JP2012216309A - Organic electroluminescent display panel and manufacturing method therefor - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a high-efficiency, long-life, high-luminance organic EL panel simply and inexpensively by employing an extraction electrode and a second electrode of the organic EL panel that have low resistance contact characteristics.SOLUTION: The substrate wiring for extraction of an organic electroluminescent display panel has a contact area where a carrier injection layer and a second electrode are laminated. Multiple convex patterns are formed on the surface of substrate wiring for extraction of the contact area. The carrier injection layer is formed to cover at least a light-emitting medium layer, the surface of substrate wiring for extraction of the contact area, and a barrier, and the second electrode is formed on the carrier injection layer in the organic electroluminescent display panel.

Description

  The present invention relates to an image display device using an organic EL element and a manufacturing method thereof.

  An organic electroluminescence element (hereinafter also referred to as an organic EL element) has an organic light-emitting layer made of an organic light-emitting material between two opposing electrodes made of a transparent electrode and a metal electrode, and a voltage is applied between the electrodes. A device in which holes are injected from the anode and electrons are injected from the cathode, a current flows through the organic light emitting layer, and the holes and electrons are recombined in the organic light emitting layer to emit light. The thickness of the organic layer is important for the production. In addition, in order to make a color display using this, it is necessary to pattern with high definition.

  In general, as a substrate for a display panel, a substrate in which a patterned photosensitive polyimide is formed in a partition shape so as to partition subpixels is used. At that time, the partition pattern is formed so as to cover the edge portion of the transparent electrode formed as an anode.

  In addition to the organic light emitting layer, a carrier injection layer (also called a carrier transport layer) is formed between the electrodes. The carrier injection layer controls the injection amount of electrons when injecting electrons from the electrode to the organic light emitting layer, or controls the injection amount of holes when holes are injected from the other electrode to the organic light emitting layer. A layer used to control and refers to a layer inserted between an electrode and an organic light emitting layer. As the electron injection layer, an electron transporting organic substance such as a metal complex of a quinolinol derivative or a relatively small work function such as Ca or Ba such as an alkali metal is used, or a plurality of layers having these functions are stacked. In some cases. As the hole injection layer, TPD (triphenyleneamine derivative: see Patent Document 1), PEDOT: PSS (mixture of polythiophene and polystyrenesulfonic acid: see Patent Document 2), or an inorganic hole transport material (Patent Document 3) See). In any case, it is necessary to obtain a high-performance organic EL display panel by inserting it between the electrode and the light-emitting layer in order to increase the luminous efficiency by controlling the injection amount of electrons and holes. It is.

  Next, there are two types of methods for forming a hole injection layer for injecting hole carriers: dry film formation and wet film formation methods. When wet film formation methods are used, they are generally dispersed in water. Polythiophene derivatives are used, but water-based inks are easily affected by the base and are difficult to coat uniformly. In contrast, dry film formation enables simple and uniform coating of the entire surface.

  Similarly, there are two methods for forming the organic light emitting layer: dry film formation and wet film formation. However, when using the vacuum evaporation method, which is dry film formation that facilitates uniform film formation, a fine pattern mask is used. Therefore, it is necessary to perform patterning, and large substrates and fine patterning are very difficult.

  Therefore, recently, a method of forming a thin film using a wet film forming method by dissolving a polymer material in a solvent to form a coating liquid has been tried. When a light emitting medium layer including an organic light emitting layer is formed by a wet film formation method using a coating material of a polymer material, the layer structure is a hole injection layer, an interlayer or a hole transport layer from the anode side, an organic light emitting layer A three-layer structure is generally laminated. At this time, the organic light emitting layer is formed by dissolving or stably dispersing organic light emitting materials having respective emission colors of red (R), green (G), and blue (B) in a solvent in order to form a color panel. It can be applied separately using organic light emitting ink (see Patent Documents 4 and 5). By using wet film formation, a mask with a fine pattern is not necessary, and a large substrate or a fine pattern can be easily formed.

  Ideally, it is possible to draw out performance by using different carrier injection layers for each of the RGB light emitting layers, but because the number of steps in the mass production process and high-definition patterning are difficult, The carrier injection layer is generally formed of a solid film common to RGB.

  By the way, the organic EL display panel uses a current driving element, and in the passive matrix driving type organic EL display panel, it is necessary to instantaneously emit light within a time when each row is selected. As a result, a large current flows into the electrode as compared with the case where a voltage-driven display element such as a liquid crystal device is used.

  In an active drive type organic EL display panel, it is generally necessary to maintain light emission for a certain period of time, and a larger number of rows are selected at a time than in a passive matrix drive type. As a result, a large current flows into the electrode as well.

  Therefore, in order to suppress the voltage rise due to this current between the second electrode and the drive circuit connection terminal, the second electrode is connected to the low resistance extraction board wiring, and the current is connected to the drive circuit connection terminal from the extraction board wiring. It has a structure that leads to

  However, as the panel becomes larger, higher definition, and higher brightness, it is necessary to further reduce the resistance of the substrate wiring for extraction, and at the same time, contact and drive between the second electrode and the substrate wiring for extraction. Lowering the resistance between circuit connection terminals and extraction substrate wiring has been a problem.

  In particular, the contact characteristics between the second electrode and the extraction substrate wiring are not only low resistance, but also stable against Joule heat generated in the contact portion due to the flowing current, that is, the contact resistance is not easily raised by Joule heat. And more stringent contact performance is required. It is considered that the contact resistance rises due to Joule heat due to oxidation of the metal used for the substrate wiring for extraction.

  In the case of bottom emission, normally, ITO (indium oxide-tin oxide) is used for the first electrode, and a metal that is easily oxidized, such as Al, Mg, and Ag, is used for the second electrode. Further, although metal such as Cr is used for the extraction substrate wiring, an oxide layer is formed on the surface, thereby increasing the contact resistance.

  In this regard, for example, there is a technique disclosed in Patent Document 6 regarding a substrate wiring for taking out an organic EL display element. In Patent Document 6, a transparent electrode material is used for the drive circuit connection terminal, and the second electrode material and the extraction substrate wiring material are made the same. In this case, the contact resistance problem between the second electrode and the extraction substrate wiring is solved if the second electrode surface and the extraction substrate wiring surface are not oxidized before the connection between the second electrode material and the extraction substrate wiring material. The possibility to do is increased.

  However, in general, in an organic EL display element, a material that is easily oxidized is used for the second electrode, while a metal oxide such as ITO is used for the transparent electrode material.

  For this reason, when the substrate wiring for extraction is made of the same material as the second electrode, the substrate wiring for extraction and the drive circuit connection using the first electrode material are used during the manufacturing process of the organic EL display panel and subsequent use. There is a problem that the metal of the extraction substrate wiring is oxidized at the contact portion with the terminal, and the contact resistance is increased.

  In particular, the increase in contact resistance is remarkable when held at a high temperature. When Al or an Al alloy is applied to the second electrode and the extraction substrate wiring, and ITO is applied to the drive circuit connection terminal, the contact resistance is maintained at about 100 ° C. As a result, the contact resistance is significantly increased.

