JP2014015263A - Cover tape and method for manufacture - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an article including a cover tape, the cover tape including: a base film layer having opposed longitudinal edges; recessed areas extending along the longitudinal edges; tear enabling features substantially parallel to the longitudinal edges; and an adhesive applied to the recessed areas.SOLUTION: An article includes a cover tape; which includes a base film layer, recessed areas, tear enabling features, and an adhesive. The base film layer has opposed longitudinal edges. The recessed areas extend along the longitudinal edges of the base film layer. The tear enabling features are substantially parallel to the longitudinal edges. The adhesive is disposed on the recessed areas.

Description

  The present invention relates to a tape for transporting components or a method and apparatus for manufacturing said tape.

  In manufacturing settings, it is often required to hold and transport components. For example, in the field of electronic circuit assemblies, electronic components are often transported from a component supply to a specific location on a circuit board for attachment thereto. The component can be of several different types including surface mount components. Specific examples include memory chips, integrated circuit chips, resistors, connectors, processors, capacitors, gate arrays, and the like. The carrier tape / cover tape system disclosed in US Pat. No. 5,325,654 can be used to carry small and delicate components.

  The electronics industry is continually moving towards smaller devices and therefore smaller components, which in turn, remove the components from the carrier tape / cover tape system in a more delicate and accurate manner. You need to do. The best known cover tapes use thermally activated adhesive (HAA) or pressure sensitive adhesive (PSA) to secure the cover tape to the carrier tape. Component removal is performed by carefully peeling or peeling the carrier tape cover tape first to expose the component to a vacuum nozzle or other component processing equipment for safe component removal. .

US Pat. No. 5,325,654

  However, some operational difficulties arise from known cover tapes. For example, peeling the cover tape from the carrier tape will result in a release that appears turbulent, rough, uneven and inconsistent, thereby moving the carrier tape / cover tape that moves small components. Disturbed debris is also known to eject small components from pockets in the carrier tape, causing mispicking and thus causing automated component processing equipment to shut down.

  The peel force of the adhesive cover tape varies considerably depending on the width of the cover tape and the type of carrier tape used. A wider HAA cover tape will certainly require higher heat to adhere. Similarly, a wider PSA cover tape has a lower peel force and requires a wider adhesive exposure to secure. Furthermore, cover tapes designed for one carrier tape type do not get good performance from other carrier material types (eg, polystyrene). Even though the cover tapes typically operate with different types of carrier tapes, they may not meet the optimal peel force and have uneven peel. Furthermore, HAA also has low stability because the peel force is time-dependent and decreases with temperature.

  Furthermore, the known cover tape has difficulty in storing and transporting the cover tape. For example, adhesive "squeezing" can occur when the adhesive on the bottom surface of the tape moves and deforms under pressure and / or heat conditions that cause the adhesive to move beyond the edges of the tape. This is a problem because it causes the adhesive to adhere to unwanted locations, which leads to contamination, requires unwanted cleaning, detracts from aesthetic value, and other issues such as unwanted equipment downtime Is to cause. In addition, when a cover tape made from a flat film (ie, a film with no recesses) is rolled up, it causes undesirable sagging between the adhesive strips, which results in an unstable roll.

  In one aspect of the invention, the article includes a cover tape, which is provided with a substrate film layer, a recess, a break mechanism, and an adhesive. The base film layer has opposing longitudinal edges. The recessed portion extends along the longitudinal edge of the base film layer. The breaking mechanism is substantially parallel to the longitudinal edge of the substrate film. The adhesive is processed on the recess.

  In another aspect of the present invention, a method of manufacturing a cover tape includes providing a base film layer having opposing longitudinal edges, forming recessed portions along each longitudinal edge, and substantially forming a longitudinal edge. Forming a breaking mechanism in the base film layer in parallel with and applying an adhesive to each recess.

  The above summary is not intended to describe each disclosed embodiment or every implementation of the present invention. The drawings and the following detailed description illustrate example embodiments more specifically.

The cross-sectional schematic of the cover tape by this invention. FIG. 6 is a schematic cross-sectional view of another embodiment of a cover tape according to the present invention. FIG. 6 is a schematic cross-sectional view of another embodiment of a cover tape according to the present invention. FIG. 6 is a schematic cross-sectional view of another embodiment of a cover tape according to the present invention. FIG. 6 is a schematic cross-sectional view of another embodiment of a cover tape according to the present invention. FIG. 2 is a schematic cross-sectional view of the cover tape in FIG. 1 after heating and pressurization. FIG. 3 is a cross-sectional schematic side view of a roll portion of a cover tape according to the present invention. 1 is a perspective view of a carrier tape / cover tape system according to the present invention. FIG. The schematic side view of the cover tape scoring apparatus by this invention. The cross-sectional schematic side view of the scoring apparatus part of FIG. FIG. 10 is a schematic rear view of the scoring device portion of FIGS. 8 and 9. FIG. 4 is a schematic cross-sectional view of another embodiment of a series of cover tapes according to the present invention. FIG. 4 is a schematic cross-sectional view of another embodiment of a series of cover tapes according to the present invention.

  Aspects of the invention relate to a cover tape / cover tape system and a method and apparatus for manufacturing a cover tape. The cover tape can be glued to the carrier tape that holds the components for storage and transport in accordance with the present invention. The cover tape can cover a cover pocket in the carrier tape that can hold the components and has a portion that can be separated from the system to expose the pocket in the carrier tape. The breaking mechanism of the cover tape can separate the portion of the cover tape from the other portion of the cover tape (and the carrier tape to which the cover tape is bonded) with a substantially constant and uniform release force, thereby During the detachment process, potential undesirable movement of components held by the carrier tape is reduced. As used herein, the term “tear” generally refers to controlled removal of component parts. In addition, the cover tape provides a recess along the longitudinal edge of the cover tape in accordance with the present invention, thereby helping the cover tape maintain a relatively flat profile during storage and application. The location of the adhesive may be spaced from the edge of the cover tape, thereby preventing adhesive contamination and unwanted adhesion of the adhesive to other surfaces such as the cover tape processing apparatus.

  FIG. 1 is a schematic cross-sectional view of a cover tape 20 suitable for use in a carrier tape / cover tape system. Cover tape 20 includes an elongate film having opposing longitudinal edges 24 and 26 and opposing top and bottom surfaces 28 and 30, respectively. The film 22 can be, for example, a polymer film such as polyethylene terephthalate, oriented polypropylene (ie, biaxially oriented polypropylene), oriented polyamide, oriented polyvinyl chloride, polystyrene, polycarbonate, polyethylene, polyacrylonitrile, polyolefin, and polyimide film. The film 22 can be transparent. Further, the film 22 may be conductive or electrostatic dissipative in nature. The breaking mechanisms 32 and 34 extending in the vertical direction or the recesses 36 and 38 extending in the vertical direction are fixed with respect to the bottom surface 30 of the film 22. There is a separation between the breaking mechanisms 32 and 34 and a central portion 40 of the film 22 is formed between them. A topcoat 42 is provided along the top surface 28 of the film 22, if desired. Topcoat 42 may include a static dissipative (SD) coating, a LAB (ie, an adhesive release agent coating), an anti-reflective or glare reducing coating, or a mixture of other coatings and coatings. A primer 44 is also optionally provided along the bottom surface 30 of the film 22, which may be an SD coating or other type of coating and can be at least partially mixed with the film 22. Longitudinal treated adhesive strips 46 and 48 are provided along the recesses 36 and 38.

