JP2012124201A - Soldering mechanism and soldering method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a soldering mechanism and a soldering method, capable of securely soldering with suppressing work man-hours.SOLUTION: The soldering mechanism for soldering a module component having mounted components with a substrate by solder fused by heating comprises: a first nozzle having a flow channel to blow a heated hot wind into the solder; a second nozzle including an exhaust mechanism having a flow channel to suck the hot wind made to blow from the first nozzle and to exhaust outside the soldering mechanism; a suction nozzle having a heat radiation sheet to radiate heat generated in the component from the component; and a control unit for exhausting the hot wind from the second nozzle to the outside of the soldering mechanism when the first nozzle blows the hot wind, and for operating the suction nozzle, so as to allow the heat radiation sheet to contact to the component.

Description

  The present invention relates to a soldering mechanism and a soldering method capable of repairing a module component mounted on a printed circuit board.

  Conventionally, in the method of repairing surface-mounted components such as BGA (Ball Grid Array) components, air heated to the solder melting temperature by a heater for air heating is applied to the entire component from the upper surface side of the component to heat the component back There is a technique of melting the solder paste on the side and soldering it to the printed circuit board. Then, the parts are mechanically repaired using the apparatus equipped with this method. As an example of such a component, there is a collective component (hereinafter referred to as a module component) having a structure in which various electronic components are mounted on a sub-board smaller than a printed circuit board. A technique for soldering is disclosed (for example, Patent Document 1).

Japanese Patent Laid-Open No. 11-26929

  However, the above-described conventional technique has a problem that the hot-air components may melt or scatter. FIG. 3 is a diagram illustrating an example of an external perspective view of a module component. In the example illustrated in FIG. 3, the module component 3 has a component structure in which various components 10 are mounted on a daughter board 11 and is configured by the daughter board 11 and the various components 10.

  In the prior art, when the module component 3 is soldered, the solder paste 8 is usually melted and soldered by the entire heating in a reflow furnace. The surface temperature of the module component 3 at this time is set to 240 ° C. or lower in the case of lead-free solder. In addition, unlike the repair work, the entire heating by the reflow furnace does not blow local hot air, so that the various components 10 mounted on the component surface are not dropped or scattered by the hot air. However, in the repair work of the module component 3, there is a case where the heating is locally performed from the upper surface of the component. In this case, the surface temperature of the component rises to around 250 ° C. As a result, various components mounted on the surface of the component. The component 10 itself or the solder for fixing the various components 10 to the module component 3 may be melted by the heat and scattered by the hot air.

  For this reason, the method as in the prior art cannot be adopted, and the terminal part 4 and the substrate 5 of the module component 3 must be fixed with a soldering iron by manual work, which requires work time, There is a problem that reliability cannot be obtained by reliably connecting the target parts of the parts to be soldered. In addition, since the position where the adjacent component is arranged is very close to the position of the target part of the part to be worked, there is a problem that the soldering iron cannot be brought into contact with the target part and the repair work cannot be performed.

  The present invention has been made in view of the above, and an object of the present invention is to provide a soldering mechanism and a soldering method capable of reducing the number of work steps and capable of reliably soldering.

  In order to solve the above-described problems and achieve the object, a soldering mechanism according to the present invention is a soldering mechanism for soldering a module component on which a component is mounted and a substrate by solder melted by heating. A first nozzle having a flow path for blowing heated hot air into the solder, and a flow path for sucking the hot air blown from the first nozzle and discharging it to the outside of the soldering mechanism A second nozzle having an exhaust mechanism, a suction nozzle having a heat radiating sheet for radiating heat generated in the component from the component, and the second nozzle when the first nozzle blows the hot air. A control unit for exhausting the hot air from the nozzle to the outside of the soldering mechanism and operating the suction nozzle to bring the heat-dissipating sheet into contact with the component. The features.

  Moreover, this invention is the soldering method performed with the soldering mechanism of the said module component.

  The soldering mechanism according to the present invention is a soldering mechanism for soldering a module component on which a component is mounted and a substrate with solder that is melted by heating, and for blowing heated hot air into the solder. A second nozzle having a first nozzle having a flow path and an exhaust mechanism having a flow path for sucking the hot air blown from the first nozzle and discharging it to the outside of the soldering mechanism A cooling nozzle that sends cooling air to the component; and when the first nozzle blows the hot air, the hot air is exhausted from the second nozzle to the outside of the soldering mechanism, and the cooling nozzle And a controller that sends the cooling air to the parts.

