JP7386754B2 - Component mounting machine - Google Patents

Description

The present disclosure relates to a component mounting machine that supports a board on which electronic components are mounted using a plurality of backup pins.

Conventionally, various techniques have been proposed regarding the above-mentioned component mounting machine. For example, the technology described in Patent Document 1 below is a component mounting machine that mounts components on a board supported by a plurality of pins arranged on a lower support plate, and includes a plurality of pins arranged on the lower support plate. a determination pin information acquisition unit that acquires determination pin information indicating the placement position of a determination pin that is a pin for identifying a placement pattern; a board camera movable within a predetermined range; and a placement position indicated by the determination pin information. an imaging control unit that moves a board camera to a position where it can image the arrangement position, and causes the board camera to take an image of the arrangement position; and based on the image obtained by the imaging, detects the presence or absence of the determination pin at the arrangement position, and performs mounting. and a determination unit that determines whether the pin arrangement pattern corresponding to the board to be displayed is correct or incorrect.

According to the description in Patent Document 1 listed below, the above-mentioned component mounting machine requires a special reading device to determine whether the arrangement pattern is correct or not, and special measures such as pasting barcodes on all prepared lower receiving plates. Even though there is no need to perform extensive preparatory work, it becomes possible to determine whether the arrangement pattern of the pins attached to the component mounting machine is correct or incorrect.

Japanese Patent Application Publication No. 2010-141053

However, once the mounting of components onto the board is started, even if the board camera attempts to take an image of each pin that supports the board, the imaging is obstructed by the boards being sequentially taken in by the component mounting machine. Therefore, it has been difficult to recognize the positions of all the pins arranged on the lower receiving plate based on the image obtained by the board camera.

The present disclosure has been made in view of the above-mentioned points, and it is possible to image all the backup pins arranged at positions that can support the board even when the board is taken in. The objective is to provide a component mounting machine that is capable of

This specification describes a component mounting machine that mounts electronic components on a board, and includes a transport device that transports the board, a plurality of backup pins disposed at positions that can support the board from below, and a transport device that transports the board. A camera that images the multiple backup pins from above the device, and when the board is loaded onto the electronic component mounting area by the transport device, the multiple backup pins are sequentially moved on the board by moving the board with the transport device. A component mounting machine is disclosed that includes a control unit that captures an image with a camera in an uncovered state.

According to the present disclosure, the component mounting machine is capable of capturing images of all backup pins arranged at positions capable of supporting the board even when the board is loaded.

It is a perspective view showing a component mounting machine. FIG. 2 is a perspective view showing a substrate transport and holding device. 3 is a sectional view taken along line II in FIG. 2. FIG. FIG. 2 is a block diagram showing a control device. FIG. 2 is a diagram schematically showing the conveyor device from above, excluding the clamp bar and the like. FIG. 2 is a diagram schematically showing the conveyor device from above, excluding the clamp bar and the like. FIG. 2 is a diagram schematically showing the conveyor device from above, excluding the clamp bar and the like. FIG. 2 is a diagram schematically showing the conveyor device from above, excluding the clamp bar and the like. FIG. 2 is a diagram schematically showing the conveyor device from above, excluding the clamp bar and the like.

Hereinafter, examples of the present disclosure will be described in detail as modes for carrying out the present disclosure with reference to the drawings.

FIG. 1 shows two component mounting machines 16 arranged side by side on the system base 12. In the following description, the direction in which the component mounting machines 16 are lined up will be referred to as the X direction, the horizontal direction perpendicular to that direction will be referred to as the Y direction, and the vertical direction (vertical direction) perpendicular to these directions will be referred to as the Z direction. to be called.

Each component mounter 16 mainly includes a mounter main body 20, a pair of substrate transport and holding devices 22, a mounting head moving device (hereinafter sometimes abbreviated as a moving device) 24, a mounting head 25, and a mark camera (FIG. 3). ) 26, a parts camera 27, a supply device 29, and a control device (see FIG. 4) 30. The mounting machine main body 20 is composed of a frame 31 and a beam 32 mounted on the frame 31.

