JP2011202038A - Antistatic agent and application thereof - Google Patents
Antistatic agent and application thereof Download PDFInfo
- Publication number
- JP2011202038A JP2011202038A JP2010071214A JP2010071214A JP2011202038A JP 2011202038 A JP2011202038 A JP 2011202038A JP 2010071214 A JP2010071214 A JP 2010071214A JP 2010071214 A JP2010071214 A JP 2010071214A JP 2011202038 A JP2011202038 A JP 2011202038A
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- JP
- Japan
- Prior art keywords
- group
- resin
- substituted
- unsubstituted
- general formula
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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- 239000002216 antistatic agent Substances 0.000 title claims abstract description 99
- 229920005989 resin Polymers 0.000 claims abstract description 130
- 239000011347 resin Substances 0.000 claims abstract description 130
- 150000001875 compounds Chemical class 0.000 claims abstract description 74
- 238000000576 coating method Methods 0.000 claims abstract description 61
- 239000011248 coating agent Substances 0.000 claims abstract description 58
- 239000000203 mixture Substances 0.000 claims abstract description 39
- 239000002904 solvent Substances 0.000 claims abstract description 37
- 239000002966 varnish Substances 0.000 claims abstract description 22
- 239000011342 resin composition Substances 0.000 claims abstract description 17
- 238000004519 manufacturing process Methods 0.000 claims abstract description 12
- 239000000758 substrate Substances 0.000 claims abstract description 10
- 125000000217 alkyl group Chemical group 0.000 claims description 25
- 125000004432 carbon atom Chemical group C* 0.000 claims description 22
- 125000000623 heterocyclic group Chemical group 0.000 claims description 22
- 150000001768 cations Chemical class 0.000 claims description 21
- 125000003118 aryl group Chemical group 0.000 claims description 20
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 17
- 125000003545 alkoxy group Chemical group 0.000 claims description 14
- 239000007788 liquid Substances 0.000 claims description 12
- 125000003342 alkenyl group Chemical group 0.000 claims description 11
- 125000005843 halogen group Chemical group 0.000 claims description 10
- 125000001820 oxy group Chemical group [*:1]O[*:2] 0.000 claims description 10
- 125000004104 aryloxy group Chemical group 0.000 claims description 9
- 239000003505 polymerization initiator Substances 0.000 claims description 9
- 125000002252 acyl group Chemical group 0.000 claims description 8
- 125000002915 carbonyl group Chemical group [*:2]C([*:1])=O 0.000 claims description 8
- 125000000524 functional group Chemical group 0.000 claims description 7
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 7
- YMWUJEATGCHHMB-UHFFFAOYSA-N Dichloromethane Chemical compound ClCCl YMWUJEATGCHHMB-UHFFFAOYSA-N 0.000 claims description 6
- 229910052799 carbon Inorganic materials 0.000 claims description 6
- 125000000304 alkynyl group Chemical group 0.000 claims description 5
- 125000005708 carbonyloxy group Chemical group [*:2]OC([*:1])=O 0.000 claims description 5
- 229920005992 thermoplastic resin Polymers 0.000 claims description 5
- 125000003277 amino group Chemical group 0.000 claims description 4
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 claims description 4
- 125000004093 cyano group Chemical group *C#N 0.000 claims description 4
- 125000000449 nitro group Chemical group [O-][N+](*)=O 0.000 claims description 4
- 229920001187 thermosetting polymer Polymers 0.000 claims description 4
- 239000003973 paint Substances 0.000 claims 1
- 239000007983 Tris buffer Substances 0.000 abstract description 10
- JRMUNVKIHCOMHV-UHFFFAOYSA-M tetrabutylammonium bromide Chemical compound [Br-].CCCC[N+](CCCC)(CCCC)CCCC JRMUNVKIHCOMHV-UHFFFAOYSA-M 0.000 abstract description 10
- 229910052751 metal Inorganic materials 0.000 abstract description 9
- 239000002184 metal Substances 0.000 abstract description 9
- 229910021645 metal ion Inorganic materials 0.000 abstract description 8
- 150000003839 salts Chemical class 0.000 abstract description 8
- 229910019142 PO4 Inorganic materials 0.000 abstract description 5
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 abstract description 5
- 239000010452 phosphate Substances 0.000 abstract description 5
- 239000000243 solution Substances 0.000 abstract description 5
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 abstract description 2
- 229910052744 lithium Inorganic materials 0.000 abstract description 2
- 238000007493 shaping process Methods 0.000 abstract description 2
- 239000012530 fluid Substances 0.000 abstract 3
- 239000003999 initiator Substances 0.000 abstract 1
- -1 pyrazinium cation Chemical class 0.000 description 175
- 230000015572 biosynthetic process Effects 0.000 description 38
- 238000003786 synthesis reaction Methods 0.000 description 38
- 230000000052 comparative effect Effects 0.000 description 30
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 20
- 238000000034 method Methods 0.000 description 20
- 125000002950 monocyclic group Chemical group 0.000 description 16
- 125000001424 substituent group Chemical group 0.000 description 16
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 15
- 239000000049 pigment Substances 0.000 description 14
- 125000003367 polycyclic group Chemical group 0.000 description 14
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 12
- 239000000178 monomer Substances 0.000 description 11
- 229920000642 polymer Polymers 0.000 description 11
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 9
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 9
- 239000004925 Acrylic resin Substances 0.000 description 8
- LYCAIKOWRPUZTN-UHFFFAOYSA-N ethylene glycol Natural products OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 8
- 239000000463 material Substances 0.000 description 8
- 229910052757 nitrogen Inorganic materials 0.000 description 8
- 238000006116 polymerization reaction Methods 0.000 description 8
- 238000001723 curing Methods 0.000 description 7
- 238000001035 drying Methods 0.000 description 7
- 230000000694 effects Effects 0.000 description 7
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 7
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 7
- ARXJGSRGQADJSQ-UHFFFAOYSA-N 1-methoxypropan-2-ol Chemical compound COCC(C)O ARXJGSRGQADJSQ-UHFFFAOYSA-N 0.000 description 6
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 6
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 6
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 6
- 229920001577 copolymer Polymers 0.000 description 6
- 150000002148 esters Chemical class 0.000 description 6
- 239000003960 organic solvent Substances 0.000 description 6
- 229920001721 polyimide Polymers 0.000 description 6
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 6
- 238000004383 yellowing Methods 0.000 description 6
- 239000002253 acid Substances 0.000 description 5
- 239000000975 dye Substances 0.000 description 5
- 239000010419 fine particle Substances 0.000 description 5
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 5
- 229920000139 polyethylene terephthalate Polymers 0.000 description 5
- 239000005020 polyethylene terephthalate Substances 0.000 description 5
- 239000009719 polyimide resin Substances 0.000 description 5
- 239000000126 substance Substances 0.000 description 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- 229920000180 alkyd Polymers 0.000 description 4
- 125000003236 benzoyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C(*)=O 0.000 description 4
- WERYXYBDKMZEQL-UHFFFAOYSA-N butane-1,4-diol Chemical compound OCCCCO WERYXYBDKMZEQL-UHFFFAOYSA-N 0.000 description 4
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 4
- 239000000428 dust Substances 0.000 description 4
- 229920001971 elastomer Polymers 0.000 description 4
- 238000004898 kneading Methods 0.000 description 4
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 4
- 229910052753 mercury Inorganic materials 0.000 description 4
- 229910001507 metal halide Inorganic materials 0.000 description 4
- 150000005309 metal halides Chemical class 0.000 description 4
- 238000002156 mixing Methods 0.000 description 4
- 238000000465 moulding Methods 0.000 description 4
- SLCVBVWXLSEKPL-UHFFFAOYSA-N neopentyl glycol Chemical compound OCC(C)(C)CO SLCVBVWXLSEKPL-UHFFFAOYSA-N 0.000 description 4
- 125000002347 octyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 4
- 235000006408 oxalic acid Nutrition 0.000 description 4
- OJMIONKXNSYLSR-UHFFFAOYSA-N phosphorous acid Chemical compound OP(O)O OJMIONKXNSYLSR-UHFFFAOYSA-N 0.000 description 4
- 229920006122 polyamide resin Polymers 0.000 description 4
- 229920001225 polyester resin Polymers 0.000 description 4
- 239000004645 polyester resin Substances 0.000 description 4
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 4
- 239000005060 rubber Substances 0.000 description 4
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 3
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 3
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 3
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 description 3
- 239000004962 Polyamide-imide Substances 0.000 description 3
- XBDQKXXYIPTUBI-UHFFFAOYSA-M Propionate Chemical compound CCC([O-])=O XBDQKXXYIPTUBI-UHFFFAOYSA-M 0.000 description 3
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 3
- 150000001450 anions Chemical class 0.000 description 3
- ZYGHJZDHTFUPRJ-UHFFFAOYSA-N benzo-alpha-pyrone Natural products C1=CC=C2OC(=O)C=CC2=C1 ZYGHJZDHTFUPRJ-UHFFFAOYSA-N 0.000 description 3
- 239000012965 benzophenone Substances 0.000 description 3
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical class C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 3
- 150000001721 carbon Chemical group 0.000 description 3
- 239000003054 catalyst Substances 0.000 description 3
- 125000002704 decyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 3
- 125000004386 diacrylate group Chemical group 0.000 description 3
- 235000014113 dietary fatty acids Nutrition 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 238000011156 evaluation Methods 0.000 description 3
- 229930195729 fatty acid Natural products 0.000 description 3
- 239000000194 fatty acid Substances 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 125000004051 hexyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 3
- 229920001903 high density polyethylene Polymers 0.000 description 3
- 239000004700 high-density polyethylene Substances 0.000 description 3
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 3
- 239000003112 inhibitor Substances 0.000 description 3
- ZFSLODLOARCGLH-UHFFFAOYSA-N isocyanuric acid Chemical compound OC1=NC(O)=NC(O)=N1 ZFSLODLOARCGLH-UHFFFAOYSA-N 0.000 description 3
- 150000002576 ketones Chemical class 0.000 description 3
- 229910044991 metal oxide Inorganic materials 0.000 description 3
- 150000004706 metal oxides Chemical class 0.000 description 3
- 150000002739 metals Chemical class 0.000 description 3
- 239000011259 mixed solution Substances 0.000 description 3
- 125000004433 nitrogen atom Chemical group N* 0.000 description 3
- 150000002913 oxalic acids Chemical class 0.000 description 3
- 125000004430 oxygen atom Chemical group O* 0.000 description 3
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 3
- FFZANLXOAFSSGC-UHFFFAOYSA-N phosphide(1-) Chemical compound [P-] FFZANLXOAFSSGC-UHFFFAOYSA-N 0.000 description 3
- 229910052698 phosphorus Inorganic materials 0.000 description 3
- 230000000704 physical effect Effects 0.000 description 3
- 229920002312 polyamide-imide Polymers 0.000 description 3
- 229920000728 polyester Polymers 0.000 description 3
- 229910001414 potassium ion Inorganic materials 0.000 description 3
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 description 3
- 229910001415 sodium ion Inorganic materials 0.000 description 3
- 229910052717 sulfur Inorganic materials 0.000 description 3
- 125000004434 sulfur atom Chemical group 0.000 description 3
- 239000004094 surface-active agent Substances 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- 238000012546 transfer Methods 0.000 description 3
- 238000002834 transmittance Methods 0.000 description 3
- GETQZCLCWQTVFV-UHFFFAOYSA-N trimethylamine Chemical group CN(C)C GETQZCLCWQTVFV-UHFFFAOYSA-N 0.000 description 3
- PUPZLCDOIYMWBV-UHFFFAOYSA-N (+/-)-1,3-Butanediol Chemical compound CC(O)CCO PUPZLCDOIYMWBV-UHFFFAOYSA-N 0.000 description 2
- BUPRYTFTHBNSBD-UHFFFAOYSA-N (2,3,4-tribromophenyl) prop-2-enoate Chemical compound BrC1=CC=C(OC(=O)C=C)C(Br)=C1Br BUPRYTFTHBNSBD-UHFFFAOYSA-N 0.000 description 2
- 0 **C1(*(*)(*)IC(*)(*)C(*)(*)C(*)(*)C1(*)*)[N+]([O-])=O Chemical compound **C1(*(*)(*)IC(*)(*)C(*)(*)C(*)(*)C1(*)*)[N+]([O-])=O 0.000 description 2
- MYWOJODOMFBVCB-UHFFFAOYSA-N 1,2,6-trimethylphenanthrene Chemical compound CC1=CC=C2C3=CC(C)=CC=C3C=CC2=C1C MYWOJODOMFBVCB-UHFFFAOYSA-N 0.000 description 2
- GKQHIYSTBXDYNQ-UHFFFAOYSA-M 1-dodecylpyridin-1-ium;chloride Chemical compound [Cl-].CCCCCCCCCCCC[N+]1=CC=CC=C1 GKQHIYSTBXDYNQ-UHFFFAOYSA-M 0.000 description 2
- SZAQZZKNQILGPU-UHFFFAOYSA-N 2-[1-(2-hydroxy-3,5-dimethylphenyl)-2-methylpropyl]-4,6-dimethylphenol Chemical compound C=1C(C)=CC(C)=C(O)C=1C(C(C)C)C1=CC(C)=CC(C)=C1O SZAQZZKNQILGPU-UHFFFAOYSA-N 0.000 description 2
- HCLJOFJIQIJXHS-UHFFFAOYSA-N 2-[2-[2-(2-prop-2-enoyloxyethoxy)ethoxy]ethoxy]ethyl prop-2-enoate Chemical compound C=CC(=O)OCCOCCOCCOCCOC(=O)C=C HCLJOFJIQIJXHS-UHFFFAOYSA-N 0.000 description 2
- TXBCBTDQIULDIA-UHFFFAOYSA-N 2-[[3-hydroxy-2,2-bis(hydroxymethyl)propoxy]methyl]-2-(hydroxymethyl)propane-1,3-diol Chemical compound OCC(CO)(CO)COCC(CO)(CO)CO TXBCBTDQIULDIA-UHFFFAOYSA-N 0.000 description 2
- GJYCVCVHRSWLNY-UHFFFAOYSA-N 2-butylphenol Chemical compound CCCCC1=CC=CC=C1O GJYCVCVHRSWLNY-UHFFFAOYSA-N 0.000 description 2
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 description 2
- NTKBNCABAMQDIG-UHFFFAOYSA-N 3-butoxypropan-1-ol Chemical compound CCCCOCCCO NTKBNCABAMQDIG-UHFFFAOYSA-N 0.000 description 2
- CDSULTPOCMWJCM-UHFFFAOYSA-N 4h-chromene-2,3-dione Chemical class C1=CC=C2OC(=O)C(=O)CC2=C1 CDSULTPOCMWJCM-UHFFFAOYSA-N 0.000 description 2
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 2
- 229920000178 Acrylic resin Polymers 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 229920002799 BoPET Polymers 0.000 description 2
- NLZUEZXRPGMBCV-UHFFFAOYSA-N Butylhydroxytoluene Chemical compound CC1=CC(C(C)(C)C)=C(O)C(C(C)(C)C)=C1 NLZUEZXRPGMBCV-UHFFFAOYSA-N 0.000 description 2
- FERIUCNNQQJTOY-UHFFFAOYSA-N Butyric acid Chemical compound CCCC(O)=O FERIUCNNQQJTOY-UHFFFAOYSA-N 0.000 description 2
- WCPRVIPJODQTPH-UHFFFAOYSA-N C[O](C1=O)[P](OC2=O)(OC2=O)(OC2=O)(OC2=O)OC1=O Chemical compound C[O](C1=O)[P](OC2=O)(OC2=O)(OC2=O)(OC2=O)OC1=O WCPRVIPJODQTPH-UHFFFAOYSA-N 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- BWGNESOTFCXPMA-UHFFFAOYSA-N Dihydrogen disulfide Chemical compound SS BWGNESOTFCXPMA-UHFFFAOYSA-N 0.000 description 2
- IAZDPXIOMUYVGZ-UHFFFAOYSA-N Dimethylsulphoxide Chemical compound CS(C)=O IAZDPXIOMUYVGZ-UHFFFAOYSA-N 0.000 description 2
- 229920002943 EPDM rubber Polymers 0.000 description 2
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 2
- ZRALSGWEFCBTJO-UHFFFAOYSA-N Guanidine Chemical compound NC(N)=N ZRALSGWEFCBTJO-UHFFFAOYSA-N 0.000 description 2
- 244000043261 Hevea brasiliensis Species 0.000 description 2
- UQSXHKLRYXJYBZ-UHFFFAOYSA-N Iron oxide Chemical compound [Fe]=O UQSXHKLRYXJYBZ-UHFFFAOYSA-N 0.000 description 2
- FFOPEPMHKILNIT-UHFFFAOYSA-N Isopropyl butyrate Chemical compound CCCC(=O)OC(C)C FFOPEPMHKILNIT-UHFFFAOYSA-N 0.000 description 2
- CSNNHWWHGAXBCP-UHFFFAOYSA-L Magnesium sulfate Chemical compound [Mg+2].[O-][S+2]([O-])([O-])[O-] CSNNHWWHGAXBCP-UHFFFAOYSA-L 0.000 description 2
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 2
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 2
- 239000004743 Polypropylene Substances 0.000 description 2
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 2
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 2
- DAKWPKUUDNSNPN-UHFFFAOYSA-N Trimethylolpropane triacrylate Chemical compound C=CC(=O)OCC(CC)(COC(=O)C=C)COC(=O)C=C DAKWPKUUDNSNPN-UHFFFAOYSA-N 0.000 description 2
- 238000003848 UV Light-Curing Methods 0.000 description 2
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 2
- HVVWZTWDBSEWIH-UHFFFAOYSA-N [2-(hydroxymethyl)-3-prop-2-enoyloxy-2-(prop-2-enoyloxymethyl)propyl] prop-2-enoate Chemical compound C=CC(=O)OCC(CO)(COC(=O)C=C)COC(=O)C=C HVVWZTWDBSEWIH-UHFFFAOYSA-N 0.000 description 2
- 125000002777 acetyl group Chemical group [H]C([H])([H])C(*)=O 0.000 description 2
- 125000003668 acetyloxy group Chemical group [H]C([H])([H])C(=O)O[*] 0.000 description 2
- XECAHXYUAAWDEL-UHFFFAOYSA-N acrylonitrile butadiene styrene Chemical compound C=CC=C.C=CC#N.C=CC1=CC=CC=C1 XECAHXYUAAWDEL-UHFFFAOYSA-N 0.000 description 2
- 239000004676 acrylonitrile butadiene styrene Substances 0.000 description 2
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 2
- 125000003647 acryloyl group Chemical group O=C([*])C([H])=C([H])[H] 0.000 description 2
- 150000001412 amines Chemical class 0.000 description 2
- 125000000129 anionic group Chemical group 0.000 description 2
- 229910052787 antimony Inorganic materials 0.000 description 2
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 description 2
- ADCOVFLJGNWWNZ-UHFFFAOYSA-N antimony trioxide Chemical compound O=[Sb]O[Sb]=O ADCOVFLJGNWWNZ-UHFFFAOYSA-N 0.000 description 2
- GHPGOEFPKIHBNM-UHFFFAOYSA-N antimony(3+);oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[Sb+3].[Sb+3] GHPGOEFPKIHBNM-UHFFFAOYSA-N 0.000 description 2
- 239000003963 antioxidant agent Substances 0.000 description 2
- 235000006708 antioxidants Nutrition 0.000 description 2
- 229910052786 argon Inorganic materials 0.000 description 2
- 150000004945 aromatic hydrocarbons Chemical class 0.000 description 2
- 150000008366 benzophenones Chemical class 0.000 description 2
- 239000012964 benzotriazole Substances 0.000 description 2
- 125000001231 benzoyloxy group Chemical group C(C1=CC=CC=C1)(=O)O* 0.000 description 2
- FQUNFJULCYSSOP-UHFFFAOYSA-N bisoctrizole Chemical compound N1=C2C=CC=CC2=NN1C1=CC(C(C)(C)CC(C)(C)C)=CC(CC=2C(=C(C=C(C=2)C(C)(C)CC(C)(C)C)N2N=C3C=CC=CC3=N2)O)=C1O FQUNFJULCYSSOP-UHFFFAOYSA-N 0.000 description 2
- 238000009835 boiling Methods 0.000 description 2
- DKPFZGUDAPQIHT-UHFFFAOYSA-N butyl acetate Chemical compound CCCCOC(C)=O DKPFZGUDAPQIHT-UHFFFAOYSA-N 0.000 description 2
- XUPYJHCZDLZNFP-UHFFFAOYSA-N butyl butanoate Chemical compound CCCCOC(=O)CCC XUPYJHCZDLZNFP-UHFFFAOYSA-N 0.000 description 2
- 125000004744 butyloxycarbonyl group Chemical group 0.000 description 2
- YCIMNLLNPGFGHC-UHFFFAOYSA-N catechol Chemical class OC1=CC=CC=C1O YCIMNLLNPGFGHC-UHFFFAOYSA-N 0.000 description 2
- 125000002091 cationic group Chemical group 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
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- NVKTUNLPFJHLCG-UHFFFAOYSA-N strontium chromate Chemical compound [Sr+2].[O-][Cr]([O-])(=O)=O NVKTUNLPFJHLCG-UHFFFAOYSA-N 0.000 description 1
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- YNHJECZULSZAQK-UHFFFAOYSA-N tetraphenylporphyrin Chemical class C1=CC(C(=C2C=CC(N2)=C(C=2C=CC=CC=2)C=2C=CC(N=2)=C(C=2C=CC=CC=2)C2=CC=C3N2)C=2C=CC=CC=2)=NC1=C3C1=CC=CC=C1 YNHJECZULSZAQK-UHFFFAOYSA-N 0.000 description 1
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- ANRHNWWPFJCPAZ-UHFFFAOYSA-M thionine Chemical class [Cl-].C1=CC(N)=CC2=[S+]C3=CC(N)=CC=C3N=C21 ANRHNWWPFJCPAZ-UHFFFAOYSA-M 0.000 description 1
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- JLGLQAWTXXGVEM-UHFFFAOYSA-N triethylene glycol monomethyl ether Chemical compound COCCOCCOCCO JLGLQAWTXXGVEM-UHFFFAOYSA-N 0.000 description 1
- 125000002023 trifluoromethyl group Chemical group FC(F)(F)* 0.000 description 1
- 125000000026 trimethylsilyl group Chemical group [H]C([H])([H])[Si]([*])(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
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- WRSPWQHUHVRNFV-UHFFFAOYSA-N tris[3,5-di(nonyl)phenyl] phosphite Chemical compound CCCCCCCCCC1=CC(CCCCCCCCC)=CC(OP(OC=2C=C(CCCCCCCCC)C=C(CCCCCCCCC)C=2)OC=2C=C(CCCCCCCCC)C=C(CCCCCCCCC)C=2)=C1 WRSPWQHUHVRNFV-UHFFFAOYSA-N 0.000 description 1
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- 239000010937 tungsten Substances 0.000 description 1
- 239000006097 ultraviolet radiation absorber Substances 0.000 description 1
- 125000003774 valeryl group Chemical group O=C([*])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
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- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
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- 125000005023 xylyl group Chemical group 0.000 description 1
- BOXSVZNGTQTENJ-UHFFFAOYSA-L zinc dibutyldithiocarbamate Chemical compound [Zn+2].CCCCN(C([S-])=S)CCCC.CCCCN(C([S-])=S)CCCC BOXSVZNGTQTENJ-UHFFFAOYSA-L 0.000 description 1
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Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Paints Or Removers (AREA)
Abstract
Description
本発明は帯電防止剤及びその用途に関するものである。 The present invention relates to an antistatic agent and its use.
加工性の高さ、軽量、素材の多様性といった観点から、樹脂は、現代において欠かすことのできない素材の一つとなっている。その一般的な性質として、絶縁性の高さが挙げられる。この特性を利用して、樹脂は、数多くの電子製品、電子部品の絶縁部位として利用されてきた。一方、その絶縁性の高さゆえ、摩擦・剥離などにより容易に帯電するといった問題を抱えている。 From the viewpoint of high processability, light weight, and variety of materials, resin has become one of the materials that are indispensable in modern times. The general property is high insulation. Utilizing this characteristic, resins have been used as insulating sites for many electronic products and electronic parts. On the other hand, because of its high insulating property, it has a problem that it is easily charged by friction and peeling.
帯電した樹脂成形物には、ほこりやゴミが付着するだけでなく、電子製品や電子部品に応用した場合、内装された回路、トランジスタ、IC、CPUなどに悪影響を与え、それらを破損する恐れもある。他にも、人体に電撃を与えたり、可燃性気体や粉塵を扱う場所においては、爆発事故を起こす可能性もある。また、クリーンルームや医療機関等では、チリやホコリが嫌われるため、帯電防止性能を持った内装材が求められている。 Not only dust and debris adhere to the charged resin molding, but when applied to electronic products and electronic components, it may adversely affect the internal circuits, transistors, ICs, CPUs, etc., and may damage them. is there. In addition, there is a possibility of causing an explosion in places where electric shock is given to the human body or where flammable gas or dust is handled. In clean rooms, medical institutions, and the like, dust and dust are disliked, and interior materials having antistatic performance are required.
電子製品や電子部品に用いられる電子材料の分野では、ナトリウムイオンやカリウムイオン等のアルカリ金属イオンやアルカリ土類金属イオンによる汚染が問題視されている。これらイオンが、電子材料に混入することにより、電子製品や電子部品の機能を低下、もしくは破壊するのみでなく、これらに起因した発熱や発火、さらには爆発の危険も含むこととなる。このような観点から、電子製品や電子部品に応用される材料は、金属イオンを含有しないことが望ましいとされている。 In the field of electronic materials used for electronic products and electronic parts, contamination by alkali metal ions such as sodium ions and potassium ions and alkaline earth metal ions is regarded as a problem. When these ions are mixed in the electronic material, not only the function of the electronic product or the electronic component is deteriorated or destroyed, but also there is a risk of heat generation, ignition, and explosion due to these. From such a point of view, it is desirable that materials applied to electronic products and electronic parts do not contain metal ions.
