JP2013148500A - Electronic component characteristic measuring jig - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an electronic component measuring jig capable of improving jamming of projections of a probe sheet and deflection of a sheet body of the probe sheet.SOLUTION: A recessed part 34 facing a center part of a sheet body 21 of a probe sheet 20 with projections 24 formed and an opening 32s facing a peripheral part of the sheet body 21 of the probe sheet 20 are formed on a principal plane 30a of a support member 30. A buffer member 38 that is more elastically deformable than the support member 30 is arranged in the recessed part 34. The probe sheet 20 is adsorbed and fixed to the principal 30a of the support member 30 by vacuum suction from the opening 32s of the support member 30. The buffer member 38 is elastically deformed when an electronic component 2 is pressed to the probe sheet 20 such that an external connecting terminal 4 of the electronic component 2 is brought into contact with the projections 24 of the probe sheet 20.

Description

  The present invention relates to an electronic component characteristic measurement jig, and more particularly, to an electronic component characteristic measurement jig provided with a probe sheet on which a protrusion for electrical connection with an external connection terminal of the electronic component is formed.

  When measuring the characteristics of an unpackaged bare chip or CSP (Chip Size Package) electronic component, the electronic component is mounted on the electronic component characteristic measuring jig and the electronic component is measured via the electronic component characteristic measuring jig. The external connection terminal and the measuring device are electrically connected.

  For example, as shown in FIGS. 5 and 6, the electronic component characteristic measurement jig includes a probe on which a protrusion for connecting to an external connection terminal of an electronic component to be measured is formed. FIG. 5 is a plan view of the probe 100. 6 is a cross-sectional view taken along line AA in FIG. As shown in FIGS. 5 and 6, a wiring pattern 111 is formed on an insulating substrate (insulating sheet) 110 such as polyimide by a conductive thin film such as copper foil. On the wiring pattern 111, plating protrusions 112 are formed. The plating protrusion 112 is a set of a plurality of small plating protrusions 112a and 112b that contact one external connection terminal such as a chip or a solder ball of an electronic component to ensure electrical conduction (for example, Patent Document 1).

JP 2001-298059 A

  Instead of a highly rigid substrate, a probe sheet is provided in which a protrusion is formed on a sheet body that is flexible and easily bends so as to be electrically connected to an external connection terminal of an electronic component to be measured.

  When such a probe sheet is attached to an electronic component characteristic measurement jig and the characteristics of an electronic component of a BGA (Ball Grid Array) are measured, there are the following problems.

  (1) When an electronic component having an external connection terminal such as a solder ball or solder bump is pressed against the probe sheet, the protrusion of the probe sheet firmly engages with the external connection terminal of the electronic component so that both are firmly There is a case where a workpiece remaining phenomenon occurs in which the electronic components cannot be separated from the probe sheet by joining. When the workpiece remaining phenomenon occurs, the probe sheet replacement time is advanced. In addition, if a work remaining phenomenon occurs in the process of measuring the characteristics of electronic parts and selecting non-defective products, the misselection rate and the equipment operation rate will deteriorate.

  (2) When the electronic component is pressed against the probe sheet, the protrusion on the probe sheet sandwiches the external connection terminal of the electronic component. When the electronic component is separated from the probe sheet, the protrusion on the probe sheet Cannot be disconnected from the external connection terminals of electronic components. When the electronic component is separated from the probe sheet, the probe sheet is pulled through the protrusion to lift the sheet main body, and then the sheet main body is restored when the protrusion is detached from the external connection terminal of the electronic component. Thus, when a deflection | deviation generate | occur | produces in the sheet | seat main body of a probe sheet, a stress will act on protrusion of a probe sheet. Therefore, fatigue repetition (crack) occurs in the protrusion of the probe sheet due to repeated measurement, and electrical measurement cannot be performed.

  (3) If deflection of the probe sheet main body occurs when the electronic component is moved away from the probe sheet, the position of the probe sheet shifts, and the position at which the protrusion of the probe sheet contacts the external connection terminal of the electronic component varies. Accuracy is reduced. For this reason, in the process of measuring the characteristics of the electronic components and selecting good products, it is determined that the product is defective even though it is a good product, and the misselection rate (defective rate) increases.

