JP6190679B2 - Substrate holding mechanism and substrate processing apparatus using the same - Google Patents

Description

  The present invention relates to a substrate holding mechanism and a substrate processing apparatus, and more particularly to a substrate holding mechanism capable of moving a substrate to be processed on a stage and a substrate processing apparatus using the substrate holding mechanism.

  For example, in a substrate processing apparatus that places a substrate such as a semiconductor wafer on a rotary stage and supplies the processing liquid to the surface of the substrate to process the substrate, the substrate needs to be held on the rotary stage. As a substrate holding mechanism used in such a case, a so-called vacuum chuck that holds the lower surface of the substrate by vacuum suction or a so-called mechanical chuck that holds the edge of the substrate in between is used. However, when the substrate to be processed is thin, these substrate holding mechanisms may damage the substrate.

  For this reason, gas is blown into the space between the substrate holding part and the substrate, and the substrate is floated by generating a negative pressure in the space between the substrate holding part and the substrate using the Bernoulli effect. A chuck that holds the substrate in a substantially non-contact manner is also used (see Patent Document 1).

JP-A-1-240682

  When processing a substrate by supplying a processing liquid to the surface of the substrate, the processing liquid or the atmosphere of the processing liquid may enter the lower surface side of the substrate and contaminate the substrate. In such a case, for example, when a so-called mechanical chuck that holds and holds the edge of the substrate is used, lower surface cleaning is performed by supplying a cleaning liquid such as pure water to the lower surface of the substrate to clean the lower surface of the substrate. It is running. However, when a chuck that supplies gas to the space between the holding surface of the substrate and the substrate is used, the gas is always supplied to the lower surface side of the substrate. It is impossible to implement.

  For this reason, when this type of chuck is used in a substrate processing apparatus for processing a substrate with a processing liquid, the clearance between the lower surface of the substrate and the surface of the rotary stage is reduced, and the processing liquid is placed on the lower surface side of the substrate. In addition, it is necessary to have a structure in which the atmosphere of the processing solution does not flow around. On the other hand, in the case of adopting such a structure, since the hand portion of the transport mechanism for supporting and transporting the substrate from below cannot enter the lower portion of the substrate, the vicinity of the edge of the substrate is placed on the lower surface thereof. Therefore, it is necessary to employ a lift-up mechanism for raising the substrate upward from the surface of the rotary stage by a plurality of lifting pins supported from above.

  In order to prevent contact between the support pin and the effective use surface of the substrate when the substrate is supported by a plurality of support pins from the lower surface and lifted, a configuration in which the support pin is in contact only with the vicinity of the edge on the lower surface of the substrate is adopted. Is done. When such a configuration is adopted, particularly when a thin substrate is processed, the substrate is deformed into a curved shape due to its own weight and hangs down. When such deformation occurs in the substrate, the substrate may be damaged, or the substrate may come into contact with the hand portion of the transport mechanism when the substrate is transported.

  The present invention has been made to solve the above-described problem, and even when a thin substrate is raised and lowered, the substrate can be prevented from being deformed and the substrate can be accurately transferred to the transport mechanism. It is an object to provide a substrate holding mechanism and a substrate processing apparatus.

The invention according to claim 1 is a substrate holding mechanism for holding a substrate, comprising a stage having an upper surface portion facing the outer peripheral portion of the lower surface of the substrate, and a flat portion facing the center portion of the lower surface of the substrate, A gas outlet is formed in the flat part, and is disposed so as to be movable up and down with respect to the stage. By ejecting gas to the lower surface of the substrate, a negative pressure generated between the substrate and the flat part is utilized. A chuck unit for holding the substrate in a non-contact manner, a plurality of lifting pins that are arranged to be movable up and down with respect to the stage, and that support the vicinity of the edge of the substrate from the lower surface thereof, the chuck unit, and the plurality of the plurality of pins A lifting mechanism that moves the lifting pins in synchronization with each other , and a flat surface facing the entire lower surface of the substrate is formed by the flat surface portion of the chuck portion and the upper surface portion of the stage. Said Further characterized in that it comprises a plurality of support pins for supporting the spaced position from the plane formed planar portion of the click portion and by the upper surface portion of the stage.

