JP2014231566A - Prepreg, metal-clad laminate, and printed wiring board - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a prepreg having both heat resistance and tracking resistance.SOLUTION: A prepreg includes a first resin layer 51 containing a fiber substrate 4 therein and a second resin layer 52 formed on at least one surface of the first resin layer 51. A total thickness of the second resin layer 52 is 6-70 μm. The second resin layer 52 contains a metal hydroxide. The first resin layer 51 does not contain a metal hydroxide or contains a metal hydroxide so that its thermal reduction rate represented by formula (1) is smaller than that of the second resin layer 52: (1) thermal reduction rate=(thermal reduction of the metal hydroxide at 400°C)/(a total mass of solid components except the fiber substrate in the resin layer).

Description

  The present invention relates to a prepreg and a metal-clad laminate used as materials for a printed wiring board and the like, and a printed wiring board manufactured using these.

  The printed wiring board is manufactured using, for example, a composite laminate board (see, for example, Patent Document 1). However, in recent years, high electrical insulation is required as electronic devices are downsized. Particularly in applications of electric vehicles (EV) and hybrid vehicles (HEV: Hybrid Electric Vehicle), the use voltage has been increased, and further improvement in tracking resistance has been demanded.

JP-A-3-81140

  Tracking resistance is evaluated using a comparative tracking index (CTI) as an index. Generally, printed wiring boards manufactured using materials with high CTI values tend to have low heat resistance, so it is difficult to sufficiently satisfy the high heat resistance required for soldering using lead-free solder. It is. Although a phenol resin is generally known as a material having high heat resistance, a printed wiring board using the phenol resin tends to have a low CTI value.

  This invention is made | formed in view of said point, and it aims at providing the prepreg which can make heat resistance and tracking resistance compatible, a metal-clad laminated board, and a printed wiring board.

The prepreg according to the present invention is
A first resin layer containing a fiber substrate therein;
A second resin layer formed on at least one side of the first resin layer;
With
The total thickness of the second resin layer is 6 to 70 μm;
The second resin layer contains a metal hydroxide,
The first resin layer does not contain a metal hydroxide, or the metal hydroxide so that the thermal weight loss rate of the formula (1) is smaller than the thermal weight loss rate of the formula (1) in the second resin layer. It is characterized by containing.
(1) Heat loss rate = heat loss of metal hydroxide at 400 ° C./total mass of solid component excluding fiber substrate in resin layer In the prepreg,
The first resin layer has a heat loss rate of 12% or less,
The second resin layer preferably has a heat loss rate of 15 to 25%.

In the prepreg,
The second resin layer is preferably formed on both surfaces of the first resin layer.

In the prepreg,
It is preferable that the second resin layer is formed only on one side of the first resin layer.

In the prepreg,
The first resin layer and the second resin layer preferably contain an epoxy resin and a phenolic curing agent as the resin component.

The metal-clad laminate according to the present invention is
It is formed by overlapping a metal foil on the second resin layer of the prepreg and heating and pressing.

The printed wiring board according to the present invention,
A conductive pattern is formed by removing a part of the metal foil of the metal-clad laminate.

  According to the present invention, both heat resistance and tracking resistance can be achieved.

BRIEF DESCRIPTION OF THE DRAWINGS It shows an example of embodiment of this invention, (a) is a schematic sectional drawing of a prepreg, (b) is a schematic sectional drawing of a metal-clad laminated board, (c) is a schematic sectional drawing of a printed wiring board. . It shows another example of an embodiment of the present invention, (a) is a schematic sectional view of a prepreg, (b) is a schematic sectional view of a metal-clad laminate, and (c) is a schematic sectional view of a printed wiring board. It is.

  Embodiments of the present invention will be described below.

  The prepreg 1 according to the present invention includes a first resin layer 51 and a second resin layer 52, as shown in FIG. 1 (a) and FIG. 2 (a). Here, FIG. 1A shows an example in which the second resin layer 52 is formed on both surfaces of the first resin layer 51, and FIG. 2A shows the one surface of the first resin layer 51 in which the second resin layer 52 is formed. The example formed only in is shown.

  First, the first resin layer 51 will be described. The 1st resin layer 51 is comprised with the semi-hardened | cured material of the 1st resin composition, and contains the fiber base material 4 in the inside.