これらの諸問題を解決するために、樹脂には帯電防止剤による処理が行われていることが多い。帯電防止剤による処理は、利用のされ方によって、表面処理と内部処理に大別される。 In order to solve these problems, the resin is often treated with an antistatic agent. Treatment with an antistatic agent is roughly divided into surface treatment and internal treatment depending on how it is used.
表面処理とは、樹脂成形物の表面に対して、塗布・浸漬・吹きつけなどの手法を用いて帯電防止剤を塗布するものである。水溶性界面活性剤等がその代表であるが、時間がたつとともにその帯電防止能が低下するといった欠点を持つ。 In the surface treatment, an antistatic agent is applied to the surface of a resin molding using a technique such as application, immersion, or spraying. A typical example is a water-soluble surfactant, but it has a drawback that its antistatic ability decreases with time.
内部処理とは、樹脂成形時に高分子中に帯電防止剤を添加する手法である。この手法における代表的な帯電防止剤としては、導電性微粒子や界面活性剤が挙げられる。 The internal treatment is a technique of adding an antistatic agent to the polymer during resin molding. Representative antistatic agents in this technique include conductive fine particles and surfactants.
導電性微粒子としては、金属粉、ITOやATOといった金属酸化物微粒子さらにはカーボン等が挙げられるが、これらの材料を用いて樹脂に帯電防止能を付与するには、かなりの量を添加しなくてはいけなく、更にはこれらを均一に分散させる高度な技術が必要になる。また、その添加量の多さゆえ、本来の樹脂物性に大きな影響を与えてしまう。 Examples of the conductive fine particles include metal powder, metal oxide fine particles such as ITO and ATO, and carbon. However, in order to impart antistatic ability to the resin using these materials, a considerable amount is not added. In addition, advanced technology is required to uniformly disperse them. Further, due to the large amount of addition, the original physical properties of the resin are greatly affected.
更に、金属酸化物微粒子の中には、アンチモンやインジウムといった金属を含むものが多い。中でも、アンチモン等の重金属は、廃棄時に大きな問題を抱え、人の健康及び環境安全性も懸念されている。更に、インジウム等の貴金属は、その枯渇問題や価格の高さが問題となっている。 Furthermore, many metal oxide fine particles contain metals such as antimony and indium. Among them, heavy metals such as antimony have a big problem at the time of disposal, and there are concerns about human health and environmental safety. Furthermore, noble metals such as indium have problems of depletion and high price.
界面活性剤としては、アニオン系・カチオン系・ノニオン系等のものがあり、安価なため、様々な用途で利用されている。しかし、それらが樹脂表面からブリードを起こし、周囲を汚染するといった問題も抱えている。加えて、アニオン系では、高分子に対しての相溶性に欠け、均一分散が困難であり耐熱性も低い、カチオン系では、帯電防止性は問題ないが、熱的安定性が低い、ノニオン系では、高分子への相溶性が低いなどの問題を持つ。 Surfactants include anionic, cationic, and nonionic surfactants, which are inexpensive and are used in various applications. However, they also have the problem of causing bleeding from the resin surface and contaminating the surroundings. In addition, anionic systems lack compatibility with polymers, are difficult to disperse uniformly, and have low heat resistance. Cationic systems have no problem with antistatic properties, but have low thermal stability. However, there are problems such as low compatibility with polymers.
また、ナトリウムイオンやカリウムイオンなどの金属イオンを有する帯電防止剤は、高分子や有機溶剤への相溶性が低く、容易に変色することが大きな問題となっている。 In addition, an antistatic agent having a metal ion such as sodium ion or potassium ion has a low compatibility with a polymer or an organic solvent, and is easily discolored.
さらに、これらの材料においては、周囲の環境による性能への影響が大きい。とりわけ、湿度の影響が大きいとされる。一般的には、湿度の高い条件下では、帯電防止効果を発揮するが、湿度が低くなるとその効果が薄れ、最終的には全く機能しなくなることもある。 Furthermore, in these materials, the influence on the performance by the surrounding environment is large. In particular, it is said that the influence of humidity is great. In general, the antistatic effect is exhibited under high humidity conditions, but when the humidity is low, the effect diminishes and eventually may not function at all.
また、無色で透明性の高い樹脂と組み合わせた場合には、その特徴を失わないよう、帯電防止剤にも高い無色透明性が要求される。あまり無色透明性を要しない用途であったとしても、意匠上の問題等から、無色透明性が高いことが望まれる。 In addition, when combined with a colorless and highly transparent resin, the antistatic agent is also required to have high colorless transparency so as not to lose its characteristics. Even if it is an application that does not require so much colorless transparency, it is desired that the colorless transparency is high due to problems in design and the like.
市場では、これらの諸問題を総合的に解決しうる帯電防止剤が求められている。すなわち、高い帯電防止能のみならず、無色透明性・樹脂や溶剤への溶解性(相溶性)・耐熱性・耐湿性を併せ持ち、金属や金属イオンを含まない帯電防止剤が求められている。 In the market, an antistatic agent capable of comprehensively solving these problems is demanded. That is, there is a demand for an antistatic agent that has not only high antistatic ability, but also colorless transparency, solubility in resins and solvents (compatibility), heat resistance, and moisture resistance, and does not contain metals or metal ions.
また、近年新規イオン性材料として、トリス(オキサラト)ホスフェートが報告されている。しかし、ナトリウムイオンやカリウムイオンなどの金属イオンを有する材料のみの報告であり、かつ、帯電防止剤としての特性については、一切触れられていない。 In recent years, tris (oxalato) phosphate has been reported as a novel ionic material. However, only materials having metal ions such as sodium ions and potassium ions are reported, and the properties as antistatic agents are not mentioned at all.
本発明の目的は、高い帯電防止能のみならず、無色透明性・樹脂や溶剤への溶解性(相溶性)・耐熱性・耐湿性を併せ持ち、金属や金属イオンを含まない帯電防止剤を提供することにある。また、本発明の他の目的は、前記帯電防止剤を用いた樹脂組成物、樹脂ワニス、重合性組成物、及び塗液、並びにこれらを用いた帯電防止能を有する樹脂造形品の製造方法を提供することにある。さらに、本発明の他の目的は、帯電防止能を有する樹脂造形品を提供することにある。 The object of the present invention is to provide an antistatic agent that has not only high antistatic ability, but also colorless transparency, solubility in resins and solvents (compatibility), heat resistance, and moisture resistance, and does not contain metals or metal ions. There is to do. Another object of the present invention is to provide a resin composition, a resin varnish, a polymerizable composition, a coating liquid using the antistatic agent, and a method for producing a resin shaped article having antistatic ability using these. It is to provide. Furthermore, the other object of this invention is to provide the resin molded article which has antistatic ability.
本発明者らは、上記の諸問題点を考慮し解決すべく鋭意研究を重ねた結果、本発明に至った。すなわち本発明は、下記一般式(1)で表される化合物からなる帯電防止剤に関する。 As a result of intensive studies to solve the above problems in consideration of the above problems, the present inventors have reached the present invention. That is, the present invention relates to an antistatic agent comprising a compound represented by the following general formula (1).
一般式(1)
(式中、X+はオニウムカチオンを表す。) (In the formula, X + represents an onium cation.)
また本発明は、一般式(1)のX+が、下記一般式(2)〜一般式(8)で表されるオニウムカチオンである、上記記載の帯電防止剤に関する。 The present invention also relates to the above-described antistatic agent, wherein X + in the general formula (1) is an onium cation represented by the following general formulas (2) to (8).
一般式(2)
一般式(3)
一般式(4)
一般式(5)
一般式(6)
一般式(7)
一般式(8)
(式中、R01〜R04は、それぞれ独立に、水素原子、置換もしくは未置換のアルキル基、置換もしくは未置換のアルケニル基、置換もしくは未置換のアリール基、置換もしくは未置換の複素環基、置換もしくは未置換のアルキルオキシ基、置換もしくは未置換のアリールオキシ基、置換もしくは未置換の複素環オキシ基、置換もしくは未置換のアシル基、置換もしくは未置換のカルボニルオキシ基、またはハロゲン原子より選ばれる基を表す。
また、R01とR02、R02とR03、R03とR04、もしくはR01 とR04は、互いに結合して環構造を形成していてもよい。
R05〜R15およびR18〜R20は、それぞれ独立に、水素原子、ハロゲン原子、水酸基、カルボキシル基、シアノ基、ニトロ基、アミノ基、置換もしくは未置換のアルキルオキシ基、置換もしくは未置換のアルキル基、置換もしくは未置換のアルケニル基、置換もしくは未置換のアルキニル基、置換もしくは未置換のアリール基、置換もしくは未置換の複素環基または、置換もしくは未置換のアシル基を表す。
また、隣接するR05〜R15およびR18〜R20は、互いに結合して環を形成してもよい。
R16およびR17は、それぞれ独立に、水素原子、置換もしくは未置換のアルキル基、置換もしくは未置換のアルケニル基、置換もしくは未置換のアリール基、または、置換もしくは未置換の複素環基を表す。
R21〜R24は、それぞれ独立に、水素原子、置換もしくは未置換のアルキル基、または、置換もしくは未置換のアリール基を表す。
R25〜R42は、それぞれ独立に、水素原子、ハロゲン原子、水酸基、置換もしくは未置換のアルキル基、置換もしくは未置換のアリール基、置換もしくは未置換の複素環基、置換もしくは未置換のアルキルオキシ基、置換もしくは未置換のアリールオキシ基、または、置換もしくは未置換の複素環オキシ基を表すか、R25とR26、R27とR28、R29とR30、R31とR32、R33とR34、R35とR36、R37とR38、R39とR40、もしくはR41とR42のいずれかが一体となり、結合する炭素原子と共に、カルボニル基(C=O)を表わす。
また、R21とR25、R25とR27、R27とR29、R29とR31、R23とR33、R33とR35、R35とR37、R37とR39、もしくはR39とR41は、互いに結合して環構造を形成していてもよい。)
Wherein R 01 to R 04 are each independently a hydrogen atom, a substituted or unsubstituted alkyl group, a substituted or unsubstituted alkenyl group, a substituted or unsubstituted aryl group, a substituted or unsubstituted heterocyclic group A substituted or unsubstituted alkyloxy group, a substituted or unsubstituted aryloxy group, a substituted or unsubstituted heterocyclic oxy group, a substituted or unsubstituted acyl group, a substituted or unsubstituted carbonyloxy group, or a halogen atom Represents a selected group.
Also, R 01 and R 02 , R 02 and R 03 , R 03 and R 04 , or R 01 And R 04 may be bonded to each other to form a ring structure.
R 05 to R 15 and R 18 to R 20 are each independently a hydrogen atom, a halogen atom, a hydroxyl group, a carboxyl group, a cyano group, a nitro group, an amino group, a substituted or unsubstituted alkyloxy group, a substituted or unsubstituted group. An alkyl group, a substituted or unsubstituted alkenyl group, a substituted or unsubstituted alkynyl group, a substituted or unsubstituted aryl group, a substituted or unsubstituted heterocyclic group, or a substituted or unsubstituted acyl group.
Adjacent R 05 to R 15 and R 18 to R 20 may be bonded to each other to form a ring.
R 16 and R 17 each independently represents a hydrogen atom, a substituted or unsubstituted alkyl group, a substituted or unsubstituted alkenyl group, a substituted or unsubstituted aryl group, or a substituted or unsubstituted heterocyclic group .
R 21 to R 24 each independently represents a hydrogen atom, a substituted or unsubstituted alkyl group, or a substituted or unsubstituted aryl group.
R 25 to R 42 each independently represent a hydrogen atom, a halogen atom, a hydroxyl group, a substituted or unsubstituted alkyl group, a substituted or unsubstituted aryl group, a substituted or unsubstituted heterocyclic group, a substituted or unsubstituted alkyl Represents an oxy group, a substituted or unsubstituted aryloxy group, or a substituted or unsubstituted heterocyclic oxy group; R 25 and R 26 , R 27 and R 28 , R 29 and R 30 , R 31 and R 32 , R 33 and R 34 , R 35 and R 36 , R 37 and R 38 , R 39 and R 40 , or R 41 and R 42 are combined, and together with the carbon atom to be bonded, a carbonyl group (C═O ).
R 21 and R 25 , R 25 and R 27 , R 27 and R 29 , R 29 and R 31 , R 23 and R 33 , R 33 and R 35 , R 35 and R 37 , R 37 and R 39 , Alternatively, R 39 and R 41 may be bonded to each other to form a ring structure. )
また本発明は、樹脂と、前記帯電防止剤とを含んでなる樹脂組成物に関する。 The present invention also relates to a resin composition comprising a resin and the antistatic agent.
また本発明は、樹脂と、前記帯電防止剤とを含んでなる樹脂組成物に関する。好ましくは、樹脂は熱可塑性樹脂および/または熱硬化性樹脂である。 The present invention also relates to a resin composition comprising a resin and the antistatic agent. Preferably, the resin is a thermoplastic resin and / or a thermosetting resin.
また本発明は、、前記樹脂組成物と、溶剤とを含んでなる樹脂ワニスに関する。 The present invention also relates to a resin varnish comprising the resin composition and a solvent.
また本発明は、重合性官能基を有する化合物と、重合開始剤と、前記帯電防止剤とを含んでなる重合性組成物に関する。さらに本発明は、前記重合性組成物を、光照射することにより硬化させる、帯電防止能を有する樹脂硬化物の製造方法、及び、前記製造方法で製造された、帯電防止能を有する樹脂硬化物に関する。 The present invention also relates to a polymerizable composition comprising a compound having a polymerizable functional group, a polymerization initiator, and the antistatic agent. Furthermore, the present invention provides a method for producing a cured resin having an antistatic ability, wherein the polymerizable composition is cured by light irradiation, and a cured resin having an antistatic ability produced by the production method. About.
また本発明は、溶剤と、帯電防止剤とを含んでなる塗液に関する。さらに本発明は、前記塗液を樹脂造形品に塗布する、帯電防止能を有する樹脂造形品の製造方法、及び、前記製造方法で製造された、帯電防止能を有する樹脂造形品に関する。 The present invention also relates to a coating liquid comprising a solvent and an antistatic agent. Furthermore, the present invention relates to a method for producing a resin shaped article having an antistatic ability, in which the coating liquid is applied to a resin shaped article, and a resin shaped article having an antistatic ability, which is produced by the production method.
また本発明は、前記樹脂組成物、前記樹脂ワニス、又は前記重合性組成物を用いて造形された、帯電防止能を有する樹脂造形品に関する。 Moreover, this invention relates to the resin molded article which has the antistatic ability modeled using the said resin composition, the said resin varnish, or the said polymeric composition.
また本発明は、前記樹脂組成物、前記樹脂ワニス、前記重合性組成物、又は前記塗液を用いて造形された、帯電防止能を有する塗膜に関する。 Moreover, this invention relates to the coating film which has the antistatic ability shape | molded using the said resin composition, the said resin varnish, the said polymeric composition, or the said coating liquid.
また本発明は、前記塗膜を基板表面に設けた、帯電防止能を有する樹脂造形品に関する。 The present invention also relates to a resin molded article having an antistatic ability, wherein the coating film is provided on the substrate surface.
本発明によれば、高い帯電防止能のみならず、透明性・樹脂や溶剤への溶解性(相溶性)・耐熱性を併せ持つ、帯電防止剤を提供することが可能となる。 According to the present invention, it is possible to provide an antistatic agent having not only high antistatic ability, but also transparency, solubility in a resin or solvent (compatibility), and heat resistance.
以下、詳細にわたって本発明の実施形態を説明する。 Hereinafter, embodiments of the present invention will be described in detail.
まず初めに、本発明で用いられる帯電防止剤について説明する。本発明で用いられる帯電防止剤は、下記一般式(1)で表される塩であり、シュウ酸が3つ配位したリンアニオンとオニウムカチオンとからなる基本構造を有することを特徴とする。これらの特定の有機イオンを組み合わせた基本構造を有することにより、高い帯電防止能のみならず、透明性樹脂や溶剤への溶解性(相溶性)や耐熱性を付与することが可能となっており、その特性を阻害しない範囲において、分子内に適当な置換基を導入して、併用する樹脂や溶剤に対する溶解性(相溶性)を調整して用いることが可能である。 First, the antistatic agent used in the present invention will be described. The antistatic agent used in the present invention is a salt represented by the following general formula (1) and is characterized by having a basic structure composed of a phosphorus anion coordinated with three oxalic acids and an onium cation. By having a basic structure combining these specific organic ions, it is possible to provide not only high antistatic properties, but also solubility (compatibility) and heat resistance in transparent resins and solvents. As long as the properties are not impaired, an appropriate substituent can be introduced into the molecule to adjust the solubility (compatibility) in the resin or solvent used in combination.
一般式(1)
(式中、X+はオニウムカチオンを表す。) (In the formula, X + represents an onium cation.)
一般式(1)中のX+について説明する。 X + in general formula (1) will be described.
一般式(1)中のX+は、オニウムカチオンを表す。具体例としては、アンモニウムカチオン、ホスホニウムカチオン、ピリジニウムカチオン、ピラジニウムカチオン、イミダゾリウムカチオン、ピペリジニウムカチオン、ピロリジニウムカチオン、オキソニウムカチオン、ヨードニウムカチオン、スルホニウムカチオン、スルホキソニウムカチオン、ピロリン骨格を有するカチオン、ピロール骨格を有するカチオン、テトラヒドロピリミジニウムカチオン、ジヒドロピリミジニウムカチオン、ピラゾリウムカチオン、ピラゾリニウムカチオン、アミジニウムカチオン、オキサゾリウムカチオン、イソオキサゾリウムカチオン、ベンゾオキサゾリウムカチオン、チアゾリウムカチオン、イソチアゾリウムカチオン、ベンゾチアゾリウムカチオン、ピリミジニウムカチオン、ピリダジニウムカチオン等を挙げることができるが、これらに限定されるものではない。 X + in the general formula (1) represents an onium cation. Specific examples include ammonium cation, phosphonium cation, pyridinium cation, pyrazinium cation, imidazolium cation, piperidinium cation, pyrrolidinium cation, oxonium cation, iodonium cation, sulfonium cation, sulfoxonium cation, and pyrroline skeleton. Cation having pyrrole skeleton, tetrahydropyrimidinium cation, dihydropyrimidinium cation, pyrazolium cation, pyrazolinium cation, amidinium cation, oxazolium cation, isoxazolium cation, benzoxa Zolium cation, thiazolium cation, isothiazolium cation, benzothiazolium cation, pyrimidinium cation, pyridazinium cation Although and the like, but is not limited thereto.
一般式(1)中のオニウムカチオンX+として好ましい構造としては、一般式(2)〜一般式(8)で表されるオニウムカチオンをあげることができる。 Preferred structures for the onium cation X + in the general formula (1) include onium cations represented by the general formulas (2) to (8).
一般式(2)
一般式(3)
一般式(4)
一般式(5)
一般式(6)
一般式(7)
一般式(8)
(式中、R01〜R04は、それぞれ独立に、水素原子、置換もしくは未置換のアルキル基、置換もしくは未置換のアルケニル基、置換もしくは未置換のアリール基、置換もしくは未置換の複素環基、置換もしくは未置換のアルキルオキシ基、置換もしくは未置換のアリールオキシ基、置換もしくは未置換の複素環オキシ基、置換もしくは未置換のアシル基、置換もしくは未置換のカルボニルオキシ基、またはハロゲン原子より選ばれる基を表す。また、R01とR02、R02とR03、R03とR04、もしくはR01 とR04は、互いに結合して環構造を形成していてもよい。
R05〜R15およびR18〜R20は、それぞれ独立に、水素原子、ハロゲン原子、水酸基、カルボキシル基、シアノ基、ニトロ基、アミノ基、置換もしくは未置換のアルキルオキシ基、置換もしくは未置換のアルキル基、置換もしくは未置換のアルケニル基、置換もしくは未置換のアルキニル基、置換もしくは未置換のアリール基、置換もしくは未置換の複素環基または、置換もしくは未置換のアシル基を表す。また、隣接するR05〜R15およびR18〜R20は、互いに結合して環を形成してもよい。
R16およびR17は、それぞれ独立に、水素原子、置換もしくは未置換のアルキル基、置換もしくは未置換のアルケニル基、置換もしくは未置換のアリール基、または、置換もしくは未置換の複素環基を表す。
R21〜R24は、それぞれ独立に、水素原子、置換もしくは未置換のアルキル基、または、置換もしくは未置換のアリール基を表す。
R25〜R42は、それぞれ独立に、水素原子、ハロゲン原子、水酸基、置換もしくは未置換のアルキル基、置換もしくは未置換のアリール基、置換もしくは未置換の複素環基、置換もしくは未置換のアルキルオキシ基、置換もしくは未置換のアリールオキシ基、または、置換もしくは未置換の複素環オキシ基を表すか、R25とR26、R27とR28、R29とR30、R31とR32、R33とR34、R35とR36、R37とR38、R39とR40、もしくはR41とR42のいずれかが一体となり、結合する炭素原子と共に、カルボニル基(C=O)を表わす。また、R21とR25、R25とR27、R27とR29、R29とR31、R23とR33、R33とR35、R35とR37、R37とR39、もしくはR39とR41は、互いに結合して環構造を形成していてもよい。)
Wherein R 01 to R 04 are each independently a hydrogen atom, a substituted or unsubstituted alkyl group, a substituted or unsubstituted alkenyl group, a substituted or unsubstituted aryl group, a substituted or unsubstituted heterocyclic group A substituted or unsubstituted alkyloxy group, a substituted or unsubstituted aryloxy group, a substituted or unsubstituted heterocyclic oxy group, a substituted or unsubstituted acyl group, a substituted or unsubstituted carbonyloxy group, or a halogen atom Represents a selected group, R 01 and R 02 , R 02 and R 03 , R 03 and R 04 , or R 01 And R 04 may be bonded to each other to form a ring structure.
R 05 to R 15 and R 18 to R 20 are each independently a hydrogen atom, a halogen atom, a hydroxyl group, a carboxyl group, a cyano group, a nitro group, an amino group, a substituted or unsubstituted alkyloxy group, a substituted or unsubstituted group. An alkyl group, a substituted or unsubstituted alkenyl group, a substituted or unsubstituted alkynyl group, a substituted or unsubstituted aryl group, a substituted or unsubstituted heterocyclic group, or a substituted or unsubstituted acyl group. Adjacent R 05 to R 15 and R 18 to R 20 may be bonded to each other to form a ring.
R 16 and R 17 each independently represents a hydrogen atom, a substituted or unsubstituted alkyl group, a substituted or unsubstituted alkenyl group, a substituted or unsubstituted aryl group, or a substituted or unsubstituted heterocyclic group .
R 21 to R 24 each independently represents a hydrogen atom, a substituted or unsubstituted alkyl group, or a substituted or unsubstituted aryl group.
R 25 to R 42 each independently represent a hydrogen atom, a halogen atom, a hydroxyl group, a substituted or unsubstituted alkyl group, a substituted or unsubstituted aryl group, a substituted or unsubstituted heterocyclic group, a substituted or unsubstituted alkyl Represents an oxy group, a substituted or unsubstituted aryloxy group, or a substituted or unsubstituted heterocyclic oxy group; R 25 and R 26 , R 27 and R 28 , R 29 and R 30 , R 31 and R 32 , R 33 and R 34 , R 35 and R 36 , R 37 and R 38 , R 39 and R 40 , or R 41 and R 42 are combined, and together with the carbon atom to be bonded, a carbonyl group (C═O ). R 21 and R 25 , R 25 and R 27 , R 27 and R 29 , R 29 and R 31 , R 23 and R 33 , R 33 and R 35 , R 35 and R 37 , R 37 and R 39 , Alternatively, R 39 and R 41 may be bonded to each other to form a ring structure. )
一般式(2)〜一般式(8)で表されるオニウムカチオンは、透明性・樹脂や溶剤への溶解性(相溶性)や、帯電防止機能の向上の面から好ましい。 The onium cation represented by the general formula (2) to the general formula (8) is preferable in terms of transparency, solubility in a resin or a solvent (compatibility), and improvement of the antistatic function.
この内、合成の容易さ、原料の入手のしやすさから、より好ましいオニウムカチオンの構造としては、一般式(2)、一般式(4)、一般式(6)で表されるオニウムカチオンがあげられる。 Among these, the onium cation represented by the general formula (2), the general formula (4), or the general formula (6) is more preferable as the structure of the onium cation because of the ease of synthesis and the availability of raw materials. can give.
一般式(2)〜一般式(8)中の置換基について説明する。 The substituents in the general formulas (2) to (8) will be described.