  The problem to be solved by the present invention is to provide an electronic component measuring jig capable of improving the biting of the protrusion of the probe sheet and the deflection of the probe sheet main body in view of the above situation. .

  In order to solve the above-described problems, the present invention provides an electronic component characteristic measuring jig configured as follows.

  The electronic component characteristic measurement jig includes a probe sheet, a support member, and an impact relaxation member. The probe sheet includes a sheet main body and a conductive protrusion formed on one main surface of the sheet main body so that an external connection terminal included in the electronic component to be measured can come into contact therewith. The support member has a main surface facing the other main surface of the sheet main body of the probe sheet, and is disposed around the concave portion facing the sheet main body of the probe sheet on the main surface. The first opening is formed. The said buffer member is arrange | positioned at the said recessed part of the said supporting member, and is more easily elastically deformed than the said supporting member. The probe sheet is fixed to the main surface of the support member by adsorbing the other main surface of the sheet body of the probe sheet by vacuum suction from the first opening of the support member. The buffer member is covered with the sheet body of the probe sheet, and the electronic component is pressed against the probe sheet so that the external connection terminal of the electronic component contacts the protrusion of the probe sheet It is elastically deformed.

  In the above configuration, the probe sheet has the sheet body fixed to the support member by suction. At this time, since the space between the sheet main body and the concave portion of the support member is also in a vacuum state, the sheet main body is also adsorbed.

  According to the above configuration, the impact when the external connection terminal of the electronic component contacts the protrusion of the probe sheet is alleviated by the elastic deformation of the buffer member. Due to this impact relaxation effect, when the electronic component is pressed against the probe sheet, the protrusion of the probe sheet gradually bites into the external connection terminal of the electronic component, and the two are joined without being firmly bitten. At this time, the biting strength of the projection of the probe sheet is smaller than the case where the projection of the probe sheet bites into the external connection terminal of the electronic component without the impact mitigating effect by the buffer member. Therefore, it is possible to prevent the work remaining phenomenon from occurring.

  When the electronic component is pressed against the probe sheet, the protrusion on the probe sheet sandwiches the external connection terminal of the electronic component. When the electronic component is separated from the probe sheet, it is immediately used for external connection of the electronic component. The terminal and the protrusion of the probe sheet are not separated. Therefore, when the electronic component is separated from the probe sheet, the sheet body of the probe sheet is pulled through the protrusion. However, since the sheet main body is adsorbed, even if the sheet main body is pulled through the protrusion, the sheet main body is unlikely to bend. As a result, the fatigue failure of the protrusions on the probe sheet is reduced and the life of the probe sheet is extended. In addition, variation in the contact position between the protrusion of the probe sheet and the external connection terminal of the electronic component is reduced, and the measurement reliability is improved.

  Preferably, a second opening is formed on an inner peripheral surface or a bottom surface of the concave portion of the support member. A gap is formed between the inner peripheral surface of the concave portion of the support member and the buffer member. By vacuum suction from the second opening, the other main surface of the sheet main body of the probe sheet is adsorbed through the gap so as to contact the buffer member.

  In this case, the sheet main body of the probe sheet is more reliably adsorbed via the gap between the inner peripheral surface of the concave portion of the support member and the buffer member, and the occurrence of deflection of the probe main body is further suppressed. it can. As a result, the fatigue failure of the protrusions on the probe sheet is further reduced, and the life of the probe sheet is further extended.

  Preferably, the buffer member has a hardness (Shore A hardness) of 90 or less and greater than 70.

  When the hardness of the buffer member is 90 or less, the impact when the electronic component is pressed against the probe sheet can be sufficiently mitigated. On the other hand, when the hardness of the buffer member is greater than 70, the contact between the external connection terminal of the electronic component and the protrusion of the probe sheet can be sufficiently stabilized when the electronic component is pressed against the probe sheet.

  Preferably, the buffer member is made of rubber.

  In this case, a buffer member having a desired hardness can be easily manufactured as compared with a buffer member such as a bag containing gas or liquid.

