JP2012116528A - Taping unit and electronic component inspection device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a taping unit and an electronic component inspection device which carry out an appearance inspection of an electronic component inserted in a carrier tape pocket, and exchange a defective product with a non-defective product efficiently.SOLUTION: The electronic component inspection device includes: a driving roller 65 intermittently transferting the carrier tape T housing the electronic component; an appearance inspection part 8 imaging and detecting defective of the housed electronic component; and a taping unit driving part moving a taping unit body part 4 along a moving direction of the carrier tape T between a position P where the electronic component is housed in the pocket arranged in the carrier tape T and a position Q where the defective of the electronic component is imaged and detected. When the defective of the electronic component is detected by the appearance inspection part 8, the taping unit driving part transfers the taping unit body part 4 and the pocket in the appearance inspection position Q is returned to a housing and elimination position P to suck and hold the defective product and discharge it.

Description

  The present invention relates to a taping unit and an electronic component inspection apparatus for inserting an electronic component such as a small semiconductor product into a pocket of a carrier tape and sealing it with a seal.

  In the manufacturing process of electronic components, an apparatus for transporting products while inspecting them is indispensable. For example, in a manufacturing process of a discrete semiconductor such as a diode or a small semiconductor product such as a small pin IC, a test handler is used as an apparatus for transporting the product while inspecting it. The most common test handler includes a test device that tests the electrical characteristics of a product, a marking device that performs marking on the surface of the product, a taping device that accommodates the product in a carrier tape, etc., and performs packing. The process of each process is performed while conveying an electronic component to each apparatus by the conveyance unit.

  In the taping device that constitutes a part of the taping device as described above, is the electronic component stored in the carrier tape stored in the correct direction, or is there no shape defect or foreign matter mixed in the stored electronic component? , Etc., and the electronic components determined to be defective in this appearance inspection are removed from the carrier tape. The carrier tape contains a large number of electronic components. If even one of the defective products is mixed, the entire carrier tape must be discarded. This is a very important process.

  Defective products in the carrier tape are discriminated by visual inspection by an operator or by a camera provided near the carrier tape, and when a defective product is found, the manufacturing apparatus is temporarily stopped and the operator manually The excision was performed automatically by exchanging or mechanical punching (Patent Document 1).

JP 2003-165506 A

  However, when a defective product is found, the replacement of the manufacturing equipment with a non-defective product stops the entire test handler with each process as described above, leading to a decrease in productivity. It was. In addition, due to the recent miniaturization of electronic components, it is very difficult for an operator to manually replace electronic components, and there are problems such as damaging the product.

  Further, in the method of mechanical punching as in Patent Document 1, the processing can be continued without stopping the manufacturing apparatus, but due to the punching of the carrier tape, a part where the product is not stored is generated in some places of the tape. It was.

  The present invention has been proposed in order to solve the above-described problems of the prior art. The purpose of the present invention is to perform an appearance inspection of an electronic component inserted into a carrier tape pocket and find a defective product. It is an object of the present invention to provide a taping device and an electronic component inspection device that can be efficiently exchanged for good products.

In order to achieve the above-mentioned object, the present invention accommodates or discharges an electronic component from a conveying means that conveys the electronic component at the accommodating / discharging position, and the electronic component accommodated at the appearance inspection position is removed from the electronic component by the appearance inspection means. A taping unit for imaging and detecting a defect, the carrier tape having the pocket for storing the electronic component conveyed by the conveying means, and the appearance inspection position of the electronic component by transferring the carrier tape A main body provided with a transfer means positioned at the storage discharge position, and a drive unit that moves the main body in the transfer direction of the carrier tape by a distance between the storage discharge position and the appearance inspection position.
When a defect of an electronic component is detected by the appearance inspection means, the driving unit moves the main body to move the electronic component at the appearance inspection position to the accommodation / discharge position.