一般式(2)〜一般式(8)中の置換基R01〜R42における、置換もしくは未置換のアルキル基としては、炭素数1〜30の直鎖状、分岐鎖状、単環状または縮合多環状アルキル基、または炭素数2〜30であり場合により1個以上のエーテル結合で中断されている直鎖状、分岐鎖状、単環状または縮合多環状アルキル基が挙げられる。炭素数1〜30の直鎖状、分岐鎖状、単環状または縮合多環状アルキル基の具体例としては、メチル基、エチル基、プロピル基、ブチル基、ペンチル基、ヘキシル基、ヘプチル基、オクチル基、ノニル基、デシル基、ドデシル基、オクタデシル基、イソプロピル基、イソブチル基、イソペンチル基、sec−ブチル基、tert−ブチル基、sec−ペンチル基、tert−ペンチル基、tert−オクチル基、ネオペンチル基、シクロプロピル基、シクロブチル基、シクロペンチル基、シクロヘキシル基、アダマンチル基、ノルボルニル基、ボロニル基、4−デシルシクロヘキシル基等を挙げることができるが、これらに限定されるものではない。また、炭素数2〜30であり場合により1個以上のエーテル結合により中断されている直鎖状、分岐鎖状アルキル基の具体例としては、−CH2−O−CH3、−CH2−CH2−O−CH2−CH3、−CH2−CH2−CH2−O−CH2−CH3、−(CH2−CH2−O)n−CH3(ここでnは1から8である)、−(CH2−CH2−CH2−O)m−CH3(ここでmは1から5である)、−CH2−CH(CH3)−O−CH2−CH3−、−CH2−CH−(OCH3)2等を挙げることができるが、これらに限定されるものではない。 The substituted or unsubstituted alkyl group in the substituents R 01 to R 42 in the general formula (2) to the general formula (8) is linear, branched, monocyclic or condensed having 1 to 30 carbon atoms. Examples include polycyclic alkyl groups, and linear, branched, monocyclic or condensed polycyclic alkyl groups having 2 to 30 carbon atoms and optionally interrupted by one or more ether bonds. Specific examples of the linear, branched, monocyclic or condensed polycyclic alkyl group having 1 to 30 carbon atoms include methyl group, ethyl group, propyl group, butyl group, pentyl group, hexyl group, heptyl group, octyl group. Group, nonyl group, decyl group, dodecyl group, octadecyl group, isopropyl group, isobutyl group, isopentyl group, sec-butyl group, tert-butyl group, sec-pentyl group, tert-pentyl group, tert-octyl group, neopentyl group , Cyclopropyl group, cyclobutyl group, cyclopentyl group, cyclohexyl group, adamantyl group, norbornyl group, boronyl group, 4-decylcyclohexyl group and the like, but are not limited thereto. Specific examples of the linear or branched alkyl group having 2 to 30 carbon atoms and optionally interrupted by one or more ether bonds include —CH 2 —O—CH 3 , —CH 2 —. CH 2 —O—CH 2 —CH 3 , —CH 2 —CH 2 —CH 2 —O—CH 2 —CH 3 , — (CH 2 —CH 2 —O) n —CH 3 (where n is from 1) 8), — (CH 2 —CH 2 —CH 2 —O) m —CH 3 (where m is from 1 to 5), —CH 2 —CH (CH 3 ) —O—CH 2 —CH. 3— , —CH 2 —CH— (OCH 3 ) 2 and the like can be mentioned, but are not limited thereto.
炭素数2〜30であり場合により1個以上のエーテル結合により中断されている単環状または縮合多環状アルキル基の具体例としては、以下のようなものを挙げることができるが、これらに限定されるものではない。 Specific examples of the monocyclic or condensed polycyclic alkyl group having 2 to 30 carbon atoms and optionally interrupted by one or more ether bonds include, but are not limited to: It is not something.
一般式(2)〜一般式(8)中の置換基R01〜R20における、置換もしくは未置換のアルケニル基としては、炭素数1〜30の直鎖状、分岐鎖状、単環状または縮合多環状アルケニル基が挙げられ、それらは構造中に複数の炭素−炭素二重結合を有していてもよく、具体例としては、ビニル基、1−プロペニル基、アリル基、2−ブテニル基、3−ブテニル基、イソプロペニル基、イソブテニル基、1−ペンテニル基、2−ペンテニル基、3−ペンテニル基、4−ペンテニル基、1−ヘキセニル基、2−ヘキセニル基、3−ヘキセニル基、4−ヘキセニル基、5−ヘキセニル基、シクロペンテニル基、シクロヘキセニル基、1,3−ブタジエニル基、シクロヘキサジエニル基、シクロペンタジエニル基等を挙げることができるが、これらに限定されるものではない。 The substituted or unsubstituted alkenyl group in the substituents R 01 to R 20 in the general formula (2) to the general formula (8) is linear, branched, monocyclic or condensed having 1 to 30 carbon atoms. And a polycyclic alkenyl group, which may have a plurality of carbon-carbon double bonds in the structure. Specific examples thereof include a vinyl group, a 1-propenyl group, an allyl group, a 2-butenyl group, 3-butenyl group, isopropenyl group, isobutenyl group, 1-pentenyl group, 2-pentenyl group, 3-pentenyl group, 4-pentenyl group, 1-hexenyl group, 2-hexenyl group, 3-hexenyl group, 4-hexenyl group Group, 5-hexenyl group, cyclopentenyl group, cyclohexenyl group, 1,3-butadienyl group, cyclohexadienyl group, cyclopentadienyl group, and the like. Not shall.
一般式(2)〜一般式(8)中の置換基R01〜R42における、置換もしくは未置換のアリール基としては、炭素数6〜24の単環または縮合多環アリール基が挙げられ、具体例としては、フェニル基、1−ナフチル基、2−ナフチル基、1−アンスリル基、9−アンスリル基、2−フェナントリル基、3−フェナントリル基、9−フェナントリル基、1−ピレニル基、5−ナフタセニル基、1−インデニル基、2−アズレニル基、1−アセナフチル基、2−フルオレニル基、9−フルオレニル基、3−ペリレニル基、o−トリル基、m−トリル基、p−トリル基、2,3−キシリル基、2,5−キシリル基、メシチル基、p−クメニル基、p−ドデシルフェニル基、p−シクロヘキシルフェニル基、4−ビフェニル基、o−フルオロフェニル基、m−クロロフェニル基、p−ブロモフェニル基、p−ヒドロキシフェニル基、m−カルボキシフェニル基、o−メルカプトフェニル基、p−シアノフェニル基、m−ニトロフェニル基、m−アジドフェニル基等が挙げることができるが、これらに限定されるものではない。 Examples of the substituted or unsubstituted aryl group in the substituents R 01 to R 42 in the general formula (2) to the general formula (8) include a monocyclic or condensed polycyclic aryl group having 6 to 24 carbon atoms, Specific examples include phenyl group, 1-naphthyl group, 2-naphthyl group, 1-anthryl group, 9-anthryl group, 2-phenanthryl group, 3-phenanthryl group, 9-phenanthryl group, 1-pyrenyl group, 5- Naphthacenyl group, 1-indenyl group, 2-azurenyl group, 1-acenaphthyl group, 2-fluorenyl group, 9-fluorenyl group, 3-perylenyl group, o-tolyl group, m-tolyl group, p-tolyl group, 2, 3-xylyl group, 2,5-xylyl group, mesityl group, p-cumenyl group, p-dodecylphenyl group, p-cyclohexylphenyl group, 4-biphenyl group, o-fluorophenyl group, -Chlorophenyl group, p-bromophenyl group, p-hydroxyphenyl group, m-carboxyphenyl group, o-mercaptophenyl group, p-cyanophenyl group, m-nitrophenyl group, m-azidophenyl group, etc. However, it is not limited to these.
一般式(2)〜一般式(8)中の置換基R01〜R20およびR25〜R42における、置換もしくは未置換の複素環基としては、窒素原子、酸素原子、硫黄原子、リン原子を含む、炭素原子数4〜24の芳香族あるいは脂肪族の複素環基が挙げられ、2−チエニル基、2−ベンゾチエニル基、ナフト[2,3−b]チエニル基、3−チアントレニル基、2−チアンスレニル基、2−フリル基、2−ベンゾフリル基、ピラニル基、イソベンゾフラニル基、クロメニル基、キサンテニル基、フェノキサチイニル基、2H−ピロリル基、ピロリル基、イミダゾリル基、ピラゾリル基、ピリジル基、ピラジニル基、ピリミジニル基、ピリダジニル基、インドリジニル基、イソインドリル基、3H−インドリル基、2−インドリル基、3−インドリル基、1H−インダゾリル基、プリニル基、4H−キノリジニル基、イソキノリル基、キノリル基、フタラジニル基、ナフチリジニル基、キノキサニリル基、キナゾリニル基、シンノリニル基、プテリジニル基、4aH−カルバゾリル基、2−カルバゾリル基、3−カルバゾリル基、β−カルボリニル基、フェナントリジニル基、2−アクリジニル基、ペリミジニル基、フェナントロリニル基、フェナジニル基、フェナルサジニル基、イソチアゾリル基、フェノチアジニル基、イソキサゾリル基、フラザニル基、3−フェニキサジニル基、イソクロマニル基、クロマニル基、ピロリジニル基、ピロリニル基、イミダゾリジニル基、イミダゾリニル基、ピラゾリジニル基、ピラゾリニル基、ピペリジル基、ピペラジニル基、インドリニル基、イソインドリニル基、キヌクリジニル基、モルホリニル基、チオキサントリル基、4−キノリニル基、4−イソキノリル基、3−フェノチアジニル基、2−フェノキサチイニル基、3−クマリニル基等を挙げることができるが、これらに限定されるものではない。 The substituted or unsubstituted heterocyclic group in the substituents R 01 to R 20 and R 25 to R 42 in the general formula (2) to the general formula (8) includes a nitrogen atom, an oxygen atom, a sulfur atom, and a phosphorus atom. And an aromatic or aliphatic heterocyclic group having 4 to 24 carbon atoms, including 2-thienyl group, 2-benzothienyl group, naphtho [2,3-b] thienyl group, 3-thianthenyl group, 2-thianthrenyl group, 2-furyl group, 2-benzofuryl group, pyranyl group, isobenzofuranyl group, chromenyl group, xanthenyl group, phenoxathiinyl group, 2H-pyrrolyl group, pyrrolyl group, imidazolyl group, pyrazolyl group, Pyridyl group, pyrazinyl group, pyrimidinyl group, pyridazinyl group, indolizinyl group, isoindolyl group, 3H-indolyl group, 2-indolyl group, 3-indolyl group, 1H-i Dazolyl group, prynyl group, 4H-quinolidinyl group, isoquinolyl group, quinolyl group, phthalazinyl group, naphthyridinyl group, quinoxanilyl group, quinazolinyl group, cinnolinyl group, pteridinyl group, 4aH-carbazolyl group, 2-carbazolyl group, 3-carbazolyl group, β-carbolinyl group, phenanthridinyl group, 2-acridinyl group, perimidinyl group, phenanthrolinyl group, phenazinyl group, phenalsadinyl group, isothiazolyl group, phenothiazinyl group, isoxazolyl group, flazanyl group, 3-phenixazinyl group, isochromanyl Group, chromanyl group, pyrrolidinyl group, pyrrolinyl group, imidazolidinyl group, imidazolinyl group, pyrazolidinyl group, pyrazolinyl group, piperidyl group, piperazinyl group, indolinyl group, isoindolinyl group Quinuclidinyl group, morpholinyl group, thioxanthryl group, 4-quinolinyl group, 4-isoquinolyl group, 3-phenothiazinyl group, 2-phenoxathinyl group, 3-coumarinyl group, etc. It is not limited.
一般式(2)〜一般式(8)中の置換基R01〜R15、R18〜R20、およびR25〜R42における、置換もしくは未置換のアルキルオキシ基としては、炭素原子数1〜30の直鎖状、分岐鎖状、単環状または縮合多環状アルキルオキシ基、または炭素数2〜30であり場合により1個以上のエーテル結合で中断されている直鎖状、分岐鎖状、単環状または縮合多環状アルキルオキシ基が挙げられる。炭素原子数1〜30の直鎖状、分岐鎖状、単環状または縮合多環状アルキルオキシ基の具体例としては、メチルオキシ基、エチルオキシ基、プロピルオキシ基、ブチルオキシ基、ペンチルオキシ基、ヘキシルオキシ基、ヘプチルオキシ基、オクチルオキシ基、ノニルオキシ基、デシルオキシ基、ドデシルオキシ基、オクタデシルオキシ基、イソプロピルオキシ基、イソブチルオキシ基、イソペンチルオキシ基、sec−ブチルオキシ基、tert−ブチルオキシ基、sec−ペンチルオキシ基、tert−ペンチルオキシ基、tert−オクチルオキシ基、ネオペンチルオキシ基、シクロプロピルオキシ基、シクロブチルオキシ基、シクロペンチルオキシ基、シクロヘキシルオキシ基、アダマンチルオキシ基、ノルボルニルオキシ基、ボロニルオキシ基、4−デシルシクロヘキシルオキシ基等を挙げることができるが、これらに限定されるものではない。また、炭素数2〜18であり場合により1個以上のエーテル結合で中断されている直鎖状、分岐鎖状アルキルオキシ基の具体例としては、−O−CH2−O−CH3、−O−CH2−CH2−O−CH2−CH3、−O−CH2−CH2−CH2−O−CH2−CH3、−O−(CH2−CH2−O)n−CH3(ここでnは1から8である)、−O−(CH2−CH2−CH2−O)m−CH3(ここでmは1から5である)、−O−CH2−CH(CH3)−O−CH2−CH3−、−O−CH2−CH−(OCH3)2等を挙げることができるが、これらに限定されるものではない。 The substituted or unsubstituted alkyloxy group in the substituents R 01 to R 15 , R 18 to R 20 , and R 25 to R 42 in the general formula (2) to the general formula (8) has 1 carbon atom. -30 linear, branched, monocyclic or condensed polycyclic alkyloxy groups, or linear, branched, having 2 to 30 carbon atoms and optionally interrupted by one or more ether bonds, A monocyclic or condensed polycyclic alkyloxy group may be mentioned. Specific examples of the linear, branched, monocyclic or condensed polycyclic alkyloxy group having 1 to 30 carbon atoms include methyloxy group, ethyloxy group, propyloxy group, butyloxy group, pentyloxy group, and hexyloxy. Group, heptyloxy group, octyloxy group, nonyloxy group, decyloxy group, dodecyloxy group, octadecyloxy group, isopropyloxy group, isobutyloxy group, isopentyloxy group, sec-butyloxy group, tert-butyloxy group, sec-pentyl Oxy group, tert-pentyloxy group, tert-octyloxy group, neopentyloxy group, cyclopropyloxy group, cyclobutyloxy group, cyclopentyloxy group, cyclohexyloxy group, adamantyloxy group, norbornyloxy group, boroni Group, 4-decyl cyclohexyl although group and the like, but is not limited thereto. Specific examples of the linear or branched alkyloxy group having 2 to 18 carbon atoms and optionally interrupted by one or more ether bonds include —O—CH 2 —O—CH 3 , — O—CH 2 —CH 2 —O—CH 2 —CH 3 , —O—CH 2 —CH 2 —CH 2 —O—CH 2 —CH 3 , —O— (CH 2 —CH 2 —O) n — CH 3 (where n is 1 to 8), —O— (CH 2 —CH 2 —CH 2 —O) m —CH 3 (where m is 1 to 5), —O—CH 2 -CH (CH 3) -O-CH 2 -CH 3 -, - OCH 2 -CH- (OCH 3) can be cited 2, etc., but is not limited thereto.
炭素数2から18であり場合により1個以上のエーテル結合により中断されている単環状または縮合多環状アルキルオキシ基の具体例としては、以下のようなものを挙げることができるが、これらに限定されるものではない。 Specific examples of monocyclic or condensed polycyclic alkyloxy groups having 2 to 18 carbon atoms and optionally interrupted by one or more ether bonds include, but are not limited to: Is not to be done.
一般式(2)〜一般式(8)中の置換基R01〜R04およびR25〜R42における、置換もしくは未置換のアリールオキシ基としては、炭素数6〜24の単環または縮合多環アリールオキシ基が挙げられ、具体例としては、フェノキシ基、1ーナフチルオキシ基、2−ナフチルオキシ基、9−アンスリルオキシ基、9−フェナントリルオキシ基、1−ピレニルオキシ基、5−ナフタセニルオキシ基、1−インデニルオキシ基、2−アズレニルオキシ基、1−アセナフチルオキシ基、9−フルオレニルオキシ基等を挙げることができるが、これらに限定されるものではない。 The substituted or unsubstituted aryloxy group in the substituents R 01 to R 04 and R 25 to R 42 in the general formula (2) to the general formula (8) is a monocyclic or condensed polycyclic group having 6 to 24 carbon atoms. Specific examples thereof include phenoxy group, 1-naphthyloxy group, 2-naphthyloxy group, 9-anthryloxy group, 9-phenanthryloxy group, 1-pyrenyloxy group, 5-naphthaldehyde. Examples thereof include, but are not limited to, a nyloxy group, a 1-indenyloxy group, a 2-azurenyloxy group, a 1-acenaphthyloxy group, and a 9-fluorenyloxy group.
一般式(2)〜一般式(8)中の置換基R01〜R04およびR25〜R42における、置換もしくは未置換の複素環オキシ基としては、窒素原子、酸素原子、硫黄原子、リン原子を含む、炭素数4〜24の単環状または縮合多環状複素環オキシ基が挙げられ、具体例としては、2−フラニルオキシ基、2−チエニルオキシ基、2−インドリルオキシ基、3−インドリルオキシ基、2−ベンゾフリルオキシ基、2−ベンゾチエニルオキシ基、2−カルバゾリルオキシ基、3−カルバゾリルオキシ基、4−カルバゾリルオキシ基、9−アクリジニルオキシ基等が挙げることができるが、これらに限定されるものではない。 The substituted or unsubstituted heterocyclic oxy group in the substituents R 01 to R 04 and R 25 to R 42 in the general formula (2) to the general formula (8) includes a nitrogen atom, oxygen atom, sulfur atom, phosphorus Examples thereof include a monocyclic or condensed polycyclic heterocyclic oxy group having 4 to 24 carbon atoms, and specific examples include 2-furanyloxy group, 2-thienyloxy group, 2-indolyloxy group, 3-in Drilloxy group, 2-benzofuryloxy group, 2-benzothienyloxy group, 2-carbazolyloxy group, 3-carbazolyloxy group, 4-carbazolyloxy group, 9-acridinyloxy group, etc. However, it is not limited to these.
一般式(2)〜一般式(8)中の置換基R01〜R15およびR18〜R20における、置換もしくは未置換のアシル基としては、水素原子または炭素数1〜30の直鎖状、分岐鎖状、単環状または縮合多環状の脂肪族が結合したカルボニル基、炭素数2〜20のアルキルオキシ基が置換したカルボニル基、炭素数6〜18の単環状あるいは縮合多環状アリール基が結合したカルボニル基、炭素数6〜18の単環状あるいは縮合多環状のアリールオキシ基が置換したカルボニル基、窒素原子、酸素原子、硫黄原子、リン原子を含む、炭素数4〜18の単環または縮合多環状の複素環基が結合したカルボニル基が挙げられ、具体例としては、ホルミル基、アセチル基、プロピオニル基、ブチリル基、イソブチリル基、バレリル基、イソバレリル基、ピバロイル基、ラウロイル基、ミリストイル基、パルミトイル基、ステアロイル基、シクロペンチルカルボニル基、シクロヘキシルカルボニル基、アクリロイル基、メタクリロイル基、クロトノイル基、イソクロトノイル基、オレオイル基、シンナモイル基ベンゾイル基、メチルオキシカルボニル基、エチルオキシカルボニル基、プロピルオキシカルボニル基、ブチルオキシカルボニル基、ヘキシルオキシカルボニル基、オクチルオキシカルボニル基、デシルオキシカルボニル基、オクタデシルオキシカルボニル基、トリフルオロメチルオキシカルボニル基、ベンゾイル基、トルオイル基、1−ナフトイル基、2−ナフトイル基、9−アンスリルカルボニル基、フェニルオキシカルボニル基、4−メチルフェニルオキシカルボニル基、3−ニトロフェニルオキシカルボニル基、4−ジメチルアミノフェニルオキシカルボニル基、2−メチルスルファニルフェニルオキシカルボニル基、1−ナフトイルオキシカルボニル基、2−ナフトイルオキシカルボニル基、9−アンスルリルオキシカルボニル基、3−フロイル基、2−テノイル基、ニコチノイル基、イソニコチノイル基等を挙げることができるが、これらに限定されるものではない。 The substituted or unsubstituted acyl group in the substituents R 01 to R 15 and R 18 to R 20 in the general formula (2) to the general formula (8) is a hydrogen atom or a straight chain having 1 to 30 carbon atoms. A carbonyl group having a branched, monocyclic or condensed polycyclic aliphatic bond, a carbonyl group substituted by an alkyloxy group having 2 to 20 carbon atoms, or a monocyclic or condensed polycyclic aryl group having 6 to 18 carbon atoms. A bonded carbonyl group, a carbonyl group substituted by a monocyclic or condensed polycyclic aryloxy group having 6 to 18 carbon atoms, a monocyclic group having 4 to 18 carbon atoms, including a nitrogen atom, an oxygen atom, a sulfur atom, or a phosphorus atom, or Examples include carbonyl groups to which condensed polycyclic heterocyclic groups are bonded, and specific examples include formyl group, acetyl group, propionyl group, butyryl group, isobutyryl group, valeryl group, isovaleryl group, pivalloy. Group, lauroyl group, myristoyl group, palmitoyl group, stearoyl group, cyclopentylcarbonyl group, cyclohexylcarbonyl group, acryloyl group, methacryloyl group, crotonoyl group, isocrotonoyl group, oleoyl group, cinnamoyl group benzoyl group, methyloxycarbonyl group, ethyloxy Carbonyl group, propyloxycarbonyl group, butyloxycarbonyl group, hexyloxycarbonyl group, octyloxycarbonyl group, decyloxycarbonyl group, octadecyloxycarbonyl group, trifluoromethyloxycarbonyl group, benzoyl group, toluoyl group, 1-naphthoyl group 2-naphthoyl group, 9-anthrylcarbonyl group, phenyloxycarbonyl group, 4-methylphenyloxycarbonyl group, 3-nitrophene Ruoxycarbonyl group, 4-dimethylaminophenyloxycarbonyl group, 2-methylsulfanylphenyloxycarbonyl group, 1-naphthoyloxycarbonyl group, 2-naphthoyloxycarbonyl group, 9-anthrylyloxycarbonyl group, 3-furoyl Group, 2-thenoyl group, nicotinoyl group, isonicotinoyl group, and the like, but are not limited thereto.
一般式(2)〜一般式(8)中の置換基R01〜R04における、置換もしくは未置換のカルボニルオキシ基としては、炭素数2〜20のカルボニルオキシ基が挙げられ、具体例としては、アセチルオキシ基、プロパノイルオキシ基、ブタノイルオキシ基、ペンタノイルオキシ基、トリフルオロメチルカルボニルオキシ基、ベンゾイルオキシ基、1−ナフチルカルボニルオキシ基、2−ナフチルカルボニルオキシ基等を挙げることができるが、これらに限定されるものではない。 Examples of the substituted or unsubstituted carbonyloxy group in the substituents R 01 to R 04 in the general formula (2) to the general formula (8) include a carbonyloxy group having 2 to 20 carbon atoms. Acetyloxy group, propanoyloxy group, butanoyloxy group, pentanoyloxy group, trifluoromethylcarbonyloxy group, benzoyloxy group, 1-naphthylcarbonyloxy group, 2-naphthylcarbonyloxy group and the like. However, it is not limited to these.
一般式(2)〜一般式(8)中の置換基R05〜R15およびR18〜R20における、置換もしくは未置換のアルキニル基としては、炭素数2〜10のアルキニル基が挙げられ、具体例としては、エチニル基、プロピニル基、プロパルギル基等を挙げることができるが、これらに限定されるものではない。 Examples of the substituted or unsubstituted alkynyl group in the substituents R 05 to R 15 and R 18 to R 20 in the general formula (2) to the general formula (8) include alkynyl groups having 2 to 10 carbon atoms, Specific examples include, but are not limited to, an ethynyl group, a propynyl group, a propargyl group, and the like.
前述したR01〜R45における置換基の水素原子はさらに他の置換基で置換されていても良い。 The hydrogen atom of the substituent in R 01 to R 45 described above may be further substituted with another substituent.
そのような置換基としては、例えばフッ素原子、塩素原子、臭素原子、ヨウ素原子等のハロゲン基、メトキシ基、エトキシ基、tert−ブトキシ基等のアルキルオキシ基、フェノキシ基、p−トリルオキシ基等のアリールオキシ基、メトキシカルボニル基、ブトキシカルボニル基等のアルキルオキシカルボニル基、フェノキシカルボニル基等のアリールオキシカルボニル基、アセトキシ基、プロピオニルオキシ基、ベンゾイルオキシ基等のアシルオキシ基、アセチル基、ベンゾイル基、イソブチリル基、アクリロイル基、メタクリロイル基、メトキサリル基等のアシル基、メチルスルファニル基、tert−ブチルスルファニル基等のアルキルスルファニル基、フェニルスルファニル基、p−トリルスルファニル基等のアリールスルファニル基、メチルアミノ基、シクロヘキシルアミノ基等のアルキルアミノ基、ジメチルアミノ基、ジエチルアミノ基、モルホリノ基、ピペリジノ基等のジアルキルアミノ基、フェニルアミノ基、p−トリルアミノ基等のアリールアミノ基、メチル基、エチル基、tert−ブチル基、ドデシル基等のアルキル基、フェニル基、p−トリル基、キシリル基、クメニル基、ナフチル基、アンスリル基、フェナントリル基等のアリール基、フリル基、チエニル基等の複素環基等の他、ヒドロキシ基、カルボキシ基、ホルミル基、メルカプト基、スルホ基、メシル基、p−トルエンスルホニル基、アミノ基、ニトロ基、シアノ基、トリフルオロメチル基、トリクロロメチル基、トリメチルシリル基、ホスフィニコ基、ホスホノ基、トリメチルアンモニウミル基、ジメチルスルホニウミル基、トリフェニルフェナシルホスホニウミル基等が挙げられる。 Examples of such substituents include halogen groups such as fluorine atom, chlorine atom, bromine atom and iodine atom, alkyloxy groups such as methoxy group, ethoxy group and tert-butoxy group, phenoxy group and p-tolyloxy group. Alkyloxycarbonyl groups such as aryloxy group, methoxycarbonyl group, butoxycarbonyl group, aryloxycarbonyl groups such as phenoxycarbonyl group, acyloxy groups such as acetoxy group, propionyloxy group, benzoyloxy group, acetyl group, benzoyl group, isobutyryl Groups, acryloyl groups, methacryloyl groups, methacrylyl groups and other acyl groups, methylsulfanyl groups, alkylsulfanyl groups such as tert-butylsulfanyl groups, arylsulfanyl groups such as phenylsulfanyl groups and p-tolylsulfanyl groups Group, methylamino group, alkylamino group such as cyclohexylamino group, dimethylamino group, diethylamino group, morpholino group, dialkylamino group such as piperidino group, arylamino group such as phenylamino group, p-tolylamino group, methyl group, Alkyl groups such as ethyl group, tert-butyl group, dodecyl group, phenyl group, p-tolyl group, xylyl group, cumenyl group, naphthyl group, anthryl group, aryl group such as phenanthryl group, complex such as furyl group, thienyl group, etc. In addition to ring groups, etc., hydroxy group, carboxy group, formyl group, mercapto group, sulfo group, mesyl group, p-toluenesulfonyl group, amino group, nitro group, cyano group, trifluoromethyl group, trichloromethyl group, trimethylsilyl group , Phosphinico group, phosphono group, trimethylammonium Group, dimethylsulfoxide Niu mill group, triphenyl phenacyl phosphonium Niu mill group, and the like.