Each of the pair of substrate transport and holding devices 22 includes a conveyor device 50 and a substrate holding device 52, as shown in FIGS. 2 and 3. FIG. 2 is a diagram showing the substrate transport and holding device 22 from an obliquely upward perspective, and FIG. 3 is a diagram showing the substrate conveying and holding device 22 from a perspective from line II in FIG. 2.

The conveyor device 50 has a pair of guide rails 60 and 62 and a conveyor belt 66 provided on each guide rail 60 and 62. The pair of guide rails 60 and 62 are arranged parallel to each other, and each guide rail 60 and 62 is supported on the upper surface of a support plate 72 via a pair of support legs 70. Note that the guide rails 60 and 62 are arranged to extend in the X direction.

Furthermore, two pulleys 74 and 76 are disposed on the side surfaces of each guide rail 60 and 62 with the Y direction as the axis. These two pulleys 74 and 76 are arranged at both ends of each guide rail 60 and 62. Note that the guide rail 60 and the guide rail 62 are arranged such that the surfaces on which the pulleys 74 and 76 are disposed face each other. A conveyor belt 66 is wound around pulleys 74 and 76 of each guide rail 60 and 62, and the conveyor belt 66 is rotated by an electromagnetic motor 78 (see FIG. 4).

Note that the conveyor belt 66 can rotate in either a clockwise direction or a counterclockwise direction in FIG. 3 . As a result, by placing the circuit board 80 on the conveyor belt 66, the direction from the side where the pulley 74 is disposed to the side where the pulley 76 is disposed, and the direction where the pulley 76 is disposed. The circuit board 80 can be transported in any direction from the side where the pulley 74 is placed to the side where the pulley 74 is placed. Note that, on the side surface of the component mounter 16, a carry-in port 81 is formed at a position facing the pulley 74, and a carry-in port 82 is formed at a position facing the pulley 76. The loading port 81 is an opening for loading the circuit board 80 into the component mounting machine 16, and the loading port 82 is an opening for loading the circuit board 80 from the component mounting machine 16. Therefore, when the component mounting machine 16 performs work on the circuit board 80, the conveyor belt 66 circulates so as to convey the circuit board 80 from the loading port 81 toward the loading port 82. Therefore, the direction from the carry-in port 81 to the carry-out port 82, that is, the direction from the pulley 74 to the pulley 76, is referred to as a conveyance direction X1. Furthermore, in the conveyance direction X1, the carry-in port 81 side is described as the upstream side, and the carry-in port 82 side is described as the downstream side. Note that the transport direction X1 is parallel to the X direction.

Furthermore, a first detection sensor 83 is provided at the end of the pair of guide rails 60 and 62 on the side where the pulley 74 is provided. The first detection sensor 83 includes a first light projecting section 84 and a first light receiving section 85, and the first light projecting section 84 is located at the end of the guide rail 60 on the side where the pulley 74 is disposed. The first light receiving section 85 is disposed at the end of the guide rail 62 on the side where the pulley 74 is disposed. Note that the first light projecting section 84 and the first light receiving section 85 are arranged to face each other. Further, a second detection sensor 86 is provided at the end of the pair of guide rails 60 and 62 on the side where the pulley 76 is provided. The second detection sensor 86 includes a second light projecting section 87 and a second light receiving section 88, and the second light projecting section 87 is located at the end of the guide rail 60 on the side where the pulley 76 is disposed. The second light receiving section 88 is disposed at the end of the guide rail 62 on the side where the pulley 76 is disposed. Note that the second light projecting section 87 and the second light receiving section 88 are arranged to face each other.