  The soldering mechanism according to the present invention is a soldering mechanism for soldering a module component on which a component is mounted and a substrate with solder that is melted by heating, and for blowing heated hot air into the solder. A first nozzle having a flow path and disposed at a position facing each other, and a position perpendicular to the facing surface of the first nozzle, disposed at a position facing each other, and blown from the first nozzle A second nozzle having an exhaust mechanism having a flow path for sucking the hot air and discharging it to the outside of the soldering mechanism; a cooling nozzle for sending cooling air to the component; and the first nozzle When the nozzle blows the hot air, the hot air is exhausted from the second nozzle to the outside of the soldering mechanism, and the cooling nozzle is operated to send the cooling air to the component. Characterized in that it comprises a control unit, a.

  According to the present invention, it is possible to provide a soldering mechanism and a soldering method capable of reducing the number of work steps and capable of soldering reliably.

It is a figure which shows the structure (Before heat-dissipation sheet fall) of the module component soldering mechanism concerning Example 1. FIG. It is a figure which shows the arrangement | positioning relationship between a nozzle and an exhaust port. It is a figure which shows the structure (after the heat radiating sheet descend | falls) of the module component soldering mechanism concerning embodiment of this invention. It is the external appearance perspective view which showed typically the example of a structure of the whole apparatus concerning this embodiment. It is the external appearance perspective view which showed an example of the module components (surface). It is the external appearance perspective view which showed an example of the module components (back surface). It is a figure which shows the example of a temperature profile. It is a figure which shows the structure of the soldering mechanism of the module components concerning Example 2. FIG. It is a figure which shows the structure of the soldering mechanism of the module components concerning Example 3. FIG. It is a figure which shows the structure of the soldering mechanism of the module components concerning Example 4 (exhaust port side side surface). It is a figure which shows the structure of the soldering mechanism of the module components concerning Example 4 (nozzle side surface). FIG. 7B is an external perspective view of the nozzle mechanism in the configuration cross-sectional view shown in FIGS. 7A and 7B. It is a figure which shows a mode that the nozzle mechanism shown to FIG. 8A was decomposed | disassembled.

In the following, it has been realized by adopting a soldering method equipped with a component cooling mechanism for the purpose of automating the repair work of a module component which has conventionally been a manual operation. This soldering method realizes a method of attaching module parts without being affected by scattering of parts during repair work soldered by a reflow furnace, adjacent parts, and hereinafter, a soldering mechanism according to the present invention, The embodiment of the soldering method will be described in detail focusing on the cooling mechanism.
Example 1
FIG. 1A is a diagram showing a configuration of a soldering mechanism (hereinafter simply referred to as a soldering mechanism) 1000 according to an embodiment of the present invention. It is assumed that the operation of each unit constituting the soldering mechanism 1000 is controlled by a control unit 100 including an arithmetic device such as a CPU (Central Processing Unit).

  As shown in FIG. 1A, the soldering mechanism 1000 covers the module component 3, and a flow path for blowing the air 7 sent from the air heating heater 6 from the air blowing port 9 between the module component 3 and the substrate 5. And a mechanism in which a heat radiating sheet 12 is attached below the suction nozzle 2 capable of sucking various components constituting the module component 3 by the suction pump P. The soldering mechanism 1000 further includes a cooling fan 15 for sucking air 7 blown out from the air heating heater 6 through the nozzle 1 and an air 7 sucked by the cooling fan 15 into the upper part of the mechanism. A nozzle having an exhaust port 16 forming a flow path is provided.

  Next, the arrangement relationship between the nozzle 1 and the exhaust port 16 will be described. FIG. 1B is a diagram showing an arrangement relationship between the nozzle 1 and the exhaust port 16. As shown in FIG. 1B, the positional relationship between the inner portion of the air outlet 9, that is, the inner portion of the tip of the nozzle 1, is the shortest distance from the outer portion of the tip of the exhaust port 16. It is in. In the example shown in FIG. 1B, the line segment connecting the tip end A of the nozzle 1 and the tip B of the exhaust port 16 is arranged to be the shortest distance, and the angle generated between the line segment and the upper surface of the substrate 5. Is about 120 °. In the present embodiment, the nozzle 1 and the exhaust port 16 are arranged so that the angle generated between the above-described line segment and the upper surface of the substrate 5 is about 120 °, but the above-mentioned shortest distance is satisfied. As long as it is, it may be arranged at any angle.

