JP2013058586A - Connection structure of printed wiring board - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a connection structure of a printed wiring board which improves the reliability and achieves low cost.SOLUTION: A connection structure of a printed wiring board comprises: a first printed wiring board 10 including a first connection pattern 14 and a second connection pattern 16 which are provided at a first slit 12; a second printed wiring board 20 where a third connection pattern 24 and a fourth connection pattern 26, corresponding to the first connection pattern 14 when the second printed wiring board 20 is inserted into the first slit 12, are formed, the second printed wiring board 20 including a second slit 28 formed over the third connection pattern 24 and the fourth connection pattern 26; a third printed wiring board 30 where a fifth connection pattern 34, corresponding to the second connection pattern 16 when the third printed wiring board 30 is inserted into the first slit 12 through the second slit 28, and a sixth connection pattern 36, corresponding to the fourth connection pattern 26, are respectively formed on one surface and the other surface. The respective connection patterns 14, 24, 16, 34, 26, 36 are connected by soldering.

Description

  The present invention relates to a printed wiring board connection structure for connecting a plurality of printed wiring boards to each other.

  In the case of electrically connecting a plurality of printed wiring boards constituting an electronic device or the like, a method using a connector is common. As a connection structure using a connector, the connector is mounted on both printed circuit boards and connected to each other, or the circuit pattern on one end of one printed circuit board is processed into a terminal shape and mounted on the other printed circuit board Some are connected to the card edge connector.

  On the other hand, a connection structure that does not use a connector has also been proposed. For example, there has been proposed a method in which a first substrate is brought into close contact with a second substrate vertically or horizontally and the substrate terminals of the first substrate and the substrate terminals of the second substrate are electrically connected to each other via solder. (For example, refer to Patent Document 1 and Patent Document 2).

JP 2004-153178 A JP 2008-60329 A

  However, when trying to electrically connect a printed wiring board using a connector as described above, the terminals are crimped together to be electrically joined so that the reliability is inferior and the cost of the connector itself is high, which increases the cost. There was a problem. In addition, even in a structure that does not use a connector, since only solder is connected, there is a problem that connection strength is inferior and reliability is low.

  SUMMARY An advantage of some aspects of the invention is to solve at least a part of the problems described above, and the invention can be implemented as the following forms or application examples.

  (Application Example 1) A first printed wiring board including a first slit having a substantially rectangular shape, a first connection pattern and a second connection pattern provided in a long side portion of the first slit, and a slant to the first slit When inserted, a third connection pattern corresponding to the first connection pattern is formed on one surface, a fourth connection pattern is formed on the other surface, and the third connection pattern and the pattern of the fourth connection pattern Corresponding to the second connection pattern on one surface when inserted into the first slit through the second slit and the second printed wiring board having the substantially rectangular second slit in the formation region And a third printed wiring board on which the sixth connection pattern corresponding to the fourth connection pattern is formed on the other surface, and the first connection pattern. And the third connection pattern, the second connection pattern and the fifth connection pattern, and the fourth connection pattern and the sixth connection pattern are connected via a conductive member. Characteristic printed wiring board connection structure.

  According to this configuration, the second printed wiring board is inserted obliquely into the first slit of the first printed wiring board, the third printed wiring board is inserted into the second slit of the second printed wiring board, and the first printed It is inserted obliquely into the first slit of the wiring board. Therefore, based on the first printed wiring board, the second printed wiring board and the third printed wiring board are attached so as to cross each other, and the respective connection patterns are arranged so as to be concentrated at the crossing portion. These connection patterns can be connected by a conductive member such as solder. As a result, the first printed wiring board, the second printed wiring board, and the third printed wiring board can be combined with each other and structurally ensure strength. In addition, inexpensive and highly reliable electrical connection can be realized by not using a connector or the like.

  Application Example 2 The first connection pattern and the second connection pattern of the first printed wiring board are provided on one surface of the first printed wiring board, and the third connection pattern of the second printed wiring board. And the fourth connection pattern is provided on each of the back and front surfaces of the second printed wiring board, and the fifth connection pattern and the sixth connection pattern of the third printed wiring board are provided on the third printed wiring board. The printed wiring board connection structure described above, wherein the printed wiring board connection structure is provided on each of the two front and back surfaces.