Recesses 36 and 38 are placed in the longitudinal edges 24 and 26 of the film 22, respectively. Recesses 36 and 38 are released, respectively, facing the bottom surface 30 and the longitudinal edge of the film 22. Alternatively, the recesses can be formed on both sides of the cover tape. This mechanism, for example, the thickness of the adhesive strip is greater than the depth of D _R, it is useful for promoting the winding cover tape.

  In the embodiment shown in FIG. 1, the bottom 50 and the side 52 form recesses 36 and 38, respectively. Adhesive strips 46 and 48 may be disposed on the bottom 50 of the recesses 36 and 38, respectively. The bottom 50 of the recesses 36 and 38 has a microstructure (not shown in FIG. 1) to better adhere the adhesive strips 46 and 48 to the film 22. It should be recognized that other recess shapes can be utilized as long as the recesses 36 and 38 are open facing the elongated edge 24 or 26 of the adjacent film 22 and the bottom surface 30 of the film 22.

Film 22 includes recesses 36 and 38 or all microstructures and is formed using processes such as scoring, extrusion, calendering, micro-replication, laser cutting, ultrasound, punching, chemical etching, and stripping. be able to. In further embodiments, the recesses 36 and 38 can be formed using different processes. Further, the film 22 can be formed using a film that can be broken or peeled along a center line (ie, a line intermediate between the top and bottom surfaces of the film 22), and the separation line is In order to form the recess, it can be cut from the top and bottom to the center line. As shown in FIG. 11A, centerline failure or delamination can be established, for example, by laminating or co-extruding two layers of different materials 25, 27 having a weak interface. The plurality of cover tapes 20 can be formed from a single film web of bilayer material by cutting a plurality of separation lines along the width of the sheet. The separation lines in one layer are separated by a width of W 2 _O. These separation lines form opposing longitudinal edges 24 and 26 of each adjacent cover tape 20. W _R These separation lines, the side portions 52 of each adjacent cover tape form, the side portions are spaced the width W _I. The portion of the second layer facing the separation line in the first layer becomes scrap material 29. After the separation line is cut, the tapes 20 are formed by separating the cut surface of the film 22 along the edges 24 and 26, the side 52 and the break line 31. The destruction line 31 forms the inside of the scrap material 29.

As FIG. 11B shows, different processes can be used to avoid this scrap material. In this case, the upper and lower layers of the film web are made of a similar material 25 that is in a thin layer of different material 27 between these layers to facilitate fracture or delamination. Preferably, the cohesion degree of the material 27 is equal to or less than the adhesive strength between the materials 25 and 27. Because the top and bottom layer materials are the same, both layers form a wider and narrower cover tape portion. (This method can be used for top and bottom layers of different materials, but is particularly useful when it is desirable to have top and bottom layers made from the same material.) , May be positioned adjacent to each other from top to bottom (ie, positioned at 180 degrees relative to each other). To that end, each separation line in the layer forms a longitudinal edge 24 or 26 of one cover tape and can also form a side portion of an adjacent tape. In other words, the separation lines in each layer are separated by width W _O and width W _I instead. In the relationship between one layer and the other layer, the distance between the separation lines is changed in the reverse order so that the width W _O in one layer 25 is paired with the width W _{I in the} other layer 25. The After the separation line is cut, the tape 20 is formed by separating the film 22 along the edges 24/52, 26/52 and the break line 33.

The adhesive strips 46 and 48 on the bottom 50 of the recesses 36 and 38 can be, for example, pressure sensitive adhesive (PSA), heat activated and microencapsulated adhesive. The adhesive strips 46 and 48, or greater than the depth D _R of the recesses 36 and 38, may have a less thickness. Usually, the thickness is equal to or less than the depth D _R. The adhesive stripes 46 and 48 has a width _{W R} less the width of the recesses 36 and 38. The width less than the width D _R of the recesses 36 and 38, when the cover tape 20 is not applied to the surface (i.e., not under tension), the recess 36 on one side of the respective adhesive strips 46 and 48 And a substantially adhesive-free zone extending longitudinally along the bottom 50 of 38.

  The breaking mechanisms 32 and 34 are located with respect to the bottom surface 30 of the film 22 and are located adjacent to the recesses 36 and 38 on the side 52 thereof. However, in further embodiments, the breaking mechanisms 32 and 34 can be located almost anywhere along the top surface 28, bottom surface 30, or both sides of the film 22 so long as they each take a width from the longitudinal edge of the film 22. Can be fixed. As shown in FIG. 1, the taper permission mechanisms 32 and 34 are continuous scoring lines extending in the longitudinal direction along the film 22. The scoring line can be formed by cutting the film 22 (for example, using a laser, a die cutter, or a blade according to the blade scoring procedure described below). In a further embodiment, the breaking mechanisms 32 and 34 may provide a weakened area of the film 22 (eg, thinner areas, micro-perforations, etc.), a transition between the two materials (eg, the first material is the center of the film 22). Part 40 and the second material may include the region of film 22 between the bottom 50 of recesses 36 and 38 and top surface 28), or other structure that promotes breakage.

In one embodiment, provided as an example and not a limitation, the cover tape has the following dimensions: The total width W _O (measured between the elongated edges 24 and 26) of the film 22 is about 2.54 centimeters (1 inch). The thickness T of the film 22 was about 0.0254 millimeters (2 mils) (the thickest portion of the central portion 40 of the film 22 was measured). Recesses 36 and 38 has a width _{W R} and depth _{D R} of about 0.0127 mm (0.5 mil) of about 1 millimeter, respectively (0.0393701 inches). The breaking mechanisms 32 and 34 are split lines each having a depth of about 0.0381 millimeters (1.5 mils) (measured from the bottom surface 30 of the film 22). It should be appreciated that the dimensions of the cover tape 20 can be changed if desired. For example, the width of the central portion 40 of the film 22 can be selected to be at least as wide as the carrier tape pocket in which the cover tape 20 is used.

  FIG. 2 is a cross-sectional schematic view of another embodiment of a cover tape 80 in accordance with the present invention. The cover tape 80 shown in FIG. 2 is generally similar to the cover tape 20 shown and described in connection with FIG. The cover tape 80 of FIG. 2 further includes coatings 82 and 84 on the elongated edge 24 of the film 22, respectively. The coatings 82 and 84 reduce the likelihood of adhesive sticking to the elongated edges 24 and 26 and thus reduce the likelihood of undesirable viscous contamination and other problems associated with the exposed adhesive. But it ’s okay.

  FIG. 3 is a cross-sectional schematic view of another embodiment of a cover tape 90 in accordance with the present invention. The cover tape 90 shown in FIG. 3 is generally similar to the cover tape 20 shown and described in connection with FIG. The cover tape 90 of FIG. 3 further includes recessed outer coatings 92 and 94 or recessed inner coatings 96 and 98. Recess outer coatings 92 and 94 lie adjacent to adhesive strips 46 and 48, respectively, and are located at the bottom 50 of recesses 36 and 38 toward the elongate edges 24 and 26 of film 22. Recess inner coatings 96 and 98 are located at the bottom 50 of the recesses 36 and 38 adjacent the adhesive strips 46 and 48 and toward the sides 52 of the recesses 36 and 38, respectively. The coatings 92, 94, 96 and 98 are LAB materials or tack free that can prevent contact with undesirable adhesives, for example, by more reliably suppressing the adhesive strips 46 and 48 in the recesses 36 and 38. It can be a material.

  FIG. 4A is a cross-sectional schematic view of a further embodiment of the cover tape 100. Cover tape 100 is generally similar to cover tape 20, but film 22 includes a first material 104 and a second material 106. With the cover tape 100, the second material 106 is located in the recesses 36 and 38 (ie, at the top) and extends from the elongated edge 24 or 26 to the material intermediate surface 108. The central portion 40 of the film 22 is formed between the material intermediate portions 108.

