JP2012243822A - Led light-emitting device and manufacturing method thereof - Google Patents

Abstract

PROBLEM TO BE SOLVED: To solve the problem of a conventional white member coated type LED light-emitting device that, because the light-emitting surface of the LED mounted on a circuit board has a translucent member or a phosphor layer bonded thereto while being exposed after a white member is filled and then cured on a side face of the LED, there is a possibility of the coating material sticking to the light extraction face of the LED, requiring an extra step in production process for removing it, for example, by polishing.SOLUTION: On a light-emitting surface of an LED element flip-chip mounted on a circuit board, a phosphor plate larger in size than the light-emitting surface of the LED element is bonded with transparent adhesive. The side face of the LED element and the bottom face of the phosphor plate are filled up to seal with a reflective white member, and a range of the LED element including the top face of the phosphor plate is covered with transparent resin.

Description

  The present invention relates to a light-emitting device including a light-emitting element such as an LED element and a method for manufacturing the light-emitting device. LED light emission with a configuration in which the LED element emits light efficiently in the upward direction by bonding with an adhesive and filling and sealing the side surface of the LED element and the lower surface of the phosphor plate with a reflective white member. The present invention relates to an apparatus and a manufacturing method thereof.

  In recent years, since an LED element (hereinafter abbreviated as LED) is a semiconductor element, it has a long life and excellent driving characteristics, is small in size, has high luminous efficiency, and has a bright emission color. Widely used for backlights and lighting.

  Particularly in recent years, a white member-covered LED light-emitting device that efficiently emits light in the upward direction by covering the periphery of the LED with a reflective white member and reflecting the light emitted to the side of the LED upward. A configuration is proposed. (For example, Patent Document 1 and Patent Document 2)

  A conventional white member-covered LED light emitting device will be described below. For ease of understanding, the drawings are partially simplified within the scope not departing from the spirit of the invention, and component names are also included in the present application. FIG. 8 is a cross-sectional view showing the manufacturing process of the LED light emitting device 100 in Patent Document 1. FIG. 8A shows a frame 109 around the LED 101 flip-chip mounted on the substrate 107 by the conductive members 106a and 106b. A state in which the light-reflective first white member 104 is filled and covered is shown. (B) shows the process of apply | coating the transparent adhesive 103 on the upper surface of LED101, and adhere | attaching the translucent member 102 (transparent member or fluorescent member) which passes the emitted light from LED101, and discharge | releases outside. (C) has shown the state by which the translucent member 102 was adhere | attached by the process of (b). FIG. 4D shows a white-member-covered LED light-emitting device by dropping the second white member 105 by the dropping device 108 and covering the entire surface including the side surface of the translucent member 102 with the second white member 105. 100 is completed.

FIG. 9 shows a cross-sectional view of the LED light emitting device 200 in Patent Document 2.
In FIG. 9, a case 203 having an opening on the light extraction side, and a wiring electrode 205a provided on the LED mounting surface in the case 203, the case 203 is placed around the LED 201 flip-chip mounted by conductive members 206a and 206b. The light-reflecting white member 204 is filled and covered, and in this state, a sheet-like phosphor layer 202 is stuck on the light extraction surface of the LED 201.

  In Patent Document 1 and Patent Document 2, the role of the white member is to reflect the emitted light emitted from the side surface side of the LED and return it to the emission surface side to increase the emission efficiency. The composition uses a coating material such as silicone resin, epoxy resin, acrylyl resin, etc., in which particles such as titanium oxide, silicon dioxide, zirconium dioxide, alumina, boron nitride are mixed as a reflective filler. A dripping device or an injection device is used.

JP 2010-192629 A JP 2007-19096 A

  In the manufacturing process of the conventional white member-covered LED light emitting device described in Patent Document 1 and Patent Document 2, the light emitting surface of the LED mounted on the circuit board or the case is exposed, A white member is filled on the side surface of the LED, and after the white member is cured, a translucent member or a phosphor layer is bonded to the light emitting surface of the LED. However, in this process order, in paragraph 0026 of Patent Document 2, “The coating material is filled so as to cover the portion other than the light extraction surface of the LED. Here, the coating material may adhere to the light extraction surface of the LED. However, in this case, there is a risk that the coating material adheres to the light extraction surface of the LED, as described in `` Removing the coating material on the light extraction surface by polishing to expose the light extraction surface ''. Such an extra process may be required, which is a production problem.

