JP2013074043A - Electronic apparatus and reinforcement member - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an electronic apparatus which, even when the thickness of a reinforcement member is relatively thin, can sufficiently lower the possibility of an electronic component housed in an internal space being broken.SOLUTION: An electronic apparatus 100 comprises an enclosure 101 having an internal space SP formed therein, an electronic component 102 housed in the internal space SP, and a reinforcement member 103 housed in the internal space SP. The reinforcement member 103 includes a flat plate-like base part 103a disposed so as to intersect a prescribed first reference direction D1 almost at right angles and at least one leg part 103b extending from the base part 103a along a direction almost parallel to the first reference direction D1. The base part 103a is disposed between the enclosure 101 and the electronic component 102 in the first reference direction D1, and a portion of the base part 103a including at least part of its surface is a high Young's modulus layer 103c which has a higher Young's modulus than that of the other portions.

Description

  The present invention relates to an electronic device in which an electronic component is accommodated in an internal space.

  An electronic device in which an electronic component is housed in an internal space is known. As one of this type of electronic device, the electronic device described in Patent Document 1 includes a housing in which an internal space is formed, an electronic component accommodated in the internal space, a reinforcing member accommodated in the internal space, Is provided.

  The reinforcing member extends from the base along a direction substantially parallel to the thickness direction, and is fixed so as to be immovable with respect to the casing. A pair of legs. According to this, when external force is applied to the housing, it is possible to reduce the possibility that the electronic component is damaged.

JP 2000-151132 A

  By the way, an electronic device may be carried by a user. Therefore, in order to facilitate portability by the user, it is required to make the casing of the electronic device much thinner. In order to reduce the thickness of the housing, it is considered preferable to reduce the thickness of the reinforcing member. However, when the reinforcing member is formed thinner, the strength of the reinforcing member is reduced.

  On the other hand, if the Young's modulus of the reinforcing member is increased, the strength of the reinforcing member can be maintained relatively high even when the thickness of the reinforcing member is thinner. However, it is difficult to process a material having a relatively high Young's modulus.

  That is, in the above electronic device, when the reinforcing member is relatively thin, there is a problem that the electronic component housed in the internal space is relatively likely to be damaged when an external force is applied to the housing. there were.

  For this reason, the object of the present invention is the above-mentioned problem “when the thickness of the reinforcing member is relatively thin, the electronic component accommodated in the internal space may be damaged when an external force is applied to the housing. The object is to provide an electronic device capable of solving the “relatively high”.

In order to achieve such an object, an electronic device according to one embodiment of the present invention is provided.
A housing in which an internal space is formed;
Electronic components housed in the internal space;
A reinforcing member housed in the internal space;
With
The reinforcing member is
A plate-like base portion disposed so as to be substantially orthogonal to a predetermined first reference direction;
At least one leg extending from the base along a direction substantially parallel to the first reference direction;
Have
The base is disposed between the housing and the electronic component in the first reference direction,
The part including at least a part of the surface of the base is a high Young's modulus layer having a Young's modulus higher than that of other parts.

  Moreover, the reinforcing member which is the other form of this invention is a reinforcing member accommodated with an electronic component in the internal space formed in the housing | casing with which an electronic device is provided.

Furthermore, this reinforcing member
A plate-like base portion disposed so as to be substantially orthogonal to a predetermined first reference direction;
At least one leg extending from the base along a direction substantially parallel to the first reference direction;
Have
The base is disposed between the housing and the electronic component in the first reference direction,
The part including at least a part of the surface of the base is a high Young's modulus layer having a Young's modulus higher than that of other parts.

  By configuring as described above, the present invention can sufficiently reduce the possibility that the electronic component housed in the internal space is damaged even when the thickness of the reinforcing member is relatively thin. .

1 is a perspective view of an electronic device according to a first embodiment of the present invention. 1 is an exploded perspective view of an electronic device according to a first embodiment of the present invention. It is sectional drawing which cut | disconnected the electronic device by the III-III line | wire of FIG. It is the expanded sectional view which expanded the base of the reinforcing member of FIG. It is sectional drawing of an electronic device when external force is applied to the electronic device which concerns on 1st Embodiment of this invention. It is sectional drawing of the electronic device which concerns on 2nd Embodiment of this invention.

