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JP2013093192A - Holder for semiconductor light-emitting element, semiconductor light-emitting element module, and lighting fixture - Google Patents

Holder for semiconductor light-emitting element, semiconductor light-emitting element module, and lighting fixture Download PDF

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JP2013093192A
JP2013093192A JP2011234171A JP2011234171A JP2013093192A JP 2013093192 A JP2013093192 A JP 2013093192A JP 2011234171 A JP2011234171 A JP 2011234171A JP 2011234171 A JP2011234171 A JP 2011234171A JP 2013093192 A JP2013093192 A JP 2013093192A
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semiconductor light
emitting element
substrate
light emitting
holder
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JP5499005B2 (en
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Hiroki Sadatoku
宏樹 貞徳
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Kyocera Connector Products Corp
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Kyocera Connector Products Corp
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Priority to KR1020110134100A priority patent/KR101305021B1/en
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    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00Fastening of light sources or lamp holders
    • F21V19/001Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F21V19/003Fastening of light source holders, e.g. of circuit boards or substrates holding light sources
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21KNON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20Light sources comprising attachment means
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)

Abstract

PROBLEM TO BE SOLVED: To provide a holder for a semiconductor light-emitting element capable of fixing a semiconductor light-emitting element unit and power-feeding contacts to other member and scarce fear of causing damage, deformation or the like when fixing to the other member, as well as a module and a lighting fixture.SOLUTION: The holder for a semiconductor light-emitting element includes: case bodies 20, 60 internally having a storage space where a semiconductor light-emitting element unit 70 as an integrated object of semiconductor light-emitting elements and a substrate 71 can be arranged; an illumination opening 21 for making the semiconductor light-emitting elements formed on the case bodies exposed to an outside the case bodies; a substrate-exposing opening 62 which is formed on the case body and can be inserted with the semiconductor light-emitting elements located at the outside at a storage space side and exposing the substrate arranged in the storage space to the outside; substrate-holding sections 39, 51, 55 formed on the case body and supporting the substrate so as to make the substrate stay in the storage space; and the contacts 40, 50 supported on insulated parts of the case body while it is located in the storage space and electrically conducted to the substrate and a power source.

Description

本発明は、半導体発光素子(LED)を取付可能な半導体発光素子用ホルダ、半導体発光素子モジュール、及び、照明器具に関する。   The present invention relates to a semiconductor light-emitting element holder to which a semiconductor light-emitting element (LED) can be attached, a semiconductor light-emitting element module, and a lighting fixture.

高輝度タイプの一つの半導体発光素子(LED)を利用した照明器具の従来例としては、例えば、ベース部材と、ベース部材に固定した金属製のシャシー(放熱部材)と、シャシーに取り付けた、LEDと基板の一体物であるLEDユニットと、基板の表面に取り付けた、基板及び電源と電気的に導通する(コンタクトを具備する)コネクタと、シャシーとの間で基板及びコネクタを挟持した状態でシャシーに固定した金属製フレームと、LEDユニットを囲んだ状態でベース部材に固定した、LEDが発した照明光が透過可能な投光性カバー部材と、を具備するものが知られている。
電源で発生した電力をコネクタ(コンタクト)を介して基板に供給するとLEDが発光し、発光した照明光は投光性カバー部材を透過して投光性カバー部材の外側に照射される。さらにLEDユニットの基板がシャシーに接触しており、LEDの発光時に生じる熱は基板を介してシャシーに効率よく伝達されシャシーから放熱されるので、LEDが極度に高温化してLEDの発光効率が低下するのを防止できる。
As a conventional example of a lighting fixture using one semiconductor light emitting device (LED) of high brightness type, for example, a base member, a metal chassis (heat radiating member) fixed to the base member, and an LED attached to the chassis The chassis in a state where the board and the connector are sandwiched between the LED unit that is an integrated body of the board and the board, the connector that is electrically connected to the board and the power source (provided with contacts), and the chassis. A metal frame fixed to a base member and a light projecting cover member fixed to a base member in a state of surrounding the LED unit and capable of transmitting illumination light emitted from the LED are known.
When the electric power generated by the power source is supplied to the substrate through the connector (contact), the LED emits light, and the emitted illumination light passes through the light projecting cover member and is irradiated to the outside of the light projecting cover member. Furthermore, the substrate of the LED unit is in contact with the chassis, and the heat generated when the LED emits light is efficiently transmitted to the chassis through the substrate and dissipated from the chassis, so the LED becomes extremely hot and the LED's luminous efficiency decreases. Can be prevented.

特開2011−91037号公報JP 2011-91037 A

しかし上記照明器具には以下の欠点がある。
即ち、LEDユニット及びコネクタをシャシーに固定する場合は、まずLEDユニットをシャシー上に載置した上でLEDユニットの基板上にコネクタを仮置きし、この状態でコネクタに被せた金属製フレームを固定ボルトによってシャシー及びコネクタに固定する必要がある。
しかし、金属製フレームを固定ボルトによってシャシー及びコネクタに固定するとき、LEDユニット及びコネクタはシャシーに対して相対移動可能なので、金属製フレームの固定作業は容易でない。
しかも、LEDユニット及びコネクタ(コンタクト)をシャシーに固定するためには、LEDユニットをシャシー上に載置するステップ、基板上にコネクタを仮置きするステップ、金属製フレームをコネクタに被せるステップ、及び、金属製フレームを固定ボルトによってシャシーに固定するステップ、という4つの工程が必要になってしまう。
また、LEDユニット及びコネクタをシャシーに固定するときに、金属製フレーム等によってLEDを傷付けてしまうおそれがある。
さらにLEDユニット及びコネクタを金属製フレーム及び固定ボルトを利用してシャシーに固定するときに、固定ボルトによる固定力(負荷)が金属製フレームを介してLEDユニット(基板)及びコネクタに掛かり、これらの部材に変形等を引き起こすおそれがある。
However, the above lighting fixture has the following drawbacks.
In other words, when fixing the LED unit and connector to the chassis, first place the LED unit on the chassis, then temporarily place the connector on the board of the LED unit, and fix the metal frame that covers the connector in this state. It must be fixed to the chassis and connector by bolts.
However, when the metal frame is fixed to the chassis and the connector by the fixing bolt, the LED unit and the connector can be moved relative to the chassis, so that the fixing operation of the metal frame is not easy.
Moreover, in order to fix the LED unit and the connector (contact) to the chassis, a step of placing the LED unit on the chassis, a step of temporarily placing the connector on the substrate, a step of covering the connector with a metal frame, and Four steps of fixing the metal frame to the chassis with fixing bolts are required.
Further, when the LED unit and the connector are fixed to the chassis, the LED may be damaged by a metal frame or the like.
Furthermore, when the LED unit and the connector are fixed to the chassis using the metal frame and the fixing bolt, the fixing force (load) by the fixing bolt is applied to the LED unit (board) and the connector via the metal frame, and these There is a risk of causing deformation or the like in the member.

本発明の目的は、半導体発光素子と基板の一体物である半導体発光素子ユニットと、基板に対して電力を供給するコンタクトとを別部材に対して簡単かつ少ない工程で固定可能であり、しかも別部材への固定時に半導体発光素子を傷付けたり、半導体発光素子ユニットやコンタクトに変形等を引き起こすおそれが小さい半導体発光素子用ホルダ、半導体発光素子モジュール、及び、照明器具を提供することにある。   It is an object of the present invention to fix a semiconductor light emitting element unit, which is an integrated body of a semiconductor light emitting element and a substrate, and a contact for supplying power to the substrate to another member in a simple and few process. An object of the present invention is to provide a semiconductor light-emitting element holder, a semiconductor light-emitting element module, and a lighting fixture that are less likely to damage a semiconductor light-emitting element or fix the semiconductor light-emitting element unit or contact when it is fixed to a member.