  Patent Document 7 discloses a technique for reducing the contact resistance between the second electrode and the extraction substrate wiring. In Patent Document 7, the substrate wiring for extraction is divided into two parts, a base pattern and an electrode pattern, TiN or Cr is applied to the base pattern, and Al is applied to the electrode pattern to make contact with the second electrode. As a result, low resistance contact characteristics can be obtained.

  However, with this technology, before discussing the problem of contact resistance, two photolithographic steps are required for forming the substrate wiring for extraction, and dry etching must be applied for patterning in TiN, which causes a problem in productivity. is there.

  In addition, when Cr is used for the base pattern, even if the initial contact characteristics are good, the contact resistance may increase remarkably when left at a high temperature of about 100 ° C. The problem remains.

  Patent Document 8 discloses a technique for reducing the contact resistance between the second electrode and the extraction substrate wiring. In Patent Document 8, the first Mo alloy layer in which the layer in contact with the drive circuit connection terminal contains Nb, the second Mo alloy layer in which the layer in contact with the conductive layer contains Nb, the first Mo alloy layer, and the second Mo alloy layer, It is composed of at least three layers of Al—Nd layers arranged between the layers, and the portion connected to the auxiliary wiring of the first conductive layer is made of Al or Al alloy, so that low resistance contact characteristics can be obtained. Yes.

  Patent Document 9 discloses a technique for reducing the contact resistance between the second electrode and the extraction substrate wiring. In Patent Document 9, the extraction substrate wiring is made of Al, Mo, Ti, W, Cr, etc., the second electrode is made of AlMo, Ti, W, Cr, Ta, Mg, etc., and the second electrode and the extraction wiring substrate are brought into direct contact with each other. As a result, low resistance contact characteristics can be obtained.

  By the way, as described above, a carrier injection layer is formed between the electrode and the light emitting layer, which is indispensable for increasing the light emission efficiency and life and obtaining a high performance organic EL display panel.

  When these carrier injection layers are formed in the contact area on the extraction substrate wiring, the techniques of Patent Document 6 to Patent Document 9 cannot provide contact characteristics with sufficiently low resistance.

  Therefore, it is conceivable to pattern the carrier injection layer only in the light emitting pixel portion so that the carrier injection layer is not formed in the contact area on the extraction substrate wiring. However, the manufacturing process becomes complicated because the different pattern is formed, and the cost is low. Issues such as productivity and tact time.

  For example, when the carrier injection layer and the second electrode are formed using a dry process such as a vacuum deposition method, it is necessary to provide different metal masks at least for both.

  In particular, when forming the electron injection layer of the carrier injection layer, an active material having a high reactivity is often used, and the electron mask is left when the metal mask for the electron injection layer pattern is replaced with the metal mask for the second electrode pattern. As a result, the outermost surface may be deteriorated, resulting in an increase in dispersion and a decrease in characteristics, which adversely affects the performance and reliability of the display panel.

  Moreover, when forming a carrier injection layer and a 2nd electrode using wet processes, such as a printing method, for example, it is necessary to provide a different printing pattern plate by at least both.

  On the other hand, the above-mentioned problem can be solved by forming a similar pattern with the carrier injection layer and the second electrode, but the second electrode is always electrically connected to the extraction substrate wiring and the contact area. It is necessary to form a carrier injection layer on the extracted substrate wiring.

  As described above, with the technologies of Patent Document 6 to Patent Document 9, it is difficult to achieve both low-resistance contact characteristics and productivity, performance, and reliability of the organic EL panel.

JP 2001-93668 A JP 2001-155858 A Japanese Patent No. 2916098 Japanese Patent No. 2851185 JP-A-9-63771 JP 11-317292 A Japanese Patent Laid-Open No. 11-329750 Japanese Patent No. 4271915 JP2008-140573

  The present invention solves the above-mentioned problems. By making the electrode for taking out the organic EL panel and the second electrode have low resistance contact characteristics, an organic EL panel having high efficiency, long life and high brightness can be easily obtained. The issue was to provide it at low cost.

  A first invention according to a manufacturing method made to solve the above problems includes at least a first electrode formed on a substrate, a second electrode facing the first electrode, and the first electrode. A partition formed on the substrate so as to partition, a light emitting medium layer sandwiched between the first electrode and the second electrode, including an organic light emitting layer, and a substrate wiring for extraction formed on the substrate; The take-out substrate wiring has a contact area in which a carrier injection layer and the second electrode are laminated, and a plurality of protrusions are formed on the surface of the contact substrate in the contact area. The carrier injection layer is formed so as to cover at least the light emitting medium layer, the surface of the contact substrate wiring for taking out the contact area, and the partition wall. Is, the second electrode is an organic electroluminescent display panel, characterized in that it is formed in the carrier injection layer.

  According to a second aspect of the present invention, there is provided the organic electroluminescence display panel, wherein an inclination angle of the slope of the convex pattern is 60 ° or more and 90 ° or less.

  According to a third aspect of the present invention, there is provided the organic electroluminescence display panel characterized in that the height difference of the convex pattern is 0.1 μm or more and 3 μm or less.

  The fourth invention is an organic electroluminescence display panel, wherein the carrier injection layer comprises an electron injection layer and / or an electron transport layer.

  In the fifth invention, the substrate wiring material for extraction is selected from the group consisting of ITO, Cr, Al, Cu, Ni, Mo, Ta, Ti, W, Fe, Zn, Ag, Pt, Pd and Ag-Mg. An organic electroluminescence display panel, wherein the organic electroluminescence display panel is one or more metals

Further, a sixth invention provides a first electrode on the substrate, a second electrode facing the first electrode,
A partition partitioning the first electrode, a light emitting medium layer sandwiched between the first electrode and the second electrode, and including at least an organic light emitting layer and a carrier injection layer; and the second electrode and a contact area. A method of manufacturing an organic electroluminescence display panel, comprising: a step of forming a convex pattern on the substrate wiring for extraction in the contact area; and Patterning the organic light emitting layer by applying an organic light emitting ink in which the organic light emitting material is dissolved or dispersed in a solvent on the formed carrier injection layer, and the first electrode and the extraction substrate wiring Forming the carrier injection layer so as to cover between the contact area and the first electrode and the contact area; The organic electroluminescence display panel manufacturing method of forming a second electrode in the same pattern as the carrier injection layer Yaria injection layer, the features are.

  The seventh invention is the method of manufacturing an organic electroluminescence display panel according to claim 6, wherein the step of forming the carrier injection layer is a dry process.

  The eighth invention is characterized in that the step of patterning the organic light emitting layer is any one of a printing method, an ink jet method, and a nozzle printing method. Manufacturing method.

  Even if a carrier injection layer is formed on the contact area of the extraction substrate wiring by forming a convex pattern on the extraction substrate wiring in the contact area where the extraction substrate wiring and the second electrode are electrically connected. Contact characteristics with low resistance can be obtained, the carrier injection layer and the second electrode can be formed in the same pattern, and an organic EL display panel with high efficiency, long life, and high brightness can be easily and inexpensively manufactured.