According to a second aspect of the present invention, in the first aspect of the present invention, the apparatus further includes a gas outlet for blowing a gas in the vicinity of an edge of the lower surface of the substrate disposed to face the stage.

According to a third aspect of the present invention, in the first or second aspect of the present invention, the plurality of lifting pins include a support portion that contacts the lower surface of the substrate and a guide portion that contacts the edge of the substrate. Prepare.

The invention according to claim 4 is the invention according to any one of claims 1 to 3 , wherein the elevating mechanism includes a connecting part that connects the chuck part and the plurality of elevating pins, and the connecting part. The chuck part and the plurality of lifting pins are moved up and down in synchronization with each other.

According to a fifth aspect of the present invention, there is provided a substrate processing apparatus, the substrate holding mechanism according to any one of the first to fourth aspects, a rotation driving source that rotationally drives the substrate holding mechanism, and the substrate holding And a processing mechanism for performing a predetermined process on the substrate held by the mechanism.

  According to the first aspect of the present invention, since the chuck portion and the lift pins are moved up and down in synchronization, it is possible to prevent the substrate from being deformed even when the thin substrate is moved up and down. For this reason, it becomes possible to accurately deliver the substrate to the transport mechanism.

Further , by arranging the plane formed by the lower surface of the substrate, the flat portion of the chuck portion, and the upper surface of the stage so as to face the lower surface of the substrate, it is possible to prevent the processing liquid and the atmosphere of the processing liquid from entering the substrate lower surface side. It becomes possible.

Furthermore , by supporting the substrate with a plurality of support pins different from the lift pins during substrate processing, the distance between the lower surface of the substrate, the flat surface portion of the chuck portion, and the flat surface formed by the upper surface of the stage can be accurately maintained. It becomes possible.

According to the second aspect of the present invention, the edge of the substrate can be reliably supported by the support pins by the Bernoulli effect caused by the gas blown near the edge of the lower surface of the substrate, and the atmosphere of the processing liquid is on the lower surface side of the substrate. It is possible to more reliably prevent intrusion into the water.

According to the third aspect of the present invention, it is possible to support the substrate and suppress the movement in the horizontal direction by using a plurality of lifting pins.

According to the fourth aspect of the present invention, it is possible to raise and lower the chuck portion and the plurality of elevating pins accurately and synchronously with a simple configuration.

According to the fifth aspect of the present invention, the substrate held by the substrate holding mechanism can be rotated during processing to perform predetermined processing, and when the substrate is transferred, it can be accurately transferred to the transport mechanism. it can.

1 is a schematic side sectional view showing a main part of a substrate processing apparatus according to the present invention. 1 is a schematic side sectional view showing a main part of a substrate processing apparatus according to the present invention. 1 is a schematic side sectional view showing a main part of a substrate processing apparatus according to the present invention. 2 is a plan view of a rotary stage 10. FIG. 2 is a perspective view of a rotary stage 10. FIG. It is explanatory drawing which shows the state which supports the board | substrate 100 with the support pin 25 and the raising / lowering pin 21. FIG.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. 1 to 3 are schematic side sectional views showing the main part of the substrate processing apparatus according to the present invention. Here, FIG. 2 shows the processing state of the substrate 100, FIG. 3 shows the delivery state of the substrate 100, and FIG. 1 shows the state at the time of transition to the processing state shown in FIG. FIG. 4 is a plan view of the rotary stage 10. Further, FIG. 5 is a perspective view of the rotary stage 10.

  This substrate processing apparatus, for example, performs processing using a processing liquid on a thin semiconductor wafer as the substrate 100, and a rotary stage 10 and a hollow motor that is a rotational drive source for rotating the rotary stage 10. 40, a chuck portion 14 and a lifting mechanism 30 for a plurality of lifting pins 21. The rotary stage 10, the hollow motor 40, and the elevating mechanism 30 are disposed in a splash prevention cup for collecting a processing liquid (not shown). In addition, a processing liquid supply nozzle 98 (see FIG. 2) for supplying a processing liquid to the substrate 100 to perform processing moves from the standby position to a position above the substrate 100 above the rotary stage 10. ing. Although not shown in FIG. 2, the processing liquid supply nozzles 98 are arranged in a number corresponding to the type of processing liquid that needs to be supplied to the substrate 100.

