JP2012156419A - Alignment device and alignment method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To downsize a device.SOLUTION: An alignment device 10 comprises guide means 16 positioned on the outer side of a semiconductor wafer W and capable of regulating movement in a surface direction; floating means 13 for floating the semiconductor wafer W; rotation force adding means 15 for adding rotation force to the semiconductor wafer W floated by the floating means 13; and positioning means 17 fitted with a V-notch N of the semiconductor wafer W rotated by the rotation force adding means 15 to position the semiconductor wafer W in a rotating direction. By adding the rotation force while the semiconductor wafer W is floated, the need of rotating a large member such as a table for rotating the semiconductor wafer W is eliminated.

Description

  The present invention relates to an alignment apparatus and an alignment method, and more particularly to an alignment apparatus and an alignment method that can position a plate-like member with a simple structure.

  A plate-like member such as a semiconductor wafer (hereinafter sometimes simply referred to as “wafer”) detects a V-notch indicating its center position and crystal orientation when performing various processes, and a predetermined reference position such as the wafer center position. Positioning (alignment) is performed so as to be positioned at a fixed position. An apparatus for performing such alignment is disclosed in, for example, Patent Document 1. The apparatus of the same document includes a rotary stage composed of three arms capable of supporting a wafer, and a drive unit that rotates the rotary stage. By operating the drive unit and rotating the wafer together with the rotary stage, The entire outer edge of the wafer can be detected.

JP 2000-211956 A

  However, in Patent Document 1, it is necessary to rotate the rotary stage together to rotate the wafer. For this reason, the motor that serves as the power source of the driving means, the gear that transmits the power, and the like become large and bulky, which not only increases the size of the entire apparatus but also causes an increase in energy consumption. There is.

[Object of invention]
An object of the present invention is to provide an alignment apparatus and an alignment method capable of reducing the size of the apparatus.

  In order to achieve the above-mentioned object, the present invention is located outside the plate-like member having a concave portion on the outer edge, and guide means capable of restricting the movement of the plate-like member in the surface direction, and levitation for floating the plate-like member. Means, a rotational force imparting means for imparting a rotational force to the plate-like member levitated by the levitating means, and a recess of the plate-like member rotated by the rotational force imparting means so as to fit in the rotational direction of the plate-like member. And a positioning means provided so as to be positioned.

  In this invention, you may take the structure that the said guide means is equipped with the inclination part extended in the direction which leaves | separates from the center of a plate-shaped member by planar view so that it goes to the said floating direction.

  Moreover, the structure that the said rotational force provision means jets gas to the said plate-shaped member and provides rotational force to the said plate-shaped member is also employ | adopted preferably.

  Further, the positioning means may include a rotating roller that contacts the outer edge of the plate-like member.

  Further, the rotational force applying means may include a drive means for rotating the rotating roller.

  Furthermore, it is possible to employ a configuration in which the guide means includes a guide roller that can be rotated by the rotation of the plate-like member.

  The rotational force applying means may include a rotating means that rotationally drives the guide roller.

Furthermore, the alignment method of the present invention includes a step of moving the plate-like member so that the guide means is positioned outward of the plate-like member having a recess on the outer edge;
A step of levitating the plate member;
Applying a rotational force to the plate-like member that has floated;
And a step of positioning the plate-like member in the rotational direction by fitting positioning means into the concave portion of the rotating plate-like member.

  According to the present invention, the rotational force can be applied in a state where the plate-like member is floated, so that it is not necessary to rotate a large member such as a table in accordance with the rotation of the plate-like member. As a result, the power source in the means for applying the rotational force can be reduced as compared with the conventional device, the entire device can be reduced in size, and the energy consumption can be reduced as the power source is reduced in size. Is possible.

  Further, since the inclined portion of the guide means extends in the above-described direction, a gap between the inclined portion and the outer edge of the plate-like member can be set large above the guide means, and the plate-like member can be smoothly rotated. In addition, the gap between the inclined portion and the outer edge of the plate-like member can be reduced or almost eliminated below the guide means, and the plate-like member after the lifting is released can be accurately positioned.

  Furthermore, when gas is blown to the plate-like member and rotated, the number of members that come into contact with the plate-like member for the rotation can be reduced, and the stress applied to the plate-like member can be reduced.

  Moreover, since the positioning means has the rotating roller, it is possible to reduce the resistance that hinders the rotation of the plate-like member. Here, by rotating and driving the rotating roller, a rotating force can be applied to the plate member that has floated, and the function of the rotating force applying unit can be added to the positioning unit.