Thereby, the light emitted from the first light projecting section 84 is received by the first light receiving section 85, and the light emitted from the second light projecting section 87 is received by the second light receiving section 88. If there is any object between the first light projecting section 84 and the first light receiving section 85, the light irradiated from the first light projecting section 84 is blocked by the object. The detection sensor 83 detects that something exists between the first light projecting section 84 and the first light receiving section 85 . With such a structure, the first detection sensor 83 detects that the circuit board 80 is carried into the board conveyance/holding device 22 , that is, the component mounter 16 via the carry-in port 81 . Furthermore, if there is an object between the second light projecting section 87 and the second light receiving section 88, the light irradiated from the second light projecting section 87 is blocked by the object, and the second light receiving section 88 is The detection sensor 86 detects that something exists between the second light projector 87 and the second light receiver 88 . With such a structure, the second detection sensor 86 detects that the circuit board 80 is unloaded from the board transport/holding device 22 , that is, the component mounter 16 via the unloading port 82 .

Further, the substrate holding device 52 includes an elevating table 90, a plurality of backup pins 91, a table elevating mechanism 92, and a pair of clamp bars 93. The lifting table 90 has a generally rectangular shape and is arranged below the guide rails 60, 62 so as to extend between the pair of support legs 70 of each guide rail 60, 62. Further, on the upper surface of the lifting table 90, for example, a plurality of backup pins 91 are arranged in 5 x 3 rows, that is, 5 rows in the X direction and 3 rows in the Y direction. It is placed on a table 90. The elevating table 90 is disposed on the upper surface of the support plate 72 via a table elevating mechanism 92, and the table elevating mechanism 92 raises and lowers the elevating table 90 by driving an electromagnetic motor (see FIG. 4) 96.

Note that, hereinafter, the backup pins 91 lined up in the first row in the X direction from the upstream side to the downstream side in the transport direction X1 are abbreviated as backup pins 91 lined up in the first row in the X direction. Similarly, the backup pins 91 arranged in the second, third, fourth and fifth rows in the X direction from the upstream side to the downstream side in the transport direction The backup pins 91 arranged in the 4th, 4th, and 5th columns are abbreviated as backup pins 91.

Further, each of the pair of clamp bars 93 is fixed to the upper surface of the guide rails 60, 62 such that the elevating table 90 is located between both ends of each clamp bar 93. That is, the clamp bar 93 is fixed to the upper surface of the guide rails 60, 62 so that the lifting table 90 extends below the clamp bar 93. Note that the clamp bar 93 is fixed to the upper surfaces of the guide rails 60, 62 so as to extend above the conveyor belt 66 disposed on the guide rails 60, 62.

With such a structure, the circuit board 80 conveyed by the conveyor device 50 is clamped by the substrate holding device 52 in the substrate conveying and holding device 22 . Specifically, the circuit board 80 is carried into the component mounting machine 16, and the conveyor device 50 places it in a predetermined area in the area between the pair of guide rails 60 and 62 (hereinafter referred to as the mounting area (see FIG. 5) 202). is transported to the mounting position 204 (see FIG. 5). Note that when the circuit board 80 is transported to the mounting position 204, both edges of the circuit board 80 placed on the conveyor belt 66 of the conveyor device 50 are located below the pair of clamp bars 93.

Next, when the circuit board 80 is transported to the mounting position 204, the elevating table 90 is raised by the operation of the table elevating mechanism 92. At this time, the upper end of the backup pin 91 comes into contact with the lower surface of the circuit board 80, and as the elevating table 90 rises, the circuit board 80 also rises. At this time, the circuit board 80 is lifted from the conveyor belt 66. Further, as the elevating table 90 rises, the circuit board 80 also rises, and both ends of the upper surface of the circuit board 80 come into contact with the lower surfaces of the pair of clamp bars 93. Thereby, the circuit board 80 is held by the board holding device 52 by contacting the clamp bars 93 at both edges while being supported by the backup pins 91 from below. Therefore, the plurality of backup pins 91 are arranged on the lifting table 90 according to the width of the mounting position 204, that is, according to the size of the circuit board 80. However, among the plurality of backup pins 91 arranged on the lifting table 90, there may be some that are placed outside the mounting position 204 as surplus items or stock items for the above-mentioned holding. . Note that even if the backup pin 91 is placed outside the mounting position 204, if the circuit board 80 is above the backup pin 91, the circuit board 80 can be supported from below if the lifting table 90 is raised. It is.