以下に、本発明の一般式(1)中のオニウムカチオンX+の構造の具体例を挙げるが、これらに限定されるものではない。なお、例示化合物中のMeはメチル基、Etはエチル基、Prはノルマルプロピル基、i−Prはイソプロピル基、Buはノルマルブチル基、t−Buはターシャリーブチル基、Hexはノルマルヘキシル基、Octはノルマルオクチル基、Decはノルマルデシル基を示す。 Specific examples of the structure of the onium cation X + in the general formula (1) of the present invention are shown below, but are not limited thereto. In the exemplified compounds, Me is a methyl group, Et is an ethyl group, Pr is a normal propyl group, i-Pr is an isopropyl group, Bu is a normal butyl group, t-Bu is a tertiary butyl group, Hex is a normal hexyl group, Oct represents a normal octyl group, and Dec represents a normal decyl group.
アンモニウムカチオンの例
ホスホニウムカチオンの例
ピリジニウムカチオンの例
ピラジニウムカチオンの例
イミダゾリウムカチオンの例
ピロリジニウムカチオンの例
ピペリジニウムカチオンの例
以上述べた本発明の化合物の具体例を以下に示すが、本発明の化合物の構造はそれらに限定されるものではない。なお、例示化合物中のMeはメチル基、Etはエチル基、Prはノルマルプロピル基、i−Prはイソプロピル基、Buはノルマルブチル基、t−Buはターシャリーブチル基、Hexはノルマルヘキシル基、Octはノルマルオクチル基、Cetはノルマルセチル基、Phはフェニル基を示す。 Specific examples of the compound of the present invention described above are shown below, but the structure of the compound of the present invention is not limited thereto. In the exemplified compounds, Me is a methyl group, Et is an ethyl group, Pr is a normal propyl group, i-Pr is an isopropyl group, Bu is a normal butyl group, t-Bu is a tertiary butyl group, Hex is a normal hexyl group, Oct represents a normal octyl group, Cet represents a normal cetyl group, and Ph represents a phenyl group.
表1
本発明の帯電防止剤により、高いレベルの帯電防止機能のみならず、無色透明性・樹脂や溶剤への溶解性(相溶性)・耐熱性・耐湿性を併せて得られる機構は完全には明らかではないが、アニオン部位、カチオン部位ともに電荷が分散または非局在化している構造であることにより、安定化するだけでなく、より解離が促進されてイオン伝導性が向上し、高い帯電防止性能につながるためと考えている。 With the antistatic agent of the present invention, not only a high level of antistatic function, but also the mechanism that can be obtained in combination with colorless transparency, solubility in resins and solvents (compatibility), heat resistance and moisture resistance is completely clear However, the structure in which the charge is dispersed or delocalized in both the anion site and the cation site not only stabilizes, but also promotes dissociation and improves ionic conductivity, and high antistatic performance. I think it will lead to
本発明の帯電防止剤は、シュウ酸が3つ配位したリンアニオンとオニウムカチオンとからなることを特徴としているが、その合成方法は特に限定されない。通常は、シュウ酸が3つ配位したリンアニオンと任意のカチオンとからなる塩(A)と、一般式(1)中の置換基X+で表されるオニウムカチオンと任意のアニオンとからなる塩(B)とを別途合成し、それらを、水または有機溶媒中にて塩交換することにより、本発明の帯電防止剤を容易に得ることが可能である。 The antistatic agent of the present invention is characterized by comprising a phosphorus anion coordinated with three oxalic acids and an onium cation, but the synthesis method is not particularly limited. Usually, it comprises a salt (A) composed of a phosphorus anion coordinated with three oxalic acids and an arbitrary cation, an onium cation represented by the substituent X + in the general formula (1), and an arbitrary anion. The antistatic agent of the present invention can be easily obtained by separately synthesizing the salt (B) and subjecting them to salt exchange in water or an organic solvent.
本発明の帯電防止剤は、単独で、または2種類以上を組み合わせて用いることができる。 The antistatic agent of this invention can be used individually or in combination of 2 or more types.
本発明の帯電防止剤を樹脂造形品へと応用する手法として、帯電防止剤を直接配合(混練)した樹脂を造形する方法と、造形した樹脂の表面に帯電防止剤の塗膜(皮膜)を形成する方法の大きく2種類が挙げられる。 As a method of applying the antistatic agent of the present invention to a resin molded product, a method of modeling a resin in which an antistatic agent is directly blended (kneaded), and a coating film (film) of the antistatic agent on the surface of the molded resin There are mainly two types of forming methods.
まず、帯電防止剤を直接配合(混練)した樹脂を造形する方法について説明する。造形には、帯電防止剤および樹脂を含有する樹脂組成物や、樹脂組成物(帯電防止剤および樹脂)および溶剤を含有する樹脂ワニスなどを用いることができる。 First, a method for forming a resin in which an antistatic agent is directly blended (kneaded) will be described. For modeling, a resin composition containing an antistatic agent and a resin, a resin varnish containing a resin composition (an antistatic agent and a resin) and a solvent, or the like can be used.
本発明の帯電防止剤を配合(混練)することができる樹脂としては、熱可塑性樹脂、熱硬化性樹脂、フッ素樹脂、高分子ゴム等が挙げられる。 Examples of resins that can be blended (kneaded) with the antistatic agent of the present invention include thermoplastic resins, thermosetting resins, fluororesins, and polymer rubbers.
熱可塑性樹脂としては、ポリオレフィン、ポリハロオレフィン、ポリスチレン、ポリエチレンテレフタレート(PET)、ポリブチレンテレフタレート(PBT)、ポリヘキサメチレンテレフタレート、ポリアミド樹脂、ポリビニルアルコール、ポリエーテルイミド樹脂、ポリアリレート樹脂、ポリサルホン樹脂、ポリアミドイミド樹脂、ポリビニルブチラール、アクリル樹脂、メタクリル樹脂、ノルボルネン樹脂、ポリイミド樹脂、ポリエーテルエーテルケトン、ケトン樹脂、ポリカーボネート、ポリビニルホルマール、ポリメチルメタクリレート、ポリフェニレンエーテル樹脂、ポリ酢酸ビニル、ポリアセタール樹脂、ポリフェニレンサルファイド樹脂、エチレン−ビニルアルコール共重合体、アクリロニトリル−スチレン共重合体(AS)、エチレン−酢酸ビニル共重合体(EVA)、アクリロニトリル−ブタジエン−スチレン共重合体(ABS)等が挙げられる。 Examples of the thermoplastic resin include polyolefin, polyhaloolefin, polystyrene, polyethylene terephthalate (PET), polybutylene terephthalate (PBT), polyhexamethylene terephthalate, polyamide resin, polyvinyl alcohol, polyetherimide resin, polyarylate resin, polysulfone resin, Polyamideimide resin, polyvinyl butyral, acrylic resin, methacrylic resin, norbornene resin, polyimide resin, polyether ether ketone, ketone resin, polycarbonate, polyvinyl formal, polymethyl methacrylate, polyphenylene ether resin, polyvinyl acetate, polyacetal resin, polyphenylene sulfide resin Ethylene-vinyl alcohol copolymer, acrylonitrile-styrene copolymer (AS), Len - vinyl acetate copolymer (EVA), acrylonitrile - butadiene - styrene copolymer (ABS) and the like.
ポリオレフィンとしては、低密度ポリエチレン(LDPE)、高密度ポリエチレン(HDPE)、ポリプロピレン(PP)、エチレン−プロピレン共重合体、ポリブタジエン、ポリイソプレン等が挙げられる。 Examples of the polyolefin include low density polyethylene (LDPE), high density polyethylene (HDPE), polypropylene (PP), ethylene-propylene copolymer, polybutadiene, polyisoprene and the like.
ポリハロオレフィンとしては、ポリ塩化ビニル(PVC)、ポリクロロプレン、ポリ塩化ビニリデン、塩化ビニル−酢酸ビニル共重合体、エチレン−塩化ビニル共重合体、塩化ビニル−塩化ビニリデン共重合体等が挙げられる。 Examples of the polyhaloolefin include polyvinyl chloride (PVC), polychloroprene, polyvinylidene chloride, vinyl chloride-vinyl acetate copolymer, ethylene-vinyl chloride copolymer, vinyl chloride-vinylidene chloride copolymer, and the like.
熱硬化性樹脂としては、シリコーン樹脂、メラミン樹脂、フェノール樹脂、ポリウレタン樹脂、フラン樹脂、ジアリルフタレート樹脂、ウレア樹脂、ロジン変性マレイン酸樹脂、ロジン変性フェノール樹脂、エポキシ樹脂、キシレン樹脂、ポリ乳酸樹脂、グアナミン樹脂、ビニルエステル樹脂、ポリイミド樹脂、不飽和ポリエステル樹脂等が挙げられる。 Thermosetting resins include silicone resin, melamine resin, phenol resin, polyurethane resin, furan resin, diallyl phthalate resin, urea resin, rosin modified maleic acid resin, rosin modified phenolic resin, epoxy resin, xylene resin, polylactic acid resin, Examples include guanamine resins, vinyl ester resins, polyimide resins, unsaturated polyester resins, and the like.
フッ素樹脂としては、テトラフルオロエチレン、ポリフッ化ビニリデン、トリフルオロエチレン等が挙げられる。 Examples of the fluororesin include tetrafluoroethylene, polyvinylidene fluoride, and trifluoroethylene.
高分子ゴムとしては、天然ゴム(NR)、スチレンブタジエンゴム(SBR)、エチレン−プロピレン−ジエンゴム(EPDM)、ポリイソプレンゴム、クロロプレンゴム、ポリブタジエンゴム、ブチルゴム、アクリロニトリル−ブタジエンゴム、シリコーンゴム等が挙げられる。 Examples of the polymer rubber include natural rubber (NR), styrene butadiene rubber (SBR), ethylene-propylene-diene rubber (EPDM), polyisoprene rubber, chloroprene rubber, polybutadiene rubber, butyl rubber, acrylonitrile-butadiene rubber, and silicone rubber. It is done.
さらには、これら樹脂を組み合わせた、いわゆるポリマーアロイでもよい。 Furthermore, what is called a polymer alloy combining these resins may be used.
また、これらを混練する方法としては、通常使用されている任意の方法を用いることができる。例えば、ロール混練り、バンパー混練り、押し出し機或いはニーダー等で混練することが可能である。 Moreover, as a method of kneading these, any commonly used method can be used. For example, it is possible to knead by roll kneading, bumper kneading, an extruder or a kneader.
混練された樹脂組成物を、任意の形状に造形することにより、帯電防止能を有する樹脂造形品を製造することができる。 By shaping the kneaded resin composition into an arbitrary shape, a resin shaped product having antistatic ability can be produced.
本発明の帯電防止剤を樹脂および溶剤に配合して樹脂ワニスとして使用することもできる。この際、樹脂としては、前出の樹脂類を用いることが可能である。好ましくは、アクリル樹脂、メタクリル樹脂、ポリイミド樹脂、ポリアミド樹脂、ポリアクリレート系樹脂、不飽和ポリエステル系樹脂、ポリエステルアクリレート系樹脂、ポリエポキシアクリレート系樹脂、ポリウレタンアクリレート系樹脂、ポリエーテルアクリレート系樹脂、ポリオールアクリレート系樹脂、セルロースアセテート系樹脂、ニトロセルロース系樹脂、スチレン系(共)重合体、ポリビニルブチラール系樹脂、アミノアルキッド系樹脂、ポリエステル系樹脂、アミノ樹脂変性ポリエステル系樹脂、ポリウレタン系樹脂、アクリルポリオールウレタン系樹脂、可溶性ポリアミド系樹脂、可溶性ポリイミド系樹脂、可溶性ポリアミドイミド系樹脂、可溶性ポリエステルイミド系樹脂、ヒドロキシエチルセルロース、スチレン−マレイン酸エステル系共重合体の水溶性塩、(メタ)アクリル酸エステル系(共)重合体の水溶性塩、水溶性アミノアルキッド系樹脂、水溶性アミノポリエステル系樹脂、水溶性ポリアミド系樹脂、石油樹脂、アルキッド樹脂、大豆油、桐油、アマニ油を用いることができる。さらに、これらは任意に単独または2種類以上を組み合わせて使用することができる。 The antistatic agent of this invention can also be mix | blended with resin and a solvent, and can also be used as a resin varnish. In this case, the above-mentioned resins can be used as the resin. Preferably, acrylic resin, methacrylic resin, polyimide resin, polyamide resin, polyacrylate resin, unsaturated polyester resin, polyester acrylate resin, polyepoxy acrylate resin, polyurethane acrylate resin, polyether acrylate resin, polyol acrylate Resin, cellulose acetate resin, nitrocellulose resin, styrene (co) polymer, polyvinyl butyral resin, amino alkyd resin, polyester resin, amino resin modified polyester resin, polyurethane resin, acrylic polyol urethane Resin, soluble polyamide resin, soluble polyimide resin, soluble polyamideimide resin, soluble polyesterimide resin, hydroxyethyl cellulose, styrene monomer Water-soluble salts of inic acid ester-based copolymers, water-soluble salts of (meth) acrylic acid ester-based (co) polymers, water-soluble amino alkyd resins, water-soluble amino polyester resins, water-soluble polyamide resins, petroleum Resins, alkyd resins, soybean oil, tung oil, and linseed oil can be used. Furthermore, these can be used individually or in combination of 2 or more types.
ワニス中の溶剤としては、高沸点石油系溶剤、脂肪族炭化水素溶剤、アルコール系溶剤、水系溶剤など樹脂の性質に合わせて、さまざまな溶剤を用いることができる。汎用されている溶剤としては、メチルエチルケトン(MEK)、ジメチルホルムアミド(DMF)、N−メチルピロリドン(NMP)、メトキシプロパノール、トルエン、水等が挙げられる。さらに、これらの溶剤は、単独あるいは2種類以上の組み合わせで任意に使用できる。 As the solvent in the varnish, various solvents can be used in accordance with the properties of the resin such as a high boiling point petroleum solvent, an aliphatic hydrocarbon solvent, an alcohol solvent, and an aqueous solvent. Commonly used solvents include methyl ethyl ketone (MEK), dimethylformamide (DMF), N-methylpyrrolidone (NMP), methoxypropanol, toluene, water and the like. Further, these solvents can be arbitrarily used alone or in combination of two or more.
樹脂ワニスを、例えば、適当な支持体上に塗布し、乾燥させることによっても、帯電防止能を有する樹脂造形品を製造することができる。 For example, a resin shaped article having an antistatic ability can also be produced by applying the resin varnish on an appropriate support and drying it.
塗布した樹脂ワニスの乾燥およびキュアは、組み合わせる溶剤等によって適宜選択され、常温乾燥することもできるが、通常は加熱乾燥炉を利用して行うことが多い。乾燥炉は、空気、不活性ガス(窒素、アルゴンなど)などで満たしておく、または、乾燥炉内に不活性ガスをフローさせることが好ましい。乾燥およびキュアの温度は、溶媒の沸点などに応じて適宜選択されるが、60℃〜600℃の範囲にあることが好ましい。また、段階的に温度を上昇させることが、発泡やユズ肌などの問題が発生せず、膜厚が均一で、さらに寸法安定性にも優れる樹脂造形品が得られるために好ましい。乾燥およびキュアの時間は、形成される樹脂造形品の厚み、樹脂ワニスの固形分濃度、溶媒の種類により適宜選択されるが、0.05分〜500分程度であることが望ましい。 Drying and curing of the applied resin varnish is appropriately selected depending on the solvent to be combined and can be dried at room temperature, but usually it is often performed using a heating and drying furnace. The drying furnace is preferably filled with air, an inert gas (such as nitrogen or argon), or the inert gas is preferably allowed to flow into the drying furnace. The drying and curing temperatures are appropriately selected according to the boiling point of the solvent, but are preferably in the range of 60 ° C to 600 ° C. In addition, it is preferable to raise the temperature stepwise because a molded resin product having a uniform film thickness and excellent dimensional stability can be obtained without causing problems such as foaming and crushed skin. The drying and curing time is appropriately selected depending on the thickness of the resin molded product to be formed, the solid content concentration of the resin varnish, and the type of the solvent, and is preferably about 0.05 to 500 minutes.
樹脂組成物および樹脂ワニスにおいて、帯電防止剤を樹脂に配合する量は特に限定されない。しかし、多量に配合すると、樹脂の機械的強度等の物性が低下するといった本来の樹脂物性に影響を与えたり、配合量が少ないと帯電防止効果が不十分となる場合がある。したがって、好ましい配合量は樹脂に対して0.01〜30重量%、より好ましくは0.02〜25重量%、最も好ましくは0.02〜20重量%である。 In the resin composition and the resin varnish, the amount of the antistatic agent added to the resin is not particularly limited. However, if blended in a large amount, it may affect the original physical properties of the resin, such as a decrease in physical properties such as mechanical strength, and if the blended amount is small, the antistatic effect may be insufficient. Therefore, the preferable blending amount is 0.01 to 30% by weight, more preferably 0.02 to 25% by weight, and most preferably 0.02 to 20% by weight based on the resin.
次に、造形した樹脂の表面に帯電防止剤の塗膜を形成する方法について説明する。塗膜の形成には、樹脂組成物、および樹脂ワニスに加え、帯電防止剤および溶剤を含有する塗液を用いることができる。 Next, a method for forming a coating film of an antistatic agent on the surface of the shaped resin will be described. For forming the coating film, a coating liquid containing an antistatic agent and a solvent can be used in addition to the resin composition and the resin varnish.
例えば、塗液を用いる場合、造形した樹脂の表面に塗膜を形成する塗布方法としては、本発明に係る帯電防止剤を含有する溶液、分散液、乳化液を浸漬法、スピンコート法、スプレー法、ローラーコート法、グラビアコート法、ダイコート法、コンマコート法、ロールコート法、カーテンコート法、バーコート法等各種の手段を用いた方法がある。それらの方法は、塗布する厚み、粘度等に応じて適宜利用できる。 For example, in the case of using a coating liquid, as a coating method for forming a coating film on the surface of a molded resin, a solution, dispersion, or emulsion containing the antistatic agent according to the present invention is immersed, spin-coated, sprayed. There are methods using various means such as a method, a roller coating method, a gravure coating method, a die coating method, a comma coating method, a roll coating method, a curtain coating method, and a bar coating method. These methods can be appropriately used depending on the thickness, viscosity, and the like to be applied.
このとき用いられる溶剤は、帯電防止剤を溶解または分散させることができる溶媒であれば特に限定されることはないが、メチルエチルケトン、シクロヘキサノン、2−ヘプタノン、3−ヘプタノン等のケトン類;エチレングリコールモノメチルエーテルアセテート、エチレングリコールモノエチルエーテルアセテート、ジエチレングリコールモノメチルエーテルアセテート、ジエチレングリコールモノエチルエーテルアセテート、プロピレングリコールモノメチルエーテルアセテート、プロピレングリコールモノエチルエーテルアセテート等の(ポリ)アルキレングリコールモノアルキルエーテルアセテート類;エチレングリコールモノメチルエーテル、エチレングリコールモノエチルエーテル、エチレングリコールモノ−n−プロピルエーテル、エチレングリコールモノ−n−ブチルエーテル、ジエチレングリコールモノメチルエーテル、ジエチレングリコールモノエチルエーテル、ジエチレングリコールモノ−n−プロピルエーテル、エチレングリコールモノ−n−ブチルエーテル、トリエチレングリコールモノメチルエーテル、トリエチレングリコールモノエチルエーテル、プロピレングリコールモノメチルエーテル、プロピレングリコールモノエチルエーテル、プロピレングリコールモノ−n−プロピルエーテル、プロピレングリコールモノ−n−ブチルエーテル、ジプロピレングリコールモノメチルエーテル、ジプロピレングリコールモノエチルエーテル、ジプロピレングリコールモノ−n−プロピルエーテル、ジプロピレングリコールモノ−n−ブチルエーテル、トリプロピレングリコールモノメチルエーテル、トリプロピレングリコールモノエチルエーテル等の(ポリ)アルキレングリコールモノアルキルエーテル類;酢酸エチル、酢酸−n−ブチル、酢酸イソブチル、ギ酸アミル、酢酸イソアミル、プロピオン酸ブチル、酪酸エチル、酪酸イソプロピル、酪酸ブチル、乳酸メチル、乳酸エチル、オキシ酢酸メチル、オキシ酢酸エチル、オキシ酢酸ブチル、メトキシ酢酸メチル、メトキシ酢酸エチル、メトキシ酢酸ブチル等のエステル類、エトキシ酢酸メチル、エトキシ酢酸エチル、3−オキシプロピオン酸メチル、3−オキシプロピオン酸エチル、3−メトキシプロピオン酸メチル、3−メトキシプロピオン酸エチル、3−エトキシプロピオン酸メチル、3−エトキシプロピオン酸エチル、2−オキシプロピオン酸メチル、2−オキシプロピオン酸エチル、2−オキシプロピオン酸プロピル、2−メトキシプロピオン酸メチル、2−メトキシプロピオン酸エチル、2−メトキシプロピオン酸プロピル、2−エトキシプロピオン酸メチル、2−エトキシプロピオン酸エチル、2−オキシ−2−メチルプロピオン酸メチル、2−オキシ−2−メチルプロピオン酸エチル、2−メトキシ−2−メチルプロピオン酸メチル、2−メトキシ−2−メチルプロピオン酸エチル、ピルビン酸メチル、ピルビン酸エチル、ピルビン酸プロピル、アセト酢酸メチル、アセト酢酸エチル、2−オキソブタン酸メチル、2−オキソブタン酸エチル等のエステル類;トルエン、キシレン等の芳香族炭化水素類、N−メチルピロリドン、N,N−ジメチルアセトアミド等のアミド類等を挙げることができる。 The solvent used at this time is not particularly limited as long as it can dissolve or disperse the antistatic agent, but ketones such as methyl ethyl ketone, cyclohexanone, 2-heptanone, and 3-heptanone; ethylene glycol monomethyl (Poly) alkylene glycol monoalkyl ether acetates such as ether acetate, ethylene glycol monoethyl ether acetate, diethylene glycol monomethyl ether acetate, diethylene glycol monoethyl ether acetate, propylene glycol monomethyl ether acetate, propylene glycol monoethyl ether acetate; ethylene glycol monomethyl ether , Ethylene glycol monoethyl ether, ethylene glycol mono-n-propyl ether Ethylene glycol mono-n-butyl ether, diethylene glycol monomethyl ether, diethylene glycol monoethyl ether, diethylene glycol mono-n-propyl ether, ethylene glycol mono-n-butyl ether, triethylene glycol monomethyl ether, triethylene glycol monoethyl ether, propylene glycol Monomethyl ether, propylene glycol monoethyl ether, propylene glycol mono-n-propyl ether, propylene glycol mono-n-butyl ether, dipropylene glycol monomethyl ether, dipropylene glycol monoethyl ether, dipropylene glycol mono-n-propyl ether, di Propylene glycol mono-n-butyl ether, tripp (Poly) alkylene glycol monoalkyl ethers such as propylene glycol monomethyl ether and tripropylene glycol monoethyl ether; ethyl acetate, n-butyl acetate, isobutyl acetate, amyl formate, isoamyl acetate, butyl propionate, ethyl butyrate, isopropyl butyrate , Butyl butyrate, methyl lactate, ethyl lactate, methyl oxyacetate, ethyl oxyacetate, butyl oxyacetate, methyl methoxyacetate, ethyl methoxyacetate, butyl methoxyacetate, methyl ethoxyacetate, ethyl ethoxyacetate, 3-oxypropion Acid methyl, ethyl 3-oxypropionate, methyl 3-methoxypropionate, ethyl 3-methoxypropionate, methyl 3-ethoxypropionate, ethyl 3-ethoxypropionate, 2-oxypropionate Methyl acetate, ethyl 2-oxypropionate, propyl 2-oxypropionate, methyl 2-methoxypropionate, ethyl 2-methoxypropionate, propyl 2-methoxypropionate, methyl 2-ethoxypropionate, 2-ethoxypropion Ethyl acetate, methyl 2-oxy-2-methylpropionate, ethyl 2-oxy-2-methylpropionate, methyl 2-methoxy-2-methylpropionate, ethyl 2-methoxy-2-methylpropionate, methyl pyruvate , Esters such as ethyl pyruvate, propyl pyruvate, methyl acetoacetate, ethyl acetoacetate, methyl 2-oxobutanoate and ethyl 2-oxobutanoate; aromatic hydrocarbons such as toluene and xylene, N-methylpyrrolidone, N Amides such as N-dimethylacetamide And the like can be given.
