KR101294657B1 - Module for securing LED and Method for manufacturing the same, LED module and Illuminating apparatus using LED module - Google Patents

Abstract

A semiconductor light emitting device mounting module excellent in productivity and heat dissipation, a semiconductor light emitting device lighting apparatus using the semiconductor light emitting device mounting module, and a method for manufacturing a semiconductor light emitting device mounting module.
The first conducting portion 28 and the second conducting portion 32, and the first contact portion having one end in contact with the first conducting portion and the second conducting portion, respectively, and the other end conducting with the anode and the cathode of the semiconductor light emitting element, respectively. A first feed part which forms a plurality of semiconductor light emitting element fixing parts 36 including the 39 and the second contact part 43 and is in contact with the first and second conducting parts located at both ends; Resin material which covers the surface of the conduction plate with the metal conduction plate 17 which has a 2nd feed part, and the said other end of a 1st contact part and a 2nd contact part, and the 1st feed part and a 2nd feed part exposed the state. A surface insulating portion 48 is provided.

Description

Module for securing LED and method for manufacturing the same, LED module and Illuminating apparatus using LED module

The present invention relates to a semiconductor light emitting device attachment module capable of attaching a plurality of semiconductor light emitting devices (LEDs), a semiconductor light emitting device module, a semiconductor lighting device using the semiconductor light emitting device module and a method for manufacturing a semiconductor light emitting device mounting module.

In recent years, lighting fixtures using LEDs (semiconductor light emitting elements) have been used in various fields such as indoor lighting fixtures and backlights for liquid crystal monitors.

In general, a luminaire using LEDs includes a plurality of circuit boards (rigid boards) in which one or a plurality of LEDs are mounted on the front side in a chain form (linear or planar), and adjacent circuit boards are connected to each other using electrical connectors. It is constructed by connecting.

As a conventional example of these, Japanese Patent Literatures Publication No. 2010-525523 (hereinafter referred to as Patent Document 1), Japanese Patent Publication No. 2010-505232 (hereinafter referred to as Patent Document 2), and Japanese Patent Laid-Open No. 2010-62556 ( Hereinafter, Patent Document 3) and Japanese Patent Application Laid-Open No. 2010-98302 (hereinafter referred to as Patent Document 4) are disclosed in detail.

In order to assemble a conventional LED lighting fixture, it was necessary to connect a plurality of circuit boards in a chain form using an electrical connector. However, since the connection parts by the connector were moved, it was necessary to fix each connection part with a screw or the like on the chassis or the mounting table.

In addition, when the circuit board is formed to be long or formed into a large area, the number of assembling steps can be reduced because the electrical connector can be omitted or the number of electrical connectors can be reduced. However, in general, when the circuit board is made into a long shape or a large area shape, it is easy to bend the board itself when forming the circuit board, and it is also easy to bend when the surface is mounted (soldering) by the reflow of the LED to the circuit board. If the warpage occurs, each LED is not located on the same plane. In addition, because of its elongated shape, the reflow apparatus also needs to be large, resulting in mechanical limitations.

In addition, in the LED luminaire, each LED generates a large amount of heat, and the heat is transferred from the LED to each circuit board to radiate heat from the circuit board. However, circuit boards used for general surface mounting are mostly made of resin materials or glass fibers in order to ensure abnormal insulation between circuits and prevent abnormal temperature rise of the circuit boards during mounting or recirculation due to reflow. The heat dissipation of the substrate itself is low.

An object of the present invention is to provide a method for manufacturing a semiconductor light emitting device attachment module, a semiconductor light emitting device module, a semiconductor light emitting device lighting fixture and a semiconductor light emitting device attachment module excellent in productivity and heat dissipation.

The module for attaching a semiconductor light emitting device of the present invention comprises a first conductive portion and a second conductive portion, and one end portion which is in contact with the first conductive portion and the second conductive portion, respectively, and is capable of conducting with the anode and the cathode of the semiconductor light emitting element, respectively. A first feed portion and a second feed portion which form a plurality of semiconductor light emitting element fixing portions having a first contact portion and a second contact portion side by side, and which are connected to the first conductive portion and the second conductive portion respectively positioned at both ends thereof. The conductive plate is formed of a metal having the metal, the tartan of the first contact portion and the second contact portion, and the first feed portion and the second feed portion in a state of exposing the exposed surface of the conductive plate is formed of a resin material Having surface insulation;

The semiconductor light emitting element fixing portion is provided with a pair of fixing pieces that can be fixed in a state where the semiconductor light emitting element is inserted and fixed, and the surface insulating portion exposes the fixing pieces;

The entire first conductive portion separated from each other is connected so as to be conductive with the second conductive portion of the semiconductor light emitting element fixing portion such as itself, and the other semiconductor light emitting element is located on one side in the longitudinal direction of the conductive plate. It is characterized in that it is connected to the 2nd conducting part of the government.

The first contact portion and the second contact portion are formed of an elastic metal separately from the semiconductor light emitting element fixing portion, one end of which contacts the first conducting portion and the second conducting portion, and the other end of each semiconductor light emitting element The first contact piece and the second contact piece may be formed at the anode and the cathode of the semiconductor light emitting element, respectively, away from the fixing portion.

The semiconductor light emitting element fixing portion may be wider than other portions of the conductive plate.

An exposed part for exposing a part of the conductive plate may be formed in the surface insulating part.

The second conductive portion of the semiconductor light emitting element fixing portion such as the first conductive portion and the first conductive portion may be connected by a cutting bridge that can be physically cut.

A support portion for supporting a diffusion lens for diffusing light generated by the semiconductor light emitting element may be formed in the surface insulation portion.

The semiconductor light emitting device module of the present invention includes the semiconductor light emitting device attachment module and a semiconductor light emitting device in which its anode and cathode are respectively conductive to the first contact portion and the second contact portion of the semiconductor light emitting device attachment module. It features.

The semiconductor light emitting device illuminating device of the present invention includes a plurality of the semiconductor light emitting device modules arranged in a direction orthogonal to the longitudinal direction of the conductive plate, and the first each positioned at an end portion in the same direction of each semiconductor light emitting device attachment module. A pair of first connecting members connecting the feeders to each other and a pair of second connecting members connecting the respective second feeders positioned at the ends in the same direction of each module for attaching the semiconductor light emitting elements, And a pair of insulators respectively supporting the first connecting member and the second connecting member located on the side.