Explanation plane schematic diagram of passive matrix drive type organic EL display panel of the present invention Explanation plane schematic diagram of active matrix drive type organic EL display panel of the present invention Description cross-sectional schematic diagram of an example of the organic EL display panel of the present invention Description cross-sectional schematic diagram of an example of the organic EL display panel of the present invention Description cross-sectional schematic diagram of an example of the organic EL display panel of the present invention Cross-sectional view of TFT substrate Schematic diagram of letterpress printer

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. In addition, the same referential mark is attached | subjected to the component which exhibits the same or similar function through all the drawings, and the overlapping description is abbreviate | omitted.

  First, as an example for explaining the organic EL display panel of the present invention in detail, a passive matrix drive type organic EL display panel using the first electrode 102 as an anode and the second electrode 106 as a cathode with reference to FIG. State. The present invention is not limited to this, and the first electrode 102 may be a cathode and the second electrode 106 may be an anode.

FIG. 1 is a schematic plan view of a passive matrix driving type organic EL display panel as one embodiment of the present invention, and FIG. 3 is a schematic cross-sectional view of AA ′ described in FIG. The organic EL display panel of the present invention uses a first electrode 102 formed on a substrate 101 as an anode and a second electrode 106 formed so as to face the first electrode 102 as a cathode, and a layer sandwiched between them (light emitting medium layer). 110). The first electrode is formed as a striped pixel electrode in the pixel region a defined by the partition wall 103 for each pixel.
In FIG. 1, a part of the second electrode 106 and the electron injection layer 114 is omitted to show the first electrode 102 and the partition wall 103. A light emitting medium layer 110, a hole injection layer 111, an interlayer or a hole transport layer 112 are formed between the first electrode 102 and the electron injection layer 114, but are omitted in FIG. ing.

  FIG. 1 shows an active matrix drive type organic EL display panel. However, in another embodiment of the present invention, a passive matrix drive type may be used. In this case, the first electrode is a pixel region defined by partitions 103 for each pixel. The second electrode is a counter electrode in the form of a stripe pattern in which the electrodes are orthogonal to each other.

  The light emitting medium layer includes at least an organic light emitting layer 113 contributing to light emission, a hole injection layer 111 as a carrier injection layer for injecting holes, a hole transport layer 112 as a carrier transport layer for transporting holes, and electrons. An electron injection layer 114 is included as a carrier injection layer to be injected.

  Further, as the light emitting medium layer 110, a carrier injection layer such as an electron transport layer or a hole blocking layer (interlayer) is required between the cathode and the light emitting layer, and an electron blocking layer (interlayer) is required between the anode and the light emitting layer. Depending on the case, it can be appropriately laminated.

  Further, outside the pixel region a, there is a take-out substrate wiring 104 for connecting to an external drive circuit, and in the contact area 105 where the take-out substrate wire 104 and the second electrode 106 are electrically connected, a take-out substrate is provided. The wiring has a convex pattern on the surface. FIGS. 4 and 5 show schematic BB ′ cross-sectional views of the contact area 105 shown in FIG. 1.

  The hole injection layer 111 covers the entire surface on the partition adjacent to the pixel region a. By covering the entire surface, the film shape in the pixel region becomes flat, and the film thickness for each pixel can be made uniform.

  Although the hole transport layer 112 is patterned only in the ancestor region a on the hole injection layer 111, the entire surface of the partition wall adjacent to the pixel region a may be covered in the same manner as the hole injection layer 111.

  The organic light emitting layer 113 can be formed without mixing colors only in the pixel region depending on the shape of the partition wall 103. Thus, by arranging the organic EL elements as pixels (subpixels), an organic EL display panel can be obtained. In other words, a full-color organic EL display panel can be manufactured by coating the organic light-emitting layer 113 constituting each pixel with, for example, three colors RGB without mixing colors.

The electron injection layer 114 covers the pixel region a on the organic light emitting layer 113 on the first electrode 102, the contact area 105 on the extraction substrate wiring 104, and between each organic light emitting layer 113 and the contact area. Is formed.

  The second electrode 106 has a pattern similar to that of the electron injection layer 114, and is electrically connected to the substrate wiring for extraction via a part of the electron injection layer 114. At this time, since the extraction substrate wiring of the present invention has a plurality of convex patterns on the surface of the contact area, the contact surface area between the second electrode and the extraction substrate wiring is increased by the side of the convex pattern. Thereby, contact characteristics with sufficiently low resistance can be obtained even through the electron injection layer 114.

  Although the number of convex patterns is arbitrary, it is preferable to optimize so as to obtain low-resistance contact characteristics. The inclination angle of the slope of the pattern is arbitrary, but it is preferably 60 ° or more and 90 ° or less so that the electron injection layer film thickness with respect to the side surface is small and the convex pattern strength is increased. The shape of the convex pattern can be a cylinder, a cone, a quadrangular pyramid, a quadrangle, etc., and any shape can be used as long as the surface area of the contact area can be increased.

  The larger the height difference of the convex pattern, the larger the surface area of the side surface. However, if the height is too large, the strength of the convex pattern becomes small and the probability of adhesion of the electron injection layer material becomes too small. It is preferable that

  The carrier injection layer formed in the contact area on the extraction substrate wiring is the electron injection layer 114. The hole injection layer, hole transport layer, electron block layer (interlayer), hole block layer (interlayer) , And so on.

<Board>
The substrate (back plane) of the passive matrix driving type organic EL display panel of the present invention is provided with a pixel electrode of the organic EL display panel and a substrate wiring 104 for extraction for connection to an external driving circuit.

  These pixel electrodes, extraction substrate wirings, and a passive matrix drive type organic EL display panel formed thereabove are supported by a support. Any material can be used as the support as long as it has mechanical strength and insulation and is excellent in dimensional stability. For example, plastic films and sheets such as glass, quartz, polypropylene, polyethersulfone, polycarbonate, cycloolefin polymer, polyarylate, polyamide, polymethyl methacrylate, polyethylene terephthalate, polyethylene naphthalate, etc., or oxidation to these plastic films and sheets Metal oxides such as silicon and aluminum oxide, metal fluorides such as aluminum fluoride and magnesium fluoride, metal nitrides such as silicon nitride and aluminum nitride, metal oxynitrides such as silicon oxynitride, acrylic resins and epoxy resins Translucent base material with a single layer or laminated polymer resin film such as silicone resin or polyester resin, metal foil such as aluminum or stainless steel, sheet, plate, aluminum on the plastic film or sheet It can be used um, copper, nickel, stainless steel and metal film non-translucent substrate as a laminate of such. What is necessary is just to select the translucency of a support body according to which surface light extraction is performed from. The support made of these materials has been subjected to moisture-proofing treatment or hydrophobic treatment by forming an inorganic film or applying a fluororesin in order to avoid intrusion of moisture into the organic EL display panel. It is preferable. In particular, it is preferable to reduce the moisture content and gas permeability coefficient of the support in order to prevent moisture from entering the luminescent medium layer.