  Preferably, the protrusion of the probe sheet is formed so that 10 or less external connection terminals of a BGA (Ball Grid Array) included in the electronic component can be brought into contact with each other.

  Since the work remaining phenomenon is more likely to occur in an electronic component having a smaller number of external connection terminals, a particularly high effect can be obtained.

  According to the present invention, it is possible to improve the biting of the protrusion of the probe sheet and the deflection of the probe sheet main body, to prevent the work remaining phenomenon, to extend the life of the probe sheet, and to improve the measurement reliability. be able to.

It is sectional drawing of the jig | tool for electronic component characteristic measurement. (Example) It is a top view of the jig | tool for an electronic component characteristic measurement. (Example) It is sectional drawing of the jig | tool for electronic component characteristic measurement. (Example) It is sectional drawing of the jig | tool for electronic component characteristic measurement. (Comparative example) It is a top view of a probe board. (Conventional example) It is sectional drawing of a probe board | substrate. (Conventional example)

  Hereinafter, embodiments of the present invention will be described with reference to FIGS.

  First, the structure of the electronic component characteristic measuring jig 10 according to the embodiment of the present invention will be described with reference to FIGS. FIG. 1 is a cross-sectional view schematically showing a configuration of an electronic component characteristic measuring jig 10. FIG. 2 is a plan view of the electronic component characteristic measuring jig 10 taken along line AA of FIG. FIG. 3 is a cross-sectional view of the electronic component characteristic measuring jig 10 taken along line BB in FIG.

  As shown in FIG. 1, the electronic component characteristic measurement jig 10 includes a base plate 12, a support member 30 disposed on the upper surface 12 a of the base plate 12, and a probe sheet 20 disposed on the upper surface 30 a of the support member 30. And. The support member 30 and the probe sheet 20 are positioned by inserting positioning pins 13 fixed to the upper surface 12 a of the base plate 12. A side plate 14 is fixed to the side surface 12 s of the base plate 12. A connector 16 is attached to the side plate 14.

  The support member 30 is formed with first and second through holes 32 and 33 for adsorbing and fixing the probe sheet 20 and a recess 34. The first through hole 32 penetrates the support member 30 and has openings 32 s and 32 t on the upper surface 30 a and the lower surface 30 b of the support member 30. An opening 32 s of the first through hole 32 formed in the upper surface 30 a of the support member 30 is a first opening. The recess 34 has an inner peripheral surface 34 a and a bottom surface 34 b, and an opening 34 s on the upper surface 30 a of the support member 30. The second through hole 33 penetrates the support member 30 and has openings 33 s and 33 t on the bottom surface 34 b of the recess 34 and the lower surface 30 b of the support member 30. An opening 33 s of the second through hole 33 formed in the bottom surface 34 b of the recess 34 is a second opening.

  As shown in FIGS. 1 and 3, the opening 34 s of the recess 34 is formed in a rectangular shape at the center of the upper surface 30 a of the support member 30. Openings 32 s of a plurality of first through holes 32 are formed on the periphery of the upper surface 30 a of the support member 30 so as to surround the openings 34 s of the recesses 34. The second through holes 33 are formed at the four corners of the bottom surface 34 b of the recess 34.

  The support member 30 is formed using a material having an appropriate dielectric constant, for example, a resin so as not to affect the characteristic measurement of the electronic component as much as possible.

  As shown in FIGS. 1 and 2, the probe sheet 20 has wirings 22 formed radially on the upper surface 21a, which is one main surface of a sheet body 21 made of resin or the like, using a metal thin film or the like. One end 22 a of the wiring 22 is disposed at the end of the probe sheet 20 and is electrically connected to the connector 16. The other end 22 b of the wiring 22 is disposed at the center of the probe sheet 20 and faces the recess 34 of the support member 30. On the other end 22b of the wiring 22, a plurality of protrusions 24 are formed by metal plating or the like. A plurality of protrusions 24 (two in the figure) are provided for one external connection terminal 4 in order to be brought into contact with the external connection terminals 4 such as solder bumps and solder balls of the electronic component 2 to be measured. Is formed.