  (Application example 3) When the first printed wiring board, the second printed wiring board, and the third printed wiring board are combined, the first connection pattern, the second connection pattern, the third connection pattern, 4. The printed wiring board connection structure according to claim 1, wherein the fourth connection pattern, the fifth connection pattern, and the sixth connection pattern are located on one surface side of the first printed wiring board.

  According to these configurations, the connection patterns of the respective printed wiring boards can be concentrated on one surface side of the first printed wiring board serving as a base and on the two long side portions of the first slit. Therefore, it becomes easy to connect each connection pattern with a conductive member such as solder.

  Application Example 4 The first connection pattern, the third connection pattern, the second connection pattern, the fifth connection pattern, the fourth connection pattern, and the sixth connection pattern use a solder bath. The printed wiring board connection structure described above, wherein the printed wiring board is connected by flow soldering.

  According to this structure, the first printed wiring board, the second printed wiring board, and the third printed wiring board can be connected by flow soldering without using a member such as a connector. Therefore, the first printed wiring board, the second printed wiring board, and the third printed wiring board can be connected at once and easily.

  Application Example 5 Solder in which the first connection pattern and the third connection pattern, the second connection pattern and the fifth connection pattern, the fourth connection pattern and the sixth connection pattern are reflow-cured. The printed wiring board connection structure described above, wherein the printed wiring board is connected by

  According to this structure, the first printed wiring board, the second printed wiring board, and the third printed wiring board can be connected by the reflow-cured solder without using a member such as a connector. Therefore, the first printed wiring board, the second printed wiring board, and the third printed wiring board can be connected at once and easily.

FIG. 3 is an external view showing a first printed wiring board. FIG. 6 is an external view showing a second printed wiring board. FIG. 6 is an external view showing a third printed wiring board. The perspective view explaining the connection method of a printed wiring board. Sectional drawing of the printed wiring board after a connection.

  Hereinafter, embodiments according to the present invention will be described with reference to the drawings. In the drawings referred to in the following description, the vertical and horizontal scales of members or parts may be shown differently from the actual ones for convenience of description and illustration.

(About printed circuit boards)
First, a printed wiring board will be described with reference to FIGS. FIG. 1 is an outline view showing a first printed wiring board, (a) is an outline plan view seen from the surface of the first printed wiring board, and (b) is a side view of the first printed wiring board. 2A and 2B are external views showing the second printed wiring board, wherein FIG. 2A is an external plan view viewed from the surface of the second printed wiring board, and FIG. 2B is a side view of the second printed wiring board. 3A and 3B are external views showing the third printed wiring board. FIG. 3A is an external plan view seen from the surface of the third printed wiring board, and FIG. 3B is a side view of the third printed wiring board. The X direction shown in FIGS. 1 to 3 indicates one long side direction of the first to third printed wiring boards, the Y direction indicates a method orthogonal to the X direction, and the Z direction is orthogonal to the X direction and the Y direction. Indicates the direction to do.

  As shown in FIGS. 1A and 1B, the first printed wiring board 10 is formed in, for example, a rectangular shape, and a first slit 12 is formed along one side (Y direction) in a substantially central portion. ing. The first slit 12 is formed as a substantially rectangular through hole in which two rectangular holes having different lengths in the long side direction are combined. In addition, on one surface (back surface 10 b) of the first printed wiring board 10, the first connection pattern 14 and the second connection pattern 16 are formed on both sides of the long side portion of the first slit 12.

  The first connection pattern 14 includes a plurality of connection terminals 14a having a certain region, extending in the X direction in the drawing, and having a conductive member such as a copper foil exposed from the insulating film. The second connection pattern 16 is provided at a position facing the first connection pattern 14 with the first slit 12 interposed therebetween, has a certain region, extends in the X direction in the figure, and is insulated from a conductive member such as a copper foil. It comprises a plurality of connection terminals 16a exposed from the film. On the first printed wiring board 10, a wiring pattern (not shown) is formed on at least one of the front surface 10a and the back surface 10b, and various mounting components (not shown) are also mounted.