  Embodiments of an electronic device and a reinforcing member according to the present invention will be described below with reference to FIGS.

<First Embodiment>
(Constitution)
As shown in FIGS. 1 to 4, the electronic device 10 according to the first embodiment is a mobile phone terminal. FIG. 1 is a perspective view of the electronic device 10. FIG. 2 is an exploded perspective view of the electronic device 10. 3 is a cross-sectional view of the electronic device 10 taken along line III-III in FIG. FIG. 4 is an enlarged view of the base portion 14a of the reinforcing member 14 shown in FIG.

  The electronic device 10 may be a smart phone, a PHS (Personal Handyphone System), a PDA (Personal Data Assistance, Personal Digital Assistant), a car navigation terminal, a tablet terminal, a personal computer, or a game terminal.

As shown in FIG. 1, the electronic device 10 has a flat housing having a rectangular shape when viewed from the front.
Note that the electronic device 10 may include two housings. In this case, the electronic device 10 may be configured so that the present invention is applied to both housings, or may be configured to be applied only to one housing. For example, the electronic device 10 may be a folding or sliding electronic device.

  As shown in FIGS. 1 to 3, the casing of the electronic device 10 includes a front panel 11, a front case 12, and a rear case 13. That is, the front panel 11, the front case 12, and the rear case 13 constitute a housing of the electronic device 10.

  The front panel 11 constitutes the front of the housing of the electronic device 10. The front case 12 constitutes a front-side portion of the side surface (side wall surface) of the casing of the electronic device 10. The rear case 13 constitutes a back side portion of the side surface of the housing of the electronic device 10 and the back surface of the housing of the electronic device 10.

  The front panel 11 is fixed to the front case 12. The front case 12 and the rear case 13 are fixed to each other.

  The front panel 11 includes an output device (for example, a display, a speaker, and a vibration module) that outputs information, and an input device (for example, a key switch, a touch panel, and a pointing device) to which information is input by the user. Have. The front panel 11 is electrically connected to electronic components 15a and 15b described later.

  The front case 12 and the rear case 13 protect the inside of the electronic device 10 and constitute the design of the electronic device 10. For example, the surface (outer wall surface) of the front case 12 and the rear case 13 is subjected to painting, printing, stamping, foil transfer, polishing, or the like.

  Each of the front case 12 and the rear case 13 is made of polycarbonate resin, ABS (acrylonitrile butylene styrene copolymer) resin, nylon resin, aromatic nylon resin, a mixture thereof (for example, engineering plastic), or a light metal alloy (for example, aluminum). Alloy and magnesium alloy). Here, a glass filler or a carbon filler may be added to the engineering plastic.

  The casing of the electronic device 10 is formed with a rectangular parallelepiped internal space SP having a height, a width, and a depth.

Furthermore, the electronic device 10 includes a reinforcing member 14 and electronic components 15a and 15b.
The electronic components 15a and 15b are accommodated in the internal space SP. In this example, the electronic components 15 a and 15 b are fixed to the rear case 13. The electronic components 15a and 15b may be fixed to the front case 12.

  The electronic components 15a and 15b output information via the output device or transmit information via the antenna based on information input via the input device or information received via an antenna (not shown). Etc.

  For example, the electronic components 15a and 15b are a camera module, an LSI (Large Scale Integration) chip, a fine wiring board, an LCD (Liquid Crystal Display) module, or an electrostatic sensor.

  The reinforcing member 14 is a plate-like body having a certain thickness. The reinforcing member 14 is formed by deforming a flat substrate. For example, the reinforcing member 14 is formed by processing such as pressing, bending, or drawing.

  In this example, the substrate is made of stainless steel containing chromium. For example, the base material is made of austenitic stainless steel, martensitic stainless steel, ferritic stainless steel, or SPCC (Steel Plate Cold Commercial).

  The reinforcing member 14 is accommodated in the internal space SP. In this example, the reinforcing member 14 is fixed to the front case 12. The reinforcing member 14 may be fixed to the rear case 13.

  For example, the fixing between the front panel 11, the front case 12, the rear case 13, the reinforcing member 14, and the electronic components 15a and 15b is performed by screwing, bonding with an adhesive or an adhesive, thermal welding, thermocompression bonding, Alternatively, it is fixed by fitting or the like. Moreover, fixation between each member may be implement | achieved by forming two members integrally by performing insert molding or outsert molding.

