JP2014127385A

JP2014127385A - Light emitting device and manufacturing method of the same

Info

Publication number: JP2014127385A
Application number: JP2012284159A
Authority: JP
Inventors: Tomomichi Satake; 友路佐竹
Original assignee: Nichia Chemical Industries Ltd
Current assignee: Nichia Chemical Industries Ltd
Priority date: 2012-12-27
Filing date: 2012-12-27
Publication date: 2014-07-07
Anticipated expiration: 2032-12-27
Also published as: JP6089694B2

Abstract

PROBLEM TO BE SOLVED: To provide a light emitting device which is excellent in heat radiation performance and is easily manufactured, and to provide a manufacturing method of the light emitting device.SOLUTION: A light emitting device 1 includes: a housing 2 in which a space part 7 enclosed by a base part 3 and a cover part 5 is formed; a substrate support part 8 which is erected at the base part 3 in the space part and has a curved or bent shape in a plan view; a flexible wiring board 9 which is supported by the substrate support part 8; and light emitting elements 10 provided on a surface of the flexible wiring board 9. The substrate support part 8 has the rigidity higher than that of the flexible wiring board 9.

Description

本発明は、発光装置及びその製造方法に関する。 The present invention relates to a light emitting device and a method for manufacturing the same.

光源として発光ダイオード（ＬＥＤ）やレーザダイオード（ＬＤ）等の半導体発光素子を搭載した発光装置が、各種の照明装置や表示装置に利用されている。これらの半導体発光素子は消費電力が低く長寿命であるため、これらの半導体発光素子を搭載した発光装置は、電球や蛍光灯に代替可能な発光装置として注目を集めている。 A light emitting device in which a semiconductor light emitting element such as a light emitting diode (LED) or a laser diode (LD) is mounted as a light source is used in various lighting devices and display devices. Since these semiconductor light-emitting elements have low power consumption and long life, light-emitting devices equipped with these semiconductor light-emitting elements are attracting attention as light-emitting devices that can replace light bulbs and fluorescent lamps.

例えば、特許文献１には、正面から見て所定の形状を有し、光出射のため前面部が開口した筐体と、筐体の所定の形状に沿うように筐体内に設けられた発光体とを備える発光装置が記載されている。そして、この発光装置では、発光体が、実装面が筐体の前面部と略直交するように配置された帯状のフレキシブル基板と、フレキシブル基板の実装面に取り付けられた発光素子とで構成され、発光素子が発光ダイオードパッケージまたはＥＬランプで構成される。 For example, Patent Document 1 discloses a casing having a predetermined shape when viewed from the front and having a front portion opened for light emission, and a light emitter provided in the casing so as to follow the predetermined shape of the casing. A light emitting device comprising: And in this light-emitting device, the light emitter is composed of a strip-shaped flexible board arranged so that the mounting surface is substantially orthogonal to the front surface portion of the housing, and a light-emitting element attached to the mounting surface of the flexible board, The light emitting element is formed of a light emitting diode package or an EL lamp.

特開２００９−１７５６４０号公報JP 2009-175640 A

しかしながら、特許文献１の発光装置では、発光素子が取り付けられたフレキシブル基板を筐体内に配置する際、フレキシブル基板を筐体の背面部に直接固定している。そのため、このような発光装置では、発光素子から発生する熱を放熱させる放熱部を備えることができず、発光装置の放熱性が低下するという問題がある。また、フレキシブル基板を筐体に固定する際、フレキシブル基板の可撓性によって固定位置が定まり難くなる。その結果、固定作業に時間を要し、発光装置の製造が容易でないという問題もある。 However, in the light emitting device disclosed in Patent Document 1, when the flexible substrate to which the light emitting element is attached is arranged in the housing, the flexible substrate is directly fixed to the back surface of the housing. Therefore, in such a light emitting device, it is not possible to provide a heat radiating part that radiates heat generated from the light emitting element, and there is a problem in that the heat radiating property of the light emitting device is lowered. Further, when the flexible substrate is fixed to the housing, the fixing position is difficult to be determined due to the flexibility of the flexible substrate. As a result, there is a problem that the fixing work takes time and the light emitting device is not easily manufactured.

そこで、本発明は、このような問題に鑑みてなされたもので、その課題は、発光素子から発生する熱の放熱性に優れ、製造が容易な発光装置及びその製造方法を提供することにある。 Therefore, the present invention has been made in view of such problems, and an object thereof is to provide a light emitting device that is excellent in heat dissipation of heat generated from a light emitting element and that can be easily manufactured, and a method for manufacturing the same. .

前記課題を解決するために、本発明に係る発光装置は、ベース部と、前記ベース部を覆うカバー部と、で囲まれる空間部が形成された筐体と、前記空間部内において、前記ベース部に立設された平面視で湾曲又は屈曲した形状の基板支持部と、前記基板支持部に支持された可撓性配線基板と、前記可撓性配線基板の表面に設けられた発光素子と、を備え、前記基板支持部が前記可撓性配線基板よりも剛性が高い構成とした。 In order to solve the above problems, a light-emitting device according to the present invention includes a casing formed with a space portion surrounded by a base portion and a cover portion covering the base portion, and the base portion in the space portion. A substrate support portion that is curved or bent in a plan view standing upright, a flexible wiring substrate supported by the substrate support portion, and a light emitting element provided on the surface of the flexible wiring substrate; The board support portion has a higher rigidity than the flexible wiring board.

前記構成によれば、発光装置は、平面視で湾曲又は屈曲した形状の基板支持部を備え、その基板支持部に可撓性配線基板が支持されることによって、可撓性配線基板が基板支持部に密着固定できる。そして、発光装置は、可撓性配線基板と基板支持部が密着固定されることによって、基板支持部が、可撓性配線基板の表面に設けられた発光素子から発生する熱を熱引きして放熱させる放熱部として機能する。加えて、発光装置は、可撓性配線基板をその可撓性配線基板よりも剛性が高い基板支持部に支持させ、その基板支持部を筐体の一部を構成するベース部に立設することによって、可撓性配線基板を筐体内に配置できる。それにより、発光装置では、可撓性配線基板はその可撓性配線基板よりも剛性が高い基板支持部を介して筐体内に配置されるため、従来の発光装置のように、可撓性配線基板の可撓性によって配置位置（固定位置）が定まり難いという問題を緩和又は解消することができる。その結果、発光装置は、可撓性配線基板を平面視で湾曲又は屈曲した形状にて筐体内に容易に配置でき、製造が容易となる。 According to the above configuration, the light emitting device includes the substrate support portion having a curved or bent shape in a plan view, and the flexible wiring substrate is supported by the substrate by supporting the flexible wiring substrate on the substrate supporting portion. Can be tightly fixed to the part. In the light emitting device, the flexible wiring substrate and the substrate support portion are closely fixed, so that the substrate support portion draws heat generated from the light emitting element provided on the surface of the flexible wiring substrate. It functions as a heat dissipation part that dissipates heat. In addition, in the light emitting device, the flexible wiring substrate is supported by a substrate support portion having higher rigidity than the flexible wiring substrate, and the substrate support portion is erected on a base portion constituting a part of the housing. Thus, the flexible wiring board can be arranged in the housing. As a result, in the light emitting device, the flexible wiring board is arranged in the housing via the substrate support portion having higher rigidity than the flexible wiring substrate. The problem that the arrangement position (fixed position) is difficult to be determined due to the flexibility of the substrate can be alleviated or eliminated. As a result, the light emitting device can be easily arranged in the housing in a shape in which the flexible wiring board is curved or bent in a plan view, and manufacture is facilitated.

