JP2012199455A - Die bonder and semiconductor manufacturing method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a semiconductor manufacturing method in which an application work is performed in a short period of time using a plurality of syringes and the application form is stable, in view of the problems that it requires time to apply a large area when application is performed with one syringe, and that it is difficult to keep a flowable material to be applied even due to difference (pressure, paste amount, etc.) in syringes when application is performed with a plurality of syringes, which easily causes variation in application and disconnection.SOLUTION: There is provided a method of applying a paste on a substrate which makes a relatively parallel movement over an arbitrary distance in X-axis and Y-axis directions by drawing and applying a predetermined pattern with a flowable material. In the method, the plurality of syringes draw and apply different sub-patterns, which forms one pattern.

Description

  The present invention relates to a die bonder and a semiconductor manufacturing method, and more particularly to a paste coating method for drawing and coating with a plurality of heads applied to die bonding and component mounting in a semiconductor manufacturing apparatus.

  In general, in a manufacturing process of a semiconductor device (or a semiconductor integrated circuit device), a fluid material such as a die bonding liquid adhesive (for example, an epoxy adhesive) is applied to a substrate to be coated such as a printed circuit board. . At this time, first, a paste-like adhesive is put in a syringe having an application nozzle (hereinafter referred to as a nozzle) below, and a pressurized gas such as air is supplied from the dispenser device for a certain period of time. Then, a fluid material such as an adhesive is applied to a substrate to be coated (hereinafter referred to as a substrate) by discharging a predetermined amount of fluid material from the nozzle of the syringe. At the time of application, a drawing application operation is performed by two-dimensionally scanning the syringe in a two-dimensional manner in the XY plane with the nozzle close to the substrate (see, for example, Patent Document 1 and Patent Document 2).

JP 2009-26851 A JP 2003-53238 A

As described above, in conventional paste application, there are a method in which a fluid material is applied with one syringe (single nozzle) and a method in which a fluid material is applied with a plurality of syringes (for example, two syringes with a single nozzle). is there.
However, when applying with one syringe, it takes time if the application area is large. In addition, when applying with a plurality of syringes, due to the difference between each syringe (pressure, paste amount, etc.), it is difficult to make the flowable material the same application amount, and uneven application and disconnection are likely to occur. .
In view of the above-described problems, an object of the present invention is to provide a die bonder and a semiconductor manufacturing method in which a coating operation is performed in a short time with a plurality of syringes and the coating shape is stable.

  In order to achieve the above object, a semiconductor manufacturing method of the present invention is formed by drawing and applying a predetermined pattern with a flowable material on a substrate that moves horizontally at an arbitrary distance in the X-axis and Y-axis directions. In this semiconductor manufacturing method, each of a plurality of syringes draws and applies different sub-patterns to form one pattern.

  In the semiconductor manufacturing method according to the invention, the pattern drawn and applied by the plurality of syringes does not intersect the drawing pattern at least at the intersection of the patterns.

  ADVANTAGE OF THE INVENTION According to this invention, it becomes possible to make application | coating operation | work into a short time with a several syringe, and can implement | achieve the die bonder and semiconductor manufacturing method with which application | coating shape was stabilized.

It is a perspective view which shows one Example of the paste coating device used for this invention. It is a perspective view which shows one Example of the paste coating device used for this invention. It is the schematic which shows one Example of the die bonder used for this invention. It is a block diagram which shows one Example of the main control part in the paste coating device used for this invention, and its control system. It is a flowchart which shows the whole operation | movement of the paste application | coating method of this invention. It is a figure for demonstrating the conventional paste application | coating method. It is a figure for demonstrating the paste application | coating method of this invention. It is a figure for demonstrating the conventional paste application | coating method. It is a figure for demonstrating one Example of the paste application | coating method of this invention. It is a figure for demonstrating one Example of the paste application | coating method of this invention. It is a figure for demonstrating one Example of the paste application | coating method of this invention. It is a figure for demonstrating one Example of the paste application | coating method of this invention. It is a figure for demonstrating one Example of the paste application | coating method of this invention.