本発明の半導体発光素子用ホルダは、半導体発光素子と基板の一体物である半導体発光素子ユニットを配置可能な収容空間を内部に有するケース本体と、該ケース本体に形成した、上記収容空間に配置した上記半導体発光素子を上記ケース本体の外側に露出させる照明用開口と、上記ケース本体に形成した、外側に位置する上記半導体発光素子が上記収容空間側に挿通可能で、かつ上記収容空間に配置した上記基板を外側に露出させる基板露出用開口と、上記ケース本体に形成した、上記収容空間に配置した上記基板を該収容空間に留めるように支持する基板保持部と、上記収容空間に位置する状態で上記ケース本体の絶縁部に支持させた、上記基板及び電源と電気的に導通可能なコンタクトと、を備えることを特徴としている。   A holder for a semiconductor light emitting device according to the present invention is disposed in a housing body having a housing space in which a semiconductor light emitting device unit that is an integrated body of a semiconductor light emitting device and a substrate can be placed, and the housing space formed in the case body The opening for illumination that exposes the semiconductor light emitting element to the outside of the case body, and the semiconductor light emitting element that is formed on the case body and that is positioned outside can be inserted into the housing space and disposed in the housing space A substrate exposure opening that exposes the substrate to the outside, a substrate holding portion that is formed in the case body and supports the substrate disposed in the accommodation space so as to be retained in the accommodation space, and is located in the accommodation space. And a contact electrically supported by the substrate and the power source, supported by the insulating part of the case body in a state.

上記ケース本体が、上記コンタクトを支持するインシュレータと、該インシュレータに対して取り付けることにより、該インシュレータとの間で上記収容空間を形成するカバー部材と、を具備していてもよい。   The case body may include an insulator that supports the contact, and a cover member that is attached to the insulator to form the housing space with the insulator.

上記ケース本体の外面に上記照明用開口の外周側に位置させて形成した、上記半導体発光素子が発した照明光を反射する、外周側から内周側に向かうにつれて該外面側から上記収容空間側に近づく形状のテーパ状反射面を備えていてもよい。
上記基板保持部が、上記基板露出用開口より外側に突出しかつ上記基板の外面を支持する係合爪であってもよい。
Reflecting the illumination light emitted from the semiconductor light emitting element formed on the outer surface of the case body on the outer peripheral side of the illumination opening, from the outer surface side toward the inner peripheral side, toward the housing space side You may provide the taper-shaped reflective surface of the shape which approaches.
The substrate holding part may be an engaging claw that protrudes outward from the substrate exposure opening and supports the outer surface of the substrate.

本発明の半導体発光素子用モジュールは、上記半導体発光素子用ホルダと、上記収容空間に配置した上記半導体発光素子ユニットと、を備えることを特徴としている。   A module for a semiconductor light emitting element according to the present invention is characterized by comprising the above-mentioned holder for a semiconductor light emitting element and the above semiconductor light emitting element unit disposed in the accommodation space.

本発明の照明器具は、半導体発光素子モジュールと、上記基板露出用開口から外部に露出した上記基板に接触する放熱部材と、上記半導体発光素子が発した照明光が透過可能で、かつ上記半導体発光素子ホルダを囲む投光性カバー部材と、を備えることを特徴としている。   The luminaire of the present invention includes a semiconductor light emitting element module, a heat radiating member that contacts the substrate exposed to the outside through the substrate exposure opening, the illumination light emitted by the semiconductor light emitting element can be transmitted, and the semiconductor light emitting device. And a light projecting cover member surrounding the element holder.

本発明の半導体発光素子用ホルダは、半導体発光素子ユニット及びコンタクトと一体化した状態(半導体発光素子ユニット及びコンタクトが相対移動しない状態)で別部材(例えば放熱部材)に固定できるので、本発明によれば半導体発光素子ユニット及びコンタクトを別の部材に対して簡単に固定できる。
しかも半導体発光素子用ホルダと半導体発光素子ユニットを予め一体化した上で、半導体発光素子用ホルダを別部材に固定できるので、少ない工程で別部材に対して固定可能である。そのため、古い半導体発光素子ユニットを新しいものと交換するときのメンテナンスが容易である。
また、半導体発光素子ユニット及びコンタクトの周囲を半導体発光素子用ホルダで覆ってあるので、半導体発光素子用ホルダを別部材に対して固定するときに半導体発光素子が他の部材と接触して傷付くおそれは小さい。さらに例えば固定ボルトによって半導体発光素子用ホルダを別部材に固定するときに、固定ボルトによる固定力(負荷)が半導体発光素子ユニットやコンタクトに及ばないので、これらの部材に変形等が生じることがない。そのため歩留まりが良く、かつ耐用期間が長くすることが可能である。
さらに半導体発光素子ユニットの基板を基板露出用開口を通して外側に露出させているので、半導体発光素子の熱が伝わり易い基板を放熱部材に接触させることにより、半導体発光素子の熱を外部に効率よく放熱できる。そのため高温化による半導体発光素子の発光効率の低下を防ぐことが可能である。
Since the holder for a semiconductor light emitting device of the present invention can be fixed to another member (for example, a heat dissipation member) in a state of being integrated with the semiconductor light emitting device unit and the contact (the semiconductor light emitting device unit and the contact are not relatively moved), Therefore, the semiconductor light emitting element unit and the contact can be easily fixed to another member.
In addition, since the semiconductor light emitting element holder and the semiconductor light emitting element unit are integrated in advance and the semiconductor light emitting element holder can be fixed to another member, it can be fixed to the other member with a small number of steps. Therefore, maintenance when replacing the old semiconductor light emitting element unit with a new one is easy.
Moreover, since the periphery of the semiconductor light emitting element unit and the contact is covered with the semiconductor light emitting element holder, the semiconductor light emitting element comes into contact with other members and is damaged when the semiconductor light emitting element holder is fixed to another member. The fear is small. Further, for example, when the semiconductor light emitting element holder is fixed to another member by a fixing bolt, the fixing force (load) by the fixing bolt does not reach the semiconductor light emitting element unit and the contact, so that these members are not deformed. . Therefore, the yield is good and the service life can be extended.
Furthermore, since the substrate of the semiconductor light emitting element unit is exposed to the outside through the substrate exposure opening, the heat of the semiconductor light emitting element can be efficiently dissipated to the outside by contacting the substrate that easily transmits the heat of the semiconductor light emitting element with the heat dissipation member. it can. Therefore, it is possible to prevent a decrease in light emission efficiency of the semiconductor light emitting element due to a high temperature.

本発明の一実施形態のLEDモジュール、ケーブル、及び、固定ボルトの前斜め上方から見た斜視図である。It is the perspective view seen from the front diagonal upper direction of the LED module of one embodiment of the present invention, a cable, and a fixed bolt. LEDモジュール、ケーブル、及び、固定ボルトの後斜め上方から見た斜視図である。It is the perspective view seen from the diagonally upper direction of a LED module, a cable, and a fixing bolt. LEDモジュールの後斜め上方から見た分解斜視図である。It is the disassembled perspective view seen from the back diagonally upward of the LED module. LEDモジュールの後斜め下方から見た分解斜視図である。It is the disassembled perspective view seen from the back diagonally downward of the LED module. インシュレータの底面図である。It is a bottom view of an insulator. 陽極側導電部材及び陰極側導電部材を支持したインシュレータとカバー部材の下方から見た分解斜視図である。It is the disassembled perspective view seen from the insulator and the cover member which supported the anode side conductive member and the cathode side conductive member. インシュレータに陽極側導電部材及び陰極側導電部材を支持させたときの底面図である。It is a bottom view when making an insulator support an anode side conductive member and a cathode side conductive member. 陽極側導電部材及び陰極側導電部材を支持したインシュレータに対してカバー部材を組み付けることにより完成したLED用ホルダの下方からみた斜視図である。It is the perspective view seen from the downward direction of the holder for LED completed by attaching a cover member with respect to the insulator which supported the anode side conductive member and the cathode side conductive member. LED用ホルダに対してLEDユニットを組み付けることにより完成したLEDモジュールと、ケーブルと、固定ボルトの下方からみた分離状態の斜視図である。It is the perspective view of the isolation | separation state seen from the downward direction of the LED module completed by attaching an LED unit with respect to the holder for LED, a cable, and a fixing bolt. 図2のX−X矢線に沿う断面図である。It is sectional drawing which follows the XX arrow line of FIG. 図1のXI−XI矢線に沿う断面図である。It is sectional drawing which follows the XI-XI arrow line of FIG. LEDモジュールを具備する照明器具の側面図である。It is a side view of the lighting fixture which comprises an LED module.