これらの溶剤は単独あるいは2種以上を適宜混合して用いることが可能である。 These solvents can be used alone or in admixture of two or more.
さらに、本発明の帯電防止剤をこれら溶剤に配合する量は特に限定されない。しかし、多量に配合すると、塗液の粘度が高くなりすぎてしまったり、塗液の白化が生じることがある。したがって、好ましい配合量は塗液全体に対して0.01〜30重量%、より好ましくは0.02〜15重量%、最も好ましくは0.02〜10重量%である。 Furthermore, the quantity which mix | blends the antistatic agent of this invention with these solvents is not specifically limited. However, when blended in a large amount, the viscosity of the coating liquid may become too high, or the coating liquid may be whitened. Therefore, a preferable blending amount is 0.01 to 30% by weight, more preferably 0.02 to 15% by weight, and most preferably 0.02 to 10% by weight with respect to the entire coating liquid.
本発明の帯電防止剤と、重合性官能基を有する化合物(モノマー、オリゴマーまたはプレポリマー)および重合開始剤とを混合して重合性組成物として利用することも可能である。重合性組成物の利用方法としては、その重合性組成物の形態に応じて、重合性組成物を重合させて樹脂造形品を製造する方法と、造形した樹脂の表面に重合性組成物を用いて帯電防止剤塗膜を形成する方法の両方の手法をとることができる。すなわち、重合性組成物を樹脂基板等に塗布し硬化させる場合は後者の手法に、重合性組成物単体で硬化させる場合は前者の手法に相当する。 The antistatic agent of the present invention, a compound having a polymerizable functional group (monomer, oligomer or prepolymer) and a polymerization initiator can be mixed and used as a polymerizable composition. As a method of using the polymerizable composition, according to the form of the polymerizable composition, a method for producing a resin shaped article by polymerizing the polymerizable composition, and using the polymerizable composition on the surface of the shaped resin Both methods of forming an antistatic agent coating film can be taken. That is, when the polymerizable composition is applied to a resin substrate or the like and cured, it corresponds to the latter method, and when it is cured with the polymerizable composition alone, it corresponds to the former method.
重合性組成物は、少なくとも、帯電防止剤と、重合性官能基を有するモノマー、オリゴマーまたはプレポリマーと、重合開始剤からなる。 The polymerizable composition comprises at least an antistatic agent, a monomer, oligomer or prepolymer having a polymerizable functional group, and a polymerization initiator.
重合性官能基を有するモノマーの例としては、エチレングリコールジ(メタ)アクリレート、ジエチレングリコールジ(メタ)アクリレート、ポリエチレングリコールジ(メタ)アクリレート、1,6−ヘキサンジオールジ(メタ)アクリレート、エトキシ化1,6−ヘキサンジオールジアクリレート、ネオペンチルグリコールジ(メタ)アクリレート、エトキシ化ネオペンチルグリコールジ(メタ)アクリレート、プロポキシ化ネオペンチルグリコールジ(メタ)アクリレート、トリプロピレングリコールジ(メタ)アクリレート、ポリプロピレングリコールジアクリレート、1,4−ブタンジオールジ(メタ)アクリレート、1,9−ノナンジオールジアクリレート、テトラエチレングリコールジアクリレート、2−n−ブチル−2−エチル−1,3−プロパンジオールジアクリレート、ジメチロールトリシクロデカンジアクリレート、ヒドロキシピバリン酸ネオペンチルグリコールジアクリレート、1,3−ブチレングリコールジ(メタ)アクリレート、エトキシ化ビスフェノールAジ(メタ)アクリレート、プロポキシ化ビスフェノールAジ(メタ)アクリレート、シクロヘキサンジメタノールジ(メタ)アクリレート、ジメチロールジシクロペンタンジアクリレート、トリメチロールプロパントリアクリレート、ヒドロキシピバリン酸トリメチロールプロパントリアクリレート、エトキシ化トリメチロールプロパントリアクリレート、プロポキシ化トリメチロールプロパントリアクリレート、エトキシ化リン酸トリアクリレート、エトキシ化トリプロピレングリコールジアクリレート、ネオペンチルグリコール変性トリメチロールプロパンジアクリレート、ステアリン酸変性ペンタエリスリトールジアクリレート、ペンタエリスリトールトリアクリレート、テトラメチロールプロパントリアクリレート、テトラメチロールメタントリアクリレート、ペンタエリスリトールテトラアクリレート、カプロラクトン変性トリメチロールプロパントリアクリレート、エトキシ化イソシアヌール酸トリアクリレート、トリ(2−ヒドロキシエチルイソシアヌレート)トリアクリレート、プロポキシレートグリセリルトリアクリレート、テトラメチロールメタンテトラアクリレート、ペンタエリスリトールテトラアクリレート、ジトリメチロールプロパンテトラアクリレート、エトキシ化ペンタエリスリトールテトラアクリレート、ジペンタエリスリトールヘキサアクリレート、カプロラクトン変性ジペンタエリスリトールヘキサアクリレート、ジペンタエリスリトールヒドロキシペンタアクリレート、ネオペンチルグリコールオリゴアクリレート、1,4−ブタンジオールオリゴアクリレート、1,6−ヘキサンジオールオリゴアクリレート、トリメチロールプロパンオリゴアクリレート、ペンタエリスリトールオリゴアクリレート、2−フェノキシエチルアクリレート、アクリロイルモルホリン、2−ヒドロキシエチルアクリレート、2−ヒドロキシプロピルアクリレート、4−ヒドロキシブチルアクリレート、イソブチルアクリレート、t−ブチルアクリレート、イソオクチルアクリレート、イソボルニルアクリレート、シクロヘキシルアクリレート、2−メトキシエチルアクリレート、メトキシトリエチレングリコールアクリレート、2−エトキシエチルアクリレート、テトラヒドロフルフリルアクリレート、3−メトキシブチルアクリレート、ベンジルアクリレート、エトキシエトキシエチルアクリレート、ブトキシエチルアクリレート、エトキシジエチレングリコールアクリレート、メトキシジプロピレングリコールアクリレート、メチルフェノキシエチルアクリレート、ジプロピレングリコールアクリレート、β-カルボキシルエチルアクリレート、フェノキシジエチレングリコールアクリレート、ビニルカプロラクタム、ビニルピロリドン、N-ビニルホルムアミド、エチルジグリコールアクリレート、トリメチロールプロパンフォルマルモノアクリレート、4−t−ブチルシクロヘキシルアクリレート、トリ(メタ)アリルイソシアヌレート、イミドアクリレート、イソアミルアクリレート、エトキシ化コハク酸アクリレート、カプロラクトン変性テトラヒドロフルフリルアクリレート、トリブロモフェニルアクリレート、エトキシ化トリブロモフェニルアクリレート、トリフルオロエチルアクリレート、ω-カルボキシポリカプロラクトンモノアクリレート等が挙げられる。さらには、山下晋三ら編、「架橋剤ハンドブック」、(1981年、大成社)や加藤清視編、「UV・EB硬化ハンドブック(原料編)」、(1985年、高分子刊行会)、ラドテック研究会編、「UV・EB硬化技術の応用と市場」、79項、(1989年、シーエムシー)、赤松清編、「新・感光性樹脂の実際技術」、(1987年、シーエムシー)、滝山榮一郎著、「ポリエステル樹脂ハンドブック」、(1988年、日刊工業新聞社)に記載の市販品もしくは業界で公知の架橋性モノマーが挙げられるが、本発明はこれらに限定されるものではない。 Examples of monomers having a polymerizable functional group include ethylene glycol di (meth) acrylate, diethylene glycol di (meth) acrylate, polyethylene glycol di (meth) acrylate, 1,6-hexanediol di (meth) acrylate, ethoxylation 1 , 6-hexanediol diacrylate, neopentyl glycol di (meth) acrylate, ethoxylated neopentyl glycol di (meth) acrylate, propoxylated neopentyl glycol di (meth) acrylate, tripropylene glycol di (meth) acrylate, polypropylene glycol Diacrylate, 1,4-butanediol di (meth) acrylate, 1,9-nonanediol diacrylate, tetraethylene glycol diacrylate, 2-n-butyl-2-ethyl-1,3-propanedi Diacrylate, dimethylol tricyclodecane diacrylate, hydroxypivalate neopentyl glycol diacrylate, 1,3-butylene glycol di (meth) acrylate, ethoxylated bisphenol A di (meth) acrylate, propoxylated bisphenol A di (meth) ) Acrylate, cyclohexanedimethanol di (meth) acrylate, dimethylol dicyclopentane diacrylate, trimethylolpropane triacrylate, hydroxypivalic acid trimethylolpropane triacrylate, ethoxylated trimethylolpropane triacrylate, propoxylated trimethylolpropane triacrylate , Ethoxylated phosphate triacrylate, ethoxylated tripropylene glycol diacrylate, neopentyl glycol Modified trimethylolpropane diacrylate, stearic acid modified pentaerythritol diacrylate, pentaerythritol triacrylate, tetramethylolpropane triacrylate, tetramethylolmethane triacrylate, pentaerythritol tetraacrylate, caprolactone modified trimethylolpropane triacrylate, ethoxylated isocyanuric acid Triacrylate, tri (2-hydroxyethyl isocyanurate) triacrylate, propoxylate glyceryl triacrylate, tetramethylol methane tetraacrylate, pentaerythritol tetraacrylate, ditrimethylolpropane tetraacrylate, ethoxylated pentaerythritol tetraacrylate, dipentaerythritol hexaa Lilate, caprolactone-modified dipentaerythritol hexaacrylate, dipentaerythritol hydroxypentaacrylate, neopentyl glycol oligoacrylate, 1,4-butanediol oligoacrylate, 1,6-hexanediol oligoacrylate, trimethylolpropane oligoacrylate, pentaerythritol oligo Acrylate, 2-phenoxyethyl acrylate, acryloylmorpholine, 2-hydroxyethyl acrylate, 2-hydroxypropyl acrylate, 4-hydroxybutyl acrylate, isobutyl acrylate, t-butyl acrylate, isooctyl acrylate, isobornyl acrylate, cyclohexyl acrylate, 2 -Methoxyethyl acrylate, methoxytri Ethylene glycol acrylate, 2-ethoxyethyl acrylate, tetrahydrofurfuryl acrylate, 3-methoxybutyl acrylate, benzyl acrylate, ethoxyethoxyethyl acrylate, butoxyethyl acrylate, ethoxydiethylene glycol acrylate, methoxydipropylene glycol acrylate, methylphenoxyethyl acrylate, dipropylene Glycol acrylate, β-carboxyl ethyl acrylate, phenoxydiethylene glycol acrylate, vinyl caprolactam, vinyl pyrrolidone, N-vinylformamide, ethyl diglycol acrylate, trimethylolpropane formal monoacrylate, 4-t-butylcyclohexyl acrylate, tri (meth) allyl isocyania Nu And imide acrylate, isoamyl acrylate, ethoxylated succinic acid acrylate, caprolactone-modified tetrahydrofurfuryl acrylate, tribromophenyl acrylate, ethoxylated tribromophenyl acrylate, trifluoroethyl acrylate, and ω-carboxypolycaprolactone monoacrylate . Furthermore, edited by Shinzo Yamashita et al., “Cross-linking agent handbook” (1981, Taiseisha), Kiyoto Kato edition, “UV / EB curing handbook (raw material edition)”, (1985, Polymer publication society), Radtech. Study Group, "Application and Market of UV / EB Curing Technology", 79, (1989, CMC), Akamatsu Kiyoshi, "New Technology for Photosensitive Resins", (1987, CMC), Commercially available products described in Teiyama Shinichiro, “Polyester Resin Handbook” (1988, Nikkan Kogyo Shimbun) or cross-linkable monomers known in the industry can be mentioned, but the present invention is not limited thereto.
オリゴマー、プレポリマーの例としては、ダイセルUCB社製「Ebecryl230、244、245、270、280/15IB、284、285、4830、4835、4858、4883、8402、8803、8800、254、264、265、294/35HD、1259、1264、4866、9260、8210、1290、1290K、5129、2000、2001、2002、2100、KRM7222、KRM7735、4842、210、215、4827、4849、6700、6700−20T、204、205、6602、220、4450、770、IRR567、81、84、83、80、657、800、805、808、810、812、1657、1810、IRR302、450、670、830、835、870、1830、1870、2870、IRR267、813、IRR483、811、436、438、446、505、524、525、554W、584、586、745、767、1701、1755、740/40TP、600、601、604、605、607、608、609、600/25TO、616、645、648、860、1606、1608、1629、1940、2958、2959、3200、3201、3404、3411、3412、3415、3500、3502、3600、3603、3604、3605、3608、3700、3700−20H、3700−20T、3700−25R、3701、3701−20T、3703、3702、RDX63182、6040、IRR419」、サートマー社製「CN104、CN120、CN124、CN136、CN151、CN2270、CN2271E、CN435、CN454、CN970、CN971、CN972、CN9782、CN981、CN9893、CN991」、BASF社製「Laromer EA81、LR8713、LR8765、LR8986、PE56F、PE44F、LR8800、PE46T、LR8907、PO43F、PO77F、PE55F、LR8967、LR8981、LR8982、LR8992、LR9004、LR8956、LR8985、LR8987、UP35D、UA19T、LR9005、PO83F、PO33F、PO84F、PO94F、LR8863、LR8869、LR8889、LR8997、LR8996、LR9013、LR9019、PO9026V、PE9027V」、コグニス社製「フォトマー3005、3015、3016、3072、3982、3215、5010、5429、5430、5432、5662、5806、5930、6008、6010、6019、6184、6210、6217、6230、6891、6892、6893−20R、6363、6572、3660」、根上工業社製「アートレジンUN−9000HP、9000PEP、9200A、7600、5200、1003、1255、3320HA、3320HB、3320HC、3320HS、901T、1200TPK、6060PTM、6060P」、日本合成化学社製「紫光 UV−6630B、7000B、7510B、7461TE、3000B、3200B、3210EA、3310B、3500BA、3520TL、3700B、6100B、6640B、1400B、1700B、6300B、7550B、7605B、7610B、7620EA、7630B、7640B、2000B、2010B、2250EA、2750B」、日本化薬社製「カヤラッドR−280、R−146、R131、R−205、EX2320、R190、R130、R−300、C−0011、TCR−1234、ZFR−1122、UX−2201、UX−2301、UX3204、UX−3301、UX−4101、UX−6101、UX−7101、MAX−5101、MAX−5100、MAX−3510、UX−4101」等が挙げられる。本発明はこれらに限定されるものではない。 Examples of oligomers and prepolymers include “Ebecryl 230, 244, 245, 270, 280 / 15IB, 284, 285, 4830, 4835, 4858, 4883, 8402, 8803, 8800, 254, 264, 265, manufactured by Daicel UCB. 294 / 35HD, 1259, 1264, 4866, 9260, 8210, 1290, 1290K, 5129, 2000, 2001, 2002, 2100, KRM7222, KRM7735, 4842, 210, 215, 4827, 4849, 6700, 6700-20T, 204, 205, 6602, 220, 4450, 770, IRR567, 81, 84, 83, 80, 657, 800, 805, 808, 810, 812, 1657, 1810, IRR302, 450, 670, 30, 835, 870, 1830, 1870, 2870, IRR267, 813, IRR483, 811, 436, 438, 446, 505, 524, 525, 554W, 584, 586, 745, 767, 1701, 1755, 740 / 40TP, 600, 601, 604, 605, 607, 608, 609, 600 / 25TO, 616, 645, 648, 860, 1606, 1608, 1629, 1940, 2958, 2959, 3200, 3201, 3404, 3411, 3412, 3415, 3500, 3502, 3600, 3603, 3604, 3605, 3608, 3700, 3700-20H, 3700-20T, 3700-25R, 3701, 3701-20T, 3703, 3702, RDX63182, 6040, IR 419 ”, manufactured by Sartomer“ CN104, CN120, CN124, CN136, CN151, CN2270, CN2271E, CN435, CN454, CN970, CN971, CN972, CN9782, CN981, CN9873, CN991 ”L871 , LR8986, PE56F, PE44F, LR8800, PE46T, LR8907, PO43F, PO77F, PE55F, LR8967, LR8981, LR8982, LR8992, LR9004, LR8956, LR8985, LR8987, UP35D, UA19T, F83L63 , LR8869, LR8889, LR8997, R8996, LR9013, LR9019, PO9026V, PE9027V, manufactured by Cognis, "Photomer 3005, 3015, 3016, 3072, 3982, 3215, 5010, 5429, 5430, 5432, 5662, 5806, 5930, 6008, 6010, 6019, 6184, 6210, 6217, 6230, 6891, 6892, 6893-20R, 6363, 6572, 3660, manufactured by Negami Kogyo Co., Ltd., "Art Resin UN-9000HP, 9000PEP, 9200A, 7600, 5200, 1003, 1255, 3320HA, 3320HB, 3320HC, 3320HS, 901T, 1200TPK, 6060PTM, 6060P ", manufactured by Nippon Synthetic Chemical Co., Ltd.," purple light UV-6630B, 7000B, 7510B, 746 " 1TE, 3000B, 3200B, 3210EA, 3310B, 3500BA, 3520TL, 3700B, 6100B, 6640B, 1400B, 1700B, 6300B, 7550B, 7605B, 7610B, 7620EA, 7630B, 7640B, 2000B, 2010B, 2250EA, 2750B, Nippon Kayaku “Kayarad R-280, R-146, R131, R-205, EX2320, R190, R130, R-300, C-0011, TCR-1234, ZFR-1122, UX-2201, UX-2301, UX3204, UX-3301, UX-4101, UX-6101, UX-7101, MAX-5101, MAX-5100, MAX-3510, UX-4101 "and the like. The present invention is not limited to these.
重合性官能基を有する化合物は、単独で、または2種類以上を組み合わせて用いることができる。重合性官能基を有する化合物の配合量は、重合性組成物全体に対して70〜99.5重量%、より好ましくは75〜99重量%、最も好ましくは80〜99重量%であることが好ましい。 The compounds having a polymerizable functional group can be used alone or in combination of two or more. The compounding amount of the compound having a polymerizable functional group is preferably 70 to 99.5% by weight, more preferably 75 to 99% by weight, and most preferably 80 to 99% by weight with respect to the entire polymerizable composition. .
重合開始剤としては、イルガキュアー651、イルガキュアー184、ダロキュアー1173、イルガキュアー500、イルガキュアー1000、イルガキュアー2959、イルガキュアー907、イルガキュアー369、イルガキュアー379、イルガキュアー1700、イルガキュアー149、イルガキュアー1800、イルガキュアー1850、イルガキュアー819、イルガキュアー784、イルガキュアー261、イルガキュアーOXE−01(CGI124)、CGI242(チバ・スペシャルティー・ケミカルズ社)、アデカオプトマーN1414、アデカオプトマーN1717(旭電化社)、Esacure1001M(Lamberti社)、ルシリンTPO(BASF社)、ダイドキュア174(大同化成社製)、特公昭59−1281号公報、特公昭61−9621号公報ならびに特開昭60−60104号公報記載のトリアジン誘導体、特開昭59−1504号公報ならびに特開昭61−243807号公報記載の有機過酸化物、特公昭43−23684号公報、特公昭44−6413号公報、特公昭47−1604号公報ならびにUSP第3567453号明細書記載のジアゾニウム化合物公報、USP第2848328号明細書、USP第2852379号明細書ならびにUSP第2940853号明細書記載の有機アジド化合物、特公昭36−22062号公報、特公昭37−13109号公報、特公昭38−18015号公報ならびに特公昭45−9610号公報記載のオルト−キノンジアジド類、特公昭55−39162号公報、特開昭59−140203号公報ならびに「マクロモレキュルス(MACROMOLECULES)」、第10巻、第1307頁(1977年)記載のヨードニウム化合物をはじめとする各種オニウム化合物、特開昭59−142205号公報記載のアゾ化合物、特開平1−54440号公報、ヨーロッパ特許第109851号明細書、ヨーロッパ特許第126712号明細書、「ジャーナル・オブ・イメージング・サイエンス(J.IMAG.SCI.)」、第30巻、第174頁(1986年)記載の金属アレン錯体、特開昭61−151197号公報記載のチタノセン類、「コーディネーション・ケミストリー・レビュー(COORDINATION CHEMISTRY REVIEW)」、第84巻、第85〜第277頁(1988年)ならびに特開平2−182701号公報記載のルテニウム等の遷移金属を含有する遷移金属錯体、特開平3−209477号公報記載のアルミナート錯体、特開平2−157760号公報記載のホウ酸塩化合物、特開昭55−127550号公報ならびに特開昭60−202437号公報記載の2,4,5−トリアリールイミダゾール二量体、2,2’−ビス(o−クロロフェニル)−4,4’,5,5’−テトラフェニル−1,1’−ビイミダゾール、四臭化炭素や特開昭59−107344号公報記載の有機ハロゲン化合物、特開平5−213861号公報、特開平5−255347号公報、特開平5−255421号公報、特開平6−157623号公報、特開2000−344812号公報、特開2002−265512号公報、特願2004−053009号公報、ならびに特願2004−263413号公報記載のスルホニウム錯体またはオキソスルホニウム錯体、特開2001−264530号公報、特開2001−261761号公報、特開2000−80068号公報、特開2001−233842号公報、USP3558309号明細書(1971年)、USP4202697号明細書(1980年)、特開昭61−24558号公報、特表2004−534797号公報、ならびに特開2004−359639号公報記載のオキシムエステル化合物、特表2002−530372号公報記載の二官能性光開始剤などが挙げられるが、本発明はこれらに限定されるものではない。重合開始剤は、単独で、または2種類以上を組み合わせて用いることができる。 Irgacure 651, Irgacure 184, Darocur 1173, Irgacure 500, Irgacure 1000, Irgacure 2959, Irgacure 907, Irgacure 369, Irgacure 379, Irgacure 1700, Irgacure 149, Irgacure Cure 1800, Irgacure 1850, Irgacure 819, Irgacure 784, Irgacure 261, Irgacure OXE-01 (CGI124), CGI242 (Ciba Specialty Chemicals), Adekaoptomer N1414, Adekaoptomer N1717 (Asahi) Denka), Esacure 1001M (Lamberti), Lucyrin TPO (BASF), DidoCure 174 (Daido Kasei Co., Ltd.), JP-B 59-1281 And triazine derivatives described in JP-B-61-9621 and JP-A-60-60104, organic peroxides described in JP-A-59-1504 and JP-A-61-243807, and JP-B-43 No. 236844, Japanese Examined Patent Publication No. 44-6413, Japanese Examined Patent Publication No. 47-1604 and US Pat. No. 3,567,453, Japanese Patent Publication No. 2,848,328, USP No. 2,852,379, and US Pat. No. 2,940,553. Organic azide compounds described in the specification, ortho-quinonediazides described in Japanese Patent Publication No. 36-22062, Japanese Patent Publication No. 37-13109, Japanese Patent Publication No. 38-18015 and Japanese Patent Publication No. 45-9610, Japanese Patent Publication No. 55 -39162, JP-A-59-140203 And various onium compounds such as iodonium compounds described in “MACROMOLECULES”, Vol. 10, page 1307 (1977), azo compounds described in JP-A-59-142205, JP-A-1 -54440, European Patent No. 109851, European Patent No. 126712, "Journal of Imaging Science (J. IMAGE. SCI.)", Volume 30, p. 174 (1986). The metal allene complexes described above, the titanocenes described in JP-A No. 61-151197, “COORDINATION CHEMISTRY REVIEW”, Vol. 84, pages 85-277 (1988) and JP-A No. 2 -1822701 publication Transition metal complexes containing transition metals such as ruthenium, aluminate complexes described in JP-A-3-209477, borate compounds described in JP-A-2-157760, JP-A-55-127550 and JP 2,4,5-triarylimidazole dimer described in JP-A-60-202437, 2,2′-bis (o-chlorophenyl) -4,4 ′, 5,5′-tetraphenyl-1,1 ′ -Biimidazole, carbon tetrabromide, organic halogen compounds described in JP-A-59-107344, JP-A-5-213861, JP-A-5-255347, JP-A-5-255421, JP-A-6 JP-A-157623, JP-A-2000-344812, JP-A-2002-265512, Japanese Patent Application No. 2004-053009, and Japanese Patent Application No. 004-263413, sulfonium complex or oxosulfonium complex, JP 2001-264530 A, JP 2001-261661 A, JP 2000-80068 A, JP 2001-233842 A, US Pat. No. 3,558,309. (1971), USP 4202697 specification (1980), Japanese Patent Application Laid-Open No. 61-24558, Japanese Patent Application Publication No. 2004-534797, and Japanese Patent Application Laid-Open No. 2004-359539, Japanese Patent Application Publication No. 2002-530372. Examples of the bifunctional photoinitiator described in the publication No. are mentioned, but the present invention is not limited thereto. A polymerization initiator can be used individually or in combination of 2 or more types.
また、重合性組成物に、紫外から近赤外の光に対して吸収を持つ増感剤を加えることにより、紫外から近赤外領域にかけての光に対する活性を高め、極めて高感度な重合性組成物とすることが可能である。 In addition, by adding a sensitizer that absorbs ultraviolet to near-infrared light to the polymerizable composition, the activity for light from the ultraviolet to the near-infrared region is increased, and an extremely sensitive polymerizable composition. Can be a product.