  The reinforcing member 14 has the same length as the internal space SP in each of the first reference direction, the second reference direction, and the third reference direction. The first reference direction is the height direction D1. The second reference direction is the width direction D2. The third reference direction is the depth direction D3.

  The reinforcing member 14 has a base portion 14a and leg portions 14b. The base portion 14a is a flat plate-like member that is arranged so as to be orthogonal to the first reference direction D1. The leg portions 14b are a pair of members that extend from both ends of the base portion 14a in the second reference direction D2 along a direction parallel to the first reference direction D1.

  The leg portion 14b may be a member that extends only from one end of the base portion 14a. Moreover, the leg part 14b may consist of a pair of member extended from each of the both ends of the base 14a in the 2nd reference direction D2, and a member extended from the end of the base 14a in the 3rd reference direction D3.

  As shown in FIG. 3, the base portion 14a is disposed between the front panel 11 and the electronic components 15a and 15b in the first reference direction D1. In this example, the surface of the base portion 14a on the front panel 11 side in the first reference direction D1 is in contact with the front panel 11 (that is, the wall surface forming the internal space SP).

  Moreover, the leg part 14b is arrange | positioned between the front case 12, the rear case 13, and the electronic components 15a and 15b in the 2nd reference direction D2, as shown in FIG. In this example, the leg portion 14b has a front case 12 and a rear case 13 side surface in the second reference direction D2 of the leg portion 14b, the front case 12 and the rear case 13 (that is, the wall surface forming the internal space SP). ).

  Further, the end of the leg 14b opposite to the base 14a in the first reference direction D1 is a wall surface in the first reference direction D1 direction of the rear case 13 (that is, the internal space of the wall surface of the housing). A wall surface forming SP).

  Thus, the reinforcing member 14 is configured to contact the wall surface that forms the internal space SP. Accordingly, the amount of deformation of the casing of the electronic device 10 when an external force is applied to the casing of the electronic device 10 can be reduced.

  The part including a part of the surface of the base part 14a is a high Young's modulus layer having a Young's modulus higher than that of the other part of the base part 14a.

  Specifically, the high Young's modulus layer 14c is disposed so as to cover the electronic components 15a and 15b when the electronic device 10 is viewed in the first reference direction D1. Furthermore, as shown in FIG. 2, the high Young's modulus layer 14c extends over the range from one end to the other end of the base portion 14a in the third reference direction D3 (that is, the whole in the third reference direction D3). Is formed. That is, the high Young's modulus layer 14c is formed in a strip shape.

  The high Young's modulus layer 14c may be formed only in a part of the range from one end to the other end of the base portion 14a in the third reference direction D3. A high Young's modulus layer may be formed on the entire surface of the base portion 14a.

  Further, the high Young's modulus layer 14c is formed both in the vicinity of the surface of the base portion 14a on the electronic component 15a, 15b side and in the vicinity of the surface of the base portion 14a on the front panel 11 side. The high Young's modulus layer 14c may be formed on only one of the vicinity of the surface of the base portion 14a on the electronic component 15a, 15b side and the vicinity of the surface of the base portion 14a on the front panel 11 side.

  In this example, the high Young's modulus layer 14c is formed only on the base portion 14a, but may be formed on the leg portion 14b in addition to the base portion 14a.

  In this example, the high Young's modulus layer 14c is formed by performing a surface treatment on the base portion 14a after the base portion 14a and the leg portions 14b are formed by processing the base material. According to this, since a base material can be processed easily, the reinforcement member 14 in which the high Young's modulus layer 14c was formed can be manufactured easily. The high Young's modulus layer 14c may be formed by performing a surface treatment before the base portion 14a and the leg portion 14b are formed.

  Here, the surface treatment is a process of heating or cooling the substrate in a state where the substrate is exposed to an atmosphere containing a specific gas or in a state where the substrate is immersed in a specific liquid.

  Specifically, the high Young's modulus layer 14c is formed by nitriding the base material. In this example, a low temperature nitriding process is used as the nitriding process. That is, in this example, the high Young's modulus layer 14c is made of a material mainly composed of chromium nitride.