  Accordingly, an object of the present invention is to solve the above-mentioned problems, and in a white member-covered LED light emitting device, the coating material adheres to the light extraction surface of the LED when the white member is filled and cured. It is an object to provide an LED light emitting device having no danger and a method for manufacturing the same.

In order to achieve the above object, the configuration of the LED light emitting device in the present invention is as follows.
A phosphor plate having a shape larger than the light emitting surface of the LED element is bonded to the light emitting surface of the LED element flip-chip mounted on the circuit board with a transparent adhesive, and the side surface of the LED element and the phosphor plate The lower surface is filled and sealed with a reflective white member, and the range including the upper surface of the phosphor plate is covered with a transparent resin.

  According to the above configuration, the phosphor plate having a shape larger than the light emitting surface of the LED is filled with the transparent adhesive on the light emitting surface of the LED flip-chip mounted (hereinafter referred to as FC mounting) on the circuit board before filling the white member. The side surfaces of the LED elements and the lower surface of the phosphor plate are filled and sealed with a reflective white member, so that the coating material adheres to the LED light emitting surface by the adhered phosphor plate. Of course, there is no fear that the coating material adheres to the portion corresponding to the LED light emitting surface of the phosphor plate by enlarging the phosphor plate. Furthermore, by covering the upper surface side of the LED light emitting device with a transparent protective resin, the phosphor plate and the white member are prevented from being deteriorated, and the reliability as the LED light emitting device is improved.

  A phosphor plate having a shape larger than each of the LED elements is adhered to the light emitting surfaces of the plurality of LED elements flip-chip mounted on the circuit board with a predetermined interval with a transparent adhesive. The side surface and the lower surface of the phosphor plate are filled and sealed with a reflective white member, and the range including the upper surface of the phosphor plate is covered with a transparent resin.

  According to the above configuration, in the LED light emitting device configured to mount a plurality of LEDs on a single circuit board, the phosphor plate having a large shape is independently bonded on the light emitting surface of each LED, and the white member is injected. By performing in common, the light emission of each LED is performed without being affected by the light emission of the adjacent LED, so that the light emission shape is balanced and the productivity is improved by the common injection of the white member. I can do it.

In order to achieve the above object, a method for manufacturing an LED light emitting device in the present invention is as follows.
A mounting process for flip-chip mounting a plurality of LED elements on a circuit board at a predetermined interval, and a phosphor plate having a shape larger than that of each of the LED elements is transparent on the light emitting surface of the plurality of flip-chip mounted LED elements A phosphor plate bonding step for bonding with an adhesive, a white member filling step for filling and sealing a side surface of each LED element and a lower surface of the phosphor plate with a reflective white member, and bonding to each LED element And a protective resin coating step of covering a range including the upper surface of each phosphor plate with a transparent resin.

  As described above, according to the present invention, the coating material does not adhere to the LED light emitting surface, and the coating material adheres to the portion corresponding to the LED light emitting surface of the phosphor plate by enlarging the phosphor plate. There is no worry that will occur. Furthermore, by covering the upper surface side of the LED light emitting device with a transparent protective resin, the phosphor plate and the white member are prevented from being deteriorated, and the reliability as the LED light emitting device is improved.

It is sectional drawing of the LED light-emitting device in 1st Embodiment of this invention. It is a top view of the LED light-emitting device in 1st Embodiment shown in FIG. It is process drawing which shows each cross section of the manufacturing method of the LED light-emitting device shown in FIG. It is process drawing which shows each upper surface of the manufacturing method of the LED light-emitting device shown in FIG. It is a top view of the LED light-emitting device in 2nd Embodiment of this invention. It is AA sectional drawing of the LED light-emitting device in 2nd Embodiment shown in FIG. It is process drawing which shows each cross section of the manufacturing method of the LED light-emitting device shown in FIG. It is process drawing which shows each cross section of the manufacturing method of the conventional LED light-emitting device. It is sectional drawing of the conventional LED light-emitting device.

