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JP2014065633A - Method for dividing laminated ceramic substrate - Google Patents

Method for dividing laminated ceramic substrate Download PDF

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JP2014065633A
JP2014065633A JP2012212192A JP2012212192A JP2014065633A JP 2014065633 A JP2014065633 A JP 2014065633A JP 2012212192 A JP2012212192 A JP 2012212192A JP 2012212192 A JP2012212192 A JP 2012212192A JP 2014065633 A JP2014065633 A JP 2014065633A
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ceramic substrate
metal film
laminated
scribe
scribe line
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JP6019999B2 (en
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Masakazu Takeda
真和 武田
Kenji Murakami
健二 村上
kenta Tamura
健太 田村
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Mitsuboshi Diamond Industrial Co Ltd
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Priority to TW102112657A priority patent/TWI574806B/en
Priority to CN201310241360.6A priority patent/CN103681294B/en
Priority to KR1020130089236A priority patent/KR101779053B1/en
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    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/07—Cutting armoured, multi-layered, coated or laminated, glass products
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/033—Apparatus for opening score lines in glass sheets
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P40/00—Technologies relating to the processing of minerals
    • Y02P40/50—Glass production, e.g. reusing waste heat during processing or shaping
    • Y02P40/57—Improving the yield, e-g- reduction of reject rates

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Ceramic Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mining & Mineral Resources (AREA)
  • Mechanical Engineering (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Dicing (AREA)
  • Ceramic Products (AREA)

Abstract

PROBLEM TO BE SOLVED: To divide a laminated ceramic substrate formed by laminating a metal film on a ceramic substrate.SOLUTION: A first scribe line S1 is formed on a ceramic substrate 11 of a laminated ceramic substrate 10 along an intended dividing line. Subsequently, a second scribe line S2 is formed by a scribing device at the same position as the first scribe line S1 on a side of a metal film 12. Then, the ceramic substrate is broken along the scribe lines S1 and S2 from a surface on a side of the ceramic substrate 11 and a surface on a side of the metal film 12, respectively. Thus, the laminated ceramic substrate 10 can be completely divided.

Description

本発明はセラミックス基板に金属膜を積層した積層セラミックス基板の分断方法に関するものである。   The present invention relates to a method for dividing a laminated ceramic substrate in which a metal film is laminated on a ceramic substrate.

従来セラミックス基板に金属膜を積層した積層セラミックス基板を分断する場合には、ダイシングソー等を用いて分断することが多かった。又特許文献１にはセラミックス基板をスクライブした後に金属層を接合し、エッチングによりスクライブラインの金属層を除去した後ブレイクするセラミックス接合基板の製造方法が提案されている。   Conventionally, when a laminated ceramic substrate in which a metal film is laminated on a ceramic substrate is divided, it is often divided using a dicing saw or the like. Patent Document 1 proposes a method of manufacturing a ceramic bonded substrate in which a metal layer is bonded after scribing the ceramic substrate, and then the metal layer on the scribe line is removed by etching and then a break is performed.

特開２００９−２５２９７１号公報JP 2009-252971 A

前述した特許文献１ではセラミックス基板に金属薄膜を積層する前にスクライブする必要があり、既に積層された積層セラミックス基板を分断するものではないという問題点があった。   In the above-mentioned Patent Document 1, it is necessary to scribe before laminating a metal thin film on a ceramic substrate, and there is a problem that the laminated ceramic substrate already laminated is not divided.

又積層された積層セラミックス基板を分断するために、図１（ａ）に示すようにセラミックス基板１０１に金属膜１０２を積層した積層基板１００をスクライブしてブレイクする場合について説明する。まず図１（ｂ）に示すようにセラミックス基板１０１の面にスクライビングホイール１０３でスクライブし、図１（ｃ）に示すようにセラミックス基板１０１側からブレイクバー１０４で押圧してブレイクする。この場合にはセラミックス基板１０１は分離できても金属膜１０２は分離されないため、図１（ｄ）に示すようにブレイクを施しても金属膜１０２が分離されずに残存してしまい、完全な分断ができないという問題点があった。   In order to divide the laminated ceramic substrates, a case will be described in which a laminated substrate 100 in which a metal film 102 is laminated on a ceramic substrate 101 is scribed and broken as shown in FIG. First, as shown in FIG. 1B, scribing is performed on the surface of the ceramic substrate 101 by a scribing wheel 103, and as shown in FIG. In this case, even if the ceramic substrate 101 can be separated, the metal film 102 is not separated. Therefore, as shown in FIG. There was a problem that could not.

