JP2018019215A - Crystal oscillator - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a crystal oscillator capable of reducing a temperature difference between a plurality of thermo-sensitive devices and a crystal element and reducing variation in correction value to the crystal element.SOLUTION: A crystal oscillator comprises: a rectangle shaped substrate 110a; a first frame body 110b provided along an outer periphery edge of an upper surface of the substrate 110a; a second frame body 110c provided along the outer periphery edge of the first frame body 110b; a pair of electrode pads 111 provided on the upper surface of the first frame body 110b; a pair of connection pads 115 provided on the upper surface of the substrate 110a; a crystal element 120 mounted on the electrode pads 111; at least two or more thermo-sensitive devices 150 mounted on the pair of connection pads 115; and a lid 130 combined to the upper surface of the second frame body 110c.SELECTED DRAWING: Figure 2

Description

  The present invention relates to a crystal resonator used in an electronic device or the like.

  The crystal resonator generates a specific frequency by using the piezoelectric effect of the crystal element. For example, it has a substrate, a first frame provided on the upper surface of the substrate to provide the first recess, and a second frame provided on the upper surface of the first frame to provide the second recess. And a crystal element mounted on an electrode pad provided on the upper surface of the first frame, and a temperature sensitive element mounted on a connection pad provided on the upper surface of the substrate. It has been proposed (see, for example, Patent Document 1 below).

JP 2008-205938 A

  Although it has been studied to mount a plurality of temperature sensitive elements on a substrate in the above-described crystal resonator, there is a possibility that a temperature difference from the crystal element may occur for each mounted temperature sensitive element. In addition, the temperature difference between the plurality of temperature-sensitive elements and the crystal element may cause variations in the correction value for the crystal element.

  The present invention has been made in view of the above problems, and can reduce a temperature difference between a plurality of temperature-sensitive elements and a crystal element, and can reduce variation in correction values for the crystal element. The challenge is to provide children.

  A crystal resonator according to one aspect of the present invention includes a rectangular substrate, a first frame provided along the outer periphery of the upper surface of the substrate, and a first frame provided along the outer periphery of the first frame. Mounted on two frames, a pair of electrode pads provided on the upper surface of the first frame, a pair of connection pads provided on the upper surface of the substrate, a crystal element mounted on the electrode pads, and a pair of connection pads And at least two or more temperature sensitive elements and a lid joined to the upper surface of the second frame.

  A crystal resonator according to one aspect of the present invention includes a rectangular substrate, a first frame provided along the outer periphery of the upper surface of the substrate, and a first frame provided along the outer periphery of the first frame. Mounted on two frames, a pair of electrode pads provided on the upper surface of the first frame, a pair of connection pads provided on the upper surface of the substrate, a crystal element mounted on the electrode pads, and a pair of connection pads And at least two or more temperature sensitive elements, and a lid joined to the upper surface of the second frame. As described above, since the plurality of temperature sensing elements are mounted on the pair of connection pads, the temperature difference between the plurality of temperature sensing elements and the crystal element can be reduced, and variation in the correction value to the crystal element can be reduced. It becomes possible to make it.

It is a disassembled perspective view which shows the crystal resonator which concerns on this embodiment. (A) It is AA sectional drawing of FIG. 1, (b) It is BB sectional drawing of FIG. (A) is the see-through plan view which looked at the package which constitutes the crystal oscillator concerning this embodiment from the upper surface, and (b) shows the 1st frame of the package which constitutes the crystal oscillator concerning this embodiment. It is the perspective top view seen from the upper surface. (A) is a perspective plan view of the substrate of the package constituting the crystal resonator according to the present embodiment as viewed from above, and (b) is a perspective plan view of the crystal resonator according to the present embodiment as viewed from below. is there. (A) is a perspective plan view of a package constituting a crystal resonator according to a modification of the present embodiment as viewed from above, and (b) is a package constituting the crystal resonator according to a modification of the present embodiment. It is the see-through top view which looked at the 1st frame from the upper surface. (A) is a perspective plan view of a substrate of a package constituting a crystal resonator according to a modification of the present embodiment as viewed from below, and (b) is a bottom view of the crystal resonator according to the modification of the present embodiment. It is the perspective top view seen from.

  As shown in FIGS. 1 to 4, the crystal resonator according to the present embodiment includes a package 110, a crystal element 120 mounted on the upper surface of the package 110, and a plurality of feelings mounted on the upper surface of the package 110. And a temperature element 150. The package 110 has a first recess K1 surrounded by the upper surface of the substrate 110a and the inner surface of the first frame 110b. Moreover, the 2nd recessed part K2 enclosed by the upper surface of the 1st frame 110b and the inner surface of the 2nd frame 110c is formed. Such a crystal resonator is used to output a reference signal used in an electronic device or the like.