  A 1st resin composition contains a thermosetting resin, a hardening | curing agent, a hardening accelerator, etc. by appropriate compounding composition. As the thermosetting resin, for example, an epoxy resin, a polyphenylene ether resin, an imide resin, a benzoxazine resin, or the like can be used. Among these, an epoxy resin is particularly preferably used. The thermosetting resin may be flame retardant by bromination or the like. The curing agent is not particularly limited as long as it can react with the thermosetting resin to form a crosslinked structure. For example, a phenol curing agent, an amine curing agent, a cyanate curing agent, and the like can be used. . The present invention is particularly useful in the case of using a phenolic curing agent from the viewpoint that the effect of improving tracking resistance is remarkably obtained. As the phenolic curing agent, for example, a polyfunctional phenol resin such as a phenol novolak resin, a bisphenol novolak resin, or a cresol novolac resin, a bifunctional phenol compound such as bisphenol A, bisphenol F, or biphenylphenol can be used. In particular, from the viewpoint of improving heat resistance, a polyfunctional phenol resin is preferably used. Thus, even when a phenol resin is used as the curing agent, in the present invention, both heat resistance and tracking resistance can be achieved as described later. As the curing accelerator, for example, an imidazole compound such as 2-ethyl-4-methylimidazole (2E4MZ), an amine compound, or the like can be used. Moreover, the 1st resin composition can also contain non-halogen flame retardants, such as halogen-containing flame retardants, such as a bromine containing compound, and a phosphorus containing compound and a nitrogen-containing compound as needed. As the fiber base material 4, glass cloth (glass cloth), glass paper (glass nonwoven fabric), an aramid nonwoven fabric, etc. can be used, for example.

  The first resin layer 51 can further contain an inorganic filler. By containing the inorganic filler, the linear expansion coefficient in the thickness direction of the metal-clad laminate 2 and the printed wiring board 3 manufactured using the prepreg 1 according to the present invention is reduced, and the metal-clad laminate 2 and The printed wiring board 3 can be toughened. Specific examples of inorganic fillers include silica, aluminum hydroxide, magnesium hydroxide, boehmite, E glass powder, alumina, magnesium oxide, titanium dioxide, calcium silicate, calcium carbonate, clay, talc and the like. Can do. Only one of these can be used, or two or more can be used in combination. By the way, the 1st resin layer 51 does not necessarily need to contain a metal hydroxide as an inorganic filler, but when it contains a metal hydroxide, the thermal weight loss shown by the following formula (1) It is important that the rate be smaller than the heat loss rate of the formula (1) in the second resin layer 52. In that case, the metal hydroxide at 400 ° C. with respect to the thermal loss rate of the formula (1) in the first resin layer 51, that is, the total mass of the solid components in the first resin composition constituting the first resin layer 51. The ratio of the heat loss is preferably 12% or less. The solid component in the first resin composition includes solid components other than the fiber substrate 4 in the first resin layer 51, that is, thermosetting resin, curing agent, curing accelerator, flame retardant, inorganic filler, and the like. Is included.

(1) Heat loss rate = heat loss of metal hydroxide at 400 ° C./total mass of solid component excluding fiber base in resin layer As the metal hydroxide, water in the molecule at high temperature What discharge | releases Japanese water and produces a heat loss (mass reduction) can be used suitably. As such a metal hydroxide, for example, aluminum hydroxide, magnesium hydroxide or the like can be used.

  Next, the second resin layer 52 will be described. The second resin layer 52 is made of a semi-cured product of the second resin composition, and is formed so as to cover at least one surface of the first resin layer 51. In addition, the 2nd resin layer 52 does not contain a fiber base material in the inside.

  A 2nd resin composition contains a thermosetting resin, a hardening | curing agent, a hardening accelerator, an inorganic filler, etc. with an appropriate compounding composition. As a thermosetting resin, a hardening | curing agent, a hardening accelerator, and an inorganic filler, what was illustrated in the 1st resin composition can be used, for example. Moreover, a flame retardant can also be contained as needed like the 1st resin composition.