  The rotary stage 10 includes a base portion 11 connected to a hollow rotating shaft 41 of the hollow motor 40, a circumferential portion 12 that forms a cylindrical hollow space on the base portion 11, and a part of the upper portion of the hollow space. It is comprised from the upper-surface part 13 which obstruct | occludes a peripheral part. The upper surface portion 13 is provided with a passage hole for the elevating pins 21, and the four elevating pins 21 are disposed so as to be movable up and down with respect to the surface of the upper surface portion 13. A plurality of support pins 25 are fixed on the upper surface portion 13. Further, a chuck portion 14 is disposed at the center of the upper surface portion 13 so as to be movable up and down. The upper surface of the chuck portion 14 is a flat portion, and, as will be described later, when the substrate 100 is supported by the support pins 25, the upper surface of the chuck portion 14 and the upper surface of the upper surface portion 13 of the rotary stage 10 A flat surface facing the entire lower surface of the substrate 100 is formed. That is, the upper surface portion 13 faces the lower surface outer peripheral portion of the substrate 100, and the flat surface portion of the upper surface of the chuck portion 14 faces the lower surface center portion of the substrate 100. Further, a gas ejection port 15 for ejecting nitrogen gas to the lower surface of the substrate 100 is formed at the center of the chuck portion 14.

  Further, on the upper surface portion 13 of the rotary stage 10, a large number of gas ejection ports 16 for ejecting nitrogen gas near the edge of the lower surface of the substrate 100 supported by the support pins 25 are centered on the gas ejection ports 15. Perforated on the circumference.

  FIG. 6 is an explanatory diagram showing a state in which the substrate 100 is supported by the support pins 25 and the lift pins 21. Here, FIG. 6A shows a state in which the substrate 100 is supported by the support pins 25. FIG. 6B shows the positional relationship between the substrate 100 supported by the support pins 25 and the lift pins 21.

  The support pin 25 fixed to the rotary stage 10 includes a support portion 26 for contacting the lower surface of the substrate 100 and supporting the substrate 100. The height H1 of the support portion 26 is 1.5 mm, for example. Further, the distance D from the edge of the substrate 100 at the support position of the lower surface of the substrate 100 by the support unit 26 is set to be within 2.8 mm when the substrate 100 is a semiconductor wafer having a diameter of 200 mm, for example. Has been.

  On the other hand, the lifting pins 21 disposed so as to be movable up and down with respect to the rotary stage 10 are in contact with the lower surface of the substrate 100 to support the substrate 100 and the edge of the substrate 100 is contacted with the substrate 100. 100 is provided with a guide portion 23 for suppressing horizontal movement. The height H2 of the support portion 22 is, for example, 1.0 mm. Further, the distance from the edge of the substrate 100 at the support position of the lower surface of the substrate 100 by the support portion 22 is D as in the case of the support pins 26.

  The four elevating pins 21 are supported and connected by the connecting member 18 inside the hollow space formed in the circumferential portion 12 below the upper surface portion 13 of the rotary stage 10. Further, the chuck portion 14 is connected to a connecting member 18 through a spacer 17. Thereby, the four raising / lowering pins 21 and the chuck | zipper part 14 are connected, and it raises / lowers synchronizing mutually. The connecting member 18 and the spacer 17 together with the chuck portion 14 function as a connecting portion that connects the chuck portion 14 and the four lifting pins 21.

  The elevating mechanism 30 includes an elevating member 31 that can contact the lower surface of the chuck portion 14 and an elevating shaft 32 connected to the elevating member 31. The elevating member 31 and the elevating shaft 32 are formed with a communication hole (not shown) that communicates with the gas ejection port 15 formed in the chuck portion 14. The lifting shaft 32 passes through a hollow portion formed in the base portion 11 of the rotary stage 10 and a hollow portion in the hollow motor 40.

