JP2016126931A - Lamp device and illuminating device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a lamp device that can improve heat dissipation performance.SOLUTION: A lamp device 10 comprises a board 20 and a case 12. Light emitting elements 21 are mounted on a surface on the side of one end of the board 20. The case 12 comprises: a body part 30 housing the board 20 on the side of one end; a protruding part 31 protruding from the side of the other end of the body part 30; and a connecting part 43 protruding from the side of one end of the protruding part 31 toward the inside of the body part 30, internally provided with a concave part 46 opened on the side of the other end of the protruding part 31, and thermally connected to the board 20.SELECTED DRAWING: Figure 1

Description

  Embodiments described herein relate generally to a lamp device and a lighting device using a light emitting element.

  Conventionally, as a lamp device using a light emitting element, for example, there is a flat lamp device using a GX53 type base.

  The lamp device accommodates a substrate on which a light emitting element is mounted on one end side of a casing, and a base portion is provided on the other end side of the casing. The heat generated when the light emitting element is turned on is transmitted from the substrate to the casing, and is radiated from the outer surface of the casing to the air. In order to efficiently release the heat generated by the light emitting element to the substrate, the configuration of the substrate has been devised such as making the substrate metal or mounting a metal block on the substrate.

JP 2007-157690 A

  Since the lamp device has a structure that dissipates the heat generated by the light-emitting element from the outer surface of the housing to the air, heat can be efficiently transferred from the substrate to the housing simply by devising the configuration of the substrate housed in the housing. In some cases, the heat dissipation cannot be improved.

  The problem to be solved by the present invention is to provide a lamp device and a lighting device that can improve heat dissipation.

  The lamp device of the embodiment includes a substrate and a housing. A light emitting element is mounted on a surface on one end side of the substrate. The housing has a main body portion that houses the substrate on one end side, a protruding portion that protrudes from the other end side of the main body portion, and protrudes from one end side of the protruding portion toward the inside of the main body portion and on the other end side of the protruding portion. A concave portion that opens is provided and has a connection portion that is thermally connected to the substrate.

  According to the present invention, it can be expected to improve heat dissipation.

It is sectional drawing of the lamp device which shows 1st Embodiment. It is a perspective view of the decomposition | disassembly state of a lamp device same as the above. It is a perspective view of the decomposition | disassembly state of a lamp device same as the above. It is a perspective view of the illuminating device using a lamp device same as the above. It is sectional drawing of the lamp device which shows 2nd Embodiment. It is sectional drawing of the lamp device which shows 3rd Embodiment.

  Hereinafter, a first embodiment will be described with reference to FIGS. 1 to 4.

  1 to 4 show a flat lamp device 10. In the following description, one end side of the lamp device is taken as the lower side and the other end side is taken as the upper side.

  The lamp device 10 includes a substrate unit 11, a housing 12 that accommodates the substrate unit 11, a plurality of electrode pins 13 that protrude from the upper surface of the housing 12, and a transparent member that is disposed below the housing 12. A light cover 14 and the like are provided.

  The substrate unit 11 includes a substrate 20, a light emitting element 21 mounted on the lower surface of the substrate 20, and a lighting circuit 22 formed on the substrate 20.

  The substrate 20 is configured by a disc-shaped printed wiring board. The lower surface of the substrate 20 is a wiring surface 20a on which a wiring pattern is formed. An attachment hole 24 for attaching the substrate 20 to the housing 12 is formed in the substrate 20.

  The light emitting element 21 is disposed in the central region of the wiring surface 20a, which is the lower surface of the substrate 20. As the light emitting element 21, for example, an SMD (Surface Mount Device) package including an LED chip is used. A plurality of light emitting elements 21 are concentrated in the central region on the lower surface of the substrate 20. The light emitting element 21 may be a COB (Chip On Board) module in which a plurality of LED chips are mounted on a mounting substrate and the LED chips are sealed with a transparent resin containing a phosphor.