(First embodiment)
Embodiments of the present invention will be described below with reference to the drawings. 1 to 4 show an LED light emitting device according to a first embodiment of the present invention, FIG. 1 is a cross-sectional view of the LED light emitting device 10 according to the first embodiment of the present invention, and FIG. FIG. 3 and FIG. 4 are process diagrams showing the manufacturing process of the LED light emitting device 10, FIG. 3 shows a sectional view of each element, and FIG. 4 shows a top view of each element.

In the cross-sectional view of the LED light emitting device 10 shown in FIG. 1 and the top view shown in FIG. 2, a wiring electrode 5a is provided on the top surface of the circuit board 7, and is connected to the power supply electrode 5b through the through-side electrode 5c. The LED 1 is FC mounted on the wiring electrode 5a by the conductive members 6a and 6b, and the phosphor plate 2 having a shape larger than the light emitting surface of the LED 1 is adhered on the light emitting surface of the LED 1 with a transparent adhesive described later. Yes. Further, the side surface of the LED 1 and the bottom surface of the phosphor plate 2 are filled and sealed with a reflective white member 4 by a printing frame 9 formed on the circuit board 7, and the range including the top surface of the phosphor plate 2 is transparent. Covered with resin 8.

  Next, a manufacturing process of the LED light emitting device 10 will be described with reference to FIGS. Note that the steps (a) to (d) in FIG. 4 correspond to the steps (a) to (d) in FIG. 3, and the cross sections in each step shown in FIG. Step (a) in FIG. 3 and FIG. 4 is an FC mounting process of the LED 1. The LED 1 is mounted on the circuit board 7 on which the wiring electrode 5 a, the through-side electrode 5 c, the power supply electrode 5 b, and the printing frame 9 are formed. It is a mounting process. Step (b) is a phosphor plate bonding step in which the phosphor plate 2 is bonded onto the light emitting surface of the LED 1 using the transparent adhesive 3. Step (c) is a white member filling step in which the side surface of the LED 1 and the lower surface of the phosphor plate 2 are filled and sealed with the reflective white member 4 using the dropping device 108. In this step, the printing frame 9 and the fluorescent material are used. The filling amount of the semiconductor chip is regulated to be constant by the lower end surface of the body plate 2, and the space between the lower surface of the LED 1 and the circuit board 7 is also filled. Therefore, by making the area of the phosphor plate 2 sufficiently larger than the light emitting surface of the LED 1, the white member 4 that covers the side surface and the lower surface of the LED 1 is interposed between the lower surface having the larger area of the phosphor plate 2 and the upper surface of the circuit board 7. The thickness is correctly regulated, and the risk of light emission leakage from the LED 1 to the side due to insufficient filling of the white member 4 is eliminated. Step (d) is a protective resin coating step in which a range including the upper surface of the phosphor plate 2 bonded to the LED 1 is covered with the transparent resin 8. The LED light emitting device 10 is covered by covering the entire area with the transparent resin 8. Is completed.

(Second Embodiment)
Next, the configuration and manufacturing method of the LED light emitting device according to the second embodiment of the present invention will be described with reference to FIGS. FIG. 5 is a top view of the LED light emitting device 20 according to the second embodiment of the present invention, and FIG. 6 is a cross-sectional view taken along the line AA of the LED light emitting device 20 shown in FIG. FIG. 7 is a process diagram showing a manufacturing process of the LED light emitting device 20, and shows the same cross section as FIG. 6 of each element.

  The LED light emitting device 20 in the second embodiment is different from the LED light emitting device 10 in the first embodiment in that the LED light emitting device 10 is mounted with only one LED 1 whereas the LED light emitting device 20 is four. LEDs 1a to 1d are mounted. That is, as shown in FIGS. 5 and 6, the circuit board 27 is provided with connection electrodes 25d for connecting the LEDs in addition to the wiring electrodes 25a, the power supply electrodes 25b, and the through-side electrodes 25c. The LEDs 1a and 1b are FC-mounted in series between the wiring electrode 25a and the connection electrode 25d, and although not shown, the LEDs 1c and 1d are similarly FC-mounted in series between the wiring electrode 25a and the connection electrode 25d. Two sets of LEDs connected in series are connected in parallel.