本発明に係る発光装置の製造方法は、ベース部と、前記ベース部を覆うカバー部と、で囲まれる空間部が形成された筐体の内部に発光素子を備える発光装置の製造方法であって、表面に前記発光素子が設けられた可撓性配線基板を、前記可撓性配線基板よりも剛性が高い基板支持部に支持させる第１工程と、前記ベース部に、前記可撓性配線基板が支持された前記基板支持部を平面視で湾曲又は屈曲した形状にて立設する第２工程と、前記ベース部に、前記ベース部を覆うように前記カバー部を接合して前記筐体を作製する第３工程と、を含むこととした。 A method for manufacturing a light emitting device according to the present invention is a method for manufacturing a light emitting device including a light emitting element inside a housing in which a space portion surrounded by a base portion and a cover portion covering the base portion is formed. A first step of supporting a flexible wiring board having the light emitting element provided on the surface thereof on a substrate supporting part having higher rigidity than the flexible wiring board; and the flexible wiring board on the base part. A second step of erecting the substrate support portion supported by a curved or bent shape in a plan view, and joining the cover portion to the base portion so as to cover the base portion. And the third step to be manufactured.

前記手順によれば、発光装置の製造方法では、発光素子を設けた可撓性配線基板が基板支持部を介して筐体内に配置された発光装置を製造できる。その結果、製造される発光装置は、基板支持部が発光素子から発生する熱を熱引きして放熱する放熱部として機能する。また、発光装置の製造方法では、可撓性配線基板の筐体内への配置が、その可撓性配線基板よりも剛性が高い基板支持部を介して行われるため、従来の発光装置のように、可撓性配線基板の可撓性によって配置位置（固定位置）が定まり難いという問題を緩和又は解消することができる。その結果、発光装置の製造方法では、可撓性配線基板を平面視で湾曲又は屈曲した形状にて筐体内に容易に配置でき、製造が容易となる。 According to the above procedure, in the method for manufacturing a light-emitting device, it is possible to manufacture a light-emitting device in which a flexible wiring board provided with a light-emitting element is arranged in a housing via a substrate support part. As a result, the manufactured light-emitting device functions as a heat radiating unit that draws heat generated by the substrate support unit from the light-emitting elements and dissipates it. Further, in the method for manufacturing a light emitting device, the flexible wiring board is placed in the housing via a substrate support portion having higher rigidity than that of the flexible wiring substrate. The problem that it is difficult to determine the arrangement position (fixed position) due to the flexibility of the flexible wiring board can be alleviated or eliminated. As a result, in the manufacturing method of the light emitting device, the flexible wiring board can be easily arranged in the housing in a curved or bent shape in plan view, and the manufacturing becomes easy.

本発明によれば、発光素子から発生する熱の放熱性に優れ、製造が容易な発光装置及びその製造方法が提供できる。また、本発明によれば、経済性、光取り出し効率が優れた発光装置が提供できる。 ADVANTAGE OF THE INVENTION According to this invention, the light-emitting device which is excellent in the heat dissipation of the heat | fever generated from a light emitting element, and is easy to manufacture, and its manufacturing method can be provided. Further, according to the present invention, a light emitting device excellent in economic efficiency and light extraction efficiency can be provided.

本発明に係る発光装置の構成を示し、一部破断した斜視図である。It is the perspective view which showed the structure of the light-emitting device which concerns on this invention, and was partly fractured | ruptured. 図１の破断断面を拡大して示した断面斜視図である。It is the cross-sectional perspective view which expanded and showed the fracture | rupture cross section of FIG. （ａ）は図２の可撓性配線基板の斜視図、（ｂ）は図２の基板支持部の斜視図、（ｃ）は（ｂ）の基板支持部に（ａ）の可撓性配線基板を設置した際の斜視図である。(A) is a perspective view of the flexible wiring board of FIG. 2, (b) is a perspective view of the board support part of FIG. 2, (c) is a flexible wiring of (a) on the board support part of (b). It is a perspective view at the time of installing a board | substrate. 本発明に係る発光装置の分解斜視図で、ベース部及びカバー部は一部破断して示した。In the exploded perspective view of the light emitting device according to the present invention, the base portion and the cover portion are partially broken. 本発明に係る発光装置の製造手順を示す工程フロー図である。It is a process flowchart which shows the manufacture procedure of the light-emitting device which concerns on this invention.

本発明に係る発光装置の実施の形態について、図面を参照して詳細に説明する。
図１、図２に示すように、発光装置１は、筐体２と、基板支持部８と、可撓性配線基板９と、発光素子１０と、を備える。以下、各構成について説明する。 Embodiments of a light emitting device according to the present invention will be described in detail with reference to the drawings.
As shown in FIGS. 1 and 2, the light emitting device 1 includes a housing 2, a substrate support 8, a flexible wiring substrate 9, and a light emitting element 10. Each configuration will be described below.

（筐体）
筐体２は、ベース部３とカバー部５とを含んで構成され、ベース部３とカバー部５とを接合することによって、ベース部３とカバー部５とで囲まれる空間部７が形成された部材である。なお、図示する例では、筐体２は、平面視で環状の外形を有する筒状の部材であるが、これに限定されず、例えば平面視でＵ字状の外形を有する筒状の部材や、箱状の部材であってもよい。そして、空間部７には、発光素子１０が表面に設けられた可撓性配線基板９が支持された基板支持部８が配置される。 (Casing)
The housing 2 includes a base portion 3 and a cover portion 5, and a space portion 7 surrounded by the base portion 3 and the cover portion 5 is formed by joining the base portion 3 and the cover portion 5. It is a member. In the illustrated example, the housing 2 is a cylindrical member having an annular outer shape in a plan view, but is not limited thereto, for example, a cylindrical member having a U-shaped outer shape in a plan view, A box-shaped member may be used. In the space portion 7, a substrate support portion 8 on which a flexible wiring substrate 9 provided with a light emitting element 10 is supported is disposed.