According to another aspect of the invention, the semiconductor light emitting device according to the present invention includes one of a plurality of semiconductor light emitting device modules according to claim 11 and a module for attaching semiconductor light emitting devices, which are arranged in a direction orthogonal to the longitudinal direction of the conductive plate. A pair of first connecting members connecting the first feeders positioned at the end side to each other, and a pair of connecting the second feeders positioned at one end side of each module for attaching semiconductor light emitting elements to each other. And an insulator for supporting the second connecting member and the first connecting member and the second connecting member, respectively.

At least one of the first connecting member and the second connecting member includes a connecting portion for connecting the first feed portion or the second feeding portion and a metal connecting member having a conductive groove, and an electric wire supported by the conductive groove. You may also do it.

In this case, the connecting portion may be a pair of elastic contact pieces which are fixed by sandwiching both the positive and negative electrode feeding parts or the negative electrode feeding part from both sides.

A circuit having a circuit and a plurality of metal conductive pins connected to the circuit and capable of fixing the respective semiconductor light emitting device modules, wherein the first conductive portion and the second conductive portion are separated from each other, and the conductive plate is provided. A surface insulating portion covering the surface of the substrate and formed of a resin, and having an exposed portion for partially exposing the entirety of the first conductive portion and the second conductive portion to the surface insulating portion; The first conductive portion and the second conductive portion may be in contact with each other.

This chassis can be made of metal.

The method of manufacturing a module for attaching a semiconductor light emitting device according to the present invention includes a first conducting portion and a second conducting portion, one end of which is in contact with the first conducting portion and the second conducting portion, and the other end of the semiconductor light emitting element attaching module, A first feed part which forms a plurality of semiconductor light emitting element fixing parts each having a first contact part and a second contact part which are conductive, and which are connected to the first and second conducting parts positioned at both ends; A second feeding portion and a cutting bridge that connects and physically cuts the second conductive portion of the semiconductor light emitting element fixing portion, such as the first conductive portion and the second conductive portion, wherein the first conductive portion is formed of the conductive plate. Stamping and forming a conductive plate made of metal connected to the second conductive portion of the other semiconductor light emitting element fixing portion located at one side in the longitudinal direction, wherein the surface of the conductive plate is Coating the other end of the first contact portion and the second contact portion and the surface insulation portion made of a resin material with the first feed portion and the second feed portion exposed, and physically cutting the entire cutting bridge. It is characterized by having a.

According to another aspect of the method for manufacturing a module for attaching a semiconductor light emitting element of the present invention, one end of the first conducting portion and the second conducting portion is in contact with the first conducting portion and the second conducting portion, and the other end thereof is the semiconductor light emitting element. A plurality of semiconductor light emitting element fixing portions having a first contact portion and a second contact portion that are electrically conductive to the anode and the cathode of the anode, respectively, and being electrically connected to the first conductive portion and the second conductive portion positioned at both ends thereof, respectively; A first feed portion and a second feed portion, a bridge connecting the first conducting portion and the second conducting portion located at one end in the longitudinal direction of the conducting plate, and the first conducting portion and the same semiconductor as the first conducting portion. A conductive bridge having a cutting bridge that connects the second conductive portion of the light emitting element fixing portion and is physically cut, and wherein the first conductive portion and the second conductive portion are made of metal connected to each other; Stamping and forming a plate, wherein the surface of the conductive plate is covered with a surface insulating portion formed of a resin material while exposing the other ends of the first contact portion and the second contact portion and the first feed portion and the second feed portion. And physically cutting the entire cutting bridge.

In the conventional LED lighting fixture, in order to attach a plurality of semiconductor light emitting devices, it is necessary to connect a plurality of substrates in a chain form (straight or flat) to each other. Since the element can be attached, the assembly and manufacture of the semiconductor light emitting device module (module for attaching the semiconductor light emitting device) are easy, and the productivity of the semiconductor light emitting device can be reduced.

The conductive plate made of a metal having excellent thermal conductivity and rigidity constitutes a large part of the module for attaching the semiconductor light emitting element, and after the thickness of the conductive plate is increased, the entire conductive plate may be covered with a surface insulating portion made of resin.

Accordingly, the module has excellent thermal conductivity and heat dissipation, and heat generated by the semiconductor light emitting device is efficiently radiated to the outside through a conductive plate and a thin surface insulating part.

In addition, since the connection part is unnecessary, the rigidity is superior to that of the module structure connected in series, and the portion corresponding to the conductive layer or the metal layer of the laminated substrate which is not intended by design can be prevented from being exposed to the surface. It is excellent in sex and can prevent inadvertent adhesion or short circuit.

According to the invention of claim 2, since the semiconductor light emitting element can be fixed by being inserted into the conductive plate, there is no need for soldering or reflowing both, and the productivity is good.

In addition, since there is no need for reflow, the semiconductor light emitting device is not likely to be damaged by heat.

In addition, heat conduction and heat dissipation are improved because heat of the semiconductor light emitting element flows to the conductive plate efficiently through the fixing piece.

According to the invention of claim 3, since a series circuit having a small variation in current values is formed on the conductive plate, variation in luminance of each semiconductor element is reduced.

According to the invention of claim 4, since the parallel circuit is formed on the conducting plate, even if one semiconductor light emitting element is deteriorated or damaged, the other semiconductor element of the module can emit light, so long life and reliability are required. It is preferable for the mechanism.

According to invention of Claim 5, the effect similar to invention of Claim 4 can be exhibited in the state which wiring was small compared with Claim 4.

According to the invention of claim 6, since only the first contact piece and the second contact piece are made of a metal material having excellent elasticity, and a metal material having no elasticity can be used for other parts of the conductive plate, the portion having elasticity can be reduced. The manufacturing cost of the whole conducting plate can be reduced.

According to the invention of claim 7, the portion excluding the semiconductor light emitting element fixing portion that mainly exerts the heat generation effect can be made narrow (with a narrow width), thereby reducing the conduction plate and the surface insulation portion and reducing the manufacturing cost of the module. You can.

