ground potential. Therefore, the shielding property in the 1st recessed part K1 by the cover body 130 improves.

  The conductor portion 163 is for electrically connecting the bonding pad 161 on the upper surface of the substrate 110a and the external terminal 162 on the lower surface. The conductor portion 163 is formed by providing through holes at the four corners of the mounting frame 160, forming a conductive member on the inner wall surface of the through hole, closing the upper surface with the bonding pad 161, and closing the lower surface with the external terminals 162. ing.

  The shape of the opening of the second recess K2 is a rectangular shape in plan view. Here, taking the case where the long side dimension of the substrate 110a in plan view is 1.2 to 2.5 mm and the short side dimension is 1.0 to 2.0 mm, the second concave portion is taken as an example. The size of the opening of K2 will be described. The length of the long side of the second recess K2 is 0.6 to 1.2 mm, and the length of the short side is 0.3 to 1.0 mm.

  A method for joining the mounting frame 160 to the substrate 110a will be described. First, the conductive bonding material 170 is applied onto the first bonding pad 161a, the second bonding pad 161b, the third bonding pad 161c, and the fourth bonding pad 161d by, for example, a dispenser and screen printing. The substrate 110 a is transported so that the bonding terminal of the substrate 110 a is positioned on the conductive bonding material 170, and is placed on the conductive bonding material 170. The conductive bonding material 170 is cured and contracted by being heated and cured. As a result, the bonding terminal 112 of the substrate 110a is bonded to the bonding pad 161. That is, the first bonding terminal 112a of the substrate 110a is bonded to the first bonding pad 161a, and the second bonding terminal 112b of the substrate 110a is bonded to the second bonding pad 161b. Further, the third bonding terminal 112c of the substrate 110a is bonded to the third bonding pad 161c, and the fourth bonding terminal 112d of the substrate 110a is bonded to the fourth bonding pad 161d.

  Further, the bonding terminal 112 of the substrate 110a and the bonding pad 161 of the mounting frame 160 are bonded via the conductive bonding material 170, so that the substrate 110a and the mounting frame 160 are shown in FIG. 2B. A gap H corresponding to the sum of the thickness of the conductive bonding member 170 and the thickness of the bonding terminal 112 and the bonding pad 161 is provided. Thereby, for example, when the crystal resonator of the present embodiment is mounted on a mounting substrate such as an electronic device, other electronic components such as power amplifiers mounted on the mounting substrate generate heat, and the heat Even if the air is transmitted into the second recess K2 via the mounting substrate, the air heated by the heat is not trapped in the second recess K2, and the heated air is discharged to the outside through the gap H. Since the air enters the second recess K2 through the gap H, the influence of heat on the temperature sensitive element 150 can be reduced in the second recess K2. Therefore, such a crystal resonator can reduce the difference between the temperature obtained by converting the voltage output from the temperature sensing element 150 and the temperature around the actual crystal element 120.

  Here, a method for manufacturing the mounting frame 160 will be described. When the mounting frame 160 is made of glass epoxy resin, it is manufactured by impregnating a base material made of glass fiber with an epoxy resin precursor and thermally curing the epoxy resin precursor at a predetermined temperature. In addition, a predetermined portion of the conductor pattern, specifically, the bonding pad 161 and the external terminal 162, for example, transfer a copper foil processed into a predetermined shape onto a resin sheet made of glass epoxy resin, and the copper foil is transferred. The formed resin sheets are laminated and bonded with an adhesive. The conductor portion 163 is formed by being deposited on the inner surface of the through hole formed in the resin sheet by printing or plating a conductor paste, or by filling the through hole. Such a conductor part 163 is formed by, for example, integrating a metal foil or a metal column by resin molding, or depositing it using a sputtering method, a vapor deposition method, or the like.

  As shown in FIGS. 1 and 2, the crystal element 120 is bonded onto the electrode pad 111 via a conductive adhesive 140. The crystal element 120 plays a role of oscillating a reference signal of an electronic device or the like by stable mechanical vibration and a piezoelectric effect.