  The lower end portion of the elevating shaft 32 is connected to a linear motion actuator with a guide mechanism constituted by a slider 34 and a ball screw 35 via a connection portion 33. This linear motion actuator with a guide mechanism is sold, for example, under the trade name Monocarrier (registered trademark of NSK Ltd.), and converts the rotational motion of the ball screw 35 into linear motion of the slider 34. It is. The ball screw 35 is connected to the rotating shaft of the motor 38 via the belt 36. A rotary encoder 37 is connected to the motor 38.

  For this reason, the raising / lowering member 31 and the raising / lowering axis | shaft 32 are between the lower position shown in FIG. 1, the intermediate position shown in FIG. 2, and the raising position shown in FIG. 3 by the drive of the motor 38 and control by the rotary encoder 37. It can be moved up and down. Here, the lower position shown in FIG. 1 is a position where the lower surface of the elevating member 31 comes into contact with the connecting member 18 and presses downward, and the lower surface of the connecting member 18 and the upper surface of the base portion 11 of the rotary stage 10 abut. It is. Further, the intermediate position shown in FIG. 2 is a position where the elevating member 31 is separated from the lower surface of the chuck portion 14 constituting the connecting portion together with the connecting member 18 and the spacer 17 and is not in contact with them. . That is, this intermediate position is a separation position. Further, in the ascending position shown in FIG. 3, the upper surface of the elevating member 31 supports the lower surface of the chuck portion 14 that constitutes the connecting portion together with the connecting member 18 and the spacer 17, and the chuck portion 14 and the four elevating pins 21 are arranged. It is a position to raise.

  A magnet 29 is disposed on the connecting member 18 that constitutes the connecting portion together with the chuck portion 14 and the spacer 17. On the other hand, a magnet 19 is disposed on the base portion 11 of the rotary stage 10. The magnet 19 and the magnet 29 are attached so as to exert an electromagnetic attractive force that urges the connecting member 18 and the base portion 11 in a direction to attract each other. In addition, the connection member 18 and the base part 11 are comprised with resin. Here, instead of providing the magnets 19 and 29 on the connecting member 18 and the base portion 11, respectively, a magnet is provided on one side, and a magnetic body such as an iron plate is provided on the other side, whereby the connecting member 18 and the base portion are provided. 11 may be employed which exerts an electromagnetic attractive force that urges 11 in the direction in which they are attracted to each other.

  The substrate processing apparatus includes a pipe line 43 connected to a nitrogen gas supply source 42 via an on-off valve 45 and a pipe line 44 connected via an on-off valve 46. The pipe line 43 is connected to a communication hole formed in the elevating member 31 and the elevating shaft 32 and communicates with the gas ejection port 15 formed in the chuck portion 14 through the communication hole. For this reason, when the on-off valve 45 is opened, nitrogen gas is ejected from the gas ejection port 15. The pipe 44 is connected to a gap formed between the inner wall of the hollow portion formed in the base portion 11 of the rotary stage 10 and the inner wall of the hollow portion of the hollow motor 40 and the outer peripheral portion of the lifting shaft 32. Yes. For this reason, when the on-off valve 46 is opened, it is formed between the inner wall of the hollow portion formed in the base portion 11 of the rotary stage 10 and the inner wall of the hollow portion of the hollow motor 40 and the outer peripheral portion of the lifting shaft 32. Through the gap, nitrogen gas is supplied to a space formed on the base portion 11 by the circumferential portion 12 and the upper surface portion 13 of the rotary stage 10. The nitrogen gas is ejected from a large number of gas ejection ports 16 formed on the upper surface portion 13 of the rotary stage 10.

  Next, a processing operation when the substrate 100 is processed by the substrate processing apparatus having the above configuration will be described.

  In the state at the time of transition shown in FIG. 1, as described above, the elevating member 31 is disposed at the lower position, and the lower surface of the elevating member 31 presses the connecting member 18 downward, The upper surface of the base part 11 in the rotary stage 10 contacts. As a result, the connecting member 18 is not only lowered due to its own weight, but is forcibly pulled down to the lowest position for surely shifting to a processing state described later. At this time, the connecting member 18 and the rotary stage 10 are fixed by the magnet 19 and the magnet 29 as described later. At this time, as shown in FIG. 6, since the height position of the support portion 26 in the support pin 25 is higher than the height position of the support portion 22 in the lift pin 21, the substrate 100 is supported by the plurality of support pins 25. Yes.