  As shown in FIGS. 1 and 3, a buffer member 38 is disposed in the recess 34 of the support member 30. The upper surface 38 a of the buffer member 38 disposed in the recess 34 is substantially the same height as the upper surface 30 a of the support member 30. That is, the upper surface 38 a of the buffer member 38 may be included in the same plane as the upper surface 30 a of the support member 30, or may slightly protrude from the upper surface 30 a of the support member 30.

  The buffer member 38 is more easily elastically deformed than the support member 30. As the buffer member 38, an elastic member such as rubber or sponge, a bag-like member packed with one or more of gas, liquid, fluid, granular elastic member, and the like can be used. It is preferable to use rubber for the buffer member 38 because the buffer member 38 having a desired hardness (Shore A hardness) can be easily manufactured.

  As shown in FIG. 1, the base plate 12 is formed with a bottomed groove 12 p that opens in the upper surface 12 a of the base plate 12. The bottomed groove 12 p communicates with the first and second through holes 32 and 33 of the support member 30. The bottomed groove 12p communicates with a suction channel 12q formed inside the base plate 12. The suction channel 12q is connected to a vacuum source (not shown) through the vacuum joint 11. The base plate 12 and the support member 30 are in close contact so that vacuum does not leak.

  When the first and second through holes 32, 32 are connected to the vacuum source via the bottomed groove 12p and the suction flow path 12q of the base plate 12, the probe sheet 20 has the first and second through holes. The lower surface 21 b, which is the other main surface of the peripheral portion of the sheet main body 21, is sucked and fixed to the upper surface 30 a of the support member 30. At this time, it is desirable that the upper surface 38a of the buffer member 38 is configured to come into contact with the lower surface 21c of the central portion of the sheet body 21 of the probe sheet 20 on which the protrusions 24 are formed.

  Since the inside of the recess 34 can be vacuum-sucked through the opening 33 s of the second through hole 33 around it, the second through hole 33 communicating directly with the recess 34 is eliminated. It is possible. However, if the second through-hole 33 that communicates directly with the recess 34 is provided, the adsorption force of the probe sheet 20 to the central portion of the sheet body 21 can be easily adjusted.

  The adsorption force with respect to the probe sheet 20 depends on the size, shape, number, and distribution of the first and second through holes 32 and 33 and the recesses 34 formed in the support member 30, and the bottomed groove 12 p formed in the base plate 12. Or the size and shape of the suction channel 12q, the vacuum pressure of the vacuum source, and the like.

  Next, characteristic measurement of the electronic component 2 using the electronic component characteristic measurement jig 10 will be described.

  At the time of measurement, the probe sheet 20 is sucked and fixed to the upper surface 30a of the support member 30 by vacuum suction. Then, as indicated by an arrow 2x in FIG. 1, the electronic component 2 gripped by a handling device (not shown) is lowered, and the electronic connection terminal 4 of the electronic component 2 and the protrusion 24 of the probe sheet 20 are brought into contact with each other. The component 2 is pressed against the probe sheet 20 to stabilize conduction between the external connection terminal 4 of the electronic component 2 and the protrusion 24 of the probe sheet 20. At this time, when the position of the external connection terminal 4 of the descending electronic component 2 is recognized by the image processing apparatus and the position of the electronic component characteristic measuring jig 10 fixed on the stage is corrected, the external connection of the electronic component 2 is performed. The positional deviation between the service terminal 4 and the protrusion 24 of the probe sheet 20 can be suppressed, and the conduction can be further stabilized.

  In a state where the external connection terminal 4 of the electronic component 2 and the protrusion 24 of the probe sheet 20 are in conduction, the characteristics of the electronic component 2 are measured using a measuring device connected through the connector 16. For example, by using a measuring device such as a network analyzer, a signal is input to an external connection terminal 4 of the electronic component 2, and an output from the other external connection terminal 4 of the electronic component 2 is detected. Two characteristics are measured.