  The substrate 110a has a rectangular shape and functions as a mounting member for mounting the temperature sensitive element 150 mounted on the upper surface. The substrate 110a is provided with connection pads 115 for mounting the temperature sensitive element 150 on the upper surface.

  The substrate 110a is made of an insulating layer made of a ceramic material such as alumina ceramic or glass-ceramic. The substrate 110a may be one using an insulating layer or may be a laminate of a plurality of insulating layers. Via conductors 114 and connection patterns 116 for electrically connecting the connection pads 115 provided on the upper surface and the external terminals 112 provided on the lower surface of the substrate 110a are provided on and inside the substrate 110a. Yes. A wiring pattern 113 for electrically connecting the electrode pad 111 provided on the upper surface of the first frame 110b and the external terminal 112 provided on the lower surface of the substrate 110a is provided on the surface of the substrate 110a. It has been. Two external terminals 112 are provided on the lower surface of the substrate 110a. Further, two of the four external terminals 112 are electrically connected to the crystal element 120, and the remaining two of the four external terminals 112 are electrically connected to the plurality of temperature sensing elements 150. ing. The first external terminal 112a and the second external terminal 112b that are electrically connected to the crystal element 120 are provided so as to be located diagonally on the lower surface of the substrate 110a, as shown in FIG. ing. The third external terminal 112c and the fourth external terminal 112d that are electrically connected to the plurality of temperature sensing elements 150 are provided with the first external terminal 112a and the second external terminal 112b that are connected to the crystal element 120. The substrate 110a is provided at a position different from that of the substrate 110a.

  The first frame 110b is disposed along the outer peripheral edge of the upper surface of the substrate 110a, and is for forming the first recess K1 on the upper surface of the substrate 110a. The frame 110b is made of a ceramic material such as alumina ceramics or glass-ceramics, and is formed integrally with the substrate 110a. An electrode pad 111 for mounting the crystal element 120 is provided on the upper surface of the first frame 110b.

  The second frame 110c is disposed along the outer peripheral edge of the first frame 110b, and is for forming the second recess K2 on the upper surface of the first frame 110b. The second frame 110c is made of a ceramic material such as alumina ceramics or glass-ceramics, and is formed integrally with the substrate 110a and the first frame 110b.

  The electrode pad 111 is for mounting the crystal element 120. A pair of electrode pads 111 are provided on the upper surface of the first frame 110b, and are provided adjacent to each other along one side of the first frame 110b. The electrode pad 111 is electrically connected to the external terminal 112 provided on the lower surface of the substrate 110a through the wiring pattern 113 and the via conductor 114 provided on the upper surface of the substrate 110a as shown in FIGS. It is connected to the.

  As shown in FIG. 3, the electrode pad 111 is composed of a first electrode pad 111a and a second electrode pad 111b. As shown in FIG. 4, the external terminal 112 includes a first external terminal 112a, a second external terminal 112b, a third external terminal 112c, and a fourth external terminal 112d. The via conductor 114 includes a first via conductor 114a, a second via conductor 114b, a third via conductor 114c, a fourth via conductor 114d, and a fifth via conductor 114e. The wiring pattern 113 is composed of a first wiring pattern 113a and a second wiring pattern 113b.

  The first electrode pad 111a is electrically connected to one end of the first wiring pattern 113a provided on the first frame 110b. The other end of the first wiring pattern 113a is electrically connected to the first external terminal 112a via the first via conductor 114a provided on the substrate 110a and the first frame 110b. Therefore, the first electrode pad 111a is electrically connected to the first external terminal 112a. The second electrode pad 111b is electrically connected to one end of the second wiring pattern 113b provided on the substrate 110a via a fifth via conductor 114e provided on the first frame 110b. The other end of the second wiring pattern 113b is electrically connected to the second external terminal 112b through the second via conductor 114b.

  The external terminal 112 is for mounting on a mounting board such as an electronic device. The external terminal 112 is provided on the lower surface of the substrate 110a. Two of the external terminals 112 are electrically connected to a pair of electrode pads 111 provided on the upper surface of the first frame 110b. The remaining two terminals of the external terminals 112 are electrically connected to a pair of connection pads 115 provided on the upper surface of the substrate 110a. The third external terminal 112c is connected to a mounting pad connected to a ground potential that is a reference potential on a mounting substrate of an electronic device or the like. As a result, the lid body 130 bonded to the sealing conductor pattern 118 is connected to the third external terminal 112c having the ground potential. Therefore, the shielding performance in the first recess K1 and the second recess K2 by the lid 130 is improved.