  An electronic component inspection apparatus that performs various process processes while transporting an electronic component by a transport unit, wherein the transport unit stores or discharges the electronic component at a storage discharge position, and at the appearance inspection position, Appearance inspection means for picking up an image of the stored electronic component and detecting a defect, a carrier tape provided with the pocket for storing the electronic component transferred by the transfer means, and an electronic component by transferring the carrier tape And a drive for moving the main body in the carrier tape transfer direction by a distance between the storage / discharge position and the visual inspection position. And when the defectiveness of the electronic component is detected by the appearance inspection means, the drive unit moves the main body. It may be characterized in that moving the electronic component in the appearance inspection position to the housing discharge position.

  Further, the transport means transports the electronic component to the next process every time one pitch advances, and when a defect is detected in the inspection of the appearance inspection unit, the transport means is returned by one pitch, It is good also as the conveyance means which is not holding an electronic component being located in the said accommodation discharge position.

  According to the present invention, a visual inspection of an electronic component inserted into a carrier tape pocket is performed, and when a defective product is found, it can be efficiently replaced with a non-defective product, and a taping unit and an electronic component having a high operating rate. An inspection device can be provided.

It is a figure which shows schematic structure of the electronic component inspection apparatus in embodiment of this invention. It is a figure which shows the structure of the taping unit in embodiment of this invention. It is a figure which shows two positions to which a taping unit main-body part moves. It is a schematic diagram which shows the effect | action (a)-(d) of the taping unit in embodiment of this invention. It is a schematic diagram which shows the effect | action (e)-(h) of the taping unit in embodiment of this invention. It is a flowchart which shows the effect | action of the taping unit in embodiment of this invention. It is a flowchart which shows the effect | action of the taping unit in other embodiment of this invention.

  Embodiments of a taping unit and an electronic component inspection apparatus according to the invention will be described in detail with reference to the drawings. First, the configuration of the taping unit and the electronic component inspection apparatus will be described with reference to FIGS. FIG. 1 is a diagram showing a schematic configuration of an electronic component inspection apparatus. FIG. 2 is a diagram illustrating a schematic configuration of the taping unit.

[1-1. Configuration of electronic component inspection equipment]
The electronic component inspection apparatus 1 according to the present embodiment is an apparatus that performs various process processes on electronic components. The electronic component is a component used for an electric product, and includes a semiconductor element. Examples of semiconductor elements include transistors, integrated circuits, resistors, capacitors, and the like. The various process processes are mainly inspection processes after each assembly process such as dicing, mounting, bonding, and sealing. Appearance inspection, forming, test contact, marking, sorting and sorting, and packing process are performed. included.

  The electronic component inspection apparatus 1 includes a transport mechanism and various process processing mechanisms. The transport mechanism includes a main table M. The center of the main table M is supported by a drive shaft of a direct drive motor disposed below. The main table M intermittently rotates by a predetermined angle as the direct drive motor is driven.

  A plurality of holding means for holding electronic components are attached to the outer peripheral end of the main table M at regular intervals along the outer periphery of the main table M. This transport mechanism holds the electronic component by the holding means and rotates the main table M to transport the electronic component in the outer peripheral direction. The arrangement interval of the holding means is equal to the rotation angle of one pitch of the main table M.

  The holding means is a suction nozzle that sucks and detaches the electronic component. The suction nozzle is movable up and down with respect to the main table M by a support portion attached to the outer peripheral end of the main table M. A drive unit including an operation rod is disposed immediately above the suction nozzle, and the suction nozzle descends when the operation rod comes into contact with the upper end of the suction nozzle and is pushed downward. The inside of the pipe of the suction nozzle communicates with a pneumatic circuit of a vacuum generator (not shown). The suction nozzle sucks an electronic component by generating a negative pressure and releases the electronic component by vacuum break.

  Various process processing mechanisms surround the main table M and are arranged at equal intervals in the outer circumferential direction. The arrangement interval is the same as or equal to an integral multiple of the rotation angle of one pitch of the main table M. As various process processing mechanisms, for example, in the order of rotation of the main table M, for example, a parts feeder 31, a marking unit 32, an appearance inspection unit 33, a test contact unit 34, a forming unit 35, a sorting / sorting unit 36, a taping unit 37, A defective product discharge unit 38 is arranged.