筐体２において、平面視で環状やＵ字状の外形を有する筒状の部材である場合、ベース部３とカバー部５との比率は、例えば、空間部７の断面における内周を占める割合でベース部：カバー部＝４５：５５〜５５：４５である。しかしながら、カバー部５は筐体内に配置された発光素子１０からの光を発光装置外に出射する部分であるので、出射光の光束を確保するためにベース部：カバー部＝５０：５０が好ましい。 When the casing 2 is a cylindrical member having an annular or U-shaped outer shape in plan view, the ratio of the base portion 3 and the cover portion 5 is, for example, a ratio that occupies the inner circumference in the cross section of the space portion 7 Therefore, base portion: cover portion = 45: 55 to 55:45. However, since the cover portion 5 is a portion that emits light from the light emitting element 10 disposed in the housing to the outside of the light emitting device, the base portion: cover portion = 50: 50 is preferable in order to ensure the luminous flux of the emitted light. .

筐体２の大きさは、ＪＩＳに規定された蛍光灯に用いられる蛍光管に準じて設定され、例えば、環状の外形を有する筒状の部材である場合、環状の外径ＤＡが２０５〜３７５ｍｍ、筒状の外径ＤＢが２８〜３２ｍｍである。筐体２及び空間部７の断面形状は、円形が好ましいが、矩形であっても構わない。 The size of the housing 2 is set in accordance with a fluorescent tube used for a fluorescent lamp specified in JIS. For example, when the tubular member has an annular outer shape, the annular outer diameter DA is 205 to 375 mm. The cylindrical outer diameter DB is 28 to 32 mm. The cross-sectional shapes of the housing 2 and the space portion 7 are preferably circular, but may be rectangular.

（ベース部）
ベース部３は、筐体２の一部を構成するもので、カバー部５と接合して空間部７を形成する部材である。図示する例では、ベース部３は、平面視で環状の外形を有する半筒状の部材であるが、これに限定されない。また、ベース部３は、カバー部５と接合して空間部７を形成するように平面視で環状の凹部４が形成されていることが好ましい（図４参照）。その凹部４の断面形状は、半円形または円弧状のものが好ましい。なお、ベース部３は、例えば板状など、凹部４が形成されない部材であってもよい。また、ベース部３の厚さは、1〜３ｍｍが好ましい。そして、ベース部３は、筐体内に基板支持部８を配置するために、例えば凹部４の底部で基板支持部８を支持する。なお、筐体内に配置される発光素子１０からの光を拡散させるために、ベース部３（例えばベース部３の凹部４）の内表面を白色塗料等で塗装、あるいは、内表面をサンドブラスト、研磨等で粗面化処理してもよい。 (Base part)
The base portion 3 constitutes a part of the housing 2 and is a member that joins with the cover portion 5 to form the space portion 7. In the illustrated example, the base portion 3 is a semi-cylindrical member having an annular outer shape in plan view, but is not limited thereto. Moreover, it is preferable that the base 3 is formed with an annular recess 4 in plan view so as to form a space 7 by joining with the cover 5 (see FIG. 4). The cross-sectional shape of the recess 4 is preferably semicircular or arcuate. The base portion 3 may be a member in which the concave portion 4 is not formed, such as a plate shape. Further, the thickness of the base portion 3 is preferably 1 to 3 mm. And the base part 3 supports the board | substrate support part 8 in the bottom part of the recessed part 4, for example, in order to arrange | position the board | substrate support part 8 in a housing | casing. In order to diffuse light from the light emitting element 10 disposed in the housing, the inner surface of the base portion 3 (for example, the concave portion 4 of the base portion 3) is painted with white paint or the like, or the inner surface is sandblasted and polished. The surface may be roughened with a method such as

ベース部３は、基板支持部８を支持できる強度を有する材料で構成されていればよく、当該技術分野で公知の材料で構成することができる。例えば、軽量で強度の強い樹脂材料や金属材料で構成でき、特に加工性や耐熱性を考慮すると、アルミニウム等の金属材料が好ましい。そして、発光装置１は、ベース部３が金属材料からなることによって、ベース部３での熱伝導性が向上し、基板支持部８からの熱を伝導し易くなる。その結果、発光装置１は、基板支持部８に支持された可撓性配線基板９に設けられた発光素子１０から発生する熱を、基板支持部８及びベース部３を介して熱引きして発光装置外に放熱し易くなる。また、ベース部３は、透光性でもよい。その場合、ベース部３は、例えば、下記カバー部５と同様に構成することができる。 The base part 3 should just be comprised with the material which has the intensity | strength which can support the board | substrate support part 8, and can be comprised with a well-known material in the said technical field. For example, it can be made of a light and strong resin material or metal material, and a metal material such as aluminum is preferable in consideration of workability and heat resistance. In the light emitting device 1, since the base portion 3 is made of a metal material, the thermal conductivity in the base portion 3 is improved and the heat from the substrate support portion 8 is easily conducted. As a result, the light emitting device 1 heats the heat generated from the light emitting element 10 provided on the flexible wiring substrate 9 supported by the substrate support portion 8 through the substrate support portion 8 and the base portion 3. It becomes easy to dissipate heat outside the light emitting device. Moreover, the base part 3 may be translucent. In that case, the base part 3 can be comprised similarly to the following cover part 5, for example.

（カバー部）
カバー部５は、筐体２の一部を構成するもので、ベース部３と接合して、ベース部３（例えばベース部３の凹部４）を覆うことによって空間部７を形成する部材である。図示する例では、カバー部５は、平面視で環状の外形を有する部材であるが、これに限定されない。また、カバー部５は、ベース部３と同様に平面視で環状の凹部６が形成された半筒状の部材であることが好ましい（図４参照）。その凹部６の断面形状は、半円形または円弧状のものが好ましい。また、カバー部５の厚さは、１．５〜２ｍｍが好ましい。なお、カバー部５は、図示しないが、例えば板状など、凹部６が形成されない部材であってもよい。そして、カバー部５は、筐体内に配置される発光素子１０からの光を透光して発光装置外に出射する。 (Cover part)
The cover part 5 constitutes a part of the housing 2 and is a member that joins with the base part 3 to form the space part 7 by covering the base part 3 (for example, the concave part 4 of the base part 3). . In the illustrated example, the cover 5 is a member having an annular outer shape in plan view, but is not limited thereto. Moreover, it is preferable that the cover part 5 is a semi-cylindrical member in which the annular recessed part 6 was formed by planar view similarly to the base part 3 (refer FIG. 4). The cross-sectional shape of the recess 6 is preferably semicircular or arcuate. Moreover, as for the thickness of the cover part 5, 1.5-2 mm is preferable. In addition, although not shown in figure, the cover part 5 may be a member in which the recessed part 6 is not formed, for example, plate shape. And the cover part 5 permeate | transmits the light from the light emitting element 10 arrange | positioned in a housing | casing, and radiate | emits it out of a light-emitting device.