The present invention relates to a paste application method and a paste application apparatus that draw and apply a predetermined pattern of a flowable material, and stably supply the application amount and shape of the flowable material with a plurality of heads (a plurality of syringes). We propose a paste application method that enables stable and high-speed drawing. In this document, a 1-nozzle (single-nozzle) paste applying method for one syringe will be described.
Moreover, in this invention, it draws with a respectively different sub pattern with a several syringe, and forms the one pattern (coating pattern) combining the said sub pattern. Moreover, in this invention, it is a paste application | coating method with which a sub pattern does not cross | intersect in the intersection part of an application pattern.
By sharing the drawing of different sub-patterns with a plurality of syringes, the need for the same application amount and the same application shape as other syringes can be reduced.
In addition, application (drawing) processing operations can be performed in parallel with a plurality of syringes, high-speed drawing is possible, and productivity is improved.
Furthermore, even with a plurality of syringes, it is possible to cope with drawing patterns in which intersecting portions exist, and drawing application can be processed in parallel to enable high-speed drawing, thereby improving productivity.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. It should be noted that the present invention is not limited to this embodiment, and any person who has ordinary knowledge in the technical field to which the present invention belongs can modify or modify the present invention based on the spirit and spirit of the present invention. Of course, the invention which can be changed is included. In the description of each figure, the same reference numerals are assigned to components having common functions, and the description is omitted to avoid duplication of description as much as possible.

Hereinafter, embodiments of the present invention will be described with reference to FIGS. 1A and 1B. FIG. 1A is a perspective view showing an embodiment of a conventional paste coating apparatus. FIG. 1B is a perspective view showing an embodiment of a paste coating apparatus according to the present invention. FIG. 1A is a perspective view showing an embodiment of a paste applicator having one syringe, and FIG. 1B is an example of a paste applicator according to the present invention having a plurality of syringes (for example, two syringes). It is a perspective view which shows an Example.
In this document, first, the schematic configuration of the paste coating apparatus will be described with reference to FIG. 1A, and the paste coating apparatus used in the present invention will be described with reference to FIG. 1B.
100 and 100 'are paste application apparatuses of the present invention, 1 is a frame, 2 is a Z-axis table support frame, 3 is an X-axis moving table, 4 is an X-axis servo motor, 5 is a Y-axis moving table, and 6 is a Y-axis servo Motor, 7 is a substrate holding mechanism, 8 is a θ-axis moving table, 9 is a substrate, 10 is a Z-axis moving table support bracket, 11 is a Z-axis moving table, 11a is a support base, 12 is a Z-axis servo motor, 13 is a flow 14 is a nozzle support, 15 is an image recognition camera, 16 is a distance meter, 17 is a main control unit, 18 is a sub-control unit, 18a is a hard disk, 18b is a DVD, and 19 is a monitor. , 20 is a keyboard, 21 is a wiring, and 26 is a guide rail for moving the Z-axis table indicating frame in the Y-axis direction. Paste coating apparatus 100 ′ is a type having one syringe 13. In order to perform the coating operation with a plurality of syringes, a plurality of paste coating apparatuses 100 ′ are prepared.

  1A, an X-axis movement table 3 is provided on the gantry 1, and a Y-axis movement table 5 is disposed on the X-axis movement table 3 so as to be orthogonal thereto. Is provided. The Y-axis movement table 5 moves on the X-axis movement table 3 in the X-axis direction by driving an X-axis servo motor 4 provided on the X-axis movement table 3. A substrate holding mechanism 7 is provided on the Y-axis moving table 5. The substrate holding mechanism 7 moves on the Y-axis movement table 5 in the Y-axis direction by driving a Y-axis servo motor 6 attached to the Y-axis movement table 5. Further, a θ-axis moving table 8 is attached to the substrate holding mechanism 7, and the substrate holding mechanism 7 is rotated in the θ-axis direction (rotating direction around the Z-axis) by the rotational drive of the θ-axis moving table 8 by a θ-axis servo motor (not shown). ). The substrate 9 is attached to the substrate holding mechanism 7 and is moved in the X and Y axis directions or rotated in the θ axis direction by driving the servo motors of the X, Y, and θ axis moving tables 3, 5, and 8. Thus, it is positioned at a predetermined position.