  However, the second resin composition, as an inorganic filler, such as aluminum hydroxide, magnesium hydroxide, etc., releases metal hydration water at high temperatures to cause heat loss (mass loss). It is essential to contain the product. And in making such 2nd resin composition contain such a metal hydroxide, the thermal weight loss rate shown by said Formula (1) is from the thermal weight loss rate of Formula (1) in the 1st resin layer 51. It is important to make it larger. This includes the case where the first resin layer 51 contains a metal hydroxide or not. In any case, the metal water at 400 ° C. with respect to the thermal weight loss rate of the formula (1) in the second resin layer 52, that is, the total mass of the solid components in the second resin composition constituting the second resin layer 52. The ratio of heat loss of the oxide is preferably 15 to 25%.

  About the content of the metal hydroxide in the first resin layer 51 and the second resin layer 52, the heat loss of the metal hydroxide at 400 ° C. is measured and grasped in advance so that the desired heat loss rate is obtained. The content of the metal hydroxide can be set from the total mass of the solid components of the first resin composition and the second resin composition. Note that the solid component in the second resin composition is a component that remains without being volatilized or the like after the prepreg 1 is thermoformed and cured. Specifically, the solid component in the second resin composition includes a solid component in the second resin layer 52, that is, a thermosetting resin, a curing agent, a curing accelerator, a flame retardant, an inorganic filler, and the like. Since the second resin layer 52 originally does not contain a fiber base material, it goes without saying that the fiber base material is not contained in the solid component in the second resin composition.

  In addition, the heat loss at 400 ° C. of the metal hydroxide contained in the first resin layer 51 and the second resin layer 52 is determined in advance using, for example, a differential heat / thermogravimetric (TG / DTA) simultaneous measurement device or the like. It is good to measure by heating a single metal hydroxide from room temperature to 400 ° C. at a rate of temperature increase of 10 ° C./min in a nitrogen atmosphere. Thereby, the heat loss at 400 ° C. per unit mass of the metal hydroxide is known, and the heat loss is calculated from the metal hydroxide contents in the first resin layer 51 and the second resin layer 52. Can do. And from the content of each component of the resin composition in the 1st resin layer 51 and the 2nd resin layer 52, the heat loss rate in the 1st resin layer 51 and the 2nd resin layer 52 is calculated by said formula (1). can do. Conversely, the content of each component of the resin composition in the first resin layer 51 and the second resin layer 52 can be determined by calculating backwards so as to obtain a desired heat loss rate.

  The content of the metal hydroxide in the first resin layer 51 may be, for example, 0 to 50 parts by mass with respect to 100 parts by mass of the total solid component of the first resin composition. Moreover, content of the metal hydroxide in the 2nd resin layer 52 is good to set it as 75-250 mass parts with respect to 100 mass parts of all the solid components of a 2nd resin composition, for example.

In the prepreg 1 shown in FIG. 1A, the second resin layer 52 is formed on both surfaces of the first resin layer 51. In this case, when the thickness of each second resin layer 52 is T ₂₁ and T ₂₂ , each second resin layer 52 is formed so that the total thickness (T ₂₁ + T ₂₂ ) of the second resin layer 52 is 6 to 70 μm. Is done. On the other hand, the thickness T ₁ of the first resin layer 51 is not particularly limited, but is preferably larger than the total thickness (T ₂₁ + T ₂₂ ) of the second resin layer 52 (T ₂₁ + T ₂₂ <T ₁ ).

FIG. 1B shows a double-sided metal-clad laminate 21 manufactured using the prepreg 1 described above.
In the double-sided metal-clad laminate 21, the metal foil 6 is disposed on the surface of the second cured resin layer 502 made of a cured product of the second resin layer 52 and laminated and integrated.

  Further, by patterning the metal foil 6 of the double-sided metal-clad laminate 21 by etching or the like, as shown in FIG. 1C, a printed wiring board 3 formed with a conductor pattern 7 on the surface is obtained. It is done.

In the printed wiring board 3 shown in FIG. 1C, the heat loss rate due to the metal hydroxide of the second resin cured layer 502 provided with the conductor pattern 7 is the first resin layer 51 cured product. Since it becomes larger than the heat loss rate in 1 resin cured layer 501, tracking resistance can be improved. On the other hand, since the total thickness (T ₂₁ + T ₂₂ ) of the second resin layer 52 is 6 to 70 μm, the thickness of the second resin cured layer 502 is relatively thin, and the heat loss rate in the first resin layer 51 is Therefore, the heat loss as a whole of the first resin cured layer 501 and the second resin cured layer 502 is reduced, and good heat resistance is obtained. Hereinafter, the first cured resin layer 501 and the second cured resin layer 502 may be referred to as insulating layers.