  Further, as shown in FIGS. 1 and 2, the crystal element 120 has a structure in which an excitation electrode 122 and an extraction electrode 123 are attached to an upper surface and a lower surface of a crystal base plate 121, respectively. . The excitation electrode 122 is formed by depositing and forming a metal in a predetermined pattern on each of the upper surface and the lower surface of the quartz base plate 121. The excitation electrode 122 includes a first excitation electrode 122a on the upper surface and a second excitation electrode 122b on the lower surface. The extraction electrode 123 extends from the excitation electrode 122 toward one side of the crystal base plate 121. The extraction electrode 123 includes a first extraction electrode 123a on the upper surface and a second extraction electrode 123b on the lower surface. The first extraction electrode 123 a is extracted from the first excitation electrode 122 a and is provided so as to extend toward one side of the crystal base plate 121. The second extraction electrode 123 b is extracted from the second excitation electrode 122 b and is provided so as to extend toward one side of the crystal base plate 121. That is, the extraction electrode 123 is provided in a shape along the long side or the short side of the quartz base plate 121. In the present embodiment, one end of the crystal element 120 connected to the first electrode pad 111a and the second electrode pad 111b is a fixed end connected to the upper surface of the substrate 110a, and the other end is between the upper surface of the substrate 110a. The quartz crystal element 120 is fixed on the substrate 110a by a cantilevered support structure with a free end.

  Here, the operation of the crystal element 120 will be described. In the crystal element 120, when an alternating voltage from the outside is applied from the extraction electrode 123 to the crystal base plate 121 via the excitation electrode 122, the crystal base plate 121 is excited in a predetermined vibration mode and frequency. ing.

  Here, a manufacturing method of the crystal element 120 will be described. First, the crystal element 120 is cut from the artificial crystalline lens at a predetermined cut angle to reduce the thickness of the outer periphery of the crystal base plate 121, and the central portion of the crystal base plate 121 is thicker than the outer peripheral portion of the crystal base plate 121. The bevel processing provided is performed. The crystal element 120 is manufactured by forming the excitation electrode 122 and the extraction electrode 123 by depositing a metal film on both main surfaces of the crystal base plate 121 by a photolithography technique, a vapor deposition technique, or a sputtering technique. Is done.

  A method for bonding the crystal element 120 to the substrate 110a will be described. First, the conductive adhesive 140 is applied onto the first electrode pad 111a and the second electrode pad 111b by a dispenser, for example. The crystal element 120 is transported onto the conductive adhesive 140 and placed on the conductive adhesive 140. The conductive adhesive 140 is cured and contracted by being heated and cured. The crystal element 120 is bonded to the electrode pad 111. That is, the first extraction electrode 123a of the crystal element 120 is bonded to the second electrode pad 111b, and the second extraction electrode 123b is bonded to the first electrode pad 111a. As a result, the first joint terminal 112a and the third joint terminal 112c are electrically connected to the crystal element 120.

  The conductive adhesive 140 contains conductive powder as a conductive filler in a binder such as silicone resin, and the conductive powder includes aluminum, molybdenum, tungsten, platinum, palladium, silver, titanium, One containing either nickel or nickel iron, or a combination thereof is used. Moreover, as a binder, a silicone resin, an epoxy resin, a polyimide resin, or a bismaleimide resin is used, for example.

  As the temperature sensing element 150, a thermistor, a platinum resistance thermometer, a diode, or the like is used. In the case of the thermistor element, the temperature sensing element 150 has a rectangular parallelepiped shape, and is provided with connection terminals 151 at both ends. The temperature sensing element 150 shows a remarkable change in electrical resistance due to a change in temperature. Since the voltage changes due to the change in resistance value, the output depends on the relationship between the resistance value and voltage and the relationship between voltage and temperature. Temperature information can be obtained from the applied voltage. The temperature sensing element 150 outputs a voltage between connection terminals 151, which will be described later, to the outside of the crystal resonator via the second external terminal 162b and the fourth external terminal 162d. Temperature information can be obtained by converting the voltage output at (not shown) into temperature. Such a temperature sensitive element 150 is arranged near the crystal resonator, and the voltage for driving the crystal resonator is controlled by the main IC in accordance with the temperature information of the crystal resonator obtained thereby, so-called temperature compensation. Can do.

  In the case where a platinum resistance thermometer is used, the temperature sensing element 150 is provided with a platinum electrode by depositing platinum at the center of a rectangular parallelepiped ceramic plate. Connection terminals 151 are provided at both ends of the ceramic plate. The platinum electrode and the connection terminal are connected by a lead electrode provided on the upper surface of the ceramic plate. An insulating resin is provided so as to cover the upper surface of the platinum electrode.