In this embodiment, the substrate 9 is moved in the surface direction for positioning, and a fluid material is applied. However, it goes without saying that the same positioning and paste application control can be performed by moving the nozzle. Further, the whole mechanism for driving the moving tables 3, 5, 8 or the mechanism for moving the nozzle in the surface direction of the substrate 9 is collectively referred to as a table driving mechanism.
For example, the Z-axis table support frame 2 is moved in the Y-axis direction on the guide rail 26, and a guide rail (not shown) for movement in the X-axis direction is provided on the Z-axis table support frame 2 to support the Z-axis movement table. The bracket 10 may be moved along the guide rail in the X-axis direction. In addition, illustration about a drive part is also well-known, and it abbreviate | omits.

  A Z-axis table support frame 2 is also provided on the frame 1, and a Z-axis movement table 11 is provided on the Z-axis table support frame 2 via a Z-axis movement table support bracket 10. Yes. On the Z-axis moving table 11, a support base 11a is attached so as to be movable in the Z-axis direction. By driving a Z-axis servo motor 12 attached to the Z-axis moving table 11, the support base 11a is It moves in the Z-axis direction (vertical direction) (this drive system is hereinafter referred to as a nozzle drive mechanism). The support base 11a is attached with a syringe 13 having a nozzle support 14 at the lower end, an image recognition camera 15 having a lens barrel with a light source capable of illumination, a distance meter 16, and the like. Although not shown, a nozzle is provided at the tip of the nozzle support 14.

  The syringe 13 is detachably attached to a movable part of a linear guide (not shown). The image recognition camera 15 is provided so as to face the substrate 9 in order to align the substrate 9 or recognize the shape of the paste pattern.

  A main control unit 17 is installed in the lower part of the gantry 1, and the main control unit 17 is connected to a separately installed sub control unit 18 through a wiring 21. The sub-control unit 18 includes an external storage device using a storage medium such as a hard disk 18a or a DVD 18b, a monitor 19, and a keyboard 20.

  The main control unit 17 controls the servo motors 4, 6, 12 of the tables 3, 5, 11, the servo motor of the θ axis movement table 8, and the like. Data for various processing in the main control unit 17 is input from the keyboard 20, and an image captured by the image recognition camera 15 and a processing status in the main control unit 17 are displayed on the monitor 19. Data input from the keyboard 20 is stored and stored in a storage medium such as a hard disk 18a or a DVD 18b, which is an external storage device.

  FIG. 1B is a paste application device provided with two syringes, whereas FIG. 1A shows one syringe. Since the paste application apparatus 100 of the present invention is applied using two or more nozzles (syringes), as shown in FIG. 1B, the Z-axis table support frame 2, the Z-axis movement table support bracket 10, and the Z-axis movement table 11 are used. Two sets of a support base 11a, a Z-axis servo motor 12, a syringe 13, a nozzle 13a, a nozzle support 14, an image recognition camera 15, and a distance meter 16 are provided.

Next, a control method of the paste coating apparatus 100 of FIG. 1B will be described with reference to FIG. FIG. 2 is a block diagram showing a specific example of the main controller 17 and its control system in FIG. 1B. 8a is a θ-axis servo motor, 13a is a nozzle, 17a is a microcomputer, 17b is a motor controller, 17c is a data communication bus, 17d is an external interface, 17e is an image processing device, 17f to 17i are motor drivers, and 22 is a negative pressure source. , 23 are positive pressure sources, 22a and 23a are regulators, 24 is a valve unit, 25 is air, and 26 is a guide rail.
The Z-axis table support frame 2, the Z-axis movement table support bracket 10, the Z-axis movement table 11, the support base 11a, the Z-axis servo motor 12, the syringe 13, the nozzle 13a, the nozzle support 14, the image recognition camera 15, and Although the description regarding the distance meter 16 is described as one set, the two sets can be operated individually.