カバー部５は、透光性を有する材料で構成されていればよく、当該技術分野で公知の材料によって構成することができる。例えば、軽量で強度の強い樹脂材料やガラスで構成でき、特に加工性及び耐熱性を考慮すると、ポリカーボネートやアクリルなどの樹脂材料にて構成されることが好ましい。ここで、透光性を有する材料は、発光素子１０からの光を効率良く透過することが好ましいが、熱伝導性に優れるフィラーを混入してもよい。そうすることで、発光素子１０から発生する熱が基板支持部８及びベース部３を介してカバー部５に伝達しやすくなり、発光装置１の放熱性を高めることができる。このようなフィラーにはアルミナ、シリカ、酸化チタンなどを使用でき、これらは光拡散部材として混入させることもできる。このように、カバー部５に光拡散部材を混入させることにより、発光素子１０の配光に起因する輝度ムラや色ムラを低減することができる。このほか、カバー部５の内表面にサンドブラスト、研磨等の粗面化処理を施したり、カバー部５の外表面や内表面に拡散シートを貼り付けて、カバー部５に光拡散効果を付与してもよい。 The cover part 5 should just be comprised with the material which has translucency, and can be comprised with a well-known material in the said technical field. For example, it can be made of a light and strong resin material or glass, and in view of workability and heat resistance, it is preferably made of a resin material such as polycarbonate or acrylic. Here, the light-transmitting material preferably transmits light from the light-emitting element 10 efficiently, but a filler having excellent thermal conductivity may be mixed therein. By doing so, the heat generated from the light emitting element 10 can be easily transmitted to the cover portion 5 via the substrate support portion 8 and the base portion 3, and the heat dissipation of the light emitting device 1 can be enhanced. As such a filler, alumina, silica, titanium oxide, or the like can be used, and these can also be mixed as a light diffusing member. As described above, by mixing the light diffusing member into the cover portion 5, luminance unevenness and color unevenness due to the light distribution of the light emitting element 10 can be reduced. In addition, the inner surface of the cover part 5 is subjected to a roughening process such as sand blasting or polishing, or a diffusion sheet is attached to the outer surface or inner surface of the cover part 5 to give the cover part 5 a light diffusion effect. May be.

（基板支持部）
基板支持部８は、例えば一方向に長い矩形状を有する板状の部材である。また、基板支持部８は、筐体２の空間部７の内部で、平面視で湾曲又は屈曲した形状にて（図示する例では空間部７の形成方向に沿って）ベース部３（例えばベース部の凹部４の底部）に立設され、その片側（片面）好ましくは両側（両面）には可撓性配線基板９が支持される。それによって、基板支持部８は、可撓性配線基板９を支持すると共に、可撓性配線基板９に設けられた発光素子１０から発生する熱を熱引きして放熱させる。 (Substrate support part)
The board | substrate support part 8 is a plate-shaped member which has a rectangular shape long in one direction, for example. The substrate support 8 is curved or bent in a plan view inside the space 7 of the housing 2 (in the example shown, along the direction in which the space 7 is formed). The flexible wiring board 9 is supported on one side (one side), preferably on both sides (both sides). As a result, the substrate support unit 8 supports the flexible wiring substrate 9 and heats the heat generated from the light emitting elements 10 provided on the flexible wiring substrate 9 to dissipate it.

図３（ｂ）、（ｃ）に示すように、好ましい形態の基板支持部８は、基板支持部８の両側面を形成する板状の本体部８ａと、本体部８ａの上端部の両側、及び、本体部８ａの下端部の両側に延出して鉤状に折り曲げられて形成された鉤部８ｂと、本体部８ａと鉤部８ｂとの間に形成される溝部８ｃとで構成される。そして、基板支持部８は、本体部８ａの下端部に形成された鉤部８ｂとベース部３の上面（例えば凹部４の底部）とをネジ等で接合することによって、平面視で湾曲又は屈曲した形状にて（図示する例では空間部７の形成方向に沿って）立設される。また、基板支持部８は、溝部８ｃに可撓性配線基板９を挿入することによって、その片側（片面）好ましくは両側（両面）に可撓性配線基板９が支持される。 As shown in FIGS. 3 (b) and 3 (c), a preferred embodiment of the substrate support 8 includes a plate-like main body 8a that forms both side surfaces of the substrate support 8, and both sides of the upper end of the main body 8a. And it is comprised by the collar part 8b extended in the both sides of the lower end part of the main-body part 8a, and bend | folded and formed in the collar shape, and the groove part 8c formed between the main-body part 8a and the collar part 8b. The substrate support portion 8 is curved or bent in plan view by joining the flange portion 8b formed at the lower end portion of the main body portion 8a and the upper surface of the base portion 3 (for example, the bottom portion of the recess portion 4) with a screw or the like. In the illustrated shape (in the example shown, along the direction in which the space 7 is formed), it is erected. Moreover, the flexible wiring board 9 is supported by the board | substrate support part 8 by inserting the flexible wiring board 9 in the groove part 8c, and its one side (one side), preferably both sides (both sides).

基板支持部８は、本体部８ａのみで構成されたものでもよい。このような形態の基板支持部８では、本体部８ａの下端部でベース部３の上面（例えばベース部の凹部４の底部）と接合し、本体部８ａの片側（片面）好ましくは両側（両面）に可撓性配線基板９が接着剤等で接着される。 The substrate support portion 8 may be constituted only by the main body portion 8a. In the substrate support portion 8 having such a configuration, the lower end portion of the main body portion 8a is joined to the upper surface of the base portion 3 (for example, the bottom portion of the concave portion 4 of the base portion), and one side (one side), preferably both sides (both sides) of the main body portion 8a. The flexible wiring board 9 is bonded with an adhesive or the like.

基板支持部８の大きさは、本体部８ａの上端部に形成された鉤部８ｂと下端部に形成された鉤部８ｂとの間隔に相当する高さｈ、または、本体部８ａの板幅（板高さ）が１４〜１６ｍｍであることが好ましい。また、本体部８ａの下端部の両側に形成された鉤部８ｂの間の長さに相当する幅ｔ、または、本体部８ａの板厚が１〜１．５ｍｍであることが好ましい。また、溝部８ｃの溝幅は、可撓性配線基板９の厚さに応じて、可撓性配線基板９を挿入、支持できる幅に適宜設定する。 The size of the substrate support portion 8 is the height h corresponding to the distance between the flange portion 8b formed at the upper end portion of the main body portion 8a and the flange portion 8b formed at the lower end portion, or the plate width of the main body portion 8a. The (plate height) is preferably 14 to 16 mm. Moreover, it is preferable that the width | variety t equivalent to the length between the collar parts 8b formed in the both sides of the lower end part of the main-body part 8a, or the plate | board thickness of the main-body part 8a is 1-1.5 mm. Further, the groove width of the groove portion 8 c is appropriately set to a width that allows the flexible wiring board 9 to be inserted and supported according to the thickness of the flexible wiring board 9.