  When a diode is used, the temperature sensing element 150 has a structure in which a semiconductor element is mounted on an upper surface of a semiconductor element substrate, and the upper surface of the semiconductor element and the semiconductor element substrate is covered with an insulating resin. . Connection terminals 151 serving as an anode terminal and a cathode terminal are provided from the bottom surface to the side surface of the semiconductor element substrate. The temperature sensing element 150 has a forward characteristic in which current flows from the anode terminal to the cathode terminal, but hardly flows current from the cathode terminal to the anode terminal. The forward characteristics of the temperature sensitive element vary greatly depending on the temperature. Voltage information can be obtained by passing a constant current through the temperature sensing element and measuring the forward voltage. By converting from the voltage information, temperature information of the crystal element can be obtained. In the diode, the relationship between voltage and temperature shows a straight line. A voltage between the cathode terminal and the anode terminal of the connection terminal 151 is output to the outside of the crystal resonator via the second junction terminal 112b and the fourth junction terminal 112d.

  As shown in FIG. 2, the temperature sensing element 150 is mounted on a connection pad 115 and a mounting pad 116 provided on the lower surface of the substrate 110a via a conductive bonding material 170 such as solder. The first connection terminal 151a of the temperature sensitive element 150 is connected to the first connection pad 115a and the first mounting pad 116a, and the second connection terminal 151b is connected to the second connection pad 115b and the second mounting pad 116b. ing. The first connection pad 115a is connected to the second bonding terminal 112b via a first connection pattern 117a provided on the lower surface of the substrate 110a. Further, the second junction terminal 112b serves as a ground terminal by being connected to a mounting electrode (not shown) connected to the ground which is a reference potential on a mounting substrate of an electronic device or the like. Therefore, the first connection terminal 151a of the temperature sensitive element 150 is connected to the ground that is the reference potential.

  Further, since the temperature sensing element 150 is positioned in the plane of the excitation electrode 122 provided on the crystal element 120 in a plan view, the temperature sensing element 150 is made electronic by the shielding effect of the metal film of the excitation electrode 122. It protects against noise from other semiconductor parts and electronic parts such as power amplifiers that make up the equipment. Therefore, due to the shielding effect of the excitation electrode 122, it is possible to reduce the superimposition of noise on the temperature sensing element 150 and to output an accurate voltage of the temperature sensing element 150. In addition, since an accurate voltage value can be output from the temperature sensing element 150, temperature information obtained by converting the voltage output from the temperature sensing element 150 and temperature information around the actual crystal element 120 are obtained. It is possible to further reduce the difference.

  A method for bonding the temperature sensitive element 150 to the substrate 110a will be described. First, the conductive bonding material 170 is applied to the connection pad 115 and the mounting pad 116 by a dispenser, for example. The temperature sensitive element 150 is placed on the conductive bonding material 170. The conductive bonding material 170 is melt-bonded by heating, the lower surface of the connection terminal 151 and the connection pad 115 are bonded, and the side surface of the connection terminal 151 of the temperature-sensitive element 150 is bonded from the mounting pad 116. At this time, the conductive bonding material 170 is formed with a fillet that is inclined so that the thickness gradually increases from the mounting pad 116 toward the side surface of the connection terminal 151 of the temperature-sensitive element 150. Therefore, the temperature sensitive element 150 is bonded to the pair of connection pads 115 and the mounting pads 116.

  When the temperature sensitive element 150 is a thermistor element, as shown in FIGS. 1 and 2, one connection terminal 151 is provided at each end of the rectangular parallelepiped shape. The first connection terminal 151 a is provided on the right side surface and the top and bottom surfaces of the temperature sensing element 150. The second connection terminals 151b are provided on the left side surface and the top and bottom surfaces of the temperature sensitive element 150. The length of the long side of the temperature sensitive element 150 is 0.4 to 0.6 mm, and the length of the short side is 0.2 to 0.3 mm. The length of the thermosensitive element 150 in the thickness direction is 0.1 to 0.3 mm.

  The conductive bonding material 170 is made of, for example, silver paste or lead-free solder. In addition, the conductive bonding material 170 contains an added solvent for adjusting the viscosity to be easily applied. The component ratio of the lead-free solder is 95 to 97.5% for tin, 2 to 4% for silver, and 0.5 to 1.0% for copper.

  The lid 130 is made of an alloy containing at least one of iron, nickel, and cobalt, for example. Such a lid 130 is for hermetically sealing the first recess K1 in a vacuum state or the first recess K1 filled with nitrogen gas or the like. Specifically, the lid body 130 is placed on the frame body 110b of the package 110 in a predetermined atmosphere, and the sealing conductor pattern 118 of the frame body 110b and the sealing member 131 of the lid body 130 are welded. As described above, by applying a predetermined current and performing seam welding, the frame body 110b is joined. The lid 130 is electrically connected to the second bonding terminal 112b on the lower surface of the substrate 110a via the sealing conductor pattern 118 and the second via conductor 114b. The second bonding terminal 112b is electrically connected to the second connection pad 115b and the second mounting pad 116b via the conductive bonding material 170. Therefore, the lid 130 is electrically connected to the connection terminal 151b of the temperature sensing element 150 and the second joint terminal 112b of the substrate 110a.