[1-2. Configuration of taping unit]
As shown in FIG. 2, the taping unit 38 of the semiconductor inspection apparatus 1 according to the embodiment of the present invention includes a carrier tape T having a pocket for storing the semiconductor product W on the upper surface of the taping unit main body 4. Further, the taping unit 38 has been sent from above the taping unit drive mechanism 5 for moving the taping unit main body 4 horizontally, the carrier tape drive mechanism 6 for intermittently transferring the carrier tape T, and the taping unit. And a carrier tape winding mechanism 7 for winding the carrier tape T.

  Further, the taping unit 38 has an appearance of the suction nozzle 21 of the holding mechanism 2 that transports the semiconductor product provided on the main table M onto the taping unit main body 38 and the semiconductor product W accommodated in the pocket of the carrier tape T. An appearance inspection unit 8 that captures an image and detects a defect in the direction of accommodation in the carrier tape T or an appearance defect is provided.

  The taping unit drive mechanism 5 includes a straight rail 52 provided on the base plate 51 and a straight rail 52 for moving the taping unit main body 4 back and forth in the horizontal direction in combination with the rail 52 provided below the taping unit main body 4. A moving guide 53. As shown in FIG. 3, the taping unit drive mechanism 5 is configured such that the taping unit main body 4 is moved by a distance L1 between the normal position in FIG. 3 (a) and the defective product replacement position in FIG. 3 (b). It is. The moving distance L1 of the taping unit main body 4 is the distance between the housing product removal position P by the suction nozzle 21 of the holding mechanism 2 and the appearance inspection position Q by the appearance inspection section 8.

  In the vicinity of the taping unit main body 4, a taping unit drive motor 55 having a drive screw 54 is disposed. By this taping unit driving motor 55, the taping unit 1 is moved back and forth in the horizontal direction. More specifically, the power of the taping unit drive motor 55 is transmitted to the drive screw 54, and the taping unit main body 4 supported by the drive screw 54 is moved in the horizontal direction. Since the configuration of the taping unit main body 4 is the same as that of the prior art, the configuration is appropriately omitted in this section and the drawings, but any configuration can be used as long as the taping unit exists as a conventional technique. It is.

  The carrier tape drive mechanism 6 includes a set of a sprocket 61 and a motor 62 that rotationally drives the sprocket 61 under the accommodation removal position P when the taping unit main body 4 is located at the normal position. The procket 61 is a sprocket provided with protrusions (pins), and is configured to hook the protrusions into an embossed hole (not shown) of the carrier tape T to be conveyed. Further, the taping unit main body 4 on the downstream side of the carrier tape T includes a sprocket 63, a motor 64 that rotationally drives the sprocket 63, and a drive roller 65 that sandwiches the carrier tape T between the sprocket 63. The sprocket 63 is a sprocket having no projection (pin), and is configured to generate a pulling force by a frictional force by sandwiching the carrier tape T between the sprocket 63 and the driving roller 65 by the 65. In order to generate a stable pulling force, the rotational speed of the motor 64 may be made larger than the rotational speed of the motor 61. It is also possible to adjust the pulling force according to the size of the sprocket 63.

  The carrier tape winding mechanism 7 includes a winding reel 71 that winds the carrier tape T by hooking a protrusion into an embossed hole of the carrier tape T. The take-up reel 71 may be provided with a motor for rotational driving, but may be configured to be rotationally driven by transmitting the power of a motor installed at another location.

  The holding mechanism 2 includes a nozzle 21 that is driven in the vertical direction, that is, the Z-axis direction to suck the semiconductor product W, and sucks or releases the semiconductor product W by vacuum suction. The nozzle 21 conveys the semiconductor product W to the accommodation / removal position P of the carrier tape T as the main table M rotates, and inserts the semiconductor product W into the pocket of the carrier tape T at that position. The nozzle 21 holds the semiconductor product W determined to be defective in the pocket of the carrier tape T by vacuum suction and discharges it from the pocket.

  The appearance inspection unit 8 photographs and inspects the appearance of the semiconductor product W accommodated in the pocket by means of a camera or the like at an appearance inspection position Q provided downstream from the accommodation removal position of the transport path of the taping unit 1. Is. In the inspection, it is determined whether the direction of the semiconductor product W stored in the pocket is the correct direction or whether the appearance of the semiconductor product W is defective.