以下、添付図面を参照しながら本発明の一実施形態について説明する。なお、以下の説明中の前後、左右、及び上下の方向は、図中の矢印の方向を基準としている。
本実施形態は本発明のLEDモジュール10を照明器具80(図12参照)の光源として利用したものである。
LEDモジュール10(半導体発光素子モジュール)は、LED用ホルダ15(半導体発光素子用ホルダ)にLEDユニット70(半導体発光素子ユニット)を取り付けて一体化したものである。まずはLEDモジュール10(LED用ホルダ15とLEDユニット70)の詳しい構造について説明する。
Hereinafter, an embodiment of the present invention will be described with reference to the accompanying drawings. In the following description, front and rear, left and right, and up and down directions are based on the directions of arrows in the figure.
In this embodiment, the LED module 10 of the present invention is used as a light source of a lighting fixture 80 (see FIG. 12).
The LED module 10 (semiconductor light emitting element module) is obtained by attaching an LED unit 70 (semiconductor light emitting element unit) to an LED holder 15 (semiconductor light emitting element holder) and integrating them. First, the detailed structure of the LED module 10 (LED holder 15 and LED unit 70) will be described.

LED用ホルダ15は大きな構成要素としてインシュレータ20(ケース本体)(絶縁部)、陽極側導電部材40、陰極側導電部材50、及び、カバー部材60(ケース本体)を具備している。
平面視略矩形のインシュレータ20は絶縁性の合成樹脂材料を射出成形したものである。インシュレータ20の中心部には円形をなす照明用開口21が貫通孔として穿設してある。インシュレータ20の上面には照明用開口21の外周側に位置するテーパ状反射面22が凹設してある。テーパ状反射面22は外周側から内周側に向かうにつれて徐々に下方に向かうテーパ形状である。インシュレータ20の上面には、対角線上に位置する2つの角部に位置する角部凹部23が2つ凹設してあり、各角部凹部23の底面には貫通孔24が穿設してある。インシュレータ20の前面と後面の中央部にはそれぞれ係合凹部25が形成してあり、各係合凹部25の底面には係止突起26がそれぞれ突設してある。またインシュレータ20の上面の右側部には左右一対のピン挿入用孔27が貫通孔として穿設してある。
図4〜図7等に示すように、インシュレータ20の下面の右側端部には左右一対のケーブル挿入溝30が、前後方向に延びかつ後端が開放する溝として形成してある。図5及び図7に示すように、左右のピン挿入用孔27は左右のケーブル挿入溝30の底面とそれぞれ連通している。インシュレータ20の下面の中央部には底面視略方形のLED収納用凹部31が凹設してある。さらにインシュレータ20の下面には、LED収納用凹部31の左右両側に位置する円弧形状のコンタクト収納用凹部32が、LED収納用凹部31より深い溝として凹設してある。インシュレータ20の下面の右側部、前縁部、及び、左側部には底面視でLED収納用凹部31を囲むようにして、右側凹部34、前側凹部35、及び、左側凹部36がそれぞれ凹設してあり、前側凹部35の左右両端部が右側凹部34と左側凹部36の前端部とそれぞれ連通している。また図5、図7等に示すように、インシュレータ20の下面には左右のケーブル挿入溝30の前端部と右側凹部34の後端部とをそれぞれ連通する、左右一対のコンタクト挿入溝37がそれぞれ凹設してある。さらにインシュレータ20の下面にはLED収納用凹部31の四隅近傍にそれぞれ位置する4本の弾性変形片38が下向きに突設してある。各弾性変形片38はインシュレータ20の下面より下方まで突出しており(図10参照)、各弾性変形片38は板厚方向に弾性変形可能である。さらに前側の弾性変形片38の下端部の後面、及び、後側の弾性変形片38の下端部の前面には係合爪39(基板保持部)がそれぞれ突設してある。
The LED holder 15 includes an insulator 20 (case body) (insulating portion), an anode-side conductive member 40, a cathode-side conductive member 50, and a cover member 60 (case body) as large components.
The insulator 20 having a substantially rectangular shape in plan view is formed by injection molding an insulating synthetic resin material. A circular illumination opening 21 is formed at the center of the insulator 20 as a through hole. A tapered reflecting surface 22 located on the outer peripheral side of the illumination opening 21 is recessed on the upper surface of the insulator 20. The tapered reflecting surface 22 has a tapered shape that gradually decreases downward from the outer peripheral side toward the inner peripheral side. On the upper surface of the insulator 20, two corner recesses 23 located at two corners located on a diagonal line are formed, and through holes 24 are formed in the bottom surface of each corner recess 23. . Engagement recesses 25 are formed in the center portions of the front and rear surfaces of the insulator 20, and locking projections 26 project from the bottom surfaces of the engagement recesses 25. A pair of left and right pin insertion holes 27 are formed as through holes on the right side of the upper surface of the insulator 20.
As shown in FIGS. 4 to 7 and the like, a pair of left and right cable insertion grooves 30 are formed in the right end portion of the lower surface of the insulator 20 as grooves that extend in the front-rear direction and open at the rear end. As shown in FIGS. 5 and 7, the left and right pin insertion holes 27 communicate with the bottom surfaces of the left and right cable insertion grooves 30, respectively. A concave portion 31 for LED storage having a substantially square shape in a bottom view is provided in the center of the lower surface of the insulator 20. Further, on the lower surface of the insulator 20, arc-shaped contact storing recesses 32 positioned on the left and right sides of the LED storing recess 31 are formed as grooves deeper than the LED storing recess 31. A right side recess 34, a front side recess 35, and a left side recess 36 are respectively provided in the right side, the front edge, and the left side of the lower surface of the insulator 20 so as to surround the LED housing recess 31 in a bottom view. The left and right ends of the front recess 35 communicate with the front ends of the right recess 34 and the left recess 36, respectively. As shown in FIGS. 5 and 7, etc., a pair of left and right contact insertion grooves 37 are provided on the lower surface of the insulator 20 to communicate the front end portions of the left and right cable insertion grooves 30 with the rear end portion of the right recess 34, respectively. It is recessed. Further, four elastically deformable pieces 38 respectively located in the vicinity of the four corners of the LED housing recess 31 protrude downward from the lower surface of the insulator 20. Each elastic deformation piece 38 protrudes downward from the lower surface of the insulator 20 (see FIG. 10), and each elastic deformation piece 38 can be elastically deformed in the plate thickness direction. Further, engaging claws 39 (substrate holding portions) project from the rear surface of the lower end portion of the front elastic deformation piece 38 and the front surface of the lower end portion of the rear elastic deformation piece 38, respectively.