又他の方法として図２（ａ），（ｂ）に示すように、積層セラミックス基板１００のうち、金属膜１０２の面にスクライビングホイール１０３を用いてスクライブを施す。次いで図２（ｃ）に示すようにブレイクバー１０４を用いて積層セラミックス基板を分断しようとしても、金属膜１０２には十分な垂直クラックが形成されておらず、セラミックス基板１０１側には垂直クラックが生じていない。そのためブレイクすることは難しく、分離できなかったり、図２（ｄ）に示すようにスクライブライン通り分離されることがないという問題点があった。   As another method, as shown in FIGS. 2A and 2B, scribing is performed on the surface of the metal film 102 of the laminated ceramic substrate 100 using a scribing wheel 103. Next, as shown in FIG. 2 (c), even if an attempt is made to divide the laminated ceramic substrate using the break bar 104, sufficient vertical cracks are not formed in the metal film 102, and there are vertical cracks on the ceramic substrate 101 side. It has not occurred. Therefore, there is a problem that it is difficult to break and cannot be separated or separated according to the scribe line as shown in FIG.

本発明はこのような問題点に鑑みてなされたものであって、セラミックス基板に金属膜を積層した積層セラミックス基板を完全に分断し個別化できるようにすることを目的とする。   The present invention has been made in view of such problems, and an object of the present invention is to completely divide and individualize a laminated ceramic substrate in which a metal film is laminated on a ceramic substrate.

この課題を解決するために、本発明の積層セラミックス基板の分断方法は、セラミックス基板に金属膜を積層した積層セラミックス基板の分断方法であって、前記セラミックス基板及び前記金属膜の一方の面に第１のスクライブラインを形成し、前記セラミックス基板及び前記金属膜の他方の面に前記第１のスクライブラインに沿って第２のスクライブラインを形成し、前記第１，第２のスクライブラインに沿って前記セラミックス基板及び金属膜の少なくとも一方をブレイクすることによってスクライブラインに沿ってセラミックス基板を分断するものである。   In order to solve this problem, a method for dividing a laminated ceramic substrate according to the present invention is a method for dividing a laminated ceramic substrate in which a metal film is laminated on a ceramic substrate, and is provided on one surface of the ceramic substrate and the metal film. 1 scribe line is formed, a second scribe line is formed along the first scribe line on the other surface of the ceramic substrate and the metal film, and along the first and second scribe lines. The ceramic substrate is divided along the scribe line by breaking at least one of the ceramic substrate and the metal film.

このような特徴を有する本発明によれば、セラミックス基板に金属膜を積層した積層セラミックス基板を両側からスクライブし少なくとも一方の面からブレイクしている。このため金属膜の剥離を回避することができ、所望の形状に完全に分断し個別化することができ、端面精度を向上させることができるという効果が得られる。   According to the present invention having such characteristics, a laminated ceramic substrate in which a metal film is laminated on a ceramic substrate is scribed from both sides and broken from at least one surface. For this reason, peeling of the metal film can be avoided, and it can be completely divided into a desired shape and individualized, and the effect that the end face accuracy can be improved is obtained.

図１は積層セラミックス基板のセラミックス基板側よりスクライブ及びブレイクする場合の分断処理を示す図である。FIG. 1 is a diagram showing a dividing process when scribing and breaking from the ceramic substrate side of the multilayer ceramic substrate. 図２は積層セラミックス基板の金属膜側よりスクライブしブレイクする際の状態を示す図である。FIG. 2 is a diagram illustrating a state in which a scribe and break are performed from the metal film side of the multilayer ceramic substrate. 図３は本発明の実施の形態による積層セラミックス基板の分断処理を示す図である。FIG. 3 is a diagram showing a dividing process of the multilayer ceramic substrate according to the embodiment of the present invention. 図４は本発明の実施の形態による積層セラミックス基板の分断処理を示す図である。FIG. 4 is a diagram showing a dividing process of the multilayer ceramic substrate according to the embodiment of the present invention.