  The interface 108 of the material exhibits a sticking or binding force that has a weak internal sticking or binding force of either the first material 104 or the second material 106. The relative weakness of the material interface 108 facilitates a substantially constant and uniform break, that is, separation of the first material 104 and the second material 106 at the material interface 108. Thereby, the interface 108 of the material can form a breaking mechanism.

  The first and second materials 104 and 106 can generally be selected from the same types of materials discussed in connection with FIGS. 1-3 described above. In certain embodiments, the first material 104 may be weaker than the second material 106, or vice versa. In other words, one material may have weaker internal aggregation or adhesion properties than the other material. Further, the central portion 40 of the film 22 can be transparent and highly optically transparent.

  The film 22 of the cover tape 100 can be processed using processes such as coextrusion and profile extrusion. In coextrusion, the first and second materials 104 and 106 are extruded together in the desired arrangement. With profile extrusion, the first and second materials 104 and 106 are individually extruded in the desired shape and combined while still melting after the initial individual extrusion process. Processing can result in undesirable mixing of the first and second materials 104 and 106 at the interface (eg, at interface 108 of FIG. 4A). One advantage of this embodiment is that the breaking mechanism does not require scoring.

  FIG. 4B is a cross-sectional schematic view of another embodiment of the cover tape 102. Cover tape 102 is generally similar to cover tape 100, and film 22 includes a first material 104 and a second material 106. With the cover tape 102, the second material 106 is processed into elongated edges 110 and 112 located near the side 52 of the recesses 36 and 38, the first material being the band 110 and the second material 106. 112 is arranged on one side. The central portion 40 of the film 22 is formed between the bands 110 and 112 of the second material 106.

  The second material 106 is generally weaker than the first material 104. In other words, the second material 106 has weaker internal sticking or bonding properties than the first material 104. This facilitates a constant and uniform break in the film 22 in the bands 110 and 112 of the second material 106. Bands 110 and 112 thus constitute a breaking mechanism. In certain embodiments, the first material 104 can resist breakage. The second material 106 can include a different weaker form of material type as the first material, or can be a completely different type of material. The first and second materials can generally be selected from the same types of materials discussed in connection with FIGS. 1-3 above. Further, the weaker second material 106 can be made of ethylene vinyl acetate (EVA). One advantage of this embodiment is that the breaking mechanism does not require scoring.

  FIG. 5 is a schematic cross-sectional view of the cover tape 20 after heating and pressing. In use, the cover tape 20 is positioned so that it touches the surface (eg, it is rolled up) so that tensile and compressive forces act on the tape 20. Heat and pressure slightly deflect the portion of the film 22 on the side of the recesses 36 and 38. Heat and pressure can also cause the adhesive strips 46 and 48 to deform and move. More specifically, heat and pressure can cause the adhesive strips 46 and 48 to change from the first shape 46A and 48A to the second shape 46B and 48B. The first shapes 46A and 48A are generally thicker and generally narrower than the second shapes 46B and 48B. Nevertheless, even after the deformation, the adhesive strips 46 and 48 are substantially contained within the recesses 36 and 38 despite the presence of pressure and heat. In the second shape 46B and 48B, the adhesive strips 46 and 48 are generally spaced from the sidewalls 52 of the recesses 36 and 38 and from the elongated edges of the film 22. By substantially including the adhesive strips 46 and 48 in the recesses 36 and 38 (even when deformed by heat and / or pressure), the cover tape 20 is undesired adhesive or tacky in undesirable locations. Without being exposed, it can be securely fixed at a desired position. It should be noted that the features of the recesses 36 and 38 are not limited to the specific embodiment of the cover tape shown in FIG.

  In the form of a roll, it is possible to place a cover tape according to the invention. FIG. 6 is a schematic side view of the cross section of the roll 120 portion of the cover tape. The cover tape 20 is wound around a core 122 (eg, a substantially cylindrical cardboard core). In this configuration, the upper surface 28 of the cover tape 20 is substantially smooth and planar, and the roll 120 is generally stable. Further, the side surface 124 of the roll 120 prevents the adhesive from protruding from the cover tape 20 along the side surface 124 of the roll 120 (the adhesive is separated from the side edge of the tape in the recess). Generally non-tacky. The adhesive strips 46 and 48 can be releasably adhered to the top coating 42 of the cover tape 20.

  The cover tape can be placed on a roll (eg, roll 120 in FIG. 6) after processing and before being bonded to the carrier tape. The placement of the cover tape on the roll facilitates storage and transport and automatic processing of the cover tape. The coating material on the top surface of the cover tape helps peel the cover tape from the roll.

  The cover tape can be used in a carrier tape / cover tape system. FIG. 7 is a perspective view of a carrier tape / cover tape system 130 that includes a carrier tape 132 and a cover tape 20. The carrier tape 132 has a pair of opposed elongated lip portions 134 and one or more pockets 136. A component 138, such as an electronic component, can be placed in the pocket 136. After the component 138 is desirably placed in the pocket 136 of the carrier tape 132, the cover tape 20 covers the pocket 136 and includes an elongated lip portion 134 to include the component 138 between the carrier tape 132 and the cover tape 20. Can be glued to. The cover tape 20 can be dispensed from a roll.

  A portion of the cover tape 20 is separated from the system 130 to expose and remove the component 138. As FIG. 7 shows, the central portion 40 of the cover tape 20 formed between the breaking mechanisms 32 and 34 is cut off. The outer portion of the cover tape 20 continues to adhere to the carrier tape 132 (after the central portion 40 is cut off. After being cut off, the central portion 40 of the cover tape 20 is rolled into a roll for disposal or recycling. Can be rolled up.

  The central portion 40 of the cover tape 20 is separated by the breaking mechanisms 32 and 34 (eg, the dividing line of the embodiment shown and described in connection with FIGS. 1-3). In other embodiments, the material interface (eg, the material interface 108 shown and described in connection with FIG. 4A), the weaker material band (eg, the second shown and described in connection with FIG. 4B). Of the material 106 are separated at other locations depending on the type and location of the breaking mechanism.

  It is desirable to have a substantially uniform cutting force when the cover tape portion is cut off. Although lasers or blades can be used to create scoring lines, creating a large number of accurate scoring lines with a difference of less than 0.0254 millimeter (0.001 inch) is too expensive for lasers and blade cutting The use of known blades, which is hindered by differences in edge positioning, is almost impossible.

  In order to achieve uniform cutting with a cover tape having a scoring line, it is desirable to provide a scoring line that has a small depth difference along the length of the cover tape and between distinct scoring lines. . A scoring line having a substantially uniform depth can be easily and efficiently formed in a film web using the method and apparatus described below. The scoring line is typically formed in the film web after the film has been formed in the recesses, but the scoring line can be implemented at other stages of the cover tape processing process. For example, one possible manufacturing process involves forming a plurality of parallel, laterally spaced, longitudinally extending recesses in a large film web. A longitudinal scoring line is then formed in the large film web. A longitudinal adhesive strip is then applied to the recesses in the film (eg, two strips of adhesive strip with one strip in each recess). Finally, the large film web is cut and divided into a plurality of individual cover tape strips by cutting through each recess between the adhesive bands therein.