  In FIG. 2, the main control unit 17 is a signal between the microcomputer 17a, the motor controller 17b, the motor drivers 17f to 17i, the image processing device 17e that processes the video signal obtained by the image recognition camera 15, and the sub-control unit 18. An external interface 17d for transmission and control of the regulators 22a and 23a and the valve unit 24 and measurement input of the distance meter 16 is built in. The microcomputer 17a, the motor controller 17b, the external interface 17d and the image processing device 17e are connected to the data communication bus. 17c are connected to each other.

  Although not shown, the microcomputer 17a includes a main processing unit, a ROM that stores a processing program for performing coating drawing described later, processing results in the main processing unit, and input data from the external interface 17d and the motor controller 17b. And an input / output unit for exchanging data with the external interface 17d and the motor controller 17b.

  The servo motors 4, 6, 12 for driving the tables 3, 5, 11 and the θ-axis servo motor 8a for rotating the θ-axis moving table 8 (FIG. 1A) incorporate an encoder for detecting the rotation amount. The detection results are returned to the corresponding motor drivers 17f, 17g, 17i, and 17h to control the position of the substrate 9 and the nozzle 13a.

  The servo motors 4, 6, 8a and 12 rotate forward and backward based on data input from the keyboard 20 and stored in the RAM built in the microcomputer 17a. As a result, the substrate 9 held by the substrate holding mechanism 7 moves by an arbitrary distance in the X and Y axis directions with respect to the nozzle 13 a supported via the Z axis moving table 11. During the movement, a slight air pressure is continuously applied to the syringe 13, whereby the fluid material is discharged from the paste discharge port at the tip of the nozzle 13 a, and a desired paste pattern is applied and drawn on the substrate 9.

  The discharge pressure control mechanism for controlling the application of the flowable material includes a regulator 23a for adjusting the pressure of compressed air supplied from the positive pressure source 23, and the pressure of negative pressure air supplied from the negative pressure source 22. And a valve unit 24 for switching and controlling the air piping adjusted in pressure from the regulators 22a and 23a and the piping opened to the atmosphere 25, and this discharge pressure control mechanism A desired pressure is applied from the valve unit 24 to the flowable material in the syringe 13 to control the discharge pressure.

Further, while the substrate 9 held by the substrate holding mechanism 7 is horizontally moved in the X and Y axis directions, the distance meter 16 determines the distance between the nozzle 13a and the substrate 9 (hereinafter referred to as the height of the nozzle 13a). Based on the measurement result, the Z-axis servo motor 12 is driven and the nozzle 13a is moved in the Z direction so that the height of the nozzle 13a is maintained substantially constant.
In the paste applying apparatuses 100 and 100 ′, servo motors are used as motors for driving the respective axes, but DC motors, linear motors, vibration motors, stepping motors, universal motors, and the like can also be used.

Next, FIG. 1C shows a schematic diagram of a die bonder 100c in which the syringe 1 moves and rotates in the X direction, the Y direction, the Z direction, and the θ direction without using the X axis movement table and the Y axis movement table.
The die bonder 210 is roughly divided into a wafer supply unit 201, a substrate supply / conveyance unit 202, a die bonding unit 203, and a control unit (not shown) for controlling these components.
The wafer supply unit 201 includes a wafer cassette lifter 211 and a wafer holder 212. The wafer cassette lifter 211 has a wafer cassette (not shown) filled with wafer rings, and sequentially supplies the wafer rings to the wafer holder 212. Wafer holder 212 moves the wafer ring so that the desired die can be picked up from the wafer ring.
The substrate supply / conveyance unit 202 includes a stack loader 221, a frame feeder 222, and an unloader 223. The stack loader 221 supplies a substrate (for example, a lead frame) to which the die is bonded to the frame feeder 222. The frame feeder 222 conveys the substrate to the unloader 223 through two processing positions on the frame feeder 222. The unloader 223 stores the transported substrate.
The die bonding unit 203 includes a preform unit 231 and a bonding head unit 232. The preform unit 231 applies a die adhesive to the substrate conveyed by the frame feeder 222. The preform portion 231 includes a preform head 231a that independently moves and rotates the syringe 13 in the X direction, the Y direction, the Z direction, and the θ direction. A linear motor, a servo motor, a DC motor, a vibration motor, a stepping motor, a universal motor, or the like can be used for movement in the X direction, Y direction, and Z direction and rotation in the θ direction. Here, a case will be described in which a linear motor is used for movement in the X direction, Y direction, Z direction, and θ direction, and a servo motor is used for rotation in the θ direction.
The preform head 231a has two syringes 13, and the two syringes 13 can be driven independently. The preform head 231a is linearly moved in the X, Y, and Z directions so that the two syringes 13 can be applied by the motor controller 17b (FIG. 2) by the application method shown in FIGS. Controls the motor and servo motor that rotates in the θ direction.
The bonding head unit 232 picks up the die from the wafer holder 212 and moves up, and moves the die to the bonding position on the frame feeder 222. Then, the bonding head unit 232 lowers the die at the bonding point, and bonds the die onto the substrate coated with the die adhesive.