  Furthermore, since the guide means has a rotatable guide roller, it is possible to reduce the resistance that hinders the rotation of the plate member while restricting the movement of the plate member in the surface direction. Here, by rotating and driving the guide roller, it is possible to apply a rotational force to the floating plate-like member, and it is also possible to provide the function of the rotational force applying means in the guide means.

The schematic plan view of the support apparatus which concerns on embodiment. The partial schematic front view of the said support apparatus. The partial schematic side view of the said support apparatus. (A) is a side view of a positioning means, (B) is explanatory drawing of the fitting state of a positioning means. The schematic front view of the support apparatus which concerns on a modification. The schematic plan view of the support apparatus which concerns on another modification. B arrow sectional drawing which follows the A line of FIG. Furthermore, the partial schematic side view of the support apparatus which concerns on another modification.

Hereinafter, embodiments of the present invention will be described with reference to the drawings.
In this specification, “upper” and “lower” are used with reference to FIG. 2 unless otherwise specified.

  1 and 2, the alignment apparatus 10 includes a support unit 12 that supports a wafer W as a plate-like member having a V notch N as a recess at the outer edge, and a floating unit 13 that floats the wafer W from the support surface 11. Rotational force applying means 15 capable of applying a circumferential rotating force to the wafer W levitated by the levitating means 13, guide means 16 provided at the outer position of the wafer W supported by the supporting means 11, and positioning And means 17.

  The support means 12 includes a base 21 and three support surface forming bodies 22 that form the support surface 11 on the upper surface, and are provided on the base 21 at intervals of about 120 ° in the circumferential direction of the wafer W in plan view. I have. As shown in FIG. 2, a plurality of first holes 25 communicating with the chamber 23 are formed on the upper surface of the base 21. A pressurizing unit such as a pressurizing pump (not shown) is connected to the chamber 23 via a switching valve (not shown), and gas is blown out from the first hole 25 by blowing of gas from the pressurizing unit, and the support surface. 11 is capable of applying a force that causes the wafer W on the surface 11 to float. Second and third holes 26 and 27 arranged in the circumferential direction of the wafer W are respectively formed in the support surface 11 of each support surface forming body 22, and the second and third holes 26 and 27 are also formed in the chamber 23. Communicating with The second hole 26 is provided so that gas can be ejected upward in the vertical direction, and is provided so that the wafer W can float from the support surface 11. The third hole 27 is provided in an obliquely upper left direction in FIG. 3 so that gas can be ejected substantially parallel to a tangent to the outer edge of the wafer W in a plan view, and a rotational force can be applied to the wafer W levitated from the support surface 11. Is provided. Here, the floating means 13 is configured including the chamber 23, the first and second holes 25 and 26, and the pressurizing means, and the rotational force applying means 15 is configured including the chamber 23, the third hole 27, and the pressurizing means. Is done. The system for supplying gas to the third hole 27 and the system for supplying gas to the first and second holes 25 and 26 may be separate systems.

  Each of the guide means 16 is provided on the base 21 so as to be connected to the support surface forming body 22 and to be positioned outside the wafer W on the support surface 11. Each guide means 16 includes an inclined portion 29 at the end on the support surface forming body 22 side, and the inclined portion 29 moves away from the center of the wafer W in a plan view as the wafer W floats upward. Inclined. At the lower end of the inclined portion 29 of each guide means 16, the movement in the surface direction of the wafer W is restricted in contact with the positions of the three outer edges of the wafer W placed on the support surface 11. On the other hand, on the upper end side of the inclined portion 29 of each guide means 16, a gap can be provided between the outer edge of the wafer W, and when the wafer W rotates, the wafer W comes into contact with the guide means 16 and the rotation is obstructed. As much as possible. The inclined portion 29 is provided in a shape having a convex portion 30 that bulges in an arc shape in the center direction of the wafer W on the support surface 11 in a plan view, whereby the area where the wafer W contacts the guide means 16. And the resistance when the rotating wafer W comes into contact with the guide means 16 can be reduced.