  This electronic component inspection apparatus 1 or taping unit includes a control unit (not shown), and is electrically connected to a direct drive motor that rotates the main table M, a drive unit that moves the suction nozzle 21 up and down, a vacuum generation device, and various process processing mechanisms. These operation timings are controlled by transmitting signals.

  That is, the control unit includes a ROM, a CPU, and a driver that store a control program, and outputs an operation signal at each timing to each drive mechanism via the interface according to the control program.

  Although the embodiment of the present invention has been described above, this embodiment is presented as an example and is not intended to limit the scope of the invention. The novel embodiment can be implemented in various other forms, and various omissions, replacements, and changes can be made without departing from the scope of the invention. And this embodiment and its deformation | transformation are included in the invention described in the claim, and its equivalent range while being included in the range and summary of invention.

  For example, in the present embodiment, the case where various process processing mechanisms are arranged on one main table M has been described as an example. However, the transport mechanism may be a linear transport system, and may include a plurality of main tables M. One conveyance path may be configured. Further, as the holding means, a chuck mechanism that mechanically clamps the electronic component may be arranged instead of the suction nozzle that sucks and releases the electronic component by generating and breaking a vacuum. The various process processing mechanisms are not limited to the types described above, and can be replaced with various process processing mechanisms, and the arrangement order can be changed as appropriate.

[1-3. Operation of the embodiment]
The operation of the present embodiment having the above-described configuration will be described with reference to FIGS. 4 (a) to (d) and FIGS. 5 (e) to (h).

  As shown in FIG. 4 (a), the electronic component W7 that has completed each process such as the electrical characteristic inspection process and the marking process is placed on the carrier tape by the nozzle 21 (a) of the holding mechanism 4 provided on the main table M. To the storage removal position P. Thereafter, the appearance inspection unit 8 inspects the semiconductor product W4 in the pocket of the carrier tape T at the appearance inspection position Q.

  In this inspection, when it is determined that the target semiconductor product W4 is defective, the carrier tape drive mechanism 1 stops feeding the carrier tape T and, as shown in FIG. 4B, the taping unit drive mechanism. 5 translates the taping unit 1 to the defective product replacement position.

  Next, as shown in FIG. 4C, the nozzle 21 (b) is moved to the accommodation removal position P by reversing the main table M by one pitch. The semiconductor product held by the nozzle 21 (b) has already been accommodated in the carrier tape T and the tip of the nozzle is empty. In FIG. b) descends, and adsorbs and holds the semiconductor product W4 stored in the carrier tape.

  Thereafter, as shown in FIG. 5E, the nozzle 21 (a) holding the semiconductor product W4 is moved to the accommodation removal position P by rotating the main table M forward by one pitch. At this time, the nozzle 21 (b) holding the semiconductor product W4 moves to the discharge position of the defective product discharge unit by rotating the main table M forward by one pitch.

  Next, as shown in FIG. 5 (f), the nozzle 21 (a) moved to the accommodation removal position P is lowered, and the semiconductor product W 7 is accommodated in the pocket of the carrier tape T. Thereafter, as shown in FIG. 5G, the taping unit drive mechanism 5 translates the taping unit 1 to the normal position. The semiconductor product W7 is positioned at the appearance inspection position Q by moving the taping unit body to the normal position.

  Next, as shown in FIG. 5G, the nozzle 21 (c) holding the semiconductor product W8 is moved to the accommodation removal position P by rotating the main table forward by one pitch. The nozzle holding the product semiconductor product is positioned at the accommodation removal position P before the inspection. The appearance inspection unit 8 inspects the semiconductor product W7 in the pocket of the carrier tape T at the appearance inspection position Q.

  In this inspection, when it is determined that the target semiconductor product W7 has no problem, the normal operation is resumed. That is, the carrier tape drive mechanism 6 advances the carrier tape T to convey the semiconductor product W2 to the appearance inspection position Q, and the appearance inspection unit 8 has a semiconductor in the pocket of the carrier tape T at the appearance inspection position Q. The product W2 is inspected.