  The lighting circuit 22 converts AC power input from the outside of the lamp device 10 into predetermined DC power and supplies it to the light emitting element 21. The lighting circuit 22 has various electronic components 25 mounted on the substrate 20. Among the electronic components 25, at least the electronic component 25 having a lead is disposed on the upper side surface of the substrate 20, and the lead is inserted into the lower side of the substrate 20 and soldered to the wiring pattern. Of the electronic components 25, chip-shaped small electronic components are arranged in a wiring pattern on the lower side of the substrate 20 and soldered and connected. The electronic component 25 disposed on the upper surface of the substrate 20 is disposed around the central region of the upper surface of the substrate 20, that is, on the side opposite to the central region of the lower surface of the substrate 20 on which the light emitting element 21 is mounted. It is not arranged in the central region on the upper side surface of the substrate 20. Therefore, a space 26 where the substrate 20 is exposed is formed in the central region on the upper side surface of the substrate 20. The electrode pin 13 is configured to be electrically connected to the AC power input portion of the lighting circuit 22 via the wiring pattern, and the light emitting element 21 is electrically connected to the wiring pattern serving as the DC power output portion of the lighting circuit 22. It is connected to the.

  The housing 12 is integrally formed of an insulating material such as polycarbonate. The housing 12 includes a main body 30 and a protrusion 31 that protrudes from the center of the upper side surface of the main body 30.

  The main body 30 has an annular flat surface portion 33 and a wall portion 34 that protrudes downward from the periphery of the flat surface portion 33. On the lower surface of the flat surface portion 33, a plurality of fixing portions 35 for arranging and fixing the substrate 20 are projected. An insertion hole 37 through which the screw 36 is inserted is formed in the lower part of the fixed part 35, and an insertion hole 38 into which the electrode pin 13 is fitted is formed in the upper part of the fixed part 35. The insertion hole 37 and the insertion hole 38 is formed coaxially. Then, the screw 36 passes through the mounting hole 24 of the substrate 20 and the insertion hole 37 of the fixing portion 35 and is screwed to the electrode pin 13, so that the substrate 20, the housing 12 and the electrode pin 13 are fixed integrally. In addition, the AC power input portion of the lighting circuit 22 and the electrode pin 13 are electrically connected via the screw 36. When the board 36 is fixed to the housing 12, the screw 36 is electrically connected to the wiring pattern of the board 20 at the head 36a of the screw 36, and is electrically connected to the AC power input portion of the lighting circuit 22 through the wiring pattern. It is connected.

  The protruding portion 31 protrudes upward from the center of the main body portion 30, that is, the center of the flat surface portion 33. The protruding portion 31 has a cylindrical peripheral surface portion 40 and an end surface portion 41 at the upper end of the peripheral surface portion 40. And the protrusion part 31 comprises the base part 42 of the shape and dimension corresponding to the standard of GX53 form, for example with the upper part side of the main-body part 30. FIG.

  A connecting portion 43 that protrudes from the center of the lower surface of the end surface portion 41 toward the inside of the main body portion 30 is formed on the end surface portion 41 of the protruding portion 31. The connection portion 43 includes a cylindrical tube portion 44 and a connection surface portion 45 that closes the lower end of the tube portion 44. A cylindrical recess 46 that opens upward is formed inside the connection portion 43. An accommodating portion 47 that communicates with the main body portion 30 and in which the electronic component 25 of the lighting circuit 22 is disposed is formed inside the protruding portion 31 and around the connecting portion 43.

  The connection portion 43 is disposed in the space portion 26 above the central region of the substrate 20 in a state where the substrate 20 is fixed to the housing 12. In this state, there is a gap between the connection surface portion 45 of the connection portion 43 and the upper side surface of the substrate 20, but the heat conduction member 48 is interposed between the connection surface portion 45 of the connection portion 43 and the upper side surface of the substrate 20. Thus, the connection portion 43 and the substrate 20 are thermally connected. The heat conductive member 48 is constituted by, for example, a heat conductive sheet having heat conductivity, insulation, and elasticity. The heat conducting member 48 is formed in a disc shape. When the housing 12, the substrate 20, and the electrode pins 13 are fixed integrally with the screw 36, the heat conducting member 48 is sandwiched between the connecting portion 43 and the substrate 20, and is elastically deformed. The upper side surface and the lower side surface are pressed against the connection portion 43 and the substrate 20, respectively. Further, all the light emitting elements 21 mounted on the lower surface of the substrate 20 are disposed in the lower region of the lower surface of the connection surface portion 45 and the heat conducting member 48 of the connection portion 43.