  When the electronic component 2 is pressed against the probe sheet 20 and the external connection terminal 4 of the electronic component 2 is brought into contact with the protrusion 24 of the probe sheet 20, the protrusion 24 of the probe sheet 20 contacts the recess 34 of the support member 30. It is supported via the arranged buffer member 38. The buffer member 38 disposed in the recess 34 of the support member 30 is elastically deformed when a force is applied between the external connection terminal 4 of the electronic component 2 and the protrusion 24 of the probe sheet 20.

  Therefore, the external connection terminal 4 of the lowered electronic component 2 hits the protrusion 24 of the probe sheet 20, and the impact when starting contact is alleviated by the elastic deformation of the buffer member 38. Due to this impact mitigating effect, when the electronic component 2 is pressed against the probe sheet 20, the protrusion 24 of the probe sheet 20 gradually bites into the external connection terminal 4 of the electronic component 2 without being firmly bitten. , Both join. At this time, the biting strength of the protrusion 24 of the probe sheet 20 is smaller than that in the case where the protrusion 24 of the probe sheet 20 bites into the external connection terminal 4 of the electronic component 2 without an impact mitigating effect by the buffer member 38. Therefore, it is possible to prevent the work remaining phenomenon from occurring.

  As a result, for example, in the process of measuring non-defective products by measuring the characteristics of electronic components, it is possible to reduce the misselection rate and improve the equipment operation rate.

  When the electronic component 2 is pressed against the probe sheet 20, the protrusion 24 of the probe sheet 20 is in a state of sandwiching the external connection terminal 4 of the electronic component 2. Therefore, when the measurement is finished and the electronic component 2 is separated from the probe sheet 20, the protrusion 24 of the probe sheet 20 does not immediately come off the external connection terminal 4 of the electronic component 2.

  In such a case, if the probe sheet 20 is not vacuum-sucked, the sheet body 21 of the probe sheet 20 moves along with the movement of the electronic component 2 and the probe sheet 20 sandwiching the external connection terminal 4 of the electronic component 2 is inserted. It is pulled by the protrusion 24 and floats up. Thereafter, when the protrusion 24 of the probe sheet 20 is detached from the external connection terminal 4 of the electronic component 2, the sheet body 21 of the probe sheet 20 returns to the original state. When the sheet main body 21 of the probe sheet 20 is bent in this manner, stress is applied to the protrusions 24 of the probe sheet 20, and thus fatigue breakage (cracks) occurs in the protrusions 24 of the probe sheet 20 when measurement is repeated.

  On the other hand, when the probe sheet 20 is vacuum-sucked, the probe sheet 20 does not easily float even if the sheet body 21 is pulled through the protrusion 24 of the probe sheet 20. Deflection is less likely to occur. Therefore, fatigue failure of the protrusion 24 of the probe sheet 20 is suppressed, and the life of the probe sheet 20 is extended. Further, variation in the contact position between the protrusion 24 of the probe sheet 20 and the external connection terminal 4 of the electronic component 2 is reduced, and the measurement reliability is improved.

  The buffer member 38 is formed so as to be appropriately elastically deformed when the electronic component 2 is pressed against the probe sheet 20. That is, the buffer member 38 is softened to such an extent that the shock can be sufficiently mitigated when the electronic component 2 is pressed against the probe sheet 20 (for example, the hardness (Shore A hardness) is 90 or less). On the other hand, when the electronic component 2 is pressed against the probe sheet 20, the contact between the external connection terminal 4 of the electronic component 2 and the protrusion 24 of the probe sheet 20 is sufficiently hardened (for example, Hardness (Shore A hardness) greater than 70).

  Preferably, as shown in FIGS. 1 and 3, a gap 39 is formed between the inner peripheral surface 34 a of the recess 34 of the support member 30 and the buffer member 38. Then, due to vacuum suction from the opening 33 s of the second through-hole 33, the lower surface 21 c that is the other main surface of the center portion of the sheet body 21 of the probe sheet 20 is brought into contact with the upper surface 38 a of the buffer member 38 through the gap 39. Make contact. In this case, the opening of the second through hole 33 may be formed on the inner peripheral surface 34 a of the recess 34.