  In this way, the nozzle 1 and the exhaust port 16 are divided into a portion inside the tip portion of the nozzle 1 (tip portion in the downstream direction of the flow path of the nozzle 1) and a portion outside the tip portion of the exhaust port 16 (exhaust port 16). The air 7 is guided to the exhaust port 16 most efficiently, and the air 7 is efficiently released upward from the cooling fan 15, so that the printed board 5 It is possible to quickly prevent a temperature rise during the repair work of the module component 3 mounted on the top.

  FIG. 2 is an external perspective view of the repair device 1100 for the module component 3 having the soldering mechanism 1000 shown in FIG. Note that the operation of the repair device 1100 is controlled by an external controller including an arithmetic device such as a CPU (not shown).

  As shown in FIG. 2, the repair device 1100 lowers the air exhaust port 16, which is an integrated mechanism with the suction nozzle 2 including the nozzle 1 and the heat radiating sheet 12, to a predetermined position. The air 7 is blown from the air blowing port 9 to the module component 3 to be attached to the printed circuit board 5 while suppressing the temperature rise. At the same time, the repair device 1100 always sucks and exhausts the air 7 from the exhaust port 16 to melt the solder of the terminal portion 4 while suppressing the temperature rise of the module component 3 and performs soldering.

  The nozzle 1 in FIG. 1 is connected to an air heating heater 6, and the control unit 100 performs solder melting temperature according to a temperature detected by the temperature sensor 22 shown in FIG. 1A in advance and a preset temperature profile. When it is determined that the heating is performed as described above, the first Z-axis Z1 shown in FIG. 2 is operated to lower the air exhaust port 16 which is a mechanism integrated with the nozzle 1 to the component terminal portion 4 on the printed circuit board 3. Then, air 7 is jetted from the air outlet 9. Note that the temperature profile defines the temperature conditions when soldering is performed properly by melting the solder. For example, the temperature profile is represented by a graph or a mathematical formula showing the relationship between temperature and time as shown in FIG. Can do.

  In this temperature profile, the preheating time, the melting time, and the cooling time are determined depending on the material of the solder and various components 10 and the like. Furthermore, the control unit 100 determines whether or not the solder has been melted by determining, for example, whether or not a predetermined time has elapsed since the solder has reached the melting temperature or higher according to the temperature profile. If it is determined that the solder has melted, the suction of hot air through the exhaust port 16 can be stopped. By performing such control, it is possible to eliminate useless suction of hot air and efficiently suppress the temperature rise of the module component 3.

  The temperature of the air 7 ejected from the air outlet 9 is heated to the solder melting point temperature or more, and the various components 10 mounted on the module component 3 itself are scattered and dropped due to the temperature rise of the component by the hot air. There are concerns. Therefore, in the present embodiment, the hardness is low and the heat conduction is low enough to cover the various components 10 mounted on the module component 3 that can be detached from the adsorption nozzle 2 below the adsorption nozzle 2. The heat-dissipating sheet 12 having excellent properties is provided. And the repair apparatus 1100 operates the 2nd Z-axis Z2 as shown in FIG. 1C, and lowers | hangs the adsorption | suction nozzle 2 which consists of a structure integrated with the thermal radiation sheet 12 to the upper part of components as shown in FIG. Repair work of the module part 3 by bringing the various parts 10 mounted on the module part 3 into contact, radiating heat from the heat radiating sheet 12, and suppressing the temperature rise of the module part 3 from the hot air of the air 7 during heating. Is possible.

  Furthermore, the repair device 1100 protects the module component 3 itself from the heat of the air 7 by always exhausting the air 7 from the exhaust port 16 until the solder paste of the component terminal portion 4 is completely melted. Enables excellent cooling. This suppresses the temperature rise of the module component 3 when the air 7 heated by the air heating heater 6 from the nozzle 1 is directly blown onto the terminal portion 4 of the module component 3, thereby preventing the various components 10 from scattering and dropping. Mounting is possible.