  A pair of L-shaped key grooves 49 are formed on the peripheral surface portion 40 of the protruding portion 31 at positions that are symmetrical with respect to the center of the protruding portion 31 and deviate from the positions where the pair of electrode pins 13 are disposed. Yes.

  The pair of electrode pins 13 is formed of a conductive metal material. A large-diameter portion 50 is formed on the upper side of the electrode pin 13. On the lower side of the electrode pin 13, a fitting portion 51 to be fitted into the fitting hole 38 of the housing 12 is formed, and a screw hole 52 into which the screw 36 is screwed is formed.

  The translucent cover 14 is formed in a disk shape from a synthetic resin material having translucency and diffusibility. A protruding wall 60 that fits inside the wall portion 34 of the housing 12 protrudes around the translucent cover 14, and the translucent cover 14 is secured to the protruding wall 60 by being locked to the wall portion 34 of the housing 12. A claw portion 61 that is fixed to the housing 12 is provided. A lens 62 such as a Fresnel lens is formed on the inner surface of the translucent cover 14 to control the light from the light emitting element 21 to a predetermined light distribution.

  Next, assembly of the lamp device 10 will be described.

  The electrode pin 13 is fitted into the fitting hole 38 from the upper side of the housing 12, the board unit 11 is arranged from the lower side of the housing 12, and the screw 36 is inserted through the mounting hole 24 of the board 20 and the insertion hole 37 of the fixing portion 35. Then, it is screwed into the screw hole 52 of the electrode pin 13.

  When the substrate unit 11 is arranged from the lower side of the housing 12, the connection portion 43 is inserted into the space portion 26 on the substrate 20, and between the connection surface portion 45 of the connection portion 43 and the upper side surface of the substrate 20. A heat conducting member 48 is interposed between the two. It should be noted that the heat conducting member 48 can be easily assembled by being attached to either the connecting portion 43 or the substrate 20. Further, the electronic component 25 protruding from the upper side surface of the substrate 20 is inserted into the accommodating portion 47 around the connection portion 43 in the protruding portion 31.

  By screwing and tightening the screw 36 into the screw hole 52 of the electrode pin 13, the housing 12, the substrate 20, and the electrode pin 13 are fixed integrally. At this time, the upper surface of the substrate 20 abuts on the fixing portion 35 of the housing 12 to fix the substrate 20 to the housing 12, and the heat conducting member 48 is sandwiched between the connection portion 43 and the substrate 20. The heat conductive member 48 is elastically deformed, and the upper side surface and the lower side surface of the heat conducting member 48 are pressed into contact with the connecting portion 43 and the substrate 20, respectively. In the state where the substrate 20 is fixed to the fixing portion 35, the substrate 20 is supported by the fixing portion 35 and the heat conducting member 48. Here, the fixing portion 35 in contact with the substrate 20 and the heat conduction member 48 are substantially flush with some dimensional errors, and the thermal connection state between the connection portion 43 and the substrate 20 by the heat conduction member 48 is stabilized. Obtained.

  Furthermore, the head 36a of the screw 36 is electrically connected to the wiring pattern of the substrate 20, and the AC power input portion of the lighting circuit 22 and the electrode pin 13 are electrically connected by the screw 36.

  Finally, the translucent cover 14 is attached to the housing 12.

  Next, FIG. 4 shows an illumination device 80 that uses the lamp device 10. The illumination device 80 is, for example, a downlight. The lighting device 80 includes an instrument body 81, a socket 82, and the lamp device 10.

  The instrument body 81 is opened downward and is also configured as a reflector.

  The socket 82 includes a socket body 83 and terminals accommodated in the socket body 83. The socket body 83 is made of an insulating resin and is formed in an annular shape, and an insertion hole 84 through which the protruding portion 31 of the lamp device 10 is inserted is formed at the center.