  The wiring pattern 113 is provided on the upper surface of the substrate 110a and the upper surface of the first frame 110b, and is drawn out from the electrode pad 111 toward the neighboring via conductor 114. Moreover, the wiring pattern 113 is comprised by the 1st wiring pattern 113a and the 2nd wiring pattern 113b, as shown in FIG.

  The via conductor 114 is provided inside the substrate 110a, and both ends thereof are electrically connected to the wiring pattern 113, the connection pattern 116, or the sealing conductor pattern 118. The via conductor 114 is provided by filling a conductor in a through hole provided in the substrate 110a. As shown in FIGS. 3 and 4, the via conductor 114 includes a first via conductor 114 a, a second via conductor 114 b, a third via conductor 114 c, a fourth via conductor 114 d, and a fifth via conductor 114 e. Yes.

  The connection pad 115 has a rectangular shape and is used for mounting a first temperature sensing element 150a and a second temperature sensing element 150b described later. Further, as shown in FIG. 4, the connection pad 115 includes a first connection pad 115a and a second connection pad 115b. A pair of connection pads 115 are formed on the upper surface of the substrate 110a in the first recess K1 along the inner peripheral edge of the first frame 110b. By forming the connection pads 115 in this way, a plurality of temperature sensing elements 150 can be mounted with a pair of connection pads 115, and the area of the connection pads 115 for mounting the plurality of temperature sensing elements 150 is also increased. Therefore, it is possible to improve the bonding strength between the temperature sensing element 150 and the connection pad 115 while suppressing the plurality of temperature sensing elements 150 from being detached from the connection pad 115. In addition, the conductive bonding material 170 is also provided between the lower surface of the connection pad 115 and the connection terminal 151 of the temperature sensitive element 150.

  Further, since the first temperature sensing element 150a and the second temperature sensing element 150b are mounted on the pair of connection pads 115, the heat transmitted to the adjacent first temperature sensing element 150a causes the connection pad 115 to pass through. Via the second temperature sensing element 150b. Therefore, the temperature difference between the first temperature sensing element 150a and the second temperature sensing element 150b can be reduced, and variation in the correction value to the crystal element 120 whose temperature is corrected by the temperature information of the temperature sensing element 150 is reduced. It becomes possible.

  Here, taking the case where the long side dimension of the substrate 110a as viewed in plan is 1.2 to 2.5 mm and the short side dimension is 1.0 to 2.0 mm, the connection pad 115 is taken as an example. Explain the size of. The length of the side of the connection pad 115 parallel to the short side of the substrate 110a is 0.8 to 2.0 mm, and the length of the side parallel to the long side of the substrate 110a is 0.25 to 0.55 mm. It has become. Further, the length between the first connection pad 115a and the second connection pad 115b is 0.1 to 0.3 mm.

  The first connection pad 115a and the fourth external terminal 112d are connected by a first connection pattern 116a and a fourth via conductor 114d provided on the upper surface of the substrate 110a. The second connection pad 115b and the third external terminal 112c are connected by a second connection pattern 116b and a third via conductor 114c provided on the upper surface of the substrate 110a.

  The connection pattern 116 is provided on the upper surface of the substrate 110 a and is drawn out from the connection pad 115 toward a predetermined external terminal 112. Further, as shown in FIG. 4, the connection pattern 116 includes a first connection pattern 116a and a second connection pattern 116b. The length of the first connection pattern 116a and the length of the second connection pattern 116b are substantially equal. Here, the substantially equal length means that the difference between the length of the first connection pattern 116a provided on the upper surface of the substrate 110a and the length of the second connection pattern 116b provided on the upper surface of the substrate 110a is different by 0 to 200 μm. Shall be included. The length of the connection pattern 116 is obtained by measuring the length of a straight line passing through the center of each connection pattern 116. That is, when the wiring length of the first connection pattern 116a and the wiring length of the second connection pattern 116b are substantially equal, the generated resistance values are equal, and the load resistance applied to the temperature sensing element 150 is also uniform. Therefore, it becomes possible to output a voltage stably.

  The connection pattern 116 is for electrically connecting adjacent connection pads 115 and connecting to the via conductor 114. The connection pattern 116 includes a first connection pattern 116a and a second connection pattern 116b. The first connection pattern 116a is electrically connected to the first connection pad 115a, and the second connection pattern 116b is electrically connected to the second connection pad 115b.

