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JP2011129308A - Vehicular lighting fixture and light source unit - Google Patents

Vehicular lighting fixture and light source unit Download PDF

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Publication number
JP2011129308A
JP2011129308A JP2009285258A JP2009285258A JP2011129308A JP 2011129308 A JP2011129308 A JP 2011129308A JP 2009285258 A JP2009285258 A JP 2009285258A JP 2009285258 A JP2009285258 A JP 2009285258A JP 2011129308 A JP2011129308 A JP 2011129308A
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Prior art keywords
housing
light
light source
pair
portions
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JP2009285258A
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Japanese (ja)
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JP5805929B2 (en
Inventor
Yoshiaki Aiiso
良明 相磯
Takeshi Omi
武史 近江
Takashi Matsunaga
崇 松永
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Koito Manufacturing Co Ltd
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Koito Manufacturing Co Ltd
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Priority to JP2009285258A priority Critical patent/JP5805929B2/en
Priority to CN2010105890815A priority patent/CN102102838B/en
Publication of JP2011129308A publication Critical patent/JP2011129308A/en
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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S43/00—Signalling devices specially adapted for vehicle exteriors, e.g. brake lamps, direction indicator lights or reversing lights
    • F21S43/10—Signalling devices specially adapted for vehicle exteriors, e.g. brake lamps, direction indicator lights or reversing lights characterised by the light source
    • F21S43/13—Signalling devices specially adapted for vehicle exteriors, e.g. brake lamps, direction indicator lights or reversing lights characterised by the light source characterised by the type of light source
    • F21S43/14—Light emitting diodes [LED]
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S41/00—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps
    • F21S41/10—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source
    • F21S41/14—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source characterised by the type of light source
    • F21S41/141—Light emitting diodes [LED]
    • F21S41/143—Light emitting diodes [LED] the main emission direction of the LED being parallel to the optical axis of the illuminating device
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S41/00—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps
    • F21S41/10—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source
    • F21S41/19—Attachment of light sources or lamp holders
    • F21S41/192—Details of lamp holders, terminals or connectors
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S41/00—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps
    • F21S41/10—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source
    • F21S41/19—Attachment of light sources or lamp holders
    • F21S41/194—Bayonet attachments
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S43/00—Signalling devices specially adapted for vehicle exteriors, e.g. brake lamps, direction indicator lights or reversing lights
    • F21S43/10—Signalling devices specially adapted for vehicle exteriors, e.g. brake lamps, direction indicator lights or reversing lights characterised by the light source
    • F21S43/19—Attachment of light sources or lamp holders
    • F21S43/195—Details of lamp holders, terminals or connectors

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To simplify structures of a vehicular lighting fixture and a light source unit, and to improve the assembling performance the structures. <P>SOLUTION: The vehicular lighting fixture is provided with a light-emitting body 6 having a semiconductor light-emitting element 13 arranged as a light source and a base board 14 arranged with a pair of power supply terminals 14a, 14a for supplying power to the semiconductor light-emitting element, a housing 4 formed of an insulating material where the light-emitting body is arranged, a pair of connection terminals 12, 12 arranged in the housing and formed of a conductive metal material and connected to the pair of power supply terminals of the light-emitting body, and a press-down member 7 mounted to the housing and pushed to the pair of connection terminals by pressing down the pair of power supply terminals of the light-emitting body. The housing is integrally arranged at a lamp body or a reflector 2. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

本発明は車輌用灯具及び光源ユニットに関する。詳しくは、ハウジングに配置される発光体の給電部をハウジングに設けられた接続部に押さえ部材によって押し付けて構造の簡素化及び組立性の向上を図る技術分野に関する。   The present invention relates to a vehicular lamp and a light source unit. More specifically, the present invention relates to a technical field that simplifies the structure and improves assemblability by pressing a power feeding portion of a light emitter disposed in a housing against a connecting portion provided in the housing by a pressing member.

発光ダイオード（ＬＥＤ：Light Emitting Diode）等の半導体発光素子を光源として用いた光源ユニットがあり、このような光源ユニットは、例えば、光源から出射された光を照明光として照射する車輌用灯具に備えられている（例えば、特許文献１乃至特許文献３参照）。   There is a light source unit using a semiconductor light emitting element such as a light emitting diode (LED) as a light source. Such a light source unit is provided in a vehicular lamp that emits light emitted from a light source as illumination light, for example. (For example, see Patent Documents 1 to 3).

これらの特許文献に記載された光源ユニットは、複数の半導体発光素子が用いられ、半導体発光素子に電力を供給するための給電部材、複数の半導体発光素子が搭載される回路基板、半導体発光素子に電力を供給する電源回路に接続されるフレキシブルプリント配線板等を備えている。   The light source units described in these patent documents use a plurality of semiconductor light emitting elements, a power supply member for supplying power to the semiconductor light emitting elements, a circuit board on which the plurality of semiconductor light emitting elements are mounted, and a semiconductor light emitting element. A flexible printed wiring board connected to a power supply circuit for supplying power is provided.

特開平８−３３９７０７号公報JP-A-8-339707 特開２００１−６３４５４号公報JP 2001-63454 A 特開２００５−３１０５８４号公報JP-A-2005-310584

ところで、近年の半導体発光素子に関する技術の進歩により、一つの半導体発光素子から出射される光の輝度の向上が図られ、半導体発光素子を数を減らして各種の光源として用いることが可能になっている。   By the way, due to recent advances in technology related to semiconductor light emitting devices, the brightness of light emitted from one semiconductor light emitting device has been improved, and the number of semiconductor light emitting devices can be reduced and used as various light sources. Yes.

例えば、車輌用灯具にあっては、例えば、一つの半導体発光素子で光源を構成することが可能とされるようになってきたが、この場合に、上記した特許文献に記載された光源ユニットのように半導体発光素子以外の様々な各部が設けられていると、構造が複雑であり製造コストの低減を妨げることになる。   For example, in a vehicle lamp, for example, it has become possible to configure a light source with a single semiconductor light emitting element. In this case, the light source unit described in the above-mentioned patent document can be used. If various parts other than the semiconductor light emitting element are provided as described above, the structure is complicated and the reduction of the manufacturing cost is hindered.

また、製造コストの低減等を図るために、光源ユニットの組立性の向上を図る必要もある。   Further, it is necessary to improve the assembly of the light source unit in order to reduce the manufacturing cost.

そこで、本発明車輌用灯具及び光源ユニットは、構造の簡素化及び組立性の向上を図ることを課題とする。   Accordingly, it is an object of the present invention to provide a vehicular lamp and a light source unit that can be simplified in structure and improved in assemblability.

車輌用灯具は、上記した課題を解決するために、光を出射する光源を有する光源ユニットを備えた車輌用灯具であって、前記光源ユニットは、光源として設けられた半導体発光素子と該半導体発光素子に給電する一対の給電部が設けられた基板とを有する発光体と、絶縁性材料によって形成され前記発光体が配置されるハウジングと、前記ハウジングに設けられ導電性金属材料によって形成され前記発光体の一対の給電部がそれぞれ接続される一対の接続部と、前記ハウジングに取り付けられ前記発光体の一対の給電部を押さえてそれぞれ前記一対の接続部に押し付ける押さえ部材とを備え、前記ハウジングをランプボデイ又はリフレクターに一体に設けたものである。   In order to solve the above-described problems, a vehicular lamp is a vehicular lamp that includes a light source unit having a light source that emits light. The light source unit includes a semiconductor light emitting element provided as a light source and the semiconductor light emitting device. A light-emitting body having a substrate provided with a pair of power supply portions for supplying power to the element; a housing formed of an insulating material in which the light-emitting body is disposed; and a light-emitting body formed of a conductive metal material provided in the housing. A pair of connecting portions to which a pair of power feeding portions of the body are respectively connected, and a pressing member that is attached to the housing and presses the pair of power feeding portions of the light emitting body and presses them against the pair of connecting portions, respectively. The lamp body or reflector is provided integrally.

従って、車輌用灯具にあっては、ランプボデイ又はリフレクターに一体に設けられたハウジングに押さえ部材が取り付けられた状態において発光体の給電部が押さえ部材によって押さえられる。   Therefore, in the vehicular lamp, the power feeding portion of the light emitter is pressed by the pressing member in a state where the pressing member is attached to the housing integrally provided with the lamp body or the reflector.

光源ユニットは、上記した課題を解決するために、光源として設けられた半導体発光素子と該半導体発光素子に給電する一対の給電部が設けられた基板とを有する発光体と、絶縁性材料によって形成され前記発光体が配置されるハウジングと、前記ハウジングに設けられ導電性金属材料によって形成され前記発光体の一対の給電部がそれぞれ接続される一対の接続部と、前記ハウジングに取り付けられ前記発光体の一対の給電部を前記発光体を挟んで前記ハウジングの反対側から覆うカバー体とを備えたものである。   In order to solve the above-described problems, the light source unit is formed of a light emitting body having a semiconductor light emitting element provided as a light source and a substrate provided with a pair of power feeding portions for supplying power to the semiconductor light emitting element, and an insulating material A housing in which the light emitter is disposed, a pair of connection portions provided on the housing and formed of a conductive metal material to which a pair of power feeding portions of the light emitter are respectively connected, and the light emitter attached to the housing And a cover body covering the pair of power feeding portions from the opposite side of the housing with the light emitter interposed therebetween.

従って、光源ユニットにあっては、カバー体がハウジングに取り付けられたときに発光体の給電部がカバー体によって覆われる。   Therefore, in the light source unit, when the cover body is attached to the housing, the power feeding portion of the light emitter is covered with the cover body.