Further, in the prepreg 1 shown in FIG. 2A, the second resin layer 52 is formed only on one side of the first resin layer 51. In this case, the thickness _{T 21} of the second resin layer 52 is 6～70Myuemu, preferably the second resin layer 52 so as to be 6~40μm is formed. Also in this case, the thickness T ₁ of the first resin layer 51 is not particularly limited, but the thickness T ₁ of the first resin layer 51 is larger than the thickness T ₂₁ of the second resin layer 52 (T ₂₁ <T ₁ ). Is preferred.

  Using the prepreg 1 and the core substrate 8 on which the conductor pattern 7 is formed in advance, the printed wiring board 3 can be manufactured as follows.

  FIG. 2B shows a metal-clad laminate 2 manufactured using the prepreg 1 described above. In this metal-clad laminate 2, the core substrate 8 is disposed on the surface of the first resin cured layer 501 made of the cured product of the first resin layer 51, and the second substrate layer 52 is made of the cured product of the second resin layer 52. 2 The metal foil 6 is arranged on the surface of the cured resin layer 502 and integrated. The conductor pattern 7 of the core substrate 8 is an inner layer pattern.

  Further, by patterning the metal foil 6 of the metal-clad laminate 2 by etching or the like, as shown in FIG. 2C, a printed wiring board 3 formed with a conductor pattern 7 on the surface is obtained. . The conductor pattern 7 on the surface is an outer layer pattern. A multilayer printed wiring board having three or more layers can also be obtained by appropriately providing outer layer patterns on both sides or providing a plurality of inner layer patterns.

In the printed wiring board 3 shown in FIG. 2C, the heat loss rate due to the metal hydroxide of the second resin cured layer 502 provided with the conductor pattern 7 as the outer layer pattern is the heat loss in the first resin cured layer 501. Since it becomes larger than the rate, the tracking resistance can be improved. On the other hand, since the total thickness (T ₂₁ ) of the second resin layer 52 is 6 to 70 μm, preferably 6 to 40 μm, the thickness of the second resin cured layer 502 is relatively thin, and the first resin layer 51 is also thin. Since the heat loss rate at is small, the heat loss as a whole of the insulating layer is reduced, and good heat resistance is obtained.

The prepreg 1 shown in FIGS. 1 (a) and 2 (a) can be manufactured as follows. First, the first resin composition is dissolved in a suitable solvent to prepare a varnish, and the varnish is impregnated into the fiber base 4 and dried to form the first resin layer 51 including the fiber base 4 inside. To do. Next, the second resin composition is dissolved in an appropriate solvent to prepare a varnish, and this varnish is applied to both sides or one side of the first resin layer 51 so that the first resin layer 51 and the second resin layer 52 are semi-cured. The prepreg 1 shown in FIG. 1 (a) and FIG. 2 (a) can be manufactured by heating and drying until it reaches a state. Thus, the second resin layer 52 can be formed by coating of the varnish, it is possible to adjust the thickness T _21, T ₂₂ and change the viscosity and coating frequency of the varnish as appropriate. In addition, although it does not specifically limit as said solvent for varnish preparation, For example, methyl ethyl ketone (MEK) etc. can be used.

  The metal-clad laminate 2 can be manufactured using the prepreg 1 obtained as described above. For example, the double-sided metal-clad laminate 21 as shown in FIG. 1B is formed by stacking the metal foil 6 on the second resin layers 52 on both sides of the prepreg 1 shown in FIG. Can be manufactured. Here, a plurality of prepregs 1 according to the present invention may be stacked to form an insulating layer. However, the prepreg 1 according to the present invention only needs to be disposed at least at a position that is the outermost layer. A prepreg other than the prepreg 1 according to the present invention may be used at the position. Although not shown in the drawing, a single-sided metal-clad laminate may be manufactured by overlapping the metal foil 6 only on the single-sided second resin layer 52 at this time.

  2A, the metal foil 6 is overlaid on the second resin layer 52 on one side of the prepreg 1 shown in FIG. 2A, and the core substrate 8 is overlaid on the first resin layer 51 on the other side for heat-pressure molding. Thus, the metal-clad laminate 2 as shown in FIG. 2B can be manufactured.