  Further, as shown in FIGS. 3 and 4, the first connection pattern 116 a is provided so as to be positioned between the pair of electrode pads 111 in a plan view. Further, by doing so, the heat transferred from the crystal element 120 is transferred from the first connection pattern 116a to the first connection pad 115a via the substrate 110a directly below the electrode pad 111. Therefore, since such a crystal resonator can further shorten the heat conduction path, the temperature of the crystal element 120 approximates the temperature of the first temperature sensing element 150a and the second temperature sensing element 150b. The difference between the temperature obtained by converting the voltages output from the first temperature sensing element 150a and the second temperature sensing element 150b and the temperature around the actual crystal element 120 can be further reduced. Become.

  The sealing conductor pattern 118 plays a role of improving the wettability of the bonding member 131 when bonded to the lid 130 via the bonding member 131. As shown in FIGS. 3 and 4, the sealing conductor pattern 118 is electrically connected to the third external terminal 112c through the third via conductor 114c. The sealing conductor pattern 118 is, for example, 10 to 25 μm thick by applying nickel plating and gold plating to the surface of the connection pattern made of, for example, tungsten or molybdenum in order to surround the upper surface of the second frame 110c in an annular shape. Is formed.

  The shape of the opening of the second recess K2 is a rectangular shape in plan view. Here, taking the case where the long side dimension of the substrate 110a in plan view is 1.2 to 2.5 mm and the short side dimension is 1.0 to 2.0 mm, the second concave portion is taken as an example. The size of the opening of K2 will be described. The length of the long side of the second recess K2 is 0.6 to 1.2 mm, and the length of the short side is 0.3 to 1.0 mm.

  Here, a method for manufacturing the substrate 110a will be described. When the substrate 110a is made of alumina ceramic, first, a plurality of ceramic green sheets obtained by adding and mixing an appropriate organic solvent or the like to a predetermined ceramic material powder is prepared. In addition, a predetermined conductor paste is applied to the surface of the ceramic green sheet or a through-hole previously punched by punching the ceramic green sheet by screen printing or the like. Further, these green sheets are laminated and press-molded and fired at a high temperature. Finally, nickel plating is applied to a predetermined portion of the connection pattern, specifically, the electrode pad 111, the external terminal 112, the wiring pattern 113, the via conductor 114, the connection pad 115, the connection pattern 116, and the sealing conductor pattern 118. Moreover, it produces by giving gold plating, silver palladium, etc. Moreover, the conductor paste is comprised from the sintered compact etc. of metal powders, such as tungsten, molybdenum, copper, silver, or silver palladium, for example.

  As shown in FIGS. 1 and 2, the crystal element 120 is bonded onto the electrode pad 111 via a conductive adhesive 140. The crystal element 120 plays a role of oscillating a reference signal of an electronic device or the like by stable mechanical vibration and a piezoelectric effect.

  Further, as shown in FIGS. 1 and 2, the crystal element 120 has a structure in which an excitation electrode 122 and an extraction electrode 123 are attached to an upper surface and a lower surface of a crystal base plate 121, respectively. . The excitation electrode 122 is formed by depositing and forming a metal in a predetermined pattern on each of the upper surface and the lower surface of the quartz base plate 121. The excitation electrode 122 includes a first excitation electrode 122a on the upper surface and a second excitation electrode 122b on the lower surface. The extraction electrode 123 extends from the excitation electrode 122 toward one side of the crystal base plate 121. The extraction electrode 123 includes a first extraction electrode 123a on the upper surface and a second extraction electrode 123b on the lower surface. The first extraction electrode 123 a is extracted from the first excitation electrode 122 a and is provided so as to extend toward one side of the crystal base plate 121. The second extraction electrode 123 b is extracted from the second excitation electrode 122 b and is provided so as to extend toward one side of the crystal base plate 121. That is, the extraction electrode 123 is provided in a shape along the long side or the short side of the quartz base plate 121. In the present embodiment, one end of the crystal element 120 connected to the first electrode pad 111a and the second electrode pad 111b is a fixed end connected to the upper surface of the first frame 110b, and the other end of the substrate 110a. The crystal element 120 is fixed on the first frame 110b by a cantilever support structure having a free end spaced from the upper surface.

  Here, the operation of the crystal element 120 will be described. In the crystal element 120, when an alternating voltage from the outside is applied from the extraction electrode 123 to the crystal base plate 121 via the excitation electrode 122, the crystal base plate 121 is excited in a predetermined vibration mode and frequency. ing.

  Here, a manufacturing method of the crystal element 120 will be described. First, the crystal element 120 is cut from the artificial crystalline lens at a predetermined cut angle to reduce the thickness of the outer periphery of the crystal base plate 121, and the central portion of the crystal base plate 121 is thicker than the outer peripheral portion of the crystal base plate 121. The bevel processing provided is performed. The crystal element 120 is manufactured by forming the excitation electrode 122 and the extraction electrode 123 by depositing a metal film on both main surfaces of the crystal base plate 121 by a photolithography technique, a vapor deposition technique, or a sputtering technique. Is done.