本発明車輌用灯具は、光を出射する光源を有する光源ユニットを備えた車輌用灯具であって、前記光源ユニットは、光源として設けられた半導体発光素子と該半導体発光素子に給電する一対の給電部が設けられた基板とを有する発光体と、絶縁性材料によって形成され前記発光体が配置されるハウジングと、前記ハウジングに設けられ導電性金属材料によって形成され前記発光体の一対の給電部がそれぞれ接続される一対の接続部と、前記ハウジングに取り付けられ前記発光体の一対の給電部を押さえてそれぞれ前記一対の接続部に押し付ける押さえ部材とを備え、前記ハウジングをランプボデイ又はリフレクターに一体に設けたことを特徴とする。   The vehicular lamp according to the present invention is a vehicular lamp including a light source unit having a light source that emits light, and the light source unit includes a semiconductor light emitting element provided as a light source and a pair of power supplies that supply power to the semiconductor light emitting element. A light emitting body having a substrate provided with a portion, a housing formed of an insulating material in which the light emitting body is disposed, and a pair of power feeding portions of the light emitting body provided in the housing and formed of a conductive metal material. A pair of connecting portions connected to each other; and a pressing member that is attached to the housing and presses the pair of power feeding portions of the light emitter to press the pair of connecting portions, respectively, and the housing is integrated with the lamp body or the reflector. It is provided.

従って、構造の簡素化及び組立性の向上を図ることができる。   Therefore, the structure can be simplified and the assemblability can be improved.

請求項２に記載した発明にあっては、前記押さえ部材として、前記半導体発光素子からの光の出射時に発生する熱を放出するヒートシンクを設けたので、ヒートシンクが放熱機能と押さえ部材としての機能を有し、部品点数の削減及び構造の簡素化を図ることができる。   In the invention described in claim 2, since the heat sink that releases heat generated when light is emitted from the semiconductor light emitting element is provided as the pressing member, the heat sink has a heat dissipation function and a function as a pressing member. It is possible to reduce the number of parts and simplify the structure.

本発明光源ユニットは、光源として設けられた半導体発光素子と該半導体発光素子に給電する一対の給電部が設けられた基板とを有する発光体と、絶縁性材料によって形成され前記発光体が配置されるハウジングと、前記ハウジングに設けられ導電性金属材料によって形成され前記発光体の一対の給電部がそれぞれ接続される一対の接続部と、前記ハウジングに取り付けられ前記発光体の一対の給電部を前記発光体を挟んで前記ハウジングの反対側から覆うカバー体とを備えたことを特徴とする。   The light source unit of the present invention includes a light emitting body having a semiconductor light emitting element provided as a light source and a substrate provided with a pair of power feeding portions for supplying power to the semiconductor light emitting element, and the light emitting body formed of an insulating material. A housing provided on the housing and formed of a conductive metal material and connected to a pair of power feeding portions of the light emitter, and a pair of power feeding portions of the light emitter attached to the housing. And a cover body covering from the opposite side of the housing with the light emitter interposed therebetween.

従って、構造の簡素化及び組立性の向上を図ることができる。   Therefore, the structure can be simplified and the assemblability can be improved.

請求項４に記載した発明にあっては、前記接続部を金属材料の蒸着によって形成したので、別に、金属部材から成る接続部を設ける必要がなく、部品点数の削減を図ることができると共に接続部の形成を容易に行うことができる。   In the invention described in claim 4, since the connection portion is formed by vapor deposition of a metal material, it is not necessary to provide a separate connection portion made of a metal member, and the number of components can be reduced and connected. The part can be easily formed.

以下に、本発明車輌用灯具及び光源ユニットを実施するための最良の形態について添付図面を参照して説明する。   The best mode for carrying out the vehicular lamp and the light source unit of the present invention will be described below with reference to the accompanying drawings.

車輌用灯具１は、例えば、前方に開口された凹部を有する図示しないランプボデイと該ランプボデイの開口面を閉塞する図示しないカバーとを備え、ランプボデイとカバーによって形成された空間にリフレクター２が配置されている（図１参照）。   The vehicular lamp 1 includes, for example, a lamp body (not shown) having a recess opened forward and a cover (not shown) that closes the opening surface of the lamp body, and the reflector 2 is formed in a space formed by the lamp body and the cover. Is arranged (see FIG. 1).

リフレクター２は内面が反射面として形成された本体３と該本体３の後端部に設けられたハウジング４とが一体に形成されて成る。尚、ハウジング４は本体３と別体で形成されていてもよい。   The reflector 2 is formed by integrally forming a main body 3 whose inner surface is formed as a reflecting surface and a housing 4 provided at the rear end of the main body 3. The housing 4 may be formed separately from the main body 3.

リフレクター２において本体３とハウジング４を一体に形成することにより、リフレクター２の製造時間の短縮化及び製造コストの低減を図ることができる。   By forming the main body 3 and the housing 4 integrally in the reflector 2, it is possible to shorten the manufacturing time and the manufacturing cost of the reflector 2.

以下に、第１の実施の形態における光源ユニット５について説明する（図１参照）。   Below, the light source unit 5 in 1st Embodiment is demonstrated (refer FIG. 1).

光源ユニット５は上記したハウジング４と発光体６とヒートシンク７を有している。   The light source unit 5 includes the housing 4, the light emitter 6, and the heat sink 7.

ハウジング４は前後方向を向く円板状に形成されたベース面部８と該ベース面部８の外周部から後方へ突出された周面部９と該周面部９の外面から反対方向へ突出された接続用突部１０、１０とを有している。   The housing 4 has a base surface portion 8 formed in a disk shape facing in the front-rear direction, a peripheral surface portion 9 protruding rearward from the outer peripheral portion of the base surface portion 8, and a connection member protruding in the opposite direction from the outer surface of the peripheral surface portion 9. Projections 10 and 10 are provided.

ベース面部８の中央部には矩形状の配置孔８ａが形成されている。ベース面部８の後面には配置孔８ａを囲む位置に枠状部１１が設けられ、該枠状部１１には配置孔８ａを挟んだ反対側の位置にそれぞれ後方に開口された切欠１１ａ、１１ａが形成されている。   A rectangular arrangement hole 8 a is formed at the center of the base surface portion 8. A frame-shaped portion 11 is provided on the rear surface of the base surface portion 8 at a position surrounding the arrangement hole 8a, and the frame-shaped portion 11 has notches 11a and 11a opened rearward at positions opposite to the arrangement hole 8a. Is formed.

周面部９には後方に開口されＬ字状に切り欠かれた支持溝９ａ、９ａが形成されている。   The peripheral surface portion 9 is formed with support grooves 9a, 9a that are opened rearward and are cut out in an L shape.

接続用突部１０、１０の後面にはそれぞれ後方に開口された図示しないネジ止め穴が形成されている。   Screw connection holes (not shown) opened rearward are formed on the rear surfaces of the connecting projections 10 and 10.

ハウジング４には導電性金属材料によって形成された一対の接続端子１２、１２が設けられている。接続端子１２、１２は発光体６の後述する一対の給電端子にそれぞれ接続される接続部として機能する。接続端子１２、１２は、ハウジング４の後面に、例えば、アルミニウム等の金属材料の蒸着によって形成され、それぞれ内側の端部が端子接続部１２ａ、１２ａとして設けられ外側の端部がコネクター接続部１２ｂ、１２ｂとして設けられている。   The housing 4 is provided with a pair of connection terminals 12 and 12 made of a conductive metal material. The connection terminals 12 and 12 function as connection portions that are respectively connected to a pair of power supply terminals described later of the light emitter 6. The connection terminals 12 and 12 are formed on the rear surface of the housing 4 by vapor deposition of a metal material such as aluminum, and the inner end portions are provided as terminal connection portions 12a and 12a, respectively, and the outer end portions are connector connection portions 12b. , 12b.

接続端子１２、１２は、端子接続部１２ａ、１２ａがそれぞれベース面部８の枠状部１１の内側における配置孔８ａを挟んだ反対側に位置され、コネクター接続部１２ｂ、１２ｂがそれぞれ接続用突部１０、１０の後面に位置されている。   The connection terminals 12 and 12 are located on opposite sides of the base surface portion 8 where the terminal connection portions 12a and 12a sandwich the arrangement hole 8a on the inner side of the frame-like portion 11, and the connector connection portions 12b and 12b are connected protrusions, respectively. 10 and 10 are located on the rear surface.

接続端子１２、１２の端子接続部１２ａ、１２ａは後方へ稍突出した状態とされている。   The terminal connection parts 12a, 12a of the connection terminals 12, 12 are in a state of protruding backward.

接続端子１２、１２のコネクター接続部１２ｂ、１２ｂにはネジ挿通孔１２ｃ、１２ｃが形成され、該ネジ挿通孔１２ｃ、１２ｃはそれぞれ接続用突部１０、１０に形成されたネジ止め穴に対応して位置されている。   Screw connection holes 12c and 12c are formed in the connector connection portions 12b and 12b of the connection terminals 12 and 12, respectively, and the screw insertion holes 12c and 12c correspond to the screw holes formed in the connection projections 10 and 10, respectively. Is located.

上記のように、接続端子１２、１２を金属材料の蒸着によって形成することにより、別に、金属部材から成る接続端子を設ける必要がなく、部品点数の削減を図ることができると共に接続端子１２、１２の形成を容易に行うことができる。   As described above, by forming the connection terminals 12 and 12 by vapor deposition of a metal material, there is no need to provide a separate connection terminal made of a metal member, the number of parts can be reduced, and the connection terminals 12 and 12 can be reduced. Can be easily formed.