  If comprised in this way, the center part of the sheet | seat main body 21 of the probe sheet 20 will be more reliably adsorbed via the clearance gap 39 between the internal peripheral surface 34a of the recessed part 34 of the support member 30, and the buffer member 38, and a probe sheet | seat. The occurrence of deflection of the 20 seat bodies 21 can be further suppressed. As a result, fatigue failure of the protrusions 24 of the probe sheet 20 is further reduced, and the life of the probe sheet 20 is further extended.

  Next, an example of manufacturing the electronic component characteristic measuring jig 10 will be described.

  In the production example, a probe sheet 20 having a total thickness of 60 μm in which a protrusion 24 is formed by metal plating at the center of a resin sheet main body 21 and a resin support member 30 having a thickness of 2.4 mm are formed on an aluminum base plate 12. Positioning is performed by a stainless steel positioning pin 13 having a diameter of 1 mm, which is fixed by press-fitting and arranged at a pitch of 21 mm.

  The support member 30 has a recess 34 of 8 mm × 5.2 mm × depth 0.51 mm. In the recess 34, urethane rubber having a thickness of 0.5 mm and a Shore hardness A90 is bonded and fixed to the bottom surface 34 b of the recess 34 with a double-sided tape as the buffer member 38.

  In the support member 30, second through holes 33 having a diameter of 1 mm are formed at four corners of the recess 34 as a vacuum path. In addition, a first through hole 32 having a diameter of 0.4 mm is formed around the concave portion 34 in a range of about 16 mm × 8 mm centering on the concave portion 34 and arranged at a pitch of 1 mm in each length and width.

  The base plate 12 is formed with a bottomed groove 12p and a suction channel 12q as a vacuum path, and the suction channel 12q is connected to one vacuum joint 11 in the base plate 12. One end of a 6 mm diameter urethane tube is connected to the vacuum joint 11, and the other end of this urethane tube is connected to a vacuum source.

  Between the vacuum source and the vacuum joint 11, that is, in the middle position of the urethane tube, a speed controller for managing the vacuum pressure is installed, or a vacuum control device is connected, and the vacuum pressure is in the range of -10 kPa to -60 kPa. It is desirable to manage within. It is more desirable to manage within the range of −10 kPa to −20 kPa.

  By vacuuming, the inside of the recess 34 of the support member 30 where the urethane rubber cushioning member 38 is disposed is in a vacuum tank state, and the central portion of the probe sheet 20 adsorbed by vacuum suction is supported by the urethane rubber cushioning member 38. Is done. The peripheral portion of the probe sheet 20 is adsorbed and held on the upper surface 30a of the support member 30 through the first through hole 32 having a diameter of 0.4 mm.

  As a comparative example, an electronic component characteristic measuring jig 10x shown in FIG. 4 was produced. In the electronic component characteristic measurement jig 10x of the comparative example, a support member 30x in which no through hole or recess is formed is disposed on a base plate 12x in which a bottomed groove or a suction channel is not formed. Both ends of the probe sheet 20 disposed on the upper surface 20s of the support member 30x are sandwiched and fixed between the pressing member 15 and the upper surface 20s of the support member 30x. The probe sheet 20 and the pressing member 15 are positioned by positioning pins 13. Other configurations are the same as those in the manufacturing example.

  Using the electronic component characteristic measuring jigs of the production example and the comparative example, the characteristics were measured for a plurality of BGA type wafer level CSP electronic components having four solder bumps as external connection terminals.

  The electronic part property measurement jig of the production example had a lower misselection rate than the electronic component property measurement jig of the comparative example. This is because the workpiece remaining phenomenon occurred in the comparative example, while in the production example, the urethane rubber cushioning member 38 suppressed the strong biting of the protrusion of the probe sheet into the solder bump of the external connection terminal, This is because the work remaining phenomenon no longer occurs.

  The lifetime of the probe sheet (the number of contact between the external connection terminal of the electronic component and the protrusion of the probe sheet until the characteristic measurement of the electronic component cannot be performed) is 100,000 times in the comparative example, and 400,000 times in the production example. Met. In the production example, since the probe sheet is constantly adsorbed and fixed, there is almost no deflection of the sheet body of the probe sheet, so that the stress acting on the protrusion of the probe sheet can be suppressed and the occurrence of fatigue failure (crack) can be prevented. Compared with the comparative example, the durability of the probe sheet was improved.