図３（ａ）はセラミックス基板１１に金属膜１２を施した分断の対象となる積層セラミックス基板（以下、単に積層基板という）１０を示す図である。ここでセラミックス基板１１はＬＴＣＣ基板であってもよく、アルミナや窒化アルミ、チタン酸バリウム、窒化珪素等のセラミックス基板であってもよい。又金属膜１２はニッケル、銀、金、銅及び白金等の薄膜であり、例えば膜厚が１０〜２０μｍとする。このとき金属膜は何らかのパターンが形成されているものであってもよい。このような積層基板１０を所定のパターンで分断する場合に、まず図３（ｂ）に示すようにセラミックス基板１１側より分断を予定するラインに沿って、図示しないスクライブ装置によってスクライビングホイール１３を押圧し転動させてスクライブを形成する。こうして形成したスクライブラインを第１のスクライブラインＳ１とする。このスクライブに用いるスクライビングホイールは、高浸透のスクライブが可能なものを用いることが好ましい。例えば日本国特許文献３０７４１４３号に示されているように、円周面に所定間隔を隔てて多数の溝を形成し、その間を突起として高浸透型としたスクライビングホイールが提案されている。ここではこのようなスクライビングホイールを用いる。   FIG. 3A is a view showing a laminated ceramic substrate (hereinafter simply referred to as a laminated substrate) 10 to be divided by applying a metal film 12 to the ceramic substrate 11. Here, the ceramic substrate 11 may be an LTCC substrate or a ceramic substrate such as alumina, aluminum nitride, barium titanate, or silicon nitride. The metal film 12 is a thin film of nickel, silver, gold, copper, platinum or the like, and has a film thickness of 10 to 20 μm, for example. At this time, the metal film may be formed with some pattern. When dividing such a laminated substrate 10 in a predetermined pattern, first, the scribing wheel 13 is pressed by a scribing device (not shown) along a line scheduled to be divided from the ceramic substrate 11 side as shown in FIG. And roll to form a scribe. The scribe line thus formed is defined as a first scribe line S1. The scribing wheel used for this scribing is preferably a scribing wheel capable of highly penetrating scribing. For example, as disclosed in Japanese Patent No. 3074143, a scribing wheel is proposed in which a large number of grooves are formed on a circumferential surface at predetermined intervals, and a high penetration type is formed with protrusions therebetween. Here, such a scribing wheel is used.

更に積層基板１０を反転させ、図３（ｃ）に示すように金属膜１２の面よりスクライブラインＳ１の真上から図示しないスクライブ装置によってスクライブを形成する。こうして形成したスクライブラインを第２のスクライブラインＳ２とする。この場合には高浸透のスクライブが可能なスクライビングホイールを用いる必要はなく、ノーマルのスクライビングホイール１４を用いることが好ましい。   Further, the laminated substrate 10 is inverted, and a scribe is formed from the surface of the metal film 12 directly above the scribe line S1 by a scribe device (not shown) as shown in FIG. The scribe line thus formed is referred to as a second scribe line S2. In this case, it is not necessary to use a scribing wheel capable of highly penetrating scribe, and a normal scribing wheel 14 is preferably used.

次いで図３（ｄ）に示すように、支持部材１５，１６の上面にテープ１７を配置し、ブレイク装置を用いて一対の支持部材１５，１６の中間にスクライブラインＳ１，Ｓ２が位置するように積層基板１０を配置する。そしてその上部より第２のスクライブラインＳ２に沿ってブレイクバー１８を押し下げブレイクを行う。更に図４（ｅ）に示すように積層基板１０を反転し、支持部材１５，１６の上面にテープ１９を配置し、金属膜１２側をブレイク装置の支持部材１５，１６に載せてスクライブラインＳ１に沿ってブレイクバー１７を押し下げてブレイクする。こうすれば図４（ｆ）に示すように、積層基板をスクライブラインＳ１，Ｓ２に沿って完全に分断し個別化することができ、端面精度を向上させることができる。この積層セラミックス基板の分断を格子状に行うことによって個別の積層基板チップを形成することができる。   Next, as shown in FIG. 3 (d), the tape 17 is disposed on the upper surfaces of the support members 15 and 16, and the scribe lines S1 and S2 are positioned between the pair of support members 15 and 16 using a break device. The laminated substrate 10 is disposed. Then, a break is performed by pushing down the break bar 18 along the second scribe line S2 from above. Further, as shown in FIG. 4 (e), the laminated substrate 10 is inverted, the tape 19 is disposed on the upper surfaces of the support members 15 and 16, and the metal film 12 side is placed on the support members 15 and 16 of the breaking device, and the scribe line S1 is placed. The break bar 17 is pushed down along the line. In this way, as shown in FIG. 4 (f), the laminated substrate can be completely divided and individualized along the scribe lines S1 and S2, and the end face accuracy can be improved. Individual laminated substrate chips can be formed by dividing the laminated ceramic substrate into a lattice shape.