Further, as shown in FIG. 1, the moving device 24 is an XY robot type moving device. The moving device 24 includes an electromagnetic motor 112 (see FIG. 4) that slides the slider 110 in the X direction, and an electromagnetic motor 114 (see FIG. 4) that slides the slider 110 in the Y direction. A mounting head 25 is attached to the slider 110, and the mounting head 25 is moved to any position on the frame 31 by the operation of two electromagnetic motors 112 and 114.

The mounting head 25 is used to mount an electronic component (see FIG. 3 above) 200 onto the circuit board 80. The mounting head 25 has a suction nozzle 120 provided on the lower end surface. The suction nozzle 120 communicates with a positive and negative pressure supply device (see FIG. 4) 122 via negative pressure air and positive pressure air passages. The suction nozzle 120 suction-holds the electronic component 200 using negative pressure, and detaches the held electronic component 200 using positive pressure. Furthermore, the mounting head 25 includes a nozzle lifting device (see FIG. 4) 124 that lifts and lowers the suction nozzle 120. Using the nozzle lifting device 124, the mounting head 25 changes the vertical position of the electronic component 200 it holds.

The mark camera (see FIG. 3 above) 26 is fixed to the slider 110 of the moving device 24 in a downwardly facing state, and is moved to an arbitrary position together with the mounting head 25 by the operation of the moving device 24. Thereby, the mark camera 26 images an arbitrary position of the frame 31 from above the conveyor device 50. Further, as shown in FIG. 1, the parts camera 27 is disposed on the upper surface of the frame 31 between the substrate conveyance and holding device 22 and the supply device 29, facing upward. Thereby, the parts camera 27 images the electronic component 200 held by the suction nozzle 120. Note that the mark camera 26 and the parts camera 27 are two-dimensional cameras, and form two-dimensional imaging data.

The supply device 29 is a feeder type supply device, and is disposed at one end of the frame 31 in the Y direction. The supply device 29 has a tape feeder 130. The tape feeder 130 accommodates tape parts in a wound state. The taped component is the electronic component 200 taped. Then, the tape feeder 130 sends out the taped parts using a sending device (see FIG. 4) 132. Thereby, the feeder type supply device 29 supplies the electronic component 200 to the mounting head 25 at the supply position by feeding out the taped component.

The control device 30 includes a controller 140 and a plurality of drive circuits 142, as shown in FIG. The plurality of drive circuits 142 are connected to the electromagnetic motors 78, 96, 112, 114, the positive and negative pressure supply device 122, the nozzle lifting device 124, and the delivery device 132. The controller 140 is mainly a computer, including a CPU, ROM, RAM, etc., and is connected to a plurality of drive circuits 142. As a result, the operations of the substrate transport/holding device 22, the moving device 24, etc. are controlled by the controller 140. The controller 140 is also connected to an image processing device 146. The image processing device 146 is a device for processing imaged data captured by the mark camera 26 and parts camera 27. Thereby, the controller 140 acquires various information from the imaging data. Further, the controller 140 is also connected to a first detection sensor 83 and a second detection sensor 86. Thereby, the controller 140 acquires the detection value of each sensor from each sensor.

In the component mounting machine 16, the above-described configuration allows the mounting head 25 to perform mounting work on the circuit board 80 held by the board transport and holding device 22. Specifically, when the circuit board 80 is loaded into the component mounting machine 16 through the loading port 81, the first detection sensor 83 detects the loading of the circuit board 80. Then, the conveyor device 50 transports the circuit board 80 from the upstream side to the downstream side in the transport direction X<b>1 to the mounting position 204 in response to a command from the controller 140 . Then, at the mounting position 204, the board holding device 52 holds the circuit board 80 fixedly. Further, when the circuit board 80 is held by the board holding device 52, the mark camera 26 moves above the circuit board 80 according to a command from the controller 140, and images the circuit board 80. As a result, information regarding the holding position of the circuit board 80, etc. can be obtained.