  As shown in FIGS. 2A and 2B, the second printed wiring board 20 is formed, for example, in a substantially rectangular shape as a whole, and has a slightly small width dimension in the width direction (Y direction) on one end side. A step shape 22 is formed. In addition, a third connection pattern 24 and a fourth connection pattern 26 are formed on the front surface 20a and the back surface 20b of the stepped shape 22 portion of the second printed wiring board 20, respectively. The third connection pattern 24 is composed of a plurality of connection terminals 24a in which a step shape 22 portion extends in the X direction in the drawing and a conductive member such as a copper foil is exposed from the insulating film. The fourth connection pattern 26 is provided on the opposite surface (back surface 20b) of the front surface 20a on which the third connection pattern 24 is formed. The fourth connection pattern 26 has a certain region and extends in the X direction in the drawing and is a conductive member such as a copper foil. Consists of a plurality of connection terminals 26a exposed from the insulating film.

  The second printed wiring board 20 has a second slit 28 in the vicinity of the third connection pattern 24 and the fourth connection pattern 26 along the Y direction. The second slit 28 is formed in a rectangular shape as a through hole, and the hole portion covers a part of the connection terminals 24a and 26a. On the second printed wiring board 20, a wiring pattern (not shown) is formed on at least one of the front surface 20a and the back surface 20b, and various mounting components (not shown) are also mounted.

  As shown in FIGS. 3A and 3B, the third printed wiring board 30 is formed, for example, in a substantially rectangular shape as a whole, and has a width dimension slightly smaller in the width direction (Y direction) on one end side. A step shape 32 is formed. Further, a fifth connection pattern 34 and a sixth connection pattern 36 are formed on the front surface 30a and the back surface 30b of the stepped shape 32 portion of the third printed wiring board 30, respectively. The fifth connection pattern 34 is composed of a plurality of connection terminals 34a in which a step shape 32 portion extends in the X direction in the drawing and a conductive member such as a copper foil is exposed from the insulating film.

  The sixth connection pattern 36 is provided on the opposite surface (back surface 30b) of the front surface 30a on which the fifth connection pattern 34 is formed, has a certain region, extends in the X direction in the figure, and is a conductive member such as a copper foil. Consists of a plurality of connection terminals 36a exposed from the insulating film. On the third printed wiring board 30, a wiring pattern (not shown) is formed on at least one of the front surface 30a and the back surface 30b, and various mounting components (not shown) are also mounted.

(About printed circuit board connection)
Next, a printed wiring board connection structure and connection method will be described with reference to FIGS. FIG. 4 is a perspective view illustrating a method for connecting printed wiring boards, and FIG. 5 is a cross-sectional view of the printed wiring board after connection. The X direction, Y direction, and Z direction shown in FIGS. 4 and 5 are the same directions as the X direction, Y direction, and Z direction shown in FIG.

  First, as shown in FIG. 4, the second printed wiring board 20 as the first sub board is temporarily fixed to the first printed wiring board 10 as the main board. Specifically, the stepped portion 22 of the second printed wiring board 20 is formed with respect to the first slit 12 of the first printed wiring board 10, and the second printed wiring board 20 is formed with respect to the surface 10 a of the first printed wiring board 10. Are inserted obliquely (in the direction of arrow A in the figure) so that the back surface 20b of the substrate has a predetermined angle. The second printed wiring board 20 is temporarily locked by fitting the stepped shape 22 of the second printed wiring board 20 to the Y-direction portion of the first slit 12 of the first printed wiring board 10.

  At this time, as shown in FIG. 5, the stepped shape 22 of the second printed wiring board 20 is fitted and positioned in the Y-direction portion of the first slit 12 of the first printed wiring board 10. On the back surface 10 b side of the substrate 10, the connection terminal 14 a of the first connection pattern 14 provided on one long side of the first slit 12 of the first printed wiring substrate 10 and the stepped shape 22 portion of the second printed wiring substrate 20. The connection terminals 24a of the third connection patterns 24 provided on the surface 20a are temporarily fixed so as to correspond to the respective positions. Further, the first slit 12 of the first printed wiring board 10 and the second slit 28 of the second printed wiring board 20 are temporarily fixed with a common through hole.

  Next, as shown in FIG. 4, a third printed wiring board 30 as a second sub board is temporarily fixed to the first printed wiring board 10 and the second printed wiring board 20. Specifically, the stepped portion 32 of the third printed wiring board 30 with respect to the common through-hole portion of the first slit 12 of the first printed wiring board 10 and the second slit 28 of the second printed wiring board 20. The back surface 30b of the third printed wiring board 30 has a predetermined angle with respect to the front surface 10a of the first printed wiring board 10, and is slanted in the direction intersecting the second printed wiring board 20 (in the direction of arrow B in the figure). Insert into. The third printed wiring board 30 is temporarily locked by fitting the stepped shape 32 of the third printed wiring board 30 to the Y-direction portion of the second slit 28 of the second printed wiring board 20.