陽極側導電部材40(コンタクト)及び陰極側導電部材50(コンタクト)は、ばね弾性を備えた銅合金(例えばリン青銅、ベリリウム銅、チタン銅)やコルソン系銅合金の薄板を順送金型(スタンピング)を用いて図示形状に成形加工したものであり、表面にニッケルメッキで下地を形成した後に、金メッキや錫銅めっきを施している。
陽極側導電部材40は、右側部41、前部42、及び、左側部43からなる平板状のベース板部44を具備している。前部42の後縁部には左右一対の逃げ用凹部42aが形成してあり、右側部41には円形孔45が貫通孔として穿設してある。右側部41の上面の後端部からはケーブル用陽極コンタクト47Aが後方に向かって延びている。ケーブル用陽極コンタクト47Aの後端部には前方に向けて折り返すことにより形成した弾性変形部48が設けてある。また左側部43の上面の後端部からは接続部54が上方に延びている。接続部54の上端部には前後方向に延びるLED用陽極コンタクト55(基板保持部)の長手方向の中央部が接続しており、LED用陽極コンタクト55の前後両端部には接触端部56がそれぞれ形成してある。陽極側導電部材40とは別体の陰極側導電部材50(コンタクト)は、ケーブル用陽極コンタクト47Aと略同形状のケーブル用陰極コンタクト47Bを具備しており、ケーブル用陰極コンタクト47Bの後端部には前方に向けて折り返すことにより形成した弾性変形部48が設けてある。さらにケーブル用陰極コンタクト47Bの上面からは接続部49が左側に延びており、接続部49の左端部は前後方向に延びるLED用陰極コンタクト51(基板保持部)の長手方向の中央部に接続している。LED用陰極コンタクト51の前後両端部には接触端部52がそれぞれ形成してある。
陽極側導電部材40及び陰極側導電部材50はインシュレータ20の底面に対して下方から、互いに離間した状態で取り付けてある。具体的には、ベース板部44の右側部41、前部42、左側部43をインシュレータ20の右側凹部34、前側凹部35、左側凹部36にそれぞれ嵌合すると共に、ケーブル用陽極コンタクト47Aとケーブル用陰極コンタクト47Bの前部(基端部)を左右のコンタクト挿入溝37にそれぞれ嵌合することにより、インシュレータ20の底面に対して固定してある。するとケーブル用陽極コンタクト47Aとケーブル用陰極コンタクト47Bの後部が左右のケーブル挿入溝30内にそれぞれ位置し、LED用陰極コンタクト51とLED用陽極コンタクト55が左右のコンタクト収納用凹部32内にそれぞれ位置する。ケーブル用陽極コンタクト47Aとケーブル用陰極コンタクト47Bの前部は対応するコンタクト挿入溝37によって弾性変形が規制されているものの、左右の弾性変形部48はケーブル挿入溝30内において基端部(後端部)を中心にして左右方向に弾性変形可能である(さらにケーブル用陽極コンタクト47Aとケーブル用陰極コンタクト47Bの後部も弾性変形可能である)。一方、LED用陰極コンタクト51及びLED用陽極コンタクト55の前部及び後部は対応するコンタクト収納用凹部32の内部において、それぞれの中央部(接続部49、接続部54との接触部)を中心にして上下方向に弾性変形可能である。
The anode-side conductive member 40 (contact) and the cathode-side conductive member 50 (contact) are made of a copper alloy (for example, phosphor bronze, beryllium copper, titanium copper) having spring elasticity or a corson-type copper alloy thin plate (stamping). ), And after the base is formed by nickel plating on the surface, gold plating or tin copper plating is applied.
The anode side conductive member 40 includes a flat base plate portion 44 including a right side portion 41, a front portion 42, and a left side portion 43. A pair of left and right escape recesses 42a is formed at the rear edge of the front portion 42, and a circular hole 45 is formed as a through hole in the right side portion 41. A cable anode contact 47A extends rearward from the rear end portion of the upper surface of the right side portion 41. An elastically deformable portion 48 formed by folding back toward the front is provided at the rear end portion of the cable anode contact 47A. A connecting portion 54 extends upward from the rear end portion of the upper surface of the left side portion 43. A central portion in the longitudinal direction of the LED anode contact 55 (substrate holding portion) extending in the front-rear direction is connected to the upper end portion of the connection portion 54, and contact end portions 56 are provided at the front and rear end portions of the LED anode contact 55. Each is formed. The cathode side conductive member 50 (contact) separate from the anode side conductive member 40 includes a cable cathode contact 47B having substantially the same shape as the cable anode contact 47A, and the rear end portion of the cable cathode contact 47B. Is provided with an elastically deformable portion 48 formed by folding it forward. Further, the connection portion 49 extends to the left from the upper surface of the cable cathode contact 47B, and the left end portion of the connection portion 49 is connected to the central portion in the longitudinal direction of the LED cathode contact 51 (substrate holding portion) extending in the front-rear direction. ing. Contact end portions 52 are formed at both front and rear end portions of the LED cathode contact 51.
The anode side conductive member 40 and the cathode side conductive member 50 are attached to the bottom surface of the insulator 20 in a state of being separated from each other from below. Specifically, the right side portion 41, the front portion 42, and the left side portion 43 of the base plate portion 44 are fitted into the right side concave portion 34, the front side concave portion 35, and the left side concave portion 36 of the insulator 20, respectively, and the cable anode contact 47A and the cable The front portion (base end portion) of the cathode contact 47 </ b> B for use is fixed to the bottom surface of the insulator 20 by fitting into the left and right contact insertion grooves 37. Then, the rear portions of the cable anode contact 47A and the cable cathode contact 47B are located in the left and right cable insertion grooves 30, respectively, and the LED cathode contact 51 and the LED anode contact 55 are located in the left and right contact housing recesses 32, respectively. To do. Although the elastic deformation of the front portions of the cable anode contact 47A and the cable cathode contact 47B is restricted by the corresponding contact insertion grooves 37, the left and right elastic deformation portions 48 are located at the base end portion (rear end) in the cable insertion groove 30. Part), and the rear part of the cable anode contact 47A and the cable cathode contact 47B can be elastically deformed. On the other hand, the front and rear portions of the LED cathode contact 51 and the LED anode contact 55 are centered on the respective center portions (contact portions with the connection portion 49 and the connection portion 54) in the corresponding contact housing recesses 32. And can be elastically deformed in the vertical direction.

平面視略矩形のカバー部材60は絶縁性の合成樹脂材料を射出成形したものである。カバー部材60は、平板状の基板部61を具備しており、基板部61の中央部には平面視矩形をなす基板露出用開口62が貫通孔として形成してある。基板露出用開口62の前後両縁部の左右2カ所には逃げ用凹部63が形成してある。さらにカバー部材60の下面の4カ所には、前側の2つの逃げ用凹部63の直前に位置する2つの押え用突起64と、後側の2つの逃げ用凹部63の直後に位置する2つの押え用突起64とが下向きに突設してある。基板部61の上面の前後両側縁部には係合凸部65が上向きに突設してあり、前後の係合凸部65には係合孔66が貫通孔として形成してある。基板部61の上面の右側縁部の後端近傍部には左右一対のコンタクト支持凸部67が上向きに突設してある。基板部61の対角線上に位置する2つの角部近傍には円形の貫通孔68がそれぞれ穿設してあり、基板部61の上面の各貫通孔68と対応する位置には環状突起69がそれぞれ上向きに突設してある。
カバー部材60は、陽極側導電部材40及び陰極側導電部材50を支持したインシュレータ20の下面に対して下方から取り付けてある。具体的には、基板部61によってインシュレータ20の下面を塞ぎながら、前後の係合凸部65を前後の係合凹部25にそれぞれ位置させ、前後の係止突起26を対応する係合凸部65の係合孔66に係合させる。すると、一方の環状突起69が円形孔45に嵌合しながら一方の貫通孔24の直下に位置し、他方の環状突起69が他方の貫通孔24の直下に位置し、さらに左右のコンタクト支持凸部67がケーブル用陽極コンタクト47Aとケーブル用陰極コンタクト47Bの後部の直下にそれぞれ微小クリアランスを形成しながら位置する(接触させてもよい)。さらにインシュレータ20の前側の2つの弾性変形片38(係合爪39)が対応する2つの逃げ用凹部42aと2つの逃げ用凹部63を通り抜けてカバー部材60の下方に突出し、後側の2つの弾性変形片38(係合爪39)が対応する2つの逃げ用凹部63を通り抜けてカバー部材60の下方に突出する。
このようにして陽極側導電部材40及び陰極側導電部材50を支持したインシュレータ20とカバー部材60とを一体化することによりLED用ホルダ15が完成する(図8参照)。またインシュレータ20のケーブル挿入溝30、LED収納用凹部31、コンタクト収納用凹部32、右側凹部34、前側凹部35、左側凹部36、及びコンタクト挿入溝37と、カバー部材60とによって囲まれた空間が収容空間である。
The cover member 60 having a substantially rectangular shape in plan view is formed by injection molding an insulating synthetic resin material. The cover member 60 includes a flat substrate portion 61, and a substrate exposure opening 62 having a rectangular shape in plan view is formed as a through hole in the central portion of the substrate portion 61. Recessed recesses 63 are formed at two positions on the left and right sides of the front and rear edges of the substrate exposure opening 62. Further, at the four positions on the lower surface of the cover member 60, two presser protrusions 64 positioned immediately before the two front clearance recesses 63 and two pressers positioned immediately after the two rear clearance recesses 63. The projection 64 is protruded downward. Engagement convex portions 65 project upward at both front and rear side edges of the upper surface of the substrate portion 61, and engagement holes 66 are formed as through holes in the front and rear engagement convex portions 65. A pair of left and right contact support protrusions 67 project upward in the vicinity of the rear end of the right edge of the upper surface of the substrate 61. Circular through holes 68 are formed in the vicinity of two corners located on the diagonal line of the substrate part 61, and annular protrusions 69 are provided at positions corresponding to the through holes 68 on the upper surface of the substrate part 61, respectively. It protrudes upward.
The cover member 60 is attached to the lower surface of the insulator 20 that supports the anode side conductive member 40 and the cathode side conductive member 50 from below. Specifically, the front and rear engaging convex portions 65 are positioned in the front and rear engaging concave portions 25 while the lower surface of the insulator 20 is closed by the substrate portion 61, and the front and rear engaging projections 26 are associated with the corresponding engaging convex portions 65. The engagement hole 66 is engaged. Then, one annular projection 69 is positioned directly below one through-hole 24 while fitting into the circular hole 45, the other annular projection 69 is positioned directly below the other through-hole 24, and left and right contact support protrusions The portion 67 is positioned (may be brought into contact) while forming a minute clearance immediately below the rear portions of the cable anode contact 47A and the cable cathode contact 47B. Further, the two elastic deformation pieces 38 (engagement claws 39) on the front side of the insulator 20 pass through the corresponding two escape recesses 42a and the two escape recesses 63 and protrude below the cover member 60. The elastic deformation piece 38 (engagement claw 39) passes through the corresponding two recesses 63 and protrudes below the cover member 60.
In this manner, the insulator 20 supporting the anode side conductive member 40 and the cathode side conductive member 50 and the cover member 60 are integrated to complete the LED holder 15 (see FIG. 8). Further, a space surrounded by the cable insertion groove 30 of the insulator 20, the LED storage recess 31, the contact storage recess 32, the right side recess 34, the front side recess 35, the left side recess 36, the contact insertion groove 37, and the cover member 60. Containment space.