<Pixel electrode>
A pixel electrode 102 is formed on the substrate, and patterning is performed as necessary. In the present invention, the pixel electrode is partitioned by a partition wall and becomes a pixel electrode corresponding to each pixel region. As the material of the pixel electrode, metal composite oxides such as ITO (indium tin composite oxide), indium zinc composite oxide and zinc aluminum composite oxide, metal materials such as gold and platinum, and these metal oxides and metals Either a single layer or a laminate of fine particle dispersion films in which fine particles of a material are dispersed in an epoxy resin or an acrylic resin can be used. When the pixel electrode is used as an anode, it is preferable to select a material having a high work function such as ITO. In the case of a so-called bottom emission structure in which light is extracted from below, it is necessary to select a light-transmitting material. If necessary, a metal material such as copper or aluminum may be provided as an auxiliary electrode in order to reduce the wiring resistance of the pixel electrode. Depending on the material, the pixel electrode is formed by a resistance heating vapor deposition method, an electron beam vapor deposition method, a reactive vapor deposition method, an ion plating method, a sputtering method, or a dry film forming method, a gravure printing method, or a screen printing method. A wet film forming method such as can be used. As a patterning method of the pixel electrode, an existing patterning method such as a mask vapor deposition method, a photolithography method, a wet etching method, or a dry etching method can be used depending on a material and a film forming method.

<Removal board wiring>
A take-out substrate wiring 104 is formed on the substrate, and patterning is performed as necessary. In the figure, the partition is not formed around the contact portion of the extraction substrate wiring, but the partition may be formed so as to partition the contact area with the portion electrically connected to the external drive wiring. The opening of the partition wall becomes a contact area. The material used for the substrate wiring for extraction is preferably low in conductivity and easy to pattern, and is a metal composite oxide such as ITO (indium tin composite oxide), indium zinc composite oxide, zinc aluminum composite oxide, etc. Or Cr, Al, Cu, Ag, Au, Pt, Pd, Ni, Mo, Ta, Ti, W, C, Fe, In, Ag-Mg, An, etc. . Further, a single layer or a laminate of fine particle dispersion films in which fine particles of these metal oxides or metal materials are dispersed in an epoxy resin or an acrylic resin can be used.

If necessary, a metal material such as Cu or Al may be provided as an auxiliary electrode in order to reduce the wiring resistance of the pixel electrode.

As a method for forming the substrate wiring for extraction, depending on the material, dry film forming methods such as resistance heating vapor deposition method, electron beam vapor deposition method, reactive vapor deposition method, ion plating method, sputtering method, gravure printing method, screen A wet film forming method such as a printing method can be used. As a patterning method for the extraction substrate wiring, an existing patterning method such as a mask vapor deposition method, a photolithography method, a wet etching method, or a dry etching method can be used depending on the material and the film forming method.

After the extraction substrate wiring is formed, in the present invention, a convex pattern is formed in the contact area of the extraction substrate wiring. Existing patterning methods such as mask vapor deposition, photolithography, wet etching, and dry etching can be used as the method for forming the convex pattern, depending on the material and film formation method. In order to form it, a photolithography method, a wet etching method, and a dry etching method are preferable. In particular, it is preferable to use a dry etching method in order to form the inclined angle of the convex pattern at 60 ° or more and 90 ° or less.

<Partition wall>
The partition wall 103 of the present invention is formed so as to partition the pixel region a corresponding to the pixel. It is preferable to form the pixel electrode 102 so as to cover the end portion.

The component which comprises the photosensitive composition for partition of the passive-matrix drive type organic electroluminescent display panel of this invention, and its composition are demonstrated.
The barrier rib photosensitive composition of the present invention (hereinafter sometimes simply referred to as “photosensitive composition”) includes at least component (A); an ethylenically unsaturated compound, component (B); a photopolymerization initiator, and (C) component; an alkali-soluble binder is contained. Usually, it is preferable to further contain a surfactant or the like, and also contains a solvent.

  As in the conventional method, the partition wall is formed by uniformly forming an inorganic film on a substrate, masking with a resist, and performing dry etching, or laminating a photosensitive resin on the substrate, and then by a photolithographic method. The method of making this pattern is mentioned.

Further, the partition wall 103 may have a multi-stage shape. In that case, the partition wall 103 includes a first-stage partition wall formed in a lattice shape so as to divide pixels, and a second-stage partition wall formed on the first-stage partition wall. Different materials may be used for the first-stage material and the second-stage material. For example, an inorganic material such as SiO ₂ or SiNx can be used for the first stage material, and an organic material such as a photosensitive resin can be used for the second stage, and these are patterned by a photolithography method as described above. I can do it.

  The preferred height of the partition wall is 0.1 μm to 10 μm, more preferably about 0.5 μm to 2 μm. If it is too high, the formation and sealing of the counter electrode will be hindered, and if it is too low, the end of the pixel electrode will not be covered, or the adjacent pixels will be mixed when forming the light emitting medium layer.

  Next, the light emitting medium layer 110 composed of the hole injection layer 111, the interlayer or hole transport layer 112, the organic light emitting layer 113, and the electron injection layer 114 formed on the first electrode 102 will be described.

<Hole injection layer>
The material of the hole injection layer 111 is arbitrary, but the resistivity is preferably 10 ⁴ Ω · cm or more in order to prevent a short circuit between pixels. Further, providing a step in the shape of the partition wall may change the film thickness of the hole injection layer to suppress a short circuit between pixels. For example, Cu ₂ O, Cr ₂ O ₃ , Mn ₂ O ₃ , FeOx, NiO, CoO, Pr ₂ O ₃ , Ag ₂ O, MoO ₂ , Bi ₂ O ₃ , ZnO, TiO ₂ , SnO ₂ , ThO ₂ , Transition metal oxides such as V ₂ O ₅ , Nb ₂ O ₅ , Ta ₂ O ₅ , MoO ₃ , WO ₃ , MnO _{2 and the} like, inorganic compounds containing one or more of these nitrides and sulfides, polyaniline derivatives, oligos Aniline derivative, quinonediimine derivative, polythiophene derivative, polyvinylcarbazole (PVK) derivative, poly (3,4-ethylenedioxythiophene) (PEDOT), pyrrole derivative, aromatic amine, (triphenylamine) dimer derivative (TPD), ( α-naphthyldiphenylamine) dimer (α-NPD), [(triphenylamine) dimer] Triarylamines such as spiro-dimer (Spiro-TAD), 4,4 ′, 4 ″ -tris [3-methylphenyl (phenyl) amino] triphenylamine (m-MTDATA), 4,4 ′, 4 ′ Starburst amines such as' -tris [1-naphthyl (phenyl) amino] triphenylamine (1-TNATA) and 5,5′-α-bis- {4- [bis (4-methylphenyl) amino] phenyl } -2,2 ′: oligothiophenes such as 5 ′, 2′-α-terthiophene (BMA-3T), aromatic amine-containing polymers, aromatic diamine-containing polymers, fluorene-containing aromatic amine polymers, Organic materials such as triazole, oxazole, oxadiazole, silole, and boron are listed.

As a method for forming the hole injection layer 111, depending on the material, a dry film forming method such as a resistance heating evaporation method, an electron beam evaporation method, a reactive evaporation method, an ion plating method, a sputtering method, a spin coating method, Existing film forming methods such as a sol-gel method, an ink jet method, a nozzle printing method, a relief printing method, a slit coating method, a wet coating method such as a bar coating method can be used. Various film forming methods can be used.

