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JP2015146332A5 - - Google Patents

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Publication number
JP2015146332A5
JP2015146332A5 JP2014017619A JP2014017619A JP2015146332A5 JP 2015146332 A5 JP2015146332 A5 JP 2015146332A5 JP 2014017619 A JP2014017619 A JP 2014017619A JP 2014017619 A JP2014017619 A JP 2014017619A JP 2015146332 A5 JP2015146332 A5 JP 2015146332A5
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development
oxide semiconductor
developer
thin film
developing
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JP2014017619A
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JP6237279B2 (en
JP2015146332A (en
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Priority to JP2014017619A priority Critical patent/JP6237279B2/en
Priority claimed from JP2014017619A external-priority patent/JP6237279B2/en
Priority to CN201510046590.6A priority patent/CN104821337B/en
Priority to TW104102947A priority patent/TWI626511B/en
Priority to KR1020150015443A priority patent/KR102302306B1/en
Publication of JP2015146332A publication Critical patent/JP2015146332A/en
Publication of JP2015146332A5 publication Critical patent/JP2015146332A5/ja
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近年、高解像度ディスプレイ向けに、アモルファスInGaZnOに代表される酸化物半導体を用いた薄膜トランジスタの開発が活発に行われている。酸化物半導体は、液晶ディスプレイに使用されているアモルファスシリコン薄膜トランジスタと比較して、電子移動度が大きく、大きなON/OFF比など優れた電気特性を示すことから、有機ELディプレイの駆動素子や、省電力素子として期待されている。ディスプレイ向けの開発においては、特にトランジスタとしてのデバイス動作安定性と大面積基板上での均一性を保つことが重要な課題となっている。デバイス動作安定性に極めて重要な要素としては、酸化物半導体層を外部雰囲気から保護する絶縁膜がある。しかし、このような絶縁膜としては、従来のアモルファスシリコンを用いた薄膜トランジスタに利用されてきた保護用絶縁膜が主に使用されており(特許文献1および2)、酸化物半導体が本質的に持つ物性を十分活かせていない虞がある。そして、このことが酸化物半導体を用いた薄膜トランジスタの性能が制限される要因の一つとなっていると考えられている。 In recent years, thin film transistors using an oxide semiconductor typified by amorphous InGaZnO have been actively developed for high-resolution displays. Oxide semiconductor, as compared with amorphous silicon thin film transistor used in liquid crystal displays, the electron mobility is large, because it exhibits excellent electrical properties, such as large ON / OFF ratio, Ya driving element of an organic EL Di scan play It is expected as a power-saving element. In the development for displays, it is particularly important to maintain device operation stability as a transistor and uniformity over a large area substrate. An extremely important element for device operation stability is an insulating film that protects the oxide semiconductor layer from the external atmosphere. However, as such an insulating film, a protective insulating film that has been used for a conventional thin film transistor using amorphous silicon is mainly used (Patent Documents 1 and 2), and an oxide semiconductor has essentially. The physical properties may not be fully utilized. This is considered to be one of the factors that limit the performance of a thin film transistor using an oxide semiconductor.

<現像工程>
露光後、必要に応じて露光後加熱を行ったあと、保護膜前駆体層を現像処理する。現像の際に用いられる現像液としては、従来周知の感光性シロキサン組成物の現像に用いられている任意の現像液を用いることができる。本発明においてはポリシロキサンの溶解速度を特定するために水酸化テトラメチルアンモニウム(TMAH)水溶液を用いるが、硬化膜を形成させるときに用いる現像液はこれに限定されない。好ましい現像液としては、水酸化テトラアルキルアンモニウム、コリン、アルカリ金属水酸化物、アルカリ金属メタ珪酸塩(水和物)、アルカリ金属燐酸塩(水和物)、アンモニア、アルキルアミン、アルカノールアミン、複素環式アミンなどのアルカリ性化合物の水溶液であるアルカリ現像液が挙げられ、特に好ましいアルカリ現像液は、TMAH水溶液である。これらアルカリ現像液には、必要に応じ更にメタノール、エタノールなどの水溶性有機溶剤、あるいは界面活性剤が含まれていてもよい。現像方法も従来知られている方法から任意に選択することができる。具体的には、現像液への浸漬(ディップ)、パドル、シャワー、スリット、キャップコート、スプレーなどの方法挙げられる。この現像によって、パターンを得ることができる。現像液により現像が行われた後には、水洗がなされることが好ましい。なお、本発明による製造方法においては、図3に示すように、現像によって形成したコンタクトホール9を介して、ドレイン電極6と保護膜7の上に形成した透明電極(画素電極8)とを導通させることもできる。
<Development process>
After the exposure, after the post-exposure heating as necessary, the protective film precursor layer is developed. As a developing solution used at the time of development, any developing solution used for developing a known photosensitive siloxane composition can be used. In the present invention, an aqueous tetramethylammonium hydroxide (TMAH) solution is used to specify the dissolution rate of polysiloxane, but the developer used for forming a cured film is not limited thereto. Preferred developers include tetraalkylammonium hydroxide, choline, alkali metal hydroxide, alkali metal metasilicate (hydrate), alkali metal phosphate (hydrate), ammonia, alkylamine, alkanolamine, complex Examples include an alkaline developer that is an aqueous solution of an alkaline compound such as a cyclic amine, and a particularly preferred alkaline developer is an aqueous TMAH solution. These alkaline developers may further contain a water-soluble organic solvent such as methanol and ethanol, or a surfactant, if necessary. The developing method can be arbitrarily selected from conventionally known methods. Specific examples include immersion (dip) in a developer, paddle, shower, slit, cap coat, and spray. By this development, a pattern can be obtained. After development with a developer, it is preferably washed with water. In the manufacturing method according to the present invention, as shown in FIG. 3, the drain electrode 6 and the transparent electrode (pixel electrode 8) formed on the protective film 7 are electrically connected through the contact hole 9 formed by development. It can also be made.