  At this time, the on-off valve 45 is opened, and the nitrogen gas supplied from the nitrogen gas supply source 42 passes through the communication hole formed in the elevating member 31 and the elevating shaft 32 from the gas outlet 15 to the substrate 100. Erupted on the lower surface of. On the upper surface of the elevating member 31 and the lower surface of the chuck portion 14, there is a labyrinth structure with unevenness not shown. When the elevating member 31 is at the position shown in FIG. 1 or FIG. 2, the labyrinth structure is completed, and the nitrogen gas is less likely to leak from the gap between them. Thereby, most of the nitrogen gas supplied from the lifting shaft 32 is ejected from the gas ejection port 15 while the lifting member 31 and the chuck portion 14 are not in contact with each other. Then, due to the Bernoulli effect by the nitrogen gas, an action to maintain a certain distance from the substrate 100 with respect to the plane formed by the rotary stage 10 and the chuck portion 14 occurs. Thus, the substrate 100 whose edge portion is supported by the plurality of support pins 25 is supported in a fixed posture without causing drooping or the like and without being separated from the support portion 26 in the support pins 25. .

  When processing the substrate 100 by supplying the processing liquid to the substrate 100, as shown in FIG. 2, the elevating member 31 is raised from the lower position in FIG. At this time, the elevating member 31 is in a position separated from the lower surface of the chuck portion 14 and the upper surface of the connecting member 18, that is, the separated position, and the substrate processing apparatus is in a processing state. At this time, the on-off valve 45 is opened, and the nitrogen gas supplied from the nitrogen gas supply source 42 passes through the communication hole formed in the elevating member 31 and the elevating shaft 32 from the gas outlet 15 to the substrate 100. Erupted on the lower surface of. Further, the on-off valve 46 is opened, and the nitrogen gas supplied from the nitrogen gas supply source 42 is raised and lowered with the inner wall of the hollow space formed in the circumferential portion 12 of the rotary stage 10 and the inner wall of the hollow portion of the hollow motor 40. The gas is ejected from a large number of gas ejection ports 16 formed on the upper surface portion 13 of the rotary stage 10 through gaps formed between the outer periphery of the shaft 32. Then, the rotary stage 10 is rotated by driving the hollow motor 40.

  In this processing state, the substrate 100 is supported by a plurality of support pins 25 as in the transition state shown in FIG. Further, the substrate 100 whose edge portion is supported by the plurality of support pins 25 by the action of nitrogen gas ejected from the gas ejection port 15 to the lower surface of the substrate 100 does not sag, and the support pins 25. Without being separated from the support portion 26 at a constant position. Furthermore, the vicinity of the edge of the substrate 100 is pressed against the support pin 25 by the Bernoulli effect by the nitrogen gas blown from the gas outlet 16 in the rotary stage 10 to the vicinity of the edge of the lower surface of the substrate 100. As a result, the substrate 100 rotating together with the rotary stage 10 can be reliably supported by the support pins 25.

  Further, in this state, since the elevating member 31 is disposed at an intermediate position separated from the lower surface of the chuck portion 14 and the upper surface of the connecting member 18, the connecting portion constituted by the chuck portion 14, the spacer 17, and the connecting member 18. And the elevating member 31 of the elevating mechanism 30 for elevating and lowering these connecting portions are completely separated, that is, not in contact with each other. For this reason, it is possible to reliably prevent the generation of dust accompanying the rotation of the rotary stage 10.