基板支持部８は、可撓性配線基板９よりも剛性が高く、可撓性配線基板９を支持できる強度を有し、かつ、可撓性配線基板９に設けられる発光素子１０から発生する熱を熱引きできる熱伝導性を有する材料で構成されていればよく、加工性や耐熱性を考慮すると、例えば、ポリカーボネート等の樹脂材料から構成されていることが好ましい。ここで、熱引きできる熱伝導性とは、ＩＳＯ規格またはＪＩＳ規格で規定された熱伝導率が１Ｗ／ｍ・Ｋ以上であることが好ましい。また、基板支持部８は、成形加工等で作製され、安価な押し出し成形品が好ましい。そして、発光装置１は、基板支持部８が安価な押し出し成形品によって構成されるため、製造コストを抑えることができる。 The substrate support portion 8 has higher rigidity than the flexible wiring substrate 9, has a strength capable of supporting the flexible wiring substrate 9, and generates heat from the light emitting element 10 provided on the flexible wiring substrate 9. In view of workability and heat resistance, for example, it is preferably made of a resin material such as polycarbonate. Here, it is preferable that the heat conductivity that can be heat-extracted is that the thermal conductivity defined by the ISO standard or the JIS standard is 1 W / m · K or more. Further, the substrate support portion 8 is produced by molding or the like, and is preferably an inexpensive extruded product. And since the board | substrate support part 8 is comprised with the cheap extrusion molding goods, the light-emitting device 1 can hold down manufacturing cost.

基板支持部８は、可撓性配線基板９よりも剛性が高いが、可撓性を有することが好ましい。このような可撓性の基板支持部８は、ＩＳＯ規格またはＪＩＳ規格で規定された曲げ弾性率が２０００〜４０００ＭＰａであることが好ましく、さらにＩＳＯ規格またはＪＩＳ規格で規定されたシャルピー衝撃強さ（ノッチ付き）が１０ＫＪ／ｍ^２以上であることが好ましい。そして、発光装置１は、基板支持部８が可撓性を有することによって、基板支持部８をベース部３に容易に立設できるため、製造がさらに容易となる。 The substrate support portion 8 has higher rigidity than the flexible wiring substrate 9, but preferably has flexibility. Such a flexible substrate support 8 preferably has a flexural modulus of 2000 to 4000 MPa as defined by the ISO or JIS standard, and further has a Charpy impact strength (as defined by the ISO or JIS standard). It is preferable that the notch is 10 KJ / m ² or more. And since the board | substrate support part 8 can stand up easily in the base part 3 because the board | substrate support part 8 has flexibility, manufacture becomes further easier.

基板支持部８としては、ベース部３（例えばベース部の凹部４の底部）に立設する前に、例えば平面視で環状など、平面視で湾曲又は屈曲した形状に予め加工したものを使用してもよい。このような形状の基板支持部８は、可撓性を実質的に有さず、具体的には、曲げ弾性率及びシャルピー衝撃強さが前記下限値未満のものである。また、このような形状の基板支持部８は、ベース部３の作製の際に、ベース部３の一部分としてベース部３（例えばベース部の凹部４の底部）に一体に作製されたものであってもよい。 As the substrate support portion 8, a substrate supporting portion 8 that has been previously processed into a curved or bent shape in a plan view, such as an annular shape in a plan view, is used before standing on the base portion 3 (for example, the bottom of the recess 4 of the base portion). May be. The substrate support portion 8 having such a shape has substantially no flexibility, and specifically has a flexural modulus and a Charpy impact strength that are less than the lower limit values. Further, the substrate support portion 8 having such a shape is manufactured integrally with the base portion 3 (for example, the bottom of the concave portion 4 of the base portion) as a part of the base portion 3 when the base portion 3 is manufactured. May be.

（可撓性配線基板）
図２、図３（ａ）に示すように、可撓性配線基板９は、一方向に長い矩形状を有し、その上面に発光素子１０やコネクタ１１等の電子部品が固定され、さらにそれらの電子部品と電気的に接続される配線（図示せず）が形成された配線基板である。また、可撓性配線基板９は、例えば平面視で環状など、平面視で湾曲又は屈曲した形状に変形可能な配線基板であって、可撓性材料から構成され、具体的には、ポリイミド、ポリエチレンテレフタレート、ポリエチレンナフタレート等から構成された配線基板であることが好ましい。さらに、可撓性配線基板９の厚さは、例えば０．６〜２．０ｍｍが好ましい。 (Flexible wiring board)
As shown in FIG. 2 and FIG. 3A, the flexible wiring board 9 has a rectangular shape that is long in one direction, and electronic components such as the light emitting element 10 and the connector 11 are fixed on the upper surface thereof. This is a wiring board on which wiring (not shown) electrically connected to the electronic component is formed. The flexible wiring board 9 is a wiring board that can be deformed into a curved or bent shape in a plan view, such as a ring shape in a plan view, and is made of a flexible material, specifically, polyimide, A wiring board composed of polyethylene terephthalate, polyethylene naphthalate, or the like is preferable. Furthermore, the thickness of the flexible wiring board 9 is preferably 0.6 to 2.0 mm, for example.

図４に示すように、可撓性配線基板９は、その長さ方向の両端部の間に接続部１５が設けられている。接続部１５は、外部電源（図示せず）からコネクタ１１及び配線を介して発光素子１０に電気を給電する部材である。 As shown in FIG. 4, the flexible wiring board 9 is provided with connecting portions 15 between both end portions in the length direction. The connection unit 15 is a member that supplies electricity to the light emitting element 10 from an external power source (not shown) via the connector 11 and wiring.

可撓性配線基板９に設けられるコネクタ１１は、接続部１５と電気的に接続されている。このコネクタ１１は、可撓性配線基板９の長さ方向の端部に設けられていることが、接続部１５と接続しやすく、また基板支持部８に支持される可撓性配線基板９の各発光素子１０を直列接続しやすいため、好ましい。 The connector 11 provided on the flexible wiring board 9 is electrically connected to the connection portion 15. The connector 11 is provided at the end in the length direction of the flexible wiring board 9 so that it can be easily connected to the connection part 15 and the flexible wiring board 9 supported by the board support part 8. Since each light emitting element 10 is easy to connect in series, it is preferable.

（発光素子）
図２、図３（ａ）に示すように、発光素子１０は、例えばＬＥＤやＬＤ等の半導体発光素子、有機ＥＬ素子（Organic Electro-Luminescence）など、従来の発光装置で使用されているものを用いることができる。また、発光素子１０は、このような発光素子を可撓性配線基板９に直接実装したもの、発光素子がセラミックや樹脂のパッケージ基体に配置された表面実装型（Surface Mount Device：ＳＭＤ）のもの、及び、リードフレームに配置された発光素子がガラスや樹脂の被覆部材で覆われた砲弾型（ランプタイプ）のもののいずれでもよい。また、そのパッケージ基体や被覆部材には、波長変換部材（例えば、アルミニウム酸化物系蛍光体、窒化物系蛍光体、シリケート系蛍光体など）や光拡散部材（例えば、アルミナやシリカ、酸化チタンなど）を含有させることができる。さらに、発光波長域の異なる（例えば赤・緑・青（ＲＧＢ）の各波長域で発光する）複数の発光素子１０を組み合わせてもよい。 (Light emitting element)
As shown in FIG. 2 and FIG. 3A, the light emitting element 10 is, for example, a semiconductor light emitting element such as an LED or LD, an organic EL element (Organic Electro-Luminescence), or the like used in a conventional light emitting device. Can be used. Further, the light emitting element 10 is a surface mount type (SMD) in which such a light emitting element is directly mounted on a flexible wiring board 9, and the light emitting element is disposed on a ceramic or resin package substrate. The light emitting element disposed on the lead frame may be of a shell type (lamp type) covered with a glass or resin coating member. In addition, the package base or covering member includes a wavelength conversion member (for example, an aluminum oxide phosphor, a nitride phosphor, a silicate phosphor) or a light diffusion member (for example, alumina, silica, titanium oxide, etc.) ) Can be contained. Further, a plurality of light emitting elements 10 having different emission wavelength ranges (for example, emitting light in each wavelength range of red, green, and blue (RGB)) may be combined.