  A method for bonding the crystal element 120 to the substrate 110a will be described. First, the conductive adhesive 140 is applied onto the first electrode pad 111a and the second electrode pad 111b by a dispenser, for example. The crystal element 120 is transported onto the conductive adhesive 140 and placed on the conductive adhesive 140. The conductive adhesive 140 is cured and contracted by being heated and cured. The crystal element 120 is bonded to the electrode pad 111. That is, the first lead electrode 123a of the crystal element 120 is joined to the first electrode pad 111a, and the second lead electrode 123b is joined to the second electrode pad 111b. Thereby, the crystal element 120 is electrically connected to the first external terminal 112a and the second external terminal 112b of the substrate 110a.

  The conductive adhesive 140 contains conductive powder as a conductive filler in a binder such as silicone resin, and the conductive powder includes aluminum, molybdenum, tungsten, platinum, palladium, silver, titanium, One containing either nickel or nickel iron, or a combination thereof is used. Moreover, as a binder, a silicone resin, an epoxy resin, a polyimide resin, or a bismaleimide resin is used, for example.

  As the temperature sensing element 150, a thermistor, a platinum resistance thermometer, a diode, or the like is used. In the case of the thermistor element, the temperature sensing element 150 has a rectangular parallelepiped shape, and is provided with connection terminals 151 at both ends. The temperature sensing element 150 includes a first temperature sensing element 150a and a second temperature sensing element 150b. The temperature sensing element 150 shows a remarkable change in electric resistance due to a change in temperature. Since the voltage changes due to the change in resistance value, the output depends on the relationship between the resistance value and the voltage and the relationship between the voltage and the temperature. Temperature information can be obtained from the applied voltage. The temperature sensing element 150 outputs a voltage between connection terminals 151, which will be described later, to the outside of the crystal resonator via the third external terminal 112c and the fourth external terminal 112d of the package 110, for example, an electronic device or the like Temperature information can be obtained by converting the voltage output from the main IC (not shown) into temperature. Such a temperature sensitive element 150 is arranged near the crystal resonator, and the voltage for driving the crystal resonator is controlled by the main IC in accordance with the temperature information of the crystal resonator obtained thereby, so-called temperature compensation. Can do.

  When the temperature sensing element 150 is a thermistor element, the first temperature sensing element 150a and the second temperature sensing element 150b are connected in parallel. In this way, a resistance value with a narrow deviation can be obtained without degrading the thermistor characteristics, and the B constant, which is a physical property value representing the sensitivity of the thermistor element to the temperature change (ratio of change in resistance value). We can suppress decline

  In the case where a platinum resistance thermometer is used, the temperature sensing element 150 is provided with a platinum electrode by depositing platinum at the center of a rectangular parallelepiped ceramic plate. Connection terminals 151 are provided at both ends of the ceramic plate. The platinum electrode and the connection terminal are connected by a lead electrode provided on the upper surface of the ceramic plate. An insulating resin is provided so as to cover the upper surface of the platinum electrode.

  When a diode is used, the temperature sensing element 150 has a structure in which a semiconductor element is mounted on an upper surface of a semiconductor element substrate, and the upper surface of the semiconductor element and the semiconductor element substrate is covered with an insulating resin. . Connection terminals 151 serving as an anode terminal and a cathode terminal are provided from the bottom surface to the side surface of the semiconductor element substrate. The temperature sensing element 150 has a forward characteristic in which current flows from the anode terminal to the cathode terminal, but hardly flows current from the cathode terminal to the anode terminal. The forward characteristics of the temperature sensitive element vary greatly depending on the temperature. Voltage information can be obtained by passing a constant current through the temperature sensing element and measuring the forward voltage. By converting from the voltage information, the temperature information of the crystal element 120 can be obtained. In the diode, the relationship between voltage and temperature shows a straight line. The voltage between the cathode terminal and the anode terminal of the connection terminal 151 is output to the outside of the crystal resonator via the third external terminal 112c and the fourth external terminal 112d.