  The high Young's modulus layer 14c may be made of a nitride compound other than chromium nitride, a carbonized compound, or the like. Further, the high Young's modulus layer 14c may be formed by a heat treatment other than the nitriding treatment (for example, carbonization treatment, carburizing and quenching, or induction hardening).

  In this example, after the portion of the base portion 14a where the high Young's modulus layer 14c is not formed is coated with a coating material such as plating, resin coating, or tape, the surface treatment is performed on the base portion 14a. By doing so, the high Young's modulus layer 14c is formed. Furthermore, after forming the high Young's modulus layer 14c, the covering member is removed to manufacture the reinforcing member 14 on which the high Young's modulus layer 14c is formed.

(Operation)
Next, as shown in FIG. 5, the operation of the electronic device 10 when an external force is applied to the electronic device 10 will be described. FIG. 5 is a cross-sectional view of the electronic device 10 taken along the line III-III in FIG. 1 when an external force is applied to the electronic device 10.

  When an external force is applied to the electronic device 10, the front panel 11, the front case 12, and the rear case 13 that have relatively low rigidity (strength) follow the deformation of the reinforcing member 14 that has relatively high rigidity. ,Deform.

  Here, as shown in FIG. 5, it is assumed that an external force F is applied to the electronic device 10 in the direction from the front panel 11 toward the rear case 13 in the first reference direction D1. In this case, the amount of deformation in the first reference direction D1 of the portion of the base portion 14a where the high Young's modulus layer 14c is formed is smaller than other portions of the base portion 14a.

  Therefore, the reinforcing member 14 can be prevented from coming into contact with the electronic components 15a and 15b. Further, even when the reinforcing member 14 is in contact with the electronic components 15a and 15b, the force with which the reinforcing member 14 presses the electronic components 15a and 15b can be reduced. As a result, it is possible to avoid damage to the electronic components 15a and 15b accommodated in the internal space SP.

  Moreover, according to the said structure, the intensity | strength (for example, bending rigidity) of the reinforcement member 14 can be improved, without changing the thickness of the reinforcement member 14. FIG. Furthermore, compared with the case where a reinforcement member is comprised with the material whose Young's modulus is higher than metals, such as a ceramic, glass, or carbon, possibility that the reinforcement member 14 will carry out a brittle fracture can be reduced.

  As a result, even if a relatively large force is applied to the electronic device 10 within a relatively short time, the possibility of permanent deformation, breakage, yielding, or destruction of the reinforcing member 14 is reduced. can do. Therefore, it is possible to avoid damage to the electronic components 15a and 15b accommodated in the internal space SP.

  In addition, when the thickness of the reinforcing member 14 is 0.1 to 0.4 mm and the thickness of the high Young's modulus layer 14 c is 5% to 20% of the thickness of the reinforcing member 14, the above-described effect is more effective. It appears even more prominently.

  As described above, according to the electronic device 10 according to the first embodiment of the present invention, an external force is applied to the casing of the electronic device 10 even when the reinforcing member 14 is relatively thin. In this case, the amount of deformation of the reinforcing member 14 can be reduced. Therefore, it is possible to avoid damage to the electronic components 15a and 15b accommodated in the internal space SP.

  Furthermore, according to the said structure, since a reinforcement member can be formed by deform | transforming the base material which consists of a material which has a comparatively low Young's modulus, the reinforcement member 14 can be manufactured easily.

In addition, in the electronic device 10 according to the first embodiment of the present invention, the high Young's modulus layer 14c is formed by performing surface treatment after the base portion 14a and the leg portions 14b are formed.
According to this, the reinforcing member 14 in which the high Young's modulus layer 14c is formed can be easily manufactured.

Furthermore, in the electronic device 10 according to the first embodiment of the present invention, the reinforcing member 14 is configured such that the leg portions 14b extend from both ends of the base portion 14a in the second reference direction D2.
According to this, the reinforcement member 14 can be easily manufactured by bending a flat member (base material).

In addition, in the electronic device 10 according to the first embodiment of the present invention, the surface of the base portion 14a on the housing side is configured to be in contact with the housing.
According to this, when an external force is applied to the housing, the amount of deformation of the portion of the housing that contacts the base portion 14a can be reduced.