Further, the tape feeder 130 feeds out the tape-formed components and supplies the electronic component 200 at the supply position according to a command from the controller 140 . Then, the mounting head 25 moves above the supply position of the electronic component 200 according to a command from the controller 140, and the suction nozzle 120 suction-holds the electronic component 200. Subsequently, the mounting head 25 moves above the parts camera 27, and the electronic component 200 held by the suction nozzle 120 is imaged by the parts camera 27. As a result, information regarding the holding posture, holding position, etc. of the electronic component 200 can be obtained. Then, the mounting head 25 moves above the circuit board 80 and mounts the electronic component 200 onto the circuit board 80 based on the holding position of the circuit board 80, the holding posture of the electronic component, and the like. In this way, when the electronic component 200 is mounted on the circuit board 80 and the work of mounting the electronic component 200 onto the circuit board 80 is completed, the holding of the circuit board 80 by the board holding device 52 is released, and the circuit board 80 is transferred to the conveyor. The device 50 transports the paper toward the downstream side in the transport direction X1. Then, the circuit board 80 is carried out from the component mounting machine 16 via the carrying out port 82. Note that the circuit board 80 is detected by the second detection sensor 86, and when the detection is interrupted, it is determined that the circuit board 80 has been carried out.

In this way, in the component mounter 16, the circuit board 80 is carried into the component mounter 16, and when the mounting work on the circuit board 80 is completed, the circuit board 80 is carried out from the component mounter 16.

In the component mounting machine 16, the positions of all the backup pins 91 arranged on the elevating table 90 are recognized before the mounting work is started. For this purpose, the mark camera 26 moves above the conveyor device 50 and images each backup pin 91 according to a command from the controller 140.

At this time, the circuit board 80 has not yet been carried into the component mounting machine 16. Therefore, as shown in FIG. 5, each backup pin 91 is visible from above the conveyor device 50 without being obstructed by the circuit board 80. Therefore, the mark camera 26 can image each backup pin 91. Thereby, position information of each backup pin 91 can be obtained. Note that since the mark camera 26 has a narrow angle of view, it images the backup pins 91 one by one.

Furthermore, in the component mounter 16, even if the mounting work is interrupted due to replacement or replenishment of the tape feeder 130, emergency stop, error stop, power outage, etc., the elevating table 90 is The positions of all the backup pins 91 arranged above are recognized. This is because the interruption may cause the backup pin 91 to shift or fall.

Here, assume a case shown in FIG. 6, for example, when the mounting work is interrupted. That is, the circuit board 80 carried into the component mounter 16 occupies the mounting position 204, and furthermore, among all the backup pins 91, each of the backup pins 91 lined up in the first row in the X direction Assume that the backup pins 91 arranged in the second to fifth rows in the X direction are not covered by the circuit board 80, but are covered by the circuit board 80.

In such a case, in the component mounting machine 16, the mark camera 26 first detects each backup pin 91 that is not covered by the circuit board 80, that is, each backup pin 91 lined up in the first row in the X direction. Take an image.

After that, in the component mounting machine 16, the circuit board 80 is moved upstream in the transport direction X1 by operating the conveyor device 50 according to a command from the controller 140. Note that the moving distance is set in advance according to the width of the mounting position 204, that is, according to the size of the circuit board 80. As a result, for example, as shown in FIG. 7, among all the backup pins 91, the backup pins 91 lined up in the fourth and fifth rows in the X direction are removed from the state covered by the circuit board 80. , the circuit board 80 transitions to a state where it is not covered. Therefore, the mark camera 26 images each backup pin 91 that has moved to a state where it is not covered by the circuit board 80, that is, each backup pin 91 lined up in the fourth and fifth rows in the X direction.