  The positioning means 17 is pivotally supported at its upper end side via a bracket (not shown) and swings at its lower end side, and is provided at the lower end side of the support bar 32 so as to come into contact with the outer edge of the wafer W. A roller 33 and a spring member 34 that urges the support shaft 32 in a direction that maintains the state in which the rotating roller 33 is in contact with the outer edge of the wafer W are provided. The rotating roller 33 is provided in a shape and size that can be fitted into the V notch N of the wafer W, and when these are fitted, the rotation in the circumferential direction of the wafer W is restricted and the positioning of the V notch N becomes possible. ing. A sensor 35 is provided in the vicinity of the support bar 32, and this sensor 35 is provided so as to detect the support bar 32 approaching when the rotating roller 33 fits into the V notch N. The rotating roller 33 is provided so as to be rotationally driven by a driving means 36 comprising a motor as a driving device, and a rotational force in the circumferential direction can be applied to the wafer W by the rotation. In this case, in addition to or without the chamber 23, the third hole 27, and the pressurizing unit, the rotational force applying unit 15 can be configured to include the rotating roller 33 and the driving unit 36. If the driving means 36 is not provided, the rotating roller 33 rolls on the outer edge of the rotating wafer W, so that the frictional resistance between them can be suppressed.

  Next, the wafer W alignment method in this embodiment will be described.

  After the wafer W is held by the arm member B1 shown by the two-dot chain line in FIG. 1, the arm member B1 is moved by the operation of a robot arm or the like (not shown), and is transferred so that the wafer W is positioned inside each guide means 16. At this time, as shown in FIG. 2, a gap is left between the lower surface of the wafer W and the support surface 11.

  Subsequently, it controls so that gas may be ejected from a pressurization means via the switching valve which is not shown in figure. Thereafter, when the holding of the wafer W by the arm member B1 is released, the wafer W tries to fall due to its own weight, but the wafer W is urged upward by the ejection of gas from the first and second holes 25, 26, The state where the wafer W is lifted from the support surface 11 is maintained. Further, the rotating roller 33 is pressed against the wafer W with a weak force by the urging force against the spring member 34, and the rotation of the rotating roller 33 by the operation of the driving means 36 and the ejection of gas from the third hole 27 cause the wafer W to rotate. Rotate in the direction. During this rotation, the movement of the wafer W in the surface direction is regulated by each guide means 16 so that the wafer W does not fall off from each support surface 11.

  When the rotation roller 33 is fitted in the V notch N of the wafer W by rotating the wafer W, the rotation of the wafer W is restricted. At this time, the support bar 32 swings to a position indicated by a two-dot chain line in FIG. 4A. This is detected by the sensor 35 and gas from the first to third holes 25 to 27 is detected via a switching valve (not shown). Control to stop the eruption. Then, when the wafer W falls due to its own weight, the wafer W is positioned and landed at a predetermined position on the support surface 11 by the inclined portion 29 of the guide means 16. Then, the wafer W is placed on the support surface 11, and the wafer W is positioned on the lower end side of each guide means 16 so as not to be displaced in the surface direction, thereby completing the alignment. After the alignment is completed, the wafer W is held by the arm member B1 and transferred to the subsequent process. At this time, since the inclined portion 29 is inclined, a gap is generated between the outer edge of the wafer W and the guide member 16, and the wafer W is unloaded. It is easy.

  Therefore, according to such an embodiment, since the wafer W is floated and rotated from the support surface 11, only the wafer W is rotated without rotating the base 21 and the support surface forming body 21 in the support means 11. Is possible. As a result, the power required for rotation can be only blown to the gas from the third hole 27 and the rotation of the rotating roller 33, energy consumption can be reduced, and a large device or power source that can rotate the entire base 21 Can be omitted.

As described above, the best configuration, method and the like for carrying out the present invention have been disclosed in the above description, but the present invention is not limited to this.
In other words, the present invention has been illustrated and described mainly with respect to specific embodiments, but without departing from the scope of the technical idea and object of the present invention, the shape, position, or With respect to the arrangement and the like, those skilled in the art can make various changes as necessary.
Therefore, the description limited to the shape disclosed above is an example for easy understanding of the present invention, and does not limit the present invention. The description by the name of the member which remove | excluded one part or all part is included in this invention.

  The guide means 16 can be variously modified. For example, the inclined portion 29 may be formed by a guide roller 40 as shown in FIG. According to this, even when the wafer W is in contact with the guide means 16 during rotation, the resistance that hinders the rotation of the wafer W can be reduced. Further, when the guide roller 40 is provided so as to be rotationally driven by a driving means 41 including a motor as a driving device, and the rotational force is applied to the wafer W by the rotation, the rotational force is efficiently applied to the wafer W. can do. In this case, in addition to or without at least one of the above-described rotational force applying means 15, the rotational force applying means 15 can be configured to include the guide roller 40 and the driving means 41.