  The sealing member 131 is provided at a position of the lid body 130 facing the sealing conductor pattern 118 provided on the upper surface of the frame 110 b of the package 110. The sealing member 131 is provided by, for example, silver solder or gold tin. In the case of silver wax, the thickness is 10 to 20 μm. For example, the component ratio is 72 to 85% for silver and 15 to 28% for copper. In the case of gold tin, the thickness is 10 to 40 μm. For example, the component ratio is 78 to 82% for gold and 18 to 22% for tin.

  The crystal resonator according to the embodiment of the present invention includes a rectangular substrate 110a, a frame provided on the upper surface of the substrate 110a, a mounting frame 160 provided on the lower surface of the substrate 110a, and an outer surface of the lower surface of the substrate 110a. The bonding terminals 112 provided along the periphery, the bonding pads 161 provided along the outer peripheral edge of the upper surface of the mounting frame 160, and the pair of electrode pads 111 provided on the upper surface of the substrate 110a in the frame 110b. A pair of connection pads 115 provided on the lower surface of the substrate 110a in the mounting frame 160, a pair of mounting pads 116 electrically connected to the connection pad 115 and provided on the lower surface of the substrate 110a, and an electrode pad The crystal element 120 mounted on 111, the temperature sensing element 150 mounted on the connection pad 115 and the mounting pad 116 with the conductive bonding material 160, and the upper surface of the frame 110b A lid 130 is engaged, provided with a connecting terminal 112 and the bonding pads 115 are electrically connected. By doing so, the quartz resonator is provided with not only the connection pad 115 but also the mounting pad 116 with the conductive bonding material 170 bonding the temperature sensing element 150, so the amount of the conductive bonding material 170 can be reduced. A fillet having an inclination that gradually increases the thickness of the conductive bonding material 170 from the mounting pad 116 toward the side surface of the connection terminal 151 of the temperature-sensitive element 150 is formed. It is possible to improve the bonding strength between the bonding material 170 and the temperature sensitive element 150.

  Further, the crystal resonator according to the embodiment of the present invention is sensitive to the plane of the excitation electrode 122 provided on the crystal element 120 in a plan view in a state where the crystal element 120 and the temperature sensitive element 150 are mounted on the substrate 110a. By positioning the temperature element 150, the temperature-sensitive element 150 is protected from noise from other semiconductor components such as a power amplifier constituting the electronic apparatus and electronic components by the shielding effect by the metal film of the excitation electrode 122. . Therefore, due to the shielding effect of the excitation electrode 122, it is possible to reduce the superimposition of noise on the temperature sensing element 150 and to output an accurate voltage of the temperature sensing element 150. In addition, since an accurate voltage value can be output from the temperature sensing element 150, temperature information obtained by converting the voltage output from the temperature sensing element 150 and temperature information around the actual crystal element 120 are obtained. It is possible to further reduce the difference.

  Further, the crystal resonator according to the embodiment of the present invention includes a connection pattern 116 for electrically connecting the connection pad 115 and the external terminal 162, and the electrode pad 111 along one side of the inner periphery of the frame 110b. Are provided so that one of the connection patterns 116 is positioned between the pair of electrode pads 111 in plan view. By doing so, the heat transferred from the crystal element 120 is transferred from the second connection pattern 116b to the second connection pad 115b via the substrate 110a directly below the electrode pad 111. Therefore, since such a crystal resonator can shorten the heat conduction path, the temperature of the crystal element 120 and the temperature of the temperature sensing element 150 are approximated, and the voltage output from the temperature sensing element 150 It is possible to further reduce the difference between the temperature obtained by converting the above and the actual temperature around the crystal element 120.

(First modification)
Hereinafter, the crystal resonator according to the first modification of the present embodiment will be described. Note that, in the crystal resonator according to the first modification of the present embodiment, the same portions as those of the above-described crystal resonator are denoted by the same reference numerals, and description thereof will be omitted as appropriate. As shown in FIGS. 7 to 9, in the crystal resonator according to the first modification of the present embodiment, the connection pad 215 and the mounting pad 216 are rectangular, and the center direction of the substrate 210 a of the connection pad 215 is the same. The length of one side that faces is different from the present embodiment in that it is provided to be shorter than the length of one side that faces the center direction of the substrate 210a of the mounting pad 216.