Furthermore, the component mounter 16 moves the circuit board 80 downstream in the transport direction X1 by operating the conveyor device 50. Note that the moving distance is also set in advance according to the size of the mounting position 204, that is, according to the size of the circuit board 80. As a result, for example, as shown in FIG. 8, among all the backup pins 91, the backup pins 91 arranged in the first to third rows in the X direction are removed from the state covered by the circuit board 80. , the circuit board 80 transitions to a state where it is not covered. However, each backup pin 91 lined up in the first row in the X direction has already been imaged by the mark camera 26. Therefore, the mark camera 26 images the backup pins 91 that are lined up in the second and third rows in the X direction among the backup pins 91 that are not covered by the circuit board 80 .

Note that the component mounting machine 16 may move the circuit board 80 in the reverse order of the case described above. That is, the component mounter 16 may first move the circuit board 80 downstream in the transport direction X1, and then move it upstream in the transport direction X1. Alternatively, the component mounter 16 can simultaneously move all the backup pins 91 covered by the circuit board 80 occupying the mounting position 204 by simply moving the circuit board 80 once to the upstream or downstream side in the transport direction X1. Alternatively, the state may be changed to a state where it is not covered with the circuit board 80.

In the component mounting machine 16 that has suspended the mounting operation in this manner, all the backup pins 91 are imaged by the mark camera 26. As a result, the positions of all backup pins 91 are recognized. Thereafter, in the component mounting machine 16, if there is no abnormality in the recognized position of the backup pins 91, the circuit board 80 is returned to the mounting position 204 by the conveyor device 50, and the interrupted mounting operation is resumed. On the other hand, if there is any abnormality in the recognized position of the backup pin 91, the backup pin 91 subject to the abnormality is relocated by the operator, and then the circuit board 80 is returned to the mounting position 204 by the conveyor device 50. The interrupted installation work will be resumed.

Furthermore, in the component mounting machine 16 that has suspended the mounting operation, all the backup pins 91 may be imaged by the mark camera 26 in a different form from the above-described case. For example, after the mark camera 26 images each backup pin 91 that is not covered by the circuit board 80 occupying the mounting position 204, that is, each backup pin 91 lined up in the first row in the X direction, FIG. As shown in FIG. 9, the circuit board 80 may continue to be moved downstream in the transport direction X1 by operating the conveyor device 50.

In such a case, each backup pin 91 covered and hidden by the circuit board 80 occupying the mounting position 204, that is, each backup pin 91 lined up in the second to fifth rows in the X direction, As it moves downstream in the conveyance direction X1, it transitions to a state where it is not covered by the circuit board 80 in the order of description in the second, third, fourth, and fifth columns in the X direction.

Therefore, while the circuit board 80 is moving downstream in the transport direction Images are taken of each backup pin 91 that transitions to a state where it is not in use, that is, each backup pin 91 lined up in the second to fifth rows in the X direction. Alternatively, after the circuit board 80 is unloaded from the component mounting machine 16, the mark camera 26 detects each backup pin 91 that is not covered by the circuit board 80, that is, from the second row to the fifth row in the X direction. Each backup pin 91 lined up in a row is imaged.

Note that, as shown in FIG. 9, when the same type of circuit board 80 is carried in and out of the component mounter 16 at the same time, such imaging by the mark camera 26 is performed when the circuit board 80 to be carried in is placed at the mounting position. This is done before being transported to 204. In such a case, the distance between the circuit board 80 being carried out and the circuit board 80 being carried in does not have to exceed the width of the mounting position 204 in the X direction, and at least the distance between the circuit board 80 being carried out and the circuit board 80 being carried in is It is only necessary to ensure a distance between the mark camera 26 and the circuit board 80 that allows the mark camera 26 to image each backup pin 91 individually.

As described in detail above, even when the circuit board 80 is loaded, the component mounting machine 16 of the present embodiment can mount the circuit board 80 on the conveyor device 50 as shown in FIGS. 6 to 9. By moving the circuit board 80, all the backup pins 91 arranged at positions where the circuit board 80 can be supported from below are sequentially uncovered by the circuit board 80, and images are taken by the mark camera 26. do.