そのような増感剤としては、ベンゾフェノン類、カルコン誘導体やジベンザルアセトンなどに代表される不飽和ケトン類、ベンジルやカンファーキノンなどに代表される1,2−ジケトン誘導体、ベンゾイン誘導体、フルオレン誘導体、ナフトキノン誘導体、アントラキノン誘導体、キサンテン誘導体、チオキサンテン誘導体、キサントン誘導体、チオキサントン誘導体、クマリン誘導体、ケトクマリン誘導体、シアニン誘導体、メロシアニン誘導体、オキソノール誘導体等のポリメチン色素、アクリジン誘導体、アジン誘導体、チアジン誘導体、オキサジン誘導体、インドリン誘導体、アズレン誘導体、アズレニウム誘導体、スクアリリウム誘導体、ポルフィリン誘導体、テトラフェニルポルフィリン誘導体、トリアリールメタン誘導体、テトラベンゾポルフィリン誘導体、テトラピラジノポルフィラジン誘導体、フタロシアニン誘導体、テトラアザポルフィラジン誘導体、テトラキノキサリロポルフィラジン誘導体、ナフタロシアニン誘導体、サブフタロシアニン誘導体、ピリリウム誘導体、チオピリリウム誘導体、テトラフィリン誘導体、アヌレン誘導体、スピロピラン誘導体、スピロオキサジン誘導体、チオスピロピラン誘導体、金属アレーン錯体、有機ルテニウム錯体などが挙げられ、その他さらに具体例には大河原信ら編、「色素ハンドブック」(1986年、講談社)、大河原信ら編、「機能性色素の化学」(1981年、シーエムシー)、池森忠三朗ら編、「特殊機能材料」(1986年、シーエムシー)に記載の色素および増感剤が挙げられるがこれらに限定されるものではない。その他、紫外から近赤外域にかけての光に対して吸収を示す色素や増感剤が挙げられる。これらは必要に応じて任意の比率で二種以上用いてもかまわない。上記、増感剤の中でチオキサントン誘導体としては、2,4−ジエチルチオキサントン、2−クロロチオキサントン、2,4−ジクロロチオキサントン、2−イソプロピルチオキサントン、4−イソプロピルチオキサントン、1−クロロ−4−プロポキシチオキサントンなどを挙げることができ、ベンゾフェノン類としては、ベンゾフェノン、4−メチルベンゾフェノン、2,4,6−トリメチルベンゾフェノン、4,4’−ジメチルベンゾフェノン、4,4’−ジメトキシベンゾフェノン、4,4’−ビス(ジエチルアミノ)ベンゾフェノンなどを挙げることができ、クマリン類としては、クマリン1、クマリン338、クマリン102などを挙げることができ、ケトクマリン類としては、3,3’−カルボニルビス(7−ジエチルアミノクマリン)などを挙げることができるが、これらに限定されるものではない。 Examples of such sensitizers include benzophenones, unsaturated ketones typified by chalcone derivatives and dibenzalacetone, 1,2-diketone derivatives typified by benzyl and camphorquinone, benzoin derivatives, and fluorene derivatives. , Naphthoquinone derivatives, anthraquinone derivatives, xanthene derivatives, thioxanthene derivatives, xanthone derivatives, thioxanthone derivatives, coumarin derivatives, ketocoumarin derivatives, cyanine derivatives, merocyanine derivatives, oxonol derivatives and other polymethine dyes, acridine derivatives, azine derivatives, thiazine derivatives, oxazine derivatives , Indoline derivatives, azulene derivatives, azurenium derivatives, squarylium derivatives, porphyrin derivatives, tetraphenylporphyrin derivatives, triarylmethane derivatives, Trabenzoporphyrin derivative, tetrapyrazinoporphyrazine derivative, phthalocyanine derivative, tetraazaporphyrazine derivative, tetraquinoxalyloporphyrazine derivative, naphthalocyanine derivative, subphthalocyanine derivative, pyrylium derivative, thiopyrylium derivative, tetraphyrin derivative, annulene derivative, Spiropyran derivatives, spirooxazine derivatives, thiospiropyran derivatives, metal arene complexes, organoruthenium complexes, and the like. Other specific examples include Okawara Nobu et al., “Dye Handbook” (1986, Kodansha), Okawara Nobu et al. Examples include, but are not limited to, the dyes and sensitizers described in “Chemicals of Functional Dyes” (1981, CMC), edited by Tadasaburo Ikemori, “Special Functional Materials” (1986, CMC). thing No. Other examples include dyes and sensitizers that absorb light in the ultraviolet to near infrared region. Two or more of these may be used in any ratio as required. Among the sensitizers, thioxanthone derivatives include 2,4-diethylthioxanthone, 2-chlorothioxanthone, 2,4-dichlorothioxanthone, 2-isopropylthioxanthone, 4-isopropylthioxanthone, 1-chloro-4-propoxythioxanthone. Examples of benzophenones include benzophenone, 4-methylbenzophenone, 2,4,6-trimethylbenzophenone, 4,4′-dimethylbenzophenone, 4,4′-dimethoxybenzophenone, 4,4′-bis. (Diethylamino) benzophenone and the like can be mentioned. Coumarins can include coumarin 1, coumarin 338, coumarin 102 and the like. Ketocoumarins can include 3,3′-carbonylbis (7-diethylaminocouma). Emissions) and the like, but not limited thereto.
本発明で使用される重合開始剤および増感剤の配合量は特に限定されないが、これらの合計量が、好ましくは、重合性組成物全体の0〜20重量%、より好ましくは、0.1〜15重量%の範囲である。 The blending amount of the polymerization initiator and the sensitizer used in the present invention is not particularly limited, but the total amount thereof is preferably 0 to 20% by weight of the whole polymerizable composition, more preferably 0.1%. It is in the range of ˜15% by weight.
本発明の帯電防止剤を重合性組成物に配合する量は特に限定されない。しかし、多量に配合すると、硬化に時間がかかる、完全に硬化できないといった硬化特性に影響を与える場合があるので、好ましい配合量は重合性組成物全体に対して0.01〜30重量%、より好ましくは0.02〜25重量%、最も好ましくは0.02〜20重量%である。 The amount of the antistatic agent of the present invention blended in the polymerizable composition is not particularly limited. However, if blended in a large amount, it may take a long time to cure, and may affect curing properties such as being unable to cure completely. Therefore, the preferable blending amount is 0.01 to 30% by weight based on the entire polymerizable composition, more Preferably it is 0.02-25 weight%, Most preferably, it is 0.02-20 weight%.
また、本発明の重合性組成物は、保存時の重合を防止する目的で重合禁止剤を添加することが可能である。 In addition, a polymerization inhibitor can be added to the polymerizable composition of the present invention for the purpose of preventing polymerization during storage.
添加可能な重合禁止剤の具体例としては、ハイドロキノン、p−メトキシフェノール、アルキル置換ハイドロキノン、カテコール、tert−ブチルカテコール、フェノチアジン等を挙げることができる。重合禁止剤の添加量はとくに限定されるものではないが、好ましくは重合性組成物中に0.01〜5重量%の範囲で用いられる。 Specific examples of the polymerization inhibitor that can be added include hydroquinone, p-methoxyphenol, alkyl-substituted hydroquinone, catechol, tert-butylcatechol, phenothiazine, and the like. The addition amount of the polymerization inhibitor is not particularly limited, but is preferably used in the range of 0.01 to 5% by weight in the polymerizable composition.
さらに、本発明の重合性組成物には、さらに重合を促進する目的で、アミンやチオール、ジスルフィドなどに代表される重合促進剤や連鎖移動触媒を添加することが可能である。 Furthermore, in the polymerizable composition of the present invention, a polymerization accelerator represented by amine, thiol, disulfide or the like or a chain transfer catalyst can be added for the purpose of further promoting the polymerization.
本発明の重合性組成物に添加可能な重合促進剤や連鎖移動触媒の具体例としては、例えば、トリメチルアミン、メチルジメタノールアミン、N−フェニルグリシン、トリエタノールアミン、N,N−ジエチルアニリン等のアミン類、USP第4414312号明細書や特開昭64−13144号公報記載のチオール類、特開平2−291561号公報記載のジスルフィド類、USP第3558322号明細書や特開昭64−17048号公報記載のチオン類、特開平2−291560号公報記載のO−アシルチオヒドロキサメートやN−アルコキシピリジンチオン類が挙げられる。重合促進剤や連鎖移動触媒の添加量はとくに限定されるものではないが、好ましくは重合性組成物中に0.001〜5重量%の範囲で用いられる。 Specific examples of the polymerization accelerator and chain transfer catalyst that can be added to the polymerizable composition of the present invention include, for example, trimethylamine, methyldimethanolamine, N-phenylglycine, triethanolamine, N, N-diethylaniline and the like. Amines, thiols described in USP No. 4414312 and JP-A 64-13144, disulfides described in JP-A-2-291561, USP 3558322 and JP-A 64-17048 And the O-acylthiohydroxamates and N-alkoxypyridinethiones described in JP-A-2-291560. The addition amount of the polymerization accelerator and the chain transfer catalyst is not particularly limited, but is preferably used in the range of 0.001 to 5% by weight in the polymerizable composition.
本発明における重合性組成物は、紫外線や可視光線、近赤外線、電子線等によるエネルギーの付与により重合し、目的とする重合物を得ることが可能である。尚、本明細書でいう紫外線、可視光線、近赤外線等の定義は久保亮五ら編「岩波理化学辞典第4版」(1987年、岩波)によった。 The polymerizable composition in the present invention can be polymerized by applying energy by ultraviolet rays, visible rays, near infrared rays, electron beams or the like to obtain a desired polymer. The definitions of ultraviolet rays, visible rays, near-infrared rays and the like in this specification are based on “Iwanami Rikagaku Dictionary 4th Edition” (1987, Iwanami) edited by Ryogo Kubo et al.
したがって、本発明の重合性組成物は、低圧水銀灯、中圧水銀灯、高圧水銀灯、超高圧水銀灯、キセノンランプ、カーボンアーク灯、メタルハライドランプ、蛍光灯、タングステンランプ、アルゴンイオンレーザ、ヘリウムカドミウムレーザ、ヘリウムネオンレーザ、クリプトンイオンレーザ、各種半導体レーザ、YAGレーザ、発光ダイオード、CRT光源、プラズマ光源、電子線、γ線、ArFエキシマーレーザ、KrFエキシマーレーザ、F2レーザ等の各種光源によるエネルギーの付与により目的とする重合物(硬化物)を得ることができる。 Therefore, the polymerizable composition of the present invention includes a low pressure mercury lamp, a medium pressure mercury lamp, a high pressure mercury lamp, an ultrahigh pressure mercury lamp, a xenon lamp, a carbon arc lamp, a metal halide lamp, a fluorescent lamp, a tungsten lamp, an argon ion laser, a helium cadmium laser, and helium. Neon laser, krypton ion laser, various semiconductor lasers, YAG laser, light emitting diode, CRT light source, plasma light source, electron beam, gamma ray, ArF excimer laser, KrF excimer laser, F2 laser, etc. A polymer (cured product) can be obtained.
本発明における帯電防止剤を使用する際に、必要に応じて他の帯電防止剤、顔料、着色剤、酸化防止剤、紫外線吸収剤、補強剤、耐候剤、滑剤、ブロッキング防止剤、可塑剤、香料、無機電解質、発泡剤、難燃剤、フィラー、表面調整剤等の添加物を同時に配合することも可能である。 When using the antistatic agent in the present invention, other antistatic agents, pigments, colorants, antioxidants, ultraviolet absorbers, reinforcing agents, weathering agents, lubricants, antiblocking agents, plasticizers, if necessary. Additives such as a fragrance, an inorganic electrolyte, a foaming agent, a flame retardant, a filler, and a surface conditioner can be blended at the same time.
他の帯電防止剤としては、グリセリンモノ脂肪酸エステル、ポリグリセリン脂肪酸エステル、ジエタノールアミン脂肪酸アミド、ポリアルキレングリコールアルキルエーテル、N−アルキルアンモニウムクロライド、金属微粒子、金属酸化物(ITO、FTO、ATO等)等が挙げられる。 Other antistatic agents include glycerin mono fatty acid ester, polyglycerin fatty acid ester, diethanolamine fatty acid amide, polyalkylene glycol alkyl ether, N-alkyl ammonium chloride, metal fine particles, metal oxides (ITO, FTO, ATO, etc.), etc. Can be mentioned.
顔料としては、カーボンブラック、酸化鉄、炭酸カルシウム、酸化チタン、酸化亜鉛、カドミウムイエロー、ニッケルチタンイエロー、ストロンチウムクロマート、プルシアンブルー等の無機顔料、アゾ顔料、インジゴ顔料、フタロシアニン顔料、キノフタロン顔料、イソインドリン顔料、イソインドリノン顔料、ジケトピロロピロール顔料、キナクリドン顔料、ペリレン顔料、インダンスロン顔料、ペリノン顔料、ジオキサジン顔料等の有機顔料が挙げられる。 Examples of pigments include inorganic pigments such as carbon black, iron oxide, calcium carbonate, titanium oxide, zinc oxide, cadmium yellow, nickel titanium yellow, strontium chromate and Prussian blue, azo pigments, indigo pigments, phthalocyanine pigments, quinophthalone pigments, Examples thereof include organic pigments such as indoline pigments, isoindolinone pigments, diketopyrrolopyrrole pigments, quinacridone pigments, perylene pigments, indanthrone pigments, perinone pigments, and dioxazine pigments.
酸化防止剤としては、例えば、2,6−ジ−tert.−ブチルフェノール(以下、tert.−ブチルを「t−ブチル」と略記する。)、2,6−ジ−t−ブチル−4−メチルフェノール、2,6−ジ−t−ブチル−4−エチルフェノール、2,4−ジメチル−6−t−ブチルフェノール、4,4’−メチレンビス(2,6−ジ−t−ブチルフェノール)、4,4’−ビス(2,6−ジ−t−ブチルフェノール)、4,4’−ビス(2−メチル−6−t−ブチルフェノール)、2,2’−メチレンビス(4−メチル−6−t−ブチルフェノール)、2,2’−メチレンビス(4−エチル−6−t−ブチルフェノール)、4,4’−ブチリデンビス(3−メチル−6−t−ブチルフェノール)、4,4’−イソプロピリデンビス(2,6−ジ−t−ブチルフェノール)、2,2’−メチレンビス(4−メチル−6−シクロヘキシルフェノール)、2,2’−メチレンビス(4−メチル−6−ノニルフェノール)、2,2’−イソブチリデンビス(4,6−ジメチルフェノール)、2,6−ビス(2’−ヒドロキシ−3’−t−ブチル−5’−メチルベンジル)4−メチルフェノール、3−t−ブチル−4−ヒドロキシアニソール、2−t−ブチル−4−ヒドロキシアニソール、3−(4−ヒドロキシ−3,5−ジ−t−ブチルフェニル)プロピオン酸ステアリル、3−(4−ヒドロキシ−3,5−ジ−t−ブチルフェニル)プロピオン酸オレイル、3−(4−ヒドロキシ−3,5−ジ−t−ブチルフェニル)プロピオン酸ドデシル、3−(4−ヒドロキシ−3,5−ジ−t−ブチルフェニル)プロピオン酸オクチル、テトラキス{3−(4−ヒドロキシ−3,5−ジ−t−ブチルフェニル)プロピオニルオキシメチル}メタン、3−(4−ヒドロキシ−3,5−ジ−t−ブチルフェニル)プロピオン酸グリセリンモノエステル、3−(4−ヒドロキシ−3,5−ジ−t−ブチルフェニル)プロピオン酸とグリセリンモノオレイルエーテルとのエステル、3−(4−ヒドロキシ−3,5−ジ−t−ブチルフェニル)プロピオン酸ブチレングリコールエステル、3−(4−ヒドロキシ−3,5−ジ−t−ブチルフェニル)プロピオン酸チオジグリコールエステル、4,4’−チオビス(3−メチル−6−t−ブチルフェノール)、4,4’−チオビス(2−メチル−6−t−ブチルフェノール)、2,2’−チオビス(4−メチル−6−t−ブチルフェノール)、2,6−ジ−t−ブチル−α−ジメチルアミノ−p−クレゾール、2,6−ジ−t−ブチル−4(N,N’−ジメチルアミノメチルフェノール)、ビス(3,5−ジ−t−ブチル−4−ヒドロキシベンジル)サルファイド、トリス{(3,5−ジ−t−ブチル−4−ヒドロキシフェニル)プロピオニル−オキシエチル}イソシアヌルレート、トリス(3,5−ジ−t−ブチル−4−ヒドロキシフェニル)イソシアヌレート、1,3,5−トリス(3’,5’−ジ−t−ブチル−4−ヒドロキシベンゾイル)イソシアヌレート、ビス{2−メチル−4−(3−n−アルキルチオプロピオニルオキシ)−5−t−ブチルフェニル)サルファイド、1,3,5−トリス(4−ジ−t−ブチル−3−ヒドロキシ−2,6−ジメチルベンジル)イソシアヌレート、テトラフタロイル−ジ(2,6−ジメチル−4−t−ブチル−3−ヒドロキシベンジルサルファイド)、6−(4−ヒドロキシ−3,5−ジ−t−ブチルアニリノ)−2,4−ビス(オクチルチオ)−1,3,5−トリアジン、2,2−チオ−{ジエチル−ビス−3−(3,5−ジ−t−ブチル−4−ヒドロキシフェニル)}プロピオネート、N,N’−ヘキサメチレンビス(3,5−ジ−t−ブチル−4−ヒドロキシ−ヒドロシナミド)、3,5−ジ−t−ブチル−4−ヒドロキシ−ベンジル−リン酸ジエステル、ビス(3−メチル−4−ヒドロキシ−5−t−ブチルベンジル)サルファイド、3,9−ビス[1,1−ジメチル−2−{β−(3−t−ブチル−4−ヒドロキシ−5−メチルフェニル)プロピオニルオキシ}エチル]−2,4,8,10−テトラオキサスピロ[5,5]ウンデカン、1,1,3−トリス(2−メチル−4−ヒドロキシ−5−t−ブチルフェニル)ブタン、1,3,5−トリメチル−2,4,6−トリス(3,5−ジ−t−ブチル−4−ヒドロキシベンジル)ベンゼン、ビス{3,3’−ビス−(4’−ヒドロキシ−3’−t−ブチルフェニル)ブチリックアシッド}グリコールエステル、トリフェニルホスファイト、ジフェニルイソデシルホスファイト、フェニルジイソデシルホスファイト、4,4−ブチリデンビス(3−メチル−6−t−ブチルフェニルジイソトリデシル)ホスファイト、ジステアリルペンタエリスリトールジホスファイト、ジイソデシルペンタエリスリトールジホスファイト、トリス(ノニルフェニル)ホスファイト、トリス(ジノニルフェニル)ホスファイト、トリス(2,4−ジ−t−ブチルフェニル)ホスファイト、ビス(2,6−ジ−t−ブチル−4−メチルフェニル)ペンタエリスリトールホスファイト、2,2−メチレンビス(4,6−ジ−t−ブチルフェニル)オクチルホスファイト、1,1,3−ブチリジントリス(3−メチル−6−t−ブチルフェニルジイソトリデシル)ホスファイト、2,2−プロピリデンビス(3−メチル−6−t−ブチルフェニルジイソトリデシル)ホスファイト、テトラキス(2,4−ジ−t−ブチルフェニル)−4,4−ビフェニレン−ジホスホナイト、9,10−ジヒドロ−9−オキサ−10−ホスファフェナントレン−10−オキサイド、10−(3,5−ジ−t−ブチル−4−ヒドロキシベンジル)−9,10−ジヒドロ−9−オキサ−10−ホスファフェナントレン−10−オキサイド、10−デシルオキシ−9,10−ジヒドロ−9−オキサ−10−ホスファフェナントレン、ジオクチルチオジプロピオネート、ジデシルチオジプロピオネート、ジラウリルチオジプロピオネート、ジミリスチルチオジプロピオネート、ジステアリルチオジプロピオネート、ラウリルステアリルチオジプロピオネート、ジステアリル−β,β’−チオジブチレート、(3−オクチルチオプロピオン酸)ペンタエリスリトールテトラエステル、(3−デシルチオプロピオン酸)ペンタエリスリトールテトラエステル、(3−ラウリルチオプロピオン酸)ペンタエリスリトールテトラエステル、(3−ステアリルチオプロピオン酸)ペンタエリスリトールテトラエステル、(3−オレイルチオプロピオン酸)ペンタエリスリトールテトラエステル、(3−ラウリルチオプロピオン酸)−4,4’−チオジ(3−メチル−5−t−ブチル−4−フェノール)エステル、2−メルカプトベンズイミダゾール、2−メルカプトメチルベンズイミダゾール、2−ベンズイミダゾールジスルフィド、ジラウリルサルファイド、アミルチオグリコール等が挙げられる。 Examples of the antioxidant include 2,6-di-tert. -Butylphenol (hereinafter, tert.-butyl is abbreviated as "t-butyl"), 2,6-di-t-butyl-4-methylphenol, 2,6-di-t-butyl-4-ethylphenol 2,4-dimethyl-6-tert-butylphenol, 4,4′-methylenebis (2,6-di-tert-butylphenol), 4,4′-bis (2,6-di-tert-butylphenol), 4 , 4'-bis (2-methyl-6-t-butylphenol), 2,2'-methylenebis (4-methyl-6-t-butylphenol), 2,2'-methylenebis (4-ethyl-6-t-) Butylphenol), 4,4′-butylidenebis (3-methyl-6-tert-butylphenol), 4,4′-isopropylidenebis (2,6-di-tert-butylphenol), 2,2′-methylenebis (4- Methyl-6-cyclo Xylphenol), 2,2'-methylenebis (4-methyl-6-nonylphenol), 2,2'-isobutylidenebis (4,6-dimethylphenol), 2,6-bis (2'-hydroxy-3) '-T-butyl-5'-methylbenzyl) 4-methylphenol, 3-t-butyl-4-hydroxyanisole, 2-t-butyl-4-hydroxyanisole, 3- (4-hydroxy-3,5- Stearyl di-t-butylphenyl) propionate, oleyl 3- (4-hydroxy-3,5-di-t-butylphenyl) propionate, 3- (4-hydroxy-3,5-di-t-butylphenyl) ) Dodecyl propionate, octyl 3- (4-hydroxy-3,5-di-t-butylphenyl) propionate, tetrakis {3- (4-hydroxy-3,5-di-t-butylpheny) ) Propionyloxymethyl} methane, 3- (4-hydroxy-3,5-di-t-butylphenyl) propionic acid glycerin monoester, 3- (4-hydroxy-3,5-di-t-butylphenyl) propion Esters of acids with glycerin monooleyl ether, 3- (4-hydroxy-3,5-di-t-butylphenyl) propionic acid butylene glycol ester, 3- (4-hydroxy-3,5-di-t-butyl) Phenyl) propionic acid thiodiglycol ester, 4,4′-thiobis (3-methyl-6-tert-butylphenol), 4,4′-thiobis (2-methyl-6-tert-butylphenol), 2,2′- Thiobis (4-methyl-6-tert-butylphenol), 2,6-di-tert-butyl-α-dimethylamino-p-cresol, 2,6-di-tert-butyl 4 (N, N′-dimethylaminomethylphenol), bis (3,5-di-tert-butyl-4-hydroxybenzyl) sulfide, tris {(3,5-di-tert-butyl-4-hydroxyphenyl) Propionyl-oxyethyl} isocyanurate, tris (3,5-di-t-butyl-4-hydroxyphenyl) isocyanurate, 1,3,5-tris (3 ′, 5′-di-t-butyl-4-hydroxy) Benzoyl) isocyanurate, bis {2-methyl-4- (3-n-alkylthiopropionyloxy) -5-tert-butylphenyl) sulfide, 1,3,5-tris (4-di-tert-butyl-3- Hydroxy-2,6-dimethylbenzyl) isocyanurate, tetraphthaloyl-di (2,6-dimethyl-4-tert-butyl-3-hydroxybenzyl sulfide), 6 -(4-Hydroxy-3,5-di-t-butylanilino) -2,4-bis (octylthio) -1,3,5-triazine, 2,2-thio- {diethyl-bis-3- (3 5-di-t-butyl-4-hydroxyphenyl)} propionate, N, N′-hexamethylenebis (3,5-di-t-butyl-4-hydroxy-hydrocinnamide), 3,5-di-t- Butyl-4-hydroxy-benzyl-phosphate diester, bis (3-methyl-4-hydroxy-5-tert-butylbenzyl) sulfide, 3,9-bis [1,1-dimethyl-2- {β- (3 -T-butyl-4-hydroxy-5-methylphenyl) propionyloxy} ethyl] -2,4,8,10-tetraoxaspiro [5,5] undecane, 1,1,3-tris (2-methyl- 4-hydroxy-5-t-butyl Phenyl) butane, 1,3,5-trimethyl-2,4,6-tris (3,5-di-t-butyl-4-hydroxybenzyl) benzene, bis {3,3'-bis- (4'- Hydroxy-3'-t-butylphenyl) butyric acid} glycol ester, triphenyl phosphite, diphenylisodecyl phosphite, phenyl diisodecyl phosphite, 4,4-butylidenebis (3-methyl-6-tert-butylphenyldi) Sotridecyl) phosphite, distearyl pentaerythritol diphosphite, diisodecylpentaerythritol diphosphite, tris (nonylphenyl) phosphite, tris (dinonylphenyl) phosphite, tris (2,4-di-t-butylphenyl) ) Phosphite, bis (2,6-di-tert-butyl-4-methylphenol) Nyl) pentaerythritol phosphite, 2,2-methylenebis (4,6-di-tert-butylphenyl) octyl phosphite, 1,1,3-butyridine tris (3-methyl-6-tert-butylphenyl diisotri) Decyl) phosphite, 2,2-propylidenebis (3-methyl-6-tert-butylphenyldiisotridecyl) phosphite, tetrakis (2,4-di-tert-butylphenyl) -4,4-biphenylene-diphosphonite, 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide, 10- (3,5-di-t-butyl-4-hydroxybenzyl) -9,10-dihydro-9-oxa-10 Phosphaphenanthrene-10-oxide, 10-decyloxy-9,10-dihydro-9-oxa-10-phosphaphenane Len, Dioctylthiodipropionate, Didecylthiodipropionate, Dilaurylthiodipropionate, Dimyristylthiodipropionate, Distearylthiodipropionate, Laurylstearylthiodipropionate, Distearyl-β, β ′ -Thiodibutyrate, (3-octylthiopropionic acid) pentaerythritol tetraester, (3-decylthiopropionic acid) pentaerythritol tetraester, (3-laurylthiopropionic acid) pentaerythritol tetraester, (3-stearylthiopropion Acid) pentaerythritol tetraester, (3-oleylthiopropionic acid) pentaerythritol tetraester, (3-laurylthiopropionic acid) -4,4′-thiodi (3-methyl-5-tert-butyl-4-phenol) Examples thereof include esters, 2-mercaptobenzimidazole, 2-mercaptomethylbenzimidazole, 2-benzimidazole disulfide, dilauryl sulfide, amylthioglycol and the like.