  The connection pads 215 are provided as a pair so as to be adjacent to the vicinity of the center of the lower surface of the substrate 210a. Further, as shown in FIGS. 8 and 9, the connection pad 215 includes a first connection pad 215a and a second connection pad 215b. The conductive bonding material 170 is provided between the lower surface of the connection pad 215 and the connection terminal 151 of the temperature sensitive element 150.

  The mounting pad 216 has a rectangular shape, and is used for mounting the temperature sensitive element 150 and securing the amount of the conductive bonding material 170. The mounting pad 216 is electrically connected to the connection pad 215 and is provided on the short side of the substrate 210a with respect to the connection pad 215. The mounting pad 216 includes a first mounting pad 216a and a second mounting pad 216b. In addition, the length of one side of the mounting pad 216 facing the center direction of the substrate 210a is longer than the length of one side of the connection pad 215 facing the center direction of the substrate 210a. By doing so, the temperature-sensitive element 150 is bonded to the connection pad 215 and the mounting pad 216 so that the conductive bonding material 170 spreads from the connection pad 215 toward the mounting pad 216 in plan view. Further, the bonding strength of the temperature sensitive element 150 can be further improved.

  Further, the second mounting pad 216b is provided so as to be positioned between the pair of electrode pads 211 in plan view, and is provided so as to overlap a part of the pair of electrode pads 211. Further, by doing so, the heat transmitted from the crystal element 120 is transmitted from the electrode pad 211 to the second mounting pad 216b directly below, and is transmitted from the second mounting pad 216b to the second connection pad 215b. Therefore, since such a crystal resonator can further shorten the heat conduction path, the temperature of the crystal element 120 and the temperature of the temperature sensing element 150 are approximated and output from the temperature sensing element 150. It becomes possible to further reduce the difference between the temperature obtained by converting the voltage and the actual temperature around the quartz crystal element 120.

  Here, when the board 210a is viewed in plan, the long side dimension is 1.2 to 2.5 mm, and the short side dimension is 1.0 to 2.0 mm. The size of the mounting pad 216 will be described. The length of the side of the connection pad 215 parallel to the short side of the substrate 210a is 0.2 to 0.5 mm, and the length of the side parallel to the long side of the substrate 210a is 0.25 to 0.55 mm. It has become. The length of the side parallel to the short side of the substrate 210a of the mounting pad 216 is 0.4 to 0.7 mm, and the length of the side parallel to the long side of the substrate 210a is 0.1 to 0.4 mm. It has become. As described above, the length of one side of the mounting pad 216 facing the center direction of the substrate 110a is longer than the length of one side of the connection pad 215 facing the center direction of the substrate 210a. Therefore, since the conductive bonding material 170 is bonded so as to spread from the connection pad 215 toward the mounting pad 216 as shown in FIG. 9 in a plan view, the bonding strength can be further improved. Become. The length between the first connection pad 215a and the second connection pad 215b is 0.1 to 0.3 mm.

  In the crystal resonator according to the first modification of the present embodiment, the connection pad 215 and the mounting pad 216 are rectangular, and the length of one side of the connection pad 215 that faces the center of the substrate 210a is the substrate 210a of the mounting pad 216. By providing the conductive bonding material 170 so as to be shorter than the length of one side that faces the center direction, the temperature-sensitive element expands from the connection pad 215 toward the mounting pad 216 in plan view. Since 150 is bonded to the connection pad 215 and the mounting pad 216, the bonding strength of the temperature sensitive element 150 can be further improved.

  Further, in the crystal resonator according to the first modification of the present embodiment, the second mounting pad 216b is provided so as to be positioned between the pair of electrode pads 211 in a plan view, and the pair of electrode pads 211 It is provided so as to overlap with a part. Further, by doing so, the heat transmitted from the crystal element 120 is transmitted from the electrode pad 211 to the second mounting pad 216b directly below, and is transmitted from the second mounting pad 216b to the second connection pad 215b. Therefore, since such a crystal resonator can further shorten the heat conduction path, the temperature of the crystal element 120 and the temperature of the temperature sensing element 150 are approximated and output from the temperature sensing element 150. It becomes possible to further reduce the difference between the temperature obtained by converting the voltage and the actual temperature around the quartz crystal element 120.