  At this time, as shown in FIG. 5, the step shape 32 of the third printed wiring board 30 is fitted and positioned in the Y-direction portion of the second slit 28 of the second printed wiring board 20, so that the first printed wiring board On the back surface 10 b side of the substrate 10, the connection terminal 16 a of the second connection pattern 16 provided on the other long side of the first slit 12 of the first printed wiring substrate 10 and the step shape 32 portion of the third printed wiring substrate 30. The connection terminals 34a of the fifth connection patterns 34 provided on the surface 30a are temporarily fixed so as to correspond to the respective positions. Further, the connection between the connection terminal 26 a of the fourth connection pattern 26 provided on the back surface 20 b of the second printed wiring board 20 and the sixth connection pattern 36 provided on the back surface 30 b of the step shape 32 portion of the third printed wiring board 30. The terminals 36a are temporarily fixed so as to be in corresponding positions.

  That is, by combining the first printed wiring board 10, the second printed wiring board 20, and the third printed wiring board 30 as described above, the second printed wiring board 20 and the third printed wiring board 30 that intersect each other are The first printed wiring board 10 is securely arranged so as to be sandwiched between both sides of the first slit 12.

  The first connection pattern 14 and the third connection pattern 24 to be connected, the second connection pattern 16 and the fifth connection pattern 34, and the fourth connection pattern 26 and the sixth connection pattern 36 are the first prints that are the bases. It arrange | positions so that it may gather in the cross | intersection part centering on the 1st slit 12 of the back surface 10b of the wiring board 10. FIG.

  Next, the first printed wiring board 10, the second printed wiring board 20, and the third printed wiring board 30 are mechanically fixed and electrically connected using solder as a conductive member.

  When the flow soldering method is used, the first printed wiring board 10 on which the second printed wiring board 20 and the third printed wiring board 30 are arranged is placed on the solder bath so that the back surface 10b side is in contact with the molten solder surface layer. As shown in FIG. 5, the first connection pattern 14 and the third connection pattern 24, the second connection pattern 16 and the fifth connection pattern 34, and the fourth connection pattern 26 and the sixth connection pattern 36, respectively. A solder film 50 is formed and soldered. The type of the solder bath may be a static bath that does not move the solder liquid level, or a jet type that makes waves on the solder liquid level.

  When the reflow soldering method is used, solder paste is previously applied to the connection terminals 14a, 16a, 24a, 26a, 34a, and 36a of the first printed wiring board 10, the second printed wiring board 20, and the third printed wiring board 30. Print. And it heats in a reflow furnace using infrared rays, a hot air, etc., and as shown in FIG. 5, the 1st connection pattern 14, the 3rd connection pattern 24, the 2nd connection pattern 16, the 5th connection pattern 34, and the 4th connection Solder films 50 are respectively formed on the surfaces of the pattern 26 and the sixth connection pattern 36 and soldered.

Hereinafter, effects of the present embodiment will be described.
(1) In the connection structure described above, the second printed wiring board 20 is inserted obliquely into the first slit 12 of the first printed wiring board 10, and the third printed wiring board 30 is connected to the second printed wiring board 20 in the second direction. It is inserted into the slit 28 and inserted into the first slit 12 of the first printed wiring board 10 at an angle. Therefore, the second printed wiring board 20 and the third printed wiring board 30 are attached in such a manner that the first printed wiring board 10 is sandwiched between the intersecting portions. In addition, the connection patterns 14, 16, 24, 26, 34, and 36 are arranged so as to be concentrated at the intersections. These connection patterns 14, 16, 24, 26, 34, and 36 can be connected with solder or the like. As a result, the first printed wiring board 10, the second printed wiring board 20, and the third printed wiring board 30 can structurally ensure strength. In addition, highly reliable electrical connection can be realized without using a connector or the like.

  (2) In the connection structure described above, the connection patterns 14, 16, 24, 26, 34, 36 of the respective printed wiring boards 10, 20, 30 are connected to one surface side of the first printed wiring board 10 serving as a base ( It is possible to concentrate on the back surface 10 b) and on the two long side portions of the first slit 12. Therefore, it becomes easy to connect with solder or the like.