LEDユニット70は、基板露出用開口62と同じ形状の基板71と、基板71の上面に形成された電気回路(図示略)と導通した一つの高輝度タイプのLED74(半導体発光素子)と、を具備しており、基板71の上面には上記電気回路の両端部にそれぞれ形成した陽極72と陰極73が形成してある。なお、必要に応じて、LED74を覆う拡散レンズ75(図1、図2、図11参照)を基板71の上面に固定してもよい。また透光性及び絶縁性を有する熱硬化性樹脂材料や紫外線硬化性樹脂材料等からなる封止剤(図示略)によって基板71の上面及びLED74を覆うことによりLEDユニットをパッケージ型のものとして構成してもよい。
LEDユニット70は、下方から基板露出用開口62に嵌合することによりLED用ホルダ15と一体化してある。LEDユニット70の基板71を基板露出用開口62に嵌合すると、陽極72がLED用陽極コンタクト55を上方に弾性変形させながら後側の接触端部56に接触し、陰極73がLED用陰極コンタクト51を上方に弾性変形させながら後側の接触端部52に接触するので、基板71のLED用ホルダ15に対する上方への移動が規制される。さらに基板71の前後両縁部が各係合爪39を押圧することにより各弾性変形片38を外側(前側の弾性変形片38は前方、後側の弾性変形片38は後方)に弾性変形させ、基板71が各係合爪39より上方に移動したときに(係合爪39を乗り越えたときに)各弾性変形片38が自由状態に戻り、4つの係合爪39が下方から基板71の下面の4カ所にそれぞれ係合する。そのためLEDユニット70は、LED用陰極コンタクト51、LED用陽極コンタクト55、及び、4つの係合爪39によって基板71の下面が基板部61の下面と面一となる状態に保持される(図10参照)。なお、LEDユニット70が各弾性変形片38を外側に弾性変形させても、各弾性変形片38は対応する押え用突起64に当接するまでしか変形できないので、各弾性変形片38が弾性限度を超えて弾性変形することはない。さらに拡散レンズ75を設けた場合は、LEDユニット70をLED用ホルダ15と一体化すると、拡散レンズ75が照明用開口21に遊嵌する(さらに拡散レンズ75がLED収納用凹部31内に位置し、拡散レンズ75が照明用開口21を通してインシュレータ20の上方に露出する)。
このようにしてLEDユニット70をLED用ホルダ15と一体化することによりLEDモジュール10が完成する(図9参照)。
The LED unit 70 includes a substrate 71 having the same shape as the substrate exposure opening 62, and one high-luminance type LED 74 (semiconductor light emitting element) that is electrically connected to an electric circuit (not shown) formed on the upper surface of the substrate 71. An anode 72 and a cathode 73 formed on both ends of the electric circuit are formed on the upper surface of the substrate 71, respectively. Note that a diffusion lens 75 (see FIGS. 1, 2, and 11) that covers the LED 74 may be fixed to the upper surface of the substrate 71 as necessary. Further, the LED unit is configured as a package type by covering the upper surface of the substrate 71 and the LED 74 with a sealant (not shown) made of a thermosetting resin material or an ultraviolet curable resin material having translucency and insulation. May be.
The LED unit 70 is integrated with the LED holder 15 by fitting into the substrate exposure opening 62 from below. When the substrate 71 of the LED unit 70 is fitted into the substrate exposure opening 62, the anode 72 contacts the rear contact end portion 56 while elastically deforming the LED anode contact 55 upward, and the cathode 73 is the LED cathode contact. Since the rear contact end 52 is contacted while elastically deforming 51 upward, the upward movement of the substrate 71 relative to the LED holder 15 is restricted. Further, the front and rear edges of the substrate 71 press the engaging claws 39 to elastically deform the elastic deformation pieces 38 outward (the front elastic deformation piece 38 is the front and the rear elastic deformation piece 38 is the rear). When the board 71 moves above the respective engaging claws 39 (when the board moves over the engaging claws 39), each elastic deformable piece 38 returns to the free state, and the four engaging claws 39 move from the lower side of the board 71. Engages in four places on the lower surface. Therefore, the LED unit 70 is held in a state where the lower surface of the substrate 71 is flush with the lower surface of the substrate portion 61 by the LED cathode contact 51, the LED anode contact 55, and the four engagement claws 39 (FIG. 10). reference). Even if the LED unit 70 elastically deforms each elastic deformation piece 38 outward, each elastic deformation piece 38 can only be deformed until it abuts the corresponding presser protrusion 64. Therefore, each elastic deformation piece 38 has an elastic limit. It will not be elastically deformed beyond. Further, when the diffusing lens 75 is provided, when the LED unit 70 is integrated with the LED holder 15, the diffusing lens 75 is loosely fitted in the illumination opening 21 (the diffusing lens 75 is positioned in the LED housing recess 31. The diffusing lens 75 is exposed above the insulator 20 through the illumination opening 21).
Thus, the LED module 10 is completed by integrating the LED unit 70 with the LED holder 15 (see FIG. 9).