  The thickness of the hole injection layer 111 is preferably 20 nm or more and 100 nm or less. If the thickness is less than 20 nm, short defects are likely to occur, and if the thickness is more than 100 nm, the resistance is increased and the current is reduced.

Inorganic materials are preferred because many materials are excellent in heat resistance and electrochemical stability. These can be formed as a single layer or a stacked structure of a plurality of layers, or a mixed layer.

<Interlayer or hole transport layer>
After forming the hole injection layer, the hole transport layer can be formed. In this case, the hole transport layer is formed in a line pattern on the hole injection layer formed on the entire surface, but the hole transport layer may be formed on the entire surface of the hole injection layer. The hole transport layer protects the hole injection layer from electrons and can also be used as an interlayer serving as a base layer for coating formation of the light emitting layer.

Polyaniline derivatives, oligoaniline derivatives, quinonediimine derivatives, polythiophene derivatives, polyvinylcarbazole (PVK) derivatives, poly (3,4-ethylenedioxythiophene) (PEDOT), pyrrole derivatives, aromatic amines as materials used for the hole transport layer Triarylamines such as (triphenylamine) dimer derivative (TPD), (α-naphthyldiphenylamine) dimer (α-NPD), [(triphenylamine) dimer] spirodimer (Spiro-TAD), 4,4 ', 4 ″ -tris [3-methylphenyl (phenyl) amino] triphenylamine (m-MTDATA), 4,4 ′, 4 ″ -tris [1-naphthyl (phenyl) amino] triphenylamine (1 Starburst amines such as -TNATA) And oligos such as 5,5′-α-bis- {4- [bis (4-methylphenyl) amino] phenyl} -2,2 ′: 5 ′, 2′-α-terthiophene (BMA-3T) Examples thereof include organic materials such as thiophenes, aromatic amine-containing polymers, aromatic diamine-containing polymers, fluorene-containing aromatic amine polymers, triazole-based, oxazole-based, oxadiazole-based, silole-based, and boron-based materials.

As a method for forming the hole transport layer 112, depending on the material, a dry film forming method such as a resistance heating evaporation method, an electron beam evaporation method, a reactive evaporation method, an ion plating method, a sputtering method, a spin coating method, Existing film forming methods such as a sol-gel method, an ink jet method, a nozzle printing method, a relief printing method, a slit coating method, a wet coating method such as a bar coating method can be used. Various film forming methods can be used.

<Organic light emitting layer>
After the formation of the interlayer, the organic light emitting layer 113 is formed. The organic light emitting layer emits light by recombining holes and electrons. When the display light emitted from the organic light emitting layer 113 is monochromatic, it is formed so as to cover the interlayer 105. In order to obtain display light, it can be suitably used by performing patterning as necessary.

  Examples of the organic light-emitting material forming the organic light-emitting layer 113 include coumarin-based, perylene-based, pyran-based, anthrone-based, porphyrin-based, quinacridone-based, N, N′-dialkyl-substituted quinacridone-based, naphthalimide-based, N, N′-. Diaryl-substituted pyrrolopyrrole, iridium complex, and other luminescent dyes dispersed in polymers such as polystyrene, polymethyl methacrylate, polyvinylcarbazole, and polyarylene, polyarylene vinylene, and polyfluorene polymers Examples of the material include, but are not limited to, the present invention.

  These organic light emitting materials are dissolved or stably dispersed in a solvent to form an organic light emitting ink. Examples of the solvent for dissolving or dispersing the organic light emitting material include toluene, xylene, acetone, anisole, methyl ethyl ketone, methyl isobutyl ketone, cyclohexanone, or a mixed solvent thereof. Among them, aromatic organic solvents such as toluene, xylene, and anisole are preferable from the viewpoint of the solubility of the organic light emitting material. Moreover, surfactant, antioxidant, a viscosity modifier, a ultraviolet absorber, etc. may be added to organic luminescent ink as needed.

  In addition to the polymer materials described above, 9,10-diarylanthracene derivatives, pyrene, coronene, perylene, rubrene, 1,1,4,4-tetraphenylbutadiene, tris (8-quinolato) aluminum complex, tris (4-methyl) -8-quinolate) aluminum complex, bis (8-quinolate) zinc complex, tris (4-methyl-5-trifluoromethyl-8-quinolate) aluminum complex, tris (4-methyl-5-cyano-8-quinolate) Aluminum complex, bis (2-methyl-5-trifluoromethyl-8-quinolinolato) [4- (4-cyanophenyl) phenolate] aluminum complex, bis (2-methyl-5-cyano-8-quinolinolato) [4- (4-Cyanophenyl) phenolate] aluminum complex, tris (8-quino) Norato) scandium complex, bis [8- (para-tosyl) aminoquinoline] zinc complex and cadmium complex, 1,2,3,4-tetraphenylcyclopentadiene, poly-2,5-diheptyloxy-para-phenylene vinylene A low molecular weight light emitting material such as can be used.

  As a method for forming the organic light emitting layer 113, an existing film forming method such as an ink jet printing method, a nozzle print printing method, a relief printing method, a gravure printing method, or a wet film forming method such as a screen printing method is used depending on the material. In the present invention, the present invention is not limited to these. In particular, when the light emitting layer is separately applied to each light emitting color using an organic light emitting ink in which an organic light emitting material is dissolved or stably dispersed in a solvent, a partition wall is used. An ink jet method, a nozzle printing method, and a relief printing method that can transfer ink between them and perform patterning are suitable.

<Method for forming luminescent medium layer>
A case where the light emitting medium layer is formed by a relief printing method is shown below.

  FIG. 7 shows a schematic diagram of a relief printing apparatus 600 when pattern printing is performed on an organic light emitting ink made of an organic light emitting material on a substrate 602 on which a pixel electrode, a hole injection layer, and a hole transport layer are formed. . The manufacturing apparatus includes an ink tank 603, an ink chamber 604 serving as ink supply means, an anilox roll 605, and a plate copper 608 on which a plate 607 provided with a doctor device 606 letterpress is mounted. The ink tank 603 contains organic light emitting ink diluted with a solvent, and the organic light emitting ink is fed into the ink chamber 604 from the ink tank. The anilox roll 605 is instructed to rotate in contact with the ink supply unit of the ink chamber 604. The doctor device removes excess ink on the anilox roll to make the ink film on the anilox roll uniform. The ink supply means to the anilox roll 605 is not limited to the ink chamber, and may be one that discharges ink such as a die coater or a slit coater. The doctor device may be a plate-like doctor blade, a roller-like doctor roll, an air knife using compressed air, or the like, and these may be used in combination.

  As the anilox roll 605 rotates, the ink layer 609 of the organic light-emitting ink supplied to the anilox roll surface by the doctor device is formed with a uniform film thickness. The ink in this ink layer is transferred to the convex portion of the plate 607 mounted on the plate cylinder 608 that is driven to rotate in the vicinity of the anilox roll. A printing substrate 602 is installed on the stage 601, and the ink on the convex portion of the plate 607 is printed on the printing substrate 602, and if necessary, an organic light emitting layer is formed on the printing substrate through a drying process. Is done.