  The phosphor plates 2a, 2b, 2c, and 2d are independently bonded to the light emitting surfaces of the LEDs 1a, 1b, 1c, and 1d by a transparent adhesive, and the printing frame 9 printed on the circuit board 27 The reflective white member 4 is filled between the lower surface of each phosphor plate 2 and between the circuit board 27 and each LED. Further, the range including the upper surfaces of the four phosphor plates 2a to 2d is covered with the transparent resin 8 to complete the LED light emitting device 20. The four LEDs 1a to 1d may be LEDs having the same emission color or LEDs having different emission colors. Further, the four phosphor plates 2a to 2d may have the same fluorescent color or different fluorescent colors.

  In the operation of the LED light emitting device 20, the power supply voltage supplied to the power supply electrode 25b is doubled that of the LED light emitting device 10, whereby the four LEDs 1a, 1b, 1c, and 1d are turned on and the brightness is four times brighter. Light emission or mixed light emission can be performed.

  Next, a manufacturing process of the LED light emitting device 20 will be described with reference to FIG. FIG. 7A shows a mounting process in which the LED 1a and the LED 1b are FC-mounted with a predetermined interval between the wiring electrode 25a and the connection electrode 25d of the circuit board 27. FIG. (B) is a phosphor plate bonding step in which the phosphor plates 2a and 2b having a shape larger than each LED are bonded to the light emitting surface of the two LEDs 1a and 1b mounted with FC by the transparent adhesive 3. (C) is a white member filling step in which the side surfaces of the LED elements 1a and 1b and the lower surfaces of the phosphor plates 2a and 2b are filled and sealed with a reflective white member 4. By dropping and injecting, the printing frame 9 on the circuit board 27 and the lower surfaces of the phosphor plates 2a and 2b and the LEDs 1a. It is filled between the lower surface of 1 b and the circuit board 27.

  FIG. 7D shows a protective resin coating step, and the LED light emitting device 20 is completed by covering the area including the upper surfaces of the phosphor plates 2a and 2b bonded to the LED elements 1a and 1b with a transparent resin. To do. According to the manufacturing method of the LED light emitting device 20, since the phosphor plate is bonded to the light emitting surface of the LED in the first step, the filled white member does not adhere to the light emitting surface of the LED. There is no worry about blocking the light. In addition, since the phosphor plate is independently bonded to each LED, the light emission through the phosphor plate of each LED is not affected by the adjacent LED, and the light emission state of the LED light emitting device as a whole There is no uneven emission of light.

1, 101, 201 LED
2, 2a, 2b, 2c Phosphor plate 3, 103 Transparent adhesive 4, 104, 204 White member 5a, 205a Wiring electrode 5b, 25b, 205b Power supply electrode 5c, 25c Side-through electrode 6a, 6b, 106a, 106b Conductive member 206a, 206b Conductive member 7, 27, 107 Circuit board 8 Transparent resin 9 Printing frame
10, 20, 100, 200 LED light emitting device 102 Transparency member 105 Second white member 108 Dropping device 109 Frame body 202 Phosphor layer 203 Case 205c Through-hole electrode

Claims (3)

  A phosphor plate having a shape larger than the light emitting surface of the LED element is bonded to the light emitting surface of the LED element flip-chip mounted on the circuit board with a transparent adhesive, and the side surface of the LED element and the phosphor plate An LED light emitting device, wherein a lower surface is filled and sealed with a reflective white member, and a range including the upper surface of the phosphor plate is covered with a transparent resin.   A phosphor plate having a shape larger than that of each of the LED elements is bonded to the light emitting surfaces of the plurality of LED elements that are flip-chip mounted on the circuit board at a predetermined interval, and the side surfaces of the LED elements and the phosphors An LED light emitting device, wherein a lower surface of a plate is filled and sealed with a reflective white member, and a range including the upper surface of the phosphor plate is covered with a transparent resin. A mounting process for flip-chip mounting a plurality of LED elements on a circuit board at a predetermined interval, and a phosphor plate having a shape larger than that of each of the LED elements is transparent on the light emitting surface of the plurality of flip-chip mounted LED elements A phosphor plate bonding step for bonding with an adhesive, a white member filling step for filling and sealing a side surface of each LED element and a lower surface of the phosphor plate with a reflective white member, and bonding to each LED element A method for manufacturing an LED light emitting device, comprising: a protective resin coating step of covering a range including the upper surface of each phosphor plate with a transparent resin.

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