  On the lower surface of the socket main body 83, a pair of connection holes 85 are formed at positions symmetrical with respect to the center of the socket 82 so that the electrode pins 13 of the lamp device 10 are inserted and rotated. These connection holes 85 are elongated holes along the circumferential direction of the socket body 83, and at one end thereof, a hole portion 86 through which the large diameter portion 50 of the electrode pin 13 can be inserted is formed. A terminal to which the electrode pin 13 inserted into the connection hole 85 is electrically connected is accommodated inside each connection hole 85.

  As the electrode pin 13 is inserted into the connecting hole 85 and rotated on the inner peripheral surface of the socket body 83, the socket body 83 is fitted into an L-shaped key groove 49 formed on the outer peripheral surface of the protrusion 31. A key 87 for supporting the device 10 on the socket body 83 is provided.

  Then, with the lamp device 10 mounted in the socket 82, by supplying AC power to the lighting circuit 22 through the terminal of the socket 82 and the electrode pin 13 of the lamp device 10, the lighting circuit 22 converts the AC power to predetermined DC power. Is converted to and supplied to the light emitting element 21, and the light emitting element 21 emits light.

  The light of the light emitting element 21 is transmitted through the translucent cover 14 and irradiated to the illumination space.

  The heat generated when the light emitting element 21 emits light is mainly conducted to the substrate 20 and is efficiently transmitted to the connection portion 43 of the housing 12 through the heat conducting member 48 that is in contact with the substrate 20 on the side opposite to the light emitting element 21. Heat conduction is good. The heat transmitted to the connection part 43 is dissipated into the air from the inner surface of the recess 46 inside the connection part 43, and is transmitted from the connection part 43 to the entire housing 12 to enter the air from the surface of the housing 12 into the air. Heat is dissipated. Further, heat is transmitted from the housing 12 to the light transmissive cover 14 and is also radiated from the surface of the light transmissive cover 14 into the air. Further, since the lamp device 10 is connected to the socket 82, a part of the heat of the housing 12 is radiated to the socket 82.

  And according to the present embodiment, since the connecting portion 43 that protrudes from the protruding portion 31 into the main body portion 30 and is thermally connected to the substrate 20 is provided, the heat of the light emitting element 21 is efficiently connected. Since the concave portion 46 opened above the projecting portion 31 is provided inside the connection portion 43, the surface area of the connection portion 43 that comes into contact with the surrounding air can be increased. The heat of the light emitting element 21 efficiently transmitted to the portion 43 can be dissipated from the inner surface of the recess 46 into the air, and the heat dissipation can be improved.

  Further, by using a heat conduction member interposed between the connection portion 43 and the substrate 20, heat conduction from the substrate 20 to the connection portion 43 can be stabilized. Further, in a state where the substrate 20 is fixed to the fixing portion 35 of the housing 12, the substrate 20 is supported by the fixing portion 35 and the heat conducting member 48, and the fixing portion 35 and the heat conducting member 48 are flush with each other. Therefore, the thermal connection state between the connection portion 43 and the substrate 20 by the heat conducting member 48 can be stably obtained.

  In addition, the plurality of light emitting elements 21 are concentrated in the central region of the lower surface of the substrate 20, and all the components mounted on the lower surface of the substrate 20 in the lower region of the lower surface of the connection portion 43 and the heat conduction member 48. Since the light emitting element 21 is arranged, the heat of the light emitting element 21 can be efficiently conducted to the heat conducting member 48 and the connecting portion 43.

  In addition, since the electronic component 25 protruding from the upper surface of the substrate 20 is disposed in the accommodating portion 47 around the connection portion 43 in the protruding portion 31, the lamp device 10 can be thinned and the electronic component 25 is generated. It is possible to easily dissipate heat to the protrusion 31.

  Further, by inserting the screw 36 through the substrate 20 and the housing 12 and screwing the electrode 36 to the electrode pin 13, the substrate 20, the housing 12 and the electrode pin 13 can be fixed together, and the lighting circuit 22 is connected via the screw 36. And the electrode pin 13 can be electrically connected to each other, and a dedicated connecting part such as a connector is not necessary, and the assemblability can be improved.