  The other light emitting medium layer can be formed by using the above-mentioned forming method in the same manner when it is applied as an ink.

<Electron injection layer>
After the organic light emitting layer 113 is formed, the electron injection layer 114 can be formed. Materials used for the electron injection layer include low molecular materials such as triazole, oxazole, oxadiazole, silole, and boron, alkali metals such as lithium fluoride, lithium oxide, and sodium fluoride, and alkaline earths It is possible to form a film by a vacuum deposition method using a metal salt, oxide or the like.

<Counter electrode>
Next, the counter electrode 106 is formed. In the case where the counter electrode is a cathode, a substance having a high electron injection efficiency into the light emitting layer 113 and a low work function is used. Specifically, a single metal such as Mg, Al, or Yb is used, or a compound such as Li, oxidized Li, or LiF is sandwiched by about 1 nm at the interface contacting the light emitting medium layer, and Al or Cu having high stability and conductivity is placed. You may use it, laminating | stacking. Alternatively, in order to achieve both electron injection efficiency and stability, one or more metals such as Li, Mg, Ca, Sr, La, Ce, Er, Eu, Sc, Y, and Yb having a low work function and stable Ag, Al An alloy system with a metal element such as Cu or Cu may be used. Specifically, alloys such as MgAg, AlLi, and CuLi can be used.

A metal mask used for forming the electron injection layer and the counter electrode is formed using a mask having a contact area, a pixel region, and an opening therebetween. In the case of the passive matrix driving type, a mask having a stripe-shaped opening perpendicular to the first electrode 102 is used as shown in FIG.
By depositing a contact area on the extraction substrate wiring, an electron injection layer is formed on the convex pattern surface of the extraction substrate wiring as shown in FIG. In addition, by using the oblique deposition method when forming the electron injection layer, the electron injection layer is formed only on a part of the convex pattern formed on the surface of the substrate wiring for extraction as shown in FIG. You can also.
Since the counter electrode covers the entire convex pattern of the extraction substrate wiring, the counter electrode is in direct contact with the extraction substrate wiring, and contact characteristics with lower resistance can be obtained.

<Sealing body>
As an organic EL display panel, it is possible to emit light by sandwiching a light emitting material between electrodes and passing an electric current. However, since an organic light emitting material is easily degraded by moisture and oxygen in the atmosphere, A sealing body for blocking is provided. The sealing body can be manufactured, for example, by providing a resin layer on a sealing material.

The sealing material needs to be a base material having low moisture and oxygen permeability. Examples of the material include ceramics such as alumina, silicon nitride, and boron nitride, glass such as alkali-free glass and alkali glass, quartz, and moisture resistant film. Examples of moisture-resistant films include films formed by CVD of SiOx on both sides of plastic substrates, films with low permeability and water-absorbing films, or polymer films coated with a water-absorbing agent. The water vapor transmission rate is preferably 10 ⁻⁶ g / m ² / day or less.

  Examples of the material for the resin layer include a photo-curing adhesive resin, a thermosetting adhesive resin, a two-component curable adhesive resin, and an ethylene ethyl acrylate (EEA) made of epoxy resin, acrylic resin, silicone resin, etc. Examples thereof include acrylic resins such as polymers, vinyl resins such as ethylene vinyl acetate (EVA), thermoplastic resins such as polyamide and synthetic rubber, and thermoplastic adhesive resins such as acid-modified products of polyethylene and polypropylene. Examples of methods for forming a resin layer on a sealing material include solvent solution method, extrusion lamination method, melting / hot melt method, calendar method, nozzle coating method, screen printing method, vacuum laminating method, hot roll laminating method, etc. Can be mentioned. A material having a hygroscopic property or an oxygen absorbing property may be contained as necessary. Although the thickness of the resin layer formed on a sealing material is arbitrarily determined by the magnitude | size and shape of the organic electroluminescent display panel to seal, about 5-500 micrometers is desirable. In addition, although formed as a resin layer on a sealing material here, it can also form directly in an organic EL display panel side.

  Finally, the organic EL display panel and the sealing body are bonded together in a sealing chamber. When the sealing body has a two-layer structure of a sealing material and a resin layer, and a thermoplastic resin is used for the resin layer, it is preferable to perform only pressure bonding with a heated roll. When a thermosetting adhesive resin is used, it is preferable to perform heat curing at a curing temperature after pressure bonding with a heated roll. In the case where a photocurable adhesive resin is used, curing can be performed by further irradiating light after pressure bonding with a roll.

  Next, as an example for describing the organic EL display panel of the present invention in detail, an active matrix drive type organic EL display panel using the first electrode 102 as an anode and the second electrode 106 as a cathode with reference to FIG. Is described. The present invention is not limited to this, and the first electrode 102 may be a cathode and the second electrode 106 may be an anode.

FIG. 2 is a schematic plan view of an active matrix driving type organic EL display panel as another embodiment of the present invention, and FIG. 3 is a schematic cross-sectional view of AA ′ described in FIG. The organic EL display panel of the present invention uses a first electrode 102 formed on a substrate 101 as an anode and a second electrode 106 formed so as to face the first electrode 102 as a cathode, and a layer sandwiched between them (light emitting medium layer). 110). The first electrode 102 is formed as a pixel electrode in a pixel region a that is partitioned and insulated from each other by a partition wall 103 for each pixel.
In FIG. 2, some parts are omitted to show the first electrode 102 and the partition wall 103. A light emitting medium layer 110, a hole transport layer 111, and an interlayer 112 are formed between the first electrode 102 and the electron injection layer 114, but are omitted in FIG.

  In the case of the active matrix driving type, the first electrode 102 is formed as a pixel electrode in the pixel region a partitioned and insulated from each other by the partition wall 103 for each pixel, and the second electrode 106 and the electron injection layer 114 are formed from the partition wall 103 and the pixel. It is formed so as to cover the entire region a. The first electrode is formed as a pixel electrode partitioned by a partition for each pixel, and the second electrode is a counter electrode formed on the entire surface of the element. The carrier injection layer is a hole injection layer, a hole transport layer, or an electron injection layer. Moreover, it is good also as an organic EL element of the reverse structure which used the 1st electrode side as the anode. In this case, the carrier injection layer formed on the first electrode is an electron injection layer.

<Board>
FIG. 6 shows an example of a TFT substrate with a partition which can be used in the present invention. A substrate (back plane) 308 used in the active matrix driving type organic EL display panel of the present invention is provided with a thin film transistor (TFT) and a lower electrode (pixel electrode) of the organic EL display panel, and the TFT, lower electrode, Is electrically connected.

  The TFT and the active matrix driving type organic EL display panel formed thereon are supported by a support. As the support, the same material as that of the passive matrix driving type organic EL display panel can be used.

  As the thin film transistor provided on the support, a known thin film transistor can be used. Specifically, a thin film transistor mainly including an active layer in which a source / drain region and a channel region are formed, a gate insulating film, and a gate electrode can be given. The structure of the thin film transistor is not particularly limited, and examples thereof include a staggered type, an inverted staggered type, a top gate type, a bottom gate type, and a coplanar type.