  (3) In the connection structure described above, the first printed wiring board 10, the second printed wiring board 20, and the third printed wiring board 30 can be connected by flow soldering or reflow soldering without using a member such as a connector. . Therefore, the 1st printed wiring board 10, the 2nd printed wiring board 20, and the 3rd printed wiring board 30 can be connected easily at once, and the improvement of working efficiency can be aimed at.

  As mentioned above, although the Example of this invention was described, various deformation | transformation can be added with respect to the said Example in the range which does not deviate from the meaning of this invention. For example, modifications other than the above embodiment are as follows.

  Although the said embodiment demonstrated the case where the 2nd printed wiring board 20 was inserted in the 1st printed wiring board 10, and the 3rd printed wiring board 30 was inserted after that, it is not limited to this. The second printed wiring board 20 and the third printed wiring board 30 may be inserted simultaneously. The insertion order is not particularly limited. Components mounted on the first printed wiring board 10, the second printed wiring board 20, and the third printed wiring board 30 are arbitrary. In addition, although the conductive member is solder, the type is not limited as long as it is a conductive member such as a conductive adhesive. Further, although the connection process is reflow soldering or flow soldering, any connection process may be used.

  Moreover, although the 1st slit 12 and the 2nd slit 28 are shown as a long hole in the center of a board | substrate, it is not limited to this. The position and shape on the substrate are arbitrary. The width of the slit and the like may be larger than the substrate to be inserted. Further, the printed wiring board may be a single-sided board, a double-sided board, or a multilayer board. In the case of a multilayer substrate, the end surfaces of the first slit 12 and the second slit 28 may be chamfered.

  DESCRIPTION OF SYMBOLS 10 ... 1st printed wiring board, 12 ... 1st slit, 14 ... 1st connection pattern, 14a, 16a, 24a, 26a, 34a, 36a ... Connection terminal, 16 ... 2nd connection pattern, 20 ... 2nd printed wiring board , 22 ... step shape, 24 ... third connection pattern, 26 ... fourth connection pattern, 28 ... second slit, 30 ... third printed wiring board, 32 ... step shape, 34 ... fifth connection pattern, 36 ... sixth. Connection pattern, 50 ... solder film.

Claims (5)

A first printed wiring board comprising a substantially rectangular first slit and a first connection pattern and a second connection pattern provided on a long side portion of the first slit;
When obliquely inserted into the first slit, a third connection pattern corresponding to the first connection pattern is formed on one surface, a fourth connection pattern is formed on the other surface, and the third connection pattern and the A second printed wiring board comprising a substantially rectangular second slit relating to the pattern formation region of the fourth connection pattern;
When inserted obliquely into the first slit through the second slit, a fifth connection pattern corresponding to the second connection pattern is formed on one surface, and the other surface corresponds to the fourth connection pattern. A third printed wiring board on which a sixth connection pattern is formed,
The first connection pattern and the third connection pattern, the second connection pattern and the fifth connection pattern, and the fourth connection pattern and the sixth connection pattern are connected via a conductive member. A printed wiring board connection structure characterized by comprising: The first connection pattern and the second connection pattern of the first printed wiring board are provided on one surface of the first printed wiring board;
The third connection pattern and the fourth connection pattern of the second printed wiring board are respectively provided on the back and front surfaces of the second printed wiring board;
2. The printed wiring board according to claim 1, wherein the fifth connection pattern and the sixth connection pattern of the third printed wiring board are respectively provided on the back and front surfaces of the third printed wiring board. Connection structure.   When the first printed wiring board, the second printed wiring board, and the third printed wiring board are combined, the first connection pattern, the second connection pattern, the third connection pattern, the fourth connection pattern, 3. The printed wiring board connection structure according to claim 1, wherein the fifth connection pattern and the sixth connection pattern are located on one surface side of the first printed wiring board. 4.   The first connection pattern and the third connection pattern, the second connection pattern and the fifth connection pattern, and the fourth connection pattern and the sixth connection pattern are connected by flow solder using a solder bath. The printed wiring board connection structure according to any one of claims 1 to 3, wherein the printed wiring board connection structure is provided.   The first connection pattern and the third connection pattern, the second connection pattern and the fifth connection pattern, and the fourth connection pattern and the sixth connection pattern are connected by reflow-cured solder. The printed wiring board connection structure according to claim 1, wherein the printed wiring board connection structure is a printed wiring board connection structure.

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