LEDモジュール10に対しては2本のケーブル77の一方の端部を接続可能である。可撓性を有するケーブル77は、多数の金属線を束ねたものである電線78と、電線78の表面を被覆する絶縁材料からなる被覆チューブ79と、を具備している。各ケーブル77の両端は被覆チューブ79を除去することにより電線78を露出させてある。2本のケーブル77の一方の端部を2つのケーブル挿入溝30にそれぞれ挿入すると、露出した電線78の端部が対応する弾性変形部48を(ケーブル用陽極コンタクト47A、ケーブル用陰極コンタクト47Bの本体部側に接近する方向に)弾性変形させながら弾性変形部48に接触する(図11参照)。そのため各ケーブル77をケーブル用陽極コンタクト47Aとケーブル用陰極コンタクト47Bに接続すると、ケーブル77に引き抜き力を与えてもケーブル77を円滑に引き抜くことはできない。そのためケーブル77をケーブル挿入溝30から引き抜くときは、図示を省略したピンの先端をピン挿入用孔27を通してケーブル挿入溝30内に挿入し、該ピンの先端によって弾性変形部48を(ケーブル用陽極コンタクト47A、ケーブル用陰極コンタクト47Bの本体部側に接近する方向に)さらに弾性変形させて、弾性変形部48と電線78との接触圧力を低下させる。このようにすれば、各ケーブル77を小さい引き抜き力で円滑に引き抜くことができる。   One end of two cables 77 can be connected to the LED module 10. The cable 77 having flexibility includes an electric wire 78 in which a large number of metal wires are bundled, and a covering tube 79 made of an insulating material that covers the surface of the electric wire 78. At both ends of each cable 77, the electric wire 78 is exposed by removing the covering tube 79. When one end of each of the two cables 77 is inserted into each of the two cable insertion grooves 30, the elastically deformed portion 48 corresponding to the exposed end of the electric wire 78 (the cable anode contact 47 </ b> A and the cable cathode contact 47 </ b> B). The elastic deformation portion 48 is contacted while being elastically deformed (in a direction approaching the main body portion side) (see FIG. 11). Therefore, when each cable 77 is connected to the cable anode contact 47A and the cable cathode contact 47B, the cable 77 cannot be pulled out smoothly even if a pulling force is applied to the cable 77. Therefore, when the cable 77 is pulled out from the cable insertion groove 30, the tip of a pin (not shown) is inserted into the cable insertion groove 30 through the pin insertion hole 27, and the elastic deformation portion 48 (the cable anode) is inserted by the tip of the pin. The contact pressure between the elastic deformation part 48 and the electric wire 78 is further reduced by further elastic deformation (in the direction approaching the main body side of the contact 47A and the cathode contact 47B for the cable). In this way, each cable 77 can be smoothly pulled out with a small pulling force.

以上構成のLEDモジュール10及びケーブル77は図12に示した照明器具80の構成物品として利用可能である。
照明器具80は平面視円形をなす合成樹脂製のベース部材81を具備しており、ベース部材81の上面(図12では下面)には凹部が形成してあり、該凹部の底面(図12では上面)には金属板からなるシャシー82(放熱部材)が固着してある。ケーブル77と一体化したLEDモジュール10は、各押え用突起64をシャシー82に凹設した位置決め用凹部に係合しながら、2つの貫通孔24に対して角部凹部23側から固定ボルト83を挿入し、貫通孔24を貫通した各固定ボルト83の雄ネジ部をシャシー82に形成した2つの雌ネジ孔(図示略)にそれぞれ螺合することにより、ベース部材81(シャシー82)に対して固定可能である。LEDモジュール10をベース部材81に固定すると、基板露出用開口62を通して露出する基板71の下面(図12では上面)がシャシー82に当接する。またベース部材81の上面(図12では下面)には、ベース部材81の上面及びLEDモジュール10を覆う半球形状の投光性カバー部材84が被せてある。
このLEDモジュール10、ケーブル77、ベース部材81、シャシー82、固定ボルト83、及び、投光性カバー部材84を備える照明器具80は、例えば図12に示すようにベース部材81の投光性カバー部材84と反対側面を上方に向けた状態で天井板85にネジ等によって固定可能である。ケーブル77のLEDモジュール10と反対側の端部は、天井板85に形成した貫通孔86を通して天井板85の上方に引き出し、図示を省略した制御装置を介して電源に接続する。図示を省略したスイッチをOFFからONに切り換えれば、電源で発生した電流がケーブル77及び陽極側導電部材40(ケーブル用陽極コンタクト47A、LED用陽極コンタクト55)、及び、陰極側導電部材50(ケーブル用陰極コンタクト47B、LED用陰極コンタクト51)を介して基板71の電気回路に流れLED74が発光する(さらに拡散レンズ75を設けた場合は拡散レンズ75によって拡散される)。LED74が発した照明光はインシュレータ20のテーパ状反射面22によって反射されながら投光性カバー部材84側に向かい、投光性カバー部材84を通り抜けて外部に照射される。一方、スイッチをONからOFFに切り換えれば、電流のLED74への供給が遮断されるのでLED74は消灯する。
The LED module 10 and the cable 77 having the above configuration can be used as components of the lighting fixture 80 shown in FIG.
The luminaire 80 includes a synthetic resin base member 81 having a circular shape in plan view. A concave portion is formed on the upper surface (lower surface in FIG. 12) of the base member 81, and the bottom surface of the concave portion (in FIG. 12). A chassis 82 (heat radiating member) made of a metal plate is fixed to the upper surface. In the LED module 10 integrated with the cable 77, the fixing bolts 83 are attached to the two through holes 24 from the corner recess 23 side while engaging the pressing protrusions 64 with the positioning recesses provided in the chassis 82. The male screw portions of the fixing bolts 83 inserted through the through-holes 24 are respectively screwed into two female screw holes (not shown) formed in the chassis 82, whereby the base member 81 (chassis 82) is engaged. It can be fixed. When the LED module 10 is fixed to the base member 81, the lower surface (upper surface in FIG. 12) of the substrate 71 exposed through the substrate exposure opening 62 contacts the chassis 82. Further, the upper surface (the lower surface in FIG. 12) of the base member 81 is covered with a hemispherical light projecting cover member 84 that covers the upper surface of the base member 81 and the LED module 10.
The lighting fixture 80 including the LED module 10, the cable 77, the base member 81, the chassis 82, the fixing bolt 83, and the light projecting cover member 84 is, for example, a light projecting cover member of the base member 81 as shown in FIG. It can be fixed to the ceiling plate 85 with a screw or the like with the side opposite to 84 facing upward. The end of the cable 77 opposite to the LED module 10 is pulled out above the ceiling plate 85 through a through hole 86 formed in the ceiling plate 85 and connected to a power source via a control device (not shown). When the switch (not shown) is switched from OFF to ON, the current generated by the power source causes the cable 77, the anode side conductive member 40 (cable anode contact 47A, LED anode contact 55), and the cathode side conductive member 50 ( The LED 74 emits light through an electric circuit of the substrate 71 via the cable cathode contact 47B and the LED cathode contact 51) (if a diffusion lens 75 is provided, it is diffused by the diffusion lens 75). The illumination light emitted from the LED 74 is directed toward the light projecting cover member 84 while being reflected by the tapered reflecting surface 22 of the insulator 20, passes through the light projecting cover member 84, and is irradiated to the outside. On the other hand, when the switch is switched from ON to OFF, the supply of current to the LED 74 is interrupted, and thus the LED 74 is turned off.

以上説明した本実施形態によれば、LEDモジュール10を、ケーブル用陽極コンタクト47A、ケーブル用陰極コンタクト47B、LED用陰極コンタクト51、LED用陽極コンタクト55、及び、LEDユニット70と一体化した状態(ケーブル用陽極コンタクト47A、ケーブル用陰極コンタクト47B、LED用陰極コンタクト51、LED用陽極コンタクト55、及び、LEDユニット70が相対移動しない状態)で別部材(例えばシャシー82)に固定できるので、LEDモジュール10を別の部材に対して簡単に固定できる。
しかもLEDモジュール10を少ない工程で別部材(例えばシャシー82)に対して固定可能である。そのため、別部材に固定した古いLEDユニット70を新しいものと交換するときのメンテナンスが容易である。
またケーブル用陽極コンタクト47A、ケーブル用陰極コンタクト47B、LED用陰極コンタクト51、LED用陽極コンタクト55、及び、LED74の周囲をLED用ホルダ15で覆ってあるので、LEDモジュール10を別部材に対して固定するときにLED74(拡散レンズ75)が他の部材と接触して傷付くおそれは小さい。さらに固定ボルト83によってLED用ホルダ15を別部材に固定するときに、固定ボルト83による固定力(負荷)がケーブル用陽極コンタクト47A、ケーブル用陰極コンタクト47B、LED用陰極コンタクト51、LED用陽極コンタクト55、及び、LEDユニット70に及ばないので、これらの部材に変形等が生じることがない。そのためLEDモジュール10は歩留まりが良く(不良品の発生を抑制でき)、かつ耐用期間が長い。
According to the present embodiment described above, the LED module 10 is integrated with the cable anode contact 47A, the cable cathode contact 47B, the LED cathode contact 51, the LED anode contact 55, and the LED unit 70 ( Since the cable anode contact 47A, the cable cathode contact 47B, the LED cathode contact 51, the LED anode contact 55, and the LED unit 70 are not relatively moved), the LED module can be fixed to another member (for example, the chassis 82). 10 can be easily fixed to another member.
Moreover, the LED module 10 can be fixed to another member (for example, the chassis 82) with a small number of steps. Therefore, maintenance when replacing the old LED unit 70 fixed to another member with a new one is easy.
Further, the LED anode contact 47A, the cable cathode contact 47B, the LED cathode contact 51, the LED anode contact 55, and the LED 74 are covered with the LED holder 15, so that the LED module 10 is attached to another member. There is little risk that the LED 74 (diffuse lens 75) may come into contact with other members when being fixed. Further, when the LED holder 15 is fixed to another member by the fixing bolt 83, the fixing force (load) by the fixing bolt 83 is the cable anode contact 47A, the cable cathode contact 47B, the LED cathode contact 51, and the LED anode contact. 55 and the LED unit 70, the members are not deformed. Therefore, the LED module 10 has a good yield (can suppress the occurrence of defective products) and has a long service life.