  FIG. 8 is a schematic side view of a scoring device including web support rollers 202A, 202B and 202C or blade assembly 204. FIG. FIG. 9 is a cross-sectional schematic side view of a blade assembly. The blade assembly 204 includes a main structure 206 with a cavity 208 formed along the rear surface 210 and a generally U-shaped opening 212 formed along the entire surface 214. Alignment means 218 (eg, an adjustment micrometer assembly) was provided to accurately align the scoring device relative to roller 202B, eg, to adjust the scoring depth. In order to maintain a substantially constant scoring depth, it is desirable to reduce the effect of differences in the shape of the support roller 202B. This can be accomplished by joining one or more scoring depth control rollers 228 to the main structure 206. These scoring depth control rollers 228 are in direct contact with the web support roller 202B, allowing the main structure 206 to follow the contour of the web support roller 202B, which is the difference in scoring depth. Minimize. One or more blades 220 (eg, a conventional metal blade with a linearly tapered cutting edge configured similar to the structure of a single edged razor blade), where the cutting edge 222 of the blade 220 is the front surface 214 of the main structure 206. And is inserted into the cavity 208 so as to contact the precision inner surface 224 (FIG. 9) of the cavity 208 that forms a plane. The blade 220 is biased against the precision surface 224 using biasing means such as connections, springs and bumpers (biasing means not shown in FIG. 8). Generally, the central portion of the cutting edge 222 of the blade 220 is exposed through the opening 212 so that the blade 220 can cut the film web material that contacts them.

  The main structure 206 of the blade assembly 204 can be formed of any material (eg, metal, glass, polymer, etc.) such that the precision inner surface 224 rejects cutting by the blade 220. In one embodiment, the main structure 206 is formed of a metallic material that is at least as hard as the blade 220.

  During operation, undivided film 22A passes between roller 202B and blade assembly 204. The cutting edge 222 of the blade 220 is adjusted by the alignment means 218 with respect to the roller 202B so that a desired cutting depth can be achieved. Different cutting depths can be provided for different blades. For example, some blades may provide scoring while other blades simultaneously detach individual cover tape strips from an article that includes multiple connected cover tape strips. However, the cutting to divide individual cover tape strips does not have to be performed simultaneously with scoring.

  After passing through the blade assembly, the just-divided film 22 can be moved to another position for further processing by the roller 202C and finally wound on a roll (e.g., FIG. Roll 120 shown and described in connection with 6).

  Multiple dividing lines can be provided to the film simultaneously using the apparatus shown and described in connection with FIGS. FIG. 10 is a schematic rear view of the blade assembly 204. In FIG. 10, the blades are omitted for clarity. A number of lateral spacers 226 are inserted into the cavities 208 of the blade assembly 204. A gap is formed between adjacent spacers so that the blade can be inserted into the gap. The spacer aligns across the width of the film being divided. In addition, the spacer provides the blade with a support that may be thin to increase the rigidity of the blade and promote the formation of a straight and uniform scoring line. The number, size, and placement of the spacers 226 will vary depending on the desired scoring pattern. The spacer 226 can be formed from a metal or polymer material.

  In a further embodiment, the spacer 226 is generally formed with the main structure 206 of the blade assembly 204. In the embodiment described above, the blade alignment plane can be collectively defined by a plurality of fine surfaces formed for each gap.

  In view of the above discussion, a number of advantages and benefits of the present invention should be recognized. One advantage of the cover tape according to the present invention is a highly uniform release force at the central portion of the tape, which eliminates mispicking during storage and transport operations due to parts or components popping out of the carrier pocket of the carrier tape. Reduce the risk of Furthermore, the cover tape solves the winding problems normally encountered with adhesive strip-coated tapes (eg, unstable rolls with slack problems), while the cover tape is more resistant to using adhesive strips. Cost efficiency can be improved. Furthermore, the cover tape of the present invention also reduces the risk of adhesive deposition on the device by “squeezing out” the adhesive by continuing to contain a significant amount of adhesive in the recess before and after the center cut of the tape. it can. It also has a substantially non-flammable side edge when rolled up in roll form, which reduces the risk of contamination when a roll of cover tape is placed on a table or other surface. Furthermore, while forming the cover tape, cutting through the adhesive is not necessary and can lead to a more effective process by avoiding the deposition of adhesive on the cutting device.

  The method and apparatus for film scoring also presents numerous advantages. Scoring can be accomplished in a simple, efficient and cost effective manner. The scoring device of the present invention allows for a substantially uniform scoring depth that is provided with relatively small differences in scoring depth. By using a conventional blade (eg, a blade similar to a single blade razor blade) in the practice of the present invention, the scoring device is relatively simple and the blade and device are relatively inexpensive. Furthermore, it is desirable in cutting or scoring due to individual differences in the blades by aligning the blades directly to their respective cutting edges rather than using blade reference mechanisms (eg notches and holes) that are spaced from the cutting edges. No difference can be reduced.

  Although the invention has been described with reference to several alternative embodiments, those skilled in the art will recognize that changes may be made in form and detail without departing from the spirit and scope of the invention. I will. For example, according to the present invention, various types of breaking mechanisms can be used, and the breaking mechanisms can have various arrangements.

  While the above drawings illustrate some embodiments of the present invention, other embodiments are also contemplated, as described in the discussion. In all cases, this disclosure presents the invention by way of representation and is not meant to be limiting. It should be understood that many other modifications and embodiments can be devised by those skilled in the art and are within the scope and spirit of the principles of the present invention. The drawings may not be drawn to scale. Throughout the drawings, like reference numerals are used to denote like parts.

  The present invention relates to a tape for transporting components or a method and apparatus for manufacturing said tape.

In manufacturing settings, it is often required to hold and transport components. For example, in the field of electronic circuit assemblies, electronic components are often transported from a component supply to a specific location on a circuit board for attachment thereto. The component can be of several different types including surface mount components. Specific examples include memory chips, integrated circuit chips, resistors, connectors, processors, capacitors, gate arrays, and the like. The carrier tape / cover tape system disclosed in US Pat. No. 5,325,654 can be used to carry small and delicate components.

The electronics industry is continually moving towards smaller devices and therefore smaller components, which in turn, remove the components from the carrier tape / cover tape system in a more delicate and accurate manner. You need to do. The best known cover tapes use thermally activated adhesive (HAA) or pressure sensitive adhesive (PSA) to secure the cover tape to the carrier tape. Component removal is performed by carefully peeling or peeling the carrier tape cover tape first to expose the component to a vacuum nozzle or other component processing equipment for safe component removal. .

US Pat. No. 5,325,654 JP-A-11-165364 JP 7-508251 Japanese National Patent Publication No. 9-508606

  However, some operational difficulties arise from known cover tapes. For example, peeling the cover tape from the carrier tape will result in a release that appears turbulent, rough, uneven and inconsistent, thereby moving the carrier tape / cover tape that moves small components. Disturbed debris is also known to eject small components from pockets in the carrier tape, causing mispicking and thus causing automated component processing equipment to shut down.

  The peel force of the adhesive cover tape varies considerably depending on the width of the cover tape and the type of carrier tape used. A wider HAA cover tape will certainly require higher heat to adhere. Similarly, a wider PSA cover tape has a lower peel force and requires a wider adhesive exposure to secure. Furthermore, cover tapes designed for one carrier tape type do not get good performance from other carrier material types (eg, polystyrene). Even though the cover tapes typically operate with different types of carrier tapes, they may not meet the optimal peel force and have uneven peel. Furthermore, HAA also has low stability because the peel force is time-dependent and decreases with temperature.