  On the other hand, in this inspection, when it is determined that the target semiconductor product W7 is a defective product, the process shown in FIGS. 4A to 5G in which the nozzle position has advanced by one pitch is repeated. That is, the taping unit drive mechanism 5 translates the taping unit main body 4 to the defective product replacement position, and moves the semiconductor product W7 to the accommodation removal position P. And the nozzle 21 (a) is moved to the accommodation removal position P by reversing the main table M by one pitch. Thereafter, the nozzle 21 (a) descends, and adsorbs and holds the semiconductor product W7 stored in the carrier tape. Thereafter, the main table M is rotated forward by one pitch, thereby moving the semiconductor product W7 from the accommodation removal position P and moving the semiconductor product W8 to the accommodation removal position P. Next, the semiconductor product W8 is accommodated in the carrier tape T, the taping unit main body is translated to the normal position, the main table M is rotated forward by one pitch, and an appearance inspection is performed on the semiconductor product W8. .

[1-4. Flow chart showing this embodiment]
Next, the flowchart of this aspect is shown in FIG. With the suction nozzle 21 (a) transporting the semiconductor product W7 to the accommodation / removal position P, the main table M rotates forward one pitch so that the suction nozzle 21 (a) transports the semiconductor product W7 to the accommodation / removal position P. (S601).

  Next, the appearance inspection unit 8 performs an appearance inspection of the semiconductor product W1 (S602), and detects whether there is a defect in the appearance (S603). If the appearance is not defective (NO in S603), the suction nozzle 21 (a) stores the semiconductor product W7 in the pocket of the carrier tape T (S604), and the carrier tape drive mechanism 6 advances the carrier tape T. Thus, the semiconductor product W2 is transported to the appearance inspection position Q, and the process returns to S601.

  On the other hand, when an appearance defect is found (YES in S602), the taping unit drive mechanism 5 moves the taping unit main body 4 to the replacement position (S605), and the semiconductor product W1 having the appearance defect is accommodated and removed. Position P. Thereafter, the main table M is reversed by one pitch (S606), the suction nozzle 21 (a) holding the semiconductor product W7 at the storage removal position P is moved from the storage removal position P, and the empty suction nozzle 21 ( b) is moved to the accommodation removal position P. The suction nozzle 21 (b) moved to the accommodation removal position P is lowered, sucked and lifted to discharge the semiconductor product W1 having a poor appearance from the carrier tape (S607).

  Next, the main table M is rotated forward by one pitch (S608), the nozzle 21 (b) holding the semiconductor product W1 having a defective appearance is moved from the accommodation removal position P, and the suction holding the semiconductor product W7. The nozzle 21 (a) is moved to the accommodation removal position P. At this time, when the defective product discharge unit 38 is arranged one pitch ahead of the main table, the semiconductor product W1 held by the nozzle 21 (b) is conveyed to the defective product discharge unit 38, and the nozzle 21 ( discharged from b).

  Thereafter, the suction nozzle 21 (a) moved to the storage removal position P is lowered, suctioned off, and raised (S609), so that the semiconductor product W7 is stored in the pocket of the carrier tape. After the storage, the taping unit drive mechanism 5 moves the taping unit 1 to the normal position (S610), and positions the semiconductor product W7 at the appearance inspection position Q. Then, returning to S601, the semiconductor product W8 is moved to the accommodation removal position P by rotating the main table M forward by one pitch (S601). Next, the appearance inspection unit 8 inspects the semiconductor product W7 in the pocket of the carrier tape T at the appearance inspection position Q (S602). In this inspection, when it is determined that there is no problem in the target semiconductor product W7, the normal operation is resumed.

  In the taping device of the present embodiment as described above, when an appearance defect or the like is found in the semiconductor product W in the carrier tape, the taping unit main body 4 is moved horizontally and the defective product is moved to the nozzle 21 of the holding mechanism 2. To hold and discharge. Further, by rotating the main table forward by one pitch, it is possible to inspect a new semiconductor product as it is. Therefore, it is not necessary to stop the manufacturing apparatus and replace it with a non-defective product as in the prior art, and the productivity is excellent. In addition, it is not necessary for an operator to manually replace a semiconductor product with a minute semiconductor product, and a high-quality product can be provided.