FIG. 3 is a flowchart showing the overall operation of the paste coating apparatus 100 used in the present invention. The operation of this embodiment will be described below with reference to FIGS. 1A and 2 as well.
In FIG. 3, first, when the power is turned on, the initial setting of the paste coating apparatus is executed in step S100.

  After this initial setting step, in step S200, the servo motors 4, 6, 8a, and 12 are driven to move the substrate holding mechanism 7 in the X, Y, and θ axis directions to be positioned at a predetermined reference position. At the same time, the nozzle 13a is also set to a predetermined origin position so that the paste discharge port becomes a position where the paste application starts (that is, the flowable material application start point). Furthermore, pattern data of fluid material, substrate position data, fluid material discharge end position data, etc. are set. As described above, each of these data is input from the keyboard 20, and the input data is stored in a RAM built in the microcomputer 17a.

Next, in step S300, the substrate 9 is mounted and held on the substrate suction mechanism 7, and then substrate preliminary positioning processing is performed.
In this substrate preliminary positioning process, the positioning mark of the substrate 9 mounted on the substrate holding mechanism 7 is photographed by the image recognition camera 15, and the center of gravity position of the positioning mark is obtained from the photographed image by image processing. The inclination in the θ-axis direction is detected, the servo motor 8a is driven in accordance with this, and the inclination in the θ-axis direction is also corrected.
In addition, when the remaining amount (internal volume) of the fluid material in the syringe 13 is small, the syringe 13 together with the nozzle 13a in advance in order to prevent the fluid material from being interrupted during the next paste application operation. Exchange. When the syringe 13 or the nozzle 13a is replaced, a positional shift on the X and Y axis surfaces may occur. In order to eliminate this misalignment, a cross mark is drawn using a new nozzle 13a exchanged in an area where no pattern is formed on the substrate 9, and this cross mark is photographed by the image recognition camera 15, and the photographed image is taken. To obtain the position of the center of gravity of the intersection of the cross marks by image processing. Then, the distance between the position of the center of gravity and the position of the center of gravity of the positioning mark on the substrate 9 is calculated, and the calculated result is used as the positional deviation amount (dx, dy) of the fluid material discharge port of the nozzle 13a. 17a is stored in a built-in RAM. Thereby, the substrate preliminary positioning process (step S400) is completed.
The amount of positional deviation (dx, dy) of the nozzle 13a is used to correct the positional deviation of the nozzle 13a during a pattern coating / drawing operation to be performed later.

Next, in step S400, a fluid material pattern drawing process is performed.
In this pattern drawing process, in order to position the fluid material discharge port of the nozzle 13a at the application start position, the substrate 9 is moved, and the position of the nozzle 13a is compared and adjusted. For this purpose, first, the positional displacement amount (dx, dy) of the nozzle 13a obtained in the previous substrate preliminary positioning process (step S400) and stored in the RAM of the microcomputer 17a is set to the position of the nozzle 13a set in advance. It is determined whether or not the deviation is within the allowable range (ΔX, ΔY).
If the positional deviation amount (dx, dy) is within this allowable range (ΔX ≧ dx and ΔY ≧ dy), leave it as it is, and if it is outside the allowable range (ΔX <dx or ΔY <dy), By moving the substrate 9 based on the amount of displacement (dx, dy), the displacement between the flowable material discharge port of the nozzle 13a and the desired position of the substrate 9 is eliminated, and the nozzle 13a is positioned at the desired position. To do.