また、一般に、リフレクターの反射面（内面）はアルミニウム等の金属材料の蒸着によって形成するが、リフレクター２に接続端子１２、１２を蒸着によって形成することにより、反射面を形成する蒸着と接続端子１２、１２を形成する蒸着を一度に行うことが可能となり、リフレクター２の形成に関する作業性の向上を図ることができる。   In general, the reflection surface (inner surface) of the reflector is formed by vapor deposition of a metal material such as aluminum. However, the connection terminals 12 and 12 are formed on the reflector 2 by vapor deposition, thereby forming the reflection surface and the connection terminal 12. , 12 can be performed at once, and workability related to the formation of the reflector 2 can be improved.

発光体６は、例えば、発光ダイオード（ＬＥＤ：Light Emitting Diode）である半導体発光素子１３と、該半導体発光素子１３が搭載された基板１４とから成る。基板１４には一対の給電端子１４ａ、１４ａが形成され、該給電端子１４ａ、１４ａは各一端部が半導体発光素子１３に接続され各他端部が基板１４の両側部に位置されている。給電端子１４ａ、１４ａはそれぞれ接続端子１２、１２に接続されて半導体発光素子１３への給電を行う給電部として機能する。   The light emitter 6 includes, for example, a semiconductor light emitting element 13 which is a light emitting diode (LED) and a substrate 14 on which the semiconductor light emitting element 13 is mounted. A pair of power supply terminals 14 a, 14 a is formed on the substrate 14, one end of each of the power supply terminals 14 a, 14 a is connected to the semiconductor light emitting element 13, and the other end is positioned on both sides of the substrate 14. The power supply terminals 14 a and 14 a are connected to the connection terminals 12 and 12, respectively, and function as power supply units that supply power to the semiconductor light emitting element 13.

ヒートシンク７は前後方向を向く円板状の基部７ａと該基部７ａの後面からそれぞれ後方へ突出されたフィン部７ｂ、７ｂ、・・・とから成る。   The heat sink 7 includes a disk-like base portion 7a facing in the front-rear direction and fin portions 7b, 7b,... Protruding rearward from the rear surface of the base portion 7a.

発光体６とヒートシンク７の間には絶縁紙１５が配置される。絶縁紙１５は円形状に形成され、中心部に挿通孔１５ａを有している。   An insulating paper 15 is disposed between the light emitter 6 and the heat sink 7. The insulating paper 15 is formed in a circular shape and has an insertion hole 15a at the center.

発光体６は枠状部１１の内側に後方から挿入されハウジング４に配置される。発光体６はハウジング４に配置された状態において、半導体発光素子１３がハウジング４の配置孔８ａに配置され、給電端子１４ａ、１４ａがそれぞれ接続端子１２、１２の端子接続部１２ａ、１２ａに接続される。   The light emitter 6 is inserted into the inside of the frame-like portion 11 from the rear and is disposed in the housing 4. In a state where the light emitter 6 is disposed in the housing 4, the semiconductor light emitting element 13 is disposed in the disposition hole 8 a of the housing 4, and the power supply terminals 14 a and 14 a are connected to the terminal connection portions 12 a and 12 a of the connection terminals 12 and 12, respectively. The

発光体６の後面には絶縁紙１５が配置され、該絶縁紙１５の後面側にヒートシンク７が配置される。絶縁紙１５の挿通孔１５ａには発光体６の回路基板１４が挿入されて配置される。   An insulating paper 15 is disposed on the rear surface of the light emitter 6, and a heat sink 7 is disposed on the rear surface side of the insulating paper 15. The circuit board 14 of the light emitter 6 is inserted and disposed in the insertion hole 15a of the insulating paper 15.

上記のように、ハウジング４に発光体６、絶縁紙１５及びヒートシンク７が配置された状態において、セットスプリング１６がハウジング４に取り付けられる。   As described above, the set spring 16 is attached to the housing 4 in a state where the light emitter 6, the insulating paper 15, and the heat sink 7 are disposed in the housing 4.

セットスプリング１６は略Ｕ字状に形成された押さえ部１６ａと該押さえ部１６ａの両端から反対方向へ突出された被支持部１６ｂ、１６ｂとから成る。セットスプリング１６は被支持部１６ｂ、１６ｂがそれぞれ周面部９の支持溝９ａ、９ａに挿入されて支持され、押さえ部１６ａの先端部が取付ネジ５０によって接続用突部１０に取り付けられる。   The set spring 16 includes a pressing portion 16a formed in a substantially U shape, and supported portions 16b and 16b protruding in opposite directions from both ends of the pressing portion 16a. The supported portions 16b and 16b of the set spring 16 are supported by being inserted into the support grooves 9a and 9a of the peripheral surface portion 9, respectively, and the distal end portion of the pressing portion 16a is attached to the connecting projection 10 by an attachment screw 50.

接続端子１２、１２のコネクター接続部１２ｂ、１２ｂにはそれぞれコネクター端子１００、１００が接続される。コネクター端子１００、１００はそれぞれコネクター接続部１２ｂ、１２ｂに接する側がそれぞれ導電性を有する導電部１００ａ、１００ａとして形成されている。コネクター端子１００、１００は図示しない電源回路に接続されている。   Connector terminals 100 and 100 are connected to the connector connection portions 12b and 12b of the connection terminals 12 and 12, respectively. The connector terminals 100 and 100 are formed as conductive portions 100a and 100a having conductivity on the sides contacting the connector connecting portions 12b and 12b, respectively. The connector terminals 100, 100 are connected to a power supply circuit (not shown).

コネクター端子１００、１００は、例えば、それぞれ取付ネジ５０、５０によってハウジング４の接続用突部１０、１０に取り付けられて接続端子１２、１２のコネクター接続部１２ｂ、１２ｂに接続される。このとき一方のコネクター端子１００は後方からセットスプリング１６の押さえ部１６ａによって押さえられた状態でセットスプリング１６とともに取付ネジ５０によって接続用突部１０に取り付けられる。   The connector terminals 100, 100 are attached to the connection projections 10, 10 of the housing 4 by attachment screws 50, 50, for example, and are connected to the connector connection portions 12 b, 12 b of the connection terminals 12, 12. At this time, one connector terminal 100 is attached to the connecting protrusion 10 together with the set spring 16 by the attachment screw 50 in a state of being pressed by the pressing portion 16a of the set spring 16 from the rear.

上記のように、セットスプリング１６によって発光体６、絶縁紙１５及びヒートシンク７がハウジング４に取り付けられた状態においては、発光体６がヒートシンク７に後方から押さえられ回路基板１４の給電端子１４ａ、１４ａがそれぞれ接続端子１２、１２の端子接続部１２ａ、１２ａに押し付けられる。ヒートシンク７は発光体６の基板１４の後面に接触される。   As described above, in a state where the light emitter 6, the insulating paper 15, and the heat sink 7 are attached to the housing 4 by the set spring 16, the light emitter 6 is pressed by the heat sink 7 from behind and the power supply terminals 14 a and 14 a of the circuit board 14. Are pressed against the terminal connection portions 12a and 12a of the connection terminals 12 and 12, respectively. The heat sink 7 is in contact with the rear surface of the substrate 14 of the light emitter 6.

従って、ヒートシンク７は発光体６を押さえて給電端子１４ａ、１４ａをそれぞれ接続端子１２、１２の端子接続部１２ａ、１２ａに押し付ける押さえ部材として機能する。   Accordingly, the heat sink 7 functions as a pressing member that presses the light-emitting body 6 and presses the power supply terminals 14 a and 14 a against the terminal connection portions 12 a and 12 a of the connection terminals 12 and 12, respectively.

上記のように、光源ユニット５は、ハウジング４に発光体６、絶縁紙１５及びヒートシンク７を配置し、セットスプリング１６によってこれらの部材をハウジング４に取り付けることにより組み立てられるため、組立が容易であり、組立性の向上を図ることができる。   As described above, the light source unit 5 is assembled by disposing the light emitter 6, the insulating paper 15, and the heat sink 7 in the housing 4, and attaching these members to the housing 4 by the set spring 16. As a result, the assemblability can be improved.

また、光源ユニット５にあっては、ヒートシンク７が発光体６を押さえる押さえ部材として機能するため、ヒートシンク７が放熱機能と押さえ部材としての機能を有し、部品点数の削減及び構造の簡素化を図ることができる。   Further, in the light source unit 5, since the heat sink 7 functions as a pressing member that presses the light emitter 6, the heat sink 7 has a heat dissipation function and a function as a pressing member, thereby reducing the number of parts and simplifying the structure. You can plan.

上記のように光源ユニット５が構成された状態において、電源回路からコネクター端子１００、１００、接続端子１２、１２及び基板１４の給電端子１４ａ、１４ａを介して半導体発光素子１３に電流が供給され、該半導体発光素子１３から光が出射される。   In the state where the light source unit 5 is configured as described above, current is supplied from the power supply circuit to the semiconductor light emitting element 13 via the connector terminals 100 and 100, the connection terminals 12 and 12 and the power supply terminals 14a and 14a of the substrate 14, Light is emitted from the semiconductor light emitting element 13.

半導体発光素子１３の発光時には光の出射に伴って発光体６に発熱が生じるが、発生した熱はヒートシンク７からリフレクター２の外側に放出される。   When the semiconductor light emitting element 13 emits light, heat is generated in the light emitter 6 as the light is emitted, but the generated heat is released from the heat sink 7 to the outside of the reflector 2.

次に、第２の実施の形態における光源ユニット５Ａについて説明する（図２参照）。   Next, the light source unit 5A in the second embodiment will be described (see FIG. 2).