  As shown in FIG. 2, the temperature sensing element 150 is mounted on a connection pad 115 provided on the lower surface of the substrate 110a via a conductive bonding material 170 such as solder. The first connection terminal 151a of the first temperature sensing element 150a and the third connection terminal 151c of the second temperature sensing element 150b are connected to the first connection pad 115a, and the second connection terminal 151b and the fourth connection terminal 151d are The second connection pad 115b is connected. The second connection pad 115b is connected to the third external terminal 112c via a second connection pattern 116b provided on the lower surface of the substrate 110a. Further, the third external terminal 112c serves as a ground terminal by being connected to a mounting pad connected to a ground which is a reference potential on a mounting substrate of an electronic device or the like. Therefore, the second connection terminal 151b of the first temperature sensing element 150a and the fourth connection terminal 151d of the second temperature sensing element 150b are connected to the ground that is the reference potential.

  Further, at least two of the two or more temperature sensitive elements 150 are positioned in the plane of the excitation electrode 122 provided on the crystal element 120 as seen through the plane. That is, a part of the first temperature sensing element 150a and the second temperature sensing element 150b is located in the plane of the excitation electrode 122 provided on the quartz crystal element 120 as seen through the plane, so that the excitation electrode The temperature-sensitive element 150 is protected from noise from other semiconductor components such as a power amplifier constituting the electronic apparatus and electronic components by the shielding effect of the metal film 122. Therefore, due to the shielding effect of the excitation electrode 122, it is possible to reduce noise from being superimposed on at least two or more temperature sensing elements 150, and to output an accurate voltage of at least two or more temperature sensing elements 150. In addition, since an accurate voltage value can be output from at least two temperature sensing elements 150, temperature information obtained by converting the voltage output from the temperature sensing element 150 and the actual crystal element 120 are converted. It is possible to further reduce the difference from the ambient temperature information.

  A method for bonding the temperature sensitive element 150 to the substrate 110a will be described. First, the conductive bonding material 170 is applied to the connection pad 115 by a dispenser, for example. The temperature sensitive element 150 is placed on the conductive bonding material 170. The conductive bonding material 170 is melt bonded by heating. Therefore, the plurality of temperature sensing elements 150 are respectively joined to the connection pads 115.

  When the temperature sensitive element 150 is a thermistor element, as shown in FIGS. 1 and 2, one connection terminal 151 is provided at each end of the rectangular parallelepiped shape. The first connection terminal 151a and the third connection terminal 151c are provided on the right side surface and the top and bottom surfaces of the first temperature sensing element 150a and the second temperature sensing element 150b. Moreover, the 2nd connection terminal 151b and the 4th connection terminal 151d are provided in the left side surface and upper and lower surfaces of the 1st temperature sensing element 150a and the 2nd temperature sensing element 150b. The long side of such a temperature sensitive element 150 has a length of 0.4 to 0.6 mm, and the short side has a length of 0.2 to 0.3 mm. The length of the thermosensitive element 150 in the thickness direction is 0.1 to 0.3 mm.

  The conductive bonding material 170 is made of, for example, silver paste or lead-free solder. In addition, the conductive bonding material 170 contains an added solvent for adjusting the viscosity to be easily applied. The component ratio of the lead-free solder is 95 to 97.5% for tin, 2 to 4% for silver, and 0.5 to 1.0% for copper.

  The lid 130 is made of an alloy containing at least one of iron, nickel, and cobalt, for example. Such a lid 130 is for hermetically sealing the first concave portion K1 and the second concave portion K2 filled with a first concave portion K1 and a second concave portion K2 in a vacuum state or nitrogen gas. . Specifically, the lid 130 is placed on the second frame 110c of the package 110 in a predetermined atmosphere, and the sealing conductor pattern 118 on the second frame 110c and the bonding member 131 of the lid 130 Is welded to the second frame 110c by applying a predetermined current so as to be welded. The lid 130 is electrically connected to the third external terminal 112c on the lower surface of the substrate 110a through the sealing conductor pattern 118 and the third via conductor 114c. Therefore, the lid 130 is electrically connected to the third external terminal 112c of the package 110.

  The joining member 131 is provided at a location of the lid 130 facing the sealing conductor pattern 118 provided on the upper surface of the second frame 110c of the package 110. The joining member 131 is provided by, for example, silver solder or gold tin. In the case of silver wax, the thickness is 10 to 20 μm. For example, the component ratio is 72 to 85% for silver and 15 to 28% for copper. In the case of gold tin, the thickness is 10 to 40 μm. For example, the component ratio is 78 to 82% for gold and 18 to 22% for tin.