  Next, the Z-axis servo motor 12 is operated to set the height of the nozzle 13a to the pattern drawing height of the fluid material. The nozzle 13a is lowered by the initial moving distance based on the initial moving distance data of the nozzle. Subsequently, by measuring the surface height of the substrate 9 with the distance meter 14, it is confirmed whether or not the height of the nozzle 13a is set to a height at which the pattern of the fluid material is drawn. If the drawing height cannot be set, the nozzle 13a is lowered by a minute distance, and thereafter, the measurement of the surface height of the substrate 9 and the minute distance descent of the nozzle 13a are repeated alternately, and the height of the nozzle 13a is set. Set the height to apply and draw the pattern. Further, when the syringe 13 is not replaced, there is no data on the positional deviation amount (dx, dy) of the nozzle 13a. Therefore, when the pattern drawing process is started, the height of the nozzle 13a is immediately set.

  When the above processing is completed, the servo motors 4 and 6 are then driven based on the flowable material pattern data stored in the RAM of the microcomputer 17a. Thereby, the substrate 9 moves in the X and Y directions according to the pattern data in a state where the paste discharge port of the nozzle 13a faces the substrate 28. Along with this, a predetermined discharge pressure is applied from the positive pressure source 23 to the syringe 13 via the regulator 23a and the valve unit 24, and discharge of the paste from the paste discharge port of the nozzle 13a of the syringe 13 is started. Thereby, coating drawing on the substrate 9 is started.

  Along with this, as described above, the microcomputer 17a inputs the actual measurement data of the height of the nozzle 13a from the distance meter 16, and measures the undulation of the surface of the substrate 9 from the actual measurement data. In response to this, the nozzle drive mechanism (Z-axis servo motor 12) is operated. Thereby, the height of the nozzle 13a is maintained substantially constant at the set value.

  At the same time, as described above, the microcomputer 17a inputs the actual measurement data of the height of the nozzle 13a from the distance meter 16 and measures the undulation of the surface of the substrate 9 from the actual measurement data. In response to this, the nozzle drive mechanism (Z-axis servo motor 12) is operated. Thereby, the height of the nozzle 13a is maintained substantially constant at the set value.

In step S500, the substrate on which the coating drawing has been completed is discharged.
In step S600, it is determined whether or not the coating operation has been completed for all the substrates. If not, the process returns to step S200. In addition, when the coating operation is completed for all the substrates, the apparatus is turned off.

Next, a conventional paste coating method and a coating method according to the present invention will be described with reference to FIGS. FIG. 4 is a diagram for explaining a conventional paste application method, and FIG. 5 is a diagram for explaining a paste application method of the present invention.
In the following description, the flowable material is discharged from the paste discharge port at the tip of the syringe nozzle and the desired pattern is applied and drawn on the substrate, assuming that the pattern is drawn and applied by the syringe.

As shown in FIG. 4A, when a syringe 402 is drawn and applied in the order of arrows 41, 42, 43, 44, 45, 46, 47, 48 from the starting point 40, a pattern 403 is formed. Further, for speeding up, as shown in FIG. 4 (b), another syringe 422 is used in the order of arrows 41, 42, 43, 44, 45, 46, 47, 48 from the starting point 40 in FIG. ), The pattern 423 is formed.
However, a syringe having a liquid level h0 and a large amount of paste remaining is used for drawing and applying the pattern 403, and a syringe having a small amount of liquid level h2 and a fluid material is used for drawing and applying the pattern 423. Therefore, the pattern 403 has a large coating amount, and the pattern 423 has a small coating amount.

Therefore, in the present invention, as shown in FIG. 5A, one sub-pattern is drawn and applied along the arrow 531 with the syringe 502, the arrow 521 with the syringe 503, and then the other sub-pattern along the arrow 522. A pattern is drawn and applied. As a result, a pattern 504 is formed in the region 501.
Similarly, as shown in FIG. 5B, an attempt is made to draw and apply the same pattern as in FIG. In this case, the syringe 502 draws and applies one sub-pattern along the arrow 531, and the syringe 503 draws and applies the other sub-pattern along the arrow 521 and then the arrow 522. As a result, a pattern 524 having a coating amount almost the same as the pattern 504 drawn and applied in the region 501 is formed in the region 521.