Here, the mounting method of the module component 3 will be described. The operator of the repair device 1100 sets the printed circuit board 5 on which the module component 3 is mounted on the table 13, and sets the mounting center coordinates of the module component 3 as XY-. Input to the Z-axis adjustment switch 19. When the mounting center coordinates are input to the XYZ-axis adjustment switch 19, the X-axis operating unit 20, the Y-axis operating unit 21, the first Z-axis Z1, and the second Z-axis Z2 are operated, and the nozzle 1. The suction nozzle 2 and the exhaust port 16 are guided to predetermined positions, and the heat dissipation sheet 12 provided in the suction nozzle 2 is brought into close contact with the module component 3 main body. At this time, by further exhausting the air 7 from the exhaust port 16, it becomes possible to suppress the temperature rise of the module component 3 that occurs when the air 7 is directly blown onto the terminal portion 4 of the module component 3. When the solder is melted by 7, the module component 3 can be attached without the various components 10 being scattered and falling.
(Example 2)
FIG. 5 shows a soldering mechanism 2000 having the nozzle 2 having the radiation fins 14 in the suction nozzle 2 integrated with the heat radiation sheet 12 of the first embodiment. In the following, the same components as those in the first embodiment are denoted by the same reference numerals, and description thereof is omitted.

  As in the first embodiment, the soldering mechanism 2000 according to the second embodiment determines that the control unit 100 has been heated to the solder melting temperature or higher according to the temperature detected by the temperature sensor 22 in advance and a preset temperature profile. At that time, the repair device 1100 shown in FIG. 2 operates the first Z-axis Z1 to lower the air exhaust port 16 which is a mechanism integrated with the nozzle 1 to the component terminal portion 4 on the printed circuit board 3. Thereafter, the second Z axis Z2 is operated and lowered to the upper part of the component to bring the heat radiating sheet 12 into contact with the various components 10 mounted on the module component 3, and from the heat radiating sheet 12 and the heat radiating fins 14 The module part 3 is cooled.

Further, the soldering mechanism 2000 protects the module component 3 itself from the heat generated by the air 7 by always exhausting the air 7 from the exhaust port 16 until the solder paste of the component terminal portion 4 is completely melted. Furthermore, excellent cooling is possible. This suppresses the temperature rise of the module component 3 when the air 7 heated by the air heating heater 6 from the nozzle 1 is directly blown onto the terminal portion 4 of the module component 3, thereby preventing the various components 10 from scattering and dropping. Mounting is possible.
(Example 3)
FIG. 6 shows a soldering mechanism 3000 having a nozzle 2 for blowing out cool air (cooling air) as an alternative to the heat dissipating sheet 12 and the heat dissipating fins 14 in the soldering mechanism 2000 shown in the second embodiment. In the following, as in the case of the second embodiment, the same components as those in the first embodiment are denoted by the same reference numerals and the description thereof is omitted.

  The cooling nozzle 2 of the soldering mechanism 2000 shown in FIG. 6 is connected to the cooling cooler 17, and at the same time as the air 7 blows out from the heating heater 6, the temperature detected by the temperature sensor 22 in advance similarly to the air 7. Then, according to a preset temperature profile, the control unit 100 determines that the temperature of the component 10 mounted on the module component 3 is not melted by the air 7 (during the cooling time shown in FIG. 4). Thus, the cooling air 17 is blown out from the cooling cooler 17.

  On the other hand, as a method for attaching the components, as in the first embodiment, the control unit 100 is shown in FIG. 2 when it is determined that the controller 100 has been heated to the solder melting temperature or higher according to the temperature profile acquired in advance by the temperature sensor 22. As described above, the first Z-axis Z <b> 1 is operated to lower the air exhaust port 16 that is a mechanism integrated with the nozzle 1 to the component terminal portion 4 on the printed circuit board 3. Then, the control unit 100 operates the second Z-axis Z2 to lower the suction nozzle 2 to the height set in advance during the temperature profile measurement, and when the lowering point is reached, the ejection of the air 7 and the cold air 18 starts simultaneously. Let

  Thereafter, until the solder paste of the component terminal portion 4 is completely melted, the cold air 18 continues to be ejected, and the control unit 100 ejects the cold air 18 previously set during the temperature profile measurement (for example, as shown in FIG. 4). When it is determined that a certain time has elapsed since the start of the melting time, the ejection of the cold air 18 is stopped. In the meantime, the air 7 is always exhausted from the exhaust port 16 as described above, but the module component 3 itself is protected from the heat of the air 7 by the cold air 18 and further excellent cooling is possible. Thereafter, when the remaining melting time elapses, the cooling time is changed, so that the cool air 18 is blown out from the cooling cooler 17 again.