  Furthermore, the known cover tape has difficulty in storing and transporting the cover tape. For example, when the adhesive on the bottom surface of the tape moves and deforms under pressure and heat conditions that cause the adhesive to move beyond the edge of the tape, the “squeezing” out of the adhesive can occur. This is a problem because it causes the adhesive to adhere to unwanted locations, which leads to contamination, requires unwanted cleaning, detracts from aesthetic value, and other issues such as unwanted equipment downtime Is to cause. In addition, when a cover tape made from a flat film (ie, a film with no recesses) is rolled up, it causes undesirable sagging between the adhesive strips, which results in an unstable roll.

  In one aspect of the invention, the article includes a cover tape, which is provided with a substrate film layer, a recess, a break mechanism, and an adhesive. The base film layer has opposing longitudinal edges. A recessed part spreads along the longitudinal direction edge part of a base film layer. The breaking mechanism is substantially parallel to the longitudinal edge of the substrate film. The adhesive is processed on the recess.

  In another aspect of the present invention, a method for manufacturing a cover tape includes providing a base film layer having opposing longitudinal edges, forming a recess extending along each longitudinal edge, and substantially forming a longitudinal edge. Forming a breaking mechanism in the base film layer in parallel and applying an adhesive to each recess.

  The above summary is not intended to describe each disclosed embodiment or every implementation of the present invention. The drawings and the following detailed description illustrate example embodiments more specifically.

The cross-sectional schematic of the cover tape by this invention. FIG. 6 is a schematic cross-sectional view of another embodiment of a cover tape according to the present invention. FIG. 6 is a schematic cross-sectional view of another embodiment of a cover tape according to the present invention. FIG. 6 is a schematic cross-sectional view of another embodiment of a cover tape according to the present invention. FIG. 6 is a schematic cross-sectional view of another embodiment of a cover tape according to the present invention. FIG. 2 is a schematic cross-sectional view of the cover tape in FIG. 1 after heating and pressurization. FIG. 3 is a cross-sectional schematic side view of a roll portion of a cover tape according to the present invention. 1 is a perspective view of a carrier tape / cover tape system according to the present invention. FIG. The schematic side view of the cover tape scoring apparatus by this invention. The cross-sectional schematic side view of the scoring apparatus part of FIG. FIG. 10 is a schematic rear view of the scoring device portion of FIGS. 8 and 9. FIG. 4 is a schematic cross-sectional view of another embodiment of a series of cover tapes according to the present invention. FIG. 4 is a schematic cross-sectional view of another embodiment of a series of cover tapes according to the present invention.

  Aspects of the invention relate to a cover tape / cover tape system and a method and apparatus for manufacturing a cover tape. The cover tape can be glued to the carrier tape that holds the components for storage and transport in accordance with the present invention. The cover tape can cover a cover pocket in the carrier tape that can hold the components and has a portion that can be separated from the system to expose the pocket in the carrier tape. The breaking mechanism of the cover tape can separate the portion of the cover tape from the other portion of the cover tape (and the carrier tape to which the cover tape is bonded) with a substantially constant and uniform release force, thereby During the detachment process, potential undesirable movement of components held by the carrier tape is reduced. As used herein, the term “tear” generally refers to controlled removal of component parts. In addition, the cover tape provides a recess along the longitudinal edge of the cover tape in accordance with the present invention, thereby helping the cover tape maintain a relatively flat profile during storage and application. The location of the adhesive may be spaced from the edge of the cover tape, thereby preventing adhesive contamination and unwanted adhesion of the adhesive to other surfaces such as the cover tape processing apparatus.

  FIG. 1 is a schematic cross-sectional view of a cover tape 20 suitable for use in a carrier tape / cover tape system. Cover tape 20 has an elongated film having opposing longitudinal edges 24 and 26 and opposing top and bottom surfaces 28 and 30, respectively. The film 22 can be, for example, a polymer film such as polyethylene terephthalate, oriented polypropylene (ie, biaxially oriented polypropylene), oriented polyamide, oriented polyvinyl chloride, polystyrene, polycarbonate, polyethylene, polyacrylonitrile, polyolefin, and polyimide film. The film 22 can be transparent. Further, the film 22 may be conductive or electrostatic dissipative in nature. The breaking mechanisms 32 and 34 extending in the vertical direction or the recesses 36 and 38 extending in the vertical direction are fixed with respect to the bottom surface 30 of the film 22. There is a separation between the breaking mechanisms 32 and 34 and a central portion 40 of the film 22 is formed between them. A topcoat 42 is provided along the top surface 28 of the film 22, if desired. Topcoat 42 may include a static dissipative (SD) coating, a LAB (ie, an adhesive release agent coating), an anti-reflective or glare reducing coating, or a mixture of other coatings and coatings. A primer 44 is also optionally provided along the bottom surface 30 of the film 22, which may be an SD coating or other type of coating and can be at least partially mixed with the film 22. Longitudinal treated adhesive strips 46 and 48 are provided along the recesses 36 and 38.

Recesses 36 and 38 are placed in the longitudinal edges 24 and 26 of the film 22, respectively. Recesses 36 and 38 are released, respectively, facing the bottom surface 30 and the longitudinal edge of the film 22. Alternatively, the recesses can be formed on both sides of the cover tape. This mechanism, for example, the thickness of the adhesive strip is greater than the depth of D _R, it is useful for promoting the winding cover tape.

  In the embodiment shown in FIG. 1, the bottom 50 and the side 52 form recesses 36 and 38, respectively. Adhesive strips 46 and 48 may be disposed on the bottom 50 of the recesses 36 and 38, respectively. The bottom 50 of the recesses 36 and 38 has a microstructure (not shown in FIG. 1) to better adhere the adhesive strips 46 and 48 to the film 22. It should be appreciated that other recess shapes can be utilized as long as the recesses 36 and 38 are open facing the longitudinal edge 24 or 26 of the adjacent film 22 and the bottom surface 30 of the film 22.

Film 22 has recesses 36 and 38 or all microstructures and is formed using processes such as scoring, extrusion, calendering, micro-replication, laser cutting, sonication, punching, chemical etching, and peeling. can do. In further embodiments, the recesses 36 and 38 can be formed using different processes. Further, the film 22 can be formed using a film that can be broken or peeled along a center line (ie, a line intermediate between the top and bottom surfaces of the film 22), and the separation line is In order to form the recess, it can be cut from the top and bottom to the center line. As shown in FIG. 11A, centerline failure or delamination can be established, for example, by laminating or co-extruding two layers of different materials 25, 27 having a weak interface. The plurality of cover tapes 20 can be formed from a single film web of bilayer material by cutting a plurality of separation lines along the width of the sheet. The separation lines in one layer are separated by a width of W 2 _O. These separation lines form opposing longitudinal edges 24 and 26 of each adjacent cover tape 20. W _R These separation lines, the side 52 of each adjacent cover tape form, the side portions are spaced the width W _I. The portion of the second layer facing the separation line in the first layer becomes scrap material 29. After the separation line is cut, the cover tape 20 is formed by separating portions of the film 22 along the longitudinal edges 24 and 26, the side 52 and the break line 31. The destruction line 31 forms the inside of the scrap material 29.

As FIG. 11B shows, different processes can be used to avoid this scrap material. In this case, the upper and lower layers of the film web are made of a similar material 25 with a thin layer of different material 27 between these layers to facilitate fracture or delamination. Preferably, the cohesion degree of the material 27 is equal to or less than the adhesive strength between the materials 25 and 27. Because the top and bottom layer materials are the same, both layers form a wider and narrower cover tape portion. (This method can be used for top and bottom layers of different materials, but is particularly useful when it is desirable to have top and bottom layers made from the same material.) , May be positioned adjacent to each other from top to bottom (ie, positioned at 180 degrees relative to each other). To that end, each separation line in the layer forms a longitudinal edge 24 or 26 of one cover tape and can also form a side portion of an adjacent tape. In other words, the separation lines in each layer are separated by width W _O and width W _I instead. In the relationship between one layer and the other layer, the distance between the separation lines is changed in the reverse order so that the width W _O in one layer 25 is paired with the width W _{I in the} other layer 25. The After the separation line is cut, the tape 20 is formed by separating the film 22 along the longitudinal edges 24, 26, the sides 52, and the break line 33.