According to the invention of claim 8, since the heat transferred from the semiconductor light emitting element to the conducting plate is generated to the outside through the exposed portion, the heat generation property is further improved. In addition, the degree of freedom in thermal design of a device (for example, a liquid crystal TV) on which a module for mounting a semiconductor light emitting element is mounted can be increased.

According to the invention of Claim 9, since the 1st conducting part and the 2nd conducting part can be integrated by a cutting bridge, when forming a surface insulation part, each conducting plate can be formed with high positional precision without a shift | offset | difference. have. In addition, after the formation of the surface insulating portion, the cutting bridge can be physically cut to separate the first conductive portion and the second conductive portion from each other.

According to the invention of claim 10, the lens can be positioned at an appropriate position with respect to the semiconductor light emitting element. In addition, since a lens having a diffusing function is disposed in the immediate vicinity of the semiconductor light emitting device, it is possible to efficiently diffuse light generated by the semiconductor light emitting device, and to reduce the overall size of the present module including the lens.

According to the invention of Claims 12 and 13, the semiconductor light emitting device lighting fixture can be assembled more easily than in the related art.

According to the invention of Claims 14 and 15, each semiconductor light emitting element attachment module (semiconductor light emitting element module) can be easily connected.

According to the invention described in claim 16, the circuit design can be freely performed only by changing the number and arrangement of the conductive pins provided in the chassis.

According to invention of Claim 17, it becomes possible to improve a heat generating effect more.

According to the invention of Claims 18 to 20, a semiconductor light emitting device module excellent in productivity and heat dissipation can be easily assembled.

1 is a perspective view of an LED mounting module of an embodiment according to the present invention.
FIG. 2 is an enlarged cross-sectional view taken along the line II-II of FIG. 1.
3 is an exploded perspective view of the LED mounting module excluding the diffusion lens and the LED element.
4 is an enlarged view of a portion VI of FIG. 3.
5 is a front view of the LED module when the diffusion lens is removed.
6 is a front view of the LED attachment module excluding the diffusion lens and the LED element.
7 is a rear view of the LED module.
FIG. 8 is an enlarged cross-sectional view taken along the line VII-VII of FIG. 5.
FIG. 9 is an enlarged cross-sectional view taken along the line VII-VII of FIG. 6.
FIG. 10 is an enlarged cross-sectional view taken along the line VII-VII of FIG. 6.
11 is a front view of a conducting plate configured for a series circuit.
12 is a rear view of a conductive plate configured for a series circuit.
13 is a schematic diagram of a conductive plate and a series circuit thereof.
14 is an enlarged perspective view of the LED fixture.
15 is a perspective view illustrating a plurality of LED modules and a pair of side connectors in a separated state.
Fig. 16 is a perspective view of an LED lighting fixture that connects a plurality of LED modules, a pair of side connectors and a chassis, and displays the reflecting plate in a separated state.
17 is an enlarged cross-sectional view taken along the line XVI-XVI of FIG. 16.
18 is a perspective view showing a state in which a positive electrode connector and a negative electrode connector are connected to a positive electrode feeder, a negative electrode feeder, and a cable.
19 is an exploded perspective view of the side connector.
20 is an enlarged view showing a portion of the inner side surface of the side connector.
FIG. 21 is an enlarged cross-sectional view taken along the line II-XI of FIG. 20.
Fig. 22 is a front view of a conducting plate constructed for parallel circuits.
Fig. 23 is a schematic diagram of a conductive plate configured for a parallel circuit and its parallel circuit.
24 is a schematic diagram of a conducting plate and its parallel circuit constructed for another type of parallel circuit.

Hereinafter, an embodiment of the present invention will be described in detail with reference to the accompanying drawings. In the following description, each of the up, down, left, and right directions is based on the arrow direction shown in the drawings.

This embodiment applies the present invention to the LED lighting device 10, and the LED lighting device 10 can be used as a backlight of a liquid crystal panel (not shown). As shown in FIG. 16, the LED luminaire 10 includes a LED module (semiconductor light emitting device module) 12, a pair of side connectors 70, a chassis 90, and a reflector 92 as a large component. Have.

First, a detailed structure of the LED module 12 will be described with reference to FIGS. 1 to 14.

In addition, although the LED module 12 in the following description is equipped with five LED elements 60 on account of the space, in fact, the number of LED elements 60 corresponding to the size of the LED lighting fixture 10 is mounted. can do.

The LED module 12 attaches the LED element 60 and the diffusion lens 64 to the LED attachment module 15.

The LED mounting module 15 has a conductive plate 17 serving as a base material, and the conductive plate 17 includes a base plate portion 20, an anode piece 39, and a cathode piece 43.

The base plate part 20 shown in FIG. 11 and FIG. 12 is a long member which stamp-forms metal flat plates, such as brass, phosphor bronze, iron, aluminum, etc., and is extended in the left-right direction. The base plate portion 20 is roughly divided into an anode half portion 21 forming the upper half and a cathode half portion 22 forming the lower half, and the base plate portion 20 has a point symmetrical shape with respect to its center point. The positive electrode half portion 21 and the negative electrode half portion 22 are connected to each other by a total of ten cutting bridges 23 and a total of eight circuit design bridges 24. The left and right ends of the positive electrode half portion 21 constitute the positive electrode side feed portion (first feed portion) 25, and the left and right both ends of the negative electrode half portion 22 constitute the negative electrode side feed portion (second feed portion) 26. Doing. A portion of the positive electrode half portion 21 except for the left and right positive electrode side power feeding portions 25 is divided into five positive electrode side conductive portions (first conductive portion) 28 that are separated from each other. Further, the first holding piece (fixed piece) 30 is provided so as to protrude in the forward direction by cutting and standing the anode side conducting portion 28. The portions of the negative electrode half portion 22 except for the left and right negative electrode side feeding portions 26 are divided into five negative electrode side conductive portions (second conductive portions) 32 which are separated from each other. In addition, the second holding pieces (fixed pieces) 34 are provided on each cathode side conducting portion 32 so as to protrude in all directions. In addition, the base plate portion 20 has four through holes 35 that span the anode half portion 21 and the cathode half portion 22 and are located between the pair of circuit design bridges 24.