(Second modification)
Hereinafter, the crystal resonator according to the second modification of the present embodiment will be described. Note that, in the crystal resonator according to the second modification of the present embodiment, the same portions as those of the above-described crystal resonator are denoted by the same reference numerals, and description thereof will be omitted as appropriate. As shown in FIGS. 10 and 11, the crystal resonator in the second modification example of the present embodiment includes a wiring pattern 313 for electrically connecting the electrode pad 311 and the connection terminal 312. One of the wiring patterns 313 is provided on the same plane as the connection pads 315, and is different from the first modification of the present embodiment in that it is provided at a position overlapping the mounting frame 160.

  As shown in FIG. 11, the electrode pad 311 includes a first electrode pad 311a and a second electrode pad 311b. Further, as shown in FIG. 10, the joining terminal 312 includes a first joining terminal 312a, a second joining terminal 312b, a third joining terminal 312c, and a fourth joining terminal 312d. The via conductor 314 includes a first via conductor 314a, a second via conductor 314b, and a third via conductor 314c. The wiring pattern 313 includes a first wiring pattern 313a, a second wiring pattern 313b, and a third wiring pattern 313c. The first electrode pad 311a is electrically connected to one end of the first wiring pattern 313a provided on the substrate 310a. The other end of the first wiring pattern 313a is electrically connected to one end of the third wiring pattern 313c via the first via conductor 314a. The other end of the third wiring pattern 313c is electrically connected to the first joint terminal 312a. Therefore, the first electrode pad 311a is electrically connected to the first joint terminal 312a. The second electrode pad 311b is electrically connected to one end of the second wiring pattern 313b provided on the substrate 310a. The other end of the second wiring pattern 313b is electrically connected to the third junction terminal 312c through the third via conductor 314c.

  Further, as shown in FIGS. 10 and 11, the wiring pattern 313 includes a first wiring pattern 313a, a second wiring pattern 313b, and a third wiring pattern 313c. The first wiring pattern 313a and the second wiring pattern 313b are provided on the upper surface of the substrate 310a, and are drawn from the electrode pad 311 toward the via conductor 314 of the nearby substrate 310a. The third wiring pattern 313c is provided on the lower surface of the substrate 310a and is provided so as to be close to the connection pad 315 of the substrate 310a. That is, the distance between the third wiring pattern 313c and the connection pad 315b is 50 to 100 μm. By doing so, the heat transmitted from the crystal element 120 is transmitted from the electrode pad 311 to the third wiring pattern 313c via the first wiring pattern 313a and the first via conductor 314a. Next, the heat transferred from the crystal element 120 is transferred from the third wiring pattern 313c to the connection pad 315 via the lower surface of the substrate 310a. Therefore, since the crystal resonator can shorten the heat conduction path, the temperature of the crystal element 120 and the temperature of the temperature sensitive element 150 are approximated, and the voltage output from the temperature sensitive element 150 is converted. Thus, the difference between the obtained temperature and the actual temperature around the quartz crystal element 120 can be reduced.

  Further, the third wiring pattern 313 c is provided at a position overlapping the mounting frame body 160. By doing so, when the crystal resonator according to the first modification of the present embodiment is mounted on a mounting substrate such as an electronic device, the wiring conductor provided on the mounting substrate and the third wiring pattern 313c. The stray capacitance generated between the two can be reduced. Therefore, fluctuation of the oscillation frequency of the crystal element 120 can be reduced while suppressing the stray capacitance from being added to the crystal element 120.

  The crystal resonator in the second modification of the present embodiment includes a wiring pattern 313 for electrically connecting the electrode pad 311 and the connection terminal 312, and the third wiring pattern 313 c is flush with the connection pad 315. It is provided on a position that overlaps with the mounting frame 160. By doing so, the heat transmitted from the crystal element 120 is transmitted from the electrode pad 311 to the third wiring pattern 313c via the first wiring pattern 313a and the first via conductor 314a. Next, the heat transferred from the crystal element 120 is transferred from the third wiring pattern 313c to the connection pad 315 via the lower surface of the substrate 310a. Therefore, since the crystal resonator can shorten the heat conduction path, the temperature of the crystal element 120 and the temperature of the temperature sensitive element 150 are approximated, and the voltage output from the temperature sensitive element 150 is converted. Thus, the difference between the obtained temperature and the temperature around the quartz crystal element 120 can be reduced.