The adhesive strips 46 and 48 on the bottom 50 of the recesses 36 and 38 can be, for example, pressure sensitive adhesive (PSA), heat activated and microencapsulated adhesive. The adhesive strips 46 and 48, or greater than the depth D _R of the recess 36 and 38, may have a less thickness. Usually, the thickness is equal to or less than the depth D _R. The adhesive stripes 46 and 48, has a width less than or equal to the width _{W R} of the recess 36 and 38. Recesses in the depth less than the depth D _R of the recess 36 and 38, when the cover tape 20 is not applied to the surface (i.e., not under tension), on one side of each of the adhesive strips 46 and 48 A substantially adhesive-free zone extending longitudinally along the bottom 50 of 36 and 38 is provided.

  The breaking mechanisms 32 and 34 are located with respect to the bottom surface 30 of the film 22 and are located adjacent to the recesses 36 and 38 on the side 52 thereof. However, in further embodiments, the breaking mechanisms 32 and 34 can be located almost anywhere along the top surface 28, bottom surface 30, or both sides of the film 22 so long as they each take a width from the longitudinal edge of the film 22. Can be fixed. As shown in FIG. 1, the breaking mechanisms 32 and 34 are continuous scoring lines (split lines) extending in the longitudinal direction along the film 22. The scoring line can be formed by cutting the film 22 (for example, using a laser, a die cutter, or a blade according to the blade scoring procedure described below). In a further embodiment, the breaking mechanisms 32 and 34 may provide a weakened area of the film 22 (eg, thinner areas, micro-perforations, etc.), a transition between the two materials (eg, the first material is the center of the film 22). Part 40 and the second material may constitute the region of the film 22 between the bottom 50 and the top surface 28 of the recesses 36 and 38), or other structure that promotes breakage.

In one embodiment, provided as an example and not a limitation, the cover tape has the following dimensions: The width W _O (measured between the elongated longitudinal edges 24 and 26) of the film 22 is about 2.54 centimeters (1 inch). The thickness T of the film 22 was about 0.0254 millimeters (2 mils) (the thickest portion of the central portion 40 of the film 22 was measured). Recesses 36 and 38 has a width _{W R} and depth _{D R} of about 0.0127 mm (0.5 mil) of about 1 millimeter, respectively (0.0393701 inches). The breaking mechanisms 32 and 34 are split lines (scoring lines) each having a depth of about 0.0381 millimeters (1.5 mils) (measured from the bottom surface 30 of the film 22). It should be appreciated that the dimensions of the cover tape 20 can be changed if desired. For example, the width of the central portion 40 of the film 22 can be selected to be at least as wide as the carrier tape pocket in which the cover tape 20 is used.

  FIG. 2 is a cross-sectional schematic view of another embodiment of a cover tape 80 in accordance with the present invention. The cover tape 80 shown in FIG. 2 is generally similar to the cover tape 20 shown and described in connection with FIG. The cover tape 80 of FIG. 2 further comprises coatings 82 and 84 on the elongate longitudinal edge 24 of the film 22, respectively. The coatings 82 and 84 reduce the likelihood of adhesive sticking to the elongated longitudinal edges 24 and 26, and thus reduce the possibility of undesirable viscous contamination and other problems associated with the exposed adhesive. LAB coating may be used.

  FIG. 3 is a cross-sectional schematic view of another embodiment of a cover tape 90 in accordance with the present invention. The cover tape 90 shown in FIG. 3 is generally similar to the cover tape 20 shown and described in connection with FIG. The cover tape 90 of FIG. 3 further has recessed outer coatings 92 and 94 or recessed inner coatings 96 and 98. Recess outer coatings 92 and 94 lie adjacent to adhesive strips 46 and 48, respectively, and are located at the bottom 50 of recesses 36 and 38 toward the elongate longitudinal edges 24 and 26 of film 22. Recess inner coatings 96 and 98 are located at the bottom 50 of the recesses 36 and 38 adjacent the adhesive strips 46 and 48 and toward the sides 52 of the recesses 36 and 38, respectively. The coatings 92, 94, 96 and 98 are LAB materials or tack free that can prevent contact with undesirable adhesives, for example, by more reliably suppressing the adhesive strips 46 and 48 in the recesses 36 and 38. It can be a material.

  FIG. 4A is a cross-sectional schematic view of a further embodiment of the cover tape 100. Cover tape 100 is generally similar to cover tape 20, but film 22 has a first material 104 and a second material 106. With respect to the cover tape 100, the second material 106 is located in the recesses 36 and 38 (ie, at the top) and extends from the elongated longitudinal edge 24 or 26 to the material interface 108. The central portion 40 of the film 22 is formed between the material interface surfaces 108.

  The material interface 108 exhibits an anchoring or binding force with a weak internal anchoring or binding force of either the first material 104 or the second material 106. The relative weakness of the material interface 108 promotes a substantially constant and uniform break, that is, separation of the first material 104 and the second material 106 at the material interface 108. Thereby, the material interface 108 can form a breaking mechanism.

  The first and second materials 104 and 106 can generally be selected from the same types of materials discussed in connection with FIGS. 1-3 described above. In certain embodiments, the first material 104 may be weaker than the second material 106, or vice versa. In other words, one material may have weaker internal aggregation or adhesion properties than the other material. Further, the central portion 40 of the film 22 can be transparent and highly optically transparent.

  The film 22 of the cover tape 100 can be processed using processes such as coextrusion and profile extrusion. In coextrusion, the first and second materials 104 and 106 are extruded together in the desired arrangement. With profile extrusion, the first and second materials 104 and 106 are individually extruded in the desired shape and combined while still melting after the initial individual extrusion process. Processing can result in undesirable mixing of the first and second materials 104 and 106 at the interface (eg, at the material interface 108 of FIG. 4A). One advantage of this embodiment is that the breaking mechanism does not require scoring.

  FIG. 4B is a cross-sectional schematic view of another embodiment of the cover tape 102. Cover tape 102 is generally similar to cover tape 100, and film 22 has a first material 104 and a second material 106. With respect to the cover tape 102, the second material 106 is processed into elongated edges 110 and 112 that are located near the sides 52 of the recesses 36 and 38, with the first material being the elongated edge 110 of the second material 106. And 112 on one side. The central portion 40 of the film 22 is formed between the elongated edges 110 and 112 of the second material 106.

  The second material 106 is generally weaker than the first material 104. In other words, the second material 106 has weaker internal sticking or bonding properties than the first material 104. This facilitates a constant and uniform break in the film 22 within the elongated edges 110 and 112 of the second material 106. The elongated edges 110 and 112 thus constitute a breaking mechanism. In certain embodiments, the first material 104 can resist breakage. The second material 106 can be of a different weaker form of the first material 104 type, or can be a completely different type of material. The first and second materials can generally be selected from the same types of materials discussed in connection with FIGS. 1-3 above. Further, the weaker second material 106 can be made of ethylene vinyl acetate (EVA). One advantage of this embodiment is that the breaking mechanism does not require scoring.