Thereby, the temperature rise of the module component 3 generated when the air 7 heated from the nozzle 1 by the air heating heater 6 is directly blown onto the terminal portion 4 of the module component 3 can be suppressed, and the various components 10 are scattered and dropped. It is possible to attach without the need to remove the heat-dissipating sheet 12 described in Example 2, and because it does not come into contact with the component as in the heat-dissipating sheet 12, regardless of the component size and shape, Excellent cooling performance is possible.
Example 4
In the soldering mechanism in each of the embodiments 1 to 3 described above, the module component 3 is provided by a repair method including a cooling mechanism that prevents a temperature rise during the repair work of the module component 3 mounted on the printed circuit board 5. The air 7 was blown from the air blowing port 9 while suppressing the temperature rise, and the solder of the terminal portion 4 was melted to perform soldering. However, the air exhaust port 16 may not be provided inside the nozzle 1 due to space restrictions or the like.

  Therefore, in preparation for such a case, in this embodiment shown in FIG. 7, in addition to the above-described repair method, the air exhaust port 16 described in Embodiments 2 and 3 is replaced with the nozzle mechanism shown in FIG. Air intake and exhaust are possible from two diagonal directions. In the case of such a configuration, it is not necessary to provide the air exhaust port 16 inside the nozzle 1 and it is arranged as one component combined with the nozzle 1, so that the solder of hot air can be used while effectively utilizing the space. Both melting and component cooling are achieved.

  As shown in FIG. 8B, which is an exploded view of the nozzle shown in FIG. 8A, it has a mechanism including an air outlet 9 and an exhaust outlet 16 in two diagonal directions. That is, the nozzle mechanism in the present embodiment is arranged so that the nozzles 1 having the air outlets 9 face each other (diagonal position), and further, the exhaust ports 16 are arranged on the adjacent sides, and the exhaust ports 16 are also arranged. Like the nozzle 1, they are arranged so as to face each other (diagonal positions), and form a rectangular space in which these are joined. In the following, as in the case of the second and third embodiments, the same components as those in the first embodiment are denoted by the same reference numerals and the description thereof is omitted.

  The cooling nozzle 2 is connected to the cooling cooler 17 in the same manner as in the third embodiment, and at the same time as the air 7 blows out from the heating heater 6, the temperature detected by the temperature sensor 22 in advance similarly to the air 7. In accordance with a preset temperature profile, the control unit 100 determines that the temperature of the component 10 mounted on the upper part of the module component 3 has not been melted by the air 7 (during the cooling time shown in FIG. 4). The cooling air is blown out from the cooling cooler 17.

  As for the mounting method of the parts, as in the case of the third embodiment, the control unit 100 determines that the heating is performed at a temperature higher than the solder melting temperature based on the temperature detected by the temperature sensor 22 in advance and a preset temperature profile. At that time, as shown in FIG. 2, the first Z-axis Z1 is operated to the height set at the time of measuring the temperature profile, and the nozzle 1 is lowered to the component terminal portion 4 on the printed circuit board 3. Then, the second Z-axis Z2 is further operated to lower the suction nozzle 2, and when the lowering point is reached, the control unit 100 starts the ejection of the air 7 and the cold air 18 simultaneously.

  And until the solder paste 8 of the component terminal part 4 melt | dissolves completely, the cold air 18 continues being ejected from the adsorption nozzle 2, and the ejection time (for example, shown in FIG. 4) of the cold air 18 preset at the time of temperature profile measurement When a certain time has elapsed from the start of the melting time, the control unit 100 stops the ejection of the cold air 18. At this time, the air 7 is released from the exhaust port 16 provided with the cooling fan 15 provided at the diagonal portion of the air blowing port 9 so that the air 7 is ejected and the air 7 is exhausted in the same nozzle. The module component 3 itself is protected from the heat generated by the air 7 and further excellent cooling is possible. Thereby, the various components 10 are scattered and dropped by suppressing the temperature rise of the module component 3 when the air 7 heated from the nozzle 1 by the air heating heater 6 is directly blown to the terminal part 4 of the module component 3. The heat dissipation sheet 12 described in Example 2 is not required to be removed, and the heat dissipating sheet 12 is not in contact with the component as in the heat dissipating sheet 12, so that it is excellent regardless of the component size and shape. Cooling performance is possible.