車輌用灯具１Ａは、例えば、前方に開口された凹部を有するランプボデイ１７と該ランプボデイ１７の開口面を閉塞する図示しないカバーとを備えている。   1 A of vehicle lamps are provided with the lamp body 17 which has the recessed part opened ahead, for example, and the cover which is not shown in figure which obstruct | occludes the opening surface of this lamp body 17. FIG.

ランプボデイ１７の後端部にはハウジング４Ａが一体に設けられ、ランプボデイ１７は本体３Ａとハウジング４Ａによって構成されている。尚、ハウジング４Ａは本体３Ａと別体で形成されていてもよい。   A housing 4A is integrally provided at the rear end portion of the lamp body 17, and the lamp body 17 is constituted by the main body 3A and the housing 4A. The housing 4A may be formed separately from the main body 3A.

ランプボデイ１７において本体３Ａとハウジング４Ａを一体に形成することにより、ランプボデイ１７の製造時間の短縮化及び製造コストの低減を図ることができる。   By forming the main body 3A and the housing 4A integrally in the lamp body 17, it is possible to shorten the manufacturing time and the manufacturing cost of the lamp body 17.

光源ユニット５Ａはハウジング４Ａと発光体６と押さえ部材１８を有している。   The light source unit 5A includes a housing 4A, a light emitter 6, and a pressing member 18.

ハウジング４Ａには配置孔４ａが形成されている。ハウジング４Ａには配置孔４ａを挟んだ反対側の位置に螺孔４ｂ、４ｂが形成されている。   An arrangement hole 4a is formed in the housing 4A. Screw holes 4b and 4b are formed in the housing 4A at positions opposite to each other with the arrangement hole 4a interposed therebetween.

ハウジング４Ａの前面には一対の接続端子１９、１９、複数の端子部材２０、２０、・・・、接続端子１９、１９や端子部材２０、２０、・・・を接続する接続線２１、２１、・・・及び保護素子や抵抗素子等の電気素子２２、２２、・・・によって構成されたバスバー回路２３が設けられている。バスバー回路２３は、例えば、接続端子１９、１９及び端子部材２０、２０、・・・が熱加締めによってハウジング４Ａに取り付けられている。   A pair of connecting terminals 19, 19, a plurality of terminal members 20, 20,..., Connecting terminals 21, 19, and connecting wires 21, 21, connecting the terminal members 20, 20,. .. And a bus bar circuit 23 constituted by electric elements 22, 22,... Such as a protection element and a resistance element. In the bus bar circuit 23, for example, the connection terminals 19, 19 and the terminal members 20, 20,... Are attached to the housing 4A by heat caulking.

接続端子１９、１９は発光体６の一対の給電端子１４ａ、１４ａにそれぞれ接続される接続部として機能する。接続端子１９、１９は導電性金属材料によって形成され左右に離隔して配置され、端子部材２０、２０、・・・はそれぞれ接続端子１９、１９の上下に配置されている。   The connection terminals 19 and 19 function as connection portions connected to the pair of power supply terminals 14 a and 14 a of the light emitter 6, respectively. The connection terminals 19, 19 are formed of a conductive metal material and are spaced apart from each other on the left and right, and the terminal members 20, 20,.

一方の接続端子１９とその上下に位置する端子部材２０、２０にはそれぞれコネクター接続部１９ａ、２０ａ、２０ａが設けられている。   One connection terminal 19 and terminal members 20 and 20 located above and below the connection terminal 19 are provided with connector connection portions 19a, 20a, and 20a, respectively.

接続端子１９、１９には、内側の端部にそれぞれ後方へ凸の円弧状に形成された端子接続部１９ｂ、１９ｂが設けられ、該端子接続部１９ｂ、１９ｂが配置孔４ａに位置されている。   The connection terminals 19 and 19 are respectively provided with terminal connection portions 19b and 19b formed in an arc shape protruding rearward at the inner end portions, and the terminal connection portions 19b and 19b are positioned in the arrangement hole 4a. .

押さえ部材１８は前後方向を向く板状に形成され、本体部２４と該本体部２４の左右両側部からそれぞれ外方へ突出された被取付突部２５、２５とから成る。   The pressing member 18 is formed in a plate shape facing in the front-rear direction, and includes a main body 24 and attached protrusions 25 and 25 that protrude outward from the left and right sides of the main body 24.

本体部２４の前面における中央部には前方へ突出された枠状部２４ａが設けられている。本体部２４の枠状部２４ａの内部には、例えば、放熱用のグリス２００が塗布されている。本体部２４のうち少なくともグリス２００が塗布された部分は放熱性の高い金属材料によって形成することが望ましい。   A frame-like portion 24 a that protrudes forward is provided at the center of the front surface of the main body portion 24. For example, heat-dissipating grease 200 is applied to the inside of the frame-like portion 24a of the main body portion 24. It is desirable that at least a portion of the main body 24 to which the grease 200 is applied is formed of a metal material having high heat dissipation.

被取付突部２５、２５にはそれぞれ前後に貫通されたネジ挿通孔２５ａ、２５ａが形成されている。   Screw insertion holes 25a and 25a penetrating in the front-rear direction are formed in the attachment projections 25 and 25, respectively.

発光体６は本体部２４の枠状部２４ａの内側に前方から挿入され押さえ部材１８に配置される。発光体６は押さえ部材１８に配置された状態において、一部が枠状部２４ａから前方へ突出される。   The light emitter 6 is inserted from the front inside the frame-like portion 24 a of the main body 24 and is disposed on the pressing member 18. In a state where the light emitter 6 is disposed on the pressing member 18, a part thereof protrudes forward from the frame-shaped portion 24 a.

押さえ部材１８は取付ネジ５０、５０がそれぞれ被取付突部２５、２５のネジ挿通孔２５ａ、２５ａを挿通されハウジング４Ａの螺孔４ｂ、４ｂに螺合されることによりハウジング４Ａの後面に取り付けられる。尚、ハウジング４Ａの後面と押さえ部材１８の前面との間には、防水性を確保するためにゴム等のオーリングを配置することが望ましい。   The holding member 18 is attached to the rear surface of the housing 4A by attaching the mounting screws 50, 50 through the screw insertion holes 25a, 25a of the attached projections 25, 25 and screwing into the screw holes 4b, 4b of the housing 4A. . In addition, it is desirable to arrange an O-ring such as rubber between the rear surface of the housing 4A and the front surface of the pressing member 18 in order to ensure waterproofness.

押さえ部材１８がハウジング４Ａに取り付けられた状態においては、枠状部２４ａ及び発光体６が配置孔４ａに配置され、発光体６の給電端子１４ａ、１４ａがそれぞれ接続端子１９、１９の端子接続部１９ｂ、１９ｂに押し付けられる。   In a state where the pressing member 18 is attached to the housing 4A, the frame-like portion 24a and the light emitter 6 are disposed in the disposition hole 4a, and the power supply terminals 14a and 14a of the light emitter 6 are the terminal connection portions of the connection terminals 19 and 19, respectively. It is pressed against 19b, 19b.

接続端子１９と端子部材２０、２０のコネクター接続部１９ａ、２０ａ、２０ａには電源回路に接続された図示しないコネクターが接続される。   A connector (not shown) connected to a power supply circuit is connected to the connector connection portions 19a, 20a, 20a of the connection terminal 19 and the terminal members 20, 20.

上記のように、光源ユニット５Ａは、ハウジング４Ａにバスバー回路２３を取り付け、押さえ部材１８に発光体６を配置し押さえ部材１８をハウジング４Ａに取り付けることにより組み立てられるため、組立が容易であり、組立性の向上を図ることができる。   As described above, the light source unit 5A is assembled by attaching the bus bar circuit 23 to the housing 4A, disposing the light emitter 6 on the holding member 18 and attaching the holding member 18 to the housing 4A. It is possible to improve the performance.

上記のように光源ユニット５Ａが構成された状態において、電源回路からコネクター、バスバー回路２３及び基板１４の給電端子１４ａ、１４ａを介して半導体発光素子１３に電流が供給され、該半導体発光素子１３から光が出射される。   In the state where the light source unit 5A is configured as described above, a current is supplied from the power supply circuit to the semiconductor light emitting element 13 via the connector, the bus bar circuit 23 and the power supply terminals 14a and 14a of the substrate 14, and the semiconductor light emitting element 13 Light is emitted.

半導体発光素子１３の発光時には光の出射に伴って発光体６に発熱が生じるが、発生した熱はグリス２００からランプボデイ１７の外側に放出される。   When the semiconductor light emitting element 13 emits light, heat is generated in the light emitter 6 as the light is emitted, but the generated heat is released from the grease 200 to the outside of the lamp body 17.

上記には、押さえ部材１８をネジ止めによりハウジング４Ａに取り付ける例を示したが、例えば、以下に示す第２の実施の形態における変形例である光源ユニット５Ｂのように、押さえ部材をネジ止めによらずにハウジングに取り付けることも可能である（図３参照）。   In the above, an example in which the pressing member 18 is attached to the housing 4A by screwing has been described. For example, as in a light source unit 5B which is a modified example of the second embodiment described below, the pressing member is screwed. It can also be attached to the housing without reference (see FIG. 3).