Furthermore, in the electronic device 10 according to the first embodiment of the present invention, the high Young's modulus layer 14c is disposed so as to cover the electronic components 15a and 15b when the electronic device 10 is viewed in the first reference direction D1. Is done.
According to this, when external force is applied to the housing, it is possible to more reliably avoid damage to the electronic components 15a and 15b accommodated in the internal space SP.

Second Embodiment
Next, an electronic apparatus according to a second embodiment of the present invention will be described with reference to FIG. FIG. 6 is a cross-sectional view of the electronic device 100.

The electronic device 100 according to the second embodiment includes:
A housing 101 in which an internal space SP is formed;
An electronic component 102 accommodated in the internal space SP;
A reinforcing member 103 accommodated in the internal space SP;
Is provided.

The reinforcing member 103 is
A flat plate-like base portion 103a arranged so as to be substantially orthogonal to the predetermined first reference direction D1,
At least one leg 103b extending from the base 103a along a direction substantially parallel to the first reference direction D1,
Have

The base portion 103a is disposed between the casing 101 and the electronic component 102 in the first reference direction D1,
The portion including at least a part of the surface of the base portion 103a is a high Young's modulus layer 103c having a Young's modulus higher than that of other portions.

  According to this, even when the thickness of the reinforcing member 103 is relatively thin, the amount of deformation of the reinforcing member 103 when an external force is applied to the housing 101 can be reduced. Therefore, it is possible to avoid damage to the electronic component 102 accommodated in the internal space SP.

  Furthermore, according to the above configuration, the reinforcing member 103 can be formed by deforming a base material made of a material having a relatively low Young's modulus, so that the reinforcing member 103 can be easily manufactured.

  Although the present invention has been described with reference to the above embodiment, the present invention is not limited to the above-described embodiment. Various changes that can be understood by those skilled in the art can be made to the configuration and details of the present invention within the scope of the present invention.

  In addition, as another modified example of the above-described embodiment, any combination of the above-described embodiments and modified examples may be employed.

<Appendix>
A part or all of the above embodiment can be described as the following supplementary notes, but is not limited thereto.

(Appendix 1)
A housing in which an internal space is formed;
Electronic components housed in the internal space;
A reinforcing member housed in the internal space;
With
The reinforcing member is
A plate-like base portion disposed so as to be substantially orthogonal to a predetermined first reference direction;
At least one leg extending from the base along a direction substantially parallel to the first reference direction;
Have
The base is disposed between the housing and the electronic component in the first reference direction,
The electronic device in which the part including at least a part of the surface of the base is a high Young's modulus layer having a Young's modulus higher than that of the other part.

  According to this, even when the thickness of the reinforcing member is relatively thin, the amount of deformation of the reinforcing member when an external force is applied to the housing can be reduced. Therefore, it is possible to avoid damage to the electronic component housed in the internal space.

  Furthermore, according to the above configuration, the reinforcing member can be formed by deforming a base material made of a material having a relatively low Young's modulus, and therefore the reinforcing member can be easily manufactured.

(Appendix 2)
The electronic device according to attachment 1, wherein
An electronic device in which the high Young's modulus layer is formed by performing a surface treatment after the base and the leg are formed.

  According to this, the reinforcement member in which the high Young's modulus layer was formed can be manufactured easily.

(Appendix 3)
An electronic device according to appendix 1 or appendix 2,
An electronic device configured such that an end of the leg opposite to the base is in contact with a wall of the housing that forms the internal space.

(Appendix 4)
An electronic device according to any one of appendix 1 to appendix 3,
The reinforcing member is an electronic device configured such that the leg portion extends from each of both ends of the base portion in a predetermined second reference direction.

  According to this, a reinforcement member can be easily manufactured by bending a flat member.

(Appendix 5)
The electronic device according to attachment 4, wherein
The internal space has a rectangular parallelepiped shape having a height, a width, and a depth,
The first reference direction is a height direction;
The electronic device in which the second reference direction is a width direction.

(Appendix 6)
An electronic device according to any one of appendix 1 to appendix 5,
An electronic device configured such that a surface of the base on the housing side is in contact with the housing.