As shown in the drawing, the base plate portion 20 has a wider upper and lower width LED fixing portion (semiconductor light emitting element fixing portion) 36 at the five locations in its longitudinal direction at regular intervals (on the positive electrode half portion 21 side). The part constitutes the upper half, and the part on the negative half 22 constitutes the lower half). A circular through hole 37 is formed in the anode half portion 21 side and the cathode half portion 22 side portion of each of the LED fixing parts 36 to form a circular shape.

As shown in Fig. 14, the anode-side conducting portion 28 of each LED fixing portion 36 includes, for example, an anode piece (first contact portion) (first contact piece) made of, for example, an elastic material made of phosphor bronze. ) Is placed. The anode piece 39 is in contact with the LED fixing part 36 (anode half part 21), and is fixed to the LED fixing part 36 by fixing with a tool or the like to fix the joint or by welding or the like. And an LED fixture 36 (cantilever-shaped elastic deformation portion 41 spaced forward from the anode half portion 21) extending from the fixing portion 40 toward the left side. As described above, the elastic deformation portion 41 is positioned directly below the first gripping piece 30 formed on the same LED fixing portion 36, and the elastic deformation portion 41 is the fixing portion 40 and the connecting portion (base end). It is possible to elastically deform in the front-rear direction with the center as the center. And a second contact piece 43. The cathode piece 43 is in contact with the LED fixing part 36 (cathode part 22) and is driven or clamped with a tool or the like. A substantially rectangular fixing portion 44 fixed to the LED fixing portion 36 by fixing the junction or by welding or the like, and the LED fixing portion 36 (cathode half portion 22) extending toward the right front from the fixing portion 44. Has elastically deformed portions 45 that are spaced apart in all directions, as shown, the elastically deformed portions 45 are located directly above the second gripping piece 34 formed on the same LED fixture 36, The elastic deformation part 45 is elastically deformable in the front-back direction centering on the connection part (base end part) with the fixed part 44. As shown in FIG.

The surfaces of the conductive plate 17 (base plate portion 20, positive electrode piece 39, and negative electrode piece 43) having the above-described structure are coated with resin (for example, PBT, LCP, nylon, etc.).

When performing coating (outsert molding) by this resin, the position which protruded in the metal mold | die not shown in figure in the state which tied the cutting bridge 23 and the circuit design bridge 24 of the whole base board part 20 together is tied. The through-hole positioning holes 37 of the anode half portion 21 and the cathode half portion 22 are fitted to the crystal pin, and the base plate portion 20 (the anode half portion 21 and the cathode half portion 22) is positioned. Support from Subsequently, the base plate 20 is fixed by closing the mold, and the resin material which is integrally cured with the base plate 20 is separated from the mold while the resin is cooled and cured in the cavity of the mold. Then, as shown in Figs. 6 to 8, the surface insulating portion 48 made of the resin is formed on almost the entire surface of the base plate portion 20. As shown in Figs. At this time, since each of the anode-side conducting portion 28 and the cathode-side conducting portion 32 is connected by the cutting bridge 23 and the circuit design bridge 24, the conducting plates 17 are scattered in the mold, respectively. It is not lost or displaced. In the case of forming the long LED attaching module 15, the surface insulating portion 48 is formed on the end side of one side of the conductive plate 17 by using a mold, and the mold is separated from the mold and installed around the mold. By one conveying apparatus, a portion adjacent to the portion of the conductive plate 17 (a portion where the surface insulation portion 48 is unmolded) is moved in the mold to form the surface insulation portion 48 in the portion. By repeating this operation a plurality of times, the surface insulating portion 48 is formed on the entire conductive plate 17.

5 to 7, the tip end portions of the anode side feed portion 25 and the cathode side feed portion 27 of the surface insulation portion 48 are not covered. In addition, the surface insulating portion 48 is the first gripping piece 30, the second gripping piece 34, the elastic deformation portion 41 and the elastic deformation portion 45 in a portion covering the front surface of each LED fixing portion 36. The center hole 49 for exposing) is provided. On the other hand, the fixing part 40 of the positive electrode piece 39 and the fixing part 44 of the negative electrode piece 43 are covered by the surface insulating part 48. In addition, the part corresponding to each LED fixing part 36 on the front surface of the surface insulating part 48 has a circular shape and is thicker than the periphery part, and the periphery of the part (the diffusion lens 64 described later) An inclined surface (support) 56 for positioning and support. In addition, the surface insulating portion 48 has the same number of forming holes 50 as the through positioning holes 37 formed by removing the positioning pins from the respective through positioning holes 37 after forming. In addition, the surface insulation portion 48 has a total of eight exposure holes (exposure portions) 51 exposing the entire surface of each LED fixing portion 36 in a portion covering the entire surface of each LED fixing portion 36, It has four exposure holes 51 which expose the back surface of each LED fixing part 36 in total. Moreover, since the surface insulation part 48 has the cutting hole 52 for exposing each cutting bridge 23 back and forth on the front and back both surfaces, the cutting hole 52 is formed after the surface insulation part 48 is formed. It cut | disconnects the whole cutting bridge 23 physically using (the cutting bridge 23 is divided into two, and both are separated from each other).

Moreover, the back surface of the surface cutting part 48 is provided with the exposure hole (exposure part) 53 for exposing the base part of the 1st holding piece 30 and the 2nd holding piece 34. As shown in FIG. Further, circular holes 54 and rectangular holes 55 smaller than the through holes 35 are formed in portions corresponding to the through holes 35. The circular hole 54 and the rectangular hole 55 can be used as a screw hole or a locking hole for fixing the LED module 12 to a chassis or heat sink of an application (a device to which the LED module 12 is attached). .

 The conductive plate 17 (base plate portion 20, anode piece 39, cathode piece 43) and surface insulating portion 48 described above are components of the LED attaching module 15.

The LED module 12 is attached by attaching a total of five LED elements (semiconductor light emitting elements) 60 and a diffusion lens 64 to the LED attachment module 15 including the conductive plate 17 and the surface insulating portion 48. Configure.