  As described above in detail, according to the present embodiment, by performing soldering by a repair method provided with a cooling mechanism, it is possible to mount the various components 10 on the module component 3 without scattering and dropping, In addition, the manual soldering operation is automated to enable a high-quality repair operation in a short time.

  It should be noted that the present invention is not limited to the above-described embodiment as it is, and can be embodied by modifying the constituent elements without departing from the scope of the invention in the implementation stage. In addition, various inventions can be formed by appropriately combining a plurality of constituent elements disclosed in the above embodiments. For example, some components may be deleted from all the components shown in the embodiment. Furthermore, constituent elements over different embodiments may be appropriately combined.

DESCRIPTION OF SYMBOLS 1 Nozzle 2 Adsorption nozzle 3 Module component 4 Module component terminal part 5 Board | substrate 6 Heater for air heating 7 Air 8 Solder paste 9 Air outlet 10 Parts mounted on module parts 11 Sub-board which comprises module parts 12 Heat dissipation sheet 13 Table 14 Radiation fin 15 Cooling fan 16 Air exhaust port 17 Cooling cooler 18 Cooling air 19 XYZ axis adjustment switch 20 X-axis operating part 21 Y-axis operating part.

Claims (8)

A soldering mechanism for soldering a module component and a board on which the component is mounted with solder melted by heating,
A first nozzle having a flow path for blowing heated hot air into the solder;
A second nozzle having an exhaust mechanism having a flow path for sucking the hot air blown from the first nozzle and discharging it to the outside of the soldering mechanism;
A suction nozzle having a heat dissipation sheet for dissipating heat generated in the component from the component;
A control unit that exhausts the hot air from the second nozzle to the outside of the soldering mechanism when the first nozzle blows the hot air, and operates the suction nozzle to contact the heat radiating sheet with the component. When,
A soldering mechanism comprising: The tip of the first nozzle in the downstream direction of the flow path and the tip of the second nozzle in the upstream direction are arranged to be the shortest distance;
The soldering mechanism according to claim 1. The heat dissipation sheet has a hardness that can cover the component,
The soldering mechanism according to claim 1 or 2, wherein the soldering mechanism is provided. A storage unit for storing temperature conditions for melting the solder;
A sensor for detecting the temperature reached by the solder, and
The controller determines whether the solder is melted based on the temperature detected by the sensor and the temperature condition, and when it is determined that the solder is melted, the hot air is sucked in by the exhaust mechanism To stop,
The soldering mechanism according to any one of claims 1 to 3. The suction nozzle further includes a radiation fin for radiating heat generated in the component.
The soldering mechanism according to any one of claims 1 to 4, wherein the soldering mechanism is provided. A soldering mechanism for soldering a module component and a board on which the component is mounted with solder melted by heating,
A first nozzle having a flow path for blowing heated hot air into the solder;
A second nozzle having an exhaust mechanism having a flow path for sucking the hot air blown from the first nozzle and discharging it to the outside of the soldering mechanism;
A cooling nozzle for sending cooling air to the component;
A control unit for exhausting the hot air from the second nozzle to the outside of the soldering mechanism when the first nozzle blows the hot air, and operating the cooling nozzle to send the cooling air to the component; ,
A soldering mechanism comprising: A soldering mechanism for soldering a module component and a board on which the component is mounted with solder melted by heating,
A first nozzle having a flow path for blowing heated hot air into the solder and disposed at positions facing each other;
A flow path that is disposed perpendicular to the facing surface of the first nozzle and is opposed to each other and that sucks the hot air blown from the first nozzle and discharges it to the outside of the soldering mechanism. A second nozzle having an exhaust mechanism,
A cooling nozzle for sending cooling air to the component;
A control unit for exhausting the hot air from the second nozzle to the outside of the soldering mechanism when the first nozzle blows the hot air, and operating the cooling nozzle to send the cooling air to the component; ,
A soldering mechanism comprising: A soldering method performed by a soldering mechanism for soldering a module component and a board on which a component is mounted by solder melted by heating,
A step of blowing heated hot air into the solder from the flow path of the first nozzle;
From the flow path of the second nozzle, sucking the hot air blown from the first nozzle and discharging it to the outside of the soldering mechanism;
A heat dissipating sheet possessed by the suction nozzle radiates heat generated in the component from the component; and
A step of exhausting the hot air from the second nozzle to the outside of the soldering mechanism when the first nozzle blows the hot air, and operating the suction nozzle to bring the heat dissipation sheet into contact with the component; ,
A soldering method comprising:

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