  The crystal resonator in the present embodiment is provided along a rectangular substrate 110a, a first frame 110b provided along the outer peripheral edge of the upper surface of the substrate 110a, and an outer peripheral edge of the first frame 110b. The second frame 110c, the pair of electrode pads 111 provided on the upper surface of the first frame 110b, the pair of connection pads 115 provided on the upper surface of the substrate 110a, and the crystal element 120 mounted on the electrode pad 111. And at least two or more temperature sensing elements 150 mounted on the pair of connection pads 115, and a lid 130 joined to the upper surface of the second frame 110c. By doing in this way, since the 1st temperature sensing element 150a and the 2nd temperature sensing element 150b are mounted in a pair of connection pad 115, the heat transmitted to the adjacent 1st temperature sensing element 150a is carried out. The second temperature sensitive element 150b is shared via the connection pad 115. Therefore, the temperature difference between the first temperature sensing element 150a and the second temperature sensing element 150b can be reduced, and variation in the correction value to the crystal element 120 whose temperature is corrected by the temperature information of the temperature sensing element 150 is reduced. It becomes possible.

  In addition, the crystal resonator according to this embodiment includes a connection pattern 116 provided on the upper surface of the substrate 110a and electrically connected to the connection pad 115, and the pair of electrode pads 111 is included in the first frame 110b. The connection patterns 116 are provided so as to be adjacent to each other along one side of the periphery, and are provided so as to be positioned between the pair of electrode pads 111 in a plan view. By doing so, the heat transmitted from the crystal element 120 is transmitted to the first connection pattern 116a through the substrate 110a immediately below the electrode pad 111, and is transmitted to the first connection pad 115a. Therefore, since such a crystal resonator can further shorten the heat conduction path, the temperature of the crystal element 120 approximates the temperature of the first temperature sensing element 150a and the second temperature sensing element 150b. The difference between the temperature obtained by converting the voltage output from the temperature sensing element 150 and the actual temperature around the quartz crystal element 120 can be further reduced.

  Further, in the crystal resonator according to the present embodiment, at least two or more of the temperature sensitive elements 150 are seen through a plane in a state where the crystal element 120 and the temperature sensitive element 150 are mounted on the substrate 110a. It is located in the plane of the excitation electrode 122 provided at 120. By doing so, at least two or more temperature-sensitive elements 150 are protected from noise from other semiconductor components such as power amplifiers and electronic components constituting the electronic device by the shielding effect of the excitation electrode 122 by the metal film. To do. Therefore, due to the shielding effect of the excitation electrode 122, it is possible to reduce noise from being superimposed on at least two or more temperature sensing elements 150, and to output accurate voltages of the plurality of temperature sensing elements 150. Moreover, since an accurate voltage value can be output from at least two or more temperature sensing elements 150, temperature information obtained by converting voltages output from at least two or more temperature sensing elements 150; It becomes possible to further reduce the difference from the temperature information around the actual crystal element 120.

  In the crystal resonator according to this embodiment, one of the connection pads 115 is electrically connected to the lid 130. Thus, when the lid 130 is connected to the ground potential, the second connection terminal 151b of the first temperature sensing element 150a and the fourth connection terminal 150d of the second temperature sensing element 150b are connected to the ground potential. As a result, noise superimposed on the voltage output from at least two or more temperature sensing elements 150 can be reduced, and the accurate voltage of at least two or more temperature sensing elements 150 can be output. . Moreover, since an accurate voltage value can be output from at least two or more temperature sensing elements 150, temperature information obtained by converting voltages output from at least two or more temperature sensing elements 150; It becomes possible to further reduce the difference from the temperature information around the actual crystal element 120.

(Modification)
Hereinafter, a crystal device according to a modification of the present embodiment will be described. Note that, in the quartz crystal device according to the modification of the present embodiment, the same parts as those of the quartz crystal device described above are denoted by the same reference numerals, and description thereof will be omitted as appropriate. As shown in FIGS. 5 to 6, the crystal device according to the modification of the present embodiment has connection pads 215 on the substrate 210 a so that the long side of the temperature sensing element 150 is parallel to the short side of the substrate 210 a. This embodiment is different from the present embodiment in that it is mounted on.

  The connection pad 215 has a rectangular shape and is provided near the center of the lower surface of the substrate 210a. As shown in FIGS. 5 and 6, the connection pads 215 are provided adjacent to each other so that the long sides of the connection pads 215 and the short sides of the substrate 210a are parallel to each other. The connection pad 215 includes a first connection pad 215a and a second connection pad 215b. In addition, a pair of connection pads 215 are formed on the upper surface of the substrate 210a so as to extend to the vicinity of the inner periphery of the first frame 210b. By forming the connection pads 215 in this manner, a plurality of temperature sensing elements 150 can be mounted with a pair of connection pads 215 and the area of the connection pads 215 for mounting the plurality of temperature sensing elements 150 is also increased. Therefore, it is possible to improve the bonding strength between the temperature sensing element 150 and the connection pad 215 while suppressing the plurality of temperature sensing elements 150 from being detached from the connection pad 215. In addition, the conductive bonding material 170 is also provided between the lower surface of the connection pad 215 and the connection terminal 151 of the temperature sensitive element 150.