  In addition, after the defective semiconductor product is discharged from the inspection discharge position Q by the nozzle 21 of the holding mechanism 2, the carrier tape is returned by one discharged pocket. Unlike the case of discharging, there is no possibility that the pocket of the carrier tape T is vacated due to the discharge of defective products.

[1-5. effect]
As described above, when an appearance defect or the like is found in the electronic component in the carrier tape, this is automatically detected by the appearance inspection unit 8, and the defective product is sucked and held by the discharge unit and discharged. Therefore, it is not necessary to stop the manufacturing apparatus and replace it with a non-defective product as in the prior art, and the productivity is excellent. In addition, it is not necessary for an operator to manually exchange electronic components for minute electronic components, and high-quality products can be provided.

  In addition, after the defective electronic component is discharged from the discharge position P by the discharge unit, the carrier tape is returned for one discharged pocket, so that the defective product and the non-defective product can be automatically replaced. Unlike the case where the defective product is discharged by punching out the defective product portion, the pocket of the carrier tape does not become empty due to the discharge of the defective product.

[2. Other Embodiments]
The present invention includes not only the aspects exemplified in the above-described embodiments but also the following aspects. For example, the effects of the present invention can be obtained even if the timing of the appearance inspection in the appearance inspection unit 8, the timing of storing the semiconductor product W in the carrier tape, and the timing of removing the semiconductor product W from the carrier tape are changed. Is possible. For example, the timing shown in the flowchart of FIG.

  FIG. 7 is a flowchart showing another aspect of the present embodiment. In this aspect, when the main table M rotates forward by one pitch, the suction nozzle 21 (a) transports the semiconductor product W7 to the storage removal position P (S701), and stores the transported W7 in the carrier pocket at the storage removal position P. (S702). Thereafter, the appearance inspection unit 8 performs an appearance inspection of the semiconductor product (S703), and detects whether there is a defect in the appearance (S703). If there is no defect in appearance (NO in S703), the carrier tape drive mechanism 6 advances the carrier tape T to convey the semiconductor product W2 to the appearance inspection position Q, and returns to S701 to rotate the main table forward by one pitch. The new suction nozzle 21 (c) transports the semiconductor product W8 to the accommodation removal position P.

  On the other hand, when an appearance defect is found (YES in S703), the taping unit drive mechanism 5 moves the taping unit main body 4 to the replacement position (S704), and the semiconductor product W1 having the appearance defect is accommodated and removed. Position P. The empty suction nozzle 21 (a) holding the semiconductor product W7 at the storage removal position P is lowered, sucked and lifted (S705), and the semiconductor product W1 having a poor appearance is discharged from the carrier tape.

  Thereafter, the main table is rotated forward by one pitch (S706), the suction nozzle 21 (a) holding the semiconductor product W1 at the storage removal position P is moved from the storage removal position P, and a new suction nozzle 21 ( c) conveys the semiconductor product W8 to the accommodation removal position P.

  Thereafter, the suction nozzle 21 (c) is lowered, sucked off, and raised (S707), and the semiconductor product W8 is stored in the pocket of the carrier tape. After the storage, the taping unit drive mechanism 5 moves the taping unit 1 to the normal position (S708), and positions the semiconductor product W8 at the appearance inspection position Q. In this inspection, if it is determined that there is no problem with the target semiconductor product W8, the carrier tape drive mechanism 6 advances the carrier tape T to convey the semiconductor product W2 to the appearance inspection position Q, and S701. Return to normal operation.

  According to such an embodiment, it is not necessary to reverse the main table by one pitch, and when an appearance defect or the like is found in an electronic component in the carrier tape, this is automatically detected by the appearance inspection unit 8 and the defect is not detected. Non-defective products can be sucked and held by the discharge unit and discharged. Similar to the above-described embodiment, it is not necessary to stop the manufacturing apparatus and replace it with a non-defective product as in the prior art, and the productivity is excellent. In addition, it is not necessary for an operator to manually exchange electronic components for minute electronic components, and high-quality products can be provided.