  The printed wiring board 3 can be manufactured using the metal-clad laminate 2 obtained as described above. For example, by removing a part of the metal foil 6 on both sides of the double-sided metal-clad laminate 21 shown in FIG. 1B by etching to form a desired conductor pattern 7, as shown in FIG. A printed wiring board 3 can be manufactured. Further, by removing a part of the metal foil 6 on one side of the metal-clad laminate 2 shown in FIG. 2B by etching to form a desired conductor pattern 7, as shown in FIG. The printed wiring board 3 can be manufactured.

  In the printed wiring board 3 formed as described above, the surface layer portion of the insulating layer is richer in the metal hydroxide such as aluminum hydroxide than in the interior, and the heat loss is increased, thereby improving the tracking resistance. Can be improved. If the content of the metal hydroxide in the insulating layer increases, the heat resistance may decrease. However, in the printed wiring board 3 formed as described above, the inside of the insulating layer has a metal hydroxide content smaller than that of the surface layer portion to reduce the heat loss, so that the metal water as the entire insulating layer can be reduced. By reducing the oxide content, adverse effects on heat resistance are reduced. In particular, if the inside of the insulating layer is made richer in the phenolic curing agent than the surface layer portion, the heat resistance can be improved while suppressing a decrease in tracking resistance. As described above, in the present invention, the heat loss rate of the outer second resin cured layer 502 on which the conductor pattern 7 is formed is larger than the heat loss rate of the inner first resin cured layer 501, thereby increasing the heat resistance. And tracking resistance can be achieved at the same time.

  Hereinafter, the present invention will be specifically described by way of examples.

(Prepreg)
In manufacturing the prepreg 1, “Epicron 1121” manufactured by DIC Corporation, which is a brominated epoxy resin, was used as a thermosetting resin.

  Further, “VH4170” manufactured by DIC Corporation, which is a bisphenol novolac resin, was used as a curing agent.

  Further, 2-ethyl-4-methylimidazole (2E4MZ) was used as a curing accelerator.

  As the inorganic filler, metal hydroxides such as aluminum hydroxide, magnesium hydroxide, and boehmite were used. Silica was used as another inorganic filler.

  Further, as the fiber base material 4, “7628 type cloth” manufactured by Nitto Boseki Co., Ltd. was used in Examples 1 to 7, 9 to 12 and Comparative Examples 1 to 5, and “1037 type cross” manufactured by Nitto Boseki Co., Ltd. in Example 8. Was used.

  And said thermosetting resin, a hardening | curing agent, a hardening accelerator, and an inorganic filler are mix | blended with the compounding quantity (mass part) shown in Table 1, this compound is melt | dissolved in a solvent (MEK), 1st resin A varnish of the composition and the second resin composition was prepared.

  Next, the varnish of the 1st resin composition was impregnated to the fiber base material 4, and was dried, and the 1st resin layer 51 which contains the fiber base material 4 inside was formed. Next, the varnish of the second resin composition is applied to both surfaces or one surface of the first resin layer 51, and is heated and dried until the first resin layer 51 and the second resin layer 52 are in a semi-cured state, thereby allowing the first embodiment. For -3, 5-12 and Comparative Examples 1, 2, 4, and 5, the prepreg 1 shown in FIG. 1 (a) was produced, and for Example 4 and Comparative Example 3, the prepreg shown in FIG. 2 (a). 1 was produced.

(Metal-clad laminate)
In producing the metal-clad laminate 2, a copper foil having a thickness of 35 μm (JTC foil, manufactured by Nikko Gould Foil Co., Ltd.) was used as the metal foil 6.

  In Examples 1 to 3, 5 to 12 and Comparative Examples 1, 2, 4, and 5, the metal foil 6 is superimposed on the second resin layer 52 on both surfaces of the prepreg 1 shown in FIG. By doing so, the double-sided metal-clad laminate 21 as shown in FIG.1 (b) was manufactured. As for Example 4 and Comparative Example 3, as shown in FIG. 2B, the metal foil 6 is superimposed on the second resin layer 52 on one side of the prepreg 1 shown in FIG. A metal-clad laminate 2 was produced.

(Evaluation)
[Tracking resistance]
After removing all of the metal foil 6 of the metal-clad laminate 2 by etching, a tracking resistance test was performed based on IEC 60112 using this as a sample, and a comparative tracking index (CTI) was measured.