  FIG. 5 is a schematic cross-sectional view of the cover tape 20 after heating and pressing. In use, the cover tape 20 is positioned so that it touches the surface (eg, it is rolled up) so that tensile and compressive forces act on the tape 20. Heat and pressure slightly deflect the portion of the film 22 on the side of the recesses 36 and 38. Heat and pressure can also cause the adhesive strips 46 and 48 to deform and move. More specifically, heat and pressure can cause the adhesive strips 46 and 48 to change from the first shape 46A and 48A to the second shape 46B and 48B. The first shapes 46A and 48A are generally thicker and generally narrower than the second shapes 46B and 48B. Nevertheless, even after the deformation, the adhesive strips 46 and 48 are substantially contained within the recesses 36 and 38 despite the presence of pressure and heat. In the second shape 46B and 48B, the adhesive strips 46 and 48 are generally spaced from the side 52 of the recesses 36 and 38 and from the elongated edge of the film 22. By having the adhesive strips 46 and 48 substantially in the recesses 36 and 38 (even when deformed by heat or pressure), the cover tape 20 exposes undesirable adhesive or tack in undesirable locations. Without fixing, it can be securely fixed at a desired position. It should be noted that the features of the recesses 36 and 38 are not limited to the specific embodiment of the cover tape shown in FIG.

  In the form of a roll, it is possible to place a cover tape according to the invention. FIG. 6 is a schematic side view of the cross section of the roll 120 portion of the cover tape. The cover tape 20 is wound around a core 122 (eg, a substantially cylindrical cardboard core). In this configuration, the upper surface 28 of the cover tape 20 is substantially smooth and planar, and the roll 120 is generally stable. Further, the side surface 124 of the roll 120 prevents the adhesive from protruding from the cover tape 20 along the side surface 124 of the roll 120 (the adhesive is separated from the side edge of the tape in the recess). Generally non-tacky. The adhesive strips 46 and 48 can be detachably adhered to the top coat (top coating) 42 of the cover tape 20.

  The cover tape can be placed on a roll (eg, roll 120 in FIG. 6) after processing and before being bonded to the carrier tape. The placement of the cover tape on the roll facilitates storage and transport and automatic processing of the cover tape. The top coating on the top surface of the cover tape helps peel the cover tape from the roll.

The cover tape can be used in a carrier tape / cover tape system. FIG. 7 is a perspective view of a carrier tape / cover tape system 130 having a carrier tape 132 and a cover tape 20. The carrier tape 132 has a pair of opposed elongated lip portions 134 and one or more pockets 136. A component 138, such as an electronic component, can be placed in the pocket 136. After the component 138 is desirably placed in the pocket 136 of the carrier tape 132, the cover tape 20 covers the pocket 136 and has an elongated lip portion 134 to have the component 138 between the carrier tape 132 and the cover tape 20. Can be glued. The cover tape 20 can be dispensed from a roll.

  A portion of the cover tape 20 is separated from the system 130 to expose and remove the component 138. As shown in FIG. 7, the central portion 40 of the cover tape 20 formed between the breaking mechanisms 32 and 34 is cut off. The outer portion of the cover tape 20 continues to adhere to the carrier tape 132 after the central portion 40 of the cover tape is cut off. After being cut off, the central portion 40 of the cover tape 20 can be wound up on a roll for disposal or recycling.

  The central portion 40 of the cover tape 20 is separated by break mechanisms 32 and 34 (eg, the dividing line of the embodiment shown and described in connection with FIGS. 1-3). In other embodiments, the material interface (eg, the material interface 108 shown and described in connection with FIG. 4A), the weaker material band (eg, the second shown and described in connection with FIG. 4B). The material 106 is separated at elongated edges (bands) 110 and 112), or other locations depending on the type and location of the breaking mechanism.

  When separating the cover tape portion, it is desirable to have a substantially uniform cutting force. Although lasers or blades can be used to create scoring lines, creating a large number of accurate scoring lines with a difference of less than 0.0254 millimeter (0.001 inch) is too expensive for lasers and blade cutting The use of known blades, which is hindered by differences in edge positioning, is almost impossible.

  In order to achieve uniform cutting with a cover tape having a scoring line, it is desirable to provide a scoring line that has a small depth difference along the length of the cover tape and between distinct scoring lines. . A scoring line having a substantially uniform depth can be easily and efficiently formed in a film web using the method and apparatus described below. The scoring line is typically formed in the film web after the film has been formed in the recesses, but the scoring line can be implemented at other stages of the cover tape processing process. For example, one possible manufacturing process involves forming a plurality of parallel, laterally spaced, longitudinally extending recesses in a large film web. A longitudinal scoring line is then formed in the large film web. A longitudinal adhesive strip is then applied to the recesses in the film (eg, two strips of adhesive strip with one strip in each recess). Finally, the large film web is cut and divided into a plurality of individual cover tape strips by cutting through each recess between the adhesive bands therein.

  FIG. 8 is a schematic side view of a scoring apparatus 200 having web support rollers 202A, 202B and 202C or blade assembly 204. FIG. FIG. 9 is a cross-sectional schematic side view of a blade assembly. The blade assembly 204 has a main structure 206 with a cavity 208 formed along the rear surface 210 and a generally U-shaped opening 212 formed along the front surface 214. Alignment means 218 (e.g., an adjustment micrometer assembly) was provided to accurately align the scoring device relative to the web support roller 202B, e.g., to adjust the scoring depth. In order to maintain a substantially constant scoring depth, it is desirable to reduce the effects of differences in the shape of the web support roller 202B. This can be accomplished by joining one or more scoring depth control rollers 228 to the main structure 206. These scoring depth control rollers 228 are in direct contact with the web support roller 202B, allowing the main structure 206 to follow the contour of the web support roller 202B, which is the difference in scoring depth. Minimize. One or more blades 220 (eg, a conventional metal blade with a linearly tapered cutting edge configured similar to the structure of a single edged razor blade), where the cutting edge 222 of the blade 220 is the front surface 214 of the main structure 206. And is inserted into the cavity 208 so as to contact the precise inner surface 224 (FIG. 9) of the cavity 208 that forms a plane. The blade 220 is biased against the precision inner surface 224 using biasing means such as connections, springs and bumpers (biasing means not shown in FIG. 8). Generally, the central portion of the cutting edge 222 of the blade 220 is exposed through the opening 212 so that the blade 220 can cut the film web material that contacts them.

  The main structure 206 of the blade assembly 204 can be formed of any material (eg, metal, glass, polymer, etc.) such that the precision inner surface 224 rejects cutting by the blade 220. In one embodiment, the main structure 206 is formed of a metallic material that is at least as hard as the blade 220.

  In operation, undivided film 22A passes between web support roller 202B and blade assembly 204. The cutting edge 222 of the blade 220 is adjusted by the alignment means 218 relative to the web support roller 202B so that the desired cutting depth can be achieved. Different cutting depths can be provided for different blades. For example, some blades can provide scoring while other blades simultaneously detach individual cover tape strips from articles having a plurality of connected cover tape strips. However, the cutting to divide individual cover tape strips does not have to be performed simultaneously with scoring.

  After passing through the blade assembly, the just-divided film 22 can be moved to another position for further processing on the web support roller 202C and finally wound on a roll (e.g. Roll 120 shown and described in connection with FIG.

  Multiple dividing lines can be provided to the film simultaneously using the apparatus shown and described in connection with FIGS. FIG. 10 is a schematic rear view of the blade assembly 204. In FIG. 10, the blades are omitted for clarity. A number of lateral spacers 226 are inserted into the cavities 208 of the blade assembly 204. A gap is formed between adjacent spacers so that the blade can be inserted into the gap. The spacer aligns across the width of the film being divided. In addition, the spacer provides the blade with a support that may be thin to increase the rigidity of the blade and promote the formation of a straight and uniform scoring line. The number, size, and placement of the spacers 226 will vary depending on the desired scoring pattern. The spacer 226 can be formed from a metal or polymer material.