  On the other hand, if the connecting portion composed of the chuck portion 14, the spacer 17 and the connecting member 18 is rotated without being fixed to the base portion 11, there is a possibility that the connecting portion cannot be rotated stably. is there. In particular, since the rotary stage 10 is configured to supply nitrogen gas into the rotary stage 10 in order to eject nitrogen gas from the gas jets 15 and 16, from the chuck portion 14, the spacer 17, and the connecting member 18. There is a possibility that the connecting portion to be configured and the elevating pin 21 connected to the connecting portion will float by the action of nitrogen gas supplied into the rotary stage 10. However, in this substrate processing apparatus, in the transition state shown in FIG. 1, the connecting member 18 is reliably pulled down by the elevating member 31, and the connecting member 18 and the rotary stage 10 constituting the connecting portion are magnetized by the magnet 19 and the magnet 29. The base portion 11 is biased in a direction to attract each other. For this reason, it is possible to prevent the connecting member 18 and the base portion 11 from being separated from each other or to be displaced, and to securely fix the both. Therefore, it becomes possible to rotate the connection part comprised from the chuck | zipper part 14, the spacer 17, and the connection member 18, and the raising / lowering pin 21 connected to this with the stable attitude | position.

  When the substrate 100 rotates together with the rotary stage 10 at a predetermined rotation speed, the processing liquid supply nozzle 98 is moved above the substrate 100, and the processing liquid is supplied from the processing liquid supply nozzle 98 to the surface of the substrate 100. With this processing liquid, necessary processing is performed on the substrate 100. When the processing with the processing liquid on the substrate 100 is completed, the processing liquid remaining on the surface of the substrate 100 is removed by being shaken off from the surface of the substrate 100 by rotating the substrate 100 at a high speed. During the processing of the substrate 100, the processing liquid supplied to the substrate 100 and scattered from the surface of the substrate 100 is collected by a scattering prevention cup (not shown) and then collected by a processing liquid recovery unit.

  During the processing of the substrate 100 with the processing liquid, as described above, nitrogen gas is blown from the gas outlet 16 in the rotary stage 10 to the vicinity of the edge of the lower surface of the substrate 100. Therefore, the action of the nitrogen gas can prevent the processing liquid and the atmosphere of the processing liquid from entering the lower surface of the substrate 100.

When the processing of the substrate 100 with the processing liquid is completed, the substrate 100 is unloaded from the rotary stage 10. In this case, as shown in FIG. 3, the elevating member 31 is moved to the raised position, and the upper surface of the elevating member 31 supports the lower surface of the chuck portion 14 that constitutes the coupling portion together with the coupling member 18 and the spacer 17, The delivery state is such that the chuck portion 14 and the four lifting pins 21 are raised. As a result, the substrate 100 supported by the support portion 26 of the support pin 25 is supported by the support portion 22 of the elevating pin 21.

  At this time, the on-off valve 45 is continuously opened, and the nitrogen gas supplied from the nitrogen gas supply source 42 passes through the communication hole formed in the elevating member 31 and the elevating shaft 32 from the gas outlet 15 to the substrate. It is ejected to the lower surface of 100. Thereby, even when the substrate 100 is raised by the elevating pins 21, the action of nitrogen gas ejected from the chuck portion 14 that rises in synchronization with the elevating pins 21 causes the substrate 100 to face the upper surface of the chuck portion 14. Thus, an effect of maintaining a certain distance occurs. Accordingly, the substrate 100 whose edge portion is supported by the four lifting pins 21 is supported in a fixed posture without causing drooping or the like and without being separated from the support portion 24 of the lifting pins 21. .

  When the substrate 100 is lifted together with the lift pins 21, as shown in FIGS. 3 and 4, the hand portion 99 of the transport mechanism is moved below the substrate 100, and the hand portion 99 is lifted to support the substrate 100. Can be carried out. When the elevating pin 21 is raised, the chuck portion 14 is also raised synchronously. Therefore, the substrate 100 is deformed into a curved shape and does not hang down due to the Bernoulli effect caused by the nitrogen gas ejected from the chuck portion 14. Maintained. For this reason, the board | substrate 100 and the hand part 99 do not contact at the time of penetration | invasion of the downward direction of the board | substrate 100 of the hand part 99. FIG. The term “hang down” as used herein means that the substrate 100 is lifted while being supported only by the lift pins 21 when the thickness of the substrate 100 is thinner than a normal substrate (for example, 725 microns for a wafer having a diameter of 200 mm), for example, 100 to 200 microns. And the center part of the board | substrate 100 which is not supported falls in concave shape by dead weight. In that case, there is a possibility that the substrate 100 and the hand unit 99 may collide and be damaged when the hand unit 99 is inserted below the substrate 100 as shown in FIG.