光源ユニット５Ｂはハウジング４Ｂと発光体６と押さえ部材１８Ｂを有している。ハウジング４Ｂはランプボデイ１７Ｂの後端部に一体に設けられ、該ランプボデイ１７Ｂは本体３Ｂとハウジング４Ｂによって構成されている。尚、ハウジング４Ｂは本体３Ｂと別体で形成されていてもよい。   The light source unit 5B includes a housing 4B, a light emitter 6, and a pressing member 18B. The housing 4B is integrally provided at the rear end of the lamp body 17B, and the lamp body 17B is constituted by the main body 3B and the housing 4B. The housing 4B may be formed separately from the main body 3B.

ランプボデイ１７Ｂにおいて本体３Ｂとハウジング４Ｂを一体に形成することにより、ランプボデイ１７Ｂの製造時間の短縮化及び製造コストの低減を図ることができる。   By integrally forming the main body 3B and the housing 4B in the lamp body 17B, it is possible to shorten the manufacturing time and the manufacturing cost of the lamp body 17B.

ハウジング４Ｂには配置孔４ｃが形成され、該配置孔４ｃは大きな円形部４ｄと該円形部４ｄの外周に連続して形成された突部４ｅ、４ｅ、４ｅとから成り、該突部４ｅ、４ｅ、４ｅが周方向に離隔して位置されている。ハウジング４Ｂの前面にはバスバー回路２３が設けられている。   An arrangement hole 4c is formed in the housing 4B, and the arrangement hole 4c includes a large circular portion 4d and protrusions 4e, 4e, and 4e formed continuously on the outer periphery of the circular portion 4d. 4e and 4e are spaced apart in the circumferential direction. A bus bar circuit 23 is provided on the front surface of the housing 4B.

押さえ部材１８Ｂは、前後方向を向く円板状に形成されたフランジ部２６と、該フランジ部２６の外周部を除く部分から前方へ突出された挿入部２７と、フランジ部２６の後面から後方へ突出された板状の回転操作部２８とから成る。   The holding member 18B includes a flange portion 26 formed in a disk shape facing in the front-rear direction, an insertion portion 27 protruding forward from a portion excluding the outer peripheral portion of the flange portion 26, and a rear surface from the rear surface of the flange portion 26. It consists of a protruding plate-like rotation operation unit 28.

挿入部２７の前面には枠状部２７ａが設けられ、該枠状部２７ａの内部には、例えば、放熱用のグリス２００が塗布されている。挿入部２７のうち少なくともグリス２００が塗布された部分は放熱性の高い金属材料によって形成することが望ましい。   A frame-shaped portion 27a is provided on the front surface of the insertion portion 27, and heat dissipation grease 200 is applied to the inside of the frame-shaped portion 27a, for example. It is desirable that at least a portion of the insertion portion 27 to which the grease 200 is applied is formed of a metal material having high heat dissipation.

挿入部２７の外周面における前端部には周方向に離隔して取付用突部２７ｂ、２７ｂ、２７ｂが設けられている。   Mounting protrusions 27b, 27b, and 27b are provided on the front end portion of the outer peripheral surface of the insertion portion 27 so as to be spaced apart in the circumferential direction.

発光体６は挿入部２７の枠状部２７ａの内側に前方から挿入され押さえ部材１８Ｂに配置される。発光体６は押さえ部材１８Ｂに配置された状態において、一部が枠状部２７ａから前方へ突出される。   The light emitter 6 is inserted into the inside of the frame-shaped portion 27a of the insertion portion 27 from the front and is disposed on the pressing member 18B. In a state where the light emitter 6 is disposed on the pressing member 18B, a part thereof protrudes forward from the frame-shaped portion 27a.

押さえ部材１８Ｂはハウジング４Ｂの配置孔４ｃに後方から挿入される。押さえ部材１８Ｂは挿入部２７の取付用突部２７ｂ、２７ｂ、２７ｂ以外の部分が円形部４ｄを挿通され取付用突部２７ｂ、２７ｂ、２７ｂがそれぞれ突部４ｅ、４ｅ、４ｅを挿通される。   The pressing member 18B is inserted into the arrangement hole 4c of the housing 4B from the rear. In the pressing member 18B, portions other than the mounting projections 27b, 27b, and 27b of the insertion portion 27 are inserted through the circular portion 4d, and the mounting projections 27b, 27b, and 27b are inserted through the projections 4e, 4e, and 4e, respectively.

取付用突部２７ｂ、２７ｂ、２７ｂがそれぞれ配置孔４ｃの突部４ｅ、４ｅ、４ｅを挿通された状態においては、フランジ部２６がハウジング４Ｂの後面に押し付けられ、この状態で押さえ部材１８Ｂをハウジング４Ｂに対して回転することにより押さえ部材１８Ｂがハウジング４Ｂに取り付けられる。このとき回転操作部２８を把持して押さえ部材１８Ｂを回転することにより、押さえ部材１８Ｂの回転を容易に行うことができる。   When the mounting protrusions 27b, 27b, and 27b are respectively inserted through the protrusions 4e, 4e, and 4e of the arrangement hole 4c, the flange portion 26 is pressed against the rear surface of the housing 4B. The pressing member 18B is attached to the housing 4B by rotating with respect to 4B. At this time, the holding member 18B can be easily rotated by gripping the rotation operation unit 28 and rotating the holding member 18B.

押さえ部材１８Ｂがハウジング４Ｂに取り付けられた状態においては、ハウジング４Ｂが押さえ部材１８Ｂの取付用突部２７ｂ、２７ｂ、２７ｂとフランジ部２６によって挟持される。尚、ハウジング４Ｂの後面とフランジ部２６の前面との間には、防水性を確保するためにゴム等のオーリングを配置することが望ましい。   In a state where the pressing member 18B is attached to the housing 4B, the housing 4B is sandwiched between the mounting protrusions 27b, 27b, 27b of the pressing member 18B and the flange portion 26. In addition, it is desirable to arrange an O-ring such as rubber between the rear surface of the housing 4B and the front surface of the flange portion 26 in order to ensure waterproofness.

押さえ部材１８Ｂがハウジング４Ｂに取り付けられた状態においては、枠状部２７ａ及び発光体６が配置孔４ｃに配置され、発光体６の給電端子１４ａ、１４ａがそれぞれ接続端子１９、１９の端子接続部１９ｂ、１９ｂに押し付けられる。   In a state where the pressing member 18B is attached to the housing 4B, the frame-shaped portion 27a and the light emitter 6 are disposed in the disposition hole 4c, and the power supply terminals 14a and 14a of the light emitter 6 are the terminal connection portions of the connection terminals 19 and 19, respectively. It is pressed against 19b, 19b.

上記のように、光源ユニット５Ｂは、ハウジング４Ｂにバスバー回路２３を取り付け、押さえ部材１８Ｂに発光体６を配置し押さえ部材１８Ｂをハウジング４Ｂに取り付けることにより組み立てられるため、組立が容易であり、組立性の向上を図ることができる。   As described above, the light source unit 5B is assembled by attaching the bus bar circuit 23 to the housing 4B, placing the light emitter 6 on the holding member 18B, and attaching the holding member 18B to the housing 4B. It is possible to improve the performance.

上記のように光源ユニット５Ｂが構成された状態において、電源回路からコネクター、バスバー回路２３及び基板１４の給電端子１４ａ、１４ａを介して半導体発光素子１３に電流が供給され、該半導体発光素子１３から光が出射される。   In the state in which the light source unit 5B is configured as described above, a current is supplied from the power supply circuit to the semiconductor light emitting element 13 via the connector, the bus bar circuit 23, and the power supply terminals 14a and 14a of the substrate 14, and the semiconductor light emitting element 13 Light is emitted.

半導体発光素子１３の発光時には光の出射に伴って発光体６に発熱が生じるが、発生した熱はグリス２００からランプボデイ１７Ｂの外側に放出される。   When the semiconductor light emitting element 13 emits light, heat is generated in the light emitter 6 as light is emitted, but the generated heat is released from the grease 200 to the outside of the lamp body 17B.

次に、第３の実施の形態における光源ユニット５Ｃについて説明する（図４及び図５参照）。   Next, the light source unit 5C in the third embodiment will be described (see FIGS. 4 and 5).

光源ユニット５Ｃはハウジング４Ｃと発光体６Ｃと放熱板２９とカバー体３０を有している。   The light source unit 5 </ b> C includes a housing 4 </ b> C, a light emitter 6 </ b> C, a heat radiating plate 29, and a cover body 30.

ハウジング４Ｃは絶縁性材料によって形成されたソケット３１と回路基板３２によって構成されている。   The housing 4C includes a socket 31 and a circuit board 32 that are formed of an insulating material.

ソケット３１は、例えば、一定の厚みを有する略円板状に形成され、前方に開口された配置用溝３１ａを有している。   The socket 31 is formed, for example, in a substantially disc shape having a certain thickness, and has a placement groove 31a that opens forward.

ソケット３１には前後に貫通された端子挿通孔３１ｂ、３１ｂが形成され、該端子挿通孔３１ｂ、３１ｂは配置用溝３１ａに開口されている。ソケット３１には前後に貫通された支持孔３１ｃ、３１ｃが形成され、該支持孔３１ｃ、３１ｃは配置用溝３１ａを挟んだ反対側に位置されている。ソケット３１の後縁には係合凹部３１ｄ、３１ｄが形成されている。   The socket 31 is formed with terminal insertion holes 31b, 31b penetrating in the front-rear direction, and the terminal insertion holes 31b, 31b are opened in the placement groove 31a. The socket 31 is formed with support holes 31c and 31c penetrating in the front-rear direction, and the support holes 31c and 31c are located on the opposite side across the placement groove 31a. Engaging recesses 31d and 31d are formed at the rear edge of the socket 31.

回路基板３２には導電性金属材料によって形成された一対の接続端子３３、３３が設けられている。   The circuit board 32 is provided with a pair of connection terminals 33 and 33 formed of a conductive metal material.