紫外線吸収剤としては、例えば、2−(2’−ヒドロキシ−5’−メチルフェニル)ベンゾトリアゾール、2−(2’−ヒドロキシ−5’−t−ブチルフェニル)ベンゾトリアゾール、2−(2’−ヒドロキシ−3’,5’−ジ−t−ブチルフェニル)ベンゾトリアゾール、2−(2’−ヒドロキシ−3’−t−ブチル−5’−メチルフェニル)ベンゾトリアゾール、2−{2’−ヒドロキシ−3’,5’−ビス(α,α−ジメチルベンジル)フェニル}ベンゾトリアゾール、2−(2’−ヒドロキシ−3’−t−ブチル−5’−メチルフェニル)−5−クロロベンゾトリアゾール、2−(2’−ヒドロキシ−3’,5’−ジ−t−ブチルフェニル)−5−クロロベンゾトリアゾール、2−(2’−ヒドロキシ−3’,5’−ジ−t−アミルフェニル)ベンゾトリアゾール、2−(2’−ヒドロキシ−5’−t−オクルフェニル)ベンゾトリアゾール、2−{2’−ヒドロキシ−3’−(3”,4”,5”,6”−テトラヒドロフタルイミドメチル)−5’−メチルフェニル}ベンゾトリアゾール、2,2−メチレンビス{4−(1,1,3,3−テトラメチルブチル)−6−(2H−ベンゾトリアゾール−2−イル)フェノール}、2−(2’−ヒドロキシ−5’−メタクリロキシフェニル)−2H−ベンゾトリアゾール、2,4−ジヒドロキシベンゾフェノン、2−ヒドロキシ−4−メトキシベンゾフェノン、2−ヒドロキシ−4−オクトキシベンゾフェノン、2−ヒドロキシ−4−ドデシルオキシベンゾフェノン、2,2’−ジヒドロキシ−4−メトキシベンゾフェノン、2,2’−ジヒドロキシ−4,4’−メトキシベンゾフェノン、2−ヒドロキシ−4−メトキシ−5−スルホベンゾフェノン、ビス(5−ベンゾイル−4−ヒドロキシ−2−メトキシフェニルメタン)、フェニルサリシレート、4−t−ブチルフェニルサリシレート、4−オクチルフェニルサリシレート等のサリシレート系;エチル−2−シアノ−3,3−ジフェニルアクリレート、2−エチルヘキシル−2−シアノ−3,3−ジフェニルアクリレート等のシアノアクリレート系;2−エトキシ−2’−エチルオキザリックアシッドビスアニリド等のオキザリックアシッド系、ビス(2,2,6,6−テトラメチル−4−ピペリジル)セバケート、ビス(N−メチル−2,2,6,6−テトラメチル−4−ピペリジル)セバケート、ビス(1,2,2,6,6−ペンタメチル−4−ピペリジル)−2−(3,5−ジ−t−ブチル−4−ヒドロキシベンジル)−2−n−ブチルマロネート、テトラキス(2,2,6,6−テトラメチル−4−ピペリジル)−1,2,3,4−ブタンテトラカルボキシレート、テトラキス(1,2,2,6,6−ペンタメチル−4−ピペリジル)−1,2,3,4−ブタンテトラカルボキシレート、(ミックスト−2,2,6,6−テトラメチル−4−ピペリジル/トリデシル)−1,2,3,4−ブタンテトラカルボキシレート、(ミックスト−1,2,2,6,6−ペンタメチル−4−ピペリジル/トリデシル)−1,2,3,4−ブタンテトラカルボキシレート、ミックスト−{2,2,6,6−テトラメチル−4−ピペリジル/β,β,β’,β’−テトラメチル−3,9−(2,4,8,10−テトラオキサスピロ[5,5]ウンデカン)ジエチル}−1,2,3,4−ブタンテトラカルボキシレート、ミックスト−{1,2,2,6,6−ペンタメチル−4−ピペリジル/β,β,β’,β’−テトラメチル−3,9−(2,4,8,10−テトラオキサスピロ[5,5]ウンデカン)ジエチル}−1,2,3,4−ブタンテトラカルボキシレート、ポリ{6−(1,1,3,3,−テトラメチルブチル)イミノ−1,3,5−トリアジン−2,4−ジイル}{(2,2,6,6−テトラメチル−4−ピペリジル)イミノ}ヘキサメチレン{(2,2,6,6−テトラメチル−4−ピペリジル)イミノ}、ジメチルサクシネート/4−ヒドロキシ−2,2,6,6−テトラメチル−1−ピペリジンエタノール重合体、2,2,6,6−テトラメチル−4−ピペリジルメタクリレート、1,2,2,6,6−ペンタメチル−4−ピペリジルメタクリレート、エチレンビス(2,2,6,6−テトラメチル−3−オキサ−4−ピペリジン)、{2,2’−チオビス(4−t−オクチルフェノレート)}−2−エチルヘキシルアミンニッケル(II)、ニッケルジブチルジチオカルバメート、{2,2'−チオビス(4−t−オクチルフェノレート)}−2−ブチルアミンニッケル(II)、ニッケルビス(オクチルフェニル)サルファイド、3,5−ジ−t−ブチル−4−ヒドロキシベンジルリン酸モノエチレートニッケル錯体等のニッケル系光安定剤;2,4−ジ−t−ブチルフェニル−3,5'−ジ−t−ブチル−4'−ヒドロキシベンゾエート等が挙げられる。 Examples of the ultraviolet absorber include 2- (2′-hydroxy-5′-methylphenyl) benzotriazole, 2- (2′-hydroxy-5′-t-butylphenyl) benzotriazole, 2- (2′- Hydroxy-3 ′, 5′-di-t-butylphenyl) benzotriazole, 2- (2′-hydroxy-3′-t-butyl-5′-methylphenyl) benzotriazole, 2- {2′-hydroxy- 3 ′, 5′-bis (α, α-dimethylbenzyl) phenyl} benzotriazole, 2- (2′-hydroxy-3′-tert-butyl-5′-methylphenyl) -5-chlorobenzotriazole, 2- (2′-hydroxy-3 ′, 5′-di-t-butylphenyl) -5-chlorobenzotriazole, 2- (2′-hydroxy-3 ′, 5′-di-t-amylphenyl) benzotria 2- (2′-hydroxy-5′-t-ocylphenyl) benzotriazole, 2- {2′-hydroxy-3 ′-(3 ″, 4 ″, 5 ″, 6 ″ -tetrahydrophthalimidomethyl) -5′-methylphenyl} benzotriazole, 2,2-methylenebis {4- (1,1,3,3-tetramethylbutyl) -6- (2H-benzotriazol-2-yl) phenol}, 2- ( 2'-hydroxy-5'-methacryloxyphenyl) -2H-benzotriazole, 2,4-dihydroxybenzophenone, 2-hydroxy-4-methoxybenzophenone, 2-hydroxy-4-octoxybenzophenone, 2-hydroxy-4- Dodecyloxybenzophenone, 2,2'-dihydroxy-4-methoxybenzophenone, 2,2'-dihydroxy-4,4'-meth Cibenzophenone, 2-hydroxy-4-methoxy-5-sulfobenzophenone, bis (5-benzoyl-4-hydroxy-2-methoxyphenylmethane), phenyl salicylate, 4-t-butylphenyl salicylate, 4-octylphenyl salicylate, etc. Salicylate type; Cyanoacrylate type such as ethyl-2-cyano-3,3-diphenyl acrylate, 2-ethylhexyl-2-cyano-3,3-diphenyl acrylate; 2-ethoxy-2′-ethyl oxalic acid bis Oxalic acids such as anilide, bis (2,2,6,6-tetramethyl-4-piperidyl) sebacate, bis (N-methyl-2,2,6,6-tetramethyl-4-piperidyl) sebacate Bis (1,2,2,6,6-pentamethyl-4-piperidyl)- -(3,5-di-tert-butyl-4-hydroxybenzyl) -2-n-butylmalonate, tetrakis (2,2,6,6-tetramethyl-4-piperidyl) -1,2,3 4-butanetetracarboxylate, tetrakis (1,2,2,6,6-pentamethyl-4-piperidyl) -1,2,3,4-butanetetracarboxylate, (mixed-2,2,6,6 -Tetramethyl-4-piperidyl / tridecyl) -1,2,3,4-butanetetracarboxylate, (mixed-1,2,2,6,6-pentamethyl-4-piperidyl / tridecyl) -1,2 , 3,4-butanetetracarboxylate, mixed- {2,2,6,6-tetramethyl-4-piperidyl / β, β, β ′, β′-tetramethyl-3,9- (2,4 , 8,10-Tetraoxaspiro [ , 5] undecane) diethyl} -1,2,3,4-butanetetracarboxylate, mixed- {1,2,2,6,6-pentamethyl-4-piperidyl / β, β, β ′, β ′ -Tetramethyl-3,9- (2,4,8,10-tetraoxaspiro [5,5] undecane) diethyl} -1,2,3,4-butanetetracarboxylate, poly {6- (1, 1,3,3-tetramethylbutyl) imino-1,3,5-triazine-2,4-diyl} {(2,2,6,6-tetramethyl-4-piperidyl) imino} hexamethylene {( 2,2,6,6-tetramethyl-4-piperidyl) imino}, dimethyl succinate / 4-hydroxy-2,2,6,6-tetramethyl-1-piperidineethanol polymer, 2,2,6, 6-tetramethyl-4-piperidylmetac Lilate, 1,2,2,6,6-pentamethyl-4-piperidylmethacrylate, ethylenebis (2,2,6,6-tetramethyl-3-oxa-4-piperidine), {2,2′-thiobis ( 4-t-octylphenolate)}-2-ethylhexylamine nickel (II), nickel dibutyldithiocarbamate, {2,2′-thiobis (4-t-octylphenolate)}-2-butylamine nickel (II), Nickel light stabilizers such as nickel bis (octylphenyl) sulfide, 3,5-di-t-butyl-4-hydroxybenzyl phosphate monoethylate nickel complex; 2,4-di-t-butylphenyl-3, And 5′-di-t-butyl-4′-hydroxybenzoate.
可塑剤としては、フタル酸エステル、リン酸エステル、ポリエステル、トリメリット酸エステル、塩素化パラフィン、二塩基酸エステル、エポキシ化エステル等が挙げられる。 Examples of the plasticizer include phthalic acid ester, phosphoric acid ester, polyester, trimellitic acid ester, chlorinated paraffin, dibasic acid ester, and epoxidized ester.
難燃剤としては、テトラブロモビスフェノールA、ヘキサブロモベンゼン、トリス(2,3−ジブロモプロピル)イソシアヌレート、2,2−ビス(4−ヒドロキシエトキシ−3,5−ジブロモフェニル)プロパン、デカブロモジフェニルオキサイド、ヘキサブロモシクロデカン、テトラブロモ無水フタル酸、塩素化ポリエチレン、塩素化パラフィン、パークロロシクロペンタデカン、クロレンド酸、テトラクロロ無水フタル酸、リン酸アンモニウム、トリクレジルフォスフェート、トリエチルフォスフェート、トリス(β−クロロエチル)フォスフェート、トリスクロロエチルフォスフェート、トリスジクロロプロピルフォスフェート、クレジルジフェニルフォスフェート、キシレニルジフェニルフォスフェート、赤燐、酸化スズ、三酸化アンチモン、水酸化ジルコニウム、メタホウ酸バリウム、ホウ酸亜鉛、水酸化アルミニウム、水酸化マグネシウム、窒素化グアニジン等が挙げられる。 Flame retardants include tetrabromobisphenol A, hexabromobenzene, tris (2,3-dibromopropyl) isocyanurate, 2,2-bis (4-hydroxyethoxy-3,5-dibromophenyl) propane, decabromodiphenyl oxide , Hexabromocyclodecane, tetrabromophthalic anhydride, chlorinated polyethylene, chlorinated paraffin, perchlorocyclopentadecane, chlorendic acid, tetrachlorophthalic anhydride, ammonium phosphate, tricresyl phosphate, triethyl phosphate, tris (β -Chloroethyl phosphate, trischloroethyl phosphate, trisdichloropropyl phosphate, cresyl diphenyl phosphate, xylenyl diphenyl phosphate, red phosphorus, tin oxide, antimony trioxide , Zirconium hydroxide, barium metaborate, zinc borate, aluminum hydroxide, magnesium hydroxide, nitrogenated guanidine, and the like.
表面調整剤としては、ビックケミー社製「BYK−300、302、306、307、310、315、320、322、323、325、330、331、333、337、340、344、370、375、377、350、352、354、355、356、358N、361N、357、390、392、UV3500、UV3510、UV3570」、テゴケミー社製「Tegorad−2100,2200、2250、2500、2700」等が挙げられる。これら表面調整剤は、一種または必要に応じて二種以上用いてもよい。 Examples of the surface conditioner include BYK-300, 302, 306, 307, 310, 315, 320, 322, 323, 325, 330, 331, 333, 337, 340, 344, 370, 375, 377, manufactured by Big Chemie. 350, 352, 354, 355, 356, 358N, 361N, 357, 390, 392, UV3500, UV3510, UV3570 ”,“ Tegorad-2100, 2200, 2250, 2500, 2700 ”manufactured by Tegochemy. These surface conditioners may be used alone or in combination of two or more as required.
本発明によれば、高い帯電防止能のみならず、透明性・樹脂や溶剤への溶解性(相溶性)・耐熱性・耐湿性を併せ持ち、金属や金属イオンを含まない帯電防止剤を提供することが可能となる。 According to the present invention, there is provided an antistatic agent having not only high antistatic ability, but also transparency, solubility in a resin or solvent (compatibility), heat resistance, and moisture resistance, and does not contain metal or metal ions. It becomes possible.
本発明において、樹脂造形品としては、FPD向け各種フィルム、導電性ゴム、帯電防止コーティング、電子部品パッケージなどがある。 In the present invention, the resin molded product includes various films for FPD, conductive rubber, antistatic coating, electronic component package, and the like.
本発明において、基板とは、ガラス、シリコン、ポリカーボネート、ポリエステル、芳香族ポリアミド、ポリアミドイミド、ポリイミド、ガラスエポキシ、ポリフェニレンエーテル樹脂、ポリオレフィン樹脂、フッ素樹脂、熱可塑性エラストマー、エポキシ樹脂、ポリイミド樹脂等が挙げられるが、これに限定されるものではない。 In the present invention, the substrate includes glass, silicon, polycarbonate, polyester, aromatic polyamide, polyamideimide, polyimide, glass epoxy, polyphenylene ether resin, polyolefin resin, fluororesin, thermoplastic elastomer, epoxy resin, polyimide resin, and the like. However, the present invention is not limited to this.
次に、本発明について実施例を用いて説明するが、本発明はこれらの実施例に限定されるものではない。
まず、以下に本発明における化合物の合成例を示す。
Next, although this invention is demonstrated using an Example, this invention is not limited to these Examples.
First, the synthesis example of the compound in this invention is shown below.
<合成例1>化合物(1)の合成
特表2003−505464号報記載の方法で合成した、リチウム−トリス(オキサラト)ホスフェート3.08gとテトラブチルアンモニウムブロマイド2.89gとをジクロロメタン30mlに溶解した溶液を、25℃にて1時間激しく攪拌する。静置分層後、有機層をイオン交換水にて洗浄し、硫酸マグネシウムにて乾燥させる。乾燥剤をろ別後、溶媒を溜去することで、化合物(1)を得た。
<Synthesis Example 1> Synthesis of Compound (1) Lithium tris (oxalato) phosphate (3.08 g) and tetrabutylammonium bromide (2.89 g) synthesized by the method described in JP-T-2003-505464 were dissolved in dichloromethane (30 ml). The solution is stirred vigorously at 25 ° C. for 1 hour. After the stationary separation layer, the organic layer is washed with ion-exchanged water and dried with magnesium sulfate. After the desiccant was filtered off, the solvent was distilled off to obtain compound (1).
<合成例2>化合物(2)の合成
ジエチルエーテル50ml中に、五塩化リン5.48gを加えて、25℃にて攪拌しているところに、ジエチルエーテル70mlに溶解させたシュウ酸7.34gを加える。添加後、加熱還流にて5時間攪拌し、その後放冷する。イオン交換水100mlを加えた後、ジエチルエーテル50mlを用いて抽出する。溶剤を減圧溜去した後に、得られた固体をジエチルエーテル50mlにて溶解する。この溶液に、トリブチルアンモニウム5.11gを加えて、25℃にて2時間攪拌する。イオン交換水50mlを加えた後、抽出し、その後溶媒を溜去することで、化合物(2)を得た。
<Synthesis Example 2> Synthesis of Compound (2) Into 50 ml of diethyl ether, 5.48 g of phosphorus pentachloride was added and stirred at 25 ° C., and 7.34 g of oxalic acid dissolved in 70 ml of diethyl ether. Add After the addition, the mixture is stirred at reflux for 5 hours and then allowed to cool. After adding 100 ml of ion-exchanged water, extraction is performed using 50 ml of diethyl ether. After the solvent is distilled off under reduced pressure, the obtained solid is dissolved in 50 ml of diethyl ether. To this solution, 5.11 g of tributylammonium is added and stirred at 25 ° C. for 2 hours. After adding 50 ml of ion-exchanged water, extraction was performed, and then the solvent was distilled off to obtain a compound (2).
<合成例3>化合物(3)の合成
合成例1のテトラブチルアンモニウムブロマイドを、テトラヘキシルアンモニウムブロマイドに置き換えた以外は、合成例1と同様の方法で、化合物(3)を得た。
<Synthesis Example 3> Synthesis of Compound (3) Compound (3) was obtained in the same manner as in Synthesis Example 1, except that tetrabutylammonium bromide in Synthesis Example 1 was replaced with tetrahexylammonium bromide.
<合成例4>化合物(9)の合成
合成例1のテトラブチルアンモニウムブロマイドを、N−ブチル−4−メチルピリジニウムブロマイドに置き換えた以外は、合成例1と同様の方法で、化合物(9)を得た。
<Synthesis Example 4> Synthesis of Compound (9) Compound (9) was synthesized in the same manner as in Synthesis Example 1, except that tetrabutylammonium bromide in Synthesis Example 1 was replaced with N-butyl-4-methylpyridinium bromide. Obtained.
<合成例5>化合物(16)の合成
合成例1のテトラブチルアンモニウムブロマイドをN−ベンジルピリジニウムクロライドに置き換えた以外は、合成例3と同様の方法で、化合物(16)を得た。
<Synthesis Example 5> Synthesis of Compound (16) Compound (16) was obtained in the same manner as in Synthesis Example 3, except that tetrabutylammonium bromide in Synthesis Example 1 was replaced with N-benzylpyridinium chloride.
<合成例6>化合物(18)の合成
合成例1のテトラブチルアンモニウムブロマイドを、1−デシルー3−メチルイミダゾリウムクロライドに置き換えた以外は、合成例1と同様の方法で、化合物(18)を得た。
<Synthesis Example 6> Synthesis of Compound (18) Compound (18) was synthesized in the same manner as in Synthesis Example 1, except that tetrabutylammonium bromide in Synthesis Example 1 was replaced with 1-decyl-3-methylimidazolium chloride. Obtained.
<合成例7>化合物(32)の合成
合成例1のテトラブチルアンモニウムブロマイドを1,2,5−トリメチルピラジニウムブロマイドに置き換えた以外は、合成例1と同様の方法で、化合物(32)を得た。
<Synthesis Example 7> Synthesis of Compound (32) Compound (32) was prepared in the same manner as in Synthesis Example 1, except that tetrabutylammonium bromide in Synthesis Example 1 was replaced with 1,2,5-trimethylpyrazinium bromide. Got.
<合成例8>化合物(41)の合成
合成例1のテトラブチルアンモニウムブロマイドを1−ブチル−1−メチルピペリジニウムクロライドに置き換えた以外は、合成例3と同様の方法で、化合物(41)を得た。
<Synthesis Example 8> Synthesis of Compound (41) Compound (41) was prepared in the same manner as in Synthesis Example 3, except that tetrabutylammonium bromide in Synthesis Example 1 was replaced with 1-butyl-1-methylpiperidinium chloride. Got.
<合成例9>化合物(47)の合成
合成例1のテトラブチルアンモニウムブロマイドを、1−ブチル−1−メチルピロリジニウムブロマイドに置き換えた以外は、合成例1と同様の方法で、化合物(47)を得た。
<Synthesis Example 9> Synthesis of Compound (47) Compound (47) was prepared in the same manner as in Synthesis Example 1, except that tetrabutylammonium bromide in Synthesis Example 1 was replaced with 1-butyl-1-methylpyrrolidinium bromide. )
<合成例10>化合物(64)の合成
合成例1のテトラブチルアンモニウムブロマイドを、1、2−ジメチル−3−プロピルイミダゾリウムクロライドに置き換えた以外は、合成例1と同様の方法で、化合物(64)を得た。
<Synthesis Example 10> Synthesis of Compound (64) Compound (64) was synthesized in the same manner as in Synthesis Example 1, except that tetrabutylammonium bromide in Synthesis Example 1 was replaced with 1,2-dimethyl-3-propylimidazolium chloride. 64) was obtained.
合成した化合物は、元素分析((株)柳本製作所製MT−5より、C、Hの含有量を、ICP発光分光分析(エスアイアイ・ナノテクノロジー(株)製SPS4000型)よりPの含有量の測定を行った。表2に、合成した化合物のうち、代表的なものの元素分析値、ICP発光分光分析値を示す。 The synthesized compounds were analyzed for elemental analysis (MT-5, manufactured by Yanagimoto Seisakusho Co., Ltd.) and P content from ICP emission spectroscopic analysis (SPS 4000, manufactured by SII Nanotechnology Co., Ltd.). Table 2 shows the elemental analysis values and ICP emission spectroscopic analysis values of representative ones of the synthesized compounds.
表2
実施例1
UV硬化性モノマーとして、紫光UV1700B(日本合成化学社製)を1.5g、重合開始剤として、ダイドキュア174(大同化成社製)を0.15g、希釈溶剤としてPGME(プロピレングリコールモノメチルエーテル)を3g、帯電防止剤として、化合物(1)を0.03g(樹脂比2%)秤量し、混合し、混合液が均一になるように撹拌した。
Example 1
As a UV curable monomer, 1.5 g of purple light UV1700B (manufactured by Nippon Synthetic Chemical Co., Ltd.), as a polymerization initiator, 0.15 g of DidoCure 174 (manufactured by Daido Kasei), and 3 g of PGME (propylene glycol monomethyl ether) as a diluent solvent As an antistatic agent, 0.03 g (resin ratio 2%) of the compound (1) was weighed, mixed, and stirred so that the mixed solution became uniform.
バーコーター#12を用いて、混合液をPET基板上に塗布し、塗膜を形成した後、90℃にて一分間乾燥させた。メタルハライドランプを用いて光照射し(640mW/cm2)、塗膜を硬化させた。硬化塗膜の表面抵抗値を測定(アドバンテスト社製 R8340A)することにより、帯電防止能を評価した。以降、表面抵抗値(Ω/□)は、1010台以下の値を◎、1011乗台Ω/□の値を○、1012乗台Ω/□の値を△、1013乗台Ω/□の値を▽、1013乗以上を×と示した。また、硬化塗膜の全光線透過率(スガ試験機社製 HGM−2B)についても測定した。 Using the bar coater # 12, the mixed solution was applied onto a PET substrate to form a coating film, and then dried at 90 ° C. for 1 minute. The film was cured by light irradiation (640 mW / cm 2 ) using a metal halide lamp. The antistatic ability was evaluated by measuring the surface resistance value of the cured coating film (R8340A manufactured by Advantest Corporation). Thereafter, the surface resistance value (Ω / □) is a value of 10 10 units or less ◎, a value of 10 11 Ω / □ is ◯, a value of 10 12 Ω / □ is △, a value of 10 13 Ω The value of / □ is indicated by ▽, and the 10 13th power or more is indicated by ×. Moreover, it measured about the total light transmittance (HGM-2B by Suga Test Instruments Co., Ltd.) of the cured coating film.
実施例2〜実施例24
化合物(1)の代わりに、表3記載の化合物を用いた以外は、実施例1と同様にして硬化塗膜の表面抵抗値を測定した。
Examples 2 to 24
The surface resistance value of the cured coating film was measured in the same manner as in Example 1 except that the compounds listed in Table 3 were used instead of the compound (1).
実施例25〜実施例48
実施例1〜実施例24の帯電防止剤を0.075g(樹脂比5%)用いた以外は、実施例1から実施例24と同様にして硬化塗膜の表面抵抗値を測定した。
Example 25 to Example 48
The surface resistance values of the cured coating films were measured in the same manner as in Examples 1 to 24 except that 0.075 g (resin ratio 5%) of the antistatic agent of Examples 1 to 24 was used.
比較例1
化合物(1)の代わりに、市販の帯電防止剤ライトエステルDQ−100(共栄社化学社製)を用いた以外は、実施例1と同様にして硬化塗膜の表面抵抗値を測定した。
Comparative Example 1
The surface resistance value of the cured coating film was measured in the same manner as in Example 1 except that the commercially available antistatic agent Light Ester DQ-100 (manufactured by Kyoeisha Chemical Co., Ltd.) was used instead of the compound (1).