  When measuring multiple electronic components, the percentage of non-defective products is higher when using the electronic component characteristic measurement jig of the production example than when using the electronic component characteristic measurement jig of the comparative example. It was. In the production example, since the probe sheet is constantly adsorbed and fixed, there is almost no deflection of the probe sheet main body, so that a slight misalignment of the protrusion of the probe sheet is suppressed, and the reproducibility of the contact position compared to the comparative example This is because of the increase.

  <Summary> As described above, the probe sheet is adsorbed by vacuum suction and fixed to the support member, and a buffer member that is easily elastically deformed is disposed in the recess provided in the support member corresponding to the protrusion of the probe sheet. And elastically support the protrusion. As a result, the protrusion of the probe sheet protrusion and the deflection of the probe sheet main body can be improved, the work remaining phenomenon can be prevented, the probe sheet can be extended, and the measurement reliability can be improved. .

  The present invention is not limited to the above embodiment, and can be implemented with various modifications.

  For example, although an electronic component measurement jig used for an electronic component having four external connection terminals has been illustrated, the number of external measurement terminals of the electronic component is not limited thereto. In particular, the electronic component characteristic measuring jig of the present invention can be suitably applied to an electronic component having 10 or less BGA external connection terminals. This is because the work remaining phenomenon is more likely to occur in an electronic component having a smaller number of external connection terminals, and thus a particularly high effect can be obtained.

2 Electronic component 4 External connection terminal 10, 10x Electronic component characteristic measurement jig 11 Vacuum joint 12, 12x Base plate 12a Top surface 12p Bottomed groove 12q Suction channel 12s Side surface 13 Positioning pin 14 Side plate 15 Holding member 16 Connector 20 Probe Sheet 20s Upper surface 21 Sheet body 21a Upper surface (one main surface)
21b, 21c Lower surface (the other main surface)
22 Wiring 22a, 22b End 24 Protrusion 30 Support member 30a Upper surface (main surface)
30b Lower surface 30x Support member 32 First through hole 32s Opening (first opening)
32t opening 33 second through hole 33s opening (second opening)
33t opening 34 recess 34a inner peripheral surface 34b bottom surface 34s opening 38 buffer member 38a upper surface 39 gap

Claims (5)

A probe sheet including a sheet main body and a conductive protrusion formed on one main surface of the sheet main body so that an external connection terminal included in the electronic component to be measured can abut;
The probe sheet has a main surface facing the other main surface of the sheet main body, and a concave portion facing the sheet main body of the probe sheet on the main surface, and a first opening disposed around the concave portion A support member formed with
A cushioning member disposed in the recess of the support member and more easily elastically deformed than the support member;
With
The probe sheet is fixed to the main surface of the support member by sucking the other main surface of the sheet body of the probe sheet by vacuum suction from the first opening of the support member,
The buffer member is covered with the sheet body of the probe sheet, and the electronic component is pressed against the probe sheet so that the external connection terminal of the electronic component contacts the protrusion of the probe sheet An electronic component characteristic measuring jig characterized by being elastically deformed. A second opening is formed on the inner peripheral surface or the bottom surface of the recess of the support member;
A gap is formed between the inner peripheral surface of the concave portion of the support member and the buffer member,
The vacuum suction from the second opening causes the other main surface of the sheet main body of the probe sheet to be adsorbed through the gap so as to contact the buffer member. The electronic component characteristic measuring jig described in 1.   3. The electronic component characteristic measuring jig according to claim 1, wherein a hardness (Shore A hardness) of the buffer member is 90 or less and greater than 70. 4.   The electronic component characteristic measurement jig according to claim 1, wherein the buffer member is made of rubber.   5. The projection according to claim 1, wherein the protrusion of the probe sheet is formed so that 10 or less external connection terminals of a BGA included in the electronic component can be brought into contact with each other. The electronic component characteristic measuring jig described in 1.

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