The LED element 60 has a rectangular substrate 61 having an anode and a cathode (not shown in the drawing) on the lower surface thereof, and an LED 62 for connecting the anode and the intaglio supported by the substrate 61. Each LED element 60 is inserted into the center hole 49 of the corresponding LED fixing part 36 and the substrate 61 is fixedly fixed by the first holding piece 30 and the second holding piece 34. When fixed (at this time, the first holding piece 30 and the second holding piece 34 slightly elastically deform in a direction away from each other), the anode formed on the lower surface of the substrate 61 is the elastic deformation portion of the anode piece 39 41, the cathode contacts the elastic deformation portion 45 of the cathode piece 43, and a part of each LED element 60 is contained by the corresponding center hole 49 (center hole ( 41), see FIG. 8). In addition, since the LED element 60 has a polarity, an erroneous insertion key may be formed in the central hole 49 or the recognition mark may be carved on the front surface of the LED fixing part 36.

Further, a diffusion lens 64 having a rear concave portion 65 in the rear center portion is fixed to the surface insulating portion 48 by adhesion or the like. As shown in FIG. 2, the annular inclined surface formed around the rear recessed portion 65 is positioned by fitting (surface contacting) to the support portion 56 of the surface insulation portion 48, and the diffusion lens 64 is positioned. When fixed, the LED element 60 is located in the rear recess 65 (the LED element 60 is located directly behind the bottom of the rear recess 65).

As described above, each LED module 12 shown in FIG. 15 is one plane while assembling a plurality of LED modules 12 (only three of them are shown in FIGS. A pair of left and right side connectors 70 are connected to the positive and negative side power supply portions 25 and the negative electrode side power supply portions 26 on the left and right sides of each LED module 12 side by side.

The side connector 70 is an insulator 71, an anode side contact (first connection member) 75, a cathode side contact (second connection member) 76, a cable (first connection member) 83 as a large component. ) And a cable (second connection member).

The insulator 71 is a member molded by an insulating resin material and extending in the vertical direction. A pair of front and rear cable support grooves 72 extending in the longitudinal direction of the insulator 71 are recessed on the outer surface of the insulator 71, and the cable support groove 72 and the inner surface of the insulator 71. A plurality of interlocking insertion holes 73 are formed (in the drawing, only three insertion holes 73 are depicted, but are actually provided with the same number of heads of the LED module 12). Moreover, inside the insertion hole 73, the center protrusion 74 which forms the clearance gap between the upper and lower surfaces of the insertion hole 73, and the front surface is provided.

Both the anode-side contact 75 and the cathode-side contact 76 which are paired with each other are made of metal, and have a pair of elastic contact pieces (connection part) 77 which shifted the front-back position of each other. The anode contact 75 is located forward of the elastic contact piece 77, and is provided with a connecting hook 78 having a conductive groove 79 formed in the cross section. Paired anode-side contacts 75 and cathode-side contacts 76 are fixed to respective insertion holes 73 of insulator 71. The connecting hook 78 of the positive electrode contact 75 is inserted into a gap above the central protrusion 74 in the insertion hole 73, and the connecting hook 80 of the negative electrode contact 76 is an insertion hole ( It is inserted in the gap below the center protrusion 74 in 73, and the elastic contact surface 77 of the anode side contact 75 and the cathode side contact 76 is located in the insertion hole 73. As shown in FIG.

The cable 83 and the cable 84 are each provided with the electric wire 85 which is a core material, and the coating tube 86 which consists of an insulating material which coat | covers the surface of the electric wire 85. As shown in FIG. When the cable 83 is inserted into the cable retaining groove 72 on the front side of the insulator 71 and the cable 84 is inserted into the cable retaining groove 72 on the rear side of the insulator 71, FIGS. 17 and 21. As shown in the figure, the cable 83 and the cable 84 are fitted into the conductive groove 79 of the connecting hook 78 and the conductive groove 81 of the connecting hook 80, respectively, and the conductive groove 79 and the conductive wire are connected. Each of the covering tubes 86 is torn into the grooves 81 so as to contact the wires 85.

When the left and right ends of each of the LED modules 12 are inserted into the insertion holes 73 of the left and right side connectors 70 assembled in this manner, the anode feed part 25 and the cathode feed part 25 which are both ends thereof ( Since 26 is inserted and fixed back and forth by the elastic contact pieces 77 before and after the anode side contact 75 and the cathode side contact 76 (see FIG. 18), the left and right side side connectors 70 and each LED module are fixed. (12) is integrated.

Subsequently, the integrated LED module 12 and the side connector 70 are fixed to the front surface of the metal (for example, cold rolled steel sheet excellent in press formability) chassis (heat sink) 90, and each LED mounting module 15 The rear surface of the surface insulating portion 48 is brought into contact with the front surface of the chassis 90.

Finally, the same number of lens exposure holes 93 as that of the diffusion lens 64 and the same arrangement are formed, and a light reflection layer is formed on the surface of polyethylene telepete (PET) or the like by vacuum deposition of metal such as aluminum. Both left and right sides of the film-like reflector plate 92 are fixed to the left and right side connectors 70, and the respective diffuser lenses 64 are exposed through the respective lens exposure holes 93.

The LED luminaire 10 assembled in this way is positioned immediately behind the liquid crystal panel (not shown) together with a deflection filter (not shown) and the one end of the cables 83 and 84 of the left and right side connectors 70, respectively. Connect to the power supply. When the switch (not shown) is turned on, current flows from the power supply to each LED module 12 through the cables 83 and 84.

As shown in FIG. 13, in the front surface of the conduction plate 17 of this embodiment, the anode side conduction part 28 and the cathode side conduction part 32 formed in the same LED fixing part 36 are the anode piece ( 39, an LED electrically conducting by the cathode piece 430 and the LED element 60, and adjacent to the LED fixing part 36 on which the anode-side conducting portion 28 and the anode-side conducting portion 28 are formed. Since the cathode-side conduction portion 32 formed in the fixed portion 36 is electrically conducting through the circuit design bridge 24, a series circuit is formed on the front surface of the conduction plate 17. Therefore, an LED module ( When the current flows in 12, each LED 62 positioned on the series circuit emits light, and the illumination light emitted by the LED 62 is diffused by each diffusing lens 64 and reflected by the reflecting plate 92. The liquid crystal panel operates because it is turned forward through the forward filter.