  Further, the support means 12 may omit the support surface forming body 22 and form the upper surface of the base 21 as a support surface for supporting the wafer W, as shown in FIGS. In the drawing, third holes 27 are formed at four positions on the upper surface of the base 21, and are provided so that gas can be ejected through a passage 43 different from the chamber 23.

Further, as shown in FIG. 8, a fourth hole 44 is provided in the support surface 11 so that gas can be ejected from the fourth hole 44 in an obliquely upper right direction in the figure, and gas ejection from the third hole 27 is achieved. A force in the direction opposite to the rotation direction of the wafer W may be applied. At this time, if the gas ejection from the third hole 27 and the fourth hole 44 can be switched via a switching valve (not shown) or the like, the rotation of the wafer W can be braked or the wafer W can be rotated in the reverse direction. You can also. As shown in the figure, the second hole 26, the third hole 27, and the fourth hole 44 may be configured to eject gas from different systems, respectively, or the second hole 26 may be configured to eject the third hole 27 or You may comprise the 4th hole 44 connected like FIG.
The levitation means 13 is not limited in any way as long as the plate-like member can be lifted from the support means 12, and as a gas, in addition to the atmosphere, a gas such as nitrogen or neon or a gas mixture is ejected. In addition, a device that ejects a liquid such as water or a liquefied compound, a static electricity, a magnet, or the like may be employed.
Furthermore, the rotational force imparting means 15 is not limited as long as it can rotate the wafer W, and as the gas, in addition to the air, a gas such as nitrogen or neon or a gas mixture is ejected in addition to the air. You may comprise by what ejects liquids, such as water and a liquefied compound, static electricity, a magnet, etc.
In addition to the V notch N, the concave portion may be other shapes such as a U shape or a concave shape, and it is sufficient if the positioning means 17 can be fitted and positioned in the rotational direction.

  The drive device in the embodiment includes an electric device such as a rotation motor, a linear motion motor, a linear motor, a single-axis robot, and an articulated robot, an actuator such as an air cylinder, a hydraulic cylinder, a rodless cylinder, and a rotary cylinder. In addition to these, a combination of them directly or indirectly may be employed (some of them overlap with those exemplified in the embodiment).

  Further, in the present invention, the plate-like member can be a target of other adherends such as a glass plate, a steel plate, or a resin plate, and the semiconductor wafer may be a silicon semiconductor wafer or a compound semiconductor wafer. Good.

DESCRIPTION OF SYMBOLS 10 Alignment apparatus 13 Levitation means 15 Rotation force provision means 16 Guide means 17 Positioning means 29 Inclination part 33 Rotating roller 36 Driving means 40 Guide roller 41 Driving means NV Notch (concave part)
W Semiconductor wafer (plate-like member)

Claims (8)

  The guide means which is located outside the plate-like member having the concave portion on the outer edge and can regulate the movement of the plate-like member in the surface direction, the levitating means for levitating the plate-like member, and the plate levitated by the levitating means A rotational force applying means for applying a rotational force to the plate-like member, and a positioning means provided so as to fit in a recess of the plate-like member rotated by the rotational force applying means so as to be able to position the plate-like member in the rotation direction. An alignment apparatus characterized by that.   The alignment apparatus according to claim 1, wherein the guide means includes an inclined portion extending in a direction away from the center of the plate-like member in plan view so as to go in the floating direction.   The alignment apparatus according to claim 1, wherein the rotational force applying means jets gas to the plate-like member to apply a rotational force to the plate-like member.   The alignment apparatus according to claim 1, 2 or 3, wherein the positioning means includes a rotating roller in contact with an outer edge of the plate-like member.   The alignment apparatus according to claim 4, wherein the rotational force applying unit includes a driving unit that rotationally drives the rotating roller.   The alignment apparatus according to claim 1, wherein the guide means includes a guide roller that is rotatable by the rotation of the plate-like member.   The alignment apparatus according to claim 6, wherein the rotational force applying unit includes a rotating unit that rotationally drives the guide roller. Moving the plate member so that the guide means is located outside the plate member having a recess on the outer edge;
A step of levitating the plate member;
Applying a rotational force to the plate-like member that has floated;
And a step of positioning the plate-like member in the rotation direction by fitting positioning means into the concave portion of the rotating plate-like member.

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