  Thus, the distance between the position where the taping unit accommodates the electronic component in the pocket provided on the carrier tape and the position where the electronic component is imaged and detected can be moved along the moving direction of the carrier tape. As long as it is configured, any specific embodiment can be adopted. That is, the semiconductor product determined to be defective may be removed by reversing the main table by one pitch after the appearance inspection. It is also possible to remove the semiconductor product determined to be defective by keeping the nozzle into which the semiconductor product W is inserted waiting.

However, it can be said that the mode shown in the above embodiment is the best at the accommodation removal position P until the result of the appearance inspection of the empty nozzle in which the semiconductor product W as described in the other embodiment is inserted is obtained. In the case of waiting, the main table M is not rotated until the inspection result is obtained. For this reason, when no defect is detected in the inspection, it is necessary to rotate the table after the inspection in order to accommodate the semiconductor product W in the carrier tape.
On the other hand, in the aspect shown in the embodiment, the main table M is rotated before the end of the inspection. In such an aspect, the main table M can be moved (FIG. 5 (h)) while the taping unit body 4 is moving from the defective product replacement position to the normal position (FIG. 5 (g)). . As a result, the time until the next inspection of the semiconductor product W can be shortened compared to the case where the main table M is not rotated until the inspection result is obtained, which is advantageous in terms of speed. is there.

DESCRIPTION OF SYMBOLS 1 ... Electronic component inspection apparatus 2 ... Holding means 21 ... Adsorption nozzle 31 ... Parts feeder 32 ... Marking unit 33 ... Appearance inspection unit 34 ... Test contact unit 35 ... Forming unit 36 ... Sorting sort unit 37 ... Taping unit 38 ... Defective product discharge Unit 4 ... Taping unit main body 5 ... Taping unit drive mechanism 51 ... Base plate 52 ... Rail 53 ... Linear motion guide 54 ... Drive screw 55 ... Taping unit drive motor 6 ... Carrier tape drive mechanism 61 ... Sprocket 62 ... Motor 63 ... Sprocket 64 ... Motor 65 ... Drive roller 7 ... Reel 8 ... Appearance inspection part M ... Main table P ... Storage removal position Q ... Appearance inspection position T ... Carrier tape W ... Semiconductor

Claims (3)

A taping unit that stores or discharges an electronic component from a transport unit that transports the electronic component at a storage / removal position, and detects and detects the defective electronic component by the visual inspection unit at the visual inspection position. There,
A carrier tape provided with a pocket for accommodating the electronic component conveyed by the conveying means;
A main body comprising transfer means for moving the electronic component from the appearance inspection position to the accommodation removal position by transferring the carrier tape;
A drive unit that moves the main body in the carrier tape transfer direction by a distance between the accommodation removal position and the appearance inspection position;
A taping characterized in that, when a defect of an electronic component is detected in an appearance inspection means, the driving unit moves the main body to move the electronic component at the appearance inspection position to the accommodation removal position. unit. An electronic component inspection apparatus that performs various process processes while transporting an electronic component by a transport means,
The transport means is for storing or discharging electronic components at a storage removal position,
Appearance inspection means for detecting defects by imaging the stored electronic component at the appearance inspection position;
A carrier tape provided with a pocket for accommodating the electronic component conveyed by the conveying means;
A main body comprising transfer means for moving the electronic component from the appearance inspection position to the accommodation removal position by transferring the carrier tape;
A drive unit that moves the main body in the carrier tape transfer direction by a distance between the accommodation removal position and the appearance inspection position;
An electronic device characterized in that, when a defect of an electronic component is detected by an appearance inspection means, the electronic component at the appearance inspection position is moved to the accommodation / removal position by the drive unit moving the main body. Parts inspection device. The transport means transports an electronic component to the next process every time one pitch is advanced,
3. The apparatus according to claim 2, wherein when a defect is detected in the inspection of the appearance inspection unit, the conveyance unit that does not hold the electronic component is positioned at the accommodation removal position by returning the conveyance unit by one pitch. The electronic component inspection apparatus described.

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