発光素子１０は、可撓性配線基板９の上面に長さ方向に所定の間隔で複数固定（配列）される。図２、図３（ａ）では、複数の発光素子１０の列が可撓性配線基板９の長さ方向に１つ設けられた例を示したが、可撓性配線基板９の幅方向にもこのような列が２つ以上設けられてもよい。なお、発光素子１０は、Ａｇ、Ａｕ、Ｓｎ等の導電性の接合部材によって、可撓性配線基板９の配線と電気的に接続される。 A plurality of light emitting elements 10 are fixed (arranged) on the upper surface of the flexible wiring substrate 9 at predetermined intervals in the length direction. 2 and 3A show an example in which one row of the plurality of light emitting elements 10 is provided in the length direction of the flexible wiring board 9, but in the width direction of the flexible wiring board 9, FIG. Two or more such columns may be provided. The light emitting element 10 is electrically connected to the wiring of the flexible wiring board 9 by a conductive bonding member such as Ag, Au, or Sn.

本発明に係る発光装置１は、空間部７及び基板支持部８が平面視で環状であって、可撓性配線基板９が、基板支持部８に、互いに逆向きに２つ支持されていることが好ましい。
そして、発光装置１は、発光素子１０が設けられた可撓性配線基板９を前記のように配置することによって、ベース部３に立設された基板支持部８の両側に光を効率良く出射可能であり、環状照明を容易に実現することができる。 In the light emitting device 1 according to the present invention, the space 7 and the substrate support 8 are annular in plan view, and two flexible wiring substrates 9 are supported by the substrate support 8 in opposite directions. It is preferable.
The light emitting device 1 efficiently emits light to both sides of the substrate support portion 8 erected on the base portion 3 by arranging the flexible wiring substrate 9 provided with the light emitting elements 10 as described above. It is possible, and annular illumination can be easily realized.

本発明に係る発光装置１は、筐体２が、ベース部３とカバー部５に加えて、反射部１２をさらに含むことが好ましい。 In the light emitting device 1 according to the present invention, it is preferable that the housing 2 further includes a reflecting portion 12 in addition to the base portion 3 and the cover portion 5.

（反射部）
反射部１２は、例えば、反射材料から構成されたシート状の部材である。図示する例では、反射部１２は、平面視で環状の外形を有する。反射部１２は、ベース部３の表面（例えばベース部の凹部４の表面）に設けられ、発光素子１０からの光をカバー部５の方向に反射する。反射材料としては、特に限定されないが、優れた反射率を有するＡｌ、Ａｇ等の金属材料が好ましい。また、反射部１２の厚さは、０．１〜０．５ｍｍが好ましい。 (Reflection part)
The reflection part 12 is a sheet-like member made of, for example, a reflective material. In the illustrated example, the reflecting portion 12 has an annular outer shape in plan view. The reflecting portion 12 is provided on the surface of the base portion 3 (for example, the surface of the concave portion 4 of the base portion), and reflects light from the light emitting element 10 toward the cover portion 5. Although it does not specifically limit as a reflective material, Metal materials, such as Al and Ag which have the outstanding reflectance, are preferable. Moreover, the thickness of the reflection part 12 is preferably 0.1 to 0.5 mm.

そして、発光装置１は、筐体２が反射部１２をさらに含むことによって、発光素子１０からの光が反射部１２によってカバー部５の方向に反射されるため、カバー部５から発光装置外に出射される光束が増加し、光取り出し効率が向上する。ここで、光取り出し効率とは、発光素子１０を発光装置１に取り付けて点灯したときに発光装置外に出射される光束と、発光素子１０を発光装置１に取り付けずに点灯したときに発光素子１０から出射される光束との比率である。 In the light emitting device 1, since the housing 2 further includes the reflecting portion 12, the light from the light emitting element 10 is reflected by the reflecting portion 12 in the direction of the cover portion 5. The emitted light flux increases, and the light extraction efficiency is improved. Here, the light extraction efficiency refers to a light beam emitted outside the light emitting device when the light emitting element 10 is attached to the light emitting device 1 and turned on, and a light emitting element when the light emitting element 10 is turned on without being attached to the light emitting device 1. 10 is a ratio with respect to the light beam emitted from 10.

反射部１２は、図２、図４に示すように、基板支持部８に対して凹部４の外周側に形成された外周側反射部１３と、凹部４の内周側に形成された内周側反射部１４とからなることが好ましい。そして、外周側反射部１３と内周側反射部１４との間の隙間ｗは、基板支持部８の幅ｔ（図３（ｂ）参照）よりも大きく（ｗ＞ｔ）形成されていることが、基板支持部８を凹部４の底部に立設しやすいことから好ましい。 As shown in FIGS. 2 and 4, the reflecting portion 12 includes an outer peripheral reflecting portion 13 formed on the outer peripheral side of the concave portion 4 with respect to the substrate support portion 8, and an inner peripheral portion formed on the inner peripheral side of the concave portion 4. The side reflection part 14 is preferable. And the gap w between the outer periphery side reflection part 13 and the inner periphery side reflection part 14 is formed larger (w> t) than the width t (see FIG. 3B) of the substrate support part 8. However, it is preferable because the substrate support 8 is easily erected on the bottom of the recess 4.

本発明に係る発光装置１において、筐体２が反射部１２を含む場合には、基板支持部８の高さｈは、ベース部３（例えばその凹部４の底部）からカバー部５までの最大高さＨ、すなわち、空間部７の最大高さの半分未満であることが好ましい。そして、発光装置１は、基板支持部８がベース部３からカバー部５までの最大高さＨの半分未満の高さｈを有することによって、発光素子１０からの光が反射部１２によって反射された際、カバー部５の方向に反射された光が基板支持部８よって遮られることが少なくなるため、カバー部５から発光装置外に出射される光束がさらに増加し、光取り出し効率がさらに向上する。 In the light emitting device 1 according to the present invention, when the housing 2 includes the reflecting portion 12, the height h of the substrate support portion 8 is the maximum from the base portion 3 (for example, the bottom of the concave portion 4) to the cover portion 5. The height H is preferably less than half of the maximum height of the space portion 7. In the light emitting device 1, the substrate support portion 8 has a height h that is less than half of the maximum height H from the base portion 3 to the cover portion 5, whereby the light from the light emitting element 10 is reflected by the reflection portion 12. In this case, the light reflected in the direction of the cover unit 5 is less likely to be blocked by the substrate support unit 8, so that the light beam emitted from the cover unit 5 to the outside of the light emitting device further increases and the light extraction efficiency is further improved. To do.