The active layer 311 is not particularly limited, and examples thereof include inorganic semiconductor materials such as amorphous silicon, polycrystalline silicon, microcrystalline silicon, cadmium selenide, thiophene oligomers, poly (p-ferylene vinylene), and the like. The organic semiconductor material can be used. These active layers are formed by, for example, laminating amorphous silicon by plasma CVD, ion doping; forming amorphous silicon by LPCVD using SiH ₄ gas, and crystallizing amorphous silicon by solid phase growth. After silicon is obtained, ion doping is performed by ion implantation; amorphous silicon is formed by LPCVD using Si ₂ H ₆ gas, or PECVD using SiH ₄ gas, and a laser such as an excimer laser is used. After annealing and crystallizing amorphous silicon to obtain polysilicon, a method of ion doping by ion doping (low temperature process); polysilicon is deposited by low pressure CVD or LPCVD, and thermally oxidized at 1000 ° C. or higher Gate break Film is formed, a gate electrode 8 of the n + polysilicon is formed thereon, then, a method of ion doping (high temperature process), and the like by an ion implantation method.

As the gate insulating film 309, a film normally used as a gate insulating film can be used. For example, the gate insulating film 309 can be obtained by thermally oxidizing SiO ₂ formed by PECVD, LPCVD, or the like, or a polysilicon film. SiO ₂ or the like can be used.

  As the gate electrode 314, a material usually used as a gate electrode can be used. For example, a metal such as aluminum or copper; a refractory metal such as titanium, tantalum or tungsten; polysilicon; Polycide; and the like.

  The thin film transistor may have a single gate structure, a double gate structure, or a multi-gate structure having three or more gate electrodes. Moreover, you may have a LDD structure and an offset structure. Further, two or more thin film transistors may be arranged in one pixel.

  The display device of the present invention needs to be connected so that the thin film transistor functions as a switching element of the organic EL display panel, and the drain electrode 310 of the transistor and the pixel electrode of the organic EL display panel are electrically connected.

<Pixel electrode>
A pixel electrode 102 is formed on the substrate, and patterning is performed as necessary. In the present invention, the pixel electrode is partitioned and insulated by the partition wall, and becomes a pixel electrode corresponding to each pixel. As the material of the pixel electrode, metal composite oxides such as ITO (indium tin composite oxide), indium zinc composite oxide and zinc aluminum composite oxide, metal materials such as gold and platinum, and these metal oxides and metals Either a single layer or a laminate of fine particle dispersion films in which fine particles of a material are dispersed in an epoxy resin or an acrylic resin can be used. When the pixel electrode is used as an anode, it is preferable to select a material having a high work function such as ITO. In the case of a so-called bottom emission structure in which light is extracted from below, it is necessary to select a light-transmitting material. If necessary, a metal material such as copper or aluminum may be provided as an auxiliary electrode in order to reduce the wiring resistance of the pixel electrode. Depending on the material, the pixel electrode is formed by a resistance heating vapor deposition method, an electron beam vapor deposition method, a reactive vapor deposition method, an ion plating method, a sputtering method, or a dry film forming method, a gravure printing method, or a screen printing method. A wet film forming method such as can be used. As a patterning method of the pixel electrode, an existing patterning method such as a mask vapor deposition method, a photolithography method, a wet etching method, or a dry etching method can be used depending on a material and a film forming method. In the case of using a substrate on which a TFT is formed as a substrate, it is formed so that conduction can be achieved corresponding to a lower pixel.

<Partition wall>
The partition wall 103 of the present invention is formed so as to partition a light emitting region corresponding to a pixel. It is preferable to form the pixel electrode 102 so as to cover the end portion. In general, in an active matrix drive type display device, a pixel electrode 102 is formed for each pixel (sub-pixel), and each pixel tries to occupy as large an area as possible, so that the end of the pixel electrode is covered. The most preferable shape of the partition wall to be formed is basically a lattice shape that divides each pixel electrode by the shortest distance.

Further, the partition wall 203 may be multi-staged, and in that case, the partition wall 203 includes a first-stage partition wall formed in a lattice shape so as to divide pixels, and a second-stage partition wall formed on the first-stage partition wall. Different materials may be used for the first-stage material and the second-stage material. For example, an inorganic material such as SiO ₂ or SiNx can be used for the first stage material, and an organic material such as a photosensitive resin can be used for the second stage, and these are patterned by a photolithography method as described above. I can do it.

  The organic light emitting medium layer can be formed by the same material, conditions, and film forming method as those of the passive matrix driving type organic EL display panel.

<Counter electrode>
Next, the counter electrode 106 is formed. The counter electrode can be formed by the same material, conditions, and film formation method as those of the passive matrix drive type organic EL display. The counter electrode is formed so as to cover the entire surface of the metal mask, and the shape of the opening of the metal mask used is a wide rectangular opening that covers the partition wall 103, the pixel portion a, and the contact area 105.

By depositing a contact area on the extraction substrate wiring, an electron injection layer is formed on the convex pattern surface of the extraction substrate wiring as shown in FIG. In addition, by using the oblique deposition method when forming the electron injection layer, the electron injection layer is formed only on a part of the convex pattern formed on the surface of the substrate wiring for extraction as shown in FIG. You can also.
Since the counter electrode covers the entire convex pattern of the extraction substrate wiring, the counter electrode is in direct contact with the extraction substrate wiring, and contact characteristics with lower resistance can be obtained.

  The sealing body can be formed by the same material, conditions, and adhesion method as the passive matrix driving type organic EL display panel.

[Example 1]
Examples of the present invention will be described below. The present invention is not limited to this.

  As the substrate, an active matrix substrate including a thin film transistor functioning as a switching element provided on a support and a pixel electrode formed thereabove was used. The size of the substrate is 200mm x 200mm, and a display panel with a diagonal of 5 inches and a pixel count of 320x240 is placed in the center, and the substrate wiring for extraction and contacts of 0.5mm length x 101.6mm width at the end An area is formed.

Cr was used as a substrate wiring material for taking out. Using photolithography and dry etching in the contact area of the substrate wiring for extraction, convex patterns of 0.2 mm x 0.2 mm and depth of 0.1 mm are formed on the surface at intervals of 0.2 mm in length and 0.2 mm in width. did. The inclination angle of the formed convex pattern was 90 °.

A partition wall was formed in such a shape as to cover the end of the pixel electrode provided on the substrate and partition the pixel. The partition walls were formed by forming a positive resist ZWD 6216-6 manufactured by Nippon Zeon Co., Ltd. on the entire surface of the substrate with a spin coater to a thickness of 2 μm, and then forming a partition wall having a width of 40 μm by photolithography. As a result, a pixel area of 960 × 240 dots and a pitch of 0.12 mm × 0.36 mm was defined.

  A sputtering film forming apparatus in which a molybdenum target is installed is placed on this substrate, and a hole injection layer is formed on the display region in a pattern so as not to be formed on the extraction electrode or the contact portion. The sputtering conditions at this time were a pressure of 1 Pa, a power of 1 kW, and a flow rate ratio of oxygen to argon gas of 30%. The film thickness was 50 nm.