  As shown in FIGS. 5 and 6, the connection pattern 216 is provided on the upper surface of the substrate 210 a and is led out from the connection pad 215 toward the desired via conductor 214. The first connection pattern 216a is provided so as to overlap the second electrode pad 211b. By doing so, the heat transmitted from the crystal element 120 is transmitted from the second electrode pad 211b to the first connection pattern 216a via the substrate 210a, and is transmitted to the first connection pad 215a. Therefore, since such a crystal resonator can further shorten the heat conduction path, the temperature of the crystal element 120 and the temperature of the temperature sensing element 150 are approximated and output from the temperature sensing element 150. It becomes possible to further reduce the difference between the temperature obtained by converting the voltage and the actual temperature around the quartz crystal element 120.

  Further, the crystal resonator according to the present embodiment includes a connection pattern 216 provided on the upper surface of the substrate 210a and electrically connected to the connection pad 215, and the pair of electrode pads 211 is included in the first frame 210b. It is provided so as to be adjacent along one side of the peripheral edge, and one of the connection patterns 216 is provided so as to overlap with one of the pair of electrode pads 211 in a plan view. By doing in this way, the heat transmitted from the crystal element 120 is transmitted from the first connection pattern 216a to the first connection pad 215a via the first frame body 210b immediately below the second electrode pad 211b. In such a crystal unit, the temperature of the crystal element 120 and the temperature of the first temperature sensing element 150a and the second temperature sensing element 150b are reduced by further shortening the heat conduction paths and further increasing the number of heat conduction paths. In addition, the difference between the temperature obtained by converting the voltage output from the temperature sensing element 150 and the actual temperature around the quartz crystal element 120 can be further reduced.

  In addition, it is not limited to this embodiment, A various change, improvement, etc. are possible in the range which does not deviate from the summary of this invention. In the above embodiment, the case where an AT crystal element is used as the crystal element has been described. However, a tuning fork-type bent crystal having a base and two flat plate-shaped vibrating arms extending in the same direction from the side surface of the base. An element may be used.

  In the above embodiment, the case where the second frame 110c is integrally formed of a ceramic material in the same manner as the substrate 110a and the first frame 110b has been described. However, the second frame 110c may be made of metal. . In this case, the frame is joined to the conductor film of the substrate via a brazing material such as silver-copper.

110, 210 ... Package 110a, 210a ... Substrate 110b, 210b ... First frame 110c, 210c ... Second frame 111, 211 ... Electrode pads 112, 212 ... External terminals 113, 213 ... wiring pattern 114, 214 ... via conductor 115, 215 ... connection pad 116, 216 ... connection pattern 118, 218 ... sealing conductor pattern 120 ... crystal element 121 ... Quartz element plate 122 ... Excitation electrode 123 ... Extraction electrode 130 ... Cover body 131 ... Joint member 140 ... Conductive adhesive 150 ... Temperature element 151 ... Connection terminal K1 ... first recess K2 ... second recess

Claims (5)

A rectangular substrate;
A first frame provided along the outer peripheral edge of the upper surface of the substrate;
A second frame provided along the outer peripheral edge of the first frame;
A pair of electrode pads provided on the upper surface of the first frame,
A pair of connection pads provided on the upper surface of the substrate;
A crystal element mounted on the electrode pad;
At least two or more temperature sensing elements mounted on the pair of connection pads;
And a lid bonded to the upper surface of the second frame. The crystal resonator according to claim 1,
A connection pattern provided on the upper surface of the substrate and electrically connected to the connection pads,
The pair of electrode pads are provided so as to be adjacent along one side of the inner peripheral edge of the first frame,
A crystal resonator, wherein the connection pattern is provided so as to be positioned between the pair of electrode pads as seen in a plan view. The crystal resonator according to claim 1,
A connection pattern provided on the upper surface of the substrate and electrically connected to the connection pads,
The pair of electrode pads are provided so as to be adjacent along one side of the inner peripheral edge of the first frame,
One of the connection patterns is provided so as to overlap with one of the pair of electrode pads in a plan view. The crystal resonator according to claim 1, wherein:
A part of the at least two temperature-sensitive elements is provided on the crystal element in a plan view with the crystal element mounted on the first frame and the temperature-sensitive element mounted on the substrate. A quartz crystal resonator, wherein the crystal resonator is positioned in a plane of the excitation electrode formed. The crystal resonator according to any one of claims 1 to 4,
One of the connection pads is electrically connected to the lid body.

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