  According to this, when an external force is applied to the housing, the amount of deformation of the portion of the housing that contacts the base can be reduced.

(Appendix 7)
An electronic device according to any one of appendix 1 to appendix 6,
The high Young's modulus layer is an electronic device arranged to cover the electronic component when the electronic device is viewed in the first reference direction.

  According to this, when an external force is applied to the housing, it is possible to more reliably avoid damage to the electronic component housed in the internal space.

(Appendix 8)
An electronic device according to any one of appendix 1 to appendix 7,
The high Young's modulus layer is an electronic device made of a material mainly composed of chromium nitride.

(Appendix 9)
The electronic device according to attachment 8, wherein
The high Young's modulus layer is an electronic device formed by nitriding a stainless steel containing chromium.

(Appendix 10)
A reinforcing member that is housed together with electronic components in an internal space formed in a housing provided in the electronic device,
A plate-like base portion disposed so as to be substantially orthogonal to a predetermined first reference direction;
At least one leg extending from the base along a direction substantially parallel to the first reference direction;
Have
The base is disposed between the housing and the electronic component in the first reference direction,
A reinforcing member in which a portion including at least a part of the surface of the base is a high Young's modulus layer having a Young's modulus higher than that of other portions.

(Appendix 11)
The reinforcing member according to appendix 10, wherein
A reinforcing member in which the high Young's modulus layer is formed by performing a surface treatment after the base and the legs are formed.

(Appendix 12)
The reinforcing member according to appendix 10 or appendix 11,
An end of the leg that is opposite to the base is a reinforcing member that is configured to come into contact with a wall of the casing that forms the internal space.

  The present invention can be applied to an electronic device in which an electronic component is accommodated in an internal space.

DESCRIPTION OF SYMBOLS 10 Electronic device 11 Front panel 12 Front case 13 Rear case 14 Reinforcement member 14a Base part 14b Leg part 14c High Young's modulus layer 15a, 15b Electronic component SP Internal space 100 Electronic device 101 Case 102 Electronic component 103 Reinforcement member 103a Base part 103b Leg part 103c High Young's modulus layer

Claims (10)

A housing in which an internal space is formed;
Electronic components housed in the internal space;
A reinforcing member housed in the internal space;
With
The reinforcing member is
A plate-like base portion disposed so as to be substantially orthogonal to a predetermined first reference direction;
At least one leg extending from the base along a direction substantially parallel to the first reference direction;
Have
The base is disposed between the housing and the electronic component in the first reference direction,
The electronic device in which the part including at least a part of the surface of the base is a high Young's modulus layer having a Young's modulus higher than that of the other part. The electronic device according to claim 1,
An electronic device in which the high Young's modulus layer is formed by performing a surface treatment after the base and the leg are formed. The electronic device according to claim 1 or 2,
An electronic device configured such that an end of the leg opposite to the base is in contact with a wall of the housing that forms the internal space. An electronic device according to any one of claims 1 to 3,
The reinforcing member is an electronic device configured such that the leg portion extends from each of both ends of the base portion in a predetermined second reference direction. The electronic device according to claim 4,
The internal space has a rectangular parallelepiped shape having a height, a width, and a depth,
The first reference direction is a height direction;
The electronic device in which the second reference direction is a width direction. An electronic device according to any one of claims 1 to 5,
An electronic device configured such that a surface of the base on the housing side is in contact with the housing. The electronic device according to any one of claims 1 to 6,
The high Young's modulus layer is an electronic device arranged to cover the electronic component when the electronic device is viewed in the first reference direction. An electronic device according to any one of claims 1 to 7,
The high Young's modulus layer is an electronic device made of a material mainly composed of chromium nitride. The electronic device according to claim 8,
The high Young's modulus layer is an electronic device formed by nitriding a stainless steel containing chromium. A reinforcing member that is housed together with electronic components in an internal space formed in a housing provided in the electronic device,
A plate-like base portion disposed so as to be substantially orthogonal to a predetermined first reference direction;
At least one leg extending from the base along a direction substantially parallel to the first reference direction;
Have
The base is disposed between the housing and the electronic component in the first reference direction,
A reinforcing member in which a portion including at least a part of the surface of the base is a high Young's modulus layer having a Young's modulus higher than that of other portions.

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