  Next, with reference to FIGS. 6, 7, 8, 9, and 10, a conventional paste coating method and a coating method for an intersection portion in the case of drawing coating according to the present invention will be described. FIG. 6 is a diagram for explaining a conventional paste coating method, and FIGS. 7 to 10 are diagrams for explaining an embodiment of the paste coating method of the present invention.

In FIG. 6, as shown in FIG. 6A, conventionally, when drawing and applying along the arrow 61 with a syringe, one sub-pattern 602 is formed. Next, as shown in FIG. 6B, the other sub-pattern 603 is formed by drawing and applying with a different syringe.
However, since the sub-pattern 602 has already been formed when the sub-pattern 603 is drawn and applied, as shown in FIG. 6C, a disconnection 644 occurs after the intersection or after the intersection, and the applied and drawn sub-pattern is The sub-patterns 642 and 642 ′ are separated.

Therefore, in one embodiment of the present invention shown in FIG. 7, as shown in FIG. 7A, a sub-pattern 702 is formed by drawing and applying along the arrow 71 with a syringe as shown in FIG. 7A. The Next, as shown in FIG. 7 (b), a different syringe is used to draw and apply as shown by arrows 72 and 73. This route is the same as the arrow 62 in FIG. However, in one embodiment of the present invention, the drawing application is not performed at the portion intersecting with the sub-pattern 702. That is, the path is separated and applied at the intersection of the arrow 72 and the arrow 73.
As a result, as shown in FIG. 7C, no disconnection occurs when the sub-pattern 703 is drawn and applied.

  Further, in one embodiment of the present invention shown in FIG. 8, a sub-pattern 802 is formed by drawing and applying with a syringe along the arrow 81 as shown in FIG. Next, as shown in FIG. 8B, a different syringe is used to draw and apply as shown by an arrow 82. The paths indicated by the arrows 81 and 82 are crossed portions of X-shapes, and the path for drawing and coating is bent to form a "<" shape. As a result, in one embodiment of the present invention, the drawing application can be performed so that the drawing application paths do not cross each other at the intersection of the sub pattern 802 and the sub pattern 803. That is, no disconnection occurs in the finally formed pattern 842. For this reason, as shown in FIG. 8C, no disconnection occurs when the pattern 842 is drawn and applied.

  In the embodiment of the present invention shown in FIG. 9, when a syringe is drawn and applied along the arrow 81 'as shown in FIG. 9A, a sub-pattern 802' is formed. Next, as shown in FIG. 9B, a sub-pattern 803 'is drawn and applied with a different syringe as shown by an arrow 82'. The paths of the arrows 81 ′ and 82 ′ are crossed portions of the X-shape, and the path for drawing and coating is bent to form a path of “K” or reverse “K”. Compared with the paths 81 and 82 in FIG. 8, the distance of the intersection is increased. As a result, in one embodiment of the present invention, the drawing application can be performed so that the drawing application paths do not cross each other at the intersection of the sub-pattern 802 'and the sub-pattern 803'. That is, no disconnection occurs in the completed pattern 842 '. For this reason, as shown in FIG. 9C, no disconnection occurs when the pattern 842 'is drawn and applied.

Further, in one embodiment of the present invention shown in FIG. 10, one embodiment of a sub-pattern in the case of drawing coating for forming the pattern 101 shown in FIG. 10 (a) with a syringe is shown in FIGS. 10 (b) and 10 (c). ).
As shown in FIG. 10B, the pattern 101 ′ is formed by combining the sub-patterns of the arrows 111, 112, and 113. Further, as shown in FIG. 10C, the pattern 101 ″ is formed by combining the sub-patterns of the arrows 121, 122, and 123.
As a result, in one embodiment of the present invention, the drawing application can be performed so that the drawing application paths do not cross each other at the intersection of each sub-pattern. That is, no disconnection occurs in the completed pattern 101 (101 ′, 101 ″).