接続端子３３、３３は発光体６Ｃの後述する一対の給電端子にそれぞれ接続される接続部として機能する。接続端子３３、３３はそれぞれ前後に延びるコネクター接続部３３ａ、３３ａと該コネクター接続部３３ａ、３３ａの前端から互いに近付く方向へ屈曲された端子接続部３３ｂ、３３ｂとから成る。接続端子３３、３３は、それぞれコネクター接続部３３ａ、３３ａが回路基板３２から後方へ突出され、端子接続部３３ｂ、３３ｂの先端部がそれぞれ回路基板３２の前面に離隔して位置されている。   The connection terminals 33 and 33 function as connection portions that are respectively connected to a pair of power supply terminals described later of the light emitter 6C. The connection terminals 33 and 33 include connector connection portions 33a and 33a extending in the front-rear direction and terminal connection portions 33b and 33b bent in a direction approaching each other from the front ends of the connector connection portions 33a and 33a. In the connection terminals 33 and 33, connector connection portions 33 a and 33 a are protruded rearward from the circuit board 32, and the tip ends of the terminal connection portions 33 b and 33 b are respectively spaced apart from the front surface of the circuit board 32.

回路基板３２はソケット３１の配置用溝３１ａに配置され、接続端子３３、３３のコネクター接続部３３ａ、３３ａがそれぞれソケット３１の端子挿通孔３１ｂ、３１ｂを挿通される。接続端子３３、３３のコネクター接続部３３ａ、３３ａはそれぞれ後端部がソケット３１から後方へ突出される。   The circuit board 32 is arranged in the arrangement groove 31 a of the socket 31, and the connector connection portions 33 a and 33 a of the connection terminals 33 and 33 are inserted through the terminal insertion holes 31 b and 31 b of the socket 31, respectively. The rear ends of the connector connection portions 33a and 33a of the connection terminals 33 and 33 protrude rearward from the socket 31, respectively.

放熱板２９は前後方向を向く基面部２９ａと該基面部２９ａの両側縁からそれぞれ後方へ突出された放熱部２９ｂ、２９ｂとから成る。放熱板２９は基面部２９ａが回路基板３２の前面に跨るように配置され放熱部２９ｂ、２９ｂがそれぞれソケット３１の支持孔３１ｃ、３１ｃに挿入される。放熱部２９ｂ、２９ｂは後端部がそれぞれソケット３１から後方へ突出される。   The heat radiating plate 29 includes a base surface portion 29a facing in the front-rear direction and heat radiating portions 29b and 29b protruding rearward from both side edges of the base surface portion 29a. The heat radiating plate 29 is disposed so that the base surface portion 29a extends over the front surface of the circuit board 32, and the heat radiating portions 29b and 29b are inserted into the support holes 31c and 31c of the socket 31, respectively. The heat radiating portions 29b and 29b have rear end portions protruding rearward from the socket 31, respectively.

発光体６Ｃは半導体発光素子１３Ｃと該半導体発光素子１３Ｃが搭載された基板１４Ｃとから成る。基板１４Ｃには一対の給電端子１４ｂ、１４ｂが設けられ、該給電端子１４ｂ、１４ｂは基板１４Ｃの両側面から反対方向へ突出されている。給電端子１４ｂ、１４ｂはそれぞれ接続端子３３、３３に接続されて半導体発光素子１３Ｃへの給電を行う給電部として機能する。   The light emitter 6C includes a semiconductor light emitting element 13C and a substrate 14C on which the semiconductor light emitting element 13C is mounted. The substrate 14C is provided with a pair of power supply terminals 14b and 14b, and the power supply terminals 14b and 14b protrude in opposite directions from both side surfaces of the substrate 14C. The power supply terminals 14b and 14b are connected to the connection terminals 33 and 33, respectively, and function as a power supply unit that supplies power to the semiconductor light emitting element 13C.

発光体６Ｃは基板１４Ｃが放熱板２９の基面部２９ａに配置され給電端子１４ｂ、１４ｂがそれぞれ回路基板３２の前面に位置された接続端子３３、３３の端子接続部３３ｂ、３３ｂに接続される。   The light emitter 6C has a substrate 14C disposed on the base surface portion 29a of the heat dissipation plate 29, and power supply terminals 14b and 14b connected to the terminal connection portions 33b and 33b of the connection terminals 33 and 33 positioned on the front surface of the circuit board 32, respectively.

カバー体３０は絶縁性材料によって形成され平板状の蓋部３４と該蓋部３４の側縁からそれぞれ後方へ突出された脚部３５、３５とから成る。   The cover body 30 is made of an insulating material and includes a flat lid portion 34 and leg portions 35 and 35 projecting rearward from the side edges of the lid portion 34.

蓋部３４の中央部には配置孔３４ａが形成されている。蓋部３４の後面には配置孔３４ａを挟んだ反対側の位置にそれぞれ後方へ突出された押さえ部３４ｂ、３４ｂが設けられている。   An arrangement hole 34 a is formed at the center of the lid portion 34. On the rear surface of the lid portion 34, pressing portions 34b and 34b that protrude backward are provided at positions opposite to each other across the arrangement hole 34a.

脚部３５、３５は弾性変形可能とされ、先端部に互いに近付く方向へ突出された係合突部３６、３６を有している。係合突部３６、３６にはそれぞれ前方へ行くに従って互いに近付く傾斜面３６ａ、３６ａが形成されている。   The leg portions 35 and 35 are elastically deformable, and have engaging protrusions 36 and 36 that protrude in a direction approaching the distal end portion. The engaging projections 36, 36 are formed with inclined surfaces 36a, 36a that approach each other as they go forward.

カバー体３０はハウジング４Ｃのソケット３１に取り付けられる。カバー体３０はソケット３１に前方から組み付けられていき、脚部３５、３５の係合突部３６、３６がソケット３１の外周面に摺接して脚部３５、３５が外側に変位するように弾性変形される。係合突部３６、３６の先端縁がそれぞれソケット３１、３１に形成された係合凹部３１ｄ、３１ｄに対応して位置されたときに、脚部３５、３５が弾性復帰して係合突部３６、３６がそれぞれ係合凹部３１ｄ、３１ｄに係合しカバー体３０がソケット３１に取り付けられる。   The cover body 30 is attached to the socket 31 of the housing 4C. The cover body 30 is assembled to the socket 31 from the front, and is elastic so that the engaging protrusions 36 and 36 of the leg portions 35 and 35 are in sliding contact with the outer peripheral surface of the socket 31 and the leg portions 35 and 35 are displaced outward. Deformed. When the leading edges of the engaging protrusions 36 and 36 are positioned corresponding to the engaging recesses 31d and 31d formed in the sockets 31 and 31, respectively, the leg portions 35 and 35 are elastically restored and the engaging protrusions 36 and 36 are engaged with the engaging recesses 31 d and 31 d, respectively, and the cover body 30 is attached to the socket 31.

カバー体３０がソケット３１に取り付けられた状態においては、押さえ部３４ｂ、３４ｂによって発光体６Ｃの給電端子１４ｂ、１４ｂが前方から押さえられそれぞれ接続端子３３、３３の端子接続部３３ｂ、３３ｂに押し付けられる。   In a state where the cover body 30 is attached to the socket 31, the power feeding terminals 14b, 14b of the light emitter 6C are pressed from the front by the pressing portions 34b, 34b and pressed against the terminal connection portions 33b, 33b of the connection terminals 33, 33, respectively. .

上記のように構成された光源ユニット５Ｃは、図示しないランプボデイ又はリフレクターに取り付けられ、ソケット３１から後方へ突出された接続端子３３、３３のコネクター接続部３３ａ、３３ａに電源回路に接続された図示しないコネクターが接続される。   The light source unit 5C configured as described above is attached to a lamp body or reflector (not shown), and is connected to a power supply circuit at connector connection portions 33a and 33a of connection terminals 33 and 33 protruding rearward from the socket 31. Connector that is not connected is connected.

光源ユニット５Ｃはランプボデイ又はリフレクターに、例えば、圧入、接着、溶接、係合、ネジ止め等の適宜の方法によって取り付けられる。   The light source unit 5C is attached to the lamp body or reflector by an appropriate method such as press fitting, adhesion, welding, engagement, screwing, or the like.

上記のように、光源ユニット５Ｃは、ハウジング４Ｃに放熱板２９及び発光体６Ｃを配置しハウジング４Ｃにカバー体３０を取り付けることにより組み立てられるため、組立が容易であり、組立性の向上を図ることができる。   As described above, since the light source unit 5C is assembled by disposing the heat radiating plate 29 and the light emitter 6C in the housing 4C and attaching the cover body 30 to the housing 4C, the light source unit 5C is easy to assemble and improves assemblability. Can do.

上記のように光源ユニット５Ｃが構成された状態において、電源回路からコネクター、接続端子３３、３３及び基板１４Ｃの給電端子１４ｂ、１４ｂを介して半導体発光素子１３Ｃに電流が供給され、該半導体発光素子１３Ｃから光が出射される。   In the state where the light source unit 5C is configured as described above, a current is supplied from the power supply circuit to the semiconductor light emitting element 13C via the connectors, the connection terminals 33 and 33, and the power supply terminals 14b and 14b of the substrate 14C. Light is emitted from 13C.

半導体発光素子１３Ｃの発光時には光の出射に伴って発光体６Ｃに発熱が生じるが、発生した熱は放熱板２９からランプボデイ又はリフレクターの外側に放出される。   When the semiconductor light emitting element 13C emits light, heat is generated in the light emitter 6C as light is emitted, but the generated heat is released from the heat radiating plate 29 to the outside of the lamp body or reflector.