According to this embodiment described above, since one part of many LED elements 60 can be attached to the conducting plate 17 of one body, the LED attachment module 15 (LED module 12) It is possible to reduce the thickness and to facilitate assembly and manufacturing, and to reduce the work process of assembling the LED module 12 into the LED luminaire 10, thereby improving productivity.

In addition, since the surface of the conductive plate 17 is covered with the surface insulating portion 48, the insulation of the LED mounting module 15 is good. In addition, since the base plate portion 20 is made of a single plate and the surface thereof is covered with the surface insulating portion 48, the module for attaching the LED 15 has great rigidity.

In addition, it is possible to efficiently flow the heat of the LED element 60 to the conductive plate 17 through the first gripping piece 30 and the second gripping piece 34 and by means of a metal having excellent thermal conductivity and heat dissipation. It is possible to increase the area and thickness of the molded base plate portion 20, and further, the heat transferred to the conductive plate 17 to the outside through the exposed holes 51 and 53 and the thin surface insulating portion 48. Since the heat dissipation is possible, the LED attachment module 15 is excellent in heat dissipation. Therefore, heat generated by the LED element 60 can be efficiently radiated to the outside through the conductive plate 17, the thin surface insulation 48, and the chassis (heat radiating plate) 90.

In addition, since the LED element 60 can be embedded and fixed with respect to the conductive plate 17, and there is no need to solder or reflow both, the assembly and adhesion of the LED element 60 and the conductive plate 17 are good. It can be done.

Moreover, since there is no need to perform reflow, there is no possibility that the LED element 60 may be damaged by heat.

Further, since each LED element 60 is disposed on a series circuit formed on the conductive plate 17, it is possible to reduce the variation in the luminance of each LED element 60.

In addition, since the conductive plate 17 is formed of only the first gripping piece 30 and the second gripping piece 34 which are members for supporting the LED element 60 by phosphor bronze having excellent elasticity, The manufacturing cost can be reduced.

In addition, since the base plate portion 20 is made thinner (with a narrower width) except for the LED fixing portion 36 that exhibits a heat dissipation effect, the conductive plate 17 and the surface insulation portion 48 are lightened and the LED mounting module The manufacturing cost of (15) can be reduced.

In addition, since the surface insulating portion 48 has a supporting portion 56 for fixing the LED element 60, the diffusion lens 64 can be positioned at an appropriate position with respect to the LED attaching module 15. In addition, since the diffusion lens 64 having a diffusion function can be disposed in the immediate vicinity of the LED element 60, the light emitted by the LED element 60 can be efficiently diffused, and the diffusion lens 64 is included. The whole LED mounting module 15 can be reduced.

In addition, since the LED connector 15 is connected to each other using the side connector 70, the assembly of the LED lighting fixture 10 is easy.

In addition, various types of circuits can be easily configured on the conductive plate 17 by changing the type (position) of the bridge formed in the base plate portion 20 during the stamping molding.

22 and 23 show an example in which parallel circuits are formed on the conductive plate 17. The conductive plate 17 of this modified example has a positive electrode bridge 29 for connecting the positive electrode side conductive parts 28 adjacent to each other by the stamping molding, and a negative electrode for connecting the negative electrode conductive parts 32 adjacent to each other. The bridge 33 is formed, and there is no circuit design bridge 24 on one side thereof. The LED element 60 is attached to such a conductive plate 17 (physically cutting each of the cutting bridges 23 after forming the surface insulating portion 48), and the anode feed part 25 is connected to the side connector. When connected to the cable 83 of 70 and connecting each cathode side feed portion 26 to the cable 84 of the side connector 70, the anode side conduction portion 28 adjacent to each other as shown in FIG. The electrical conduction between each other via the anode bridge 29, the adjacent cathode-side conducting portion 32 is electrically conducting via the cathode bridge 33, and the anode formed on the same LED fixing portion 36 Since the side conducting portion 28 and the cathode side conducting portion 32 are electrically conducted by the anode piece 39, the cathode piece 43, and the LED element 60, a parallel circuit is formed on the front surface of the conducting plate 17. Formed. Therefore, even if one LED element 60 is damaged, the other LED element 60 maintains a state in which light can be emitted, so that it can be used in a device (lighting device 10, etc.) that requires lifetime or reliability of light emission. desirable.

24 shows an example in which a parallel circuit of a type different from that of FIGS. 22 and 23 is formed on the conductive plate 17. The difference from the conduction plate 17 of FIG. 22 of the conduction plate 17 of this modification is left without cutting each cutting bridge 23 located in one end part (right end part in the figure), and each cutting The positive electrode feeder 25 and the negative electrode feeder 20 located at the end of the bridge 23 side are not connected to the side connectors 70 (cables 83 and 84). When the parallel circuit is formed on the conductive plate 17, the wiring (the side connector 70 on the right side) is less than that of the parallel circuits of FIGS. 22 and 23. The same effects as in the case can be obtained.

In the case of forming this parallel circuit, a cutting bridge is formed between the anode-side conducting portion 28 and the cathode-side conducting portion 32 formed on the LED fixing portion 36 on one end side of the base plate portion 20 by stamping. You may physically cut | disconnect the whole cutting bridge 23 in the point which connected by the bridge different from (23).

And the whole bridge (cutting bridge 23, the circuit design bridge 24, the positive electrode bridge 29, and the negative electrode bridge 33) is formed in the base board part 20 by stamping shaping | molding, and after that, An arbitrary electrical circuit may be formed on the conductive plate 17 by physically cutting the bridge of the one to be selected.

As mentioned above, although this invention was demonstrated based on the said embodiment, this invention can be implemented in various aspects different from the said embodiment.

For example, the base plate 20 may be made of a metal material other than the above excellent in conductivity, thermal conductivity and heat dissipation, or the positive electrode piece 39 and the negative electrode piece 43 may be made of metal other than phosphor bronze having excellent elasticity and conductivity. You may comprise with a material. Moreover, the base plate part 20, the positive electrode piece 39, and the negative electrode piece 43 may be integrally formed by the whole conductive plate 17 comprised by the metal material excellent in electroconductivity, elasticity, and heat dissipation.

Instead of the exposure hole 51, a cutout or the like for exposing the conductive plate 17 may be formed in the surface insulation portion 48.