さらにLED74で発生した熱は基板71から放熱され、さらに基板71からシャシー82に伝わりシャシー82からも放熱されるので、LED74の熱を外部に効率よく放熱できる。そのため高温化によるLED74の発光効率の低下を防ぐことが可能である。
またLEDモジュール10はLED74(拡散レンズ75)の直近に位置するテーパ状反射面22を備えているので、照明光の指向性の制御が可能であり、照明光の輝度むらを抑えることができる。
また図12に示すようにインシュレータ20に形成した角部凹部23内に固定ボルト83の頭部の大部分を位置させているので(固定ボルト83のインシュレータ20の上面から上方への突出量が小さいので)、照明光が固定ボルト83の頭部によって遮られ難い。
さらにケーブル用陽極コンタクト47A、ケーブル用陰極コンタクト47B、LED用陰極コンタクト51、及び、LED用陽極コンタクト55をすべて別体とするのではなく陽極側導電部材40及び陰極側導電部材50としてそれぞれ一体化してあるので、ケーブル用陽極コンタクト47A、ケーブル用陰極コンタクト47B、LED用陰極コンタクト51、及び、LED用陽極コンタクト55をすべて別体とした場合に比べてLEDモジュール10(LED用ホルダ15)の組立が容易である。
Further, the heat generated by the LED 74 is dissipated from the substrate 71 and further transmitted from the substrate 71 to the chassis 82 and is also dissipated from the chassis 82, so that the heat of the LED 74 can be efficiently dissipated to the outside. Therefore, it is possible to prevent a decrease in the light emission efficiency of the LED 74 due to a high temperature.
In addition, since the LED module 10 includes the tapered reflecting surface 22 positioned in the immediate vicinity of the LED 74 (diffuse lens 75), the directivity of the illumination light can be controlled, and uneven brightness of the illumination light can be suppressed.
Further, as shown in FIG. 12, most of the head of the fixing bolt 83 is positioned in the corner recess 23 formed in the insulator 20 (the amount of protrusion of the fixing bolt 83 upward from the upper surface of the insulator 20 is small). Therefore, it is difficult for the illumination light to be blocked by the head of the fixing bolt 83.
Further, the cable anode contact 47A, the cable cathode contact 47B, the LED cathode contact 51, and the LED anode contact 55 are not integrated, but are integrated as the anode-side conductive member 40 and the cathode-side conductive member 50, respectively. Therefore, the LED module 10 (LED holder 15) is assembled as compared with the case where the cable anode contact 47A, the cable cathode contact 47B, the LED cathode contact 51, and the LED anode contact 55 are all separated. Is easy.

以上、本発明を上記実施形態に基づいて説明したが、本発明は上記実施形態に限定されるものではなく、様々な変形を施しながら実施可能である。
例えば陽極側導電部材40及び陰極側導電部材50を成形型の内部に入れたインサート成形によってインシュレータ20とカバー部材60を有するケース本体を一体的に成形してもよい。
弾性変形片38(係合爪39)を、インシュレータ20ではなくカバー部材60に形成してもよい。
さらに基板71の下面とシャシー82の間に伝熱シートなどを介在させてもよい。このようにすると基板71と係合爪39は互いに離間するが、LED用陰極コンタクト51及びLED用陽極コンタクト55からの基板71に対する押圧力は消失しない(さらに強まる)ので、陽極72及び陰極73とLED用陽極コンタクト55とLED用陰極コンタクト51の導通は共に維持される。
基板71の下面が係合爪39と係合したときに、基板71の下面が基板露出用開口62(基板部61の下面)から下方に突出するように、弾性変形片38の長さ(係合爪39の位置)を設定してもよい。このようにすれば、LEDモジュール10をベース部材81に固定したときに、基板71の下面をシャシー82に対してより確実に当接させることが可能になる。
またケーブル用陽極コンタクト47A、ケーブル用陰極コンタクト47B、LED用陰極コンタクト51、及び、LED用陽極コンタクト55をそれぞれ別体としてもよい。
さらに基板71に載せるLED74の数を複数としたり、LEDモジュール10(LED用ホルダ15)を照明器具80とは別タイプの照明器具の構成部品として利用してもよい。
As mentioned above, although this invention was demonstrated based on the said embodiment, this invention is not limited to the said embodiment, It can implement, giving various deformation | transformation.
For example, the case main body having the insulator 20 and the cover member 60 may be integrally formed by insert molding in which the anode-side conductive member 40 and the cathode-side conductive member 50 are placed inside a mold.
The elastic deformation piece 38 (engagement claw 39) may be formed not on the insulator 20 but on the cover member 60.
Further, a heat transfer sheet or the like may be interposed between the lower surface of the substrate 71 and the chassis 82. In this way, the substrate 71 and the engaging claw 39 are separated from each other, but the pressing force on the substrate 71 from the LED cathode contact 51 and the LED anode contact 55 does not disappear (becomes stronger). The conduction between the LED anode contact 55 and the LED cathode contact 51 is maintained.
When the lower surface of the substrate 71 is engaged with the engaging claw 39, the length (engagement) of the elastic deformation piece 38 is such that the lower surface of the substrate 71 protrudes downward from the substrate exposure opening 62 (the lower surface of the substrate portion 61). The position of the joint claw 39) may be set. In this way, when the LED module 10 is fixed to the base member 81, the lower surface of the substrate 71 can be brought into contact with the chassis 82 more reliably.
Also, the cable anode contact 47A, the cable cathode contact 47B, the LED cathode contact 51, and the LED anode contact 55 may be separated from each other.
Furthermore, the number of LEDs 74 placed on the substrate 71 may be plural, or the LED module 10 (LED holder 15) may be used as a component of a lighting fixture of a different type from the lighting fixture 80.