次に、本発明に係る発光装置の製造方法について、図４、図５を用いて説明する。本発明の製造方法で製造される発光装置は、前記した発光装置１であるので、発光装置１の各構成については、図１〜図３を参照する。
図５に示すように、本発明の製造方法は、第１工程Ｓ１と、第２工程Ｓ２と、第３工程Ｓ３の３つの工程を含む。以下、各工程の手順について説明する。 Next, a method for manufacturing a light emitting device according to the present invention will be described with reference to FIGS. Since the light-emitting device manufactured by the manufacturing method of the present invention is the above-described light-emitting device 1, refer to FIGS. 1 to 3 for each configuration of the light-emitting device 1.
As shown in FIG. 5, the manufacturing method of the present invention includes three steps of a first step S1, a second step S2, and a third step S3. Hereinafter, the procedure of each process will be described.

（第１工程）
第１工程Ｓ１は、表面に発光素子１０を設けた可撓性配線基板９を、可撓性配線基板９よりも剛性が高い基板支持部８に支持させる工程である。
可撓性配線基板９への発光素子１０の設置方法は、従来公知の方法で行われ、例えば、発光素子１０を可撓性配線基板９の表面に形成された配線にハンダ等の導電性材料を用いて設置する。
基板支持部８への可撓性配線基板９の支持方法は、従来公知の方法で行われ、例えば、図３（ｂ）に示すような鉤部８ｂを有する基板支持部８を使用する場合には、本体部８ａの両側で、鉤部８ｂと本体部８ａとの間に形成された溝部８ｃに可撓性配線基板９を挿入することによって行われる。そして、可撓性配線基板９は本体部８ａの両端部に形成された鉤部８ｂによって係止される。
なお、図示しないが、鉤部８ｂを有さず本体部８ａのみからなる基板支持部８を使用する場合には、本体部８ａの両側面に可撓性配線基板９を接着剤等で接着することによって行われる。 (First step)
The first step S <b> 1 is a step of supporting the flexible wiring board 9 provided with the light emitting element 10 on the surface thereof by the board support portion 8 having higher rigidity than the flexible wiring board 9.
The light emitting element 10 is installed on the flexible wiring board 9 by a conventionally known method. For example, the light emitting element 10 is connected to a wiring formed on the surface of the flexible wiring board 9 with a conductive material such as solder. Use to install.
The flexible wiring substrate 9 is supported on the substrate support portion 8 by a conventionally known method. For example, when the substrate support portion 8 having the flange portion 8b as shown in FIG. 3B is used. Is performed by inserting the flexible wiring board 9 into the groove 8c formed between the flange 8b and the main body 8a on both sides of the main body 8a. And the flexible wiring board 9 is latched by the collar part 8b formed in the both ends of the main-body part 8a.
Although not shown, in the case of using the substrate support portion 8 that has only the main body portion 8a and does not have the flange portion 8b, the flexible wiring board 9 is bonded to both side surfaces of the main body portion 8a with an adhesive or the like. Is done by.

（第２工程）
第２工程Ｓ２は、ベース部３（例えばベース部の凹部４の底部）に、可撓性配線基板９が支持された基板支持部８を平面視で湾曲又は屈曲した形状にて立設する工程である。
ベース部３への基板支持部８の立設方法は、ネジ等を用いて基板支持部８をベース部３に接合することが好ましい。しかしながら、基板支持部８とベース部３とが十分な接合強度で接合できれば、立設方法は特に限定されるものではなく、例えば、接着剤等を用いて基板支持部８をベース部３に接着することでもよい。
なお、前記第１工程Ｓ１で可撓性を有する基板支持部８を使用する場合には、可撓性配線基板９が支持された基板支持部８を、平面視で環状など、平面視で湾曲又は屈曲した形状に変形させた後に、変形した基板支持部８をベース部３に立設する。また、あらかじめ平面視で湾曲又は屈曲した形状に加工した可撓性を実質的に有しない基板支持部８を使用する場合には、可撓性配線基板９が支持された状態で、基板支持部８をベース部３に立設する。
なお、基板支持部８がベース部３と一体に作製されている場合には、第２工程Ｓ２は行わず、第１工程Ｓ１終了後、次工程である第３工程Ｓ３を行う。 (Second step)
The second step S2 is a step of standing on the base portion 3 (for example, the bottom portion of the concave portion 4 of the base portion) with the substrate support portion 8 on which the flexible wiring substrate 9 is supported being curved or bent in plan view. It is.
As a method of erecting the substrate support portion 8 on the base portion 3, it is preferable to join the substrate support portion 8 to the base portion 3 using screws or the like. However, if the substrate support portion 8 and the base portion 3 can be bonded with sufficient bonding strength, the standing method is not particularly limited. For example, the substrate support portion 8 is bonded to the base portion 3 using an adhesive or the like. You may do it.
In the case where the flexible substrate support portion 8 is used in the first step S1, the substrate support portion 8 on which the flexible wiring substrate 9 is supported is curved in plan view, such as annular in plan view. Alternatively, after deforming into a bent shape, the deformed substrate support portion 8 is erected on the base portion 3. In addition, when using the substrate support portion 8 that has been bent or bent in plan view and has substantially no flexibility, the substrate support portion is supported while the flexible wiring substrate 9 is supported. 8 is erected on the base portion 3.
In addition, when the board | substrate support part 8 is produced integrally with the base part 3, 2nd process S2 is not performed but 3rd process S3 which is the next process is performed after 1st process S1 completion | finish.

（第３工程）
第３工程Ｓ３は、ベース部３に、ベース部３（例えばベース部の凹部４）を覆うようにカバー部５を接合して筐体２を作製する工程である。ベース部３とカバー部５との接合方法は、接着剤等で接着することによって接合することが好ましい。しかしながら、ベース部３とカバー部５とが十分な接合強度で接合できれば、接着以外の方法でベース部３とカバー部５とを接合してもよい。 (Third step)
The third step S3 is a step of manufacturing the housing 2 by joining the cover portion 5 to the base portion 3 so as to cover the base portion 3 (for example, the concave portion 4 of the base portion). The joining method of the base part 3 and the cover part 5 is preferably joined by bonding with an adhesive or the like. However, as long as the base part 3 and the cover part 5 can be joined with sufficient joining strength, the base part 3 and the cover part 5 may be joined by a method other than adhesion.