尚、前述した実施の形態では、図３（ｂ），（ｃ）に示すようにセラミックス面をスクライブし、次いで金属面をスクライブするようにしているが、先に金属面をスクライブし、その後セラミックス面をスクライブしてもよい。   In the above-described embodiment, the ceramic surface is scribed and then the metal surface is scribed as shown in FIGS. 3B and 3C. However, the metal surface is first scribed, and then the ceramic surface is scribed. You may scribe the face.

又前述した例では図３（ｄ）及び図４（ｅ）に示すように、セラミックス基板側からと金属膜側の両側からブレイク装置でブレイクするようにしているが、金属膜の種類や厚みによっては一方のブレイクを行うことで分断が可能となる。例えばセラミックス基板１１にスクライブラインＳ１に沿って十分深くスクライブが浸透している場合や、金属膜１２が十分薄い場合は、いずれか一方の面からブレイクすることにより分断し個別化することができる。   In the above-described example, as shown in FIGS. 3D and 4E, the breaker is used to break from the ceramic substrate side and from both sides of the metal film side, but depending on the type and thickness of the metal film. Can be divided by performing one break. For example, when the scribe has penetrated the ceramic substrate 11 sufficiently deep along the scribe line S1 or when the metal film 12 is sufficiently thin, the ceramic substrate 11 can be divided and individualized by breaking from one of the surfaces.

本発明はセラミックス基板に金属膜を積層した積層基板をスクライブ装置とブレイク装置を用いて容易に分断することができ、微小な積層基板の製造に有効である。   INDUSTRIAL APPLICABILITY The present invention can easily divide a laminated substrate obtained by laminating a metal film on a ceramic substrate using a scribe device and a break device, and is effective in manufacturing a minute laminated substrate.

１０ 積層セラミックス基板
１１ セラミックス基板
１２ 金属膜
１３，１４ スクライビングホイール
１５，１６ 支持部材
１７，１９ テープ
１８ ブレイクバー DESCRIPTION OF SYMBOLS 10 Multilayer ceramic substrate 11 Ceramic substrate 12 Metal film 13, 14 Scribing wheel 15, 16 Support member 17, 19 Tape 18 Break bar

Claims (1)

セラミックス基板に金属膜を積層した積層セラミックス基板の分断方法であって、
前記セラミックス基板及び前記金属膜の一方の面に第１のスクライブラインを形成し、
前記セラミックス基板及び前記金属膜の他方の面に前記第１のスクライブラインに沿って第２のスクライブラインを形成し、
前記第１，第２のスクライブラインに沿って前記セラミックス基板及び金属膜の少なくとも一方をブレイクすることによってスクライブラインに沿ってセラミックス基板を分断する積層セラミックス基板の分断方法。 A method for dividing a laminated ceramic substrate in which a metal film is laminated on a ceramic substrate,
Forming a first scribe line on one surface of the ceramic substrate and the metal film;
Forming a second scribe line along the first scribe line on the other surface of the ceramic substrate and the metal film;
A method for dividing a multilayer ceramic substrate, wherein the ceramic substrate is divided along the scribe line by breaking at least one of the ceramic substrate and the metal film along the first and second scribe lines.
JP2012212192A 2012-09-26 2012-09-26 Method for dividing laminated ceramic substrate Active JP6019999B2 (en)

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JP2012212192A JP6019999B2 (en) 2012-09-26 2012-09-26 Method for dividing laminated ceramic substrate
TW102112657A TWI574806B (en) 2012-09-26 2013-04-10 Disassembly method of laminated ceramic substrate
CN201310241360.6A CN103681294B (en) 2012-09-26 2013-06-13 Lamination ceramic substrate breaking method
KR1020130089236A KR101779053B1 (en) 2012-09-26 2013-07-29 Method for dividing multi-layered ceramic substrate

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JP2012212192A JP6019999B2 (en) 2012-09-26 2012-09-26 Method for dividing laminated ceramic substrate

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JP6019999B2 JP6019999B2 (en) 2016-11-02

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JPWO2015174216A1 (en) * 2014-05-14 2017-04-20 旭硝子株式会社 COMPOSITE, LAMINATE, ELECTRONIC DEVICE, AND METHOD FOR PRODUCING THEM
CN107009524A (en) * 2015-09-29 2017-08-04 三星钻石工业股份有限公司 The method for cutting of brittle base
WO2019082736A1 (en) * 2017-10-27 2019-05-02 三星ダイヤモンド工業株式会社 Method for segmenting substrate having metal film

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JP6481465B2 (en) * 2014-08-21 2019-03-13 三星ダイヤモンド工業株式会社 Breaking method of composite substrate
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