  Further, in the crystal resonator according to the second modification of the present embodiment, the third wiring pattern 313 c is provided at a position where it overlaps the mounting frame 160. By doing so, when the crystal resonator of the present embodiment is mounted on a mounting board such as an electronic device, it is generated between the wiring conductor provided on the mounting board and the third wiring pattern 313c. The stray capacitance to be reduced can be reduced. Therefore, fluctuation of the oscillation frequency of the crystal element 120 can be reduced while suppressing the stray capacitance from being added to the crystal element 120.

(Third modification)
Hereinafter, the crystal resonator according to the third modification of the present embodiment will be described. Note that, in the crystal resonator in the third modified example of the present embodiment, the same portions as those of the above-described crystal resonator are denoted by the same reference numerals, and description thereof will be omitted as appropriate. As shown in FIGS. 12 to 14, the crystal resonator in the third modification of the present embodiment is formed on the substrate 410 a so that the long side of the temperature sensitive element 150 is parallel to the short side of the substrate 410 a. The present embodiment is different from the present embodiment in that it is mounted on the connection pad 415 and the mounting pad 416.

  The connection pad 415 has a rectangular shape and is provided near the center of the lower surface of the substrate 410a. As shown in FIGS. 13 and 14, the connection pads 415 are provided adjacent to each other so that the long sides of the connection pads 415 and the short sides of the substrate 410a are parallel to each other. The connection pad 415 includes a first connection pad 415a and a second connection pad 415b.

  The mounting pad 416 has a rectangular shape and is electrically connected to the connection pad 415. In addition, the mounting pad 416 is provided so as to be positioned on the long side of the substrate 410 a with respect to the connection pad 415. The conductive bonding material 170 is formed with a fillet having an inclination such that the thickness gradually increases from the mounting pad 416 toward the side surface of the connection terminal 151 of the temperature-sensitive element 150. By doing so, the temperature sensitive element 150 can improve the bonding strength between the connection pad 415 and the mounting pad 416.

  The second mounting pad 416b is provided at a position overlapping the first wiring pattern 413a as shown in FIGS. 12 and 13 in plan view. By doing so, heat transmitted from the crystal element 120 is transmitted from the first electrode pad 411a to the first wiring pattern 413a, and from the second mounting pad 416b via the substrate 410a immediately below the first wiring pattern 413a. It is transmitted to the second connection pad 415b. Therefore, since such a crystal resonator can further shorten the heat conduction path, the temperature of the crystal element 120 and the temperature of the temperature sensing element 150 are approximated and output from the temperature sensing element 150. It becomes possible to further reduce the difference between the temperature obtained by converting the voltage and the actual temperature around the quartz crystal element 120.

  As shown in FIG. 13B, the connection pattern 417 is provided on the lower surface of the substrate 410 a and is drawn out from the mounting pad 416 toward the neighboring via conductor 414. The second connection pattern 417b is provided so as to overlap the first wiring pattern 413a. By doing so, heat transmitted from the crystal element 120 is transmitted from the first electrode pad 411a to the first wiring pattern 413a, and from the second connection pattern 417b via the substrate 410a immediately below the first wiring pattern 413a. It is transmitted to the second mounting pad and the second connection pad 415b. Therefore, since such a crystal resonator can further shorten the heat conduction path, the temperature of the crystal element 120 and the temperature of the temperature sensing element 150 are approximated and output from the temperature sensing element 150. It becomes possible to further reduce the difference between the temperature obtained by converting the voltage and the actual temperature around the quartz crystal element 120.

  Here, the case where the long side dimension when the substrate 410a is viewed in plan is 1.2 to 2.5 mm and the short side dimension is 1.0 to 2.0 mm is taken as an example. The size of the mounting pad 416 will be described. The length of the side of the connection pad 415 parallel to the long side of the substrate 410a is 0.2 to 0.5 mm, and the length of the side parallel to the short side of the substrate 410a is 0.25 to 0.55 mm. It has become. The length of the side parallel to the long side of the substrate 410a of the mounting pad 416 is 0.4 to 0.7 mm, and the length of the side parallel to the short side of the substrate 410a is 0.1 to 0.4 mm. It has become. As described above, the length of one side of the mounting pad 416 facing the center direction of the substrate 410a is set to be longer than the length of one side of the connection pad 415 facing the center direction of the substrate 410a. Therefore, since the conductive bonding material 170 is bonded so as to spread from the connection pad 415 toward the mounting pad 416 as shown in FIG. 14 in plan view, the bonding strength can be further improved. Become. Further, the length between the first connection pad 415a and the second connection pad 415b is 0.1 to 0.3 mm.