第３工程Ｓ３を行うことによって、筐体２の内部に空間部７が形成され、その空間部７の内部に、平面視で湾曲又は屈曲した形状にて（図示する例では空間部７の形成方向に沿って）基板支持部８が立設される。その結果、基板支持部８に支持された可撓性配線基板９、及び、可撓性配線基板９に設けられた発光素子１０が、平面視で湾曲又は屈曲した形状にて配置されることとなる。 By performing the third step S3, the space portion 7 is formed inside the housing 2, and the space portion 7 is curved or bent in a plan view (in the illustrated example, the space portion 7 is formed). Along the direction, a substrate support 8 is erected. As a result, the flexible wiring board 9 supported by the board support portion 8 and the light emitting element 10 provided on the flexible wiring board 9 are arranged in a curved or bent shape in plan view. Become.

本発明に係る発光装置の製造方法は、筐体２が反射部１２を含む場合には、第２工程Ｓ２を行う前に、ベース部３の表面（ベース部３の凹部４の表面）に反射部１２を設ける工程を行う。
反射部１２を設ける方法としては、反射部１２を構成するＡｌ等の金属シートを凹部４の表面に接着剤等で接着する。なお、反射部１２を設ける方法として、Ａｌ等の金属の金属蒸着や金属メッキを用いてもよい。 In the method for manufacturing a light emitting device according to the present invention, when the housing 2 includes the reflecting portion 12, the light is reflected on the surface of the base portion 3 (the surface of the concave portion 4 of the base portion 3) before the second step S2. The process of providing the part 12 is performed.
As a method of providing the reflecting portion 12, a metal sheet such as Al constituting the reflecting portion 12 is bonded to the surface of the recess 4 with an adhesive or the like. In addition, as a method of providing the reflection part 12, you may use metal vapor deposition and metal plating of metals, such as Al.

反射部１２を設ける工程を行うことによって、発光素子１０が反射部１２と対向する位置に配置されることとなる。それによって、発光素子１０からの光が反射部１２によってカバー部５の方向に反射され、カバー部５から発光装置外に出射する光束が増加して、光取り出し効率が向上する。 By performing the process of providing the reflection part 12, the light emitting element 10 will be arrange | positioned in the position facing the reflection part 12. FIG. Thereby, the light from the light emitting element 10 is reflected in the direction of the cover part 5 by the reflecting part 12, and the light flux emitted from the cover part 5 to the outside of the light emitting device is increased, so that the light extraction efficiency is improved.

以上で説明した各工程によって製造された発光装置は、放熱性に優れ、製造が容易な発光装置となる。そして、この発光装置は、照明装置として天井や壁面等に設置して点灯した際、優れた放熱性によって発光素子、ひいては発光装置自体の寿命を延ばすことができるため、信頼性が高いものとなる。また、この発光装置は、優れた光取り出し効率によって十分な照度を確保できるため、信頼性がさらに高いものとなる。 The light emitting device manufactured by the above-described steps is a light emitting device that has excellent heat dissipation and is easy to manufacture. And when this light-emitting device is installed on a ceiling or a wall surface as a lighting device and is lit, it is possible to extend the life of the light-emitting element, and thus the light-emitting device itself, due to excellent heat dissipation. . In addition, since the light emitting device can secure sufficient illuminance due to excellent light extraction efficiency, the light emitting device has higher reliability.

なお、以上、図示する例として、筐体２（空間部７）、基板支持部８、及び可撓性配線基板９が平面視で環状である発光装置１について説明したが、本発明の発光装置１は、本発明の要旨を逸脱しない範囲で種々の変更や変形を行うことができる。例えば、図示しないが、本発明は、筐体（空間部）、基板支持部、及び可撓性配線基板が平面視でＵ字状である発光装置にも適用することができる。この場合には、可撓性配線基板は、基板支持部の片側（片面）にのみ支持されていてもよいし、両側（両面）に各々支持されていてもよい。また例えば、図示しないが、本発明は、箱状の筐体のベース部上に、導光板を備え、その導光板の周囲（側方）に、基板支持部及び可撓性配線基板が、例えば平面視で環状など、平面視で湾曲又は屈曲した形状にて設けられた発光装置にも適用することができる。この場合には、可撓性配線基板は、導光板に対向する基板支持部の片側（片面）にのみ支持されていることが好ましい。 As described above, the light emitting device 1 in which the casing 2 (space portion 7), the substrate support portion 8, and the flexible wiring substrate 9 are annular in plan view has been described as an example. 1 can be variously changed and modified without departing from the gist of the present invention. For example, although not shown, the present invention can also be applied to a light emitting device in which a housing (space portion), a substrate support portion, and a flexible wiring substrate are U-shaped in plan view. In this case, the flexible wiring board may be supported only on one side (one side) of the substrate support part, or may be supported on both sides (both sides). Further, for example, although not shown, the present invention includes a light guide plate on a base portion of a box-shaped housing, and a substrate support portion and a flexible wiring board are provided around (side) the light guide plate. The present invention can also be applied to a light-emitting device provided in a shape that is curved or bent in a plan view, such as a ring shape in a plan view. In this case, it is preferable that the flexible wiring substrate is supported only on one side (one side) of the substrate support portion facing the light guide plate.

１発光装置
２筐体
３ベース部
４凹部
５カバー部
７空間部
８基板支持部
９可撓性配線基板
１０発光素子
１２反射部
Ｓ１第１工程
Ｓ２第２工程
Ｓ３第３工程 DESCRIPTION OF SYMBOLS 1 Light-emitting device 2 Case 3 Base part 4 Recessed part 5 Cover part 7 Space part 8 Board | substrate support part 9 Flexible wiring board 10 Light emitting element 12 Reflecting part S1 1st process S2 2nd process S3 3rd process

Claims

A housing in which a space portion surrounded by a base portion and a cover portion covering the base portion is formed;
In the space portion, a substrate support portion having a curved or bent shape in a plan view standing on the base portion;
A flexible wiring board supported by the board support part;
A light emitting element provided on the surface of the flexible wiring board,
The light emitting device characterized in that the substrate support portion has higher rigidity than the flexible wiring substrate.

The light emitting device according to claim 1, wherein the substrate support portion has flexibility.

The light emitting device according to claim 1, wherein the base portion is made of a metal material.

The said housing | casing is further provided in the said base part, and further contains the reflection part which reflects the light from the said light emitting element in the direction of the said cover part, The Claim 1 thru | or 3 characterized by the above-mentioned. The light-emitting device of description.

The light emitting device according to claim 4, wherein a height of the substrate support portion is less than half of a maximum height from the base portion to the cover portion.

The space portion and the substrate support portion are annular in plan view,
6. The light emitting device according to claim 1, wherein two flexible wiring boards are supported on the board support portion in opposite directions.

A manufacturing method of a light emitting device including a light emitting element inside a housing in which a space portion surrounded by a base portion and a cover portion covering the base portion is formed,
A first step of supporting a flexible wiring board provided with the light emitting element on a surface thereof on a substrate support portion having higher rigidity than the flexible wiring board;
A second step of standing on the base portion in a shape in which the substrate support portion on which the flexible wiring substrate is supported is curved or bent in plan view;
A third step of manufacturing the casing by joining the cover portion to the base portion so as to cover the base portion.