上記には、ハウジング４Ｃをソケット３１Ｄと回路基板３２によって構成した例を示したが、例えば、以下に示す第３の実施の形態における変形例である光源ユニット５Ｄのように、ハウジングをソケットと放熱体によって構成することも可能である（図６及び図７参照）。   In the above, an example in which the housing 4C is configured by the socket 31D and the circuit board 32 has been described. For example, as in a light source unit 5D which is a modified example of the third embodiment described below, the housing is dissipated from the socket. It can also be constituted by a body (see FIGS. 6 and 7).

光源ユニット５Ｄはハウジング４Ｄと発光体６Ｃとカバー体３０Ｄを有している。   The light source unit 5D includes a housing 4D, a light emitter 6C, and a cover body 30D.

ハウジング４Ｄは絶縁性材料によって形成されたソケット３１Ｄと金属材料によって形成された放熱体３７が、例えば、金属部材が配置された金型に溶融樹脂が充填されて成形される所謂インサート成形によって一体に形成されて成る。   The housing 4D is integrally formed by a so-called insert molding in which a socket 31D made of an insulating material and a heat radiating body 37 made of a metal material are molded by, for example, filling a mold in which a metal member is arranged with a molten resin. Formed.

ハウジング４Ｄは、例えば、一定の厚みを有する略円板状に形成され、ソケット３１Ｄとして設けられた樹脂成形部３８、３８と該樹脂成形部３８、３８間に位置する放熱体３７とによって構成されている。   The housing 4D is formed, for example, in a substantially disc shape having a certain thickness, and is configured by resin molded portions 38 and 38 provided as a socket 31D and a heat radiator 37 positioned between the resin molded portions 38 and 38. ing.

樹脂成形部３８、３８は、例えば、略半円形状に形成され、外周面のうち平面とされた部分が向き合うように位置されている。樹脂成形部３８、３８の対向する側の部分にはそれぞれ内方及び前方に開口された配置用溝３８ａ、３８ａが形成されている。樹脂成形部３８、３８には前後に貫通された端子挿通孔３８ｂ、３８ｂが形成されている。   The resin molding portions 38 and 38 are formed, for example, in a substantially semicircular shape, and are positioned so that the flat portions of the outer peripheral surface face each other. Arrangement grooves 38a and 38a that are opened inwardly and forwardly are formed in the opposite side portions of the resin molding portions 38 and 38, respectively. The resin molding portions 38 and 38 are formed with terminal insertion holes 38b and 38b penetrating in the front-rear direction.

樹脂成形部３８、３８にはそれぞれ導電性金属材料によって形成された接続端子３９、３９が設けられている。接続端子３９、３９は発光体６Ｃの一対の給電端子１４ｂ、１４ｂにそれぞれ接続される接続部として機能する。接続端子３９、３９は配置用溝３８ａ、３８ａから該配置用溝３８ａ、３８ａの開口縁に亘る位置に設けられている。   The resin molding portions 38 and 38 are provided with connection terminals 39 and 39 made of a conductive metal material, respectively. The connection terminals 39 and 39 function as connection portions connected to the pair of power supply terminals 14b and 14b of the light emitter 6C, respectively. The connection terminals 39, 39 are provided at positions extending from the placement grooves 38a, 38a to the opening edges of the placement grooves 38a, 38a.

放熱体３７は、前面が樹脂成形部３８、３８の前面より後方に位置され、後面が樹脂成形部３８、３８の後面と同一平面状に位置されている。放熱体３７の後縁には係合凹部３７ａ、３７ａが形成されている。   The heat dissipating body 37 has a front surface positioned behind the front surfaces of the resin molding portions 38 and 38 and a rear surface positioned on the same plane as the rear surfaces of the resin molding portions 38 and 38. Engagement recesses 37 a and 37 a are formed at the rear edge of the radiator 37.

発光体６Ｃは基板１４Ｃが放熱体３７に配置され給電端子１４ｂ、１４ｂがそれぞれハウジング４Ｄに設けられた接続端子３９、３９に接続される。   In the light emitter 6C, the substrate 14C is disposed on the radiator 37, and the power supply terminals 14b and 14b are connected to connection terminals 39 and 39 provided on the housing 4D, respectively.

カバー体３０Ｄは絶縁性材料によって形成され、内部に図示しない回路が設けられている。カバー体３０Ｄは平板状の蓋部３４と該蓋部３４の側縁からそれぞれ後方へ突出された脚部３５、３５とから成る。   The cover body 30D is formed of an insulating material, and a circuit (not shown) is provided inside. The cover body 30 </ b> D includes a flat lid portion 34 and leg portions 35, 35 projecting rearward from the side edges of the lid portion 34.

カバー体３０Ｄには配置孔３４ａを挟んだ反対側の位置に接続部材４０、４０が設けられている。接続部材４０、４０はカバー体３０Ｄの後面に設けられた端子接続部４０ａ、４０ａと該端子接続部４０ａ、４０ａの外側の端縁から後方へ突出されたコネクター接続部４０ｂ、４０ｂとから成る。接続部材４０、４０は端子接続部４０ａ、４０ａがカバー体３０Ｄの内部に設けられた回路に接続されている。   Connection members 40 and 40 are provided on the opposite side of the cover body 30D with the arrangement hole 34a interposed therebetween. The connection members 40 and 40 include terminal connection portions 40a and 40a provided on the rear surface of the cover body 30D, and connector connection portions 40b and 40b protruding rearward from the outer edges of the terminal connection portions 40a and 40a. The connection members 40, 40 are connected to a circuit in which terminal connection portions 40a, 40a are provided inside the cover body 30D.

カバー体３０Ｄはハウジング４Ｄに取り付けられる。カバー体３０Ｄはハウジング４Ｄに前方から組み付けられていき、脚部３５、３５の係合突部３６、３６が放熱体３７の外面に摺接して脚部３５、３５が外側に変位するように弾性変形される。係合突部３６、３６の先端縁がそれぞれ放熱体３７の係合凹部３７ａ、３７ａに対応して位置されたときに、脚部３５、３５が弾性復帰して係合突部３６、３６がそれぞれ係合凹部３７ａ、３７ａに係合しカバー体３０Ｄがハウジング４Ｄに取り付けられる。   The cover body 30D is attached to the housing 4D. The cover body 30D is assembled to the housing 4D from the front, and the engagement protrusions 36, 36 of the leg portions 35, 35 are slidably contacted with the outer surface of the heat radiating body 37 so that the leg portions 35, 35 are displaced outward. Deformed. When the front end edges of the engaging protrusions 36, 36 are positioned corresponding to the engaging recesses 37a, 37a of the radiator 37, the leg portions 35, 35 are elastically restored and the engaging protrusions 36, 36 are The cover 30D is attached to the housing 4D by engaging with the engaging recesses 37a and 37a, respectively.

カバー体３０Ｄがハウジング４Ｄに取り付けられるときには、接続部材４０、４０のコネクター接続部４０ｂ、４０ｂがそれぞれソケット３１Ｄの端子挿通孔３８ｂ、３８ｂに挿入されソケット３１Ｄから後方へ突出される。接続部材４０、４０の端子接続部４０ａ、４０ａはそれぞれソケット３１Ｄに設けられた接続端子３９、３９に接続される。   When the cover body 30D is attached to the housing 4D, the connector connection portions 40b, 40b of the connection members 40, 40 are respectively inserted into the terminal insertion holes 38b, 38b of the socket 31D and protrude rearward from the socket 31D. The terminal connection portions 40a and 40a of the connection members 40 and 40 are connected to connection terminals 39 and 39 provided in the socket 31D, respectively.

カバー体３０Ｄがハウジング４Ｄに取り付けられた状態においては、押さえ部３４ｂ、３４ｂによって発光体６Ｃの給電端子１４ｂ、１４ｂが前方から押さえられそれぞれ接続端子３９、３９に押し付けられる。   In a state where the cover body 30D is attached to the housing 4D, the power feeding terminals 14b and 14b of the light emitter 6C are pressed from the front by the pressing portions 34b and 34b and pressed against the connection terminals 39 and 39, respectively.

上記のように構成された光源ユニット５Ｄは、図示しないランプボデイ又はリフレクターに取り付けられ、ソケット３１Ｄから後方へ突出された接続部材４０、４０のコネクター接続部４０ｂ、４０ｂに電源回路に接続された図示しないコネクターが接続される。   The light source unit 5D configured as described above is attached to a lamp body or reflector (not shown), and is connected to the power supply circuit at the connector connection portions 40b and 40b of the connection members 40 and 40 protruding rearward from the socket 31D. Connector that is not connected is connected.

光源ユニット５Ｄはランプボデイ又はリフレクターに、例えば、圧入、接着、溶接、係合、ネジ止め等の適宜の方法によって取り付けられる。   The light source unit 5D is attached to the lamp body or reflector by an appropriate method such as press fitting, adhesion, welding, engagement, screwing, or the like.

上記のように、光源ユニット５Ｄは、ハウジング４Ｄに発光体６Ｃを配置しハウジング４Ｄにカバー体３０Ｄを取り付けることにより組み立てられるため、組立が容易であり、組立性の向上を図ることができる。   As described above, the light source unit 5D is assembled by disposing the light emitter 6C in the housing 4D and attaching the cover body 30D to the housing 4D. Therefore, the light source unit 5D is easy to assemble and can improve the assemblability.