  In the above description, the operation from the state in which the substrate 100 is carried onto the rotary stage 10 has been described. However, when the substrate 100 is carried onto the rotary stage 10 by the hand unit 99, FIGS. The operation opposite to that at the time of unloading the substrate 100 shown is executed. That is, after unloading the substrate 100 in the delivery state of FIG. 3, the lifting pins 21 remain in the raised state (or, once lowered, the lifting pins 21 are raised again), and the new substrate 100 is moved to the hand unit. 99, and is supported by the lift pins 21, and after the hand portion 99 is retracted, the lift member 31 is lowered to the lower position shown in FIG. The connecting member 18 is securely fixed to the base portion 11.

  In the embodiment described above, the elevating member 31 presses the lower surface of the chuck portion 14 to raise and lower the chuck portion and the four elevating pins 21 synchronously. However, the elevating member 31 lowers the lower surface of the connecting member 18. You may employ | adopt the structure which raises / lowers the chuck | zipper part 14 and the four raising / lowering pins 21 synchronously by pressing. Further, as long as the chuck portion 14 and the lifting pins 21 are lifted and lowered in synchronization, they may be lifted and lowered by a separate drive source.

DESCRIPTION OF SYMBOLS 10 Rotation stage 11 Base part 13 Upper surface part 14 Chuck part 15 Gas outlet 16 Gas outlet 17 Spacer 18 Connecting member 19 Magnet 21 Lifting pin 22 Support part 23 Guide part 25 Support pin 26 Support part 29 Magnet 30 Lifting mechanism 31 Contact Member 32 Elevating shaft 34 Slider 35 Ball screw 37 Rotary encoder 38 Motor 40 Hollow motor 42 Nitrogen gas supply source 45 Open / close valve 46 Open / close valve 98 Treatment liquid supply nozzle 99 Hand part 100 Substrate

Claims (5)

In the substrate holding mechanism for holding the substrate,
A stage having an upper surface facing the outer periphery of the lower surface of the substrate;
By having a flat portion facing the central portion of the lower surface of the substrate, a gas ejection port is formed in the flat portion, arranged to be movable up and down relative to the stage, and by jetting gas to the lower surface of the substrate, A chuck portion for holding the substrate in a non-contact manner using a negative pressure generated between the substrate and the planar portion;
A plurality of elevating pins that are arranged to be movable up and down with respect to the stage and support the vicinity of the edge of the substrate from the lower surface thereof;
An elevating mechanism for elevating and lowering the chuck portion and the plurality of elevating pins synchronously;
Equipped with a,
A flat surface facing the entire lower surface of the substrate is formed by the flat surface portion of the chuck portion and the upper surface portion of the stage,
A substrate holding mechanism , further comprising a plurality of support pins for supporting the substrate at a position where a lower surface thereof is separated from a plane formed by the flat surface portion of the chuck portion and the upper surface portion of the stage . The substrate holding mechanism according to claim 1 ,
A substrate holding mechanism further comprising a gas jet for blowing gas to the vicinity of the edge of the lower surface of the substrate disposed opposite to the stage. The substrate holding mechanism according to claim 1 or 2 ,
The plurality of elevating pins include a support portion that contacts the lower surface of the substrate and a guide portion that contacts the edge of the substrate. The substrate holding mechanism according to any one of claims 1 to 3 ,
The lifting mechanism includes a connecting portion that connects the chuck portion and the plurality of lifting pins, and moves the connecting portion up and down to raise and lower the chuck portion and the plurality of lifting pins synchronously. A substrate holding mechanism according to any one of claims 1 to 4 ,
A rotational drive source for rotationally driving the substrate holding mechanism;
A processing mechanism for performing a predetermined process on the substrate held by the substrate holding mechanism;
A substrate processing apparatus comprising:

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