FIG. 11 shows an embodiment of the present invention of FIG. In this embodiment, the nozzle diameters of the two syringes 13 are different. Pattern A is applied with a syringe 13 having a small nozzle diameter. Next, the pattern B is applied on the applied pattern A with the syringe 13 having a large nozzle diameter. At this time, the pattern B may not overlap the pattern A completely but may overlap a part of the tip. The application amount of the adhesive can be controlled without the adhesive protruding from the adhesive surface. The amount of adhesive applied can also be controlled by a combination of patterns.
Instead of the nozzle diameter, a different application amount may be applied by changing the pressure when applying the adhesive between the two syringes.

Furthermore, in the embodiment of FIG. 7, speeding up can be realized by drawing and applying with different syringes. Also in the embodiment of FIG. 8, speeding up can be realized by drawing and applying with separate syringes.
7 and FIG. 8, the path 71 and the paths 72 and 73 may be drawn and applied with the same syringe. Further, the path 81 and the path 82 may be drawn and applied with the same syringe.

As described above, according to the present invention, it is possible to provide a paste coating method capable of stably supplying the coating amount and the shape by sharing the drawing and coating of different paths with a plurality of nozzles (a plurality of syringes). .
In addition, according to the present invention, it is possible to provide a paste coating method capable of stably supplying a coating amount and a shape without causing a pattern disconnection by preventing intersections at the intersections of the drawing paths. it can.
Furthermore, productivity improves by drawing and applying with a plurality of syringes.

Furthermore, by sharing different drawing paths with a plurality of syringes, the necessity of having exactly the same amount and shape for each syringe is reduced. Accordingly, it is not necessary to strictly align the parameters such as the nozzle, pressure, speed, height, and pattern shape among the syringes used, and the man-hours for the setup work and the skill level of the operator are not required.
In addition, since different patterns are drawn and applied with each syringe, the nozzle diameter, pressure, and speed can be set separately, and the degree of freedom of drawing application increases. For example, it is possible to use one syringe for filling holes such as irregularities on the substrate. Also, for example, a complicated-shaped coating pattern can be realized.

  The present invention applies a liquid adhesive for die bonding or a liquid adhesive for mounter to a substrate to be coated such as a printed circuit board, and also applies a filler for chip coating in a semiconductor element such as an LED or LSI. It can also be applied to manufacturing equipment.

  100, 100 ′: Paste coating device, 1: frame, 2: Z-axis table support frame, 3: X-axis movement table, 4: X-axis servo motor, 5: Y-axis movement table, 6: Y-axis servo motor, 7 : Substrate holding mechanism, 8: θ-axis moving table, 8a: θ-axis servo motor, 9: substrate, 10: Z-axis moving table support bracket, 11: Z-axis moving table, 11a: support base, 12: Z-axis servo motor , 13: Syringe, 13a: Nozzle, 14: Nozzle support, 15: Image recognition camera, 16: Distance meter, 17: Main controller, 17a: Microcomputer, 17b: Motor controller, 17c: Data communication bus, 17d: External interface, 17e: Image processing device, 17f to 17i: Motor driver, 18: Sub-control unit, 18a: Hard disk, 18b: DVD, 19: monitor, 20: keyboard, 21: wiring, 26: guide rail, 22: negative pressure source, 22a, 23a: regulator, 23: positive pressure source, 24: valve unit, 25: air.

Claims (3)

  A paste application method in which a predetermined pattern is drawn and applied with a flowable material on a substrate that moves horizontally at an arbitrary distance in the X-axis and Y-axis directions. Each sub-pattern is drawn by a plurality of syringes. A semiconductor manufacturing method characterized by forming a pattern by coating.   The semiconductor manufacturing method according to claim 1, wherein the pattern to be drawn and applied by the plurality of syringes does not intersect the drawing pattern at least at the intersection of the patterns. A preform mechanism having a plurality of syringes for applying an adhesive and a drive mechanism for driving the plurality of syringes;
A control unit capable of individually driving the drive mechanism and controlling the plurality of syringes to apply the adhesive in a plurality of different application patterns;
Die bonder with.

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