  Next, FIG. 5 shows a second embodiment. In addition, about the same structure as 1st Embodiment, the same code | symbol is used and the description about the structure and an effect is abbreviate | omitted.

  A reflector 90 that reflects the light of the light emitting element 21 is disposed below the substrate 20. In the center of the reflector 90, an opening 91 through which the light emitting element 21 is exposed is formed.

  The reflector 90 covers the periphery of the lower surface of the substrate 20, and the light reflected from the inner surface of the light-transmitting cover 14 is directed again to the light-transmitting cover 14, thereby increasing the light emitted from the light-transmitting cover 14. , Light extraction efficiency can be improved.

  Next, FIG. 6 shows a third embodiment. In addition, about the same structure as 1st Embodiment, the same code | symbol is used and the description about the structure and an effect is abbreviate | omitted.

  A metal plate 95 is disposed over the inside of the connection portion 43 of the housing 12, that is, the inside of the tube portion 44 and the connection surface portion 45. The metal plate 95 is formed in the same shape as the connection portion 43. The housing 12 is formed by insert molding that covers the metal plate 95 with a resin material that forms the main body 30 and the protrusion 31.

  The heat generated during light emission of the light emitting element 21 is transmitted to the connection surface portion 45 of the connection portion 43 through the substrate 20 and the heat conducting member 48, and is transmitted to the metal plate 95 inside the connection surface portion 45, so that the entire metal plate 95 is To spread. Accordingly, heat is efficiently diffused throughout the connection portion 43, and the heat dissipation effect from the inner surface of the recess 46 to the air is improved.

  The metal plate 95 may be provided from the region of the connecting portion 43 to the region of the end surface portion 41, further to the region of the peripheral surface portion 40, further to the region of the flat surface portion 33, and further to the region of the wall portion 34. . When providing from the region of the connection part 43 to the region of the flat part 33 or the wall part 34, an opening through which the electrode pin 13 is inserted is provided in the metal plate 95.

  Note that, although the connection portion 43 and the substrate 20 are thermally connected via the heat conducting member 48, the connection portion 43 and the substrate 20 may be in direct contact with each other.

  The lamp device is not limited to the lamp device having the GX53 type base, but may be a lamp device having a GH76p type base or a GH69 type base.

  Although several embodiments of the present invention have been described, these embodiments are presented by way of example and are not intended to limit the scope of the invention. These novel embodiments can be implemented in various other forms, and various omissions, replacements, and changes can be made without departing from the scope of the invention. These embodiments and modifications thereof are included in the scope and gist of the invention, and are included in the invention described in the claims and the equivalents thereof.

10 Lamp device
12 Enclosure
13 Electrode pin
20 substrates
21 Light emitting element
22 Lighting circuit
25 Electronic components
30 Main unit
31 Protrusion
35 Fixed part
36 screws
43 Connection
46 Recess
48 Heat conduction member
80 Lighting equipment
82 socket

Claims (5)

A substrate having a light-emitting element mounted on one end surface;
A main body portion that accommodates the substrate on one end side, a projecting portion that projects from the other end side of the main body portion, and projects from one end side of the projecting portion toward the inside of the main body portion and on the other end side of the projecting portion A housing having a connecting portion that is provided with a recessed portion that is open and is thermally connected to the substrate;
A lamp device comprising: A heat conduction member interposed between the connection portion and the substrate to thermally connect the connection portion and the substrate;
The main body has a fixing part for fixing the substrate,
The lamp device according to claim 1, wherein the substrate is supported by the fixing portion and the heat conducting member in a state where the substrate is fixed to the fixing portion. An electrode pin disposed on the other end surface of the main body;
A screw inserted through the substrate and the body portion and screwed to the electrode pin, fixing the electrode pin to the body portion and electrically connecting the electrode pin to the substrate;
The lamp device according to claim 1, further comprising: Comprising a lighting circuit mounted on the substrate;
The said lighting circuit has an electronic component mounted in the surface of the other end side of the said board | substrate, and is arrange | positioned around the said connection part in the said protrusion part. Lamp device. A lamp device according to any one of claims 1 to 4;
A socket for mounting the lamp device;
An illumination device comprising:

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