  The temperature sensing element 150 is mounted on the lower surface of the substrate 410a so that the long side of the temperature sensing element 150 and the short side of the substrate 410a are parallel to each other. By doing in this way, the 1st junction terminal 412a electrically connected with the crystal element 120 can lengthen the space | interval with the 1st connection pad 415a, and is electrically connected with the crystal element 120. Since the third joint terminal 412c can be spaced apart from the second connection pad 415b, even if the conductive joint material 170 joining the temperature sensing element 150 overflows, the conductive joint material 170 Can be suppressed. Therefore, a short circuit between the temperature sensing element 150 and the junction terminal 412 electrically connected to the crystal element 120 can be reduced.

  In addition, it is not limited to this embodiment, A various change, improvement, etc. are possible in the range which does not deviate from the summary of this invention. In the above embodiment, the case where an AT crystal element is used as the crystal element has been described. However, a tuning fork-type bent crystal having a base and two flat plate-shaped vibrating arms extending in the same direction from the side surface of the base. An element may be used.

  A bevel processing method for the crystal element 120 will be described. A polishing material provided with media and abrasive grains having a predetermined particle size and a quartz base plate 121 having a predetermined size are prepared. The abrasive prepared in the cylindrical body and the quartz base plate 121 are placed, and the open end of the cylindrical body is closed with a cover. The quartz base plate 121 that rotates the cylindrical body containing the abrasive and the quartz base plate 121 with the central axis of the cylindrical body as the rotation axis is polished with the abrasive and beveled.

  In the above embodiment, the case where the first frame body 110b is integrally formed of a ceramic material in the same manner as the substrate 110a has been described. However, the first frame body 110b may be made of metal. In this case, the frame is joined to the conductor film of the substrate via a brazing material such as silver-copper.

  Moreover, although the case where the conductor part 163 was provided in the board | substrate was demonstrated in the said embodiment, you may provide in the inside of the notch provided in the corner | angular part of the mounting frame 160. FIG. At this time, the conductive portion is provided so as to print the conductor paste in the cut.

110, 210, 310, 410 ... package 110a, 210a, 310a, 410a ... substrate 110b, 210b, 310b, 410b ... frame 111, 211, 311, 411 ... electrode pad 112, 212, 312, 412... Junction terminal 113, 213, 313, 413... Wiring pattern 114, 214, 314, 414... Via conductor 115, 215, 315, 415. 416: Mounting pads 117, 217, 317, 417 ... Connection pattern 118, 218, 318, 418 ... Conductive pattern for sealing 120 ... Crystal element 121 ... Crystal base plate 122 ... Excitation electrode 123... Extraction electrode 130... Lid 131... Sealing member 140. Adhesive 150 150 ... temperature sensing element 151 ... connecting terminal 160 ... mounting frame 161 ... bonding pad 162 ... external terminal 163 ... conductor part K1 ... first recess K2. ..Second recess H ... Gap

Claims (5)

A rectangular substrate;
A frame provided on the upper surface of the substrate;
A mounting frame provided on the lower surface of the substrate;
Bonding terminals provided along the outer peripheral edge of the lower surface of the substrate;
A bonding pad provided along the outer peripheral edge of the upper surface of the mounting frame;
A pair of electrode pads provided on the upper surface of the substrate in the frame;
A pair of connection pads provided on the lower surface of the substrate in the mounting frame;
A pair of mounting pads electrically connected to the connection pads and provided on the lower surface of the substrate;
A crystal element mounted on the electrode pad;
A temperature sensitive element mounted with a conductive bonding material on the connection pad and the mounting pad;
A lid joined to the upper surface of the frame,
The crystal resonator, wherein the bonding terminal and the bonding pad are electrically bonded. The crystal resonator according to claim 1,
The temperature sensing element is positioned in a plane of an excitation electrode provided on the crystal element in plan view in a state where the crystal element and the temperature sensing element are mounted on the substrate. A crystal resonator. A crystal resonator according to claim 1 or 2, wherein
The connection pad and the mounting pad are rectangular.
The quartz vibrator according to claim 1, wherein a length of one side of the connection pad facing the center direction of the substrate is shorter than a length of one side of the mounting pad facing the center direction of the substrate. The crystal resonator according to claim 1, wherein:
The electrode pad is provided so as to be adjacent along one side of the inner peripheral edge of the frame,
One of the mounting pads is provided so as to be positioned between the pair of electrode pads in plan view. The crystal resonator according to any one of claims 1 to 4,
A wiring pattern for electrically connecting the electrode pad and the external terminal;
One of the wiring patterns is provided on the same plane as the connection pad, and is provided at a position overlapping the mounting frame.

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