  Thereafter, a film having a 30 nm thick liquid repellent is laminated at a roll temperature of 120 ° C., a pressing pressure of 0.6 MPa, and a speed of 150 mm per minute, and a liquid repellent layer is formed on the hole injection layer formed on the partition wall. A pattern was formed to be 10 nm.

  After that, this substrate was set in a printing machine using an ink in which polyvinylcarbazole derivative as an interlayer material was dissolved in toluene so as to have a concentration of 0.5%, and the substrate was directly above the pixel electrode sandwiched between insulating layers. Printing was performed by letterpress printing according to the line pattern. At this time, an anilox roll of 300 lines / inch and a photosensitive resin plate were used. The film thickness of the interlayer after printing and drying was 20 nm.

  Next, using organic light-emitting ink in which polyphenylene vinylene derivative, which is an organic light-emitting material, is dissolved in toluene to a concentration of 1%, this substrate is set in a printing machine and directly above the pixel electrode sandwiched between insulating layers. The organic light emitting layer was printed by a relief printing method according to the line pattern. At this time, an anilox roll of 150 lines / inch and a photosensitive resin plate corresponding to the pixel pitch were used. The thickness of the organic light emitting layer after printing and drying was 80 nm. This process was repeated three times in total to form an organic light emitting layer corresponding to the emission colors of R (red), G (green), and B (blue) in each pixel.

  Thereafter, Ba was deposited to a thickness of 4 nm using a vacuum deposition method and a shadow mask as an electron injection layer so as to cover between the pixel portion and the contact area.

Then, using the metal mask used when forming the electron injection layer, an aluminum film having a thickness of 150 nm was formed as a counter electrode in the same pattern as the electron injection layer.

  After the Ba film formation, the time required to start the Al film formation was 5 s.

  Thereafter, a glass plate was placed as a sealing material so as to cover the entire light emitting region, and sealing was performed by thermosetting the adhesive at about 90 ° C. for 1 hour.

  The contact characteristics of the active matrix driving type organic EL display panel obtained in this way are ohmic, and when the voltage is 1 V, the contact characteristic is 5 mA, that is, 200Ω, and a low resistance contact characteristic is obtained. Moreover, when this was driven, it was able to drive satisfactorily.

[Comparative Example 1]
An active matrix driving type organic EL display panel was produced in the same manner as in Example 1 except that the convex pattern was not formed in the contact area of the substrate wiring for extraction in the substrate of Example 1.

  When the active matrix drive type organic EL display panel thus obtained was driven, the contact characteristics were not ohmic, and became 0.01 mA when 1 V was applied, and low resistance contact characteristics were not obtained. Moreover, when this was driven, abnormal heat was generated in the vicinity of the contact area, and normal driving was not possible.

[Comparative Example 2]
In the substrate of Example 1, Ba is 4 nm thick using a vacuum deposition method and a shadow mask as an electron injection layer so as to cover only the pixel portion without forming a convex pattern in the contact area of the substrate wiring for extraction. A film was formed.

  Thereafter, the metal mask used for forming the electron injection layer was changed to a metal mask for a counter electrode, and an aluminum film having a thickness of 150 nm was formed as a counter electrode so as to cover between the pixel portion and the contact area.

  After the Ba film formation, the time required to start the Al film formation was 60 s.

  Otherwise, an active matrix driving type organic EL display panel was produced in the same manner as in Example 1.

  The contact characteristics of the active matrix driving type organic EL display panel obtained in this way are ohmic, and when the voltage is 1 V, the contact characteristic is 5 mA, that is, 200Ω, and a low resistance contact characteristic is obtained. However, when this was driven, the luminous efficiency and life were reduced, and the drive could not be performed satisfactorily.

101: Support (substrate)
102: Pixel electrode (first electrode)
103: Partition 104: Extraction substrate wiring 105: Contact area 106: Counter electrode (second electrode)
110: Organic light emitting medium layer 111: Hole injection layer
112: Interlayer 113: Organic light emitting layer 114: Electron injection layer 308: Substrate with TFT 309: Gate insulating film 310: Drain electrode 311: Active layer 312: Source electrode 313: Scan line 314: Gate electrode 600: Letterpress printing apparatus 601 : Stage 602: Printed substrate 603: Ink tank 604: Ink chamber 605: Anilox roll 606: Doctor device 607: Letterpress 608: Plate cylinder 609: Ink layer a: Pixel area

Claims (8)

At least a first electrode formed on the substrate, a second electrode facing the first electrode, a partition formed on the substrate to partition the first electrode, the first electrode, and the first electrode An organic electroluminescence display panel having a light emitting medium layer sandwiched between two electrodes and including an organic light emitting layer, and a substrate wiring for extraction formed on the substrate,
The extraction substrate wiring has a contact area on which a carrier injection layer and the second electrode are laminated, and a plurality of convex patterns are formed on the surface of the extraction substrate wiring in the contact area, and the carrier injection layer is at least , Formed so as to cover the light emitting medium layer, the substrate wiring surface for taking out the contact area, and the partition wall,
The organic electroluminescence display panel, wherein the second electrode is formed on the carrier injection layer.   The organic electroluminescence display panel according to claim 1, wherein an inclination angle of the slope of the convex pattern is 60 ° or more and 90 ° or less. 3. The organic electroluminescence display panel according to claim 1, wherein a height difference of the convex pattern is 0.1 μm or more and 0.5 μm or less. The organic electroluminescence display panel according to any one of claims 1 to 3, wherein the carrier injection layer is composed of an electron injection layer and / or an electron transport layer. The at least one substrate wiring material for extraction is selected from the group consisting of ITO, Cr, Al, Cu, Ni, Mo, Ta, Ti, W, Fe, Zn, Ag, Pt, Pd, and Ag—Mg. 5. The organic electroluminescence display panel according to claim 1, wherein the organic electroluminescence display panel is a metal. On the substrate, a first electrode, a second electrode facing the first electrode,
A partition partitioning the first electrode;
A light-emitting medium layer sandwiched between the first electrode and the second electrode and including at least an organic light-emitting layer and a carrier injection layer;
A substrate wiring for extraction electrically connected to the second electrode at a contact area;
An organic electroluminescence display panel manufacturing method comprising:
Forming a convex pattern on the substrate wiring for taking out the contact area;
Patterning the organic light emitting layer by applying an organic light emitting ink in which the organic light emitting material is dissolved or dispersed in a solvent on the carrier injection layer formed on the first electrode;
Forming the carrier injection layer so as to cover the contact area of the first electrode and the substrate wiring for extraction, and between the first electrode and the contact area;
Forming a second electrode in the same pattern as the carrier injection layer on the carrier injection layer;
A method for producing an organic electroluminescence display panel. 7. The method of manufacturing an organic electroluminescence display panel according to claim 6, wherein the step of forming the carrier injection layer is a dry process.   The method for producing an organic electroluminescence display panel according to claim 6 or 7, wherein the step of patterning the organic light emitting layer is any one of a printing method, an ink jet method, and a nozzle printing method.

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