JP2014017619A 2014-01-31 2014-01-31 Thin film transistor substrate having protective film and method for manufacturing the same Active JP6237279B2 (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2014017619A JP6237279B2 (en) 2014-01-31 2014-01-31 Thin film transistor substrate having protective film and method for manufacturing the same
CN201510046590.6A CN104821337B (en) 2014-01-31 2015-01-29 The thin film transistor base plate and its manufacturing method for having protective film
TW104102947A TWI626511B (en) 2014-01-31 2015-01-29 A method of manufacturing a thin film transistor substrate having a passivation film
KR1020150015443A KR102302306B1 (en) 2014-01-31 2015-01-30 A thin film transistor substrate having a passivation film, and a method of manufacturing the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014017619A JP6237279B2 (en) 2014-01-31 2014-01-31 Thin film transistor substrate having protective film and method for manufacturing the same

Publications (3)

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JP2015146332A JP2015146332A (en) 2015-08-13
JP2015146332A5 true JP2015146332A5 (en) 2016-11-24
JP6237279B2 JP6237279B2 (en) 2017-11-29

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JP (1) JP6237279B2 (en)
KR (1) KR102302306B1 (en)
CN (1) CN104821337B (en)
TW (1) TWI626511B (en)

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Publication number Priority date Publication date Assignee Title
EP3194502A4 (en) 2015-04-13 2018-05-16 Honeywell International Inc. Polysiloxane formulations and coatings for optoelectronic applications
KR101862710B1 (en) * 2015-10-30 2018-05-30 삼성에스디아이 주식회사 Photo-sensitive Composition, Cured Film Prepared Therefrom, and Device Incoporating the Cured Film
TW201723096A (en) * 2015-12-31 2017-07-01 奇美實業股份有限公司 Photosensitive resin composition and uses thereof
WO2017200201A1 (en) * 2016-05-19 2017-11-23 Rohm And Haas Electronic Materials Korea Ltd. Photosensitive resin composition and cured film prepared therefrom
KR102310794B1 (en) * 2016-05-19 2021-10-12 롬엔드하스전자재료코리아유한회사 Photosensitive resin composition and cured film prepared therefrom
JP6852296B2 (en) * 2016-07-19 2021-03-31 株式会社リコー Manufacturing method of field effect transistor
CN110073476B (en) * 2016-11-28 2023-09-01 默克专利有限公司 Thin film transistor substrate having protective film and method for manufacturing the same
KR102028642B1 (en) * 2016-12-19 2019-10-04 삼성에스디아이 주식회사 Photo-sensitive Composition, Cured Film Prepared Therefrom, and Electronic Device Incoporating the Cured Film
KR20220046598A (en) * 2019-08-16 2022-04-14 도쿄엘렉트론가부시키가이샤 Methods and Processes for Probability-Based Defect Correction

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JP2006236839A (en) * 2005-02-25 2006-09-07 Mitsubishi Electric Corp Organic electroluminescent display device
KR101800015B1 (en) * 2007-12-10 2017-11-21 카네카 코포레이션 Alkali-developable curable composition, insulating thin film using the same, and thin film transistor
WO2011077978A1 (en) * 2009-12-25 2011-06-30 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing display device
KR101799260B1 (en) * 2010-08-24 2017-11-20 메르크 파텐트 게엠베하 Positive photosensitive siloxane composition
US9236496B2 (en) * 2011-03-11 2016-01-12 Sharp Kabushiki Kaisha Thin film transistor and display device
JP2012235104A (en) 2011-04-22 2012-11-29 Kobe Steel Ltd Thin film transistor structure, and thin film transistor and display device including the structure
KR101902164B1 (en) * 2011-05-20 2018-10-01 메르크 파텐트 게엠베하 Positive photosensitive siloxane composition
KR20130042867A (en) * 2011-10-19 2013-04-29 삼성디스플레이 주식회사 Solution composition for passivation layer, thin film transistor array panel and manufacturing method for thin film transistor array panel
JPWO2013108301A1 (en) * 2012-01-20 2015-05-11 パナソニック株式会社 Thin film transistor
JP5965696B2 (en) 2012-03-29 2016-08-10 株式会社半導体エネルギー研究所 Semiconductor device and manufacturing method of semiconductor device
JP6175740B2 (en) 2012-03-30 2017-08-09 株式会社Joled THIN FILM TRANSISTOR, MANUFACTURING METHOD THEREOF, DISPLAY DEVICE AND ELECTRONIC DEVICE
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