10 LEDモジュール(半導体発光素子モジュール)
15 LED用ホルダ(半導体発光素子用ホルダ)
20 インシュレータ(ケース本体)(絶縁部)
21 照明用開口
22 テーパ状反射面
23 角部凹部
24 貫通孔
25 係合凹部
26 係止突起
27 ピン挿入用孔
30 ケーブル挿入溝
31 LED収納用凹部
32 コンタクト収納用凹部
34 右側凹部
35 前側凹部
36 左側凹部
37 コンタクト挿入溝
38 弾性変形片
39 係合爪(基板保持部)
40 陽極側導電部材(コンタクト)
41 右側部
42 前部
42a 逃げ用凹部
43 左側部
44 ベース板部
45 円形孔
47A ケーブル用陽極コンタクト
47B ケーブル用陰極コンタクト
48 弾性変形部
49 接続部
50 陰極側導電部材(コンタクト)
51 LED用陰極コンタクト(基板保持部)
52 接触端部
54 接続部
55 LED用陽極コンタクト(基板保持部)
56 接触端部
60 カバー部材(ケース本体)
61 基板部
62 基板露出用開口
63 逃げ用凹部
64 押え用突起
65 係合凸部
66 係合孔
67 コンタクト支持凸部
68 貫通孔
69 環状突起
70 LEDユニット(半導体発光素子ユニット)
71 基板
72 陽極
73 陰極
74 LED(半導体発光素子)
75 拡散レンズ
77 ケーブル
78 電線
79 被覆チューブ
80 照明器具
81 ベース部材
82 シャシー(放熱部材)
83 固定ボルト
84 投光性カバー部材
85 天井板
86 貫通孔
10 LED module (semiconductor light-emitting element module)
15 LED holder (semiconductor light-emitting element holder)
20 Insulator (case body) (insulating part)
21 Illumination opening 22 Tapered reflecting surface 23 Corner recess 24 Through hole 25 Engaging recess 26 Locking projection 27 Pin insertion hole 30 Cable insertion groove 31 LED storage recess 32 Contact storage recess 34 Right recess 35 Front recess 36 Left concave portion 37 Contact insertion groove 38 Elastic deformation piece 39 Engaging claw (substrate holding portion)
40 Anode-side conductive member (contact)
41 right side 42 front 42a escape recess 43 left side 44 base plate part 45 circular hole 47A cable anode contact 47B cable cathode contact 48 elastic deformation part 49 connection part 50 cathode side conductive member (contact)
51 Cathode contact for LED (substrate holding part)
52 Contact end portion 54 Connection portion 55 LED anode contact (substrate holding portion)
56 Contact end 60 Cover member (case body)
61 Substrate part 62 Substrate exposure opening 63 Relief recess 64 Pressing protrusion 65 Engaging protrusion 66 Engaging hole 67 Contact supporting protrusion 68 Through hole 69 Annular protrusion 70 LED unit (semiconductor light emitting element unit)
71 Substrate 72 Anode 73 Cathode 74 LED (Semiconductor Light Emitting Element)
75 Diffuser lens 77 Cable 78 Electric wire 79 Covered tube 80 Lighting fixture 81 Base member 82 Chassis (heat dissipation member)
83 Fixing bolt 84 Light-emitting cover member 85 Ceiling plate 86 Through hole

上記ケース本体の外面に上記照明用開口の外周側に位置させて形成した、上記半導体発光素子が発した照明光を反射する、外周側から内周側に向かうにつれて該外面側から上記収容空間側に近づく形状のテーパ状反射面を備えていてもよい。
上記基板保持部が、上記基板露出用開口より外側に突出しかつ上記基板の外面を支持する係合爪であってもよい。
さらに上記ケース本体の外周面の一部をなしかつ平面からなる一つのケーブル接続面のみに形成した、それぞれケーブルを挿脱可能な陽極側ケーブル挿入孔及び陰極側ケーブル挿入孔を有し、上記コンタクトが、上記収容空間に位置する状態で上記ケース本体の絶縁部に支持させた、上記半導体発光素子の陽極と電気的に導通可能でかつ上記陽極側ケーブル挿入孔に挿入した上記ケーブルと接続する陽極コンタクト及び上記半導体発光素子の陰極と電気的に導通可能かつ上記陰極側ケーブル挿入孔に挿入した上記ケーブルと接続する陰極コンタクトと、を備えてもよい。
Reflecting the illumination light emitted from the semiconductor light emitting element formed on the outer surface of the case body on the outer peripheral side of the illumination opening, from the outer surface side toward the inner peripheral side, toward the housing space side You may provide the taper-shaped reflective surface of the shape which approaches.
The substrate holding part may be an engaging claw that protrudes outward from the substrate exposure opening and supports the outer surface of the substrate.
Further, the contact is formed on only one flat cable connection surface that forms a part of the outer peripheral surface of the case body, and has an anode-side cable insertion hole and a cathode-side cable insertion hole, respectively, through which the cable can be inserted and removed. Is connected to the cable inserted into the anode-side cable insertion hole and electrically connected to the anode of the semiconductor light-emitting element supported by the insulating portion of the case body in a state of being located in the housing space. And a cathode contact that is electrically conductive with the contact and the cathode of the semiconductor light emitting element and is connected to the cable inserted into the cathode side cable insertion hole.

Claims (6)

半導体発光素子と基板の一体物である半導体発光素子ユニットを配置可能な収容空間を内部に有するケース本体と、
該ケース本体に形成した、上記収容空間に配置した上記半導体発光素子を上記ケース本体の外側に露出させる照明用開口と、
上記ケース本体に形成した、外側に位置する上記半導体発光素子が上記収容空間側に挿通可能で、かつ上記収容空間に配置した上記基板を外側に露出させる基板露出用開口と、
上記ケース本体に形成した、上記収容空間に配置した上記基板を該収容空間に留めるように支持する基板保持部と、
上記収容空間に位置する状態で上記ケース本体の絶縁部に支持させた、上記基板及び電源と電気的に導通可能なコンタクトと、
を備えることを特徴とする半導体発光素子用ホルダ。
A case body having therein a housing space in which a semiconductor light emitting element unit, which is an integrated body of the semiconductor light emitting element and the substrate, can be disposed;
An opening for illumination that is formed in the case body and exposes the semiconductor light emitting element disposed in the housing space to the outside of the case body;
A substrate exposure opening formed on the case body, the semiconductor light emitting element located on the outside can be inserted into the housing space side, and the substrate disposed in the housing space is exposed to the outside;
A substrate holding part that is formed in the case body and supports the substrate disposed in the accommodation space so as to be retained in the accommodation space;
A contact that is electrically conductive with the substrate and the power source, supported by the insulating portion of the case body in a state of being located in the accommodating space;
A holder for a semiconductor light emitting element, comprising:
請求項1記載の半導体発光素子用ホルダにおいて、
上記ケース本体が、
上記コンタクトを支持するインシュレータと、
該インシュレータに対して取り付けることにより、該インシュレータとの間で上記収容空間を形成するカバー部材と、を具備する半導体発光素子用ホルダ。
In the holder for semiconductor light emitting elements according to claim 1,
The case body is
An insulator that supports the contact;
A holder for a semiconductor light emitting element, comprising: a cover member that forms the accommodation space with the insulator by being attached to the insulator.
請求項1または2記載の半導体発光素子用ホルダにおいて、
上記ケース本体の外面に上記照明用開口の外周側に位置させて形成した、上記半導体発光素子が発した照明光を反射する、外周側から内周側に向かうにつれて該外面側から上記収容空間側に近づく形状のテーパ状反射面を備える半導体発光素子用ホルダ。
In the holder for semiconductor light emitting elements according to claim 1 or 2,
Reflecting the illumination light emitted from the semiconductor light emitting element formed on the outer surface of the case body on the outer peripheral side of the illumination opening, from the outer surface side toward the inner peripheral side, toward the housing space side The holder for semiconductor light emitting elements provided with the taper-shaped reflective surface of the shape which approaches.
請求項1から3のいずれか1項記載の半導体発光素子用ホルダにおいて、
上記基板保持部が、上記基板露出用開口より外側に突出しかつ上記基板の外面を支持する係合爪である半導体発光素子用ホルダ。
In the holder for semiconductor light emitting elements according to any one of claims 1 to 3,
A holder for a semiconductor light emitting element, wherein the substrate holding portion is an engaging claw that projects outward from the substrate exposure opening and supports the outer surface of the substrate.
請求項1から4のいずれか1項記載の半導体発光素子用ホルダと、
上記収容空間に配置した上記半導体発光素子ユニットと、
を備えることを特徴とする半導体発光素子モジュール。
A holder for a semiconductor light emitting device according to any one of claims 1 to 4,
The semiconductor light emitting element unit disposed in the housing space;
A semiconductor light-emitting element module comprising:
請求項5記載の半導体発光素子モジュールと、
上記基板露出用開口から外部に露出した上記基板に接触する放熱部材と、
上記半導体発光素子が発した照明光が透過可能で、かつ上記半導体発光素子ホルダを囲む投光性カバー部材と、
を備えることを特徴とする照明器具。
The semiconductor light-emitting element module according to claim 5;
A heat dissipating member in contact with the substrate exposed to the outside from the substrate exposure opening;
Illuminating light emitted from the semiconductor light emitting element can be transmitted, and a light projecting cover member surrounding the semiconductor light emitting element holder;
A lighting apparatus comprising:
JP2011234171A 2011-10-25 2011-10-25 Semiconductor light emitting element holder, semiconductor light emitting element module, and lighting fixture Expired - Fee Related JP5499005B2 (en)

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