In addition, the number of LED fixing parts 36 formed on one base plate 20 (the number of LED elements 60 and diffusion lenses 64 attachable to one LED attaching module 15) or one LED The number of LED modules 12 with which the luminaire 10 is equipped is not limited to the thing of the said embodiment.

In addition, the reflecting plate 92 may be omitted from the LED lighting fixture 10.

In addition, since the chassis 90 is made of a conductive metal material, the circuit is formed on the chassis 90 by printing or the like, and the entire bridge (cutting bridge 23, circuit design bridge 24) is formed. The anode bridge 29 and the cathode bridge 33 are cut off, and a plurality of conductive pins made of a conductive metal material on the front surface of the chassis 90 and connected to the circuit are projected and exposed. Each conduction pin may be brought into contact with the anode-side conduction portion 28 or the cathode-side conduction portion 32 of each LED mounting module 15 via 51.

According to this modification, the circuit design can be freely performed only by changing the number or arrangement of the conduction pins provided in the chassis 90.

In addition, the base plate portion 20 of the LED module 12 and the chassis 90 may be brought into contact with each other (with no short circuit occurring) to further improve heat dissipation.

This design change, for example, forms a metal contact protrusion protruding outward from the exposed hole of the surface insulation portion 48 in the base plate portion 20, and makes the contact protrusion contact the chassis 90, or Alternatively, a metal contact protrusion is formed on the side of the chassis 90 so that the contact protrusion is provided with a metal contact spring similar to the positive electrode piece 39 or the negative electrode piece 43 on the base plate portion 20 through the exposed hole. The spring may contact the chassis 90 through the exposure hole.

Moreover, the indoor lighting fixture is arrange | positioned by arrange | positioning the LED module 12 (1 piece may be sufficient, and multiple LEDs may electrically connect each LED module 12 to each other side by side in a straight line) in the cylindrical tube member comprised by the translucent material. May be configured.

10: LED lighting fixture (semiconductor light emitting device lighting fixture)
12: LED module (semiconductor light emitting device module)
15: LED attachment module (module for semiconductor light emitting element attachment)
17: conduction plate 20: base plate
21: anode half 22: cathode half
23: cutting bridge 24: circuit design bridge
25: positive electrode feeder (first feeder) 26: negative electrode feeder (second feeder)
28: anode side conducting portion (first conducting portion) 29: anode bridge
30: 1st holding piece (fixed piece) 32: cathode side conducting part (second conducting part)
33: cathode bridge 34: second gripping piece (fixed piece)
35: Through hole
36: LED fixing part (semiconductor light emitting element fixing part)
37: through positioning hole
39: anode piece (first contact portion) (first contact piece)
40: fixed part 41: elastic deformation part
43: cathode piece (second contact portion) (second contact piece)
44: fixing part 45: elastic deformation part
48: surface insulation 49: center hole
50: molding hole 51: exposed hole (exposed part)
52: cutting hole 53: exposure hole (exposed part)
54: circular hole 55: rectangular hole
56 support 60 LED device (semiconductor light emitting device)
61: substrate 62: LED
64 diffused lens 65 backside recessed portion
70: side connector 71: insulator
72: cable retaining groove 73: insertion hole
74: center protrusion 75: anode side contact (first connection member)
76: cathode side contact (second connection member) 77: elastic contact piece (connection)
78, 80: hook hook 79, 81: through groove
83: cable (first connection member) 84: cable (second connection member)
85: wire 86: coated tube
90: chassis (heat sink) 92: reflector
93: lens exposure hole

Claims (20)