Incidentally, in this embodiment, the conveyor device 50 of the substrate conveyance and holding device 22 is an example of a conveyance device. The mark camera 26 is an example of a camera. The circuit board 80 is an example of a board. Controller 140 is an example of a control unit.

Note that the present disclosure is not limited to the above embodiments, and various changes can be made without departing from the spirit thereof.
For example, if the circuit board 80 is conveyed between the pair of guide rails 60 and 62 in the conveyor device 50, that is, within the mounting area 202, even if the circuit board 80 is shifted or removed from the mounting position 204, the main It is possible to apply disclosure.

Further, the image capturing by the mark camera 26 may be performed not when the circuit board 80 is carried out, but when the circuit board 80 is carried in. In such a case, the mark camera 26 sequentially images each pack-up pin 91 located downstream in the transport direction X1 from the circuit board 80 being carried in, starting from the upstream side in the transport direction X1.

In addition, when the mark camera 26 captures images when the circuit board 80 is carried in or out, it may be carried out each time one circuit board 80 is carried in or out, or at regular intervals (for example, when the circuit board 80 This may be performed each time the number of sheets brought in and taken out reaches a predetermined number, or every time a predetermined time elapses.

Further, the image capturing by the mark camera 26 may be performed other than when the mounting operation is interrupted. For example, the mark camera 26 may image the backup pin 91 when it is detected that the mounting state of the electronic component 200 in a partial area of the circuit board 80 is abnormal. In such a case, the mounting state of the electronic component 200 on the circuit board 80 may be inspected by a board inspection device (not shown) disposed downstream of the component mounter 16 in the transport direction X1 or by the component mounter 16 itself. It will be done. As a result, when it is detected that the mounting state of the electronic component 200 in a part of the circuit board 80 is abnormal, the backup pins 91 that were supporting the circuit board 80 in that part of the region are shifted from their placed positions. There is a possibility that it may have fallen down or fallen down. Therefore, the component mounter 16 uses the mark camera 26 to take an image in order to confirm the arrangement state of the backup pins 91. At this time, all of the backup pins 91 may be imaged, or only the backup pins 91 that supported the circuit board 80 in a partial area thereof may be imaged. Note that when the board inspection device performs the inspection, the board inspection device notifies the component mounter 16 of an abnormality in the mounting state of the electronic component 200 in a partial area of the circuit board 80 or information regarding the partial area. . Thereby, the component mounting machine 16 can obtain a detection result that the mounting state of the electronic component 200 in a partial area of the circuit board 80 is abnormal.

16: Component mounter, 22: Board transport and holding device, 26: Mark camera, 50: Conveyor device, 80: Circuit board, 91: Backup pin, 140: Controller, 200: Electronic component, 202: Mounting area, 204: Mounting Position, X1: Conveying direction

Claims (5)

A component mounting machine that mounts electronic components on a board,
a transport device that transports the substrate;
a plurality of backup pins arranged at positions capable of supporting the substrate from below the substrate;
a camera that images the plurality of backup pins from above the transport device;
When the board is loaded into the electronic component mounting area by the transport device, by moving the board by the transport device, the plurality of backup pins are sequentially brought into a state in which they are not covered by the board. a control unit configured to take an image using the camera. The control unit repeatedly covers and hides the plurality of backup pins with the substrates at predetermined intervals while the plurality of substrates of the same type are successively loaded into the electronic component mounting area. 2. The component mounting machine according to claim 1, wherein the camera captures an image in a state in which the component mounter is not in use. The control unit moves the board from a mounting position where the electronic component is mounted to at least one of an upstream side in the transport direction of the board and a downstream side in the transport direction. 3. The component mounting machine according to claim 1 or 2, which takes an image of the component mounting machine. 2. The controller according to claim 1, wherein the control unit images the backup pin when or when the board is being unloaded from the component mounter by moving the board downstream in the transport direction of the board. The component mounting machine according to claim 2. 5. The control unit is configured to use the camera to image a backup pin that is not covered by the substrate, among the plurality of backup pins, before the substrate is moved by the transport device. A component mounting machine described in any one of the above.

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