比較例2
化合物(1)の代わりに、市販の帯電防止剤ライトエステルDQ−100(共栄社化学社製)を用いた以外は、実施例25と同様にして硬化塗膜の表面抵抗値を測定した。
Comparative Example 2
The surface resistance value of the cured coating film was measured in the same manner as in Example 25 except that the commercially available antistatic agent Light Ester DQ-100 (manufactured by Kyoeisha Chemical Co., Ltd.) was used instead of the compound (1).
比較例3
化合物(1)の代わりに、市販の帯電防止剤サンコノールA400−50R(三光化学工業社製)を用いた以外は、実施例1と同様にして硬化塗膜の表面抵抗値を測定した。
Comparative Example 3
The surface resistance value of the cured coating film was measured in the same manner as in Example 1 except that the commercially available antistatic agent Sanconol A400-50R (manufactured by Sanko Chemical Co., Ltd.) was used instead of the compound (1).
比較例4
化合物(1)の代わりに、市販の帯電防止剤サンコノールA400−50R(三光化学工業社製)を用いた以外は、実施例25と同様にして硬化塗膜の表面抵抗値を測定した。
Comparative Example 4
The surface resistance value of the cured coating film was measured in the same manner as in Example 25 except that the commercially available antistatic agent Sanconol A400-50R (manufactured by Sanko Chemical Co., Ltd.) was used instead of the compound (1).
表3に、実施例1〜実施例48及び比較例1〜比較例4の結果を示す。 Table 3 shows the results of Examples 1 to 48 and Comparative Examples 1 to 4.
表3
本発明の帯電防止剤を用いた場合、その添加量に関わらず、十分な帯電防止効果が得られた(実施例1〜48)。具体的には、2%と5%との値を比較しても大差なく、少量でも十分に効果があった。一方、市販の帯電防止剤を用いた場合、硬化塗膜の表面抵抗が測定範囲を超えており、帯電防止剤としては機能していなかった。 When the antistatic agent of the present invention was used, a sufficient antistatic effect was obtained regardless of the amount added (Examples 1 to 48). Specifically, even when the values of 2% and 5% were compared, there was no significant difference, and even a small amount was sufficiently effective. On the other hand, when a commercially available antistatic agent was used, the surface resistance of the cured coating film exceeded the measurement range and did not function as an antistatic agent.
基板のPETフィルムの全光線透過率は、89.80%であり、本発明の帯電防止剤を用いた場合は、ほぼ同等の値を示していた。本発明の帯電防止剤は、非常に透明性の高い材料である。一方、比較例1〜比較例4では、帯電防止剤の相溶性の低さからか、塗膜にはブツが観測された。それらによる散乱成分が増加したためか、全光線透過率は低い値を示した。 The total light transmittance of the PET film of the substrate was 89.80%, and when the antistatic agent of the present invention was used, almost the same value was shown. The antistatic agent of the present invention is a highly transparent material. On the other hand, in Comparative Examples 1 to 4, irregularities were observed in the coating film because of the low compatibility of the antistatic agent. The total light transmittance showed a low value because the scattering component by them increased.
実施例49
アクアブル48E(昭和ワニス株式会社製 水溶性アルキッド樹脂)100gに、化合物(1)を5g添加し均一になるように混合し、樹脂ワニスを作製した。この樹脂ワニスをバーコーター#15を用いて、ガラス基板上に塗布し、塗膜を形成し、120℃にて45分加熱乾燥した。帯電防止能の評価として、塗膜の表面抵抗値を測定した結果を表4に示す。
Example 49
5 g of the compound (1) was added to 100 g of Aquaable 48E (water-soluble alkyd resin manufactured by Showa Varnish Co., Ltd.) and mixed uniformly to prepare a resin varnish. This resin varnish was applied onto a glass substrate using a bar coater # 15 to form a coating film, and dried by heating at 120 ° C. for 45 minutes. Table 4 shows the results of measuring the surface resistance value of the coating film as an evaluation of the antistatic ability.
実施例50〜実施例72
化合物(1)の代わりに、表4に記載した化合物を用いた以外は、実施例49と同様にして塗膜の表面抵抗値を測定した。結果を表3に示す。
Example 50 to Example 72
The surface resistance value of the coating film was measured in the same manner as in Example 49 except that the compounds listed in Table 4 were used instead of the compound (1). The results are shown in Table 3.
比較例5
化合物(1)の代わりに、市販の帯電防止剤ライトエステルDQ−100(共栄社化学社製)を用いた以外は、実施例49と同様にして塗膜の表面抵抗値を測定した。結果を表4に示す。
Comparative Example 5
The surface resistance value of the coating film was measured in the same manner as in Example 49 except that the commercially available antistatic agent Light Ester DQ-100 (manufactured by Kyoeisha Chemical Co., Ltd.) was used instead of the compound (1). The results are shown in Table 4.
比較例6
化合物(1)の代わりに、市販の帯電防止剤ダスパー125B(ミヨシ樹脂株式会社製)を用いた以外は、実施例49と同様にして塗膜の表面抵抗値を測定した。結果を表4に示す。
Comparative Example 6
The surface resistance value of the coating film was measured in the same manner as in Example 49 except that the commercially available antistatic agent Dasper 125B (manufactured by Miyoshi Resin Co., Ltd.) was used instead of the compound (1). The results are shown in Table 4.
比較例7
化合物(1)の代わりに、市販の帯電防止剤エマルゲン105(花王株式会社製)を用いた以外は、実施例49と同様にして塗膜の表面抵抗値を測定した。結果を表4に示す。
Comparative Example 7
The surface resistance value of the coating film was measured in the same manner as in Example 49 except that the commercially available antistatic agent Emulgen 105 (manufactured by Kao Corporation) was used instead of the compound (1). The results are shown in Table 4.
表4
表4の結果から分かるように、本発明の帯電防止剤を用いた場合、水系のワニスに配合した場合でも均一に分散され、表面抵抗値が低くなり、高い帯電防止効果が得られた。それに対し、比較例では、本発明の帯電防止剤を用いた場合と比べ、高い表面抵抗値を示した。特に比較例7においては、帯電防止剤を水系ワニスに均一に分散できず、塗膜は白化していた。 As can be seen from the results in Table 4, when the antistatic agent of the present invention was used, even when blended in an aqueous varnish, it was uniformly dispersed, the surface resistance value was low, and a high antistatic effect was obtained. On the other hand, in the comparative example, the surface resistance value was higher than that in the case of using the antistatic agent of the present invention. Particularly in Comparative Example 7, the antistatic agent could not be uniformly dispersed in the aqueous varnish, and the coating film was whitened.
実施例73
高密度ポリエチレン(アルドリッチ社製)100gと、帯電防止剤として化合物(1)5gとを、井上製作所製ニーダーを用いて130℃で8時間混練した。さらに、押出し成型機を用いて混練物を押し出し、厚さ5mmの樹脂板を形成した。帯電防止能の評価として、樹脂板の表面抵抗値を測定した。また、樹脂板の黄変性を目視にて評価した。
Example 73
100 g of high density polyethylene (manufactured by Aldrich) and 5 g of compound (1) as an antistatic agent were kneaded at 130 ° C. for 8 hours using a kneader manufactured by Inoue Seisakusho. Further, the kneaded product was extruded using an extrusion molding machine to form a resin plate having a thickness of 5 mm. As an evaluation of the antistatic ability, the surface resistance value of the resin plate was measured. Further, the yellowing of the resin plate was visually evaluated.
実施例74〜96
化合物(1)の代わりに、表5に記載した化合物を用いた以外は、実施例73と同様にして樹脂板の表面抵抗値を測定し、黄変性を評価した。
Examples 74-96
Instead of the compound (1), the surface resistance value of the resin plate was measured in the same manner as in Example 73 except that the compounds listed in Table 5 were used, and yellowing was evaluated.
比較例8
化合物(1)の代わりに、市販の帯電防止剤ドデシルピリジニウムクロライド(DPC:東京化成社製)を用いた以外は、実施例73と同様にして樹脂板の表面抵抗値を測定し、黄変性を評価した。
Comparative Example 8
Instead of the compound (1), the surface resistance value of the resin plate was measured in the same manner as in Example 73 except that a commercially available antistatic agent dodecylpyridinium chloride (DPC: manufactured by Tokyo Chemical Industry Co., Ltd.) was used. evaluated.
比較例9
化合物(1)の代わりに、市販の帯電防止剤ダスパー125B(ミヨシ樹脂株式会社製)を用いた以外は、実施例73と同様にして樹脂板の表面抵抗値を測定し、黄変性を評価した。
Comparative Example 9
The surface resistance value of the resin plate was measured in the same manner as in Example 73 except that a commercially available antistatic agent Dasper 125B (manufactured by Miyoshi Resin Co., Ltd.) was used instead of the compound (1), and yellowing was evaluated. .
比較例10
化合物(1)の代わりに、市販の帯電防止剤エマルゲン105(花王株式会社製)を用いた以外は、実施例73と同様にして樹脂板の表面抵抗値を測定し、黄変性を評価した。
Comparative Example 10
The surface resistance value of the resin plate was measured in the same manner as in Example 73 except that a commercially available antistatic agent Emulgen 105 (manufactured by Kao Corporation) was used instead of the compound (1), and yellowing was evaluated.
実施例73〜96及び比較例8〜10の結果を表5に示した。 The results of Examples 73 to 96 and Comparative Examples 8 to 10 are shown in Table 5.
表5
表5の結果から分かるように、本発明の帯電防止剤を用いた場合(実施例73〜96)、熱可塑性樹脂に130℃、8時間という高温長時間で混練しても、高い帯電防止能を示すことがわかった。また、本発明の帯電防止剤を用いた樹脂板においては、黄変は全く認められなかった。 As can be seen from the results in Table 5, when the antistatic agent of the present invention was used (Examples 73 to 96), even when kneaded with a thermoplastic resin at a high temperature of 130 ° C. for 8 hours, a high antistatic ability It was found that Moreover, no yellowing was observed in the resin plate using the antistatic agent of the present invention.
一方、汎用の帯電防止剤で試験を行った比較例8〜10では、帯電防止効果は得られず、さらには高温長時間の混練のためか、黄変も見られた。 On the other hand, in Comparative Examples 8 to 10 tested with a general-purpose antistatic agent, an antistatic effect was not obtained, and yellowing was also observed due to kneading at a high temperature for a long time.
実施例97
化合物(1)0.5gをPGME(プロピレングリコールモノメチルエーテル)10gに溶解させたものを、スピンコーターを用いて100μmのPETフィルムの上に塗布し、100℃で1分間乾燥させ塗膜を形成した。帯電防止能の評価として、塗膜の表面抵抗値を測定した。
Example 97
A solution obtained by dissolving 0.5 g of compound (1) in 10 g of PGME (propylene glycol monomethyl ether) was applied onto a 100 μm PET film using a spin coater and dried at 100 ° C. for 1 minute to form a coating film. . As an evaluation of the antistatic ability, the surface resistance value of the coating film was measured.
実施例98〜120
化合物(1)の代わりに、表6に記載した化合物を用いた以外は、実施例97と同様にして塗膜の表面抵抗値を測定した。
Examples 98-120
The surface resistance value of the coating film was measured in the same manner as in Example 97 except that the compounds listed in Table 6 were used instead of the compound (1).
比較例11
化合物(1)の代わりに、市販の帯電防止剤ドデシルピリジニウムクロライド(DPC:東京化成社製)を用いた以外は、実施例97と同様にして塗膜の表面抵抗値を測定した。
Comparative Example 11
The surface resistance value of the coating film was measured in the same manner as in Example 97 except that the commercially available antistatic agent dodecylpyridinium chloride (DPC: manufactured by Tokyo Chemical Industry Co., Ltd.) was used instead of the compound (1).
比較例12
化合物(1)の代わりに、市販の帯電防止剤ダスパー125B(ミヨシ樹脂株式会社製)を用いた以外は、実施例97と同様にして塗膜の表面抵抗値を測定した。
Comparative Example 12
The surface resistance value of the coating film was measured in the same manner as in Example 97 except that the commercially available antistatic agent Dasper 125B (manufactured by Miyoshi Resin Co., Ltd.) was used instead of the compound (1).
実施例97〜120及び比較例11〜12の結果を表6に示す。 Table 6 shows the results of Examples 97 to 120 and Comparative Examples 11 to 12.
表6
表6の結果から明らかなように、本発明の帯電防止剤は、汎用の帯電防止剤に対して、低い表面抵抗値を示した。 As is clear from the results in Table 6, the antistatic agent of the present invention exhibited a low surface resistance value compared to a general-purpose antistatic agent.
実施例121
UVモノマーとして、紫光UV1700B(日本合成化学社製)を5g、重合開始剤として、ダイドキュア174(大同化成社製)を0.5g、希釈溶剤として酢酸エチルを15g、化合物(1)を0.25g(樹脂比5重量%)秤量して混合し、撹拌した。
Example 121
As a UV monomer, 5 g of purple light UV1700B (manufactured by Nippon Synthetic Chemical Co., Ltd.), as a polymerization initiator, 0.5 g of DidoCure 174 (manufactured by Daido Kasei), 15 g of ethyl acetate as a diluting solvent, 0.25 g of compound (1) (Resin ratio 5 wt%) Weighed, mixed and stirred.
バーコーター#12を用いて、混合液をPET基板上に塗布し、塗膜を形成した後、100℃にて一分間乾燥を行った。メタルハライドランプを用いて光照射し(640mW:cm2)、塗膜を硬化させた。硬化直後の硬化塗膜のヘイズ値と、一週間保管(25℃、60%RH)した後の硬化塗膜のヘイズ値を測定した。 Using a bar coater # 12, the mixture was applied onto a PET substrate to form a coating film, and then dried at 100 ° C. for 1 minute. The film was cured by light irradiation using a metal halide lamp (640 mW: cm 2 ). The haze value of the cured coating film immediately after curing and the haze value of the cured coating film after storage for one week (25 ° C., 60% RH) were measured.
実施例122〜144
化合物(1)の代わりに、表7に示す化合物を用いたこと以外は実施例121と同様にして、硬化塗膜を作成してヘイズ値を測定した。
Examples 122-144
A cured coating film was prepared and the haze value was measured in the same manner as in Example 121 except that the compound shown in Table 7 was used instead of the compound (1).
実施例121〜144の結果を表7に示した。 The results of Examples 121 to 144 are shown in Table 7.
表7
表7の結果より、本発明の帯電防止剤を用いた場合、硬化直後はいずれの硬化塗膜もヘイズ値が低く、透明性が高かった。さらに、25℃、60%RHにおいて一週間保管した硬化塗膜のヘイズ値も、硬化直後とほぼ等しい値を示した。 From the results of Table 7, when the antistatic agent of the present invention was used, immediately after curing, all the cured coating films had low haze values and high transparency. Furthermore, the haze value of the cured coating film stored for one week at 25 ° C. and 60% RH also showed a value almost equal to that immediately after curing.
実施例145
UV硬化性モノマーとして、アロニックスM408(東亞合成株式会社製)を5g、重合開始剤として、ダイドキュア174(大同化成社製)を0.5g、希釈溶剤として酢酸エチルを15g、化合物(1)を0.25g(樹脂比5重量%)秤量して混合し、撹拌した。
Example 145
As a UV curable monomer, 5 g of Aronix M408 (manufactured by Toagosei Co., Ltd.), 0.5 g of DidoCure 174 (manufactured by Daido Kasei Co., Ltd.) as a polymerization initiator, 15 g of ethyl acetate as a diluting solvent, 0 of compound (1) .25 g (resin ratio: 5% by weight) were weighed, mixed and stirred.
バーコーター#12を用いて、混合液をPET基板上に塗布し、塗膜を形成した後、100℃にて一分間乾燥させた。メタルハライドランプを用いて光照射し(640mW/cm2)、塗膜を硬化させた。湿度条件を変化させ硬化塗膜の表面抵抗値を測定した。 Using the bar coater # 12, the mixed solution was applied onto a PET substrate to form a coating film, and then dried at 100 ° C. for 1 minute. The film was cured by light irradiation (640 mW / cm 2 ) using a metal halide lamp. The surface resistance value of the cured coating film was measured by changing the humidity conditions.
実施例146〜168
化合物(1)の代わりに、表8に示す化合物を用いたこと以外は実施例145と同様にして、表面抵抗値を測定した。
Examples 146-168
Surface resistance values were measured in the same manner as in Example 145 except that the compounds shown in Table 8 were used instead of the compound (1).
比較例13〜14
化合物(1)の代わりに、表8に示す化合物を用いたこと以外は実施例145と同様にして表面抵抗値を測定した。
Comparative Examples 13-14
Surface resistance values were measured in the same manner as in Example 145 except that the compounds shown in Table 8 were used instead of the compound (1).
実施例145〜168及び比較例13〜14の結果を表8に示した。 The results of Examples 145 to 168 and Comparative Examples 13 to 14 are shown in Table 8.
表8
本発明の帯電防止剤を用いた場合には、湿度による表面抵抗値の変化はほとんど見られなかった。しかし、比較例の化合物を用いた場合は、湿度が低下するにつれ表面抵抗値が大きくなり、35%RHでは1014Ω/□以上の値となり、帯電防止剤として機能していなかった。 When the antistatic agent of the present invention was used, there was hardly any change in the surface resistance value due to humidity. However, when the compound of the comparative example was used, the surface resistance value increased as the humidity decreased, and it was 10 14 Ω / □ or more at 35% RH, and did not function as an antistatic agent.
実施例169
錠剤成型器を用いて、化合物(1)のペレットを作成し、湿度条件を変化させ表面抵抗値を測定した。
Example 169
Using a tablet molding machine, pellets of compound (1) were prepared, and the surface resistance value was measured by changing the humidity conditions.
実施例170〜192、比較例15〜16
化合物(1)の代わりに、表9に示す化合物を用いたこと以外は実施例169と同様にして、表面抵抗値を測定した。
Examples 170-192, Comparative Examples 15-16
Surface resistance values were measured in the same manner as in Example 169 except that the compounds shown in Table 9 were used instead of the compound (1).
実施例169〜192及び比較例15〜16の結果を表9に示した。 The results of Examples 169 to 192 and Comparative Examples 15 to 16 are shown in Table 9.
表9
表9に示す本発明の帯電防止剤は、表面抵抗値は湿度による影響を全く受けず、どの湿度条件化においてもほぼ同程度の良好な値を示していた。しかし、比較例の化合物は、湿度による影響が顕著に認められた。さらに、湿度が35%RHの条件においては、表面抵抗値は非常に大きくなり、帯電防止剤としては、機能していなかった。 In the antistatic agent of the present invention shown in Table 9, the surface resistance value was not affected by humidity at all, and showed a favorable value of almost the same in any humidity condition. However, the compound of the comparative example was significantly affected by humidity. Furthermore, the surface resistance value became very large under the condition where the humidity was 35% RH, and it did not function as an antistatic agent.
実施例193〜200
表10に示した本発明の帯電防止剤のいくつかについて、有機溶剤、UV硬化性モノマーへの溶解性試験を行った。
Examples 193-200
Some of the antistatic agents of the present invention shown in Table 10 were subjected to solubility tests in organic solvents and UV curable monomers.
比較例17
市販の帯電防止剤ライトエステルDQ−100(共栄社化学社製)の有機溶剤、UV硬化性モノマーへの溶解性試験を行った。
Comparative Example 17
A solubility test of a commercially available antistatic agent Light Ester DQ-100 (manufactured by Kyoeisha Chemical Co., Ltd.) in an organic solvent and a UV curable monomer was performed.
実施例193〜200及び比較例17の結果を表10に示した。 The results of Examples 193 to 200 and Comparative Example 17 are shown in Table 10.
表10
表10に示した本発明の帯電防止剤は、有機溶剤やUV硬化性モノマーへの溶解性が高かった。一方、比較例の帯電防止剤は、水に対する溶解性が高く、有機溶剤やUV硬化性モノマーへの溶解性が低く、本発明の帯電防止剤とほぼ逆の性質を示した。 The antistatic agents of the present invention shown in Table 10 were highly soluble in organic solvents and UV curable monomers. On the other hand, the antistatic agent of the comparative example had high solubility in water, low solubility in organic solvents and UV curable monomers, and exhibited almost the opposite properties to the antistatic agent of the present invention.
以上の結果を総合的に考えると、比較例に挙げた化合物群は、黄変しやすいという特徴がある。これは、有機物のカチオンと無機物のアニオンから構成されることに起因しているためだと考えられる。さらに、比較例に挙げた化合物群は、湿度が低い条件では、表面抵抗値が大きくなり、帯電防止能が低下することから、その除電メカニズムには水が大きく関与していると考えられる。しかしながら、本発明の帯電防止剤は、有機物同士の塩であるため黄変しにくい上、様々な条件において、その表面抵抗値は湿度による影響を受けなかった。 Considering the above results comprehensively, the compound group listed in the comparative example is characterized by being easily yellowed. This is thought to be due to the fact that it is composed of organic cations and inorganic anions. Furthermore, since the compound group mentioned in the comparative example has a high surface resistance value and low antistatic ability under low humidity conditions, it is considered that water is greatly involved in the static elimination mechanism. However, since the antistatic agent of the present invention is a salt between organic substances, it is difficult to yellow, and the surface resistance value was not affected by humidity under various conditions.
これら実施例から総合的に判断をすると、本発明の有機カチオンと特定のアニオンとの組み合わせからなる帯電防止剤は、高い帯電防止能のみならず、無色透明性・樹脂や溶剤への溶解性(相溶性)・耐熱性・耐湿性を併せ持ち、貴金属や重金属さらには金属イオンを含まないといった特徴を兼ね備え、溶剤や樹脂に溶解させても無色であるという特徴を持つ、優れた帯電防止剤であるといえる。 Judging comprehensively from these examples, the antistatic agent comprising a combination of the organic cation of the present invention and a specific anion has not only high antistatic ability but also colorless transparency and solubility in resins and solvents ( (Compatibility), heat resistance, moisture resistance, no precious metals, heavy metals, and no metal ions. It can be said.
Claims (14)
一般式(1)
General formula (1)
一般式(2)
R05〜R15およびR18〜R20は、それぞれ独立に、水素原子、ハロゲン原子、水酸基、カルボキシル基、シアノ基、ニトロ基、アミノ基、置換もしくは未置換のアルキルオキシ基、置換もしくは未置換のアルキル基、置換もしくは未置換のアルケニル基、置換もしくは未置換のアルキニル基、置換もしくは未置換のアリール基、置換もしくは未置換の複素環基または、置換もしくは未置換のアシル基を表す。また、隣接するR05〜R15およびR18〜R20は、互いに結合して環を形成してもよい。
R16およびR17は、それぞれ独立に、水素原子、置換もしくは未置換のアルキル基、置換もしくは未置換のアルケニル基、置換もしくは未置換のアリール基、または、置換もしくは未置換の複素環基を表す。
R21〜R24は、それぞれ独立に、水素原子、置換もしくは未置換のアルキル基、または、置換もしくは未置換のアリール基を表す。
R25〜R42は、それぞれ独立に、水素原子、ハロゲン原子、水酸基、置換もしくは未置換のアルキル基、置換もしくは未置換のアリール基、置換もしくは未置換の複素環基、置換もしくは未置換のアルキルオキシ基、置換もしくは未置換のアリールオキシ基、または、置換もしくは未置換の複素環オキシ基を表すか、R25とR26、R27とR28、R29とR30、R31とR32、R33とR34、R35とR36、R37とR38、R39とR40、もしくはR41とR42のいずれかが一体となり、結合する炭素原子と共に、カルボニル基(C=O)を表わす。また、R21とR25、R25とR27、R27とR29、R29とR31、R23とR33、R33とR35、R35とR37、R37とR39、もしくはR39とR41は、互いに結合して環構造を形成していてもよい。) The antistatic agent according to claim 1, wherein X + in the general formula (1) is an onium cation represented by the following general formula (2) to general formula (8).
General formula (2)
R 05 to R 15 and R 18 to R 20 are each independently a hydrogen atom, a halogen atom, a hydroxyl group, a carboxyl group, a cyano group, a nitro group, an amino group, a substituted or unsubstituted alkyloxy group, a substituted or unsubstituted group. An alkyl group, a substituted or unsubstituted alkenyl group, a substituted or unsubstituted alkynyl group, a substituted or unsubstituted aryl group, a substituted or unsubstituted heterocyclic group, or a substituted or unsubstituted acyl group. Adjacent R 05 to R 15 and R 18 to R 20 may be bonded to each other to form a ring.
R 16 and R 17 each independently represents a hydrogen atom, a substituted or unsubstituted alkyl group, a substituted or unsubstituted alkenyl group, a substituted or unsubstituted aryl group, or a substituted or unsubstituted heterocyclic group .
R 21 to R 24 each independently represents a hydrogen atom, a substituted or unsubstituted alkyl group, or a substituted or unsubstituted aryl group.
R 25 to R 42 each independently represent a hydrogen atom, a halogen atom, a hydroxyl group, a substituted or unsubstituted alkyl group, a substituted or unsubstituted aryl group, a substituted or unsubstituted heterocyclic group, a substituted or unsubstituted alkyl Represents an oxy group, a substituted or unsubstituted aryloxy group, or a substituted or unsubstituted heterocyclic oxy group; R 25 and R 26 , R 27 and R 28 , R 29 and R 30 , R 31 and R 32 , R 33 and R 34 , R 35 and R 36 , R 37 and R 38 , R 39 and R 40 , or R 41 and R 42 are combined, and together with the carbon atom to be bonded, a carbonyl group (C═O ). R 21 and R 25 , R 25 and R 27 , R 27 and R 29 , R 29 and R 31 , R 23 and R 33 , R 33 and R 35 , R 35 and R 37 , R 37 and R 39 , Alternatively, R 39 and R 41 may be bonded to each other to form a ring structure. )
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