A first contact portion and a second contact portion, and a first contact portion and a second contact portion, the one end of which is in contact with the first and second conducting portions, respectively, and the other end thereof is capable of conducting with the anode and the cathode of the semiconductor light emitting element, respectively. A conductive plate formed of a metal having a plurality of semiconductor light emitting element fixing parts provided side by side and having first and second feed parts respectively connected to the first and second conductive parts positioned at both ends thereof, respectively. and,
A surface insulator that covers the surface of the conductive plate while the other ends of the first and second contact portions and the first feed portion and the second feed portion are exposed;
The semiconductor light emitting device fixing part is provided with a pair of fixing pieces which can be fixed while the semiconductor light emitting device is fitted;
The surface insulating portion exposes the fixing piece;
The entire first conductive portion separated from each other is connected so as to be conductive with the second conductive portion of the semiconductor light emitting element fixing portion such as itself, and the other semiconductor light emitting element is located on one side in the longitudinal direction of the conductive plate. A module for attaching a semiconductor light emitting element characterized in that it is connected to a second conducting portion of the government. delete delete The method of claim 1,
The entire first conductive portion is connected to each other,
The entire second conductive portion is connected to each other,
The first conductive portion and the second conductive portion are separated from each other,
A module for attaching a semiconductor light emitting element, wherein the first conducting portion is enabled to conduct with the second conducting portion of a semiconductor light emitting element fixing portion such as itself. The method of claim 1,
The entire first conductive portion is connected to each other,
The entire second conductive portion is connected to each other,
Only the first conductive portion and the second conductive portion of the semiconductor light emitting element fixing portion located at one end side of the conductive plate are connected to each other,
A module for attaching a semiconductor light emitting element, wherein the first conducting portion is enabled to conduct with the second conducting portion of a semiconductor light emitting element fixing portion such as itself. The method according to any one of claims 1, 4 and 5,
The first contact portion and the second contact portion,
The semiconductor light emitting device fixing part is made of a metal having elasticity and at the same time, one end of which is connected to the first conducting part and the second conducting part, respectively, and the other end of the semiconductor light emitting device fixing part is separated from the semiconductor. A module for attaching a semiconductor light emitting element, wherein the first contact piece and the second contact piece are respectively conductive to the anode and the cathode of the light emitting device. The method according to claim 6,
The semiconductor light emitting element attachment module having the semiconductor light emitting element fixing portion is wider than other portions of the conductive plate. 8. The method of claim 7,
A module for attaching a semiconductor light emitting element having an exposed portion for exposing a portion of the conductive plate to the surface insulating portion. The method of claim 8,
A module for attaching a semiconductor light emitting element, wherein the first conducting plate and the second conducting portion of a semiconductor light emitting element fixing part, such as the conducting plate, are connected by a cutting bridge that can be physically cut. The method of claim 9,
And a support portion for supporting a diffusion lens for diffusing light generated by the semiconductor light emitting element, in the surface insulating portion. delete A first contact portion and a second contact portion, and a first contact portion and a second contact portion, the one end of which is in contact with the first and second conducting portions, respectively, and the other end thereof is capable of conducting with the anode and the cathode of the semiconductor light emitting element, respectively. A conductive plate formed of a metal having a plurality of semiconductor light emitting element fixing parts provided side by side and having first and second feed parts respectively connected to the first and second conductive parts positioned at both ends thereof, respectively. and,
A plurality of semiconductor light emitting device modules having a semiconductor light emitting device in which an anode and a cathode of the first contact portion and a second contact portion are electrically connected to each other, and arranged in a direction orthogonal to a length direction of the conductive plate;
A pair of first connection members for connecting the respective first feeders located at the end portions of the semiconductor light emitting element attachment modules in the same direction;
A pair of second connection members for connecting the respective second feeders positioned on the end side in the same direction of each semiconductor light emitting element attachment module;
And an insulator for supporting the first connecting member and the second connecting member respectively located on the same side. A first contact portion and a second contact portion, and a first contact portion and a second contact portion, the one end of which is in contact with the first and second conducting portions, respectively, and the other end thereof is capable of conducting with the anode and the cathode of the semiconductor light emitting element, respectively. A conductive plate formed of a metal having a plurality of semiconductor light emitting element fixing parts provided side by side and having first and second feed parts respectively connected to the first and second conductive parts positioned at both ends thereof, respectively. and,
A plurality of semiconductor light emitting device modules having a semiconductor light emitting device in which an anode and a cathode of the first contact portion and a second contact portion are electrically connected to each other, and arranged in a direction orthogonal to a length direction of the conductive plate;
A pair of first connection members for connecting the first feeders positioned at one end side of each semiconductor light emitting element attachment module to each other;
A pair of second connection members for connecting the respective second feeders positioned at one end side of each semiconductor light emitting element attachment module to each other;
And an insulator for supporting the first connecting member and the second connecting member, respectively. The method according to claim 12 or 13,
At least one of the first connecting member and the second connecting member,
A metal connecting member having a connecting portion connected to the first feeding portion or the second feeding portion and a conductive groove;
A semiconductor light emitting device lighting device having a wire supported by the conductive groove. The method of claim 14,
And the connecting portion is formed of a pair of elastic contact pieces which fix the first feed portion or the second feed portion on both sides of the front and back. 16. The method of claim 15,
And a chassis having a circuit and a plurality of metal conductive pins connected to the circuit and capable of fixing the respective semiconductor light emitting device modules.
The first conducting portion and the second conducting portion as a whole are separated from each other,
A surface insulating portion covering the surface of the conductive plate and formed of resin;
An exposed portion for partially exposing the first conductive portion and the second conductive portion as a whole in the surface insulating portion;
And each conductive pin is in contact with the first conductive portion and the second conductive portion through the exposed portion, respectively. 17. The method of claim 16,
A semiconductor light emitting element lighting device, wherein the chassis is made of metal. A first contact portion and a second conduction portion, one end of which is connected to the first conduction portion and the second conduction portion, respectively, and the other end is provided with a first contact portion and a second contact portion that are capable of conducting respectively with the anode and the cathode of the semiconductor light emitting element; A first feed portion and a second feed portion that are provided with a plurality of semiconductor light emitting element fixing parts side by side and are in contact with the first and second conducting portions respectively positioned at both ends; and the first conducting portion and the first conducting portion A second connecting portion of the semiconductor light emitting element fixing portion, such as a conductive portion, having a cutting bridge that can be physically cut and having the first conductive portion located on one side in the longitudinal direction of the conductive plate; Stamping-forming a conductive plate formed of a metal connected to the conductive portion;
Covering the surface of the conductive plate with a surface insulating portion formed of a resin material while exposing the other ends of the first contact portion and the second contact portion and the first feed portion and the second feed portion; And
A method of manufacturing a module for attaching a semiconductor light emitting device comprising the steps of physically cutting the entire cutting bridge. A first contact portion and a second contact portion, one end of which is connected to the first conduction portion and the second conducting portion, respectively, and the other end has a first contact portion and a second contact portion that are capable of conducting respectively with the anode and the cathode of the semiconductor light emitting element; A first feed portion and a second feed portion that form a plurality of semiconductor light emitting element fixing portions side by side and electrically connect with the first conductive portion and the second conductive portion located at both ends, and the first conductive portion and the same; A conductive bridge having a cutting bridge which connects the first conductive portion of the semiconductor light emitting element fixing portion such as the first conductive portion and is physically cut, and wherein the first conductive portions and the second conductive portions are formed of a metal connected to each other; Stamping forming the plate;
Covering the surface of the conductive plate with a surface insulating portion made of a resin material while exposing the other ends of the first contact portion and the second contact portion and the first feed portion and the second feed portion; And
A method of manufacturing a module for attaching a semiconductor light emitting device comprising the steps of physically cutting the entire cutting bridge. A first contact portion and a second contact portion, one end of which is in contact with the first and second conduction portions, respectively, and the other end has a first contact portion and a second contact portion that are capable of conducting respectively with the anode and the cathode of the semiconductor light emitting element; One end portion in the longitudinal direction of the first feed portion and the second feed portion, and the conduction plate, each of which has a plurality of semiconductor light emitting element fixing portions formed side by side and electrically connected to the first conducting portion and the second conducting portion, respectively positioned at both ends. An end bridge for connecting the first conducting portion and the second conducting portion, which is located in the first conducting portion, and the second conducting portion capable of connecting and physically cutting the first conducting portion and the second conducting portion of the semiconductor light emitting element fixing unit such as the first conducting portion. Stamping-forming a conductive plate having a cutting bridge, the conductive plate being formed of a metal in which the first conductive portions and the second conductive portions are connected to each other;
Covering the surface of the conductive plate with a surface insulating portion formed of a resin material while exposing the other ends of the first contact portion and the second contact portion and the first feed portion and the second feed portion; And
And a step of physically cutting the cutting bridge as a whole.

Images