[Reflow heat resistance]
After etching the metal foil 6 of the metal-clad laminate 2 to form a pattern with a remaining copper ratio of 75% and a 5 cm square, the following reflow heat resistance test was performed using this as a sample. First, the sample was subjected to a pressure cooker test (PCT) as a moisture absorption treatment at 121 ° C. for 2 hours. Next, the sample after the moisture absorption treatment was passed through a reflow furnace set at 260 ° C. (maximum temperature), and this operation was repeated until swelling occurred in the sample. And the frequency | count until a blister generate | occur | produces was measured, and heat resistance was evaluated as follows by this frequency | count.

  “◎”: No swelling occurred unless the number of times exceeded 10.

  “◯”: The swelling occurred within 10 times exceeding 6 times.

  “△”: A swelling occurred within 3 times and within 6 times.

  “×”: A swelling occurred within 3 times.

[Formability]
Four prepregs 1 are stacked, and a copper foil (JTC foil, manufactured by Nikko Gould Foil Co., Ltd.) having a thickness of 70 μm and a thickness of 105 μm is stacked on the outer side, and heat-press molding is performed. The laminate 2 was manufactured. Next, the copper foil on both surfaces of the metal-clad laminate 2 is etched to form a pattern (inner layer pattern) with a remaining copper ratio of 75% and a 5 cm square, and then a multibond treatment (manufactured by McDormid) on the surface of this pattern Went. Next, the metal-clad laminate 2 is used as the core substrate 8 and the prepregs 1 are stacked one by one on each side, and further 18 μm-thick copper foil (JTC foil, manufactured by Nikko Gould Foil Co., Ltd.) is stacked one by one. A printed wiring board 3 as a four-layer board was manufactured by heat-pressing under a condition of 2.9 MPa (30 kgf / cm ² ) for 90 minutes and laminate molding. Then, after etching the copper foils on both sides of the four-layer substrate, the cross-section of the four-layer substrate is observed, and whether the moldability is good or not depends on whether or not the resin composition is filled between the circuits of the inner layer pattern. It was evaluated as follows.

  “◎”: No unfilled portion of the resin composition is observed between the circuits of the inner layer pattern with a thickness of 70 μm and between the circuits of the inner layer pattern with a thickness of 105 μm.

  “◯”: An unfilled portion of the resin composition is not seen between the circuits of the inner layer pattern with a thickness of 70 μm, but an unfilled portion of the resin composition is seen between the circuits of the inner layer pattern with a thickness of 105 μm.

  “×”: Unfilled portions of the resin composition are observed between the circuits of the inner layer pattern having a thickness of 70 μm.

  The results are shown in Table 1.

  As is clear from Table 1, it was confirmed that each example can achieve both heat resistance and tracking resistance.

DESCRIPTION OF SYMBOLS 1 Prepreg 2 Metal-clad laminated board 3 Printed wiring board 4 Fiber base material 51 1st resin layer 52 2nd resin layer 6 Metal foil 7 Conductor pattern

Claims (7)

A first resin layer containing a fiber substrate therein;
A second resin layer formed on at least one side of the first resin layer;
With
The total thickness of the second resin layer is 6 to 70 μm;
The second resin layer contains a metal hydroxide,
The first resin layer does not contain a metal hydroxide, or the metal hydroxide so that the thermal weight loss rate of the formula (1) is smaller than the thermal weight loss rate of the formula (1) in the second resin layer. A prepreg comprising:
(1) Thermal loss rate = heat loss of metal hydroxide at 400 ° C./total mass of solid components excluding fiber base material in resin layer The first resin layer has a heat loss rate of 12% or less,
The prepreg according to claim 1, wherein the second resin layer has a heat loss rate of 15 to 25%. The prepreg according to claim 1 or 2, wherein the second resin layer is formed on both surfaces of the first resin layer. The prepreg according to claim 1 or 2, wherein the second resin layer is formed only on one side of the first resin layer. The prepreg according to any one of claims 1 to 4, wherein the first resin layer and the second resin layer contain an epoxy resin and a phenol-based curing agent as the resin component.   A metal-clad laminate comprising: a metal foil laminated on the second resin layer of the prepreg according to any one of claims 1 to 5;   A printed wiring board, wherein a conductor pattern is formed by removing a part of the metal foil of the metal-clad laminate according to claim 6.

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