また、ハウジング４Ｄはソケット３１Ｄと放熱体３７が一体に形成され、カバー体３０Ｄの内部に回路が設けられているため、部品点数の削減及び構造の簡素化を図ることができる。   In addition, since the socket 4D and the heat radiating body 37 are integrally formed in the housing 4D and a circuit is provided inside the cover body 30D, the number of parts can be reduced and the structure can be simplified.

上記のように光源ユニット５Ｄが構成された状態において、電源回路からコネクター、接続部材４０、４０、接続端子３３、３３及び基板１４Ｃの給電端子１４ｂ、１４ｂを介して半導体発光素子１３Ｃに電流が供給され、該半導体発光素子１３Ｃから光が出射される。   In the state in which the light source unit 5D is configured as described above, current is supplied from the power supply circuit to the semiconductor light emitting element 13C through the connectors, the connection members 40 and 40, the connection terminals 33 and 33, and the power supply terminals 14b and 14b of the substrate 14C. Then, light is emitted from the semiconductor light emitting element 13C.

半導体発光素子１３Ｃの発光時には光の出射に伴って発光体６Ｃに発熱が生じるが、発生した熱は放熱体３７からランプボデイ又はリフレクターの外側に放出される。   When the semiconductor light emitting element 13C emits light, heat is generated in the light emitter 6C as light is emitted, but the generated heat is released from the heat radiator 37 to the outside of the lamp body or reflector.

以上に記載した通り、光源ユニット５、５Ａ、５Ｂ、５Ｃ、５Ｄにあっては、絶縁性材料によって形成され発光体６又は６Ｃが配置されるハウジング４乃至４Ｄと発光体６又は６Ｃに接続される一対の接続端子１２、１２、１９、１９、３３、３３、３９、３９と発光体６又は６Ｃを押さえる押さえ部材として機能するヒートシンク７、押さえ部材１８、１８Ｂ又は発光体６Ｃの給電端子１４ｂ、１４ｂを覆って押さえるカバー体３０、３０Ｄとが設けられている。   As described above, the light source units 5, 5A, 5B, 5C, and 5D are connected to the housings 4 to 4D that are formed of an insulating material and in which the light emitters 6 or 6C are disposed and the light emitters 6 or 6C. A pair of connection terminals 12, 12, 19, 19, 33, 33, 39, 39 and a heat sink 7 that functions as a pressing member for pressing the light emitter 6 or 6 C, a pressing member 18, 18 B, or a power supply terminal 14 b for the light emitter 6 C, Cover bodies 30 and 30D that cover and hold 14b are provided.

従って、光源ユニット５、５Ａ、５Ｂ、５Ｃ、５Ｄにおける構造の簡素化及び組立性の向上を図ることができる。   Therefore, the structure of the light source units 5, 5A, 5B, 5C, and 5D can be simplified and the assemblability can be improved.

また、上記のような光源ユニット５、５Ａ、５Ｂ、５Ｃ、５Ｄがランプボデイ（又はリフレクター）に取り付けられた車輌用灯具１においても、構造の簡素化及び組立性の向上を図ることができる。   In addition, in the vehicular lamp 1 in which the light source units 5, 5A, 5B, 5C, and 5D as described above are attached to the lamp body (or reflector), the structure can be simplified and the assemblability can be improved.

上記した最良の形態において示した各部の形状及び構造は、何れも本発明を実施するに際して行う具体化のほんの一例を示したものに過ぎず、これらによって本発明の技術的範囲が限定的に解釈されることがあってはならないものである。   The shapes and structures of the respective parts shown in the above-described best mode are merely examples of implementations in carrying out the present invention, and the technical scope of the present invention is limitedly interpreted by these. It should not be done.

図２乃至図７と共に本発明の最良の形態を示すものであり、本図は、第１の実施の形態における光源ユニットの分解斜視図である。2 to 7 show the best mode of the present invention, and this figure is an exploded perspective view of the light source unit in the first embodiment. FIG. 第２の実施の形態における光源ユニットの分解斜視図である。It is a disassembled perspective view of the light source unit in 2nd Embodiment. 第２の実施の形態の変形例における光源ユニットを一部を断面にして示す斜視図である。It is a perspective view which shows a part of light source unit in the modification of 2nd Embodiment in cross section. 第３の実施の形態における光源ユニットの分解斜視図である。It is a disassembled perspective view of the light source unit in 3rd Embodiment. 第３の実施の形態における光源ユニットの拡大断面図である。It is an expanded sectional view of the light source unit in 3rd Embodiment. 第３の実施の形態の変形例における光源ユニットの分解斜視図である。It is a disassembled perspective view of the light source unit in the modification of 3rd Embodiment. 第３の実施の形態の変形例における光源ユニットの拡大断面図である。It is an expanded sectional view of the light source unit in the modification of 3rd Embodiment.

１…車輌用灯具、２…リフレクター、４…ハウジング、５…光源ユニット、６…発光体、７…ヒートシンク（押さえ部材）、１２…接続端子（接続部）、１３…半導体発光素子、１４…基板、１４ａ…給電端子（給電部）、１７…ランプボデイ、４Ａ…ハウジング、５Ａ…光源ユニット、１８…押さえ部材、１９…接続端子（接続部）、１７Ｂ…ランプボデイ、４Ｂ…ハウジング、５Ｂ…光源ユニット、１８Ｂ…押さえ部材、４Ｃ…ハウジング、５Ｃ…光源ユニット、６Ｃ…発光体、１３Ｃ…半導体発光素子、１４Ｃ…基板、１４ｂ…給電端子（給電部）、３０…カバー体、３３…接続端子（接続部）、４Ｄ…ハウジング、５Ｄ…光源ユニット、６Ｃ…発光体、３０Ｄ…カバー体、３９…接続端子（接続部）   DESCRIPTION OF SYMBOLS 1 ... Vehicle lamp, 2 ... Reflector, 4 ... Housing, 5 ... Light source unit, 6 ... Light-emitting body, 7 ... Heat sink (pressing member), 12 ... Connection terminal (connection part), 13 ... Semiconductor light-emitting device, 14 ... Board | substrate 14a ... Power supply terminal (power supply part), 17 ... Lamp body, 4A ... Housing, 5A ... Light source unit, 18 ... Pressing member, 19 ... Connection terminal (connection part), 17B ... Lamp body, 4B ... Housing, 5B ... Light source Unit, 18B ... Pressing member, 4C ... Housing, 5C ... Light source unit, 6C ... Light emitting body, 13C ... Semiconductor light emitting element, 14C ... Substrate, 14b ... Power feeding terminal (power feeding portion), 30 ... Cover body, 33 ... Connection terminal ( Connection part), 4D ... housing, 5D ... light source unit, 6C ... light emitter, 30D ... cover body, 39 ... connection terminal (connection part)

Claims (4)

光を出射する光源を有する光源ユニットを備えた車輌用灯具であって、
前記光源ユニットは、
光源として設けられた半導体発光素子と該半導体発光素子に給電する一対の給電部が設けられた基板とを有する発光体と、
絶縁性材料によって形成され前記発光体が配置されるハウジングと、
前記ハウジングに設けられ導電性金属材料によって形成され前記発光体の一対の給電部がそれぞれ接続される一対の接続部と、
前記ハウジングに取り付けられ前記発光体の一対の給電部を押さえてそれぞれ前記一対の接続部に押し付ける押さえ部材とを備え、
前記ハウジングをランプボデイ又はリフレクターに一体に設けた
ことを特徴とする車輌用灯具。 A vehicular lamp including a light source unit having a light source that emits light,
The light source unit is
A light-emitting body having a semiconductor light-emitting element provided as a light source and a substrate provided with a pair of power supply portions for supplying power to the semiconductor light-emitting element;
A housing formed of an insulating material and disposed with the light emitter;
A pair of connection portions provided in the housing and formed of a conductive metal material, to which a pair of power feeding portions of the light emitter are respectively connected;
A pressing member that is attached to the housing and presses the pair of power feeding portions of the light emitter to press the pair of connecting portions, respectively.
A vehicle lamp characterized in that the housing is provided integrally with a lamp body or reflector. 前記押さえ部材として、前記半導体発光素子からの光の出射時に発生する熱を放出するヒートシンクを設けた
ことを特徴とする請求項１に記載の車輌用灯具。 The vehicular lamp according to claim 1, wherein a heat sink that releases heat generated when light is emitted from the semiconductor light emitting element is provided as the pressing member. 光源として設けられた半導体発光素子と該半導体発光素子に給電する一対の給電部が設けられた基板とを有する発光体と、
絶縁性材料によって形成され前記発光体が配置されるハウジングと、
前記ハウジングに設けられ導電性金属材料によって形成され前記発光体の一対の給電部がそれぞれ接続される一対の接続部と、
前記ハウジングに取り付けられ前記発光体の一対の給電部を前記発光体を挟んで前記ハウジングの反対側から覆うカバー体とを備えた
ことを特徴とする光源ユニット。 A light-emitting body having a semiconductor light-emitting element provided as a light source and a substrate provided with a pair of power supply portions for supplying power to the semiconductor light-emitting element;
A housing formed of an insulating material and disposed with the light emitter;
A pair of connection portions provided in the housing and formed of a conductive metal material, to which a pair of power feeding portions of the light emitter are respectively connected;
A light source unit comprising: a cover body attached to the housing and covering a pair of power feeding portions of the light emitter from the opposite side of the housing with the light emitter interposed therebetween. 前記接続部を金属材料の蒸着によって形成した
ことを特徴とする請求項３に記載の光源ユニット。 The light source unit according to claim 3, wherein the connection portion is formed by vapor deposition of a metal material.
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