  In a further embodiment, the spacer 226 is generally formed with the main structure 206 of the blade assembly 204. In the embodiment described above, the blade alignment plane can be collectively defined by a plurality of fine surfaces formed for each gap.

  In view of the above discussion, a number of advantages and benefits of the present invention should be recognized. One advantage of the cover tape according to the present invention is a highly uniform release force at the central portion of the tape, which eliminates mispicking during storage and transport operations due to parts or components popping out of the carrier pocket of the carrier tape. Reduce the risk of Furthermore, the cover tape solves the winding problems normally encountered with adhesive strip-coated tapes (eg, unstable rolls with slack problems), while the cover tape is more resistant to using adhesive strips. Cost efficiency can be improved. Furthermore, the cover tape of the present invention also reduces the risk of adhesive deposition on the device by “squeezing out” the adhesive by continuing to contain a significant amount of adhesive in the recess before and after the center cut of the tape. it can. It also has a substantially non-flammable side edge when rolled up in roll form, which reduces the risk of contamination when a roll of cover tape is placed on a table or other surface. Furthermore, while forming the cover tape, cutting through the adhesive is not necessary and can lead to a more effective process by avoiding the deposition of adhesive on the cutting device.

  The method and apparatus for film scoring also presents numerous advantages. Scoring can be accomplished in a simple, efficient and cost effective manner. The scoring device of the present invention allows for a substantially uniform scoring depth that is provided with relatively small differences in scoring depth. By using a conventional blade (eg, a blade similar to a single blade razor blade) in the practice of the present invention, the scoring device is relatively simple and the blade and device are relatively inexpensive. Furthermore, it is desirable in cutting or scoring due to individual differences in the blades by aligning the blades directly to the respective cutting edges rather than using blade reference mechanisms (eg notches and holes) that are spaced from the cutting edges. No difference can be reduced.

  Although the invention has been described with reference to several alternative embodiments, those skilled in the art will recognize that changes may be made in form and detail without departing from the spirit and scope of the invention. I will. For example, according to the present invention, various types of breaking mechanisms can be used, and the breaking mechanisms can have various arrangements.

  While the above drawings illustrate some embodiments of the present invention, other embodiments are also contemplated, as described in the discussion. In all cases, this disclosure presents the invention by way of representation and is not meant to be limiting. It should be understood that numerous other modifications and embodiments can be devised by those skilled in the art and are within the scope and spirit of the principles of the present invention. The drawings may not be drawn to scale. Throughout the drawings, like reference numerals are used to denote like parts.

20, 80, 90 Cover tape 22 Film 22A Undivided film 22B Divided film 24, 26 Longitudinal edges 25, 27 Material (layer)
28 Upper surface 29 Scrap material 30 Bottom surface 32, 34 Breaking mechanism 36, 38 Recess 40 Central portion 42 Top coating (upper surface coating)
44 Undercoat 46, 48 Adhesive strips 46A, 48A First shape 46B, 48B Second shape 50 Bottom 52 Side 82, 84 Coating 92, 94 Recess outer coating 96, 98 Recess inner coating 100, 102 Cover tape 104 First One material 106 Second material 108 Material interface 110, 112 Elongated edge (band)
120 roll of cover tape 122 core 124 side of roll 130 carrier tape / cover tape system 132 carrier tape 134 lip portion 136 pocket 138 component 200 scoring device 202A, 202B web support roller 202C web support roller 204 blade assembly 206 The main structure 208 cavity 210 rear 212 opening 214 front 218 alignment means 220 blade 222 blade 224 inner surface 226 spacer 228 scoring depth control rollers _{D R} depth T thickness _{Wo, W I,} W _R width

Claims (23)

An article including a cover tape,
Cover tape
A base film layer with opposed longitudinal edges,
A recess extending along the longitudinal edge,
An article comprising a breaking mechanism substantially parallel to a longitudinal edge and an adhesive applied to a recess.   The article of claim 1, wherein the substrate film layer is made from a material selected from the group consisting of polyethylene terephthalate, polypropylene, polyamide, polyvinyl chloride, polystyrene, polycarbonate, polyethylene, polyacrylonitrile, polyolefin and polyimide. .   The article according to claim 1, wherein the base film layer comprises an alignment film.   The article according to claim 1, wherein the base film layer is transparent.   The article of claim 1, wherein the adhesive is selected from the group consisting of a pressure sensitive adhesive, a heat activated adhesive and a microencapsulated adhesive.   The article according to claim 1, wherein the article can be wound by itself, and the thickness of the adhesive before being wound is not more than the depth of the recess.   The article can be wound on itself, and the adhesive before being wound has an initial thickness that exceeds the depth of the recess, so that the article has a substantially flat contour after being wound. The article of claim 1, which can be moved.   The article according to claim 1, wherein the adhesive has a width equal to or smaller than the width of the recessed portion.   The article of claim 1 wherein the adhesive in each recess is separated from the longitudinal edge of the substrate film layer.   The article of claim 1, wherein the adhesive in each recess is separated from the adjacent breaking mechanism.   The article according to claim 1, further comprising a non-stick material in the recessed portion.   The article of claim 1 comprising two breaking mechanisms, each breaking mechanism being continuous.   The article of claim 1, wherein each breaking mechanism includes a weaker area in the substrate film layer.   The article of claim 1, wherein the substrate film layer includes a first material and a second material, and the breaking mechanism includes a transition between the first material and the second material.   The article of claim 1, wherein the breaking mechanism provides a substantially constant breaking force. And further comprising a carrier tape having a compartment formed therein to hold the component;
The article of claim 1, wherein the cover tape can be adhered to the carrier tape to seal components to the compartment.   The article of claim 1, wherein each recess is open at a longitudinal edge of an adjacent substrate film layer. A cover tape manufacturing method comprising:
Providing a substrate film layer having opposite longitudinal edges;
Forming a recess in the base film layer extending along each longitudinal edge;
Forming a breaking mechanism in the base film layer substantially parallel to the longitudinal edge;
Applying an adhesive to each recess.   19. The method of claim 18, wherein the step of forming the recess comprises a process selected from the group consisting of scoring, extrusion, calendering, microreplication, laser cutting, ultrasound, chemical etching and stripping.   The base film layer comprises a laminated or coextruded two layer material having a weak intermediate surface, and the step of forming a recess includes cutting each layer to the intermediate surface at an offset location; 19. The method of claim 18, comprising separating the two substrate film layer sections from each other along a portion of the cut and the intermediate surface.   The base film layer consists of two layers of an outer layer of laminate or co-extruded material separated by an intermediate layer having a bond strength weaker than the adhesive strength with the outer layer, and forming a recess comprises 19. The method includes the step of cutting at an offset position to the interface with the intermediate layer, and then separating the three layers of the base film layer from each other along the cut portion and part of the intermediate layer. The method described in 1.   19. The method of claim 18, wherein the step of forming a breaking mechanism comprises a process selected from the group consisting of scoring, extrusion, calendering, microreplication, laser cutting, ultrasound, stamping and chemical etching. 19. The step of claim 18, wherein the substrate film layer comprises a first longitudinal film substrate strip having a plurality of longitudinally parallel strips, wherein the step of forming a plurality of parallel cover tapes. Carried out in parallel to
The method of claim 18, further comprising the step of separating adjacent cover tapes.

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